Display panel, display device, and method for manufacturing display panel

Abstract

A display panel, a display device and a method for manufacturing a display panel, wherein the display panel includes a driving structure and a light-emitting structure, the driving structure includes a driving substrate, a retaining wall and a soldering pad, the driving substrate has a first surface, the retaining wall and the soldering pad are both arranged on the first surface, the retaining wall and the first surface jointly enclose a receiving space, and the soldering pad is received in the receiving space; the light-emitting structure includes a micro-light-emitting diode and a boss, the boss is arranged on the side of the micro-light-emitting diode, the light-emitting structure is at least partially received in the receiving space, and the micro-light-emitting diode is connected to the soldering pad; the retaining wall and / or the boss are elastic components, and the retaining wall and the boss are elastically abutted. Through the above arrangement, by elastically abutting the retaining wall and the boss, another connection point in addition to the soldering pad is provided, thereby improving the connection reliability between the light-emitting structure and the driving structure, and when the carrier substrate is removed, the light-emitting structure will not be taken away, thereby ensuring that the light-emitting structure is successfully transferred to the driving structure.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel, a display device and a method for manufacturing a display panel. Background Art

[0002] At present, the mass transfer process of micro-light-emitting diodes (Micro-LEDs) is one of the important factors restricting their large-scale mass production. There are many ways of mass transfer, such as van der Waals force, electromagnetic adsorption, fluid transfer, laser direct transfer, etc. Among them, laser direct transfer, as the simplest and most direct transfer method, is being studied by major manufacturers.

[0003] The principle of laser direct transfer is to use the high energy density of laser pulses to decompose the buffer layer and instantly destroy the bonding force between the Micro-LED chip and its substrate, thereby peeling the Micro-LED chip from the substrate. The Micro-LED chip then falls onto the target driving substrate, thus completing the laser direct transfer.

[0004] Due to the small size and weight of Micro-LED chips, they are often unable to be peeled off from the substrate by their own weight alone, resulting in transfer failure. Summary of the invention

[0005] The purpose of the present application is to provide a display panel, a display device and a method for manufacturing a display panel to solve the problem that the Micro-LED chip cannot be peeled off from the substrate.

[0006] To achieve the purpose of this application, this application provides the following technical solutions:

[0007] In a first aspect, the present application provides a display panel, comprising:

[0008] A driving structure, comprising a driving substrate, a retaining wall and a pad, wherein the driving substrate has a first surface, the retaining wall and the pad are both arranged on the first surface, the retaining wall and the first surface jointly enclose a receiving space, and the pad is received in the receiving space;

[0009] A light emitting structure, comprising a micro light emitting diode and a boss, wherein the boss is arranged on a side of the micro light emitting diode, the light emitting structure is at least partially accommodated in the accommodation space, and the micro light emitting diode is connected to the pad;

[0010] Wherein, the retaining wall and / or the boss are elastic components, and the retaining wall elastically abuts against the boss.

[0011] In one embodiment, the retaining wall includes a snap-fit ​​surface, and the snap-fit ​​surface constitutes a side wall of the receiving space;

[0012] The boss comprises a matching surface facing away from the micro light emitting diode, the clamping surface is opposite to the matching surface, and an end of the clamping surface away from the driving substrate is elastically abutted against the boss.

[0013] In one embodiment, a first angle is formed between the clamping surface and the first surface, and the first angle is an acute angle, so that the width of the receiving space gradually increases from an end away from the driving substrate to an end close to the driving substrate;

[0014] The mating surface is connected to an end of the boss close to the drive substrate, and a second angle is formed between the mating surface and the first surface. The second angle is an acute angle so that the width of the boss close to the drive substrate is smaller than the width of the end away from the drive substrate.

[0015] In one embodiment, one end of the clamping surface away from the driving substrate elastically abuts against the matching surface;

[0016] or,

[0017] The boss also includes an abutment surface facing away from the micro-light-emitting diode, the abutment surface connects an end of the mating surface away from the driving substrate and an end of the boss away from the driving substrate, the abutment surface has a third angle with the first surface, the third angle is greater than or equal to 90°, and the end of the clamping surface away from the driving substrate is elastically abutted against the abutment surface.

[0018] In one embodiment, the retaining wall includes a plurality of retaining blocks arranged relatively in a first direction and / or a second direction, and the first direction intersects with the second direction;

[0019] The boss includes a plurality of protrusions that are arranged relatively to each other in the first direction and / or the second direction, and at least part of the stoppers elastically abut against at least part of the protrusions accordingly.

[0020] In one embodiment, the micro light emitting diode includes a buffer layer, a main body and an electrode, the main body is stacked on the buffer layer, the electrode is connected to the surface of the main body facing away from the buffer layer, the electrode is connected to the pad, the buffer layer protrudes from the side of the main body, and the end of the boss away from the driving substrate is connected to the buffer layer.

[0021] In a second aspect, the present application further provides a display device, comprising a housing and a display panel according to any one of the various embodiments of the first aspect, wherein the display panel is mounted on the housing.

[0022] In a third aspect, the present application further provides a method for manufacturing a display panel, comprising:

[0023] A driving structure is provided, the driving structure comprising a driving substrate, a retaining wall and a pad, the driving substrate having a first surface, the retaining wall and the pad are both arranged on the first surface, the retaining wall and the first surface jointly enclose a receiving space, and the pad is received in the receiving space;

[0024] A light-emitting structure is formed on a carrier substrate, wherein the light-emitting structure comprises a micro light-emitting diode and a boss, wherein the micro light-emitting diode is connected to the carrier substrate, and the boss is arranged on a side of the micro light-emitting diode; the retaining wall and / or the boss is an elastic member;

[0025] Aligning the supporting substrate with the driving structure so that in the orthographic projection of the first surface, the boss partially overlaps with the retaining wall;

[0026] The supporting substrate and the driving structure are relatively moved so that the micro-LED extends into the receiving space, the boss contacts the retaining wall and the elastic member is elastically deformed;

[0027] Connecting the micro light emitting diode to the soldering pad;

[0028] The carrier substrate is peeled off.

