A three-dimensional optical fiber array and 800G DR8 silicon photonic module

Abstract

The present invention relates to a three-dimensional optical fiber array. The upper and lower surfaces of a substrate each have at least eight straight V-grooves arranged in rows and parallel to each other. The bare fibers of eight TX optical fibers are located within the eight straight V-grooves on the substrate's lower surface and held down by a glass cover. The bare fibers of eight RX optical fibers are located within the eight straight V-grooves on the substrate's upper surface and held down by a glass cover. In an 800G DR8 silicon photonic module, the bare fibers of the eight TX optical fibers in the three-dimensional optical array are coupled to the eight output waveguides of a silicon photonic chip, while the bare fibers of the eight RX optical fibers in the three-dimensional optical array are coupled to one or two multi-channel optical chips via a lens with a 45° reflecting prism. The beneficial effect is that all V-grooves in the three-dimensional optical fiber array are straight, so the bare fibers of the TX and RX optical fibers do not need to be bent. When used in an 800G DR8 silicon photonic module, only one coupling with the optical fiber array is required.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon photonic modules, and in particular to a three-dimensional optical fiber array and an 800G DR8 silicon photonic module. Background Art

[0002] Traditional 800G DR8 silicon photonic modules are equipped with one fiber array for transmission (TX) and one or two fiber arrays for reception (RX). Therefore, the number of fiber arrays in an 800G DR8 silicon photonic module is at least two, which makes coupling difficult.

[0003] Patent application number 2023100007508 discloses a fiber array and an optical component. The designed fiber array can simultaneously have a transmitting end fiber and a receiving end fiber, so that the optical component can be coupled with only one fiber array, thereby reducing the coupling difficulty. However, the fiber array has the following defects:

[0004] 1) The second and third V-grooves of the optical fiber array have 90° bends. For those skilled in the art, V-grooves with 90° bends cannot be cut or processed using existing processes or are very difficult to achieve. Even if this structure can be achieved, when installing optical fibers in the second and third V-grooves, the fibers must also be bent 90°. Since the fiber bending radius is greater than 2.5 mm, it is difficult to use the optical fibers in the optical fiber array.

[0005] 2) The optical fiber array is processed to open V-grooves at different heights on the same side of the same substrate or V-grooves are opened on three different substrates. If V-grooves are opened on three different substrates, three phases must be assembled, and the accuracy is difficult to guarantee;

[0006] 3) The receiving (RX) side of the fiber array has a 45° reflective surface, and the transmitting (TX) side has a 0° surface. Since the same fiber array needs to be polished with two 45° surfaces and one 0° surface, which is not possible or very difficult to achieve with current technology, it requires at least three polishings;

[0007] 4) The optical fiber array discloses that "when the first V-groove is provided with the transmitting end optical fiber, and the second V-groove and the third V-groove are provided with the receiving end optical fiber", in this case, the receiving end optical fibers on both sides are not at the same height; "when the first V-groove is provided with the receiving end optical fiber, and the second V-groove and the third V-groove are provided with the transmitting end optical fiber", in this case, the transmitting end optical fibers on both sides are not at the same height. Summary of the Invention

[0008] The technical problem to be solved by the present invention is to provide a three-dimensional optical fiber array and an 800G DR8 silicon photonic module to overcome the deficiencies in the above-mentioned prior art.

[0009] The present invention provides a technical solution for solving the above-mentioned technical problem as follows: a three-dimensional optical fiber array comprising: a substrate, wherein the upper and lower surfaces of the substrate each have at least eight straight V-grooves arranged in a row and parallel to each other, the straight V-grooves on the upper surface of the substrate and the straight V-grooves on the lower surface of the substrate being oriented in the same direction, the region on the upper surface of the substrate where the straight V-grooves are formed and the region on the lower surface where the straight V-grooves are formed are offset and do not overlap, the bare optical fibers of eight TX optical fibers are respectively located in the eight straight V-grooves on the lower surface of the substrate and are pressed by a glass cover plate, and the bare optical fibers of eight RX optical fibers are respectively located in the eight straight V-grooves on the upper surface of the substrate and are pressed by the glass cover plate.

