Vacuum adsorption microgripper based on dual-material flexible hinge assembly

Abstract

An operation-sensing integrated vacuum adsorption micro-gripper based on a dual-material flexible hinge group and a micro-force sensing method for micro-gripper assembly relate to the field of clamping operation and micro-assembly force sensing of tiny parts. The present invention solves the problem that the existing vacuum adsorption micro-gripper lacks a three-dimensional micro-assembly force sensing function, which limits its application in the field of high-precision tiny parts assembly. The L-shaped columnar elastomer of the present invention is provided with a vacuum adsorption hole inside, the L-shaped columnar elastomer is connected to the base, and a base pneumatic pipeline connected to the vacuum adsorption hole is provided inside the base. The high-rigidity flexible hinge group and the surface of the L-shaped columnar elastomer are integrally processed by a stereolithography method. A low-rigidity flexible hinge group is adhered to the hinge groove of the high-rigidity flexible hinge group, and a semiconductor strain gauge assembly is attached to the outer surface of the low-rigidity flexible hinge group. The present invention is used to realize the clamping operation and micro-assembly force sensing of tiny parts, and meet the high-precision operation and assembly tasks of tiny parts.

Description

Technical Field

[0001] The present invention relates to the field of clamping operation and micro-assembly force perception of tiny parts, and in particular to an operation-perception-integrated vacuum adsorption micro-gripper based on a dual-material flexible hinge group and a micro-gripper assembly micro-force perception method. Background Art

[0002] In the manufacture of complex micro-devices, micro-grippers are often required to perform tasks such as high-precision clamping and assembly of tiny parts. Two-finger gripping and vacuum adsorption are commonly used methods for gripping tiny parts. Compared with two-finger gripping, vacuum adsorption has the advantages of simple structure and control, as well as small size. However, most of the current vacuum adsorption micro-grippers lack the three-dimensional micro-assembly force sensing function, which limits their application in the field of high-precision tiny parts assembly. The design of an operation-sensing integrated vacuum adsorption micro-gripper based on a dual-material flexible hinge group can promote the application of integrated micro-grippers in fields such as micro-device assembly. Summary of the Invention

[0003] The purpose of the present invention is to solve the problem that the existing vacuum adsorption micro-gripper lacks the three-dimensional micro-assembly force sensing function, which limits its application in the field of high-precision micro-parts assembly, and further provides an operation-sensing integrated vacuum adsorption micro-gripper and a micro-gripper assembly micro-force sensing method based on a dual-material flexible hinge group. The micro-gripper can clamp micro-parts and sense three-dimensional micro-assembly forces, and can improve the force measurement resolution to meet the high-precision operation and assembly tasks of micro-parts. The L-shaped columnar elastomer of the micro-gripper is provided with vacuum adsorption holes, and the vacuum negative pressure is applied by the pneumatic control unit to achieve the adsorption of micro-parts. At the same time, the L-shaped columnar elastomer is provided with three groups of dual-material flexible hinges, which can improve the sensitivity of three-dimensional micro-force sensing while maintaining the overall structural rigidity of the gripper. Under the action of the operating load, the semiconductor strain gauges attached to each group of flexible hinges are deformed accordingly, and the output signals are collected and processed by the controller to achieve three-dimensional micro-operation force sensing at the end of the gripper.

[0004] The technical solution of the present invention is:

[0005] The yoke is an L-shaped elastic body with a plurality of holes arranged opposite to each other, and the yoke is an L-shaped elastic body with a plurality of holes arranged opposite to each other. Three groups of high-rigidity flexible hinges, the first group of high-rigidity flexible hinges and the second group of high-rigidity flexible hinges are arranged in sequence from top to bottom on the surface of the "|" section of the L-shaped columnar elastomer to form a staggered hinge structure. The third group of high-rigidity flexible hinges is arranged on the surface of the "_" section of the L-shaped columnar elastomer; the low-rigidity flexible hinge group includes the first group of low-rigidity flexible hinges, the second group of low-rigidity flexible hinges and the third group of low-rigidity flexible hinges. The first group of low-rigidity flexible hinges, the second group of low-rigidity flexible hinges and the third group of low-rigidity flexible hinges are respectively adhered to the hinge grooves of the first group of high-rigidity flexible hinges, the second group of high-rigidity flexible hinges and the third group of high-rigidity flexible hinges; the semiconductor strain gauge assembly includes the first semiconductor strain gauge group, the second semiconductor strain gauge group and the third semiconductor strain gauge group. The first semiconductor strain gauge group, the second semiconductor strain gauge group and the third semiconductor strain gauge group are respectively attached to the outer surfaces of the first group of low-rigidity flexible hinges, the second group of low-rigidity flexible hinges and the third group of low-rigidity flexible hinges.

[0006] Furthermore, the first group of high-rigidity flexible hinges includes an X-axis high-rigidity flexible hinge A and an X-axis high-rigidity flexible hinge B, which are symmetrically arranged on the surface of the "|" segment of the L-shaped columnar elastomer, and the axis of symmetry is perpendicular to the X-axis of the micro-gripper; the second group of high-rigidity flexible hinges includes a Y-axis high-rigidity flexible hinge A and a Y-axis high-rigidity flexible hinge B, which are symmetrically arranged on the surface of the "|" segment of the L-shaped columnar elastomer, and the axis of symmetry is perpendicular to the Y-axis of the micro-gripper; the third group of high-rigidity flexible hinges includes a Z-axis high-rigidity flexible hinge A and a Z-axis high-rigidity flexible hinge B, which are symmetrically arranged on the surface of the "_" segment of the L-shaped columnar elastomer, and the axis of symmetry is perpendicular to the Z-axis of the micro-gripper.

[0007] Furthermore, the first group of low-rigidity flexible hinges includes an X-axis low-rigidity flexible hinge A and an X-axis low-rigidity flexible hinge B, and the X-axis low-rigidity flexible hinge A and the X-axis low-rigidity flexible hinge B are respectively adhered to the hinge grooves of the X-axis high-rigidity flexible hinge A and the X-axis high-rigidity flexible hinge B; the second group of low-rigidity flexible hinges includes a Y-axis low-rigidity flexible hinge A and a Y-axis low-rigidity flexible hinge B, and the Y-axis low-rigidity flexible hinge A and the Y-axis low-rigidity flexible hinge B are respectively adhered to the hinge grooves of the Y-axis high-rigidity flexible hinge A and the Y-axis high-rigidity flexible hinge B; the third group of low-rigidity flexible hinges includes a Z-axis low-rigidity flexible hinge A and a Z-axis low-rigidity flexible hinge B, and the Z-axis low-rigidity flexible hinge A and the Z-axis low-rigidity flexible hinge B are respectively adhered to the hinge grooves of the Z-axis high-rigidity flexible hinge A and the Z-axis high-rigidity flexible hinge B.

