Evaporation device

Abstract

The present invention provides a vapor deposition device, which can increase the number of substrates carried by a substrate holder while increasing the vapor deposition speed, can achieve higher productivity, and can achieve film forming processing with a high film forming speed while ensuring the uniformity of film thickness. The vapor deposition device comprises: a vacuum chamber, the interior of which can be decompressed to a specified pressure; a circular substrate holder, which is rotatably arranged in the vacuum chamber; a plurality of substrates, which are held on the lower surface of the substrate holder; and a plurality of vacuum vapor deposition sources, which eject vapor of vapor deposition materials, the substrate holder is arranged to hold the plurality of substrates in a manner such that the film forming surface of the substrate faces the direction of the vapor of the vapor deposition material ejected by the vacuum vapor deposition source, and the substrate holder is configured as follows: the substrates are held in a manner such that the distance and angle between the plurality of substrates and the vacuum vapor deposition source are optimal relative to each vacuum vapor deposition source.

Description

Technical Field

[0001] The present invention relates to a vapor deposition device for vapor-depositing a vapor deposition material from a vacuum vapor deposition source onto a substrate arranged on a substrate holder. Background Art

[0002] There is known a vapor deposition device that forms a predetermined film on a substrate by vapor-depositing a vapor deposition material onto the substrate. As a method for depositing a functional multilayer film on a three-dimensional substrate, a planetary rotor mechanism has been proposed.

[0003] In such a vapor deposition apparatus, it is required to increase the number of substrates loaded per batch.

[0004] As such a vapor deposition device, the following scheme has been proposed: a substrate holder (planetary rotor) is set in a vacuum chamber, and the substrate holder revolves while rotating on its orbit through a rotation unit such as a planetary gear or a transmission belt, and a plurality of substrates are arranged on the substrate holder. While the substrate holder rotates / revolves, the vapor deposition material vaporized by heating from a vacuum vapor deposition source is deposited on the substrate to form a film (for example, refer to Documents 1 and 2).

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Publication No. 2017-110260

[0008] Patent Document 2: WO2022 / 040240

[0009] In such conventional vapor deposition apparatuses, there is a demand to increase the number of substrates loaded per batch in order to improve operation efficiency and increase productivity.

[0010] In order to meet this demand, measures such as increasing the size of a substrate holder on which the substrate is placed or increasing the number of substrate holders can be considered.

[0011] However, if the size of the substrate holder is increased or the number of substrate holders is increased, the following technical problems will occur.

[0012] If the size of the substrate holder is increased, the distance between the substrate holder and the vapor deposition source must be increased to ensure uniform film thickness, which results in a decrease in vapor deposition rate and the chamber must be configured to be higher and larger.

[0013] If the size of the substrate holder is increased, the weight of the substrate holder increases, so that the bearings and driving parts of the rotating parts of the substrate holder are worn out more and more, and failures are likely to occur.

[0014] If the number of substrate holders is increased, the rotation mechanism of the substrate holders becomes more complicated and is more likely to fail.

[0015] If the size and weight of the substrate holder are increased, there is a risk that abrasion powder generated by a driving portion of the substrate holder will be mixed into the film.

[0016] If the size of the substrate holder is increased, the raw material atoms will be incident at a large angle, which will easily cause the film to be shielded during film formation, and the film thickness will become uneven, forming an island structure. As a result, tensile stress will be generated when adjacent islands merge with each other, making it difficult to produce a film with compressive stress. Summary of the invention

[0017] The present invention has been made in view of the above-mentioned conventional problems, and an object of the present invention is to provide a vapor deposition apparatus that can increase the number of substrates mounted on a substrate holder and improve the vapor deposition rate, thereby achieving higher productivity.

[0018] Another object of the present invention is to provide a vapor deposition apparatus capable of achieving a film formation process at a high film formation speed while ensuring uniformity in film thickness.

[0019] In order to achieve the above-mentioned purpose, the evaporation device of the present invention is characterized in that it comprises: a vacuum chamber, the interior of which can be decompressed to a specified pressure; a circular substrate holder, which is rotatably arranged in the vacuum chamber; a plurality of substrates, which are held on the lower surface of the substrate holder; and a plurality of vacuum evaporation sources, which spray vapor of evaporation materials, wherein the substrate holder is arranged to hold the plurality of substrates in a manner such that the film-forming surfaces of the substrates face the direction of the vapor of the evaporation materials sprayed from the vacuum evaporation sources, and the substrate holder holds the substrates in a manner such that the distance and angle between the plurality of substrates and the vacuum evaporation sources are optimal relative to each of the vacuum evaporation sources.

