Power amplifier and radio frequency front-end module

Abstract

The present application discloses a power amplifier and a radio frequency front-end module. The power amplifier may include a first-stage power amplification circuit, a second-stage power amplification circuit, a choke unit, and a stabilization unit. Among them, the power supply terminal of the second-stage power amplification circuit is connected to a first power supply terminal, and the choke unit is connected between the power supply terminal of the first-stage power amplification circuit and the first power supply terminal. The stabilization unit is connected in parallel with the choke unit, and the stabilization unit includes at least one resistor. Specifically, the stabilization unit may be resistive, so that a part of the out-of-band low-frequency signals in the radio frequency signals coupled to the first-stage power amplification circuit via the second-stage power amplification circuit and the subsequent stage pass through the stabilization unit. The stabilization unit can suppress the above-mentioned out-of-band low-frequency signals, thereby reducing the signal gain brought by the out-of-band low-frequency signals, reducing the signal coupling between the first-stage power amplification circuit and the second-stage power amplification circuit, and improving the stability of the power amplifier during operation.

Description

Technical Field

[0001] This application relates to the field of radio frequency technology, and more specifically, to a power amplifier and a radio frequency front-end module. Background Art

[0002] Existing radio frequency front-end modules have been widely used in fields such as wireless communication, Internet of Things, and smart home. Among them, as the core unit of the radio frequency front-end module, the performance of the power amplifier has a great impact on the signal output index of the radio frequency front-end module.

[0003] When the power amplifier is implemented by a power amplification circuit, a choke inductor is provided between the power supply terminal of the transistor in the power amplification circuit and the power supply. This choke inductor can prevent the radio frequency signal output by the transistor from leaking to the power supply.

[0004] However, in the case where the power amplification circuit is implemented by a multi-stage amplification architecture, there is often signal coupling between the first-stage power amplification circuit and the second-stage power amplification circuit, which results in poor stability of the power amplifier. Summary of the Invention

[0005] Embodiments of this application provide a power amplifier and a radio frequency front-end module.

[0006] According to the first aspect of this application, embodiments of this application provide a power amplifier. The power amplifier is provided with a signal input terminal, a signal output terminal, and a first power supply terminal. The power amplifier includes a first-stage power amplification circuit, a second-stage power amplification circuit, a choke unit, and a stability unit. Among them, the input terminal of the first-stage power amplification circuit is connected to the signal input terminal, and the output terminal of the first-stage power amplification circuit is connected to the input terminal of the second-stage power amplification circuit; the output terminal of the second-stage power amplification circuit is connected to the signal output terminal. One end of the choke unit is connected to the power supply terminal of the first-stage power amplification circuit, and the other end of the choke unit and the power supply terminal of the second-stage power amplification circuit are respectively connected to the first power supply terminal. The stability unit is connected in parallel with the choke unit, and the stability unit includes at least one resistor.

[0007] This application provides a power amplifier, which may include a first-stage power amplification circuit, a second-stage power amplification circuit, a choke unit, and a stability unit. Among them, the power supply terminal of the second-stage power amplification circuit is connected to the first power supply terminal, and the choke unit is connected between the power supply terminal of the first-stage power amplification circuit and the first power supply terminal.

[0008] The stabilization unit and the choke unit are connected in parallel. The stabilization unit includes at least one resistor. Exemplarily, the stabilization unit can be resistive, such that a part of the out-of-band low-frequency signals in the radio frequency signals coupled to the first-stage power amplifier circuit via the second-stage power amplifier circuit and the subsequent stage pass through the stabilization unit. The stabilization unit can suppress the above-mentioned out-of-band low-frequency signals, thereby reducing the signal gain brought by the out-of-band low-frequency signals, reducing the signal coupling between the first-stage power amplifier circuit and the second-stage power amplifier circuit, and improving the stability of the power amplifier during operation. When the output terminal and the power supply terminal of the second-stage power amplifier circuit share the same signal port, the stabilization unit and the choke unit can also suppress the output signal fed back from the second-stage power amplifier circuit to the first-stage power amplifier circuit, so as to prevent the power amplifier 100 from oscillating.

[0009] According to the second aspect of the present application, an embodiment of the present application further provides a power amplifier, which is provided with a signal input terminal, a signal output terminal, and a power supply terminal. The power amplifier includes a power amplifier circuit, a choke unit, and a stabilization unit. Among them, the input terminal of the power amplifier circuit is connected to the signal input terminal, and the output terminal of the power amplifier circuit is connected to the signal output terminal. The first end of the choke unit is connected to the power supply terminal of the power amplifier circuit, and the second end of the choke unit is connected to the power supply terminal. The stabilization unit and the choke unit are connected in parallel, and the stabilization unit includes at least one resistor.

[0010] The present application further provides a power amplifier, which may include a power amplifier circuit, a choke unit, and a stabilization unit. Among them, the first end of the choke unit is connected to the power supply terminal of the power amplifier circuit, and the second end of the choke unit is connected to the power supply terminal. The stabilization unit and the choke unit are connected in parallel, and the stabilization unit includes at least one resistor.

[0011] Since the stabilization unit is connected in parallel on both sides of the choke unit in the present application, the stabilization unit can be resistive, thereby reducing the quality factor (i.e., Q value) of the choke unit. Therefore, when there is coupling between the parasitic capacitance of the transistor itself in the power amplifier circuit and the choke unit, the reduction of the Q value of the choke unit can reduce the amplification gain of the power amplifier, thereby reducing the risk of oscillation of the power amplifier and improving the stability of the power amplifier during operation.

[0012] According to the third aspect of the present application, an embodiment of the present application further provides a radio frequency front-end module, which includes a substrate and the above-mentioned power amplifier. Among them, the power amplifier is disposed on the substrate. Description of the Drawings

[0013] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the accompanying drawings required for the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those skilled in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0014] Figure 1 It is the first structural schematic diagram of the power amplifier provided by the embodiment of the present application.

[0015] Figure 2 Is Figure 1 A structural schematic diagram of the stabilization unit in the power amplifier shown.

[0016] Figure 3 Is Figure 1 Another structural schematic diagram of the stabilization unit in the power amplifier shown.

[0017] Figure 4 Is Figure 1 The second structural schematic diagram of the power amplifier shown.

[0018] Figure 5 Is Figure 1 The third structural schematic diagram of the power amplifier shown.

[0019] Figure 6 Is Figure 5 A structural schematic diagram of the first balun, the third-stage power amplification circuit, and the second balun in the power amplifier shown.

[0020] Figure 7 Is Figure 1 The fourth structural schematic diagram of the power amplifier shown.

[0021] Figure 8 Is Figure 1 The fifth structural schematic diagram of the power amplifier shown.

[0022] Figure 9 Is Figure 1 The sixth structural schematic diagram of the power amplifier shown.

[0023] Figure 10 Is Figure 1 The seventh structural schematic diagram of the power amplifier shown.

[0024] Figure 11 Is Figure 1 The eighth structural schematic diagram of the power amplifier shown.

[0025] Figure 12 Is Figure 1 The ninth structural schematic diagram of the power amplifier shown.

[0026] Figure 13 It is a schematic structural diagram of a power amplifier provided by another embodiment of the present application.

[0027] Figure 14 is Figure 13 Another schematic structural diagram of the shown power amplifier.

[0028] Figure 15 It is a schematic structural diagram of a radio frequency front-end module provided by an embodiment of the present application. Detailed implementation manners

[0029] In order to enable those skilled in the art to better understand the solution of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of the present application.

[0030] The embodiment of the present application provides a power amplifier 100. The power amplifier 100 is a device for increasing the output power of a radio frequency signal. The power amplifier 100 in this embodiment is provided with a signal input terminal 12, a signal output terminal 14, and a first power supply terminal 16. Among them, the signal input terminal 12 is used to input a radio frequency signal to be power-amplified, and the signal output terminal 14 is used to output the radio frequency signal that has been power-amplified by the power amplifier 100. The first power supply terminal 16 is used to supply power to the components or chips in the power amplifier 100. Specifically, the first power supply terminal 16 can provide a first power supply voltage (Volt Current Condenser, VCC1). For example, VCC1 can be 3V, 5V, 8V, etc., and this embodiment does not make specific limitations.

[0031] Please refer to Figure 1 , the power amplifier 100 may include a first-stage power amplification circuit 10, a second-stage power amplification circuit 20, a choke unit 30, and a stabilization unit 40. Among them, the input terminal 101 of the first-stage power amplification circuit 10 is connected to the signal input terminal 12, the output terminal 103 of the first-stage power amplification circuit 10 is connected to the input terminal 201 of the second-stage power amplification circuit 20, and the output terminal 203 of the second-stage power amplification circuit 20 is connected to the signal output terminal 14.