[0008] Furthermore, the first semiconductor strain gauge group includes an X-axis semiconductor strain gauge A and an X-axis semiconductor strain gauge B, which are respectively attached to the outer surfaces of the X-axis low-rigidity flexible hinge A and the X-axis low-rigidity flexible hinge B, and are used to detect the X-direction micro-assembly force exerted on the micro-gripper; the second semiconductor strain gauge group includes a Y-axis semiconductor strain gauge A and a Y-axis semiconductor strain gauge B, which are respectively attached to the outer surfaces of the Y-axis low-rigidity flexible hinge A and the Y-axis low-rigidity flexible hinge B, and are used to detect the Y-direction micro-assembly force exerted on the micro-gripper; the third semiconductor strain gauge group includes a Z-axis semiconductor strain gauge A and a Z-axis semiconductor strain gauge B, which are respectively attached to the outer surfaces of the Z-axis low-rigidity flexible hinge A and the Z-axis low-rigidity flexible hinge B, and are used to detect the Z-direction micro-assembly force exerted on the micro-gripper.

[0009] Furthermore, the L-shaped columnar elastomer and each high-rigidity flexible hinge in the high-rigidity flexible hinge group are made of photosensitive resin and are processed as a whole through stereolithography; each low-rigidity flexible hinge in the low-rigidity flexible hinge group is made of 704 silicone rubber and is processed through room temperature moisture absorption and curing.

[0010] Furthermore, the cross section of the vacuum adsorption hole inside the L-shaped columnar elastic body is square.

[0011] Furthermore, the outer surface of the end of the L-shaped columnar elastic body is cylindrical.

[0012] Furthermore, the hinge grooves of each high-rigidity flexible hinge in the high-rigidity flexible hinge group are semicircular grooves, and each low-rigidity flexible hinge in the low-rigidity flexible hinge group are semi-cylindrical, and the semi-cylindrical low-rigidity flexible hinges are coaxially arranged in the corresponding semicircular grooves.

[0013] Furthermore, the length of the L-shaped columnar elastic body is represented by l, the width is represented by w, the height is represented by h, the wall thickness of the elastic body is represented by t, and the height of the top cylinder of the elastic body is represented by h. c Expressed as: t = 5w / 12; h c =h / 5; l=16h / 25; the radius of the semicircular groove of the high-rigidity flexible hinge is r, the height of the Y-axis high-rigidity flexible hinge A or the Y-axis high-rigidity flexible hinge B from the base is h1, the height of the X-axis high-rigidity flexible hinge A or the X-axis high-rigidity flexible hinge B from the Y-axis high-rigidity flexible hinge A or the Y-axis high-rigidity flexible hinge B is h2, and the length of the Z-axis high-rigidity flexible hinge A or the Z-axis high-rigidity flexible hinge B from the load action center is l1, then: h1=2r; h2=9r / 4; l1=6r.

[0014] The present invention also provides a micro-force sensing method for micro-gripper assembly, which is implemented by the aforementioned operation-sensing integrated vacuum adsorption micro-gripper based on a dual-material flexible hinge assembly. The specific steps are as follows:

[0015] Step 1: Adsorb the target parts:

[0016] Use a vacuum hose to connect the pneumatic interface 2 of the base 1 in the micro-gripper to the pneumatic control system. Apply vacuum negative pressure through the pneumatic control system, and the micro-gripper approaches the target micro-axis part. The upper computer controls the opening of the air circuit to achieve the adsorption operation of the micro-axis part.

[0017] Step 2: Assemble the micro-axis and micro-hole:

[0018] The micro-gripper absorbs the micro-axis component and contacts the fixed micro-hole. The assembly force between the micro-axis and the micro-hole causes the L-shaped columnar elastic body 4 to deform, and the semiconductor strain gauge attached to the surface of the L-shaped columnar elastic body 4 is deformed accordingly.

[0019] Step 3: Get the voltage value of each channel:

[0020] Due to the piezoresistive effect, the deformation of the semiconductor strain gauge will produce a resistance change, which is connected to the Wheatstone bridge and outputs the voltage value of each channel after circuit processing;

[0021] Step 4: Calculate the assembly force on the end of the micro gripper:

[0022] The voltage value of each channel is multiplied by the calibration matrix obtained by the calibration method, and the assembly force exerted on the end of the micro-gripper is calculated by the host computer.

[0023] Compared with the prior art, the present invention has the following effects:

[0024] 1. The operation-sensing integrated vacuum adsorption micro-gripper based on a dual-material flexible hinge group described in the present invention can improve the resolution of force measurement. Compared with the elastomer structure of a pure thin-walled columnar micro-force sensor, the present invention adopts a hollow columnar elastomer structure with a dual-material flexible hinge group to measure assembly micro-forces, and three groups of dual-material flexible hinge groups are evenly arranged on the surface of the L-shaped hollow columnar elastomer. Compared with a pure thin-walled columnar structure under the same size conditions, using finite element software analysis, the micro-gripper of the present invention has an 18-22 times higher sensitivity to force, ultimately forming a micro-gripper that can measure three-dimensional high-resolution assembly micro-forces, which has great practical value in related fields such as the assembly of micro-sized parts.

[0025] 2. The operation-sensing integrated vacuum adsorption micro-gripper based on the dual-material flexible hinge group described in the present invention has a simple structure and is easy to process. The L-shaped columnar elastomer and each high-rigidity flexible hinge in the present invention are made of photosensitive resin (liquid at room temperature) and are processed as a whole by stereolithography. The photosensitive resin material has good surface finish and high dimensional stability, which ensures the stability of the overall structure and physical properties of the micro-manipulation tool, and is conducive to long-term storage and reuse. The low-rigidity flexible hinges in the present invention are made of 704 silicone rubber (liquid at room temperature) and are processed by the method of room-temperature moisture absorption and curing. The 704 silicone rubber material has good adhesion, high strength, excellent insulation properties and aging resistance, and is particularly suitable for the bonding and mechanical damage protection of high-precision semiconductor strain gauges.

