Exposure machine projection lens system and high-efficiency exposure machine

Abstract

The invention relates to the technical field of exposure machines, and provides an exposure machine projection lens system, which comprises: a laser module for emitting a light signal; a DMD component for receiving the light signal and reflecting it to a lens device after processing; the lens device for projecting the light signal; a coolant cooling component installed on the DMD component and used to cool the DMD component; a coolant control component connected to the coolant cooling component and used to control the flow rate and / or temperature of the coolant in the coolant cooling component, thereby controlling the temperature of the DMD component within a preset temperature range; the invention directly contacts the DMD component through the coolant cooling component; and then controls the flow rate of the coolant in the coolant cooling component through the coolant control component, so that the temperature of the DMD component does not exceed 30 degrees, so that the DMD component is quickly cooled under the condition of direct action of the coolant, thereby ensuring that the DMD component will not be damaged due to excessive temperature, and at the same time, the temperature reduction can also enable the DMD component to withstand a laser power of 150W or more, thereby achieving a better exposure effect.

Description

Technical Field

[0001] The present invention relates to the technical field of exposure machines, and in particular to an exposure machine projection lens system and a high-efficiency exposure machine. Background Art

[0002] The exposure principle of the digital DMD exposure machine is to receive high-intensity laser irradiation through the DMD (Digital Micromirror Device), and then process it to form a high-definition exposure pattern, which is widely used.

[0003] In order to ensure the exposure effect, the laser irradiation needs to reach a certain intensity. While part of the light is reflected by the DMD into the optical imaging system, the other part of the high-intensity light will be converted into heat energy, causing the DMD to heat up. It is necessary to cool it down in time. The existing conventional solution is: contact the back of the DMD digital micromirror through a metal heat sink, and then pass cold air or cold water to contact the metal heat sink to take away the heat. When the metal heat sink contacts the DMD shell, there will be problems such as unevenness or gaps in the metal heat sink, which makes it impossible for the metal heat sink to completely fuse with the DMD shell, resulting in the heat not being absorbed by the metal heat sink in time. At the same time, the effect of air cooling or water cooling is limited, which will cause the temperature of the DMD digital micromirror to be high. In severe cases, it will cause the DMD to burn out and cannot be used anymore.

[0004] In order to ensure that the temperature of the DMD module is controlled below 30 degrees, the existing conventional solution for heat dissipation is that the DMD module can withstand a laser irradiation power below 40W; the existing water cooling method for heat dissipation is that the DMD module can withstand a laser irradiation power below 80W; neither cooling method can make the DMD withstand a higher laser power. Summary of the invention

[0005] In view of the shortcomings of the prior art in that the heat dissipation effect is poor, an object of the present invention is to provide an exposure machine projection lens system and a high-efficiency exposure machine that have good heat dissipation and cooling effect on the DMD module.

[0006] To solve the above problems, the present invention provides the following technical solutions:

[0007] An exposure machine projection lens system, comprising:

[0008] A laser module, used for emitting optical signals;

[0009] The DMD component is used to receive the optical signal and reflect it to the lens device after processing;

[0010] A lens device, used for projecting the light signal;

[0011] A coolant cooling component, installed on the DMD component and used to cool the DMD component;

[0012] A coolant control component is connected to the coolant cooling component and is used to control the flow rate and / or temperature of the coolant in the coolant cooling component, thereby controlling the temperature of the DMD component within a preset temperature range.

[0013] In some embodiments, the power of the laser module when in use is above 100 W.

[0014] In some embodiments, the DMD component includes a micromirror chip module;

[0015] The coolant cooling assembly comprises a cavity for containing coolant and a first liquid inlet pipe and a first liquid outlet pipe connected to the cavity; the cavity comprises an outer wall and a first opening formed by the outer wall;

[0016] The liquid in the coolant cooling assembly directly contacts the micromirror chip module through the first opening to cool the micromirror chip module.

[0017] In some embodiments, the outer wall of the cavity is connected to the micromirror chip module, and the coolant cooling assembly further includes a seal, which is used to seal the connection between the outer wall of the cavity and the micromirror chip module.

