High isolation transmit and receive co-aperture phased array antenna

Abstract

The present invention relates to a high-isolation transceiver co-aperture phased array antenna, which adopts a tile-type stacked architecture. The high-isolation transceiver co-aperture phased array antenna comprises, from top to bottom, a transceiver co-aperture antenna board, a high-isolation matching adapter board, a chip network board, a control power board, and a heat dissipation structure. By adopting multiple isolation measures in the transceiver co-aperture antenna board, the high-isolation matching adapter board, and the chip network board, the present invention can effectively reduce the mutual coupling between the receiving and transmitting antennas, achieve high radiation efficiency while miniaturizing the antenna, and adjust the spatial arrangement order of each component module according to design requirements. At the same time, the design concept of standardized sub-arrays is adopted, and the antenna can be expanded into full arrays of different sizes through plane splicing, thereby enhancing the adaptability of application scenarios. The antenna has the characteristics of miniaturization, high isolation, standardization, and scalability.

Description

Technical Field

[0001] The present invention relates to the technical field of phased array antennas, and in particular to a high-isolation transmitting and receiving co-aperture phased array antenna. Background Art

[0002] Satellite communications are booming, and phased array antennas, as a crucial component of satellite communication terminals, hold broad application prospects. Traditional phased array antennas often use separate transmit and receive antennas. While this ensures isolation between the transmit and receive antennas, they suffer from large size, high weight, and difficulty integrating with existing platforms. Therefore, a co-aperture phased array antenna can be used to achieve a compact design, facilitating integration with various mounting platforms.

[0003] Compared to brick-type phased array antennas, tile-type phased array antennas have advantages such as low profile and easy conformal integration. Common tile-type phased array antennas often integrate antennas, networks, RF components, control, and power networks into a single board. However, this architecture is mostly suitable for single-beam, pure receive / pure transmit array designs. For multi-beam transmit-receive co-aperture phased array antennas, multiple beams will increase the number of PCB design layers of the phased array antenna, thereby affecting the overall stacking design and the number of press-fits, making it difficult to achieve single PCB board integration of the above modules. Co-aperture will increase the wiring and hole density of the entire board, increasing the difficulty of design and processing while potentially reducing radiation efficiency due to transmit-receive mutual coupling, thereby affecting the overall performance of the phased array. However, there is currently no confirmed technical solution for the high-isolation design architecture of transmit-receive co-aperture phased array antennas. Summary of the Invention

[0004] In order to solve the technical problems existing in the above-mentioned prior art, the purpose of the present invention is to provide a high-isolation transmit-receive co-aperture phased array antenna, and design a high-isolation architecture of the transmit-receive co-aperture phased array antenna, which has the characteristics of miniaturization, high isolation, standardization, and scalability.

[0005] To achieve the above-mentioned object, the present invention provides a high-isolation transmit-receive co-aperture phased array antenna, which adopts a tile-type stacked architecture. The high-isolation transmit-receive co-aperture phased array antenna comprises, from top to bottom:

[0006] A transceiver co-aperture antenna board, used for transmitting and receiving radio frequency signals, comprising a plurality of receiving antenna units, a plurality of transmitting antenna units, a plurality of feeding channels, and an inter-unit isolation structure. The inter-unit isolation structure comprises a transmitting antenna isolation structure and a receiving antenna isolation structure. Any of the receiving antenna units is surrounded by a plurality of receiving antenna isolation structures, and any of the transmitting antenna units is surrounded by a plurality of transmitting antenna isolation structures. Any feeding channel is configured with a feeding channel isolation structure, and the interface of the corresponding feeding channel is configured with a feeding interface isolation structure.

[0007] A high-isolation matching adapter board includes a receiving interface interconnection RF channel, a transmitting interface interconnection RF channel, and a matching adapter board isolation junction. The receiving interface interconnection RF channel is used to connect the receiving antenna interface and the receiving chip interface, and the transmitting interface interconnection RF channel is used to connect the transmitting chip interface and the transmitting antenna interface. The matching adapter board isolation structure includes at least one of the following isolation structures: a receiving antenna end interface, a transmitting antenna end interface, a receiving chip end interface, a transmitting chip end interface, a receiving interface interconnection channel, and a transmitting interface interconnection channel.

