A particle size detection method

Abstract

The present application provides a particle size detection method, which relates to the technical field of defect detection. This particle size detection method uses the same reflecting moving mirror to simultaneously participate in the detection of the first surface and the second surface of the workpiece to be detected. By switching the working angle of the reflecting moving mirror, only one camera is needed to complete the shooting of the first surface and the second surface of the workpiece to be detected, effectively simplifying the detection optical path and reducing the cost. Moreover, when the workpiece to be detected enters and exits the plate, there will be processes of deceleration, stop, and acceleration. As long as the rotation timing of the reflecting moving mirror is set when the workpiece to be detected stops, the rotation of the reflecting moving mirror can be skillfully integrated into the movement process of the workpiece to be detected, thus not increasing the overall time consumption of the detection process.

Description

Technical Field

[0001] This application relates to the technical field of defect detection, and more particularly, to a method for detecting granularity. Background Art

[0002] With the development of integrated circuit technology, photolithography technology, as a core and key process of integrated circuits, is one of the most advanced technologies in the semiconductor industry. As an indispensable and important carrier in the photolithography process, the mask plate bears the circuit pattern of the chip design on its surface, which is transferred to the silicon wafer through the photolithography / etching process. Therefore, the surface quality of the mask plate will directly affect the quality of the pattern on the silicon wafer, and further affect the final chip function and performance, as well as the semiconductor production yield.

[0003] After being used multiple times, the mask plate may be contaminated with particles or scratched due to problems such as non-standard design and non-compliant personnel operation. Therefore, it is particularly important to perform granularity detection on the mask plate before the photolithography process starts. This detection can not only timely detect the particles or scratches on the surface of the mask plate, but also effectively prevent the impact of these problems on the subsequent process. However, the existing granularity detection methods require two cameras to separately capture the upper and lower surfaces of the mask plate, and their detection optical paths are relatively complex and the cost is relatively high. Summary of the Invention

[0004] The purpose of this application is to provide a method for detecting granularity, which can simplify the detection optical path, reduce the cost, and at the same time does not increase the overall time consumption of the detection process, aiming at the deficiencies in the above-mentioned existing technologies.

[0005] To achieve the above purpose, the technical solutions adopted in the embodiments of this application are as follows:

[0006] The embodiments of this application provide a method for detecting granularity, including:

[0007] Place the part to be detected on the stage, turn on the first light source and the camera, and adjust the reflecting movable mirror to the first working angle;

[0008] Drive the stage to move from the initial position to the stop position. The first light source emits a first light beam to the first surface of the part to be detected. As the part to be detected moves, the first light beam sequentially irradiates different regions on the first surface;

[0009] Direct the first light beam reflected from the first surface to the reflecting movable mirror, and then enter the camera after being reflected by the reflecting movable mirror;

[0010] Control the camera to capture the first surface at the first preset frequency to obtain multiple first sub-images of the first surface until the stage reaches the stop position;

[0011] Adjust the reflecting movable mirror to the second working angle and turn on the second light source;

[0012] The driving stage moves from the stop position to the initial position, and the second light source emits a second light beam towards the second surface of the workpiece to be detected. As the workpiece to be detected moves, the second light beam sequentially irradiates different regions on the second surface;

[0013] The second light beam reflected by the second surface is directed towards the reflecting moving mirror, and then enters the camera after being reflected by the reflecting moving mirror;

[0014] Control the camera to take pictures of the second surface at a second preset frequency to obtain multiple second sub-images of the second surface until the stage reaches the initial position;

[0015] Obtain the particle images on the first sub-image and the second sub-image, and perform algorithm analysis on the particle images to determine whether the particles corresponding to the particle images are defects.

[0016] Optionally, the driving stage moving from the initial position to the stop position includes:

[0017] Control the stage motor to actuate, so as to drive the stage connected to the stage motor to move in a direction parallel to the first surface of the workpiece to be detected, and make the workpiece to be detected move from the initial position to the stop position;

[0018] Adjusting the reflecting moving mirror to the second working angle includes:

[0019] Control the reflecting moving mirror motor to actuate, so as to drive the reflecting moving mirror connected to the reflecting moving mirror motor to adjust to the second working angle;

[0020] The driving stage moving from the stop position to the initial position includes:

[0021] Control the stage motor to actuate, so as to drive the stage to move in a direction parallel to the first surface of the workpiece to be detected, and make the workpiece to be detected move from the stop position to the initial position.

[0022] Optionally, placing the workpiece to be detected on the stage, turning on the first light source and the camera, and adjusting the reflecting moving mirror to the first working angle includes:

[0023] Place the workpiece to be detected on the stage, turn on the first light source and the camera, and electrically connect the camera to the encoder of the stage motor, so that the camera can obtain the encoder signal sent by the encoder, and adjust the reflecting moving mirror to the first working angle;

[0024] Controlling the camera to take pictures of the first surface at a first preset frequency to obtain multiple first sub-images of the first surface until the stage reaches the stop position includes:

[0025] Control the camera to take a picture of the first surface once when receiving a first preset number of encoder signals, and repeat the above shooting process until the stage reaches the stop position to obtain multiple first sub-images of the first surface.

[0026] Controlling the camera to capture the second surface at a second preset frequency to obtain multiple second sub-images of the second surface until the stage reaches the initial position includes:

[0027] Controlling the camera to capture the second surface once when receiving a second preset number of encoder signals, and repeating the above capture process until the stage reaches the initial position to obtain multiple second sub-images of the second surface.

[0028] Optionally, the granularity detection method includes:

[0029] Placing the workpiece to be detected on the stage, turning on the first light source, the board-in sensor and the camera, and adjusting the reflecting movable mirror to the first working angle. Among them, the board-in sensor is electrically connected to the camera, and the board-in sensor is used to detect the position of the workpiece to be detected when the workpiece to be detected moves from the initial position to the stop position;

[0030] Driving the stage to move from the initial position to the stop position, controlling the board-in sensor to send a first board-in position signal to the camera, and the first light source to emit a first light beam to the first surface of the workpiece to be detected. As the workpiece to be detected moves, the first light beam is sequentially irradiated on different regions of the first surface;

[0031] Directing the first light beam reflected by the first surface to the reflecting movable mirror, and then entering the camera after being reflected by the reflecting movable mirror;

[0032] Controlling the camera to capture the first surface at a first preset frequency after receiving the first board-in position signal to obtain multiple first sub-images of the first surface until the stage reaches the stop position;

[0033] After the stage moves to the stop position, controlling the board-in sensor to send a second board-in position signal to the camera;

[0034] Controlling the camera to stop capturing the first surface of the workpiece to be detected after receiving the second board-in position signal;

[0035] Adjusting the reflecting movable mirror to the second working angle, and turning on the second light source and the board-out sensor. Among them, the board-out sensor is electrically connected to the camera, and the board-out sensor is used to detect the position of the workpiece to be detected when the workpiece to be detected moves from the stop position to the initial position;

[0036] Driving the stage to move from the stop position to the initial position, controlling the board-out sensor to send a first board-out position signal to the camera, and the second light source to emit a second light beam to the second surface of the workpiece to be detected. As the workpiece to be detected moves, the second light beam is sequentially irradiated on different regions of the second surface;

[0037] Directing the second light beam reflected by the second surface to the reflecting movable mirror, and then entering the camera after being reflected by the reflecting movable mirror;

[0038] Control the camera to take pictures of the second surface at a second preset frequency after receiving the first out-board position signal, so as to obtain multiple second sub-images of the second surface until the stage reaches the initial position;

[0039] After the stage moves to the initial position, control the out-board sensor to send a second out-board position signal to the camera;

[0040] Control the camera to stop taking pictures of the second surface of the workpiece to be detected after receiving the second out-board position signal;

[0041] Obtain the particle images on the first sub-image and the second sub-image, and perform algorithm analysis on the particle images to determine whether the particles corresponding to the particle images are defects.

