Display module, electronic equipment and fault detection method

By arranging detection units and conductive elements in the edge sub-region of the circuit layer of the display module to monitor the circuit connection status, the problem of difficult circuit layer breakage is solved, and fault prediction of the display module and real-time monitoring of the circuit layer is realized, improving The sensitivity and accuracy of fault detection.

CN119107885APending Publication Date: 2024-12-10LENOVO (BEIJING) LTD
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Patent Information

Application Number
CN202411035491.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-07-30
Publication Date
2024-12-10

AI Technical Summary

Technical Problem

The circuit layer of the existing display module is prone to break when subjected to external forces, resulting in circuit connection failure and difficult to detect, affecting the use of the display module and fault prediction.

Method used

A display module is designed, including a display unit, a control unit and a detection unit. The circuit layer can undergo structural bending and deformation when it is subjected to a preset external force threshold. The detection unit is arranged in the edge sub-region of the circuit layer, and passes through conductive elements and detection. The circuit monitors the circuit connection status to realize real-time monitoring and fault prediction of the circuit layer.

Benefits of technology

It improves the sensitivity and accuracy of fault detection, can timely predict the risk of breakage of the circuit layer, and ensures the normal operation and user experience of the display module.

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Abstract

The invention provides a display module, electronic equipment and a fault detection method. The display module comprises a display unit which comprises a display function area and a non-display function area; the non-display function area comprises a circuit layer, the circuit layer comprises a first area and a second area, and the first area and the second area are arranged on the circuit layer at intervals; the circuit layer can generate structural bending deformation under the condition that an external force applied to the circuit layer reaches a preset external force threshold value; the control unit is connected with the display unit through a circuit; the circuit is arranged in the second area of the circuit layer; and the detection unit is arranged in the first area of the circuit layer, is connected with the control unit and is used for detecting the connection state of the circuit.
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Description

Technical Field

[0001] The present application relates to display technology, and in particular to a display module, an electronic device and a fault detection method. Background Art

[0002] The circuit layer of the existing display module is prone to breakage when subjected to external force, resulting in circuit connection failure, which affects the use of the display module. At present, the breakage of the circuit layer is difficult to detect, and thus it is impossible to predict the failure of the display module. Therefore, a display module design that can predict the failure of the display module is needed. Summary of the invention

[0003] Embodiments of the present application provide a display module, an electronic device, and a fault detection method.

[0004] According to the first aspect of the present application, a display module is provided, comprising: a display unit, comprising a display function area and a non-display function area; the non-display function area comprises a circuit layer, the circuit layer comprises a first area and a second area, the first area and the second area are arranged at intervals on the circuit layer; the circuit layer can undergo structural bending deformation when subjected to an external force reaching a preset external force threshold; a control unit, connected to the display unit via a circuit; the circuit is arranged in the second area of ​​the circuit layer; a detection unit, arranged in the first area of ​​the circuit layer, connected to the control unit, and used to detect the connection status of the circuit.

[0005] According to an embodiment of the present application, the first region of the circuit layer includes at least one edge sub-region, one end of the edge sub-region is the edge of the circuit layer, and the other end of the edge sub-region is the second region.

[0006] According to one embodiment of the present application, the detection unit includes a detection circuit and a detection component; the detection component is arranged in the edge sub-area, and the distance between the detection component and the edge of the circuit layer is smaller than the distance between the circuit and the edge of the circuit layer; one end of the detection circuit is connected to the control unit, and the other end is connected to the detection component.

[0007] According to one embodiment of the present application, the detection component includes a conductive element, which can be set at any position of the edge sub-area; the distance between the conductive element and the edge of the circuit layer is less than or equal to the distance between the conductive element and the circuit, so that the display unit meets the set display conditions.

[0008] According to one embodiment of the present application, the detection component includes a plurality of conductive elements; the plurality of conductive elements are arranged in the edge sub-region along a first direction with gradually decreasing heights; the first direction represents the direction from the edge of the circuit layer to the circuit.

[0009] According to a second aspect of the present application, there is provided an electronic device, comprising a display module and a shell: the display module comprises a display unit and a control unit; the display unit comprises a display function area and a non-display function area, the control unit is arranged on the back side of the display function area, the non-display function area is arranged at the bottom end of the display function area, and the non-display function area is connected to the control unit in a structural bending deformation state; the non-display function area comprises a circuit layer, and the circuit layer comprises a first area and a second area; the display module further comprises a detection unit, which is arranged in the first area of ​​the circuit layer, connected to the control unit, and is used to detect the connection state of the circuit arranged in the second area; the shell is used to accommodate the display module, and the display surface of the display function area is opposite to the inner side of the shell.