[0032] Therefore, the first-stage power amplifier circuit 10 and the second-stage power amplifier circuit 20 in this embodiment form a two-stage amplifier circuit to increase the upper limit of power amplification of the RF signal. Of course, more power amplifier circuits can be cascaded between the output terminal 203 of the second-stage power amplifier circuit 20 and the signal output terminal 14, for example, a third-stage power amplifier circuit, a fourth-stage power amplifier circuit, etc., which are not specifically limited in this embodiment.

[0033] The first end 301 of the choke unit 30 is connected to the power supply terminal 105 of the first-stage power amplifier circuit 10, and the second end 303 of the choke unit 30 and the power supply terminal 205 of the second-stage power amplifier circuit 20 are respectively connected to the first power supply terminal 16. Therefore, the power supply terminal 105 of the first-stage power amplifier circuit 10 and the power supply terminal 205 of the second-stage power amplifier circuit 20 in this embodiment are both connected to the same power supply terminal, that is, the first power supply terminal 16. Among them, there is electromagnetic coupling between the second-stage power amplifier circuit 20 and other circuits and the first-stage power amplifier circuit 10, which will generate out-of-band low-frequency signals in the first-stage power amplifier circuit 10. If the out-of-band low-frequency signals are amplified by the first-stage power amplifier circuit and the second-stage power amplifier circuit according to the normal gain, it will interfere with the output of the power amplifier 100 and reduce the stability of the power amplifier 100.

[0034] The stabilization unit 40 is connected in parallel with the choke unit 30, and the stabilization unit 40 includes at least one resistor 410. Exemplarily, the stabilization unit 40 can be implemented by a pure resistor circuit, so that the stabilization unit 40 is resistive. When a part of the out-of-band low-frequency signals in the RF signal coupled to the first-stage power amplifier circuit 10 via the second-stage power amplifier circuit 20 and the subsequent circuits pass through the stabilization unit 40, the stabilization unit 40 can suppress the above-mentioned out-of-band low-frequency signals, thereby reducing the signal gain of the out-of-band low-frequency signals and reducing the signal coupling between the first-stage power amplifier circuit 10 and the second-stage power amplifier circuit 20, so as to improve the stability of the power amplifier 100 during operation.

[0035] The following will introduce each module in the power amplifier 100 in detail.

[0036] In this embodiment, the choke unit 30 is used to prevent the RF signal at the first-stage power amplifier circuit 10 from leaking to the first power supply terminal 16 to ensure the normal operation of the power amplifier 100. In addition, the choke unit 30 can also prevent the AC component (that is, the interference signal) in the first power supply voltage VCC1 output by the first power supply terminal 16 from entering the first-stage power amplifier circuit 10.

[0037] In Figure 1In the illustrated embodiment, the choke unit 30 may include a first inductor 310, and the first inductor 310 is connected between the power supply terminal 105 of the first-stage power amplifier circuit 10 and the first power supply terminal 16. Specifically, the first inductor 310 may be a surface mount inductor, a plug-in inductor, etc., and the first inductor 310 may also be a section of metal trace wound around a substrate or a chip, and this metal trace may be equivalent to the first inductor 310.

[0038] In this embodiment, the stabilization unit 40 is connected in parallel with the choke unit 30. Specifically, the first end 401 of the stabilization unit 40 is connected to the first end 301 of the choke unit 30, and the second end 403 of the stabilization unit 40 is connected to the second end 303 of the choke unit 30. The stabilization unit 40 is used to suppress some out-of-band low-frequency signals in the radio frequency signals coupled from the second-stage power amplifier circuit 20 and the subsequent stage to the first-stage power amplifier circuit 10, so as to reduce the out-of-band low-frequency gain of the above radio frequency signals and improve the stability of the power amplifier 100 during operation.

[0039] In some possible embodiments, the output terminal 203 and the power supply terminal 205 of the second-stage power amplifier circuit 20 may share the same signal port. In this case, the output terminal 203 of the second-stage power amplifier circuit 20 is also connected to the first power supply terminal 16, resulting in the output signal of the second-stage power amplifier circuit 20 being fed back to the first-stage power amplifier circuit 10. At this time, a part of the output signal of the second-stage power amplifier circuit 20 is fed back to the first-stage power amplifier circuit 10 through the choke unit 30 and the stabilization unit 40. The choke unit 30 presents a high impedance to in-band signals, which can reduce the signal fed back from the second-stage power amplifier circuit 20 to the first-stage power amplifier circuit 10. Even if a small amount of in-band signals are fed back to the first-stage power amplifier circuit 10, through the choke unit 30 and the stabilization unit 40, the gain of the feedback signal can be reduced, the interference to the output signal of the power amplifier 100 can be alleviated, and thus the stability of the power amplifier 100 can be improved.

[0040] It is not difficult to understand here that the "out-of-band low-frequency signal" refers to a low-frequency signal outside the operating frequency band of the power amplifier 100, which is mainly generated by electromagnetic coupling, and the "in-band signal" is a signal within the operating frequency band of the power amplifier 100, including the fundamental wave signal fed back from the second-stage power amplifier circuit 20 to the first-stage power amplifier circuit 10.

[0041] As an implementation manner, the stabilization unit 40 may include a resistor 410, and the resistor 410 is connected in parallel with the first inductor 310.

[0042] As another embodiment, the stabilization unit 40 may include M resistors 410 and M switches 430 corresponding to the M resistors 410 one by one, where M is an integer greater than 1. Specifically, the resistance values of the M resistors 410 may be the same or different from each other. The switch 430 may be a transistor switch. Therefore, in this embodiment, by controlling the open / close state of the switch 430 corresponding to the resistor 410, it is possible to control whether the resistor 410 is connected to the resistor network corresponding to the stabilization unit 40, thereby adjusting the equivalent resistance value of the stabilization unit 40.

[0043] Please refer to Figure 2 , the M resistors 410 are connected in series with each other, and the switch 430 is connected in parallel with the corresponding resistor 410. One end formed after the M resistors 410 are connected in series with each other is the first end 401 of the stabilization unit 40, and the other end formed after the M resistors 410 are connected in series with each other is the second end 403 of the stabilization unit 40. Please refer to Figure 3 , the M resistors 410 are connected in parallel with each other, and the switch 430 is connected in series in the branch where the corresponding resistor 410 is located. One end formed after the M resistors 410 are connected in parallel with each other is the first end 401 of the stabilization unit 40, and the other end formed after the M resistors 410 are connected in parallel with each other is the second end 403 of the stabilization unit 40. Of course, the M resistors 410 and the M switches 430 may also adopt other connection methods, which are not specifically limited in this embodiment.

[0044] In Figure 2 and Figure 3 In the embodiments shown, the power amplifier 100 may further include a control unit 50. The control unit 50 is connected to the M switches 430, and the control unit 50 is configured to adjust the equivalent resistance value of the stabilization unit 40 based on the inductance value of the first inductor 310 and the signal frequency of the radio frequency signal to be suppressed. Specifically, the inductance value of the first inductor 310 and the equivalent resistance value of the stabilization unit 40 satisfy the following formula.

[0045]

[0046] Where f is the signal frequency of the radio frequency signal to be suppressed, R is the equivalent resistance value of the stabilization unit 40, and L is the inductance value of the first inductor 310. Therefore, when L is a fixed value, f and R are in a positive correlation.

[0047] Specifically, the control unit 50 can determine the signal frequency of the radio frequency signal to be suppressed according to the operating frequency band of the power amplifier 100, and control the opening and closing states of the M switches 430 to adjust the equivalent resistance value of the stabilization unit 40. For example, the operating frequency band of the power amplifier 100 can be the N77 frequency band, that is, the frequency band of the in-band signal is 3.3 GHz to 4.2 GHz, then the corresponding out-of-band low-frequency signal is a radio frequency signal less than 3.3 GHz, that is, the radio frequency signal to be suppressed can include signals with a frequency less than 3.3 GHz. For example, the signal frequency of the radio frequency signal to be suppressed can be 2.5 GHz, 3 GHz, and so on.

[0048] Of course, the signal frequency of the radio frequency signal to be suppressed can also include the frequency of the in-band signal. Similarly, taking the operating frequency band of the power amplifier 100 as the N77 frequency band as an example, the radio frequency signal to be suppressed can include signals with a frequency greater than or equal to 3.3 GHz and less than 4.2 GHz. For example, the signal frequency of the radio frequency signal to be suppressed can be 3.5 GHz, 4 GHz, and so on. Therefore, in this embodiment, by suppressing the in-band signal, the positive feedback of the in-band signal between the first-stage power amplification circuit 10 and the second-stage power amplification circuit 20 can be weakened, so as to improve the stability of the power amplifier 100 during operation.