[0008] Chip network board and control power board, the chip network board is used for receiving beam network, transmitting beam network and RF chip interconnection integration; the control power board is used for phased array antenna control signal transmission and power supply of each module of phased array antenna;

[0009] The heat dissipation structure is used for the installation and heat dissipation of the high-isolation transmit-receive co-aperture phased array antenna.

[0010] According to a technical solution of the present invention, the receiving antenna unit and the transmitting antenna unit are microstrip antennas, helical antennas, or dipole antennas.

[0011] According to a technical solution of the present invention, the polarization modes of the receiving antenna unit and the transmitting antenna unit are linear polarization or circular polarization.

[0012] According to a technical solution of the present invention, the topological layout of the receiving antenna unit and the transmitting antenna unit is a rectangular grid arrangement, a triangular grid arrangement, a concentric ring grid arrangement or an elliptical ring grid arrangement.

[0013] According to a technical solution of the present invention, the antenna array surface shape of the transmitting and receiving co-aperture antenna board can be a rectangular array, a cross array, a triangular array, a hexagonal array, a circular array or an elliptical array.

[0014] According to a technical solution of the present invention, the unit spacing between the receiving antenna unit and the transmitting antenna unit should be determined according to their operating frequency and maximum scanning angle, then: d≤λ / (1+sinθ), wherein d represents the unit spacing between the receiving antenna unit and the transmitting antenna unit in the arrangement direction, λ represents the wavelength at the operating frequency of the receiving antenna or the transmitting antenna, and θ represents the maximum scanning angle of the receiving antenna or the transmitting antenna in the arrangement direction.

[0015] According to a technical solution of the present invention, the high-isolation matching adapter board is electrically connected to the transceiver co-aperture antenna board and the chip network board through a PCB board interconnection structure, and the electrical connection method is LGA welding, BGA welding or button connection.

[0016] According to a technical solution of the present invention, the chip network board includes a radio frequency chip, at least one layer of receiving beam power combining network, at least one layer of transmitting beam power splitting network and an isolation layer.

[0017] According to a technical solution of the present invention, the control power board includes a control signal layer, a power layer, a low-frequency signal layer and an isolation ground layer.

[0018] According to a technical solution of the present invention, the heat dissipation structure includes a mounting structure and at least one of heat dissipation teeth, a heat-conducting boss, a heat-conducting pad, and a heat dissipation fan.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] According to the solution of the present invention, by integrating the receiving antenna and the transmitting antenna in the same radiation aperture, the size of the phased array antenna is reduced and the application scenarios of the phased array antenna are expanded.

[0021] The high-isolation transceiver phased array antenna of the present invention can effectively reduce the mutual coupling between the receiving and transmitting antennas by adopting multiple isolation measures in the transceiver co-aperture antenna board, the high-isolation matching adapter board and the chip network board, thereby achieving high radiation efficiency while miniaturizing the antenna.

[0022] The high-isolation transceiver phased array antenna of the present invention adopts a tile-type stacked architecture, and the spatial arrangement order of each component module can be adjusted according to design requirements. At the same time, it adopts the design concept of standardized sub-arrays and can be expanded into full arrays of different sizes through plane splicing, thereby enhancing the adaptability of application scenarios.

[0023] The high-isolation transceiver phased array antenna of the present invention has the characteristics of miniaturization, high isolation, standardization, and scalability. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be derived from these drawings without inventive effort.

[0025] Figure 1 A schematic diagram of a high-isolation transmit-receive co-aperture phased array antenna architecture provided by an embodiment of the present invention is shown;

[0026] Figure 2 A schematic diagram schematically illustrates the structure of a transceiver antenna and its isolation measures provided in an embodiment of the present invention;

[0027] Figure 3A schematic diagram of a PCB stackup of a high-isolation matching adapter board provided by an embodiment of the present invention is shown;

[0028] Figure 4 A schematic diagram schematically illustrates the structure of a transceiver switching channel and its isolation measures provided in an embodiment of the present invention;

[0029] Figure 5 The figure schematically shows the PCB stacking diagram of the chip network board and the control power board provided in the embodiment of the present invention.