[0018] In some embodiments, the DMD assembly further includes a DMD data carrier board, a DMD integrated circuit board, a fixed pressure plate, and a DMD data card connector;

[0019] The DMD data card connector is installed on the DMD data carrier board;

[0020] The DMD data carrier, the DMD integrated circuit board and the fixed pressure plate are located on the same side of the micromirror chip module where the coolant cooling component is located; the fixed pressure plate is provided with a first clearance hole, the DMD data carrier is provided with a second clearance hole, and the DMD integrated circuit board is provided with a third clearance hole, and the coolant cooling component passes through the first clearance hole, the second clearance hole and the third clearance hole in sequence to directly contact the micromirror chip module.

[0021] In some embodiments, the coolant cooling assembly further comprises a pressure device; the pressure device comprises a fastening bolt, a compression spring and an extrusion plate installed outside the coolant cooling assembly;

[0022] The fastening bolt passes through the extrusion plate and is installed and fixed to the DMD assembly;

[0023] The compression spring is sleeved on the fastening bolt; the compression spring creates an extrusion force between the coolant cooling assembly and the micromirror chip via the extrusion plate, and the extrusion force enables the sealing member to tightly seal the connection between the outer wall of the cavity and the micromirror chip module.

[0024] In some embodiments, the DMD component includes a micromirror chip module;

[0025] The coolant cooling assembly includes a cooling chamber for containing coolant, and an exhaust pipe, heat insulation cotton and a plurality of condensing pipes directed to the micromirror chip module contained in the cooling chamber; the cooling chamber includes an outer wall and a second opening formed by the outer wall;

[0026] A plurality of groups of condensing tubes are evenly arranged on the micromirror chip module, each of the condensing tubes is a U-shaped tube, and the bottom of the condensing tube is in direct contact with the micromirror chip module;

[0027] The outer side of the second liquid inlet pipe of each condenser tube is wrapped with the heat insulation cotton, and the heat insulation cotton isolates the heat on the outer side of the second liquid inlet pipe;

[0028] The liquid inlet end of each of the second liquid inlet pipes is connected;

[0029] The outer jacket of the second liquid outlet pipe of each condenser pipe is provided with an exhaust pipe, and the exhaust pipe timely extracts the heat dissipated by the second liquid outlet pipe;

[0030] The liquid outlet ends of each of the second liquid outlet pipes are connected;

[0031] Each of the second liquid outlet pipes is connected to the upper end of the exhaust pipe sleeve.

[0032] In some embodiments, the exposure machine projection lens system further includes an adjustment component for adjusting the position of the DMD component; the adjustment component includes a fixing plate, an adjustment plate and a mounting plate;

[0033] The fixing plate is mounted on the lens device;

[0034] The adjusting plate can rotate horizontally relative to the fixing plate;

[0035] The mounting plate can move up and down relative to the fixing plate, and the DMD assembly is mounted on the mounting plate.

[0036] In some embodiments, the adjusting plate is provided with arc grooves with the same center, and the fixing plate is fixed with stoppers corresponding to the arc grooves one by one, and the adjusting plate rotates horizontally via the stoppers;

[0037] A plurality of adjusting bolts for moving up and down are arranged on the upper side of the mounting plate, the number of the adjusting bolts is greater than or equal to 3, the axes of the plurality of adjusting bolts are parallel and the axes are not on the same plane, and the up and down movement of the adjusting bolts drives the corresponding position of the mounting plate to move up and down.

[0038] In some embodiments, a base;

[0039] A workbench, which is mounted on the base and is used to carry the workpiece to be exposed;

[0040] The lens device projects the light signal onto the workpiece to be exposed on the workbench.

[0041] The beneficial effects of the present invention are as follows: a coolant cooling component is installed on a DMD component and is in direct contact with a micromirror chip module; a coolant control component controls the flow rate and / or temperature of the coolant in the coolant cooling component so that the temperature of the micromirror chip module does not exceed 30 degrees. By rapidly cooling the micromirror chip module under the direct action of the coolant, it is ensured that the micromirror chip module will not be damaged due to excessive temperature. Meanwhile, the temperature reduction can also enable the DMD module to withstand a laser power of 100W-180W, thereby achieving a better exposure effect.

