Ceramic base and method for manufacturing the same

Abstract

The present invention relates to a ceramic base. The manufacturing method of the ceramic base of the present invention comprises: a manufacturing step of manufacturing a plurality of ceramic sheets including via holes and conductors for filling the via holes, a stacking step of stacking the plurality of ceramic sheets, and a sintering step of sintering a stacked body formed by the stacking; in the stacking step, the via holes of at least one of the plurality of ceramic sheets can be arranged not to overlap with the via holes of other adjacent ceramic sheets.

Description

Technical Field

[0001] The present invention relates to a ceramic base, and in particular to a multi-layer wiring structure of a ceramic insulating board used for supporting a substrate. Background Art

[0002] Typically, a semiconductor device or display device is a device that stacks multiple thin film layers including a dielectric layer and a metal layer on a glass substrate, a flexible substrate or a semiconductor wafer substrate, and then manufactures it in a patterned manner. These thin film layers are sequentially deposited on the substrate by a chemical vapor deposition (CVD) process or a physical vapor deposition (PVD) process. The CVD process includes a low pressure chemical vapor deposition (LPCVD) process, a plasma enhanced chemical vapor deposition (PECVD) process, and an organic metal chemical vapor deposition (MOCVD) process.

[0003] Such a CVD device and PVD device is provided with a ceramic base for supporting a glass substrate, a flexible substrate, a semiconductor wafer substrate, etc. and for processing a semiconductor process. The ceramic base can be provided in the CVD device and the PVD device, and provided with a suction cup electrode for supporting the substrate and a heating wire for heating the substrate in a heat treatment process, etc. In addition, the ceramic base can be provided with a high-frequency (RF) electrode instead of a heating wire, or can also be provided with a high-frequency (RF) electrode to form plasma (in an etching process of a thin film layer formed on a substrate, etc.).

[0004] Figure 1a , Figure 1b and Figure 1c This is a diagram for explaining the problems of the conventional ceramic susceptor. Figure 1a and Figure 1b is a cross-sectional view of a multilayer wiring structure of a ceramic insulating board, Figure 1c This is a diagram showing the area around via holes in a ceramic insulating board during the multilayer wiring stacking process, as viewed from above.

[0005] First, refer to Figure 1a and Figure 1b In the conventional multilayer wiring structure of the insulating plate of the substrate supporting the ceramic base, for example, the upper wiring and the lower wiring are connected to each other through the conductor through the via hole of the stacked ceramic sheets. However, as the via holes are designed to be arranged side by side in a vertical line, various problems are exposed. For example, Figure 1aAs shown in FIG. 1 , there is a problem that the wire may be broken if the vertical alignment of the via hole is slightly deviated. Figure 1b As shown, after ceramic sheets with printed wiring are stacked, when pressure is applied to the stacked body before sintering, the shape of the via hole cannot be maintained and deformation occurs, which increases the possibility of disconnection.

[0006] In addition, refer to Figure 1c For example, an electrode rod (not shown) for power supply is combined at the lower part of the ceramic insulating plate. In particular, when the stacked body is pressurized, the shapes of the via holes 51 and 52 provided in the groove area combined with the electrode rod cannot be maintained and are severely deformed, thereby causing surface bending around the via holes on the inner side of the stacked structure along the ceramic sheet, thereby further increasing the possibility of wire breakage. Summary of the invention

[0007] Problem that the invention aims to solve

[0008] Therefore, the present invention is proposed to solve the above-mentioned problems. The purpose of the present invention is to provide a ceramic base and a method for manufacturing the same. The ceramic base is manufactured in the following manner: when pressurized in a laminated state before sintering, the conductive holes of the ceramic insulating board with a multi-layer wiring structure minimize shape deformation (such as collapse), thereby minimizing the deformed cross-sectional area of ​​the ceramic base.

[0009] In addition, another object of the present invention is to provide a ceramic base and a method for manufacturing the same, wherein the ceramic base is manufactured in the following manner: a via hole is not provided in a groove area in which an electrode rod for supplying power to a lower portion of a ceramic insulating plate is combined, but a via hole is provided on the outside of the groove area, thereby preventing surface bending or the like from occurring around the via hole on the inner side of the stacked structure of the ceramic sheets and minimizing shape deformation.

[0010] Means used to solve problems

[0011] First, summarizing the features of the present invention, a method for manufacturing a ceramic base according to one aspect of the present invention for achieving the purpose includes: a manufacturing step of manufacturing a plurality of ceramic sheets including via holes and conductors for filling the via holes, a stacking step of stacking the plurality of ceramic sheets, and a sintering step of sintering a stacked body formed by the stacking; in the stacking step, the via holes of at least one of the plurality of ceramic sheets can be arranged to not overlap with the via holes of other adjacent ceramic sheets.

[0012] The ceramic sheet may include a wiring layer that is electrically connected to the conductor of the via hole on the surface or inside.

[0013] The wiring layer may include an electrostatic chuck electrode, a high frequency electrode, or a heating element.

[0014] The wiring layer may be formed in a plurality of partial regions or the entire region of each ceramic sheet.

[0015] In the step of making the multiple ceramic sheets, multiple first ceramic sheets having multiple first conductive holes at a first distance from the center in the radial direction can be made, and the stacking step may include the following steps: continuously stacking two or more of the multiple first ceramic sheets, and the conductive holes of the ceramic sheets are arranged at non-overlapping positions along the stacking direction.

[0016] In the step of making the multiple ceramic sheets, multiple first ceramic sheets having multiple first conductive holes at positions separated by a first distance from the center in the radial direction can be made, and multiple second ceramic sheets having multiple second conductive holes at positions separated by a second distance from the center in the radial direction can be made; the stacking step may include the following steps: continuously stacking one of the multiple first ceramic sheets and one of the multiple second ceramic sheets, and the conductive holes of the ceramic sheets are arranged at non-overlapping positions along the stacking direction.