[0029] In one embodiment, the relative movement of the carrier substrate and the driving structure comprises:

[0030] detecting a deformation amount of the elastic member;

[0031] Comparing the detected deformation amount of the elastic member with the preset deformation amount to determine whether the supporting substrate and the driving structure are accurately aligned;

[0032] If the carrier substrate and the driving structure are accurately aligned, the micro light emitting diode is connected to the pad;

[0033] If the alignment between the supporting substrate and the driving structure is not accurate, the supporting substrate and the driving structure are re-aligned.

[0034] In one embodiment, the comparison of the deformation amount of the elastic member detected with the preset deformation amount to determine whether the supporting substrate and the driving structure are accurately aligned includes:

[0035] The offset direction of the supporting substrate relative to the driving structure is determined according to the difference between the detected deformation amount of the elastic member and the preset deformation amount.

[0036] By setting a retaining wall of the driving structure and a boss of the light-emitting structure, and the retaining wall and / or the boss are elastic components, and elastic abutment between the retaining wall and the boss provides another connection point in addition to the solder pad, the connection reliability between the light-emitting structure and the driving structure is improved. When the supporting substrate is removed, the light-emitting structure will not be taken away, thereby ensuring that the light-emitting structure is successfully transferred to the driving structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0038] Figure 1 is a flow chart of a method for manufacturing a display panel according to an embodiment;

[0039] Figure 2 is a plan view of a driving structure of an embodiment and a cross-sectional view along the AA direction thereof;

[0040] Figure 3 is a plan view of a supporting substrate and a light emitting structure of an embodiment and a cross-sectional view along the BB direction thereof;

[0041] Figure 4 is a cross-sectional view of a manufacturing process of a light emitting structure of an embodiment;

[0042] Figure 5 is a cross-sectional view of an embodiment when a carrier substrate and a driving structure are aligned;

[0043] Figure 6 is a cross-sectional view of a light emitting structure and a driving structure connected in one embodiment;

[0044] Figure 7 is a cross-sectional view of a display panel of an embodiment;

[0045] Figure 8 is a cross-sectional view of a light emitting structure and a driving structure in an embodiment in which the light emitting structure and the driving structure are misaligned;

[0046] Fig. 9 is a cross-sectional view of a display panel according to another embodiment;

[0047] Fig.10 It is a schematic diagram of a display device.

[0048] Description of reference numerals:

[0049] 100-display panel, 200-housing, 1000-display device;

[0050] 10-driving structure, 11-driving substrate, 111-first surface, 12-blocking wall, 121-accommodating space, 122-clamping surface, 13-soldering pad, 131-disk body, 132-solder, 133-first soldering pad, 134-second soldering pad;

[0051] 20 - light emitting structure, 21 - micro light emitting diode, 211 - buffer layer, 212 - main body, 213 - electrode, 214 - first electrode, 215 - second electrode, 22 - boss, 221 - matching surface, 222 - abutting surface;

[0052] 30-carrying substrate;

[0053] α is the first angle, β is the second angle. DETAILED DESCRIPTION

[0054] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0055] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there can be a central component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there can be a central component at the same time.

[0056] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in this application and in the specification are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in this application includes any and all combinations of one or more of the related listed items.

[0057] In conjunction with the accompanying drawings, some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0058] Please refer to Figure 1 , an embodiment of the present application provides a method for manufacturing a display panel, including steps S10-S60.

[0059] refer to Figure 1 and Figure 2S10, provide a driving structure 10, the driving structure 10 includes a driving substrate 11, a retaining wall 12 and a pad 13, the driving substrate 11 has a first surface 111, the retaining wall 12 and the pad 13 are both arranged on the first surface 111, the retaining wall 12 and the first surface 111 jointly enclose a receiving space 121, and the pad 13 is received in the receiving space 121.

[0060] The driving substrate 11 has a driving circuit (not shown), which can be formed by stacking various layer structures of the driving substrate 11, and is not specifically limited. The pad 13 is arranged on the first surface 111 of the driving substrate 11 and connected to the driving circuit, and the driving circuit is suitable for providing an electrical signal to the pad 13. The first surface 111 can be a plane or a curved surface, and can be made into a flat display panel or a curved display panel, respectively. The embodiment of the present application takes the first surface 111 as a plane as an example for description.

[0061] The pad 13 may include a plate body 131 and solder 132. The plate body 131 is connected to the driving circuit, and the solder 132 is arranged on the surface of the plate body 131 facing away from the driving substrate 11. The plate body 131 may be manufactured at the same time as the driving substrate 11, and the solder 132 is placed on the plate body 131 when welding is required.

[0062] The pad 13 may include a first pad 133 and a second pad 134 to provide positive and negative connection positions, respectively. The structures of the first pad 133 and the second pad 134 are substantially the same and are not limited thereto.

[0063] The retaining wall 12 is disposed on the first surface 111. The retaining wall 12 can be directly manufactured on the first surface 111 by a patterning process, or can be manufactured by a patterning process first and then connected to the first surface 111, without limitation. The patterning process includes any feasible method such as exposure, development, and etching, without limitation. The retaining wall 12 and the first surface 111 enclose a receiving space 121, the side walls of the receiving space 121 are formed by the retaining wall 12, and the bottom wall of the receiving space 121 is the first surface 111. The retaining wall 12 has an opening at one end away from the driving substrate 11, and the opening is connected to the receiving space 121.

[0064] refer to Figure 1 , Figure 3 and Figure 4 S20, forming a light emitting structure 20 on a carrier substrate 30, the light emitting structure 20 comprising a micro light emitting diode 21 and a boss 22, the micro light emitting diode 21 is connected to the carrier substrate 30, and the boss 22 is arranged on the side of the micro light emitting diode 21; the retaining wall 12 and / or the boss 22 are elastic components.

[0065] The carrier substrate 30 may be a growth substrate on which the light emitting structure 20 may be grown. The carrier substrate 30 may also be a transfer substrate on which the light emitting structure 20 may be first grown and then transferred to the transfer substrate. The carrier substrate 30 may be made of sapphire, silicon carbide, etc., without limitation.

