Quartz shaft polishing device for semiconductor

Abstract

The present invention relates to the technical field of polishing equipment, and discloses a quartz shaft polishing device for semiconductors, comprising a supporting and clamping unit, a rotating polishing unit and a wiping unit. In the present invention, a driving motor can drive the quartz shaft clamped inside the supporting and clamping unit to rotate, and the driving motor drives the screw shaft to rotate through a belt, thereby driving the polishing motor to drive the polishing disc to move on the quartz shaft. Since the quartz shaft is rotating and the polishing disc is moving horizontally, the polishing disc can polish the quartz shaft as a whole, and there is no need to move the polishing position separately, thereby improving the overall polishing efficiency. The water-absorbing sponge inside the wiping unit can move with the rotating polishing unit, and when moving, the water-absorbing sponge can wipe the polished quartz shaft, so that the polishing liquid remaining on the surface is absorbed by the water-absorbing sponge, so that after polishing, the cleanliness of the quartz shaft is guaranteed, and the device is suitable for wide promotion and use.

Description

Technical Field

[0001] The invention belongs to the technical field of polishing equipment, and in particular relates to a quartz shaft polishing device for semiconductors. Background Art

[0002] Quartz shaft for semiconductor refers to the shaft made of quartz material used in the semiconductor processing process. Quartz is a crystal form of high-purity silicon. It has good thermal stability, chemical stability and mechanical strength, so it is widely used in the semiconductor industry.

[0003] When a quartz shaft is used in the semiconductor field, certain surfaces of the quartz shaft need to be polished. However, in actual use, it is found that the existing polishing equipment needs to rotate along the quartz shaft because the quartz shaft is cylindrical, so that one circle of polishing operation can be completed. Then the polishing machine needs to be moved to the next polishing position. The overall operation is relatively complicated, and after polishing, a large amount of polishing liquid still remains on the surface of the quartz shaft, which requires re-cleaning after disassembly, which increases the workload.

[0004] In view of this, the present invention is proposed. Summary of the invention

[0005] In order to solve the above technical problems, the basic concept of the technical solution adopted by the present invention is:

[0006] A quartz shaft polishing device for semiconductors comprises a supporting clamping unit, a rotating polishing unit and a wiping unit.

[0007] The supporting and clamping unit comprises an operating table, a first fixing seat is installed on one side of the operating table, a second fixing seat is installed on the other side of the operating table, a three-jaw chuck is installed on the first fixing seat, and a quartz shaft is clamped on the three-jaw chuck;

[0008] The rotary polishing unit comprises a driving motor, the end of the driving motor output shaft is connected to the rotation center of the three-jaw chuck, and a driving pulley is installed on the driving motor output shaft, a belt is sleeved on the driving pulley, a driven pulley is sleeved on the other side of the belt, a screw shaft is installed at the rotation center of the driven pulley, a screw ring is sleeved on the screw shaft, an electric push rod is installed at the bottom of the screw ring, a polishing motor is installed on the electric push rod, a polishing disc is installed on the output end of the polishing motor, a mounting cover is wrapped around the outer side of the polishing disc, and a nozzle is installed on the mounting cover, and the nozzle corresponds vertically to the quartz axis;

[0009] The wiping unit includes a water-absorbing sponge, a squeezing plate is installed on the base of the water-absorbing sponge, a plug rod is installed on the bottom of the squeezing plate, a pressure rod is installed on the end of the plug rod, a positioning track is slidably provided at the bottom of the pressure rod, and a plurality of pairs of protrusions are installed on the positioning track, a positioning sleeve is sleeved on the plug rod, an L-shaped bracket is installed on the side wall of the positioning sleeve, and the L-shaped bracket and the screw ring are connected to each other.

[0010] As a preferred embodiment of the present invention, a support leg is installed at the bottom corner of the operating table, an anti-slip pad is installed at the bottom of the support leg, a protective cover is installed on the operating table, the protective cover covers the top of the screw shaft, a socket is opened on one side of the protective cover, and the socket is adapted to the through hole opened on the second fixed seat, and the quartz axis movably passes through the through hole and the socket.

[0011] As a preferred embodiment of the present invention, a pair of sealed doors are slidably arranged on the protective cover, a pair of sealed doors are provided with sliding rails on the top, a sliding groove is provided on the protective cover, the sliding rail is slidably arranged in the sliding groove, a handle is provided on the sealed door, an anti-slip cover is provided on the handle, and an observation window is provided on the sealed door.