[0017] In the step of manufacturing the plurality of ceramic sheets, a plurality of first ceramic sheets having a plurality of first via holes at a first distance from the center in the radial direction may be manufactured, and a plurality of second ceramic sheets having a plurality of second via holes at a second distance from the center in the radial direction may be manufactured; the stacking step may include the following steps: continuously stacking two or more of the plurality of first ceramic sheets, and the via holes of the ceramic sheets are arranged at non-overlapping positions along the stacking direction, and continuously stacking one of the plurality of first ceramic sheets and one of the plurality of second ceramic sheets, and the via holes of the ceramic sheets are arranged at non-overlapping positions along the stacking direction.

[0018] The stacking step may further include the step of continuously stacking two or more of the plurality of second ceramic sheets, with the via holes of the ceramic sheets being arranged at positions that do not overlap along the stacking direction.

[0019] In the stacking step, preferably, in a groove region in a lower region of the plurality of ceramic sheets where an electrode rod for supplying power to wiring layers of the plurality of ceramic sheets is provided, the via holes are not provided along the stacking direction.

[0020] Moreover, another aspect of the present invention, a ceramic base made by sintering a stack of multiple ceramic sheets, may include a stacked structure, wherein the stacked structure is made by sintering a stack of multiple ceramic sheets, the ceramic sheets being formed with via holes and conductors for filling the via holes, and the via holes of at least one of the multiple ceramic sheets may be arranged not to overlap with the via holes of other adjacent ceramic sheets.

[0021] The plurality of ceramic sheets may each have a wiring layer disposed on a surface or inside thereof that is electrically connected to the conductor of the via hole.

[0022] The wiring layer may include an electrostatic chuck electrode, a high frequency electrode, or a heating element.

[0023] Preferably, the wiring layer is formed in a plurality of partial regions or the entire region of each ceramic sheet.

[0024] The multiple ceramic sheets may include multiple first ceramic sheets having multiple first conductive holes at a first distance from the center in the radial direction, and the ceramic base may include multiple ceramic sheets, wherein more than two of the multiple first ceramic sheets are stacked continuously and the conductive holes of the ceramic sheets are arranged at non-overlapping positions along the stacking direction.

[0025] The multiple ceramic sheets may include: multiple first ceramic sheets, each having a multiple first via holes at a first distance from the center in the radial direction, and multiple second ceramic sheets, each having a multiple second via holes at a second distance from the center in the radial direction; the ceramic base may include multiple ceramic sheets, wherein one of the multiple first ceramic sheets and one of the multiple second ceramic sheets are continuously stacked and the via holes of the ceramic sheets are arranged at non-overlapping positions along the stacking direction.

[0026] The multiple ceramic sheets may include: multiple first ceramic sheets, each having a multiple first via holes at a first distance from the center in the radial direction, and multiple second ceramic sheets, each having a multiple second via holes at a second distance from the center in the radial direction; the ceramic base may include: a ceramic sheet group arranged in a manner of continuously stacking two or more of the multiple first ceramic sheets and having the via holes of the ceramic sheets arranged at non-overlapping positions along the stacking direction; and a ceramic sheet group arranged in a manner of continuously stacking one of the multiple first ceramic sheets and one of the multiple second ceramic sheets and having the via holes of the ceramic sheets arranged at non-overlapping positions along the stacking direction.

[0027] The ceramic base may further include a ceramic sheet group in which two or more of the plurality of second ceramic sheets are stacked continuously and the via holes of the ceramic sheets are disposed at positions that do not overlap along a stacking direction.

[0028] Preferably, in a groove region in a lower region of the plurality of ceramic sheets where an electrode rod for supplying power to a wiring layer of the plurality of ceramic sheets is provided, the via holes are not provided along the stacking direction.

[0029] Effects of the Invention

[0030] According to the ceramic base and the manufacturing method thereof of the present invention, a ceramic base can be provided, in which the conductive holes of the ceramic insulating plate with a multi-layer wiring structure minimize shape deformation (such as collapse) when pressurized in the laminated state before sintering, thereby the ceramic base is manufactured in a manner that minimizes the deformed cross-sectional area.

[0031] In addition, a via hole is not provided in a groove area for connecting an electrode rod for supplying power to the lower part of the ceramic insulating plate, but a via hole is provided on the outside of the groove area, thereby preventing surface bending around the via hole on the inner side of the stacked structure of the ceramic sheet and manufacturing in a manner that minimizes shape deformation. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] To help understanding of the present invention, the accompanying drawings, which are included as a part of the detailed description, provide embodiments of the present invention and are used to explain the technical concept of the present invention together with the detailed description.

[0033] Figure 1a , Figure 1b and Figure 1c This is a diagram for explaining the problems of the conventional ceramic susceptor.

[0034] Figure 2 This is a flowchart for explaining a method for manufacturing a ceramic susceptor according to an embodiment of the present invention.

[0035] Figure 3 It is used to illustrate Figure 2 Flowchart of ceramic sheet preparation, shape processing and via hole processing.

[0036] Figures 4a to 4d It is used to illustrate Figure 2 Flowchart of the conductor filling and wiring printing process of the via hole.

[0037] Figure 5 yes Figure 2 A schematic diagram of an exemplary stacked body after the lamination step of ceramic sheets in FIG.

[0038] Figure 6 Shown from above Figure 5 An exemplary laminate is provided with a location of a via hole therein.

[0039] Figure 7 Shown in Figure 6The position of the via hole that appears in the vertical section of line segment AA.

[0040] Figure 8 FIG. 4 is a cross-sectional view of an insulating plate of a ceramic base manufactured according to an embodiment of the present invention.

