Semiconductor dehumidifying device and dehumidifying method thereof

Abstract

The application provides a semiconductor dehumidifying device and a dehumidifying method thereof, wherein the semiconductor dehumidifying device comprises a shell, a semiconductor cold-hot sheet in the shell; the cold-hot sheet divides the internal space of the shell into a condensation chamber and a heat dissipation chamber which are communicated with each other, the cold surface of the cold-hot sheet is located in the condensation chamber, and the hot surface is located in the heat dissipation chamber; the condensation chamber is provided with a first flow-through opening, the heat dissipation chamber is provided with a second flow-through opening, and the condensation chamber and the heat dissipation chamber are communicated with each other through a third flow-through opening; wherein along the direction from the first flow-through opening to the third flow-through opening, the condensation chamber is provided with a plurality of condensation nets with adjustable bending angles, so as to adjust the condensation efficiency of air passing through the condensation nets. The application can improve the condensation efficiency of water vapor in air and improve the dehumidifying efficiency of the semiconductor dehumidifying device.

Description

Technical Field

[0001] The present invention relates to the field of dehumidification devices, in particular to a semiconductor dehumidification device and a dehumidification method thereof. Background Art

[0002] In daily life, there are many scenarios where air dehumidification is required, such as in the bathroom after a hot shower, in a closed kitchen, and indoors during rainy weather and the rainy season.

[0003] Currently, semiconductor cooling elements can be used to dehumidify the air. The principle of semiconductor cooling elements is the Peltier effect. By changing the polarity of the DC current, both sides of the cooling element can achieve cooling and heating at the same time. Semiconductor cooling elements are widely used due to their very small thermal inertia and large temperature range (from -90°C to +130°C, and the temperature difference between the cooling elements can reach up to 70°C). However, the dehumidification efficiency of semiconductor cooling elements in related technologies is low.

[0004] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present invention, and therefore may include information that does not constitute prior art known to ordinary technicians in this field. Summary of the Invention

[0005] In view of this, the present invention provides a semiconductor dehumidification device and a dehumidification method thereof, so as to at least solve the problem of low dehumidification efficiency of the existing semiconductor dehumidification device.

[0006] In one aspect, an embodiment of the present invention provides a semiconductor dehumidification device, comprising: a housing, a semiconductor cooling and heating plate located in the housing;

[0007] The semiconductor cooling plate divides the internal space of the shell into a condensation chamber and a heat dissipation chamber which are interconnected. The cold surface of the semiconductor cooling plate is located in the condensation chamber, and the hot surface is located in the heat dissipation chamber.

[0008] The condensing chamber has a first flow opening, the heat dissipating chamber has a second flow opening, and the condensing chamber and the heat dissipating chamber are connected to each other through a third flow opening;

[0009] Wherein, in the direction from the first flow opening to the third flow opening, a plurality of condensation nets with adjustable bending angles are provided in the condensation chamber to adjust the condensation efficiency of the air passing through the condensation nets.

[0010] In some embodiments, the multiple condensation nets have the same structure and are parallel to each other, and the meshes of the condensation nets have a spike structure.

[0011] In some embodiments, the semiconductor dehumidification device further comprises:

[0012] A fixed heat transfer surface wraps the cold and hot surfaces of the semiconductor heat and cooling plate. The bottom edge of each condensation net is connected to the fixed heat transfer surface, and the top edge is connected to the shell.

[0013] Multiple rotation axes, each of which is parallel to the fixed temperature conducting surface and parallel to each other, each rotation axis is located at the center of each condensation network and connected thereto, and each condensation network is symmetrical about the rotation axis;

[0014] A damper shaft, the damper shaft is parallel to the fixed temperature conducting surface and perpendicular to each rotating shaft, and the damper shaft is connected to each rotating shaft;

[0015] The damper motor is located at the other end of the condensation chamber opposite to the first flow port. The damper motor is connected to the damper shaft and has a working state of making the damper shaft approach or move away from the damper motor to adjust the bending angle of the condensation net.

[0016] In some embodiments, the semiconductor dehumidification device further comprises:

[0017] a first ducting fan, the first ducting fan being located at the first flow opening and capable of sucking air into the condensing chamber at a low speed and at a high speed;

[0018] a second ducting fan, the second ducting fan being located at the second flow opening and having a working state of extracting air from the heat dissipation chamber at a low speed, extracting air at a high speed, and sucking air into the heat dissipation chamber at a high speed;

[0019] The third ducting fan is located at the third flow port and has the working states of extracting air from the condensation chamber at a low speed, extracting air at a high speed, and sucking air into the condensation chamber at a high speed.

[0020] In some embodiments, the semiconductor dehumidification device further comprises:

[0021] A water storage box is located at the bottom of the heat dissipation chamber;

[0022] Multiple diversion holes, the diversion holes are located in the condensation chamber near the inner edge of the shell, and the condensed water condensed in the condensation chamber flows into the water storage box at the bottom of the heat dissipation chamber through the diversion holes;

[0023] Multiple heat dissipation nets are located in the heat dissipation chamber and are arranged along the third flow port toward the second flow port. The multiple heat dissipation nets have the same structure and are parallel to each other. The lower end of the heat dissipation net is located in the water storage box and immersed in the condensed water formed by condensation.

[0024] In some embodiments, the semiconductor dehumidification device further comprises:

[0025] Atomizer: The atomizer is located in the heat dissipation chamber.

