Evaporation conveying device, equipment, control method and semiconductor device

Abstract

An evaporation and delivery device, equipment, control method and semiconductor device, relate to the field of equipment technology, the evaporation and delivery device comprises a bottle body, a bottle cap and a splash-proof structure. The bottle body has a groove cavity; the bottle cap is buckled on the bottle body and sealed with the opening of the groove cavity, and the bottle cap is provided with an inlet and an outlet; the splash-proof structure is located in the groove cavity and is arranged on the inner wall of the bottle cap, and the splash-proof structure comprises a first splash-proof part and a second splash-proof part. By arranging the splash-proof structure in the evaporation and delivery device, the amount of particles generated by bubble breakage flowing into the rear end cavity can be effectively reduced; by arranging the above-mentioned evaporation and delivery device in the device and using the device control method, the amount of particles entering the device reaction chamber can be effectively reduced without affecting the precursor delivery, thereby ensuring a good effect of the semiconductor and obtaining a semiconductor device with better performance.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor-related equipment, and in particular to an evaporation and delivery device, equipment, control method and semiconductor device. Background Art

[0002] In the field of semiconductor devices, thin films obtained by semiconductor preparation, such as chemical vapor deposition and atomic layer deposition, are widely used in integrated circuits due to their excellent performance. In order to ensure that uniform layers of materials can be plated on the integrated circuit, these two precursor gas sources with a certain temperature and pressure are introduced into the reaction chamber, and chemical reactions occur on the substrate to form thin films. The current method of supplying precursor vapor to the chamber includes bringing out the liquid precursor vapor in the form of bubbling with a carrier gas. The bubbles generated during the bubbling process of the precursor are likely to have a key impact on the quality of the conveying gas. However, the bubbles generated by the carrier gas are prone to bursting when they move to the liquid surface, causing particles to splash. The splashed particles may enter the cavity of the rear-end equipment and cause pollution. There are currently many splash shield designs, but the design itself has problems such as difficult processing, blocking the gas passage, and difficulty in cleaning, and the effect is not ideal. Summary of the invention

[0003] The present application provides an evaporation and delivery device, equipment, control method and semiconductor device. By adopting a simple splash-proof structure in the evaporation and delivery device, the amount of particles generated by bubble breakage flowing into the cavity of the back-end device can be effectively reduced without affecting the precursor delivery; by arranging the above-mentioned evaporation and delivery device in the equipment, and / or using a device control method, the quality of the thin film deposited on the integrated circuit can be effectively guaranteed, thereby preparing a semiconductor device with good performance.

[0004] In a first aspect, the present application provides an evaporation and delivery device, comprising a bottle body, a bottle cap, and a splash-proof structure. The bottle body is a groove-shaped structure, having a groove cavity for accommodating a precursor liquid; the bottle cap is buckled on the bottle body and sealedly connected to the opening of the groove cavity, the bottle cap seals the groove cavity, and the bottle cap is provided with an inlet and an outlet; the splash-proof structure is located in the groove cavity and is arranged on the inner wall of the bottle cap, the splash-proof structure comprises a first splash-proof part, the first splash-proof part divides the groove cavity into a first cavity and a second cavity, the first cavity is located between the first splash-proof part and the bottle cap, the second cavity is located on a side of the first splash-proof part away from the bottle cap, the first cavity and the second cavity are connected to form a first curved channel; the splash-proof structure also comprises a second splash-proof part, the second splash-proof part is at least partially located in the first cavity to divide the first cavity into a first sub-cavity and a second sub-cavity, the first sub-cavity and the second sub-cavity are connected to form a second curved channel, and the second cavity, the second sub-cavity, the first sub-cavity and the outlet are connected in sequence.

[0005] By adopting the evaporation and delivery device, the carrier gas can form bubbles after entering the precursor liquid from the inlet, and the bubbles can form gas carrying precursor molecules after leaving the precursor liquid, and at least a part of the gas can enter the cavity of the back-end device through the second cavity, the second sub-cavity, the first sub-cavity and the outlet in sequence. A part of the bubbles may be broken after leaving the precursor liquid, and the particles generated by the breakage can at least partially exist in the second cavity, that is, at least part of the particles can be blocked by the first splash guard to prevent the particles from flowing from the second cavity to the first cavity through the first curved channel; if some of the particles can flow into the first cavity through the first curved channel, the particles generated by the breakage can be blocked by the second splash guard, that is, the particles can exist in the second sub-cavity of the first cavity, so that the particles cannot pass through the second curved channel to prevent the particles from further entering the first sub-cavity from the second sub-cavity, and finally the amount of particles generated by the bubble breakage flowing into the cavity of the back-end device through the outlet can be significantly reduced.

[0006] In a possible implementation, there is a first gap between the first splash guard and the side wall of the slot cavity, the first cavity, the first gap and the second cavity are connected in sequence, and the first cavity and the second cavity are connected by bending at the first gap. By providing a first gap between the first splash guard and the side wall of the slot cavity, wherein the first cavity, the first gap and the second cavity are connected in sequence, the carrier gas can enter the first cavity from the second cavity, which is beneficial for the carrier gas to carry the precursor molecules into the cavity of the back-end device. The first cavity and the second cavity are connected by bending at the first gap, which can extend the flow path of the particles generated by the bubble breakage in the slot cavity and reduce the amount of the particles entering the cavity of the back-end device through the outlet.

[0007] In a possible implementation, the first splash-proof part includes a first connecting part and a first splash-proof part body, the first cavity is located between the first splash-proof part body and the bottle cap, and the first connecting part is connected between the first splash-proof part body and the bottle cap. By arranging the first connecting part and the first splash-proof part body in the first splash-proof part, wherein the first cavity is located between the first splash-proof part body and the bottle cap, and the first connecting part is connected between the first splash-proof part body and the bottle cap, the first splash-proof part body can be located between the flow outlet and the second cavity, and the flow outlet can be separated from the precursor liquid located at the bottom of the second cavity by the first splash-proof part body, which can effectively block the particulate matter generated by bubble breakage, and thus reduce the amount of the particulate matter flowing into the cavity of the back-end device through the flow outlet.

[0008] In a possible implementation, the first anti-splash body has a first guide surface facing the bottle cap side, and the first guide surface is inclined to guide the precursor on the first guide surface to the second cavity. By setting the first guide surface on the first anti-splash body, wherein the first guide surface is inclined to guide the precursor on the first guide surface to the second cavity, when the carrier gas carrying the precursor molecules passes through the anti-splash structure, the carrier gas can condense to form droplets, and the droplets can flow back to the second cavity through the inclined first guide surface, that is, the droplets can flow back to the precursor liquid located at the groove cavity away from the outlet, thereby improving the utilization rate of the precursor liquid.

[0009] In a possible implementation, the first flow guide surface is an arc surface that bulges toward the bottle cap. By making the first splash-proof part main body have an arc-shaped first flow guide surface that bulges toward the bottle cap, it is possible to prevent the droplets formed by the condensation of the carrier gas on the first flow guide surface from being easily retained on the first flow guide surface, which is conducive to the droplets flowing back to the precursor liquid located at the groove cavity away from the outlet, thereby improving the utilization rate of the precursor liquid.

[0010] In a possible implementation, a second gap is provided between the second splash guard and the first splash guard, the first sub-cavity, the second gap and the second sub-cavity are connected in sequence, and the first sub-cavity and the second sub-cavity are connected by bending at the second gap. The second gap can be used to allow the carrier gas to enter the first sub-cavity from the second sub-cavity of the first cavity, which is beneficial for the carrier gas to carry the precursor molecules into the cavity of the back-end device. The first sub-cavity and the second sub-cavity can be connected by bending at the second gap, which can extend the flow path of the particles generated by the bubble breakage in the slot cavity and reduce the amount of the particles entering the cavity of the back-end device through the outlet.

