A high-efficiency vibration test device and method for evaluating interconnection reliability

Abstract

The application relates to a high-efficiency vibration ring test device and method for evaluating interconnection reliability, and belongs to the technical field of reliability evaluation. The specific scheme is as follows: a high-efficiency vibration test device for evaluating interconnection reliability, comprising a printed circuit board with symmetry and a plurality of electronic components, a plurality of through holes I are symmetrically arranged on the edge of the printed circuit board relative to the geometric center of the printed circuit board, a screw rod is used to pass through the through holes I to fix the printed circuit board on a vibration test table; the geometric centers of the plurality of electronic components are correspondingly arranged at the midpoints of the lines connecting the geometric centers of the plurality of through holes I and the geometric center of the printed circuit board, and the plurality of electronic components are connected on the corresponding pads of the printed circuit board through a connection process to form a to-be-tested interconnection. The application solves the problem of low efficiency of interconnection vibration test by a traditional vibration test table. The method has strong applicability, simple operation method and low cost, and can effectively improve the efficiency of vibration test of a large number of to-be-tested interconnections.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of reliability evaluation, and particularly relates to a high-efficiency vibration test device and method for evaluating interconnection reliability. BACKGROUND

[0002] Interconnection is a component unit with a large number of types and easy to fail in electronic equipment. It completes the physical connection between various electronic components and ultimately realizes the function of electronic equipment. In the application fields of aviation, aerospace, military and medical treatment, interconnection usually needs to serve in a severe environment represented by continuous vibration for a long time. The process of serving in the vibration condition for a long time will cause fatigue damage in the interconnection, and the thermal effect caused by vibration will accelerate the degradation of the interconnection. These interconnection degradation or failure is the main reason for the failure or failure of electronic equipment. Therefore, interconnection is a typical weak link of long-life and high-reliability electronic equipment, and it is extremely important to study and evaluate the reliability of interconnection under the action of vibration.

[0003] The traditional environmental vibration loading system is a single vibration device, which is used to load the vibration on the electronic equipment to be tested based on the single vibration device, and complete the vibration test. In order to evaluate the reliability of interconnection, a single electronic component and the corresponding printed circuit board are assembled to form a test interconnection assembly, and a nut and a long screw are used to connect and fix the test assembly and the vibration table, and the vibration test is completed by the traditional single vibration device. This vibration test method for evaluating the reliability of interconnection has low efficiency and high cost. Therefore, in engineering, the method of placing and fixing multiple test interconnection assemblies on the vibration table at the same time is usually used to improve the test efficiency. However, this method has the following two problems: first, the number of interconnection assemblies that can be placed at the same time by the single vibration device is small (usually not more than three), which cannot effectively solve the problem of low efficiency. Second, because the vibration input consistency of each position of the vibration table is not high, the actual vibration input of multiple test interconnection assemblies is inconsistent, so the accuracy of the final test result is low, and the repeatability of the test result is poor.

[0004] Considering the above limitations of the existing interconnection reliability evaluation method, in view of the high efficiency and low cost evaluation demand of interconnection vibration reliability, it is necessary to develop a high-efficiency vibration test device and method to solve the problems of low efficiency, high energy consumption and high cost in the traditional vibration test method for evaluating the reliability of interconnection. SUMMARY

[0005] In view of the problems of low efficiency, high energy consumption and high cost in the traditional vibration test device and method for evaluating the reliability of interconnection, the present application provides a high-efficiency vibration test device and method for evaluating the reliability of interconnection.

[0006] In order to achieve the above purpose, the present application adopts the following technical scheme:

[0007] The application discloses a high-efficiency vibration test device for evaluating interconnection reliability, which comprises a printed circuit board with high symmetry and a plurality of electronic components, wherein edges of the printed circuit board are provided with a plurality of through holes I which are symmetrically distributed relative to a geometric center of the printed circuit board, a screw rod is used to pass through the through holes I to fix the printed circuit board on a vibration test table, geometric centers of the plurality of electronic components are correspondingly distributed at midpoints of lines connecting geometric centers of the plurality of through holes I and the geometric center of the printed circuit board, so as to improve vibration excitation accuracy, and the plurality of electronic components are connected on corresponding pads of the printed circuit board through a connection process to form to-be-tested interconnections.