[0010] According to one embodiment of the present application, the electronic device also includes a main board, which is arranged on the back side of the display function area and accommodated inside the shell; the main board is connected to the control unit, and the detection unit is connected to the main board through the control unit, and the connection status of the circuit is detected through the main board.

[0011] According to a third aspect of the present application, a fault detection method is provided, comprising: obtaining target detection information sent by a detection unit of a display module; determining, based on the target detection information, a connection state of a circuit between a control unit of the display module and a display unit; if the connection state indicates that the circuit has a fault tendency, generating a display control instruction and sending it to the control unit, so that the control unit controls the display unit to display the detection result based on the display control instruction.

[0012] According to one embodiment of the present application, determining the connection state of the circuit between the control unit of the display module and the display unit includes: obtaining position information of the conductive element included in the detection unit; based on the target detection information, determining the current change information of the detection circuit included in the detection unit; based on the position information of the conductive element and the current change information, determining the connection state of the circuit.

[0013] According to one embodiment of the present application, determining the connection state of the circuit between the control unit of the display module and the display unit includes: obtaining position information of multiple conductive elements included in the detection unit; based on the target detection information, determining current change information of multiple detection circuits corresponding to the multiple conductive elements; based on the current change information, determining the target conductive element corresponding to the target detection circuit where the current change occurs; based on the position information of the target conductive element, determining the connection state of the circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] By reading the detailed description below with reference to the accompanying drawings, the above and other purposes, features and advantages of the exemplary embodiments of the present application will become readily understood. In the accompanying drawings, several embodiments of the present application are shown in an exemplary and non-limiting manner, wherein:

[0015] In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.

[0016] Figure 1 The schematic diagram of the structure of the display module of the present application is shown in FIG. Figure 1 ;

[0017] Figure 2 The schematic diagram of the structure of the display module of the present application is shown in FIG. Figure 2 ;

[0018] Figure 3 A schematic diagram of the structure of an electronic device according to an embodiment of the present application is shown;

[0019] Figure 4 The following is a schematic diagram showing the processing flow of the fault detection method provided in the embodiment of the present application. Figure 1 ;

[0020] Figure 5 The following is a schematic diagram showing the processing flow of the fault detection method provided in the embodiment of the present application. Figure 2 ;

[0021] Figure 6 The following is a schematic diagram showing the processing flow of the fault detection method provided in the embodiment of the present application. Figure 3 ;

[0022] Figure 7 An application scenario diagram of the fault detection method provided in an embodiment of the present application is shown.

[0023] Reference numerals:

[0024] 1. Display unit; 2. Control unit; 3. Detection unit; 11. Display function area; 12. Non-display function area; 121. First area; 122. Second area; 1211. Edge sub-area; 31. Detection circuit; 32. Detection component; 321. Conductive element; 4. Housing; 5. Main board. DETAILED DESCRIPTION

[0025] In order to make the purpose, features, and advantages of the present application more obvious and easy to understand, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0026] In the following description, reference is made to “some embodiments”, which describe a subset of all possible embodiments, but it will be understood that “some embodiments” may be the same subset or different subsets of all possible embodiments and may be combined with each other without conflict.

[0027] In the following description, the terms "first\second" involved are merely used to distinguish similar objects and do not represent a specific ordering of the objects. It can be understood that "first\second" can be interchanged with a specific order or sequence where permitted, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein are only for the purpose of describing the embodiments of this application and are not intended to limit this application.

[0029] The technical solution of the present application is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0030] Figure 1 The schematic diagram of the structure of the display module of the present application is shown in FIG. Figure 1 .

[0031] Figure 2 The schematic diagram of the structure of the display module of the present application is shown in FIG. Figure 2 .