[0012] As a preferred embodiment of the present invention, a pair of guide blocks are installed on the surface of the second fixed seat, and clamps are slidably arranged on the pair of guide blocks. Locking bolts are screwed between the pair of clamps, and the pair of clamps are in contact with the surface of the quartz axis.

[0013] As a preferred embodiment of the present invention, a support frame is installed on the operating table close to the first fixed seat side, a cross bar is installed laterally on the bottom of the support frame, the cross bar is interconnected with the driving motor housing, the support frame is connected to the rotation center of the driven pulley, and a pair of arched brackets are symmetrically installed on the operating table, and the arched brackets are rotatably connected to the screw shaft.

[0014] As a preferred embodiment of the present invention, limiting plates are installed on both sides of the screw ring, limiting sleeves are installed at the ends of the limiting plates, limiting rods are movably inserted inside the limiting sleeves, synchronous brackets are installed on the side walls of the limiting plates, and the synchronous brackets are interconnected with the L-shaped brackets.

[0015] As a preferred embodiment of the present invention, enclosures are installed on both sides of the installation cover, the enclosures cover both sides of the quartz axis, and a delivery pipe is installed on the nozzle.

[0016] As a preferred embodiment of the present invention, a collection box is installed on the operating table, the positioning track is installed in the collection box, and the collection box is placed in the gap between the first fixing seat and the second fixing seat, and the collection box vertically corresponds to the quartz axis.

[0017] As a preferred embodiment of the present invention, a slide plate is slidably arranged inside the positioning sleeve, one end of the slide plate is connected to a pressure rod, a guide wheel is installed at the bottom of the pressure rod, and the guide wheel is slidably connected to the positioning track, an insertion rod is installed on the other side of the slide plate, a return spring is sleeved on the insertion rod located on the inner side of the positioning sleeve, one end of the return spring is clamped on the slide plate, and the other end of the return spring is clamped on the inner wall of the positioning sleeve.

[0018] As a preferred embodiment of the present invention, a fixing seat is installed on the operating table, and the fixing seat is located outside the second fixing seat. An auxiliary sponge is installed on the top of the fixing seat, and the auxiliary sponge is fitted with the quartz axis.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] A rotating polishing unit is provided in which a driving motor can drive the quartz shaft clamped inside the supporting clamping unit to rotate, and the driving motor drives the screw shaft to rotate through a belt, thereby driving the polishing motor to drive the polishing disk to move on the quartz shaft. Since the quartz shaft rotates and the polishing disk moves horizontally, the polishing disk can polish the entire quartz shaft without moving the polishing position separately, thereby improving the overall polishing efficiency.

[0021] A wiping unit is provided, in which the water-absorbing sponge inside the wiping unit can move with the rotating polishing unit, and when moving, the water-absorbing sponge can wipe the polished quartz shaft, so that the polishing liquid remaining on the surface is absorbed by the water-absorbing sponge, so that after polishing, the cleanliness of the quartz shaft is guaranteed, and the insertion rod and the pressure rod at the bottom of the water-absorbing sponge slide on the protrusion of the positioning track to drive the insertion rod to move upward, and the water absorbed in the water-absorbing sponge can be discharged by squeezing, so as to ensure that the water-absorbing sponge can fully clean the quartz shaft, thereby improving the cleaning quality.

[0022] The specific implementation modes of the present invention are further described in detail below in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In the attached picture:

[0024] Figure 1 It is a schematic diagram of the three-dimensional structure of a quartz shaft polishing device for semiconductors;

[0025] Figure 2 It is a schematic diagram of the side structure of a quartz shaft polishing device for semiconductors;

[0026] Figure 3 A schematic diagram of the internal structure of a quartz shaft polishing device for semiconductors (I);

[0027] Figure 4A schematic diagram of the internal structure of a quartz shaft polishing device for semiconductors (II);

[0028] Figure 5 A schematic diagram of the partial structure of a quartz shaft polishing device for semiconductors (I);

[0029] Figure 6 A schematic diagram of the partial structure of a quartz shaft polishing device for semiconductors (II);

[0030] Figure 7 A partial cross-sectional view of a quartz shaft polishing device for semiconductors;

[0031] Figure 8 A quartz shaft polishing device for semiconductors Figure 7 Enlarged view of point A in the middle.

