Display module and display device

Abstract

The invention provides a display module and a display device. The display module comprises a display panel, the display panel is provided with a display area and a non-display area located on the outer side of the display area, the non-display area comprises a first binding area, and the display panel comprises a first chip; the flexible circuit board is electrically connected with the first chip in the first binding area; the first chip is electrically connected with the display area, the second chip is electrically connected with the first chip through a flexible circuit board, the flexible circuit board comprises a first side edge close to one side of the display area, and the first side edge and the display area are spaced by a first spacing distance; the flexible circuit board further comprises a first connecting part, the first connecting part is used for being electrically connected with the first chip, the first connecting part comprises a second side edge close to one side of the display area, the second side edge and the first side edge are spaced by a second spacing distance, and the second spacing distance is smaller than the first spacing distance.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] A silicon-based organic light-emitting diode display device (abbreviated as Micro OLED display device or silicon-based OLED display device) is a new type of OLED display device with a silicon substrate as the substrate. Silicon-based OLED display devices have the characteristics of small size and high resolution, and are widely used in the fields of near-eye display, virtual reality (VR) and augmented reality (AR), especially in AR / VR head-mounted display devices. Usually, a silicon-based OLED display device is provided with a binding area in the side area for connecting to the driver chip. However, if the binding area is too close to the display area, the heat generated in the binding area may have an adverse effect on the light-emitting device in the display area; if the binding area is too far from the display area, the border of the display device will be too wide, and the cost will increase.

[0003] How to achieve a narrow frame of a silicon-based OLED display device while reducing the impact of the binding area on the light-emitting device is one of the important research topics for researchers in this field.

[0004] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to those skilled in the art. Summary of the invention

[0005] In one aspect, a display module is provided, comprising:

[0006] A display panel, the display panel having a display area and a non-display area located outside the display area, the non-display area including a first binding area, and the display panel including a first chip;

[0007] a flexible circuit board, the flexible circuit board being electrically connected to the first chip in the first binding area; and

[0008] a second chip, the second chip being electrically connected to the first chip through the flexible circuit board,

[0009] Wherein, the flexible circuit board comprises a first side edge close to one side of the display area, and the first side edge is spaced apart from the display area by a first spacing distance; and

[0010] The flexible circuit board further includes a first connection portion, the first connection portion is used to be electrically connected to the first chip, the first connection portion includes a second side edge close to one side of the display area, and the second side edge is spaced apart from the first side edge by a second spacing distance.

[0011] The second spacing distance is smaller than the first spacing distance.

[0012] According to some exemplary embodiments, a sum of the first spacing distance and the second spacing distance is greater than or equal to 500 micrometers.

[0013] According to some exemplary embodiments, a ratio of the first spacing distance to the second spacing distance is in a range of 2.7-15.

[0014] According to some exemplary embodiments, the display panel includes a third side edge partially covered by the flexible circuit board, the first connecting portion includes a fourth side edge close to the third side edge, the third side edge and the fourth side edge are spaced apart by an eleventh spacing distance, and the eleventh spacing distance is substantially equal to the second spacing distance.

[0015] According to some exemplary embodiments, the first chip includes a plurality of first terminals located in the first binding area, the flexible circuit board includes a plurality of second terminals located in the first connecting portion, and the plurality of first terminals and the plurality of second terminals are connected in a one-to-one correspondence; and

[0016] The size of the second terminal is larger than the size of the corresponding first terminal.

[0017] According to some exemplary embodiments, the flexible circuit board further includes a second connection portion, the second connection portion is located on a side of the first connection portion away from the display area, and the second connection portion is electrically connected to the second chip.

[0018] According to some exemplary embodiments, the flexible circuit board also includes a fifth side away from the display area, the fifth side is spaced apart from the side of the second connecting portion close to the fifth side by a twelfth spacing distance, and the twelfth spacing distance is greater than the second spacing distance.

[0019] According to some exemplary embodiments, the flexible circuit board further includes a second connection portion, and the second connection portion is located on a side of the first connection portion away from the display area;

[0020] The display module further includes a printed circuit board, and the printed circuit board is electrically connected to the second connecting portion; and

[0021] The second chip is arranged on the printed circuit board.

[0022] According to some exemplary embodiments, the second connection portion and the second chip are spaced apart by a thirteenth spacing distance, and the thirteenth spacing distance is greater than the second spacing distance; and / or,

[0023] The printed circuit board includes a sixth side away from the display area, the sixth side is spaced apart from the second chip by a fourteenth spacing distance, and the fourteenth spacing distance is greater than the second spacing distance.

[0024] According to some exemplary embodiments, in a first direction, the first binding area includes a first area located at a first side, a second area located in the middle, and a third area located at the second side, and the first direction is parallel to the first side;

[0025] The plurality of first terminals include: a plurality of first sub-terminals located in the first region, a plurality of second sub-terminals located in the second region, and a plurality of third sub-terminals located in the third region.

[0026] Wherein, an end of at least one of the first sub-terminals close to the display area is inclined toward the third area relative to an end of the first sub-terminal away from the display area; and / or,

[0027] An end of at least one of the second sub-terminals close to the display area is not inclined relative to an end of the second sub-terminal away from the display area; and / or,

[0028] An end of at least one of the third sub-terminals close to the display area is inclined toward a direction close to the first area relative to an end of the third sub-terminal away from the display area.

[0029] According to some exemplary embodiments, in the second direction, the plurality of first terminals include M rows of first terminals, wherein a region where the first terminals in the i-th row are located and a region where the first terminals in the i+1-th row are located are spaced apart by a third spacing distance, wherein the second direction is parallel to a direction from the display area to the flexible circuit board, M is a positive integer greater than or equal to 2, and i is a positive integer greater than or equal to 1 and less than or equal to M-1;

[0030] The first binding area has a first width in the second direction, and a ratio of the third spacing distance to the first width is less than 20%.

[0031] According to some exemplary embodiments, a ratio of the third spacing distance to the second spacing distance is in the range of 0.5-4.

[0032] According to some exemplary embodiments, in the first direction, two adjacent first sub-terminals of the plurality of first sub-terminals are spaced apart by a fourth spacing distance, two adjacent second sub-terminals of the plurality of second sub-terminals are spaced apart by a fifth spacing distance, and two adjacent third sub-terminals of the plurality of third sub-terminals are spaced apart by a sixth spacing distance.

[0033] Wherein, the fourth spacing distance is substantially equal to the fifth spacing distance; and / or,

[0034] The fourth spacing distance is substantially equal to the sixth spacing distance; and / or,

[0035] The fifth spacing distance is substantially equal to the sixth spacing distance.

[0036] According to some exemplary embodiments, the second chip includes a second binding region and a plurality of third terminals located in the second binding region;

[0037] In the first direction and the second direction, the multiple third terminals include N rows and L columns of third terminals, wherein the third terminal in the j+1th row and kth column is offset along the first direction relative to the third terminal in the jth row and kth column, wherein N and L are positive integers greater than or equal to 2, j is a positive integer greater than or equal to 1 and less than or equal to N-1, and k is a positive integer greater than or equal to 1 and less than or equal to L.

[0038] According to some exemplary embodiments, the third terminal has a second width in the first direction, the third terminal has a third width in the second direction, and the second width is substantially equal to the third width.

[0039] According to some exemplary embodiments, centers of two adjacent third terminals in the same row are spaced apart by a seventh spacing distance in the first direction, and a ratio of the seventh spacing distance to the second width is greater than or equal to 2.4; and / or,

[0040] Centers of two adjacent third terminals in the same column are spaced apart by an eighth spacing distance in the second direction, and a ratio of the eighth spacing distance to the third width is greater than or equal to 2.

[0041] According to some exemplary embodiments, the second chip further includes a third binding region; in the first direction, a width of the third binding region is greater than a width of the second binding region.

[0042] According to some exemplary embodiments, the second chip includes a plurality of fourth terminals located in the third binding region, and in the second direction, the plurality of fourth terminals include P rows of fourth terminals, where P is a positive integer greater than or equal to 2;

[0043] In a first direction, the third binding area includes a fourth area located at the first side, a fifth area located in the middle, and a sixth area located at the second side, and the first direction is parallel to the first side.

[0044] Among them, in at least one column of the fourth terminals in the fourth region, the fourth terminals in the a+1th row are offset in the opposite direction of the first direction relative to the fourth terminals in the ath row; and / or,

[0045] In at least one column of the fourth terminals in the fifth region, the fourth terminals in the a+1th row are aligned with the fourth terminals in the ath row in the first direction; and / or,

[0046] In at least one column of fourth terminals in the sixth region, the fourth terminals in the a+1th row are offset along the first direction relative to the fourth terminals in the ath row, where a is a positive integer greater than or equal to 1 and less than or equal to P-1.