[0010] The beneficial effects of the present invention are as follows: All V-grooves in the three-dimensional fiber array of the present invention are straight V-grooves, so the bare fibers of the TX fibers and the bare fibers of the RX fibers do not need to be bent. The three-dimensional fiber array uses straight V-grooves on the upper and lower surfaces of the same substrate, which is highly precise. In addition, the three-dimensional fiber array has TX fibers and RX fibers, so when it is used in an 800GDR8 silicon photonic module, only one fiber array coupling is required, greatly simplifying the difficulty of fiber array coupling and improving the fiber array coupling speed and production capacity. In addition, in the present invention, all straight V-grooves for installing TX fibers and all straight V-grooves for installing RX fibers are at the same height, which means that all TX fibers and all RX fibers can be made at the same height, making processing convenient and ensuring precision easy. Based on the above technical solution, the present invention can also be improved as follows.

[0011] Furthermore, the RX surface and the TX surface of the substrate share a common plane and are a 0° plane.

[0012] A further beneficial effect of the above method is that the RX surface and the TX surface of the three-dimensional optical fiber array are in the same plane and are 0° planes, so they can be ground and polished at one time.

[0013] Furthermore, the height distance between the bare optical fiber of the RX optical fiber located above and the bare optical fiber of the TX optical fiber located below is 1 mm ± 0.2 mm, and the center distance between the bare optical fiber of the RX optical fiber close to the TX optical fiber among all the RX optical fibers located above and the center distance between the bare optical fiber of the TX optical fiber close to the RX optical fiber among all the TX optical fibers located below is 2.7 mm ± 0.3 mm.

[0014] The above-mentioned further beneficial effect is as follows: the bare optical fiber of the RX optical fiber located above and the bare optical fiber of the TX optical fiber located below have a height difference of 1mm in the height direction, so that when the three-dimensional optical fiber array is applied to the 800G DR8 silicon photonic module, the lens 4 with a 45° reflecting prism has spatial coupling. Since the lens itself has size requirements, it is difficult to make a mold if it is too small. The design of 1mm can have a processing error of ±0.2mm, which is convenient for lens processing. In addition, the center distance between the bare optical fiber of the RX optical fiber close to the TX optical fiber among all the RX optical fibers located above and the bare optical fiber of the TX optical fiber close to the RX optical fiber among all the TX optical fibers located below is 2.7mm, which is convenient for the layout and routing of silicon photonic chips, multi-channel optical chips, multi-channel electrical chips and PCB boards.

[0015] Based on the above technical solution, the present invention also provides an 800G DR8 silicon photonic module, including: a silicon photonic chip and a three-dimensional optical fiber array, the input waveguide of the silicon photonic chip is coupled with the optical emitting device, the bare optical fibers of the eight TX optical fibers in the three-dimensional optical fiber array are respectively coupled with the eight output waveguides of the silicon photonic chip, the bare optical fibers of the eight RX optical fibers in the three-dimensional optical fiber array are coupled with one or two multi-channel optical chips through a lens with a 45° reflecting prism, and the multi-channel optical chip is coupled with the multi-channel electrical chip.

[0016] The above-mentioned advantages further benefit: the 800G DR8 silicon photonic module has only one three-dimensional fiber array, so the fiber array only needs to be coupled once, which greatly simplifies the difficulty of fiber array coupling and improves the fiber array coupling speed and production capacity. The bare fiber of the RX fiber is coupled to one or two multi-channel optical chips through a lens with a 45° reflecting prism, which can increase the RX coupling tolerance and make the overall design compact.

[0017] Furthermore, the spacing between two adjacent straight V-grooves on the lower surface of the substrate is 0.25 mm; the multi-channel optical chip is an eight-channel optical chip, the multi-channel electrical chip is an eight-channel electrical chip, the bare optical fibers of the eight RX optical fibers in the three-dimensional optical fiber array are coupled to an eight-channel optical chip through a lens with a 45° reflecting prism, and the spacing between two adjacent straight V-grooves on the upper surface of the substrate is 0.25 mm.