[0020] Another feature of the present invention is that the evaporation device comprises: a vacuum chamber, the interior of which can be decompressed to a specified pressure; a circular substrate holder, which is rotatably arranged in the vacuum chamber via a holder support portion, and during the film forming process, the substrate holder is rotationally driven by a drive motor; a plurality of substrates, which are held on the lower surface of the substrate holder; and a plurality of vacuum evaporation sources, which eject vapor of evaporation materials, the lower surface of the substrate holder facing each of the vacuum evaporation sources is concave, and the plurality of substrates are arranged on the lower surface, and a plurality of independent substrate mounting portions are provided in the substrate holder in a manner that each of the plurality of substrates can be individually mounted, and in consideration of the flying distribution of the vapor of the evaporation material, the substrates are held in the substrate mounting portions in a manner that the distance and angle between the plurality of substrates and the vacuum evaporation sources are optimal relative to each of the vacuum evaporation sources.

[0021] Effects of the Invention

[0022] According to the present invention, by shortening the distance between the substrate holder and the vapor deposition source, the vapor deposition rate can be increased while increasing the number of substrates mounted on the substrate holder, thereby achieving higher productivity.

[0023] Furthermore, according to the present invention, a film forming process at a high film forming speed can be realized while ensuring uniformity of film thickness. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a diagram showing the internal structure of a vapor deposition device according to an embodiment of the present invention, Figure 2 A cross-sectional view along line II'.

[0025] Figure 2 yes Figure 1 A top view of the evaporation device shown.

[0026] Figure 3 yes Figure 1 The front view of the evaporation device shown.

[0027] Figure 4 yes Figure 3 The evaporation device is shown in a cross-sectional view along line II-II'.

[0028] Figure 5 yes Figure 1 A top view of the substrate holder is shown.

[0029] Figure 6 yes Figure 5 An enlarged cross-sectional view of the substrate holder along line III-III' is shown.

[0030] Figure 7 yes Figure 4 A bottom view of the substrate holder is shown.

[0031] Figure 8 This is an explanatory diagram showing a state where a plurality of substrates are arranged at optimal positions and angles with respect to a first vacuum deposition source.

[0032] Fig. 9 It is an explanatory diagram showing a state of arrangement of a plurality of vacuum deposition sources.

[0033] Fig.10 1 is an explanatory diagram showing the M-shaped cross-sectional shape of the substrate holder 7 .

[0034] Description of reference numerals:

[0035] 1: evaporation device; 2: vacuum chamber; 4: first vacuum evaporation source;

[0036] 5: second vacuum evaporation source; 6: substrate; 7: substrate holder; 8: holder support portion; 9: drive motor; 10: rotation axis. DETAILED DESCRIPTION

[0037] Hereinafter, embodiments of the vapor deposition device of the present invention will be described with reference to the drawings.

[0038] Figure 1 is a diagram showing the internal structure of a vapor deposition device according to an embodiment of the present invention, Figure 2 A cross-sectional view along line II', Figure 2 yes Figure 1 A top view of the evaporation device shown, Figure 3 yes Figure 1 The front view of the evaporation device shown, Figure 4 yes Figure 3 The evaporation device is shown in a cross-sectional view along line II-II'.

[0039] like Figure 1 to Figure 4 As shown, the evaporation device 1 of this embodiment is connected to a vacuum chamber 2 as a film forming chamber, for example, with an exhaust pipe and a vacuum pump (not shown) so that the inside of the vacuum chamber 2 can be depressurized to a predetermined pressure. The back pressure in the vacuum chamber 2 when forming a film by vacuum evaporation is, for example, 10 －2 Pa~10 －5 Pa around.

[0040] A first vacuum deposition source 4 and a second vacuum deposition source 5 are arranged at the lower portion of the vacuum chamber 2 as a film forming material supply unit 3. The first vacuum deposition source 4 contains a first deposition material, and the second vacuum deposition source 5 contains a second deposition material.

[0041] In addition, various materials can be used as a vapor deposition material.

