High-insulation high-heat-dissipation powder coating and preparation method thereof

Abstract

The application relates to a high-insulation high-heat-dissipation powder coating and a preparation method thereof. The high-insulation high-heat-dissipation powder coating comprises the following components: solid epoxy resin, fluorocarbon resin, curing agent, oleophilic boron nitride, pigment, benzoin, wherein the oleophilic boron nitride is a mixture of hexagonal boron nitride and spherical boron nitride after surface modification. The prepared powder coating has a smooth and flat paint film after curing, excellent insulation and high-efficiency heat dissipation, light weight, excellent flame retardation, and is suitable for the surfaces of various substrates and can be widely applied to the fields of energy storage, electronics, automobiles and the like, provides efficient heat dissipation protection and insulation safety for related equipment and structures, and has remarkable energy-saving and equipment performance-improving effects.

Description

Technical Field

[0001] This invention relates to the field of powder coating technology, and in particular to a high-insulation, high-heat-dissipation powder coating and its preparation method. Background Technology

[0002] In today's electronics and electrical equipment field, with the rapid development of electronic technology, the operating speed and power density of equipment are constantly increasing, making heat generation a more prominent issue. Efficient heat dissipation and reliable insulation performance are key factors in ensuring stable equipment operation, extending service life, and improving safety. Traditional heat dissipation methods, such as heat sinks, fans, and water cooling, are no longer sufficient to meet equipment requirements and have limitations in certain application scenarios, such as space constraints, noise issues, and insufficient reliability. Simultaneously, insulation protection is crucial for electronic equipment. Insulating materials must not only effectively prevent current leakage but also maintain stable insulation performance in complex working environments. However, some materials with good insulation properties do not have ideal heat dissipation effects and cannot effectively conduct heat away in a timely manner, making it difficult to meet the heat dissipation needs of high-power equipment; other materials, while possessing good heat dissipation performance, fail to meet high standards of insulation performance.

[0003] Powder coating is a new type of powder coating with 100% solid content. It has outstanding characteristics such as being solvent-free, environmentally friendly, efficient, recyclable, saving energy and resources, reducing labor intensity, and having high mechanical strength of the coating film. It integrates insulation and heat dissipation functions into powder coating, providing an innovative solution for solving the heat dissipation and insulation problems of electronic devices.

[0004] In summary, developing a powder coating that combines excellent insulation and efficient heat dissipation properties has significant practical implications and broad market prospects. Based on this background, this invention aims to provide an innovative insulating and heat-dissipating powder coating and its preparation method to meet the urgent needs of the electronics and electrical industries for high-performance heat dissipation and insulation materials. Summary of the Invention

[0005] To address the problem that existing powder coatings cannot simultaneously achieve high insulation and high heat dissipation, this invention provides a high-insulation, high-heat-dissipation powder coating and its preparation method.

[0006] The first objective of this invention is to provide a high-insulation, high-heat-dissipation powder coating, comprising the following components by weight:

[0007] 20-30 parts of solid epoxy resin;

[0008] 5-10 parts of fluorocarbon resin;

[0009] 3-8 parts of curing agent;

[0010] 30-70 parts of lipophilic boron nitride;

[0011] 1-8 parts pigment;

[0012] 1-4 parts benzoin;

[0013] The oleophilic boron nitride is a mixture of hexagonal boron nitride and spherical boron nitride that has undergone surface modification, wherein the mass ratio of hexagonal boron nitride to spherical boron nitride is 1-10:20.

[0014] In some embodiments of the present invention, the particle size D50 of the hexagonal boron nitride is 20-35 μm, and the particle size D50 of the spherical boron nitride is 20-80 μm.

[0015] In some embodiments of the present invention, the lipophilic boron nitride is prepared by the following method:

[0016] Hexagonal boron nitride and spherical boron nitride are provided and premixed in a certain mass ratio to obtain premix A;

[0017] Hexagonal boron nitride and spherical boron nitride premix A were subjected to high-temperature annealing to obtain active boron nitride mixture B;

[0018] The active boron nitride mixture B was first coated and modified with a silane coupling agent, and then a second coating and modification was performed with an organic compound to obtain the lipophilic boron nitride.