[0047] According to some exemplary embodiments, the fourth terminal has a fourth width in the first direction, the fourth terminal has a fifth width in the second direction, and the fourth width is substantially equal to the fifth width.

[0048] According to some exemplary embodiments, the fourth width is greater than the second width; and / or,

[0049] The fifth width is greater than the third width.

[0050] According to some exemplary embodiments, centers of two adjacent fourth terminals in the same row are spaced apart by a ninth spacing distance in the first direction, and a ratio of the ninth spacing distance to the fourth width is in a range of 2.1 to 2.5; and / or,

[0051] Centers of two adjacent fourth terminals in the same column are spaced apart by a tenth spacing distance in the second direction, and a ratio of the tenth spacing distance to the fifth width is in a range of 1.9 to 2.5.

[0052] According to some exemplary embodiments, the flexible circuit board includes a first flexible circuit layer, a second flexible circuit layer, and a first insulating layer located between the first flexible circuit layer and the second flexible circuit layer, and the first flexible circuit layer and the second flexible circuit layer are electrically connected through a plurality of first connecting traces passing through the first insulating layer.

[0053] According to some exemplary embodiments, the flexible circuit board further includes an auxiliary portion, the auxiliary portion being connected to the first connecting portion; the auxiliary portion includes a bending portion and a main portion, the bending portion being located on a side of the first connecting portion close to the display area, and the main portion being bent toward a direction close to the first connecting portion through the bending portion; and

[0054] The main body portion and the first connecting portion are connected via a first adhesive layer.

[0055] According to some exemplary embodiments, the first connecting trace is located in the main body.

[0056] According to some exemplary embodiments, the bending portion has a first bending radius, the first adhesive layer has a first thickness in a third direction, the first bending radius is greater than the first thickness, and the third direction is parallel to the light emitting direction of the display panel.

[0057] According to some exemplary embodiments, the second spacing distance is approximately equal to 0.

[0058] According to some exemplary embodiments, the flexible circuit board further includes a third connection portion, and the third connection portion is located on a side of the second connection portion away from the display area;

[0059] The display module further includes a flexible circuit board connector, and the flexible circuit board connector is electrically connected to the third connecting portion.

[0060] In another aspect, a display device is provided, comprising the display module as described in any one of the above items. BRIEF DESCRIPTION OF THE DRAWINGS

[0061] The above contents and other purposes, features and advantages of the present disclosure will become more apparent through the following description of the embodiments of the present disclosure with reference to the accompanying drawings, in which:

[0062] Figure 1 is a schematic structural diagram of a display module according to an embodiment of the present disclosure;

[0063] Figure 2 is a schematic plan view of a display panel according to an embodiment of the present disclosure;

[0064] Figure 3 is along Figure 2 Schematic diagram of a cross section taken along the midline AA';

[0065] Figure 4 is a schematic plan view of a display module according to an embodiment of the present disclosure;

[0066] Figure 5 is based on Figure 4 A local enlarged schematic diagram of the first binding region;

[0067] Figure 6 is a partial structural schematic diagram of a display module according to an embodiment of the present disclosure;

[0068] Figure 7is a partial enlarged schematic diagram of a driver chip binding area according to an embodiment of the present disclosure;

[0069] Figure 8 is a schematic plan view of a display module according to an embodiment of the present disclosure;

[0070] Fig. 9 is a partial plan view of a display module according to an embodiment of the present disclosure;

[0071] Fig.10 is a partial plan view of a display module according to an embodiment of the present disclosure, wherein a first binding area is shown;

[0072] Fig.11 is a partial plan view of a display module according to an embodiment of the present disclosure;

[0073] Fig.12 is a partial plan view of a display module according to an embodiment of the present disclosure, wherein a second binding area is shown;

[0074] Fig.13 is a partial plan view of a display module according to an embodiment of the present disclosure, wherein a third binding area is shown;

[0075] Fig.14 is a partial structural schematic diagram of a display module according to an embodiment of the present disclosure, wherein a double-layer flexible circuit board is shown;

[0076] Fig.15A and Fig. 15B is a schematic structural diagram of a display module according to an embodiment of the present disclosure;

[0077] Fig.16A and Fig. 16B is a schematic structural diagram of a display module according to an embodiment of the present disclosure; and

[0078] Fig.17 is a structural block diagram of a display device according to an embodiment of the present disclosure.

[0079] It should be noted that, for the sake of clarity, in the drawings used to describe the embodiments of the present invention, the sizes of layers, structures or regions may be enlarged or reduced, that is, these drawings are not drawn according to the actual scale. DETAILED DESCRIPTION

[0080] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0081] It should be noted that in the drawings, the size and relative size of the elements may be exaggerated for the purpose of clarity and / or description. Thus, the size and relative size of each element are not necessarily limited to the size and relative size shown in the drawings. In the specification and drawings, the same or similar reference numerals indicate the same or similar parts.

[0082] Unless otherwise defined, the technical terms or scientific terms used in this disclosure should be understood by ordinary technicians in the field. "First", "second" and similar words used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprising" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0083] In this document, unless otherwise specified, directional terms such as "upper", "lower", "left", "right", "inner", "outer", etc. are used to indicate the orientation or positional relationship based on the drawings, and are only for the convenience of describing the present disclosure, and do not indicate or imply that the device, element or component referred to must have a specific orientation, be constructed or operate in a specific orientation. It should be understood that when the absolute position of the described object changes, the relative positional relationship they represent may also change accordingly. Therefore, these directional terms should not be understood as limiting the present disclosure.

[0084] In this article, "parallel" refers to a state where the angle formed by two straight lines or two planes is greater than -10° and less than 10°, and therefore, also includes a state where the angle is greater than -5° and less than 5°. In addition, "perpendicular" refers to a state where the angle formed by two straight lines or two planes is greater than 80° and less than 100°, and therefore, also includes a state where the angle is greater than 85° and less than 95°.

[0085] As used herein, the terms "substantially," "approximately," "approximately," and other similar terms are used as terms of approximation rather than as terms of degree, and they are intended to account for the inherent deviations in measured or calculated values ​​that would be recognized by one of ordinary skill in the art. Taking into account factors such as process fluctuations, measurement problems, and errors associated with the measurement of a particular quantity (i.e., limitations of the measurement system), "approximately" or "approximately" as used herein include the stated value and mean that the particular value is within an acceptable range of deviation as determined by one of ordinary skill in the art. For example, "approximately" can mean within one or more standard deviations, or within ±10% or ±5% of the stated value.

[0086] In this document, the term "terminal" refers to the part of a chip or circuit board that is electrically connected to external leads, traces, electrodes, etc., including but not limited to the pad of the chip.

[0087] The silicon-based OLED display device is an active organic light-emitting diode display device made by combining CMOS technology and OLED technology with single-crystal silicon as an active driving backplane. The silicon-based OLED device structure includes two parts: a driving backplane and an OLED device. The driving backplane may include a first chip (also referred to as a panel chip) made by applying a standard CMOS process on a silicon substrate. The first chip may include a pixel circuit, a row and column driving circuit, and other functional circuits. In order to improve the display effect of the silicon-based OLED display device, the silicon-based OLED display device can usually be connected to a second chip, for example, the second chip may include a display driver chip (Display Driver IC, referred to as DDIC chip). The second chip may include pixel circuits, row and column driving modules, digital-to-analog conversion modules, communication modules, data processing, power supply modules and other functional modules. In response to high-resolution application requirements, the second chip may use a digital interface to complete data transmission using data sampling and comparison. Since the brightness of the OLED device varies greatly under different temperature conditions, a temperature sensing module may also be integrated in the second chip to monitor the chip operating temperature in real time, so that the chip can accurately adjust the voltage output at high and low temperatures, thereby adjusting the display brightness of the device and maintaining the stability and consistency of the device display.

[0088] When silicon-based OLED display devices are used in near-eye display devices, the fixed position of the display panel is very important for users and determines the user experience. On the one hand, the current silicon-based OLED display devices are used in AR / VR devices, and users may appear in different environments, which is crucial for the reliability and life requirements of OLED devices. On the other hand, during the production process of silicon-based OLED display devices, in order to improve the display effect, there cannot be obvious color differences on the module surface, which will cause poor display quality experience.

[0089] Exemplarily, an embodiment of the present disclosure provides a display module. The display module includes: a display panel, the display panel has a display area and a non-display area outside the display area, the non-display area includes a first binding area, and the display panel includes a first chip. The display module also includes: a flexible circuit board, the flexible circuit board is electrically connected to the first chip in the first binding area; and a second chip, the second chip is electrically connected to the first chip through the flexible circuit board. Wherein, the flexible circuit board includes a first side edge close to one side of the display area, and the first side edge is spaced apart from the display area by a first spacing distance; and the flexible circuit board also includes a first connecting portion, the first connecting portion is used to be electrically connected to the first chip; the first connecting portion includes a second side edge close to one side of the display area, and the second side edge and the first side edge are spaced apart by a second spacing distance, wherein the second spacing distance is smaller than the first spacing distance.