[0066] The light-emitting structure 20 is used to connect with the aforementioned solder pad 13, and is suitable for connecting with the retaining wall 12, so that the retaining wall 12 has a certain connection and fixing effect on the light-emitting structure 20, so as to avoid the light-emitting structure 20 being taken away when the supporting substrate 30 is subsequently peeled off, thereby ensuring that the light-emitting structure 20 can be smoothly separated from the supporting substrate 30 and connected to the driving substrate 11.

[0067] The size of the micro-light emitting diode 21 (i.e., Micro-LED) is extremely small, generally between 1μm-100μm, and its weight is also very small. Transferring a large number of micro-light emitting diodes 21 to the driving substrate 11 is a difficulty in the current micro-light emitting diode 21 display manufacturing technology. In the embodiment of the present application, a boss 22 is provided on the side of the micro-light emitting diode 21, and a retaining wall 12 and / or the boss 22 are provided as elastic components, so that the light-emitting structure 20 can extend into the aforementioned receiving space 121, and the retaining wall 12 and the boss 22 are elastically abutted to enhance the connection strength between the light-emitting structure 20 and the driving structure 10.

[0068] The micro-LED 21 includes a bottom surface connected to the carrier substrate 30, a top surface opposite to the carrier substrate 30, and four side surfaces connecting the bottom surface and the top surface, and the four side surfaces have two sets of two opposite side surfaces. The boss 22 is provided on at least one of the four side surfaces, for example, the boss 22 can be provided on any side surface of the micro-LED 21, or on two opposite side surfaces, or on all four side surfaces, etc., without limitation.

[0069] The entire light emitting structure 20 may be manufactured through multiple patterning processes, for example, multiple stacked layer structures of the micro-LED 21 may be manufactured through multiple patterning processes, and these layer structures form the main body 212, and the electrode 213 formed on the main body 212 may also be manufactured through a patterning process. The boss 22 is also manufactured through a patterning process, and may be manufactured simultaneously with the micro-LED 21 or after the micro-LED 21 is manufactured, without limitation.

[0070] refer to Figure 1 and Figure 5 S30, align the supporting substrate 30 and the driving structure 10 so that in the orthographic projection of the first surface 111, the boss 22 and the retaining wall 12 partially overlap.

[0071] During alignment, the carrier substrate 30 and the light emitting structure 20 thereon are moved together to be opposite to the driving structure 10, and the light emitting structure 20 is located on the side of the carrier substrate 30 facing the driving structure 10. For example, Figures 3 to 5 As shown, the carrier substrate 30 is a growth substrate. After the micro-light emitting diodes 21 and the bosses 22 are grown on the carrier substrate 30 , the carrier substrate 30 is flipped over and moved to directly above the driving structure 10 . At this time, the light emitting structure 20 is directly opposite to the receiving space 121 of the driving structure 10 .

[0072] During alignment, the electrode 213 of the micro-LED 21 and the pad 13 of the driving structure 10 should be aligned, so that the electrode 213 and the pad 13 can be connected in the subsequent step. When the electrode 213 and the pad 13 are aligned, the supporting substrate 30 and the driving structure 10 are accurately aligned.

[0073] When the supporting substrate 30 and the driving structure 10 are accurately aligned, the following conditions are satisfied: in the orthographic projection of the first surface 111, the boss 22 partially overlaps with the retaining wall 12. In other words, the width dimension of the light-emitting structure 20 is greater than the width dimension of the opening of the receiving space 121, and the width dimension refers to the dimension in the relative directions of the two opposite side surfaces of the micro-light-emitting diode 21, and the relative directions of the two opposite side surfaces of the micro-light-emitting diode 21 are roughly parallel to the first surface 111. The boss 22 is located on the outer side of the light-emitting structure 20, so that the boss 22 and the retaining wall 12 will partially overlap in the orthographic projection of the first surface 111, and when the light-emitting structure 20 is extended into the receiving space 121, the boss 22 will contact the retaining wall 12. Among them, the width dimension of the micro light emitting diode 21 is smaller than the width dimension of the opening of the receiving space 121, while the overall width dimension of the micro light emitting diode 21 and the boss 22 is larger than the width dimension of the opening of the receiving space 121. Under the condition of accurate alignment, when the light emitting structure 20 is extended into the receiving space 121, the micro light emitting diode 21 will not contact the retaining wall 12, but the boss 22 will contact the retaining wall 12.

[0074] refer to Figure 1 , Figure 5 and Figure 6 S40, the supporting substrate 30 and the driving structure 10 are relatively moved so that the micro light emitting diode 21 extends into the receiving space 121, the boss 22 contacts the retaining wall 12 and the elastic member undergoes elastic deformation.

[0075] Among them, the relative movement of the supporting substrate 30 and the driving structure 10 can be to fix the driving structure 10 and move the supporting substrate 30, or to fix the supporting substrate 30 and move the driving structure 10, or to move the driving structure 10 and the supporting substrate 30 at the same time. During the movement, the supporting substrate 30 and the driving structure 10 gradually approach each other from a relatively far distance, and after approaching to a certain distance, the boss 22 contacts the retaining wall 12. When the relative movement continues, the boss 22 and the retaining wall 12 are squeezed, so that the elastic components in the two are elastically deformed, so that at least part of the boss 22 is squeezed into the receiving space 121. Optionally, the surface of the boss 22 facing away from the micro-light-emitting diode 21 (i.e., the mating surface 221 or the abutting surface 222 in the following text) is elastically abutted by the retaining wall 12. Alternatively, the elastic abutment between the boss 22 and the retaining wall 12 can also be any other feasible manner without limitation.

[0076] Among them, the retaining wall 12 and / or the boss 22 are elastic components, and the elastic components are elastically deformed when squeezed, so that the elastic components are shifted in position due to the elastic deformation, so that the boss 22 can elastically abut against the retaining wall 12, and the retaining wall 12 can provide a connecting force to the boss 22, that is, the light-emitting structure 20 forms a connection point by elastically abutting against the retaining wall 12.