[0042] When a multi-group condensation arrangement design is adopted, and the use of heat insulation cotton and exhaust ducts is combined, the effect of rapid cooling can be achieved, and the temperature at any position on the micromirror chip module can be made the same, thereby ensuring stability during exposure. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 A three-dimensional diagram of one embodiment of a projection lens system of an exposure machine of the present invention;

[0044] Figure 2 A stereoscopic diagram of a projection lens system of an exposure machine of the present invention;

[0045] Figure 3 A three-dimensional diagram of a laser emission source and a lens device according to the present invention;

[0046] Figure 4 A front cross-sectional view of one embodiment of a projection lens system for an exposure machine of the present invention;

[0047] Figure 5 For the present invention Figure 4 A magnified image of point A;

[0048] Figure 6 An exploded view of one embodiment of a projection lens system of an exposure machine of the present invention;

[0049] Figure 7 A stereoscopic diagram of the laser emission source and the lens device of the present invention;

[0050] Figure 8 It is a structural schematic diagram of another embodiment of the coolant cooling assembly of the present invention;

[0051] Fig. 9 A schematic diagram of the internal structure of another embodiment of a coolant cooling assembly of the present invention;

[0052] Fig.10 A schematic diagram of a condenser tube of another embodiment of a coolant cooling assembly of the present invention;

[0053] Fig.11 A schematic diagram of a cooling unit in another embodiment of a coolant cooling assembly of the present invention;

[0054] Fig.12 It is another embodiment of the exhaust pipe in the coolant cooling assembly of the present invention;

[0055] Fig.13 It is a schematic diagram of the exposure machine of the present invention.

[0056] Reference numerals:

[0057] 110, exposure machine projection lens system; 120, laser module; 130, DMD assembly; 140, lens device; 150, coolant cooling assembly; 160, coolant control assembly; 170, adjustment assembly; 180, base; 190, workbench; 200, workpiece to be exposed; 210, exposure machine;

[0058] 131, micromirror chip module; 132, DMD data carrier board; 133, DMD integrated circuit board; 134, DMD data card connector; 135, fixed pressure plate; 13a, first clearance hole; 13b, second clearance hole; 13c, third clearance hole; 136, frame member; 137, gasket; 138, bolt;

[0059] 151, cavity; 152, first liquid inlet pipe; 153, first liquid outlet pipe; 154, first opening; 155, sealing member; 156, pressure device; 15a, fastening bolt; 15b, compression spring; 15c, extrusion plate;

[0060] 251, cooling chamber; 252, exhaust pipe; 253, heat insulation cotton; 254, condenser pipe; 255, second opening; 256, second liquid inlet pipe; 257, second liquid outlet pipe;

[0061] 161. Temperature sensor;

[0062] 171, fixing plate; 172, adjusting plate; 173, mounting plate; 17a, arc groove; 17b, limiting member;

[0063] 17c, adjusting bolt; 17d, fourth clearance hole; 17e, fifth clearance hole; 17f, sixth clearance hole;

[0064] 271. First support block; 272. Second support block; 273. Clearance groove; 274. Rotating rod; 275. Stop block. DETAILED DESCRIPTION

[0065] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0066] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0067] For the convenience of describing the first direction, the second direction and the third direction in the embodiment of the present application, the first direction is the left-right direction in the drawings, the second direction is the front-back direction in the drawings, and the third direction is the up-down direction in the drawings. The x-axis arrow direction is referred to as the "right" direction in the following text, the y-axis arrow direction is referred to as the "up" direction in the following text, and the z-axis arrow direction is referred to as the "back" direction in the following text, which is not limited to the actual application of the present application.