[0090] Through such a design, on the one hand, the chip on chip (COC) design in the display module can be realized to improve the driving effect of the display device; on the other hand, the narrow frame of the display device can be realized, which is conducive to reducing the size of a single silicon substrate and thus reducing costs.

[0091] Figure 1 is a schematic structural diagram of a display module according to an embodiment of the present disclosure, Figure 2 is a schematic plan view of a display panel according to an embodiment of the present disclosure, Figure 3 is along Figure 2 Schematic diagram of the cross section taken along the midline AA'.

[0092] For example, in the embodiments of the present disclosure, referring to Figure 1 , a display module 200 is provided. The display module 200 may include a display panel 100 and a flexible circuit board 30 electrically connected to the display panel 100. The flexible circuit board 30 may be connected to an external driving circuit (eg, a driving power supply or a driving circuit board) to drive the display panel to display.

[0093] For example, in conjunction with reference Figure 2 and Figure 3 The display panel 100 may include a substrate 11 and a cover plate 18. For example, the substrate 11 may be a silicon substrate. The display panel 100 may also include a light emitting device 20 located between the substrate 11 and the cover plate 18. The cover plate 18 has the function of realizing light emission and protecting the light emitting device 20. The light emitting device 20 may be an OLED light emitting device, which may realize a color light emitting function. The substrate 11 may be used as a substrate material for the light emitting device 20. The cover plate 18 may be a transparent material, for example, the cover plate 18 may be a plain glass with high transmittance.

[0094] Exemplarily, the display panel 100 has a display area AA and a non-display area NA located outside the display area AA. For example, the orthographic projection of the display area AA on the substrate 11 may fall within the orthographic projection of the cover plate 18 on the substrate 11. That is, the area of ​​the orthographic projection of the cover plate 18 on the substrate 11 is larger than the area of ​​the display area AA, so that the entire display area can be protected.

[0095] Exemplarily, the area of ​​the orthographic projection of the cover plate 18 on the substrate 11 is smaller than the area of ​​the substrate 11, so that the display module is positioned and fixed through the portion of the substrate 11 exposed from the cover plate 18. For example, at least a portion of the non-display area NA is not covered by the cover plate 18, and a terminal may be provided in a portion of the non-display area NA exposed from the cover plate 18 for electrical connection with other components in the display module.

[0096] Exemplarily, the light emitting device 20 may include: a first electrode 12 formed on a substrate 11, for example, the first electrode 12 may be an anode. The first electrode 12 may be formed of a material having high transmittance and high work function, for example, the material of the first electrode 12 may include ITO.

[0097] Exemplarily, the light emitting device 20 may further include: a light emitting functional layer 13 located on a side of the first electrode 12 away from the substrate 11. For example, the light emitting functional layer 13 may be made of an organic material, and the light emitting characteristics of the organic material may be utilized to excite holes and electrons under the action of voltage or current to form excitons, thereby achieving light emission.

[0098] Exemplarily, the light emitting device 20 may further include: a second electrode 14 located on a side of the light emitting functional layer 13 away from the substrate 11. For example, the second electrode 14 may be a cathode of the light emitting device 20. For example, the material of the second electrode 14 may include a combination of one or more of Mg and Ag. The second electrode 14 may be a transparent structure, and light may be emitted in a direction away from the substrate 11 through the second electrode 14.

[0099] Exemplarily, the light-emitting device 20 may further include: a first encapsulation layer 15 located on the side of the second electrode 14 away from the substrate 11; a color filter layer 16 located on the side of the first encapsulation layer 15 away from the substrate 11; and a second encapsulation layer 17 located on the side of the color filter layer 16 away from the substrate 11. For example, the first encapsulation layer 15 and the second encapsulation layer 17 may be thin film encapsulation layers. Exemplarily, the first encapsulation layer 15 and the second encapsulation layer 17 may be made of one or more organic materials or inorganic materials with good sealing properties, such as silicon oxide, silicon nitride and other materials, so as to protect the OLED light-emitting device and achieve a good sealing effect. The first encapsulation layer 15 and the second encapsulation layer 17 are used in combination to achieve effective encapsulation of the light-emitting device, achieve effective blocking of water vapor and oxygen, and achieve the purpose of protecting the light-emitting device and extending the life. Exemplarily, the color filter layer 16 may include a combination of one or more of a red color filter layer, a green color filter layer and a blue color filter layer. The color filter layer 16 may be arranged corresponding to the light-emitting functional layer 13 to achieve a colored display of the emitted light.

[0100] Exemplarily, the substrate 11 may be a silicon substrate, which may be used as a substrate material for the driving backplane, and may be manufactured using a standard CMOS process to form a first chip of the display module on the substrate 11. The first chip may include a pixel circuit, a row and column driving circuit, and other functional circuits. For example, the first chip may be manufactured using a 180nm or 110nm semiconductor process. The first chip may include a plurality of terminals located in a non-display area that is exposed to a portion of the cover plate, for electrical connection to other display modules (e.g., a flexible circuit board or a second chip). Figure 4 is a plan view of a display module according to an embodiment of the present disclosure, Figure 5 is based on Figure 4 A partial enlarged schematic diagram of the first binding area in the figure. Figure 6 It is a schematic diagram of the partial structure of a display module according to an embodiment of the present disclosure.

[0101] For example, in the embodiments of the present disclosure, in combination with reference Figure 4-Figure 6 , the display module 200 includes a display panel 100. The display panel 100 has a display area AA and a non-display area NA. The non-display area NA includes a first binding area SA1. The display panel 100 includes a first chip IC1. For example, the first chip IC1 can be integrated and prepared on the display panel 100 using a CMOS process. The first chip IC1 may include a plurality of pins arranged in a non-display area (e.g., the first binding area SA1) of the display panel 100 for electrically connecting to other structures or components in the display module. The display module 200 also includes a flexible circuit board 30. The first chip IC1 and the flexible circuit board 30 can be bound and connected in the first binding area SA1 to achieve signal transmission between the first chip IC1 and the flexible circuit board 30.

[0102] Exemplarily, the display module 200 may further include a second chip IC2 . The second chip IC2 may be electrically connected to the first chip IC1 through the flexible circuit board 30 .

[0103] Exemplarily, the flexible circuit board 30 may include a first connection portion 31. The first connection portion 31 may be electrically connected to the first chip IC1.

[0104] Exemplarily, the flexible circuit board 30 may further include a second connection portion 32. The second connection portion 32 is located at a side of the first connection portion 31 away from the display area AA. The second connection portion 32 may be electrically connected to the second chip IC2.

[0105] Exemplarily, the flexible circuit board 30 may further include a third connection portion 33, which is located on a side of the second connection portion 32 away from the display area AA. The display module 200 may further include a flexible circuit board connector 60, which may be electrically connected to the third connection portion 33. By designing the flexible circuit board connector 60, the connection between the flexible circuit board 30 and the external drive circuit may be facilitated, for example, the flexible circuit board connector 60 and the external drive circuit may be connected in a plug-in manner.

[0106] The first connection portion 31 , the second connection portion 32 and the third connection portion 33 may be electrically connected via the connection traces inside the flexible circuit board 30 , thereby achieving electrical connection between the first chip IC1 and the second chip IC2 ; and / or electrical connection between the second chip IC2 and the flexible circuit board connector 60 .

[0107] Exemplarily, the flexible circuit board 30 may further include an auxiliary portion 34 located on the side of the first connection portion 31 close to the display area AA. The auxiliary portion 34 may protect the second terminal 312 in the flexible circuit board 30. During the binding process between the flexible circuit board 30 and the first chip IC1, the auxiliary portion 34 may also play a heat dissipation role, which may reduce the effect of heat generation during the binding process on the light-emitting device in the display area. In some embodiments, the flexible circuit board 30 may include multiple flexible circuit layers, and different flexible circuit layers may be electrically connected through the connection traces located in the auxiliary portion 34.

[0108] For example, in conjunction with reference Figure 4 and Figure 5 The first chip IC1 includes a plurality of first terminals 111 located in the first binding area SA1. The flexible circuit board 30 includes a first connection portion 31 located in the first binding area SA1. The first connection portion 31 is electrically connected to at least a portion of the plurality of first terminals 111 to achieve electrical connection between the flexible circuit board 30 and the first chip IC1.

[0109] Exemplarily, the first connection portion 31 may include a plurality of second terminals 312 . The plurality of first terminals 111 and the plurality of second terminals 312 may be connected in a one-to-one correspondence, thereby achieving electrical connection between the first chip IC1 and the flexible circuit board 30 .