[0049] It is not difficult to understand here that when the choke unit 30 and the stabilization unit 40 perform signal suppression, "broadband" suppression is generated, that is, signals near the signal frequency of the radio frequency signal to be suppressed will all be suppressed. When the out-of-band low-frequency signal generated by signal coupling is relatively close to the frequency of the in-band signal, the choke unit 30 and the stabilization unit 40 can suppress both the out-of-band low-frequency signal and the in-band signal at the same time.

[0050] Specifically, the signal frequency of the radio frequency signal to be suppressed can also be directly stored in the memory of the electronic device where the power amplifier 100 is located, and the control unit 50 can determine the signal frequency of the radio frequency signal to be suppressed by directly reading the data in the above memory.

[0051] As an implementation manner, when the control unit 50 determines the signal frequency of the radio frequency signal to be suppressed, it can determine the opening and closing states of the M switches 430 based on the pre-stored switch state mapping relationship, and then control the M switches 430 to work based on the opening and closing states of the M switches 430 to adjust the equivalent resistance value of the stabilization unit 40. Among them, the pre-stored switch state mapping relationship represents the corresponding relationship between different signal frequencies and the opening and closing states of different M switches 430. Specifically, the switch state mapping relationship can be a mapping table, and this mapping table can be summarized by R & D personnel based on a large amount of test data of the power amplifier 100. This embodiment does not make specific limitations on this.

[0052] Therefore, when the stabilization unit 40 includes M resistors 410, the control unit 50 can dynamically adjust the equivalent resistance value of the stabilization unit 40, so that when the power amplifier 100 is used to amplify radio frequency signals of different frequency bands, the stabilization unit 40 can suppress some out-of-band low-frequency signals in the radio frequency signals, making the application scenarios of the power amplifier 100 more diverse.

[0053] In this embodiment, the first-stage power amplification circuit 10 and the second-stage power amplification circuit 20 are used to sequentially amplify the radio frequency signals input to the power amplifier 100. Please refer to Figure 4 , the first-stage power amplification circuit 10 and the second-stage power amplification circuit 20 are respectively single-ended power amplification circuits. In Figure 4 the embodiment shown, the output terminal 103 of the first-stage power amplification circuit 10 and the power supply terminal 105 of the first-stage power amplification circuit 10 share the same signal port. Therefore, the output terminal 103 of the first-stage power amplification circuit 10 in this embodiment is not only used to output the radio frequency signal amplified by the first-stage power amplification circuit 10, but also used to input the first supply voltage VCC1 provided by the first power supply terminal 16, realizing the multiplexing of the signal port.

[0054] Similarly, the output terminal 203 of the second-stage power amplification circuit 20 and the power supply terminal 205 of the second-stage power amplification circuit 20 share the same signal port. Therefore, the output terminal 203 of the second-stage power amplification circuit 20 in this embodiment is not only used to output the radio frequency signal amplified by the second-stage power amplification circuit 20, but also used to input the first supply voltage VCC1 provided by the first power supply terminal 16, realizing the multiplexing of the signal port.

[0055] Specifically, the first-stage power amplification circuit 10 may include a first transistor 120, and the second-stage power amplification circuit 20 may include a second transistor 210. The control terminal 1201 of the first transistor 120 is connected to the input terminal 101 of the first-stage power amplification circuit 10, the first terminal 1203 of the first transistor 120 is connected to the output terminal 103 of the first-stage power amplification circuit 10, and the second terminal 1205 of the first transistor 120 is grounded. The control terminal 2101 of the second transistor 210 is connected to the input terminal 201 of the second-stage power amplification circuit 20, the first terminal 2103 of the second transistor 210 is connected to the output terminal 203 of the second-stage power amplification circuit 20, and the second terminal 2105 of the second transistor 210 is grounded.

[0056] As an implementation manner, the first transistor 120 and the second transistor 210 can be respectively implemented by a Heterojunction Bipolar Transistor (HBT). Among them, the control terminal 1201 of the first transistor 120 and the control terminal 2101 of the second transistor 210 are the bases of the HBT, the first terminal 1203 of the first transistor 120 and the first terminal 2103 of the second transistor 210 are the collectors of the HBT, and the second terminal 1205 of the first transistor 120 and the second terminal 2105 of the second transistor 210 are the emitters of the HBT.

[0057] As other implementation manners, the first transistor 120 and the second transistor 210 can be respectively implemented by a Bipolar Junction Transistor (BJT). Or, the first transistor 120 and the second transistor 210 can be respectively implemented by a Metal - Oxide - Semiconductor Field - Effect Transistor (MOS). This embodiment does not make specific limitations on this.

[0058] In Figure 4 In the shown embodiment, the power amplifier 100 may further include a first DC - blocking capacitor 121 and a second DC - blocking capacitor 212. Among them, the first DC - blocking capacitor 121 is connected between the signal input terminal 12 and the control terminal 1201 of the first transistor 120, and it is used to prevent the DC bias signal applied to the control terminal 1201 of the first transistor 120 from flowing to the signal input terminal 12 to ensure the smooth operation of the first transistor 120. The second DC - blocking capacitor 212 is connected between the first terminal 1203 of the first transistor 120 and the control terminal 2101 of the second transistor 210, and it is used to prevent the DC bias signal applied to the control terminal 2101 of the second transistor 210 from flowing to the first transistor 120 to ensure the smooth operation of the second transistor 210. Specifically, the first DC - blocking capacitor 121 and the second DC - blocking capacitor 212 can be respectively a chip capacitor, a plug - in capacitor, and so on.

[0059] In Figure 4In the illustrated embodiment, the power amplifier 100 may further include a choke inductor 214. The choke inductor 214 is connected between the first end 2103 of the second transistor 210 and the first power supply terminal 16, and is used to prevent the radio frequency signal output by the second transistor 210 from leaking to the first power supply terminal 16, so as to ensure the normal operation of the power amplifier 100. In addition, the choke inductor 214 can also prevent the AC component (i.e., the interference signal) in the first power supply voltage VCC1 output by the first power supply terminal 16 from entering the second-stage power amplification circuit 20. Specifically, the choke inductor 214 can be a surface mount inductor, a plug-in inductor, etc. The choke inductor 214 can also be a section of metal trace wound on a substrate or a chip, and this metal trace can be equivalent to the choke inductor 214.

[0060] In Figure 4 In the illustrated embodiment, the power amplifier 100 may further include a first bypass capacitor 416. One end of the first bypass capacitor 416 is connected to the first power supply terminal 16, and the other end is grounded. The first bypass capacitor 416 can filter out the noise signal in the first power supply voltage VCC1 to ensure the power supply safety of the power amplifier 100. Specifically, the first bypass capacitor 416 can be a surface mount capacitor, a plug-in capacitor, etc.

[0061] In some possible embodiments, the power amplifier 100 may further include a first isolation unit 312 and a second isolation unit 314. Among them, the first end 3121 of the first isolation unit 312 is connected to the second end 303 of the choke unit 30, and the second end 3123 of the first isolation unit 312 is connected to the first power supply terminal 16. The first end 3141 of the second isolation unit 314 is connected to the power supply terminal 205 of the second-stage power amplification circuit 20, and the second end 3143 of the second isolation unit 314 is connected to the first power supply terminal 16. Among them, the first isolation unit 312 and the second isolation unit 314 are used to isolate the radio frequency signals between the first-stage power amplification circuit 10 and the second-stage power amplification circuit 20, so as to improve the operating stability of the power amplifier 100. Specifically, in Figure 4 In the illustrated embodiment, the first isolation unit 312 and the second isolation unit 314 can be respectively implemented by inductors. For example, surface mount inductors, plug-in inductors, or inductors equivalent to metal traces wound on a substrate.

[0062] In some possible embodiments, the power amplifier 100 may further include a first decoupling unit 412 and a second decoupling unit 414. One end of the first decoupling unit 412 is connected to the first end of the first isolation unit 312, and the other end is grounded. One end of the second decoupling unit 414 is connected to the first end of the second isolation unit 314, and the other end is grounded. Specifically, in Figure 4In the illustrated embodiment, the first decoupling unit 412 and the second decoupling unit 414 can be implemented by capacitors respectively. For example, surface mount capacitors, plug-in capacitors, and the like.