[0041] Figures 9a to 9d This is an embodiment of the present invention in which the wiring patterns of the ceramic sheets of the respective layers are formed in partial regions.

[0042] Figures 10a to 10d This is an embodiment of the present invention in which the wiring patterns of the ceramic sheets of each layer are formed in the entire area.

[0043] Description of Reference Numerals

[0044] 410, 420, 430, 440: Ceramic sheets

[0045] 411, 412, 421, 422, 431, 432, 441, 442: Wiring

[0046] 419, 429, 439, 449: vias DETAILED DESCRIPTION

[0047] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. At this time, in each of the accompanying drawings, the same components are represented by the same figure marks as much as possible. In addition, the detailed description of the known functions and / or structures is omitted. The content disclosed below focuses on the parts required for understanding the actions of various embodiments, and omits the description of the elements that make the main purpose of the description unclear. In addition, some of the components in the drawings may be enlarged or omitted, or shown schematically. The size of each component does not fully reflect the actual size, so the content recorded here is not limited to the relative size or spacing of the components shown in each of the accompanying drawings.

[0048] In the process of describing the embodiments of the present invention, when it is judged that the specific description of the known technology related to the present invention unnecessarily confuses the main idea of ​​the present invention, the detailed description thereof will be omitted. Moreover, the terms described below, as terms defined by considering the functions in the present invention, can be changed according to the intention or convention of the user, operator. Therefore, it should be defined based on the content of the full text of this specification. The terms used in the detailed description are only used to describe the embodiments of the present invention and should not be restrictive. Unless otherwise explicitly stated, the expression of a single number of forms includes the meaning of a plurality of numbers of forms. In the process of this description, expressions such as "including" or "provided with" are used to indicate certain characteristics, numbers, steps, actions, elements, parts or combinations of these, and should not be interpreted as excluding the existence or possibility of one or more other characteristics, numbers, steps, actions, elements, parts or combinations of these other than those described.

[0049] In addition, terms such as “first” and “second” may be used to describe a plurality of components, but the components are not limited to the terms, and the terms are only used to distinguish one component from other components.

[0050] First, in the present invention, the ceramic base is a semiconductor device used to process processing object substrates for various purposes (semiconductor wafers, glass substrates, flexible substrates, etc.). In order to support the processing object substrate, an electrostatic chuck electrode used as an electrostatic chuck may be provided. In order to heat the processing object substrate at a specified temperature, a heating wire (or heating element) may be provided. Or in order to perform a process treatment (plasma enhanced chemical vapor deposition, etc.) on the processing object substrate, a high-frequency electrode may be provided, or a high-frequency electrode may be used instead of the heating wire.

[0051] In addition, as described below, the ceramic sheet mentioned refers to a ceramic green sheet, and it is previously noted that the wiring (or wiring layer or wiring pattern) formed on the ceramic sheet should be understood as including the wiring of the electrostatic chuck electrode, high-frequency electrode, or heating wire (or heating element) as described above.

[0052] Figure 2 This is a flowchart for explaining a method for manufacturing a ceramic susceptor according to an embodiment of the present invention.

[0053] Reference Figure 2 A method for manufacturing a ceramic base according to an embodiment of the present invention may include: a step of manufacturing a plurality of ceramic sheets including via holes and conductors for filling the via holes (steps S210 to S240); a step of forming a stacked body formed by stacking the plurality of ceramic sheets (step S250); and a sintering step (step S260).

[0054] The steps of manufacturing multiple ceramic sheets including the via holes and the conductors for filling the via holes (steps S210 to S240) may include: a step of preparing ceramic sheets for manufacturing a ceramic base (step S210); a step of cutting and processing the prepared ceramic sheets into a manufacturing shape that conforms to the ceramic base (step S220); a via hole processing step (step S230); and a conductor filling and wiring printing step (step S240).

[0055] Below, refer to Figures 3 to 7 , a method for manufacturing a ceramic base according to an embodiment of the present invention is described in detail.

[0056] Figure 3 It is used to illustrate Figure 2 Flowchart of the ceramic sheet preparation (step S210), shape processing (step S220) and conductive hole processing (step S230) processes.

[0057] Reference Figure 3 In the ceramic sheet preparation process (step S210), a ceramic sheet 200 manufactured in a roll shape on a carrier film can be prepared, and in the shape processing (step S220) process, the prepared ceramic sheet 200 can be cut into a required size of a manufacturing shape (for example, a circle, etc.) that conforms to the ceramic base of the present invention by a prescribed shape processing device and processed into a manufacturing shape.

[0058] For the ceramic sheet 300 whose shape processing conforms to the manufacturing shape (e.g., circular, etc.) of the ceramic base of the present invention, the via hole 400 is then processed by a predetermined via hole processing device (step S230). As described later, when multiple ceramic sheets are stacked, the via hole 400 is electrically connected to the via hole of the lower ceramic sheet or the wiring of the ceramic sheet including the wiring and the via hole 400 through the filled conductor. After the via holes of the ceramic sheets of each layer are appropriately processed and filled with conductors, the via holes or wiring of the ceramic sheets of each layer are electrically connected, so that the wiring can play the role of an electrostatic chuck electrode, a high-frequency electrode, or a heating wire (or a heating element).

[0059] Figures 4a to 4d It is used to illustrate Figure 2 Flowchart of the process of filling the conductive body of the via hole and printing the wiring (step S240).

[0060] Reference Figures 4a to 4d For example, after processing the via holes 419, 429, 439, 449 of the plurality of ceramic sheets 410, 420, 430, 440 in step S230, the via holes 419, 429, 439, 449 are filled with a conductor, and in order to form the wiring 411, 412, 421, 422, 431, 432, 441, 442 required in each ceramic sheet for each layer, a plurality of conductor pattern forming methods can be used, and the plurality of conductor pattern forming methods use conductive ink or paste such as silver and copper (step S240). Each of the ceramic sheets can be prepared in a manner that a wiring layer electrically connected to the conductor of the via holes 419, 429, 439, 449 is provided on the surface or inside, or provided on the surface and inside at the same time.