[0019] In some embodiments of the present invention, the mass ratio of hexagonal boron nitride to spherical boron nitride is 1-10:20. Exemplarily, it can be 1:10, 3:20, 1:5, 1:4, 6:20, 7:20, 2:5, 9:20, 1:2, etc., or any range between any two values.

[0020] In some embodiments of the present invention, the annealing temperature is 900-1300°C and the time is 2-5 hours.

[0021] In some embodiments of the present invention, the mass ratio of the active boron nitride mixture B to the silane coupling agent is 100:1-5;

[0022] The silane coupling agent is any one or more of the following: triethoxyoctylsilane, aminopropyltrimethoxysilane, polydimethylsilane, propyltrimethoxysilane, diaminosilane, vinyltrichlorosilane, vinyltrimethoxysilane, mercaptopropyltriethoxysilane, chloropropylmethyldichlorosilane, hexadecyltrimethoxysilane, and octadecyltrimethylsilane.

[0023] In some embodiments of the present invention, the organic compound is any one or more of stearic acid, zinc stearate, magnesium stearate, hydrogen-containing silicone oil, titanate, aluminate, and zirconate.

[0024] The mass ratio of the active boron nitride mixture B to the organic matter is 100:1-3.

[0025] In some embodiments of the present invention, the specific operation of the first coating modification is as follows: the active boron nitride mixture B and the silane coupling agent are added to the powder modification machine, mixed and modified at 3000-8000 r / min for 5-15 min, and allowed to stand for 1-12 h to complete the first coating modification.

[0026] In some embodiments of the present invention, the specific operation of the second coating modification is as follows: the organic material is added to the mixture that has undergone the first coating modification, and the mixture is mixed and coated at 3000-8000 r / min for 10-30 min to achieve the second coating modification.

[0027] In some embodiments of the present invention, the curing agent is an isocyanate curing agent and / or an amine curing agent;

[0028] The pigment is one or more of iron oxide pigment, ultramarine pigment, or organic pigment;

[0029] The softening temperature of the solid epoxy resin is 90-130℃.

[0030] A second objective of this invention is to provide a method for preparing the aforementioned high-insulation, high-heat-dissipation powder coating, comprising the following steps:

[0031] S1. Add solid epoxy resin, fluorocarbon resin, curing agent, oleophilic boron nitride, pigment and benzoin to a high-speed mixer and mix evenly to obtain a premix;

[0032] S2. Extrude the premixed material into thin sheets, cool and then crush it, and sieve it through a 160-200 mesh to obtain the high-insulation and high-heat-dissipation powder coating.

[0033] When the high-insulation and high-heat-dissipation powder coating described in this invention is specifically applied, the workpiece can be coated by electrostatic spraying or fluidized bed application, followed by high-temperature curing and cooling.

[0034] The technical solution of the present invention has the following advantages compared with the prior art:

[0035] The high-insulation and high-heat-dissipation powder coating of the present invention uses boron nitride, which has high insulation, high thermal conductivity and low density, as a filler. Compared with the high insulation and low heat dissipation of alumina and magnesium hydroxide and the low insulation and high heat dissipation of metal powder and carbon-based materials, the powder coating prepared by boron nitride has both high insulation and good heat dissipation. This ensures the efficient, stable operation and safety of high-power equipment, while also making the equipment lighter.

[0036] The high-insulation and high-heat-dissipation powder coating of the present invention uses a mixture of hexagonal boron nitride and spherical boron nitride. The sheet-like and spherical shapes are bridged to form more heat conduction channels, which greatly improves the thermal conductivity.