[0063] It is not difficult to understand here that if the output signal of the second-stage power amplifier circuit 20 (that is, the fundamental wave signal in the band) is fed back to the first-stage power amplifier circuit 10, it will form positive feedback amplification of the signal, thereby causing the power amplifier 100 to oscillate during operation. Therefore, to solve the above problems in this embodiment, the first decoupling unit 412 and the second decoupling unit 414 are provided, which can filter out most of the output signals coupled to the first-stage power amplifier circuit 10, and the signals that are not filtered out will reach the branches where the choke unit 30 and the stabilization unit 40 are located, and then the choke unit 30 and the stabilization unit 40 will suppress the above signals to avoid the occurrence of oscillation of the power amplifier 100 and improve the operating stability of the power amplifier 100.

[0064] In some possible embodiments, please refer to Figure 5 , the power amplifier 100 may further include a first balun 60, a third-stage power amplifier circuit 70, and a second balun 80. Among them, the second-stage power amplifier circuit 20 is a single-ended power amplifier circuit, and the third-stage power amplifier circuit 70 is a differential power amplifier circuit. Among them, the output terminal 203 of the second-stage power amplifier circuit 20 is sequentially connected to the signal output terminal 14 through the first balun 60, the third-stage power amplifier circuit 70, and the second balun 80. Therefore, in this embodiment, three-stage amplification of the radio frequency signal is achieved by setting the first balun 60, the third-stage power amplifier circuit 70, and the second balun 80, further improving the power amplification gain of the power amplifier 100.

[0065] Please refer to Figure 6 , the first balun 60 may include a coupled first primary side 610 and a first secondary side 630. Among them, the first end 6101 of the first primary side 610 is connected to the output terminal 203 of the second-stage power amplifier circuit 20, and the second end 6103 of the first primary side 610 is grounded. The first secondary side 630 is connected between the first input terminal 701 and the second input terminal 703 of the third-stage power amplifier circuit 70. Therefore, the first balun 60 in this embodiment adopts a single-ended to differential architecture, which can convert a single radio frequency signal output from the output terminal 203 of the second-stage power amplifier circuit 20 into a pair of differential signals. Specifically, the first balun 60 can be implemented by a dedicated balun chip, and the first primary side 610 and the first secondary side 630 included in the first balun 60 can also be equivalently formed by metal traces wound on the substrate. The specific implementation manner of the first balun 60 in this embodiment is not limited.

[0066] In Figure 6In the illustrated embodiment, the third-stage power amplification circuit 70 may include a third transistor 720 and a fourth transistor 740. Among them, the control terminal 7201 of the third transistor 720 is connected to the first input terminal 701 of the third-stage power amplification circuit 70, the first terminal 7203 of the third transistor 720 is connected to the first output terminal 705 of the third-stage power amplification circuit 70, and the second terminal 7205 of the third transistor 720 is grounded. The control terminal 7401 of the fourth transistor 740 is connected to the second input terminal 703 of the third-stage power amplification circuit 70, the first terminal 7403 of the fourth transistor 740 is connected to the second output terminal 707 of the third-stage power amplification circuit 70, and the second terminal 7405 of the fourth transistor 740 is grounded.

[0067] As an implementation manner, the third transistor 720 and the fourth transistor 740 may be respectively implemented by heterojunction bipolar transistors (HBT transistors). Among them, the control terminal 7201 of the third transistor 720 and the control terminal 7401 of the fourth transistor 740 are the bases of the HBT transistors, the first terminal 7203 of the third transistor 720 and the first terminal 7403 of the fourth transistor 740 are the collectors of the HBT transistors, and the second terminal 7205 of the third transistor 720 and the second terminal 7405 of the fourth transistor 740 are the emitters of the HBT transistors.

[0068] As other implementation manners, the third transistor 720 and the fourth transistor 740 may be respectively implemented by bipolar junction transistors (BJT transistors). Or, the third transistor 720 and the fourth transistor 740 may be respectively implemented by metal-oxide-semiconductor field-effect transistors (MOS transistors), and this embodiment does not make specific limitations thereon.

[0069] Optionally, the third transistor 720 and the fourth transistor 740 may be two transistors with exactly the same model. For example, NPN-type HBT transistors that are more suitable for high-power circuits are both used. The third transistor 720 and the fourth transistor 740 may also be two transistors with opposite models. For example, one of them is an NPN-type HBT transistor and the other is a PNP-type HBT transistor.

[0070] The third-stage power amplification circuit 70 in this embodiment is implemented by using a differential power amplification circuit. On the one hand, compared with a single-ended power amplification circuit, the differential power amplification circuit can provide a higher power output. On the other hand, the working efficiency and anti-interference ability of the power amplifier 100 can be improved to improve the stability of the radio frequency signal output by the power amplifier 100.

[0071] In Figure 6 In the illustrated embodiment, the second balun 80 may include a coupled second primary side 810 and a second secondary side 830. Among them, the second primary side 810 is connected between the first output terminal 705 and the second output terminal 707 of the third-stage power amplifier circuit 70, and one end of the second secondary side 830 is connected to the signal output terminal 14 and the other end is grounded. Therefore, the second balun 80 in this embodiment adopts a differential-to-single-ended architecture, which can convert a pair of differential signals output by the third-stage power amplifier circuit 70 into a single RF signal. Specifically, the second balun 80 may be implemented by a dedicated balun chip, and the second primary side 810 and the second secondary side 830 included in the second balun 80 may also be equivalently formed by metal traces wound on a substrate. This embodiment does not limit the specific implementation manner of the second balun 80.

[0072] In Figure 6 In the illustrated embodiment, the power amplifier 100 may further be provided with a second power supply terminal 18. The second power supply terminal 18 is used to supply power to the components or chips in the power amplifier 100. Among them, the second power supply terminal 18 and the first power supply terminal 16 are two different power supply ports. Specifically, the second power supply terminal 18 may provide a second power supply voltage (Volt Current Condenser, VCC2). For example, VCC2 may be 3V, 5V, 8V, etc., and this embodiment does not make specific limitations.

[0073] Specifically, the second primary side 810 may include a first coil 8120 and a second coil 8140. The first coil 8120 and the second coil 8140 are connected in series and then connected between the first end 7203 of the third transistor 720 and the first end 7403 of the fourth transistor 740. Therefore, the first coil 8120 and the second coil 8140 in this embodiment can be understood as two parts of the second primary side 810, and the first coil 8120 and the second coil 8140 are connected in series to form the second primary side 810.

[0074] The common end of the first coil 8120 and the second coil 8140 is connected to the second power supply terminal 18. Therefore, the second power supply voltage VCC2 output by the second power supply terminal 18 will flow through the first coil 8120 to the first end 7203 of the third transistor 720 to supply power to the third transistor 720. The first coil 8120 can play a choke role to prevent the AC component (i.e., the interference signal) in the second power supply voltage VCC2 output by the second power supply terminal 18 from entering the third transistor 720 to ensure the normal operation of the third transistor 720.

[0075] Similarly, the second supply voltage VCC2 output from the second power supply terminal 18 will flow through the second coil 8140 to the first terminal 7403 of the fourth transistor 740 to supply power to the fourth transistor 740. The second coil 8140 can also act as a choke to prevent the AC component (i.e., interference signal) in the second supply voltage VCC2 output from the second power supply terminal 18 from entering the fourth transistor 740 to ensure the normal operation of the fourth transistor 740.

[0076] In summary, the first coil 8120 can be used as a choke inductor between the third transistor 720 and the second power supply terminal 18, and the second coil 8140 can be used as a choke inductor between the fourth transistor 740 and the second power supply terminal 18, realizing the structural reuse of the second primary side 810, simplifying the hardware structure of the power amplifier 100, and saving the hardware cost of the power amplifier 100.

[0077] In some possible embodiments, the power amplifier 100 may further include a third DC-blocking capacitor 650 and a fourth DC-blocking capacitor 670. One end of the first secondary side 630 is connected to the control terminal 7201 of the third transistor 720 through the third DC-blocking capacitor 650. The third DC-blocking capacitor 650 can prevent the DC bias signal applied at the control terminal 7201 of the third transistor 720 from flowing to the first secondary side 630 to ensure the smooth operation of the third transistor 720. The other end of the first secondary side 630 is connected to the control terminal 7401 of the fourth transistor 740 through the fourth DC-blocking capacitor 670. The fourth DC-blocking capacitor 670 can prevent the DC bias signal applied at the control terminal 7201 of the fourth transistor 740 from flowing to the first secondary side 630 to ensure the smooth operation of the fourth transistor 740. In addition, the third DC-blocking capacitor 650 and the fourth DC-blocking capacitor 670 can also participate in impedance matching together with the first balun 60 to improve the transmission efficiency of the RF signal. Specifically, the third DC-blocking capacitor 650 and the fourth DC-blocking capacitor 670 can be surface mount capacitors, plug-in capacitors, etc.

