A heat dissipation system for electronic devices

Abstract

The application provides a heat dissipation system of an electronic device, and relates to the technical field of electronic device heat dissipation. The heat dissipation system of the electronic device comprises: a first heat dissipation piece; a semiconductor refrigerator, the semiconductor refrigerator has a cold surface and a hot surface, the cold surface is used for contacting the electronic device, and the first heat dissipation piece is used for dissipating heat of the hot surface; and the semiconductor refrigerator is configured to absorb heat on the side of the cold surface and transfer the heat to the hot surface. The heat dissipation system of the electronic device provided by the application solves the problem of poor heat dissipation effect of a CPU in the prior art.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic device heat dissipation, and in particular to a heat dissipation system of an electronic device. BACKGROUND

[0002] A processor (CPU) is one of the core components of a notebook computer, a desktop computer and the like. The CPU generates heat when working, and therefore heat dissipation is particularly important to ensure that the CPU can maintain good working performance.

[0003] In the related art, a heat dissipation system for a CPU includes a heat transfer member and a fan. The heat transfer member is in contact with the surface of the CPU, and the fan is used to blow air to the heat transfer member. When working, the heat on the CPU is conducted away by the heat transfer member, and then the heat is carried away by the air flow formed by the fan.

[0004] However, as the power consumption of the CPU increases, the heat generated during work also gradually increases, so that the above heat dissipation system is difficult to meet the heat dissipation needs of the CPU, resulting in poor heat dissipation effect of the CPU. SUMMARY

[0005] The present application provides a heat dissipation system of an electronic device to solve the problem of poor heat dissipation effect of the CPU in the related art.

[0006] The present application provides a heat dissipation system of an electronic device, comprising:

[0007] a first heat dissipation member;

[0008] a semiconductor refrigerator, the semiconductor refrigerator having a cold face and a hot face, the cold face being configured to contact the electronic device, and the first heat dissipation member being configured to dissipate heat from the hot face;

[0009] the semiconductor refrigerator being configured to absorb heat on the side of the cold face and transfer the heat to the hot face;

[0010] a secondary heat transfer member, the secondary heat transfer member being in contact with the semiconductor refrigerator, or the secondary heat transfer member being configured to contact the electronic device;

[0011] a secondary heat dissipation member, the secondary heat dissipation member being configured to dissipate heat from the secondary heat transfer member.

[0012] In one possible implementation, a heat dissipation layer is further included, the heat dissipation layer being configured to be arranged between the cold face and the electronic device, and the cold face being configured to contact the electronic device through the heat dissipation layer.

[0013] In one possible implementation, a projection of the heat dissipation layer on the cold face is located inside the cold face.

[0014] In one possible implementation, the secondary heat transfer element is a first heat transfer element, the secondary heat dissipation element is a second heat dissipation element, and the end of the semiconductor cooler away from the cold surface has a receiving cavity. The first heat transfer element is disposed in the receiving cavity and is in contact with the semiconductor cooler. The second heat dissipation element is used to dissipate heat from the first heat transfer element.

[0015] In one possible implementation, the secondary heat transfer element is a second heat transfer element, the secondary heat dissipation element is a third heat dissipation element, at least a portion of the heat dissipation layer is located on the second heat transfer element, the second heat transfer element is used to contact the electronic device through the heat dissipation layer, and the third heat dissipation element is used to dissipate heat from the second heat transfer element.

[0016] In one possible implementation, a heat transfer plate is further included, one end of which is connected to the heat dissipation layer, and the other end of which is connected to the thermoelectric cooler and the second heat transfer element, so that the heat dissipation layer is simultaneously connected to the thermoelectric cooler and the second heat transfer element through the heat transfer plate.

[0017] In one possible implementation, the first heat sink includes a liquid cooling pipe, the interior of which is used for the flow of coolant, and the liquid cooling pipe is in contact with the hot surface.

[0018] In one possible implementation, the first heat sink further includes a driving member disposed on the liquid cooling pipeline, the driving member being used to drive the coolant to circulate within the liquid cooling pipeline to increase the flow rate of the coolant.

