Radio frequency chip packaging body wiring structure
By using the design of line separation integrated block and transition conductor in the RF chip package, the problem of short circuit in the elongated wire during glue injection is solved, and the safety and flexibility of the packaging is improved, ensuring the efficiency of the RF chip connect.
Patent Information
- Application Number
- CN202411184598.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-27
- Publication Date
- 2024-12-10
AI Technical Summary
The slender and dense wires of existing RF chips are easily bent by the glue during glue injection, resulting in the risk of overlap short circuits, especially in multi-chip areas.
Design a radio frequency chip package wiring structure, using line separation integrated blocks and transition conductors, forming partition grooves and barriers through etching, limiting the path of the conductors, avoiding short circuits, and setting transition conductors on the partition path to replace the intermediate section of the conductors. Ensure the security of the packaging process.
It effectively avoids the risk of short circuit caused by bending during the glue injection process, ensures the smooth progress of the packaging, and allows the nearest connection and long-distance connection of the associated chip, while providing flexible welding positions of the wires.
Smart Images
Figure CN119108353A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a radio frequency chip package wiring structure, belonging to the technical field of chip wiring. Background Art
[0002] There are many connecting wires between the chip and the wires in the substrate or between the chip and the peripheral pins. One of the purposes of chip packaging is to solidify all the connecting wires by injection glue to spatially position all the wires and insulate them from each other.
[0003] Existing RF chips have too many pins, and need to be connected to the chip with a lot of long wires to complete the electrical signal connection from the chip to the pins. The chip wires are connected by welding, but because the pads (PADs) are small, thin wires need to be connected.
[0004] In this way, the entire wire bonding area has thin, long, dense and even staggered wires. In this case, it is very easy to bend the wires during glue injection, causing the risk of overlapping short circuits. Especially when multiple chips are in the same area, the risk of overlapping short circuits is even greater. Summary of the invention
[0005] The technical problem to be solved by the present invention is: how to prevent dense and slender wires in the bonding area from being bent by glue during the glue injection process and causing overlapping and short circuiting.
[0006] In view of the above problems, the technical solution proposed by the present invention is: A radio frequency chip package wiring structure is provided with a line separation integrated block between the radio frequency chip lead-out point area and the pin arrangement area. The line separation integrated block is arranged to set a plurality of mutually insulated separation paths, and the leads from the radio frequency chip to the pins each pass through a separation path.
[0007] The separation path is a separation groove formed by etching on the circuit separation integrated block.
[0008] A transition conductor is provided in the separation groove. The transition conductor is formed by cooling the molten copper injected into the separation groove. The upper surface of the transition conductor exposed from the notch of the separation groove is an exposed welding surface. The lead is divided into two sections, one section connects the RF chip and the transition conductor by welding, and the other section connects the transition conductor and the pin by welding. One end of the lead connecting the transition conductor and the pin can be welded at any position of the transition conductor.
[0009] A blocking piece is arranged at the notch of the separation groove, and the middle section of the lead wire is located in and restricted by the blocking piece in the separation groove.
[0010] The blocking member is elastic baffle plate 1 and baffle plate 2 which are arranged horizontally facing each other. One end of baffle plate 1 and one end of baffle plate 2 are respectively fixed on the groove walls on both sides of the dividing groove. When baffle plate 1 and baffle plate 2 are bent downward, the lead can enter the dividing groove in a horizontal posture. When baffle plate 1 and baffle plate 2 are bent upward, the lead can be taken out of the dividing groove in a horizontal posture.
[0011] There is a distance between the first baffle and the second baffle, and the distance between the first baffle and the second baffle is smaller than the diameter of the lead wire.
[0012] The upper parts of the blocking piece 1 and the blocking piece 2 are respectively provided with a guiding inclined surface 1 and a guiding inclined surface 2, and the guiding inclined surface 1 and the guiding inclined surface 2 form a V-shaped guiding groove in the same direction as the dividing groove.
[0013] The first and second baffles are formed by etching an elastic organic sheet bonded to the circuit separation integrated block, and the V-shaped guide groove is formed by etching an organic plate bonded to the organic sheet.
[0014] There is a gap between adjacent blocking members.