[0026] In some embodiments, the semiconductor dehumidification device further comprises:

[0027] a first temperature and humidity sensor, the first temperature and humidity sensor being located in the condensation chamber and close to the first ducted fan to detect the temperature and humidity of the gas flowing through the first ducted fan;

[0028] The second temperature and humidity sensor is located in the heat dissipation chamber and close to the second ducted fan to detect the temperature and humidity of the gas flowing through the second ducted fan.

[0029] In some embodiments, the bending angle of the condensation net, the power of the semiconductor cooling and heating plate, and the power and direction of the first, second and third ducted fans are adjusted through the temperature and humidity control algorithm to achieve the temperature and humidity values ​​of the second temperature and humidity sensor as preset values.

[0030] On the other hand, an embodiment of the present invention further provides a dehumidification method for a semiconductor dehumidification device, using the above-mentioned semiconductor dehumidification device, comprising:

[0031] Turn on the semiconductor hot and cold plate;

[0032] Air is drawn into the condensation chamber from outside the shell, and the air in the condensation chamber is cooled;

[0033] The air in the condensation chamber is pumped into the heat dissipation chamber, and the temperature and pressure of the air in the heat dissipation chamber are increased;

[0034] The high-temperature and high-pressure air in the heat dissipation chamber is drawn into the condensation chamber, and the air in the condensation chamber is cooled and condensed;

[0035] The cooled and condensed air in the condensation chamber is drawn into the heat dissipation chamber, and the cooled and condensed air is discharged from the heat dissipation chamber to the shell.

[0036] In some embodiments,

[0037] The sucking of air from outside the shell into the condensing chamber comprises: adjusting the first induced fan to suck air from outside the shell into the condensing chamber at a low speed, adjusting the third induced fan to draw air from the condensing chamber at a high speed, and adjusting the second induced fan to draw air from the heat dissipation chamber to outside the shell at a high speed;

[0038] The step of drawing the air from the condensing chamber to the heat dissipation chamber comprises: adjusting the first ducting fan to draw air from outside the housing into the condensing chamber at a high speed, adjusting the third ducting fan to draw air from the condensing chamber at a high speed, and adjusting the second ducting fan to draw air from the heat dissipation chamber to outside the housing at a low speed;

[0039] The step of drawing the high-temperature and high-pressure air in the heat dissipation chamber into the condensation chamber comprises: adjusting the first ducting fan to draw air from outside the housing into the condensation chamber at a high speed, adjusting the third ducting fan to draw air from the heat dissipation chamber at a high speed, and adjusting the second ducting fan to draw air from the housing into the heat dissipation chamber at a high speed;

[0040] The method of drawing the cooled and condensed air in the condensation chamber into the heat dissipation chamber, and discharging the cooled and condensed air from the heat dissipation chamber into the shell, includes: adjusting the first guide fan to draw air from outside the shell into the condensation chamber at high speed, adjusting the third guide fan to draw air from the condensation chamber at low speed, and adjusting the second guide fan to draw air from the heat dissipation chamber to outside the shell at low speed.

[0041] In some embodiments,

[0042] The system draws air from outside the housing into the condensation chamber and cools the air in the condensation chamber, and further comprises: driving the damper motor to drive the condensation net to bend in a direction from the first induced fan to the third induced fan, so as to adjust the condensation efficiency of the air passing through the condensation net;

[0043] The high-temperature and high-pressure air in the heat dissipation chamber is drawn into the condensation chamber, and the air in the condensation chamber is cooled and condensed. It also includes: driving the damper motor to drive the condensation net to bend in the direction from the third guide fan to the first guide fan to adjust the condensation efficiency of the air passing through the condensation net.

[0044] In some embodiments, the method of pumping air from the condensation chamber to the heat dissipation chamber and increasing the temperature and pressure of the air in the heat dissipation chamber further includes:

[0045] Turn on the atomizer and humidify the gas entering the heat dissipation chamber from the condensation chamber.

[0046] The semiconductor dehumidification device and dehumidification method of the present invention, wherein the semiconductor dehumidification device can improve the condensation efficiency of water vapor in the air and improve the dehumidification efficiency of the semiconductor dehumidification device by setting a plurality of condensation nets whose bending angles can be adjusted according to the air flow direction; the dehumidification method of the semiconductor dehumidification device first quickly cools the air in the condensation chamber, then heats and pressurizes the air in the heat dissipation chamber, and then re-leads the air back to the condensation chamber for condensation, thereby improving the temperature difference and pressure difference between the air and the condensation chamber, thereby improving the condensation efficiency of water vapor in the air and further improving the dehumidification efficiency of the semiconductor dehumidification device. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] The accompanying drawings are incorporated into and constitute a part of this specification, illustrate embodiments consistent with the present invention, and together with the description, serve to explain the principles of the present invention. Obviously, the drawings described below are only some embodiments of the present invention, and it is clear that those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0048] Figure 1 1 is a schematic structural diagram of a semiconductor dehumidification device provided by an embodiment of the present invention;

[0049] Figure 2yes Figure 1 Schematic diagram of the structure of the condensation net of the semiconductor dehumidification device when it is bent;

[0050] Figure 3 yes Figure 1 Schematic diagram of the mesh structure of the middle condensation net;

[0051] Figure 4 yes Figure 1 Schematic diagram of the connection structure of the condensation network;

[0052] Figure 5 yes Figure 2 Schematic diagram of the cross section of AA';

[0053] Figure 6 yes Figure 1 A schematic diagram of display content of a display screen;

[0054] Figure 7 This is a module diagram of a semiconductor dehumidification device provided by an embodiment of the present invention;

[0055] Figure 8 This is a flowchart of a dehumidification method for a semiconductor dehumidification device provided by an embodiment of the present invention;

[0056] Figure 9 yes Figure 8 Schematic diagram of the operation of the semiconductor dehumidification device in steps S120 and S140.

