A power module suitable for parallel connection

Abstract

The present invention provides a power module suitable for parallel connection. The power module comprises: a substrate, the first layer of which is a wiring layer, and the second layer is an insulating layer; an upper bridge arm, which is arranged on the wiring layer, the upper bridge arm comprises at least one power chip, and has a first pole and a second pole; a lower bridge arm, which is arranged on the wiring layer, the lower bridge arm comprises at least one power chip, and has a third pole and a fourth pole; a plastic package, which is covered on the wiring layer to cover the upper bridge arm and the lower bridge arm; a DC+ terminal, a DC-terminal, a power AC terminal, a first parallel AC terminal, and a second parallel AC terminal which are exposed relative to the plastic package, the DC+ terminal is connected to the first pole, the DC-terminal is connected to the fourth pole, and the power AC terminal, the first parallel AC terminal, and the second parallel AC terminal are respectively connected to the second pole and the third pole at the same time; the flow distances from the first parallel AC terminal and the second parallel AC terminal to the upper bridge arm are both shorter than the flow distance from the power AC terminal to the upper bridge arm. According to the present invention, the problem of gate voltage oscillation when the existing power module is used in parallel can be solved.

Description

Technical Field

[0001] The present invention belongs to the technical field of power modules, and more specifically, relates to a power module suitable for parallel connection. Background Art

[0002] At present, power modules are widely used in many fields such as new energy vehicles, new energy power generation, smart grids and transportation electrification. Among them, in some fields, such as the controller of new energy vehicles, there are higher requirements for the power of power modules. In order to meet the high power requirements of power modules in the corresponding application fields, it is a common solution to use multiple power modules in parallel. However, since the existing power modules are not specifically designed for AC side output, if multiple power modules are used in parallel, a gate voltage oscillation phenomenon will occur due to the inconsistency of the conduction characteristics and reverse recovery characteristics of the body diode of the power chip, which will seriously affect the reliability of the power module. Summary of the invention

[0003] The purpose of the present invention is to solve the problem of gate voltage oscillation when the existing power modules are used in parallel.

[0004] In order to achieve the above object, the present invention provides a power module suitable for parallel connection, the power module comprising:

[0005] A substrate, wherein the first layer of the substrate is a wiring layer, and the second layer of the substrate is an insulating layer;

[0006] An upper bridge arm is arranged on the wiring layer, the upper bridge arm includes at least one power chip and has a first pole and a second pole;

[0007] A lower bridge arm is arranged on the wiring layer, the lower bridge arm includes at least one power chip and has a third pole and a fourth pole;

[0008] A plastic package body, which is disposed on the wiring layer to cover the upper bridge arm and the lower bridge arm;

[0009] The DC+ terminal, the DC- terminal, the power AC terminal, the first parallel AC terminal, and the second parallel AC terminal that are exposed relative to the plastic package body, the DC+ terminal is connected to the first pole, the DC- terminal is connected to the fourth pole, the power AC terminal is connected to the second pole and the third pole at the same time, the first parallel AC terminal is connected to the second pole and the third pole at the same time, and the second parallel AC terminal is connected to the second pole and the third pole at the same time;

[0010] The length of the current path between the first parallel AC terminal and the upper bridge arm is smaller than the length of the current path between the power AC terminal and the upper bridge arm, and the length of the current path between the second parallel AC terminal and the upper bridge arm is smaller than the length of the current path between the power AC terminal and the upper bridge arm.

[0011] Optionally, the plastic package body has a first side surface and a second side surface that are opposite to each other in a first direction;

[0012] The first parallel AC terminal extends out from the inside of the plastic package body to the first side surface;

[0013] The second parallel AC terminal extends out from the inside of the plastic package to the second side surface.

[0014] Optionally, the plastic package body further has a first end face and a second end face opposite to each other in a second direction, and the second direction is perpendicular to the first direction;

[0015] The DC-terminal extends out of the first end surface from the inside of the plastic package body;

[0016] The power AC terminal extends out from the inside of the plastic package body to the second end surface.

[0017] Optionally, the upper bridge arm and the lower bridge arm are arranged opposite to each other in the second direction;

[0018] The upper bridge arm is closer to the power AC terminal than the lower bridge arm;

[0019] The lower bridge arm is closer to the DC-terminal than the upper bridge arm.

[0020] Optionally, the first parallel AC terminal and the second parallel AC terminal are arranged opposite to each other in the first direction;

[0021] In the second direction, the first parallel AC terminal is located between the upper bridge arm and the lower bridge arm, or, in the second direction, the first parallel AC terminal is located between the upper bridge arm and the power AC terminal, or, in the second direction, the first parallel AC terminal is arranged in parallel with the upper bridge arm.