[0077] Please refer to Figure 1 and Figure 6 , S50, connect the micro light emitting diode 21 to the pad 13. Optionally, the electrode 213 of the micro light emitting diode 21 is fixed to the pad 13 by welding, specifically, the electrode 213 and the solder 132 of the pad 13 are welded by heating and melting to achieve welding. Other options, the electrode 213 of the micro light emitting diode 21 is fixed to the pad 13 by bonding with a conductive adhesive, or other connection and fixing methods can be used. In this way, the pad 13 is connected to the micro light emitting diode 21, thereby providing another connection point between the light emitting structure 20 and the driving structure 10. The connection reliability between the light emitting structure 20 and the driving structure 10 can be increased.

[0078] Please refer to Figure 1 , Figure 6 and Figure 7 , S60, peeling off the carrier substrate 30. Optionally, laser irradiation may be used to irradiate the carrier substrate 30, so that the connection between the buffer layer 211 of the light emitting structure 20 and the carrier substrate 30 is decomposed, so that the bonding force between the light emitting structure 20 and the carrier substrate 30 is instantly destroyed, so that the light emitting structure 20 and the carrier substrate 30 are peeled off, and then the carrier substrate 30 is removed. Alternatively, any other feasible method may be used to peel off the light emitting structure 20 and the carrier substrate 30, and then the carrier substrate 30 is removed.

[0079] The manufacturing method of the display panel of the embodiment of the present application is to set a retaining wall 12 of the driving structure 10 and a boss 22 on the light-emitting structure 20, and the retaining wall 12 and / or the boss 22 are elastic components. The retaining wall 12 and the boss 22 are elastically abutted against each other, thereby providing another connection point in addition to the pad 13, thereby improving the connection reliability between the light-emitting structure 20 and the driving structure 10. When the supporting substrate 30 is removed, the light-emitting structure 20 will not be taken away, thereby ensuring that the light-emitting structure 20 is successfully transferred to the driving structure 10.

[0080] The display panel 100 according to the embodiment of the present application is described in more detail below.

[0081] Please refer to Figure 7 An embodiment of the present application provides a display panel 100 , including a driving structure 10 and a light emitting structure 20 .

[0082] The driving structure 10 includes a driving substrate 11, a retaining wall 12 and a pad 13. The driving substrate 11 has a first surface 111. The retaining wall 12 and the pad 13 are both arranged on the first surface 111. The retaining wall 12 and the first surface 111 together enclose a receiving space 121. The pad 13 is received in the receiving space 121.

[0083] The light emitting structure 20 includes a micro-LED 21 and a boss 22 . The boss 22 is disposed on the side of the micro-LED 21 . The light emitting structure 20 is at least partially received in the receiving space 121 , and the micro-LED 21 is connected to the pad 13 .

[0084] The retaining wall 12 and / or the boss 22 are elastic components, and the retaining wall 12 elastically abuts against the boss 22 .

[0085] The driving substrate 11 , the retaining wall 12 , the pad 13 , the micro light emitting diode 21 , the boss 22 , etc. may all be referred to the aforementioned description and will not be elaborated in detail.

[0086] The retaining wall 12 and / or the boss 22 are elastic components, the retaining wall 12 may be a rigid component and the boss 22 may be an elastic component, or the retaining wall 12 may be an elastic component and the boss 22 may be a rigid component, or both the retaining wall 12 and the boss 22 may be elastic components, without limitation. The retaining wall 12 and the boss 22 are elastically abutted, and the elastic component will be relative to the Figure 5 The light emitting structure 20 in the middle is elastically deformed when not transferred to the driving structure 10 , and the elastic member generates elastic tension due to the elastic deformation, so that the boss 22 and the retaining wall 12 are elastically abutted.

[0087] The materials of the retaining wall 12 and the boss 22 can be selected as needed. For example, taking the retaining wall 12 as a rigid component and the boss 22 as an elastic component, the retaining wall 12 can be made of a photoresist material and the boss 22 can be made of a resin material.

[0088] Optionally, the retaining wall 12 provided on the driving substrate 11 can enclose a plurality of spaced receiving spaces 121, and adjacent receiving spaces 121 are separated by at least part of the retaining wall 12. There are a plurality of light-emitting structures 20, and at least part of the plurality of light-emitting structures 20 are received in the plurality of receiving spaces 121 in a one-to-one correspondence, and are connected to the pads 13 in the plurality of receiving spaces 121 in a one-to-one correspondence, and the bosses 22 of the light-emitting structures 20 in each receiving space 121 are elastically abutted against the corresponding retaining wall 12. Optionally, in order to prevent light from two adjacent light-emitting structures 20 from crosstalking with each other, the retaining wall 12 can be set to be a black photoresist material to play a light-shielding role.

[0089] Optionally, there are multiple retaining walls 12, which may be connected or unconnected to each other, and the multiple retaining walls 12 jointly define multiple receiving spaces 121. Optionally, there is one retaining wall 12, and multiple receiving spaces 121 are patterned on the one retaining wall 12.

[0090] The display panel 100 of the embodiment of the present application is provided with a retaining wall 12 of the driving structure 10 and a boss 22 of the light-emitting structure 20, and the retaining wall 12 and / or the boss 22 are elastic components. The retaining wall 12 and the boss 22 are elastically abutted against each other, thereby providing another connection point in addition to the pad 13, thereby improving the connection reliability between the light-emitting structure 20 and the driving structure 10. When the supporting substrate 30 is removed, the light-emitting structure 20 will not be taken away, thereby ensuring that the light-emitting structure 20 is successfully transferred to the driving structure 10.

[0091] In one embodiment, please refer to Figure 7 The retaining wall 12 includes a snap-fit ​​surface 122, which constitutes a side wall of the receiving space 121. The boss 22 includes a mating surface 221 facing away from the micro-LED 21, the snap-fit ​​surface 122 is opposite to the mating surface 221, and one end of the snap-fit ​​surface 122 away from the driving substrate 11 elastically abuts against the boss 22.

[0092] The clamping surface 122 may be a plane, a curved surface, etc., without limitation. The end of the clamping surface 122 away from the drive substrate 11 may constitute the opening of the receiving space 121 or the opening close to the receiving space 121. The mating surface 221 may also be a plane, a curved surface, etc., without limitation. The boss 22 at least partially extends into the receiving space 121, so that the mating surface 221 is opposite to the clamping surface 122. When the clamping surface 122 abuts against the boss 22, the mating surface 221 is at least partially spaced from the clamping surface 122.