[0030] Description of reference numerals:

[0031] 10. Transmitter and receiver common aperture antenna board; 20. PCB board interconnection structure; 30. High isolation matching adapter board; 40. Chip network board; 50. Control power board; 60. Heat dissipation structure; 11. Transmitting antenna unit; 12. Receiving antenna unit; 13. Inter-unit isolation structure; 14. Feed channel isolation structure; 15. Isolation structure at the feed interface; 31. Transmitter transfer channel; 32. Receiving transfer channel; 33. Transfer transmission line isolation structure; 34. Transfer vertical via isolation structure; 35. Isolation ground layer; 41. Transmitter network layer; 42. Receiving network layer; 43. Isolation ground layer between networks; 44 Low-frequency signal layer; 45. Chip components. DETAILED DESCRIPTION

[0032] The description of the embodiments in this specification should be combined with the corresponding drawings, which should be considered a complete part of this specification. In the drawings, the shapes and thicknesses of the embodiments may be exaggerated and indicated for simplicity or convenience. Furthermore, the various structural components in the drawings will be described separately. It is worth noting that components not shown in the drawings or not described in words are known to those of ordinary skill in the art.

[0033] The description of the embodiments herein and any references to directions and orientations are for ease of description only and are not to be construed as limiting the scope of the present invention. The following description of the preferred embodiments may involve combinations of features, which may exist independently or in combination. The present invention is not specifically limited to the preferred embodiments. The scope of the present invention is defined by the claims.

[0034] like Figures 1 to 3 As shown, a high-isolation transmit-receive co-aperture phased array antenna of the present invention adopts a tile-type stacked architecture. The high-isolation transmit-receive co-aperture phased array antenna includes, from top to bottom: a transmit-receive co-aperture antenna board 10, a high-isolation matching adapter board 30, a chip network board 40, a control power board 50, and a heat dissipation structure 60.

[0035] The transceiver co-aperture antenna board 10 has a receiving antenna and a transmitting antenna integrated thereon. The receiving antenna is composed of an array of multiple receiving antenna units 12. Similarly, the transmitting line is also composed of multiple reflecting antenna units. That is, the transceiver co-aperture antenna board 10 is used for transmitting and receiving radio frequency signals. The transceiver co-aperture antenna board 10 includes multiple receiving antenna units 12, multiple transmitting antenna units 11, multiple feeding channels and inter-unit isolation structures 13. The inter-unit isolation structure includes a transmitting antenna isolation structure and a receiving antenna isolation structure. Any of the receiving antenna units 12 is surrounded by multiple receiving antenna isolation structures, and any of the transmitting antenna units 11 is surrounded by multiple transmitting antenna isolation structures. Any feeding channel is configured with a feeding channel isolation structure 14, and the corresponding feeding channel interface is configured with a feeding interface isolation structure 15.

[0036] In some embodiments of the present invention, the receiving antenna unit 12 and the transmitting antenna unit 11 of the transmitting and receiving co-aperture antenna board 10 may be located in the same PCB layer or in different PCB layers.

[0037] The transmitting and receiving common aperture antenna board 10 can be pressed together into a PCB board separately. The transmitting antenna unit 11 and the receiving antenna unit 12 are in the same PCB board. The transmitting antenna unit 11 adopts a triangular grid arrangement, and the receiving antenna unit 12 adopts a rectangular grid arrangement. The arrangement spacing is determined according to the operating frequency and the maximum scanning angle, that is, d≤λ / (1+sinθ), where d represents the unit spacing of the receiving / transmitting antenna unit 11 in the arrangement direction, λ represents the wavelength of the receiving / transmitting antenna at the operating frequency, and θ represents the maximum scanning angle of the receiving / transmitting antenna in the arrangement direction.

[0038] like Figure 2 As shown, the transmitting antenna unit 11 and receiving antenna unit 12 are located on different layers within the same PCB board, with a ground layer used to isolate the layers where the radiating patches reside. Inter-unit isolation structures 13 are provided around the receiving antenna unit 12 and the transmitting antenna unit 11 to reduce the effects of inter-unit coupling after array formation, effectively enhancing the antenna's scanning performance.