[0032] In the figure:

[0033] 100, support and clamping unit; 101, operating table; 1011, supporting leg; 1012, protective cover; 1013, jack; 102, sealing door; 1021, slide rail; 1022, slide groove; 1023, observation window; 1024, handle; 103, first fixed seat; 1031, second fixed seat; 1032, through hole; 1033, three-jaw chuck; 104, clamping plate; 1041, guide block;

[0034] 200, rotary polishing unit; 201, driving motor; 2011, supporting frame; 2012, cross bar; 202, driving pulley; 2021, belt; 2022, driven pulley; 203, screw shaft; 2031, arch bracket; 2032, screw sleeve; 2033, limit plate; 2034, limit sleeve; 2035, limit rod; 204, electric push rod; 2041, polishing motor; 2042, polishing disc; 2043, mounting cover; 2044, enclosure; 205, nozzle; 2051, conveying pipe;

[0035] 300, wiping unit; 301, water-absorbing sponge; 3011, squeezing plate; 3012, auxiliary sponge; 3013, fixing seat; 302, positioning sleeve; 3021, plug rod; 3022, return spring; 3023, slide plate; 3024, pressure rod; 3025, guide wheel; 303, positioning track; 3031, protrusion; 3032, collection box; 304, L-shaped bracket; 3041, synchronous bracket;

[0036] 400, Quartz axis. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. The following embodiments are used to illustrate the present invention. Example

[0038] like Figures 1 to 8 As shown, a quartz shaft polishing device for semiconductors includes a supporting and clamping unit 100, a rotating polishing unit 200 and a wiping unit 300. The supporting and clamping unit 100 includes an operating table 101. A first fixed seat 103 is installed on one side of the operating table 101, and a second fixed seat 1031 is installed on the other side of the operating table 101. A three-jaw chuck 1033 is installed on the first fixed seat 103, and a quartz shaft 400 is clamped on the three-jaw chuck 1033; the three-jaw chuck 1033 serves the purpose of clamping.

[0039] The rotary polishing unit 200 includes a driving motor 201, the end of the output shaft of the driving motor 201 is connected to the rotation center of the three-jaw chuck 1033, and a driving pulley 202 is installed on the output shaft of the driving motor 201, a belt 2021 is sleeved on the driving pulley 202, and a driven pulley 2022 is sleeved on the other side of the belt 2021, a screw shaft 203 is installed at the rotation center of the driven pulley 2022, a screw shaft 203 is sleeved on the screw shaft 203, an electric push rod 204 is installed at the bottom of the screw shaft ring 2032, and a polishing motor 2041 is installed on the electric push rod 204, and the polishing motor 20 A polishing disc 2042 is installed at the output end 41, and a mounting cover 2043 is provided on the outer side of the polishing disc 2042, and a nozzle 205 is installed on the mounting cover 2043, and the nozzle 205 vertically corresponds to the quartz axis 400; wherein the driving motor can drive the quartz axis clamped inside the supporting clamping unit to rotate, and the driving motor drives the screw shaft to rotate through the belt, thereby driving the polishing motor to drive the polishing disc to move on the quartz axis. Since the quartz axis is rotating and the polishing disc is moving horizontally, the polishing disc can polish the entire quartz axis without moving the polishing position separately, thereby improving the overall polishing efficiency.

[0040] The wiping unit 300 includes a water-absorbing sponge 301, a base of the water-absorbing sponge 301 is installed with an extrusion plate 3011, a plug rod 3021 is installed at the bottom of the extrusion plate 3011, a pressure rod 3024 is installed at the end of the plug rod 3021, a positioning track 303 is slidably arranged at the bottom of the pressure rod 3024, and a plurality of pairs of protrusions 3031 are installed on the positioning track 303, a positioning sleeve 302 is sleeved on the plug rod 3021, an L-shaped bracket 304 is installed on the side wall of the positioning sleeve 302, and the L-shaped bracket 304 and the screw ring 2032 are connected to each other. The water-absorbing sponge inside the wiping unit can move with the rotating polishing unit, and when moving, the water-absorbing sponge can wipe the polished quartz shaft, so that the polishing liquid remaining on the surface is absorbed by the water-absorbing sponge, so that the cleanliness of the quartz shaft is guaranteed after polishing, and the insertion rod and the pressure rod at the bottom of the water-absorbing sponge slide on the protrusion of the positioning track to drive the insertion rod to move upward, and the water absorbed by the water-absorbing sponge can be discharged by squeezing, so as to ensure that the water-absorbing sponge can fully clean the quartz shaft and improve the cleaning quality.

