Multifunctional metal surface processing system based on galvanometer

Abstract

The invention relates to a multifunctional metal surface processing system based on a galvanometer, comprising a laser for emitting a processing laser; a laser beam splitting transmission device arranged opposite to a light outlet of the laser and used for splitting the received processing laser into at least a first coherent light beam and a second coherent light beam; a first galvanometer and a second galvanometer are arranged at the rear end of the laser beam splitting transmission device, the first galvanometer receives the first coherent light beam, and the second galvanometer receives the second coherent light beam; a displacement platform is arranged below the first galvanometer and the second galvanometer, the displacement platform is used for loading a workpiece to be processed, the first coherent light beam controlled by the first galvanometer and the second coherent light beam controlled by the second galvanometer converge to form an interference light spot, which is controlled by the first galvanometer, the second galvanometer and the displacement platform, and the interference light spot moves on the surface of the workpiece to be processed according to a preset trajectory to perform subtractive processing to obtain a desired product morphology.

Description

Technical Field

[0001] The invention relates to the technical field of micro-nano processing, and in particular to a multifunctional metal surface processing system based on a galvanometer. Background Art

[0002] The strange phenomena and laws exhibited by micro-nano functional surfaces in engineering technology applications will change the existing theoretical framework, breed a new technological revolution, and bring great development space to the fields of materials, information, green manufacturing, biology and medicine. Existing laser micro-nano manufacturing technology has shown its unique advantages and potential. Laser micro-nano manufacturing technology mainly includes two categories: laser additive manufacturing and laser subtractive manufacturing. They can be used in different processing occasions of different products, making laser micro-nano manufacturing technology widely used in defense, aerospace, industry and medical fields.

[0003] In the related technology, the patent number is CN113515020B-an additive manufacturing system, including a three-dimensional displacement platform, a curing container, a surface projection device, a micro-nano light field control device and a grid-shaped heat conductor, the curing container is fixed on the three-dimensional displacement platform, and a curing pool for accommodating liquid photosensitive material is formed inside the curing container; the surface projection device emits surface projection light to project the liquid photosensitive material in the curing pool; the micro-nano light field control device emits N beams of coherent laser light to converge with the surface projection light, and the N beams of coherent laser light interfere at the convergence point to generate interference light, N≥2; the grid-shaped heat conductor is fixed in the curing pool, annularly arranged around the periphery of the workpiece to be processed, and at least partially immersed in the liquid photosensitive material; wherein the three-dimensional displacement platform drives the curing pool to move, and the surface projection light and the interference light work together to cure the liquid photosensitive material in the curing pool to form the main body of the workpiece to be processed, and form micrometer-scale or nanometer-scale concave and convex stripes on the main body of the workpiece to be processed. However, the laser point-by-point scanning processing technology in the related art for preparing micro-nano structures has shortcomings such as low processing efficiency and limited characteristic size of the micro-nano structures. Summary of the invention

[0004] The purpose of the present invention is to provide a multifunctional metal surface processing system based on a galvanometer, which is used to solve the problems of low processing efficiency and limited characteristic size of micro-nano structures in the preparation of micro-nano structures by laser point-by-point scanning processing technology in the prior art.

[0005] According to one aspect of the present invention, there is provided a multifunctional metal surface processing system based on a galvanometer, comprising:

[0006] A laser, for emitting a processing laser;

[0007] A laser beam splitting transmission device, which is arranged opposite to the light outlet of the laser and is used to split the received processing laser into at least a first coherent light beam and a second coherent light beam;

[0008] A first galvanometer and a second galvanometer, wherein the first galvanometer and the second galvanometer are arranged at the rear end of the laser beam splitting transmission device, the first galvanometer receives the first coherent light beam, and the second galvanometer receives the second coherent light beam;

[0009] A displacement platform is provided below the first galvanometer and the second galvanometer. The displacement platform is used to load the workpiece to be processed. The first coherent light beam controlled by the first galvanometer and the second coherent light beam controlled by the second galvanometer converge to form an interference light spot. The interference light spot is controlled by the first galvanometer, the second galvanometer and the displacement platform. The interference light spot moves along a preset trajectory on the surface of the workpiece to be processed to perform subtractive processing to obtain the desired product morphology. The subtractive processing speed v can be derived by the following formula:

[0010]

[0011] E p =E0ft (2)

[0012] From formula (1) and (2), we have:

[0013]

[0014]

[0015] Symbols:

[0016] h——Processing depth (an indicator to measure the degree of microstructure forming) (m)

[0017] L0——Latent heat of vaporization (material property, determines the material ablation threshold) (J / m 3 )

[0018] γ——Laser incident divergence half angle (material properties) (rad)

[0019] d0——Spot diameter (m)

[0020] E p ——Laser energy (J)

[0021] E0——Single pulse energy (J)

[0022] f——Pulse frequency

[0023] v——Processing speed (m 2 / s)

[0024] t—— single spot processing time (s)

[0025] s——area of ​​a single light spot (m 3).