[0032] refer to Figure 1 and Figure 2 The display module of the embodiment of the present application includes: a display unit 1, including a display function area 11 and a non-display function area 12; the non-display function area 12 includes a circuit layer, the circuit layer includes a first area 121 and a second area 122, and the first area 121 and the second area 122 are arranged at intervals on the circuit layer; the circuit layer can undergo structural bending deformation when an external force reaches a preset external force threshold; a control unit 2, connected to the display unit 1 through a circuit; the circuit is arranged in the second area 122 of the circuit layer; a detection unit 3, arranged in the first area 121 of the circuit layer, connected to the control unit 2, and used to detect the connection status of the circuit.

[0033] In some embodiments, the display unit 1 may include a display screen and related display components. The display unit 1 may include a liquid crystal display (LCD, Liquid Crystal Display) and an organic light-emitting diode (OLED, Organic Light-Emitting Diode). The display unit 1 may also include other display screens, which are not limited in the embodiments of the present application. The display function area 11 can be used to display images, videos or other visual information. The display function area 11 may include a touch layer, a display layer and a circuit layer. The display function area 11 may also include other components, and the embodiments of the present application do not limit the specific components included in the display function area 11. The non-display function area 12 may include an area other than the display function area 11 in the display unit 1. The non-display function area 12 generally includes circuits, connectors and other electronic components. The non-display function area 12 may also include other components, and the embodiments of the present application do not limit the specific components included in the non-display function area 12. The non-display function area 12 may be used to support input operations for the display function area 11. The circuit layer may include a physical carrier of an electronic circuit. The display unit 1 and the control unit 2 are connected through a circuit. The control unit 2 may be arranged on a circuit board (PCB, Printed Circuit Board). The control unit 2 may include a microcontroller, a processor, or other types of integrated circuits, and the control unit 2 may be used to process input signals, perform calculations, generate output signals, and control other electronic components. The first area 121 may be used to arrange the detection unit 3. The detection unit 3 may be used to monitor the connection state or other functions of the circuit. The second area 122 may be used to arrange the circuit between the display unit 1 and the control unit 2. The circuit may be used to transmit signals between the display unit 1 and the control unit 2. The connection state of the circuit may include: normal connection, partial disconnection, complete disconnection, and fault tendency. The fault tendency may characterize whether there is a risk of line breakage in the second area 122 of the non-display functional area 12. The connection state of the circuit may also include other connection states, which are not limited in the embodiments of the present application.

[0034] The display module of the embodiment of the present application detects the connection status of the circuit in the non-display functional area of ​​the display unit 1 through the detection unit 3, thereby realizing real-time monitoring of the circuit layer, and being able to determine whether there is a risk of breakage of the circuit in the circuit layer, thereby being able to predict the failure of the entire display module.

[0035] In some embodiments, the first region 121 of the circuit layer includes at least one edge sub-region 1211, one end of the edge sub-region 1211 is the edge of the circuit layer, and the other end of the edge sub-region 1211 is the second region 122. The edge sub-region 1211 may include: a smaller region further divided within the first region 121. The first region 121 may include one or more edge sub-regions 1211. The edge of the circuit layer may include the outer boundary of the circuit layer. For example, one end of the edge sub-region 1211 is adjacent to or connected to the edge of the circuit layer, and the other end of the edge sub-region 1211 is adjacent to or connected to the second region 122.

[0036] In some embodiments, the first area 121 of the circuit layer also includes at least one central sub-area, and both ends of the central sub-area are second areas 122. The detection unit 3 may include a detection circuit 31 and a detection component 32. The detection component 32 may be arranged at any position of the central sub-area, and one end of the detection circuit 31 is connected to the control unit 2, and the other end is connected to the detection component 32, which is used to detect whether a break occurs in the middle of the circuit layer, and then infer the risk of a break failure in the second area 122 located in the middle of the circuit.

[0037] The display module of the embodiment of the present application is designed with an edge sub-area 1211 in the first area 121 of the circuit layer, and the detection unit 3 can be arranged near the outer boundary of the circuit layer. The applicant has found that the fracture failure of the circuit layer often occurs at both ends of the non-display functional area 12, and the trajectory of the circuit layer fracture extends from the outermost edge to the center of the circuit layer. Therefore, it is designed to arrange the detection unit in the edge sub-area 1211, so that the detection unit 3 is closer to the edge of the circuit layer, and the detection unit 3 is closer to the potential stress concentration area, which improves the early prediction ability of the detection unit 3 for potential damage to the circuit layer, and improves the sensitivity and accuracy of fault detection.