[0019] In one possible implementation, the device further includes a temperature measuring element and a control unit, the temperature measuring element being electrically connected to the control unit, the temperature measuring element being used to detect the temperature of the electronic device;

[0020] The control unit is configured to adjust the power of the semiconductor cooler and / or the drive to a preset range based on the temperature signal from the temperature sensor.

[0021] In one possible implementation, the semiconductor cooler includes two conductive layers, a core layer distributed between the two conductive layers, and an insulating shell that covers the conductive layers and the core layer.

[0022] The core layer includes multiple P-type semiconductors and multiple N-type semiconductors, and both the P-type semiconductors and the N-type semiconductors are in contact with the two conductive layers;

[0023] The insulating shell forms the cold surface and the hot surface on two opposite sides of the conductive layer distribution direction, respectively.

[0024] This application provides a heat dissipation system for electronic devices, comprising: a first heat sink; and a thermoelectric cooler having a cold side and a hot side. The cold side is used to contact the electronic device, and the first heat sink is used to dissipate heat from the hot side. The thermoelectric cooler is configured to absorb heat from the cold side and transfer the heat to the hot side. During operation, heat from the electronic device (such as a CPU) can be transferred from the cold side to the hot side through the thermoelectric cooler, and then dissipated through the first heat sink, thereby achieving the purpose of heat dissipation for the electronic device. Furthermore, during the heat dissipation process, in addition to contact heat transfer, the thermoelectric cooler also utilizes its own performance to actively absorb heat from the cold side and transfer it to the hot side after being energized, thus effectively increasing the speed at which heat is transferred from the electronic device to the hot side, thereby improving the heat dissipation efficiency of the electronic device and solving the problem of poor heat dissipation of CPUs in related technologies. Attached Figure Description

[0025] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0026] Figure 1 This is a schematic diagram of the heat dissipation system of an electronic device provided in Embodiment 1 of this application;

[0027] Figure 2 for Figure 1 A schematic diagram of the structure of a semiconductor cooler;

[0028] Figure 3 for Figure 1 A schematic diagram of the structure of the first heat sink component;

[0029] Figure 4 for Figure 1 Workflow diagram of the central control unit;

[0030] Figure 5 This is a schematic diagram of the heat dissipation system of an electronic device provided in Embodiment 2 of this application;

[0031] Figure 6 This is a schematic diagram of the heat dissipation system of an electronic device provided in Embodiment 3 of this application.

[0032] Explanation of reference numerals in the attached figures:

[0033] 10-Electronic devices;

[0034] 20 - Outer shell;

[0035] 100 - First heat sink; 110 - Drive unit; 120 - Liquid cooling piping;

[0036] 200 - Semiconductor cooler; 210 - Cold side; 220 - Hot side; 230 - Conductive layer; 240 - Core layer; 250 - Insulating shell; 251 - Ceramic plate; 260 - Receiving cavity;

[0037] 300 - Temperature Measuring Component;

[0038] 400 - Control Unit;

[0039] 500 - Heat dissipation layer;

[0040] 600 - First heat transfer element;

[0041] 700 - Second heat sink;

[0042] 800 - Second heat transfer element;

[0043] 900 - Third heat sink;

[0044] 1000-Heat transfer plate.

[0045] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0046] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0047] In related technologies, the processor (Central Processing Unit, CPU) is one of the core components of devices such as laptops and desktop computers. The CPU generates heat when it is working, and heat dissipation is a particularly important aspect to ensure that it can maintain good performance.

[0048] The CPU cooling system includes a heat transfer element and a fan. The heat transfer element contacts the CPU surface, and the fan blows air onto the heat transfer element. During operation, the heat is dissipated from the CPU through the heat transfer element, and then the airflow generated by the fan carries away the heat.

[0049] However, as CPU power consumption increases, the heat generated during operation also increases. At this point, relying solely on the contact heat transfer between the heat transfer components and the CPU results in a slow heat transfer speed and low air cooling efficiency. Consequently, the aforementioned cooling system has a poor cooling effect on the CPU and is unable to meet the CPU's cooling requirements.