[0042] Each vacuum deposition source 4 , 5 is provided with a heating unit such as resistance heating, electron beam heating, laser beam heating, electron gun, etc. (not shown). When the deposition material is heated and vaporized in the vacuum deposition source, the vapor of the deposition material is ejected.

[0043] It should be noted that, in the present embodiment, two vacuum evaporation sources are provided as a plurality of evaporation sources, but as described below, the number of vacuum evaporation sources is not limited, and various schemes such as providing three vacuum evaporation sources may be adopted (see Fig. 9 ).

[0044] Next, in the vacuum chamber 2, the vapor of the vapor deposition material is ejected from the first vacuum vapor deposition source 4 and the second vacuum vapor deposition source 5 in the direction ( Figure 1A substrate holder 7 is provided on the top (as indicated by the dotted arrow) and the substrate holder 7 holds the substrate 6 in such a manner that the film forming surface of the optical substrate, i.e., the substrate 6 to be the film forming object, faces the film forming material supply unit 3 side.

[0045] It should be noted that in Figure 1 In FIG. 1 , the directions in which the vapors of the vapor deposition materials are ejected from the first vacuum vapor deposition source 4 and the second vacuum vapor deposition source 5 are indicated by dotted arrows.

[0046] In addition, Figure 1 In the figure, only a part of the substrate 6 is briefly described (for details, refer to Figure 4 and Figure 6 ).

[0047] In the vacuum chamber 2 , the substrate holder 7 is rotatably supported by the holder support 8 from above. During the film forming process, the substrate holder 7 is rotationally driven in the direction of arrow A by a drive motor 9 provided at the upper part of the vacuum chamber 2 .

[0048] That is, the holder support portion 8 is assembled on the lower portion 10a of the rotating shaft 10, and the rotating shaft 10 extends downward in the vacuum chamber 2 from the driving motor 9 protruding from the upper portion of the vacuum chamber 2, and a substrate holder 7 is provided on the lower surface 8a of the holder support portion 8 for holding the substrate 6 in such a manner that the film forming surface of the substrate 6 faces the side of the film forming material supply portion 3.

[0049] It should be noted that the configuration of the holder support portion 8 is not limited to the present embodiment, and may be in any shape as long as it is configured to rotatably support the substrate holder 7 described in detail below.

[0050] Next, the substrate holder 7 mounted on the lower surface 8 a of the holder support portion 8 will be described.

[0051] The invention of the present application is characterized in that the substrate holder 7 is configured to hold a plurality of substrates 6 in a manner such that the film forming surface of the substrate 6 is oriented toward the direction in which the vapor of the vapor deposition material is ejected from a plurality of vacuum vapor deposition sources 4, 5, and in consideration of the flying distribution of the vapor of the vapor deposition material, the substrate holder 7 is configured to hold the substrates 6 in a manner such that the distances and angles between the plurality of substrates 6 and the vacuum vapor deposition sources 4, 5 are optimal relative to the vacuum vapor deposition sources 4, 5, respectively.

[0052] Therefore, in this embodiment, as described below, the substrate holder 7 is formed into a circle on a plane, and the lower surfaces 7a on both sides of the center point 7x of the circle, that is, the lower surfaces 7a facing the first vacuum evaporation source 4 and the second vacuum evaporation source 5, are concave in cross section, and a plurality of substrates 6 are arranged on the lower surface 7a.

[0053] Therefore, if Figure 1 or Figure 6As shown, the cross-sectional shape of the substrate holder 7 forms a gentle M-shape.

[0054] That is, in Figure 1 In the cross-sectional view shown, the lower surface 7a1 on the left side of the circular center point 7x of the substrate holder 7 toward the first vacuum evaporation source 4 is formed into a concave shape, and the lower surface 7a2 on the right side of the circular center point 7x of the substrate holder 7 toward the second vacuum evaporation source 5 is formed into a concave shape.

[0055] Of course, the substrate holder 7 rotates together with the holder support 8 during film formation, so the cross-sectional shape becomes the same throughout the entire circumference of the substrate holder 7. That is, any cross-sectional shape passing through the center point 7x of the substrate holder 7 becomes Figure 1 or Figure 6 The cross-sectional shape shown.

[0056] Furthermore, in this embodiment, if Figure 6 As shown, the first vacuum evaporation source 4 is provided directly below the concave lower surface 7a1 of the substrate holder 7, that is, on a virtual line extending downward from a center point 7a3 of the concave lower surface 7a1.