[0057] Reference numerals:

[0058] 10. Housing; 20. Semiconductor cooling and heating plate; 21. Cold surface; 22. Hot surface; 30. Condensation chamber; 31. Condensation net; 40. Heat dissipation chamber; 41. Heat dissipation net; 51. Temperature conducting surface; 52. Rotating shaft; 53. Damper shaft; 54. Damper motor; 55. Fixed shaft; 61. First ducted fan; 62. Second ducted fan; 63. Third ducted fan; 71. Water storage box; 72. Diversion hole; 80. Atomizer; 91. First temperature and humidity sensor; 92. Second temperature and humidity sensor; 93. Main board; 94. Display screen. DETAILED DESCRIPTION

[0059] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be comprehensive and complete and will fully convey the concepts of the example embodiments to those skilled in the art. Identical reference numerals in the figures represent identical or similar structures, and thus a repeated description thereof will be omitted.

[0060] The terms "first", "second", and similar terms used in the description are not intended to denote any order, quantity, or importance, but are used to distinguish different constituent parts. In addition, in the description of the present application, the terms "upper", "lower", and the like indicate the orientation or positional relationship shown in the drawings, which is merely for the convenience of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0061] It should be noted that the embodiments of the present application and the features in different embodiments can be combined with each other without conflict.

[0062] The present application provides a semiconductor dehumidification device and a dehumidification method thereof. The semiconductor dehumidification device comprises a shell, a semiconductor cold-hot sheet located in the shell. The cold-hot sheet divides the internal space of the shell into a condensation chamber and a heat dissipation chamber which are in communication with each other. The cold surface of the cold-hot sheet is located in the condensation chamber, and the hot surface is located in the heat dissipation chamber. The condensation chamber has a first flow-through opening, the heat dissipation chamber has a second flow-through opening, and the condensation chamber and the heat dissipation chamber are in communication with each other through a third flow-through opening. In the direction from the first flow-through opening to the third flow-through opening, the condensation chamber has a plurality of condensation nets with adjustable bending angles to adjust the condensation efficiency of air passing through the condensation nets. The dehumidification method of the semiconductor dehumidification device uses the above semiconductor dehumidification device, which comprises the following steps: turning on the semiconductor cold-hot sheet; inhaling air from outside the shell into the condensation chamber and cooling the air in the condensation chamber; pumping the air in the condensation chamber to the heat dissipation chamber and heating and pressurizing the air in the heat dissipation chamber; pumping the high-temperature and high-pressure air in the heat dissipation chamber into the condensation chamber and cooling and condensing the air in the condensation chamber; pumping the air in the condensation chamber after cooling and condensation into the heat dissipation chamber, and discharging the air after cooling and condensation from the heat dissipation chamber to the shell. The semiconductor dehumidification device can improve the condensation efficiency of water vapor in the air and the dehumidification efficiency of the semiconductor dehumidification device by setting a plurality of condensation nets with adjustable bending angles according to the flow direction of the air. The dehumidification method of the semiconductor dehumidification device can improve the condensation efficiency of water vapor in the air by first cooling the air in the condensation chamber, then heating and pressurizing the air in the heat dissipation chamber, and then re-directing the air to the condensation chamber for condensation, thereby improving the temperature difference and pressure difference between the air and the condensation chamber and improving the dehumidification efficiency of the semiconductor dehumidification device.

[0063] As shown in Figure 1 and Figure 2 In one aspect, the semiconductor dehumidification device provided by the embodiments of the present application comprises a shell 10 and a semiconductor cold-hot sheet 20, and the semiconductor cold-hot sheet 20 is horizontally placed in the interior of the shell 10.

[0064] Specifically, the semiconductor cooling element 20 divides the interior space of the housing 10 into a condensing chamber 30 and a heat dissipation chamber 40, which are interconnected. The cold surface 21 of the semiconductor cooling element 20 is located in the condensing chamber 30, and the hot surface 22 is located in the heat dissipation chamber 40. The semiconductor cooling element 20 is positioned horizontally, so that the condensing chamber 30 is located above the heat dissipation chamber 40. The condensing chamber 30 has a first flow opening, and the heat dissipation chamber 40 has a second flow opening. The condensing chamber 30 and the heat dissipation chamber 40 are interconnected through a third flow opening. Air enters the condensing chamber 30 and the heat dissipation chamber 40 through the first and second flow openings, respectively, enters or leaves the heat dissipation chamber 40 through the third flow opening, and finally exits the semiconductor dehumidification device through the second flow opening. During this process, the semiconductor dehumidification device completes the dehumidification of the air.

[0065] Furthermore, along the direction from the first flow opening to the third flow opening, the condensation chamber 30 includes multiple condensation nets 31 with adjustable bending angles to adjust the condensation efficiency of the air passing through the condensation nets 31. The condensation chamber 30 cools the air, and the condensation nets 31 increase their contact area with the cool air, thereby improving the condensation efficiency of the water vapor in the air and the dehumidification efficiency of the semiconductor dehumidifier. Furthermore, the condensation nets 31 can bend in a direction that changes according to the direction of air flow, specifically, so that the bending direction of the condensation nets 31 aligns with the direction of air flow, further improving the condensation efficiency of the water vapor in the air.