[0078] In some possible embodiments, the power amplifier 100 may further include a second bypass capacitor 850. One end of the second bypass capacitor 850 is connected to the second power supply terminal 18, and the other end is grounded. The second bypass capacitor 850 can filter out the noise signal in the second supply voltage VCC2 to ensure the power supply safety of the power amplifier 100. Specifically, the second bypass capacitor 850 can be a surface mount capacitor, a plug-in capacitor, etc.

[0079] In some possible embodiments, please refer to Figure 7, when the output terminal 203 of the second-stage power amplifier circuit 20 and the power supply terminal 205 of the second-stage power amplifier circuit 20 share the same signal port, the second end 6103 of the first primary side 610 is also connected to the first power supply terminal 16. Therefore, the first primary side 610 in this embodiment can also serve as a choke inductor between the second transistor 210 and the first power supply terminal 16, that is, the first primary side 610 can replace Figure 4 the choke inductor 214 in, realizing the structural reuse of the first primary side 610, simplifying the hardware structure of the power amplifier 100, and saving the hardware cost of the power amplifier 100.

[0080] Of course, in some other possible embodiments, an additional choke inductor can also be set, that is, the circuit structure in Figure 4 is adopted. Specifically, the power supply terminal 16 is sequentially connected to the first end 2103 of the second transistor 210 through the second isolation unit 314 and the choke inductor 214. In this case, the R & D personnel can more flexibly adjust the inductance value of the choke inductor 214, making the hardware parameters of the power amplifier 100 more flexible during debugging.

[0081] In Figure 7 the embodiment shown, the power amplifier 100 may further include a first capacitor 690. One end of the first capacitor 690 is connected to the second end 6103 of the first primary side 610, and the other end is grounded. Since the first power supply voltage VCC1 output by the first power supply terminal 16 will flow through the first primary side 610 to the first end 2103 of the second transistor 210 to supply power to the second transistor 210. Therefore, to prevent the first power supply voltage VCC1 from short-circuiting to the ground at the second end 6103 of the first primary side 610, in this embodiment, by setting the first capacitor 690 between the second end 6103 of the first primary side 610 and the ground terminal, it can play a role of "blocking direct current" to ensure the smooth operation of the second transistor 210. Specifically, the first capacitor 690 can be a chip capacitor, a plug-in capacitor, etc. In addition, the first capacitor 690 can also participate in impedance matching together with the first balun 60 to improve the transmission efficiency of the radio frequency signal.

[0082] In some possible embodiments, please refer to Figure 8 , the first-stage power amplifier circuit 10, the second-stage power amplifier circuit 20, the choke unit 30, the stabilization unit 40, the first balun 60, the third-stage power amplifier circuit 70, and the second balun 80 form a power amplifier module 19, where the number of power amplifier modules 19 is two.

[0083] Specifically, the input terminals 101 of the first-stage power amplification circuits 10 in the two power amplification modules 19 are respectively connected to the signal input terminal 12. The secondary sides 830 of the second baluns 80 in the two power amplification modules 19 are connected in series to form an output combiner 8320. One end of the output combiner 8320 is connected to the signal output terminal 14, and the other end is grounded. It is not difficult to understand here that Figure 8 The first power supply terminals 16 in supply power to the first-stage power amplification circuits 10 and the second-stage power amplification circuits 20 in the two power amplification modules 19 respectively, and the second power supply terminals 18 supply power to the third-stage power amplification circuits 70 in the two power amplification modules 19 respectively. Therefore, Figure 8 The power amplifier 100 shown adopts a dual-channel differential amplification circuit structure, which can further improve the maximum output power and operating efficiency of the power amplifier 100, so as to be applied to application scenarios with higher transmission power, such as satellite communication scenarios.

[0084] In some other possible embodiments, please refer to Figure 9 , the power amplifier 100 may further include a transformer 45. The output terminal 203 of the second-stage power amplification circuit 20 is connected to the signal output terminal 14 through the transformer 45. Therefore, in this embodiment, by setting the transformer 45, the function of output impedance matching can be achieved to improve the transmission efficiency of radio frequency signals.

[0085] Please refer to Figure 10 , the transformer 45 may include a coupled third primary side 452 and a third secondary side 454. Among them, the first end 4521 of the third primary side 452 is connected to the output terminal 203 of the second-stage power amplification circuit 20, and the second end 4523 of the third primary side 452 is grounded. One end of the third secondary side 454 is connected to the signal output terminal 14, and the other end is grounded. Specifically, the transformer 45 may be implemented by using a dedicated chip, for example, an integrated passive device (IPD, Integrated Passive Device). The third primary side 452 and the third secondary side 454 included in the transformer 45 may also be respectively equivalent to metal traces wound on a substrate. The specific implementation manner of the transformer 45 in this embodiment is not limited.

[0086] In some possible embodiments, when the output terminal 203 and the power supply terminal 205 of the second-stage power amplification circuit 20 share the same signal port, the second end 4523 of the third primary side 452 is further connected to the first power supply terminal 16. Therefore, the third primary side 452 in this embodiment can also serve as a choke inductor between the second transistor 210 and the first power supply terminal 16, that is, the third primary side 452 can replace Figure 4The choke inductor 214 therein realizes the structural reuse of the third primary side 452, simplifies the hardware structure of the power amplifier 100, and saves the hardware cost of the power amplifier 100.

[0087] Of course, in some other possible embodiments, an implementation manner of setting an additional choke inductor can also be adopted, that is, the circuit structure in the Figure 4 illustrated embodiment is adopted. Specifically, the power supply terminal 16 is sequentially connected to the first end 2103 of the second transistor 210 through the second isolation unit 314 and the choke inductor 214. In this case, the R & D personnel can more flexibly adjust the inductance value of the choke inductor 214, making the hardware parameters of the power amplifier 100 more flexible during debugging.

[0088] In Figure 10 the illustrated embodiment, the power amplifier 100 may further include a second capacitor 470. One end of the second capacitor 470 is connected to the second end 4523 of the third primary side 452, and the other end is grounded. Since the first power supply voltage VCC1 output by the first power supply terminal 16 will flow through the third primary side 452 to the first end 2103 of the second transistor 210 to supply power to the second transistor 210. Therefore, to avoid the first power supply voltage VCC1 short-circuiting to the ground at the second end 4523 of the third primary side 452, in this embodiment, by setting the second capacitor 470 between the second end 4523 of the third primary side 452 and the ground terminal, the function of "blocking direct current" can be achieved to ensure the smooth operation of the second transistor 210. Specifically, the second capacitor 470 can be a patch capacitor, a plug-in capacitor, etc.

[0089] In some possible embodiments, referring to Figure 11 , the first-stage power amplification circuit 10 may be a single-ended power amplification circuit, the second-stage power amplification circuit 20 may be a differential power amplification circuit, and the power amplifier 100 may further include a third balun 34 and a fourth balun 36. Among them, the third balun 34 is connected between the output terminal 103 of the first-stage power amplification circuit 10 and the input terminal 201 of the second-stage power amplification circuit 20. Among them, the input terminal 201 of the second-stage power amplification circuit 20 includes a third input terminal 2012 and a fourth input terminal 2014. The output terminal 203 of the second-stage power amplification circuit 20 is connected to the signal output terminal 14 through the fourth balun 36. Among them, the output terminal 203 of the second-stage power amplification circuit 20 includes a third output terminal 2032 and a fourth output terminal 2034. Therefore, in this embodiment, the output terminal 103 of the first-stage power amplification circuit 10 is sequentially connected to the signal output terminal 14 through the third balun 34, the second-stage power amplification circuit 20, and the fourth balun 36.

[0090] Specifically, the third balun 34 may include a coupled fourth primary side 341 and a fourth secondary side 343. One end of the fourth primary side 341 is connected to the output terminal 103 of the first-stage power amplifier circuit 10, and the other end is grounded. The fourth secondary side 343 is connected between the third input terminal 2012 and the fourth input terminal 2014. Therefore, the third balun 34 in this embodiment adopts a single-ended to differential architecture, which can convert a single RF signal output from the output terminal 103 of the first-stage power amplifier circuit 10 into a pair of differential signals. Specifically, the third balun 34 can be implemented by a dedicated balun chip, and the fourth primary side 341 and the fourth secondary side 343 included in the third balun 34 can also be respectively equivalent to metal traces wound on a substrate. The specific implementation manner of the third balun 34 in this embodiment is not limited.