[0011] In a possible implementation, the second splash guard includes a second connecting portion and a second splash guard body, the second splash guard body is located between the first sub-cavity and the second sub-cavity, and the second connecting portion is connected between the second splash guard body and the bottle cap. By arranging the second connecting portion and the second splash guard body in the second splash guard, wherein the second splash guard body is located between the first sub-cavity and the second sub-cavity, and the second connecting portion is connected between the second splash guard body and the bottle cap, the second splash guard body can be located between the flow outlet and the second sub-cavity, and then the flow outlet can be further separated from the precursor liquid located at the bottom of the second cavity by the second splash guard body. The particles generated by the breakage when the bubbles leave the precursor liquid can first be blocked by the first splash guard body, and a part of the particles can enter the first cavity through the first curved channel. The particles entering the first cavity can be blocked by the second splash guard body, and the path of the particles in the first cavity will be extended by the second curved channel, which can reduce the amount of particles entering the first sub-cavity from the second sub-cavity through the second curved channel, and ultimately reduce the amount of particles flowing into the cavity of the back-end device through the outlet.

[0012] In a possible implementation, the second anti-splash part body has a second guide surface facing one side of the bottle cap, and the second guide surface is inclined from the side connected to the second connecting part to the direction away from the bottle cap. When the carrier gas carrying the precursor molecules passes through the anti-splash structure, the carrier gas can condense to form droplets, and the droplets can flow back from the first sub-cavity to the second sub-cavity through the second guide surface inclined in the direction away from the bottle cap, and the droplets can further flow back from the second sub-cavity to the second cavity through the first guide surface inclined in the direction away from the bottle cap, that is, the droplets can flow back to the precursor liquid located at the groove cavity away from the outlet, thereby improving the utilization rate of the precursor liquid.

[0013] In a possible implementation, the first splash-proof part also includes first side plates located on both sides of the first splash-proof part body, and the first side plates are respectively connected to the bottle cap, the first connecting part and the first splash-proof part body to enclose the first cavity of the groove-type structure; the second splash-proof part also includes second side plates located on both sides of the second splash-proof part body, and the second side plates are respectively connected to the bottle cap, the second connecting part and the second splash-proof part body to enclose the first sub-cavity of the groove-type structure; a third gap is provided between the first side plate and the second side plate, and the first sub-cavity, the third gap and the second sub-cavity are connected in sequence, and the first sub-cavity and the second sub-cavity are connected by bending at the third gap. The first side plate can block particles from the second cavity from entering the first cavity. Since the first side plate can be respectively connected to the bottle cap, the first connecting part and the first splash guard body, a first cavity with a groove-shaped structure can be formed. The first cavity with a groove-shaped structure can effectively block particles generated by bubble breakage without affecting the carrier gas carrying precursor molecules from the second cavity into the first cavity. That is, the particles can be blocked by the first splash guard body, the first connecting part and the first side plate to reduce the amount of particles entering the second sub-cavity through the first curved channel.

[0014] The second side plate can block particles from the second sub-cavity from entering the first sub-cavity. Since the second side plate can be respectively connected to the bottle cap, the second connecting part and the second splash-proof part body, a first sub-cavity with a groove-shaped structure can be formed. The first sub-cavity with a groove-shaped structure can effectively block particles generated by bubble breakage without affecting the carrier gas carrying precursor molecules from the second sub-cavity into the first sub-cavity. That is, part of the particles entering the second sub-cavity through the first curved channel can be blocked by the second splash-proof part body, the second connecting part and the second side plate to reduce the amount of particles entering the first sub-cavity through the second curved channel.

[0015] Since the third gap can exist between the first side plate and the second side plate, and the first sub-cavity, the third gap and the second sub-cavity can be connected in sequence, the first sub-cavity and the second sub-cavity can be connected by bending at the third gap, so that the carrier gas carrying the precursor molecules can smoothly enter the first sub-cavity from the second sub-cavity through the third gap, and finally the carrier gas can flow into the cavity of the back-end device through the outlet. When the carrier gas flows smoothly, the particles generated due to possible bubble breakage can be blocked by the first splash guard and the second splash guard in sequence, that is, the particles initially located in the second cavity can be blocked by the first splash guard body, the first connecting part and the first side plate, and the particles partially entering the second sub-cavity of the first cavity through the first curved channel can be further blocked by the second splash guard body, the second connecting part and the second side plate, and finally the amount of the particles flowing into the cavity of the back-end device through the outlet can be significantly reduced.

[0016] In a possible implementation, a grid is provided on the first splash-proof part, the grid has grid holes, and the first cavity, the grid holes and the second cavity are sequentially connected. The grid can be used to allow the carrier gas carrying the precursor molecules to enter the splash-proof structure, that is, the carrier gas can enter the first cavity from the second cavity through the grid holes, and the grid can also be used to allow the droplets formed by the condensation of the carrier gas to flow back into the precursor liquid at the bottom of the tank cavity through the grid holes.

[0017] In a possible implementation, the first splash-proof part includes a splash-proof cover with a groove-shaped structure, the opening of the splash-proof cover is connected to the inner wall surface of the bottle cap, the grille is arranged on the side wall of the splash-proof cover, the bottom wall of the splash-proof cover is inclined, and the lowest end of the bottom wall is arranged with an opening; the second splash-proof part includes a tube body, the tube body is located in the inner cavity of the splash-proof cover, one end of the tube body is connected to the inner wall of the bottle cap, the outlet is communicated with the inner cavity of the tube body, a fourth gap is provided between the other end of the tube body and the inner wall of the splash-proof cover, a spacing channel is provided between the outer wall of the tube body and the inner wall of the splash-proof cover, and the grille, the spacing channel, the fourth gap, the inner cavity of the tube body and the outlet are connected in sequence. By providing a splash shield with a groove-shaped structure in the first splash shield, wherein the opening of the splash shield can be connected to the inner wall surface of the bottle cap, the particles generated by bubble bursting cannot enter the first cavity from the second cavity, that is, the particles can be blocked by the splash shield and cannot enter the cavity of the back-end device through the outlet.

[0018] By arranging a grid on the side wall of the splash shield, the carrier gas carrying the precursor molecules can enter the first cavity through the grid holes on the grid. Since the bottom wall of the splash shield can be arranged at an angle, and the lowest end of the bottom wall can be provided with an opening, the droplets formed by the condensation of the carrier gas can flow back into the precursor liquid at the bottom of the tank cavity through the opening, and at the same time, part of the carrier gas can also enter the first cavity through the opening, which can facilitate the transportation of the precursor.

[0019] By arranging a tube body in the second splash-proof part, wherein the tube body can be located in the inner cavity of the splash-proof cover, one end of the tube body can be connected to the inner wall of the bottle cap, the outlet can be connected to the inner cavity of the tube body, a fourth gap can be provided between the other end of the tube body and the inner wall of the splash-proof cover, and a spacing channel can be provided between the outer wall of the tube body and the inner wall of the splash-proof cover, so that particulate matter entering the first cavity from the second cavity through the grille hole can be intercepted on the inner wall of the splash-proof cover, and the carrier gas carrying the precursor molecules can pass through the grille, the spacing channel, the fourth gap, the inner cavity of the tube body and the outlet in sequence, and finally the carrier gas can enter the cavity of the back-end equipment.

[0020] In a possible implementation, a first through hole is provided on the first splash guard, and the first through hole connects the first cavity and the second cavity. By providing the first through hole on the first splash guard, the carrier gas carrying the precursor molecules can enter the first cavity from the second cavity through the first through hole. At the same time, the first through hole can have a smaller area than the surface area of ​​the first splash guard, which can prevent a large number of particles generated by bubble breakage from entering the first cavity from the second cavity, that is, most of the particles can be blocked by other components of the first splash guard and cannot enter the cavity of the back-end device through the outlet.