[0042] Optionally, place the workpiece to be detected on the stage, turn on the first light source, the in-board sensor and the camera, and adjust the reflecting mirror to the first working angle. Among them, the in-board sensor is electrically connected to the camera, and the in-board sensor is used to detect the position of the workpiece to be detected when the workpiece to be detected moves from the initial position to the stop position, including:

[0043] Place the workpiece to be detected on the stage, turn on the first light source, the in-board sensor, the camera and the control component, and adjust the reflecting mirror to the first working angle. Among them, the in-board sensor is electrically connected to the camera through the control component, the in-board sensor is used to detect the position of the workpiece to be detected when the workpiece to be detected moves from the initial position to the stop position, and the control component is also electrically connected to the reflecting mirror motor;

[0044] Adjusting the reflecting mirror to the second working angle includes:

[0045] After the control component receives the second in-board position signal, control the reflecting mirror motor to act to drive the reflecting mirror to switch from the first working angle to the second working angle.

[0046] Optionally, the particle size detection method further includes:

[0047] Turn on the film body detection sensor. Among them, the film body detection sensor is electrically connected to the stage motor, and the film body detection sensor is used to detect whether the second surface of the workpiece to be detected is covered with a dust-proof film, and the stage motor is used to drive the stage to move in a direction perpendicular to the first surface;

[0048] Before driving the stage to move from the stop position to the initial position, the particle size detection method further includes:

[0049] Control the film body detection sensor to detect the second surface. If the film body detection sensor detects that the second surface is covered with a dust-proof film, control the film body detection sensor to send a film body presence signal to the stage motor;

[0050] After receiving the film body presence signal, the stage motor drives the stage to move a preset distance in the direction of the first surface.

[0051] Optionally, the particle size detection method further includes:

[0052] Turn on the limit position detection sensor, where the limit position detection sensor is electrically connected to the stage motor, and the limit position detection sensor is used to detect the position of the workpiece to be detected;

[0053] The stage motor drives the stage to move a preset distance in the direction of the first surface after receiving the film body presence signal, including:

[0054] The stage motor drives the stage to move a preset distance in the direction of the first surface after receiving the film body presence signal. During this period, if the limit position detection sensor detects that the workpiece to be detected has reached the limit position, a stop signal is sent to the stage motor;

[0055] The stage motor stops driving the stage to continue moving after receiving the stop signal.

[0056] Optionally, the first light source emits a first light beam to the first surface of the workpiece to be detected, including:

[0057] The first light source emits a first light beam to the first surface of the workpiece to be detected, and the first light beam irradiates on the first surface of the workpiece to be detected after passing through the first semi-transparent and semi-reflective mirror;

[0058] Directing the first light beam reflected by the first surface to the movable reflecting mirror includes:

[0059] The first light beam is reflected by the first surface, the first semi-transparent and semi-reflective mirror and the first reflecting mirror in sequence, and then directed to the movable reflecting mirror;

[0060] The second light source emits a second light beam to the second surface of the workpiece to be detected, including:

[0061] The second light source emits a second light beam to the second surface of the workpiece to be detected, and the second light beam irradiates on the second surface of the workpiece to be detected after passing through the second semi-transparent and semi-reflective mirror;

[0062] Directing the second light beam reflected by the second surface to the movable reflecting mirror includes:

[0063] The second light beam is reflected by the second surface, the second semi-transparent and semi-reflective mirror and the second reflecting mirror in sequence, and then directed to the movable reflecting mirror.

[0064] Optionally, directing the first light beam reflected by the first surface to the movable reflecting mirror, and then entering the camera after being reflected by the movable reflecting mirror, includes:

[0065] Directing the first light beam reflected by the first surface to the movable reflecting mirror, then being reflected by the movable reflecting mirror and directed to the focusing lens group, and entering the camera after being focused by the focusing lens group;

[0066] Direct the second light beam reflected by the second surface towards the movable reflecting mirror, and after being reflected by the movable reflecting mirror, enter the camera, including:

[0067] Direct the second light beam reflected by the second surface towards the movable reflecting mirror, and after being reflected by the movable reflecting mirror, direct it towards the focusing lens group, and after being focused by the focusing lens group, enter the camera.

[0068] Optionally, turn on the control component. Among them, the board feeding sensor is electrically connected to the camera through the control component, and the control component is also electrically connected to the movable reflecting mirror motor, including:

[0069] Turn on the host computer and the slave computer. Among them, the host computer is electrically connected to the slave computer, the board feeding sensor is electrically connected to the camera through the slave computer, and the slave computer is also electrically connected to the movable reflecting mirror motor;

[0070] Adjust the movable reflecting mirror to the second working angle, including:

[0071] After the slave computer receives the second board feeding position signal, it sends the second board feeding position signal to the host computer, and the host computer sends a rotation control instruction to the slave computer after receiving the second board feeding position signal;

[0072] After the slave computer receives the rotation control instruction, it controls the movable reflecting mirror motor to act, so as to drive the movable reflecting mirror to switch from the first working angle to the second working angle.

[0073] The beneficial effects of this application include:

[0074] The present application provides a particle size detection method, including: placing a workpiece to be detected on a stage, turning on a first light source and a camera, and adjusting a reflecting movable mirror to a first working angle; driving the stage to move from an initial position to a stop position, the first light source emitting a first light beam to a first surface of the workpiece to be detected, and as the workpiece to be detected moves, the first light beam sequentially irradiates different regions on the first surface; reflecting the first light beam reflected by the first surface to the reflecting movable mirror, and then entering the camera after being reflected by the reflecting movable mirror; controlling the camera to take pictures of the first surface at a first preset frequency to obtain multiple first sub-images of the first surface until the stage reaches the stop position; adjusting the reflecting movable mirror to a second working angle and turning on a second light source; driving the stage to move from the stop position to the initial position, the second light source emitting a second light beam to a second surface of the workpiece to be detected, and as the workpiece to be detected moves, the second light beam sequentially irradiates different regions on the second surface; reflecting the second light beam reflected by the second surface to the reflecting movable mirror, and then entering the camera after being reflected by the reflecting movable mirror; controlling the camera to take pictures of the second surface at a second preset frequency to obtain multiple second sub-images of the second surface until the stage reaches the initial position; obtaining particle images on the first sub-images and the second sub-images, and performing algorithm analysis on the particle images to determine whether the particles corresponding to the particle images are defects. This particle size detection method uses the same reflecting movable mirror to simultaneously participate in the detection of the first surface and the second surface of the workpiece to be detected. By switching the working angle of the reflecting movable mirror, only one camera can complete the work of taking pictures of the first surface and the second surface of the workpiece to be detected, effectively simplifying the detection optical path and reducing the cost. Moreover, when the workpiece to be detected enters and exits the board, there will be processes of deceleration, stop and acceleration. As long as the rotation timing of the reflecting movable mirror is set when the workpiece to be detected stops, the rotation of the reflecting movable mirror can be cleverly integrated into the movement process of the workpiece to be detected, thus not increasing the overall time consumption of the detection process. BRIEF DESCRIPTION OF THE DRAWINGS