[0061] When multiple ceramic sheets 410, 420, 430, 440 are stacked, the via holes 419, 429, 439, 449 are electrically connected to the via holes of the lower ceramic sheet or the wiring of the ceramic sheet including the wiring and the via holes 419, 429, 439, 449 through the filled conductor. The via holes 419, 429, 439, 449 and the wiring 411, 412, 421, 422, 431, 432, 441, 442 of each layer of ceramic sheets can be formed in an appropriate pattern so that the wiring of each layer of ceramic sheets can be electrically connected through the formation of the conductor. The pattern of the wiring of each layer of ceramic sheets can play the role of playing the role of electrostatic chuck electrode, high-frequency electrode, or heating wire (or heating element).

[0062] In addition, the via holes of each ceramic sheet may be connected to or not connected to the electrostatic chuck electrode, high-frequency electrode, or heating wire (or heating element). The portion where the via holes of each ceramic sheet are not connected to the electrostatic chuck electrode, high-frequency electrode, or heating wire (or heating element) and the via holes of the adjacent upper and lower ceramic sheets are electrically connected can be overlapped continuously in a straight line along the stacking direction of the ceramic sheets to form an electrical connection between the via holes. In particular, as shown in the present invention, the conductor pattern extending from the via holes of the lower ceramic sheet to the surrounding area is electrically connected to the via holes of the upper ceramic sheet so that they do not overlap in a straight line along the stacking direction. In the specification of the present invention, "overlap of via holes" means that when the via holes are projected along the normal direction on the surface of any stacked and adjacent ceramic sheet and another ceramic sheet, the images of the projected via holes do not overlap each other.

[0063] As the various conductor pattern forming methods, for example, preferably, ink jet, gravure, gravure-offset and screen printing can be used, and depending on the circumstances, photolithography, electroplating, shadow mask, evaporation deposition, shadow mask, sputtering deposition, computerized numerically controlled machine tool, laser beam machining and electric discharge machining can also be used.

[0064] As described above, after the conductor filling and wiring printing steps (step S240) are performed, a stacked body is formed by stacking a plurality of ceramic sheets 410, 420, 430, and 440 (step S250) (see Figure 5 ). At this time, the laminate may be pressurized.

[0065] Next, the laminate (see Figure 5 ) is sintered (step S260). For example, in order to manufacture the ceramic base of the present invention, in the sintering process (step S260), sintering can be performed at a temperature of about 1600° C. to 1950° C.

[0066] Figure 6 Shown from above Figure 5 An exemplary laminate is provided with a location of a via hole therein.

[0067] Figure 7 Shown along Figure 6 The location of the via hole in the vertical section of line AA.

[0068] Reference Figure 6 and Figure 7 In the present invention, in the step S250 of forming a stacked body of the plurality of ceramic sheets 410, 420, 430, 440, the via holes 419, 429, 439, 449 of the plurality of ceramic sheets 410, 420, 430, 440 may be stacked in a non-continuous form, i.e., in a non-overlapping form, on a straight line along the stacking direction, and the via holes or wiring of the plurality of ceramic sheets 410, 420, 430, 440 may be electrically connected through the via holes 419, 429, 439, 449. An insulating material such as a dielectric or ceramic may be added to the upper portion 550 of the plurality of ceramic sheets 410, 420, 430, 440.

[0069] The ceramic sheets of the plurality of ceramic sheets may be composed of two or more layers, and may form a multi-layer wiring structure, for example, Figure 7As shown, according to the purpose of the ceramic base to be manufactured, the plurality of ceramic sheets 410, 420, 430, 440 can be repeatedly stacked in a manner having a variety of thicknesses. However, in the present invention, a ceramic base can be provided, wherein the via holes 419, 429, 439, 449 of the ceramic insulating plate having such a multi-layer wiring structure are discontinuous in a straight line along the stacking direction, so that the whole or a part of the ceramic sheets are stacked in a non-overlapping manner, so that when the stacked body is pressurized before sintering, the shape deformation (such as collapse) is minimized, thereby the ceramic base is manufactured in a manner that minimizes the deformed cross-sectional area. That is, preferably, the via hole of at least one of the plurality of ceramic sheets is arranged so as not to overlap with the via hole of another adjacent ceramic sheet.

[0070] In the present invention, in order to form the insulating plate of such a ceramic base, various methods for forming the laminated body can be implemented. Figures 4a to 4d , Figure 5 and Figure 6 Various embodiments are described.

[0071] In the following examples, Figure 4a A plurality of first ceramic sheets 410 are shown, each having a plurality of first via holes 419 at a first distance r1 from a center O in a radial direction. Figure 4b The first ceramic sheets 420 are shown, and a plurality of first via holes 429 are provided at a first distance r1 from the center O in the radial direction, and the via holes 429 are arranged at an angle with respect to Figure 4a The first ceramic sheets 410 and 420 are sheets that also have a plurality of first via holes 419 and 429 at a first distance r1 from the center O in the radial direction, and only the relative setting angles of the via holes 419 and 429 are different.

[0072] in addition, Figure 4c A plurality of second ceramic sheets 430 are shown, and a plurality of second via holes 439 are provided at a second distance r2 from the center O in the radial direction. Figure 4d The second ceramic sheets 440 are shown, and a plurality of second via holes 449 are provided at a second distance r2 from the center O in the radial direction, and the via holes 449 are arranged at an angle with respect to Figure 4c The second ceramic sheets 430 and 440 are sheets that also have a plurality of second via holes 439 and 449 at a second distance r2 from the center O in the radial direction, and only the relative setting angles of the via holes 439 and 449 are different.