[0026] In one embodiment, the formula (4) can be simplified as follows:

[0027] v=1.21*E0.

[0028] In one embodiment, the scanning overlap area of ​​the scanning range of the first galvanometer on the displacement platform and the scanning range of the second galvanometer on the displacement platform is set as a processing area S, the first galvanometer and the second galvanometer are arranged at the same height and the distance from the light outlet to the processing surface is set to H, the interference incident angle of the first related light beam and the second coherent light beam is set to θ, the distance between the first galvanometer and the second galvanometer is set to d, the distance from the light outlet of the first galvanometer and the second galvanometer to the galvanometer edge is set to k, and the maximum interference incident angle is set to θ1;

[0029] Among them, S, H, θ1, d and k are related, and:

[0030] S=2Htanθ1[2Htanθ1-(d+2k)].

[0031] In one embodiment, the displacement platform includes a processing platform, an X-axis moving module and a Y-axis moving module connected thereto, the X-axis moving module includes a tray, an X-axis servo motor, an X-axis precision screw and an X-axis transmission nut, the X-axis servo motor is arranged on the tray and connected to the X-axis precision screw, the X-axis transmission nut is sleeved on the outside of the X-axis precision screw and connected to the processing platform, the Y-axis moving module includes a Y-axis servo motor, a Y-axis precision screw and a Y-axis transmission nut, the Y-axis servo motor is connected to the Y-axis precision screw, the Y-axis transmission nut is sleeved on the outside of the Y-axis precision screw and connected to the tray.

[0032] In one embodiment, the laser beam splitting transmission equipment includes a beam splitter and a reflector, wherein the beam splitter is opposite to the light outlet of the laser, and is used to split the processing laser into the first coherent beam and the second coherent beam, and the first coherent beam continues to be transmitted after passing through the beam splitter, and the reflector is arranged at intervals on the opposite side of the beam splitter, and the second coherent beam separated by reflection from the beam splitter is transmitted to the reflector, and then continues to be transmitted after reflection from the reflector; wherein the second coherent beam is transmitted in parallel with the first coherent beam.

[0033] In one embodiment, the laser beam splitting transmission device also includes a first polarizer and a first wave plate, wherein the first polarizer is spaced apart and arranged at the rear end of the beam splitter, and the first wave plate is spaced apart and arranged at the rear end of the first polarizer and located between the first polarizer and the first galvanometer.

[0034] In one embodiment, the laser beam splitting transmission device also includes a second polarizer and a second wave plate, the second polarizer is spaced apart at the rear end of the reflector, the second wave plate is spaced apart at the rear end of the second polarizer and is located between the second polarizer and the second galvanometer.

[0035] In one embodiment, when the interference spot moves along the Z axis, θ1 is the interference incident angle of the first coherent light beam, θ2 is the interference incident angle of the second coherent light beam, θ3 is the deflection angle of the first galvanometer, and θ4 is the deflection angle of the second galvanometer. As the internal angles are equal, θ1=θ3, θ2=θ4.

[0036] Controlled by the driving of the first galvanometer and the second galvanometer 420, when the interference spot moves from point A (0, 0, z1) to point B (0, 0, z2), θ1, θ2, θ3, and θ4 all change, and: θ1=θ2, θ3=θ4. By changing the position of the interference spot on the Z-axis, the interference incident angles θ1 and θ2 can be changed, thereby realizing periodic regulation of the micro-nano structure.

[0037] In one of the embodiments, during the movement of the interference spot on the X-axis, θ1 is the interference incident angle of the first coherent light beam, θ2 is the interference incident angle of the second coherent light beam, θ3 is the deflection angle of the first galvanometer, and θ4 is the deflection angle of the second galvanometer; controlled by the drive of the first galvanometer and the second galvanometer, during the movement of the interference spot from point C (x1, y1, z1) to point D (x2, y1, z1), θ1, θ2, θ3, and θ4 all change, and: θ1≠θ2, θ3≠θ4, and by changing the position of the interference spot on the X-axis, the interference incident angles θ1 and θ2 can be changed, thereby realizing periodic regulation of the micro-nano structure.