[0068] Embodiment 1:

[0069] like Figure 7 As shown, this embodiment provides an exposure machine projection lens system 110, which includes a laser module 120, a lens device 140 and a DMD component 130. The laser module 120 and the DMD component 130 are respectively installed on the lens device 140. The laser module 120 emits a high-intensity optical signal through a laser. The DMD component 130 includes a micromirror chip module 131, which is a component for processing the optical signal to form a pattern to be exposed; the micromirror chip module 131 receives the optical signal emitted by the laser module 120, forms an optical pattern after processing, a part of which is reflected into the lens device 140, and the other part is absorbed to form heat energy.

[0070] Reference Figure 1-4As shown, the exposure machine projection lens system 110 includes a coolant cooling component 150 and a coolant control component 160. The coolant cooling component 150 is installed on the DMD component 130 and directly contacts the micromirror chip module 131 on the DMD component 130. Since the coolant is in direct contact with the micromirror chip module 131, the heat exchange between the two is more thorough, the temperature reduction is more direct, and the efficiency is higher.

[0071] The coolant control component 160 controls the flow rate and / or temperature of the coolant so that the temperature of the DMD component 130 is controlled within a preset temperature range. That is, when the micromirror chip module 131 is working, the micromirror chip module 131 heats up, and the coolant can quickly cool down the DMD component 130 and make the temperature not exceed 30 degrees.

[0072] During exposure, when the power of the laser module 120 increases, the exposure energy will also increase, thereby improving the efficiency of exposure. By using the coolant cooling component 150 to directly contact the micromirror chip module 131, the temperature is always kept below 30 degrees, so that the micromirror chip module 131 can withstand laser irradiation with a power of 100W-180W.

[0073] like Figure 4-5 As shown, in this embodiment, the cooling liquid cooling assembly 150 includes a cavity 151 for accommodating cooling liquid, and a first liquid inlet pipe 152 and a first liquid outlet pipe 153 connected to the cavity 151. The cavity 151 includes an outer wall and a first opening 154 formed by the outer wall. The cooling liquid cooling assembly 150 also includes a seal 155. The seal 155 is used to seal the connection between the outer wall of the cavity 151 and the micromirror chip module 131; the cooling liquid can flow into the first opening 154 formed by the outer wall of the cavity 151 through the first liquid inlet pipe 152 and directly contact the micromirror chip module 131, so that the micromirror chip module 131 is cooled quickly; and then flow out through the first liquid outlet pipe 153 to achieve a continuous cooling effect. The sealing member 155 is used for sealing to ensure that the cooling liquid will not leak out of the cavity 151. The DMD assembly with this structural design makes it more convenient for the cooling liquid to directly contact the micromirror chip module to facilitate heat dissipation.

[0074] In this embodiment, the DMD assembly 130 further includes a DMD data carrier board 132, a DMD integrated circuit board 133, a fixed pressure plate 135 and a DMD data card connector 134. The DMD data card connector 134 is installed on the DMD data carrier board 132; the DMD data carrier board 132 and the DMD integrated circuit board 133 control the micromirror chip module 131 to process the optical signal; the fixed pressure plate 135 realizes the installation of the DMD data carrier board 132, the DMD integrated circuit board 133 and the micromirror chip module 131 and the lens device 140.

[0075] like Figure 6 As shown, in this embodiment, the DMD data carrier board 132, the DMD integrated circuit board 133 and the fixed pressure plate 135 are located on the same side of the micromirror chip module 131 where the coolant cooling assembly 150 is located. The fixed pressure plate 135 is provided with a first clearance hole 13a, the DMD data carrier board 132 is provided with a second clearance hole 13b, and the DMD integrated circuit board 133 is provided with a third clearance hole 13c. The coolant cooling assembly 150 is directly in contact with the micromirror chip module 131 through the first clearance hole 13a, the second clearance hole 13b and the third clearance hole 13c in sequence, ensuring rapid cooling of the micromirror chip module 131. The DMD assembly with this structural design makes it more convenient for the coolant to directly contact the micromirror chip module to facilitate heat dissipation.

