Phased array antenna and its microchannel heat dissipation structure

Abstract

The present invention relates to a phased array antenna and a microchannel heat dissipation structure thereof, wherein the microchannel heat dissipation structure comprises: a microchannel cold plate, wherein a microchannel network is provided inside the microchannel network, wherein the microchannel network comprises a main root channel and secondary lateral root channels connected to the main root channel, wherein the main root channel is arranged along the length direction of the microchannel cold plate, and the secondary lateral root channels are arranged on both sides of the main root channel; a radio frequency circuit installation cavity and a control circuit installation cavity are arranged on the top and bottom surfaces of the microchannel cold plate and on both sides of the microchannel network; a connector installation cavity is arranged through the top and bottom surfaces of the microchannel cold plate and connected to the radio frequency circuit installation cavity and the control circuit installation cavity; and a fluid interface is arranged on the outer surface of the microchannel cold plate and connected to the main root channel. The present invention adopts a microchannel bionic structure, which can achieve efficient heat dissipation and heat replenishment under limited space conditions while meeting the temperature uniformity requirements of multiple chips on the antenna array surface, thereby meeting the electrical performance requirements of the phased array antenna.

Description

Technical Field

[0001] The present invention relates to the field of microwave emission technology, and in particular to a phased array antenna and a microchannel heat dissipation structure thereof. Background Art

[0002] With the rapid development of 5G communications and satellite internet communications, millimeter-wave active phased array antennas are experiencing unprecedented growth. Tile-type phased array antennas utilize a highly integrated chip array parallel to the antenna face. They feature a low profile, light weight, and easy conformal integration into payload platforms. They are widely used in applications such as satellite communication terminals and 5G antennas. However, the extremely high density of transceiver chips and various circuits causes a sharp increase in antenna face temperature, impacting the antenna's electrical performance.

[0003] Phased array antennas utilize a laminated tile-like overall architecture, making them highly sensitive to structural deformation. Thermal deformation and temperature drift can degrade the antenna's electrical performance. Furthermore, when operating in a space environment, the antenna's surface heat flux is high and the vacuum heat dissipation environment creates extremely limited spatial dimensions and thermal control conditions. This requires addressing the challenges of antenna thermal insulation, localized high heat flux on the antenna surface, and temperature consistency across multiple chips within a wide temperature range and the constrained thermal control space and conditions onboard. Summary of the Invention

[0004] In order to solve the technical problems existing in the above-mentioned prior art, the purpose of the present invention is to provide a phased array antenna and its microchannel heat dissipation structure, which can meet the temperature uniformity requirements of multiple chips on the antenna array surface while achieving efficient heat dissipation and heat replenishment under limited space conditions, thereby meeting the electrical performance requirements of the phased array antenna.

[0005] To achieve the above-mentioned object, the present invention provides a microchannel heat dissipation structure for a phased array antenna, comprising:

[0006] A microchannel cold plate having a microchannel network therein, the microchannel network comprising a main root channel and secondary lateral root channels communicating with the main root channel, the main root channel being arranged along the length of the microchannel cold plate, and the secondary lateral root channels being arranged on both sides of the main root channel;

[0007] The radio frequency circuit installation cavity and the control circuit installation cavity are arranged on the top surface and the bottom surface of the microchannel cold plate and on both sides of the microchannel network;

[0008] a connector mounting cavity, which is provided through the top and bottom surfaces of the microchannel cold plate and is in communication with the RF circuit mounting cavity and the control circuit mounting cavity;

[0009] The fluid interface is provided on the outer surface of the microchannel cold plate and is communicated with the main root channel.

[0010] According to a technical solution of the present invention, the main root channel includes a first main root channel and a second main root channel symmetrically arranged along the length direction of the microchannel cold plate, the diameters of the first main root channel and the second main root channel gradually decrease from the end connected to the fluid interface to the end close to the middle of the microchannel cold plate, and the first main root channel and the second main root channel are connected through the secondary lateral root channel.

[0011] According to a technical solution of the present invention, the diameter of the secondary lateral root channel is 100 μm.

