Semiconductor package and ultrasonic system having the same

Abstract

The invention relates to a semiconductor package and an ultrasonic system having the same. The semiconductor package includes a housing and at least one micromechanical ultrasonic transducer disposed in the housing. Furthermore, the semiconductor package comprises a cable interface integrated into the housing, which cable interface is designed to be detachably connected to a connector of a cable in order to electrically contact the semiconductor package from the outside.

Description

Technical Field

[0001] The present disclosure relates to contacting of semiconductor packages for ultrasound applications. Examples relate in particular to semiconductor packages and ultrasound systems having the semiconductor packages. Background Art

[0002] In ultrasonic sensors, the challenge is to ensure a good acoustic connection between the component and the surrounding system by means of a coupling medium. Likewise, the acoustic sensor needs to be electrically connected as simply as possible.

[0003] Therefore, a need exists for enabling improved electrical connections for ultrasonic sensors. Summary of the invention

[0004] This need is solved by a semiconductor package and an ultrasound system according to the independent claims. Further aspects and developments are described in the dependent claims, the following description and the drawings.

[0005] According to a first aspect, the present disclosure relates to a semiconductor package. The semiconductor package includes a housing and at least one micromechanical ultrasonic transducer arranged in the housing. In addition, the semiconductor package includes a cable interface integrated into the housing, the cable interface being configured to be detachably connected to a connector of a cable so as to electrically contact the semiconductor package from the outside.

[0006] According to a second aspect, the present disclosure relates to an ultrasound system. The ultrasound system includes a semiconductor package according to the first aspect and a cable having a connector. The connector can be detachably connected to a cable interface integrated into a housing of the semiconductor package so as to electrically contact the semiconductor package through the cable.

[0007] The cable interface integrated into the housing of the semiconductor package is a compact solution for flexible and simple installation of cables for electrical contacting of at least one ultrasonic transducer. Thus, the semiconductor package or at least one ultrasonic transducer can also be integrated into (very) small systems. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Some examples of the device and / or method are described in detail below with reference to the accompanying drawings, wherein:

[0009] Figure 1 A first example of an ultrasound system having a semiconductor package is schematically shown;

[0010] Figure 2 A second example of an ultrasound system having a semiconductor package is schematically shown;

[0011] Figure 3 A third example of an ultrasound system having a semiconductor package is schematically shown;

[0012] Figure 4 A fourth example of an ultrasound system having a semiconductor package is schematically shown;

[0013] Figure 5 A fifth example of an ultrasound system having a semiconductor package is schematically illustrated;

[0014] Figure 6 schematically illustrates another semiconductor package;

[0015] Figure 7 A sixth example of an ultrasound system having a semiconductor package is schematically illustrated;

[0016] Figure 8 A seventh example of an ultrasound system having a semiconductor package is schematically illustrated; and

[0017] Fig. 9 Schematically shows Figure 8 A rear view of a semiconductor package is shown. DETAILED DESCRIPTION

[0018] Some examples are now described in more detail with reference to the accompanying drawings. However, other possible examples are not limited to the features of the embodiments described in detail. Other possible examples may have modifications of features and analogs and alternatives of features. In addition, the terms used to describe specific examples in this article should not limit other possible examples.

[0019] Throughout the description of the drawings, the same or similar reference numerals refer to the same or similar elements or features, which can be implemented identically or also in a modified form, respectively, and which provide the same or similar functions. In addition, in the drawings, the thickness of the lines, layers and / or regions used for illustration may be exaggerated.

[0020] When two elements A and B are combined using "or", this should be understood to mean that, unless explicitly defined otherwise in individual cases, all possible combinations are disclosed, i.e. only A, only B and A and B. As alternative expressions for the same combination, "at least one of A and B" or "A and / or B" can be used. This is equivalent to a combination of more than two elements.

[0021] If singular forms such as "a", "an" and "the" are used and the use of only one single element is neither explicitly nor implicitly defined as mandatory, then additional examples may also use multiple elements in order to achieve the same function. If the function is subsequently described as being achieved using multiple elements, then additional examples may achieve the same function using a single element or a single processing entity. It is also to be understood that the terms "comprising" and "having" when used describe the presence of the described features, integers, steps, operations, processes, elements, parts and / or components thereof, but do not exclude the presence or addition of one or more other features, integers, steps, operations, processes, elements, parts and / or components thereof.

[0022] Figure 1 A cross-sectional view of a first semiconductor package 100 is schematically shown. The semiconductor package 100 includes a housing 110. The housing 110 is formed of a casting material (casting material). For example, the casting material may be an epoxy casting material, a thermoplastic casting material, such as polyphenylene sulfide (PPS), polystyrene (PS), polypropylene (PP), polycarbonate (PC), polybutylene succinate (PBS) or liquid crystal polymer (English: Liquid Crystal Polymer, LCP), a thermosetting casting material, a foamed plastic casting material or a combination thereof. However, it should be noted that the present disclosure is not limited to the above examples.

[0023] The semiconductor package 100 also includes at least one micromachined ultrasonic transducer (English: Micromachined Ultrasonic Transducer, micromachined ultrasonic transducer) 120 arranged in the housing 110. A micromachined ultrasonic transducer is an ultrasonic transducer based on a microsystem (English: MicroElectroMechanical System, MEMS). At least one micromachined ultrasonic transducer 120 is formed in a semiconductor material 125 such as a silicon wafer or a silicon chip. However, it should be noted that the present disclosure is not limited to the above-mentioned semiconductor materials. In principle, any suitable semiconductor material can be used. The semiconductor material 125 is arranged in the housing 110. The housing 110 is a physical package that protects at least one micromachined ultrasonic transducer 120 and, if necessary, protects other elements arranged in the housing. Figure 1 Exactly one micromachined ultrasonic transducer 120 is shown. However, it should be noted that the semiconductor package 100 is not limited thereto. In general, the semiconductor package 100 may include any number N ≥ 1 of micromachined ultrasonic transducers that are packaged (packaged, assembled, mounted) in the housing 110. In other words, a plurality of micromachined ultrasonic transducers may also be optionally arranged in the housing 110.

