Interconnection component and power device having the same

Abstract

The present invention provides an interconnection component and a power device having the same. The interconnection component comprises: a main body section, the lower surface of the main body section is a conductive connection surface; an interface interconnection section connected to the main body section, the lower surface of the interface interconnection section is an interconnection surface; an arched connection section, comprising a first arc segment and a second arc segment connected to each other, the first arc segment is connected to the main body section, the second arc segment is connected to the interface interconnection section, the first arc segment has a first arc center line in a preset longitudinal section, and the first arc center line and a preset curve satisfy a determination coefficient R 2 , the preset curve satisfies the following formula: #imgabs0#; x and y are the horizontal and vertical coordinate values ​​of the preset curve in the preset coordinate system; h is the distance from the highest point of the preset curve to the X-axis, a is the maximum distance from the preset curve to the Y-axis, #imgabs1# is a preset constant; at the highest point of the preset curve, the preset curve satisfies #imgabs2#; R 2 ≥0.8. Through this solution, the problem of high stress at the interconnection interface of the interconnection components can be alleviated.

Description

Technical Field

[0001] The present invention relates to the technical field of power devices, and in particular to an interconnection component and a power device having the same. Background Art

[0002] Power devices are devices used in the field of power electronics to control and convert electrical energy. They are used to perform power conversion functions such as rectification, inversion, chopping, and frequency conversion. They are widely used in power management, motor drive, solar inverter, power system, energy storage and other fields.

[0003] In the related art, the transmission of signals or power currents between the components inside the power device relies on the metal interconnection interface set on the components and the connectors connecting the metal interconnection interfaces. For example, the interconnection between the upper surface of the chip and the conductive layer. The connector is generally a bonding wire or a bonding copper ribbon, and the bonding copper ribbon has a larger interconnection interface.

[0004] However, power devices generate heat during operation, and the bonding copper tape deforms after being heated, thereby increasing the maximum interface stress value between the bonding copper tape and the copper layer or chip. Summary of the invention

[0005] The present invention provides an interconnection component and a power device having the same, so as to alleviate the problem of high stress at the interconnection interface of the interconnection component in the related art.

[0006] According to one aspect of the present invention, an interconnection component is provided, the interconnection component comprising: a main body segment, the lower surface of the main body segment is a conductive connection surface; an interface interconnection segment connected to the main body segment, the lower surface of the interface interconnection segment is an interconnection surface; an arched connection segment, comprising a first arc segment and a second arc segment connected to each other, the first arc segment is connected to the main body segment, the second arc segment is connected to the interface interconnection segment, the first arc segment has a first arc center line in a preset longitudinal section, and the first arc center line and a preset curve satisfy a determination coefficient R 2 , the preset curve satisfies the following formula: ;

[0007] Among them, x and y are the horizontal and vertical coordinate values ​​of the preset curve in the preset coordinate system, the X-axis direction of the preset coordinate system is parallel to or coincides with the extension direction of the horizontal center line of the main segment in the preset longitudinal section, and the Y-axis direction of the preset coordinate system passes through the highest point of the preset curve. At the highest point of the preset curve, the preset curve satisfies ; h is the distance from the highest point of the preset curve to the X-axis, a is the maximum distance from the preset curve to the Y-axis, is the preset constant; R 2 ≥0.8.

[0008] Further, among them, .

[0009] Furthermore, the preset constant satisfy .

[0010] Furthermore, the thickness of the first arc segment is t, wherein t≥0.4 mm and t / a≥0.2.

[0011] Furthermore, the second arc segment has a second arc center line in the preset longitudinal section, and the second arc center line and the preset curve satisfy the determination coefficient R 2 , R 2 ≥0.8.

[0012] Furthermore, a first flexible groove is provided on the first arc segment, and a second flexible groove is provided on the second arc segment.

[0013] Further, the ratio of the width of the first flexible groove to the width of the first arc segment is between 0.2 and 0.6; and / or the ratio of the width of the second flexible groove to the width of the second arc segment is between 0.2 and 0.6.

[0014] Further, the first flexible groove extends along the length direction of the first arc segment, and the second flexible groove extends along the length direction of the second arc segment.

[0015] Further, the first flexible groove runs through the upper surface and the lower surface of the first arc-shaped segment, and the second flexible groove runs through the upper surface and the lower surface of the second arc-shaped segment.

[0016] Furthermore, the lower surface of the main body section is provided with a first wetting groove extending along the length direction thereof; and the lower surface of the interface interconnection section is provided with a second wetting groove extending along the length direction thereof.

[0017] Further, the first wetting groove runs through the upper surface and the lower surface of the main body section, and the second wetting groove runs through the upper surface and the lower surface of the interface interconnection section.

[0018] Further, the first flexible groove and the second flexible groove are connected.

[0019] Further, the lower surface of the interface interconnection segment is higher than or flush with the lower surface of the main body segment.

[0020] Furthermore, the thicknesses of the main body segment, the interface interconnection segment, the first arc segment and the second arc segment are all the same.