[0012] According to a technical solution of the present invention, a radio frequency circuit mounting platform and a chip mounting groove are provided in the radio frequency circuit mounting cavity, and a control circuit mounting platform and a device mounting groove are provided in the control circuit mounting cavity, and the depth of the device mounting groove is greater than the maximum height of the device.

[0013] According to a technical solution of the present invention, the secondary lateral root channel includes a lateral lateral root channel parallel to the length direction of the microchannel cold plate and a longitudinal lateral root channel perpendicular to the lateral lateral root channel, and the intersection of the lateral lateral root channel and the longitudinal lateral root channel is set below the chip mounting groove.

[0014] According to a technical solution of the present invention, a heat transfer surface is provided in the chip mounting groove and the device mounting groove.

[0015] According to a technical solution of the present invention, a thermally conductive pad is provided on the heat transfer surface.

[0016] According to one aspect of the present invention, there is provided a phased array antenna, comprising the above-mentioned microchannel heat dissipation structure, and further comprising:

[0017] a radome, disposed on top of the microchannel cold plate;

[0018] A radio frequency circuit is fixedly arranged in the radio frequency circuit installation cavity;

[0019] A control circuit is fixedly arranged in the control circuit installation cavity;

[0020] An antenna array surface is arranged on top of the radio frequency circuit and is electrically connected to the radio frequency circuit;

[0021] A radio frequency chip and a power device are fixed on the radio frequency circuit and the control circuit, respectively, and are electrically connected to the radio frequency circuit and the control circuit, respectively;

[0022] A connector is arranged in the connector installation cavity and is electrically connected to the radio frequency circuit and the control circuit.

[0023] According to a technical solution of the present invention, the antenna cover is made of a transparent material with a honeycomb sandwich structure.

[0024] According to a technical solution of the present invention, the antenna array includes a plurality of spliced microstrip antenna units, and the microstrip antenna units are manufactured using a standard modular borderless process.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] The present invention provides a phased array antenna and its microchannel heat dissipation structure. The microchannel heat dissipation structure includes a microchannel cold plate. A microchannel network consisting of a main root channel and secondary lateral root channels is provided on the microchannel cold plate. The microchannel network forms a two-phase fluid loop. The microchannel structure is designed based on the structure of plant veins and root networks. The typical characteristics of the root structure are imitated. The main root of the root microchannel is arranged horizontally, and secondary lateral root branches of the root microchannel are distributed under each radio frequency chip. This enhances the heat transfer and heat dissipation capacity of the chip, allowing heat to be quickly transferred out through the two-phase fluid loop, reducing the temperature difference of the array surface and ensuring that the array surface meets temperature consistency. The present invention is designed based on the structure of plant veins and root networks. Through integration with the mounting platform, the microchannel cold plate can be used as both an evaporator and a heater, meeting the integration and miniaturization requirements of the phased array antenna.

[0027] The diameter of the secondary lateral root channel is 100μm, which meets the flow requirements of two-phase fluid. By changing the type of fluid medium in the microchannel network, the microchannel cold plate can act as a radiator or heater, which can improve the temperature uniformity of multiple chips on the antenna array while achieving rapid heat dissipation or heat replenishment under limited space conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be derived from these drawings without inventive effort.

[0029] Figure 1 A schematic diagram schematically illustrates the top structure of a heat dissipation structure of a phased array antenna provided in accordance with one embodiment of the present invention;

[0030] Figure 2 A schematic diagram schematically illustrates the bottom structure of a heat dissipation structure of a phased array antenna provided in accordance with one embodiment of the present invention;

[0031] Figure 3 Schematically showing the structure of a chip mounting slot and a microchannel network provided in one embodiment of the present invention;

[0032] Figure 4 The figure schematically shows the structure of a phased array antenna provided according to one embodiment of the present invention.