[0075] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0076] Figure 1 It is one of the flowcharts of the particle size detection method provided by the embodiment of the present application;

[0077] Figure 2 It is one of the structural schematic diagrams of the particle size detection system used in the particle size detection method provided by the embodiment of the present application;

[0078] Figure 3 It is the second structural schematic diagram of the particle size detection system used in the particle size detection method provided by the embodiment of the present application;

[0079] Figure 4 It is the control logic diagram of the particle size detection method provided by the embodiment of the present application;

[0080] Figure 5 It is the second flowchart of the particle size detection method provided by the embodiment of the present application;

[0081] Figure 6 It is the third flowchart of the particle size detection method provided by the embodiment of the present application;

[0082] Figure 7 It is the comparison diagram of the images taken by the camera when there is and there is no carrier motor encoder signal in the particle size detection method provided by the embodiment of the present application;

[0083] Figure 8a and Figure 8b It is the fourth flowchart of the particle size detection method provided by the embodiment of the present application;

[0084] Figure 9a and Figure 9b It is the fifth flowchart of the particle size detection method provided by the embodiment of the present application;

[0085] Figure 10a and Figure 10b It is the sixth flowchart of the particle size detection method provided by the embodiment of the present application;

[0086] Figure 11 It is the seventh flowchart of the particle size detection method provided by the embodiment of the present application;

[0087] Figure 12a and Figure 12b It is the eighth flowchart of the particle size detection method provided by the embodiment of the present application;

[0088] Figure 13 It is the ninth flowchart of the particle size detection method provided by the embodiment of the present application;

[0089] Figure 14 It is the schematic diagram of the particle size detection method provided by the embodiment of the present application for detecting the first surface of the workpiece to be detected;

[0090] Figure 15 It is the schematic diagram of the particle size detection method provided by the embodiment of the present application for detecting the second surface of the workpiece to be detected;

[0091] Figure 16 It is the tenth flowchart of the particle size detection method provided by the embodiment of the present application.

[0092] Icons: 12 - stage; 13 - first light source; 131 - first light beam; 141 - first semi-transmissive and semi-reflective mirror; 142 - first reflector; 15 - movable reflecting mirror; 151 - first working angle; 152 - second working angle; 16 - second light source; 161 - second light beam; 171 - second semi-transmissive and semi-reflective mirror; 172 - second reflector; 18 - camera; 19 - motor of movable reflecting mirror; 20 - feed-in sensor; 21 - discharge sensor; 22 - film body detection sensor; 23 - limit position detection sensor; 24 - focusing lens group; 100 - workpiece to be detected; V1 - feed-in; V2 - discharge. Detailed implementation manners

[0093] To make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Apparently, the described embodiments are some but not all of the embodiments of the present application. The components of the embodiments of the present application usually described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0094] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed present application, but merely represents selected embodiments of the present application. It should be noted that, without conflict, the various features in the embodiments of the present application can be combined with each other, and the combined embodiments are still within the protection scope of the present application.

[0095] It should be noted that: similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0096] In the description of the present application, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this application is usually placed during use. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present application. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and cannot be understood as indicating or implying relative importance.

[0097] In the description of the present application, it should also be noted that, unless otherwise clearly specified and defined, the terms "arrange", "install", "connect", and "couple" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediate medium, and it may be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0098] Please refer to Figures 1 to 3 , the embodiment of the present application provides a particle size detection method, including:

[0099] S100: Place the part to be detected on the stage, turn on the first light source and the camera, and adjust the reflecting mirror to the first working angle.

[0100] Place the part to be detected 100 on the stage 12, and the stage 12 can drive the part to be detected 100 to move along a preset path. Preferably, the part to be detected 100 is fixed on the stage 12. The part to be detected 100 can be a sheet-like part such as a mask plate, a silicon wafer, a substrate, etc. The part to be detected 100 has opposite first and second surfaces. Generally speaking, one of the first surface and the second surface is the upper surface and the other is the lower surface. After the part to be detected 100 is fixed on the stage 12, it should be ensured that the stage 12 can expose the first surface and the second surface of the part to be detected 100.

[0101] Turn on the first light source 13 and the camera 18. The first light source 13 is used to emit a first light beam 131 to the first surface of the part to be detected 100, and the camera 18 is used to take a picture of the image formed by the first light beam 131 reflected by the first surface and the reflecting mirror 15.

[0102] The reflecting mirror 15 has a first working angle 151 and a second working angle 152. When taking a picture of the first surface of the part to be detected 100, the reflecting mirror 15 is adjusted to the first working angle 151; when taking a picture of the second surface of the part to be detected 100, the reflecting mirror 15 needs to be adjusted to the second working angle 152.

[0103] Exemplarily, the included angle between the first working angle 151 and the second working angle 152 is 90°. When the reflecting mirror 15 is at the first working angle 151, the reflecting surface of the reflecting mirror 15 is tilted upward by 45°; when the reflecting mirror 15 is at the second working angle 152, the reflecting surface of the reflecting mirror 15 is tilted downward by 45°.

[0104] The camera 18 can be a time delay integration camera (TDI camera). A time delay integration camera is a new type of line scan camera that has multiple photosensitive units arranged in parallel on the image sensor perpendicular to the direction of target movement. During image acquisition, the image sensor reads and integrates the image data from each photosensitive unit, and this integration method enhances the effective information. Therefore, even when the light intensity is low, enhancement can be obtained in each integration process. Moreover, the time delay integration camera is suitable for imaging high-speed moving objects and can reduce the time consumption of the particle detection system. Compared with ordinary cameras, the time delay integration camera has advantages such as high sensitivity and wide dynamic range, and can also output signals with high signal-to-noise ratio in low light intensity environments.

[0105] S110: Drive the stage to move from the initial position to the stop position, and the first light source emits a first light beam towards the first surface of the workpiece to be detected. As the workpiece to be detected moves, the first light beam sequentially irradiates different regions on the first surface.

[0106] During the process of the workpiece to be detected 100 moving from the initial position to the stop position (feeding in V1), the light beam emitted by the first light source 13 can irradiate on the first surface of the workpiece to be detected 100. The first surface can be divided into a plurality of sequentially connected first regions along the direction opposite to the moving direction of the workpiece to be detected 100. Due to the limited illumination range of the first light source 13, the first light source 13 can only illuminate part of the first regions. However, as the workpiece to be detected 100 continues to move, the first light source 13 can sequentially illuminate all the first regions.

[0107] S120: Shoot the first light beam reflected by the first surface towards the reflecting moving mirror, and then enter the camera after being reflected by the reflecting moving mirror.