[0008] Further, the number of the electronic components is greater than or equal to 4.

[0009] Further, a distance between two adjacent electronic components is greater than 10 mm.

[0010] Further, a pre-tightening force between a part of the screw rod located outside the printed circuit board and a nut is 40N-60N, and a pre-tightening force between a part of the screw rod located on one side of the vibration test table and the nut is 60N-75N.

[0011] Further, a through hole II is formed in the center of the printed circuit board.

[0012] The printed circuit board is connected with the vibration table through a nut and a screw rod. High-precision nuts and screw rods are adopted to ensure that sufficient clamping force can be provided when the printed circuit board is fixed, and the torsion applied to the nut is accurately controlled, the nut is automatically stopped from being tightened according to a preset torsion value, the torsion of each nut is consistent, the uniformity of the printed circuit board is ensured, and the vibration excitation consistency of each to-be-tested interconnection in the vibration test is improved.

[0013] A method for evaluating interconnection reliability by using the test device, comprising the following steps:

[0014] Step one, a printed circuit board is prepared according to a design layout, electronic components are connected on corresponding pads of the printed circuit board through a connection process to form to-be-tested interconnections;

[0015] Step two, the to-be-tested interconnections are checked, and after it is ensured that the to-be-tested interconnections are defect-free, resistance values of the to-be-tested interconnections are tested;

[0016] Step three, fix the printed circuit board on the vibration test table, design the vibration test scheme, determine the number of vibration test samples, design the vibration frequency, vibration direction, vibration amplitude, vibration time and acceleration time history waveform of the vibration test, and record the temperature of the test site; according to the preset test parameter value, carry out the vibration test;

[0017] Step four, observe whether the to-be-tested interconnection of the completed vibration test is cracked and failed, record the image data of the to-be-tested interconnection caused by the vibration test, test the resistance value of the to-be-tested interconnection after the vibration test, analyze and calculate the resistance change of each to-be-tested interconnection in the vibration test, and evaluate the performance degradation degree of the to-be-tested interconnection in the vibration test.

[0018] Further, the to-be-tested interconnection resistance value change exceeding the threshold value before and after the vibration test is considered to be failed in the vibration test.

[0019] Preferably, the threshold value is 20%.

[0020] Compared with the prior art, the beneficial effects of the present application are:

[0021] The present application adopts a symmetrically designed printed circuit board, and the to-be-tested interconnections are symmetrically distributed on each position on the printed circuit board, thereby improving the vibration excitation consistency of each to-be-tested interconnection in the vibration test.

[0022] The printed circuit board adopted in the present application can simultaneously set four and more electronic components containing to-be-tested interconnections for vibration test, thereby solving the problem of low efficiency of interconnection vibration test by the traditional vibration test table. The method has strong applicability, simple operation method and low cost, and can effectively improve the efficiency of vibration test of a large number of to-be-tested interconnections.

[0023] The vibration test method in the present application quantitatively analyzes the degradation degree of the interconnection in the vibration test by monitoring the resistance value change of the interconnection in the vibration test process, thereby providing data support for the reliability optimization design of the interconnection serving in the vibration environment. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 It is a schematic diagram of the six-array vibration test device of the present application for testing 0805 packaged electronic component interconnection test pieces;

[0025] Figure 2 It is a schematic diagram of the six-array vibration test device of the present application for testing BGA packaged electronic component interconnection test pieces;

[0026] Figure 3 It is a schematic diagram of the four-array vibration test device of the present application for testing BGA packaged electronic component interconnection test pieces;

[0027] Figure 4Schematic diagram of screw and nut used in the present application;

[0028] In the figure, 1 is a printed circuit board, 2 is an electronic component, 3 is a through hole I, 4 is a screw, 5 is a nut, 6 is a through hole II, and 21 is an interconnection to be tested. DETAILED DESCRIPTION

[0029] The technical solutions in the present application will be described clearly and completely below in combination with the drawings and embodiments. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work belong to the protection scope of the present application.