[0057] Similarly, the second vacuum deposition source 5 is provided directly below the concave lower surface 7 a 2 of the substrate holder 7 , that is, on a virtual line extending downward from the center point 7 a 4 of the concave lower surface 7 a 2 .

[0058] In addition, in this embodiment, the substrate holder 7 is formed in a torus shape by removing the center of a so-called circle.

[0059] By adopting such a structure, the substrate 6 held by the substrate holder 7 continuously receives vaporized evaporation material from multiple (in this case, two) vacuum evaporation sources 4 and 5, thereby shortening the distance between the substrate holder 7 and the film forming material supply part 3. As a result, the evaporation speed can be accelerated while increasing the number of substrates carried by the substrate holder 7, thereby achieving higher productivity.

[0060] Next, refer to Figure 5 to Figure 7 , the substrate holder 7 is described in detail.

[0061] Figure 5 yes Figure 1 A top view of the substrate holder 7 is shown, Figure 6 yes Figure 5 An enlarged cross-sectional view of the substrate holder 7 along line III-III' is shown, Figure 7 yes Figure 4 A bottom view of the substrate holder 7 is shown.

[0062] First, if Figure 1 As shown, the substrate holder 7 is mounted on the lower surface 8 a of the holder support portion 8 .

[0063] Moreover, if Figure 5 As shown in FIG. 1 , when viewed from the top, the substrate holder 7 has a torus shape with the center point 7x as the center and the center of the circle is removed in a circular shape, and has an outer circular portion 7c and an inner circular portion 7d.

[0064] In this embodiment, if Figure 6 As shown in the enlarged sectional view, as a cross-section of the substrate holder 7, the lower surface 7a1 on the left side of the circular center point 7x of the substrate holder 7 facing the first vacuum evaporation source 4 and the lower surface 7a2 on the right side of the center point 7x facing the second vacuum evaporation source 5 are respectively formed into a concave shape.

[0065] Moreover, if Figure 6 As shown in the enlarged sectional view, in the present embodiment, the lower surface 7a1 and the lower surface 7a2 of the substrate holder 7 are respectively concave in the shape of an arc, and in order to form the lower surfaces 7a1 and 7a2, a plurality of independent substrate mounting portions 7e for respectively mounting a plurality of substrates 6 are provided.

[0066] That is, Figure 6 As shown in the enlarged cross-sectional view of FIG. 1 , in the present embodiment, the substrate holder 7 is provided with a plurality of independent substrate placement portions 7 e for individually placing each of the plurality of substrates 6 , and each substrate placement portion 7 e has a different height and a different inclination of the lower surface.

[0067] Therefore, in consideration of the flying distribution of the vaporized deposition material, the lower surface 7a1 and the lower surface 7a2 are respectively formed into arc-shaped concave shapes, and the distances and angles between the plurality of substrates 6 and the vacuum deposition sources 4 and 5 are optimized.

[0068] In this way, by using a plurality of independent substrate placement portions 7 e , the position and angle of the substrate 6 can be set individually.

[0069] It should be noted that, in the present embodiment, a plurality of independent substrate mounting portions 7e are provided in a manner to individually mount each of the plurality of substrates 6, but the present invention is not limited thereto, and a plurality of annular substrate mounting portions may be provided, and the substrates 6 may be arranged in a row in the annular substrate mounting portions. In this case, all the substrates 6 in the row have the same position and angle.

[0070] Alternatively, all of the plurality of substrate placement portions 7e may be connected to form a single curved surface, and the substrates 6 may be arranged side by side on the curved surface.

[0071] like Figure 6As shown in the enlarged cross-sectional view, the lower surface 7a of the substrate holder 7 is formed into a concave shape. This is to allow the multiple substrates 6 to be in the optimal position and angle relative to the vacuum evaporation source. Therefore, each substrate mounting portion 7e is formed so that its height and lower surface inclination are different.

[0072] In this embodiment, as a prerequisite for adjusting to the above-mentioned optimal position and angle, Figure 6 As shown, a first vacuum evaporation source 4 is arranged directly below the concave lower surface 7a1 of the substrate holder 7, that is, on an imaginary line extending downward from the center point 7a3 of the concave lower surface 7a1. Similarly, a second vacuum evaporation source 5 is arranged directly below the concave lower surface 7a2 of the substrate holder 7, that is, on an imaginary line extending downward from the center point 7a4 of the concave lower surface 7a2.