[0021] Furthermore, in the length direction, the thickness of the main body segment, the interface interconnection segment, the first arc segment and the second arc segment remains unchanged; in the width direction, the thickness of the main body segment, the interface interconnection segment, the first arc segment and the second arc segment remains unchanged.

[0022] Further, the thickness of the interconnection member is less than or equal to 5 mm.

[0023] According to another aspect of the present invention, a power device is provided, comprising: a first substrate having a first conductive layer and a second conductive layer spaced apart; a first chip disposed on the first substrate, wherein the lower surface of the first chip is connected to the first conductive layer; a first interconnection member disposed on the first substrate, wherein the conductive connection surface of the first interconnection member is connected to the second conductive layer, and the interconnection surface of the first interconnection member is connected to the upper surface of the first chip, wherein the first interconnection member is the interconnection member provided above.

[0024] According to another aspect of the present invention, a power device is provided, the power device comprising: a first substrate and a second substrate, the first substrate having a first conductive layer and a second conductive layer spaced apart, the second substrate having a third conductive layer and a fourth conductive layer spaced apart; a first chip and a second chip, the first chip being arranged on the first substrate, the lower surface of the first chip being electrically connected to the first conductive layer, the upper surface of the first chip being electrically connected to the second conductive layer, the second chip being arranged on the second substrate, the lower surface of the second chip being electrically connected to the third conductive layer, the upper surface of the second chip being electrically connected to the fourth conductive layer; a second interconnection member, the conductive connection surface of the second interconnection member being connected to the second conductive layer, the interconnection surface of the second interconnection member being electrically connected to the third conductive layer, the second interconnection member being the interconnection member provided above.

[0025] By applying the technical solution of the present invention, the interconnection component includes a main body segment, an interface interconnection segment, and an arched connection segment. The conductive connection surface of the main body segment is connected to the conductive layer of the liner, the interconnection surface of the interface interconnection segment is connected to the source electrode on the upper surface of the chip, or the interconnection surface of the interface interconnection segment is connected to the conductive layer of another liner, so that the power circuit of the power device can be turned on. Since the arched connection segment of the interconnection component includes a first arc segment and a second arc segment connected to each other, the first arc segment is connected to the main body segment, and the second arc segment is connected to the interface interconnection segment, the first arc segment has a first arc center line in a preset longitudinal section, and the first arc center line and the preset curve meet the determination coefficient R 2 , the preset curve satisfies the formula , R 2 ≥0.8, so that the interconnection component has a higher flexibility. When the power device is running, the overall structure of the power device including the interconnection component is subjected to thermal load, and there will be a certain relative displacement between the main section of the interconnection component and the conductive surface of the liner, and between the interface interconnection section and the upper surface of the chip or the conductive surface of another liner. The greater flexibility of the interconnection component can effectively reduce the maximum interface stress value between the main section and the conductive surface of the liner, and between the interface interconnection section and the upper surface of the chip or the conductive surface of another liner, thereby improving the reliability of the interface interconnection. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The drawings constituting a part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0027] Figure 1 A front view of an interconnection member provided according to an embodiment of the present invention is shown;

[0028] Figure 2 A schematic structural diagram of an interconnection component provided according to an embodiment of the present invention is shown;

[0029] Figure 3 A front view of an interconnection member provided according to an embodiment of the present invention is shown;

[0030] Figure 4 A schematic structural diagram of an interconnection component provided according to an embodiment of the present invention is shown;

[0031] Figure 5 A schematic structural diagram of an interconnection component provided according to an embodiment of the present invention is shown;

[0032] Figure 6 A schematic diagram of a preset curve provided according to an embodiment of the present invention is shown;

[0033] Figure 7 The interconnection structure provided by the embodiment of the present invention is shown. Relationship diagram with J;

[0034] Figure 8 A schematic structural diagram of an interconnection component provided according to an embodiment of the present invention is shown;

[0035] Fig. 9 A top view of an interconnection member provided according to an embodiment of the present invention is shown;

[0036] Fig.10 A schematic structural diagram of an interconnection component provided according to an embodiment of the present invention is shown;

[0037] Fig.11 A top view of an interconnection member provided according to an embodiment of the present invention is shown;

[0038] Fig.12 A schematic structural diagram of an interconnection component provided according to an embodiment of the present invention is shown;

[0039] Fig.13 A top view of an interconnection member provided according to an embodiment of the present invention is shown;

[0040] Fig.14 A partial structural schematic diagram of a power device provided in an embodiment of the present invention is shown;

[0041] Fig.15 A schematic diagram of another part of the structure of a power device provided according to an embodiment of the present invention is shown.