[0033] The corresponding relationship between component names and reference numerals is as follows:

[0034] 1. Microchannel cold plate; 2. RF circuit mounting platform; 3. Control circuit mounting platform; 4. Connector mounting cavity; 5. Fluid interface; 6. Microchannel network; 7. Chip mounting slot; 8. Device mounting slot; 9. Heat transfer surface; 10. Antenna cover; 11. RF circuit; 12. Control circuit; 13. Antenna array surface; 14. RF chip. DETAILED DESCRIPTION

[0035] The description of the embodiments in this specification should be combined with the corresponding drawings, which should be considered a complete part of this specification. In the drawings, the shapes and thicknesses of the embodiments may be exaggerated and indicated for simplicity or convenience. Furthermore, the various structural components in the drawings will be described separately. It is worth noting that components not shown in the drawings or not described in words are known to those of ordinary skill in the art.

[0036] The description of the embodiments herein and any references to directions and orientations are for ease of description only and are not to be construed as limiting the scope of the present invention. The following description of the preferred embodiments may involve combinations of features, which may exist independently or in combination. The present invention is not specifically limited to the preferred embodiments. The scope of the present invention is defined by the claims.

[0037] like Figures 1 to 3 As shown, the present invention provides a microchannel heat dissipation structure for a phased array antenna, which is applied to the phased array antenna and includes a microchannel cold plate 1, a radio frequency circuit installation cavity, a control circuit installation cavity, a connector installation cavity 4 and a fluid interface 5.

[0038] The microchannel cold plate 1 is internally provided with a microchannel network 6 comprising a main root channel and secondary lateral root channels interconnected with the main root channel. The main root channel runs the length of the microchannel cold plate 1, while the secondary lateral root channels flank the main root channel. The microchannel cold plate 1 can be fabricated from aluminum. The microchannel network 6 utilizes a biomimetic design, mimicking the typical characteristics of a root network. This improves the dispersion of the fluid medium within the microchannel network 6, thereby enhancing the heat dissipation efficiency of the microchannel cold plate 1.

[0039] The radio frequency circuit installation cavity and the control circuit installation cavity are respectively provided on the top surface and the bottom surface of the microchannel cold plate 1 , and are used to install the radio frequency circuit 11 and the control circuit 12 respectively.

[0040] The connector installation cavity 4 is set through the top and bottom surfaces of the microchannel cold plate 1 and is connected to the RF circuit installation cavity and the control circuit installation cavity for installing a connector that vertically interconnects the RF circuit 11 and the control circuit 12.

[0041] The fluid interface 5 is provided on the outer surface of the microchannel cold plate 1 and is communicated with the main root channel to realize the exchange of two-phase fluids in the microchannel cold plate 1 .

[0042] Preferably, the main root channel includes a first main root channel and a second main root channel symmetrically arranged along the length of the microchannel cold plate 1. The diameters of the first main root channel and the second main root channel gradually decrease from the end connected to the fluid interface 5 to the end near the middle of the microchannel cold plate 1. The first main root channel and the second main root channel are connected through a secondary lateral root channel. By adjusting the shape of the main root channel, the pressure distribution within the main root channel can be adjusted, thereby preventing the pressure difference between the main root channel and the secondary lateral root channel from affecting the free flow of the fluid medium in the microchannel network, improving the efficiency of the medium flow within the microchannel network, and further improving the heat dissipation effect of the heat dissipation structure.

[0043] Preferably, an RF circuit mounting platform 2 and a chip mounting groove 7 are provided in the RF circuit mounting cavity, and a control circuit mounting platform 3 and a device mounting groove 8 are provided in the control circuit mounting cavity. The depth of the device mounting groove 8 is greater than the maximum height of the device to avoid interference between the microchannel cold plate 1 and the devices on the control circuit 12.

[0044] Preferably, the secondary lateral root channels include transverse lateral root channels parallel to the length direction of the microchannel cold plate 1 and longitudinal lateral root channels perpendicular to the transverse lateral root channels, and the intersection of the transverse lateral root channels and the longitudinal lateral root channels is set below the chip mounting groove 7.

[0045] The antenna unit RF chip and control circuit power devices generate a large amount of heat during operation. The microchannel cold plate adopts two-phase fluid loop thermal control technology. The structure of the microchannel is designed based on the structure of plant veins and root networks, imitating the typical characteristics of the root structure. The main roots of the root microchannel are arranged horizontally, and secondary lateral root branches of the root microchannel are distributed under each chip. This enhances the heat transfer and heat dissipation capacity of the chip, allowing the heat to be quickly transferred out through the two-phase fluid loop, reducing the temperature difference of the array surface and ensuring that the array surface meets temperature consistency.