[0037] Due to the excellent chemical inertness of boron nitride, effective surface modification of boron nitride is very difficult. This invention first subjects inert boron nitride to high-temperature annealing to generate boron nitride nanosheets with active groups, then chemically modifies it with a silane coupling agent, and finally modifies it by coating it with organic matter in a two-stage modification method to obtain oleophilic boron nitride. It has outstanding high filling capacity and high compatibility in coating systems, making the insulation and electrical breakdown resistance of powder coatings greater than 3KV and the thermal conductivity of heat dissipation performance greater than 2W / M·K, which is 5 times higher than the thermal conductivity of existing insulating and heat dissipation coatings of 0.4W / M·K. At the same time, it also gives the paint film good adhesion, flame retardancy and mechanical properties.

[0038] The high-insulation and high-heat-dissipation coating of this invention is a powder coating with 100% solid content. Compared with oil-based and water-based coatings, it has outstanding advantages such as being solvent-free, environmentally friendly, efficient, recyclable, and saving energy and resources, and is very friendly to the health of operators. Detailed Implementation

[0039] The present invention will be further described below with reference to specific embodiments, so that those skilled in the art can better understand and implement the present invention, but the embodiments are not intended to limit the present invention.

[0040] Example 1

[0041] This embodiment provides a high-insulation and high-heat-dissipation powder coating and its preparation method, as detailed below:

[0042] (I) High insulation and high heat dissipation powder coating, by weight, includes the following components:

[0043]

[0044] (II) The preparation method of high insulation and high heat dissipation powder coating is as follows:

[0045] (1) 10g of hexagonal boron nitride with a particle size D50 of 20um and 200g of spherical boron nitride with a particle size D50 of 30um were premixed to obtain premix A, and then annealed at 900℃ for 2H to obtain active boron nitride B.

[0046] (2) Add 100g of active boron nitride B and 1g of triethoxyoctylsilane to a powder modifier, mix and modify at 3000r / min for 5min, let stand for 1H, then add 1g of stearic acid, mix and modify at 4000r / min for 15min to obtain lipophilic boron nitride.

[0047] (3) Add solid epoxy resin, fluorocarbon resin, isocyanate curing agent, lipophilic boron nitride, iron oxide red and benzoin to a high-speed mixer in proportion and mix evenly to obtain a premix;

[0048] (4) The premixed material is extruded into thin sheets through a 130°C melt extruder, cooled and crushed, and then sieved through a 160-mesh sieve to obtain a high-insulation and high-heat-dissipation powder coating.

[0049] (III) The powder coating was sprayed onto the copper equipment using electrostatic spraying. The coating thickness was 160-180 μm. It was cured at 200℃ for 20 min and cooled to obtain the coating film. The insulation, heat dissipation and other performance tests of the coating film were performed. The specific test indicators and results are shown in Table 1.

[0050] Example 2

[0051] This embodiment provides a high-insulation and high-heat-dissipation powder coating and its preparation method, as detailed below:

[0052] (I) High insulation and high heat dissipation powder coating, by weight, includes the following components:

[0053]

[0054] (II) The preparation method of high insulation and high heat dissipation powder coating is as follows:

[0055] (1) 30g of hexagonal boron nitride with a particle size D50 of 30um and 200g of spherical boron nitride with a particle size D50 of 50um were premixed to obtain premix A, and then annealed at 1000℃ for 2H to obtain active boron nitride B.

[0056] (2) Add 100g of active boron nitride B and 1g of triethoxyoctylsilane to a powder modifier, mix and modify at 4000r / min for 10min, let stand for 2H, then add 2g of stearic acid, mix and modify at 8000r / min for 15min to obtain lipophilic boron nitride.

[0057] (3) Add solid epoxy resin, fluorocarbon resin, isocyanate curing agent, lipophilic boron nitride, iron oxide red and benzoin to a high-speed mixer in proportion and mix evenly to obtain a premix;

[0058] (4) The premixed material is extruded into thin sheets through a 90°C melt extruder, cooled and crushed, and then sieved through a 200-mesh sieve to obtain a high-insulation and high-heat-dissipation powder coating.

[0059] (III) The powder coating was sprayed onto the copper equipment using electrostatic spraying. The coating thickness was 160-180 μm. It was cured at 200℃ for 20 min and cooled to obtain the coating film. The insulation, heat dissipation and other performance tests of the coating film were performed. The specific test indicators and results are shown in Table 1.

