Multi-interface interconnection component and power module having the same

Abstract

The present invention provides a multi-interface interconnection component and a power module having the same, the multi-interface interconnection component comprises: a main body section, the lower surface of the main body section is a conductive connection surface; a first interface interconnection section, located at the side of the main body section and connected to the main body section, the lower surface of the first interface interconnection section is a first interconnection surface; a second interface interconnection section, located at the side of the main body section and connected to the main body section, the lower surface of the second interface interconnection section is a second interconnection surface; wherein at least one of the lower surface of the main body section, the lower surface of the first interface interconnection section and the lower surface of the second interface interconnection section is provided with a wetting groove. The technical solution provided by the present application can solve the problem of low utilization rate in the power module in the related art.

Description

Technical Field

[0001] The present invention relates to the technical field of power modules, and in particular to a multi-interface interconnection component and a power module having the same. Background Art

[0002] Power modules are devices used in the field of power electronics to control and convert electrical energy. They are used to perform power conversion functions such as rectification, inversion, chopping, and frequency conversion. They are widely used in power management, motor drive, solar inverter, power system, energy storage and other fields.

[0003] In the related art, the transmission of signals or power currents between the components inside the power module relies on the metal interconnection interfaces provided on the components and the connectors connecting the metal interconnection interfaces, for example, the interconnection between the upper surface of the chip and the upper copper layer.

[0004] However, the existing connectors only realize signal connection of two interconnection interfaces. When multiple pairs of interfaces need to be interconnected, such as when there are multiple chips on a substrate, multiple connectors are required, which will occupy a large space in the module, resulting in low device space utilization and placing greater restrictions on device layout. Summary of the invention

[0005] The present invention provides a multi-interface interconnection component and a power module having the same, so as to solve the problem of low utilization rate in the power module in the related art.

[0006] According to one aspect of the present invention, a multi-interface interconnection component is provided, comprising: a main body segment, the lower surface of which is a conductive connection surface; a first interface interconnection segment, located at the side of the main body segment and connected to the main body segment, the lower surface of the first interface interconnection segment is a first interconnection surface; a second interface interconnection segment, located at the side of the main body segment and connected to the main body segment, the lower surface of the second interface interconnection segment is a second interconnection surface; wherein at least one of the lower surface of the main body segment, the lower surface of the first interface interconnection segment and the lower surface of the second interface interconnection segment is provided with a wetting groove.

[0007] Furthermore, the multi-interface interconnection component also includes a first connecting section, which is located on the side of the main body section, and the two ends of the first connecting section are respectively connected to the main body section and the first interface interconnection section, and the lower surface of the first connecting section is higher than the lower surface of the main body section and / or the lower surface of the first interface interconnection section; the multi-interface interconnection component also includes a second connecting section, which is located on the side of the main body section, and the two ends of the second connecting section are respectively connected to the main body section and the second interface interconnection section, and the lower surface of the second connecting section is higher than the lower surface of the main body section and / or the lower surface of the second interface interconnection section.

[0008] Further, the wetting groove arranged on the first interface interconnection segment extends along the length direction of the first interface interconnection segment.

[0009] Furthermore, a connecting groove is provided on the first connecting section, and the connecting groove extends along the length direction of the first connecting section.

[0010] Furthermore, the wetting groove arranged on the main body section includes an arc-shaped groove, and the arc-shaped groove is connected to the connecting groove.

[0011] Furthermore, the wetting groove is arranged to penetrate along the up-down direction.

[0012] Further, the ratio of the width of the wetting groove arranged on the first interface interconnection segment to the width of the first interface interconnection segment is between 1 / 5 and 1 / 3; and / or, the ratio of the length of the portion of the wetting groove arranged on the first interface interconnection segment located in the first interface interconnection segment to the length of the first interface interconnection segment is between 0.1 and 0.9.

[0013] Further, the wetting groove arranged on the main body section includes a main body groove.

[0014] Furthermore, the infiltration groove arranged on the main body section also includes a main body groove, and the main body groove and the arc groove are arranged at intervals and are not connected to each other.

[0015] Furthermore, the first connecting section and / or the second connecting section is a protruding structure protruding upward; the first interface interconnection section, the second interface interconnection section and the main body section are all flat plates.

[0016] Furthermore, the first connecting section and / or the second connecting section is an arc-shaped plate.

[0017] Furthermore, the first interface interconnection segment and the second interface interconnection segment are symmetrically arranged on both sides of the main body segment, and the first interface interconnection segment and the second interface interconnection segment have the same structure.

