Aerosol electronic device manufacturing platform in microgravity environment and working method thereof

Abstract

The application provides an aerosol electronic device manufacturing platform in a microgravity environment and a working method thereof, and belongs to the technical field of intelligent manufacturing and additive manufacturing. The aerosol electronic device manufacturing platform in the microgravity environment comprises an atomizer and an in-situ sintering platform. The atomizer comprises an ink tank, a piston, a capillary tube array, a carrier gas channel, a discharging channel, an ultrasonic transducer, a sheath gas channel and a nozzle. The ink tank can accommodate ink. One end of the capillary tube array is in communication with one end of the ink tank. The piston is slidingly arranged at the other end of the ink tank. The carrier gas channel and the discharging channel are in communication. The other end of the capillary tube array is in communication with the discharging channel. The central axes of the carrier gas channel and the discharging channel are on the same straight line. The ultrasonic transducer is fixedly connected with the capillary tube array. The sheath gas channel is in communication with the discharging channel. The nozzle is in communication with the discharging channel. The in-situ sintering platform is located below the nozzle. The aerosol electronic device manufacturing platform can capture and transport ink in a microgravity environment and avoid over-spraying.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of intelligent manufacturing and additive manufacturing, and particularly relates to an aerosol electronic device manufacturing platform in a microgravity environment and a working method thereof. BACKGROUND

[0002] Electronic devices, as the basic components of electronic equipment, are widely used in various space loads. The extreme environment in space makes electronic devices subject to extremely cold and hot temperature cycles, cosmic high-energy radiation, atomic oxygen erosion and other harsh loads, which are more likely to cause the failure of electronic components. The failure of a single electronic component will lead to the failure of the entire electronic equipment and even threaten the safety of the entire space system. Therefore, damaged, degraded and failed electronic components need to be replaced in time. In addition, space activities such as extravehicular activities of astronauts and space experiments such as space breeding require specific electronic devices to monitor the health status of astronauts and the growth of plants. However, any space resources currently need to be carried by spacecraft, and the time period of a single launch is long and the cost is huge, which cannot meet the real-time demand of space for electronic devices, which urgently requires space stations to have the ability to manufacture electronic devices.

[0003] The microgravity environment in space brings great difficulties to the manufacturing of electronic devices. Most importantly, materials cannot be deposited by gravity. In addition, the space environment also requires the manufacturing platform to have high resource utilization, miniaturization, light weight, high safety and other characteristics.

[0004] Aerosol jet printing is an emerging additive manufacturing method. Ink is atomized and applied with a sheath gas by ultrasonic. Due to the protection, convergence and collimation of the sheath gas, the ink has a large speed (more than 1 m / s) when it leaves the nozzle, which can be inertially deposited on the substrate, preliminarily overcoming the microgravity environment. In addition, aerosol jet printing can achieve micron-level manufacturing precision under the convergence of the sheath gas, and is compatible with a variety of material systems such as metal conductive materials, polymer insulating materials and ceramic materials, which can realize the integrated preparation and packaging integration of multiple materials, preliminarily possessing the ability to carry out precise electronic device additive manufacturing and meeting the high requirements of space on resource utilization efficiency.

[0005] However, there are two technical bottlenecks for applying aerosol jet printing to the microgravity environment in space: one is the problem of ink atomization in the microgravity environment, and the ink will be suspended in the liquid reservoir, and the capture and transmission of the ink will be difficult. The second is the easy occurrence of over jet phenomenon, which will cause serious safety hazards. Over jet refers to the droplets around the printing track, and this printing defect widely exists in aerosol jet printing, which affects the printing resolution and also brings the risk of short circuit. In addition, in the microgravity environment, the droplets splash and float in the air after colliding with the substrate, which also threatens the safety of electronic equipment and staff in the space station. SUMMARY

[0006] Therefore, in order to solve the problems that the capture and transmission of the ink will be difficult in the microgravity environment, and the over jet phenomenon is easy to occur, which affects the printing resolution and causes serious safety hazards, the aerosol electronic device manufacturing platform in the microgravity environment and the working method thereof are provided.