[0060] Example 3

[0061] This embodiment provides a high-insulation and high-heat-dissipation powder coating and its preparation method, as detailed below:

[0062] (I) High insulation and high heat dissipation powder coating, by weight, includes the following components:

[0063]

[0064] (II) The preparation method of high insulation and high heat dissipation powder coating is as follows:

[0065] (1) 40g of hexagonal boron nitride with a particle size D50 of 35um and 200g of spherical boron nitride with a particle size D50 of 80um were premixed to obtain premix A, and then annealed at 1000℃ for 2H to obtain active boron nitride B.

[0066] (2) Add 100g of active boron nitride B and 0.5g of vinyltrimethoxysilane to a powder modifier, mix and modify at 5000r / min for 15min, let stand for 5H, then add 1g of stearic acid and 1g of aluminate, mix and modify at 8000r / min for 10min to obtain lipophilic boron nitride.

[0067] (3) Add solid epoxy resin, fluorocarbon resin, amine curing agent, lipophilic boron nitride, iron oxide yellow and benzoin to a high-speed mixer in proportion and mix evenly to obtain a premix;

[0068] (4) The premixed material is extruded into thin sheets through a 130°C melt extruder, cooled and crushed, and then sieved through a 200-mesh sieve to obtain a high-insulation and high-heat-dissipation powder coating.

[0069] (III) The powder coating was sprayed onto the copper equipment using electrostatic spraying. The coating thickness was 160-180 μm. It was cured at 200℃ for 20 min and cooled to obtain the coating film. The insulation, heat dissipation and other performance tests of the coating film were performed. The specific test indicators and results are shown in Table 1.

[0070] Example 4

[0071] This embodiment provides a high-insulation and high-heat-dissipation powder coating and its preparation method, as detailed below:

[0072] (I) High insulation and high heat dissipation powder coating, by weight, includes the following components:

[0073]

[0074] (II) The preparation method of high insulation and high heat dissipation powder coating is as follows:

[0075] (1) 60g of hexagonal boron nitride with a particle size D50 of 30um and 200g of spherical boron nitride with a particle size D50 of 20um were premixed to obtain premix A, and then annealed at 1200℃ for 2H to obtain active boron nitride B.

[0076] (2) Add 100g of active boron nitride B, 0.5g of triethoxyoctylsilane, and 1g of hexadecylmethoxysilane to a powder modifier, mix and modify at 5000r / min for 5min, let stand for 6H, then add 3g of hydrogen-containing silicone oil, mix and modify at 5000r / min for 25min to obtain oleophilic boron nitride.

[0077] (3) Add solid epoxy resin, fluorocarbon resin, isocyanate curing agent, oleophilic boron nitride, ultramarine blue and benzoin into a high-speed mixer in proportion and mix evenly to obtain a premix;

[0078] (4) The premixed material is extruded into thin sheets through a 120°C melt extruder, cooled and crushed, and then sieved through a 180-mesh sieve to obtain a high-insulation and high-heat-dissipation powder coating.

[0079] (III) The powder coating was sprayed onto the copper equipment using electrostatic spraying. The coating thickness was 150-180 μm. It was cured at 200℃ for 20 min and cooled to obtain the coating film. The insulation, heat dissipation and other performance tests of the coating film were conducted. The specific test indicators and results are shown in Table 1.

[0080] Example 5

[0081] This embodiment provides a high-insulation and high-heat-dissipation powder coating and its preparation method, as detailed below:

[0082] (I) A high-insulation and high-heat-dissipation powder coating, comprising the following components by weight:

[0083]

[0084]

[0085] (II) The preparation method of high insulation and high heat dissipation powder coating is as follows:

[0086] (1) 60g of hexagonal boron nitride with a particle size D50 of 30um and 200g of spherical boron nitride with a particle size D50 of 80um were premixed to obtain premix A, and then annealed at 1100℃ for 2H to obtain active boron nitride B.