[0093] The clamping surface 122 is arranged to elastically abut against the boss 22 at one end away from the driving substrate 11, and the clamping surface 122 is opposite to the matching surface 221, so that the boss 22 at least partially extends into the receiving space 121, so that the retaining wall 12 can elastically abut against the side of the boss 22 away from the micro-light-emitting diode 21, which is equivalent to the retaining wall 12 "clamping" the light-emitting structure 20 to connect and fix it, and then cooperate with the connection between the micro-light-emitting diode 21 and the solder pad 13 to provide two stable connection points, thereby ensuring the stable connection between the light-emitting structure 20 and the driving structure 10, and avoiding the light-emitting structure 20 being carried away by the supporting substrate 30 and unable to be transferred to the driving structure 10 when the display panel 100 is transferred.

[0094] Optionally, for an embodiment in which a boss 22 is provided on one of the side surfaces of the micro-light-emitting diode 21 but not on the other side surfaces, a retaining wall 12 may also be provided at the position where the boss 22 is not provided. For example, a retaining wall 12 may be provided at the other side surface of the micro-light-emitting diode 21 opposite to the side surface provided with the boss 22, and the retaining wall 12 may directly abut against the side surface of the micro-light-emitting diode 21. At the position where the boss 22 is provided, the retaining wall 12 elastically abuts against the boss 22, and a "clamping" connection is established between the light-emitting structure 20 and the retaining wall 12 through the action of elastic tension.

[0095] Optionally, for an embodiment in which two opposite sides of the micro-LED 21 are provided with bosses 22, as shown in FIG. Figure 7 As shown, the retaining wall 12 includes a plurality of blocks arranged relatively in the first direction and / or the second direction, and the first direction intersects with the second direction; the boss 22 includes a plurality of protrusions arranged relatively in the first direction and / or the second direction, and at least some of the blocks are elastically abutted against at least some of the protrusions. In this way, the two protrusions are elastically abutted against the corresponding two blocks, and a "clamping" connection can also be established between the light-emitting structure 20 and the retaining wall 12. In addition, in this way, the retaining wall 12 will not directly contact the micro-LED 21, thereby avoiding damage to the LED.

[0096] Optional, reference Figure 2 , Figure 3 and Figure 7 The protrusion can be set in a "mouth" shape, that is, bosses 22 are provided on the four sides of the micro light-emitting diode 21, and the corresponding retaining wall 12 also has corresponding four clamping surfaces 122. The four clamping surfaces 122 are elastically abutted against the bosses 22 on the four sides of the micro light-emitting diode 21. This connection method has high stability.

[0097] In one embodiment, reference Figure 7, a first angle α is formed between the clamping surface 122 and the first surface 111, and the first angle α is an acute angle, so that the width of the receiving space 121 gradually increases from the end away from the driving substrate 11 to the end close to the driving substrate 11. The mating surface 221 is connected to the end of the boss 22 close to the driving substrate 11, and a second angle β is formed between the mating surface 221 and the first surface 111, and the second angle β is an acute angle, so that the width of the end of the boss 22 close to the driving substrate 11 is smaller than the width of the end away from the driving substrate 11.

[0098] The width of the receiving space 121 and the width of the boss 22 can refer to the above description and will not be repeated here. The acute angle of the first angle α can be 60°-85°, specifically 60°, 65°, 70°, 75°, 80°, 85°, etc., so that the width difference of the retaining wall 12 at both ends close to and far from the driving substrate 11 is not too large, and the structural miniaturization requirement can be met. At the same time, after the clamping surface 122 abuts against the boss 22, due to the above angle of the first angle α, the abutting pressure of the clamping surface 122 on the boss 22 can include a larger component force toward the driving substrate 11, so that when the retaining wall 12 abuts against the boss 22, the boss 22 can be pressed downward toward the driving substrate 11, ensuring the elastic abutment effect and preventing the light-emitting structure 20 from popping out from the receiving space 121 to the outside outside the driving substrate 11 under the action of elastic tension. If the first angle α is less than 60°, and the width of the opening of the receiving space 121 meets the requirements, the width of the bottom of the receiving space 121 (i.e., the position close to the driving substrate 11) is too large. Since the bottom of the retaining wall 12 (i.e., the position close to the driving substrate 11) needs to meet the structural strength and the width cannot be too small, the width of the top of the retaining wall 12 (i.e., the position close to the opening) will be too large, which is not conducive to the miniaturization design of the retaining wall 12, causing the retaining wall 12 to occupy most of the space of the driving substrate 11, which is not conducive to reducing the spacing between the light-emitting structures 20, resulting in the inability to achieve high-definition display effects. If the first angle α is greater than 85°, the width of the receiving space 121 near the driving substrate 11 and near the opening is not much different, and the downward pressure of the clamping surface 122 on the boss 22 toward the driving substrate 11 is small or even non-existent, which may cause the light-emitting structure 20 to pop out to the outside.

[0099] The acute angle of the second angle β can be 60°-85°, specifically 60°, 65°, 70°, 75°, 80°, 85°, etc., so that at least part of the boss 22 can be extended into the receiving space 121 and can elastically abut against the retaining wall 12, and the structure is miniaturized. If the second angle β is less than 60°, while the boss 22 can be extended into the receiving space 121 and can elastically abut against the retaining wall 12, the width of the boss 22 close to the drive substrate 11 and the width of the end away from the drive substrate 11 are too different, which is not conducive to structural miniaturization. Similar to the first angle α of the retaining wall 12 being less than 60°, it will make it difficult to achieve high-definition display. If the second angle β is greater than 85°, the width difference between the end of the boss 22 close to the driving substrate 11 and the end away from the driving substrate 11 is too small, and either the width of the boss 22 is too large to extend into the receiving space 121, or after extending into the receiving space 121, it cannot elastically abut against the retaining wall 12.