[0050] Therefore, this application provides a heat dissipation system for an electronic device, including: a first heat sink; and a thermoelectric cooler having a cold side and a hot side. The cold side is used to contact the electronic device, and the first heat sink is used to dissipate heat from the hot side. The thermoelectric cooler is configured to absorb heat from the cold side and transfer the heat to the hot side. Thus, during operation, the cold side of the thermoelectric cooler is brought into contact with the electronic device (such as a CPU), allowing heat from the electronic device to be transferred to the hot side via the thermoelectric cooler. Subsequently, the first heat sink dissipates heat from the hot side, thereby achieving the purpose of heat dissipation for the electronic device. Furthermore, during the heat dissipation process, in addition to heat transfer through contact, the thermoelectric cooler's own performance is utilized, enabling it to actively absorb heat from the cold side and transfer it to the hot side after being powered on. This effectively increases the speed at which heat is transferred from the electronic device to the hot side, thereby improving the heat dissipation efficiency of the electronic device and solving the problem of poor CPU heat dissipation in related technologies.

[0051] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0052] Example 1:

[0053] like Figure 1 As shown in the figure, an embodiment of this application provides a heat dissipation system for an electronic device, comprising:

[0054] First heat sink 100;

[0055] The semiconductor cooler 200 has a cold surface 210 and a hot surface 220. The cold surface 210 is used to contact the electronic device 10, and the first heat sink 100 is used to dissipate heat from the hot surface 220.

[0056] The semiconductor cooler 200 is configured to absorb heat from the cold side 210 and transfer the heat to the hot side 220.

[0057] During operation, the cold side 210 of the thermoelectric cooler 200 (TEC) is brought into contact with the electronic device 10 (such as the CPU) so that the heat on the CPU can be transferred to the hot side 220 through the thermoelectric cooler 200. Then, the first heat sink 100 dissipates heat from the hot side 220, thereby achieving the purpose of cooling the CPU.

[0058] Furthermore, during the heat dissipation process, in addition to heat transfer through contact between the thermoelectric cooler 200 and the CPU, the thermoelectric cooler 200 also utilizes its own performance to actively absorb heat from the cold side 210 after being powered on, and transfer the heat to the hot side 220. This effectively increases the speed at which heat is transferred from the CPU to the hot side 220, thereby improving the CPU's heat dissipation efficiency and solving the problem of poor CPU heat dissipation in related technologies.

[0059] It should be noted that the heat dissipation system of the electronic device provided in this application can be applied to various electronic devices 10, such as CPUs, motherboards, or other electronic modules.

[0060] Specifically, such as Figure 2 As shown, the semiconductor cooler 200 includes two conductive layers 230, a core layer 240 distributed between the two conductive layers 230, and an insulating shell 250, which covers the conductive layers 230 and the core layer 240.

[0061] The core layer 240 includes multiple P-type semiconductors and multiple N-type semiconductors, and both the P-type semiconductors and the N-type semiconductors are in contact with the two conductive layers 230;

[0062] The insulating shell 250 has a cold surface 210 and a hot surface 220 formed on two opposite sides of the conductive layer 230.

[0063] Specifically, the conductive layer 230 can be made of copper, and the two conductive layers 230 are vertically spaced apart. A core layer 240 is disposed between the two conductive layers 230, and the core layer 240 includes multiple pairs of arrayed PN semiconductors, which can be connected in series or in parallel. Each pair of PN semiconductors includes a P-type semiconductor and an N-type semiconductor, both of which are connected to the two conductive layers 230. Furthermore, electrodes (such as positive and negative electrodes) can be disposed on one of the conductive layers 230 to connect to a circuit.

[0064] The insulating shell 250 may be made of ceramic material and covers the conductive layer 230 and the core layer 240. In this embodiment, the insulating shell 250 may include two ceramic plates 251, which cover the two opposing sides of the two conductive layers 230. This forms the overall semiconductor cooler 200, and the semiconductor cooler 200 has a cold surface 210 and a hot surface 220 formed on the opposing sides of the conductive layers 230 in the distribution direction.