[0087] (2) Add 100g of active boron nitride B and 2g of aminopropyltrimethoxysilane to a powder modifier, mix and modify at 8000r / min for 15min, let stand for 8H, then add 3g of aluminate, mix and modify at 8000r / min for 10min to obtain lipophilic boron nitride.

[0088] (3) Add solid epoxy resin, fluorocarbon resin, isocyanate curing agent, oleophilic boron nitride, Red 21 and benzoin into a high-speed mixer in proportion and mix evenly to obtain a premix.

[0089] (4) The premixed material is extruded into thin sheets through a 110°C melt extruder, cooled and crushed, and then sieved through a 160-mesh sieve to obtain a high-insulation and high-heat-dissipation powder coating.

[0090] (III) The powder coating was sprayed onto the copper equipment using electrostatic spraying. The coating thickness was 150-180 μm. It was cured at 200℃ for 20 min and cooled to obtain the coating film. The insulation, heat dissipation and other performance tests of the coating film were conducted. The specific test indicators and results are shown in Table 1.

[0091] Example 6

[0092] This embodiment provides a high-insulation and high-heat-dissipation powder coating and its preparation method, as detailed below:

[0093] (I) A high-insulation and high-heat-dissipation powder coating, comprising the following components by weight:

[0094]

[0095]

[0096] (II) The preparation method of high insulation and high heat dissipation powder coating is as follows:

[0097] (1) 100g of hexagonal boron nitride with a particle size D50 of 25um and 200g of spherical boron nitride with a particle size D50 of 60um were premixed to obtain premix A, and then annealed at 1300℃ for 2H to obtain active boron nitride B.

[0098] (2) Add 100g of active boron nitride B and 1g of octadecyltrimethylsilane to a powder modifier, mix and modify at 6000r / min for 10min, let stand for 10H, then add 2g of aluminate and 1g of zirconate, mix and modify at 3000r / min for 30min to obtain lipophilic boron nitride.

[0099] (3) Add solid epoxy resin, fluorocarbon resin, isocyanate curing agent, lipophilic boron nitride, Orange 5 and benzoin to a high-speed mixer in proportion and mix evenly to obtain a premix;

[0100] (4) The premixed material is extruded into thin sheets through a 120°C melt extruder, cooled and crushed, and then sieved through a 160-mesh sieve to obtain a high-insulation and high-heat-dissipation powder coating.

[0101] (III) The powder coating was sprayed onto the copper equipment using electrostatic spraying. The coating thickness was 150-180 μm. It was cured at 200℃ for 20 min and cooled to obtain the coating film. The insulation, heat dissipation and other performance tests of the coating film were conducted. The specific test indicators and results are shown in Table 1.

[0102] Comparative Example 1

[0103] This embodiment provides a high-insulation and high-heat-dissipation powder coating and its preparation method, as detailed below:

[0104] (I) A high-insulation and high-heat-dissipation powder coating, comprising the following components by weight:

[0105]

[0106]

[0107] (II) The preparation method of high insulation and high heat dissipation powder coating is as follows:

[0108] (1) Add solid epoxy resin, fluorocarbon resin, isocyanate curing agent, iron oxide red and benzoin into a high-speed mixer in proportion and mix evenly to obtain a premix;

[0109] (2) The premixed material is extruded into thin sheets through a 130°C melt extruder, cooled and crushed, and then sieved through a 160-mesh sieve to obtain a high-insulation and high-heat-dissipation powder coating.

[0110] (III) The powder coating was sprayed onto the copper equipment using electrostatic spraying. The coating thickness was 150-180 μm. It was cured at 200℃ for 20 min and cooled to obtain the coating film. The insulation, heat dissipation and other performance tests of the coating film were conducted. The specific test indicators and results are shown in Table 1.