[0026] 3. The vacuum adsorption microgripper with integrated operation sensing based on a dual-material flexible hinge assembly, described in this invention, boasts a compact size and high integration. The microgripper utilizes the hollow and sealed interior of a cylindrical elastomer, combined with pneumatic connectors and a negative pressure air source to achieve adsorption. Combined with integrated micro-force sensing, the microgripper enables active, compliant manipulation of tiny parts. This safe and efficient approach makes it suitable for transporting and assembling a variety of micro-components, and holds great promise for applications in micro-component assembly, lab-on-a-chip, and other fields. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is an axonometric view of the operation-sensing integrated vacuum adsorption micro-gripper based on the dual-material flexible hinge assembly of the present invention (before the low-rigidity hinge is installed);

[0028] Figure 2 This is an axonometric diagram of the vacuum adsorption micro-gripper with integrated operation and perception based on the dual-material flexible hinge assembly of the present invention (after installing the low-rigidity hinge);

[0029] Figure 3 This is a front view of the L-shaped columnar elastic body in the operation-sensing integrated vacuum adsorption micro-gripper based on a dual-material flexible hinge group of the present invention;

[0030] Figure 4 This is a side view of an L-shaped columnar elastic body in the operation-sensing integrated vacuum adsorption micro-gripper based on a dual-material flexible hinge assembly of the present invention;

[0031] Figure 5 This is a block diagram of the electronic control system for measuring three-dimensional micro-assembly force according to the present invention;

[0032] Figure 6 This is a block diagram of the pneumatic control system for measuring three-dimensional micro-assembly force according to the present invention;

[0033] Figure 7 Schematic diagram of the L-shaped columnar elastic body structure of the present invention (simplified version);

[0034] Figure 8 Schematic diagram of the L-shaped columnar elastic body structure of the comparative example (simplified version);

[0035] Figure 9 The L-shaped column elastic body of the present invention is subjected to F x Equivalent elastic strain diagram when force is applied;

[0036] Figure 10 The L-shaped column elastic body of the comparative example is subjected to F x Equivalent elastic strain diagram when force is applied;

[0037] Figure 11 The L-shaped columnar elastic body of the present invention is subjected to F y Equivalent elastic strain diagram when force is applied;

[0038] Figure 12 The L-shaped column elastic body of the comparative example is subjected to F y Equivalent elastic strain diagram when force is applied;

[0039] Figure 13 The L-shaped column elastic body of the present invention is subjected to F z Equivalent elastic strain diagram when force is applied;

[0040] Figure 14 The L-shaped column elastic body of the comparative example is subjected to F z Equivalent elastic strain diagram when load is applied. DETAILED DESCRIPTION

[0041] Specific implementation method 1: Combination Figures 1 to 41. The invention relates to an operation-sensing integrated vacuum adsorption micro-gripper based on a dual-material flexible hinge group. The micro-gripper comprises a base 1, an L-shaped columnar elastomer 4, a high-rigidity flexible hinge group, a low-rigidity flexible hinge group and a semiconductor strain gauge assembly. The base 1 is a rectangular block structure, and four base mounting holes arranged opposite to each other are provided on the left and right sides respectively. The base mounting holes pass through the upper and lower end faces of the base. The L-shaped columnar elastomer 4 is a square columnar thin-walled structure. A vacuum adsorption hole is provided at the geometric center of the L-shaped columnar elastomer 4. The vacuum adsorption hole passes through the surfaces of the first and second ends of the elastomer. The L-shaped columnar elastomer 4 and the base 1 are integrally processed by stereolithography. A pneumatic interface 2 is provided at the center of the front end face of the base 1, and a base pneumatic pipeline is provided inside the base 1. The two ends of the base pneumatic pipeline are respectively connected to the pneumatic interface 2 and the vacuum adsorption hole. The high-rigidity flexible hinge group and the L-shaped columnar elastomer 4 are integrally processed by stereolithography. The high-rigidity flexible hinge group comprises a first group of high-rigidity flexible hinges, The second group of high-rigidity flexible hinges and the third group of high-rigidity flexible hinges, the first group of high-rigidity flexible hinges and the second group of high-rigidity flexible hinges are arranged in sequence from top to bottom on the surface of the "|" segment of the L-shaped column elastic body 4 to form a staggered hinge structure together, and the third group of high-rigidity flexible hinges are arranged on the surface of the "_" segment of the L-shaped column elastic body 4; the low-rigidity flexible hinge group includes the first group of low-rigidity flexible hinges, the second group of low-rigidity flexible hinges and the third group of low-rigidity flexible hinges, the first group of low-rigidity flexible hinges, the second group of low-rigidity flexible hinges The high-rigidity flexible hinge and the third group of low-rigidity flexible hinges are respectively adhered to the hinge grooves of the first group of high-rigidity flexible hinges, the second group of high-rigidity flexible hinges and the third group of high-rigidity flexible hinges; the semiconductor strain gauge assembly includes a first semiconductor strain gauge group, a second semiconductor strain gauge group and a third semiconductor strain gauge group, and the first semiconductor strain gauge group, the second semiconductor strain gauge group and the third semiconductor strain gauge group are respectively attached to the outer surfaces of the first group of low-rigidity flexible hinges, the second group of low-rigidity flexible hinges and the third group of low-rigidity flexible hinges.

[0042] In this embodiment, the high-rigidity flexible hinge group and the low-rigidity flexible hinge group form three dual-material flexible hinge groups. The high-rigidity flexible hinge group is arranged on the surface of the L-shaped columnar elastomer 4, which can improve the sensitivity of the local position of the elastomer to micro-force perception while ensuring the overall stiffness of the elastomer; the low-rigidity flexible hinge group is adhered to the hinge groove of the high-rigidity flexible hinge group, which can ensure that the outer surface of the micro-manipulation tool is flat, which is convenient for the pasting of semiconductor strain gauges; the two flexible hinge groups with different stiffness are stacked and arranged, which is similar to the typical laminated structure in composite material mechanics, and has the function of increasing strain.

[0043] In this embodiment, the L-shaped columnar elastomer 4 is integrated with the base 1, and the pneumatic interface 2, the base pneumatic pipeline and the vacuum adsorption hole form a passage. When connected to a negative pressure source, adsorption operations can be performed on micro-sized parts. The pneumatic control system includes a control unit, a vacuum system and an operating tool. The vacuum system includes a pressure source, an air filter, a pressure regulating valve, a switch 1, a vacuum generator and a switch 2. Switch 1 is responsible for controlling the on-off of the system gas circuit. When it is open, the gas circuit is connected; switch 2 is responsible for controlling the positive and negative air pressure of the system. When it is open, the gas circuit is under negative pressure. The upper computer controls switch 1 to close and switch 2 to close, and then the micro-gripper can be operated to perform negative pressure adsorption operations.