[0110] For example, refer to Figure 5 , the size of the second terminal 312 is greater than the size of the corresponding first terminal 111. For example, in the first direction X, the width d2 of the second terminal 312 is greater than the width d1 of the first terminal 111. In the second direction Y, the width d4 of the second terminal 312 is greater than the width d3 of the first terminal 111. In some embodiments, the orthographic projections of the plurality of first terminals 111 on the substrate may fall within the orthographic projections of the plurality of second terminals 312 on the substrate, respectively.

[0111] Through such a design, the reliability of the binding connection between the first chip IC1 and the flexible circuit board 30 can be improved.

[0112] For example, continue to refer to Figure 4 The flexible circuit board 30 includes a first side L1 close to the display area AA, for example, the first side L1 can be located in the auxiliary portion 34. The first side L1 is spaced apart from the display area AA by a first spacing distance H1. The first connecting portion 31 includes a second side L2 close to the display area AA. The second side L2 is spaced apart from the first side L1 by a second spacing distance H2. Exemplarily, the second spacing distance H2 is less than the first spacing distance H1.

[0113] It should be noted that the "display area" in the embodiments of the present disclosure is the area of ​​the display panel that displays the image externally. The boundary of the display area is the boundary between the area of ​​the display panel that displays the image and the area of ​​the display panel that does not display the image. The first spacing distance H1 between the first side L1 and the display area AA refers to the minimum spacing distance between the first side L1 and the display area AA, that is, the spacing distance between the first side L1 and the boundary of the display area AA closest to the first side L1.

[0114] By such a design, the width of the portion of the flexible circuit board 30 protruding toward the display area AA relative to the first binding area SA1 (for example, the auxiliary portion 34) in the second direction Y can be made smaller, so that the space occupied by the flexible circuit board 30 in the non-display area NA of the display panel 100 can be reduced. Accordingly, during the design, the width of the non-display area NA in the display panel 100 can be designed to be smaller, thereby achieving a narrow frame of the display panel 100, reducing the size of a single silicon-based OLED display device, and reducing costs.

[0115] For example, in conjunction with reference Figure 4 and Figure 5, the sum of the first spacing distance H1 and the second spacing distance H2 is greater than 500 microns. That is, the spacing distance between the second terminal 312 in the first connecting portion 31 and the display area is greater than or equal to 500 microns. The first terminal 111 is arranged correspondingly to the second terminal 312, and the size of the first terminal 111 is smaller than the size of the second terminal 312. Therefore, the spacing distance between the first terminal 111 of the first chip IC1 and the display area is also greater than or equal to 500 microns.

[0116] Through such a design, the influence of the heat generated when the first chip IC1 is bound to the flexible circuit board 30 on the light-emitting devices in the display area can be reduced, and the service life of the display panel can be increased.

[0117] In some embodiments, the ratio of the first spacing distance H1 to the second spacing distance H2 is in the range of 2.7-15. For example, the first spacing distance H1 is in the range of 800-1500 microns, and the second spacing distance H2 is in the range of 100-300 microns.

[0118] For example, continue to refer to Figure 4 , the display panel 100 further includes a third side L3 partially covered by the flexible circuit board 30, the first connection portion 31 includes a fourth side L4 close to the third side L3, and the third side L3 and the fourth side L4 are spaced apart by an eleventh spacing distance H11. Exemplarily, the eleventh spacing distance H11 is substantially equal to the second spacing distance H2. Here, "substantially equal" means that the ratio of the eleventh spacing distance H11 to the second spacing distance H2 is in the range of 0.8-1.2.

[0119] Exemplarily, the eleventh spacing distance H11 is in the range of 100-300 micrometers.

[0120] Through such a design, it can be ensured that when the flexible circuit board and the display panel are bonded, sufficient space is left near the bonding area, which is conducive to improving the bonding yield.

[0121] For example, in conjunction with reference Figure 4 and Figure 6 , the second chip IC2 can be electrically connected to the first chip IC1 through the flexible circuit board 30. For example, the flexible circuit board 30 also includes a driver chip binding area SA20, and the second connection portion 32 in the flexible circuit board 30 can be located in the driver chip binding area SA20. The driver chip binding area SA20 is located on the side of the first binding area SA1 away from the display area AA. Exemplarily, the second chip IC2 and the second connection portion 32 can be bound and connected in the driver chip binding area SA20, thereby realizing signal transmission between the second chip IC2 and the flexible circuit board 30, and then realizing signal transmission between the second chip IC2 and the first chip IC1, so as to realize drive control of the display panel.

[0122] Exemplarily, the driving chip binding area SA20 is spaced apart from the display panel 100 in the second direction Y, and the second direction Y is parallel to the display area AA and points toward the flexible circuit board 30 .

[0123] For example, continue to refer to Figure 4 The flexible circuit board 30 further includes a fifth side L5 away from the display area AA. The fifth side L5 is spaced apart from the side of the second connection portion 32 close to the fifth side L5 by a twelfth spacing distance H12. The twelfth spacing distance H12 is greater than the second spacing distance H2. For example, the twelfth spacing distance H12 is in the range of 400-600 microns. The second spacing distance H2 is in the range of 100-300 microns.

[0124] Through such a design, it can be ensured that when the second chip is bonded, the flexible circuit board has sufficient bonding space, which is beneficial to improving the bonding effect between the second chip and the flexible circuit board.

[0125] Figure 7 It is a partial enlarged schematic diagram of the driver chip binding area according to an embodiment of the present disclosure.

[0126] For example, in the embodiments of the present disclosure, in combination with reference Figure 4 , Figure 6 and Figure 7 The flexible circuit board 30 may include a second connection portion 32. The second connection portion 32 is located on a side of the first connection portion 31 away from the display area AA. The second connection portion 32 and the second chip IC2 may be electrically connected in the driving chip binding area SA20.

[0127] Exemplarily, the second chip IC2 may include a second binding area SA2 and a plurality of third terminals IC23 located in the second binding area SA2. The second connection portion 32 in the flexible circuit board 30 may include a plurality of fifth terminals 325 located in the driver chip binding area SA20, and the plurality of fifth terminals 325 may be arranged in a one-to-one correspondence with the plurality of third terminals IC23. Exemplarily, the plurality of fifth terminals 325 may be electrically connected to the first chip IC1 through the internal wiring of the flexible circuit board 30, thereby realizing the electrical connection between the second chip IC2 and the first chip IC1. In some embodiments, the terminals in the second chip IC2 for electrical connection with the first chip IC1 may all be arranged in the second binding area SA2.

[0128] Exemplarily, the second chip IC2 may further include a third binding area SA3 and a plurality of fourth terminals IC24 located in the third binding area SA3. Exemplarily, the third binding area SA3 may be located on a side of the second binding area SA2 away from the display area AA. The second connection portion 32 in the flexible circuit board 30 may further include a plurality of sixth terminals 326 located in the driver chip binding area SA20, and the plurality of sixth terminals 326 may be arranged in a one-to-one correspondence with the plurality of fourth terminals IC24. The plurality of sixth terminals 326 may be connected to an external driving circuit through internal wiring of the flexible circuit board 30, for example, connected to an external driving circuit board PCB, thereby providing a driving signal for the second chip IC2.

[0129] Through such a design, signal transmission between the second chip IC2 and the first chip IC1, and signal transmission between the second chip IC2 and an external driving circuit can be achieved, thereby driving the display panel to emit light.

[0130] It should be noted that, although the embodiment of the present disclosure schematically shows that the shape of the orthographic projection of the first terminal, the second terminal, the third terminal, the fourth terminal, the fifth terminal and the sixth terminal on the substrate is a rectangle, the embodiment of the present disclosure is not limited thereto. In the embodiment of the present disclosure, the shape of the orthographic projection of the first terminal, the second terminal, the third terminal, the fourth terminal, the fifth terminal and the sixth terminal on the substrate can also be various shapes such as a square, a parallelogram, a circle, an ellipse, etc.

[0131] Exemplarily, the size of the fifth terminal 325 is larger than the size of the corresponding third terminal IC23 .

[0132] Exemplarily, the size of the sixth terminal 326 is larger than the size of the corresponding fourth terminal IC24 .

[0133] Through such a design, the reliability of the binding connection between the second chip IC2 and the flexible circuit board 30 can be improved.

[0134] Figure 8 is a plan view of a display module according to an embodiment of the present disclosure.

[0135] For example, in some embodiments of the present disclosure, referring to Figure 8 The flexible circuit board 30 includes a second connection portion 32, and the second connection portion 32 is located at a side of the first connection portion 31 away from the display area AA. The display module 200 may further include a printed circuit board 50, for example, the printed circuit board 50 may be a driving circuit board.

[0136] By way of example, the printed circuit board 50 may be electrically connected to the second connection portion 32. Also, the printed circuit board 50 is provided with a second chip IC2.

[0137] For example, the orthographic projection of the second chip IC2 on the printed circuit board 50 and the orthographic projection of the second connecting portion 32 on the printed circuit board 50 may partially overlap or may not overlap.