[0073] Furthermore, as an example of the above-mentioned plurality of substrates 6 being at optimal positions and angles with respect to the vacuum deposition source, in the present embodiment, Figure 6 In the cross section shown, each substrate placement portion 7 e is formed to have different heights and lower surface inclinations so that the distances and angles from each first vacuum deposition source 4 and second vacuum deposition source 5 to each substrate 6 are the same.

[0074] Figure 8 It is an explanatory diagram showing a state where a plurality of substrates 6 are arranged at optimal positions and angles with respect to the first vacuum deposition source 4 .

[0075] In this embodiment, the substrate 6 is composed of a convex lens 6 .

[0076] In order to form a predetermined thin film with uniform film thickness on the surface of each convex lens 6 , each convex lens 6 needs to obtain an optimal distance and angle with the first vacuum evaporation source 4 according to its arrangement position.

[0077] Therefore, if Figure 8 As shown, each substrate placement portion 7e is designed to have a different height and a different inclination of the lower surface so that the distance and angle between each convex lens 6 placed on the lower surface and the first vacuum evaporation source 4 are optimal.

[0078] It should be noted that the height and the inclination of the lower surface of each substrate placement portion 7 e are designed to be different depending on parameters such as the rotation speed of the substrate holder 7 .

[0079] As described above, according to the present embodiment, the substrate holder 7 is formed into a circle on a plane, and the lower surfaces 7a on both sides of the center point 7x of the circle, that is, the lower surfaces 7a1 and 7a2 facing the first vacuum evaporation source 4 and the second vacuum evaporation source 5, respectively, are concave to form a gentle M shape, and a plurality of substrates 6 are arranged on the lower surfaces 7a1 and 7a2 so that the plurality of substrates are in the optimal position and angle relative to the vacuum evaporation sources 4 and 5, respectively, thereby significantly shortening the distance between the substrate holder 7 and the vacuum evaporation sources 4 and 5.

[0080] Thereby, the following effects can be obtained.

[0081] The number of substrates that can be loaded on the substrate holder can be increased while the vapor deposition rate can be increased, thereby achieving higher productivity.

[0082] It is possible to achieve a high film forming speed while ensuring uniformity of film thickness.

[0083] The abrasion powder generated in the driving part of the substrate holder can be significantly reduced, and the stability of the driving part can be maintained.

[0084] The height of the vacuum chamber can be designed to be lower.

[0085] Since the distance and angle between each substrate 6 and the vacuum deposition sources 4 and 5 are optimized, a film having excellent compressive stress can be formed.

[0086] It should be noted that although the present embodiment is described, it should not be understood that the description and drawings constituting a part of the present disclosure are limiting, and various embodiments not described here are included.

[0087] For example, in this embodiment, Figure 1 and Fig. 9 As shown in (a) of FIG. 1 , a configuration with two vacuum evaporation sources is described, but it is not limited thereto. Fig. 9 As shown in (b), there are three vacuum evaporation sources, or Fig. 9 As shown in (c), four vacuum evaporation sources are provided.

[0088] Fig. 9 1 is an explanatory diagram showing the arrangement of a plurality of vacuum deposition sources including the vacuum deposition sources when the substrate holder 7 is viewed from the bottom. Fig. 9 (a) shows a configuration with two vacuum evaporation sources. Fig. 9 (b) shows a configuration with three vacuum evaporation sources. Fig. 9 (c) shows a configuration in which four vacuum evaporation sources are provided.

[0089] In this way, if the number of vacuum evaporation sources is increased, although the cost will increase accordingly, the evaporation speed can be further increased, and the productivity can be improved.

[0090] In addition, in this embodiment, the substrate holder 7 is as follows Fig.10 The M-shaped cross-sectional shape shown in (a) of FIG. 1 is not limited thereto and may also be configured as follows: Fig.10 The M-shaped cross-sectional shape shown in (b).

[0091] That is, in the above-mentioned embodiment, the substrate holder 7 is in the shape of a torus by removing the center of the circle, and its cross-sectional shape is as follows: Fig.10 As shown in (a), it is also possible that the center of the circle does not need to be removed circularly but becomes as shown in Fig.10 The circular M-shaped cross-sectional shape shown in (b).

[0092] exist Fig.10 In the case of the substrate holder 7 shown in (b), the substrate holder 7 is formed into a circle without removing the center of the circle.