[0044] The operation-sensing integrated vacuum adsorption micro-gripper based on the dual-material flexible hinge group described in the present invention can perform micro-part clamping and three-dimensional micro-assembly force sensing, and can improve the force measurement resolution. The L-shaped columnar elastomer of the present invention is provided with vacuum adsorption holes, and the adsorption of micro-parts can be achieved by applying vacuum negative pressure through the pneumatic control system. At the same time, the L-shaped columnar elastomer is provided with three groups of dual-material flexible hinges, which can improve the sensitivity of three-dimensional micro-force sensing while maintaining the overall structural rigidity of the micro-gripper. Under the action of the operating load, the semiconductor strain gauges attached to each group of flexible hinges are deformed accordingly, and the output signal is collected and processed by the controller to realize the three-dimensional micro-operation force sensing of the end of the clamp.

[0045] The operation-sensing integrated vacuum adsorption micro-gripper based on a dual-material flexible hinge assembly described in the present invention has the advantages of a simple structure, compact size, high integration, and high sensitivity. Compared with a thin-walled columnar elastomer structure of the same size, the hinge-based columnar elastomer structure of the present invention has greatly improved sensitivity to micro-force sensing, thereby improving the resolution of micro-assembly force detection by 18-22 times. The micro-gripper of the present invention is suitable for clamping operations of tiny parts and three-dimensional micro-assembly force sensing. In practical applications, the micro-gripper of the present invention can improve the resolution of force detection without increasing its size.

[0046] Specific implementation method 2: Combination Figures 1 to 4Describe this embodiment, the first group of high-rigidity flexible hinges in this embodiment include X-axis high-rigidity flexible hinge A5a and X-axis high-rigidity flexible hinge B5b, X-axis high-rigidity flexible hinge A5a and X-axis high-rigidity flexible hinge B5b are symmetrically arranged on the surface of the "|" segment 4 of the L-shaped columnar elastic body, and the symmetry axis is perpendicular to the X-axis of the micro-gripper; the second group of high-rigidity flexible hinges include Y-axis high-rigidity flexible hinge A6a and Y-axis high-rigidity flexible hinge B6b, Y-axis high-rigidity flexible hinge The high-rigidity flexible hinge A6a and the Y-axis high-rigidity flexible hinge B6b are symmetrically arranged on the surface of the "|" section of the L-shaped columnar elastic body 4, and their symmetry axis is perpendicular to the Y-axis of the micro-gripper. The third group of high-rigidity flexible hinges includes the Z-axis high-rigidity flexible hinge A7a and the Z-axis high-rigidity flexible hinge B7b. The Z-axis high-rigidity flexible hinge A7a and the Z-axis high-rigidity flexible hinge B7b are symmetrically arranged on the surface of the "_" section of the L-shaped columnar elastic body 4, and their symmetry axis is perpendicular to the Z-axis of the micro-gripper. With this arrangement, the high-rigidity flexible hinge group is arranged at two locations on the surface of the L-shaped columnar elastic body 4, namely the "|" section and the "_" section. In the "|" segment, X-axis high-rigidity flexible hinges A5a and B5b are positioned above Y-axis high-rigidity flexible hinges A6a and B6b, forming a staggered hinge structure. In the "_" segment, Z-axis high-rigidity flexible hinges A7a and B7b are symmetrically arranged. Other components and connections are the same as in the first embodiment.

[0047] Specific implementation method three: Combination Figures 1 to 4 The first set of low-rigidity flexible hinges in this embodiment includes an X-axis low-rigidity flexible hinge A8a and an X-axis low-rigidity flexible hinge B8b, and the X-axis low-rigidity flexible hinge A8a and the X-axis low-rigidity flexible hinge B8b are respectively adhered to the hinge grooves of the X-axis high-rigidity flexible hinge A5a and the X-axis high-rigidity flexible hinge B5b; the second set of low-rigidity flexible hinges includes a Y-axis low-rigidity flexible hinge A9a and a Y-axis low-rigidity flexible hinge B9b, and the Y-axis low-rigidity flexible hinge Hinge A9a and Y-axis low-rigidity flexible hinge B9b are adhered to the hinge grooves of Y-axis high-rigidity flexible hinge A6a and Y-axis high-rigidity flexible hinge B6b, respectively. The third group of low-rigidity flexible hinges includes Z-axis low-rigidity flexible hinge A10a and Z-axis low-rigidity flexible hinge B10b, which are adhered to the hinge grooves of Z-axis high-rigidity flexible hinge A7a and Z-axis high-rigidity flexible hinge B7b, respectively. Other components and connection relationships are the same as those in Specific Embodiments 1 or 2.

[0048] Specific implementation method four: Combination Figures 1 to 4The present embodiment is described. The first semiconductor strain gauge group of the present embodiment includes an X-axis semiconductor strain gauge A11a and an X-axis semiconductor strain gauge B11b. The X-axis semiconductor strain gauge A11a and the X-axis semiconductor strain gauge B11b are respectively attached to the outer surfaces of the X-axis low-rigidity flexible hinge A8a and the X-axis low-rigidity flexible hinge B8b, and are used to detect the X-axis micro-assembly force exerted on the micro-gripper. The second semiconductor strain gauge group includes a Y-axis semiconductor strain gauge A12a and a Y-axis semiconductor strain gauge B12b. The Y-axis semiconductor strain gauge A12a and the Y-axis semiconductor strain gauge B12b are respectively attached to the outer surfaces of the X-axis low-rigidity flexible hinge A8a and the X-axis low-rigidity flexible hinge B8b, and are used to detect the X-axis micro-assembly force exerted on the micro-gripper. The Y-axis semiconductor strain gauge B12b is attached to the outer surfaces of the Y-axis low-rigidity flexible hinges A9a and B9b, respectively, to detect the Y-axis micro-assembly force applied to the microgripper. The third semiconductor strain gauge group includes the Z-axis semiconductor strain gauge A13a and B13b, which are attached to the outer surfaces of the Z-axis low-rigidity flexible hinges A10a and B10b, respectively, to detect the Z-axis micro-assembly force applied to the microgripper. The remaining components and connections are the same as those in the first, second, or third embodiments.

[0049] Specific implementation method five: Combination Figures 1 to 4 To describe this embodiment, the L-shaped columnar elastomer 4 and each high-rigidity flexible hinge in the high-rigidity flexible hinge group are made of photosensitive resin and processed as a single unit using stereolithography. The low-rigidity flexible hinges in the low-rigidity flexible hinge group are made of 704 silicone rubber and processed by room-temperature hygroscopic curing. With this arrangement, the L-shaped columnar elastomer 4 and each high-rigidity flexible hinge are made of photosensitive resin (liquid at room temperature) and processed as a single unit using stereolithography. The photosensitive resin material offers excellent surface finish and dimensional stability, ensuring the overall structural and physical stability of the micromanipulator, facilitating long-term storage and repeated use. Each low-rigidity flexible hinge is made of 704 silicone rubber (liquid at room temperature) and processed by room-temperature hygroscopic curing. 704 silicone rubber has excellent adhesion, high strength, and excellent insulation and aging resistance, making it particularly suitable for bonding high-precision semiconductor strain gauges and protecting them from mechanical damage. Other components and connections are the same as those in Specific Embodiments 1, 2, 3, or 4.