[0022] Optionally, the DC+ terminal is exposed relative to the upper surface of the plastic package body;

[0023] In the second direction, the DC+ terminal is located between the upper bridge arm and the lower bridge arm, and a portion of the DC+ terminal extends between the first parallel AC terminal and the second parallel AC terminal, or, in the second direction, the DC+ terminal is located between the upper bridge arm and the power AC terminal, or, in the second direction, the DC+ terminal and the upper bridge arm are arranged in parallel;

[0024] The DC+ terminal is a conductive block extending beyond the upper surface of the plastic package body, or the DC+ terminal is formed in the wiring layer, and a window corresponding to the position of the DC+ terminal is provided on the upper surface of the plastic package body.

[0025] Optionally, the upper bridge arm and the lower bridge arm each include N power chips;

[0026] When N is 1, the first pole is the first power electrode of the power chip in the upper bridge arm, the second pole is the second power electrode of the power chip in the upper bridge arm, the third pole is the first power electrode of the power chip in the lower bridge arm, and the fourth pole is the second power electrode of the lower bridge arm;

[0027] When N is greater than 1, the first pole is the common lead-out terminal of the first power electrodes of the N power chips in the upper bridge arm, the second pole is the common lead-out terminal of the second power electrodes of the N power chips in the upper bridge arm, the third pole is the common lead-out terminal of the first power electrodes of the N power chips in the lower bridge arm, and the fourth pole is the common lead-out terminal of the second power electrodes of the N power chips in the lower bridge arm.

[0028] Optionally, the power chip is connected to the wiring layer via a first solder layer;

[0029] The second pole of the upper bridge arm is connected to the wiring layer via a metal sheet and a second solder layer in sequence, or the second pole of the upper bridge arm is connected to the wiring layer via a metal sheet and a second solder layer in sequence, the metal sheet is part of the power AC terminal, or the second pole of the upper bridge arm is connected to the wiring layer via a binding wire.

[0030] Optionally, the power module further includes:

[0031] The signal terminal is exposed relative to the plastic package body.

[0032] Optionally, a metal heat dissipation layer is provided on a side of the insulation layer away from the wiring layer.

[0033] The beneficial effects of the present invention are:

[0034] The power module suitable for parallel connection of the present invention is designed with an independent parallel AC terminal, and the current flow distance from the upper bridge arm to the parallel AC terminal is shorter than the current flow distance from the upper bridge arm to the power AC terminal. When multiple power modules are used in parallel, the parallel AC terminals are connected by a copper busbar, thereby forming a low-inductance parallel path. The formation of this low-inductance parallel path can greatly reduce the amplitude of the induced voltage on the parasitic inductance of the power chip, and thus can effectively reduce the risk of gate voltage oscillation caused by the parallel use of multiple power modules. It can be seen that the use of the power module suitable for parallel connection of the present invention can effectively solve the problem of gate voltage oscillation when the existing power modules are used in parallel.

[0035] Other features and advantages of the present invention will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The present invention may be better understood by referring to the following description taken in conjunction with the accompanying drawings, in which the same or similar reference numerals are used throughout the drawings to represent the same or similar components.

[0037] Figure 1 A schematic structural diagram of a power module suitable for parallel connection according to an embodiment of the present invention is shown, wherein the plastic package is not shown;

[0038] Figure 2 A circuit schematic diagram of power modules suitable for parallel connection according to an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0039] In order to enable those skilled in the art to more fully understand the technical solution of the present invention, the exemplary embodiments of the present invention will be described in more comprehensive and detailed in conjunction with the accompanying drawings below. Obviously, the one or more embodiments of the present invention described below are only one or more of the specific ways in which the technical solution of the present invention can be implemented, and are not exhaustive. It should be understood that other ways belonging to a general inventive concept can be used to implement the technical solution of the present invention, and should not be limited by the exemplary embodiments described. Based on one or more embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without making creative work should fall within the scope of protection of the present invention.

[0040] Example: Figure 1 A schematic structural diagram of a power module suitable for parallel connection according to an embodiment of the present invention is shown, wherein the plastic package is not shown; Figure 2 A circuit schematic diagram of power modules suitable for parallel connection according to an embodiment of the present invention is shown.