[0065] The working principle of the thermoelectric cooler 200 is as follows: When the thermoelectric cooler 200 is energized via electrodes, electron-hole pairs are generated at one end, reducing its internal energy and lowering its temperature, forming a cold end (the surface corresponding to this end is the cold surface 210); at the other end, electron-hole pairs recombine, increasing their internal energy and raising their temperature, forming a hot end (the surface corresponding to this end is the hot surface 220). This allows it to actively absorb heat from the cold end and transfer it to the hot end. Furthermore, the thermoelectric cooler 200 itself generates heat during the energizing process, which is also transferred to the hot end. The hot end is then cooled by the first heat sink 100.

[0066] At the same time, the heat transfer efficiency of the semiconductor cooler 200 itself can be effectively improved due to the arrangement of multiple pairs of PN semiconductors.

[0067] In other embodiments, the semiconductor cooler 200 may also be an existing product, and its structure is not limited.

[0068] In some embodiments, such as Figure 3 As shown, the first heat sink 100 includes a liquid cooling pipe 120, the interior of which is used for the flow of coolant, and the liquid cooling pipe 120 is in contact with the hot surface 220.

[0069] The liquid cooling pipe 120 can be a closed-loop coil structure, and a liquid storage tank connected to the liquid cooling pipe 120 can be added to allow the coolant to circulate within the coil and the liquid storage tank, without restricting the extension trajectory of the coil; the liquid cooling pipe 120 can also be designed with reference to the structure of existing liquid cooling systems, without any restrictions. The coolant flowing inside can be refrigerant, a mixture of water and refrigerant, or other types of coolant.

[0070] It should be noted that it is sufficient to ensure that the liquid cooling pipe 120 is in contact with the hot surface 220 on the thermoelectric cooler 200, so as to ensure that the coolant in the liquid cooling pipe 120 can effectively remove the heat from the hot surface 220 and dissipate heat from the hot surface 220. In addition, the coolant can be dissipated using heat sink fins, fans or other forms.

[0071] In practice, the liquid cooling pipeline 120 can be integrated into the housing 20 of the equipment. Alternatively, the liquid cooling pipeline 120 can be designed as several parallel branch pipelines.

[0072] like Figure 1 and Figure 3 As shown, the first heat sink 100 further includes a drive 110, which is disposed on the liquid cooling pipe 120. The drive 110 is used to drive the coolant to circulate within the liquid cooling pipe 120 to increase the flow rate of the coolant.

[0073] Therefore, under the action of the driving component 110, the flow rate of the coolant in the liquid cooling pipe 120 can be accelerated, thereby improving the heat exchange efficiency between the coolant and the hot surface 220, improving the heat dissipation efficiency of the hot surface 220, and further improving the heat dissipation efficiency of the electronic device 10 (such as the CPU).

[0074] Understandably, with the combined action of the drive unit 110 and the semiconductor cooler 200, the CPU's heat dissipation efficiency is greatly improved by increasing the speed at which heat is transferred out of the CPU and by increasing the flow rate of the coolant in the liquid cooling pipe 120.

[0075] It should be noted that the drive unit 110 can be a micro pump or other types of drive pumps.

[0076] like Figure 3 and Figure 4 As shown, in some embodiments, the heat dissipation system of the electronic device further includes a temperature measuring element 300 and a control unit 400. The temperature measuring element 300 is electrically connected to the control unit 400 and is used to detect the temperature of the electronic device 10.

[0077] The control unit 400 is configured to adjust the power of the thermoelectric cooler 200 and / or the drive unit 110 to a preset range based on the temperature signal from the temperature sensor 300.

[0078] The temperature sensing element 300 can be a temperature sensor or a thermistor, and its model is not limited. The temperature sensing element 300 is in contact with the electronic device 10 to detect the real-time temperature of the electronic device 10 (such as a CPU). The control unit 400 can be an existing product, such as an embedded controller, and this application does not limit its structure. The control unit 400 is electrically connected to the temperature sensing element 300 so that the control unit 400 can receive the temperature signal from the temperature sensing element 300.