[0050] Specific implementation method six: combination Figures 1 to 4 To explain this embodiment, the vacuum adsorption hole within the L-shaped columnar elastic body 4 has a square cross-section. This arrangement places the geometric center of the L-shaped columnar elastic body 4 within the square cross-section vacuum adsorption hole, ensuring uniform and equal deformation of the L-shaped columnar elastic body 4 when subjected to loads in the x and y directions. The remaining components and connections are identical to those of Embodiments 1, 2, 3, 4, or 5.

[0051] Specific implementation method seven: combination Figures 1 to 4In this embodiment, the outer surface of the L-shaped columnar elastic body 4 is cylindrical. This arrangement facilitates the suction operation of small parts. The other components and connections are the same as those of the first, second, third, fourth, fifth, or sixth embodiments.

[0052] Specific implementation method eight: combination Figures 1 to 4 To describe this embodiment, the hinge grooves of each high-rigidity flexible hinge in the high-rigidity flexible hinge group are semicircular, and each low-rigidity flexible hinge in the low-rigidity flexible hinge group is semi-cylindrical. The semi-cylindrical low-rigidity flexible hinges are coaxially arranged within the corresponding semi-circular grooves. The remaining components and connections are the same as those in Specific Embodiments 1, 2, 3, 4, 5, 6, or 7.

[0053] Specific implementation method nine: combination Figures 1 to 8 In this embodiment, the length of the L-shaped columnar elastic body 4 is represented by l, the width is represented by w, the height is represented by h, the wall thickness of the elastic body is represented by t, and the height of the top cylinder of the elastic body is represented by h. c Expressed as: t = 5w / 12; h c =h / 5; l=16h / 25; the radius of the semicircular groove of the high-rigidity flexible hinge is r, the height of Y-axis high-rigidity flexible hinge A6a or Y-axis high-rigidity flexible hinge B6b from the base 1 is h1, the height of X-axis high-rigidity flexible hinge A5a or X-axis high-rigidity flexible hinge B5b from Y-axis high-rigidity flexible hinge A6a or Y-axis high-rigidity flexible hinge B6b from the base 1 is h2, and the length of Z-axis high-rigidity flexible hinge A7a or Z-axis high-rigidity flexible hinge B7b from the load application center is l1. Therefore, h1=2r; h2=9r / 4; l1=6r. Other components and connection relationships are the same as those in Specific Embodiments 1, 2, 3, 4, 5, 6, 7, or 8.

[0054] Specific implementation method ten: Combination Figures 1 to 8 This embodiment describes a micro-gripper assembly micro-force sensing method. Taking the shaft-hole assembly experiment of a micro-axis part and a fixed micro-hole as an example, the micro-gripper assembly micro-force sensing method is implemented by the described operation-sensing integrated vacuum adsorption micro-gripper based on a dual-material flexible hinge group. The specific steps are as follows:

[0055] Step 1: Adsorb the target parts:

[0056] Use a vacuum hose to connect the pneumatic interface 2 of the base 1 in the micro-gripper to the pneumatic control system. Apply vacuum negative pressure through the pneumatic control system, and the micro-gripper approaches the target micro-axis part. The upper computer controls the opening of the air circuit to achieve the adsorption operation of the micro-axis part.

[0057] Step 2: Assemble the micro-axis and micro-hole:

[0058] The micro-gripper absorbs the micro-axis component and contacts the fixed micro-hole. The assembly force between the micro-axis and the micro-hole causes the L-shaped columnar elastic body 4 to deform, and the semiconductor strain gauge attached to the surface of the L-shaped columnar elastic body 4 is deformed accordingly.

[0059] Step 3: Get the voltage value of each channel:

[0060] Due to the piezoresistive effect, the deformation of the semiconductor strain gauge will produce a resistance change, which is connected to the Wheatstone bridge and outputs the voltage value of each channel after circuit processing;

[0061] Step 4: Calculate the assembly force on the end of the micro gripper:

[0062] The voltage value of each channel is multiplied by the calibration matrix obtained by the calibration method, and the assembly force exerted on the end of the micro-gripper is calculated by the host computer.

[0063] The other components and connection relationships are the same as those in the first, second, third, fourth, fifth, sixth, seventh, eighth or ninth embodiment.

[0064] In this embodiment, when the end of the micro-gripper is subjected to the positive X-axis micro-assembly force F x When deformation occurs, the X-axis high-rigidity flexible hinge A5a is stretched, which in turn stretches the X-axis low-rigidity flexible hinge A8a. The X-axis semiconductor strain gauge A11a attached to the X-axis low-rigidity flexible hinge A8a is stretched, and its resistance increases. On the other side, the X-axis high-rigidity flexible hinge B5b is compressed, which in turn compresses the X-axis low-rigidity flexible hinge B8b. The X-axis semiconductor strain gauge B11b attached to the X-axis low-rigidity flexible hinge B8b is compressed, and its resistance decreases.

[0065] When the end of the micro gripper is subjected to the positive Y-axis micro assembly force F y When deformation occurs, the Y-axis high-rigidity flexible hinge A6a is stretched, which in turn stretches the Y-axis low-rigidity flexible hinge A9a. The Y-axis semiconductor strain gauge A12a attached to the Y-axis low-rigidity flexible hinge A9a is stretched, and its resistance increases. On the other side, the Y-axis high-rigidity flexible hinge B6b is compressed, which in turn compresses the Y-axis low-rigidity flexible hinge B9b. The Y-axis semiconductor strain gauge B12b attached to the Y-axis low-rigidity flexible hinge B9b is compressed, and its resistance decreases.

[0066] When the end of the micro gripper is subjected to the positive Z-axis micro assembly force F z When deformation occurs, the Z-axis high-rigidity flexible hinge A7a is stretched, which in turn stretches the Z-axis low-rigidity flexible hinge A10a. The Z-axis semiconductor strain gauge A13a attached to the Z-axis low-rigidity flexible hinge A10a is stretched, and its resistance increases. On the other side, the Z-axis high-rigidity flexible hinge B7b is compressed, which in turn compresses the Z-axis low-rigidity flexible hinge B10b. The Z-axis semiconductor strain gauge B13b attached to the Z-axis low-rigidity flexible hinge B10b is compressed, and its resistance decreases.