[0038] In some embodiments, the detection unit 3 includes a detection circuit 31 and a detection component 32; the detection component 32 is arranged in the edge sub-area 1211, and the distance between the detection component 32 and the edge of the circuit layer is less than the distance between the circuit and the edge of the circuit layer; one end of the detection circuit 31 is connected to the control unit 2, and the other end is connected to the detection component 32. Among them, the detection component 32 may include components such as sensors, conductive elements and strain gauges. The detection component 32 may also include other detection components, which are not limited in the embodiments of the present application. The detection component 32 can be used to monitor the connection status of the circuit. The detection circuit 31 may include a circuit part in the detection unit 3. The detection circuit 31 can be used to receive the detection information sent by the detection component 32, and transmit the detection information to the control unit 2 for further processing.

[0039] The display module of the embodiment of the present application arranges the detection component 32 in the edge sub-region 1211 so as to keep a small distance from the edge of the circuit layer. The detection component 32 is closer to the edge of the circuit layer than the circuit, thereby improving the sensitivity and accuracy of fault detection. At the same time, the detection circuit 31 is connected to the control unit 2 to realize real-time monitoring of the circuit layer.

[0040] In some embodiments, the detection component 32 includes a conductive element 321, which can be set at any position of the edge sub-region 1211; the distance between the conductive element 321 and the edge of the circuit layer is less than or equal to the distance between the conductive element 321 and the circuit, so that the display unit 1 meets the set display conditions. Among them, the conductive element 321 can be connected in series with the detection circuit 31. The conductive element may include: conductive elements such as wires, resistors, conductive glue and metal connections. The set display conditions may include: in order to meet the display performance or display quality requirements of the display unit 1, the standard set for the element layout of the conductive element 321. Reducing the distance between the conductive element 321 and the edge of the circuit layer can improve the display performance and display quality of the display unit 1 and meet higher display conditions. For example, the detection component 32 is composed of a conductive element 321, the distance between the conductive element 321 and the edge of the circuit layer is less than or equal to the distance between the conductive element 321 and the circuit, and the conductive element 321 is set in the edge sub-region 1211. The conductive element 321 is connected in series with the detection circuit 31. The detection unit 3 can generate detection information according to the current corresponding to the conductive element 321 in the detection circuit 31 .

[0041] The display module of the embodiment of the present application arranges the conductive element 321 in the edge sub-region 1211 so as to keep a small distance from the edge of the circuit layer. The conductive element 321 is closer to the edge of the circuit layer. When a fracture fault occurs, the conductive element 321 will break before the circuit, which can meet the display performance or display quality requirements of the display unit 1 and improve the sensitivity and accuracy of fault detection. At the same time, the detection circuit 31 is connected to the control unit 2, and the current change information of the detection circuit 31 is used to realize real-time monitoring of the circuit in the circuit layer.

[0042] In some embodiments, the detection component 32 includes a plurality of conductive elements 321; the plurality of conductive elements 321 are arranged in the edge sub-region 1211 with a gradually decreasing height along a first direction; the first direction represents the direction from the edge of the circuit layer to the circuit. Among them, the heights of the plurality of conductive elements 321 are different, and the first direction may include: the direction in which the conductive elements 321 are arranged in the edge sub-region 1211. The gradually decreasing height may include: the conductive elements 321 are arranged in sequence in the first direction, and the height of each conductive element 321 gradually decreases. For example, the detection component 32 is composed of four conductive elements 321, and the four conductive elements 321 are arranged in the edge sub-region 1211 with a gradually decreasing height along the direction from the edge of the circuit layer to the circuit. Each conductive element 321 is connected to the detection circuit 31. The detection unit 3 can generate detection information according to the current corresponding to each conductive element 321 in the detection circuit 31.

[0043] The display module of the embodiment of the present application arranges multiple conductive elements 321 in the edge sub-region 1211, so that the multiple conductive elements 321 are arranged in a step-by-step decreasing height from the edge of the circuit layer to the circuit. According to the positions of the multiple conductive elements 321 and the current change information of the detection circuit 31, the trajectory of the circuit layer fracture can be predicted, and the predicted fault location is more accurate, which improves the sensitivity and accuracy of fault detection. At the same time, the detection circuit 31 is connected to the control unit 2, and the current change of the detection circuit 31 is used to achieve a more detailed hierarchical monitoring of the circuit layer, and the display module can perform fault detection before leaving the factory, ensuring the normal connection state and structural integrity of the circuit of the display module.