[0079] The control unit 400 is also electrically connected to a rheostat or switch in the circuit containing the thermoelectric cooler 200, so that the control unit 400 can control the current or voltage in the circuit containing the thermoelectric cooler 200, thereby regulating the power of the thermoelectric cooler 200. The control unit 400 is also electrically connected to the drive unit 110, so that the control unit 400 can regulate the power of the drive unit 110.

[0080] Therefore, the temperature of the CPU is detected in real time by the temperature measuring element 300, and then the control unit 400 adjusts the power of the semiconductor cooler 200 and the drive unit 110 to a preset range according to the temperature signal of the temperature measuring element 300 to improve adaptability.

[0081] For example, when the CPU temperature is detected to be too high (e.g., exceeding a set threshold), the voltage / current supplied to the semiconductor cooler 200 and the drive unit 110 can be increased to improve the power of both, thereby increasing the heat transfer speed and the coolant flow rate, quickly reducing the CPU temperature, and ensuring CPU performance.

[0082] When the CPU temperature is detected to be low (e.g., below a set threshold), the voltage / current supplied to the thermoelectric cooler 200 and the driver 110 can be reduced, or even the thermoelectric cooler 200 and the driver 110 can be turned off, in order to reduce energy consumption and optimize the overall energy efficiency of the system.

[0083] like Figure 1 As shown, in some embodiments, the heat dissipation system of the electronic device further includes a heat dissipation layer 500, which is disposed between the cold surface 210 and the electronic device 10, and the cold surface 210 is used to contact the electronic device 10 through the heat dissipation layer 500.

[0084] It should be noted that the heat dissipation layer 500 can be thermal paste or other heat dissipation interface material. In practice, thermal paste can be applied to the side of the electronic device 10 (such as a CPU) facing the thermoelectric cooler 200 to form the heat dissipation layer 500. Next, the thermoelectric cooler 200 is placed in contact with the side of the heat dissipation layer 500 away from the electronic device 10.

[0085] Therefore, the heat dissipation layer 500 can fill the microscopic gap between the CPU and the thermoelectric cooler 200, and remove air, thereby significantly improving the efficiency of heat conduction from the CPU to the thermoelectric cooler 200, and further improving the heat dissipation effect of the CPU.

[0086] In practice, the heat dissipation layer 500 can be fully covered on the side of the CPU facing the thermoelectric cooler 200, and the projection of the heat dissipation layer 500 on the cold surface 210 can be located inside the cold surface 210. That is, the area of ​​the cold surface 210 is larger than the coverage area of ​​the heat dissipation layer 500, and the thermoelectric cooler 200 completely covers the heat dissipation layer 500, so as to improve the heat transfer efficiency in the thermoelectric cooler 200 after heat is transferred to it.

[0087] In summary, the heat dissipation system for an electronic device provided in Embodiment 1 of this application, during operation, brings the cold surface 210 of the thermoelectric cooler 200 into contact with the CPU, allowing heat from the CPU to be transferred to the hot surface 220 via the thermoelectric cooler 200. Subsequently, the first heat sink 100 dissipates heat from the hot surface 220, thereby achieving the purpose of cooling the CPU. Furthermore, during the heat dissipation process, in addition to heat transfer through contact, the thermoelectric cooler 200 also utilizes its own properties to actively absorb heat from one end of the cold surface 210 and transfer it to the hot surface 220 after being powered on. This effectively increases the speed at which heat is transferred from the CPU to the hot surface 220, thus improving the CPU's heat dissipation efficiency and solving the problem of poor CPU heat dissipation in related technologies.

[0088] Example 2:

[0089] like Figure 5 As shown, the difference between this embodiment and Embodiment 1 is that the heat dissipation system of the electronic device further includes: a secondary heat transfer component, which is in contact with the semiconductor cooler 200, or the secondary heat transfer component is used to contact the electronic device 10.

[0090] Secondary heat sink is used to dissipate heat from the secondary heat transfer component.