[0038] In one embodiment, the galvanometer-based multifunctional metal surface processing system also includes an industrial computer and a motion controller, the industrial computer is electrically connected to the motion controller, and the motion controller is electrically connected to the laser, the first galvanometer, and the second galvanometer.

[0039] Implementing the embodiments of the present invention will have the following beneficial effects:

[0040] When the galvanometer-based multifunctional metal surface processing system of the present scheme is working, the processing laser emitted by the laser will first be transmitted to the laser beam splitting transmission device, and the laser beam splitting transmission device will split the processing laser into at least a first coherent light beam and a second coherent light beam, and then the first coherent light beam will continue to be transmitted to the first galvanometer, and at the same time, the second coherent light beam will continue to be transmitted to the second galvanometer, so that the first coherent light beam controlled by the first galvanometer and the second coherent light beam controlled by the second galvanometer will converge on the displacement platform and form an interference spot, wherein the overlapping area of ​​the scanning range of the first galvanometer and the second galvanometer is the processing range, and when the interference spot moves to the surface of the workpiece to be processed, the interference spot laser energy will ablate and remove part of the material of the workpiece to be processed, and continuous processing is achieved as the interference spot moves along the preset path, thereby completing the subtractive manufacturing of the workpiece to be processed. Compared with the existing technology, this solution combines the characteristics of high-speed scanning of the laser beam controlled by the galvanometer with the advantages of large-area high-precision patterning of laser interference, which can realize fast and large-format laser micro-nano additive / subtractive manufacturing. At the same time, it also takes into account the characteristics of digital processing of macro structures and massive high-precision micro structures. The scanning speed and angle of the galvanometer, as well as the power and pulse width of the laser, are adjusted to control the depth, width, and characteristic size of the microstructure to achieve the best subtractive manufacturing quality and efficiency, thereby reducing the difficulty of micro-nano structure processing and improving the efficiency of micro-nano structure preparation. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0042] Figure 1 It is a structural schematic diagram of a multifunctional metal surface processing system based on a galvanometer according to an embodiment;

[0043] Figure 2 A schematic diagram of the processing range of the multifunctional metal surface processing system based on a galvanometer;

[0044] Figure 3 Schematic diagram of the interference spot moving on the Z axis;

[0045] Figure 4 Schematic diagram of the interference spot moving on the X-axis;

[0046] Figure 5 for Figure 1 The electron microscope scanning image after processing cobalt-chromium-molybdenum alloy by the multifunctional metal surface processing system based on the galvanometer shown;

[0047] Figure 6for Figure 1 The electron microscope scanning image after processing cobalt-chromium-molybdenum alloy by the galvanometer-based multifunctional metal surface processing system is shown.

[0048] in:

[0049] 100. Multifunctional metal surface processing system based on galvanometer; 10. Laser; 20. Laser beam splitting transmission equipment; 21. Beam splitter; 22. Reflector; 23. First polarizer; 24. First wave plate; 25. Second polarizer; 26. Second wave plate; 30. First galvanometer; 40. Second galvanometer; 50. Displacement platform; 51. X-axis moving module; 52. Y-axis moving module; 60. Industrial computer; 70. Motion controller; 200. First coherent light beam; 300. Second coherent light beam. DETAILED DESCRIPTION

[0050] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0051] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0052] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0053] Please refer to Figure 1, is a multifunctional metal surface processing system 100 based on a galvanometer according to an embodiment, which includes a laser 10 for emitting a processing laser; a laser beam splitting transmission device 20, which is arranged opposite to the light outlet of the laser 10 and is used to split the received processing laser into at least a first coherent light beam 200 and a second coherent light beam 300; a first galvanometer 30 and a second galvanometer 40, which are arranged at the rear end of the laser beam splitting transmission device 20, and the first galvanometer 30 receives the first coherent light beam 200 and the second coherent light beam 300; The first galvanometer 30 receives the second coherent light beam 200, and the second galvanometer 40 receives the second coherent light beam 300. The displacement platform 50 is arranged below the first galvanometer 30 and the second galvanometer 40. The displacement platform 50 is used to load the workpiece to be processed. The first coherent light beam 200 controlled by the first galvanometer 30 and the second coherent light beam 300 controlled by the second galvanometer 40 converge to form an interference spot. Controlled by the first galvanometer 30, the second galvanometer 40 and the displacement platform 50, the interference spot moves along a preset trajectory on the surface of the workpiece to be processed to perform subtractive processing to obtain the desired product morphology.