[0066] like Figure 1 、 Figure 2 and Figure 3 As shown, in some embodiments, multiple condensation nets 31 have the same structure and are parallel to each other, and the mesh of the condensation net 31 has a spike structure (not shown in the figure). Specifically, the bending of the multiple condensation nets 31 is performed simultaneously, and the bending degree is the same, so that the multiple condensation nets 31 are parallel to each other for easy control. The mesh diameter of the condensation net 31 can be set as fine as possible to increase the contact area and contact time between the condensation net 31 and the air, so as to improve the condensation efficiency of water vapor in the air. The spike structure of the mesh can further increase the contact area with the cold air, so as to improve the condensation efficiency of water vapor in the air and improve the dehumidification efficiency of the semiconductor dehumidification device.

[0067] like Figure 3 and Figure 4 As shown, in some embodiments, the semiconductor dehumidification device further includes a fixed thermal conductive surface 51. The fixed thermal conductive surface 51 wraps around the cold surface 21 and hot surface 22 of the semiconductor cooling / heating plate 20. The bottom edge of each condensation net 31 is connected to the fixed thermal conductive surface 51, and the top edge is connected to the housing 10. Specifically, the fixed thermal conductive surface 51 is made of metal to facilitate heat transfer between the cold surface 21 of the semiconductor cooling / heating plate 20 and the condensation net 31. A metal hinge is provided on the surface of the fixed thermal conductive surface 51 to securely connect to the bottom edge of the condensation net 31.

[0068] Continue to refer Figure 3 and Figure 4 In some embodiments, the semiconductor dehumidification device further includes multiple rotating shafts 52. The rotating shafts 52 are parallel to the fixed heat conducting surface 51 and are arranged in pairs. Each rotating shaft 52 is located at the center of and connected to each condensation net 31, and each condensation net 31 is symmetrical about the rotating shafts 52. The aforementioned positioning of the rotating shafts 52 facilitates the bending of the condensation nets 31 and facilitates unified control of the condensation nets 31.

[0069] Continue to refer Figure 4 In some embodiments, the semiconductor dehumidification device further includes a damper shaft 53. The damper shaft 53 is parallel to the fixed heat conducting surface 51 and perpendicular to each rotating shaft 52. The damper shaft 53 is connected to each rotating shaft 52. The damper shaft 53 reciprocates along the air flow direction, driving the rotating shaft 52 to reciprocate along the air flow direction, thereby further driving the condensation net 31 to bend.

[0070] Continue to refer Figure 4 In some embodiments, the semiconductor dehumidification device further includes a damper motor 54. The damper motor 54 is located at the other end of the condensation chamber 30, opposite the first flow opening. The damper motor 54 is connected to the damper shaft 53 and can move the damper shaft 53 toward or away from the damper motor 54 to adjust the bending angle of the condensation net 31. This arrangement allows the damper motor 54 to uniformly control the simultaneous bending of multiple condensation nets 31, with the same degree of bending, so that each of the condensation nets 31 is parallel.

[0071] Continue to refer Figure 4 In some embodiments, the semiconductor dehumidification device further includes a plurality of fixed shafts 55. The first end of each fixed shaft 55 is connected to the fixed heat conducting surface 51, and the second end is connected to the damper shaft 53 to provide vertical support for the damper shaft 53. Furthermore, the fixed shafts 55 are connected to the rotating shaft 52, and the rotating shaft 52 is connected to the damper shaft 53 to provide vertical support for both.

[0072] Continue to refer Figure 1In some embodiments, the semiconductor dehumidification device further includes: a first ducting fan 61, a second ducting fan 62, and a third ducting fan 63. Specifically, the first ducting fan 61 is used to achieve air circulation between the outside of the shell 10 and the inside of the condensation chamber 30; the second ducting fan 62 is used to achieve air circulation between the outside of the shell 10 and the inside of the heat dissipation chamber 40; and the third ducting fan 63 is used to achieve air circulation between the inside of the condensation chamber 30 and the inside of the heat dissipation chamber 40. Furthermore, the first ducting fan 61 is located at the first circulation port and has a working state of sucking air into the condensation chamber 30 at a low speed and sucking air at a high speed. The second ducting fan 62 is located at the second circulation port and has a working state of extracting air from the heat dissipation chamber 40 at a low speed, extracting air at a high speed, and sucking air into the heat dissipation chamber 40 at a high speed. The third ducting fan 63 is located at the third circulation port and has a working state of extracting air from the condensation chamber 30 at a low speed, extracting air at a high speed, and sucking air into the condensation chamber 30 at a high speed. Furthermore, the first guide fan 61, the second guide fan 62 and the third guide fan 63 work together to enable air to enter the condensation chamber 30 and the heat dissipation chamber 40 from the first flow port and the second flow port respectively, enter or leave the heat dissipation chamber 40 from the third flow port, and finally flow out of the semiconductor dehumidification device from the second flow port. In this process, the semiconductor dehumidification device completes the dehumidification of the air.

[0073] like Figure 1 and Figure 5 As shown, in some embodiments, the semiconductor dehumidification device further includes: a water storage box 71 , a plurality of guide holes 72 and a plurality of heat dissipation nets 41 .

[0074] Specifically, a water storage box 71 is located at the bottom of the heat dissipation chamber 40 and is used to collect condensed water from the semiconductor dehumidifier. A diversion hole 72 is located at the inner edge of the condensation chamber 30 near the housing 10. Condensed water formed in the condensation chamber 30 flows through the diversion hole 72 into the water storage box 71 at the bottom of the heat dissipation chamber 40. A heat dissipation net 41 is located in the heat dissipation chamber 40 and is arranged along the third flow opening toward the second flow opening. Multiple heat dissipation nets 41 have the same structure and are arranged in parallel. The lower ends of the heat dissipation nets 41 are located in the water storage box 71 and are immersed in the condensed water.