[0024] The micromachined ultrasonic transducer can be configured so that it recognizes ultrasonic waves received from the environment and / or generates ultrasonic waves and outputs the ultrasonic waves to the environment. The energy transmission through the micromachined ultrasonic transducer can be based on different effects such as capacitance and piezoelectricity. In other words, the micromachined ultrasonic transducer mentioned in the present disclosure can be a capacitive micromachined ultrasonic transducer (English: Capacitive Micromachined Ultrasonic Transducer, C micromachined ultrasonic transducer) or a piezoelectric micromachined ultrasonic transducer (English: Piezoelectric Micromachined Ultrasonic Transducer, P micromachined ultrasonic transducer). The capacitive micromachined ultrasonic transducer consists of two electrodes, one of which is fixed and the other electrode is wrapped, surrounded or formed by a movable membrane of the micromachined ultrasonic transducer. The membrane electrode is separated from the fixed electrode by a small gas-filled gap (e.g., an air gap) so that the membrane electrode can move relative to the fixed electrode. The piezoelectric micromachined ultrasonic transducer includes a movable membrane coupled to a piezoelectric element (device, structure) or formed by a piezoelectric element. Typically, at least one micromechanical ultrasonic transducer 120 can be configured such that it can transmit and / or detect sound waves at least between 20 kHz and 1 GHz and / or any sub-range thereof. In particular, at least one micromechanical ultrasonic transducer 120 can be configured such that it can transmit and / or detect low-frequency ultrasonic waves (e.g., in about 50 kHz) for applications in air, such as for proximity identification (e.g., for parking sensors of vehicles) or high-frequency ultrasonic waves (e.g., in about 2 to 10 MHz) for diagnostic applications (e.g., medical ultrasound).

[0025] An acoustic coupling medium 140 is also arranged (introduced) in the housing 110 for acoustic coupling between the at least one micromechanical ultrasonic transducer 120 and the housing 110. Figure 1As shown, the acoustic coupling medium 140 can fill the housing 110. However, the housing 110 does not have to be completely filled with the acoustic coupling medium 140. The acoustic coupling medium 140 is a substance or material that facilitates the transmission of ultrasonic waves between the housing 110 and the at least one micromechanical ultrasonic transducer 120. The acoustic coupling medium 140 serves as a medium through which ultrasonic waves can be propagated, so as to ensure that when the ultrasonic waves from the at least one micromechanical ultrasonic transducer 120 pass through the acoustic coupling medium 40 and enter the housing 110 (or vice versa), there is only as little or minimal energy loss as possible. In addition, the acoustic coupling medium 140 is a medium for impedance matching between the acoustic impedance of the at least one micromechanical ultrasonic transducer 120 and the acoustic impedance of the housing 110. Therefore, the acoustic impedance of the acoustic coupling medium 140 can be lower than the acoustic impedance of the at least one micromechanical ultrasonic transducer 120. Similarly, the acoustic impedance of the acoustic coupling medium 140 can be higher than the acoustic impedance of the housing 110. The acoustic coupling medium 140 can be, for example, a gel. However, the current disclosure is not limited thereto. In other examples, the acoustic coupling medium 140 can be, for example, cream or oil. The acoustic coupling medium 140 can be composed of different substances, such as silicone or bistable epoxide. However, the present disclosure is not limited to the above substances. Generally, any suitable substance can be used for the acoustic coupling medium 140. The composition of the acoustic coupling medium 140 can be related to the specific application, and therefore to the frequency range of the ultrasonic wave transmitted and / or to be detected by the at least one micromechanical ultrasonic transducer 120.

[0026] For example, the semiconductor package 100 may be disposed on an external application surface (on the first side 111 of the housing 110 or the semiconductor package 100). Figure 1 100). The external application surface is a surface outside the semiconductor package 100, on which the semiconductor package 100 can be placed (directly or indirectly). The external application surface is arranged between the semiconductor package 100, that is, at least one micromechanical ultrasonic transducer 120 and an object to be monitored or tracked (e.g., a finger or hand) or a spatial volume. The external application surface can be, for example, a housing or an operating panel of a device / application including the semiconductor package 100. For example, the external application surface can be an operating panel of a consumer electronic device for touch input or an operating panel of a vehicle (e.g., a car, truck, train, airplane, ship, etc.). Therefore, at least one micromechanical ultrasonic transducer 120 can be formed to transmit ultrasonic waves in the direction of the first side 111 and / or receive ultrasonic waves passing through the first side 11. Ultrasonic waves can propagate through the coupling medium 140 between at least one micromechanical ultrasonic transducer 120 and the external application surface with minimal energy loss.

[0027] The lead frame (connection frame) 150 is arranged in the housing 110 and is electrically coupled to the at least one micromechanical ultrasonic transducer 120. To this end, the at least one micromechanical ultrasonic transducer 120 is electrically contacted by means of one or more bonding wires, such as in Figure 1 As shown in FIG. 1 , the semiconductor material 125 is electrically coupled to the lead frame 150 by bonding wires 155 and 156 between the semiconductor material 125 and the lead frame 150. By means of one or more bonding wires, an electrical coupling to the lead frame 150 can be established. Further electrical elements or components arranged in the housing 110 can be electrically coupled to the lead frame 150 by bonding wires in a similar manner. At least one micromechanical ultrasonic transducer 120 can be electrically contacted via the lead frame 150.