[0138] With such a design, the connection design between the second chip IC2, the printed circuit board 50 and the first chip IC1 can be realized more flexibly. If the second chip IC2 has a large number of terminals, the printed circuit board 50 can provide more sufficient binding space for the second chip IC2, thereby improving the stability of the binding and further improving the reliability of the display module.

[0139] For example, continue to refer to Figure 8 The second connection portion 32 and the second chip IC2 are spaced apart by a thirteenth spacing distance H13, and the thirteenth spacing distance H13 is greater than the second spacing distance H2. For example, the thirteenth spacing distance H13 is in the range of 400-600 microns. The second spacing distance H2 is in the range of 100-300 microns.

[0140] Exemplarily, the printed circuit board 50 includes a sixth side L6 away from the display area AA, and the sixth side L6 is spaced from the second chip IC2 by a fourteenth spacing distance H14. The fourteenth spacing distance H14 is greater than the second spacing distance H2. For example, the fourteenth spacing distance H14 is in the range of 400-600 micrometers.

[0141] Exemplarily, the second connection portion 32 is spaced apart from the side of the printed circuit board 50 close to the display area AA by a fifteenth spacing distance H15. The fifteenth spacing distance H15 is in the range of 150-300 micrometers.

[0142] Through such a design, the bonding effect between the flexible circuit board and the printed circuit board can be improved, and the bonding effect between the second chip and the printed circuit board can also be improved.

[0143] The inventor has found through research that as silicon-based OLED display devices develop towards high resolution and narrow frame, the number of terminals in silicon-based OLED display devices is increasing, while the layout space of the terminals is getting smaller and smaller, resulting in a smaller and smaller spacing distance between adjacent terminals, and higher and higher requirements for the alignment accuracy between the terminals. However, during the binding process of the display module, a lot of heat will be generated, which can easily cause the terminal to expand due to heat, thereby causing the terminal binding to be offset, for example, causing a certain offset when the second terminal 312 in the flexible circuit board is bound to the first terminal 111 in the first chip IC1, or causing a certain offset when the fifth terminal 325 or the sixth terminal 326 in the flexible circuit board is bound to the third terminal IC23 or the fourth terminal IC24 in the second chip IC2, thereby affecting the yield of the display module. In order to improve the alignment accuracy of the terminals during the binding process, the arrangement of the terminals can be designed.

[0144] Fig. 9 is a partial plan view of a display module according to an embodiment of the present disclosure.

[0145] For example, in the embodiments of the present disclosure, referring to Fig. 9 In the first direction X, the first binding area 31 includes a first area S1 located at the first side, a second area S2 located in the middle, and a third area S3 located at the second side, and the first direction X is parallel to the first side L1.

[0146] Exemplarily, the plurality of first terminals 111 may include: a plurality of first sub-terminals 1111 located in the first region S1 , a plurality of second sub-terminals 1112 located in the second region S2 , and a plurality of third sub-terminals 1113 located in the third region S3 .

[0147] Exemplarily, one end of at least one first sub-terminal 1111 close to the display area is inclined toward the third area S3 relative to one end of the first sub-terminal away from the display area. For example, at least one first sub-terminal 1111 is designed to be inclined to the right.

[0148] For example, an end of at least one second sub-terminal 1112 close to the display area is not inclined relative to an end of the second sub-terminal away from the display area. That is, a side edge of the second sub-terminal 1112 may be parallel to the second direction Y.

[0149] Exemplarily, one end of at least one third sub-terminal 1113 close to the display area is inclined toward the first area S1 relative to one end of the third sub-terminal away from the display area. For example, at least one third sub-terminal 1113 is designed to be inclined to the left.

[0150] By dividing the plurality of first terminals 111 into zones and adopting different tilt designs, the plurality of first terminals 111 can be designed in an overall figure-eight shape.

[0151] Exemplarily, the plurality of second terminals 312 in the first connection portion 31 of the flexible circuit board 30 may also adopt an inclined design in the same form as the plurality of first terminals 111 , so that the plurality of second terminals 312 are also designed in an eight-shaped shape as a whole.

[0152] When the terminals expand due to heat, the offset of multiple terminals that are not tilted in one direction tends to accumulate too much, which can easily lead to a defective display module.

[0153] In the exemplary embodiment of the present disclosure, multiple first terminals 111 and multiple second terminals 312 all adopt an eight-shaped inclined design, which can compensate for the offset of the terminals due to thermal expansion during binding, avoid the situation where the terminals are too offset during binding, resulting in misalignment, short circuit or missing connection, which is beneficial to improving the yield of the display module.

[0154] For example, continue to refer to Fig. 9 In the first direction X, two adjacent first sub-terminals 1111 among the multiple first sub-terminals 1111 are spaced apart by a fourth spacing distance H4, two adjacent second sub-terminals 1112 among the multiple second sub-terminals 1112 are spaced apart by a fifth spacing distance H5, and two adjacent third sub-terminals 1113 among the multiple third sub-terminals 1113 are spaced apart by a sixth spacing distance H6.

[0155] It should be noted that the "fourth spacing distance" in the embodiments of the present disclosure refers to the spacing distance between the center points or center lines of two adjacent first sub-terminals. The "fifth spacing distance" in the embodiments of the present disclosure refers to the spacing distance between the center points or center lines of two adjacent second sub-terminals. The "sixth spacing distance" in the embodiments of the present disclosure refers to the spacing distance between the center points or center lines of two adjacent third sub-terminals.

[0156] Exemplarily, the fourth spacing distance H4 is substantially equal to the fifth spacing distance H5. And / or, the fourth spacing distance H4 is substantially equal to the sixth spacing distance H6. And / or, the fifth spacing distance H5 is substantially equal to the sixth spacing distance H6. It should be noted that "substantially equal" here means that the ratio of the two is within the range of 0.8 to 1.2.

[0157] The multiple first terminals 111 located in different areas can all be designed with equal spacing, and combined with the eight-shaped tilted design of the multiple first terminals 111, the offset during the binding process can be made smaller than the spacing distance between two adjacent first terminals 111, thereby avoiding the situation where the terminal is misaligned and short-circuited, resulting in a poor display module. Through such a design, the reliability of the binding connection between the first chip IC1 and the flexible circuit board 30 can be further improved, thereby improving the reliability of the display module.

[0158] Fig.10 is a partial plan view of a display module according to an embodiment of the present disclosure, wherein a first binding area is shown.

[0159] For example, in the embodiments of the present disclosure, in combination with reference Fig. 9 and Fig.10 In the second direction Y, the plurality of first terminals 111 may be designed to be arranged in a single row or in multiple rows. For example, the plurality of first terminals 111 may include M rows of first terminals, for example, 1 to 5 rows of first terminals. The number of terminals in each row of first terminals may be in the range of 300 to 500.

[0160] Exemplarily, the plurality of first terminals 111 may be arranged in two rows in the second direction Y. For example, a row of first terminals 111 close to the display area AA may be used to transmit signals to the display area, and a row of first terminals 111 close to the second chip IC2 may be used to transmit signals to the second chip IC2.

[0161] Exemplarily, the plurality of first terminals 111 are designed in multiple rows, for example, in M ​​rows, where M is a positive integer greater than or equal to 2. The region where the first terminals in the i-th row are located and the region where the first terminals in the i+1-th row are located are spaced by a third spacing distance H3, where i is a positive integer greater than or equal to 1 and less than or equal to M-1. The first binding region 31 has a first width D1 in the second direction Y. Exemplarily, the ratio of the third spacing distance H3 to the first width D1 is less than 20%.

[0162] In some embodiments, the ratio of the third spacing distance H3 to the second spacing distance H2 is in the range of 0.5-4. For example, the third spacing distance H3 is in the range of 150-400 micrometers, and the second spacing distance H2 is in the range of 100-300 micrometers.

[0163] When the first terminal adopts a multi-row design, by adjusting the ratio range of the spacing distance between two adjacent rows of terminals in the second direction Y and the width of the first binding area 31 in the second direction Y, the size of the first binding area in the second direction Y can be reduced while ensuring that the multiple rows of terminals have little influence on each other, which is conducive to achieving a narrow frame of the display panel, thereby reducing costs.

[0164] Fig.11 is a partial plan view of a display module according to an embodiment of the present disclosure.

[0165] In some embodiments, in order to increase the number of channels between the flexible circuit board 30 and the first chip IC1 within a limited space, the flexible circuit board 30 may adopt a multi-layer design, for example, the flexible circuit board 30 may adopt a double-layer design. An insulating layer and connecting traces passing through the insulating layer are provided between the multiple flexible circuit layers to ensure signal transmission between the multiple flexible circuit layers.