[0021] In a possible implementation, a second through hole is provided on the second splash guard, and the second through hole connects the first sub-cavity and the second sub-cavity. By providing the second through hole on the second splash guard, the carrier gas carrying the precursor molecules can enter the first sub-cavity from the second sub-cavity through the second through hole. At the same time, the second through hole can have an area smaller than the surface area of ​​the second splash guard, that is, the portion of the second splash guard that allows the carrier gas to pass through can account for a smaller proportion of the second splash guard, which can prevent a large number of particles generated by bubble breakage from entering the first sub-cavity from the second sub-cavity, that is, most of the particles can be blocked by other components of the second splash guard and cannot enter the cavity of the back-end device through the outlet.

[0022] In a second aspect, the present application provides an apparatus comprising a pressure regulating valve, a flow controller, a reaction chamber, a vacuum pump, and the evaporation and delivery device described in the first aspect, wherein the pressure regulating valve, the evaporation and delivery device, the flow controller, and the reaction chamber are connected in sequence, and the evaporation and delivery device delivers precursor vapor into the reaction chamber to form a functional layer on the surface of the substrate.

[0023] By setting a pressure regulating valve in the equipment, the flow rate of the carrier gas entering the evaporation and delivery device can be controlled. After the carrier gas enters the evaporation and delivery device and flows out of the evaporation and delivery device carrying the precursor molecules, the flow controller adjusts the flow rate of the carrier gas carrying the precursor molecules, so that the carrier gas carrying the precursor molecules can enter the reaction chamber for deposition at a specific flow rate and flow velocity, and the vacuum pump can evacuate the reaction chamber so that the vacuum degree in the reaction chamber reaches the required value for deposition; by setting the evaporation and delivery device described in the first aspect in the equipment, the amount of particles generated by the bubbling and breaking of the precursor liquid flowing into the rear-end reaction chamber can be effectively reduced without affecting the precursor delivery, thereby ensuring a good deposition effect, and forming a functional layer on the surface of the substrate to obtain a semiconductor device.

[0024] In a third aspect, the present application provides a device control method, which is applied to the device described in the second aspect, and includes the following steps: injecting steam into the evaporation and delivery device; adjusting the pressure regulating valve to adjust the flow rate of steam flowing into the evaporation and delivery device; turning on the vacuum pump to drive the precursor of the evaporation and delivery device to flow into the reaction chamber; adjusting the flow controller to adjust the flow rate of the precursor flowing into the reaction chamber, and the precursor enters the reaction chamber and is deposited on the substrate to form a functional layer. By inputting a certain flow rate of steam into the evaporation and delivery device, and sucking the precursor out of the evaporation and delivery device through the vacuum pump, the precursor enters the reaction chamber of the device at a certain flow rate to ensure a good deposition effect and form a functional layer on the surface of the substrate.

[0025] In a fourth aspect, the present application provides a semiconductor device, comprising a substrate and a functional layer located on the substrate, wherein the functional layer is obtained by the device according to the second aspect, or by the method according to the third aspect. By using the precursor vapor delivered by the evaporation delivery device of the present application to deposit a uniform thin film on the surface of the substrate to form the functional layer, a semiconductor device with good performance can be produced. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a schematic structural diagram of an evaporation and delivery device provided in an embodiment of the present application;

[0027] Figure 2 This application provides Figure 1 AA cross-sectional view of the evaporation conveying device in;

[0028] Figure 3 This application provides Figure 2 A schematic diagram of the local enlarged structure at B in the middle;

[0029] Figure 4 is a schematic structural diagram of a splash-proof structure provided in an embodiment of the present application;

[0030] Figure 5 is a schematic structural diagram of an evaporation and delivery device provided in another embodiment of the present application;

[0031] Figure 6 This application provides Figure 5 A schematic diagram of the structure of the splash-proof structure;

[0032] Figure 7 is a schematic structural diagram of an evaporation and delivery device provided in another embodiment of the present application;

[0033] Figure 8 This application provides Figure 7 A schematic diagram of the structure of the inflow member;

[0034] Fig. 9 is a schematic structural diagram of an evaporation and delivery device provided in another embodiment of the present application;

[0035] Fig.10 This application provides Fig. 9 A schematic diagram of the structure of the splash-proof structure;

[0036] Fig.11 This application provides Fig.10 CC cross-sectional view of the splash-proof structure;

[0037] Fig.12 is a schematic structural diagram of a splash-proof structure provided in another embodiment of the present application;

[0038] Fig.13 is a schematic structural diagram of a splash-proof structure provided in another embodiment of the present application;

[0039] Fig.14 Is adopted Figure 1 A schematic diagram of the structure of the evaporation and conveying device of the device;

[0040] Fig.15 It is a flow chart of the device control method provided in the implementation mode of the present application.

[0041] Reference numerals:

[0042] 1- Evaporation and conveying device;

[0043] 2-bottle body; 21-bottle wall; 22-groove cavity; 221-first cavity; 2211-first sub-cavity; 2212-second sub-cavity; 2213-second gap; 222-second cavity; 223-first gap; 224-second curved channel; 23-first curved channel;

[0044] 3-bottle cap; 31-inlet; 32-outlet;

[0045] 4-splash-proof structure; 41-first splash-proof part; 411-first splash-proof part body; 4111-first flow-guiding surface; 412-first connecting part; 413-first side plate; 414-grid; 4141-grid hole; 415-splash-proof cover; 4151-side wall; 4152-bottom wall; 4153-opening; 416-first through hole; 42-second splash-proof part; 421-second splash-proof part body; 4211-second flow-guiding surface; 422-second connecting part; 423-second side plate; 424-tube body; 4241-inner cavity; 425-second through hole; 43-third gap; 44-interval channel; 45-fourth gap;

[0046] 5-inflow member; 51-pipe; 52-bubble generator; 521-bubble generator body; 522-vent;

[0047] 10-equipment; 11-pressure regulating valve; 12-valve; 13-flow controller; 14-reaction chamber; 15-vacuum pump. DETAILED DESCRIPTION

[0048] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.

[0049] For ease of understanding, the English abbreviations and related technical terms involved in the embodiments of the present application are explained and described below.

[0050] Functional materials: Functional materials refer to materials that have specific functions after being acted upon by light, electricity, magnetism, heat, chemistry, biochemistry, etc.

[0051] Precursor: In chemistry, a precursor is a chemical substance that can participate in a chemical reaction, the result of which is the formation of another chemical substance.

[0052] Vapor pressure: The pressure exerted on the container wall and other objects by gas molecules produced by the evaporation of liquid or the sublimation of solid.

[0053] Thermal stability: refers to the heat resistance of the substance, the ability of an object to deform under the influence of temperature. The smaller the deformation, the higher the stability.

[0054] Chamber: It is the place where the entire deposition reaction takes place. During the deposition process, there is multi-field coupling such as flow field, temperature field and plasma field.

[0055] Chemical vapor deposition: Chemical vapor deposition (CVD) is a chemical technology that mainly uses one or more gas phase compounds or single substances containing thin film elements to chemically react on the surface of the substrate to form a thin film. Chemical vapor deposition is a new technology for preparing inorganic materials developed in recent decades. Chemical vapor deposition has been widely used to purify substances, develop new crystals, and deposit various single crystal, polycrystalline or glassy inorganic thin film materials. These materials can be oxides, sulfides, nitrides, carbides, or binary or multi-element compounds in groups II IV, III-IV, and IV-VI, and their physical functions can be precisely controlled through the deposition process of gas phase doping.