[0046] Natural structures such as plant leaf veins and root networks have the characteristics of well-developed conductive tissues, low resistance to water movement, large absorption area, and efficient transmission performance. They are of great reference significance for the heat dissipation of electronic devices. The bionic microchannel structure designed based on plant leaf veins and root networks can effectively improve and enhance the heat dissipation performance of microchannel cold plates.

[0047] Preferably, heat transfer surfaces 9 are provided in the chip mounting slots 7 and the device mounting slots 8, and thermally conductive adhesive pads are provided on the heat transfer surfaces 9. Heat from the RF chip 14 and the power device is transferred to the microchannel cold plate 1 via the thermally conductive adhesive pads in the chip mounting slots 7 and the device mounting slots 8, respectively, further improving the heat dissipation effect of the microchannel cold plate 1. Furthermore, the thermally conductive adhesive pads act as a shock absorber, thus protecting the RF chip 14 and the power device.

[0048] like Figure 4 As shown, the present invention provides a phased array antenna, including a radome 11, a radio frequency circuit 11, a control circuit 12, an antenna array surface 13, a radio frequency chip 14, a power device and a connector.

[0049] The radome 10 is arranged on the top of the microchannel cold plate 1; the radome is made of a transparent material with a honeycomb sandwich structure, which has good wave transmission, high strength, and resistance to high and low temperature impact, and effectively protects the antenna array from damage.

[0050] The radio frequency circuit 11 is fixedly arranged in the radio frequency circuit installation cavity; and is fixedly arranged on the radio frequency circuit installation platform 2 of the heat dissipation structure.

[0051] The control circuit 12 is fixedly arranged in the control circuit installation cavity; and is fixedly arranged on the control circuit installation platform 3 of the heat dissipation structure.

[0052] The antenna array 13 is located on top of the RF circuit 11 and is electrically connected to the RF circuit 11. The antenna array 13 is connected to the top of the RF circuit 11 via BGA solder balls. The antenna array 13 comprises several spliced microstrip antenna units. These units are manufactured using a standard modular, borderless process and can be spliced together according to actual application requirements, thereby meeting the requirements for the antenna array in different usage scenarios.

[0053] The RF chip 14 and the power device are fixed on the RF circuit 11 and the control circuit 12 respectively, and are electrically connected to the RF circuit 11 and the control circuit 12 respectively; the RF chip 14 and the power device can be fixed to the RF circuit 11 and the control circuit 12 respectively through BGA solder ball connections.

[0054] The connector is disposed in the connector mounting cavity 4 and is electrically connected to the radio frequency circuit 11 and the control circuit 12 .

[0055] The phased array antenna provided by the present invention is mainly supported by a rectangular cavity microchannel cold plate structure, a radio frequency circuit mounting platform for mounting the radio frequency circuit is provided on the top of the microchannel cold plate, a control circuit mounting platform for mounting the control circuit is provided on the bottom of the microchannel cold plate, and a connector mounting cavity for vertically interconnecting the radio frequency circuit and the control circuit is provided in the middle of the microchannel cold plate. A fluid interface is provided on the side of the microchannel cold plate, and a chip mounting cavity and a device mounting cavity are provided on the top and bottom. The heat dissipation structure of the phased array antenna of the present invention adopts the two-phase fluid loop thermal control technology of the microchannel cold plate, wherein the microchannel adopts the design concept of bionic structure and is designed based on the structure of plant veins and root networks. Through integration with the satellite body, the microchannel cold plate acts as both an evaporator and a heater, while meeting the temperature uniformity requirements of multiple chips on the antenna array surface, realizing rapid heat dissipation and heat replenishment under limited space conditions.

[0056] It should be noted that, in this document, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or terminal device that includes a series of elements includes not only those elements but also other elements not explicitly listed, or also includes elements inherent to such process, method, article, or terminal device. In the absence of further limitations, an element defined by the phrase "comprises a..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes the element.