[0007] To achieve the above-mentioned purpose, the following technical solutions are adopted:

[0008] The aerosol electronic device manufacturing platform in the microgravity environment comprises an atomizer and an in-situ sintering platform, wherein the atomizer comprises:

[0009] An ink tank capable of containing ink;

[0010] A piston and a capillary tube array, one end of the capillary tube array is in communication with one end of the ink tank, and the piston is slidingly arranged at the other end of the ink tank;

[0011] A carrier gas channel and a discharging channel, the carrier gas channel and the discharging channel are in communication, the other end of the capillary tube array is in communication with the discharging channel, and the central axes of the carrier gas channel and the discharging channel are on the same straight line;

[0012] An ultrasonic transducer fixedly connected with the capillary tube array;

[0013] A sheath gas channel in communication with the discharging channel;

[0014] A nozzle in communication with the discharging channel, and the in-situ sintering platform is located below the nozzle.

[0015] As a preferred solution of the aerosol electronic device manufacturing platform in the microgravity environment, the nozzle adopts a Luer connector.

[0016] As a preferred solution of the aerosol electronic device manufacturing platform in the microgravity environment, the inner diameter of the nozzle is 100 μm, 150 μm, 200 μm, 300 μm or 450 μm.

[0017] As a preferred solution of the aerosol electronic device manufacturing platform in the microgravity environment, the table of the in-situ sintering platform is made of alumina ceramic material.

[0018] The application also provides a working method of the aerosol electronic device manufacturing platform in the microgravity environment, which adopts the aerosol electronic device manufacturing platform in the microgravity environment.

[0019] S1: selecting ink material for electronic device preparation;

[0020] S2: configuring the ink material into ink using solvent;

[0021] S3: injecting the ink into the ink tank, and sliding the piston to be arranged in the ink tank, so that the ink is located between the piston and the capillary array;

[0022] S4: starting the ultrasonic transducer;

[0023] S5: in-situ sintering platform;

[0024] S6: introducing carrier gas into the carrier gas channel, and introducing sheath gas into the sheath gas channel;

[0025] S7: the ultrasonic transducer drives the capillary array to vibrate, and the ink at the liquid-gas interface at the end of the capillary array is broken to generate aerosol particles;

[0026] S8: the aerosol particles form an aerosol flow under the action of the carrier gas, and are converged and collimated by the sheath gas, and the aerosol beam flow surrounded by the sheath gas is sprayed from the nozzle outlet to the in-situ sintering platform after further convergence of the nozzle.

[0027] As a preferred solution of the working method of the aerosol electronic device manufacturing platform in the microgravity environment, in S1, the ink material adopts metal conductive material, polymer insulating material, quantum dot material, thermoelectric material for energy conversion, or sensing material for temperature, humidity or pressure sensing.

[0028] As a preferred solution of the working method of the aerosol electronic device manufacturing platform in the microgravity environment, in S2, the solvent is made of 60-75% deionized water, 5-10% diethylene glycol, 15-20% isopropyl alcohol, and 0.5% terpineol, by volume percentage.

[0029] As a preferred solution of the working method of the aerosol electronic device manufacturing platform in the microgravity environment, in S4, the input voltage of the ultrasonic transducer is adjusted according to the viscosity of the ink, the higher the viscosity of the ink, the greater the required critical atomization voltage, and the input voltage range of the ultrasonic transducer is 10-50V.

[0030] As a preferred method of the aerosol electronic device manufacturing platform in the microgravity environment, in S5, the in-situ sintering platform can provide a heating temperature of 30-500 DEG C.

[0031] As a preferred method of the aerosol electronic device manufacturing platform in the microgravity environment, in S6, the carrier gas flow into the carrier gas channel is 0-500 sccm; the sheath gas flow into the sheath gas channel is 0-2000 sccm.