[0041] like Figure 1 , Figure 2 and Figure 3 As shown, in a specific embodiment, a support leg 1011 is installed at the bottom corner of the operating table 101, and an anti-skid pad is installed at the bottom of the support leg 1011. A protective cover 1012 is installed on the operating table 101, and the protective cover 1012 covers the top of the screw shaft 203. A plug hole 1013 is opened on one side of the protective cover 1012, and the plug hole 1013 is adapted to the through hole 1032 opened on the second fixing seat 1031, and the quartz shaft 400 movably passes through the through hole 1032 and the plug hole 1013. The quartz shaft 400 is inserted from the inside of the plug hole 1013 and the through hole 1032 respectively, and the end of the quartz shaft 400 is connected to the three-jaw chuck 1033, thereby achieving the purpose of preliminary fixation, and the protective cover 1012 as a whole plays a protective purpose, and the support leg 1011 can improve the stability of the device.

[0042] like Figure 2 As shown, further, a pair of sealed doors 102 are slidably provided on the protective cover 1012, a slide rail 1021 is installed on the top of the pair of sealed doors 102, a slide groove 1022 is provided on the protective cover 1012, the slide rail 1021 is slidably provided in the slide groove 1022, a handle 1024 is installed on the sealed door 102, an anti-slip cover is installed on the handle 1024, and an observation window 1023 is provided on the sealed door 102. The sealed door 102 can slide inside the protective cover 1012 with the slide groove 1022, so as to open the protective cover 1012, and the handle 1024 can be used to facilitate the opening and closing of the sealed door 102, and the observation window 1023 on the sealed door 102 can directly understand the internal polishing degree, so that the emergency situation can be known in advance.

[0043] like Figure 3 and Figure 6 As shown, further, a pair of guide blocks 1041 are installed on the surface of the second fixing seat 1031, and a clamping plate 104 is slidably arranged on the pair of guide blocks 1041. A locking bolt is screwed between the pair of clamping plates 104, and the pair of clamping plates 104 are in contact with the surface of the quartz shaft 400. When the pair of clamping plates 104 are pushed inward, the ends of the pair of clamping plates 104 are in contact with the side wall of the quartz shaft 400, and the current position of the clamping plates 104 is fixed by the locking bolt, and the clamping plates 104 can ensure that the quartz shaft 400 as a whole rotates coaxially. Example

[0044] The difference between the above embodiment and this embodiment is that: Figure 3 , Figure 4 and Figure 5 As shown, a support frame 2011 is installed on the operating table 101 near the first fixed seat 103, a cross bar 2012 is installed horizontally on the bottom of the support frame 2011, the cross bar 2012 is connected to the housing of the driving motor 201, the support frame 2011 is connected to the rotation center of the driven pulley 2022, and a pair of arched brackets 2031 are symmetrically installed on the operating table 101, and the arched brackets 2031 are rotatably connected to the screw shaft 203. The driving motor 201 drives the driving pulley 202 to rotate, and the driving pulley 202 is installed with a belt 2021, and the driven pulley 2022 can be driven to rotate through the transmission of the belt 2021, and the driven pulley 2022 rotates around the support frame 2011, and finally drives the coaxially connected screw shaft 203 to rotate in the arched bracket 2031.