[0091] In this embodiment, the secondary heat transfer element is the first heat transfer element 600, the secondary heat dissipation element is the second heat dissipation element 700, and the end of the semiconductor cooler 200 away from the cold surface 210 is provided with a receiving cavity 260. The first heat transfer element 600 is disposed in the receiving cavity 260 and is in contact with the semiconductor cooler 200. The second heat dissipation element 700 is used to dissipate heat from the first heat transfer element 600.

[0092] It should be noted that the first heat transfer element 600 can be a heat pipe, and is made of copper or other thermally conductive materials. Of course, the first heat transfer element 600 can also be plate-shaped, sheet-shaped, or other shapes, and there are no restrictions on this. The second heat dissipation element 700 can be a fan, and there are no restrictions on the model.

[0093] Specifically, the semiconductor cooler 200 has a receiving cavity 260 at one end away from the cold surface 210. The first heat transfer element 600 is embedded in the receiving cavity 260, and one end of the first heat transfer element 600 is connected to the semiconductor cooler 200, while the other end extends to the second heat dissipation element 700 so that the first heat transfer element 600 can be cooled by the second heat dissipation element 700.

[0094] Therefore, during operation, the heat from the CPU is transferred to the thermoelectric cooler 200, and then through the thermoelectric cooler 200 to the first heat sink 100 for dissipation. Heat can also be transferred through the first heat transfer element 600 to the second heat sink 700 for dissipation. This creates two heat dissipation paths: liquid cooling and air cooling. The choice between these two paths can be made according to actual needs. For example, only the air cooling path can be used, only the liquid cooling path can be used, or even both liquid cooling and air cooling paths can be used simultaneously to rationally control energy consumption based on actual cooling requirements.

[0095] Furthermore, embedding the first heat transfer element 600 within the receiving cavity 260 of the semiconductor cooler 200 can effectively save space and reduce the overall space occupied by the heat dissipation system.

[0096] For example, when the CPU generates low heat, only the air cooling path can be operated (in this case, the portion of the thermoelectric cooler 200 corresponding to the first heat transfer element 600 can only serve as contact heat transfer) to control energy consumption. When the CPU generates high heat, both liquid cooling and air cooling paths can be operated simultaneously to increase heat dissipation efficiency accordingly.

[0097] In practice, the part of the semiconductor cooler 200 corresponding to the first heat transfer element 600 (i.e. the part located between the first heat transfer element 600 and the CPU) can be set independently so that the semiconductor cooler 200 of that part can be controlled separately according to actual needs, thereby improving the heat dissipation effect of the air-cooled heat dissipation path.

[0098] Example 3:

[0099] like Figure 6 As shown, the difference between this embodiment and Embodiment 1 is that the heat dissipation system of the electronic device further includes: a secondary heat transfer component, which is in contact with the semiconductor cooler 200, or the secondary heat transfer component is used to contact the electronic device 10.

[0100] Secondary heat sink is used to dissipate heat from the secondary heat transfer component.

[0101] In this embodiment, the secondary heat transfer element is the second heat transfer element 800, the secondary heat dissipation element is the third heat dissipation element 900, at least part of the heat dissipation layer 500 is located on the second heat transfer element 800, the second heat transfer element 800 is used to contact the electronic device 10 through the heat dissipation layer 500, and the third heat dissipation element 900 is used to dissipate heat from the second heat transfer element 800.

[0102] It should be noted that the second heat transfer element 800 can be a heat pipe, and is made of copper or other thermally conductive materials. Of course, the second heat transfer element 800 can also be plate-shaped, sheet-shaped, or other shapes, and there are no restrictions on this. The third heat dissipation element 900 can be a fan, and there are no restrictions on the model.

[0103] During operation, the CPU's heat can be transferred from the semiconductor cooler 200 to the first heat sink 100 for cooling. Alternatively, it can be transferred from the second heat transfer element 800 to the third heat sink 900 for cooling. This creates two cooling paths: liquid cooling and air cooling, which can be selected according to actual needs.