[0057] Finally, it should be noted that the above is a preferred embodiment of the present invention. It should be noted that although the preferred embodiment of the present invention has been described, it is clear that those skilled in the art, once they understand the basic inventive concept of the present invention, can make various improvements and modifications without departing from the principles of the present invention. Such improvements and modifications should also be considered as within the scope of protection of the present invention. Therefore, the appended claims are intended to be interpreted as including the preferred embodiment and all changes and modifications that fall within the scope of the embodiments of the present invention.

Claims

1. A microchannel heat dissipation structure for a phased array antenna, characterized in that: include: A microchannel cold plate (1) is provided with a microchannel network (6) therein, wherein the microchannel network (6) comprises a main root channel and secondary lateral root channels communicating with the main root channel, the main root channel being arranged along the length direction of the microchannel cold plate (1), and the secondary lateral root channels being arranged on both sides of the main root channel; A radio frequency circuit installation cavity and a control circuit installation cavity are arranged on the top and bottom surfaces of the microchannel cold plate (1) and on both sides of the microchannel network (6); A connector mounting cavity (4) is provided through the top and bottom surfaces of the microchannel cold plate (1) and is in communication with the radio frequency circuit mounting cavity and the control circuit mounting cavity; A fluid interface (5) is provided on the outer surface of the microchannel cold plate (1) and is in communication with the main root channel; The main root channel comprises a first main root channel and a second main root channel symmetrically arranged along the length direction of the microchannel cold plate (1), the diameters of the first main root channel and the second main root channel gradually decreasing from one end thereof connected to the fluid interface (5) to one end close to the middle of the microchannel cold plate (1), and the first main root channel and the second main root channel are connected through the secondary lateral root channel.

2. The microchannel heat dissipation structure of the phased array antenna according to claim 1, characterized in that: The diameter of the secondary lateral root channel is 100 μm.

3. The microchannel heat dissipation structure of the phased array antenna according to claim 1, characterized in that: A radio frequency circuit mounting platform (2) and a chip mounting groove (7) are provided in the radio frequency circuit mounting cavity, and a control circuit mounting platform (3) and a device mounting groove (8) are provided in the control circuit mounting cavity. The depth of the device mounting groove (8) is greater than the maximum height of the device.

4. The microchannel heat dissipation structure of the phased array antenna according to claim 3, characterized in that: The secondary lateral root channel comprises a transverse lateral root channel parallel to the length direction of the microchannel cold plate (1) and a longitudinal lateral root channel perpendicular to the transverse lateral root channel, and an intersection of the transverse lateral root channel and the longitudinal lateral root channel is arranged below the chip mounting groove (7).

5. The microchannel heat dissipation structure of the phased array antenna according to claim 3, characterized in that: Heat transfer surfaces (9) are provided in the chip mounting groove (7) and the device mounting groove (8).

6. The microchannel heat dissipation structure of the phased array antenna according to claim 5, characterized in that: A heat-conducting rubber pad is provided on the heat transfer surface (9).

7. A phased array antenna, characterized in that: The microchannel heat dissipation structure according to any one of claims 1 to 6, further comprising: A radome (10) is arranged on top of the microchannel cold plate (1); A radio frequency circuit (11) is fixedly arranged in the radio frequency circuit installation cavity; A control circuit (12) is fixedly arranged in the control circuit installation cavity; An antenna array surface (13) is arranged on top of the radio frequency circuit (11) and is electrically connected to the radio frequency circuit (11); A radio frequency chip (14) and a power device are fixed on the radio frequency circuit (11) and the control circuit (12), respectively, and are electrically connected to the radio frequency circuit (11) and the control circuit (12), respectively; A connector is arranged in the connector installation cavity (4) and is electrically connected to the radio frequency circuit (11) and the control circuit (12).

8. The phased array antenna according to claim 7, wherein: The radome (10) is made of a transparent material with a honeycomb sandwich structure.

9. The phased array antenna according to claim 7, wherein: The antenna array surface (13) comprises a plurality of spliced microstrip antenna units, and the microstrip antenna units are manufactured using a standard modular borderless process.

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