[0075] Furthermore, the water storage box 71 can be configured to cover the entire bottom of the heat dissipation chamber 40, so that the lower end of the heat dissipation net 41 is immersed in condensed water to cool the heat dissipation net 41. Since the temperature difference between the cold surface 21 and the hot surface 22 of the semiconductor heat dissipation plate 20 is generally a fixed value, by cooling the heat dissipation net 41, the temperature of the hot surface 22 of the semiconductor heat dissipation plate 20 can be reduced, thereby reducing the temperature of the cold surface 21, thereby further improving the dehumidification efficiency of the semiconductor dehumidification device. At the same time, the metal material of the fixed temperature conducting surface 51 can also facilitate heat transfer between the hot surface 22 of the semiconductor heat dissipation plate 20 and the heat dissipation net 41. In addition, the guide hole 72 is located in the condensation chamber 30 near the inner edge of the shell 10, so that the condensed water entering the heat dissipation chamber 40 from the guide hole 72 can flow into the water storage box 71 along the side wall of the shell 10, thereby guiding the condensed water.

[0076] Furthermore, similar to the condensation net 31, the heat dissipation net 41 can also be set to a bendable structure, and adopt a fine mesh and a spike structure on the mesh to improve the heat exchange efficiency with the air and quickly heat up the air.

[0077] Continue to refer Figure 1 In some embodiments, the semiconductor dehumidification device further includes an atomizer 80. The atomizer 80 is located in the heat dissipation chamber 40. The atomizer 80 can humidify the air that flows through the condensation chamber 30 and then enters the heat dissipation chamber 40 after condensation. This can improve the condensation efficiency of the humidified air after it re-enters the condensation chamber 30, thereby further improving the dehumidification efficiency of the semiconductor dehumidification device.

[0078] Continue to refer Figure 1 In some embodiments, the semiconductor dehumidification device further includes: a first temperature and humidity sensor 91 and a second temperature and humidity sensor 92. Specifically, the first temperature and humidity sensor 91 is located in the condensation chamber 30, near the first ducted fan 61, to detect the temperature and humidity of the gas flowing through the first ducted fan 61. The second temperature and humidity sensor 92 is located in the heat dissipation chamber 40, near the second ducted fan 62, to detect the temperature and humidity of the gas flowing through the second ducted fan 62. The temperature and humidity readings of the first temperature and humidity sensor 91 and the second temperature and humidity sensor 92 can be used to detect the dehumidification efficiency of the semiconductor dehumidification device and reflect the current dehumidification status of the semiconductor dehumidification device.

[0079] like Figure 1 and Figure 6 As shown, in some embodiments, the semiconductor dehumidification device further includes a display screen 94. Display screen 94 is used to display the temperature and humidity readings of the air at the first and second air flow ports, that is, the temperature and humidity readings of the first and second temperature and humidity sensors 91, 92. Display screen 94 can also be used to display the target air temperature for the semiconductor dehumidification device to operate, or the current ambient air temperature.

[0080] As Figure 1 and Figure 7 In some embodiments, the semiconductor dehumidification device further comprises a mainboard 93, a processor, a water level sensor, a wind speed sensor, a fan motor and a cold and hot sheet driver.

[0081] Specifically, the mainboard 93 and the processor are used to control other components of the semiconductor dehumidification device to collectively complete the dehumidification of air. The water level sensor can be two, respectively located in the atomizer 80 and the water storage box 71, to prompt the water level in the atomizer 80 and the water storage box 71, to remind the user to add water to the atomizer 80 and take out condensed water from the water storage box 71. The wind speed sensor can also be two, respectively located near the first and second temperature and humidity sensors 91 and 92, to detect the wind speed of the gas flowing through the first and second air guide fans 61 and 62. The fan motor can be three, respectively controlling the forward and reverse rotation of the first, second and third air guide fans 61, 62 and 63, to control the air to flow through the first, second and third air guide fans 61, 62 and 63 from different directions. The processor controls the working power of the semiconductor cold and hot sheet 20 through the cold and hot sheet driver.

[0082] In some embodiments, by a temperature and humidity control algorithm, the bending angle of the condensation net 31, the power of the semiconductor cold and hot sheet 20, and the power and steering of the first, second and third air guide fans 61, 62 and 63 are adjusted to achieve the preset value of the temperature and humidity value of the second temperature and humidity sensor 92. The temperature and humidity value of the second temperature and humidity sensor 92 is usually the temperature and humidity value of the air that the user hopes to obtain, and the bending angle of the condensation net 31, the power of the semiconductor cold and hot sheet 20, and the power and steering of the first, second and third air guide fans 61, 62 and 63 can all affect the condensation efficiency of the semiconductor dehumidification device to quickly achieve the temperature and humidity value of the air that the user hopes to obtain. Specifically, the temperature and humidity control algorithm can be a PID control algorithm. PID (Proportion, Integration, Differentiation) refers to proportional, integral and differential control. The principle of the PID control algorithm is that after obtaining the output of the system, the output is subjected to three operation methods of proportion, integration and differentiation, and is superimposed into the input, thereby controlling the behavior of the system. In this application, the semiconductor dehumidification device can be the aforementioned system.

[0083] In some embodiments, the semiconductor dehumidification device further comprises a voice recognition module and an Internet of Things module. Specifically, the voice recognition module can be used to realize the voice interaction between the semiconductor dehumidification device and the user. The Internet of Things module can be used to realize the network connection between the semiconductor dehumidification device and the smart terminal. The smart terminal can be a mobile phone or a computer, etc.