[0030] Embodiment 1

[0031] In combination with the drawings Figure 1 And 4 This embodiment is used to test the vibration reliability of 0805 packaged electronic component interconnection. A high-efficiency vibration test device for evaluating interconnection reliability includes a circular printed circuit board 1 with high symmetry and six electronic components 2. The edge of the printed circuit board 1 is provided with six through holes I 3 symmetrically distributed with respect to the geometric center of the printed circuit board 1. A screw 4 is used to pass through the through holes I 3 to fix the printed circuit board 1 on a vibration test table. The geometric centers of the six electronic components 2 are correspondingly distributed at the midpoints of the lines connecting the geometric centers of the six through holes I 3 and the geometric center of the printed circuit board 1, so as to improve the vibration excitation accuracy. The pins of the six electronic components 2 are connected on the corresponding six pads on the printed circuit board 1 by a reflow soldering process to form the interconnection to be tested 21. The connection material uses a tin-based solder alloy paste.

[0032] Further, the distance between the adjacent two electronic components 2 is greater than 10 mm.

[0033] Further, the pre-tightening force between the part of the screw located outside the printed circuit board 1 and the nut is 40 N, and the pre-tightening force between the part of the screw located on one side of the vibration test table and the nut is 60 N.

[0034] A method for evaluating the interconnection reliability by using the test device includes the following steps:

[0035] Step one, according to the design layout, a printed circuit board 1 containing six symmetric through holes I 3 is prepared, and electronic components 2 are welded on the corresponding pads of the printed circuit board 1 by a reflow soldering process to form the interconnection to be tested 21. The symmetric pad design ensures the symmetric layout of the electronic components 2, so that the vibration excitation received by the interconnection to be tested 21 of each electronic component 2 is the same.

[0036] Step two, use X-ray detector to check the to-be-tested interconnection 21, prevent the to-be-tested interconnection 21 from having defects such as virtual welding, open circuit and porosity, and ensure that the to-be-tested interconnection 21 and the electronic component 2 have normal performance before the vibration test; after ensuring that the to-be-tested interconnection 21 has no defects, test the resistance value of the to-be-tested interconnection 21, which is used for vibration failure judgment of the interconnection;

[0037] Step three, use a torque control tool to connect the long screw rod with the printed circuit board 1 and the vibration test table, and ensure that the pre-tightening force between the part of the screw rod 4 located outside the printed circuit board and the nut 5 and the pre-tightening force between the part of the screw rod 4 located on the side of the vibration test table and the nut 5 are accurate.

[0038] Step four, design a vibration test scheme, determine the number of vibration test samples, design the vibration frequency, vibration direction, vibration amplitude, vibration time (vibration cycle) and acceleration time history waveform of the vibration test, and record the temperature of the test site;

[0039] Step five, perform the vibration test according to the preset test parameter value;

[0040] Step six, perform X-ray detection on the to-be-tested interconnection of the electronic component on the printed circuit board after the vibration test is completed, observe whether the to-be-tested interconnection 21 after the vibration test is cracked and fails, and record the image data of the to-be-tested interconnection 21 caused by the vibration test to crack and fail;

[0041] Step seven, aggregate the resistance values of the to-be-tested interconnections 21 after the vibration test is completed, analyze and calculate the resistance change of the interconnection of each electronic component 2 in the vibration test, which is used to evaluate the performance degradation degree of the interconnection in the vibration test. The resistance value change of the to-be-tested interconnection 21 before and after the vibration test is more than 20%, which is considered to be degraded and failed in the vibration test.

[0042] Step eight, repeat steps five to seven until the required number of samples in the vibration test scheme is completed, count the percentage of interconnection cracking and functional failure and the percentage of interconnection resistance value increase of more than 20% in the vibration test, and complete the reliability evaluation of the interconnection.

[0043] Example 2

[0044] In combination Figure 2 , 4The embodiment is used for testing the vibration reliability of the interconnection of the BGA packaged electronic component, and the difference between the embodiment and the embodiment 1 is that the size and mass of the object of the vibration test are larger, in order to ensure the input consistency of the vibration test and the stable operation of the vibration test device, the through hole II 6 is additionally arranged at the center of the printed circuit board 1 prepared in step one, the printed circuit board 1 is fixed on the vibration test table by using the screw rod 4 to pass through the through hole II 6, the isolation of each BGA packaged electronic component and the to-be-tested interconnection thereof in the vibration test is increased, the vibration input of the to-be-tested interconnection 21 of each electronic component 2 is ensured to be the same, and the test result is more accurate.