[0015] A stacking area for associated chips related to the radio frequency chip is arranged in the middle area of the upper surface of the line separation integrated block. Beneficial Effects
[0016] 1. For the thin and densely laid leads with fixed ends, the middle section is restricted by the separation path in the line separation integrated block, so that it will not be bent and short-circuited with other lines, which is conducive to the smooth injection packaging in the later stage; 2. The associated chip of the main chip can be directly set on the line separation integrated block, which is convenient for the associated chip to be connected nearby, and can also ensure that the main chip crosses the associated chip for long-distance connection, and both can be restricted by the separation path in the line separation integrated block; 3. The lead wire can enter the separation path at any position of the circuit separation integrated block or be led out from any position of the separation path as required. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 A schematic top view of the wiring structure of the radio frequency chip package according to the first embodiment; Figure 2 for Figure 1 A partial enlarged schematic diagram of Figure 3 This is a front view schematic diagram of the circuit separation integrated block described in Example 1, in which only the separation groove is shown; Figure 4 It is a three-dimensional schematic diagram of the circuit separation integrated block described in Example 1; Figure 5 It is a three-dimensional schematic diagram of the wiring structure of the radio frequency chip package according to the second embodiment; Figure 6 for Figure 5 A partial enlarged schematic diagram, in which lead A is a lead located in the separation groove and extends from the end of the separation groove, and lead B is a lead located in the separation groove and extends from between two adjacent blocking members at the notch of the separation groove; Figure 7 A three-dimensional schematic diagram of the wiring structure of the RF chip and the associated chip package according to Example 2; Figure 8 It is a partial schematic diagram of the three-dimensional schematic diagram of the circuit separation integrated block described in Example 3; Fig. 9 This is a partial schematic diagram of the cross-sectional schematic diagram of the circuit separation integrated block described in Example 3.
[0018] In the figure: 1. circuit separation integrated block; 101. separation groove; 102. groove wall; 103. stacking area; 2. transition conductor; 201. welding surface; 3. lead; 4. pin; 5. blocking member; 501. baffle plate 1; 502. baffle plate 2; 503. spacing; 6. V-shaped guide groove; 601. guide slope 1; 602. guide slope 2; 7. RF chip; 8. associated chip. DETAILED DESCRIPTION
[0019] The present invention will be further described below in conjunction with embodiments and drawings: Embodiment 1
[0020] like Figure 1 —3 shows a wiring structure of a radio frequency chip package. A line separation integrated block 1 is provided between the line outlet area of the radio frequency chip 7 and the pin 4 arrangement area. The line separation integrated block 1 is provided with a plurality of mutually insulated separation paths. The lead 3 from the radio frequency chip 7 to the pin 4 passes through a separation path respectively. For the slender lead 3, when one end is welded and fixed to the line outlet point of the radio frequency chip 7 and the other end is fixed to the pin 4, the part that is most easily bent by the glue when the glue is used for packaging is the middle section. When the middle section passes through the separation path, it is restricted by the separation path so that it will not be bent and contact with other lines to cause a short circuit, which is conducive to the smooth glue injection packaging in the later stage.
[0021] The separation path is a separation groove 101 formed by etching on the circuit separation integrated block 1 .
[0022] A transition conductor 2 is provided in the separation groove 101. The transition conductor 2 is formed by cooling the molten copper injected into the separation groove 101. The upper surface of the transition conductor 2 leaking from the notch of the separation groove 101 is an exposed welding surface 201. The lead 3 is divided into two sections, one section connects the RF chip 7 and the transition conductor 2 by welding, and the other section connects the transition conductor 2 and the pin 4 by welding. In this way, the middle section of the lead 3 is replaced by the transition conductor 2, and the transition conductor 2 is separated by insulation, so that the short circuit will not occur during packaging.
[0023] One end of the lead wire connected between the transition conductor 2 and the pin 4 can be welded at any position of the transition conductor 2 .
[0024] like Figure 4 As described above, a stacking area 103 of the associated chip 8 related to the RF chip 7 is provided in the middle area of the upper surface of the line separation integrated block 1. In this way, the RF chip 7 can safely cross the associated chip 8 and connect to the pin 4 at a distance, and the associated chip 8 can select the transition conductor 2 nearby on the line separation integrated block 1 or connect to the RF chip 7 or the pin 4. Embodiment 2
[0025] like Figure 5 As shown in FIG. 7 , the difference from the first embodiment is that a blocking member 5 is provided at the notch of the separation groove 101, and the middle section of the lead 3 is located in and restricted by the blocking member 5 in the separation groove 101, thereby eliminating the need to provide a transition conductor 2 in the separation groove 101.
[0026] Preferably, the blocking member 5 is an elastic blocking piece 1 501 and a blocking piece 2 502 which are arranged horizontally facing each other. One end of the blocking piece 1 501 and one end of the blocking piece 2 502 are respectively fixed to the groove walls 102 on both sides of the separation groove 101. When the blocking piece 1 501 and the blocking piece 2 502 are bent downward (see FIG. Fig. 9 ), the lead 3 can enter the partition groove 101 in a horizontal posture, and when the baffle 1 501 and the baffle 2 502 are bent upward, the lead 3 can be taken out of the partition groove 101 in a horizontal posture. In this way, the lead 3 can be directly pressed downward into the partition groove 101 in a horizontal posture. When pressed downward, the baffle 1 501 and the baffle 2 502 are bent downward. When the lead 3 is pressed downward into the partition groove 101 in a horizontal posture, the baffle 1 501 and the baffle 2 502 rebound, and the lead 3 cannot jump out of the partition groove 101 by itself and is restricted.