[0028] At least one contact 151 of the lead frame 150 is guided out of the housing 110 laterally to form a cable interface 130 in the form of a laterally extending electrical plug contact integrated into the housing 110. The cable interface 130 or at least one contact 151 of the lead frame 150 is configured to be detachably connected to a plug connector 161 of a cable 160 to electrically contact or be able to electrically contact the semiconductor package 100 from the outside. Figure 1 , exactly one contact 151 of the lead frame 150 is led out of the housing 110. However, it should be noted that the semiconductor package 100 is not limited thereto. Generally, any number M≥1 of contacts of the lead frame 150 can be led out of the housing 110 laterally. In other words, optionally, multiple contacts of the lead frame 150 can also be led out of the housing 110 laterally to form corresponding laterally extending electrical plug contacts for one or more connectors of one or more cables. As in Figure 1 As shown by arrow 170 in the figure, the connector 161 of the cable 160 can be detachably connected to the cable interface 130 integrated into the housing 110 of the semiconductor package 100, that is, to at least one contact 151 of the lead frame 150, so as to electrically contact the semiconductor package 100 by means of the cable 160.

[0029] For example, one or more control signals for at least one micromachined ultrasonic transducer 120 or other electrical element or component in housing 110 may be provided via cable 160 or cable interface 130 integrated into housing 110. In a similar manner, one or more output signals of at least one micromachined ultrasonic transducer 120 or other electrical element or component in housing 110 may be read via cable 160 or cable interface 130 integrated into housing 110. Semiconductor package 100 and cable 160 form an ultrasonic system 199.

[0030] At least one micromachined ultrasonic transducer 120 can operate as an ultrasonic transmitter and / or an ultrasonic receiver (detector). For example, in order to control the capacitive micromachined ultrasonic transducer so that it transmits ultrasonic waves, a DC voltage for pre-tightening the electrodes and an AC voltage for manipulating the membrane can be provided (applied) to the electrodes of the capacitive micromachined ultrasonic transducer. In order to control the capacitive micromachined ultrasonic transducer that acts as an ultrasonic receiver (detector), a DC voltage for pre-tightening the electrodes can be provided (applied) to the electrodes of the capacitive micromachined ultrasonic transducer and a voltage change between the electrodes can be measured, which is caused by the capacitance change caused by the movement of the membrane through the received ultrasonic waves. The signal or voltage to be applied to the capacitive micromachined ultrasonic transducer can be provided via the cable 160 and applied to the capacitive micromachined ultrasonic transducer via the lead frame 150. In a similar manner, the voltage change caused by the movement of the membrane between the electrodes of the capacitive micromechanical ultrasonic transducer can be guided out from the semiconductor package 100 via the lead frame 150 (i.e., the cable interface 130) and transmitted to the external circuit via the cable 160 for further processing. In a similar manner, in order to control a piezoelectric micromechanical ultrasonic transducer that transmits ultrasonic waves, for example, an AC voltage can be provided (applied) to the piezoelectric element so as to manipulate the membrane by the induced deflection of the piezoelectric element. In order to control a piezoelectric micromechanical ultrasonic transducer used as an ultrasonic receiver (detector), for example, the voltage output by the piezoelectric element due to the deflection caused by the piezoelectric element through the received ultrasonic wave can be measured. The signal to be applied to the piezoelectric micromechanical ultrasonic transducer or the voltage to be applied can be provided via the cable 160 and applied to the piezoelectric micromechanical ultrasonic transducer via the lead frame 150. In a similar manner, the piezoelectric voltage caused by the movement of the membrane can be led out of the semiconductor package 100 via the lead frame 150 and transmitted to an external circuit via the cable 160 for further processing. In other words: the control of the at least one micromechanical ultrasonic transducer 120 can be realized from the outside through the corresponding signal transmitted to the cable interface 130 via the cable 160. Similarly, one or more output signals of the at least one micromechanical ultrasonic transducer 120 can be transmitted to an external circuit via the cable interface 130 or the cable 160 for further processing.

[0031] In an alternative example, the at least one micromechanical ultrasonic transducer 120 can also be controlled or read out internally, ie, within the semiconductor package 100. To this end, the semiconductor package 100 may include, for example, a processing circuit (in Figure 1110 ), the processing circuit is electrically connected to at least one micromechanical ultrasonic transducer 120. The processing circuit can be formed in the semiconductor material 125 or a separate semiconductor material arranged in the housing 110, such as another silicon wafer or silicon chip. For example, the processing circuit can be electrically coupled to the lead frame 150. To this end, similar to the above-mentioned embodiments for at least one micromechanical ultrasonic transducer 120, the processing circuit can be electrically contacted, for example, by means of one or more bonding wires. The electrical coupling with the lead frame 150 can be established by one or more bonding wires. The processing circuit is configured to control at least one micromechanical ultrasonic transducer 120 and to process one or more output signals of at least one micromechanical ultrasonic transducer 120. Here, according to the above-mentioned embodiments, the control of at least one micromechanical ultrasonic transducer 120 or the processing of one or more output signals of at least one micromechanical ultrasonic transducer 120 can be performed by the processing circuit for external control or further processing. The processing circuit can be implemented in different ways. For example, the processing circuit can be or include an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a processor or a combination thereof. The processing circuit may optionally be coupled to or include a memory in which a program having program code is stored, which, when executed by the processing circuit, causes the processing circuit to perform the functions described herein. Accordingly, corresponding control commands or control signals for the processing circuit may be provided to the cable interface 130 via the cable 160. Likewise, one or more output signals of the processing circuit may be delivered to an external circuit via the cable interface 130 or the cable 160 for further processing.

[0032] Optionally, the semiconductor package 100 may include additional electronic components, such as one or more amplifiers for amplifying one or more signals within the semiconductor package 100, one or more passive electronic components (such as resistors, capacitors, or inductors), or one or more light emitting diodes (LEDs) for status indication. Depending on the type, the additional electronic components may be arranged in or on the housing.

[0033] exist Figure 1 In the example of FIG. 1 , at least one contact 151 of the lead frame 150 protrudes laterally (ie, sideways) from the housing to form a corresponding laterally extending electrical plug contact as the cable interface 130 . However, it should be noted that the present disclosure is not limited thereto.