[0039] The transmitting and receiving common aperture antenna board 10 is electrically interconnected with other structures by BGA welding. The signals of the transmitting / receiving frequency band are transmitted through BGA solder balls, coaxial structures, microstrip lines / strip lines and other structures. Figure 2 As shown, the transmitting antenna unit 11 and the receiving antenna unit 12 establish a feed channel isolation structure 14 and a feed interface isolation structure 15 by adding ground holes / GND solder balls. Corresponding isolation structures need to be set at the RF transmission channel and the RF signal interface, which can enhance the isolation between the receiving and transmitting frequency bands and ensure the antenna performance of the two frequency bands.

[0040] The high-isolation matching adapter board 30 includes a receiving interface interconnection RF channel, a transmitting interface interconnection RF channel and a matching adapter board isolation junction. The receiving interface interconnection RF channel is used to connect the receiving antenna interface and the receiving chip interface, and the transmitting interface interconnection RF channel is used to connect the transmitting chip interface and the transmitting antenna interface. The matching adapter board isolation structure includes at least one of the isolation structures at the receiving antenna end interface, the transmitting antenna end interface, the receiving chip end interface, the transmitting chip end interface, the receiving interface interconnection channel, and the transmitting interface interconnection channel.

[0041] By setting up a high-isolation matching adapter board 30, matching interconnection between the transmitting antenna interface, the receiving antenna interface and the transmitting chip RF port, and the receiving chip RF port can be achieved. The high-isolation matching adapter board 30 and the transmitting and receiving common-aperture antenna board 10 and the chip network board 40 are interconnected through the PCB board interconnection structure 20 using LGA, BGA or button connectors.

[0042] In some embodiments of the present invention, the number of layers of the PCB board where the high-isolation matching adapter board 30 is located is at least 5, namely the top layer, the transmitting adapter layer, the isolation ground layer, the receiving adapter layer and the bottom layer. It can be understood that the number of layers of the transmitting adapter layer, the isolation ground layer and the receiving adapter layer can be appropriately increased according to actual design requirements and if the process permits.

[0043] like Figure 3 As shown, the high-isolation matching adapter board 30 comprises a total of 10 layers. L2 and L4 are transmit adapter layers, L7 and L9 are receive adapter layers, and the remaining layers are ground layers. It is worth noting that in this embodiment, to further enhance isolation between the receive and transmit frequency bands, two ground layers are provided between the transmit adapter layer L4 and the receive adapter layer L7.

[0044] In some embodiments of the present invention, the high isolation matching adapter board 30 includes a transmitting adapter channel 31, a receiving adapter channel 32, a transfer transmission line isolation structure 33, a transfer vertical via isolation structure 34, and an isolation layer 35. In order to achieve matching interconnection between the transmitting / receiving antenna interface and the transmitting / receiving chip RF port while ensuring the isolation between the receiving / transmitting frequency bands, such as Figure 4 As shown, a transfer transmission line isolation structure 33 and a transfer vertical via isolation structure 34 are established for the transmitting transfer channel 31 and the receiving transfer channel 32 respectively by adding ground holes / GND solder balls, and an isolation layer 35 is added between the layers where the transmitting transfer transmission line and the receiving transfer transmission line are located. If the process permits, the number of layers of the isolation layer 35 can be appropriately increased to obtain better performance.

[0045] In some embodiments of the present invention, a chip network board 40 and a control power board 50 are provided. The chip network board 40 is used for interconnecting and integrating the receiving beam network, the transmitting beam network, and the RF chip. The control power board 50 is used for controlling signal transmission of the phased array antenna and powering each module of the phased array antenna.

[0046] The heat dissipation structure 60 is used for installation and heat dissipation of the high-isolation transmit-receive co-aperture phased array antenna.

[0047] In some embodiments of the present invention, the chip network board 40 and the control power board 50 can be placed in parallel or vertically according to design requirements. Figure 5 As shown, the chip network board 40 and the control power board 50 are in the same plane. The chip network board 40 is composed of a transmitting network layer 41, a receiving network layer 42, an isolation layer 43 between networks, a low-frequency signal layer 44 and a chip component 45.