[0067] So far, the output signal distributions of the X-axis semiconductor strain gauge A11a, X-axis semiconductor strain gauge B11b, Y-axis semiconductor strain gauge A12a, Y-axis semiconductor strain gauge B12b, Z-axis semiconductor strain gauge A13a, and Z-axis semiconductor strain gauge B13b in the micro-gripper under X, Y, and Z-axis loads are obtained. and The signal distribution of the semiconductor strain gauge in the micro-gripper under various loads is shown in Table 1.

[0068] Table 1 Signal distribution of semiconductor strain gauges in the micro-gripper under various loads

[0069]

[0070] Under the action of the Wheatstone bridge excitation voltage E, the output voltage U of each bridge is collected Fx 、U Fy and U Fz The collected voltage signal is input into the signal processing unit, and then processed by the signal amplifier, filter, A / D converter, and processing module. The strain signal of the semiconductor strain gauge is finally converted into the load value of the micro-gripper. The host computer analyzes and applies this value. The simplified calculation method of the Wheatstone bridge can be used to obtain the output voltage formula of each channel:

[0071]

[0072] Where K is the sensitivity coefficient of the semiconductor strain gauge, and E is the Wheatstone bridge excitation voltage;

[0073] The output signals in Table 1 and Substituting the above channel output voltage formula, we can get the voltage channel output value U of the micro gripper under the above loads. Fx 、U Fy and U Fz , as shown in Table 2.

[0074] Table 2 Voltage channel output of micro-gripper under various loads

[0075]

[0076] As can be seen from Table 2, when a unidirectional load is applied, the L-shaped columnar elastic body 4 in the micro-gripper has a slight coupling in the Y direction and the Z direction. After calibration and decoupling, it can be used normally. and Finally, the three-dimensional assembly force F acting on the micro-manipulation tool can be calculated based on the existing multi-dimensional force sensor decoupling method. x 、F y and Fz For example, the Chinese patent application number 201010168331.8, entitled Multi-dimensional force sensor decoupling method based on coupling error modeling, discloses the decoupling method, which will not be described in detail here.

[0077] In this embodiment, the pneumatic control system includes a control unit and a vacuum system. The vacuum system includes a pressure source, an air filter, a pressure regulating valve, a switch 1, a vacuum generator, and a switch 2. The vacuum generator outlet is connected, the vacuum generator inlet is connected to the air filter outlet via a vacuum hose, and the air filter inlet is connected to the pressure source via a vacuum hose. The vacuum hose between the vacuum generator and the air filter is provided with a pressure regulating valve and a switch 1, sequentially from the air inlet to the air outlet. The vacuum generator is connected to positive and negative air pressure regulating pipelines, each of which is provided with a switch 1. The control unit includes a host computer and a controller. The controller is connected to the host computer via wires, and the controller is connected to the pressure regulating valve, switch 1, and switch 2 via three wires, respectively. Switch 1 is used to control the air flow of the vacuum system. When switch 1 is open, the air flow is connected. Switch 2 is used to control the positive and negative pressure of the vacuum system. When switch 2 is open, the air flow is negative. The controller controls the closing of switches 1 and 2, thereby operating the microgripper for negative pressure suction.

[0078] In this embodiment, the microgripper's three-dimensional microassembly force measurement is achieved using semiconductor strain gauges and a bridge circuit. Two strain gauges, paired with two precision resistors, form a half-bridge circuit to measure microassembly force in one dimension. The present invention utilizes six semiconductor strain gauges, forming three half-bridge circuits. By measuring the output voltage of each bridge circuit and performing calibration and decoupling, the three-dimensional microassembly force can be calculated.

[0079] The X-axis semiconductor strain gauge A11a and the X-axis semiconductor strain gauge B11b are grouped together with the precision resistor R1 and the precision resistor R2 to form a half-bridge circuit 1 for measuring the X-axis micro-assembly force F exerted on the micro-gripper. x Due to mechanical deformation and the symmetry of the semiconductor strain gauges, the resistance change, ΔR, is nearly equal. When bridging, the X-axis semiconductor strain gauge A11a and the X-axis semiconductor strain gauge B11b are placed on adjacent sides of the Wheatstone bridge. Precision resistors R1 and R2, both of equal resistance, form an adjacent half-bridge.

[0080] The Y-axis semiconductor strain gauge A12a and the Y-axis semiconductor strain gauge B12b are grouped together with the precision resistor R3 and the precision resistor R4 to form a half-bridge circuit 2 for measuring the Y-axis micro-assembly force F exerted on the micro-gripper. yDue to mechanical deformation and the symmetry of the semiconductor strain gauges, the resistance change, ΔR, is nearly equal. When assembling a bridge, the Y-axis semiconductor strain gauge A12a and the Y-axis semiconductor strain gauge B12b are placed on adjacent sides of the Wheatstone bridge. Precision resistors R3 and R4, both of equal resistance, together form an adjacent half-bridge.

[0081] The Z-axis semiconductor strain gauge A13a and the Z-axis semiconductor strain gauge B13b are grouped together with the precision resistor R5 and the precision resistor R6 to form a half-bridge circuit 3 for measuring the Z-axis micro-assembly force F exerted on the micro-gripper. z Due to mechanical deformation and the symmetry of the semiconductor strain gauges, the resistance changes, ΔR, are nearly equal. When bridging, Z-axis semiconductor strain gauges A13a and B13b are placed on adjacent sides of the Wheatstone bridge. Precision resistors R5 and R6, both of equal resistance, form an adjacent half-bridge.

[0082] The following simulation test comparison is used to demonstrate the excellent performance of the micro-gripper of the present invention in micro-assembly force sensing.

[0083] The thin-walled cylindrical elastomer used for comparison (hereinafter referred to as the comparative example elastomer) has the same overall structure as the present invention, except that it is not modified by the flexible hinge group of two materials. The rest of the structure is the same as the present invention, including the placement of the strain gauge. The specific parameters are shown in Table 3. The structures of the elastomer of the present invention and the comparative example used for finite element analysis are shown in Table 3. Figure 4 As shown (to indicate the size parameters, the low-rigidity flexible hinge groups are hidden).

[0084] Table 3 Elastomer size parameters

[0085]

[0086] The elastic properties of the two structures were tested using the finite element analysis software ANSYS. In the test, the same force was applied to both. The simulation test results were obtained by the simulation software ANSYS analysis, such as Figure 5-10 The main data obtained are listed in Table 4.