[0104] For example, when the CPU generates low heat, only the air cooling path can be run to control energy consumption. When the CPU generates high heat, both liquid cooling and air cooling paths can be run simultaneously, so that some heat is dissipated through the liquid cooling path and the other part of heat is dissipated through the air cooling path, thereby increasing the heat dissipation efficiency.

[0105] The heat dissipation system of the electronic device also includes a heat transfer plate 1000. One end of the heat transfer plate 1000 is connected to the heat dissipation layer 500, and the other end of the heat transfer plate 1000 is connected to the semiconductor cooler 200 and the second heat transfer element 800, so that the heat dissipation layer 500 is simultaneously connected to the semiconductor cooler 200 and the second heat transfer element 800 through the heat transfer plate 1000.

[0106] The heat transfer plate 1000 may be made of copper or other thermally conductive materials. Of the two opposing sides of the heat transfer plate 1000, one side is in contact with the heat dissipation layer 500; the other side is in contact with both the semiconductor cooler 200 and the second heat transfer element 800.

[0107] Therefore, when both liquid cooling and air cooling paths are running simultaneously, the heat on the CPU can be transferred relatively evenly to the semiconductor cooler 200 and the second heat transfer element 800 through the heat transfer plate 1000, thus optimizing the heat transfer effect.

[0108] Finally, it should be noted that other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A heat dissipation system for an electronic device, characterized in that, include: First heat sink (100); A semiconductor cooler (200) having a cold surface (210) and a hot surface (220), the cold surface (210) being used to contact an electronic device (10), and a first heat sink (100) being used to dissipate heat from the hot surface (220); The semiconductor cooler (200) is configured to absorb heat from one side of the cold surface (210) and transfer the heat to the hot surface (220). It also includes a first heat transfer element (600) and a second heat dissipation element (700). The semiconductor cooler (200) has a receiving cavity (260) at one end away from the cold surface (210). The first heat transfer element (600) is disposed in the receiving cavity (260) and is in contact with the semiconductor cooler (200). The second heat dissipation element (700) is used to dissipate heat from the first heat transfer element (600). The first heat sink (100) includes a liquid cooling pipe (120), the interior of which is used for the flow of coolant, and the liquid cooling pipe (120) is in contact with the hot surface (220).

2. The heat dissipation system for the electronic device according to claim 1, characterized in that, It also includes a heat dissipation layer (500) for being disposed between the cold surface (210) and the electronic device (10), the cold surface (210) for contacting the electronic device (10) through the heat dissipation layer (500).

3. The heat dissipation system for the electronic device according to claim 2, characterized in that, The projection of the heat dissipation layer (500) onto the cold surface (210) is located inside the cold surface (210).

4. The heat dissipation system for the electronic device according to any one of claims 1-3, characterized in that, The first heat sink (100) further includes a drive (110), which is disposed on the liquid cooling pipeline (120). The drive (110) is used to drive the coolant to circulate within the liquid cooling pipeline (120) to increase the flow rate of the coolant.

5. The heat dissipation system for the electronic device according to claim 4, characterized in that, It also includes a temperature measuring element (300) and a control unit (400), wherein the temperature measuring element (300) is electrically connected to the control unit (400), and the temperature measuring element (300) is used to detect the temperature of the electronic device (10); The control unit (400) is configured to adjust the power of the semiconductor cooler (200) and / or the drive unit (110) to a preset range based on the temperature signal from the temperature sensor (300).

6. The heat dissipation system for the electronic device according to any one of claims 1-3, characterized in that, The semiconductor cooler (200) includes two conductive layers (230), a core layer (240) distributed between the two conductive layers (230), and an insulating shell (250), wherein the insulating shell (250) covers the conductive layers (230) and the core layer (240); The core layer (240) includes a plurality of P-type semiconductors and a plurality of N-type semiconductors, and both the P-type semiconductors and the N-type semiconductors are in contact with the two conductive layers (230); The insulating shell (250) has a cold surface (210) and a hot surface (220) formed on two opposite sides of the conductive layer (230) in the distribution direction.

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