[0034] Figure 2A cross-sectional view of a further semiconductor package 200 is schematically shown, in which at least one outwardly directed contact of the lead frame 150 extends in a different manner. Otherwise, the semiconductor package 200 is implemented like the semiconductor package 100. As in the semiconductor package 200, the contact 251 of the lead frame 150 also initially projects laterally from the housing 110. Unlike the contact 151, Figure 2 The contact 251 in the example is bent toward the second side 112 of the housing 110 or the semiconductor package 200 to form an electrical plug contact as the cable interface 130. The second side 112 is opposite to the first side of the housing 110 or the semiconductor package 200. Figure 1 As described, at least one micromechanical ultrasonic transducer 120 is configured to emit ultrasonic waves in the direction of the first side surface 111 and / or receive ultrasonic waves passing through the first side surface 111. In other words, the contacts 251 of the lead frame 150 are removed from the active side of the semiconductor package 200 so as to form electrical plug contacts as the cable interface 130 on the rear side of the semiconductor package 200.

[0035] exist Figure 2 , exactly one contact 251 of the lead frame 150 is led out of the housing 110. However, it should be noted that the semiconductor package 200 is not limited thereto. Generally, any number M≥1 of contacts of the lead frame 150 can be led out of the housing 110. In other words, optionally, a plurality of contacts of the lead frame 150 can also be led out of the housing 110 to form corresponding electrical plug contacts of one or more plug connectors for one or more cables.

[0036] Semiconductor package 200 and cable 160 form an ultrasound system 299 .

[0037] Figure 3 A cross-sectional view of a third semiconductor package 300 is schematically shown, in which a plurality of contacts of a lead frame are directed outward. In other respects, the semiconductor package 300 is implemented as the semiconductor package 100 .

[0038] exist Figure 3 In the embodiment, at least two contacts 351 and 352 of the lead frame 150 are guided out of the housing 110 laterally on opposite sides and form electrical contact surfaces on the laterally opposite sides of the housing 110 as the cable interface 130. The at least two contacts 351 and 352 of the lead frame 150 are bent here so that they form raised electrical contact surfaces on the laterally opposite sides of the housing 110 as the cable interface 130.

[0039] It should be noted, however, that the present disclosure is not limited to the at least two contacts 351 and 352 of the lead frame 150. Figure 3The form shown in the figure is used to form electrical contact surfaces on the laterally opposite sides of the housing 110 as the cable interface 130. For example, the at least two contacts 351 and 351 of the lead frame 150 can be bent or shaped only in the direction of the first side 111 (i.e., in the direction of the active side of the semiconductor package 300) or only in the direction of the second side 112 (i.e., in the direction of the rear side of the semiconductor package 300). Alternatively, one or more of the at least two contacts 351 and 352 of the lead frame 150 can also be bent in the direction of the first side 111, and one or more other of the at least two contacts 351 and 352 of the lead frame 150 can also be bent in the direction of the second side 112.

[0040] With cable 160 Figure 1 and Figure 2 Compared to the connector 161 shown, the cable 360 Figure 3 The illustrated plug connector 361 is adapted in terms of its dimensions such that it overlaps electrical contact surfaces formed on laterally opposite sides of the housing 110 and can thus make electrical contact with at least two contacts 351 and 352 of the lead frame 150 .

[0041] Semiconductor package 300 and cable 360 ​​form an ultrasound system 399 .

[0042] In various applications, acoustic decoupling of a semiconductor package and a cable may be desirable. To achieve acoustic decoupling of the semiconductor package and the cable, the cable connector may include an acoustic decoupling medium for acoustically decoupling the semiconductor package and the cable interface of the connector when the cable interface and the connector are in a connected state. This is described below with reference to Figure 4 and Figure 5 It is to be understood that according to the combination Figure 4 and Figure 5 Interposers constructed in accordance with the principles described may also be used with other semiconductor packages described herein.

[0043] Figure 4 An additional ultrasound system 499 is shown. The ultrasound system 499 includes the above combined Figure 2 The semiconductor package 200 and the cable 460 connectable to the cable interface 130 of the semiconductor package 200 are described.

[0044] and Figure 2 Compared to the connector 161 of the cable 160 shown, the connector 461 of the cable 460, in addition to the electrical contact surface 462 for electrically contacting the cable interface 130 integrated in the housing 110, also includes an acoustic decoupling medium 463 for acoustically decoupling the cable interface 130 from the connector 461 when the cable interface 130 and the connector 461 are in a connected state.

[0045] The acoustic decoupling medium 463 is a substance or material that reduces or prevents the transmission of ultrasonic waves between the cable interface 30 and the rest of the connector 461 when the cable interface 130 and the connector 461 are connected. The acoustic decoupling medium 463 is used as a medium that can only propagate ultrasonic waves poorly, so as to ensure that there is a high or maximum energy loss when the ultrasonic wave is transferred from the cable interface 130 to the connector 461 (or vice versa). Compared with other materials of the connector 461 and the cable interface 130, the acoustic decoupling medium 463 can be a (very) soft material to reduce the acoustic stress between the cable interface 130 and the other connectors 461. For example, the acoustic decoupling medium 463 can be formed by vulcanized rubber, other rubber materials, silicone or acrylate or include them. However, the present disclosure is not limited to the above-mentioned substances. Generally, any suitable substance can be used for the acoustic decoupling medium 463. The composition of the acoustic decoupling medium 463 can be related to a specific application, and therefore to the frequency range of the ultrasonic wave sent and / or to be detected by at least one micromechanical ultrasonic transducer 120.

[0046] Due to the acoustic decoupling medium 463, the semiconductor package 200 can be acoustically decoupled from the cable 460. Therefore, the transmission of ultrasonic waves from the semiconductor package 200 via the cable 460 to an external entity connected to the other end of the cable 460 and vice versa can be prevented or at least (strongly) reduced.