[0054] It is necessary to explain that the present invention can control the depth, width, and characteristic size of the microstructure by adjusting the scanning speed and angle of the first galvanometer 30 and the second galvanometer 40, as well as the power and pulse width of the laser 10 using control software to achieve optimal subtractive manufacturing quality and efficiency.

[0055] Among them, the subtractive processing speed v can be derived by the following formula:

[0056]

[0057] E p =E0ft (2)

[0058] From formula (1) and (2), we have:

[0059]

[0060]

[0061] Symbols:

[0062] h——Processing depth (an indicator to measure the degree of microstructure forming) (m)

[0063] L0——Latent heat of vaporization (material property, determines the material ablation threshold) (J / m 3 )

[0064] γ——Laser incident divergence half angle (material properties) (rad)

[0065] d0——Spot diameter (m)

[0066] E p——Laser energy (J)

[0067] E0——Single pulse energy (J)

[0068] f——Pulse frequency

[0069] v——Processing speed (m 2 / s)

[0070] t—— single spot processing time (s)

[0071] s——area of ​​a single light spot (m 3 ).

[0072] The implementation of the embodiment of the present invention will have the following beneficial effects: when the multifunctional metal surface processing system 100 based on the galvanometer of the present scheme is working, the processing laser emitted by the laser 10 will first be transmitted to the laser beam splitting transmission device 20, and the laser beam splitting transmission device 20 will split the processing laser into at least a first coherent light beam 200 and a second coherent light beam 300, and then the first coherent light beam 200 will continue to be transmitted to the first galvanometer 30, and the second coherent light beam 300 will continue to be transmitted to the second galvanometer 40, so that the first coherent light beam 200 controlled by the first galvanometer 30 and the second coherent light beam 300 controlled by the second galvanometer 40 will converge on the displacement platform 50 and form an interference spot, wherein the overlapping area of ​​the scanning range of the first galvanometer 30 and the second galvanometer 40 is the processing range, and when the interference spot moves to the surface of the workpiece to be processed, the interference spot laser energy will ablate and remove part of the material of the workpiece to be processed, and continuous processing is achieved as the interference spot moves along the preset path, thereby completing the subtractive manufacturing of the workpiece to be processed. Compared with the existing technology, this solution combines the characteristics of high-speed scanning of the laser beam controlled by the galvanometer with the advantages of large-area high-precision patterning of laser interference, which can realize fast and large-scale laser micro-nano additive / subtractive manufacturing. At the same time, it also takes into account the characteristics of digital processing of macro structures and massive high-precision micro structures. The scanning speed and angle of the first galvanometer 30 and the second galvanometer 40, as well as the power and pulse width of the laser 10 are adjusted to control the depth, width, and characteristic size of the microstructure to achieve the best subtractive manufacturing quality and efficiency, thereby reducing the difficulty of micro-nano structure processing and improving the efficiency of micro-nano structure preparation.

[0073] It is necessary to explain that the first coherent light beam 200 and the second coherent light beam 300 of the processing laser beam emitted by the same laser 10 have the same wavelength. When irradiated onto the same plane, the first coherent light beam 200 and the second coherent light beam 300 converge to generate laser interference.

[0074] In addition, it is necessary to explain that the present invention provides the processing efficiency of the micro-nano structure by converging the first coherent light beam 200 and the second coherent light beam 300 to form an interference light spot, which has no direct correlation with the energy density of the first coherent light beam 200 and the second coherent light beam 300. In other words, according to actual needs, after the processing laser beam splitting process, the energy density of the first coherent light beam 200 may be greater than the energy density of the second coherent light beam 300, or the energy density of the second coherent light beam 300 may be greater than the energy density of the first coherent light beam 200.

[0075] In the present application, the function of the first galvanometer 30 is to control the scanning direction and speed of the corresponding first coherent light beam 200, so as to focus with the second coherent light beam 300 controlled by the second galvanometer 40, thereby forming an interference spot on the workbench plane, and achieving the purpose of marking according to the preset pattern and parameters. The function of the second galvanometer 40 is to control the scanning direction and speed of the corresponding second coherent light beam 300, so as to focus with the first coherent light beam 200 controlled by the first galvanometer 30, thereby forming an interference spot on the workbench plane, and achieving the purpose of additive manufacturing according to the preset pattern and parameters.