[0084] The semiconductor dehumidification device of the present application can improve the condensation efficiency of water vapor in the air and the dehumidification efficiency of the semiconductor dehumidification device by setting multiple condensation nets 31 that can adjust the bending angle according to the air flow direction, the mesh and thorn structure of the condensation net 31, the cooling of the condensed water on the heat dissipation net 41, and the temperature and humidity control algorithm.

[0085] As shown in Figure 8 and Figure 9 In another aspect, the embodiments of the present application also provide a dehumidification method of a semiconductor dehumidification device, which uses the semiconductor dehumidification device described above, and includes:

[0086] S110, turning on the semiconductor cooling and heating sheet 20;

[0087] S120, inhaling air from the outside of the shell 10 to the condensation chamber 30 and cooling the air in the condensation chamber 30;

[0088] S130, pumping the air in the condensation chamber 30 to the heat dissipation chamber 40 and warming and pressurizing the air in the heat dissipation chamber 40;

[0089] S140, pumping the high-temperature and high-pressure air in the heat dissipation chamber 40 into the condensation chamber 30 and cooling the air in the condensation chamber 30;

[0090] S150, pumping the air after cooling and condensation in the condensation chamber 30 into the heat dissipation chamber 40, and discharging the air after cooling and condensation from the heat dissipation chamber 40 to the outside of the shell 10.

[0091] The above method can improve the temperature difference and pressure difference between the air and the condensation chamber 30 by first cooling the air in the condensation chamber 30, then warming and pressurizing the air in the heat dissipation chamber 40, and then re-directing the air to the condensation chamber 30 for condensation, so as to improve the condensation efficiency of water vapor in the air and the dehumidification efficiency of the semiconductor dehumidification device.

[0092] It is worth noting that S110-S150 are only step labels, which are used for reference and to avoid repetition of words, and do not limit the implementation order of each step of the method. In other embodiments, the above steps of the method can also be written in a different order, and are not limited to this. The subsequent step labels in the present application all have the same meaning, and the repeated parts will not be described again.

[0093] In some embodiments, for the step S120 of "inhaling air from the outside of the shell 10 to the condensation chamber 30", it can include: adjusting the first air guide fan 61 to inhale air from the outside of the shell 10 to the condensation chamber 30 at a low speed, adjusting the third air guide fan 63 to pump out air from the condensation chamber 30 at a high speed, and adjusting the second air guide fan 62 to pump out air from the heat dissipation chamber 40 to the outside of the shell 10 at a high speed.

[0094] Specifically, for step S120, it aims to adjust the first fan 61, the second fan 62 and the third fan 63 so that the condensation chamber 30 is in a low-pressure state and the heat dissipation chamber 40 is in a normal-pressure state, thereby reducing the amount of air in the condensation chamber 30 and achieving rapid cooling and condensation of the air in the condensation chamber 30.

[0095] In some embodiments, for "drawing air from the condensation chamber 30 to the heat dissipation chamber 40" in step S130, it can include: adjusting the first guide fan 61 to draw air from outside the shell 10 to the condensation chamber 30 at high speed, adjusting the third guide fan 63 to draw air from the condensation chamber 30 at high speed, and adjusting the second guide fan 62 to draw air from the heat dissipation chamber 40 to the outside of the shell 10 at low speed.

[0096] Specifically, for step S130, it aims to adjust the first guide fan 61, the second guide fan 62 and the third guide fan 63 so that the condensation chamber 30 is in a normal pressure state and the heat dissipation chamber 40 is in a high pressure state, so that the air cooled and condensed in step S120 forms a high-temperature and high-pressure gas in the heat dissipation chamber 40, thereby forming a larger temperature and pressure difference with the condensation chamber 30.

[0097] In some embodiments, step S140 of drawing high-temperature and high-pressure air in the heat dissipation chamber 40 into the condensation chamber 30 may include: adjusting the first guide fan 61 to draw air at high speed from outside the shell 10 into the condensation chamber 30, adjusting the third guide fan 63 to draw air out from the heat dissipation chamber 40 at high speed, and adjusting the second guide fan 62 to draw air from the shell 10 into the heat dissipation chamber 40 at high speed.

[0098] Specifically, step S140 aims to maintain a high-pressure state in the condensing chamber 30 and a normal-pressure state in the heat dissipation chamber 40 by adjusting the first, second, and third air guide fans 61, 62, and 63, so that the high-temperature, high-pressure gas in the heat dissipation chamber 40 in step S130 is quickly directed back to the condensing chamber 30 for condensation. Since the greater the temperature and pressure difference between the air and the condensing chamber 30, the higher the air condensation efficiency, this step can achieve rapid condensation and dehumidification of the gas.

[0099] In some embodiments, step S150 may include: adjusting the first fan 61 to draw air at high speed from outside the shell 10 to the condensation chamber 30, adjusting the third fan 63 to draw air out of the condensation chamber 30 at low speed, and adjusting the second fan 62 to draw air out of the heat dissipation chamber 40 to the outside of the shell 10 at low speed.

[0100] Specifically, step S150 aims to maintain a high-pressure state in the condensation chamber 30 and a normal-pressure state in the heat dissipation chamber 40 by adjusting the first, second, and third air ducts 61, 62, and 63, thereby discharging the gas condensed and dehumidified in step S140 from the heat dissipation chamber 40 and simultaneously cooling the heat dissipation chamber 40. Since the temperature difference between the cold surface 21 and the hot surface 22 of the semiconductor heat dissipation plate 20 is typically a fixed value, cooling the heat dissipation network 41 can reduce the temperature of the hot surface 22 of the semiconductor heat dissipation plate 20, thereby reducing the temperature of the cold surface 21, thereby further improving the dehumidification efficiency of the semiconductor dehumidification device.