[0018] According to another aspect of the present invention, a power module is provided, which includes: a first substrate having a first conductive layer, a second conductive layer and a third conductive layer arranged in sequence; a first chip and a second chip, both of which are arranged on the first substrate, the lower surface of the first chip is connected to the first conductive layer, and the lower surface of the second chip is connected to the third conductive layer; a first multi-interface interconnection component is arranged on the substrate, the conductive connection surface of the first multi-interface interconnection component is connected to the second conductive layer, the first interconnection surface of the first multi-interface interconnection component is connected to the upper surface of the first chip, and the second interconnection surface of the first multi-interface interconnection component is connected to the upper surface of the second chip, and the multi-interface interconnection component is the multi-interface interconnection component provided above.

[0019] According to another aspect of the present invention, a power module is provided, which includes: a second liner and a third liner, the second liner having a fourth conductive layer and a fifth conductive layer arranged at intervals, and the third liner having a sixth conductive layer and a seventh conductive layer arranged at intervals; a third chip and a fourth chip, the third chip being arranged on the second liner, the lower surface of the third chip being electrically connected to the fourth conductive layer, and the upper surface of the third chip being electrically connected to the fifth conductive layer, the fourth chip being arranged on the third liner, the lower surface of the fourth chip being electrically connected to the sixth conductive layer, and the upper surface of the fourth chip being electrically connected to the seventh conductive layer; a second multi-interface interconnection component, the conductive connection surface of the second multi-interface interconnection component being connected to the fifth conductive layer, the first interconnection surface and the second interconnection surface of the second multi-interface interconnection component being electrically connected to the sixth conductive layer, respectively, and the second multi-interface interconnection component being the multi-interface interconnection component provided above.

[0020] According to the technical solution of the present invention, the multi-interface interconnection component includes a main body section, a first interface interconnection section, and a second interface interconnection section. The conductive connection surface of the main body section is connected to the conductive layer of the liner, the first interconnection surface of the first interface interconnection section is connected to the upper surface of the chip, the lower surface of the chip is connected to another conductive layer of the liner, the second interconnection surface of the second interface interconnection section is connected to the upper surface of another chip, and the lower surface of the other chip is connected to another conductive layer of the liner. Thus, the chip, another chip and the liner can be electrically connected. Alternatively, the conductive connection surface of the main body section is connected to the conductive layer of the liner, and the first interconnection surface of the first interface interconnection section and the second interconnection surface of the second interface interconnection section are respectively connected to the conductive layer of another liner, so that the electrical connection between different conductive layers can be achieved. Since the multi-interface interconnection component connects at least two chips or conductive layers of different liner boards, the number of connectors in the related art can be reduced, the space occupied in the power module can be reduced, the space utilization rate can be improved, and the arrangement of the device can be facilitated. In addition, since at least one of the lower surface of the main body section, the lower surface of the first interface interconnection section and the lower surface of the second interface interconnection section is provided with a wetting groove. The wetting groove can be used to wet the solder to form a solder layer with a concave upper surface. Compared with the situation where there is no groove at the interconnection interface, the wetting boundary length of the interconnection material is increased, thereby improving the strength of the interface connection. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The drawings constituting a part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0022] Figure 1 A schematic structural diagram of a multi-interface interconnection component provided according to an embodiment of the present invention is shown;

[0023] Figure 2Another schematic structural diagram of a multi-interface interconnection component provided according to an embodiment of the present invention is shown;

[0024] Figure 3 A front view of a multi-interface interconnection component provided according to an embodiment of the present invention is shown;

[0025] Figure 4 A top view of a multi-interface interconnection component provided according to an embodiment of the present invention is shown;

[0026] Figure 5 A partial structural schematic diagram of a power module provided in an embodiment of the present invention is shown;

[0027] Figure 6 A schematic structural diagram of a multi-interface interconnection component provided according to another embodiment of the present invention is shown;

[0028] Figure 7 A bottom view of a multi-interface interconnection component provided according to yet another embodiment of the present invention is shown;

[0029] Figure 8 A schematic structural diagram of a multi-interface interconnection component provided according to another embodiment of the present invention is shown;

[0030] Fig. 9 A top view of a multi-interface interconnection component provided according to yet another embodiment of the present invention is shown;

[0031] Fig.10 A partial structural schematic diagram of a power module provided according to another embodiment of the present invention is shown;

[0032] Fig.11 A schematic structural diagram of a multi-interface interconnection component provided according to another embodiment of the present invention is shown;

[0033] Fig.12 A schematic structural diagram of a multi-interface interconnection component provided according to another embodiment of the present invention is shown;

[0034] Fig.13 A schematic structural diagram of a multi-interface interconnection component provided according to another embodiment of the present invention is shown.