[0076] like Figure 6 As shown, in this embodiment, the coolant cooling assembly 150 further includes a pressure device 156. The pressure device 156 includes a fastening bolt 15a, a compression spring 15b, and an extrusion plate 15c installed outside the coolant cooling assembly 150. The fastening bolt 15a passes through the extrusion plate 15c and is fixed to the coolant cooling assembly 150. The compression spring 15b is sleeved on the fastening bolt 15a so that there is an extrusion force between the coolant cooling assembly 150 and the micromirror chip, ensuring that the seal 155 between the outer wall of the cavity 151 and the micromirror chip module 131 is always subjected to the extrusion force, thereby ensuring the seal between the outer wall and the micromirror chip module 131, and preventing the problem of coolant overflow due to insufficient extrusion force.

[0077] like Figure 4 , Figure 6 As shown, in another embodiment, the exposure machine projection lens system 110 further includes an adjustment component 170 for adjusting the position of the DMD component 130. The adjustment component 170 includes a fixing plate 171, an adjustment plate 172 and a mounting plate 173. The fixing plate 171 is fixedly mounted on the lens device 140. The adjustment plate 172 is provided with a concentric arc groove 17a, and the fixing plate 171 is fixed with a stopper 17b corresponding to the arc groove 17a. During installation, the adjustment plate 172 is placed on the fixing plate 171, and each stopper 17b is placed in a corresponding arc groove 17a. The stopper 17b can be a bolt. When adjusting the adjustment plate 172, the bolt is loosened upward, and the adjustment plate 172 is moved to rotate horizontally relative to the fixing plate 171. Then, the bolt is rotated to fix the adjustment plate 172 and the fixing plate 171, thereby ensuring the projection angle of the optical signal.

[0078] like Figure 1 , Figure 6As shown, in another embodiment, a first support block 271 is installed at a corner of the fixing plate 171, and a second support block 272 is installed at a corresponding corner of the adjusting plate 172. The first support block 271 is provided with a horizontally arranged clearance groove 273, and a rotating rod 274 is inserted in the clearance groove 273. The rotating rod 274 is provided with stoppers 275 on both sides of the clearance groove 273. The other end of the rotating rod 274 is inserted into the second support block 272 and is connected by threads. When the rotating rod 274 is rotated, the rotating rod 274 drives the adjusting plate 172 to rotate horizontally through the second support block 272, so that the rotation of the adjusting plate 172 is more stable.

[0079] like Figure 6 As shown, in another embodiment, a plurality of adjusting bolts 17c are installed on the mounting plate 173. Further, the number of the adjusting bolts 17c is greater than or equal to 3, and the axes of the plurality of adjusting bolts 17c are parallel and not on the same plane. When the adjusting bolts 17c are rotated, the adjusting bolts 17c move the corresponding position of the mounting plate 173 upward or downward. The bottom of the adjusting bolt 17c is hemispherical, and the adjusting bolt 17c contacts the adjusting plate 172 through the hemispherical shape. The adjusting bolt 17c is rotated to adjust the height change of the mounting plate 173, thereby ensuring that the projection height of the optical signal is consistent.

[0080] In this embodiment, the fixing plate 171 is provided with a fourth clearance hole 17d, the adjusting plate 172 is provided with a fifth clearance hole 17e, and the mounting plate 173 is provided with a sixth clearance hole 17f. When the optical signal is irradiated to the micromirror chip module 131, the optical signal can sequentially pass through the fourth clearance hole 17d, the fifth clearance hole 17e, and the sixth clearance hole 17f to irradiate the micromirror chip module 131. When the micromirror chip module 131 reflects the optical signal, the optical signal is then sequentially reflected through the sixth clearance hole 17f, the fifth clearance hole 17e, and the fourth clearance hole 17d.

[0081] like Figure 6 As shown, the exposure machine projection lens system 110 further includes a frame 136 and a gasket 137. The micromirror chip module 131 is installed in the frame 136, and the micromirror chip module 131 is installed on the mounting plate 173 through the frame 136. Bolts 138 are inserted into the fixed pressure plate 135, and the bolts 138 pass through the gasket 137, the DMD data carrier board 132 and the DMD integrated circuit board 133 to be fixed to the mounting plate 173. The gasket 137 causes the fixed pressure plate 135 to directly contact the DMD data carrier board 132, causing it to be damaged.