[0076] The present invention can select lasers 10 of different types and wavelengths, such as solid lasers, semiconductor lasers, gas lasers, etc., according to different additive and subtractive processing requirements, so as to adapt to the additive and subtractive processing requirements of different materials.

[0077] In formula (4), L0 is a fixed value of metal material, γ is a parameter of the laser 10 itself, s is the area of ​​an interference spot and is also a fixed value, and the processing speed is proportional to the laser energy. For example, when metal copper is selected for processing under a 1064nm solid-state laser and the processing depth is 10 microns, other parameters can be determined as follows:

[0078] <![CDATA[L0]]> γ <![CDATA[d0]]> f <![CDATA[47kJ / cm 3 ]]> 7.39μrad 12mm 10

[0079] Under this condition, formula (4) can be simplified to: v = 1.21*E0, unit: (m 2 / s).

[0080] Based on the maximum scanning speed of 2m / s of the selected galvanometer, a scanning speed of 1.8m / s is proposed. According to the simplified formula above, the laser energy is 1.49J, and it takes about 8 seconds to process an area of ​​0.12m*0.12m. Taking the preparation of a stripe structure with a period of 2 microns (duty cycle of 1:1) as an example, compared with the traditional laser focused galvanometer scanning processing, it takes 4000s to complete the processing of a 0.12m*0.12m sample at a scanning speed of 1.8m / s. It can be seen that the existing technology is 500 times that of the traditional technology.

[0081] In the present application, the scanning overlap area of ​​the scanning range of the first galvanometer 30 on the displacement platform 50 and the scanning range of the second galvanometer 40 on the displacement platform 50 is set as the processing area S, the first galvanometer 30 and the second galvanometer 40 are set at the same height and the distance from the light outlet to the processing surface is set to H, the interference incident angle of the first coherent light beam 200 and the second coherent light beam 300 is set to θ, the distance between the first galvanometer 30 and the second galvanometer 40 is set to d, the distance from the light outlet of the first galvanometer 30 and the second galvanometer 40 to the galvanometer edge is set to k, and the maximum interference incident angle is set to θ1; wherein S, H, θ1, d and k are related, and:

[0082] S=2Htanθ1[2Htanθ1-(d+2k)].

[0083] In this way, the area size of each processing area S can be quantitatively determined, and then multiple processing areas can be accurately divided according to different processing patterns.

[0084] In one embodiment, the displacement platform 50 includes a processing platform, an X-axis moving module 51 and a Y-axis moving module 52 connected thereto, the X-axis moving module 51 includes a tray, an X-axis servo motor, an X-axis precision screw and an X-axis transmission nut, the X-axis servo motor is arranged on the tray and connected to the X-axis precision screw, the X-axis transmission nut is sleeved on the outside of the X-axis precision screw and connected to the processing platform, the Y-axis moving module 52 includes a Y-axis servo motor, a Y-axis precision screw and a Y-axis transmission nut, the Y-axis servo motor is connected to the Y-axis precision screw, the Y-axis transmission nut is sleeved on the outside of the Y-axis precision screw and connected to the tray. With the help of the precision screw nut for precise transmission, it can ensure that the processing platform drives the workpiece to be processed to accurately displace in any direction and any stroke size in the XY plane, and ensure that the interference spot moves accurately on the workpiece to be processed according to the preset path, so as to gradually process the designed product morphology.

[0085] Of course, in other optional embodiments, electric push rods, cylinder sliders, etc. can also be used to replace the above-mentioned screw nuts.

[0086] See also Figure 1In an optional embodiment, the laser beam splitting transmission device 20 includes a beam splitter 21 and a reflector 22. The beam splitter 21 is opposite to the light outlet of the laser 10. The beam splitter 21 is used to split the processing laser into a first coherent beam 200 and a second coherent beam 300. The first coherent beam 200 continues to be transmitted after passing through the beam splitter 21. The reflector 22 is arranged at intervals on the opposite side of the beam splitter 21. The second coherent beam 300 separated by reflection from the beam splitter 21 is transmitted to the reflector 22, and then continues to be transmitted after being reflected by the reflector 22; wherein the second coherent beam 300 is transmitted in parallel with the first coherent beam 200. When the processing laser is irradiated onto the beam splitter 21, the beam splitter 21 can split the processing laser into a first coherent light beam 200 and a second coherent light beam 300, and after being processed by the beam splitter 21 and the reflector 22 respectively, the first coherent light beam 200 and the second coherent light beam 300 can continue to be transmitted backward in a parallel relationship, thereby avoiding the first coherent light beam 200 and the second coherent light beam 300 from intersecting before reaching the first galvanometer 30 and the second galvanometer 40.