[0035] The above drawings include the following reference numerals:

[0036] 10. Main body section; 11. Arc groove; 12. Main body groove;

[0037] 20. first interface interconnection section; 21. first connection section; 211. connection groove;

[0038] 30. Second interface interconnection section; 31. Second connection section;

[0039] 40. Infiltration tank;

[0040] 50. first liner; 51. first conductive layer; 52. second conductive layer; 53. first chip; 54. second chip; 55. third conductive layer;

[0041] 60. A first multi-interface interconnection component;

[0042] 71, second lining plate; 711, fourth conductive layer; 712, fifth conductive layer; 72, third lining plate; 721, sixth conductive layer; 722, seventh conductive layer;

[0043] 81. third chip; 82. fourth chip;

[0044] 90. A second multi-interface interconnect component. DETAILED DESCRIPTION

[0045] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0046] like Figures 1 to 13 As shown, an embodiment of the present invention provides a multi-interface interconnection component, which includes a main body section 10, a first interface interconnection section 20, and a second interface interconnection section 30, wherein the lower surface of the main body section 10 is a conductive connection surface; the first interface interconnection section 20 is located at the side of the main body section 10 and is connected to the main body section 10, and the lower surface of the first interface interconnection section 20 is a first interconnection surface; the second interface interconnection section 30 is located at the side of the main body section 10 and is connected to the main body section 10, and the lower surface of the second interface interconnection section 30 is a second interconnection surface; wherein, at least one of the lower surface of the main body section 10, the lower surface of the first interface interconnection section 20, and the lower surface of the second interface interconnection section 30 is provided with a wetting groove 40.

[0047] The technical solution of the present invention is applied, and the multi-interface interconnection component includes a main body section 10, a first interface interconnection section 20, and a second interface interconnection section 30. The conductive connection surface of the main body section 10 is connected to the conductive layer of the liner, the first interconnection surface of the first interface interconnection section 20 is connected to the upper surface of the chip, the lower surface of the chip is connected to another conductive layer of the liner, the second interconnection surface of the second interface interconnection section 30 is connected to the upper surface of another chip, and the lower surface of the other chip is connected to another conductive layer of the liner. Thus, the chip, another chip and the liner can be electrically connected. Alternatively, the conductive connection surface of the main body section 10 is connected to the conductive layer of the liner, and the first interconnection surface of the first interface interconnection section 20 and the second interconnection surface of the second interface interconnection section 30 are respectively connected to the conductive layer of another liner, so that the electrical connection between different conductive layers can be achieved. Since the multi-interface interconnection component connects at least two chips or conductive layers of different liner boards, the number of connectors in the related art can be reduced, the space occupied in the power module can be reduced, the space utilization rate can be improved, and the arrangement of the device can be facilitated. Furthermore, since at least one of the lower surface of the main body section 10, the lower surface of the first interface interconnection section 20, and the lower surface of the second interface interconnection section 30 is provided with a wetting groove 40, the solder can be wetted by the wetting groove 40 to form a solder layer with a concave upper surface, which increases the wetting boundary length of the interconnection material compared to the case where there is no groove at the interconnection interface, thereby improving the strength of the interface connection.

[0048] It should be noted that the shape of the infiltration groove 40 can be a smooth or non-smooth curve as the outline, such as the outline can be any polygon, circle, straight slot, arc slot, etc., so that the infiltration boundary length in the infiltration groove 40 can have a longer length under specific working conditions. Among them, the shape of the infiltration groove 40 can be a circle, any polygon, straight slot and arc slot.

[0049] It should be noted that when the area of ​​the metal connection region of the interconnection component at the interface interconnection section is constant, compared with the case where no wetting groove is provided, the interconnection component provided with the wetting groove 40 can make the current more evenly distributed in the active area of ​​the chip, thereby alleviating local overheating of the chip caused by current concentration.

[0050] Among them, the interconnection surface can realize the connection between the interface interconnection segment and the chip.

[0051] In other embodiments, a plurality of interface interconnection segments may be provided on the side of the main body segment 10 to achieve the same potential integrated parallel connection of a plurality of chips.

[0052] It should be noted that the first interface interconnection section 20 and the second interface interconnection section 30 can be arranged on the same side of the main body section 10, or on different side walls of the main body section 10, for example, on two opposite sides or two adjacent sides.

[0053] In this embodiment, the thickness of the interconnection member is between 0.4 mm and 5 mm. With the above size range, the solder does not protrude from the upper surface of the wetting groove 40 and is located in the wetting groove 40, so as to increase the wetting boundary length of the interconnection interface.