[0042] The above drawings include the following reference numerals:

[0043] 10. Main body section; 11. First infiltration tank;

[0044] 20. Interface interconnection section; 21. Second wetting tank;

[0045] 30. Arched connecting section; 31. First arc section; 311. First arc center line; 312. First flexible groove; 32. Second arc section; 321. Second arc center line; 322. Second flexible groove; 33. Preset curve;

[0046] 40. first lining plate; 41. first conductive layer; 42. second conductive layer; 43. second lining plate; 44. third conductive layer; 45. fourth conductive layer;

[0047] 50. first chip; 51. second chip;

[0048] 60. A first interconnection member;

[0049] 70. Second interconnecting member. DETAILED DESCRIPTION

[0050] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0051] like Figures 1 to 13 As shown, an embodiment of the present invention provides an interconnection component, the interconnection component includes a main body segment 10, an interface interconnection segment 20, and an arched connection segment 30, the lower surface of the main body segment 10 is a conductive connection surface; the interface interconnection segment 20 is connected to the main body segment 10, and the lower surface of the interface interconnection segment 20 is an interconnection surface; the arched connection segment 30 includes a first arc segment 31 and a second arc segment 32 connected to each other, the first arc segment 31 is connected to the main body segment 10, the second arc segment 32 is connected to the interface interconnection segment 20, the first arc segment 31 has a first arc center line 311 in a preset longitudinal section, and the first arc center line 311 and the preset curve 33 satisfy the determination coefficient R 2 , the preset curve 33 satisfies the following formula: .

[0052] Wherein, x and y are the horizontal coordinate value and the vertical coordinate value of the preset curve 33 in the preset coordinate system, the X-axis direction of the preset coordinate system is parallel to or coincides with the extension direction of the horizontal center line of the main body section 10 in the preset longitudinal section, and the Y-axis direction of the preset coordinate system passes through the highest point of the preset curve 33; h is the distance from the highest point of the preset curve 33 to the X-axis, and a is the maximum distance from the preset curve 33 to the Y-axis. is a preset constant; at the highest point of the preset curve 33, the preset curve 33 satisfies Among them, R 2 ≥0.8.

[0053] By applying the technical solution of the present invention, the interconnection component includes a main body section 10, an interface interconnection section 20, and an arched connection section 30. The conductive connection surface of the main body section 10 is connected to the conductive layer of the liner, the interconnection surface of the interface interconnection section 20 is connected to the source electrode on the upper surface of the chip, or the interconnection surface of the interface interconnection section 20 is connected to the conductive layer of another liner, so that the power circuit of the power device can be turned on. Since the arched connection section 30 of the interconnection component includes a first arc segment 31 and a second arc segment 32 connected to each other, the first arc segment 31 is connected to the main body section 10, and the second arc segment 32 is connected to the interface interconnection section 20, the first arc segment 31 has a first arc center line 311 in a preset longitudinal section, and the first arc center line 311 and the preset curve 33 meet the determination coefficient R 2 , the preset curve 33 satisfies the formula , R 2 ≥0.8, so that the interconnection component has a higher flexibility. When the power device is running, the overall structure of the power device including the interconnection component is subjected to thermal load, and there will be a certain relative displacement between the main section of the interconnection component and the conductive surface of the liner, and between the interface interconnection section and the upper surface of the chip or the conductive surface of another liner. The greater flexibility of the interconnection component can effectively reduce the maximum interface stress value between the main section and the conductive surface of the liner, and between the interface interconnection section and the upper surface of the chip or the conductive surface of another liner, thereby improving the reliability of the interface interconnection.

[0054] The interconnection member in this embodiment has a higher flexibility, which means that when the structure and shape of the interconnection members are similar, and when the conditions such as the cross section remain unchanged, the longer the length of the interconnection member, the greater its flexibility. When the lengths are the same, the interconnection member in this embodiment has a greater flexibility.

[0055] It should be noted that the interconnection member of this embodiment is used to connect different interfaces of the power device, and generally the main body section 10 is used to connect the conductive layer of the substrate of the power device. The interface interconnection section 20 is used to connect the source electrode on the upper surface of the chip, or to connect the conductive layer of another substrate, and of course, it can also connect another conductive layer of the same substrate.

[0056] Furthermore, when the interconnection member connects the source electrode of the chip and the conductive layer of the substrate, since the heights of the two may be different, the heights of the lower surface of the main segment 10 and the lower surface of the interface interconnection segment 20 are also different. When the interconnection member connects two different conductive layers, the heights of the lower surface of the main segment 10 and the lower surface of the interface interconnection segment 20 are the same.

[0057] At the same time, due to the greater flexibility of the interconnected components, when the interconnected components need to be slightly deformed to meet specific manufacturing requirements, the external force required to be applied is smaller, which is conducive to precise manufacturing and processing.

[0058] Of course, the structural form of the first arc segment 31 is not only applicable to the interconnection component provided in this embodiment, but also in other interconnection components, for example, connecting multiple chips arranged in parallel and the same conductive layer. In the above-mentioned interconnection components, the structure of the first arc segment provided in this embodiment can be adopted.

[0059] Among them, the preset constant satisfy . Using the above range of values , which can make the interconnected components have higher flexibility.

[0060] in, It can be 0.4, 0.5, 0.6, 0.8, 1, 1.3, 1.5, 1.6, 2, 2.5, 2.6 and any value between 0.4 and 2.6.