[0073] <Example 1>

[0074] First, in step S210 of preparing the ceramic sheet, as Figure 4a (or Figure 4b )and Figure 6 As shown, a plurality of first ceramic sheets 410 having a plurality of first via holes 419 at a first distance r1 from a center O in a radial direction may be manufactured.

[0075] In step S250 of forming a stacked body, two or more first ceramic sheets 410 having a plurality of first via holes 419 at the first distance r1 may be stacked continuously, and the via holes 419 of the ceramic sheets 410 may be arranged at discontinuous positions on a straight line along the stacking direction.

[0076] According to the purpose, the first distance r1 can be set in various ways, and in order to arrange the via holes 419 of the ceramic sheet at discontinuous positions along the stacking direction on a straight line, for example, Figure 4a As shown, when each ceramic sheet is formed with four via holes 419, as shown in FIG. Figure 6 As shown, the setting angle between the via holes 419 of each layer of the ceramic sheet can be 45 degrees.

[0077] exist Figure 6 The example in which the setting angle between the via holes 419 of each layer of the ceramic sheet is 45 degrees is illustrated, but it is not limited to this, and as long as the via holes 419 of the ceramic sheet are discontinuous and non-overlapping in a straight line along the stacking direction, the setting angle can be realized in various embodiments by considering the diameter of the via holes 419 and the number of via holes 419 of each ceramic sheet, such as 10 degrees, 20 degrees, 30 degrees, 40 degrees, 45 degrees, 50 degrees, 60 degrees, 70 degrees, 80 degrees and 90 degrees.

[0078] For example, in Figure 6 In the embodiment, ceramic sheets 430 and 440 having a plurality of second via holes 439 and 449 at a second distance r2 are excluded, and two first ceramic sheets 410 having a plurality of first via holes 419 at a first distance r1 are stacked so that the setting angle between the via holes 419 of each layer of the ceramic sheets is 45, and by repeating the process (repeatedly stacking the first ceramic sheets 410), the staggered stacking structure of the via holes 419 of the two ceramic sheets 410 is repeated.

[0079] <Example 2>

[0080] In the step S210 of preparing the ceramic sheet, Figure 4b and Figure 6 As shown, a plurality of first ceramic sheets 420 having a plurality of first via holes 429 at a first distance r1 from the center O in the radial direction may be manufactured. Figure 4cand Figure 6 As shown, a plurality of second ceramic sheets 430 having a plurality of second via holes 439 at a second distance r2 from the center O in the radial direction may be manufactured.

[0081] Thus, in the step S250 of forming the stacked body, one of the plurality of first ceramic sheets 420 and one of the plurality of second ceramic sheets 430 are stacked successively, as shown in FIG. Figure 7 As shown, the via holes 429 and 439 of the ceramic sheets 420 and 430 can be stacked in a manner that is set at discontinuous positions in a straight line along the stacking direction. That is, the via holes of the continuous ceramic sheets are located at different pitch circle diameters (PCD), so they are naturally set at discontinuous and non-overlapping positions in a straight line along the stacking direction. In this case, one of the multiple first ceramic sheets 420 and one of the multiple second ceramic sheets 430 are stacked continuously, and by repeating the process (repeatedly stacking the first ceramic sheet 420 and the second ceramic sheet 430), the stacking structure repetition in which the via holes 429 and 439 of the first ceramic sheet 420 and the second ceramic sheet 430 do not overlap is achieved.

[0082] The first distance r1 and the second distance r2 can be set in various ways according to the purpose, and because the via holes 429 and 439 of the ceramic sheets 420 and 430 have different radial distances, they can be set at positions that are not continuous and do not overlap in a straight line along the stacking direction. However, even in this case, for example, Figure 6 and Figure 7 As shown, when four via holes 429 and 439 are formed on each ceramic sheet, the setting angle between the via holes 419 of each layer of the ceramic sheet can be 45 degrees.

[0083] exist Figure 6 The example in which the setting angle between the via holes 429 and 439 of each layer of the ceramic sheet is 45 degrees is illustrated, but it is not limited to this, and as long as the via holes 429 and 439 of the ceramic sheet are discontinuous and non-overlapping on a straight line along the stacking direction, the setting angle can be realized in various embodiments by considering the diameter of the via holes 429 and 439 and the number of the via holes 429 and 439 of each ceramic sheet, such as 10 degrees, 20 degrees, 30 degrees, 40 degrees, 45 degrees, 50 degrees, 60 degrees, 70 degrees, 80 degrees and 90 degrees.

[0084] <Example 3>

[0085] Furthermore, as shown in Example 2, although an example of repeating the discontinuous stacking structure of the via holes 429 and 439 of the first ceramic sheet 420 and the second ceramic sheet 430 is described by continuously stacking one of the plurality of first ceramic sheets 420 and one of the plurality of second ceramic sheets 430 and repeating the process (repeatedly stacking the first ceramic sheet 420 and the second ceramic sheet 430), it is not limited to this. Figure 6 and Figure 7 As shown, the via holes 419, 429, 439, 449 of the ceramic sheets 410, 420, 430, 440 can be stacked by repeating the discontinuous stacking structure of the via holes 419, 429 of two of the multiple first ceramic sheets (the first ceramic sheet 410 and the first ceramic sheet 420) and the discontinuous stacking structure of the via holes 439, 449 of two of the multiple second ceramic sheets (the second ceramic sheet 430 and the second ceramic sheet 440) (repeatedly stacking the first ceramic sheet 410, the first ceramic sheet 420, the second ceramic sheet 430, and the second ceramic sheet 440) so that the via holes are arranged at discontinuous and non-overlapping positions on a straight line along the stacking direction.