[0018] A further beneficial effect of the above is that only one multi-channel optical chip and one eight-channel electrical chip need to be configured, thereby reducing the number of coupling times.

[0019] Furthermore, the multi-channel optical chip is a four-channel optical chip, the multi-channel electrical chip is a four-channel electrical chip, the number of multi-channel optical chips is two, the number of multi-channel electrical chips is two, each four-channel optical chip is coupled with a four-channel electrical chip, the bare optical fibers of the eight RX optical fibers in the three-dimensional optical fiber array are coupled with the two four-channel optical chips through a lens with a 45° reflecting prism, and the eight straight V-grooves located on the upper surface are divided into two groups with four adjacent ones and distributed according to a predetermined spacing. The spacing between two adjacent straight V-grooves in each group of straight V-grooves is 0.25 mm.

[0020] A further beneficial effect of the above is that the 800G DR8 silicon photonic module can be compatible with two four-channel optical chips and two four-channel electrical chips, and has better adaptability.

[0021] Furthermore, the spacing between the two four-channel optical chips is 0.25 mm, and the eight straight V-grooves on the upper surface are divided into two groups of four adjacent ones and distributed at a spacing of 0.5 mm.

[0022] Furthermore, the silicon photonic chip has two light input waveguides, and the number of light emitting devices is two, and the two light emitting devices are respectively coupled to the two light input waveguides of the silicon photonic chip.

[0023] Furthermore, the light emitting device includes: a laser chip, a collimating lens, an optical isolator and a converging lens distributed in sequence along the light propagation direction; the laser chip is fixed on the ceramic heat sink; and the optical isolator is fixed on the first pad.

[0024] Furthermore, it also includes: a base and a PCB board fixed on the base, the PCB board has an opening in a part of the area corresponding to the base, the silicon photonic chip, the three-dimensional optical fiber array and the light emitting device are all arranged in the opening and fixed to the base, a second pad is fixed on the upper surface of the PCB board near the opening, the lens is fixed on the second pad, the multi-channel optical chip is located below the lens, and the multi-channel optical chip and the multi-channel electrical chip are electrically connected to the PCB board respectively. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A structural diagram of a three-dimensional optical fiber array in the present invention;

[0026] Figure 2 This is a structural diagram of the 800G DR8 silicon photonic module in the present invention;

[0027] Figure 3 This is a partial structural top view of the 800G DR8 silicon photonic module in the present invention;

[0028] Figure 4 This is a partial structural front view of the 800G DR8 silicon photonic module in the present invention.

[0029] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0030] 1. Silicon photonic chip, 110. Input optical waveguide, 120. Output optical waveguide, 2. Three-dimensional optical fiber array, 210. Substrate, 211. Straight V-groove, 220. TX optical fiber, 230. Glass cover, 240. RX optical fiber, 3. Light emitting device, 310. Laser chip, 320. Collimating lens, 330. Optical isolator, 340. Converging lens, 350. Ceramic heat sink, 360. First pad, 4. Lens, 5. Multi-channel optical chip, 6. Multi-channel electrical chip, 7. Base, 810. Opening, 8. PCB board, 810. Opening, 9. Second pad. DETAILED DESCRIPTION

[0031] The principles and features of the present invention are described below with reference to the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0032] Example 1

[0033] like Figure 1 As shown, a three-dimensional optical fiber array includes: a substrate 210, the material of the substrate 210 can be glass, the upper surface of the substrate 210 is provided with at least eight straight V-grooves 211 distributed in a row and parallel to each other, and the lower surface of the substrate 210 is also provided with at least eight straight V-grooves 211 distributed in a row and parallel to each other, that is, the V-grooves in the present invention do not turn 90 degrees, and the straight V-grooves 211 on the upper surface of the substrate 210 and the straight V-grooves 211 on the lower surface are in the same direction, which can also be understood as: the straight V-grooves 211 on the upper surface of the substrate 210 are parallel to the straight V-grooves 211 on the lower surface;