[0044] Figure 3 A schematic diagram of the structure of an electronic device according to an embodiment of the present application is shown.

[0045] refer to Figure 3 The electronic device of the embodiment of the present application includes a display module and a shell 4: the display module includes a display unit 1 and a control unit 2; the display unit 1 includes a display function area 11 and a non-display function area 12, the control unit 2 is arranged on the back side of the display function area 11, and the non-display function area 12 is arranged at the bottom of the display function area 11, and the non-display function area 12 is connected to the control unit 2 in a structural bending deformation state; the non-display function area 12 includes a circuit layer, and the circuit layer includes a first area 121 and a second area 122; the display module also includes a detection unit 3, the detection unit 3 is arranged in the first area 121 of the circuit layer, and is connected to the control unit 2, and is used to detect the connection state of the circuit arranged in the second area 122; the shell 4 is used to accommodate the display module, and the display surface of the display function area 11 is opposite to the inner side of the shell 4.

[0046] In some embodiments, the non-display functional area 12 includes a circuit layer, and the circuit layer can be structurally bent and deformed when subjected to an external force reaching a preset external force threshold. In the structural bending and deformation state, the non-display functional area 12 can also maintain performance. The preset external force threshold may include a threshold value of the maximum external force that the non-display functional area 12 can withstand without being damaged. The circuit layer can be made of a flexible material, and the flexible material can maintain performance when the circuit layer is bent. The back side of the display functional area 11 may include: the opposite side of the display functional area 11 facing the user when the electronic device is normally used. The housing 4 can be used to support and protect the display module, and the display surface of the display functional area 11 is located opposite to the inner side of the housing 4, that is, the side that the user faces when the electronic device is normally used, so as to directly view the display content in the display functional area 11. The non-display functional area 12 is arranged at the bottom of the display functional area 11, which may include: in the vertical layout of the display module, the non-display functional area 12 is arranged in the lower area relative to the display functional area 11.

[0047] The electronic device of the embodiment of the present application integrates the structure of the display module and the housing 4, and detects the connection status of the circuit in the non-display functional area of ​​the display unit 1 through the connection between the control unit 2 and the detection unit 3, thereby realizing real-time monitoring of the circuit layer, and being able to determine whether there is a risk of a circuit breakage in the circuit layer, and thus being able to predict the failure of the display module in the electronic device. There is no need to separate the housing 4 and the display module during the fault detection process, thereby improving the efficiency of fault detection.

[0048] In some embodiments, the electronic device further includes a mainboard 5, which is arranged on the back side of the display function area 11 and accommodated inside the housing 4; the mainboard 5 is connected to the control unit 2, and the detection unit 3 is connected to the mainboard 5 through the control unit 2, and the connection state of the circuit is detected by the mainboard 5. Among them, the mainboard may include core components such as a processor, a memory, and an input / output port. The mainboard may also include other components, which are not limited in the embodiments of the present application. The mainboard can be used to control electronic equipment and transmit data. The detection information sent by the detection unit 3 can be first sent to the control unit 2, and then forwarded to the mainboard 5 by the control unit 2. The connection state of the circuit may include: normal connection, partial disconnection, complete disconnection and fault tendency. The fault tendency can characterize whether there is a risk of line breakage in the second area 122 of the non-display function area 12. The connection state of the circuit may also include other connection states, which are not limited in the embodiments of the present application.

[0049] The electronic device of the embodiment of the present application integrates the structure of the display module and the housing 4, and detects the connection status of the circuit of the non-display functional area of ​​the display unit 1 through the connection between the control unit 2 and the detection unit 3, and sends the target detection information to the main board 5 of the electronic device. The main board 5 can realize real-time monitoring of the circuit layer, and can determine whether there is a risk of fracture of the circuit in the circuit layer, and then predict the failure of the display module in the electronic device. There is no need to separate the housing 4 and the display module during the fault detection process, which improves the efficiency of fault detection. Users can perform self-tests when using electronic devices, which improves the user experience.

[0050] The processing flow in the fault detection method provided in the embodiment of the present application is described.

[0051] See also Figure 4 , Figure 4 This is a schematic diagram of the processing flow of the fault detection method provided in the embodiment of the present application. Figure 1 , will combine Figure 4 Steps S1001-S1003 are shown for explanation.