[0166] For example, in the embodiments of the present disclosure, referring to Fig.11 The flexible circuit board 30 may further include an auxiliary portion 34. The auxiliary portion 34 is located on a side of the first connecting portion 31 close to the display area.

[0167] Exemplarily, the auxiliary portion 34 may include a plurality of via holes VH and a plurality of first connection traces 341 filling the plurality of via holes VH. The plurality of flexible circuit layers may be electrically connected through the plurality of first connection traces 341.

[0168] The flexible circuit board adopts a multi-layer design, which can increase the number of transmission channels on the flexible circuit board and ensure the transmission of large amounts of data between the second chip IC2 and the first chip ICl, so that the display panel meets the requirements of high resolutions such as 3K and 4K, and enhances the competitive advantage of the product.

[0169] For example, in the embodiments of the present disclosure, continue to refer to Fig.11 , the second chip IC2 may include a second binding area SA2 and a third binding area SA3 spaced apart in the second direction Y. The third binding area SA3 is located at a side of the second binding area SA2 away from the display area.

[0170] Exemplarily, the second chip IC2 may include a plurality of third terminals IC23 located in the second bonding area SA2 and a plurality of fourth terminals IC24 located in the third bonding area SA3 .

[0171] For example, the terminal (e.g., the third terminal IC23) in the second chip IC2 for communicating with the first chip IC1 can be set in the second binding area SA2, and the terminal (e.g., the fourth terminal IC24) in the second chip IC2 for communicating with the external driving circuit or driving board can be set in the third binding area SA3. Through such a design, the transmission distance of the signal can be shortened, which is conducive to improving the transmission efficiency of the signal, thereby improving the response speed of the display device.

[0172] In some embodiments, in order to improve the binding effect of the second chip IC2 and avoid the misalignment, short circuit or missing connection of the terminals due to thermal expansion, the plurality of third terminals IC23 and the plurality of fourth terminals IC24 may be the same or different in terms of the number of terminals, terminal size, and arrangement of the terminals. For example, the terminal size of the fourth terminal IC24 may be larger than the size of the third terminal IC23. For another example, the spacing distance between two adjacent fourth terminals IC24 may be larger than the spacing distance between two adjacent third terminals IC23.

[0173] For example, in the first direction X, the width d6 of the third binding area SA3 may be greater than the width d5 ​​of the second binding area SA2 , so as to better meet the spatial arrangement requirements of the plurality of fourth terminal ICs 24 .

[0174] Fig.12 is a partial plan view of a display module according to an embodiment of the present disclosure, wherein a second binding area is shown.

[0175] For example, in the embodiments of the present disclosure, referring to Fig.12The plurality of third terminal ICs 23 may include N rows of third terminal ICs 23 spaced apart in the second direction Y. For example, N is greater than or equal to 1 and less than or equal to 15. For example, N is equal to 10. The number of terminals in each row of third terminal ICs 23 is approximately in the range of 300 to 500.

[0176] Exemplarily, in the first direction X and the second direction Y, the plurality of third terminals IC23 include N rows and L columns of third terminals, where N and L are positive integers greater than or equal to 2. The third terminal IC232 in the j+1th row and kth column is offset relative to the third terminal IC231 in the jth row and kth column along the first direction X, where j is a positive integer greater than or equal to 1 and less than or equal to N-1, and k is a positive integer greater than or equal to 1 and less than or equal to L.

[0177] Through such an inclined design, the spacing distance between two adjacent third terminals IC23 in the same column can be increased, which can reduce the impact of thermal expansion on the terminal offset during the binding process, thereby reducing the probability of misalignment, short circuit or missing connection during the binding process, which is beneficial to improving the yield of the display module.

[0178] For example, continue to refer to Fig.12 , the third terminal IC23 has a second width D2 in the first direction X, and the third terminal IC23 has a third width D3 in the second direction Y. Exemplarily, the second width D2 is substantially equal to the third width D3. It should be noted that "substantially equal" here means that the ratio of the two is within the range of 0.8 to 1.2.

[0179] Exemplarily, the second width D2 is approximately equal to 36 micrometers. The third width D3 is approximately equal to 36 micrometers.

[0180] Exemplarily, centers of two adjacent third terminals IC23 in the same row are spaced apart by a seventh spacing distance H7 in the first direction X. A ratio of the seventh spacing distance H7 to the second width D2 is greater than or equal to 2.4. For example, the seventh spacing distance H7 is approximately equal to 87 micrometers.

[0181] Exemplarily, the gap width d7 between two adjacent third terminals IC23 in the same row is approximately equal to the difference between the seventh spacing distance H7 and the second width D2, that is, d7≈H7-D2. For example, the gap width d7 between two adjacent third terminals IC23 in the same row is approximately equal to 51 microns.

[0182] Exemplarily, centers of two adjacent third terminals IC23 in the same column are spaced apart by an eighth spacing distance H8 in the second direction Y. A ratio of the eighth spacing distance H8 to the third width D3 is greater than or equal to 2. For example, the eighth spacing distance is approximately equal to 72 micrometers.

[0183] Exemplarily, the gap width d8 between two adjacent third terminals IC23 in the same column is approximately equal to the difference between the eighth spacing distance H8 and the third width D3, that is, d8≈H8-D3. For example, the gap width d8 between two adjacent third terminals IC23 in the same column is approximately equal to 36 microns.

[0184] Through such a design, while ensuring good terminal binding performance, the impact of thermal expansion between adjacent terminals can be minimized, and the probability of terminal misalignment, short circuit or missing connection caused by thermal expansion during the binding process can be reduced, which is beneficial to improving the yield of the display module.

[0185] For example, in some embodiments of the present disclosure, continue to refer to Fig.12 , the multiple third terminals IC23 may include one or more first virtual pads IC233. The first virtual pad IC233 may be located in the edge area of ​​the second binding area SA2, for example, the first virtual pad IC233 may be located in one or more rows of the multiple third terminals IC23 close to the edge; or, the first virtual pad IC233 may be located in one or more columns of the multiple third terminals IC23 close to the edge. By designing the first virtual pad, the second chip can be supported, thereby avoiding warping or poor contact during the binding process, which is beneficial to improving the reliability of chip binding, thereby improving the yield of the display module.

[0186] Fig.13 is a partial plan view of a display module according to an embodiment of the present disclosure, wherein a third binding area is shown.

[0187] For example, refer to Fig.13 The second chip IC2 may further include a plurality of fourth terminals IC24 located in the third binding area SA3. In the second direction Y, the plurality of fourth terminals include P rows of fourth terminals, where P is a positive integer greater than or equal to 2.

[0188] Exemplarily, in the first direction X, the third binding area SA3 includes a fourth area S4 located at the first side, a fifth area S5 located in the middle, and a sixth area S6 located at the second side.

[0189] For example, among the multiple rows of fourth terminal ICs 24 in the fourth region S4, the fourth terminal ICs 24 in the lower row are offset in a direction away from the sixth region S6 relative to the fourth terminal ICs 24 in the upper row, that is, toward Fig.13 For example, in at least one column of fourth terminals IC24 in the fourth region S4, the fourth terminals in the a+1th row are offset in the opposite direction of the first direction X relative to the fourth terminals in the ath row, so that the fourth terminals IC24 in the fourth region S4 are arranged in a manner tilted to the right as a whole.

[0190] Exemplarily, in at least one column of fourth terminals IC24 in the fifth region S5 , fourth terminals IC24 in the a+1th row are aligned with fourth terminals IC24 in the ath row in the first direction X. That is, the fourth terminals IC24 in the fifth region S5 are arranged without tilting as a whole.

[0191] For example, among the multiple rows of fourth terminal IC24 in the sixth region S6, the fourth terminal IC24 located in the lower row is offset in a direction away from the fourth region S4 relative to the fourth terminal IC24 located in the upper row, that is, toward Fig.13 For example, in at least one column of fourth terminals IC24 in the sixth region S6, the fourth terminals IC24 in the a+1th row are offset along the first direction X relative to the fourth terminals IC24 in the ath row, where a is a positive integer greater than or equal to 1 and less than or equal to P-1, so that the fourth terminals IC24 in multiple rows in the sixth region S6 are arranged to be tilted to the left as a whole.

[0192] By such a design, the fourth terminals IC24 in the third binding area SA3 can be arranged in an overall figure eight structure. The figure eight structure design can compensate for the offset of the terminal during binding, avoid excessive terminal offset during binding, and help improve the yield of the display module.

[0193] For example, continue to refer to Fig.13 , the fourth terminal IC24 has a fourth width D4 in the first direction X, and the fourth terminal IC24 has a fifth width D5 in the second direction Y. The fourth width D4 may be substantially equal to the fifth width D5. It should be noted that "substantially equal" here means that the ratio of the two is within the range of 0.8 to 1.2. For example, the fourth width D4 is approximately equal to 40 microns. The fifth width D5 is approximately equal to 40 microns.