[0087] According to actual needs, the beam splitter 21 adopts any one of a beam splitter or a grating. In actual use, the beam splitter is installed and fixed by an adjustable bracket, and the mirror surface of the beam splitter faces the light outlet of the laser 10. After the processing laser is irradiated on the beam splitter, a part of the laser beam will penetrate the beam splitter to form a first coherent light beam 200, and the other part of the laser beam will be reflected on the mirror surface and irradiated on the reflector 22, and then reflected by the reflector 22 to form a second coherent light beam 300. The laser beam splitting structure is simple and has strong feasibility.

[0088] Preferably, the adjustable bracket is angularly adjustable and / or height adjustable, so that the beam splitter and the laser 10 form different emission distances and azimuth relationships, thereby obtaining different first coherent light beams 200 and second coherent light beams 300 according to actual needs.

[0089] In addition, in another optional embodiment, the laser beam splitting transmission device 20 further includes a first polarizer 23 and a first wave plate 24, wherein the first polarizer 23 is disposed at a distance at the rear end of the beam splitter 21, and the first wave plate 24 is disposed at a distance at the rear end of the first polarizer 23 and is located between the first polarizer 23 and the first galvanometer 30. The first coherent light beam 200 is transmitted once through the first polarizer 23 and the first wave plate 24, so that the first coherent light beam 200 can be shaped to obtain a desired spot shape, and the laser energy can be more concentrated, thereby improving the transmission efficiency and quality of the first coherent light beam 200.

[0090] Furthermore, the laser beam splitting transmission device 20 further includes a second polarizer 25 and a second wave plate 26, wherein the second polarizer 25 is disposed at a distance at the rear end of the reflector, and the second wave plate 26 is disposed at a distance at the rear end of the second polarizer 25 and is located between the second polarizer 25 and the second galvanometer 40. The second coherent light beam 300 is transmitted once through the second polarizer 25 and the second wave plate 26, so that the second coherent light beam 300 can be shaped to obtain a desired spot shape, and the laser energy can be more concentrated, thereby improving the transmission efficiency and quality of the second coherent light beam 300.

[0091] In another embodiment, the multifunctional metal surface processing system 100 based on the galvanometer further includes an industrial computer 60 and a motion controller 70, wherein the industrial computer 60 is electrically connected to the motion controller 70, and the motion controller 70 is electrically connected to the laser 10, the first galvanometer 30, and the second galvanometer 40. The industrial computer 60 is used to generate a pattern module code, which is used to generate a corresponding control code for the rotation trajectory and rotation rate of the first galvanometer 30 and the second galvanometer 40 according to the pattern and parameters input or selected by the user; the motion controller 70 is used to realize the on / off mode of the laser 10, and realize the motion control of the x-axis and y-axis galvanometer lenses in the first galvanometer 30 and the second galvanometer 40.

[0092] View Figures 2 to 6 In this application, when the interference spot of the multifunctional metal surface processing system 100 based on the galvanometer moves along the Z axis, θ1 is the interference incident angle of the coherent laser LB1, θ2 is the interference incident angle of the coherent laser LB2, θ3 is the deflection angle of the first galvanometer 30, and θ4 is the deflection angle of the second galvanometer 40. As the internal angles are equal, θ1=θ3, θ2=θ4. Under the action of the first galvanometer 30 and the second galvanometer 40, the interference spot moves from point A (0, 0, z1) to point B (0, 0, z2); during the movement, θ1, θ2, θ3, and θ4 all change, and: θ1=θ2, θ3=θ4. By changing the position of the interference spot on the Z axis, the interference incident angles θ1 and θ2 can be changed, thereby realizing the periodic regulation of the micro-nano structure.