[0091] In Figure 11 In the illustrated embodiment, the second-stage power amplifier circuit 20 may include a fifth transistor 230 and a sixth transistor 250. The control terminal of the fifth transistor 230 is connected to the third input terminal 2012 of the second-stage power amplifier circuit 20. The first terminal of the fifth transistor 230 is connected to the third output terminal 2032 of the second-stage power amplifier circuit 20, and the second terminal of the fifth transistor 230 is grounded. The control terminal of the sixth transistor 250 is connected to the fourth input terminal 2014 of the second-stage power amplifier circuit 20. The first terminal of the sixth transistor 250 is connected to the fourth output terminal 2034 of the second-stage power amplifier circuit 20, and the second terminal of the sixth transistor 250 is grounded.

[0092] As an implementation manner, the fifth transistor 230 and the sixth transistor 250 can be respectively implemented by heterojunction bipolar transistors (HBT transistors). As other implementation manners, the fifth transistor 230 and the sixth transistor 250 can be respectively implemented by bipolar junction transistors (BJT transistors). Or, the fifth transistor 230 and the sixth transistor 250 can be respectively implemented by metal-oxide-semiconductor field-effect transistors (MOS transistors). This embodiment does not make specific limitations in this regard.

[0093] Optionally, the fifth transistor 230 and the sixth transistor 250 can be two transistors with exactly the same model. For example, both use NPN-type HBT transistors that are more suitable for high-power circuits. The fifth transistor 230 and the sixth transistor 250 can also be two transistors with opposite models. For example, one of them is an NPN-type HBT transistor, and the other is a PNP-type HBT transistor.

[0094] In this embodiment, the second-stage power amplifier circuit 20 is implemented by using a differential power amplifier circuit. On the one hand, compared with a single-ended power amplifier circuit, the differential power amplifier circuit can provide a higher power output. On the other hand, it can improve the working efficiency and anti-interference ability of the power amplifier 100 to improve the stability of the radio frequency signal output by the power amplifier 100.

[0095] In Figure 11 In the illustrated embodiment, the fourth balun 36 may include a coupled fifth primary side 361 and a fifth secondary side 363. The fifth primary side 361 is connected between the third output terminal 2032 and the fourth output terminal 2034, and one end of the fifth secondary side 363 is connected to the signal output terminal 14 and the other end is grounded. Therefore, the fourth balun 36 in this embodiment adopts a differential-to-single-ended architecture, which can convert a pair of differential signals output by the second-stage power amplifier circuit 20 into a radio frequency signal. Specifically, the fourth balun 36 may be implemented by using a dedicated balun chip, and the fifth primary side 361 and the fifth secondary side 363 included in the fourth balun 36 may also be respectively equivalent to metal traces wound on a substrate. The specific implementation manner of the fourth balun 36 in this embodiment is not limited.

[0096] Specifically, the fifth primary side 361 may include a third coil 3612 and a fourth coil 3614. The third coil 3612 and the fourth coil 3614 are connected in series and then connected between the third output terminal 2032 and the fourth output terminal 2034. Therefore, the third coil 3612 and the fourth coil 3614 in this embodiment can be understood as two parts of the fifth primary side 361, and the third coil 3612 and the fourth coil 3614 are connected in series to form the fifth primary side 361.

[0097] The common end of the third coil 3612 and the fourth coil 3614 is connected to the first power supply terminal 16. Therefore, the first power supply voltage VCC1 output by the first power supply terminal 16 will flow through the third coil 3612 to the first end of the fifth transistor 230 to supply power to the fifth transistor 230. Therefore, the third coil 3612 in this embodiment can, on the one hand, prevent the radio frequency signal output by the third transistor 720 from leaking to the first power supply terminal 16 to ensure the normal operation of the power amplifier 100. On the other hand, it can prevent the AC component (i.e., the interference signal) in the first power supply voltage VCC1 output by the first power supply terminal 16 from entering the fifth transistor 230 to ensure the normal operation of the fifth transistor 230.

[0098] Similarly, the first supply voltage VCC1 output from the first power supply terminal 16 will flow through the fourth coil 3614 to the first end of the sixth transistor 250 to supply power to the sixth transistor 250. Therefore, the fourth coil 3614 in this embodiment can, on the one hand, prevent the radio frequency signal output by the sixth transistor 250 from leaking to the first power supply terminal 16 to ensure the normal operation of the power amplifier 100. On the other hand, it can prevent the alternating current component (i.e., interference signal) in the first supply voltage VCC1 output from the first power supply terminal 16 from entering the sixth transistor 250 to ensure the normal operation of the sixth transistor 250.

[0099] In summary, the third coil 3612 can be used as a choke inductor between the fifth transistor 230 and the first power supply terminal 16, and the fourth coil 3614 can be used as a choke inductor between the sixth transistor 250 and the first power supply terminal 16, realizing the structural reuse of the fifth primary side 361, simplifying the hardware structure of the power amplifier 100, and saving the hardware cost of the power amplifier 100.

[0100] In some possible embodiments, the power amplifier 100 may further include a fifth DC blocking capacitor 680 and a sixth DC blocking capacitor 690. One end of the fifth secondary side 363 is connected to the control end of the fifth transistor 230 through the fifth DC blocking capacitor 680. The fifth DC blocking capacitor 680 can prevent the DC bias signal applied at the control end of the fifth transistor 230 from flowing to the fifth secondary side 363 to ensure the smooth operation of the fifth transistor 230. The other end of the fifth secondary side 363 is connected to the control end of the sixth transistor 250 through the sixth DC blocking capacitor 690. The sixth DC blocking capacitor 690 can prevent the DC bias signal applied at the control end of the sixth transistor 250 from flowing to the fifth secondary side 363 to ensure the smooth operation of the sixth transistor 250. In addition, the fifth DC blocking capacitor 680 and the sixth DC blocking capacitor 690 can also participate in impedance matching together with the third balun 34 to improve the transmission efficiency of the radio frequency signal. Specifically, the fifth DC blocking capacitor 680 and the sixth DC blocking capacitor 690 can be surface mount capacitors, plug-in capacitors, etc.

[0101] Please refer to Figure 12, the power amplifier 100 may further include a filtering unit 49. The output terminal 203 of the second-stage power amplification circuit 20 is connected to the signal output terminal 14 through the filtering unit 49. Among them, the filtering unit 49 can be used to filter out harmonic signals in the radio frequency signal (for example, second-order harmonic signals, third-order harmonic signals, etc.). Specifically, the filtering unit 49 may include at least one LC harmonic suppression circuit composed of an inductor and a capacitor. The LC harmonic suppression circuit can operate at a specified operating frequency to filter out the corresponding harmonic signals. For example, the LC harmonic suppression circuit can resonate at the frequency corresponding to the second-order harmonic signal to filter out the second-order harmonic signal in the radio frequency signal. Of course, the number of LC harmonic suppression circuits can be multiple, and the operating frequencies of the multiple LC harmonic suppression circuits can be the same or different. The specific implementation manner of the filtering unit 49 in this embodiment is not specifically limited.

[0102] It is not difficult to understand here that, as Figure 5 shown, when the power amplifier 100 includes the first balun 60, the third-stage power amplification circuit 70, and the second balun 80, the filtering unit 49 can be connected between the output terminal of the second balun 80 and the signal output terminal 14. As Figure 9 shown, when the power amplifier 100 includes the transformer 45, the filtering unit 49 can be connected between the output terminal of the transformer 45 and the signal output terminal 14. As Figure 11 shown, when the power amplifier 100 includes the third balun 34 and the fourth balun 36, the filtering unit 49 can be connected between the output terminal of the fourth balun 36 and the signal output terminal 14.

[0103] An embodiment of the present application also provides a power amplifier 900. The power amplifier 900 is a device for increasing the output power of a radio frequency signal. The power amplifier 900 in this embodiment is provided with a signal input terminal 902, a signal output terminal 904, and a power supply terminal 906. Among them, the relevant features of the signal input terminal 902, the signal output terminal 904, and the power supply terminal 906 in this embodiment can respectively refer to and adopt the features of the signal input terminal 12, the signal output terminal 14, and the first power supply terminal 16 in the above embodiments. To save space, they will not be elaborated here one by one.

[0104] Please refer to Figure 13, the power amplifier 900 may include a power amplification circuit 910, a choke unit 920, and a stabilization unit 930. Among them, the input terminal 9101 of the power amplification circuit 910 is connected to the signal input terminal 902, and the output terminal 9103 of the power amplification circuit 910 is connected to the signal output terminal 904. The first terminal 9201 of the choke unit 920 is connected to the power supply terminal 9015 of the power amplification circuit 910, and the second terminal 9203 of the choke unit 920 is connected to the power supply terminal 906. The stabilization unit 930 is connected in parallel with the choke unit 920, and the stabilization unit 930 includes at least one resistor 9320.