[0048] In this embodiment, several isolation ground layers are provided between each transmit network layer 41, each receive network layer 42, and each low-frequency layer, effectively reducing inter-layer interference and improving phased array antenna performance. The chip network board 40 is provided with several vertical interconnect vias and transmission lines for interconnection, and additional ground vias can be used to enhance isolation.

[0049] The co-aperture antenna board 10 for transmission and reception, the PCB interconnect structure 20, the high-isolation matching adapter board 30, the chip network board 40, and the control power board 50 are all mounted and heat-dissipated via a heat dissipation structure 60. The mounting position of these structures can be adjusted according to actual design requirements to optimize the size and weight of the phased array antenna.

[0050] In some embodiments of the present invention, the receiving antenna unit 12 and the transmitting antenna unit 11 are microstrip antennas, helical antennas, or dipole antennas.

[0051] In some embodiments of the present invention, the polarization modes of the receiving antenna unit 12 and the transmitting antenna unit 11 are linear polarization or circular polarization.

[0052] In some embodiments of the present invention, the topological layout of the receiving antenna unit 12 and the transmitting antenna unit 11 is a rectangular grid arrangement, a triangular grid arrangement, a concentric ring grid arrangement, or an elliptical ring grid arrangement.

[0053] In some embodiments of the present invention, the antenna array surface shape of the transmitting and receiving common-aperture antenna board 10 can be a rectangular array, a cross array, a triangular array, a hexagonal array, a circular array or an elliptical array.

[0054] In some embodiments of the present invention, the chip network board 40 includes a radio frequency chip, at least one layer of a receiving beam power combining network, at least one layer of a transmitting beam power splitting network, and an isolation layer.

[0055] In some embodiments of the present invention, the control power board 50 includes a control signal layer, a power layer, a low-frequency signal layer 44 and an isolation ground layer.

[0056] In some embodiments of the present invention, the heat dissipation structure 60 includes a mounting structure and at least one of heat dissipation teeth, a heat-conducting boss, a heat-conducting pad, and a heat dissipation fan.

[0057] The high-isolation transceiver co-aperture phased array antenna of the present invention can effectively reduce the mutual coupling between the receiving and transmitting antennas by adopting multiple isolation measures in the transceiver co-aperture antenna board, the high-isolation matching adapter board, and the chip network board, thereby achieving high radiation efficiency while miniaturizing the antenna. The high-isolation transceiver phased array antenna adopts a tile-type stacked architecture, and the spatial arrangement order of each component module can be adjusted according to design requirements. At the same time, it adopts the design concept of standardized sub-arrays, and can be expanded into full arrays of different sizes through plane splicing, thereby enhancing the adaptability of application scenarios. The high-isolation transceiver phased array antenna has the characteristics of miniaturization, high isolation, standardization, and scalability.

[0058] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, horizontal, vertical, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0059] The above is a specific embodiment of the present invention. Those skilled in the art can produce a dual-polarized common-aperture horn array antenna by applying the method disclosed in the present invention and some alternative methods without creative work. The structure of the present invention has the characteristics of low profile, low loss, simple design and easy processing.

[0060] The above embodiments are used to illustrate the present invention rather than to limit the present invention. Any modifications and changes made to the present invention within the spirit of the present invention and the protection scope of the claims shall fall within the protection scope of the present invention.