[0082] The coolant used in the coolant cooling assembly 150 of the present invention is fluorinated liquid, silicone oil, etc., which has good thermal conductivity and chemical inertness, which prevents corrosion of the micromirror chip module 131 and quickly conducts the generated heat away, achieving a good cooling effect, solving the problem of poor cooling effect between water cooling and air cooling.

[0083] like Figure 4 As shown, in this embodiment, the cooling liquid control component 160 is used to control the flow rate and / or temperature of the cooling liquid to ensure that the micromirror chip module 131 is controlled within a preset temperature range. When the micromirror chip module 131 has been working for a period of time, the more heat it absorbs, the faster the temperature rises. The cooling liquid control component 160 can control the temperature of the cooling liquid to decrease, or increase the flow rate of the cooling liquid, thereby increasing the heat exchange between the cooling liquid and the micromirror chip module 131, so that the micromirror chip module 131 cools down faster, and the temperature of the micromirror chip module 131 during operation is always maintained within a preset temperature range. In this embodiment, the preset temperature range is no more than 30 degrees, or 0-30 degrees.

[0084] Furthermore, in order to control the temperature of the micromirror chip module 131 within a precise range, the present embodiment further includes a temperature sensor 161. The temperature sensor 161 is used to detect the temperature of the micromirror chip module 131. Specifically, the temperature sensor 161 is arranged on the side of the micromirror chip module 131, and is used to detect the temperature of the micromirror chip module 131. The temperature sensor 161 detects the temperature of the micromirror chip module 131, and immediately feeds back the temperature data to the coolant control component 160, and the coolant control component 160 controls the flow rate and / or temperature of the coolant according to the instant temperature change. Specifically, the temperature sensor 161 monitors the temperature change of the micromirror chip module 131 for a period of time, and calculates the temperature change a, a=C1-C2 / T. C1 and C2 are two temperature values ​​separated by a period of time, T is a period of time, specifically, T can be 10 seconds, or 20 seconds or 1 second. When the temperature variation a increases, the cooling liquid control component 160 controls the temperature variation of the cooling liquid to increase (i.e., the cooling liquid is subjected to a cooling treatment), or controls the flow rate variation of the cooling liquid to increase, or controls the temperature variation and flow rate variation of the cooling liquid to increase at the same time. When the temperature variation a is not large, the cooling liquid control component 160 controls the flow rate of the cooling liquid to slow down. The temperature of the micromirror chip module 131 is monitored in real time by the temperature sensor 161, and the heat exchange change between the micromirror chip module 131 and the cooling liquid is controlled, so that the micromirror chip module 131 is maintained in a relatively stable constant temperature state when working. This is conducive to extending the service life of the micromirror chip module 131 and improving the working efficiency.

[0085] Since the present invention performs good heat dissipation and temperature control of the micromirror chip module 131 through the coolant cooling component 150 and the coolant control component 160, the micromirror chip module 131 can withstand more efficient laser irradiation. In this example, when the laser module 120 is in use, the power can be above 100W, and can even reach 180W.

[0086] The laser module 120 is more efficient and has a higher light utilization rate, which is beneficial to the exposure efficiency. At the same time, the number of lens devices 140 can be reduced, and similarly, the cost of the exposure machine is reduced.

[0087] Embodiment 2:

[0088] The present embodiment provides an exposure machine projection lens system 110, which includes: a coolant cooling assembly 150 installed on the DMD assembly 130 and in direct contact with the micromirror chip module 131. The coolant cooling assembly 150 includes a cooling chamber 251 for accommodating coolant, and an exhaust pipe 252, a heat insulation cotton 253 and a plurality of condensing tubes 254 directed to the micromirror chip module 131 accommodated in the cooling chamber 251. The cooling chamber 251 includes an outer wall and a second opening 255 formed by the outer wall. The plurality of condensing tubes 254 are evenly arranged on the micromirror chip module 131, and the condensing tubes 254 are U-shaped tubes, and the bottom of the condensing tubes 254 is in direct contact with the micromirror chip module 131; there is a clearance fit between two adjacent condensing tubes 254. By evenly arranging and matching the gap between two adjacent condensing tubes 254 on the micromirror chip module 131, any position on the micromirror chip module 131 can be simultaneously cooled by the cooling tubes while absorbing heat, thereby ensuring that the overall temperature of the micromirror chip module 131 is consistent, and there will be no problem of high temperature on one side and low temperature on the other side, thereby ensuring the stability of exposure during exposure.