[0056] Atomic layer deposition: Atomic layer deposition (ALD) is a method (technology) of forming a deposited film by alternately passing gaseous precursor pulses into a reactor and chemically adsorbing and reacting on a deposition substrate. When the precursors reach the surface of the deposition substrate, they will chemically adsorb on its surface and undergo a surface reaction. The atomic layer deposition reactor needs to be cleaned with an inert gas between precursor pulses. It can be seen that whether the deposition reaction precursor substance can chemically adsorb on the surface of the deposited material is the key to achieving atomic layer deposition. The surface adsorption characteristics of gaseous substances on the substrate material show that any gaseous substance can be physically adsorbed on the surface of the material, but the chemical adsorption on the surface of the material must have a certain activation energy. Therefore, whether atomic layer deposition can be achieved depends on the selection of appropriate reaction precursor substances.

[0057] Mass flow controller: Mass flow controller (MFC) is used to precisely measure and control the mass flow of gas or liquid. It is used in diffusion, oxidation, molecular beam epitaxy, CVD, plasma etching, sputtering, ion implantation, vacuum coating equipment, optical fiber melting, micro-reaction device, gas mixing and distribution system, capillary measurement gas chromatograph, optical fiber manufacturing equipment, and is widely used in petrochemical industry, metallurgy, pharmaceutical industry, etc. Features: high precision and good repeatability.

[0058] It should be clear that the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0059] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms "a", "said" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings.

[0060] It should be understood that the terms “first”, “second”, etc. used in the present application are only used for the purpose of distinguishing the description, and cannot be understood as indicating or implying relative importance, nor can they be understood as indicating or implying an order.

[0061] In the description of the present application, the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0062] It should be understood that the term "and / or" used in this article is only a description of the same field of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0063] In the description of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, a conflicting connection or an integrated connection. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0064] Modern semiconductor devices are increasingly using functional materials. In order to ensure that a uniform layer of material can be deposited on the integrated circuit, chemical vapor deposition (CVD) and atomic layer deposition (ALD) are widely used. These two methods introduce a precursor gas source of a certain temperature and pressure into the reaction chamber, and a chemical reaction occurs on the substrate to form a thin film. The chemical properties of the precursor have an important influence on the precursor, such as vapor pressure, thermal stability, reactivity, etc., and many precursors have lower vapor pressure at low temperatures. Therefore, different containers are designed to correspond to the properties of different precursor materials.

[0065] There are several technologies for supplying precursor vapor to the processing chamber. One method uses a liquid mass flow controller (LMFC) to control the flow rate, delivers the liquid to the processing chamber and then evaporates it through a vaporizer. The second method heats the liquid precursor to evaporate it and delivers it to the chamber at a uniform flow rate through a mass flow controller (MFC). The third method uses a carrier gas to carry the liquid precursor vapor out in the form of bubbles. The fourth method allows the carrier gas to flow over the surface of the precursor to carry the precursor out.

[0066] For the third type of bubbling, the bubbles generated during the precursor delivery process are likely to have a critical impact on the quality of the delivered gas. The bubbles generated by the carrier gas are likely to burst when they move to the liquid surface, causing particles to splash. The splashed particles may enter the semiconductor cavity at the back end and cause pollution. There are currently many splash shield designs, but the design itself has problems such as difficult processing, blocking the gas passage, and difficulty in cleaning, and the effect is not ideal.

[0067] The present application provides an evaporation and delivery device, which effectively reduces the possibility of particles generated by bubble breakage flowing into the rear end cavity by adopting a simple anti-splash structure without affecting the delivery of the precursor.

[0068] Figure 1 is a schematic structural diagram of an evaporation and delivery device 1 provided in an embodiment of the present application, Figure 2 This application provides Figure 1 AA cross-sectional view of the evaporation and delivery device 1, Figure 3 This application provides Figure 2 The local enlarged structural diagram of B in the middle. Figure 1 , Figure 2 as well as Figure 3 As shown, the evaporation delivery device 1 may include a bottle body 2, a bottle cap 3, and a splash-proof structure 4. The bottle body 2 may be a trough-shaped structure, and the bottle body 2 may have a trough cavity 22, and the trough cavity 22 may be used to contain the precursor liquid. The bottle cap 3 may be buckled on the bottle body 2 and sealedly connected to the opening of the trough cavity 22, the bottle cap 3 seals the trough cavity 22, and the bottle cap 3 may be provided with an inlet 31 and an outlet 32. The splash-proof structure 4 can be located in the groove cavity 22, and the splash-proof structure 4 can be arranged on the inner wall of the bottle cap 3. The splash-proof structure 4 can include a first splash-proof portion 41, and the first splash-proof portion 41 can separate the groove cavity 22 into a first cavity 221 and a second cavity 222. The first cavity 221 can be located between the first splash-proof portion 41 and the bottle cap 3, and the second cavity 222 can be located on the side of the first splash-proof portion 41 away from the bottle cap 3. The first cavity 221 and the second cavity 222 can be connected to form a first curved channel 23; the splash-proof structure 4 can also include a second splash-proof portion 42, and the second splash-proof portion 42 can be at least partially located in the first cavity 221 to separate the first cavity 221 into a first sub-cavity 2211 and a second sub-cavity 2212. The first sub-cavity 2211 and the second sub-cavity 2212 can be connected to form a second curved channel 224, and the second cavity 222, the second sub-cavity 2212, the first sub-cavity 2211 and the outlet 32 ​​can be connected in sequence.

[0069] By adopting the above-mentioned evaporation and delivery device 1, bubbles can be formed after the carrier gas enters the precursor liquid from the inlet 31, and the bubbles can form a gas carrying precursor molecules after leaving the precursor liquid. At least a part of the gas can enter the cavity of the back-end equipment through the second cavity 222, the second sub-cavity 2212, the first sub-cavity 2211 and the outlet 32 ​​in sequence. A portion of the bubbles may break after leaving the precursor liquid, and the particles produced by the breakage can at least partially exist in the second cavity 222, that is, at least part of the particles can be blocked by the first splash guard 41 to prevent the particles from flowing from the second cavity 222 into the first cavity 221 through the first curved channel 23; if some of the particles can flow into the first cavity 221 through the first curved channel 23, the particles produced by the breakage can be blocked by the second splash guard 42, that is, the particles can exist in the second sub-cavity 2212 of the first cavity 221, so that the particles cannot pass through the second curved channel 224 to prevent the particles from further entering the first sub-cavity 2211 from the second sub-cavity 2212, and finally the amount of particles produced by bubble breakage that flow into the cavity of the back-end device through the outlet 32 ​​can be significantly reduced.

[0070] See also Figure 3 In a possible implementation, a first gap 223 may be provided between the first splash guard 41 and the side wall of the groove cavity 22, and the first cavity 221, the first gap 223 and the second cavity 222 may be connected in sequence, and the first cavity 221 and the second cavity 222 may be connected in a curved manner at the first gap 223. The portion of the first splash guard 41 located in the first cavity 221 is the first portion, and the portion of the first splash guard 41 located in the second cavity 222 is the second portion. The direction between the first portion and the first gap 223 may intersect with the direction between the second portion and the first gap 223, so that the flow direction of the particles generated by the bubble breakage may be curved and changed at the first gap 223. Schematically, the side wall may be the inner side wall of the bottle wall 21 of the bottle body 2, and the first cavity 221, the first gap 223 and the second cavity 222 may be components of the first curved channel 23. The first gap 223 may be used to allow the carrier gas to enter the first cavity 221 from the second cavity 222, which is beneficial for the carrier gas to carry the precursor molecules into the cavity of the back-end device. The first cavity 221 and the second cavity 222 are connected by bending at the first gap 223 , which can extend the flow path of the particles generated by bubbling and breaking in the groove cavity 22 , and reduce the amount of the particles entering the cavity of the back-end device through the outlet 32 ​​.