[0086] <Example 4>

[0087] Furthermore, in Example 3, additionally, instead of the discontinuous stacking structure of the via holes 419, 429 of two of the plurality of first ceramic sheets (first ceramic sheet 410, first ceramic sheet 420), the via holes of a greater number of the plurality of first ceramic sheets may be stacked in a manner so as to be arranged at discontinuous and non-overlapping positions in a straight line along the stacking direction.

[0088] That is, two or more of the first ceramic sheets are stacked continuously, and the via holes of the ceramic sheets can be set at positions that are discontinuous and non-overlapping in a straight line along the stacking direction. At this time, as described in Example 1, two ceramic sheets are stacked so that the setting angle between the via holes of each layer of the ceramic sheets is 45 degrees, and the process can also be repeated, or as long as the via holes of the ceramic sheets are discontinuous and non-overlapping in a straight line along the stacking direction, the setting angle between the via holes of each layer of the ceramic sheets can be realized in various embodiments by considering the diameter of the via holes and the number of via holes of each ceramic sheet, such as 10 degrees, 20 degrees, 30 degrees, 40 degrees, 45 degrees, 50 degrees, 60 degrees, 70 degrees, 80 degrees and 90 degrees, etc.

[0089] <Example 5>

[0090] In addition, further, in Example 3, additionally, instead of the discontinuous stacking structure of the via holes 439, 449 of two of the multiple second ceramic sheets (second ceramic sheet 430, second ceramic sheet 440), the via holes of a greater number of the multiple second ceramic sheets can be stacked in a manner that is arranged at discontinuous and non-overlapping positions on a straight line along the stacking direction.

[0091] That is, two or more of the second ceramic sheets are stacked continuously, and the via holes of the ceramic sheets can be set at positions that are discontinuous and non-overlapping in a straight line along the stacking direction. At this time, as described in Example 1, two ceramic sheets are stacked so that the setting angle between the via holes of each layer of the ceramic sheet is 45 degrees, and the process can be repeated, or as long as the via holes of the ceramic sheets are discontinuous and non-overlapping in a straight line along the stacking direction, the setting angle between the via holes of each layer of the ceramic sheet can be realized in various embodiments by considering the diameter of the via holes and the number of via holes of each ceramic sheet, such as 10 degrees, 20 degrees, 30 degrees, 40 degrees, 45 degrees, 50 degrees, 60 degrees, 70 degrees, 80 degrees and 90 degrees, etc.

[0092] <Example 6>

[0093] Furthermore, additionally, in the step S250 of forming the stacked body, as Figure 7 As shown, preferably, in the lower region of the plurality of ceramic sheets 410, 420, 430, 440, a groove region 600 of an electrode rod for supplying power to the wiring layers of the plurality of ceramic sheets 410, 420, 430, 440 is provided, and the vias 419, 429, 439, 449 are not provided along the stacking direction in the groove region 600. The vias 419, 429, 439, 449 and the wirings 411, 412, 421, 422, 431, 432, 441, 442 of the respective ceramic sheets 410, 420, 430, 440 can realize full power supply to the electrodes or conductors in the insulating plate.

[0094] Figure 8 FIG. 4 is a cross-sectional view of an insulating plate of a ceramic base manufactured according to an embodiment of the present invention.

[0095] Reference Figure 8In the insulating plate structure of the ceramic base of the above-mentioned embodiment 1, more than two first ceramic sheets 410 are continuously stacked, and the via holes 419 of the ceramic sheets 410 are arranged at discontinuous and non-overlapping positions on a straight line along the stacking direction, and in a groove area 600 combined with an electrode rod for supplying power to the lower part of the ceramic insulating plate, the via holes are not arranged in a non-overlapping manner along the stacking direction, but are arranged on the outside of the groove area, thereby preventing surface bending around the via holes on the inner side of the stacked structure of the ceramic sheets and manufacturing in a manner that minimizes shape deformation.

[0096] <Example of Wiring Pattern>

[0097] On the other hand, in the above-mentioned embodiment, in the stacked body of the plurality of ceramic sheets 410, 420, 430, 440, the reference Figures 9a to 9d and Figures 10a to 10d , an embodiment of wiring 411, 412, 421, 422, 431, 432, 441, 442 is described.

[0098] Figures 9a to 9d This is an embodiment of the present invention in which the wiring patterns of the ceramic sheets of the respective layers are formed in partial regions.

[0099] Figures 10a to 10d This is an embodiment of the present invention in which the wiring patterns of the ceramic sheets of each layer are formed in the entire area.

[0100] By combination Figures 9a to 9d and Figures 10a to 10d The wiring of each layer of the ceramic sheet of the present invention can be realized in combination, where the wiring is formed in a partial area on a certain ceramic sheet and in the entire area on another ceramic sheet. Figures 9a to 9d As shown in FIG. 1 , the wiring 421, 433, 442, 443 in the partial area refers to the wiring formed in each area of ​​the specified partition part, rather than being formed on the entire surface (or inside) of the ceramic sheet. Figures 10a to 10d As shown, the wiring 424, 434, and 444 of the entire area refers to the wiring formed on the entire (no partitioned part) surface (or interior) of the ceramic sheet and extending and connected as a whole. However, there may be partially vacant wiring patterns, such as at the location where the pores are set.

[0101] For example, refer to Figure 9a In the stacked body of the lower ceramic sheet 410 and the upper ceramic sheet 420 with different setting angles of the via holes, the wiring 411 of the lower ceramic sheet 410 and the wiring 421 of the partial area of ​​the upper ceramic sheet 420 can be electrically connected through the via hole 429 of the upper ceramic sheet 420. The via hole 419 of the lower ceramic sheet 410 is electrically connected to the wiring at the bottom of the lower ceramic sheet 410. In addition, referring to Fig.10a In the stack of the lower ceramic sheet 410 and the upper ceramic sheet 420 having via holes at different setting angles, the wiring 411 of the lower ceramic sheet 410 and the entire area wiring 424 of the upper ceramic sheet 420 can be electrically connected through the via hole 429 of the upper ceramic sheet 420.