[0045] Embodiment 3

[0046] In combination Figure 3 , 4 The embodiment is used for testing the vibration reliability of the to-be-tested interconnection of the BGA packaged electronic component (or the plug-in electronic component), and the difference between the embodiment and the embodiment 1 is that the printed circuit board 1 in the vibration test is the printed circuit board containing four symmetrical through holes I 3, the test scene of smaller vibration table size and higher device cost can be coped with, vibration test is performed according to the embodiment, and the vibration input of the to-be-tested interconnection 21 of each electronic component 2 can also be ensured to be completely the same, and the efficiency and consistency of the vibration test are improved.

[0047] The high-efficiency vibration test device for evaluating the interconnection reliability has the advantages of quickly and efficiently completing the vibration test, and can solve the problems of high energy consumption, long time, low efficiency, poor consistency and repeatability and the like in the process of evaluating the interconnection reliability by using the traditional vibration test equipment.

[0048] In addition, it should be understood that although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description manner of the specification is only for the sake of clarity, and the person skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be combined to form other embodiments that can be understood by the person skilled in the art.

Claims

1. A method for evaluating reliability of interconnection using a high-efficiency vibration test apparatus for evaluating reliability of interconnection, characterized by comprising: The efficient vibration test device for evaluating the reliability of interconnection comprises a printed circuit board (1) with symmetry and a plurality of electronic components (2), the edge of the printed circuit board (1) is provided with a plurality of through holes I (3) symmetrically distributed with respect to the geometric center of the printed circuit board (1), a screw rod (4) is used to pass through the through holes I (3) to fix the printed circuit board (1) on a vibration test table, the geometric centers of the plurality of electronic components (2) are correspondingly distributed at the midpoints of the lines connecting the geometric centers of the plurality of through holes I (3) and the geometric center of the printed circuit board (1), and the plurality of electronic components (2) are connected on the corresponding pads of the printed circuit board (1) by a connection process to form a to-be-tested interconnection (21). ​ The method for evaluating the reliability of interconnection by using the test device comprises the following steps: Step one, preparing the printed circuit board (1) according to the design layout, and connecting the electronic components (2) on the corresponding pads of the printed circuit board (1) by a connection process to form the to-be-tested interconnection (21); Step two, checking the to-be-tested interconnection (21), and testing the resistance value of the to-be-tested interconnection (21) after ensuring that the to-be-tested interconnection (21) is defect-free; Step three, fixing the printed circuit board (1) on a vibration test table, designing a vibration test scheme, determining the number of vibration test samples, designing the vibration frequency, vibration direction, vibration amplitude, vibration time and acceleration time history waveform of the vibration test, and recording the temperature of the test site; and performing the vibration test according to the preset test parameter values; Step four, observing whether the to-be-tested interconnection (21) that has completed the vibration test is cracked and fails, recording the image data of the to-be-tested interconnection (21) that is caused to crack and fail by the vibration test, testing the resistance value of the to-be-tested interconnection (21) that has completed the vibration test, analyzing and calculating the resistance change of each to-be-tested interconnection (21) in the vibration test, and used for evaluating the performance degradation degree of the to-be-tested interconnection (21) in the vibration test.

2. The method of evaluating interconnect reliability of claim 1, wherein: The number of the electronic components (2) is greater than or equal to 4.

3. The method of evaluating interconnect reliability of claim 1, wherein: The distance between two adjacent electronic components (2) is greater than 10 mm.

4. The method of evaluating interconnect reliability of claim 1, wherein: The pre-tightening force between the part of the screw rod located outside the printed circuit board (1) and the nut is 40N-60N, and the pre-tightening force between the part of the screw rod located on one side of the vibration test table and the nut is 60N-75N.

5. The method of evaluating interconnect reliability of claim 1, wherein: A through hole II (6) is formed in the center of the printed circuit board (1).

6. The method of evaluating interconnect reliability of claim 1, wherein: The to-be-tested interconnection (21) is considered to fail in the vibration test when the resistance value change of the to-be-tested interconnection (21) before and after the vibration test exceeds a threshold value.

7. The method of evaluating interconnect reliability of claim 6, wherein: The threshold value is 20%.

Images