[0041] Reference Figure 1 and Figure 2, the power module suitable for parallel connection in an embodiment of the present invention includes:

[0042] A substrate, wherein the first layer of the substrate is a wiring layer 100 and the second layer is an insulating layer;

[0043] An upper bridge arm is arranged on the wiring layer 100 , and the upper bridge arm includes two power chips 210 , and has a first pole 220 and a second pole 230 ;

[0044] A lower bridge arm is arranged on the wiring layer 100 , and the lower bridge arm includes two power chips 310 , and has a third pole 320 and a fourth pole 330 ;

[0045] A plastic package body is disposed on the wiring layer 100 to cover the upper bridge arm and the lower bridge arm;

[0046] The DC+ terminal 410, the DC-terminal 420, the power AC terminal 430, the first parallel AC terminal 440, and the second parallel AC terminal 450 which are exposed relative to the plastic package, the DC+ terminal 410 is connected to the first pole 220, the DC-terminal 420 is connected to the fourth pole 330, the power AC terminal 430 is connected to the second pole 230 and the third pole 320 at the same time, the first parallel AC terminal 440 is connected to the second pole 230 and the third pole 320 at the same time, and the second parallel AC terminal 450 is connected to the second pole 230 and the third pole 320 at the same time;

[0047] The length of the current path between the first parallel AC terminal 440 and the upper bridge arm is shorter than that between the power AC terminal 430 and the upper bridge arm, and the length of the current path between the second parallel AC terminal 450 and the upper bridge arm is shorter than that between the power AC terminal 430 and the upper bridge arm.

[0048] Further, in an embodiment of the present invention, the plastic package body has a first side surface and a second side surface that are opposite to each other in a first direction;

[0049] The first parallel AC terminal 440 extends out from the first side surface of the plastic package;

[0050] The second parallel AC terminal 450 extends out of the second side surface from the inside of the plastic package.

[0051] Furthermore, in an embodiment of the present invention, the plastic package body further has a first end face and a second end face opposite to each other in a second direction, and the second direction is perpendicular to the first direction;

[0052] The DC-terminal 420 extends out of the first end surface from the inside of the plastic package body;

[0053] The power AC terminal 430 extends out of the second end surface from the inside of the plastic package.

[0054] Furthermore, in an embodiment of the present invention, the upper bridge arm and the lower bridge arm are arranged opposite to each other in the second direction;

[0055] The upper bridge arm is closer to the power AC terminal 430 relative to the lower bridge arm;

[0056] The lower bridge arm is closer to the DC-terminal 420 than the upper bridge arm.

[0057] Furthermore, in the embodiment of the present invention, the first parallel AC terminal 440 and the second parallel AC terminal 450 are arranged opposite to each other in the first direction;

[0058] In the second direction, the first parallel AC terminal 440 is located between the upper bridge arm and the lower bridge arm.

[0059] Specifically, as an optional implementation, in the embodiment of the present invention, in the second direction, the first parallel AC terminal 440 is located between the upper bridge arm and the power AC terminal 430 .

[0060] Specifically, as an optional embodiment, in the second direction, the first parallel AC terminal 440 is arranged in parallel with the upper bridge arm, that is, in this arrangement, the first parallel AC terminal 440 is opposite to the first side of the upper bridge arm and is spaced apart, the second parallel AC terminal 450 is opposite to the second side of the upper bridge arm and is spaced apart, and the first side and the second side of the upper bridge arm are opposite in the first direction.

[0061] Furthermore, in the embodiment of the present invention, the DC+ terminal 410 is exposed relative to the upper surface of the plastic package body;

[0062] In the second direction, the DC+ terminal 410 is located between the upper bridge arm and the lower bridge arm, and a portion of the DC+ terminal 410 extends between the first parallel AC terminal 440 and the second parallel AC terminal 450;

[0063] The DC+ terminal 410 is a conductive block extending beyond the upper surface of the plastic package, or the DC+ terminal 410 is formed on the wiring layer 100 , and a window corresponding to the position of the DC+ terminal 410 is provided on the upper surface of the plastic package.

[0064] Specifically, as an optional implementation, in the embodiment of the present invention, in the second direction, the DC+ terminal 410 is located between the upper bridge arm and the power AC terminal 430 .

[0065] Specifically, as an optional implementation, in an embodiment of the present invention, in the second direction, the DC+ terminal 410 is arranged in parallel with the upper bridge arm, that is, in this arrangement, the DC+ terminal 410 is opposite to the first side of the upper bridge arm and is spaced apart, or the DC+ terminal 410 is opposite to the second side of the upper bridge arm and is spaced apart, wherein the first side of the upper bridge arm is on the same side as the first side surface of the plastic package body, and the second side of the upper bridge arm is on the same side as the second side surface of the plastic package body.