[0087] Table 4 Main simulation results

[0088] Applied force Elastomer of comparative example Elastomer of the present invention Multiple relationship <![CDATA[F x =1mN]]> <![CDATA[1.7505×e -7 ]]> <![CDATA[3.8727×e -6 ]]> 22.123 <![CDATA[F y =1mN]]> <![CDATA[2.6619×e -7 ]]> <![CDATA[4.8450×e -6 ]]> 18.201 <![CDATA[F z =1mN]]> <![CDATA[1.2140×e -7 ]]> <![CDATA[2.6118×e -6 ]]> 21.514

[0089] The following is a detailed analysis of each figure to compare the performance of the two.

[0090] By observation Figure 9 and Figure 10 It can be seen that: under the influence of F xWhen the force is applied, the hollow cylindrical elastic body of the micro-gripper of the present invention has almost the same deformation law as the cylindrical elastic body of the comparative example. x =1mN, the average strain of the columnar elastic body of the comparative example at the X-axis semiconductor strain gauge attachment point is: 1.7505×e -7 The average strain of the hollow cylindrical elastic body of the micro-gripper of the present invention at the X-axis semiconductor strain gauge is: 3.8727×e -6 Since the average strain at the target location of the elastic structure of the present invention is 22.123 times that of the elastic structure of the comparative example, it can be said that the elastic structure of the comparative example has the same performance as the elastic structure of the present invention under the condition of 22.123 times the applied force. Therefore, under the premise of ensuring the yield strength, the hollow cylindrical elastic body of the micro-gripper of the present invention is 22.123 times more sensitive than the elastic structure of the comparative example.

[0091] By observation Figure 11 and Figure 12 It can be seen that: under the influence of F y When the force is applied, the hollow cylindrical elastic body of the micro-gripper of the present invention has almost the same deformation law as the cylindrical elastic body of the comparative example. y =1mN, the average strain of the columnar elastic body of the comparative example at the Y-direction semiconductor strain gauge attachment point is: 2.6619×e -7 The average strain of the hollow cylindrical elastic body of the micro-gripper of the present invention at the Y-direction semiconductor strain gauge is: 4.8450×e -6 Since the average strain at the target location of the elastomeric structure of the present invention is 18.201 times that of the comparative elastomeric structure, it can be said that the comparative elastomeric structure has the same performance as the elastomeric structure of the present invention under the condition of 18.201 times the applied force. Therefore, under the premise of ensuring the yield strength, the hollow cylindrical elastomer of the microgripper of the present invention has an 18.201-fold improvement in sensitivity compared to the comparative elastomeric structure.

[0092] By observation Figure 13 and Figure 14 It can be seen that: under the influence of F z When the force is applied, the hollow cylindrical elastic body of the micro-gripper of the present invention has almost the same deformation law as the cylindrical elastic body of the comparative example. z =1mN, the average strain of the columnar elastic body of the comparative example at the Z-direction semiconductor strain gauge attachment point is: 1.2140×e -7 The average strain of the hollow cylindrical elastic body of the micro-gripper of the present invention at the Z-direction semiconductor strain gauge is: 2.6118×e -6Since the average strain at the target location of the elastomeric structure of the present invention is 21.514 times that of the comparative elastomeric structure, it can be said that the comparative elastomeric structure has the same performance as the elastomeric structure of the present invention under the condition of 21.514 times the applied force. Therefore, under the premise of ensuring the yield strength, the hollow cylindrical elastomer of the microgripper of the present invention is 21.514 times more sensitive than the comparative elastomeric structure.

[0093] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A vacuum adsorption micro-gripper based on a dual-material flexible hinge assembly, characterized by: The micro-gripper comprises a base (1), an L-shaped columnar elastic body (4), a high-rigidity flexible hinge group, a low-rigidity flexible hinge group and a semiconductor strain gauge assembly; the base (1) is a rectangular block structure, and four base mounting holes arranged opposite to each other are respectively provided on the left and right sides, and the base mounting holes pass through the upper and lower end surfaces of the base; the L-shaped columnar elastic body (4) is a square columnar thin-walled structure, and a vacuum adsorption hole is provided at the geometric center of the L-shaped columnar elastic body (4), and the vacuum adsorption hole passes through the surfaces of the first and second ends of the elastic body. The L-shaped columnar elastic body (4) and the base (1) are integrally processed by a stereolithography method, a pneumatic interface (2) is provided at the center of the front end surface of the base (1), and a base pneumatic pipeline is provided inside the base (1), and both ends of the base pneumatic pipeline are respectively connected to the pneumatic interface (2) and the vacuum adsorption hole; the high-rigidity flexible hinge group and the L-shaped columnar elastic body (4) are integrally processed by a stereolithography method; the high-rigidity flexible hinge group includes a first group of high-rigidity flexible hinges, a second group of high-rigidity flexible hinges and a third group of high-rigidity flexible hinges. Three groups of high-rigidity flexible hinges, the first group of high-rigidity flexible hinges and the second group of high-rigidity flexible hinges are sequentially arranged from top to bottom on the surface of the "|" segment of the L-shaped column elastic body (4) to form a staggered hinge structure together, and the third group of high-rigidity flexible hinges is arranged on the surface of the "_" segment of the L-shaped column elastic body (4); the low-rigidity flexible hinge group includes the first group of low-rigidity flexible hinges, the second group of low-rigidity flexible hinges and the third group of low-rigidity flexible hinges, the first group of low-rigidity flexible hinges, the second group of low-rigidity flexible hinges The chain and the third group of low-rigidity flexible hinges are respectively adhered to the hinge grooves of the first group of high-rigidity flexible hinges, the second group of high-rigidity flexible hinges and the third group of high-rigidity flexible hinges; the semiconductor strain gauge assembly includes a first semiconductor strain gauge group, a second semiconductor strain gauge group and a third semiconductor strain gauge group, and the first semiconductor strain gauge group, the second semiconductor strain gauge group and the third semiconductor strain gauge group are respectively attached to the outer surfaces of the first group of low-rigidity flexible hinges, the second group of low-rigidity flexible hinges and the third group of low-rigidity flexible hinges.