[0089] like Figure 8-9 As shown, the outer side of the second liquid inlet pipe 256 of each condenser 254 is wrapped with heat insulation cotton 253. The heat insulation cotton 253 isolates the heat from the outer side of the second liquid inlet pipe 256, so that when the second liquid inlet pipe 256 of the condenser 254 is filled with liquid, the coolant in the second liquid inlet pipe 256 does not absorb the external heat, so that the coolant does not heat up before the coolant contacts the micromirror chip module 131 through the cooling pipe, ensuring that the coolant effectively absorbs the heat on the micromirror chip module 131. The liquid inlet ends of each second liquid inlet pipe 256 are connected, so that the liquid inlet temperature is kept consistent when the liquid is filled.

[0090] like Fig.12 As shown, the second liquid outlet pipe 257 of each condenser 254 is sleeved with an exhaust pipe 252. The exhaust pipe 252 extracts the heat dissipated by the second liquid outlet pipe 257 in time, so that the temperature in the cooling chamber 251 will not rise due to the heat dissipated by the second liquid outlet pipe 257, further ensuring that the temperature on the micromirror chip module 131 is not higher than 30 degrees. The liquid outlet ends of each second liquid outlet pipe 257 are connected; the upper ends of each exhaust pipe 252 sleeved on the second liquid outlet pipe 257 are connected, saving the outflow path and ensuring the same flow rate.

[0091] Please refer to Figure 10-11The portion where the condenser 254 contacts the micromirror chip module 131 is disc-shaped, which increases the contact surface between the condenser 254 and the micromirror chip module 131 and improves the effect of the condenser 254 absorbing heat from the micromirror chip module 131.

[0092] Similar to the first embodiment, the condensate in the condenser 254 is fluorinated liquid, silicone oil, etc., which will not be described in detail here.

[0093] Similar to the first embodiment, in order to control the temperature of the DMD component 130 within a precise range, the cooling liquid control component 160 of the present embodiment further includes a temperature sensor 161. The temperature sensor 161 is used to detect the temperature of the micromirror chip module 131. Specifically, the temperature sensor 161 is disposed on the surface of the micromirror chip module 131 and is used to detect the surface temperature of the micromirror chip module 131. The temperature sensor 161 detects the surface temperature of the micromirror chip module 131 and immediately feeds back the temperature data to the cooling liquid control component 160. The cooling liquid control component 160 controls the flow rate and / or temperature of the cooling liquid in the second liquid inlet pipe 256 according to the immediate temperature change. It is the same as the first embodiment and will not be described in detail here.

[0094] like Fig.13 As shown, this embodiment provides a high-efficiency exposure machine 210, including a base 180 with a workbench 190 installed. The workbench 190 is installed on the base 180 and is used to carry the workpiece 200 to be exposed. The exposure machine projection lens system 110 is installed on the workbench 190, and the exposure machine projection lens system 110 projects the light signal to the workpiece 200 to be exposed on the workbench 190 through the lens device 140. When the power of the laser irradiation reaches 100W-180W, the exposure efficiency is higher, that is, the exposure time can be shortened; the lens device 140 can also be appropriately reduced.

[0095] The object 200 to be exposed on the exposure machine 210 is a PCB board or other microelectronic devices and optical elements.

[0096] In summary, the present invention provides an exposure machine projection lens system and an exposure machine, which are installed on the DMD component through a coolant cooling component and are in direct contact with the micromirror chip module; the flow rate and / or temperature of the coolant in the coolant cooling component are controlled by the coolant control component, so that the temperature of the micromirror chip module does not exceed 30 degrees. By allowing the micromirror chip module to be quickly cooled under the direct action of the coolant, it is ensured that the micromirror chip module will not be damaged due to excessive temperature. At the same time, the temperature reduction can also enable the DMD module to withstand a laser power of 100W-180W, so that the exposure effect is better.