[0054] like Figure 1 , Figure 6 and Figure 8 As shown, the multi-interface interconnection component further includes a first connection segment 21, which is located at the side of the main body segment 10, and the two ends of the first connection segment 21 are respectively connected to the main body segment 10 and the first interface interconnection segment 20, and the lower surface of the first connection segment 21 is higher than the lower surface of the main body segment 10 and the lower surface of the first interface interconnection segment 20; the multi-interface interconnection component further includes a second connection segment 31, which is located at the side of the main body segment 10, and the two ends of the second connection segment 31 are respectively connected to the main body segment 10 and the second interface interconnection segment 30, and the lower surface of the second connection segment 31 is higher than the lower surface of the main body segment 10 and the lower surface of the second interface interconnection segment 30. The main body segment 10 and the first interface interconnection segment 20 are connected by the first connection segment 21, and the main body segment 10 and the second interface interconnection segment 30 are connected by the second connection segment 31, which has the advantages of simple structure and easy processing.

[0055] It should be noted that when the first interface interconnection segment 20 and the second interface interconnection segment 30 are respectively connected to corresponding chips, the lower surface of the main body segment 10 is lower than the lower surface of a portion of the first connection segment 21 .

[0056] In this embodiment, the first connecting section 21 and the second connecting section 31 are both raised structures protruding upward, the upper surface of the first connecting section 21 is higher than the upper surface of the main section 10 and the upper surface of the first interface interconnection section 20, and the upper surface of the second connecting section 31 is higher than the upper surface of the main section 10 and the upper surface of the second interface interconnection section 30.

[0057] like Fig.11 and Fig.12 As shown, one of the first connecting section 21 and the second connecting section 31 can be set as a convex structure with a smooth transition, and the other can be set as a convex structure with a non-smooth transition. Of course, both can also be set as convex structures with a smooth transition, or both can be set as convex structures with a non-smooth transition.

[0058] like Figure 1 , Figure 6 and Figure 8 As shown, the wetting groove 40 provided on the first interface interconnection section 20 extends along the length direction of the first interface interconnection section 20. With the above structure, the wetting groove 40 on the first interface interconnection section 20 can have a larger length, thereby making the first interface interconnection section 20 and the first chip have a larger wetting boundary length, thereby improving the strength of the interface connection.

[0059] In this embodiment, the wetting groove 40 penetrates the side wall where the first interface interconnection section 20 and the first connection section 21 are connected.

[0060] In other embodiments, Figure 6 and Figure 7 As shown, the wetting groove 40 only extends along the length direction of the first interface interconnection section 20, and both ends of the wetting groove 40 are not through.

[0061] Furthermore, in the height direction of the first interface interconnection section 20 , the wetting groove 40 may penetrate the upper surface thereof, or may be arranged in a non-penetrating manner.

[0062] Alternatively, the wetting groove 40 provided on the first interface interconnection section 20 may be a through groove, and the wetting groove 40 provided on the second interface interconnection section 30 may be a non-through groove.

[0063] like Figure 1 As shown, the first connecting section 21 is provided with a connecting groove 211, which extends along the length direction of the first connecting section 21. The connecting groove 211 can effectively increase the flexibility of the component, reduce the maximum interlayer stress when different interconnection interfaces produce relative displacement, and help improve the reliability of the interconnection interface.

[0064] The connecting groove 211 penetrates the side wall of the first connecting section 21 and communicates with the wetting groove 40 on the first interface interconnection section 20 .

[0065] like Figure 1 As shown, the wetting groove 40 provided on the main body segment 10 includes an arc-shaped groove 11. The arc-shaped groove 11 can increase the wetting boundary length of the interconnection material between the main body segment 10 and the second conductive layer 52, thereby improving the strength of the interface connection.

[0066] Specifically, the arc groove 11 is connected to the connecting groove 211. With the above arrangement, the arc groove 11 and the connecting groove 211 can be processed in one process, which has the advantage of easy processing.

[0067] In this embodiment, the wetting groove 40 is arranged to penetrate along the vertical direction. The above arrangement can reduce the weight of the component and facilitate processing.

[0068] The connection groove 211 is arranged to penetrate along the up-down direction.

[0069] In this embodiment, the ratio between the area of ​​the wetting groove 40 provided on the first interface interconnection segment 20 and the area of ​​the first interface interconnection segment 20 is between 0.03 and 0.45. With the above ratio range, the wetting boundary length of the interconnection material can be increased while ensuring that the first interface interconnection segment 20 has a sufficient interconnection area.

[0070] Of course, the ratio between the area of ​​the wetting groove 40 provided on the second interface interconnection section 30 and the area of ​​the second interface interconnection section 30 is between 0.03 and 0.45.

[0071] Preferably, the ratio between the area of ​​the wetting groove 40 provided on the first interface interconnection section 20 and the area of ​​the first interface interconnection section 20 is between 0.1 and 0.4.

[0072] Specifically, the ratio between the width of the wetting groove 40 arranged on the first interface interconnection segment 20 and the width of the first interface interconnection segment 20 is between 1 / 5 and 1 / 3. By adopting the above ratio range, the wetting boundary length of the interconnection material can be increased while ensuring that the first interface interconnection segment 20 has a sufficient interconnection area.