[0108] S130: Control the camera to shoot the first surface at the first preset frequency to obtain multiple first sub-images of the first surface until the stage reaches the stop position.

[0109] The first light beam 131 forms an image in front of the lens of the camera 18, and the camera 18 shoots the image formed by the first light beam 131 reflected by the first surface at the first preset frequency. During the process of the workpiece to be detected 100 moving from the initial position to the stop position, the camera 18 continuously scans and shoots the image formed by the first light beam 131, and each shooting will obtain a first sub-image of the first surface. After the stage 12 reaches the stop position, the camera 18 stops shooting.

[0110] S140: Adjust the reflecting moving mirror to the second working angle and turn on the second light source.

[0111] When the workpiece 100 to be detected is stationary at the stop position, adjust the reflecting movable mirror 15 to the second working angle 152 to prepare for starting the detection of the second surface of the workpiece 100 to be detected. Turn on the second light source 16. At this time, the first light source 13 can be turned off. The second light source 16 is used to emit a second light beam 161 to the second surface of the workpiece 100, and the camera 18 is used to capture the image formed by the second light beam 161 reflected by the second surface and the reflecting movable mirror 15.

[0112] S150: Drive the stage to move from the stop position to the initial position, and the second light source emits a second light beam to the second surface of the workpiece to be detected. As the workpiece to be detected moves, the second light beam is sequentially irradiated on different regions of the second surface.

[0113] During the process of the workpiece 100 to be detected moving from the stop position to the initial position (unloading V2), the light beam emitted by the second light source 16 can be irradiated on the second surface of the workpiece 100 to be detected. The second surface can be divided into a plurality of sequentially connected second regions along the direction opposite to the moving direction of the workpiece 100 to be detected. Due to the limited illumination range of the second light source 16, the second light source 16 can only illuminate part of the second regions. However, as the workpiece 100 to be detected continues to move, the second light source 16 can illuminate all the second regions in sequence.

[0114] S160: Direct the second light beam reflected by the second surface to the reflecting movable mirror, and then enter the camera after being reflected by the reflecting movable mirror.

[0115] S170: Control the camera to capture the second surface at the second preset frequency to obtain multiple second sub-images of the second surface until the stage reaches the initial position.

[0116] The second light beam 161 forms an image in front of the lens of the camera 18, and the camera 18 captures the image formed by the second light beam 161 reflected by the second surface at the second preset frequency. During the process of the workpiece 100 to be detected moving from the initial position to the stop position, the camera 18 continuously scans and captures the image formed by the second light beam 161, and two second sub-images of the second surface are obtained each time of shooting until the stage 12 reaches the stop position and then the camera 18 stops shooting.

[0117] S180: Obtain the particle images on the first sub-image and the second sub-image, and perform algorithm analysis on the particle images to determine whether the particle images are defects.

[0118] The first sub-image and the second sub-image contain the information of the particle images. By performing algorithm analysis on the parameters such as the position, shape, and size of the particle images, it is determined whether the particles corresponding to the particle images are defects.

[0119] Exemplarily, after performing algorithm analysis on the particles, the size of the particle image is obtained. Based on the size of the particle image, it is determined whether the particle corresponding to the particle image is a defect. For example, a critical size is set in advance. Particles corresponding to particle images with a size less than or equal to the critical size are not recognized as defects, while particles corresponding to particle images with a size greater than the critical size are recognized as defects. Thus, the particle size detection of the first surface and the second surface opposite to the workpiece 100 to be detected can be achieved.

[0120] It should be noted that after obtaining a plurality of first sub-images and a plurality of second sub-images, particle images can be directly obtained from the first sub-images and the second sub-images for algorithm analysis. Alternatively, a plurality of first sub-images can be first stitched together to obtain a first surface image, and a plurality of second sub-images can be stitched together to obtain a second surface image, and then particle images are obtained from the first surface image and the second surface image for algorithm analysis.

[0121] The above particle size detection method uses the same reflecting mirror 15 to participate in the detection of the first surface and the second surface of the workpiece 100 to be detected at the same time. By switching the working angle of the reflecting mirror 15, only one camera 18 can complete the shooting of the first surface and the second surface of the workpiece 100, effectively simplifying the detection optical path and reducing the cost. Moreover, when the workpiece 100 enters the plate V1 and exits the plate V2, there are processes of deceleration, stop, and acceleration itself. As long as the rotation timing of the reflecting mirror 15 is set when the workpiece 100 stops, the rotation of the reflecting mirror 15 can be cleverly integrated into the movement process of the workpiece 100, thus not increasing the overall time consumption of the detection process.

[0122] Exemplarily, please refer to Figure 4 , before detection, the upper computer and the lower computer also need to be turned on, and the signal of the image acquisition card of the lower computer is set high. Among them, the lower computer is electrically connected to the upper computer, and the image acquisition card of the lower computer is electrically connected to the camera 18.

[0123] When the stage 12 moves from the initial position to the stop position, the board-in sensor 20 sends a first movement signal to the image acquisition card. After receiving the first movement signal, the image acquisition card adjusts the frame trigger signal to be high, and the camera 18 starts shooting the upper surface. After the stage 12 moves to the stop position, the board-in sensor 20 sends a first stop signal to the image acquisition card. After receiving the first stop signal, the image acquisition card adjusts the frame trigger signal to be low, and the camera 18 stops shooting the upper surface.

[0124] Similarly, when the carrier stage 12 stops moving towards the initial position, the outfeed sensor 21 sends a second movement signal to the image acquisition card. After receiving the second movement signal, the image acquisition card adjusts the frame trigger signal to high, and the camera 18 starts to capture the lower surface. After the carrier stage 12 moves to the initial position, the outfeed sensor 21 sends a second stop signal to the image acquisition card. After receiving the second stop signal, the image acquisition card adjusts the frame trigger signal to low, and the camera 18 stops capturing the lower surface.

[0125] Optionally, please refer to Figure 2 , Figure 3 and Figure 5 , driving the carrier stage to move from the initial position to the stop position includes:

[0126] S111: Control the operation of the carrier stage motor to drive the carrier stage connected to the carrier stage motor to move in a direction parallel to the first surface of the component to be detected, so that the component to be detected moves from the initial position to the stop position.

[0127] Adjusting the reflecting mirror to the second working angle includes:

[0128] S141: Control the operation of the reflecting mirror motor to drive the reflecting mirror connected to the reflecting mirror motor to be adjusted to the second working angle;

[0129] Driving the carrier stage to move from the stop position to the initial position includes:

[0130] S151: Control the operation of the carrier stage motor to drive the carrier stage to move in a direction parallel to the first surface of the component to be detected, so that the component to be detected moves from the stop position to the initial position.

[0131] The carrier stage 12 is connected to the carrier stage motor, and the reflecting mirror 15 is connected to the reflecting mirror motor 19. Controlling the operation of the carrier stage motor can drive the movement of the carrier stage 12. Controlling the operation of the reflecting mirror motor 19 can drive the adjustment of the working angle of the reflecting mirror 15.

[0132] Exemplarily, the carrier stage motor and the reflecting mirror motor 19 are also connected to the lower computer. The upper computer issues an instruction to the lower computer, and the lower computer controls the operations of the carrier stage motor and the reflecting mirror motor 19 according to the instruction issued by the upper computer.