[0045] like Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7As shown, in a specific embodiment, limit plates 2033 are installed on both sides of the screw ring 2032, and a limit sleeve 2034 is installed at the end of the limit plate 2033. A limit rod 2035 is movably inserted inside the limit sleeve 2034. A synchronous bracket 3041 is installed on the side wall of the limit plate 2033, and the synchronous bracket 3041 is connected to the L-shaped bracket 304. When the limit plate 2033 and the screw ring 2032 move, the synchronous bracket 3041 and the L-shaped bracket 304 are driven to move synchronously, and the L-shaped bracket 304 drives the positioning sleeve 302 to move, and the positioning sleeve 302 drives the water-absorbing sponge 301 and the polishing disk 2042 to move at the same time, so that the polishing liquid on the surface of the quartz shaft 400 polished by the polishing disk 2042 can be absorbed to ensure the cleanliness of the surface of the quartz shaft 400, and the screw shaft 203 rotates. Afterwards, a screw shaft 203 is mounted with a screw ring 2032, at which time a limit plate 2033 is mounted on the screw ring 2032, and the limit sleeve 2034 can slide along the limit rod 2035 as a whole, and then through the movement of the limit rod 2035, the screw ring 2032 can move as a whole, and enclosures 2044 are mounted on both sides of the mounting cover 2043, and the enclosures 2044 cover both sides of the quartz shaft 400, and a delivery pipe 2051 is mounted on the nozzle 205. The enclosures 2044 play a role in splash prevention, and the polishing liquid is input into the delivery pipe 2051 through the pump body (not indicated in the figure), and at this time, the polishing liquid can be sprayed onto the surface of the quartz shaft 400 through the nozzle 205, which plays a role in auxiliary polishing. Example

[0046] The difference between the above embodiment and this embodiment is that: Figure 5 and Figure 8 As shown, a collection box 3032 is installed on the operating table 101, the positioning track 303 is installed in the collection box 3032, and the collection box 3032 is placed in the gap between the first fixing seat 103 and the second fixing seat 1031, and the collection box 3032 is vertically corresponding to the quartz axis 400. The collection box 3032 can collect liquid for later cleaning.

[0047] like Figure 6 , Figure 7 and Figure 8As shown, in a specific embodiment, a slide plate 3023 is slidably arranged inside the positioning sleeve 302, one end of the slide plate 3023 is connected to a pressure rod 3024, a guide wheel 3025 is installed at the bottom of the pressure rod 3024, and the guide wheel 3025 is slidably connected to the positioning rail 303, and an insertion rod 3021 is installed on the other side of the slide plate 3023. A return spring 3022 is sleeved on the insertion rod 3021 located on the inner side of the positioning sleeve 302, one end of the return spring 3022 is clamped on the slide plate 3023, and the other end of the return spring 3022 is clamped on the inner wall of the positioning sleeve 302. When the positioning sleeve 302 moves, the pressure rod 3024 and the guide wheel 3025 at the bottom drive the positioning rail 303 to slide. When it moves to the protrusion 3031, the protrusion 3031 drives the pressure rod 3024 to slide upward as a whole, and drives the slide plate 3023 to slide upward on the positioning sleeve 302. At this time, the reset spring 3022 can be compressed, and the reset spring 3022 is used to facilitate the subsequent reset processing. The upward movement of the slide plate 3023 can push the pressure rod 3024 to slide upward. The pressure rod 3024 moves upward through the extrusion plate 3011, and one end of the water-absorbing sponge 301 and the quartz axis 400, and the other end is squeezed through the extrusion plate 3011, so that the water-absorbing sponge 301 can be flattened, and the polishing liquid adsorbed inside is cleaned, thereby ensuring the cleaning effect of the water-absorbing sponge 301.

[0048] like Figure 4 As shown, further, a fixing seat 3013 is installed on the operating table 101, and the fixing seat 3013 is located outside the second fixing seat 1031. An auxiliary sponge 3012 is installed on the top of the fixing seat 3013, and the auxiliary sponge 3012 fits the quartz shaft 400. When the water-absorbing sponge 301 is squeezed, the water-absorbing sponge 301 does not clean the quartz shaft 400 very well. However, after the quartz shaft 400 is disassembled later, the quartz shaft 400 needs to be cleaned from the jack 1013 and the through hole 1032. At this time, the water-absorbing sponge 301 and the auxiliary sponge 3012 are used to complete the secondary cleaning, thereby improving the cleaning effect.

[0049] The implementation principle of a semiconductor quartz shaft polishing device of this embodiment is as follows:

[0050] The operator first needs to install the quartz axis 400, plug the quartz axis 400 from the inside of the socket 1013 and the through hole 1032 respectively, and connect the end of the quartz axis 400 to the three-jaw chuck 1033, thereby achieving the purpose of preliminary fixation. Then the operator pushes a pair of clamps 104 to move inward, and the ends of a pair of clamps 104 fit the side walls of the quartz axis 400, and the current position of the clamps 104 is fixed by the locking bolts. The clamps 104 can ensure that the quartz axis 400 as a whole rotates coaxially.