[0101] In some embodiments, step S120 further includes driving the damper motor 54 to cause the condensation net 31 to bend in a direction from the first guide fan 61 to the third guide fan 63 to adjust the condensation efficiency of the air passing through the condensation net 31. At this time, the bending direction of the condensation net 31 is the same as the flow direction of the air, thereby increasing the contact area and contact time between the condensation net 31 and the air, further improving the condensation efficiency of the water vapor in the air.

[0102] In some embodiments, step S140 further includes driving the damper motor 54 to cause the condensation net 31 to bend in a direction from the third guide fan 63 to the first guide fan 61, thereby adjusting the condensation efficiency of the air passing through the condensation net 31. At this time, the bending direction of the condensation net 31 is the same as the flow direction of the air, thereby increasing the contact area and contact time between the condensation net 31 and the air, further improving the condensation efficiency of the water vapor in the air.

[0103] In some embodiments, step S130 further includes: turning on the atomizer 80 and humidifying the gas entering the heat dissipation chamber 40 from the condensation chamber 30. The atomizer 80 can humidify the air that flows through the condensation chamber 30 and then enters the heat dissipation chamber 40 after condensation. Since the greater the humidity difference between the air and the condensation chamber 30, the better the condensation effect, the humidification of the air by the atomizer 80 can improve the condensation efficiency of the humidified air after it re-enters the condensation chamber 30, thereby further improving the dehumidification efficiency of the semiconductor dehumidification device.

[0104] In some embodiments, the dehumidification method for a semiconductor dehumidification device further includes:

[0105] The first temperature and humidity sensor 91 and the second temperature and humidity sensor 92 detect the temperature and humidity of the air flowing through the first and second ducting fans 61 and 62 in real time and display the temperature and humidity on the display screen 94 in real time. The above steps can detect the dehumidification efficiency of the semiconductor dehumidification device and reflect the current dehumidification status of the semiconductor dehumidification device through the temperature and humidity readings of the first and second temperature and humidity sensors 91 and 92.

[0106] In some embodiments, the dehumidification method for a semiconductor dehumidification device further includes:

[0107] When the reading of the second temperature and humidity sensor 92 is not equal to the preset value, that is, when the temperature and humidity of the air flowing out of the semiconductor dehumidifier does not meet the preset value, the temperature and humidity control algorithm adjusts the bending angle of the condensation net 31, the power of the semiconductor cooling and heating plate 20, and the power and direction of the first, second, and third ducting fans 61, 62, 63 to achieve the preset temperature and humidity value of the second temperature and humidity sensor 92. The above steps can be adjusted intelligently to quickly achieve the desired air temperature and humidity value.

[0108] The dehumidification method of the semiconductor dehumidifier of the present invention first cools the air in the condensation chamber 30, then heats and pressurizes the air in the heat dissipation chamber 40, and then returns the air to the condensation chamber 30 for condensation, thereby increasing the temperature difference and pressure difference between the air and the condensation chamber 30, thereby improving the condensation efficiency of water vapor in the air, and further improving the dehumidification efficiency of the semiconductor dehumidifier.

[0109] In summary, the semiconductor dehumidification device and the dehumidification method thereof of the present invention, wherein the semiconductor dehumidification device, by providing a plurality of condensation nets whose bending angles can be adjusted according to the air flow direction, can improve the condensation efficiency of water vapor in the air and improve the dehumidification efficiency of the semiconductor dehumidification device; the dehumidification method of the semiconductor dehumidification device, by first cooling the air in the condensation chamber, then heating and pressurizing the air in the heat dissipation chamber, and then re-guiding the air back to the condensation chamber for condensation, thereby improving the temperature difference and pressure difference between the air and the condensation chamber, thereby improving the condensation efficiency of water vapor in the air, and thus improving the dehumidification efficiency of the semiconductor dehumidification device.

[0110] The above is a further detailed description of the present invention in conjunction with specific optional embodiments, and the specific implementation of the present invention should not be considered to be limited to these descriptions. For those skilled in the art of the present invention, without departing from the concept of the present invention, several simple deductions or substitutions can be made, which should be considered to fall within the scope of protection of the present invention.

Claims

1. A semiconductor dehumidification device, characterized in that: include: A housing, and a semiconductor cooling and heating element located in the housing; The semiconductor cooling plate divides the internal space of the housing into a condensation chamber and a heat dissipation chamber that are interconnected. The cold surface of the semiconductor cooling plate is located in the condensation chamber, and the hot surface is located in the heat dissipation chamber. The condensing chamber has a first flow opening, the heat dissipation chamber has a second flow opening, and the condensing chamber and the heat dissipation chamber are connected to each other through a third flow opening; Wherein, along the direction from the first flow opening to the third flow opening, the condensation chamber is provided with a plurality of condensation nets with adjustable bending angles to adjust the condensation efficiency of the air passing through the condensation nets; The semiconductor dehumidification device further comprises: A fixed thermal conductive surface, the fixed thermal conductive surface wrapping the cold surface and the hot surface of the semiconductor cooling and heating plate, the bottom edge of each condensation net being connected to the fixed thermal conductive surface, and the top edge being connected to the housing; A plurality of rotating shafts, each of the rotating shafts being parallel to the fixed temperature conducting surface and being parallel to each other, each of the rotating shafts being located at the center of and connected to each of the condensation nets, and each of the condensation nets being symmetrical about the rotating shaft; a damper shaft, the damper shaft being parallel to the fixed temperature conducting surface and perpendicular to each of the rotating shafts, the damper shaft being connected to each of the rotating shafts; A damper motor is located at the other end of the condensation chamber opposite to the first flow port, the damper motor is connected to the damper shaft, and has a working state of making the damper shaft approach or move away from the damper motor to adjust the bending angle of the condensation net.