[0071] See also Figure 3In a possible implementation, a second gap 2213 may be provided between the second splash guard 42 and the first splash guard 41, the first sub-cavity 2211, the second gap 2213 and the second sub-cavity 2212 may be connected in sequence, and the first sub-cavity 2211 and the second sub-cavity 2212 may be connected in a curved manner at the second gap 2213. The portion of the second splash guard 42 located in the first sub-cavity 2211 is the first sub-portion, and the portion of the second splash guard 42 located in the second sub-cavity 2212 is the second sub-portion. The direction between the first sub-portion and the second gap 2213 may intersect with the direction between the second sub-portion and the second gap 2213, so that the flow direction of the particles generated by the bubble breakage may be curved and changed at the second gap 2213. Schematically, the first sub-cavity 2211, the second gap 2213 and the second sub-cavity 2212 may be components of the second curved channel 224. The second gap 2213 can be used to allow the carrier gas to enter the first sub-cavity 2211 from the second sub-cavity 2212 of the first cavity 221, which is conducive to the carrier gas carrying the precursor molecules into the cavity of the back-end device. The first sub-cavity 2211 and the second sub-cavity 2212 can be connected by bending at the second gap 2213, which can extend the flow path of the particles generated by bubble breakage in the groove cavity 22, and reduce the amount of the particles entering the cavity of the back-end device through the outlet 32.

[0072] Combination Figure 2 and Figure 3 As shown, in a possible embodiment, the first splash guard 41 may include a first connecting portion 412 and a first splash guard body 411, the first cavity 221 may be located between the first splash guard body 411 and the bottle cap 3, the first connecting portion 412 may be connected between the first splash guard body 411 and the bottle cap 3, so that the first splash guard body 411 may be located between the outlet 32 ​​and the second cavity 222, and the outlet 32 ​​may be separated from the precursor liquid located at the bottom of the second cavity 222 by the first splash guard body 411, which may effectively block the particulate matter generated by bubble breakage, thereby reducing the amount of the particulate matter flowing into the cavity of the back-end device through the outlet 32.

[0073] Figure 4 is a schematic diagram of the structure of the splash-proof structure 4 provided in the embodiment of the present application, combined with Figure 4 , Figure 2 and Figure 3 As shown in FIG. 1 , in a possible embodiment, the first splash-proof body 411 may have a first guide surface 4111 facing the bottle cap 3, and the first guide surface 4111 may be tilted to guide the precursor on the first guide surface 4111 to the second cavity 222. The first guide surface 4111 may be tilted from the side connected to the first connecting portion 412 to the direction away from the bottle cap 3. In the process of transporting the precursor molecules, the bottle body 2 may be as shown in FIG. Figure 2 The bottle body 21 is placed as shown, that is, the bottom wall of the bottle wall 21 can be perpendicular to the direction of gravity G. When the carrier gas carrying the precursor molecules passes through the splash-proof structure 4, the carrier gas can condense to form droplets. The droplets gathered on the first guide surface 4111 can move under the action of gravity G, that is, the droplets can flow back from the first guide surface 4111 to the second cavity 222 by gravity G, that is, the droplets can flow back to the precursor liquid located at the groove cavity 22 away from the outlet 32, thereby improving the utilization rate of the precursor liquid. In another possible embodiment, the first guide surface 4111 can also be inclined from the side facing the bottle cap 3 to the side connected to the first connection part 412. At this time, an opening, a through hole or a gap can be set at the connection between the first connection part 412 and the first guide surface 4111, so that the first cavity 221 and the second cavity 222 can be connected at the connection. When the carrier gas carrying the precursor molecules passes through the splash-proof structure 4, the carrier gas can condense to form droplets. The droplets gathered on the first guide surface 4111 can move under the action of gravity G, and the droplets can flow from the side of the first guide surface 4111 facing the bottle cap 3 to the side connected to the first connection part 412, that is, the droplets can flow back from the first guide surface 4111 to the second cavity 222 by gravity G, thereby improving the utilization rate of the precursor liquid. Schematically, the angle between the first guide surface 4111 and the plane where the bottle cap 3 is located can be between 10° and 60°.

[0074] Figure 5 is a schematic structural diagram of an evaporation and delivery device 1 provided in another embodiment of the present application, Figure 6 This application provides Figure 5 The schematic diagram of the splash-proof structure 4 in FIG. Figure 5 and Figure 6As shown, in a possible embodiment, the first guide surface 4111 can be a curved surface protruding toward one side of the bottle cap 3. By making the first anti-splash body 411 have a curved first guide surface 4111 protruding toward one side of the bottle cap 3, the droplets formed by the condensation of the carrier gas on the first guide surface 4111 are not easy to be retained on the first guide surface 4111, which is conducive to the reflux of the droplets to the precursor liquid located in the groove cavity 22 away from the outlet 32, thereby improving the utilization rate of the precursor liquid. Schematically, the first guide surface 4111 can be a spherical curved surface, in which case the droplets on the first guide surface 4111 can slide in any direction away from the bottle cap 3; schematically, the first guide surface 4111 can be a cylindrical curved surface, in which case the droplets can slide along the non-axis of the cylindrical first guide surface 4111 and in a direction away from the bottle cap 3. It should be pointed out that when the first guide surface 4111 is arc-shaped, the side of the first splash-proof part body 411 facing away from the bottle cap 3 can be recessed toward the bottle cap 3, and the first splash-proof part body 411 can be groove-shaped; or the side of the first splash-proof part body 411 facing away from the bottle cap 3 can be flat, and the first splash-proof part body 411 can be semi-elliptical.

[0075] See also Figure 3 In a possible implementation, the second splash-proof part 42 may include a second connecting part 422 and a second splash-proof part body 421, the second splash-proof part body 421 may be located between the first sub-cavity 2211 and the second sub-cavity 2212, the second connecting part 422 may be connected between the second splash-proof part body 421 and the bottle cap 3, so that the second splash-proof part body 421 may be located between the outlet 32 ​​and the second sub-cavity 2212, and the outlet 32 ​​may be further separated from the precursor liquid located at the bottom of the second cavity 222 by the second splash-proof part body 421. The particles generated by the bubbles breaking when leaving the precursor liquid may be first blocked by the first splash-proof part body 411, and a part of the particles may enter the first cavity 221 through the first curved channel 23, and schematically, a part of the particles may enter the first cavity 221 from the second cavity 222 through the first gap 223. The particles entering the first cavity 221 can be blocked by the second splash guard body 421, and the path of the particles in the first cavity 221 will be extended by the second curved channel 224, which can reduce the amount of particles entering the first sub-cavity 2211 from the second sub-cavity 2212 through the second curved channel 224, and ultimately reduce the amount of particles flowing into the cavity of the back-end device through the outlet 32.

[0076] Combination Figure 2 , Figure 3 and Figure 4As shown, in a possible embodiment, the second anti-splash body 421 may have a second guide surface 4211 facing one side of the bottle cap 3, and the second guide surface 4211 may be inclined from the side connected to the second connecting portion 422 to the direction away from the bottle cap 3. When the carrier gas carrying the precursor molecules passes through the anti-splash structure 4, the carrier gas may condense to form droplets, and the droplets may flow back from the first sub-cavity 2211 to the second sub-cavity 2212 through the second guide surface 4211 inclined in the direction away from the bottle cap 3. The droplets may further flow back from the second sub-cavity 2212 to the second cavity 222 through the first guide surface 4111 inclined in the direction away from the bottle cap 3, that is, the droplets may flow back to the precursor liquid located at the groove cavity 22 away from the outlet 32, thereby improving the utilization rate of the precursor liquid. Schematically, the angle between the second guide surface 4211 and the plane where the bottle cap 3 is located may be between 10° and 60°.