[0061] In this embodiment, the thickness of the first arc segment 31 is t, wherein t≥0.4 mm and t / a≥0.2.

[0062] When interconnect structures are required in power devices, there are many ways: metal wire bonding, metal ribbon bonding (such as aluminum ribbon) and metal clip (such as copper clip) bonding or welding, etc. When power devices require interconnect components to have greater current flow and heat dissipation capabilities, thicker metal clips are often used.

[0063] When the thickness of the interconnection component is small (metal wire or metal strip), the flexibility of the interconnection component is large. In the related art, the structural shape of the interconnection component is often formed naturally by the bonding process. For thicker metal clips (such as copper clips), they need to be processed in advance and then the interface interconnection is achieved through welding and other technologies. Due to the convenience of processing, bending or cylindrical stamping methods are often used in related technologies.

[0064] However, when the thickness of the interconnection component is further increased (such as the thickness t satisfies t≥0.4mm and t / a≥0.2), the stiffness of the interconnection component will increase rapidly, that is, the flexibility will decrease rapidly. During the interconnection process and the service process of the power device, the interconnection component and the power device in which it is located are subjected to thermal loads, which will cause relative displacement between the interconnection surface of the interconnection component and the interconnected surface (such as the chip source surface or the liner conductive layer). The rapid decrease in the flexibility of the interconnection component due to the increase in the thickness of the interconnection component will cause the maximum interface stress value caused by the relative displacement to increase rapidly, which is extremely unfavorable for the mechanical reliability of the interconnection at the interface of the interconnection component. To this end, for the case of an interconnection component with a larger thickness (thickness t satisfies t≥0.4mm, t / a≥0.2), the shape of the interconnection component provided in this embodiment can obtain an interconnection component with greater flexibility under the same thickness, thereby increasing the reliability of the interface interconnection.

[0065] like Figure 1 , Figure 3 as well as Figure 6 As shown, the second arc segment 32 has a second arc center line 321 in the preset longitudinal section, and the second arc center line 321 and the preset curve 33 satisfy the determination coefficient R 2 , R 2 ≥0.8. The above-mentioned second arc segment 32 can further increase the flexibility of the interconnection component. After the interconnection component is heated, it is easier to deform, which can effectively reduce the maximum interface stress at the interconnection interface and improve the reliability of the interface connection.

[0066] It should be noted that when the interconnection member connects two different conductive layers, since the lower surface of the main body segment 10 and the lower surface of the interface interconnection segment 20 are at the same height, at this time, the second arc center line 321 and the first arc center line 311 are exactly the same in shape, and the interconnection member is a symmetrical structure. When the interconnection member connects the source electrode of the chip and the conductive layer of the liner, the lower surface of the main body segment 10 and the lower surface of the interface interconnection segment 20 are at different heights, at this time, the second arc center line 321 and the first arc center line 311 are the same in shape, but the lengths of the two are different.

[0067] like Figure 6As shown, when the interconnection member connects the chip and the conductive layer, the a value of the preset curve corresponding to the second arc center line 321 is recorded as a1, and the h value is recorded as h1, and the a value of the preset curve corresponding to the first arc center line 311 is recorded as a2, and the h value is recorded as h2. Since the height of the lower surface of the main segment 10 and the lower surface of the interface interconnection segment 20 are different, when the first arc center line 311 is compared with the preset curve 33, the X-axis direction of the coordinate system where the preset curve 33 is located is the extension direction of the horizontal center line of the main segment 10 in the preset longitudinal section. When the second arc center line 321 is compared with the preset curve 33, the X-axis direction of the coordinate system where the preset curve 33 is located is the extension direction of the horizontal center line of the interface interconnection segment 20 in the preset longitudinal section.

[0068] In this embodiment, points are taken at equal intervals on the upper surface of the first arc segment 31, and the number of points taken should be no less than 5 points. Correspondingly, under the same horizontal coordinate value, points are taken at equal intervals on the lower surface of the first arc segment 31, and the number of points taken is the same as the number of points taken on the upper surface, thereby obtaining the coordinates of the discrete points on the upper and lower surfaces of the first arc segment 31. In addition, the points should span the entire span of the first arc segment 31, that is, if the number of points taken is n (n≥5), the arc length spacing between adjacent points is approximately 1 / (n-1) of the arc length corresponding to the span a. The coordinates of the discrete points on the corresponding first arc centerline 311 are calculated in this way, and the formula is used The coordinates of the discrete points on the obtained first arc center line 311 are fitted, for example, by using MATLAB to fit, and the following equation can be obtained: and the coefficient of determination R 2 .