[0034] Furthermore, the region on the upper surface of the substrate 210 where the straight V-grooves 211 are defined is offset from the region on the lower surface of the substrate 210 where the straight V-grooves 211 are defined, and they do not overlap (in the height direction). The bare fibers of the eight TX optical fibers 220 are located within the eight straight V-grooves 211 on the lower surface of the substrate 210 and are held down by the glass cover 230. The TX optical fibers 220 are transmitting optical fibers. The bare fibers of the eight RX optical fibers 240 are located within the eight straight V-grooves 211 on the upper surface of the substrate 210 and are held down by the glass cover 230. The RX optical fibers 240 are receiving optical fibers. Since the V-grooves 211 defined on the substrate 210 are straight V-grooves 211, the bare fibers of the TX optical fibers 220 and the bare fibers of the RX optical fibers 240 do not need to be bent.

[0035] The three-dimensional optical fiber array 2 adopts a substrate 210 with straight V-grooves 211 formed on the upper and lower surfaces thereof, respectively, with high precision.

[0036] Example 2

[0037] like Figure 1As shown, this embodiment is a further improvement on the basis of embodiment 1, specifically as follows:

[0038] The RX surface and the TX surface of the substrate 210 share a common plane and are 0° planes, so they can be ground and polished in one go.

[0039] Example 3

[0040] like Figure 1 As shown, this embodiment is a further improvement on the basis of embodiment 1 or 2, specifically as follows:

[0041] The height distance between the bare optical fibers of the upper RX optical fibers 240 and the bare optical fibers of the lower TX optical fibers 220 is 1 mm ± 0.2 mm, and the center distance between the bare optical fibers of the RX optical fibers 240 close to the TX optical fibers 220 among all the upper RX optical fibers 240 and the bare optical fibers of the TX optical fibers 220 close to the RX optical fibers 240 among all the lower TX optical fibers 220 is 2.7 mm ± 0.3 mm.

[0042] Example 4

[0043] like Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 As shown, an 800G DR8 silicon photonic module includes: a silicon photonic chip 1 and a three-dimensional optical fiber array 2 as described in any one of embodiments 1 to 3. The input waveguide 110 of the silicon photonic chip 1 is coupled to the optical transmitter 3, and the bare optical fibers of eight TX optical fibers 220 in the three-dimensional optical fiber array 2 are respectively coupled to the eight output waveguides 120 of the silicon photonic chip 1. The bare optical fibers of eight RX optical fibers 240 in the three-dimensional optical fiber array 2 are coupled to one or two multi-channel optical chips 5 via a lens 4 with a 45° reflecting prism. The multi-channel optical chip 5 is coupled to a multi-channel electrical chip 6.

[0044] For the emission light, the emission light emitted by the light emitting device 3 is first coupled into the input optical waveguide 110 of the silicon photonic chip 1, and then the silicon photonic chip 1 divides the emission light into multiple paths and emits them from each output optical waveguide 120, and couples them into the TX optical fiber 220 of the three-dimensional optical fiber array 2;

[0045] As for the received light, the received light in the RX optical fiber 240 is emitted toward the lens 4 with a 45° reflecting prism, and is then turned 90° by the lens 4 and coupled into the multi-channel optical chip 5 .

[0046] Example 5

[0047] like Figure 1 As shown, this embodiment is a further improvement on the basis of embodiment 4, specifically as follows:

[0048] The spacing between two adjacent straight V-grooves 211 on the lower surface of the substrate 210 is 0.25 mm. The multi-channel optical chip 5 is an eight-channel optical chip, and the multi-channel electrical chip 6 is an eight-channel electrical chip. Then, the bare optical fibers of the eight RX optical fibers 240 in the three-dimensional optical fiber array 2 are coupled to one eight-channel optical chip via the lens 4 with a 45° reflecting prism. The spacing between two adjacent straight V-grooves 211 on the upper surface of the substrate 210 is 0.25 mm. In this case, only one multi-channel optical chip 5 and one multi-channel electrical chip 6 are required.