[0093] During the movement of the interference spot of the multifunctional metal surface processing system 100 based on the galvanometer on the X-axis, θ1 is the interference incident angle of the coherent laser LB1, θ2 is the interference incident angle of the coherent laser LB2, θ3 is the deflection angle of the first galvanometer 30, and θ4 is the deflection angle of the first galvanometer 30. Under the action of the first galvanometer 30 and the second galvanometer 40, the interference spot moves from point C (x1, y1, z1) to point D (x2, y1, z1); during the movement, θ1, θ2, θ3, and θ4 all change, and: θ1≠θ2, θ3≠θ4, by changing the position of the interference spot on the X-axis, the interference incident angles θ1 and θ2 can be changed, thereby realizing the periodic regulation of the micro-nano structure.

[0094] In addition, the present application also provides a processing example, the laser 10 is a Nd:YAG pulse laser with a wavelength of 1064nm, a spot diameter of 2mm, and an output power of 2W; the processing material is a cobalt-chromium-molybdenum alloy. Under the Nd:YAG pulse laser processing with an output power of 2W and a spot diameter of 2mm, the number of coherent laser beams is two, and the processing speed is: 0.4mm 2 / s, the writing linear speed is: 41.7mm / s, and its efficiency is much higher than the traditional direct laser writing speed. After being processed by the multifunctional metal surface dual-beam processing system based on the galvanometer, the surface of the processed material presents an interference fringe structure at the microscopic level, with a characteristic size of about 8um and an interference fringe period of about 10um.

[0095] like Figure 6 As shown in another processing example, the laser 10 is a Nd:YAG pulse laser with a wavelength of 1064nm, a spot diameter of 2mm, and an output power of 2W; the processing material is cobalt-chromium-molybdenum alloy. Under the Nd:YAG pulse laser processing with an output power of 2W and a spot diameter of 2mm, the number of coherent laser beams is three, and the processing speed is: 0.4mm 2 / s, the writing linear speed is: 41.7mm / s, and its efficiency is much higher than the traditional direct laser writing speed. After being processed by the multifunctional metal surface dual-beam processing system based on the galvanometer, the surface of the processed material presents an interference lattice structure at the microscopic level.

[0096] It is necessary to explain that when two two-dimensional scanning galvanometers are used to control the corresponding outgoing laser beams to converge, a stripe structure pattern appears on the surface of the workpiece to be processed. When three or more two-dimensional scanning galvanometers are used to control the corresponding laser beams to converge, a dot matrix structure pattern appears on the surface of the sample to be processed.

[0097] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A multifunctional metal surface processing system based on a galvanometer, characterized in that: include: A laser, for emitting a processing laser; A laser beam splitting transmission device, which is arranged opposite to the light outlet of the laser and is used to split the received processing laser into at least a first coherent light beam and a second coherent light beam; A first galvanometer and a second galvanometer, wherein the first galvanometer and the second galvanometer are arranged at the rear end of the laser beam splitting transmission device, the first galvanometer receives the first coherent light beam, and the second galvanometer receives the second coherent light beam; A displacement platform is provided below the first galvanometer and the second galvanometer. The displacement platform is used to load the workpiece to be processed. The first coherent light beam controlled by the first galvanometer and the second coherent light beam controlled by the second galvanometer converge to form an interference light spot. The interference light spot is controlled by the first galvanometer, the second galvanometer and the displacement platform. The interference light spot moves along a preset trajectory on the surface of the workpiece to be processed to perform subtractive processing to obtain the desired product morphology. The subtractive processing speed v can be derived by the following formula: AND p =E0ft (2) From formula (1) and (2), we have: Symbols: h——Processing depth (an indicator to measure the degree of microstructure forming) (m) L0——Latent heat of vaporization (material property, determines the material ablation threshold) (J / m 3 ) γ——Laser incident divergence half angle (material properties) (rad) d0——Spot diameter (m) E p ——Laser energy (J) E0——Single pulse energy (J) f——Pulse frequency v——Processing speed (m 2 / s) t—— single spot processing time (s) s——area of ​​a single light spot (m 3 ).

2. The multifunctional metal surface processing system based on a galvanometer according to claim 1 is characterized in that: The formula (4) can be simplified as follows: v=1.21*E0.