[0069] like Figure 4 As shown, when When the value is 1, "sharp corners" appear at the connection "joints" between the main body section 10 and the arched connection section 30, and between the interface interconnection section 20 and the arched connection section 30. This situation rarely occurs in actual processing, because the thickness at the "sharp corners" will increase, which causes the interconnected components to no longer have equal thickness. To solve this problem, the connection can be "rounded" in the design stage to obtain Figure 5 Although the “rounded corner” will cause the center line of the first arc to deviate from the preset curve, the arc length corresponding to the “rounded corner” is generally expected to be less than or equal to 30% of the arc length on one side. Therefore, when the formula satisfied by the preset curve is used When fitting the discrete points on the center line of the first arc, the It is expected to be close to 1, and R 2 Greater than or equal to 0.8.

[0070] like Figure 8 , Fig.10 as well as Fig.12 As shown, and also refer to Fig. 9 , Fig.11 as well as Fig.13 ,in Fig. 9 for Figure 8 A top view of Fig.11 for Fig.10 A top view of Fig.13 for Fig.12 A first flexible groove 312 is provided on the first arc segment 31, and a second flexible groove 322 is provided on the second arc segment 32. The first flexible groove 312 and the second flexible groove 322 can increase the deformation capacity of the first arc segment 31 and the second arc segment 32 respectively, so that the first arc segment 31 and the second arc segment 32 have greater flexibility, so that the interconnection member itself is easier to deform, and the interface stress at the interconnection interface is effectively reduced.

[0071] The first flexible groove 312 may penetrate the upper surface and the lower surface of the first arc segment 31, and the second flexible groove 322 may penetrate the upper surface and the lower surface of the second arc segment 32. Of course, it is also possible to penetrate only the upper surface or the lower surface, as long as it is conducive to the deformation of the first arc segment 31 and the second arc segment 32.

[0072] like Figure 8 , Fig.10 as well as Fig.12 As shown, the first flexible groove 312 extends along the length direction of the first arc segment 31, and the second flexible groove 322 extends along the length direction of the second arc segment 32. With the above structure, the first flexible groove 312 and the second flexible groove 322 can have a larger length, further increasing the deformation capacity of the first arc segment 31 and the second arc segment 32, and making the first arc segment 31 and the second arc segment 32 have greater flexibility.

[0073] Of course, in other embodiments, the extension direction of the first flexible groove 312 and the extension direction of the first arc segment 31 may have a certain angle, and the extension direction of the second flexible groove 322 and the extension direction of the second arc segment 32 may have a certain angle, as long as it can facilitate the deformation of the first arc segment 31 and the second arc segment 32.

[0074] The ratio between the width of the first flexible groove 312 and the width of the first arc segment 31 is between 0.2 and 0.6, and the ratio between the width of the second flexible groove 322 and the width of the second arc segment 32 is between 0.2 and 0.6. With the above ratio range, the first arc segment 31 and the second arc segment 32 can have a suitable flexibility range under the premise that the first arc segment 31 and the second arc segment 32 have sufficient connection strength.

[0075] The ratio between the width of the first flexible groove 312 and the width of the first arc segment 31 and the ratio between the width of the second flexible groove 322 and the width of the second arc segment 32 can be 0.2, 0.3, 0.4, 0.5, 0.6 and any value between 0.2 and 0.6.

[0076] Preferably, the ratio between the width of the first flexible groove 312 and the width of the first arc segment 31 and the ratio between the width of the second flexible groove 322 and the width of the second arc segment 32 are between 0.3 and 0.5.

[0077] In this embodiment, the ratio of the area of ​​the first flexible groove 312 to the horizontal projection area of ​​the first arc segment 31 is between 0.2 and 0.6, so that the first arc segment 31 and the second arc segment 32 can have a suitable flexibility range under the premise that the first arc segment 31 and the second arc segment 32 have sufficient connection strength.

[0078] Preferably, the ratio of the area of ​​the first flexible groove 312 to the horizontal projection area of ​​the first arc segment 31 is between 0.3 and 0.5.

[0079] like Figure 8 , Fig.10 as well as Fig.12 As shown, the first flexible groove 312 runs through the upper surface and the lower surface of the first arc segment 31, and the second flexible groove 322 runs through the upper surface and the lower surface of the second arc segment 32. The above structure can facilitate the deformation of the first arc segment 31 and the second arc segment 32, so that the first arc segment 31 and the second arc segment 32 have greater flexibility.

[0080] In other embodiments, the first flexible groove 312 may penetrate the upper and lower surfaces of the first arc segment 31, and the second flexible groove 322 may only penetrate the upper or lower surface of the second arc segment 32. Alternatively, the first flexible groove 312 may only penetrate the upper or lower surface of the first arc segment 31, and the second flexible groove 322 may penetrate the upper and lower surfaces of the second arc segment 32.

[0081] Of course, the first flexible groove 312 may only pass through one end of the first arc segment 31, or the first flexible groove 312 may be arranged in the middle of the first arc segment 31 but not pass through both ends of the first arc segment 31. The second flexible groove 322 may also adopt the above structure.