[0102] In addition, refer to Figure 9b In the stacked body of the lower ceramic sheet 420 and the upper ceramic sheet 430 having different distances from the center of the via hole, the wiring 422 of the lower ceramic sheet 420 and the wiring 433 of the partial area of ​​the upper ceramic sheet 430 can be electrically connected through the via hole 439 of the upper ceramic sheet 430. The via hole 429 of the lower ceramic sheet 420 is electrically connected to the wiring at the bottom of the lower ceramic sheet 420. In addition, referring to Fig.10b In a stack of a lower ceramic sheet 420 and an upper ceramic sheet 430 having different distances from the center of a via hole, a wiring 422 of the lower ceramic sheet 420 and a whole area wiring 434 of the upper ceramic sheet 430 may be electrically connected through a via hole 439 of the upper ceramic sheet 430 .

[0103] In addition, refer to Fig.9c In the stacked body of the lower ceramic sheet 430 and the upper ceramic sheet 440 with different setting angles of the via holes, the wiring 432 of the lower ceramic sheet 430 and the wiring 442 of the partial area of ​​the upper ceramic sheet 440 can be electrically connected through the via hole 449 of the upper ceramic sheet 440. The via hole 439 of the lower ceramic sheet 430 is electrically connected to the wiring at the bottom of the lower ceramic sheet 430. In addition, referring to Fig.10c In the stack of the lower ceramic sheet 430 and the upper ceramic sheet 440 having via holes at different setting angles, the wiring 432 of the lower ceramic sheet 430 and the entire area wiring 444 of the upper ceramic sheet 440 can be electrically connected through the via hole 449 of the upper ceramic sheet 440.

[0104] In addition, refer to Figure 9d , at different distances from the center of the via and not adjacent (refer to Figure 6 and Figure 7 ), in a stack of a lower ceramic sheet 410 and an upper ceramic sheet 440, the wiring 412 of the lower ceramic sheet 410 and the wiring 443 of a partial area of ​​the upper ceramic sheet 430 can be electrically connected through the via hole 449 of the upper ceramic sheet 430. In particular, in order to connect the via hole 449 of the upper ceramic sheet 440 to the wiring 412 of the non-adjacent lower ceramic sheet 410, the connection can be made through the via holes and wiring of the two ceramic sheets (ceramic sheet 420, ceramic sheet 430) between the lower ceramic sheet 410 and the upper ceramic sheet 440. Furthermore, in order to directly connect the via hole 449 of the upper ceramic sheet 440 to the wiring 412 of the non-adjacent lower ceramic sheet 410, such a via hole 449 can be additionally processed. Similarly, referring to Fig.10d , at different distances from the center of the via and not adjacent (refer to Figure 6 and Figure 7 ) in a stack of a lower ceramic sheet 410 and an upper ceramic sheet 440, the wiring 412 of the lower ceramic sheet 410 and the entire area wiring 444 of the upper ceramic sheet 430 can be electrically connected through the conductive hole 449 of the upper ceramic sheet 430.

[0105] As described above, the ceramic base of the present invention provides a ceramic base, which is manufactured by sintering a laminated body of a plurality of ceramic sheets 410, 420, 430, 440. The ceramic base includes a laminated structure, which is manufactured by sintering a laminated body of a plurality of ceramic sheets 410, 420, 430, 440 on which a plurality of vias 419, 429, 439, 449 and wirings 411, 412, 421, 422, 431, 432, 441, 442 are formed. Among them, the plurality of vias 419, 429, 439, 449 are arranged discontinuously and non-overlappingly in a straight line along the stacking direction of the plurality of ceramic sheets 410, 420, 430, 440, and the plurality of vias 419, 429, 439, 449 electrically connect the wiring 411, 412, 421, 422, 431, 432, 441, 442 of the plurality of ceramic sheets 410, 420, 430, 440.

[0106] According to the ceramic base and the manufacturing method thereof of the present invention, a ceramic base can be provided, in which when a pressure is applied to a laminated body before sintering, the conduction hole of the ceramic insulating plate having a multilayer wiring structure minimizes shape deformation (such as collapse), thereby the ceramic base is manufactured in a manner that minimizes the deformed cross-sectional area. In addition, a ceramic base can be provided in which the conduction hole is not provided in the groove area 600 in which the electrode rod for supplying power to the lower part of the ceramic insulating plate is combined, but the conduction hole is provided outside the groove area, thereby preventing the surface from being bent around the conduction hole inside the laminated structure of the ceramic sheet, and in a manner that minimizes shape deformation.

[0107] As described above, in the present invention, specific matters such as specific constituent elements and limited embodiments and drawings are used for explanation, but this is only provided for a more comprehensive understanding of the present invention, and the present invention is not limited to the embodiments, and a person of ordinary skill in the technical field to which the present invention belongs can make various modifications and variations within the scope of the essential characteristics of the present invention. Therefore, the idea of ​​the present invention should not be limited to the embodiments described, and not only the claims described later, but all technical ideas that are equivalent to or have equivalent variations of the claims should be interpreted as being included in the scope of the present invention.

Claims

1. A method for manufacturing a ceramic base, wherein the ceramic base is used to support a substrate, characterized in that: include: The manufacturing step comprises manufacturing a plurality of ceramic sheets including via holes and conductors for filling the via holes. a laminating step of laminating the plurality of ceramic sheets, and a sintering step of sintering the laminated body formed by the lamination; In the lamination step, The via holes of at least one of the plurality of ceramic sheets are arranged so as not to overlap with the via holes of other adjacent ceramic sheets. In the lamination step, In a groove region in a lower region of the plurality of ceramic sheets where an electrode rod for supplying power to a wiring layer of the plurality of ceramic sheets is provided, the via holes are not provided along the stacking direction.