[0093] It should be noted that, in the present embodiment, a plurality of independent substrate mounting portions 7e are provided in a manner to individually mount each of the plurality of substrates 6, but the present invention is not limited thereto, and a plurality of annular substrate mounting portions may be provided, and the substrates 6 may be arranged in a row in the annular substrate mounting portions. In this case, all the substrates 6 in the row have the same position and angle.

[0094] Alternatively, all of the plurality of substrate placement portions 7e may be connected to form a single curved surface, and the substrates 6 may be arranged side by side on the curved surface.

[0095] Furthermore, for example, an ion source that irradiates oxygen ions or the like onto the substrate to be film-formed may be provided in the vacuum chamber 2 to perform ion beam-assisted vacuum deposition.

Claims

1. A vapor deposition device, characterized in that: have: A vacuum chamber, the interior of which can be decompressed to a specified pressure; a circular substrate holder rotatably disposed in the vacuum chamber; a plurality of substrates held on the lower surface of the substrate holder; as well as Multiple vacuum evaporation sources eject vapor of evaporation materials. The substrate holder is configured to hold the plurality of substrates in a manner such that the film-forming surfaces of the substrates face the direction in which the vapor of the deposition material is ejected from the vacuum deposition source. The substrate holder holds the substrates in such a manner that the distances and angles between the plurality of substrates and the vacuum deposition sources are optimal with respect to each of the vacuum deposition sources. The substrate holder is provided with a plurality of independent substrate mounting parts in a manner of independently mounting each of the plurality of substrates, and each of the substrate mounting parts has a different height and a different inclination of a lower surface so as to optimize the distance and angle between the plurality of substrates and the vacuum evaporation source. The vacuum evaporation source includes a first vacuum evaporation source and a second vacuum evaporation source. Considering the flying distribution of the vapor of the evaporation material, the height and the inclination of the lower surface of the substrate mounting portion are formed differently so that the distances and angles from the first vacuum evaporation source and the second vacuum evaporation source to each substrate are the same in cross section.

2. The evaporation device according to claim 1, characterized in that The lower surface of the substrate holder facing the respective vacuum evaporation sources is concave, and the plurality of substrates are arranged on the lower surface.

3. The evaporation device according to claim 1, characterized in that: During the film forming process, the substrate holder is rotationally driven by a driving motor.

4. The evaporation device according to claim 1, characterized in that: The evaporation device includes a holder supporting portion for holding the substrate holder, wherein the holder supporting portion is assembled at the lower portion of a rotating shaft, wherein the rotating shaft extends downwardly from a driving motor protruding from the upper portion of the vacuum chamber into the vacuum chamber, and wherein the substrate holder for holding the substrate in such a manner that the film forming surface of the substrate faces the vacuum evaporation source side is provided on the lower surface of the holder supporting portion.

5. The evaporation device according to claim 1, characterized in that: The cross section of the substrate holder is a gentle M-shape in which each lower surface facing the first vacuum deposition source and the second vacuum deposition source is concave.

6. A vapor deposition device, characterized in that: have: A vacuum chamber, the interior of which can be decompressed to a specified pressure; a circular substrate holder rotatably disposed in the vacuum chamber; a plurality of substrates held on the lower surface of the substrate holder; as well as Multiple vacuum evaporation sources eject vapor of evaporation materials. The substrate holder is configured to hold the plurality of substrates in such a manner that the film-forming surfaces of the substrates face the direction in which the vapor of the deposition material is ejected from the vacuum deposition source. The substrate holder holds the substrates in such a manner that the distances and angles between the plurality of substrates and the vacuum deposition sources are optimal with respect to each of the vacuum deposition sources. The substrate holder is in the shape of a ring. The substrate holder is provided with a plurality of independent substrate mounting parts in a manner of independently mounting each of the plurality of substrates, and each of the substrate mounting parts has a different height and a different inclination of a lower surface so as to optimize the distance and angle between the plurality of substrates and the vacuum evaporation source. The vacuum evaporation source includes a first vacuum evaporation source and a second vacuum evaporation source. Considering the flying distribution of the vapor of the evaporation material, the height and the inclination of the lower surface of the substrate mounting portion are formed differently so that the distances and angles from the first vacuum evaporation source and the second vacuum evaporation source to each substrate are the same in cross section.

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