[0082] For metal clip-type interconnection components, solder welding or ultrasonic terminal welding can be used. If the interface interconnection is achieved by melting and then solidifying the solder, setting up a wetting tank can achieve better technical effects. Fig.12 and Fig.13As shown, the lower surface of the main body section 10 is provided with a first wetting groove 11 extending along the length direction thereof, and the first wetting groove 11 is connected to the first flexible groove 312. With the above structure, the first wetting groove 11 can be used to wet the solder to form a solder layer with a concave upper surface, which increases the wetting boundary length of the interconnection material compared to the case where there is no groove at the interconnection interface, thereby improving the strength of the interface connection.

[0083] like Fig.12 As shown, the lower surface of the interface interconnection section 20 is provided with a second wetting groove 21 extending along its length direction, and the second wetting groove 21 is connected to the second flexible groove 322. With the above structure, the second wetting groove 21 can be used to wet the solder to form a solder layer with a concave upper surface, which increases the wetting boundary length of the interconnection material compared to the case where there is no groove at the interconnection interface, thereby improving the strength of the interface connection.

[0084] It should be noted that by making the first wetting groove 11 communicate with the first flexible groove 312 and the second wetting groove 21 communicate with the second flexible groove 322, the processing of the interconnection component can be facilitated and the weight of the interconnection component can be reduced.

[0085] Specifically, the first wetting groove 11 penetrates the upper surface and the lower surface of the main body section 10, and the second wetting groove 21 penetrates the upper surface and the lower surface of the interface interconnection section 20. With the above structure, the weight of the interconnection component can be reduced.

[0086] like Fig.12 and Fig.13 As shown, the first flexible groove 312 and the second flexible groove 322 are connected. With the above structure, the interconnection member has a higher flexibility. When the power device is running, the interconnection member is more likely to deform after being heated, which can effectively reduce the interface stress at the interconnection interface.

[0087] It should be noted that the interconnection member may only be provided with a flexible groove without a wetting groove, such as Fig.10 and Fig.11 As shown. The flexible groove may be provided only on the first arc segment 31, or only on the second arc segment 32, or on both. Furthermore, the first flexible groove 312 and the second flexible groove 322 may also be in a non-connected manner.

[0088] When the wetting grooves are provided, the first wetting groove 11 and the first flexible groove 312 , and the second wetting groove 21 and the second flexible groove 322 may also be provided in a non-connected manner.

[0089] The first infiltration tank 11 and the second infiltration tank 21 are not limited to the long strip shape, and may also be in other forms, such as polygonal or other special-shaped structures, such as Figure 8 and Fig. 9 shown.

[0090] like Figure 2 and Figure 3 As shown, the lower surface of the interface interconnection section 20 is higher than or flush with the lower surface of the main body section 10. The above structure is advantageous for connecting the main body section 10 and the interface interconnection section 20 with different interfaces.

[0091] like Figure 2 As shown, the thicknesses of the main body segment 10, the interface interconnection segment 20, the first arc segment 31 and the second arc segment 32 are all the same. By making each part of the interconnection component have the same thickness, the processing of the interconnection component is facilitated.

[0092] Specifically, in the length direction, the thickness of the main body section 10, the interface interconnection section 20, the first arc section 31 and the second arc section 32 remains unchanged. In the width direction, the thickness of the main body section 10, the interface interconnection section 20, the first arc section 31 and the second arc section 32 remains unchanged. With the above structure, the thickness of the interconnection member as a whole can be made uniform, which is convenient for processing.

[0093] In this embodiment, the thickness of the interconnection member is less than or equal to 5 mm. By setting the thickness of the interconnection member within the above range, the power current transmission function is achieved under the premise that the interconnection member has greater flexibility.

[0094] The thickness of the interconnecting member may be 4.5 mm, 4.6 mm, 4.7 mm, 4.8 mm, 4.9 mm, 5 mm, or any value less than or equal to 5 mm and greater than or equal to 0.4 mm, while satisfying that the ratio of the thickness of the interconnecting member to a is greater than or equal to 0.2.

[0095] Preferably, the thickness of the interconnecting member is between 1 mm and 4 mm.

[0096] The interconnection components are described below in conjunction with specific embodiments:

[0097] The interconnection member is a symmetrical structure. The length of the center line of the arched connecting section 30 of the interconnection member is 2πmm, the thickness of the interconnection member is 0.4mm, the span of the arched connecting section 30 is 4mm, and the two ends of the arched connecting section 30 are applied with equal and opposite forces in the X-axis direction. The force can be a tensile force or a compressive force. The relative displacement J of the end of the interconnection member in the direction of the force is taken as the ordinate quantity, and the preset constant As the horizontal axis, =2.6, the relative displacement J is recorded as 1, and we can get Relationship diagram with J Figure 7 .

[0098] Depend on Figure 7 It is known that in Between the ranges, the interconnecting member can have a higher flexibility, while outside this range, the structural flexibility is lower.

[0099] Specifically, in At this time, J ≥ 1.17, and the interconnected components have greater flexibility.