[0100] In the cross-sectional view of the display panel 100 , the shape of the retaining wall 12 separating two adjacent receiving spaces 121 is substantially an inverted isosceles trapezoid, and the shape of the boss 22 is also substantially an inverted trapezoid.

[0101] Therefore, setting the first angle α and the second angle β as acute angles can meet the requirements of structural miniaturization and ensure elastic abutment between the retaining wall 12 and the boss 22, so that the elastic components in the retaining wall 12 and the boss 22 are elastically deformed to provide tension and ensure connection reliability.

[0102] In one embodiment, reference Figure 7 One end of the clamping surface 122 away from the driving substrate 11 elastically abuts against the matching surface 221 .

[0103] In combination with the above description, on the basis that the locking surface 122 and the first surface 111 have a first acute angle α, and the mating surface 221 and the first surface 111 have a second acute angle β, the locking surface 122 is set to elastically abut against the mating surface 221 directly, and there is no need to set a complicated structure of the boss 22, so that the elastic abutment between the retaining wall 12 and the boss 22 can be achieved, which is easy to achieve in terms of process.

[0104] It should be understood that the size of the micro-LED 21 itself is already at the micron or even nanometer level, and its size is tiny, while the size level of the boss 22 is smaller than that of the micro-LED 21. When the first angle α and the second angle β are both acute angles, the clamping surface 122 is directly elastically abutted against the mating surface 221, and when the micro-LED 21 is connected to the pad 13, the mating surface 221 will not slide relative to the retaining wall 12 to cause the light-emitting structure 20 to pop out of the receiving space 121.

[0105] In another embodiment, please refer to Fig. 9The boss 22 also includes a contact surface 222 facing away from the micro-light-emitting diode 21, the contact surface 222 connects the end of the mating surface 221 away from the driving substrate 11 and the end of the boss 22 away from the driving substrate 11, the contact surface 222 and the first surface 111 have a third angle greater than or equal to 90°, and the end of the clamping surface 122 away from the driving substrate 11 is elastically contacted with the contact surface 222.

[0106] In this embodiment, the mating surface 221 does not directly elastically abut against the clamping surface 122. Figure 5 , Figure 6 The mating surface 221 will only slide relative to the end of the clamping surface 122 away from the driving substrate 11 when the supporting substrate 30 is moved relative to the driving structure 10. After sliding to a certain position, the abutting surface 222 contacts and elastically abuts against the end of the clamping surface 122 away from the driving substrate 11.

[0107] The abutting surface 222 and the first surface 111 are provided with a third angle, which is greater than or equal to 90°, so that when the clamping surface 122 abuts against the abutting surface 222, the force exerted by the clamping surface 122 on the abutting surface 222 will not cause the light emitting structure 20 to pop out of the receiving space 121. Figure 7 In the embodiment shown, the clamping surface 122 is directly in elastic contact with the matching surface 221 , so that the retaining wall 12 has a better “clamping” effect on the boss 22 .

[0108] In one embodiment, reference Figure 7 The micro light emitting diode 21 includes a buffer layer 211, a main body 212 and an electrode 213. The main body 212 is stacked on the buffer layer 211. The electrode 213 is connected to the surface of the main body 212 facing away from the buffer layer 211. The electrode 213 is connected to the pad 13. The buffer layer 211 protrudes from the side of the main body 212. The end of the boss 22 away from the driving substrate 11 is connected to the buffer layer 211.

[0109] The main body 212 of the micro light emitting diode 21 includes various layer structures. Specifically, the layer structure may include an N-type semiconductor layer (not shown), a light emitting layer (not shown), a P-type semiconductor layer (not shown), etc. There may be two electrodes 213, namely a first electrode 214 connected to the N-type semiconductor layer and a second electrode 215 connected to the P-type semiconductor layer. The first electrode 214 and the second electrode 215 are connected to the first pad 133 and the second pad 134 in a one-to-one manner.

[0110] refer to Figure 4In one embodiment, taking the carrier substrate 30 as the growth substrate and the boss 22 as the elastic member as an example, when manufacturing the light emitting structure 20, a large buffer layer 211 that completely covers the carrier substrate 30 is first formed on the carrier substrate 30, and then the large buffer layer 211 is patterned to form a plurality of buffer layers 211 disposed at intervals, and then a plurality of main bodies 212 are formed on the plurality of buffer layers 211, and then electrodes 213 are formed on the main bodies 212 to obtain the micro light emitting diodes 21. Among them, the bottom surface of the main body 212 is connected to the buffer layer 211, the side surface of the main body 212 constitutes the side surface of the aforementioned micro light emitting diode 21, and the edge of the buffer layer 211 is located outside the side surface of the main body 212. Thereafter, a boss 22 is formed on the buffer layer 211, one side of the boss 22 is connected to the side of the main body 212, and one end of the boss 22 facing away from the side of the main body 212 (i.e., the aforementioned mating surface 221 or the whole of the mating surface 221 and the abutting surface 222) is connected to the side of the buffer layer 211, that is, the edge of the buffer layer 211 defines the maximum width dimension of the boss 22, which is also the initial width dimension of the boss 22 when it is not elastically deformed.

[0111] refer to Figures 5 to 7 , taking the retaining wall 12 as a rigid component and the boss 22 as an elastic component as an example, when the light emitting structure 20 is aligned with the driving structure 10 and the light emitting structure 20 is extended into the receiving space 121, the retaining wall 12 squeezes the boss 22, forcing the width of the boss 22 to be reduced and compressed, and one side of the boss 22 is always in close contact with the side of the main body 212, while the other side opposite to the main body 212 moves toward the direction of the main body 212, and the width of the buffer layer 211 remains basically unchanged. Figures 5 to 7 As shown in the figure, when the light emitting structure 20 and the driving structure 10 are installed, one edge of the boss 22 away from the main body 212 is flush with the buffer layer 211 and elastically abuts against the side of the retaining wall 12 away from the driving substrate 11, that is, the edge of the boss 22 that was originally flush with the edge of the buffer layer 211 moves to a position closer to the main body 212. In other words, since the retaining wall 12 is a rigid component, its position remains basically unchanged and it will not deform. Figure 5 As shown, when the light emitting structure 20 is not mounted on the driving structure 10, the edge of the boss 22 away from the driving substrate 11 and facing away from the main body 212 needs to overlap with the retaining wall 12 in the orthographic projection of the first surface 111, and the width d of the overlapping portion of the projection is the width of the boss 22 that is reduced by compression. In the embodiment of the present application, the width d can be 1μm-10μm, specifically 1μm, 2μm, 3μm, 4μm, 5μm, 6μm, 7μm, 8μm, 9μm, 10μm, etc., without limitation.