[0032] Compared with the prior art, the aerosol electronic device manufacturing platform in the microgravity environment and the working method thereof have the following advantages:

[0033] 1. The aerosol electronic device manufacturing platform in the microgravity environment and the working method thereof, the ink is injected into the ink tank and sealed by using a piston, the piston will automatically move with the consumption of the ink, and the volume of the ink tank containing the ink will change according to the automatic movement of the piston, so as to avoid the internal air bubbles of the ink during the consumption process. The capillary array is connected to one end of the ink tank, the microgravity environment does not affect the action of capillary force, and the ink enters the capillary array under the action of capillary force. The ultrasonic transducer is fixedly connected with the capillary array and closely contacts, under the action of alternating voltage, the ultrasonic transducer can drive the capillary array to vibrate, and the ink at the liquid-gas interface at the end of the capillary array is broken to generate aerosol particles. The aerosol electronic device manufacturing platform in the microgravity environment, by using the piston and the capillary array to capture and transport the ink, and using the ultrasonic transducer and the capillary array to directly contact and transmit ultrasonic energy, aerosol particles are generated, which can solve the problem that the ink cannot be atomized in the microgravity environment and is difficult to capture and transport.

[0034] 2. The aerosol electronic device manufacturing platform in the microgravity environment and the working method thereof, after the aerosol beam is sprayed from the nozzle, it is protected by the sheath gas, reaches the high-temperature substrate of the in-situ sintering platform and is quickly sintered in-situ, and the nanoparticles quickly form a sintering neck under the action of high temperature, so as to avoid over-spraying and obtain a regular printed circuit with extremely low edge roughness. Through the convergence, collimation and protection of the sheath gas, combined with the high-temperature heating provided by the in-situ sintering platform, the over-spraying phenomenon is solved, the in-situ sintering of the ink material is realized, the liquid drop splashing is avoided, the printing resolution is improved, and the safety in the microgravity environment is improved. BRIEF DESCRIPTION OF DRAWINGS

[0035] The accompanying drawings, which form a part of this application, are included to provide a further understanding of the application, illustrate the preferred embodiments of the application and assist in

[0036] Figure 1 is a structural schematic diagram of an aerosol electronic device manufacturing platform in a microgravity environment provided by specific embodiments of the present application;

[0037] Figure 2 is a state of aerosol flow of the aerosol electronic device manufacturing platform in a microgravity environment provided by specific embodiments of the present application at a lower sheath gas flow / carrier gas flow value;

[0038] Figure 3 is a state of aerosol flow of the aerosol electronic device manufacturing platform in a microgravity environment provided by specific embodiments of the present application at a higher sheath gas flow / carrier gas flow value;

[0039] Figure 4 is a change process of the nano-particles sprayed by the aerosol electronic device manufacturing platform in a microgravity environment provided by specific embodiments of the present application;

[0040] Figure 5 is a structural schematic diagram of a circuit prepared by the aerosol electronic device manufacturing platform in a microgravity environment provided by specific embodiments of the present application when the in-situ sintering platform is not turned on;

[0041] Figure 6 is Figure 5 a microstructure diagram at A in FIG. 1;

[0042] Figure 7 is a structural schematic diagram of a circuit prepared by the aerosol electronic device manufacturing platform in a microgravity environment provided by specific embodiments of the present application after the in-situ sintering platform is turned on;

[0043] Figure 8 is Figure 7 a microstructure diagram at B in FIG. 1;

[0044] in FIG. 1;

[0045] 1, ink tank; 2, piston; 3, capillary array; 4, ultrasonic transducer; 5, carrier gas channel; 6, material feeding channel; 7, sheath gas channel; 8, nozzle; 9, aerosol particle; 10, in-situ sintering platform; 11, nano-particle. DETAILED DESCRIPTION

[0046] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict, and the described embodiments are only some of the embodiments of the present application, not all the embodiments.

[0047] In the description of the present application, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0048] In the present application, unless otherwise explicitly specified and limited, the first feature "on" or "under" the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "above" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0049] In the description of the present embodiment, the terms "up", "down", "right", and other orientation or position relationships are based on the orientation or position relationship shown in the drawings, and are only for the convenience of description and simplification of operation, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second" are only used to distinguish in description, and have no special meaning.