[0111] Comparative Example 2

[0112] This embodiment provides a high-insulation and high-heat-dissipation powder coating and its preparation method, as detailed below:

[0113] (I) A high-insulation and high-heat-dissipation powder coating, comprising the following components by weight:

[0114]

[0115] (II) The preparation method of high insulation and high heat dissipation powder coating is as follows:

[0116] (1) 10g of hexagonal boron nitride with a particle size D50 of 20um and 200g of spherical boron nitride with a particle size D50 of 30um were premixed to obtain boron nitride;

[0117] (2) Add solid epoxy resin, fluorocarbon resin, isocyanate curing agent, boron nitride, iron oxide red and benzoin to a high-speed mixer in proportion and mix evenly to obtain a premix;

[0118] (3) The premixed material is extruded into thin sheets through a 130℃ melt extruder, cooled and crushed, and sieved through a 160-mesh sieve to obtain a high-insulation and high-heat-dissipation powder coating.

[0119] (III) The powder coating was sprayed onto the copper equipment using electrostatic spraying. The coating thickness was 150-180 μm. It was cured at 200℃ for 20 min and cooled to obtain the coating film. The insulation, heat dissipation and other performance tests of the coating film were conducted. The specific test indicators and results are shown in Table 1.

[0120] Comparative Example 3

[0121] This embodiment provides a high-insulation and high-heat-dissipation powder coating and its preparation method, as detailed below:

[0122] (I) A high-insulation and high-heat-dissipation powder coating, comprising the following components by weight:

[0123]

[0124] (II) The preparation method of high insulation and high heat dissipation powder coating is as follows:

[0125] (1) 100g of hexagonal boron nitride with a particle size D50 of 20um was annealed at 900℃ for 2H to obtain active hexagonal boron nitride.

[0126] (2) Add 100g of active hexagonal boron nitride and 1g of triethoxyoctylsilane to a powder modifier, mix and modify at 3000r / min for 5min, let stand for 1H, then add 1g of stearic acid, mix and modify at 4000r / min for 15min to obtain lipophilic hexagonal boron nitride.

[0127] (3) Add solid epoxy resin, fluorocarbon resin, isocyanate curing agent, lipophilic hexagonal boron nitride, iron oxide red and benzoin to a high-speed mixer in proportion and mix evenly to obtain a premix;

[0128] (4) The premixed material is extruded into thin sheets through a 130°C melt extruder, cooled and crushed, and then sieved through a 160-mesh sieve to obtain a high-insulation and high-heat-dissipation powder coating.

[0129] (III) The powder coating was sprayed onto the copper equipment using electrostatic spraying. The coating thickness was 150-180 μm. It was cured at 200℃ for 20 min and cooled to obtain the coating film. The insulation, heat dissipation and other performance tests of the coating film were conducted. The specific test indicators and results are shown in Table 1.

[0130] Comparative Example 4

[0131] This embodiment provides a high-insulation and high-heat-dissipation powder coating and its preparation method, as detailed below:

[0132] (I) A high-insulation and high-heat-dissipation powder coating, comprising the following components by weight:

[0133]

[0134] (II) The preparation method of high insulation and high heat dissipation powder coating is as follows:

[0135] (1) 100g of spherical boron nitride with a particle size D50 of 50um was annealed at 900℃ for 2H to obtain active spherical boron nitride.

[0136] (2) Add 100g of active spherical boron nitride and 1g of triethoxyoctylsilane to a powder modifier, mix and modify at 3000r / min for 5min, let stand for 1H, then add 1g of stearic acid, mix and modify at 4000r / min for 15min to obtain lipophilic spherical boron nitride.

[0137] (3) Add solid epoxy resin, fluorocarbon resin, isocyanate curing agent, lipophilic spherical boron nitride, iron oxide red and benzoin to a high-speed mixer in proportion and mix evenly to obtain a premix;

[0138] (4) The premixed material is extruded into thin sheets through a 130°C melt extruder, cooled and crushed, and then sieved through a 160-mesh sieve to obtain a high-insulation and high-heat-dissipation powder coating.

[0139] (III) The powder coating was sprayed onto the copper equipment using electrostatic spraying. The coating thickness was 150-180 μm. It was cured at 200℃ for 20 min and cooled to obtain the coating film. The insulation, heat dissipation and other performance tests of the coating film were conducted. The specific test indicators and results are shown in Table 1.