[0077] Combination Figure 2 , Figure 3 and Figure 4 As shown, in a possible embodiment, the first splash-proof portion 41 may further include a first side plate 413 located on both sides of the first splash-proof portion main body 411, and the first side plate 413 may be respectively connected to the bottle cap 3, the first connecting portion 412 and the first splash-proof portion main body 411 to enclose a first cavity 221 with a groove-shaped structure; the second splash-proof portion 42 may further include a second side plate 423 located on both sides of the second splash-proof portion main body 421, and the second side plate 423 may be respectively connected to the bottle cap 3, the second connecting portion 422 and the second splash-proof portion main body 421 to enclose a first sub-cavity 2211 with a groove-shaped structure; a third gap 43 may be provided between the first side plate 413 and the second side plate 423, and the first sub-cavity 2211, the third gap 43 and the second sub-cavity 2212 may be connected in sequence, and the first sub-cavity 2211 and the second sub-cavity 2212 may be connected by bending at the third gap 43.

[0078] The first side plate 413 can block particles from the second cavity 222 from entering the first cavity 221. Since the first side plate 413 can be connected to the bottle cap 3, the first connecting part 412 and the first splash-proof part main body 411 respectively, this can form a first cavity 221 with a groove-shaped structure. The first cavity 221 with a groove-shaped structure can effectively block particles generated by bubble breakage without affecting the carrier gas carrying precursor molecules from the second cavity 222 to enter the first cavity 221. That is, the particles can be blocked by the first splash-proof part main body 411, the first connecting part 412 and the first side plate 413 to reduce the amount of particles entering the second sub-cavity 2212 through the first curved channel 23.

[0079] The second side plate 423 can block particles from the second sub-cavity 2212 from entering the first sub-cavity 2211. Since the second side plate 423 can be respectively connected to the bottle cap 3, the second connecting part 422 and the second splash-proof part main body 421, a first sub-cavity 2211 with a groove-shaped structure can be formed. The first sub-cavity 2211 with a groove-shaped structure can effectively block particles generated by bubble breakage without affecting the carrier gas carrying precursor molecules from the second sub-cavity 2212 to enter the first sub-cavity 2211, that is, part of the particles entering the second sub-cavity 2212 through the first curved channel 23 can be blocked by the second splash-proof part main body 421, the second connecting part 422 and the second side plate 423, so as to reduce the amount of particles entering the first sub-cavity 2211 through the second curved channel 224.

[0080] Since the third gap 43 can exist between the first side plate 413 and the second side plate 423, and the first sub-cavity 2211, the third gap 43 and the second sub-cavity 2212 can be connected in sequence, the first sub-cavity 2211 and the second sub-cavity 2212 can be connected by bending at the third gap 43, so that the carrier gas carrying the precursor molecules can smoothly pass through the third gap 43 from the second sub-cavity 2212 into the first sub-cavity 2211, and finally the carrier gas can flow into the cavity of the back-end equipment through the outlet 32. When the carrier gas flows smoothly, the particles generated due to possible bubble breakage can be blocked by the first splash guard 41 and the second splash guard 42 in turn, that is, the particles initially located in the second cavity 222 can be blocked by the first splash guard body 411, the first connecting part 412 and the first side plate 413, and some of the particles entering the second sub-cavity 2212 of the first cavity 221 through the first curved channel 23 can be further blocked by the second splash guard body 421, the second connecting part 422 and the second side plate 423, and ultimately the amount of particles flowing into the cavity of the back-end device through the outlet 32 ​​can be significantly reduced.

[0081] Figure 7 is a schematic structural diagram of an evaporation and delivery device 1 provided in another embodiment of the present application, Figure 8 This application provides Figure 7 The structural diagram of the inlet member 5 in FIG. Figure 7 and Figure 8As shown, in a possible embodiment, the evaporation and delivery device 1 may further include an inlet member 5, and the inlet member 5 may include a pipe 51 and a bubble generator 52. The pipe 51 may be connected to the inlet port 31 of the bottle cap 3, and the end of the pipe 51 away from the bottle cap 3 may be connected to the bubble generator 52. When the evaporation and delivery device 1 is working, the end of the inlet member 5 away from the bottle cap 3 may extend below the liquid level of the precursor contained in the groove cavity 22, that is, at least part of the bubble generator 52 may extend below the liquid level of the precursor. The pipe 51 may be used to receive and transmit the carrier gas from the inlet port 31 to the bubble generator 52, and the bubble generator 52 may be used to make the carrier gas form bubbles in the precursor liquid to carry the precursor molecules.

[0082] In a possible embodiment, the pipeline 51 can be a vertical through pipe, and the diameter can be between 3-15mm. The bubble generator 52 can be cylindrical, and the diameter of the cylindrical bubble generator 52 can be between 5mm and 10mm, and the height can be approximately between 2mm and 12mm. The bubble generator 52 may include a bubble generator body 521, and the side of the bubble generator body 521 may have a vent 522. There can be multiple vents 522, schematically, the number of vents 522 can be 8 to 12, and the multiple vents 522 can be evenly distributed on the side of the bubble generator body 521, and the hole diameter of the vent 522 can be between 1-10mm. By injecting a carrier gas into the bubble generator 52, the carrier gas can diffuse into the precursor liquid through the vent 522 and generate bubbles, which carry away the precursor molecules as they rise through the precursor liquid. The bubbles can supply the liquid precursor to the chamber of the device without condensation of the precursor.

[0083] Fig. 9 is a schematic structural diagram of an evaporation and delivery device 1 provided in another embodiment of the present application, Fig.10 This application provides Fig. 9 The schematic diagram of the splash-proof structure 4 in FIG. Fig. 9 , Fig.10 as well as Figure 3 As shown, in a possible embodiment, a grid 414 may be provided on the first splash-proof portion 41, and the grid 414 may have grid holes 4141, and the first cavity 221, the grid holes 4141 and the second cavity 222 may be connected in sequence. The grid 414 may be used to allow the carrier gas carrying the precursor molecules to enter the splash-proof structure 4, that is, the carrier gas may enter the first cavity 221 from the second cavity 222 through the grid holes 4141, and the grid 414 may also be used to allow the droplets formed by the condensation of the carrier gas to flow back through the grid holes 4141 to the precursor liquid at the bottom of the tank cavity 22. Schematically, the number of the grid holes 4141 may be 1 to 10, and the grid holes 4141 may be rectangular.

[0084] Fig.11 This application provides Fig.10 CC cross-sectional view of the splashback structure, combined with Fig.11 , Figure 3 , Fig. 9 as well as Fig.10 As shown, in a possible embodiment, the first splash guard 41 may include a splash guard 415 with a groove structure, the opening of the splash guard 415 may be connected to the inner wall surface of the bottle cap 3, a grille 414 may be provided on the side wall 4151 of the splash guard 415, the bottom wall 4152 of the splash guard 415 may be inclined, and the lowest end of the bottom wall 4152 may be provided with an opening 4153; the second splash guard 42 may include a tube 424, and the tube 424 may be located at the splash guard. The inner cavity of the splash shield 415, one end of the tube body 424 can be connected to the inner wall of the bottle cap 3, the outlet 32 ​​can be connected to the inner cavity of the tube body 424, a fourth gap 45 can be provided between the other end of the tube body 424 and the inner wall of the splash shield 415, a spacing channel 44 can be provided between the outer wall of the tube body 424 and the inner wall of the splash shield 415, the grille 414, the spacing channel 44, the fourth gap 45, the inner cavity 4241 of the tube body 424 and the outlet 32 ​​can be connected in sequence.

[0085] By setting a splash shield 415 with a groove-shaped structure in the first splash shield 41, wherein the opening of the splash shield 415 can be connected to the inner wall surface of the bottle cap 3, the particles generated by the bubble breakage cannot enter the first cavity 221 from the second cavity 222, that is, the particles can be blocked by the splash shield 415 and cannot enter the cavity of the back-end device through the outlet 32.