[0050] The microgravity environment of space brings great difficulties to the manufacture of electronic devices. Most importantly, materials cannot be deposited by gravity. In addition, the space environment also requires the manufacturing platform to have the characteristics of high resource utilization, miniaturization, light weight, high safety, etc. There are two technical bottlenecks in applying aerosol jet printing to the microgravity environment of space: one is the problem of ink atomization in the microgravity environment, and there will be difficulties in capturing and transporting the ink. The second is prone to over-spraying, which affects the printing resolution and also brings the risk of short circuit, which will cause serious safety hazards.

[0051] To this end, the present application provides an aerosol electronic device manufacturing platform in microgravity environment and a working method thereof. The aerosol electronic device manufacturing platform in microgravity environment uses a piston and a capillary array to capture and transport ink, uses a physical direct contact between an ultrasonic transducer and the capillary array to deliver ultrasonic energy, and generates aerosol particles to solve the problem that ink cannot be atomized in a microgravity environment and is difficult to capture and transport. Through the convergence, collimation and protection of sheath gas, combined with high-temperature heating provided by the in-situ sintering platform, the overshooting phenomenon is solved, the in-situ sintering of ink materials is realized, droplet splashing is avoided, the printing resolution is improved, and the safety of use in a microgravity environment is improved.

[0052] Reference Figures 1-8 To specifically describe the present embodiment, the present application provides an aerosol electronic device manufacturing platform in microgravity environment and a working method thereof. The aerosol electronic device manufacturing platform in microgravity environment includes an atomizer and an in-situ sintering platform 10. The atomizer includes an ink bin 1, a piston 2, a capillary array 3, a carrier gas channel 5, a discharge channel 6, an ultrasonic transducer 4, a sheath gas channel 7 and a nozzle 8. The ink bin 1 can accommodate ink. One end of the capillary array 3 is in communication with one end of the ink bin 1. The piston 2 is slidingly arranged at the other end of the ink bin 1. The carrier gas channel 5 and the discharge channel 6 are in communication. The other end of the capillary array 3 is in communication with the discharge channel 6. The central axes of the carrier gas channel 5 and the discharge channel 6 are on the same straight line. The ultrasonic transducer 4 is fixedly connected with the capillary array 3. The sheath gas channel 7 is in communication with the discharge channel 6. The nozzle 8 is in communication with the discharge channel 6. The in-situ sintering platform 10 is located below the nozzle 8.

[0053] The aerosol electronic device manufacturing platform in the microgravity environment, after the ink is injected into the ink tank 1, the piston 2 is used for sealing, the piston 2 will automatically move with the consumption of the ink, the volume of the ink tank 1 containing the ink will change according to the automatic movement of the piston 2, so that the air bubbles inside the ink during the consumption process are avoided. The capillary array 3 is connected with one end of the ink tank 1, the microgravity environment does not affect the action of capillary force, and the ink enters the capillary array 3 under the action of capillary force. The ultrasonic transducer 4 is fixedly connected with the capillary array 3 and is in close contact, under the action of alternating voltage, the ultrasonic transducer 4 can drive the capillary array 3 to vibrate, break the ink at the liquid-gas interface at the end of the capillary array 3 to generate aerosol particles 9, and enter the discharging channel 6. The carrier gas enters the discharging channel 6 from the carrier gas channel 5, in the discharging channel 6, the aerosol particles 9 form a stable aerosol flow under the action of the carrier gas, and are converged and collimated by the sheath gas entering the discharging channel 6 from the sheath gas channel 7, and finally are further converged by the nozzle 8, the aerosol beam flow surrounded by the sheath gas is sprayed out of the nozzle 8 outlet, and is sprayed onto the in-situ sintering platform 10. The atomizer can be compatible with polymers, metals, semiconductors and various materials and stably generate aerosol droplets with a particle size of less than 5 microns. After the aerosol beam flow is sprayed out of the nozzle 8, it is surrounded by the sheath gas, reaches the high-temperature substrate of the in-situ sintering platform 10 and is rapidly sintered in-situ, and the nanoparticles 11 rapidly form sintering necks under the action of high temperature, so that over-spraying is avoided, and regular printed lines with extremely low edge roughness are obtained. Moreover, by changing the gas volume flow ratio of the sheath gas to the carrier gas, aerosol beam flows with different widths can be obtained, so that the printing resolution is adjusted, for example, as shown in FIG. 6, a larger printing resolution is brought by a lower sheath gas flow / carrier gas flow value, as shown in FIG. 7, a smaller printing resolution is brought by a higher sheath gas flow / carrier gas flow value. By adjusting the ratio of the gas volume flow of the carrier gas to the sheath gas, a super-fine resolution of 5 microns and a super-wide resolution interval of 5-300 microns can also be obtained. Figure 2 Figure 3