Claims

1. A high-isolation transmit-receive co-aperture phased array antenna, characterized in that: Adopting a tile-type stacked architecture, the high-isolation transmit-receive co-aperture phased array antenna comprises, from top to bottom: A transceiver co-aperture antenna board (10) is used for transmitting and receiving radio frequency signals. The transceiver co-aperture antenna board (10) comprises a plurality of receiving antenna units (12), a plurality of transmitting antenna units (11), a plurality of feeding channels and an inter-unit isolation structure (13). The inter-unit isolation structure comprises a transmitting antenna isolation structure and a receiving antenna isolation structure. Any of the receiving antenna units (12) surrounds a plurality of the receiving antenna isolation structures. Any of the transmitting antenna units (11) is provided with a plurality of the transmitting antenna isolation structures. Any of the feeding channels is provided with a feeding channel isolation structure (14). The interface of the corresponding feeding channel is provided with a feeding interface isolation structure (15). The receiving antenna unit (12) and the transmitting antenna unit (11) are located in different layers within the same PCB board, and the layers where the radiation patches are located are isolated by a ground layer; A high-isolation matching adapter board (30) comprises a receiving interface interconnection radio frequency channel, a transmitting interface interconnection radio frequency channel and a matching adapter board isolation structure, wherein the receiving interface interconnection radio frequency channel is used for connecting the receiving antenna interface and the receiving chip interface, the transmitting interface interconnection radio frequency channel is used for connecting the transmitting chip interface and the transmitting antenna interface, and the matching adapter board isolation structure comprises isolation structures at the receiving antenna end interface, the transmitting antenna end interface, the receiving chip end interface, the transmitting chip end interface, the receiving interface interconnection channel, and the transmitting interface interconnection channel; A chip network board (40) and a control power supply board (50), wherein the chip network board (40) is used for interconnecting and integrating a receiving beam network, a transmitting beam network, and a radio frequency chip; and the control power supply board (50) is used for controlling signal transmission of a phased array antenna and supplying power to each module of the phased array antenna; A heat dissipation structural component (60) is used for installing and dissipating heat for the high-isolation transmitting and receiving co-aperture phased array antenna; The high-isolation matching adapter board (30), the transmitting and receiving common-aperture antenna board (10), and the chip network board (40) are electrically connected via a PCB board interconnection structure (20), and the electrical connection is carried out by LGA welding, BGA welding, or button connection.

2. The high-isolation transmit-receive co-aperture phased array antenna according to claim 1, characterized in that: The receiving antenna unit (12) and the transmitting antenna unit (11) are microstrip antennas, helical antennas, or dipole antennas.

3. The high-isolation transmit-receive co-aperture phased array antenna according to claim 1, characterized in that: The polarization modes of the receiving antenna unit (12) and the transmitting antenna unit (11) are linear polarization or circular polarization.

4. The high-isolation transmitting and receiving co-aperture phased array antenna according to claim 1, characterized in that: The topological layout of the receiving antenna unit (12) and the transmitting antenna unit (11) is a rectangular grid arrangement, a triangular grid arrangement, a concentric ring grid arrangement or an elliptical ring grid arrangement.

5. The high-isolation transmitting and receiving co-aperture phased array antenna according to claim 1, characterized in that: The antenna array surface shape of the transmitting and receiving common aperture antenna plate (10) can be a rectangular array, a cross array, a triangular array, a hexagonal array, a circular array or an elliptical array.

6. The high-isolation transmitting and receiving co-aperture phased array antenna according to claim 1, characterized in that: The unit spacing between the receiving antenna unit (12) and the transmitting antenna unit (11) should be determined according to their operating frequency and maximum scanning angle, and then: d≤λ / (1+sinθ), wherein d represents the unit spacing between the receiving antenna unit (12) and the transmitting antenna unit (11) in the arrangement direction, λ represents the wavelength at the operating frequency of the receiving antenna or the transmitting antenna, and θ represents the maximum scanning angle of the receiving antenna or the transmitting antenna in the arrangement direction.

7. The high-isolation transmitting and receiving co-aperture phased array antenna according to claim 1, characterized in that: The chip network board (40) comprises a radio frequency chip, at least one layer of a receiving beam power combining network, at least one layer of a transmitting beam power splitting network and an isolation layer.

8. The high-isolation transmitting and receiving co-aperture phased array antenna according to claim 1, characterized in that: The control power supply board (50) comprises a control signal layer, a power supply layer, a low-frequency signal layer and an isolation ground layer.

9. The high-isolation transmitting and receiving co-aperture phased array antenna according to claim 1, characterized in that: The heat dissipation structural component (60) comprises a mounting structure and at least one of heat dissipation teeth, a heat-conducting boss, a heat-conducting pad, and a heat dissipation fan.

Images