[0105] Since the stabilization unit 930 is connected in parallel on both sides of the choke unit 920 in this embodiment, the stabilization unit 930 can be resistive, thereby reducing the quality factor (i.e., Q value) of the choke unit 920. Therefore, when there is coupling between the parasitic capacitance of the transistor itself in the power amplification circuit 910 and the choke unit 920, the reduction of the Q value of the choke unit 920 can reduce the amplification gain of the power amplifier 900, thereby reducing the risk of oscillation of the power amplifier 900 and improving the stability of the power amplifier 900 during operation.

[0106] In this embodiment, the power amplification circuit 910 is the first-stage amplification circuit of the power amplifier 900. As an implementation manner, the power amplification circuit 910 can be a single-ended power amplification circuit. As another implementation manner, the power amplification circuit 910 can be a differential power amplification circuit. Please refer to Figure 14 , Figure 14 shows the circuit structure of the power amplification circuit 910 as a single-ended power amplification circuit. Among them, the output terminal 9103 and the power supply terminal 9105 of the power amplification circuit 910 share the same signal port. Therefore, the output terminal 9103 of the power amplification circuit 910 is not only used to output the radio frequency signal amplified by the power amplification circuit 910, but also used to input the power supply voltage provided by the power supply terminal 906, realizing the multiplexing of the signal port.

[0107] Specifically, the power amplification circuit 910 may include a transistor 9120. The control terminal 9121 of the transistor 9120 is connected to the input terminal 9101 of the power amplification circuit 910. The first terminal 9123 of the transistor 9120 is connected to the output terminal 9103 of the power amplification circuit 910, and the second terminal 9125 of the transistor 9120 is grounded. The relevant characteristics of the transistor 9120 can respectively refer to and follow the characteristics of the first transistor 120 in the above embodiment. To save space, they will not be elaborated here one by one.

[0108] In Figure 14In the illustrated embodiment, the power amplifier circuit 910 may further include a DC-blocking capacitor 9140. The DC-blocking capacitor 9140 is connected between the signal input terminal 902 and the control terminal 9121 of the transistor 9120, and is used to prevent the DC bias signal applied to the control terminal 9121 of the transistor 9120 from flowing to the signal input terminal 902, so as to ensure the smooth operation of the transistor 9120. Specifically, the DC-blocking capacitor 9140 may be a surface mount capacitor, a plug-in capacitor, or the like.

[0109] In this embodiment, the choke unit 920 may include a first inductor 9210. The relevant features of the choke unit 920 and the first inductor 9210 may respectively refer to and adopt the features of the choke unit 30 and the first inductor 310 in the above embodiment. For the sake of brevity, they will not be elaborated here one by one.

[0110] In this embodiment, the stabilization unit 930 may include one resistor 9320, or may include a plurality of resistors 9320. The relevant features of the stabilization unit 930 and the resistor 9320 may respectively refer to and adopt the features of the stabilization unit 40 and the resistor 410 in the above embodiment. For the sake of brevity, they will not be elaborated here one by one.

[0111] In this embodiment, the power amplifier circuit 910 may further include a filtering unit (not shown in the figure). The filtering unit is connected between the output terminal 9103 of the power amplifier circuit 910 and the signal output terminal 904. The relevant features of the filtering unit may respectively refer to and adopt the features of the filtering unit 49 in the above embodiment. For the sake of brevity, they will not be elaborated here one by one.

[0112] Please refer to Figure 15 , this embodiment of the present application further provides a radio frequency front-end module 950. The radio frequency front-end module 950 is an element that integrates two or more discrete devices such as radio frequency switches, low-noise amplifiers, filters, duplexers, and power amplifiers into an independent module, thereby improving the integration and hardware performance and miniaturizing the volume. Specifically, the radio frequency front-end module 950 can be applied to 4G and 5G communication devices such as smart phones, tablet computers, and smart watches. In this embodiment, the radio frequency front-end module 200 may include a substrate 9520 and the power amplifier 100 in the above embodiment, or the power amplifier 900 in the above embodiment.

[0113] In this embodiment, the substrate 9520 is generally rectangular and is used to fixedly support the components (such as the power amplifier 100, etc.) in the radio frequency front-end module 950. Specifically, the substrate 9520 may be a copper-clad laminate. By performing hole processing, electroless copper plating, electroplating copper, etching, etc. on the copper-clad laminate, a circuit can be printed on the surface of the substrate 9520.

[0114] In some possible embodiments, the power amplifier 100 is disposed on the substrate 9520. As an implementation manner, the power amplifier 100 can be integrated in the same chip, and the chip can be fixed on the substrate 9520 by using a wire bonding process or a flip-chip process to improve the integration degree of the radio frequency front-end module 950. As another implementation manner, some components (for example, transistors) in the power amplifier 100 can be integrated in the same chip, and the chip is fixed on the substrate 9520. Another part of the components (for example, capacitors, inductors, etc.) can be attached to the substrate 9520. For example, the inductor in the power amplifier 100 can be wound around the substrate 9520 in the form of a metal trace, and the capacitor in the power amplifier 100 can be attached to the substrate 9520 in the form of a chip capacitor, so that the hardware layout of the radio frequency front-end module 950 is more compact and reasonable.

[0115] In some other possible embodiments, the power amplifier 900 is disposed on the substrate 9520. The setting manner of the power amplifier 900 on the substrate 9520 can refer to the setting manner of the power amplifier 100 on the substrate 9520 in the above text, and will not be described herein again.

[0116] The present application provides a power amplifier 100 and a radio frequency front-end module 950 configured with the power amplifier 100. The power amplifier 100 can include a first-stage power amplification circuit 10, a second-stage power amplification circuit 20, a choke unit 30, and a stabilization unit 40. Among them, the input end 101 of the first-stage power amplification circuit 10 is connected to the signal input end 12, the output end 103 of the first-stage power amplification circuit 10 is connected to the input end 201 of the second-stage power amplification circuit 20, and the output end 203 of the second-stage power amplification circuit 20 is connected to the signal output end 14.

[0117] The first end 301 of the choke unit 30 is connected to the power supply end 105 of the first-stage power amplification circuit 10, and the second end 303 of the choke unit 30 and the power supply end 205 of the second-stage power amplification circuit 20 are respectively connected to the first power supply end 16. Therefore, in this embodiment, the power supply end 105 of the first-stage power amplification circuit 10 and the power supply end 205 of the second-stage power amplification circuit 20 are both connected to the same power supply end, that is, the first power supply end 16, so that there is signal coupling between the first-stage power amplification circuit 10 and the second-stage power amplification circuit 20.

[0118] The stabilization unit 40 and the choke unit 30 are connected in parallel. The stabilization unit 40 includes at least one resistor 410. Exemplarily, the stabilization unit 40 can be implemented by a pure resistor circuit, such that the stabilization unit 40 is resistive. When a part of the out-of-band low-frequency signal in the radio frequency signal coupled to the first-stage power amplifier circuit 10 via the second-stage power amplifier circuit 20 and the subsequent stage passes through the stabilization unit 40, the stabilization unit 40 can suppress the above-mentioned out-of-band low-frequency signal, thereby reducing the signal gain brought by the out-of-band low-frequency signal, alleviating the signal coupling between the first-stage power amplifier circuit 10 and the second-stage power amplifier circuit 20, so as to improve the stability of the power amplifier 100 during operation.

[0119] In the description of the present application, certain terms are used to refer to specific components in the specification and claims. Those skilled in the art should understand that hardware manufacturers may use different terms to refer to the same component. The specification and claims do not use the difference in names as a way to distinguish components, but use the difference in functions of components as the criterion for distinction. As mentioned throughout the specification and claims, "including" is an open-ended term and should be interpreted as "including but not limited to"; "substantially" means that those skilled in the art can solve technical problems within a certain error range and basically achieve the technical effect.

[0120] In the description of the present application, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "inside", etc. indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present application.

[0121] In the present application, unless otherwise clearly specified or limited, the terms "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or the communication inside two components, or just a surface contact. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0122] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0123] In addition, the terms "first" and "second" are used only for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of this application, "a plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0124] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit them; although this application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the various embodiments of this application.