[0049] Example 6

[0050] This embodiment is a further improvement on the basis of embodiment 4, specifically as follows:

[0051] The multi-channel optical chip 5 is a four-channel optical chip, and the multi-channel electrical chip 6 is a four-channel electrical chip. In this case, there are two multi-channel optical chips 5 and two multi-channel electrical chips 6. Each four-channel optical chip is coupled to one four-channel electrical chip. The bare optical fibers of the eight RX optical fibers 240 in the three-dimensional optical fiber array 2 are coupled to the two four-channel optical chips via a lens 4 with a 45° reflecting prism. The eight straight V-grooves 211 on the upper surface are divided into two groups of four adjacent straight V-grooves and distributed at a predetermined spacing. The spacing between two adjacent straight V-grooves 211 in each group of straight V-grooves 211 is 0.25 mm.

[0052] Furthermore, the spacing between two four-channel optical chips is 0.25 mm, and the eight straight V-grooves 211 on the upper surface are divided into two groups with four adjacent ones as a group and distributed at a spacing of 0.5 mm.

[0053] Example 7

[0054] like Figure 2 、 Figure 3 As shown, this embodiment is a further improvement on the basis of any one of the embodiments 4 to 6, specifically as follows:

[0055] The silicon photonic chip 1 has two input light waveguides 110 and two light emitting devices 3 . The two light emitting devices 3 are respectively coupled to the two input light waveguides 110 of the silicon photonic chip 1 . The silicon photonic chip 1 has eight output light waveguides 120 , and each input light waveguide 110 has four output light waveguides 120 .

[0056] Furthermore: the light emitting device 3 includes: a laser chip 310, a collimating lens 320, an optical isolator 330 and a converging lens 340 distributed in sequence along the light propagation direction. The emission light emitted by the laser chip 310 is coupled into the optical input waveguide 110 of the silicon photonic chip 1 after passing through the collimating lens 320, the optical isolator 330 and the converging lens 340 in sequence. The laser chip 310 is fixed on the ceramic heat sink 350, and the optical isolator 330 is fixed on the first pad 360.

[0057] Example 8

[0058] like Figure 2 、 Figure 3 、 Figure 4 As shown, this embodiment is a further improvement on the basis of any one of the embodiments 4 to 7, and the details are as follows:

[0059] The 800G DR8 silicon photonic module also includes: a base 7 and a PCB board 8 fixed on the base 7. The material of the base 7 is preferably tungsten copper. An opening 810 is opened on the PCB board 8 in a part of the area corresponding to the base 7, and the silicon photonic chip 1, the three-dimensional optical fiber array 2 and the light emitting device 3 are all arranged in the opening 810. In addition, the silicon photonic chip 1, the three-dimensional optical fiber array 2 and the light emitting device 3 are respectively fixed to the base 7, the silicon photonic chip 1 is electrically connected to the PCB board 8, a second pad 9 is fixed on the upper surface of the PCB board 8 near the opening 810, and the lens 4 is fixed on the second pad 9. The multi-channel optical chip 5 is below the lens 4, and the multi-channel optical chip 5 and the multi-channel electrical chip 6 are respectively electrically connected to the PCB board 8.

[0060] Although the embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and are not to be construed as limitations on the present invention. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. An 800G DR8 silicon photonic module, characterized in that: include: A silicon photonic chip (1) and a three-dimensional optical fiber array (2), wherein an input light waveguide (110) of the silicon photonic chip (1) is coupled to a light emitting device (3), and the three-dimensional optical fiber array (2) comprises: a substrate (210), wherein the upper and lower surfaces of the substrate (210) each have at least eight straight V-grooves (211) arranged in a row and parallel to each other, the straight V-grooves (211) on the upper surface of the substrate (210) and the straight V-grooves (211) on the lower surface are in the same direction, the region on the upper surface of the substrate (210) where the straight V-grooves (211) are arranged is offset from the region on the lower surface of the substrate (210) where the straight V-grooves (211) are arranged and do not overlap, and the bare optical fibers of eight TX optical fibers (220) are respectively located on the eight straight V-grooves on the lower surface of the substrate (210). The bare optical fibers of the eight RX optical fibers (240) are located in the eight straight V-grooves (211) on the upper surface of the substrate (210) and are pressed by the glass cover (230); the bare optical fibers of the eight RX optical fibers (240) are located in the eight straight V-grooves (211) on the upper surface of the substrate (210) and are pressed by the glass cover (230); the RX surface and the TX surface of the substrate (210) share a common plane and are a 0° plane; the bare optical fibers of the eight TX optical fibers (220) in the three-dimensional optical fiber array (2) are respectively coupled with the eight light-emitting waveguides (120) of the silicon photonic chip (1); the bare optical fibers of the eight RX optical fibers (240) in the three-dimensional optical fiber array (2) are coupled with one or two multi-channel optical chips (5) via a lens (4) with a 45° reflecting prism; and the multi-channel optical chip (5) is coupled with the multi-channel electrical chip (6).