3. The multifunctional metal surface processing system based on a galvanometer according to claim 1 is characterized in that: The scanning overlap area of ​​the scanning range of the first galvanometer on the displacement platform and the scanning range of the second galvanometer on the displacement platform is set as a processing area S, the first galvanometer and the second galvanometer are arranged at the same height and the distance from the light outlet to the processing surface is set to H, the interference incident angle of the first coherent light beam and the second coherent light beam is set to θ, the distance between the first galvanometer and the second galvanometer is set to d, the distance from the light outlet of the first galvanometer and the second galvanometer to the galvanometer edge is set to k, and the maximum interference incident angle is set to θ1; Among them, S, H, θ1, d and k are related, and: S=2Htanθ1[2Htanθ1-(d+2k)].

4. The multifunctional metal surface processing system based on a galvanometer according to claim 1 is characterized in that: The displacement platform includes a processing platform, an X-axis moving module and a Y-axis moving module connected thereto, the X-axis moving module includes a pallet, an X-axis servo motor, an X-axis precision lead screw and an X-axis transmission nut, the X-axis servo motor is arranged on the pallet and connected to the X-axis precision lead screw, the X-axis transmission nut is sleeved on the outside of the X-axis precision lead screw and connected to the processing platform, the Y-axis moving module includes a Y-axis servo motor, a Y-axis precision lead screw and a Y-axis transmission nut, the Y-axis servo motor is connected to the Y-axis precision lead screw, the Y-axis transmission nut is sleeved on the outside of the Y-axis precision lead screw and connected to the pallet.

5. The multifunctional metal surface processing system based on a galvanometer according to any one of claims 1 to 4, characterized in that: The laser beam splitting transmission equipment includes a beam splitter and a reflector. The beam splitter is opposite to the light outlet of the laser. The beam splitter is used to split the processing laser into the first coherent beam and the second coherent beam. The first coherent beam continues to be transmitted after passing through the beam splitter. The reflector is arranged at intervals on the opposite side of the beam splitter. The second coherent beam separated by reflection from the beam splitter is transmitted to the reflector and then continues to be transmitted after reflection from the reflector. The second coherent beam is transmitted in parallel with the first coherent beam.

6. The multifunctional metal surface processing system based on a galvanometer according to claim 5, characterized in that: The laser beam splitting transmission device also includes a first polarizer and a first wave plate, wherein the first polarizer is disposed at a rear end of the beam splitter, and the first wave plate is disposed at a rear end of the first polarizer and is located between the first polarizer and the first galvanometer.

7. The multifunctional metal surface processing system based on a galvanometer according to claim 6, characterized in that: The laser beam splitting transmission device also includes a second polarizer and a second wave plate, wherein the second polarizer is spaced apart at the rear end of the reflector, and the second wave plate is spaced apart at the rear end of the second polarizer and is located between the second polarizer and the second galvanometer.

8. The multifunctional metal surface processing system based on a galvanometer according to claim 1, characterized in that: During the movement of the interference spot on the Z axis, let θ1 be the interference incident angle of the first coherent light beam, θ2 be the interference incident angle of the second coherent light beam, θ3 be the deflection angle of the first galvanometer, and θ4 be the deflection angle of the second galvanometer; it can be known from the equality of the internal angles that θ1=θ3, θ2=θ4; Controlled by the driving of the first galvanometer and the second galvanometer 420, when the interference spot moves from point A (0, 0, z1) to point B (0, 0, z2), θ1, θ2, θ3, and θ4 all change, and: θ1=θ2, θ3=θ4. By changing the position of the interference spot on the Z-axis, the interference incident angles θ1 and θ2 can be changed, thereby realizing periodic regulation of the micro-nano structure.

9. The multifunctional metal surface processing system based on a galvanometer according to claim 1, characterized in that: During the movement of the interference spot on the X-axis, θ1 is the interference incident angle of the first coherent light beam, θ2 is the interference incident angle of the second coherent light beam, θ3 is the deflection angle of the first galvanometer, and θ4 is the deflection angle of the second galvanometer; controlled by the drive of the first galvanometer and the second galvanometer, during the movement of the interference spot from point C (x1, y1, z1) to point D (x2, y1, z1), θ1, θ2, θ3, and θ4 all change, and: θ1≠θ2, θ3≠θ4, by changing the position of the interference spot on the X-axis, the interference incident angles θ1 and θ2 can be changed, thereby realizing periodic regulation of the micro-nano structure.

10. The multifunctional metal surface processing system based on a galvanometer according to claim 1, characterized in that: The multifunctional metal surface processing system based on the galvanometer further includes an industrial computer and a motion controller. The industrial computer is electrically connected to the motion controller, and the motion controller is electrically connected to the laser, the first galvanometer and the second galvanometer.

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