[0047] exist Figure 4 , the electrical contact surface 462 and the acoustic decoupling medium 463 of the connector 461 are shown as separate elements. However, the present disclosure is not limited to this. In an alternative example, the electrical contact surface 462 and the acoustic decoupling medium 463 of the connector 461 can be implemented in one piece. For example, in a connector according to the present disclosure, the acoustic decoupling medium can be conductive or mixed with a conductive material, so that the acoustic decoupling medium can simultaneously serve as an electrical contact surface for electrically contacting the cable interface 130 integrated into the housing 110. For example, a rubber material doped with carbon can be used for an integrated embodiment.

[0048] Figure 5 An additional ultrasound system 599 is shown. The ultrasound system 599 includes the above combined Figure 3 The semiconductor package 300 and the cable 560 connectable to the cable interface 130 of the semiconductor package 300 are described.

[0049] and Figure 3 Compared to the connector 361 of the cable 360 ​​shown, the connector 561 of the cable 560 includes, in addition to an electrical contact surface 562 for electrically contacting the cable interface 130 integrated in the housing 110, an acoustic decoupling medium 563 for acoustically decoupling the cable interface 130 from the connector 561 when the cable interface 130 and the connector 561 are in a connected state.

[0050] Similar to the above-described embodiment regarding ultrasound system 499 , semiconductor package 300 may be acoustically decoupled from cable 560 via acoustic decoupling medium 563 .

[0051] In combination with the above Figures 1 to 5 In the described example, the lead frame 150 is respectively arranged in the housing 110 and electrically coupled to at least one micromechanical ultrasonic transducer 120. In addition, at least one contact of the lead frame 150 is respectively led out of the housing 110 to form the cable interface 130. This enables inexpensive manufacturing, because only one or more contacts of the lead frame 150 must be shaped or bent accordingly to form the cable interface 130. In addition, for manufacturing, no reflow process is required, so that the corresponding semiconductor package does not have to be exposed to the high temperature of the reflow process. This allows high flexibility in selecting materials for the various components of the corresponding semiconductor package and can increase the reliability of the various components of the corresponding semiconductor package.

[0052] However, the present disclosure is not limited thereto. Figures 6 to 9 Further examples of alternative embodiments with a housing or a cable interface integrated into a housing are described.In the following description, in order to avoid unnecessary repetitions, substantially only the differences from the above-described examples are discussed.

[0053] Figure 6 Another semiconductor package 600 is shown. Unlike the semiconductor packages 100 to 500, the housing 610 of the semiconductor package 600 is not completely formed by a potting compound (potting material). A portion of the housing 610 is formed by a flexible circuit board 615. The flexible circuit board 615 is made of a flexible substrate, such as polyimide or polyester, so that the circuit board can be bent and rotated, for example, by Figure 6 The curled shape of the flexible circuit board 615 is shown in FIG. On the flexible circuit board 615 , one or more conductive structures 616 and 617 are formed of a conductive material, for example one or more conductor tracks. Flexible circuit boards are also known under the name “flexible PCB”.

[0054] At least one micromechanical ultrasonic transducer 120 or semiconductor material 125 is arranged on the first region 613 of the flexible circuit board 615 and electrically coupled to the flexible circuit board, and at least one micromechanical ultrasonic transducer 120 is formed in the semiconductor material. To this end, at least one micromechanical ultrasonic transducer 120 is electrically contacted by means of one or more bonding wires, for example, Figure 6 1 and 12. Bond wires 655 and 656 between semiconductor material 125 and conductive structures 616 and 617 are shown in FIG.

[0055] The first area 613 of the flexible circuit board 615 is surrounded by the remaining part 619 of the housing 610. The remaining housing 619 of the semiconductor package 600 is formed by a casting material (casting material) as in the above-mentioned example. The remaining housing 619 formed by the casting material is formed on the flexible circuit board 615. Similar to the above-mentioned example, the acoustic coupling medium 140 for acoustically coupling at least one micromechanical ultrasonic transducer 120 with the housing 610 is arranged (introduced) in the housing 610.

[0056] A second region 614 of the flexible circuit board 615, which is different from the first region 613, forms an electrical plug contact as a cable interface 130, and one or more conductive structures 616 and 617 are formed in the second region. In other words, the portion of the flexible circuit board 615 on which at least one micromechanical ultrasonic transducer 120 of the semiconductor package 600 and the remaining housing 619 are not formed forms the cable interface 130. Therefore, the semiconductor package 600 can be detachably connected to the plug connector of the cable similar to the above embodiment so as to electrically contact the semiconductor package 600 from the outside. In the second region 614 of the flexible circuit board 615, the one or more conductive structures 616 and 617 can, for example, extend substantially linearly and parallel to each other, so that a common plug connector can be used for contact.

[0057] Since the semiconductor package 600 can also follow a curved surface due to the flexible circuit board 615 , mounting of the semiconductor package 600 into an application may be simplified.

[0058] exist Figure 7 In the semiconductor package 700 shown, at least one micromechanical ultrasonic transducer 120 or semiconductor material 125 (in which at least one micromechanical ultrasonic transducer 120 is formed) is also arranged on and electrically coupled to the first region 713 of the circuit board 715. However, unlike in the semiconductor package 600, the circuit board 715 is a rigid circuit board rather than a flexible circuit board.

[0059] Similar to Figure 6 For example, at least one micromachined ultrasonic transducer 120 is electrically contacted via one or more bonding wires, such as in Figure 7 1 and 2. Bond wires 755 and 756 are shown between semiconductor material 125 and conductive structures 716 and 717 of a circuit board 715 made of a conductive material.

