A copper-chromium alloy and a method for producing and using the same

Abstract

The application belongs to the technical field of optical communication metal materials, and particularly relates to a copper-chromium alloy and a preparation method and application thereof. Raw materials of the copper-chromium alloy include metal raw materials and a binder, and the volume ratio of the binder to the metal is 11:100. The metal raw materials include the following components according to weight parts: Si content 0.18-0.22%, Cu content 98.5-99.5%, Fe content 0.01-0.03%, Ni content 0.02-0.04%, Cr content 0.5-1.5%, Zr content 0.05-0.25%, and Ag content 0.3-0.5%. The preparation method of the copper-chromium alloy optimizes the proportioning of the copper-chromium alloy, adjusts the element content in the batching, and is matched with a proper MIM process, so that the thermal conductivity and hardness of the material are successfully improved, and the material meets specific performance requirements.

Description

Technical Field

[0001] This invention belongs to the field of optical communication metal materials technology, and particularly relates to a copper-chromium alloy, its preparation method and application. Background Technology

[0002] With the rapid development of the AI ​​era, the demand for high-speed, high-capacity signal transmission in the 5G communication field is increasing. 800G optical communication is gradually failing to meet the needs of the times, making the transition to 1600G an inevitable trend. However, existing zinc-aluminum alloy materials are not ideal in terms of heat dissipation, which has become one of the key factors restricting the further development of optical communication technology.

[0003] Copper, with its excellent thermal conductivity, has become a potential alternative to zinc-aluminum alloys. However, traditional manufacturing processes for copper products have many shortcomings, such as high material waste, large processing volumes, and high processing costs. Therefore, developing new manufacturing processes, especially MIM (Metal Injection Molding) technology, is of great significance for improving the performance and reducing the cost of copper products. However, the copper feedstocks currently available for MIM are not ideal, and the performance of the processed products often fails to meet usage requirements. This is mainly reflected in the product's variability and insufficient thermal conductivity. Variability may lead to shape changes or performance degradation during use, directly affecting the signal transmission efficiency and stability of optical communication equipment.

[0004] Currently, the market lacks MIM (Metal Injection Molding) processes for preparing copper that can meet industrial performance requirements, as well as the corresponding raw materials and products. Summary of the Invention

[0005] The technical problem to be solved by the present invention is that the feeding of the existing MIM process is not ideal and the product performance is insufficient. To overcome the shortcomings and defects mentioned in the background art, the present invention provides a copper-chromium alloy, its preparation method and application.

[0006] To solve the above-mentioned technical problems, the technical solution proposed by this invention is as follows:

[0007] A copper-chromium alloy, wherein the raw materials of the copper-chromium alloy include metal raw materials and a binder, wherein the volume ratio of the binder to the metal is 11:100;

[0008] The metal raw materials, by weight, include the following components:

[0009] The content of Si is 0.18-0.22%, Cu is 98.5-99.5%, Fe is 0.01-0.03%, Ni is 0.02-0.04%, Cr is 0.5-1.5%, Zr is 0.05-0.25%, and Ag is 0.3-0.5%.

[0010] Traditional copper-chromium alloy materials often contain elements such as Si, Cu, Fe, and Ni, resulting in products with insufficient heat dissipation and electrical conductivity, failing to meet the requirements of 1600G products. To address these issues, this application adds 0.5-1.5% Cr to the copper-chromium alloy raw material to increase its thermal conductivity and 0.05-0.25% Zr to increase its hardness. The addition of these two elements significantly improves the thermal conductivity and hardness of the material, enabling it to meet the thermal conductivity requirement of (370-390) W·m. -1 ·K -1 The material meets the requirement of a hardness HV≥110; secondly, to improve the conductivity of the material, we added Ag element, with the content controlled at 0.3-0.5%. Ag is an excellent conductive material, and its addition makes the conductivity of the copper-chromium alloy reach ≥59.6×10⁻⁶. 6 S / m requirements.

[0011] Preferably, the adhesive is a plastic-based adhesive. The plastic-based adhesive comprises 65% polystyrene, 16% polyethylene, 12% stearic acid, and 10% diethyl phthalate by weight.

[0012] Plastic-based binders undergo rapid degreasing via acid catalysis, with byproducts being safe gases such as CO2 and N2. The equipment is simple and easy to manage. Meanwhile, wax-based binders have a short sintering time and result in minimal product deformation.

[0013] Preferably, the thermal conductivity of the copper-chromium alloy is 370-390 W·m. -1 ·K -1 Hardness HV≥110, conductivity ≥59.6×10 6 S / m.

[0014] Based on a general inventive concept, the present invention also provides a method for preparing the copper-chromium alloy, comprising the following steps:

[0015] (1) The raw materials of the copper-chromium alloy are prepared and mixed by intensive kneading to obtain a mixture;

[0016] (2) The mixture is injection molded to obtain an alloy green blank;

[0017] (3) The alloy green billet is subjected to acid-catalyzed degreasing treatment to obtain copper-chromium alloy.