[0066] Specifically, in the embodiment of the present invention, if the DC+ terminal 410 is implemented by a conductive block extending beyond the upper surface of the plastic package, the conductive block is made of conductive materials such as copper, aluminum, copper-molybdenum alloy, or aluminum silicon carbide.

[0067] Furthermore, in the embodiment of the present invention, the upper bridge arm includes two power chips 210, and the lower bridge arm includes two power chips 310;

[0068] The first pole 220 is a common lead-out terminal of the first power electrodes of the two power chips 210 in the upper bridge arm, and the second pole 230 is a common lead-out terminal of the second power electrodes of the two power chips 210 in the upper bridge arm;

[0069] The third pole 320 is a common lead-out terminal of the first power electrodes of the two power chips 310 in the lower bridge arm, and the fourth pole 330 is a common lead-out terminal of the second power electrodes of the two power chips 310 in the lower bridge arm.

[0070] Specifically, the power chip used in the power module suitable for parallel connection in the embodiment of the present invention may be one or more of a diode chip (Diode chip), a metal oxide semiconductor field effect transistor chip (MOSFET chip), an insulated gate bipolar transistor chip (IGBT chip), a high electron mobility transistor chip (HEMT chip), a junction field effect transistor chip (JFET chip), a bipolar junction transistor chip (BJT chip) or a thyristor chip (SCR chip).

[0071] Specifically, in an embodiment of the present invention, if the power chip 210 and the power chip 310 are both MOSFET chips, the first pole 220 is the common lead-out terminal of the drain of the two power chips 210 in the upper bridge arm, and the second pole 230 is the common lead-out terminal of the source of the two power chips 210 in the upper bridge arm; the third pole 320 is the common lead-out terminal of the drain of the two power chips 310 in the lower bridge arm, and the fourth pole 330 is the common lead-out terminal of the source of the two power chips 310 in the lower bridge arm.

[0072] Furthermore, in the embodiment of the present invention, the power chip 310 in the lower bridge arm is connected to the wiring layer 100 through the first solder layer;

[0073] The second pole 230 of the upper bridge arm is connected to the wiring layer 100 through the metal sheet 431 and the second solder layer in sequence, and the metal sheet 431 is a part of the power AC terminal 430;

[0074] The power chip 210 in the upper bridge arm is connected to the wiring layer 100 through the third solder layer.

[0075] Specifically, as an optional implementation, in the embodiment of the present invention, the second pole 230 of the upper bridge arm can be connected to the wiring layer 100 through an independent metal sheet and a second solder layer in sequence;

[0076] The second pole 230 of the upper bridge arm may also be connected to the wiring layer 100 via a binding wire, where the binding wire is a linear conductive structure such as an aluminum wire, an aluminum tape, a copper wire or a copper tape.

[0077] Specifically, in the embodiment of the present invention, the first solder layer is a conductive connecting material such as sintered silver, solder or conductive silver paste, the second solder layer is a conductive connecting material such as sintered silver, solder or conductive silver paste, and the third solder layer is a conductive connecting material such as sintered silver, solder or conductive silver paste.

[0078] Furthermore, the power module of the embodiment of the present invention further includes:

[0079] The signal terminal is exposed relative to the plastic package body, and the signal terminal is a welding terminal or a crimping terminal led out from the first end surface or the second end surface of the plastic package body.

[0080] Specifically, in the embodiment of the present invention, the signal terminal can also be a welding terminal or a crimping terminal extending beyond the upper surface of the plastic package, or can be a conductive block extending beyond the upper surface of the plastic package, or can be formed above the wiring layer 100, and a window corresponding to the signal terminal is provided at a corresponding position on the upper surface of the plastic package.

[0081] Furthermore, in the embodiment of the present invention, the substrate further includes a third layer, which is a metal heat dissipation layer. The metal heat dissipation layer is disposed on a side of the insulating layer away from the wiring layer 100 .

[0082] Specifically, in the embodiment of the present invention, the insulating layer is made of insulating materials such as aluminum oxide, aluminum nitride, zirconium oxide, silicon nitride, epoxy resin or silicone.

[0083] Although one or more embodiments of the present invention are described above, it should be known to those skilled in the art that the present invention can be implemented in any other form without departing from its subject matter and scope. Therefore, the embodiments described above are illustrative rather than restrictive, and many modifications and substitutions are obvious to those skilled in the art without departing from the spirit and scope of the present invention as defined in the appended claims.