[0112] It should be understood that when the boss 22 is elastically deformed and compressed, the boss 22 may have different compression degrees at the two ends close to the drive substrate 11 and away from the substrate, with a lower degree of compression at the end close to the drive substrate 11 and a higher degree of compression at the end away from the drive substrate 11.

[0113] It should be understood that the boss 22 is formed on the buffer layer 211, and the buffer layer 211 has a certain adhesive force on it. At the same time, when the retaining wall 12 squeezes the boss 22, the boss 22 can move locally on the buffer layer 211 without separating.

[0114] refer to Figure 7 After the light emitting structure 20 and the driving structure 10 are correctly installed, the buffer layer 211 may partially cover the end surface of the retaining wall 12 away from the driving substrate 11 .

[0115] It should be understood that, for embodiments in which the retaining wall 12 is an elastic component and the boss 22 is a rigid component, or in which both the retaining wall 12 and the boss 22 are elastic components, the above principles can be referred to for design and will not be described in detail.

[0116] Please refer to Figure 8 When the display panel manufacturing method is used to manufacture the display panel 100, it is possible that the bearing substrate 30 and the driving structure 10 are not accurately aligned, resulting in the misalignment of the electrode 213 of the micro-light emitting diode 21 and the pad 13, thereby causing the light emitting structure 20 and the driving structure 10 to be unable to be properly installed. Based on this problem, the display panel manufacturing method of the embodiment of the present application further includes:

[0117] refer to Figure 5 and Figure 6 In the aforementioned step S40: moving the supporting substrate 30 and the driving structure 10 relative to each other, the method further includes:

[0118] Detecting the deformation of the elastic component;

[0119] Compare the detected deformation amount of the elastic member with the preset deformation amount to determine whether the supporting substrate 30 and the driving structure 10 are accurately aligned;

[0120] If the supporting substrate 30 and the driving structure 10 are aligned accurately, the micro light emitting diode 21 is connected to the pad 13;

[0121] If the alignment between the supporting substrate 30 and the driving structure 10 is not accurate, the supporting substrate 30 and the driving structure 10 are re-aligned.

[0122] Specifically, the deformation of the elastic member can be detected by any feasible method such as electrical signal detection, optical detection, ultrasonic detection, etc., without limitation. The deformation of the elastic member is the difference between the width dimension of the elastic member before elastic deformation and the width dimension after deformation.

[0123] The preset deformation of the elastic member refers to the deformation of the elastic member when the supporting substrate 30 and the driving structure 10 are accurately aligned. In the actual alignment process, the supporting substrate 30 and the driving structure 10 may not be accurately aligned, that is, the actual deformation of the elastic member is not equal to the preset deformation.

[0124] For example, the retaining wall 12 is a rigid component and the boss 22 is an elastic component. Figure 5 As shown, when the supporting substrate 30 and the driving structure 10 are accurately aligned, the preset deformation amount of the boss 22 is the width of the part of the orthographic projection of the boss 22 on the first surface 111 and the orthographic projection of the retaining wall 12 on the first surface 111, that is, the preset deformation amount of the boss 22 is d. Figure 6 As shown, after the light emitting structure 20 is extended into the receiving space 121, the actual deformation amount of the boss 22 is detected. Figure 5 If the preset deformation amounts shown are equal, it means that the alignment is accurate and step S50 can be performed.

[0125] And reference Figure 8 After the light emitting structure 20 is extended into the receiving space 121, the actual deformation amount of the boss 22 is detected. Figure 5 If the preset deformation amounts shown are not equal, it means that the alignment is inaccurate, and the supporting substrate 30 needs to be moved away from the driving structure 10, and the process returns to step S30 for re-alignment, and continues with step S40 and the above-mentioned steps of detecting the deformation amount of the elastic component and the size of the preset deformation amount, until the final alignment is accurate, and then proceeds to step S50.

[0126] It should be understood that, for embodiments in which the retaining wall 12 is an elastic component and the boss 22 is a rigid component, or in which both the retaining wall 12 and the boss 22 are elastic components, the design can be carried out with reference to the above principles and will not be described in detail.

[0127] By performing the above steps, the supporting substrate 30 and the driving structure 10 can be accurately aligned, thereby ensuring that the final light emitting structure 20 and the driving structure 10 are accurately connected.

[0128] In one embodiment, reference Figure 5 , Figure 7 and Figure 8 , comparing the detected deformation amount of the elastic member with the preset deformation amount to determine whether the supporting substrate 30 and the driving structure 10 are accurately aligned, including:

[0129] The offset direction of the supporting substrate 30 relative to the driving structure 10 is determined according to the difference between the detected deformation amount of the elastic member and the preset deformation amount.

[0130] For example, the retaining wall 12 is a rigid component, the boss 22 is an elastic component, and the bosses 22 are disposed on two opposite sides of the micro-LED 21. Figure 5 and Figure 7 As shown, the difference between the actual deformation of the boss 22 and the preset deformation is 0, which means that the supporting substrate 30 is not offset relative to the driving structure 10 and the alignment is accurate. At this time, the deformation of the two opposite sides of the micro-LED 21 is the preset deformation d. Figure 5 and Figure 8 As shown, the preset deformation amount of the two opposite sides of the micro-LED 21 is d, and one of the two sides is Figure 8 The deformation of the boss 22 on the left side of the micro-LED 21 is greater than d, and the deformation of the boss 22 on the right side is less than d, that is, the boss 22 on the left side is compressed more, and the boss 22 on the right side is compressed less. The difference between the deformation of the boss 22 on the left side and the preset deformation is greater than 0, and the difference between the deformation of the boss 22 on the right side and the preset deformation is less than 0, indicating that the supporting substrate 30 is offset to the left relative to the driving structure 10 during alignment. Therefore, when re-aligning subsequently, the supporting substrate 30 is corrected to the right by a certain distance, and the detection steps are repeated until accurate alignment is finally achieved.