[0051] Next, the operator starts the electric push rod 204, which drives the mounting cover 2043 and the polishing disk 2042 to move downward as a whole, ensuring that the polishing surface of the polishing disk 2042 can contact the surface of the quartz shaft 400. At this time, polishing liquid is input into the delivery pipe 2051 through the pump body (not shown in the figure). At this time, the polishing liquid can be sprayed onto the surface of the quartz shaft 400 through the nozzle 205, thereby achieving the purpose of auxiliary polishing.

[0052] Then a polishing operation is performed.

[0053] The driving motor 201 is started, and the three-jaw chuck 1033 connected to the output shaft is driven to rotate by the driving motor 201. At this time, the three-jaw chuck 1033 can drive the entire quartz shaft 400 to start rotating.

[0054] The driving motor 201 drives the driving pulley 202 to rotate, and a belt 2021 is installed on the driving pulley 202. The transmission of the belt 2021 can drive the driven pulley 2022 to rotate, and the driven pulley 2022 rotates around the support frame 2011, and finally drives the coaxially connected screw shaft 203 to rotate in the arch bracket 2031.

[0055] After the screw shaft 203 rotates, a screw ring 2032 is installed on the screw shaft 203. At this time, a limit plate 2033 is installed on the screw ring 2032, and the limit sleeve 2034 can slide along the limit rod 2035 as a whole. Then, through the movement of the limit rod 2035, the screw ring 2032 can move as a whole.

[0056] The bottom of the screw ring 2032 moves horizontally through the polishing disc 2042 connected to the electric push rod 204 and the polishing motor 2041, and the quartz shaft 400 rotates as a whole, so the horizontal movement of the polishing disc 2042 can polish various positions of the quartz shaft 400, and before each polishing operation, the quartz shaft 400 is wetted with polishing liquid to facilitate subsequent grinding operations.

[0057] When the limit plate 2033 and the screw ring 2032 move, they drive the synchronous bracket 3041 and the L-shaped bracket 304 to move synchronously, the L-shaped bracket 304 drives the positioning sleeve 302 to move, and the positioning sleeve 302 drives the absorbent sponge 301 and the polishing disk 2042 to move at the same time, so as to absorb the polishing liquid on the surface of the quartz shaft 400 polished by the polishing disk 2042, thereby ensuring the cleanliness of the surface of the quartz shaft 400.

[0058] When the positioning sleeve 302 moves, the pressure rod 3024 and the guide wheel 3025 at the bottom drive the positioning rail 303 to slide. When it moves to the protrusion 3031, the protrusion 3031 drives the pressure rod 3024 to slide upward as a whole, and drives the slide plate 3023 to slide upward on the positioning sleeve 302. At this time, the reset spring 3022 can be compressed, and the reset spring 3022 is used to facilitate the subsequent reset processing. The upward movement of the slide plate 3023 can push the pressure rod 3024 to slide upward. The pressure rod 3024 moves upward through the extrusion plate 3011, and one end of the water-absorbing sponge 301 and the quartz axis 400, and the other end is squeezed through the extrusion plate 3011, so that the water-absorbing sponge 301 can be flattened, and the polishing liquid adsorbed inside is cleaned, thereby ensuring the cleaning effect of the water-absorbing sponge 301.

[0059] When squeezing the absorbent sponge 301, the quartz shaft 400 cannot be cleaned particularly thoroughly by the absorbent sponge 301. However, after the quartz shaft 400 is disassembled later, the quartz shaft 400 needs to be cleaned twice from the socket 1013 and the through hole 1032 by the absorbent sponge 301 and the auxiliary sponge 3012, thereby improving the cleaning effect.