[0054] Optionally, the nozzle 8 adopts a luer interface. It can be quickly disassembled and replaced, and nozzles 8 of different sizes can be selected to quickly adapt to circuit printing of different resolutions.

[0055] Optionally, the inner diameter of the nozzle 8 is 100 microns, 150 microns, 200 microns, 300 microns or 450 microns. The inner diameter of the nozzle 8 can be selected according to the target resolution.

[0056] Optionally, the table top of the in-situ sintering platform 10 is made of alumina ceramic material.

[0057] The application also provides a working method of an aerosol electronic device manufacturing platform in a microgravity environment, which adopts the aerosol electronic device manufacturing platform in the microgravity environment. ​​

[0058] S1: Select ink materials for electronic device preparation.

[0059] Among them, the ink material adopts metal conductive materials such as nano-silver and nano-copper, high molecular insulating materials such as polyimide and polyurethane, quantum dot materials such as CdSe and PbS, thermoelectric materials for energy conversion such as SiGe and BiSb, or sensing materials for temperature, humidity or pressure sensing such as MXene, MOF and graphene.

[0060] Among them, the morphology of the metal conductive material can be nanoparticles 11, nanosheets or nanowires.

[0061] S2: Use solvents to configure the ink material into ink.

[0062] Among them, the solvent is made of 60-75% deionized water, 5-10% diethylene glycol, 15-20% isopropyl alcohol, and 0.5% terpineol, by volume percentage. The viscosity of the ink is 1-50 cp.

[0063] S3: Inject the ink into the ink tank 1, and slide the piston 2 to set in the ink tank 1, so that the ink is located between the piston 2 and the capillary array 3.

[0064] After injecting the ink into the ink tank 1, use the piston 2 to seal it. The ink automatically wets into the capillary array 3, and as the ink is consumed, the piston 2 automatically moves, compressing the space in the ink tank 1 to accommodate the ink, so that the ink can be easily captured and transported.

[0065] S4: Turn on the ultrasonic transducer 4. Adjust the input voltage of the ultrasonic transducer 4 according to the viscosity of the ink. The higher the viscosity of the ink, the greater the critical atomization voltage required, and the input voltage range of the ultrasonic transducer 4 is 10-50V. The frequency of the ultrasonic transducer 4 is 2400KHz.

[0066] S5: Sinter in situ platform 10. The table of the in situ sintering platform 10 is alumina ceramic, which can provide a heating temperature of 30-500℃. If the sintering temperature is too low, the overspray phenomenon cannot be avoided, and if the sintering temperature is too high, the aerosol droplets will completely dry before reaching the in situ sintering platform 10, hindering the inertial deposition. The best sintering temperature should be the lowest temperature at which the particles just form a sintering neck, which can be obtained by experiment or molecular dynamics simulation calculation.

[0067] S6: Introduce carrier gas into the carrier gas channel 5, and introduce sheath gas into the sheath gas channel 7.

[0068] Wherein, according to the target resolution to select the appropriate carrier gas flow and sheath gas flow. The carrier gas flow into the carrier gas channel 5 is 0-500sccm; the sheath gas flow into the sheath gas channel 7 is 0-2000sccm. The appropriate process window can be determined by experiment or computational fluid dynamics simulation method.

[0069] S7: The ultrasonic transducer 4 drives the capillary array 3 to vibrate, and the ink at the liquid-gas interface at the end of the capillary array 3 is broken to generate aerosol particles 9.