[0073] The ratio between the width of the wetting groove 40 provided on the first interface interconnection section 20 and the width of the first interface interconnection section 20 may be 1 / 5, 1 / 4, 1 / 3, and any value between 1 / 5 and 1 / 3.

[0074] Preferably, the ratio between the width of the wetting groove 40 provided on the first interface interconnection section 20 and the width of the first interface interconnection section 20 is between 0.25 and 0.3.

[0075] In this embodiment, the ratio between the width of the wetting groove 40 provided on the first interface interconnection section 20 and the width of the first interface interconnection section 20 is 3 / 11.

[0076] Specifically, the ratio of the length of the portion of the wetting groove 40 disposed on the first interface interconnection segment 20 located in the first interface interconnection segment 20 to the length of the first interface interconnection segment 20 is between 0.1 and 0.9. With the above ratio range, the wetting boundary length of the interconnection material can be increased while ensuring that the first interface interconnection segment 20 has a sufficient interconnection area.

[0077] The ratio of the length of the portion of the wetting groove 40 disposed on the first interface interconnection section 20 located in the first interface interconnection section 20 to the length of the first interface interconnection section 20 may be 0.1, 0.3, 0.5, 0.75, 0.9, and any value between 0.1 and 0.9.

[0078] Preferably, the ratio of the length of the portion of the wetting groove 40 disposed on the first interface interconnection segment 20 located in the first interface interconnection segment 20 to the length of the first interface interconnection segment 20 is between 0.3 and 0.7.

[0079] like Figure 1As shown, the wetting groove 40 disposed on the main body segment 10 further includes a main body groove 12. The main body groove 12 can increase the wetting boundary length of the interconnection material between the main body segment 10 and the second conductive layer 52, thereby improving the strength of the interface connection.

[0080] Specifically, the main groove 12 and the arc groove 11 are spaced apart and are not connected to each other.

[0081] like Fig.13 As shown, the shape of the main body groove 12 can be a circular arc groove shape with a straight line as the center line, or a circular arc groove shape with an arc line as the center line, or an irregular polygonal structure.

[0082] like Figure 1 As shown, the first connecting section 21 and the second connecting section 31 are arc-shaped plates. The first interface interconnection section 20, the second interface interconnection section 30 and the main section 10 are flat plates. The interconnection component adopting the above structure has the advantages of simple structure and easy processing.

[0083] In other embodiments, the first connecting section 21 and the second connecting section 31 are square plates.

[0084] In addition, providing a connection groove on the arc plate can increase the flexibility of the interconnection components and improve the reliability of the interface interconnection.

[0085] It should be noted that a plurality of interface interconnection segments may be provided on the side of the main body segment 10. Of course, a plurality of connection segments corresponding to the plurality of interface interconnection segments may also be provided. Moreover, the setting position, span, height and shape of each connection segment may be different from each other.

[0086] like Figure 1 As shown, the first interface interconnection section 20 and the second interface interconnection section 30 are symmetrically arranged on both sides of the main section 10, and the first interface interconnection section 20 and the second interface interconnection section 30 have the same structure. With the above structure, it is easier to achieve the same potential of the interconnection components, which has the advantage of being easy to process.

[0087] In other embodiments, the first interface interconnection segment 20 and the second interface interconnection segment 30 may be symmetrically disposed on the same side of the main body segment 10 .

[0088] like Figure 5As shown, another embodiment of the present invention provides a power module, the power module includes a first liner 50, a first chip 53, a second chip 54, and a multi-interface interconnection component, the first liner 50 has a first conductive layer 51, a second conductive layer 52 and a third conductive layer 55 arranged in sequence; the first chip 53 and the second chip 54 are both arranged on the first liner 50, the lower surface of the first chip 53 is connected to the first conductive layer 51, and the lower surface of the second chip 54 is connected to the third conductive layer 55; the first multi-interface interconnection component 60 is arranged on the first liner 50, the conductive connection surface of the first multi-interface interconnection component 60 is connected to the second conductive layer 52, the first interconnection surface of the first multi-interface interconnection component 60 is connected to the upper surface of the first chip 53, and the second interconnection surface of the first multi-interface interconnection component 60 is connected to the upper surface of the second chip 54, and the first multi-interface interconnection component 60 is the multi-interface interconnection component provided above. Since the first multi-interface interconnection component 60 connects at least two chips, it can reduce the number of connectors in the related art, reduce the space occupied in the power module, improve the space utilization rate, and facilitate the arrangement of devices. Furthermore, since at least one of the lower surface of the main body section 10, the lower surface of the first interface interconnection section 20, and the lower surface of the second interface interconnection section 30 is provided with a wetting groove 40, the solder can be wetted by the wetting groove 40 to form a solder layer with a concave upper surface, which increases the wetting boundary length of the interconnection material compared to the case where there is no groove at the interconnection interface, thereby improving the strength of the interface connection.