Claims

1. A quartz shaft polishing device for semiconductors, comprising a supporting and clamping unit, a rotating polishing unit and a wiping unit, characterized in that: The supporting and clamping unit comprises an operating table, a first fixing seat is installed on one side of the operating table, a second fixing seat is installed on the other side of the operating table, a three-jaw chuck is installed on the first fixing seat, and a quartz shaft is clamped on the three-jaw chuck; The rotary polishing unit comprises a driving motor, the end of the driving motor output shaft is connected to the rotation center of the three-jaw chuck, and a driving pulley is installed on the driving motor output shaft, a belt is sleeved on the driving pulley, a driven pulley is sleeved on the other side of the belt, a screw shaft is installed at the rotation center of the driven pulley, a screw ring is sleeved on the screw shaft, an electric push rod is installed at the bottom of the screw ring, a polishing motor is installed on the electric push rod, a polishing disc is installed on the output end of the polishing motor, a mounting cover is wrapped around the outer side of the polishing disc, and a nozzle is installed on the mounting cover, and the nozzle corresponds vertically to the quartz axis; The wiping unit includes a water-absorbing sponge, a squeezing plate is installed on the base of the water-absorbing sponge, a plug rod is installed on the bottom of the squeezing plate, a pressure rod is installed on the end of the plug rod, a positioning track is slidably provided at the bottom of the pressure rod, and a plurality of pairs of protrusions are installed on the positioning track, a positioning sleeve is sleeved on the plug rod, an L-shaped bracket is installed on the side wall of the positioning sleeve, and the L-shaped bracket and the screw rod ring are connected to each other, limiting plates are installed on both sides of the screw rod ring, a limiting sleeve is installed on the end of the limiting plate, a limiting rod is movably inserted inside the limiting sleeve, a synchronous bracket is installed on the side wall of the limiting plate, and the synchronous bracket and the L-shaped bracket are connected to each other.

2. A quartz shaft polishing device for semiconductor according to claim 1, characterized in that: A support leg is installed at the bottom corner of the operating table, and an anti-slip pad is installed at the bottom of the support leg. A protective cover is installed on the operating table, and the protective cover covers the top of the screw shaft. A socket is opened on one side of the protective cover, and the socket is adapted to the through hole opened on the second fixing seat, and the quartz axis movably passes through the through hole and the socket.

3. A quartz shaft polishing device for semiconductor according to claim 2, characterized in that: A pair of sealed doors are slidably arranged on the protective cover, a pair of sealed doors are provided with slide rails on top, a slide groove is provided on the protective cover, the slide rail is slidably arranged in the slide groove, a handle is provided on the sealed door, an anti-slip cover is provided on the handle, and an observation window is provided on the sealed door.

4. A quartz shaft polishing device for semiconductor according to claim 1, characterized in that: A pair of guide blocks are installed on the surface of the second fixing seat, clamping plates are slidably arranged on the pair of guide blocks, locking bolts are screwed between the pair of clamping plates, and the pair of clamping plates are in contact with the surface of the quartz shaft.

5. A semiconductor quartz shaft polishing device according to claim 1, characterized in that: A support frame is installed on the operating table near the first fixed seat, and a cross bar is installed laterally on the bottom of the support frame. The cross bar is connected to the driving motor housing, and the support frame is connected to the rotation center of the driven pulley. A pair of arched brackets are symmetrically installed on the operating table, and the arched brackets are rotatably connected to the screw shaft.

6. A quartz shaft polishing device for semiconductor according to claim 1, characterized in that: The mounting cover is provided with enclosures on both sides, the enclosures cover both sides of the quartz axis, and the nozzle is provided with a delivery pipe.

7. A semiconductor quartz shaft polishing device according to claim 1, characterized in that: A collection box is installed on the operating table, the positioning track is installed in the collection box, and the collection box is placed in the gap between the first fixing seat and the second fixing seat, and the collection box vertically corresponds to the quartz axis.

8. A semiconductor quartz shaft polishing device according to claim 1, characterized in that: A slide plate is slidably arranged inside the positioning sleeve, one end of the slide plate is connected to a pressure rod, a guide wheel is installed at the bottom of the pressure rod, and the guide wheel is slidably connected to the positioning track, an insertion rod is installed on the other side of the slide plate, a return spring is sleeved on the insertion rod located on the inner side of the positioning sleeve, one end of the return spring is clamped on the slide plate, and the other end of the return spring is clamped on the inner wall of the positioning sleeve.

9. A semiconductor quartz shaft polishing device according to claim 1, characterized in that: A fixing seat is installed on the operating table, and the fixing seat is located outside the second fixing seat. An auxiliary sponge is installed on the top of the fixing seat, and the auxiliary sponge is fitted with the quartz shaft.

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