[0097] When a multi-group condensation arrangement design is adopted, and the use of heat insulation cotton and exhaust ducts is combined, the effect of rapid cooling can be achieved, and the temperature at any position on the micromirror chip module can be made the same, thereby ensuring stability during exposure.

[0098] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An exposure machine projection lens system, characterized in that: include: A laser module, used for emitting optical signals; The DMD component is used to receive the optical signal and reflect it to the lens device after processing; A lens device, used for projecting the light signal; A coolant cooling component, installed on the DMD component and used to cool the DMD component; A coolant control component, connected to the coolant cooling component, for controlling the flow rate and / or temperature of the coolant in the coolant cooling component, thereby controlling the temperature of the DMD component within a preset temperature range; The DMD component includes a micromirror chip module; The coolant cooling assembly includes a cooling chamber for containing coolant, and an exhaust pipe, heat insulation cotton and a plurality of condensing pipes directed to the micromirror chip module contained in the cooling chamber; the cooling chamber includes an outer wall and a second opening formed by the outer wall; A plurality of groups of condensing tubes are evenly arranged on the micromirror chip module, each of the condensing tubes is a U-shaped tube, and the bottom of the condensing tube is in direct contact with the micromirror chip module; The outer side of the second liquid inlet pipe of each condenser tube is wrapped with the heat insulation cotton, and the heat insulation cotton isolates the heat on the outer side of the second liquid inlet pipe; The liquid inlet end of each of the second liquid inlet pipes is connected; The outer jacket of the second liquid outlet pipe of each condenser pipe is provided with an exhaust pipe, and the exhaust pipe timely extracts the heat dissipated by the second liquid outlet pipe; The liquid outlet ends of each of the second liquid outlet pipes are connected; Each of the second liquid outlet pipes is connected to the upper end of the exhaust pipe sleeve.

2. The exposure machine projection lens system according to claim 1, characterized in that: The power of the laser module when in use is above 100W.

3. The exposure machine projection lens system according to claim 1, characterized in that: The DMD assembly also includes a DMD data carrier board, a DMD integrated circuit board, a DMD data card connector and a fixed pressure plate; The DMD data card connector is installed on the DMD data carrier board; The DMD data carrier, the DMD integrated circuit board and the fixed pressure plate are located on the same side of the micromirror chip module where the coolant cooling component is located; the fixed pressure plate is provided with a first clearance hole, the DMD data carrier is provided with a second clearance hole, and the DMD integrated circuit board is provided with a third clearance hole, and the coolant cooling component passes through the first clearance hole, the second clearance hole and the third clearance hole in sequence to directly contact the micromirror chip module.

4. The exposure machine projection lens system according to claim 1, characterized in that: The exposure machine projection lens system also includes an adjustment component for adjusting the position of the DMD component; the adjustment component includes a fixing plate, an adjustment plate and a mounting plate; The fixing plate is mounted on the lens device; The adjusting plate can rotate horizontally relative to the fixing plate; The mounting plate can move up and down relative to the fixing plate, and the DMD assembly is mounted on the mounting plate.

5. The exposure machine projection lens system according to claim 4, characterized in that: The adjusting plate is provided with arc grooves with the same center, and the fixing plate is fixed with stoppers corresponding to the arc grooves one by one, and the adjusting plate rotates horizontally via the stoppers; A plurality of adjusting bolts for moving up and down are arranged on the upper side of the mounting plate, the number of the adjusting bolts is greater than or equal to 3, the axes of the plurality of adjusting bolts are parallel and the axes are not on the same plane, and the up and down movement of the adjusting bolts drives the corresponding position of the mounting plate to move up and down.

6. A high-efficiency exposure machine, characterized in that: The exposure machine comprises: Pedestal; A workbench, which is mounted on the base and is used to carry the workpiece to be exposed; According to the exposure machine projection lens system as described in claim 1, the lens device projects the light signal onto the workpiece to be exposed on the workbench.

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