2. The semiconductor dehumidification device according to claim 1, characterized in that The multiple condensation nets have the same structure and are parallel to each other, and the meshes of the condensation nets have a spike structure.

3. The semiconductor dehumidification device according to claim 1, characterized in that Also includes: a first ducting fan, the first ducting fan being located at the first flow opening and capable of sucking air into the condensing chamber at a low speed and at a high speed; a second ducting fan, the second ducting fan being located at the second flow opening and having a working state of extracting air from the heat dissipation chamber at a low speed, extracting air at a high speed, and sucking air into the heat dissipation chamber at a high speed; The third ducting fan is located at the third flow port and has the working states of extracting air from the condensing chamber at a low speed, extracting air at a high speed, and sucking air into the condensing chamber at a high speed.

4. The semiconductor dehumidification device according to claim 1, characterized in that Also includes: A water storage box, located at the bottom of the heat dissipation chamber; a plurality of guide holes, wherein the guide holes are located in the condensation chamber near the inner edge of the shell, and the condensed water condensed in the condensation chamber flows into the water storage box at the bottom of the heat dissipation chamber through the guide holes; Multiple heat dissipation nets are located in the heat dissipation chamber and are arranged along the third flow port toward the second flow port. The multiple heat dissipation nets have the same structure and are parallel to each other. The lower end of the heat dissipation net is located in the water storage box and immersed in the condensed water formed by condensation.

5. The semiconductor dehumidification device according to claim 3, characterized in that: Also includes: An atomizer is located in the heat dissipation chamber.

6. The semiconductor dehumidification device according to claim 3, characterized in that: a first temperature and humidity sensor, located in the condensation chamber and close to the first ducted fan, to detect the temperature and humidity of the gas flowing through the first ducted fan; The second temperature and humidity sensor is located in the heat dissipation chamber and close to the second ducted fan to detect the temperature and humidity of the gas flowing through the second ducted fan.

7. The semiconductor dehumidification device according to claim 6, characterized in that: Through the temperature and humidity control algorithm, the bending angle of the condensation net, the power of the semiconductor cooling and heating plate, and the power and direction of the first, second and third ducted fans are adjusted to achieve the temperature and humidity values ​​of the second temperature and humidity sensor as preset values.

8. A dehumidification method for a semiconductor dehumidification device, using the semiconductor dehumidification device according to claim 5, characterized in that: include: Turning on the semiconductor hot and cold plate; Inhaling air from outside the housing into the condensation chamber and cooling the air in the condensation chamber; Pumping the air from the condensation chamber into the heat dissipation chamber, and increasing the temperature and pressure of the air in the heat dissipation chamber; The high-temperature and high-pressure air in the heat dissipation chamber is drawn into the condensation chamber, and the air in the condensation chamber is cooled and condensed; The air cooled and condensed in the condensation chamber is drawn into the heat dissipation chamber, and the air cooled and condensed is discharged from the heat dissipation chamber into the housing.

9. The dehumidification method for a semiconductor dehumidification device according to claim 8, characterized in that: The sucking of air from outside the shell into the condensing chamber comprises: adjusting the first induced fan to suck air from outside the shell into the condensing chamber at a low speed, adjusting the third induced fan to draw air from the condensing chamber at a high speed, and adjusting the second induced fan to draw air from the heat dissipation chamber to outside the shell at a high speed; The step of drawing the air from the condensing chamber to the heat dissipation chamber comprises: adjusting the first ducting fan to draw air from outside the housing into the condensing chamber at a high speed, adjusting the third ducting fan to draw air from the condensing chamber at a high speed, and adjusting the second ducting fan to draw air from the heat dissipation chamber to outside the housing at a low speed; The step of drawing the high-temperature and high-pressure air in the heat dissipation chamber into the condensation chamber comprises: adjusting the first ducting fan to draw air from outside the housing into the condensation chamber at a high speed, adjusting the third ducting fan to draw air from the heat dissipation chamber at a high speed, and adjusting the second ducting fan to draw air from the housing into the heat dissipation chamber at a high speed; The method of drawing the cooled and condensed air in the condensation chamber into the heat dissipation chamber, and discharging the cooled and condensed air from the heat dissipation chamber into the shell, includes: adjusting the first guide fan to draw air from outside the shell into the condensation chamber at high speed, adjusting the third guide fan to draw air from the condensation chamber at low speed, and adjusting the second guide fan to draw air from the heat dissipation chamber to outside the shell at low speed.

10. The dehumidification method for a semiconductor dehumidification device according to claim 8, wherein: The method of drawing air from outside the housing into the condensation chamber and cooling the air in the condensation chamber further includes: driving the damper motor to drive the condensation net to bend in a direction from the first induced fan to the third induced fan, so as to adjust the condensation efficiency of the air passing through the condensation net; The method of drawing high-temperature and high-pressure air in the heat dissipation chamber into the condensation chamber and cooling and condensing the air in the condensation chamber also includes: driving the damper motor to drive the condensation net to bend in the direction from the third guide fan to the first guide fan to adjust the condensation efficiency of the air passing through the condensation net.

11. The dehumidification method for a semiconductor dehumidification device according to claim 8, wherein: The method of pumping the air from the condensation chamber to the heat dissipation chamber and increasing the temperature and pressure of the air in the heat dissipation chamber further includes: The atomizer is turned on to humidify the gas entering the heat dissipation chamber from the condensation chamber.

Images