[0070] Wherein, the physical direct contact of the ultrasonic transducer 4 with the capillary array 3 can better transmit ultrasonic energy.

[0071] S8: The aerosol particles 9 form an aerosol stream under the action of the carrier gas, and are converged and collimated by the sheath gas, and the aerosol beam stream surrounded by the sheath gas is sprayed from the nozzle 8 outlet to the in-situ sintering platform 10.

[0072] The ink at the liquid-gas interface at the end of the capillary array 3 is broken by the ultrasonic transducer 4 to generate aerosol particles 9, which enter the feeding channel 6. The carrier gas enters the feeding channel 6 from the carrier gas channel 5. In the feeding channel 6, the aerosol particles 9 form a stable aerosol stream under the action of the carrier gas, and are converged and collimated by the sheath gas entering the feeding channel 6 from the sheath gas channel 7. Finally, the aerosol beam stream surrounded by the sheath gas is sprayed from the nozzle 8 outlet at high speed and collimation, and is sprayed onto the high-temperature substrate of the in-situ sintering platform 10 to perform rapid in-situ sintering. The nanoparticles 11 rapidly form sintering necks under the action of high temperature, thereby avoiding over-spraying.

[0073] The steps of preparing the conductive circuit by using the aerosol electronic device manufacturing platform in the microgravity environment are as follows:

[0074] Step one: Select silver, a common conductor material for electronic devices, in the form of spherical nanoparticles 11 with an average particle size of 45 nm.

[0075] Step two: Take 1.0g of silver nanoparticles and add them to a mixed solvent made of 72% deionized water, 6% diethylene glycol, 21.5% isopropyl alcohol, and 0.5% terpineol by volume percentage. Stir at a speed of 600r / min for 1h at room temperature, then place in an ultrasonic water bath for 0.5h of ultrasonic dispersion to obtain the required conductive ink. The viscosity of the ink is 22cp.

[0076] Step three: Inject the ink into the ink tank 1, and the ink automatically wets into the capillary array 3.

[0077] Step four: Turn on the ultrasonic transducer 4. The frequency of the ultrasonic transducer 4 is 2400KHz, and the voltage is 32V.

[0078] Step five: turn on the in-situ sintering platform 10. The temperature of the in-situ sintering platform 10 is 175℃.

[0079] Step six: introduce carrier gas into the carrier gas channel 5 and sheath gas into the sheath gas channel 7. According to the target resolution of 15 microns, a nozzle 8 with an inner diameter of 150 microns is selected, the carrier gas flow rate is 40 sccm, and the sheath gas flow rate is 165 sccm.

[0080] Step seven: the ultrasonic transducer 4 drives the capillary array 3 to vibrate, and the ink at the liquid-gas interface at the end of the capillary array 3 is broken to generate aerosol particles 9.

[0081] Step eight: the aerosol particles 9 form an aerosol stream under the action of the carrier gas, and are converged and collimated by the sheath gas, and are further converged by the nozzle 8. The aerosol beam stream surrounded by the sheath gas is sprayed out of the nozzle 8 to the in-situ sintering platform 10.

[0082] When the in-situ sintering platform 10 is not turned on, a large amount of over-spraying occurs, as shown in Figure 5 and 6 , and the microstructure of the circuit is separated spherical nanoparticles 11. After turning on the in-situ sintering platform 10, in-situ sintering of the aerosol beam stream is achieved, and over-spraying is avoided, as shown in Figure 7 and 8 , and the microstructure of the circuit can be seen that the spherical nanoparticles 11 form sintering necks between each other to realize connection. The printed conductive circuit is measured to have a resistivity of 26μΩ·cm after being kept at 175℃ for 1h, which meets the conductive requirements of electronic circuits.

[0083] Obviously, the above disclosed embodiments of the application are only used to help explain the application. The embodiments do not describe all the details, nor limit the application to the specific implementation. According to the content of the specification, many modifications and changes can be made. The embodiments are selected and described in detail in order to better explain the principles and practical applications of the application, so that those skilled in the art can well understand and utilize the application. It is not necessary and impossible to exhaust all the implementation ways. Any modification, equivalent replacement and improvement made within the spirit and principles of the application shall be included in the protection scope of the claims of the application.