[0133] Optionally, please refer to Figure 2 , Figure 3 and Figure 6 , placing the component to be detected on the carrier stage, turning on the first light source and the camera, and adjusting the reflecting mirror to the first working angle includes:

[0134] S101: Place the component to be detected on the carrier stage, turn on the first light source and the camera, and electrically connect the camera to the encoder of the carrier stage motor, so that the camera can obtain the encoder signal sent by the encoder, and adjust the reflecting mirror to the first working angle.

[0135] Controlling the camera to capture the first surface at a first preset frequency to obtain multiple first sub-images of the first surface until the stage reaches the stop position includes:

[0136] S131: Controlling the camera to capture the first surface once when receiving a first preset number of encoder signals, and repeating the above capture process until the stage reaches the stop position to obtain multiple first sub-images of the first surface.

[0137] Controlling the camera to capture the second surface at a second preset frequency to obtain multiple second sub-images of the second surface until the stage reaches the initial position includes:

[0138] S171: Controlling the camera to capture the second surface once when receiving a second preset number of encoder signals, and repeating the above capture process until the stage reaches the initial position to obtain multiple second sub-images of the second surface.

[0139] Introducing the encoder signal of the stage motor into the camera 18 enables the camera 18 to capture images at a preset frequency by obtaining the encoder signal, ensuring that the camera 18 can capture images at all stages of the acceleration, uniform motion, and deceleration of the stage 12, and can automatically adjust the capture frequency according to the motion state of the stage 12. Even if there is a slight jitter or unstable speed during the movement of the stage 12, the captured images will not have stretching or shrinking phenomena. As Figure 7 shown, Figure 7 the left diagram in shows the pictures captured by the camera 18 without synchronizing the encoder of the stage motor, Figure 7 and the right diagram in shows the pictures captured by the camera 18 in this embodiment when synchronizing the encoder of the stage motor. It can be seen from Figure 7 that introducing the encoder signal of the stage motor into the camera 18 enables the camera 18 to capture images at a preset frequency according to the encoder signal, and uniform and high-quality images can be obtained. At the same time, if a time delay integration camera (the time delay integration camera is suitable for high-speed moving objects) is used in combination, the movement speed of the stage 12 can be greatly increased, thereby reducing the time-consuming of the capture.

[0140] Exemplarily, the camera 18 captures an image once every 8 encoder signals. When configuring the parameters of the camera 18, select "encoder signal 8:1 ratio" and "external trigger signal" to ensure the synchronization between the photographing of the camera 18 and the movement speed of the stage 12, that is, when the encoder of the stage motor generates eight pulses, the camera 18 collects an image once. In other embodiments, according to different encoders or different cameras 18, other numbers of pulse signals can also be set to set the acquisition frequency of the camera 18.

[0141] Optionally, please refer to Figure 2 、 Figure 3 、Figure 8a and Figure 8b , the particle size detection method includes:

[0142] S102: Place the workpiece to be detected on the stage, turn on the first light source, the board-in sensor and the camera, and adjust the reflecting mirror to the first working angle. Among them, the board-in sensor is electrically connected to the camera, and the board-in sensor is used to detect the position of the workpiece to be detected when it moves from the initial position to the stop position.

[0143] S112: Drive the stage to move from the initial position to the stop position, control the board-in sensor to send the first board-in position signal to the camera, and the first light source emits the first light beam to the first surface of the workpiece to be detected. As the workpiece to be detected moves, the first light beam is sequentially irradiated on different regions of the first surface.

[0144] S120: Shoot the first light beam reflected from the first surface to the reflecting mirror, and then enter the camera after being reflected by the reflecting mirror.

[0145] S132: Control the camera to take pictures of the first surface at the first preset frequency after receiving the first board-in position signal to obtain multiple first sub-images of the first surface until the stage reaches the stop position.

[0146] S133: After the stage moves to the stop position, control the board-in sensor to send the second board-in position signal to the camera.

[0147] S134: Control the camera to stop taking pictures of the first surface of the workpiece to be detected after receiving the second board-in position signal.

[0148] S142: Adjust the reflecting mirror to the second working angle, and turn on the second light source and the board-out sensor. Among them, the board-out sensor is electrically connected to the camera, and the board-out sensor is used to detect the position of the workpiece to be detected when it moves from the stop position to the initial position.

[0149] S152: Drive the stage to move from the stop position to the initial position, control the board-out sensor to send the first board-out position signal to the camera, and the second light source emits the second light beam to the second surface of the workpiece to be detected. As the workpiece to be detected moves, the second light beam is sequentially irradiated on different regions of the second surface.

[0150] S160: Shoot the second light beam reflected from the second surface to the reflecting mirror, and then enter the camera after being reflected by the reflecting mirror.

[0151] S172: Control the camera to take pictures of the second surface at the second preset frequency after receiving the first board-out position signal to obtain multiple second sub-images of the second surface until the stage reaches the initial position.

[0152] S173: After the stage moves to the initial position, control the out-feed sensor to send a second out-feed position signal to the camera.

[0153] S174: Control the camera to stop shooting the second surface of the part to be detected after receiving the second out-feed position signal.

[0154] S180: Obtain the particle images on the first sub-image and the second sub-image, and perform algorithm analysis on the particle images to determine whether the particles corresponding to the particle images are defects.

[0155] The in-feed sensor 20 is used when detecting the first surface of the part to be detected 100, and the out-feed sensor 21 is used when detecting the second surface. At the stop position, the control system (such as the lower computer) needs to switch the digital input of the in-feed sensor 20 and the out-feed sensor 21 to avoid triggering both sensors simultaneously. That is to say, when in-feeding, only the signal of the in-feed sensor 20 is valid. After reaching the stop position, stop reading the signal of the in-feed sensor 20 and start reading the signal of the out-feed sensor 21, that is, when out-feeding, only the signal of the out-feed sensor 21 is valid.

[0156] When the stage 12 carries the part to be detected 100 and is transported from the outside to the initial position, the in-feed sensor 20 detects the in-feed V1 and sends a signal to start shooting the first surface (i.e., the first in-feed position signal) to the camera 18. After that, when the stage 12 carries the part to be detected 100 and moves from the initial position to the stop position, the in-feed sensor 20 can always detect the part to be detected 100 and continuously send a signal to shoot the first surface (i.e., the first in-feed position signal) to the camera 18. When the stage 12 carries the part to be detected 100 and moves to the stop position, the in-feed sensor 20 can no longer detect the part to be detected 100 and sends a signal to stop shooting the first surface (i.e., the second in-feed position signal) to the camera 18. Exemplarily, the first in-feed position signal is a high-level trigger signal, and the second in-feed position signal is a low-level trigger signal.