Claims

1. A power module suitable for parallel connection, characterized in that: include: A substrate, wherein the first layer of the substrate is a wiring layer, and the second layer of the substrate is an insulating layer; An upper bridge arm is arranged on the wiring layer, the upper bridge arm includes at least one power chip and has a first pole and a second pole; A lower bridge arm is arranged on the wiring layer, the lower bridge arm includes at least one power chip and has a third pole and a fourth pole; A plastic package body, which is disposed on the wiring layer to cover the upper bridge arm and the lower bridge arm; The DC+ terminal, the DC- terminal, the power AC terminal, the first parallel AC terminal, and the second parallel AC terminal that are exposed relative to the plastic package body, the DC+ terminal is connected to the first pole, the DC- terminal is connected to the fourth pole, the power AC terminal is connected to the second pole and the third pole at the same time, the first parallel AC terminal is connected to the second pole and the third pole at the same time, and the second parallel AC terminal is connected to the second pole and the third pole at the same time; The length of the current path between the first parallel AC terminal and the upper bridge arm is smaller than the length of the current path between the power AC terminal and the upper bridge arm, and the length of the current path between the second parallel AC terminal and the upper bridge arm is smaller than the length of the current path between the power AC terminal and the upper bridge arm.

2. The power module suitable for parallel connection according to claim 1, characterized in that: The plastic package body has a first side surface and a second side surface which are opposite to each other in a first direction; The first parallel AC terminal extends out from the inside of the plastic package body to the first side surface; The second parallel AC terminal extends out from the inside of the plastic package to the second side surface.

3. The power module suitable for parallel connection according to claim 2, characterized in that: The plastic package body further has a first end face and a second end face opposite to each other in a second direction, and the second direction is perpendicular to the first direction; The DC-terminal extends out of the first end surface from the inside of the plastic package body; The power AC terminal extends out from the inside of the plastic package body to the second end surface.

4. The power module suitable for parallel connection according to claim 3, characterized in that: The upper bridge arm and the lower bridge arm are arranged opposite to each other in the second direction; The upper bridge arm is closer to the power AC terminal than the lower bridge arm; The lower bridge arm is closer to the DC-terminal than the upper bridge arm.

5. The power module suitable for parallel connection according to claim 2, characterized in that: The first parallel AC terminal and the second parallel AC terminal are arranged opposite to each other in the first direction; In the second direction, the first parallel AC terminal is located between the upper bridge arm and the lower bridge arm, or, in the second direction, the first parallel AC terminal is located between the upper bridge arm and the power AC terminal, or, in the second direction, the first parallel AC terminal and the upper bridge arm are arranged in parallel; The second direction is perpendicular to the first direction.

6. The power module suitable for parallel connection according to claim 5, characterized in that: The DC+ terminal is exposed relative to the upper surface of the plastic package body; In the second direction, the DC+ terminal is located between the upper bridge arm and the lower bridge arm, and a portion of the DC+ terminal extends between the first parallel AC terminal and the second parallel AC terminal, or, in the second direction, the DC+ terminal is located between the upper bridge arm and the power AC terminal, or, in the second direction, the DC+ terminal and the upper bridge arm are arranged in parallel; The DC+ terminal is a conductive block extending beyond the upper surface of the plastic package body, or the DC+ terminal is formed in the wiring layer, and a window corresponding to the position of the DC+ terminal is provided on the upper surface of the plastic package body.

7. The power module suitable for parallel connection according to claim 1, characterized in that: The upper bridge arm and the lower bridge arm each include N power chips; When N is 1, the first pole is the first power electrode of the power chip in the upper bridge arm, the second pole is the second power electrode of the power chip in the upper bridge arm, the third pole is the first power electrode of the power chip in the lower bridge arm, and the fourth pole is the second power electrode of the lower bridge arm; When N is greater than 1, the first pole is the common lead-out terminal of the first power electrodes of the N power chips in the upper bridge arm, the second pole is the common lead-out terminal of the second power electrodes of the N power chips in the upper bridge arm, the third pole is the common lead-out terminal of the first power electrodes of the N power chips in the lower bridge arm, and the fourth pole is the common lead-out terminal of the second power electrodes of the N power chips in the lower bridge arm.

8. The power module suitable for parallel connection according to claim 1, characterized in that: The power chip is connected to the wiring layer via a first solder layer; The second pole of the upper bridge arm is connected to the wiring layer through a metal sheet and a second solder layer in sequence, wherein the metal sheet is an independent metal sheet or the metal sheet is a part of the power AC terminal. Alternatively, the second pole of the upper bridge arm is connected to the wiring layer through a binding wire.

9. The power module suitable for parallel connection according to claim 1, characterized in that: Also includes: The signal terminal is exposed relative to the plastic package body.

10. The power module suitable for parallel connection according to claim 1, characterized in that: A metal heat dissipation layer is provided on a side of the insulating layer away from the wiring layer.

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