[0089] Among them, since the first chip 53 and the second chip 54 are arranged on the first liner 50, the main body section 10 is connected to the conductive layer of the first liner 50, and the two interface interconnection sections are respectively connected to the two chips, so that there is a height difference between the main body section 10 and the two interface interconnection sections. Generally speaking, the lower surface of the interface interconnection section is higher than the lower surface of the main body section 10.

[0090] like Fig.10As shown, another embodiment of the present invention provides a power module, which includes a second liner 71, a third liner 72, a third chip 81, a fourth chip 82, and a second multi-interface interconnection component 90. The second liner 71 has a fourth conductive layer 711 and a fifth conductive layer 712 arranged at intervals, and the third liner 72 has a sixth conductive layer 721 and a seventh conductive layer 722 arranged at intervals; the third chip 81 is arranged on the second liner 71, the lower surface of the third chip 81 is electrically connected to the fourth conductive layer 711, and the upper surface of the third chip 81 is electrically connected to the fifth conductive layer 712; the fourth chip 82 is arranged on the third liner 72, the lower surface of the fourth chip 82 is electrically connected to the sixth conductive layer 721, and the upper surface of the fourth chip 82 is electrically connected to the seventh conductive layer 722; the conductive connection surface of the second multi-interface interconnection component 90 is connected to the fifth conductive layer 712, the first interconnection surface and the second interconnection surface of the second multi-interface interconnection component 90 are electrically connected to the sixth conductive layer 721, respectively, and the second multi-interface interconnection component 90 is the multi-interface interconnection component provided above. Since the second multi-interface interconnection member 90 connects at least two conductive layers of different linings, the number of connectors in the related art can be reduced, the space occupied in the power module can be reduced, the space utilization rate can be improved, and the arrangement of the device can be facilitated. In addition, since at least one of the lower surface of the main body section 10, the lower surface of the first interface interconnection section 20, and the lower surface of the second interface interconnection section 30 is provided with a wetting groove 40. The wetting groove 40 can be used to wet the solder to form a solder layer with a concave upper surface. Compared with the case where there is no groove at the interconnection interface, the wetting boundary length of the interconnection material is increased, thereby improving the strength of the interface connection.

[0091] In this embodiment, the second liner 71 and the third liner 72 of the power module are axisymmetric structures, the third chip 81 and the fourth chip 82 form a symmetrical layout respectively, and the conductive layer of the power circuit of the second liner 71 and the conductive layer of the power circuit of the third liner 72 also form a symmetrical layout, the symmetry axis of the conductive layer of the power circuit of the second liner 71, the symmetry axis of the conductive layer of the power circuit of the third liner 72, the symmetry axis of multiple third chips 81, and the symmetry axis of multiple fourth chips 82 are all the same, so that the interconnection length from the upper surface of the chip to the conductive layer can be equal and of moderate length.

[0092] In the related art, the chip layout is relatively concentrated, resulting in different and generally longer interconnection lengths between the chip upper surface and the upper copper layer (conductive structure).

[0093] In other embodiments, the second lining plate 71 and the third lining plate 72 may be provided as an integrated lining plate, and the fourth conductive layer 711 , the fifth conductive layer 712 , the sixth conductive layer 721 and the seventh conductive layer 722 are all provided on the lining plate.

[0094] Specifically, there are two fourth conductive layers 711, and the two fourth conductive layers 711 are respectively located on both sides of the fifth conductive layer 712, and the axis of the fifth conductive layer 712 is coaxially arranged with the symmetry axis. The third chips 81 are symmetrically arranged on the two fourth conductive layers 711. The two fourth conductive layers 711 are separated by the fifth conductive layer 712, and the third chips 81 are arranged on both fourth conductive layers 711, which can further increase the spacing between the third chips 81, so that the third chips 81 are arranged as dispersedly as possible, thereby improving the heat dissipation performance.

[0095] like Fig.10 As shown, the fifth conductive layer 712 includes a first segment and a second segment which are perpendicular to each other, the axis of the first segment is coaxial with the axis of symmetry, one end of the first segment is connected to the middle of the second segment, the second segment is arranged between the first segment and the third liner 72, the two fourth conductive layers 711 are respectively located on both sides of the first segment, the upper surfaces of the third chip 81 on the two fourth conductive layers 711 are conductively connected to the first segment, and the second segment is conductively connected to the sixth conductive layer 721. With the above structure, the perpendicular first segment and the second segment together form a T-shaped structure.