[0060] The first area 713 of the circuit board 715 is again surrounded by the rest 719 of the housing 710. The rest of the housing 719 of the semiconductor package 700 is formed by a casting compound (casting material) as in the above example. Similar to the above example, an acoustic coupling medium 740 for acoustically coupling at least one micromechanical ultrasonic transducer 120 with the housing 710 is arranged (introduced) in the housing 710.

[0061] The electrical plug contacts 780 on the circuit board 715 are arranged as the cable interface 130 in a second area 714 of the circuit board 715 that is different from the first area 713. The electrical plug contacts 780 are electrically coupled to at least one micromachined ultrasonic transducer 120 or semiconductor material 125 (and possibly to other electrical elements or components of the semiconductor package 700) via one or more conductive structures 716 and 717 of the circuit board 715. For example, the plug contacts 780 can be electrically coupled to one or more conductive structures 716 and 717 of the circuit board 715 via corresponding metallization (e.g., solder material).

[0062] exist Figure 7 In the example of FIG. 7 , the electrical plug contact 780 is bent so as to form a laterally extending electrical plug contact as the cable interface 130. However, it should be noted that the present disclosure is not limited thereto. For example, the electrical plug contact 780 may also extend only in the direction from the first side 111 to the second side 112 of the housing 710 or the semiconductor package 700. In other words, the electrical plug contact 780 may form the cable interface 130 on the rear side of the semiconductor package 700.

[0063] Figure 7 Exactly one plug contact 780 is shown. However, it should be noted that the semiconductor package 700 is not limited thereto. Generally, any number of plug contacts K ≥ 1 may be arranged in the second region 714 of the circuit board 715. In other words, a plurality of plug contacts may also be optionally arranged in the second region 714 of the circuit board 715 to form the cable interface 130. As shown in Figure 7 As indicated by arrow 170 in FIG. 1 , plug connector 161 of cable 160 may be detachably connected to cable interface 130 , ie, at least one plug contact 780 , integrated in housing 110 of semiconductor package 100 , in order to electrically contact semiconductor package 700 by means of cable 160 .

[0064] Semiconductor package 700 and cable 160 form an ultrasound system 799 .

[0065] Figure 8 Another semiconductor package 800 is shown, in which a portion of the housing 810 is formed by a rigid substrate or a rigid carrier 815. The rigid substrate 815 can be formed of plastic, for example. However, it should be noted that the present disclosure is not limited thereto. In principle, any suitable material can be used for the rigid substrate 815.

[0066] At least one micromechanical ultrasonic transducer 120 or semiconductor material 125 is arranged on the first region 813 of the rigid substrate 815 and electrically coupled thereto, forming at least one micromechanical ultrasonic transducer 120 in the semiconductor material. Similar to the above example, at least one micromechanical ultrasonic transducer 120 is electrically contacted by means of one or more bonding wires, such as in Figure 8 815 and 816 are shown by bonding wires 855 and 856 between the semiconductor material 125 and conductive structures 816 and 817 formed of conductive material in or on the rigid substrate 815.

[0067] Combined with Figure 6 and Figure 7 Similarly in the described example, the first region 813 of the rigid substrate 815 is surrounded by the rest 819 of the housing 810. The rest of the housing 819 of the semiconductor package 800 is formed by a casting material (casting material) as in the above example. Similar to the above example, an acoustic coupling medium 140 for acoustically coupling at least one micromechanical ultrasonic transducer 120 with the housing 810 is arranged (introduced) in the housing 810.

[0068] A second region 814 of the substrate 815 that is different from the first region 813 forms a plug-in contact as a cable interface 130, and one or more conductive structures 816 and 817 are formed in the second region. In other words, the portion of the substrate 815 on which at least one micromechanical ultrasonic transducer 120 of the semiconductor package 800 and the remaining housing 819 are not formed forms the cable interface 130. Therefore, the semiconductor package 800 can be detachably connected to the plug connector of the cable similar to the above embodiment so as to electrically contact the semiconductor package 800 from the outside. In the second region 814 of the substrate 815, the one or more conductive structures 816 and 817 can, for example, extend substantially linearly and parallel to each other, so that the cable interface 130 is formed similar to the electrical contacts of the SD memory card, and therefore a common plug connector can be used for contact.

[0069] At least one micromechanical ultrasonic transducer 120 or a semiconductor material 125 in which at least one micromechanical ultrasonic transducer 120 is formed is arranged on the first side 811 of the substrate 815. One or more conductive structures 816 and 817 or sub-regions thereof forming the cable interface 130 can only be formed on the first side 811 of the substrate 815, for example. Figure 8 Shown in.

[0070] Alternatively, one or more conductive structures 816 and 817 or their sub-regions forming the cable interface 130 may also be formed only on the second side 812 of the substrate, which is opposite to the first side 811 of the substrate 815. Furthermore, alternatively, one or more conductive structures 816 and 817 or their sub-regions forming the cable interface 130 may be arranged on the first side 811 and the second side 812 of the substrate 815.

[0071] Fig. 9 An exemplary top view of the second side 812 of the substrate 815 is shown. The five mutually parallel conductive structures 921, ..., 925 are understood to be purely exemplary. In principle, any number of conductive structures can be arranged on the first side 811 and the second side 812 of the substrate 815 to form the cable interface 130. The corresponding conductive structures on each side of the substrate 815 can extend linearly and parallel to each other, so that the cable interface 130 is formed similar to the electrical contacts of an SD memory card.

[0072] Semiconductor package 800 and cable 160 form an ultrasound system 899 .