[0131] Through the above steps, it is possible to determine whether the alignment is accurate and the offset direction of the supporting substrate 30 relative to the driving structure 10 during alignment, which can facilitate subsequent corrections and facilitate rapid re-alignment.

[0132] Please refer to Fig.10 The embodiment of the present application also provides a display device 1000 , including a housing 200 and a display panel 100 of any one of the aforementioned embodiments, wherein the display panel 100 is mounted on the housing 200 .

[0133] The display device 1000 may be a display screen, a handheld terminal, a television, etc., without limitation.

[0134] In the description of the embodiments of the present application, it should be noted that the orientation or positional relationship of terms such as "center", "up", "down", "left", "right", "vertical", "horizontal", "inside" and "outside" are based on the orientation or positional relationship described in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0135] What is disclosed above is only a preferred embodiment of the present application, and it certainly cannot be used to limit the scope of rights of the present application. Ordinary technicians in this field can understand that all or part of the processes of implementing the above embodiment and equivalent changes made according to the claims of the present application are still within the scope covered by the present application.

Claims

1. A display panel, characterized in that: include: A driving structure, comprising a driving substrate, a retaining wall and a pad, wherein the driving substrate has a first surface, the retaining wall and the pad are both arranged on the first surface, the retaining wall and the first surface jointly enclose a receiving space, and the pad is received in the receiving space; A light emitting structure, comprising a micro light emitting diode and a boss, wherein the boss is arranged on a side of the micro light emitting diode, the light emitting structure is at least partially accommodated in the accommodation space, and the micro light emitting diode is connected to the pad; Wherein, the retaining wall and / or the boss are elastic components, and the retaining wall elastically abuts against the boss; The retaining wall includes a clamping surface, and the clamping surface constitutes a side wall of the receiving space; The boss comprises a matching surface facing away from the micro light emitting diode, the clamping surface is opposite to the matching surface, and an end of the clamping surface away from the driving substrate is elastically abutted against the boss.

2. The display panel according to claim 1, characterized in that: A first angle is formed between the clamping surface and the first surface, and the first angle is an acute angle, so that the width of the receiving space gradually increases from an end away from the driving substrate to an end close to the driving substrate; The mating surface is connected to an end of the boss close to the drive substrate, and a second angle is formed between the mating surface and the first surface. The second angle is an acute angle so that the width of the boss close to the drive substrate is smaller than the width of the end away from the drive substrate.

3. The display panel according to claim 2, characterized in that: One end of the clamping surface away from the driving substrate elastically abuts against the matching surface; or, The boss also includes an abutment surface facing away from the micro-light-emitting diode, the abutment surface connects an end of the mating surface away from the driving substrate and an end of the boss away from the driving substrate, the abutment surface has a third angle with the first surface, the third angle is greater than or equal to 90°, and the end of the clamping surface away from the driving substrate is elastically abutted against the abutment surface.

4. The display panel according to any one of claims 1 to 3, characterized in that: The retaining wall comprises a plurality of retaining blocks arranged relatively in a first direction and / or a second direction, wherein the first direction intersects with the second direction; The boss includes a plurality of protrusions that are arranged relatively to each other in the first direction and / or the second direction, and at least part of the stoppers elastically abut against at least part of the protrusions accordingly.

5. The display panel according to any one of claims 1 to 3, characterized in that: The micro light emitting diode includes a buffer layer, a main body and an electrode, wherein the main body is stacked on the buffer layer, the electrode is connected to the surface of the main body facing away from the buffer layer, the electrode is connected to the pad, the buffer layer protrudes from the side of the main body, and the end of the boss away from the driving substrate is connected to the buffer layer.

6. A display device, characterized in that: The invention comprises a housing and a display panel as claimed in any one of claims 1 to 5, wherein the display panel is mounted on the housing.

7. A method for manufacturing a display panel, characterized in that: include: A driving structure is provided, the driving structure comprising a driving substrate, a retaining wall and a pad, the driving substrate having a first surface, the retaining wall and the pad are both arranged on the first surface, the retaining wall and the first surface jointly enclose a receiving space, and the pad is received in the receiving space; A light-emitting structure is formed on a carrier substrate, wherein the light-emitting structure comprises a micro light-emitting diode and a boss, wherein the micro light-emitting diode is connected to the carrier substrate, and the boss is arranged on a side of the micro light-emitting diode; the retaining wall and / or the boss is an elastic member; Aligning the supporting substrate with the driving structure so that in the orthographic projection of the first surface, the boss partially overlaps with the retaining wall; The carrier substrate and the driving structure are relatively moved so that the micro-LED extends into the receiving space, the boss contacts the retaining wall and the elastic member is elastically deformed; the retaining wall includes a clamping surface, and the clamping surface constitutes a side wall of the receiving space; the boss includes a mating surface facing away from the micro-LED, the clamping surface is opposite to the mating surface, and one end of the clamping surface away from the driving substrate is elastically abutted against the boss; Connecting the micro light emitting diode to the soldering pad; The carrier substrate is peeled off.

8. The method for manufacturing a display panel according to claim 7, characterized in that: The step of relatively moving the supporting substrate and the driving structure comprises: detecting a deformation amount of the elastic member; Comparing the detected deformation amount of the elastic member with the preset deformation amount to determine whether the supporting substrate and the driving structure are accurately aligned; If the carrier substrate and the driving structure are accurately aligned, the micro light emitting diode is connected to the pad; If the alignment between the supporting substrate and the driving structure is not accurate, the supporting substrate and the driving structure are re-aligned.

9. The method for manufacturing a display panel according to claim 8, characterized in that: The comparing the deformation amount of the elastic member detected with the preset deformation amount to determine whether the supporting substrate and the driving structure are accurately aligned includes: The offset direction of the supporting substrate relative to the driving structure is determined according to the difference between the detected deformation amount of the elastic member and the preset deformation amount.

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