[0157] When the stage 12 carries the part to be detected 100 and moves to the stop position, the out-feed sensor 21 detects the out-feed V2 and sends a signal to start shooting the second surface (i.e., the first out-feed position signal) to the camera 18. After that, when the stage 12 carries the part to be detected 100 and moves from the stop position to the initial position, the out-feed sensor 21 can always detect the part to be detected 100 and continuously send a signal to shoot the second surface (i.e., the first out-feed position signal) to the camera 18. When the stage 12 carries the part to be detected 100 and moves to the initial position, the out-feed sensor 21 can no longer detect the part to be detected 100 and sends a signal to stop shooting the second surface (i.e., the second out-feed position signal) to the camera 18. Exemplarily, the first out-feed position signal is a high-level trigger signal, and the second out-feed position signal is a low-level trigger signal.

[0158] Exemplarily, the in-feed sensor 20 and the out-feed sensor 21 are electrically connected to the camera 18 through the slave computer respectively. The in-feed sensor 20 can send the position signals (the first in-feed position signal and the second in-feed position signal) of the workpiece 100 to be detected to the image acquisition card of the slave computer, and the image acquisition card controls whether the camera 18 takes pictures of the first surface according to the received position signals. The out-feed sensor 21 can send the position signals (the first out-feed position signal and the second out-feed position signal) of the workpiece 100 to be detected to the image acquisition card of the slave computer, and the image acquisition card controls whether the camera 18 takes pictures of the second surface according to the received position signals.

[0159] The in-feed sensor 20 and the out-feed sensor 21 are used to detect the position of the workpiece 100 to be detected, and the operation of the camera 18 is controlled according to the position detection signals, so that the particle size detection system has better process adaptability. During installation and adjustment, by adjusting the positions of the in-feed sensor 20 and the out-feed sensor 21, images of different regions of the first surface and the second surface of the workpiece 100 can be obtained. Compared with taking a whole image and then cropping out the required region of the image, the computational amount and complexity of the algorithm for cropping the image can be reduced.

[0160] Optionally, please refer to Figure 2 、 Figure 3 、 Figure 9a and Figure 9b , place the workpiece to be detected on the stage, turn on the first light source, the in-feed sensor and the camera, and adjust the reflecting movable mirror to the first working angle. Among them, the in-feed sensor is electrically connected to the camera, and the in-feed sensor is used to detect the position of the workpiece to be detected when the workpiece to be detected moves from the initial position to the stop position, including:

[0161] S103: Place the workpiece to be detected on the stage, turn on the first light source, the in-feed sensor, the camera and the control component, and adjust the reflecting movable mirror to the first working angle. Among them, the in-feed sensor is electrically connected to the camera through the control component, and the in-feed sensor is used to detect the position of the workpiece to be detected when the workpiece to be detected moves from the initial position to the stop position. The control component is also electrically connected to the reflecting movable mirror motor.

[0162] Adjusting the reflecting movable mirror to the second working angle includes:

[0163] S143: After the control component receives the second in-feed position signal, it controls the reflecting movable mirror motor to act to drive the reflecting movable mirror to switch from the first working angle to the second working angle.

[0164] When the workpiece 100 to be detected moves to the stop position, the board feeding sensor 20 sends a second board feeding position signal to the control component. After receiving the second board feeding position signal, the control component controls the action of the reflecting mirror motor 19, driving the reflecting mirror 15 to switch from the first working angle 151 to the second working angle 152. In this embodiment, the information that the workpiece 100 to be detected is in the stop position is obtained through the board feeding sensor 20, and this position information is transmitted to the control component, enabling the control component to control the action of the reflecting mirror motor 19 and adjust the angle of the reflecting mirror 15.

[0165] Optionally, please refer to Figure 2 、 Figure 3 、 Figure 10a and Figure 10b , turn on the control component. Among them, the board feeding sensor is electrically connected to the camera through the control component, and the control component is also electrically connected to the reflecting mirror motor, including:

[0166] S105: Turn on the host computer and the slave computer. Among them, the host computer is electrically connected to the slave computer, the board feeding sensor is electrically connected to the camera through the slave computer, and the slave computer is also electrically connected to the reflecting mirror motor.

[0167] The host computer issues an instruction to the slave computer, and the slave computer controls the camera 18 and the reflecting mirror motor 19 according to the instruction issued by the host computer.

[0168] Adjusting the reflecting mirror to the second working angle includes:

[0169] S144: After the slave computer receives the second board feeding position signal, it sends the second board feeding position signal to the host computer. After receiving the second board feeding position signal, the host computer issues a rotation control instruction to the slave computer.

[0170] S145: After the slave computer receives the rotation control instruction, it controls the action of the reflecting mirror motor to drive the reflecting mirror to switch from the first working angle to the second working angle.

[0171] Optionally, please refer to Figure 2 、 Figure 3 and Figure 11 , the particle size detection method further includes:

[0172] S106: Turn on the film body detection sensor. Among them, the film body detection sensor is electrically connected to the stage motor. The film body detection sensor is used to detect whether the second surface of the workpiece to be detected is covered with a dust-proof film, and the stage motor is used to drive the stage to move in a direction perpendicular to the first surface.

[0173] It can be understood that the step of turning on the film body detection sensor 22 can be performed before or when the stage 12 reaches the stop position.

[0174] Before driving the stage to move from the stop position to the initial position, the particle size detection method further includes:

[0175] S190: Control the film body detection sensor to detect the second surface. If the film body detection sensor detects that the second surface is covered with a dust-proof film, control the film body detection sensor to send a film body presence signal to the stage motor.

[0176] S200: After receiving the film body presence signal, the stage motor drives the stage to move a preset distance in the direction of the first surface.

[0177] Before photographing the second surface of the workpiece 100 to be detected, the dust-proof film of the workpiece 100 to be detected is detected by the film body detection sensor 22, and the signal of the film body detection sensor 22 is directly given to the driver of the stage motor to control the operation of the stage motor. Such a setting can simplify the process, realize process automation, reduce the circuit, increase the reliability, reduce the time, and increase the output. If it is detected that the workpiece 100 to be detected has no dust-proof film, the height of the stage 12 does not change, and the board-out movement is directly performed (that is, the workpiece 100 to be detected moves from the stop position to the initial position following the stage 12), and the second surface of the workpiece 100 to be detected is photographed. If it is detected that the workpiece 100 to be detected has a dust-proof film, the stage motor drives the stage 12 to rise a preset distance in the direction perpendicular to the first surface of the workpiece 100 towards the first light source 13, and then the board-out movement is performed to photograph the second surface of the workpiece 100 to be detected. Therefore, the particle size detection method of this embodiment can detect two workpieces 100 to be detected (that is, the workpiece 100 to be detected with a dust-proof film and the workpiece 100 to be detected without a dust-proof film).

[0178] It should be noted that the above preset distance is determined by the thickness of the dust-proof film. For the workpiece 100 to be detected with different thicknesses of dust-proof films, the upward movement height of the stage 12 can be calculated according to the thickness of the dust-proof film and preset in the control system (such as the upper computer) in advance, so as to ensure quick shifting and accurate focusing. In addition, different light source intensities need to be set for detecting workpieces 100 to be detected with different thicknesses of dust-proof films, which can be controlled through the upper computer or the local mode.

[0179] Optionally, please refer to Figure 2 、 Figure 3 、 Figure 12a and Figure 12b , the particle size detection method further includes:

[0180] S107: Turn on the limit position detection sensor, where the limit position detection sensor is electrically connected to the stage motor, and the limit position detection sensor is used to detect the position of the workpiece to be detected.