2. The vacuum adsorption micro-gripper based on a dual-material flexible hinge assembly according to claim 1, characterized in that: The first group of high-rigidity flexible hinges includes an X-axis high-rigidity flexible hinge A (5a) and an X-axis high-rigidity flexible hinge B (5b), and the X-axis high-rigidity flexible hinge A (5a) and the X-axis high-rigidity flexible hinge B (5b) are symmetrically arranged on the surface of the "|" segment of the L-shaped columnar elastic body (4), and the symmetry axis is perpendicular to the X-axis of the micro-gripper; the second group of high-rigidity flexible hinges includes a Y-axis high-rigidity flexible hinge A (6a) and a Y-axis high-rigidity flexible hinge B (6b), and the Y-axis high-rigidity flexible hinge A (6 a) and the Y-axis high-rigidity flexible hinge B (6b) are symmetrically arranged on the surface of the "|" segment of the L-shaped columnar elastic body (4), and the symmetry axis is perpendicular to the Y-axis of the micro-gripper; the third group of high-rigidity flexible hinges includes a Z-axis high-rigidity flexible hinge A (7a) and a Z-axis high-rigidity flexible hinge B (7b), and the Z-axis high-rigidity flexible hinge A (7a) and the Z-axis high-rigidity flexible hinge B (7b) are symmetrically arranged on the surface of the "_" segment of the L-shaped columnar elastic body (4), and the symmetry axis is perpendicular to the Z-axis of the micro-gripper.

3. The vacuum adsorption micro-gripper based on a dual-material flexible hinge assembly according to claim 2, characterized in that: The first group of low-rigidity flexible hinges includes an X-axis low-rigidity flexible hinge A (8a) and an X-axis low-rigidity flexible hinge B (8b), and the X-axis low-rigidity flexible hinge A (8a) and the X-axis low-rigidity flexible hinge B (8b) are respectively adhered to the hinge grooves of the X-axis high-rigidity flexible hinge A (5a) and the X-axis high-rigidity flexible hinge B (5b); the second group of low-rigidity flexible hinges includes a Y-axis low-rigidity flexible hinge A (9a) and a Y-axis low-rigidity flexible hinge B (9b), and the Y-axis low-rigidity flexible hinge A (9a) and the Y-axis high-rigidity flexible hinge B (9b) are respectively adhered to the hinge grooves of the X-axis high-rigidity flexible hinge A (5a) and the X-axis high-rigidity flexible hinge B (5b). The Y-axis low-rigidity flexible hinge B (9b) is adhered to the hinge grooves of the Y-axis high-rigidity flexible hinge A (6a) and the Y-axis high-rigidity flexible hinge B (6b) respectively; the third group of low-rigidity flexible hinges includes the Z-axis low-rigidity flexible hinge A (10a) and the Z-axis low-rigidity flexible hinge B (10b), and the Z-axis low-rigidity flexible hinge A (10a) and the Z-axis low-rigidity flexible hinge B (10b) are adhered to the hinge grooves of the Z-axis high-rigidity flexible hinge A (7a) and the Z-axis high-rigidity flexible hinge B (7b) respectively.

4. The vacuum adsorption micro-gripper based on a dual-material flexible hinge assembly according to claim 3, characterized in that: The first semiconductor strain gauge group includes an X-axis semiconductor strain gauge A (11a) and an X-axis semiconductor strain gauge B (11b), wherein the X-axis semiconductor strain gauge A (11a) and the X-axis semiconductor strain gauge B (11b) are respectively attached to the outer surfaces of the X-axis low-rigidity flexible hinge A (8a) and the X-axis low-rigidity flexible hinge B (8b), and are used to detect the X-axis micro-assembly force exerted on the micro-gripper; The second semiconductor strain gauge group includes a Y-axis semiconductor strain gauge A (12a) and a Y-axis semiconductor strain gauge B (12b), wherein the Y-axis semiconductor strain gauge A (12a) and the Y-axis semiconductor strain gauge B (12b) are respectively attached to the outer surfaces of the Y-axis low-rigidity flexible hinge A (9a) and the Y-axis low-rigidity flexible hinge B (9b), and are used to detect the Y-axis micro-assembly force exerted on the micro-gripper; The third semiconductor strain gauge group includes a Z-axis semiconductor strain gauge A (13a) and a Z-axis semiconductor strain gauge B (13b). The Z-axis semiconductor strain gauge A (13a) and the Z-axis semiconductor strain gauge B (13b) are respectively attached to the outer surfaces of the Z-axis low-rigidity flexible hinge A (10a) and the Z-axis low-rigidity flexible hinge B (10b), and are used to detect the Z-direction micro-assembly force exerted on the micro-gripper.

5. The vacuum adsorption micro-gripper based on a dual-material flexible hinge assembly according to claim 4, characterized in that: The L-shaped columnar elastic body (4) and each high-rigidity flexible hinge in the high-rigidity flexible hinge group are made of photosensitive resin and are processed as a whole by a stereoscopic light-curing molding method; each low-rigidity flexible hinge in the low-rigidity flexible hinge group is made of 704 silicone rubber and is processed by a room-temperature moisture absorption and curing method.

6. The vacuum adsorption micro-gripper based on a dual-material flexible hinge assembly according to claim 1, 2 or 5, characterized in that: The cross section of the vacuum adsorption hole inside the L-shaped columnar elastic body (4) is square.

7. The vacuum adsorption micro-gripper based on a dual-material flexible hinge assembly according to claim 6, characterized in that: The outer surface of the end of the L-shaped columnar elastic body (4) is cylindrical.

8. The vacuum adsorption micro-gripper based on a dual-material flexible hinge assembly according to claim 7, characterized in that: The hinge grooves of each high-rigidity flexible hinge in the high-rigidity flexible hinge group are all semicircular grooves, and each low-rigidity flexible hinge in the low-rigidity flexible hinge group is semi-cylindrical. The semi-cylindrical low-rigidity flexible hinges are coaxially arranged in the corresponding semicircular grooves.

9. The vacuum adsorption micro-gripper based on a dual-material flexible hinge assembly according to claim 8, characterized in that: The length of the L-shaped columnar elastic body (4) is represented by l, the width is represented by w, the height is represented by h, the wall thickness of the elastic body is represented by t, and the height of the top cylinder of the elastic body is represented by h. c Expressed as: t = 5w / 12; h c =h / 5; l=16h / 25; the radius of the semicircular groove of the high-rigidity flexible hinge is r, the height of the Y-axis high-rigidity flexible hinge A (6a) or the Y-axis high-rigidity flexible hinge B (6b) from the base (1) is h1, the height of the X-axis high-rigidity flexible hinge A (5a) or the X-axis high-rigidity flexible hinge B (5b) from the Y-axis high-rigidity flexible hinge A (6a) or the Y-axis high-rigidity flexible hinge B (6b) is h2, and the length of the Z-axis high-rigidity flexible hinge A (7a) or the Z-axis high-rigidity flexible hinge B (7b) from the load application center is l1, then: h1=2r; h2=9r / 4; l1=6r.

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