[0052] Step S1001, obtaining target detection information sent by a detection unit of a display module.

[0053] Step S1002: determining the connection state of the circuit between the control unit of the display module and the display unit based on the target detection information.

[0054] Step S1003: if the connection status characterization circuit has a fault tendency, a display control instruction is generated and sent to the control unit, so that the control unit controls the display unit to display the detection result based on the display control instruction.

[0055] In some embodiments, the fault detection method can be applied to electronic devices, and the mainboard 5 can obtain the position information of the conductive element 321 included in the detection unit 3. The target detection information sent by the detection unit 3 can be first sent to the control unit 2, and then forwarded to the mainboard 5 by the control unit 2. The target detection information can be used to characterize the current state of the detection circuit 31. The current state of the detection circuit 31 may include: state information such as voltage, current and temperature. The current state of the detection circuit 31 may also include other state information, which is not limited in the embodiment of the present application. The connection state of the circuit between the control unit 2 of the display module and the display unit 1 may include normal connection, partial disconnection, complete disconnection and fault tendency. The fault tendency can characterize whether there is a risk of line breakage in the second area 122 of the non-display functional area 12. The connection state of the circuit may also include other connection states, which are not limited in the embodiment of the present application. The display control instruction may include: an instruction generated by the mainboard 5 according to the detected connection state of the circuit. The display control instruction can be used to control the control unit 2 to adjust the display content of the display unit 1. The detection result may include detection results such as the degree of circuit performance degradation, the connection state of the circuit and the predicted remaining life. The detection result may also include other detection results, which are not limited in the embodiment of the present application.

[0056] In some embodiments, the fault detection method can be applied to the control unit 2 of the display module, including: the control unit 2 obtains the target detection information sent by the detection unit 3 of the display module, the control unit 2 determines the connection status of the circuit between the control unit 2 and the display unit 1 based on the target detection information, if the connection status indicates that the circuit has a fault tendency, a display control instruction is generated and based on the display control instruction, the display unit 1 is controlled to display the detection result.

[0057] The fault detection method of the embodiment of the present application can realize dynamic monitoring of the circuit state by real-time analysis of target detection information, and can determine whether there is a risk of fracture in the circuit layer, and thus can predict the failure of the entire display module. If a fracture occurs, the detection result can be displayed in time, and no manual detection is required during the fault detection process, thereby improving the efficiency of fault detection.

[0058] Figure 5 This is a schematic diagram of the processing flow of the fault detection method provided in the embodiment of the present application. Figure 2 ,like Figure 5 As shown, the step S1002 of determining the connection state of the circuit between the control unit of the display module and the display unit based on the target detection information includes:

[0059] Step S1101, obtaining position information of a conductive element included in a detection unit.

[0060] Step S1102: determining current change information of a detection circuit included in the detection unit based on the target detection information.

[0061] Step S1103, determining the connection state of the circuit based on the position information of the conductive element and the current change information.

[0062] In some embodiments, the mainboard 5 can obtain the position information of the conductive element 321 included in the detection unit 3. The position information may include: the specific position of the conductive element 321 in the first area 121. The current change information may include: the change of the current size in the detection circuit 31 within a set time. The current change information may specifically include change information such as the increase, decrease and fluctuation of the current. The current change information may also include other change information, which is not limited in the embodiments of the present application.

[0063] As an example, the mainboard 5 obtains the specific position of the conductive element 321 included in the detection unit 3 in the first area 121. Based on the received target detection information sent by the control unit 2, the mainboard 5 determines that the current change information of the detection circuit 31 included in the detection unit 3 is changed from normal current to zero current at the first moment. Based on the specific position and the current change information, it is determined that the connection state of the circuit is that the circuit has a tendency to fail. For example, the circuit layer includes an edge sub-area 1211 close to the left edge of the circuit layer and an edge sub-area 1211 close to the right edge of the circuit layer. The conductive element 321 is arranged in the edge sub-area 1211 close to the left edge of the circuit layer. The current change information of the detection circuit 31 corresponding to the conductive element 321 is that the normal current changes to zero current at the first moment. According to the specific position of the conductive element 321, it is determined that a fracture fault occurs in the edge sub-area 1211 on the left edge of the circuit layer, and it is determined that the connection state of the circuit corresponding to the edge sub-area 1211 close to the left edge of the circuit layer is that the circuit has a tendency to fail.