[0096] like Fig.10 As shown, the fourth conductive layer 711 is a rectangular structure, which includes a first side and a second side that are perpendicular to each other, the first side is arranged away from the second section and is flush with an end of the first section away from the second section, and the second side is arranged away from the first section and is flush with the end of the second section. The above structure makes the shape of the conductive layer more regular, which is convenient for the uniform and dispersed arrangement of the third chip 81.

[0097] like Fig.10 As shown, the sixth conductive layer 721 has a notch at one end facing the second liner 71 in the first direction, the seventh conductive layer 722 extends into the notch, the axis of the seventh conductive layer 722 is coaxial with the symmetry axis, the sixth conductive layer 721 is provided with fourth chips 82 at positions on both sides of the notch in the second direction, the fifth conductive layer 712 is conductively connected to the sixth conductive layer 721, and the upper surface of the fourth chip 82 on the sixth conductive layer 721 is conductively connected to the seventh conductive layer 722. The fourth chips 82 on the sixth conductive layer 721 are separated by the seventh conductive layer 722, which can further increase the spacing between the fourth chips 82, so that the fourth chips 82 are dispersed as much as possible, thereby improving the heat dissipation performance.

[0098] The first direction refers to the length direction of the second lining plate 71 , and the second direction refers to the width direction of the second lining plate 71 .

[0099] In this embodiment, the sixth conductive layer 721 includes a third section, a fourth section and a fifth section, the third section and the fifth section are located on the same side of the fourth section, the third section and the fifth section are respectively connected to both ends of the fourth section, the side wall of the third section, the side wall of the fourth section and the side wall of the fifth section together form a gap, and the fourth section is arranged at an end of the third section away from the second liner 71. With the above structure, the third section, the fourth section and the fifth section together form a U-shaped structure, and the two legs of the U-shaped structure are arranged opposite to the second section of the T-shaped structure, which can further improve the symmetry of the power module.

[0100] It should be noted that the end of the third segment away from the fourth segment, the end of the fifth segment away from the fourth segment and the end of the seventh conductive layer 722 away from the fourth segment are flush. The above structure makes the conductive layer of the liner more regular, which is convenient for the uniform and dispersed arrangement of the fourth chip 82.

[0101] It should be noted that the lining board in this application is a copper-clad ceramic substrate. The copper-clad ceramic substrate is a three-layer structure. The upper and lower layers are both conductor layers, and the middle layer is a ceramic substrate. The upper conductor layer is a conductive layer, forming a topological structure of the circuit. The ceramic substrate in the middle layer plays an insulating and heat-conducting role. The lower conductor layer is generally connected to the bottom plate (the bottom plate is connected to the bottom plate) through an interconnection material. Fig.10 It has a heat-conducting effect, increases the symmetry of the liner structure, and suppresses the thermal warping of the liner.

[0102] The ceramic substrate of the middle layer can generally be made of ceramic materials such as alumina, aluminum nitride, alumina doped with zirconium oxide, and silicon nitride. Alumina has excellent mechanical strength and chemical corrosion resistance, and is suitable for applications with high durability requirements. Zirconia is known for its outstanding toughness and high temperature resistance, and performs well in high temperature and high stress environments. Aluminum nitride has high thermal conductivity and low expansion coefficient, can effectively dissipate heat, and is suitable for high-power electronic devices. Silicon carbide not only has high hardness and high wear resistance, but also can remain stable at extremely high temperatures, making it very popular in high-temperature electronic devices and high-frequency applications. The diversity and excellent properties of these ceramic materials provide a wide range of choices and significant performance improvements for the design and application of silicon carbide devices.

[0103] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0104] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the present invention. Meanwhile, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, method and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, method and equipment should be considered as a part of the specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0105] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the devices or elements referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention. The directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0106] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0107] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the present invention.

[0108] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A multi-interface interconnection component, characterized in that: include: A main body section (10), wherein the lower surface of the main body section (10) is a conductive connection surface; a first interface interconnection section (20), located at a side of the main body section (10) and connected to the main body section (10), the lower surface of the first interface interconnection section (20) being a first interconnection surface; a second interface interconnection section (30), located at a side of the main body section (10) and connected to the main body section (10), the lower surface of the second interface interconnection section (30) being a second interconnection surface; Wherein, the lower surface of the main body section (10), the lower surface of the first interface interconnection section (20) and the lower surface of the second interface interconnection section (30) are all provided with a wetting groove (40); The multi-interface interconnection component further comprises a first connection section (21), the first connection section (21) being located at a side of the main body section (10), two ends of the first connection section (21) being respectively connected to the main body section (10) and the first interface interconnection section (20), and a lower surface of the first connection section (21) being higher than a lower surface of the main body section (10) and / or a lower surface of the first interface interconnection section (20); The first connecting section (21) is provided with a connecting groove (211), the connecting groove (211) extending along the length direction of the first connecting section (21), the connecting groove (211) penetrating the side wall of the first end of the first connecting section (21) and communicating with the wetting groove (40) on the first interface interconnection section (20); The wetting groove (40) provided on the main body section (10) comprises an arc-shaped groove (11), and the arc-shaped groove (11) is connected to the side wall of the second end of the connecting groove (211); The ratio between the width of the wetting groove (40) provided on the first interface interconnection section (20) and the width of the first interface interconnection section (20) is between 1 / 5 and 1 / 3; The ratio between the length of the portion of the wetting groove (40) disposed on the first interface interconnection section (20) located in the first interface interconnection section (20) and the length of the first interface interconnection section (20) is between 0.1 and 0.