[0073] All the above-mentioned semiconductor packages 100 to 800 have in common that they include a housing and at least one micromechanical ultrasonic transducer arranged in the housing. In addition, each of the semiconductor packages 100 to 800 includes a cable interface integrated into the housing, which is configured to be detachably connected to the plug connector of the cable so as to electrically contact the semiconductor package from the outside. As obtained in the above embodiment, the cable interface integrated into the housing can be implemented in various ways here. Regardless of the specific embodiment of the integrated cable interface, the cable interface can realize flexible and simple installation of the cable so as to electrically contact at least one micromechanical ultrasonic transducer. Therefore, the semiconductor package or at least one micromechanical ultrasonic transducer can also be integrated into a very small system. Semiconductor packages 100 to 800 can also realize simplified installation in applications, and therefore reduce the system cost of the application. In particular, for installation, none of the semiconductor packages 100 to 800 needs a circuit board additionally provided for this purpose. On the contrary, the semiconductor package according to the present disclosure can be connected to any other element by a corresponding cable. Thus, for example, it may be sufficient to provide a circuit board for an application, to which the semiconductor package according to the present disclosure and other components of the application can be electrically coupled via corresponding cables.

[0074] Examples of the present disclosure provide a micromachined ultrasound transducer member with an integrated cable interface.

[0075] The examples described here can be summarized as follows:

[0076] Example 1 is a semiconductor package. The semiconductor package includes a housing and at least one micromechanical ultrasonic transducer arranged in the housing. In addition, the semiconductor package includes a cable interface integrated into the housing, which is configured to be detachably connected to a connector of a cable so as to electrically contact the semiconductor package from the outside.

[0077] Example 2 is a semiconductor package according to Embodiment 1, wherein a lead frame is arranged in a housing and electrically coupled to at least one micromachined ultrasonic transducer, and wherein at least one contact of the lead frame is led out of the housing to form a cable interface.

[0078] Example 3 is a semiconductor package according to Example 2, wherein at least one contact of the lead frame protrudes laterally from the housing to form a corresponding laterally extending electrical plug contact as a cable interface.

[0079] Example 4 is a semiconductor package according to Example 2, wherein at least one contact of the lead frame protrudes laterally from the housing and is bent toward a second side of the semiconductor package to form a corresponding electrical plug contact as a cable interface, wherein the second side is opposite to a first side of the semiconductor package, and wherein at least one micromechanical ultrasonic transducer is constructed to emit ultrasonic waves in the direction of the first side and / or receive ultrasonic waves passing through the first side.

[0080] Example 5 is a semiconductor package according to Example 2, wherein at least two contacts of the lead frame are led out laterally from the housing on opposite sides, and electrical contact surfaces are formed on laterally opposite sides of the housing as a cable interface.

[0081] Example 6 is a semiconductor package according to Example 5, wherein at least two contacts of the lead frame are bent such that they form convex electrical contact surfaces on laterally opposite sides of the housing as a cable interface.

[0082] Example 7 is a semiconductor package according to Example 1, wherein a portion of the shell is formed by a flexible circuit board, wherein at least one micromechanical ultrasonic transducer is arranged on a first area of ​​the flexible circuit board and electrically coupled to the flexible circuit board, and wherein a second area of ​​the flexible circuit board different from the first area forms an electrical plug contact as a cable interface, and one or more conductive structures are formed in the second area.

[0083] Example 8 is a semiconductor package according to Example 1, wherein a portion of the housing is formed by a circuit board, wherein at least one micromechanical ultrasonic transducer is arranged on a first area of ​​the circuit board and electrically coupled to the circuit board, and wherein at least one electrical plug contact on the circuit board is arranged as a cable interface in a second area of ​​the circuit board that is different from the first area.

[0084] Example 9 is a semiconductor package according to Example 8, wherein at least one electrical plug contact is bent to form a corresponding laterally extending electrical plug contact as a cable interface.

[0085] Example 10 is a semiconductor package according to Example 1, wherein a portion of the shell is formed by a rigid substrate, wherein at least one micromechanical ultrasonic transducer is arranged on a first area of ​​the substrate and electrically coupled to the substrate, and wherein a second area of ​​the substrate different from the first area forms an electrical plug contact as a cable interface, and one or more conductive structures are formed in the second area.

[0086] Example 11 is a semiconductor package according to Example 10, wherein at least one micromechanical ultrasonic transducer is arranged on a first side of a substrate, wherein the first side is opposite to a second side of the substrate, and wherein one or more conductive structures are formed on the first side and / or the second side of the substrate.

[0087] Example 12 is the semiconductor package according to one of Examples 7 to 11, wherein the first region is surrounded by a remaining housing of the semiconductor package.

[0088] Example 13 is a semiconductor package according to one of Examples 1 to 12, wherein an acoustic coupling medium for acoustically coupling the at least one micromechanical ultrasonic transducer to the housing is arranged in the housing.

[0089] Example 14 is a semiconductor package according to one of Examples 1 to 13, wherein a plurality of micromachined ultrasonic transducers are arranged in the housing.

[0090] Example 15 is a semiconductor package according to one of Examples 1 to 14, wherein at least one micromachined ultrasound transducer is electrically contacted by means of one or more bond wires.

[0091] Example 16 is a semiconductor package according to one of claims 1 to 15, wherein at least one micromachined ultrasonic transducer is a capacitive micromachined ultrasonic transducer or a piezoelectric micromachined ultrasonic transducer.

[0092] Example 17 is a semiconductor package according to one of claims 1 to 16, wherein the housing is at least partially formed by a casting compound.

[0093] Example 18 is an ultrasound system. The ultrasound system includes a semiconductor package according to one of Examples 1 to 17 and a cable having a connector. The connector is detachably connected to a cable interface integrated into a housing of the semiconductor package so as to electrically contact the semiconductor package through the cable.

[0094] Example 19 is an ultrasound system according to Example 18, wherein the connector includes an acoustic decoupling medium for acoustically decoupling the cable interface and the connector when the cable interface and the connector are in a connected state.

[0095] Example 20 is an ultrasound system according to Example 19, wherein the acoustic decoupling medium is conductive or mixed with a conductive material.

[0096] The aspects and features described in conjunction with a specific example in the foregoing examples may also be combined with one or more other examples in order to replace the same or similar features of the other examples, or to additionally introduce features into the other examples.