[0064] The fault detection method of the embodiment of the present application realizes accurate judgment of the connection state of the circuit by acquiring the position information of the conductive element 321 and the current change information of the detection circuit 31, thereby improving the sensitivity and accuracy of fault detection. At the same time, by detecting the current change information of the detection circuit 31, real-time monitoring of the circuit in the circuit layer is realized.

[0065] Figure 6 This is a schematic diagram of the processing flow of the fault detection method provided in the embodiment of the present application. Figure 3 ,like Figure 6 As shown, the step S1002 of determining the connection state of the circuit between the control unit of the display module and the display unit based on the target detection information includes:

[0066] Step S1201, obtaining position information of a plurality of conductive elements included in a detection unit.

[0067] Step S1202: determining current change information of multiple detection circuits corresponding to multiple conductive elements based on the target detection information.

[0068] Step S1203: determining, based on the current change information, a target conductive element corresponding to the target detection circuit where the current change occurs.

[0069] Step S1204: determining the connection state of the circuit based on the position information of the target conductive element.

[0070] In some embodiments, the mainboard 5 can obtain the position information of the multiple conductive elements 321 included in the detection unit 3. The position information may include: multiple specific positions of the multiple conductive elements 321 in the first area 121. The current change information may include: the change of the current size in the multiple detection circuits 31 corresponding to the multiple conductive elements 321 within a set time. The current change information may specifically include change information such as the increase, decrease and fluctuation of the current. The current change information may also include other change information, which is not limited in the embodiments of the present application. The target conductive element may include: a conductive element corresponding to the target detection circuit in which the current changes.

[0071] As an example, the mainboard 5 obtains the specific positions of the four conductive elements 321 included in the detection unit 3 in the first area 121. Based on the target detection information sent by the control unit 2, the mainboard 5 determines that the current change information of the two detection circuits 31 near the edge of the circuit layer included in the detection unit 3 is changed from normal current to zero current at the first moment, and the current of the third detection circuit 31 does not change. Based on the current change information, the target conductive element 1 and the target conductive element 2 corresponding to the detection circuits 31 are determined. Based on multiple position information of the target conductive elements, the trajectory of the target conductive element breaking is determined. For example, the current corresponding to the target conductive element 1 and the target conductive element 2 is zero, while the current corresponding to the third conductive element is normal current. The third conductive element is close to the circuit. It can be determined that a break fault has occurred between the position corresponding to the target conductive element 2 and the position corresponding to the third conductive element, and the break fault has not yet affected the circuit. It can be determined that the trajectory of the target conductive element breaking is from the position of the target conductive element 1 to the position of the target conductive element 2, and extends to the third conductive element, and the connection state of the circuit is determined to be that the circuit has a fault tendency.

[0072] The fault detection method of the embodiment of the present application identifies the target conductive element of the specific fault according to the position of multiple conductive elements 321 and the current change information of the detection circuit 31, and determines the connection state of the circuit based on the position information of the target conductive element, so as to predict the track of the circuit layer fracture, and the predicted fault location is more accurate, thereby improving the sensitivity and accuracy of fault detection. At the same time, through the current change of the target detection circuit corresponding to the target conductive element, a more detailed hierarchical monitoring of the circuit layer is achieved.

[0073] Figure 7 An application scenario diagram of the fault detection method provided in an embodiment of the present application is shown.

[0074] refer to Figure 7 , an application scenario of the fault detection method provided in an embodiment of the present application. Applicable to fault detection of a display module. The detection unit of the display module may include a conductive element and a detection circuit. The conductive element may include a metal connection. The metal connection may be arranged in a first area 121 of a circuit layer of a non-display functional area 12 of the display module. The detection circuit may be arranged on a circuit board where a control unit 2 is located, and the detection circuit may be connected to the control unit 2. The detection circuit, the wire and the metal connection form a loop.

[0075] When the metal connection is in a normal state, the detection circuit can monitor the current, and the detection circuit can send corresponding target detection information to the control unit 2 in real time. The control unit 2 forwards the target detection information to the mainboard 5. The mainboard 5 obtains the target detection information, and based on the target detection information, determines that the connection state of the circuit between the control unit of the display module and the display unit is normal.