[0018] Preferably, the mixing temperature is 180-200℃ and the granulation time is 6-7 hours.

[0019] Preferably, the injection molding parameters include: injection speed of 100±30% mm / s, injection pressure of 195±30% MPa, screw advance position of 10±10 mm, holding pressure of 70±30% MPa, time of 40±1 s, mold opening and closing speed of 30% mm / s, mold opening and closing pressure of 40±30% MPa, and mold opening position of 10±10 mm.

[0020] Preferably, the screw switching position of the injection molding is 10±15.0mm, and the metering residual material is 5±5.0mm.

[0021] Preferably, the injection molding cycle is 10-20s, the cooling time is 1-11s, and the cycle time differs by 5-15s between using a robotic arm and not using a robotic arm.

[0022] Preferably, the acid-catalyzed degreasing treatment involves acid catalysis followed by high-temperature combustion, with the high temperature being 900-1000 degrees Celsius. The acids used include sulfuric acid (30g / L-50g / L), ammonium bifluoride (3g / L-8g / L), citric acid (2g / L-4g / L), sodium nitrate (1g / L-3g / L), ferric sulfate (0.5g / L-1.5g / L), or dipropylene glycol (1g / L-2g / L). Sulfuric acid can act as an auxiliary component, synergistically working with other acids to improve the degreasing effect and enhance the permeability and solubility of the degreasing agent. Citric acid primarily acts as a corrosion inhibitor in acidic degreasing solutions, effectively suppressing the corrosion of metals such as copper in acidic media. Sodium nitrate primarily acts as an oxidizing flux. Ammonium bifluoride has strong corrosive and dissolving capabilities, reacting with grease, dirt, and oxides on metal surfaces to achieve a cleaning effect.

[0023] The above acids provide rapid acid-catalyzed degreasing, and the byproducts are safe gases such as CO2 and N2, resulting in a high safety index and environmental friendliness. Degreasing effectively removes impurities and excess components from materials, further improving their performance.

[0024] Based on a general inventive concept, the present invention also provides an application of the copper-chromium alloy, which is used in the field of optical communication.

[0025] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0026] (1) This invention provides a copper-chromium alloy that solves the problems of processing deformation and insufficient thermal conductivity of copper-chromium alloy feedstock in MIM process. The thermal conductivity of the copper-chromium alloy is 370-390 W·M. -1 ·K -1 Hardness HV≥110, conductivity ≥59.6×10 6The S / m ratio meets the performance requirements of the optical communication field; copper-chromium alloy materials not only have excellent thermal conductivity, hardness and electrical conductivity, but also good processing performance and environmental friendliness, and are expected to be widely used in optical communication and other fields.

[0027] (2) The method for preparing copper-chromium alloy of the present invention optimizes the proportion of copper-chromium alloy, adjusts the element content in the ingredients, and uses appropriate MIM process to successfully improve the thermal conductivity and hardness of the material so as to meet specific performance requirements. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 The images show specific examples of the copper-chromium alloy obtained in Example 1 being used in optical communication accessories. Detailed Implementation

[0030] To facilitate understanding of the present invention, the present invention will be described more fully and in detail below with reference to the accompanying drawings and preferred embodiments, but the scope of protection of the present invention is not limited to the following specific embodiments.

[0031] Unless otherwise defined, all technical terms used herein have the same meaning as commonly understood by those skilled in the art. The technical terms used herein are for the purpose of describing particular embodiments only and are not intended to limit the scope of the invention.

[0032] Unless otherwise specified, all raw materials, reagents, instruments and equipment used in this invention can be purchased from the market or prepared by existing methods.

[0033] Example 1

[0034] This embodiment provides a copper-chromium alloy, the raw materials of which include metal raw materials and binders, and the volume ratio of binder to metal is 11:100;

[0035] Metal raw materials, by weight, include the following components:

[0036] The content of Si is 1.8g, Cu is 985g, Fe is 0.1g, Ni is 0.2g, Cr is 5g, Zr is 5g, and Ag is 3g.

[0037] The adhesive consists of 650g polystyrene, 160g polyethylene, 120g stearic acid and 100g diethyl phthalate by weight.

[0038] The method for preparing the copper-chromium alloy in this embodiment includes the following steps:

[0039] (1) Prepare the raw materials according to the copper-chromium alloy. First, add the metal raw materials, mix them evenly, then add the binder, and mix and granulate at 180 degrees Celsius to obtain the mixture. The granulation time is 6-7 hours.

[0040] (2) Set the injection molding process parameters as follows: injection speed 100mm / s, injection pressure 195MPa, screw advance position 10mm, holding pressure 70MPa, time 40s, mold opening and closing speed 30%mm / s, mold opening and closing pressure 40%MPa, mold opening position 10mm; screw switching position 10mm, metering residual material 5mm; injection molding cycle 15s, cooling time 6s, and the cycle time difference between using a robot and not using a robot is 10s.