[0181] It can be understood that the step of turning on the limit position detection sensor 23 can be performed before the stage 12 reaches the stop position or when it reaches the stop position.

[0182] After receiving the film body presence signal, the stage motor drives the stage to move a preset distance in the direction of the first surface, which includes:

[0183] S201: After receiving the film body presence signal, the stage motor drives the stage to move a preset distance in the direction of the first surface. During this period, if the limit position detection sensor detects that the workpiece to be detected has reached the limit position, a stop signal is sent to the stage motor.

[0184] S202: After receiving the stop signal, the stage motor stops driving the stage to continue moving.

[0185] The signal detected by the limit position detection sensor 23 is directly introduced into the stage motor, and the stage motor directly executes. That is, when the limit position detection sensor 23 detects that the workpiece to be detected 100 has reached the limit position, the workpiece to be detected 100 is restricted from continuing to move in the direction of the first surface, so as to protect the device and the workpiece to be detected 100. The limit position detection sensor 23 can be an optoelectronic sensor, and the position of the workpiece to be detected 100 is confirmed by detecting the vertical distance from the workpiece to be detected 100.

[0186] Optionally, please refer to Figures 13 to 15 , the first light source emits a first light beam to the first surface of the workpiece to be detected, which includes:

[0187] S113: The first light source emits a first light beam to the first surface of the workpiece to be detected, and the first light beam passes through the first half-transmissive and half-reflective mirror and then irradiates on the first surface of the workpiece to be detected.

[0188] Directing the first light beam reflected by the first surface to the reflecting moving mirror includes:

[0189] S121: The first light beam is reflected by the first surface, the first half-transmissive and half-reflective mirror and the first reflector in sequence, and then shoots towards the reflecting moving mirror.

[0190] The second light source emits a second light beam to the second surface of the workpiece to be detected, which includes:

[0191] S153: The second light source emits a second light beam to the second surface of the workpiece to be detected, and the second light beam passes through the second half-transmissive and half-reflective mirror and then irradiates on the second surface of the workpiece to be detected.

[0192] Directing the second light beam reflected by the second surface to the reflecting moving mirror includes:

[0193] S161: The second light beam is reflected by the second surface, the second half-transmissive and half-reflective mirror and the second reflector in sequence, and then shoots towards the reflecting moving mirror.

[0194] The particle size detection method in the prior art uses dark field detection, and realizes the detection of minute particles on the surface of the workpiece to be detected by collecting stray light. Since the light intensity of the stray light is weak, this requires a large light source intensity and detection time. The particle size detection method of this embodiment uses a first semi-transmissive semi-reflective mirror 141 perpendicular to the surface of the workpiece 100 to be detected, a first light source 13, a second semi-transmissive semi-reflective mirror 142 and a second light source 16 to directly use the workpiece 100 to be detected as the imaging object surface, realizing bright field detection, and greatly shortening the detection time while ensuring the particle size detection performance.

[0195] Use the first reflector 142 to reflect the first light beam 131 so that the first light beam 131 can reach the reflecting moving mirror 15 smoothly. Use the second reflector 172 to reflect the second light beam 161 so that the second light beam 161 can reach the reflecting moving mirror 15 smoothly.

[0196] Optionally, please refer to Figures 14 to 16 , shooting the first light beam reflected from the first surface towards the reflecting moving mirror, and then entering the camera after being reflected by the reflecting moving mirror includes:

[0197] S122: Shoot the first light beam reflected from the first surface towards the reflecting moving mirror, and then shoot it towards the focusing lens group after being reflected by the reflecting moving mirror, and enter the camera after being focused by the focusing lens group;

[0198] Shooting the second light beam reflected from the second surface towards the reflecting moving mirror, and then entering the camera after being reflected by the reflecting moving mirror includes:

[0199] S162: Shoot the second light beam reflected from the second surface towards the reflecting moving mirror, and then shoot it towards the focusing lens group after being reflected by the reflecting moving mirror, and enter the camera after being focused by the focusing lens group.

[0200] The particle size detection method of this embodiment uses a focusing lens group 24 to converge the first light beam 131 or the second light beam 161 reflected by the reflecting moving mirror 15, and reduces the imaging surface of the first light beam 131 and the second light beam 161 in front of the camera 18 to within the range of the lens of the camera 18, so as to ensure that the camera 18 can completely photograph the first surface and the second surface.

[0201] The above are only the preferred embodiments of the present application and are not used to limit the present application. For those skilled in the art, various changes and modifications can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A particle size detection method, characterized in that: include: Place the object to be inspected on the stage, turn on the first light source and the camera, and adjust the reflective mirror to a first working angle; Controlling the movement of the stage motor to drive the stage connected to the stage motor to move in a direction parallel to the first surface of the to-be-detected object, so that the to-be-detected object moves from an initial position to a stop position, and the first light source emits a first light beam to the first surface of the to-be-detected object, and as the to-be-detected object moves, the first light beam sequentially irradiates different areas of the first surface; Directing the first light beam reflected by the first surface toward the reflecting mirror, and then entering the camera after being reflected by the reflecting mirror; Controlling the camera to photograph the first surface at a first preset frequency to obtain a plurality of first sub-images of the first surface until the stage reaches the stop position; Adjusting the reflecting mirror to a second working angle and turning on the second light source; Controlling the motor of the stage to drive the stage to move in a direction parallel to the first surface of the part to be detected, so that the part to be detected moves from the stop position to the initial position, and the second light source emits a second light beam to the second surface of the part to be detected, and as the part to be detected moves, the second light beam sequentially irradiates different areas of the second surface; Directing the second light beam reflected by the second surface toward the reflecting mirror, and then entering the camera after being reflected by the reflecting mirror; Controlling the camera to photograph the second surface at a second preset frequency to obtain a plurality of second sub-images of the second surface until the stage reaches the initial position; The particle images on the first sub-image and the second sub-image are acquired, and the particle images are analyzed by an algorithm to determine whether the particles corresponding to the particle images are defects.

2. The particle size detection method according to claim 1, characterized in that: The adjusting the reflective moving mirror to the second working angle comprises: The action of the reflective moving mirror motor is controlled to drive the reflective moving mirror connected to the reflective moving mirror motor to adjust to a second working angle.

3. The particle size detection method according to claim 2, characterized in that: Placing the to-be-detected part on the stage, turning on the first light source and the camera, and adjusting the reflective mirror to the first working angle comprises: Placing the object to be inspected on the stage, turning on the first light source and the camera, and electrically connecting the camera to the encoder of the stage motor so that the camera can obtain the encoder signal sent by the encoder and adjust the reflective moving mirror to a first working angle; The step of controlling the camera to photograph the first surface at a first preset frequency to obtain a plurality of first sub-images of the first surface until the stage reaches the stop position comprises: Controlling the camera to shoot the first surface once when receiving a first preset number of encoder signals, and repeating the above shooting process until the stage reaches the stop position, so as to obtain a plurality of first sub-images of the first surface; The step of controlling the camera to photograph the second surface at a second preset frequency to obtain a plurality of second sub-images of the second surface until the stage reaches the initial position comprises: The camera is controlled to shoot the second surface once when receiving a second preset number of encoder signals, and the above shooting process is repeated until the stage reaches the initial position to obtain multiple second sub-images of the second surface.