[0086] By setting a grid 414 on the side wall 4151 of the splash shield 415, the carrier gas carrying the precursor molecules can enter the first cavity 221 through the grid holes 4141 on the grid 414. Since the bottom wall 4152 of the splash shield 415 can be tilted, and the lowest end of the bottom wall 4152 can be provided with an opening 4153, the droplets formed by the condensation of the carrier gas can flow back to the precursor liquid at the bottom of the tank cavity 22 through the opening 4153. At the same time, part of the carrier gas can also enter the first cavity 221 through the opening 4153, which can be beneficial to the transportation of the precursor. Schematically, the angle between the bottom wall 4152 of the splash shield 415 and the plane where the bottle cap 3 is located can be between 10° and 60°.

[0087] By setting a tube body 424 in the second splash-proof part 42, wherein the tube body 424 can be located in the inner cavity of the splash-proof cover 415, one end of the tube body 424 can be connected to the inner wall of the bottle cap 3, the outlet 32 ​​can be connected to the inner cavity of the tube body 424, a fourth gap 45 can be provided between the other end of the tube body 424 and the inner wall of the splash-proof cover 415, and a spacing channel 44 can be provided between the outer wall of the tube body 424 and the inner wall of the splash-proof cover 415, so that particulate matter entering the first cavity 221 from the second cavity 222 through the grille hole 4141 can be intercepted on the inner wall of the splash-proof cover 415, and the carrier gas carrying the precursor molecules can pass through the grille 414, the spacing channel 44, the fourth gap 45, the inner cavity of the tube body 424 and the outlet 32 ​​in sequence, and finally the carrier gas can enter the cavity of the back-end equipment.

[0088] Fig.12 is a schematic structural diagram of a splash-proof structure 4 provided in another embodiment of the present application, combined with Fig.12 and Figure 3 As shown, in a possible embodiment, the first through hole 416 may be provided on the first splash guard 41, and the first through hole 416 may connect the first cavity 221 and the second cavity 222. Schematically, the first through hole 416 may be provided on the first splash guard body 411, and / or the first connecting portion 412, and / or the first side plate 413. By providing the first through hole 416 on the first splash guard 41, the carrier gas carrying the precursor molecules can enter the first cavity 221 from the second cavity 222 through the first through hole 416. At the same time, the first through hole 416 may have an area smaller than the surface area of ​​the first splash guard 41, which can prevent the particles generated by the bubble breakage from entering the first cavity 221 from the second cavity 222 in large quantities, that is, most of the particles can be blocked by other components of the first splash guard 41 and cannot enter the cavity of the back-end device through the outlet 32.

[0089] Fig.13 is a schematic structural diagram of a splash-proof structure 4 provided in another embodiment of the present application, combined with Fig.13 and Figure 3As shown, in a possible embodiment, the second splash guard 42 may be provided with a second through hole 425, and the second through hole 425 may connect the first sub-cavity 2211 and the second sub-cavity 2212. By providing the second through hole 425 on the second splash guard 42, the carrier gas carrying the precursor molecules may enter the first sub-cavity 2211 from the second sub-cavity 2212 through the second through hole 425. At the same time, the second through hole 425 may have an area smaller than the surface area of ​​the second splash guard 42, that is, the portion of the second splash guard 42 that allows the carrier gas to pass through may account for a smaller proportion of the second splash guard 42, which may prevent a large number of particles generated by bubble breakage from entering the first sub-cavity 2211 from the second sub-cavity 2212, that is, most of the particles may be blocked by other components of the second splash guard 42 and cannot enter the cavity of the back-end device through the outlet 32.

[0090] Combination Fig.13 , Figure 2 and Fig.12 As shown, in a possible implementation, the first through hole 416 may be a circular hole, the number of the first through holes 416 may be 5 to 30, the diameter of the first through hole 416 may be between 1 and 10 mm, schematically, the first through hole 416 may be disposed at the portion of the first splash guard 41 facing the bottom of the slot cavity 22, that is, the first through hole 416 may be disposed at the portion of the first splash guard 41 away from the outlet 32, the first through hole 416 may be used for the reflux of condensed droplets, that is, the carrier gas may condense to form droplets, and the droplets may flow back through the first through hole 416 to the precursor liquid located at the portion of the slot cavity 22 away from the outlet 32. Schematically, the second through hole 425 may be a rectangular hole, the second through hole 425 may be disposed at the portion of the second splash guard 42 away from the inlet 31, and the second through hole 425 may be used to allow the carrier gas carrying the precursor molecules to pass through the second through hole 425 from the second sub-cavity 2212 into the first sub-cavity 2211.

[0091] The above describes in detail the detailed structure of the evaporation and delivery device 1 and the splash-proof structure 4 therein. The following describes the application of the evaporation and delivery device 1 in the equipment.

[0092] Fig.14 Is adopted Figure 1 The schematic diagram of the structure of the device 10 of the evaporation conveying device 1 is shown in FIG. Fig.14, the device 10 may include a pressure regulating valve 11, a flow controller 13, a reaction chamber 14, a vacuum pump 15 and an evaporation conveying device 1, the pressure regulating valve 11, the evaporation conveying device 1, the flow controller 13 and the reaction chamber 14 may be connected in sequence, and the evaporation conveying device 1 conveys the precursor vapor into the reaction chamber 14 to form a functional layer on the surface of the substrate to obtain a semiconductor device. Schematically, the semiconductor device may include a substrate and a functional layer arranged on the substrate. The functional layer may be a thin film deposited on the surface of the substrate by the precursor vapor. The present application introduces a carrier gas into the evaporation conveying device, and finally brings out a stable, uniform, clean and small concentration fluctuation precursor vapor, and forms a functional layer on the surface of the substrate by using the precursor vapor conveyed by the evaporation conveying device of the present application. The functional layer has a uniform distribution of components and a high consistency of film thickness, and a semiconductor device with good performance can be obtained. Schematically, the device 10 described in this embodiment can be applied to semiconductor methods such as chemical vapor deposition (CVD) and atomic layer deposition (ALD).

[0093] By setting a pressure regulating valve 11 in the device 10, the flow rate of the carrier gas entering the evaporation and delivery device 1 can be controlled. After the carrier gas enters the evaporation and delivery device 1 and flows out of the evaporation and delivery device 1 carrying the precursor molecules, the flow controller 13 can adjust the flow rate of the carrier gas carrying the precursor molecules, so that the carrier gas carrying the precursor molecules can enter the reaction chamber 14 for deposition at a specific flow rate and flow velocity, and the vacuum pump 15 can evacuate the reaction chamber 14 so that the vacuum degree in the reaction chamber 14 can reach the required value for deposition; by setting the evaporation and delivery device 1 in the device 10, the amount of particulate matter generated by the bubbling and breaking of the precursor liquid flowing into the rear-end reaction chamber 14 can be effectively reduced without affecting the precursor delivery, thereby ensuring a good deposition effect.

[0094] See also Fig.14 In a possible embodiment, the device 10 may further include a valve 12, the number of the valves 12 may be at least three, and the at least three valves 12 may be respectively arranged between the pressure regulating valve 11 and the evaporation and delivery device 1, between the evaporation and delivery device 1 and the flow controller 13, and between the vacuum pump 15 and the reaction chamber 14, so that the gas path of the device 10 is controllable as a whole, which is conducive to the deposition.

[0095] The above describes the specific structure of the device 10 using the evaporation conveying device 1. The present application also proposes a device control method. Fig.15 is a flow chart of the device control method provided in the embodiment of the present application, see Fig.15 , the device control method is applied to the above-mentioned device 10, comprising the following steps:

[0096] Step S100, injecting steam into the evaporation and transportation device 1;

[0097] Step S200, adjusting the pressure regulating valve 11 to adjust the flow rate of steam flowing into the evaporation and transportation device 1;

[0098] Step S300, turning on the vacuum pump 15 to drive the precursor of the evaporation and delivery device 1 to flow into the reaction chamber 14;

[0099] Step S400 , adjusting the flow controller 13 to adjust the flow rate of the precursor into the reaction chamber 14 , the precursor enters the reaction chamber 14 and is deposited on the substrate to form a functional layer.