9.

2. The multi-interface interconnection component according to claim 1, characterized in that: The multi-interface interconnection component further comprises a second connecting section (31), the second connecting section (31) being located at a side of the main section (10), the two ends of the second connecting section (31) being respectively connected to the main section (10) and the second interface interconnection section (30), and the lower surface of the second connecting section (31) being higher than the lower surface of the main section (10) and / or the lower surface of the second interface interconnection section (30).

3. The multi-interface interconnection component according to claim 1, characterized in that: The wetting groove (40) provided on the first interface interconnection section (20) extends along the length direction of the first interface interconnection section (20).

4. The multi-interface interconnection component according to claim 1, characterized in that: The infiltration groove (40) is arranged to penetrate in the up-down direction.

5. The multi-interface interconnection component according to claim 1, characterized in that: The wetting groove (40) arranged on the main body section (10) comprises a main body groove (12).

6. The multi-interface interconnection component according to claim 1, characterized in that: The infiltration groove (40) arranged on the main body section (10) further comprises a main body groove (12), wherein the main body groove (12) and the arc-shaped groove (11) are arranged at intervals and are not connected to each other.

7. The multi-interface interconnection component according to claim 2, characterized in that: The first connecting section (21) and / or the second connecting section (31) is a raised structure protruding upwards; The first interface interconnection section (20), the second interface interconnection section (30) and the main body section (10) are all flat plates.

8. The multi-interface interconnection component according to claim 2, characterized in that: The first connecting section (21) and / or the second connecting section (31) is an arc-shaped plate.

9. The multi-interface interconnection component according to claim 2, characterized in that: The first interface interconnection section (20) and the second interface interconnection section (30) are symmetrically arranged on both sides of the main body section (10), and the first interface interconnection section (20) and the second interface interconnection section (30) have the same structure.

10. A power module, characterized in that: The power module comprises: A first lining plate (50) having a first conductive layer (51), a second conductive layer (52) and a third conductive layer (55) arranged in sequence; A first chip (53) and a second chip (54), wherein the first chip (53) and the second chip (54) are both arranged on the first substrate (50), the lower surface of the first chip (53) is connected to the first conductive layer (51), and the lower surface of the second chip (54) is connected to the third conductive layer (55); A first multi-interface interconnection component (60) is arranged on the first liner (50), the conductive connection surface of the first multi-interface interconnection component (60) is connected to the second conductive layer (52), the first interconnection surface of the first multi-interface interconnection component (60) is connected to the upper surface of the first chip (53), and the second interconnection surface of the first multi-interface interconnection component (60) is connected to the upper surface of the second chip (54), and the first multi-interface interconnection component (60) is the multi-interface interconnection component described in any one of claims 1 to 9.

11. A power module, characterized in that: The power module comprises: A second lining plate (71) and a third lining plate (72), wherein the second lining plate (71) has a fourth conductive layer (711) and a fifth conductive layer (712) arranged at intervals, and the third lining plate (72) has a sixth conductive layer (721) and a seventh conductive layer (722) arranged at intervals; a third chip (81) and a fourth chip (82), wherein the third chip (81) is arranged on the second substrate (71), the lower surface of the third chip (81) is electrically connected to the fourth conductive layer (711), and the upper surface of the third chip (81) is electrically connected to the fifth conductive layer (712); and the fourth chip (82) is arranged on the third substrate (72), the lower surface of the fourth chip (82) is electrically connected to the sixth conductive layer (721), and the upper surface of the fourth chip (82) is electrically connected to the seventh conductive layer (722); A second multi-interface interconnection component (90), wherein the conductive connection surface of the second multi-interface interconnection component (90) is connected to the fifth conductive layer (712), the first interconnection surface and the second interconnection surface of the second multi-interface interconnection component (90) are respectively electrically connected to the sixth conductive layer (721), and the second multi-interface interconnection component (90) is the multi-interface interconnection component according to any one of claims 1 to 9.

Images