[0194] Exemplarily, the fourth width D4 is greater than the second width D2. For example, the fourth width D4 is approximately equal to 40 micrometers, and the second width D2 is approximately equal to 36 micrometers.

[0195] Exemplarily, the fifth width D5 is greater than the third width D3. For example, the fifth width D5 is approximately equal to 40 micrometers, and the third width D3 is approximately equal to 36 micrometers.

[0196] Exemplarily, the centers of two adjacent fourth terminals IC24 in the same row are spaced apart by a ninth spacing distance H9 in the first direction X, and a ratio of the ninth spacing distance H9 to the fourth width D4 is in a range of 2.1 to 2.5. For example, the ninth spacing distance H9 is in a range of 84 micrometers to 100 micrometers.

[0197] Exemplarily, the gap width d9 between two adjacent fourth terminals IC24 in the same row is approximately equal to the difference between the ninth spacing distance H9 and the fourth width D4, that is, d9≈H9-D4. For example, the gap width d9 between two adjacent fourth terminals IC24 in the same row is in the range of 44 micrometers to 60 micrometers.

[0198] Exemplarily, the centers of two adjacent fourth terminals IC24 in the same column are spaced apart by a tenth spacing distance H10 in the second direction Y, and a ratio of the tenth spacing distance H10 to the fifth width D5 is in a range of 1.9 to 2.5. For example, the tenth spacing distance H10 is in a range of 76 micrometers to 100 micrometers.

[0199] Exemplarily, the gap width d10 between two adjacent fourth terminals IC24 in the same column is approximately equal to the difference between the tenth spacing distance H10 and the fifth width D5, that is, d10≈H10-D5. For example, the gap width d10 between two adjacent fourth terminals IC24 in the same column is in the range of 36 micrometers to 60 micrometers.

[0200] Through such a design, while ensuring good terminal binding performance, the impact of thermal expansion between adjacent terminals can be minimized, and the probability of terminal misalignment, short circuit or missing connection caused by thermal expansion during the binding process can be reduced, which is beneficial to improving the yield of the display module.

[0201] For example, in some embodiments of the present disclosure, continue to refer to Fig.13 , the multiple fourth terminals IC24 may include one or more second virtual pads IC241. The second virtual pad IC241 may be located in the edge area of ​​the third binding area SA3. For example, the second virtual pad IC241 may be located in one or more rows of the multiple fourth terminals IC24 close to the edge; or, the second virtual pad IC241 may be located in one or more columns of the multiple fourth terminals IC24 close to the edge. By designing the second virtual pad, the second chip IC2 can be supported, thereby avoiding warping or poor contact during the binding process, which is beneficial to improving the reliability of chip binding, thereby improving the yield of the display module.

[0202] Fig.14 is a schematic diagram of the partial structure of a display module according to an embodiment of the present disclosure, wherein a double-layer flexible circuit board is shown.

[0203] For example, in the embodiments of the present disclosure, referring to Fig.14 The flexible circuit board 30 may adopt a double-layer design. For example, the flexible circuit board 30 may include a first flexible circuit layer 301 , a second flexible circuit layer 302 , and a first insulating layer 303 located between the first flexible circuit layer 301 and the second flexible circuit layer 302 .

[0204] The flexible circuit board 30 may further include an auxiliary portion 34. The auxiliary portion 34 is located on a side of the first connection portion 31 close to the display area. The flexible circuit board 30 may further include a plurality of via holes VH located in the auxiliary portion 34 and a plurality of first connection traces 341 filling the plurality of via holes VH. The first flexible circuit layer 301 and the second flexible circuit layer 302 may be electrically connected through the plurality of first connection traces 341 penetrating the first insulating layer 303.

[0205] The flexible circuit board 30 adopts a double-layer design, which can increase the number of transmission channels on the flexible circuit board and ensure the transmission of large amounts of data between the second chip IC2 and the first chip IC1, so that the display panel meets the requirements of high resolutions such as 3K and 4K, thereby enhancing the competitive advantage of the product.

[0206] Fig.15A and Fig. 15B is a schematic structural diagram of a display module according to an embodiment of the present disclosure.

[0207] By way of example, in an embodiment of the present disclosure, the flexible circuit board 30 may further include an auxiliary portion 34, which is connected to the first connection portion 31. The auxiliary portion 34 protrudes in a direction toward the display area AA relative to the first connection portion 31. By way of example, the auxiliary portion 34 may be used for electrical connection between multiple flexible circuit layers or for protecting the terminals in the first connection portion 31.

[0208] In some embodiments, after the first chip IC1 and the first connection portion 31 are bound and connected, the following can be obtained: Fig.15A The display module structure shown. The flexible circuit board 30 includes a first side L1 close to the display area AA, and the first connecting portion 31 includes a second side L2 close to the display area AA. The first side L1 and the second side L2 are spaced apart by a second spacing distance H2. When the auxiliary portion 34 adopts a flattened design, the second spacing distance H2 is equal to the width of the auxiliary portion 34 in the second direction Y. Since the width of the auxiliary portion 34 in the second direction Y is relatively large, for example, the width of the auxiliary portion 34 in the second direction Y is in the range of 1 mm to 2 mm, the auxiliary portion 34 needs to occupy more space, which is not conducive to the narrow frame of the display panel.

[0209] In some embodiments of the present disclosure, after the first chip IC1 and the first connecting portion 31 are bound and connected, the auxiliary portion 34 can be bent toward the direction close to the first connecting portion 31, and the auxiliary portion 34 and the first connecting portion 31 can be fixed by using a connecting component, so as to obtain Fig. 15BFor example, the auxiliary portion 34 may include a bending portion 342 and a main body 343. The bending portion 342 is located on a side of the first connection portion 31 close to the display area AA, and the main body 343 is bent toward the first connection portion 31 through the bending portion 342. The first side L1 of the flexible circuit board 30 close to the display area AA may be located in the bending portion 342.

[0210] and Fig.15A Compared with the display module in the embodiment shown, Fig. 15B The auxiliary portion 34 of the display module in the embodiment shown adopts a bending design, which can greatly reduce the second spacing distance H2 between the first side L1 and the second side L2 in the flexible circuit board 30. For example, the second spacing distance H2 is approximately equal to 0.325 mm.

[0211] By such a design, the space occupied by the flexible circuit board 30 in the non-display area NA can be reduced. Accordingly, when designing the display panel, the reserved width of the non-display area of ​​the display panel can be reduced. For example, in the second direction Y, the reserved width d0 between the cover plate 18 of the display panel and the flexible circuit board 30 can be reduced, which is conducive to realizing the narrow frame of the display panel. The narrow frame design of the display panel can reduce the size of the silicon substrate in a single silicon-based OLED display device and reduce the cost.

[0212] Exemplarily, the main body portion 343 and the first connection portion 31 may be connected via a first adhesive layer 70 .

[0213] In some embodiments, in conjunction with reference Fig.14 and Fig. 15B , the first connection trace 341 can be located in the main body 343 .

[0214] Exemplarily, the bending portion 342 has a first bending radius r1, the first adhesive layer 70 has a first thickness h1 in the third direction Z, and the first bending radius r1 is greater than the first thickness h1. The third direction Z is parallel to the light emitting direction of the display panel.

[0215] Exemplarily, the first bending radius r1 is in the range of 0.3 mm to 2 mm. For example, the first bending radius r1 may be approximately equal to 0.325 mm.

[0216] Exemplarily, the first thickness h1 is in the range of 0.2 mm to 2 mm. For example, the first thickness h1 may be approximately equal to 0.25 mm.

[0217] Exemplarily, the thickness of the flexible circuit board 30 in the third direction Z may be approximately equal to 0.2 mm.

[0218] Exemplarily, the surface of the cover plate 18 away from the substrate 11 is spaced apart by an eleventh spacing distance H11 from the surface of the substrate 11 close to the cover plate 18. Exemplarily, the eleventh spacing distance H11 is approximately equal to 0.7 mm.

[0219] Exemplarily, a surface of the main body 343 away from the substrate 11 is spaced apart from a surface of the substrate 11 close to the cover 18 by a twelfth spacing distance H12. Exemplarily, the twelfth spacing distance H12 is approximately equal to 0.65 mm.

[0220] Exemplarily, the eleventh spacing distance H11 is greater than or equal to the twelfth spacing distance H12. That is, the bending design of the auxiliary portion 34 does not increase the thickness of the entire display module.

[0221] Through such a design, on the one hand, a narrow frame of the display panel can be achieved, and on the other hand, the total thickness of the display module will not be increased, which is conducive to miniaturization and thinness of the display module.

[0222] Fig.16A and Fig. 16B is a schematic structural diagram of a display module according to an embodiment of the present disclosure.