Claims

1. A method for operating an aerosol electronic device manufacturing platform under microgravity conditions, characterized in that, An aerosol electronic device manufacturing platform in a microgravity environment, The aerosol electronic device manufacturing platform in a microgravity environment comprises an atomizer and an in-situ sintering platform (10), wherein the atomizer comprises: An ink tank (1) capable of containing ink; A piston (2) and a capillary array (3), one end of the capillary array (3) is in communication with one end of the ink tank (1), and the piston (2) is slidingly arranged at the other end of the ink tank (1); after the ink is injected into the ink tank (1), the piston (2) is used for sealing, the piston (2) automatically moves with the consumption of the ink, and the volume of the ink tank (1) containing the ink changes according to the automatic movement of the piston (2), so that air bubbles are avoided in the internal consumption process of the ink; the ink enters the capillary array (3) under the action of capillary force; A carrier gas channel (5) and a discharging channel (6), the carrier gas channel (5) and the discharging channel (6) are in communication, the other end of the capillary array (3) is in communication with the discharging channel (6), and the central axes of the carrier gas channel (5) and the discharging channel (6) are on the same straight line; An ultrasonic transducer (4) fixedly connected with the capillary array (3); the ultrasonic transducer (4) is in physical direct contact with the capillary array (3); A sheath gas channel (7) in communication with the discharging channel (6); A nozzle (8) in communication with the discharging channel (6), and the in-situ sintering platform (10) is located below the nozzle (8); the nozzle (8) adopts a luer interface; the inner diameter of the nozzle (8) is 100 μm, 150 μm, 200 μm, 300 μm or 450 μm; The working method of the aerosol electronic device manufacturing platform in a microgravity environment comprises: S1: selecting an ink material for electronic device preparation; S2: configuring the ink material into ink using a solvent; S3: injecting the ink into the ink tank (1), and slidingly arranging the piston (2) in the ink tank (1) so that the ink is located between the piston (2) and the capillary array (3); S4: turning on the ultrasonic transducer (4); adjusting the input voltage of the ultrasonic transducer (4) according to the viscosity of the ink, the higher the viscosity of the ink, the greater the required critical atomization voltage, and the input voltage range of the ultrasonic transducer (4) is 10-50 V; S5: turning on the in-situ sintering platform (10); the in-situ sintering platform (10) provides a heating temperature of 30 ℃-500 ℃; the table surface of the in-situ sintering platform (10) is made of alumina ceramic material; S6: introducing carrier gas into the carrier gas channel (5) and sheath gas into the sheath gas channel (7); the flow rate of the carrier gas introduced into the carrier gas channel (5) is 0-500 sccm; the flow rate of the sheath gas introduced into the sheath gas channel (7) is 0-2000 sccm; S7: the ultrasonic transducer (4) drives the capillary array (3) to vibrate, breaks the ink at the liquid-gas interface at the end of the capillary array (3) to generate aerosol particles (9); S8: The aerosol particles (9) form an aerosol flow under the action of the carrier gas, and are converged and collimated by the sheath gas, and are further converged by the nozzle (8), and the aerosol flow surrounded by the sheath gas is sprayed from the nozzle (8) outlet to the in-situ sintering platform (10), and the aerosol particles (9) reach the high-temperature substrate of the in-situ sintering platform and are rapidly in-situ sintered, and the nanoparticles rapidly form sintering necks under the action of high temperature, thereby avoiding over-spraying; By changing the gas volume flow ratio of the sheath gas to the carrier gas, an aerosol flow with different widths is obtained, so as to control the printing resolution.

2. The method of claim 1, wherein: In S1, the ink material is a metal conductive material, a polymer insulating material, a quantum dot material, a thermoelectric material for energy conversion, or a sensing material for temperature, humidity or pressure sensing.

3. The method of claim 1, wherein: In S2, the solvent is made of 60-75% deionized water, 5-10% diethylene glycol, 15-20% isopropyl alcohol, and 0.5% terpineol.

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