4. The particle size detection method according to claim 2, characterized in that: include: Place the part to be detected on the stage, turn on the first light source, the board-entering sensor and the camera, and adjust the reflective moving mirror to a first working angle, wherein the board-entering sensor is electrically connected to the camera, and the board-entering sensor is used to detect the position of the part to be detected when the part to be detected moves from the initial position to the stop position; The stage is driven to move from the initial position to the stop position, the board-feeding sensor is controlled to send a first board-feeding position signal to the camera, and the first light source emits a first light beam to the first surface of the to-be-detected component, and as the to-be-detected component moves, the first light beam is sequentially irradiated on different areas of the first surface; Directing the first light beam reflected by the first surface toward the reflecting mirror, and then entering the camera after being reflected by the reflecting mirror; Controlling the camera to photograph the first surface at a first preset frequency after receiving the first plate-entering position signal, so as to obtain a plurality of first sub-images of the first surface until the stage reaches the stop position; After the stage moves to the stop position, controlling the board-entering sensor to send a second board-entering position signal to the camera; Controlling the camera to stop photographing the first surface of the to-be-detected component after receiving the second plate-entry position signal; Adjust the reflective moving mirror to a second working angle, and turn on the second light source and the board-out sensor, wherein the board-out sensor is electrically connected to the camera, and the board-out sensor is used to detect the position of the to-be-detected part when the to-be-detected part moves from the stop position to the initial position; The stage is driven to move from the stop position to the initial position, the plate-out sensor is controlled to send a first plate-out position signal to the camera, and the second light source emits a second light beam to the second surface of the to-be-detected part, and as the to-be-detected part moves, the second light beam is sequentially irradiated on different areas of the second surface; Directing the second light beam reflected by the second surface toward the reflecting mirror, and then entering the camera after being reflected by the reflecting mirror; Controlling the camera to photograph the second surface at a second preset frequency after receiving the first plate-out position signal, so as to obtain a plurality of second sub-images of the second surface until the stage reaches the initial position; After the stage moves to the initial position, controlling the plate-out sensor to send a second plate-out position signal to the camera; Controlling the camera to stop photographing the second surface of the to-be-detected component after receiving the second plate-out position signal; The particle images on the first sub-image and the second sub-image are acquired, and the particle images are analyzed by an algorithm to determine whether the particles corresponding to the particle images are defects.

5. The particle size detection method according to claim 4, characterized in that: The method of placing the part to be detected on the carrier, turning on the first light source, the board-entering sensor and the camera, and adjusting the reflective moving mirror to a first working angle, wherein the board-entering sensor is electrically connected to the camera, and the board-entering sensor is used to detect the position of the part to be detected when the part to be detected moves from the initial position to the stop position, comprises: The object to be detected is placed on the stage, the first light source, the board-entering sensor, the camera and the control component are turned on, and the reflective mirror is adjusted to a first working angle, wherein the board-entering sensor is electrically connected to the camera through the control component, the board-entering sensor is used to detect the position of the object to be detected when the object to be detected moves from the initial position to the stop position, and the control component is also electrically connected to the reflective mirror motor; The adjusting the reflective moving mirror to the second working angle comprises: After receiving the second plate entry position signal, the control component controls the reflective moving mirror motor to operate, so as to drive the reflective moving mirror to switch from the first working angle to the second working angle.

6. The particle size detection method according to claim 2, characterized in that: Also includes: Turning on a film detection sensor, wherein the film detection sensor is electrically connected to the stage motor, the film detection sensor is used to detect whether the second surface of the object to be detected is covered with a dustproof film, and the stage motor is used to drive the stage to move in a direction perpendicular to the first surface; Before driving the stage to move from the stop position to the initial position, the particle size detection method further includes: Controlling the film detection sensor to detect the second surface, and if the film detection sensor detects that the second surface is covered with the dustproof film, controlling the film detection sensor to send a film presence signal to the stage motor; The stage motor drives the stage to move a preset distance in the direction where the first surface is located after receiving the film existence signal.

7. The particle size detection method according to claim 6, characterized in that: Also includes: Turning on the limit position detection sensor, wherein the limit position detection sensor is electrically connected to the stage motor, and the limit position detection sensor is used to detect the position of the part to be detected; The stage motor drives the stage to move a preset distance in the direction where the first surface is located after receiving the film body existence signal, including: The stage motor drives the stage to move a preset distance in the direction of the first surface after receiving the film existence signal. During this period, if the limit position detection sensor detects that the part to be detected has reached the limit position, a stop signal is sent to the stage motor. The stage motor stops driving the stage to continue moving after receiving the stop signal.

8. The particle size detection method according to claim 1, characterized in that: The first light source emitting a first light beam toward the first surface of the to-be-detected component comprises: The first light source emits a first light beam toward the first surface of the object to be detected, and the first light beam is irradiated on the first surface of the object to be detected after passing through the first semi-transparent and semi-reflective mirror; Directing the first light beam reflected by the first surface toward the reflecting mirror comprises: The first light beam is reflected by the first surface, the first semi-transparent mirror and the first reflector in sequence, and then emitted to the reflective mirror; The second light source emitting a second light beam toward the second surface of the to-be-detected component comprises: The second light source emits a second light beam toward the second surface of the to-be-detected object, and the second light beam is irradiated on the second surface of the to-be-detected object after passing through the second semi-transparent and semi-reflective mirror; Directing the second light beam reflected by the second surface toward the reflecting mirror comprises: The second light beam is reflected by the second surface, the second semi-transmissive mirror and the second reflecting mirror in sequence, and then is directed to the reflecting mirror.

9. The particle size detection method according to claim 1, characterized in that: The step of directing the first light beam reflected by the first surface toward the reflective mirror and then entering the camera after being reflected by the reflective mirror comprises: Directing the first light beam reflected by the first surface toward the reflecting mirror, and then directed toward the focusing lens group after being reflected by the reflecting mirror, and then directed into the camera after being focused by the focusing lens group; The step of directing the second light beam reflected by the second surface toward the reflective mirror and then entering the camera after being reflected by the reflective mirror comprises: The second light beam reflected by the second surface is directed toward the reflecting mirror, and then directed toward the focusing lens group after being reflected by the reflecting mirror, and then enters the camera after being focused by the focusing lens group.

10. The particle size detection method according to claim 5, characterized in that: Turning on the control assembly, wherein the board-entry sensor is electrically connected to the camera through the control assembly, and the control assembly is also electrically connected to the reflective mirror motor, including: Turn on the upper computer and the lower computer, wherein the upper computer is electrically connected to the lower computer, the board entry sensor is electrically connected to the camera through the lower computer, and the lower computer is also electrically connected to the reflective mirror motor; The adjusting the reflective moving mirror to the second working angle comprises: After receiving the second board entry position signal, the lower computer sends the second board entry position signal to the upper computer, and the upper computer sends a rotation control instruction to the lower computer after receiving the second board entry position signal; After receiving the rotation control instruction, the lower computer controls the motor of the reflective moving mirror to drive the reflective moving mirror to switch from the first working angle to the second working angle.

Images