[0100] like Fig.14 As shown, another embodiment of the present invention provides a power device, which includes a first substrate 40, a first chip 50, and a first interconnection member 60. The first substrate 40 has a first conductive layer 41 and a second conductive layer 42 arranged at intervals; the first chip 50 is arranged on the first substrate 40, and the lower surface of the first chip 50 is connected to the first conductive layer 41; the first interconnection member 60 is arranged on the first substrate 40, and the conductive connection surface of the first interconnection member 60 is connected to the second conductive layer 42, and the interconnection surface of the first interconnection member 60 is connected to the upper surface of the first chip 50, and the first interconnection member 60 is the interconnection member provided above. By using the above power device, the conductive connection surface of the main body section 10 is connected to the conductive layer of the first substrate 40, and the interconnection surface of the interface interconnection section 20 is connected to the source electrode on the upper surface of the first chip 50, so as to realize the conduction of the power circuit of the power device. Since the arched connecting section 30 of the interconnecting member includes a first arc segment 31 and a second arc segment 32 connected to each other, the first arc segment 31 is connected to the main section 10, and the second arc segment 32 is connected to the interface interconnecting section 20, the first arc segment 31 has a first arc center line 311 in a preset longitudinal section, and the first arc center line 311 and the preset curve 33 satisfy the determination coefficient R 2 , the preset curve 33 satisfies the formula , R 2 ≥0.8, so that the interconnection component has a high flexibility. When the power device is running, the overall structure of the power device including the interconnection component is subjected to thermal load, and there will be a certain relative displacement between the main section of the interconnection component and the conductive surface of the liner, and between the interface interconnection section and the upper surface of the chip. The greater flexibility of the interconnection component can effectively reduce the maximum interface stress value between the main section and the conductive surface of the liner, and between the interface interconnection section 20 and the upper surface of the chip, thereby improving the reliability of the interface interconnection.

[0101] like Fig.15As shown, another embodiment of the present invention provides a power device, which includes a first liner 40, a second liner 43, a first chip 50, a second chip 51, and a second interconnection member 70. The first liner 40 has a first conductive layer 41 and a second conductive layer 42 arranged at intervals, and the second liner 43 has a third conductive layer 44 and a fourth conductive layer 45 arranged at intervals; the first chip 50 is arranged on the first liner 40, the lower surface of the first chip 50 is electrically connected to the first conductive layer 41, and the upper surface of the first chip 50 is electrically connected to the second conductive layer 42; the second chip 51 is arranged on the second liner 43, the lower surface of the second chip 51 is electrically connected to the third conductive layer 44, and the upper surface of the second chip 51 is electrically connected to the fourth conductive layer 45; the conductive connection surface of the second interconnection member 70 is connected to the second conductive layer 42, and the interconnection surface of the second interconnection member 70 is electrically connected to the third conductive layer 44, and the second interconnection member 70 is the interconnection member provided above. By using the above-mentioned power device, the conductive connection surface of the main body segment 10 is connected to the second conductive layer 42, and the interconnection surface of the interface interconnection segment 20 is connected to the third conductive layer 44, so that the power circuit of the power device can be turned on. Since the arched connection segment 30 of the interconnection member includes a first arc segment 31 and a second arc segment 32 connected to each other, the first arc segment 31 is connected to the main body segment 10, and the second arc segment 32 is connected to the interface interconnection segment 20, the first arc segment 31 has a first arc center line 311 in a preset longitudinal section, and the first arc center line 311 and the preset curve 33 meet the determination coefficient R 2 , the preset curve 33 satisfies the formula , R 2 ≥0.8, so that the interconnection component has a high flexibility. When the power device is running, the overall structure of the power device including the interconnection component is subjected to thermal load, and there will be a certain relative displacement between the main section of the interconnection component and the conductive surface of the liner, and between the interface interconnection section and the conductive surface of another liner. The greater flexibility of the interconnection component can effectively reduce the maximum interface stress value between the main section 10, the interface interconnection section and the conductive surface of the corresponding liner, and improve the reliability of the interface interconnection.

[0102] In this embodiment, the interconnection member is used to connect the upper bridge arm and the lower bridge arm of the power device.

[0103] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0104] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the present invention. Meanwhile, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, method and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, method and equipment should be considered as a part of the specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0105] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the devices or elements referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention. The directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0106] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0107] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the present invention.

[0108] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An interconnection component, characterized in that: The interconnection member comprises: A main body section (10), wherein the lower surface of the main body section (10) is a conductive connection surface; An interface interconnection section (20) connected to the main body section (10), the lower surface of the interface interconnection section (20) being an interconnection surface; The arched connecting section (30) comprises a first arc section (31) and a second arc section (32) connected to each other, the first arc section (31) being connected to the main section (10), the second arc section (32) being connected to the interface interconnection section (20), the first arc section (31) having a first arc center line (311) in a preset longitudinal cross section, the first arc center line (311) and a preset curve (33) satisfying a determination coefficient R 2 , the preset curve (33) satisfies the following formula: ； Wherein, x and y are the horizontal coordinate value and the vertical coordinate value of the preset curve (33) in the preset coordinate system, the X-axis direction of the preset coordinate system is parallel to or coincides with the extension direction of the horizontal center line of the main body section (10) in the preset longitudinal section, and the Y-axis direction of the preset coordinate system passes through the highest point of the preset curve (33). At the highest point of the preset curve (33), the preset curve (33) satisfies the y-axis direction. ' =0; h is the distance from the highest point of the preset curve (33) to the X-axis, a is the maximum distance from the preset curve (33) to the Y-axis, α is a preset constant; R 2 ≥0.8； The preset constant α Satisfy 0.4≤ α ≤2.