[0076] When the metal connection is in a broken state, the detection circuit can monitor the change in current, and the detection circuit can send the corresponding target detection information to the control unit 2 in real time. The control unit 2 forwards the target detection information to the mainboard 5. The mainboard 5 obtains the target detection information, and based on the target detection information, determines that the connection state of the circuit between the control unit of the display module and the display unit is prone to failure. The mainboard 5 generates a display control instruction and sends it to the control unit 2, so that the control unit 2 controls the display unit 1 to display the detection result based on the display control instruction.

[0077] Understandably, Figure 7 The application scenarios of the fault detection method are only some exemplary implementations in the embodiments of the present application. The application scenarios of the fault detection method in the embodiments of the present application include but are not limited to Figure 7 Application scenario of the fault detection method shown.

[0078] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps recorded in this application can be executed in parallel, sequentially or in different orders, as long as the expected results of the technical solution disclosed in this application can be achieved, and this document is not limited here.

[0079] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0080] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A display module, include: The display unit comprises a display function area and a non-display function area; the non-display function area comprises a circuit layer, the circuit layer comprises a first area and a second area, the first area and the second area are arranged at intervals on the circuit layer; the circuit layer can undergo structural bending deformation when an external force reaches a preset external force threshold; A control unit connected to the display unit via a circuit; the circuit is arranged in the second area of ​​the circuit layer; The detection unit is arranged in the first area of ​​the circuit layer, connected to the control unit, and is used to detect the connection state of the circuit. 2 . The display module according to claim 1 , wherein the first region of the circuit layer comprises at least one edge sub-region, one end of the edge sub-region is an edge of the circuit layer, and the other end of the edge sub-region is the second region.

3. The display module according to claim 2, wherein the detection unit comprises a detection circuit and a detection component; the detection component is arranged in the edge sub-region, and the distance between the detection component and the edge of the circuit layer is smaller than the distance between the circuit and the edge of the circuit layer; One end of the detection circuit is connected to the control unit, and the other end is connected to the detection component.

4. The display module according to claim 3, wherein the detection component comprises a conductive element, and the conductive element can be arranged at any position of the edge sub-region; The distance between the conductive element and the edge of the circuit layer is less than or equal to the distance between the conductive element and the circuit, so that the display unit meets the set display conditions.

5. The display module according to claim 3, wherein the detection component comprises a plurality of conductive elements; The plurality of conductive elements are arranged in the edge sub-region along a first direction with gradually decreasing heights; The first direction represents a direction from an edge of a circuit layer to the circuit.

6. An electronic device, comprising a display module and a housing: The display module includes a display unit and a control unit; the display unit includes a display function area and a non-display function area, the control unit is arranged on the back side of the display function area, the non-display function area is arranged at the bottom end of the display function area, and the non-display function area is connected to the control unit in a structural bending deformation state; the non-display function area includes a circuit layer, and the circuit layer includes a first area and a second area; The display module further includes a detection unit, which is arranged in the first area of ​​the circuit layer and connected to the control unit, and is used to detect the connection state of the circuit arranged in the second area; The shell is used to accommodate the display module, and the display surface of the display function area is opposite to the inner side of the shell.

7. The electronic device according to claim 6, further comprising a main board, wherein the main board is arranged on the back side of the display function area and is accommodated inside the housing; The main board is connected to the control unit, the detection unit is connected to the main board through the control unit, and the connection state of the circuit is detected through the main board.

8. A fault detection method, include: Obtaining target detection information sent by a detection unit of a display module; Based on the target detection information, determining a connection state of a circuit between a control unit of the display module and a display unit; If the connection status indicates that the circuit has a tendency to fail, a display control instruction is generated and sent to the control unit, so that the control unit controls the display unit to display the detection result based on the display control instruction.

9. The method according to claim 8, wherein determining the connection state of the circuit between the control unit of the display module and the display unit, include: Obtaining position information of a conductive element included in the detection unit; Based on the target detection information, determining current change information of the detection circuit included in the detection unit; Based on the position information of the conductive element and the current variation information, a connection state of the circuit is determined.

10. The method according to claim 8, wherein determining the connection state of the circuit between the control unit of the display module and the display unit, include: Obtaining position information of a plurality of conductive elements included in the detection unit; Based on the target detection information, determining current change information of a plurality of detection circuits corresponding to the plurality of conductive elements; Based on the current change information, determining a target conductive element corresponding to a target detection circuit in which the current change occurs; Based on the position information of the target conductive element, a connection state of the circuit is determined.