[0027] Furthermore, there is a gap 503 between the first baffle 501 and the second baffle 502 , and the gap between the first baffle 501 and the second baffle 502 is smaller than the diameter of the lead 3 , so that it is very easy to press the lead 3 into the separation groove 101 .
[0028] The first baffle 501 and the second baffle 502 are formed by etching an elastic organic sheet bonded to the circuit separation integrated block 1 .
[0029] There is a spacing between adjacent blocking members 5 , so that the lead wire 3 can be led out from between any two blocking members 5 as needed. Embodiment 3
[0030] like Figure 8 , 9 As shown, the difference from the second embodiment is that the first baffle 501 and the second baffle 502 are provided with a first guiding slope 601 and a second guiding slope 602 above them respectively, and the first guiding slope 601 and the second guiding slope 602 form a V-shaped guiding groove 6 in the same direction as the separation groove 101. In this way, it is more convenient to press the lead 3 downward from the V-shaped guiding groove 6 into the separation groove 101 in a horizontal posture.
[0031] Here, pressing the lead 3 downward from the V-shaped guide groove 6 into the separation groove 101 in a horizontal posture means pressing the entire middle portion of the lead 3 downward into the separation groove 101 in a horizontal posture or a posture close to a horizontal posture.
[0032] The V-shaped guide groove 6 is formed by etching the organic plate pasted on the organic sheet.
[0033] The above embodiments are only used to more clearly describe the present invention and cannot be regarded as limiting the protection scope of the present invention. Any modifications in equivalent forms should be regarded as falling within the protection scope of the present invention.
Claims
1. A radio frequency chip package wiring structure, characterized in that: A line separation integrated block (1) is provided between the radio frequency chip (7) lead-out point area and the pin (4) arrangement area, wherein the line separation integrated block (1) is provided with a plurality of mutually insulated separation paths, and each lead (3) from the radio frequency chip (7) to the pin (4) passes through a separation path.
2. The RF chip package wiring structure according to claim 1, characterized in that: The separation path is a separation groove (101) formed by etching on the circuit separation integrated block (1).
3. The RF chip package wiring structure according to claim 2, characterized in that: A transition conductor (2) is provided in the separation groove (101), and the transition conductor (2) is formed by cooling molten copper injected into the separation groove (101). The upper surface of the transition conductor (2) exposed from the notch of the separation groove (101) is an exposed welding surface (201). The lead (3) is divided into two sections, one section connects the radio frequency chip (7) and the transition conductor (2) by welding, and the other section connects the transition conductor (2) and the pin (4) by welding. One end of the lead connecting the transition conductor (2) and the pin (4) can be welded at any position of the transition conductor (2).
4. The RF chip package wiring structure according to claim 2, characterized in that: A blocking member (5) is provided at the notch of the separation groove (101), and the middle section of the lead wire (3) is located in and restricted by the blocking member (5) within the separation groove (101).
5. The RF chip package wiring structure according to claim 4, characterized in that: The blocking member (5) is a first elastic baffle (501) and a second baffle (502) which are arranged horizontally opposite to each other. One end of the first baffle (501) and one end of the second baffle (502) are respectively fixed to the groove walls (102) on both sides of the separation groove (101). When the first baffle (501) and the second baffle (502) are bent downward, the lead wire (3) can enter the separation groove (101) in a horizontal posture. When the first baffle (501) and the second baffle (502) are bent upward, the lead wire (3) can be taken out of the separation groove (101) in a horizontal posture.
6. The RF chip package wiring structure according to claim 5, characterized in that: There is a distance between the first baffle (501) and the second baffle (502), and the distance between the first baffle (501) and the second baffle (502) is smaller than the diameter of the lead wire (3).
7. The RF chip package wiring structure according to claim 6, characterized in that: The first baffle plate (501) and the second baffle plate (502) are provided with a first guiding slope (601) and a second guiding slope (602) respectively on their upper sides, and the first guiding slope (601) and the second guiding slope (602) form a V-shaped guiding groove (6) in the same direction as the separation groove (101).
8. The RF chip package wiring structure according to claim 7, characterized in that: The first baffle (501) and the second baffle (502) are formed by etching an elastic organic sheet bonded to the circuit separation integrated block (1), and the V-shaped guide groove (6) is formed by etching an organic plate bonded to the organic sheet.
9. The RF chip package wiring structure according to claim 4, characterized in that: There is a gap between adjacent blocking members (5).
10. The RF chip package wiring structure according to any one of claims 1 to 9, characterized in that: A stacking area (103) for associated chips (8) related to the radio frequency chip (7) is provided in the middle area of the upper surface of the line separation integrated block (1).