Claims

1. A power amplifier, characterized in that, There is a signal input terminal, a signal output terminal and a first power supply terminal. The power amplifier includes a first-stage power amplification circuit, a second-stage power amplification circuit, a first isolation unit, a second isolation unit, a choke unit and a stabilization unit; The input terminal of the first-stage power amplification circuit is connected to the signal input terminal, and the output terminal of the first-stage power amplification circuit is connected to the input terminal of the second-stage power amplification circuit; the output terminal of the second-stage power amplification circuit is connected to the signal output terminal; The first end of the choke unit is connected to the power supply terminal of the first-stage power amplification circuit, the second end of the choke unit is connected to the first end of the first isolation unit, the power supply terminal of the second-stage power amplification circuit is connected to the first end of the second isolation unit, and the second end of the first isolation unit and the second end of the second isolation unit are connected to the first power supply terminal; The stabilization unit is connected in parallel with the choke unit, and the stabilization unit is resistive and includes at least one resistor.

2. The power amplifier according to claim 1, wherein The choke unit includes a first inductor; The power amplifier further includes a control unit, and the control unit is used to adjust the equivalent resistance value of the stabilization unit based on the inductance value of the first inductor and the signal frequency of the radio frequency signal to be suppressed.

3. The power amplifier according to claim 1, characterized in that, The power amplifier further includes a first decoupling unit and a second decoupling unit; One end of the first decoupling unit is connected to the first end of the first isolation unit, and the other end is grounded; One end of the second decoupling unit is connected to the first end of the second isolation unit, and the other end is grounded.

4. The power amplifier according to claim 1, characterized in that, The first-stage power amplification circuit is a single-ended power amplification circuit, the second-stage power amplification circuit is a differential power amplification circuit, and the input terminal of the second-stage power amplification circuit includes a third input terminal and a fourth input terminal; the output terminal of the second-stage power amplification circuit includes a third output terminal and a fourth output terminal; the power amplifier further includes a third balun; The third balun includes a coupled fourth primary side and a fourth secondary side; one end of the fourth primary side is connected to the output terminal of the first-stage power amplification circuit, and the other end is grounded; the fourth secondary side is connected between the third input terminal and the fourth input terminal.

5. The power amplifier according to claim 1, characterized in that, Both the first-stage power amplification circuit and the second-stage power amplification circuit are single-ended power amplification circuits.

6. The power amplifier according to claim 5, characterized in that The power amplifier further includes a transformer, and the transformer includes a coupled third primary side and a third secondary side; The first end of the third primary side is connected to the output terminal of the second-stage power amplification circuit, and the second end of the third primary side is grounded; one end of the third secondary side is connected to the signal output terminal, and the other end is grounded.

7. The power amplifier according to claim 6, characterized in that, The output terminal of the second-stage power amplification circuit and the power supply terminal of the second-stage power amplification circuit share the same signal port; the second end of the third primary side is also connected to the first power supply terminal; The power amplifier further includes a second capacitor, one end of the second capacitor is connected to the second end of the third primary side, and the other end is grounded.

8. The power amplifier according to any one of claims 1, 4, and 5, characterized in that, The power amplifier further includes a third-stage power amplification circuit and a second balun; the third-stage power amplification circuit is a differential power amplification circuit; the second balun includes a coupled second primary side and a second secondary side; the second primary side is connected between the first output terminal and the second output terminal of the third-stage power amplification circuit; one end of the second secondary side is connected to the signal output terminal, and the other end is grounded.

9. The power amplifier according to claim 8, characterized in that, The second-stage power amplification circuit is a single-ended power amplification circuit, and the power amplifier further includes a first balun, and the first balun includes a coupled first primary side and a first secondary side; the first end of the first primary side is connected to the output terminal of the second-stage power amplification circuit, and the second end of the first primary side is grounded; the first secondary side is connected between the first input terminal and the second input terminal of the third-stage power amplification circuit.

10. The power amplifier according to claim 9, wherein The output terminal of the second-stage power amplification circuit and the power supply terminal of the second-stage power amplification circuit share the same signal port; the second end of the first primary side is further connected to the first power supply terminal; The power amplifier further includes a first capacitor, one end of the first capacitor is connected to the second end of the first primary side, and the other end is grounded.

11. The power amplifier according to claim 8, wherein The power amplifier is further provided with a second power supply terminal; the second primary side includes a first coil and a second coil; The first coil and the second coil are connected in series and then connected between the first output terminal and the second output terminal of the third-stage power amplification circuit; the common terminal of the first coil and the second coil is connected to the second power supply terminal.

12. A power amplifier, characterized in that, A signal input terminal, a signal output terminal and a first power supply terminal are provided, and the power amplifier includes a first-stage power amplification circuit, a second-stage power amplification circuit, a choke unit and a stabilization unit; The input terminal of the first-stage power amplification circuit is connected to the signal input terminal, and the output terminal of the first-stage power amplification circuit is connected to the input terminal of the second-stage power amplification circuit; the output terminal of the second-stage power amplification circuit is connected to the signal output terminal; The first end of the choke unit is connected to the power supply terminal of the first-stage power amplification circuit, and the second end of the choke unit and the power supply terminal of the second-stage power amplification circuit are respectively connected to the first power supply terminal; The stabilization unit is connected in parallel with the choke unit, and the stabilization unit is resistive and includes at least one resistor; Wherein, the second-stage power amplification circuit is a differential power amplification circuit; or, the second-stage power amplification circuit is a single-ended power amplification circuit, and the power amplifier further includes a third-stage power amplification circuit, and the third-stage power amplification circuit is a differential power amplification circuit and is connected between the output terminal of the second-stage power amplification circuit and the signal output terminal; or, the second-stage power amplification circuit is a differential power amplification circuit, and the power amplifier further includes a third-stage power amplification circuit, and the third-stage power amplification circuit is a differential power amplification circuit and is connected between the output terminal of the second-stage power amplification circuit and the signal output terminal.

13. The power amplifier according to claim 12, characterized in that, The first-stage power amplification circuit is a single-ended power amplification circuit, and the second-stage power amplification circuit is a differential power amplification circuit; the input end of the second-stage power amplification circuit includes a third input end and a fourth input end; the output end of the second-stage power amplification circuit includes a third output end and a fourth output end; the power amplifier further includes a third balun. The third balun includes a coupled fourth primary side and a fourth secondary side; one end of the fourth primary side is connected to the output end of the first-stage power amplification circuit, and the other end is grounded; the fourth secondary side is connected between the third input end and the fourth input end.

14. The power amplifier according to claim 13, characterized in that, The power amplifier further includes a fourth balun, and the fourth balun includes a coupled fifth primary side and a fifth secondary side; the fifth primary side is connected between the third output end and the fourth output end; one end of the fifth secondary side is connected to the signal output end, and the other end is grounded.

15. The power amplifier according to claim 14, characterized in that, The fifth primary side includes a third coil and a fourth coil, and the third coil and the fourth coil are connected in series between the third output end and the fourth output end. The common end of the third coil and the fourth coil is connected to the first power supply terminal.

16. The power amplifier according to claim 12 or 13, characterized in that, The power amplifier further includes a third-stage power amplification circuit and a second balun, and the third-stage power amplification circuit is a differential power amplification circuit. The second balun includes a coupled second primary side and a second secondary side; the second primary side is connected between the first output end and the second output end of the third-stage power amplification circuit; one end of the second secondary side is connected to the signal output end, and the other end is grounded.

17. A power amplifier, characterized in that, There are provided a signal input end, a signal output end and a first power supply terminal. The power amplifier is applied to satellite communication and includes two power amplification modules. Each power amplification module includes a first-stage power amplification circuit, a second-stage power amplification circuit, a choke unit, a stabilization unit, a first balun, a third-stage power amplification circuit and a second balun. The first end of the choke unit is connected to the power supply terminal of the first-stage power amplification circuit, and the second end of the choke unit and the power supply terminal of the second-stage power amplification circuit are respectively connected to the first power supply terminal. The stabilization unit is connected in parallel with the choke unit, and the stabilization unit is resistive and includes at least one resistor. Among them, the input ends of the first-stage power amplification circuits in the two power amplification modules are respectively connected to the signal input end, and the output end of the first-stage power amplification circuit is connected to the input end of the second-stage power amplification circuit; the output end of the second-stage power amplification circuit is connected to the input end of the third-stage power amplification circuit, and the output end of the third-stage power amplification circuit is connected to the primary side of the second balun. The secondary sides of the second baluns in the two power amplification modules are connected in series to form an output combiner. One end of the output combiner is connected to the signal output end, and the other end is grounded.

18. A radio frequency front-end module, characterized in that, Including: A substrate; And The power amplifier according to any one of claims 1 to 17, wherein the power amplifier is disposed on the substrate.

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