2. The 800G DR8 silicon photonic module according to claim 1, wherein: The height distance between the bare optical fiber of the RX optical fiber (240) located above and the bare optical fiber of the TX optical fiber (220) located below is 1 mm ± 0.2 mm, and the center distance between the bare optical fiber of the RX optical fiber (240) close to the TX optical fiber (220) among all the RX optical fibers (240) located above and the bare optical fiber of the TX optical fiber (220) close to the RX optical fiber (240) among all the TX optical fibers (220) located below is 2.7 mm ± 0.3 mm.

3. The 800G DR8 silicon photonic module according to claim 1, wherein: The spacing between two adjacent straight V-grooves (211) on the lower surface of the substrate (210) is 0.25 mm; the multi-channel optical chip (5) is an eight-channel optical chip, the multi-channel electrical chip (6) is an eight-channel electrical chip, the bare optical fibers of the eight RX optical fibers (240) in the three-dimensional optical fiber array (2) are coupled to an eight-channel optical chip via a lens (4) with a 45° reflecting prism, and the spacing between two adjacent straight V-grooves (211) on the upper surface of the substrate (210) is 0.25 mm.

4. The 800G DR8 silicon photonic module according to claim 1, wherein: The multi-channel optical chip (5) is a four-channel optical chip, the multi-channel electrical chip (6) is a four-channel electrical chip, the number of the multi-channel optical chips (5) is two, the number of the multi-channel electrical chips (6) is two, each four-channel optical chip is coupled to a four-channel electrical chip, the bare optical fibers of the eight RX optical fibers (240) in the three-dimensional optical fiber array (2) are coupled to the two four-channel optical chips via a lens (4) with a 45° reflecting prism, the eight straight V-grooves (211) on the upper surface are divided into two groups with four adjacent straight V-grooves as one group and are distributed at a predetermined interval, and the interval between two adjacent straight V-grooves (211) in each group of straight V-grooves (211) is 0.25 mm.

5. The 800G DR8 silicon photonic module according to claim 4, wherein: The spacing between the two four-channel optical chips is 0.25 mm, and the eight straight V-grooves (211) on the upper surface are divided into two groups with four adjacent ones as one group and distributed at a spacing of 0.5 mm.

6. An 800G DR8 silicon photonic module according to claim 1, 3, 4 or 5, characterized in that: The silicon photonic chip (1) has two light-input waveguides (110), the number of the light-emitting devices (3) is two, and the two light-emitting devices (3) are respectively coupled to the two light-input waveguides (110) of the silicon photonic chip (1).

7. The 800G DR8 silicon photonic module according to claim 1, wherein: The light emitting device (3) comprises: a laser chip (310), a collimating lens (320), an optical isolator (330), and a converging lens (340) sequentially distributed along a light propagation direction; the laser chip (310) is fixed on a ceramic heat sink (350); and the optical isolator (330) is fixed on a first pad (360).

8. The 800G DR8 silicon photonic module according to claim 1, wherein: Also includes: A base (7) and a PCB (8) fixed on the base (7), wherein an opening (810) is provided on the PCB (8) in a partial area corresponding to the base (7), the silicon photonic chip (1), the three-dimensional optical fiber array (2) and the light emitting device (3) are arranged in the opening (810) and fixed to the base (7), a second pad (9) is fixed on the upper surface of the PCB (8) near the opening (810), the lens (4) is fixed on the second pad (9), the multi-channel optical chip (5) is located below the lens (4), and the multi-channel optical chip (5) and the multi-channel electrical chip (6) are electrically connected to the PCB (8) respectively.

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