2. The method for manufacturing a ceramic base according to claim 1, characterized in that: Each of the plurality of ceramic sheets has a wiring layer electrically connected to the conductor of the via hole disposed on a surface or inside thereof.

3. The method for manufacturing a ceramic base according to claim 2, characterized in that: The wiring layer includes an electrostatic chuck electrode, a high-frequency electrode, or a heating element.

4. The method for manufacturing a ceramic base according to claim 2, characterized in that: The wiring layer is formed in a plurality of partial regions or the entire region of each ceramic sheet.

5. The method for manufacturing a ceramic base according to claim 1, characterized in that: In the step of manufacturing the plurality of ceramic sheets, a plurality of first ceramic sheets having a plurality of first via holes at a first distance from the center in a radial direction are manufactured. The stacking step comprises the following steps: Two or more of the plurality of first ceramic sheets are stacked continuously, and the via holes of the ceramic sheets are arranged at positions that do not overlap along a stacking direction.

6. The method for manufacturing a ceramic base according to claim 1, characterized in that: In the step of manufacturing the plurality of ceramic sheets, a plurality of first ceramic sheets having a plurality of first conductive holes at a first distance from the center in the radial direction are manufactured; and a plurality of second ceramic sheets having a plurality of second conductive holes at a second distance from the center in the radial direction are manufactured, The stacking step comprises the following steps: One of the plurality of first ceramic sheets and one of the plurality of second ceramic sheets are stacked successively, and the via holes of the ceramic sheets are arranged at positions that do not overlap along a stacking direction.

7. The method for manufacturing a ceramic base according to claim 1, characterized in that: In the step of manufacturing the plurality of ceramic sheets, a plurality of first ceramic sheets having a plurality of first conductive holes at a first distance from the center in a radial direction are manufactured, and a plurality of second ceramic sheets having a plurality of second conductive holes at a second distance from the center in a radial direction are manufactured; The stacking step comprises the following steps: Two or more of the plurality of first ceramic sheets are stacked successively, and the via holes of the ceramic sheets are arranged at positions that do not overlap along the stacking direction, and One of the plurality of first ceramic sheets and one of the plurality of second ceramic sheets are stacked successively, and the via holes of the ceramic sheets are arranged at positions that do not overlap along a stacking direction.

8. The method for manufacturing a ceramic base according to claim 7, characterized in that: The stacking step further comprises the following steps: Two or more of the plurality of second ceramic sheets are stacked continuously, and the via holes of the ceramic sheets are arranged at positions that do not overlap along a stacking direction.

9. A ceramic base for supporting a substrate, which is manufactured by sintering a laminated body formed by stacking a plurality of ceramic sheets, characterized in that: The invention comprises a laminated structure, wherein the laminated structure is manufactured by sintering a laminated body formed by stacking a plurality of ceramic sheets, wherein the ceramic sheets are provided with via holes and a conductor for filling the via holes, The via holes of at least one of the plurality of ceramic sheets are arranged so as not to overlap with the via holes of other adjacent ceramic sheets. In a groove region in a lower region of the plurality of ceramic sheets where an electrode rod for supplying power to a wiring layer of the plurality of ceramic sheets is provided, the via holes are not provided along the stacking direction.

10. The ceramic base according to claim 9, characterized in that: Each of the plurality of ceramic sheets has a wiring layer electrically connected to the conductor of the via hole disposed on a surface or inside thereof.

11. The ceramic base according to claim 10, characterized in that: The wiring layer includes an electrostatic chuck electrode, a high-frequency electrode, or a heating element.

12. The ceramic base according to claim 10, characterized in that: The wiring layer is formed in a plurality of partial regions or the entire region of each ceramic sheet.

13. The ceramic base according to claim 9, characterized in that: The plurality of ceramic sheets include a plurality of first ceramic sheets having a plurality of first via holes at positions spaced a first distance from the center in a radial direction, The ceramic base includes a plurality of ceramic sheets, wherein two or more of the plurality of first ceramic sheets are stacked continuously and the via holes of the ceramic sheets are arranged at non-overlapping positions along a stacking direction.

14. The ceramic base according to claim 9, characterized in that: The plurality of ceramic sheets include: A plurality of first ceramic sheets have a plurality of first conducting holes at a first distance from the center in a radial direction, and A plurality of second ceramic sheets, each having a plurality of second conducting holes at a second distance from the center in a radial direction; The ceramic base includes a plurality of ceramic sheets, wherein one of the plurality of first ceramic sheets and one of the plurality of second ceramic sheets are stacked continuously and the via holes of the ceramic sheets are arranged at positions that do not overlap along a stacking direction.

15. The ceramic base according to claim 9, characterized in that: The plurality of ceramic sheets include: A plurality of first ceramic sheets have a plurality of first conducting holes at a first distance from the center in a radial direction, and A plurality of second ceramic sheets, each having a plurality of second conducting holes at a second distance from the center in a radial direction; The ceramic base comprises: a ceramic sheet group in which two or more of the plurality of first ceramic sheets are stacked continuously and the via holes of the ceramic sheets are arranged at positions that do not overlap along the stacking direction, and A ceramic sheet group is provided in such a manner that one of the plurality of first ceramic sheets and one of the plurality of second ceramic sheets are continuously stacked and the via holes of the ceramic sheets are provided at positions that do not overlap along a stacking direction.

16. The ceramic base according to claim 15, characterized in that: The ceramic base further includes a ceramic sheet group in which two or more of the plurality of second ceramic sheets are stacked continuously, and the via holes of the ceramic sheets are arranged at positions that do not overlap along a stacking direction.

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