6.

2. The interconnection member according to claim 1, characterized in that The preset constant α Satisfy 0.6≤ α ≤1.

6.

3. The interconnection member according to claim 1, characterized in that The thickness of the first arc segment (31) is t, wherein t≥0.4 mm and t / a≥0.

2.

4. The interconnection member according to claim 1, characterized in that The second arc segment (32) has a second arc center line (321) in a preset longitudinal cross section, and the second arc center line (321) and the preset curve (33) satisfy a determination coefficient R 2 , R 2 ≥0.

8.

5. The interconnection member according to claim 1, characterized in that The first arc segment (31) is provided with a first flexible groove (312), and the second arc segment (32) is provided with a second flexible groove (322).

6. The interconnection member according to claim 5, characterized in that The ratio between the width of the first flexible groove (312) and the width of the first arc segment (31) is between 0.2 and 0.6; and / or, The ratio between the width of the second flexible groove (322) and the width of the second arc segment (32) is between 0.2 and 0.

6.

7. The interconnection member according to claim 5, characterized in that The first flexible groove (312) extends along the length direction of the first arc segment (31), and the second flexible groove (322) extends along the length direction of the second arc segment (32).

8. The interconnection member according to claim 5, characterized in that The first flexible groove (312) runs through the upper surface and the lower surface of the first arc-shaped segment (31), and the second flexible groove (322) runs through the upper surface and the lower surface of the second arc-shaped segment (32).

9. The interconnection member according to claim 5, characterized in that The first flexible groove (312) and the second flexible groove (322) are connected.

10. The interconnection member according to any one of claims 1 to 9, characterized in that The lower surface of the main body section (10) is provided with a first wetting groove (11) extending along its length direction; The lower surface of the interface interconnection section (20) is provided with a second wetting groove (21) extending along its length direction.

11. The interconnection member according to claim 10, characterized in that The first wetting groove (11) runs through the upper surface and the lower surface of the main body section (10), and the second wetting groove (21) runs through the upper surface and the lower surface of the interface interconnection section (20).

12. An interconnection member according to any one of claims 1 to 9, characterized in that The lower surface of the interface interconnection section (20) is higher than or flush with the lower surface of the main body section (10).

13. An interconnection member according to any one of claims 1 to 9, characterized in that The thicknesses of the main body segment (10), the interface interconnection segment (20), the first arc segment (31), and the second arc segment (32) are all the same.

14. The interconnection member according to claim 13, characterized in that In the length direction, the thicknesses of the main body segment (10), the interface interconnection segment (20), the first arc segment (31) and the second arc segment (32) remain constant; In the width direction, the thicknesses of the main body segment (10), the interface interconnection segment (20), the first arc segment (31) and the second arc segment (32) remain constant.

15. An interconnection member according to any one of claims 1 to 9, characterized in that The thickness of the interconnection member is less than or equal to 5 mm.

16. A power device, characterized in that: The power device comprises: A first lining plate (40) having a first conductive layer (41) and a second conductive layer (42) arranged at intervals; A first chip (50) is arranged on the first liner (40), and a lower surface of the first chip (50) is connected to the first conductive layer (41); A first interconnection member (60) is arranged on the first substrate (40), the conductive connection surface of the first interconnection member (60) is connected to the second conductive layer (42), the interconnection surface of the first interconnection member (60) is connected to the upper surface of the first chip (50), and the first interconnection member (60) is the interconnection member according to any one of claims 1 to 15.

17. A power device, characterized in that: The power device comprises: A first lining plate (40) and a second lining plate (43), wherein the first lining plate (40) comprises a first conductive layer (41) and a second conductive layer (42) which are arranged at intervals, and the second lining plate (43) comprises a third conductive layer (44) and a fourth conductive layer (45) which are arranged at intervals; a first chip (50) and a second chip (51), wherein the first chip (50) is arranged on the first substrate (40), the lower surface of the first chip (50) is electrically connected to the first conductive layer (41), the upper surface of the first chip (50) is electrically connected to the second conductive layer (42), and the second chip (51) is arranged on the second substrate (43), the lower surface of the second chip (51) is electrically connected to the third conductive layer (44), and the upper surface of the second chip (51) is electrically connected to the fourth conductive layer (45); A second interconnection member (70), wherein the conductive connection surface of the second interconnection member (70) is connected to the second conductive layer (42), and the interconnection surface of the second interconnection member (70) is electrically connected to the third conductive layer (44), and the second interconnection member (70) is the interconnection member according to any one of claims 1 to 15.

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