[0097] The following claims are hereby incorporated into the detailed description, wherein each claim may be presented as a separate example. It should also be noted that, although in the claims, one dependent claim refers to a specific combination with one or more other claims, other examples may also include a combination of the dependent claim with the subject matter of any other dependent claim or independent claim. Unless it is stated in individual cases that a specific combination is not intended, such a combination is hereby expressly proposed. Furthermore, features of a claim shall also be included in each other independent claim, even when this claim is not directly defined as dependent on the other independent claims.

Claims

1. A semiconductor package (100), comprising: A housing (110); at least one micromechanical ultrasonic transducer (120) disposed in the housing (110); and A cable interface (130) is integrated into the housing (110), and is configured to be detachably connected to a plug connector (161) of a cable (160) so as to electrically contact the semiconductor package (100) from the outside.

2. The semiconductor package (100) according to claim 1, wherein: A lead frame (150) is arranged in the housing (110) and is electrically coupled to the at least one micromechanical ultrasonic transducer (120), wherein at least one contact of the lead frame (150) is guided out of the housing (110) to form the cable contact (130).

3. The semiconductor package (100) according to claim 2, wherein: At least one contact (151) of the lead frame (150) protrudes laterally from the housing (110) to form a corresponding laterally extending electrical plug contact as a cable interface (130).

4. The semiconductor package (200) according to claim 2, wherein: At least one contact (251) of the lead frame (150) protrudes laterally from the housing (110) and is bent in the direction of a second side surface (112) of the semiconductor package (200) to form a corresponding electrical plug contact as a cable interface (130), wherein the second side surface (112) is opposite to a first side surface (111) of the semiconductor package (200), and wherein the at least one micromechanical ultrasonic transducer (120) is configured to transmit ultrasonic waves in the direction of the first side surface (111) and / or receive ultrasonic waves passing through the first side surface (111).

5. The semiconductor package (300) according to claim 2, wherein: At least two contacts (351, 352) of the lead frame (150) protrude laterally from the housing (110) on opposite sides and form electrical contact surfaces as a cable interface (130) on laterally opposite sides of the housing (110).

6. The semiconductor package (300) according to claim 5, wherein: At least two contacts (351, 352) of the lead frame (150) are bent so that the contacts form raised electrical contact surfaces on laterally opposite sides of the housing (110) as a cable interface (130).

7. The semiconductor package (600) according to claim 1, wherein: A portion of the housing (610) is formed by a flexible printed circuit (615), wherein the at least one micromechanical ultrasonic transducer (120) is arranged on a first area (613) of the flexible printed circuit (615) and is electrically coupled to the flexible printed circuit, and wherein a second area (614) of the flexible printed circuit (615) different from the first area (613) forms an electrical plug contact as a cable interface (130), and one or more conductive structures are formed in the second area.

8. The semiconductor package (700) according to claim 1, wherein: A portion of the housing (710) is formed by a circuit board (715), wherein at least one micromechanical ultrasonic transducer (120) is arranged on a first area (713) of the circuit board (715) and is electrically coupled to the circuit board, and wherein at least one electrical plug contact (780) on the circuit board is arranged as a cable interface (130) in a second area (714) of the circuit board (715) that is different from the first area (713).

9. The semiconductor package (700) according to claim 8, wherein: At least one electrical plug contact (780) is bent in order to form a corresponding transversely extending electrical plug contact as a cable interface (130).

10. The semiconductor package (800) according to claim 1, wherein: A portion of the housing (810) is formed by a rigid substrate (815), wherein at least one micromechanical ultrasonic transducer (120) is arranged on a first region (813) of the substrate (815) and is electrically coupled to the substrate, and wherein a second region (814) of the substrate (815) different from the first region (813) forms an electrical plug contact as a cable interface (130), and one or more conductive structures are formed in the second region.

11. The semiconductor package (800) according to claim 10, wherein: At least one micromechanical ultrasonic transducer (120) is arranged on a first side (811) of the substrate (815), wherein the first side (811) is opposite to a second side (812) of the substrate (815), and wherein one or more conductive structures are formed on the first side (811) and / or the second side (812) of the substrate (815).

12. The semiconductor package (600) according to any one of claims 7 to 11, wherein: The first region (613) is surrounded by the remaining housing (619) of the semiconductor package (600).

13. The semiconductor package (100) according to any one of claims 1 to 12, wherein: An acoustic coupling medium (140) is arranged in the housing (110) for acoustically coupling at least one micromechanical ultrasonic transducer (120) to the housing (110).

14. The semiconductor package (100) according to any one of claims 1 to 13, wherein: A plurality of micromechanical ultrasonic transducers (120) are arranged in the housing (110).

15. The semiconductor package (100) according to any one of claims 1 to 14, wherein: The at least one micromechanical ultrasonic transducer (120) is electrically contacted by means of one or more bonding wires (155, 156).

16. The semiconductor package (100) according to any one of claims 1 to 15, wherein: The at least one micromechanical ultrasonic transducer (120) is a capacitive micromechanical ultrasonic transducer (120) or a piezoelectric micromechanical ultrasonic transducer.

17. The semiconductor package (100) according to any one of claims 1 to 16, wherein: The housing (110) is at least partially formed from a casting compound.

18. An ultrasound system (199), comprising: The semiconductor package (100) according to any one of claims 1 to 17; and A cable (160) having a plug connector (161), wherein the plug connector (161) is detachably connected to a cable interface (130) integrated into a housing (110) of the semiconductor package (100), so as to electrically contact the semiconductor package (100) by means of the cable (160).

19. The ultrasound system (199) of claim 18, wherein: The connector (461) includes an acoustic decoupling medium (463) for acoustically decoupling the cable interface (130) and the connector (461) when the cable interface (130) and the connector (461) are in a connected state.

20. The ultrasound system (199) of claim 19, wherein: The acoustic decoupling medium (463) is conductive or mixed with conductive material.

Images