[0140] Table 1. Coating film test results of the examples and comparative examples.

[0141]

[0142] The test results in Table 1 above show that the high-insulation and high-heat-dissipation powder coating provided by the present invention has a thermal conductivity of more than 2 W / M·K, which can improve the heat dissipation function of electronic devices by more than 10 times. It also has an electrical breakdown resistance of more than 3KV, ensuring the safe and stable operation of electronic components and extending their service life. Furthermore, the powder coating provided by the present invention also has excellent comprehensive properties such as flexibility, adhesion, and flame retardancy.

[0143] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A high-insulation, high-heat-dissipation powder coating, characterized in that, By weight, it includes the following components: 20-30 parts of solid epoxy resin; 5-10 parts of fluorocarbon resin; 3-8 parts of curing agent; 30-70 parts of lipophilic boron nitride; 1-8 parts pigment; 1-4 parts benzoin; The oleophilic boron nitride is a mixture of hexagonal boron nitride and spherical boron nitride that has undergone surface modification, wherein the mass ratio of hexagonal boron nitride to spherical boron nitride is 1-10:20; The lipophilic boron nitride was prepared by the following method: Hexagonal boron nitride and spherical boron nitride are premixed to obtain premix A; The premix A was subjected to high-temperature annealing to obtain an active boron nitride mixture B; The active boron nitride mixture B was first coated and modified with a silane coupling agent, and then a second coating and modification was performed with an organic compound to obtain the lipophilic boron nitride. The organic compound is any one or more of stearic acid, zinc stearate, magnesium stearate, hydrogen-containing silicone oil, titanate, aluminate, and zirconate. The specific operation of the first coating modification is as follows: add active boron nitride and silane coupling agent into the powder modification machine, mix and modify at 3000-8000r / min for 5-15min, let stand for 1-12h to complete the first coating modification; The specific operation of the second coating modification is as follows: add the organic matter to the mixture that has undergone the first coating modification, mix and coat at 3000-8000 r / min for 10-30 min to achieve the second coating modification.

2. The high-insulation, high-heat-dissipation powder coating according to claim 1, characterized in that, The particle size D50 of the hexagonal boron nitride is 20-35 μm, and the particle size D50 of the spherical boron nitride is 20-80 μm.

3. The high-insulation, high-heat-dissipation powder coating according to claim 1, characterized in that, The annealing temperature is 900-1300℃, and the time is 2-5 hours.

4. The high-insulation, high-heat-dissipation powder coating according to claim 1, characterized in that, The mass ratio of the active boron nitride B to the silane coupling agent is 100:1-5; The silane coupling agent is any one or more of the following: triethoxyoctylsilane, aminopropyltrimethoxysilane, propyltrimethoxysilane, diaminosilane, vinyltrichlorosilane, vinyltrimethoxysilane, mercaptopropyltriethoxysilane, chloropropylmethyldichlorosilane, and hexadecyltrimethoxysilane.

5. The high-insulation, high-heat-dissipation powder coating according to claim 1, characterized in that, The mass ratio of active boron nitride B to organic matter is 100:1-3.

6. The high-insulation, high-heat-dissipation powder coating according to claim 1, characterized in that, The curing agent is an isocyanate curing agent and / or an amine curing agent; The pigment is one or more of iron oxide pigment, ultramarine pigment, or organic pigment; The softening temperature of the solid epoxy resin is 90-130℃.

7. The method for preparing the high-insulation, high-heat-dissipation powder coating according to any one of claims 1 to 6, characterized in that, Includes the following steps: S1. Add solid epoxy resin, fluorocarbon resin, curing agent, oleophilic boron nitride, pigment and benzoin to a high-speed mixer and mix evenly to obtain a premix; S2. Extrude the premixed material into thin sheets, cool and then crush it, and sieve it through a 160-200 mesh to obtain the high-insulation and high-heat-dissipation powder coating.

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