[0041] Start the molding equipment to inject the mixture into a green alloy blank;

[0042] (3) The alloy billet is subjected to acid catalysis and then high-temperature combustion at a temperature of 900-1000 degrees Celsius. The acid used is a mixture of sulfuric acid 30g / L-50g / L, ammonium bifluoride 3g / L-8g / L, citric acid 2g / L-4g / L, sodium nitrate 1g / L-3g / L, ferric sulfate 0.5g / L-1.5g / L, and dipropylene glycol 1g / L-2g / L to obtain a copper-chromium alloy.

[0043] The obtained copper-chromium alloy was subjected to product performance testing:

[0044] 1. Thermal conductivity determination, the test method is GB / T 22588-2008. Prepare the thermal conductivity measuring instrument, turn on the instrument, put in the specimen to be tested, click start test, test time is 3 hours, wait for data output;

[0045] 2. Hardness and conductivity tests

[0046] Ambient conditions: Temperature: 23±2℃; Humidity: 50±5%RH; Test standards: ASTM E1269-11 (Reapproved 2018), GB / T 1423-1996, GB / T 22588-2008; Test conditions: Test model: Cowan model + impulse correction;

[0047] The test results are shown in Table 1 below. The thermal conductivity of the copper-chromium alloy obtained in this embodiment is 370-390 W·M. -1 ·K-1 Hardness HV≥110, conductivity ≥59.6×10 6 S / m.

[0048] Table 1. Performance test results of copper-chromium alloy products in Example 1 and Comparative Examples 1-3

[0049]

[0050] The copper-chromium alloy of this embodiment is used in optical communication accessories in the field of optical communication, as shown in the specific picture. Figure 1 As shown, the product's durability has been improved, and the waste materials after processing are easily recyclable.

[0051] Comparative Example 1:

[0052] The rest of this comparative example is exactly the same as that of Example 1, except that the metal raw material does not contain Cr, Zr and Ag.

[0053] Comparative Example 2:

[0054] The rest of this comparative example is exactly the same as that of Example 1, except that the metal raw material does not contain Zr and Ag.

[0055] Comparative Example 3:

[0056] The rest of this comparative example is exactly the same as that of Example 1, except that the metal raw material does not contain Ag.

Claims

1. A method of producing a copper-chromium alloy, characterized by, The copper-chromium alloy is used in the field of optical communication, and the raw material of the copper-chromium alloy comprises metal raw material and binder, and the volume ratio of the binder to the metal is 105-115:995-1005; the metal raw material comprises the following components according to weight parts: Si content 0.18-0.22%, Cu content 98.5-99.5%, Fe content 0.01-0.03%, Ni content 0.02-0.04%, Cr content 0.5-1.5%, Zr content 0.05-0.25%, Ag content 0.3-0.5%, and the preparation method comprises the following steps: (1) the raw material of the copper-chromium alloy is dosed, and the mixed material is obtained by dense mixing and granulation; the temperature of the dense mixing is 180-200 DEG C, and the granulation time is 6-7h; (2) the mixed material is injection molded to obtain the alloy green body; the injection molding parameters comprise: the injection speed is 100±30% mm / s, the injection pressure is 195±30% MPa, the forward position of the screw is 10±10mm, the holding pressure is 70±30% MPa, the time is 40±1s, the opening and closing speed of the mold is 30% mm / s, the opening and closing pressure of the mold is 40±30% MPa, and the mold opening position is 10±10mm; (3) the alloy green body is subjected to acid catalytic debinding treatment to obtain the copper-chromium alloy, wherein the acid catalytic debinding treatment is high-temperature combustion after acid catalysis, and the high temperature is 900-1000 DEG C.

2. The production method according to claim 1, wherein The screw switching position of the injection molding is 10±15.0mm, and the metering excess material amount is 5±5.0mm.

3. The production method according to claim 1, wherein The cycle of the injection molding is 10-20s, the cooling time is 1-11s, and the cycle time difference between using a mechanical hand and not using a mechanical hand is 5-15s.

4. The production method according to claim 1, wherein The acid used in the acid catalytic debinding treatment comprises sulfuric acid 30g / L-50g / L, ammonium hydrogen fluoride 3g / L-8g / L, citric acid 2g / L-4g / L, sodium nitrate 1g / L-3g / L, ferric sulfate 0.5g / L-1.5g / L and dipropylene glycol 1g / L-2g / L.

5. The production method according to claim 1, wherein The binder is a plastic-based binder, and the plastic-based binder comprises mass parts 60~65% polystyrene, 16~20% polyethylene, 12~15% stearic acid and 10~15% diethyl phthalate.

6. The production method according to claim 1, wherein The copper-chromium alloy has a thermal conductivity of 370-390 W·M -1 ·K -1 , a hardness HV≥110, and an electrical conductivity≥59.6×10 6 S / m.

7. Use of a copper-chromium alloy obtained by the production process according to any one of claims 4 to 6, characterized in that, The copper-chromium alloy is used in the field of optical communication.

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