[0100] In a possible implementation, based on the use of the device 10, a semiconductor device can be obtained based on the device control method. Under the control of the pressure regulating valve 11, steam can be input into the evaporation and delivery device 1 at a certain flow rate. After a certain flow rate of steam enters the evaporation and delivery device 1 from the inlet 31, it can carry part of the precursor liquid in the upper tank chamber 22. Under the vacuuming action of the vacuum pump 15, the steam carrying the precursor liquid can be sucked out from the outlet 32 ​​of the evaporation and delivery device 1, so that the precursor enters the reaction chamber 14 of the device 10 at a flow rate that meets certain conditions. The evaporation and delivery device outputs stable, uniform, clean precursor vapor with small concentration fluctuations. The component distribution of the formed functional layer is uniform and the film thickness consistency is high, so that a semiconductor device with good performance can be produced.

[0101] The present application also provides an embodiment of a semiconductor device, which may include a substrate and a functional layer located on the substrate, and the functional layer may be a thin film obtained by depositing the precursor vapor on the surface of the substrate. The device 10 described in the above embodiment and the device control method described in the above embodiment can be used to obtain the functional layer on the substrate. The present application introduces a carrier gas into the evaporation and delivery device to eventually bring out a stable, uniform, clean precursor vapor with small concentration fluctuations, and forms a functional layer on the surface of the substrate by using the precursor vapor delivered by the evaporation and delivery device of the present application. The composition distribution of the functional layer is uniform, and the film thickness consistency is high, so that a semiconductor device with good performance can be produced.

[0102] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. An evaporation and delivery device, characterized in that: include: The bottle body is in a groove-shaped structure and has a groove cavity for containing the precursor liquid; A bottle cap, buckled on the bottle body and sealed with the opening of the groove cavity, the bottle cap seals the groove cavity, and the bottle cap is provided with an inlet and an outlet; The splash-proof structure is located in the groove cavity and is arranged on the inner wall of the bottle cap, the splash-proof structure includes a first splash-proof part, the first splash-proof part divides the groove cavity into a first cavity and a second cavity, the first cavity is located between the first splash-proof part and the bottle cap, the second cavity is located on the side of the first splash-proof part away from the bottle cap, the first cavity and the second cavity are connected to form a first curved channel; the splash-proof structure also includes a second splash-proof part, the second splash-proof part is at least partially located in the first cavity to divide the first cavity into a first sub-cavity and a second sub-cavity, the first sub-cavity and the second sub-cavity are connected to form a second curved channel, the second cavity, the second sub-cavity, the first sub-cavity and the outlet are connected in sequence, the first splash-proof part includes a first connecting part and a first splash-proof part main body, the first cavity is located between the first splash-proof part and the bottle cap, the second cavity is located on the side of the first splash-proof part away from the bottle cap, the first cavity and the second cavity are connected to form a first curved channel. Between the first splash-proof part body and the bottle cap, the first connecting part is connected between the first splash-proof part body and the bottle cap, the second splash-proof part includes a second connecting part and a second splash-proof part body, the second splash-proof part body is located between the first sub-cavity and the second sub-cavity, the second connecting part is connected between the second splash-proof part body and the bottle cap, the first splash-proof part also includes a first side plate located on both sides of the first splash-proof part body, the first side plate is respectively connected to the bottle cap, the first connecting part and the first splash-proof part body to enclose the first cavity with a groove-shaped structure, the second splash-proof part also includes a second side plate located on both sides of the second splash-proof part body, the second side plate is respectively connected to the bottle cap, the second connecting part and the second splash-proof part body to enclose the first sub-cavity with a groove-shaped structure.

2. The evaporation delivery device according to claim 1, characterized in that: A first gap is provided between the first splash-proof portion and the side wall of the groove cavity, the first cavity, the first gap and the second cavity are connected in sequence, and the first cavity and the second cavity are connected by bending at the first gap.

3. The evaporation delivery device according to claim 1, characterized in that: The first splash-proof body has a first guide surface facing one side of the bottle cap, and the first guide surface is inclined to guide the precursor on the first guide surface to the second cavity.

4. The evaporation delivery device according to claim 3, characterized in that: The first flow-guiding surface is a curved surface convex toward one side of the bottle cap.

5. The evaporation and delivery device according to any one of claims 1 to 4, characterized in that: A second gap is defined between the second anti-splash portion and the first anti-splash portion, the first sub-cavity, the second gap and the second sub-cavity are connected in sequence, and the first sub-cavity and the second sub-cavity are connected in a curved manner at the second gap.

6. The evaporation delivery device according to claim 1, characterized in that: The second splash-proof part body has a second flow-guiding surface facing one side of the bottle cap, and the second flow-guiding surface is inclined from the side connected to the second connecting part to a direction away from the bottle cap.

7. The evaporation delivery device according to claim 1 or 6, characterized in that: A third gap is defined between the first side plate and the second side plate, the first sub-cavity, the third gap and the second sub-cavity are connected in sequence, and the first sub-cavity and the second sub-cavity are connected by bending at the third gap.

8. The evaporation and delivery device according to any one of claims 1 to 4, characterized in that: The first anti-splash portion is provided with a grid having grid holes, and the first cavity, the grid holes and the second cavity are sequentially connected.

9. The evaporation delivery device according to claim 8, characterized in that: The first splash-proof part comprises a splash-proof cover in a groove-shaped structure, the opening of the splash-proof cover is connected to the inner wall surface of the bottle cap, the grille is arranged on the side wall of the splash-proof cover, the bottom wall of the splash-proof cover is arranged obliquely, and the lowest end of the bottom wall is provided with an opening; The second splash-proof part includes a tube body, which is located in the inner cavity of the splash-proof cover, one end of the tube body is connected to the inner wall of the bottle cap, the outlet is communicated with the inner cavity of the tube body, a fourth gap is provided between the other end of the tube body and the inner wall of the splash-proof cover, a spacing channel is provided between the outer wall of the tube body and the inner wall of the splash-proof cover, and the grille, the spacing channel, the fourth gap, the inner cavity of the tube body and the outlet are communicated in sequence.

10. The evaporation and delivery device according to any one of claims 1 to 4, characterized in that: The first splash-proof portion is provided with a first through hole, and the first through hole communicates with the first cavity and the second cavity.

11. The evaporation and delivery device according to any one of claims 1 to 4, characterized in that: The second splash-proof portion is provided with a second through hole, and the second through hole communicates with the first sub-cavity and the second sub-cavity.

12. A device, characterized in that: It comprises a pressure regulating valve, a flow controller, a reaction chamber, a vacuum pump and the evaporation and delivery device according to any one of claims 1 to 11, wherein the pressure regulating valve, the evaporation and delivery device, the flow controller and the reaction chamber are connected in sequence, and the evaporation and delivery device delivers precursor vapor into the reaction chamber to form a functional layer on the surface of the substrate.

13. A method for controlling a device as claimed in claim 12, characterized in that: The steps include: injecting steam into the evaporation and delivery device; adjusting the pressure regulating valve to adjust the flow rate of steam into the evaporation and delivery device; Turning on the vacuum pump to drive the precursor of the evaporation and delivery device to flow into the reaction chamber; The flow controller is adjusted to adjust the flow rate of the precursor flowing into the reaction chamber, and the precursor enters the reaction chamber and is deposited on the substrate to form a functional layer.

14. A semiconductor device, characterized in that: The semiconductor device comprises a substrate and a functional layer located on the substrate, wherein the functional layer is manufactured by the device according to claim 12 or the functional layer is obtained by the method according to claim 13.

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