[0223] For example, in the embodiments of the present disclosure, in combination with reference Fig.16A and Fig. 16B , after the binding process of the first connection part 31 and the first chip IC1 is completed, the part of the flexible circuit board 30 that protrudes toward the display area AA relative to the first connection part 31 can also be cut off, such as cutting off the auxiliary part 34, so that the second spacing distance H2 between the first side L1 and the second side L2 can be reduced. Specifically, before the flexible circuit board 30 is bound to the first chip IC1, a first substrate layer 80 can be attached to the surface of the auxiliary part 34 close to the substrate. After the flexible circuit board 30 is bound to the first chip IC1, the first substrate layer 80 is used to assist in removing the auxiliary part 34. For example, the auxiliary part 34 is used to protect the first connection part on the flexible circuit board 30 before binding; or the auxiliary part is used to dissipate heat during the binding process, reducing the influence of the heat generated during the binding process on the light-emitting device in the display area. After the binding of the flexible circuit board 30 and the first chip IC1 is completed, the auxiliary part 34 has played a corresponding protective or heat dissipation role. Further, a part of the auxiliary part 34 can be removed or the auxiliary part 34 can be completely removed, so that the space occupied by the flexible circuit board 30 in the non-display area is reduced.

[0224] For example, the first side L1 and the second side L2 may be the same side. That is, the second spacing distance H2 may be approximately equal to 0.

[0225] By such a design, the space occupied by the flexible circuit board 30 in the non-display area NA can be reduced. Accordingly, when designing the display panel, the reserved width of the non-display area of ​​the display panel can be reduced. For example, in the second direction Y, the reserved width d0 between the cover plate 18 of the display panel and the flexible circuit board 30 can be reduced, which is conducive to realizing the narrow frame of the display panel. The narrow frame design of the display panel can reduce the size of the silicon substrate in a single silicon-based OLED display device and reduce costs.

[0226] Fig.17 is a structural block diagram of a display device according to an embodiment of the present disclosure.

[0227] Optionally, an embodiment of the present disclosure further provides a display device. Fig.17 , the display device 1000 may include the above-mentioned display module 200. The display device may include but is not limited to: electronic paper, mobile phones, tablet computers, monitors, laptop computers, digital photo frames, navigators, and any other products or components with display functions. It should be understood that the display device has the same beneficial effects as the display module provided in the above-mentioned embodiment.

[0228] Although some embodiments of the present general inventive concept have been shown and described, it will be appreciated by those skilled in the art that changes may be made to these embodiments without departing from the principles and spirit of the present general inventive concept, the scope of which is defined by the claims and their equivalents.

Claims

1. A display module, characterized in that: include: A display panel, the display panel having a display area and a non-display area located outside the display area, the non-display area including a first binding area, and the display panel including a first chip; a flexible circuit board, wherein the flexible circuit board is electrically connected to the first chip in the first binding area; and a second chip, the second chip being electrically connected to the first chip through the flexible circuit board, Wherein, the flexible circuit board comprises a first side edge close to one side of the display area, and the first side edge is spaced apart from the display area by a first spacing distance; and The flexible circuit board further includes a first connection portion, the first connection portion is used to be electrically connected to the first chip, the first connection portion includes a second side edge close to one side of the display area, and the second side edge is spaced apart from the first side edge by a second spacing distance. The second spacing distance is smaller than the first spacing distance.

2. The display module according to claim 1, wherein: The sum of the first spacing distance and the second spacing distance is greater than or equal to 500 micrometers.

3. The display module according to claim 1, wherein: A ratio of the first spacing distance to the second spacing distance is in the range of 2.7-15.

4. The display module according to claim 1, wherein: The display panel includes a third side partially covered by the flexible circuit board, the first connecting portion includes a fourth side close to the third side, the third side and the fourth side are spaced apart by an eleventh spacing distance, and the eleventh spacing distance is substantially equal to the second spacing distance.

5. The display module according to claim 1 or 2, wherein: The first chip includes a plurality of first terminals located in the first binding area, the flexible circuit board includes a plurality of second terminals located in the first connecting portion, and the plurality of first terminals and the plurality of second terminals are connected in a one-to-one correspondence; and The size of the second terminal is larger than the size of the corresponding first terminal.

6. The display module according to claim 5, wherein: The flexible circuit board further includes a second connection portion, the second connection portion is located at a side of the first connection portion away from the display area, and the second connection portion is electrically connected to the second chip.

7. The display module according to claim 6, wherein: The flexible circuit board further includes a fifth side away from the display area, the fifth side is spaced apart from a side of the second connection portion close to the fifth side by a twelfth spacing distance, and the twelfth spacing distance is greater than the second spacing distance.

8. The display module according to claim 5, wherein: The flexible circuit board further includes a second connecting portion, and the second connecting portion is located at a side of the first connecting portion away from the display area; The display module further includes a printed circuit board, and the printed circuit board is electrically connected to the second connecting portion; and The second chip is arranged on the printed circuit board.

9. The display module according to claim 8, wherein: The second connection portion and the second chip are spaced apart by a thirteenth spacing distance, and the thirteenth spacing distance is greater than the second spacing distance; and / or, The printed circuit board includes a sixth side away from the display area, the sixth side is spaced apart from the second chip by a fourteenth spacing distance, and the fourteenth spacing distance is greater than the second spacing distance.

10. The display module according to any one of claims 5 to 9, wherein: In a first direction, the first binding area includes a first area located at a first side, a second area located in the middle, and a third area located at the second side, and the first direction is parallel to the first side; The plurality of first terminals include: a plurality of first sub-terminals located in the first region, a plurality of second sub-terminals located in the second region, and a plurality of third sub-terminals located in the third region. Wherein, an end of at least one of the first sub-terminals close to the display area is inclined toward the third area relative to an end of the first sub-terminal away from the display area; and / or, An end of at least one of the second sub-terminals close to the display area is not inclined relative to an end of the second sub-terminal away from the display area; and / or, An end of at least one of the third sub-terminals close to the display area is inclined toward a direction close to the first area relative to an end of the third sub-terminal away from the display area.

11. The display module according to any one of claims 5 to 10, wherein: In the second direction, the plurality of first terminals include M rows of first terminals, wherein an area where the first terminals in the i-th row are located and an area where the first terminals in the i+1-th row are located are spaced apart by a third spacing distance, wherein the second direction is parallel to a direction where the display area points to the flexible circuit board, M is a positive integer greater than or equal to 2, and i is a positive integer greater than or equal to 1 and less than or equal to M-1; The first binding area has a first width in the second direction, and a ratio of the third spacing distance to the first width is less than 20%; and / or, A ratio of the third spacing distance to the second spacing distance is in the range of 0.5-4.

12. The display module according to claim 10, wherein: In the first direction, two adjacent first sub-terminals of the plurality of first sub-terminals are spaced apart by a fourth spacing distance, two adjacent second sub-terminals of the plurality of second sub-terminals are spaced apart by a fifth spacing distance, and two adjacent third sub-terminals of the plurality of third sub-terminals are spaced apart by a sixth spacing distance. Wherein, the fourth spacing distance is substantially equal to the fifth spacing distance; and / or, The fourth spacing distance is substantially equal to the sixth spacing distance; and / or, The fifth spacing distance is substantially equal to the sixth spacing distance.

13. The display module according to claim 12, wherein: The second chip includes a second binding area and a plurality of third terminals located in the second binding area; The third terminal has a second width in the first direction, and the third terminal has a third width in the second direction, and the second width is substantially equal to the third width; Centers of two adjacent third terminals in the same row are spaced apart by a seventh spacing distance in the first direction, and a ratio of the seventh spacing distance to the second width is greater than or equal to 2.4; and / or, Centers of two adjacent third terminals in the same column are spaced apart by an eighth spacing distance in the second direction, and a ratio of the eighth spacing distance to the third width is greater than or equal to 2.

14. The display module according to claim 13, wherein: The second chip further includes a third binding area and a plurality of fourth terminals located in the third binding area, the fourth terminals having a fourth width in the first direction, the fourth terminals having a fifth width in the second direction, and the fourth width being substantially equal to the fifth width; and / or, The fourth width is greater than the second width; and / or, The fifth width is greater than the third width.

15. The display module according to claim 14, wherein: Centers of two adjacent fourth terminals in the same row are spaced apart by a ninth spacing distance in the first direction, and a ratio of the ninth spacing distance to the fourth width is in a range of 2.1 to 2.5; and / or, Centers of two adjacent fourth terminals in the same column are spaced apart by a tenth spacing distance in the second direction, and a ratio of the tenth spacing distance to the fifth width is in a range of 1.9 to 2.

5.

16. The display module according to any one of claims 1 to 15, wherein: The flexible circuit board includes a first flexible circuit layer, a second flexible circuit layer and a first insulating layer located between the first flexible circuit layer and the second flexible circuit layer, and the first flexible circuit layer and the second flexible circuit layer are electrically connected through a plurality of first connecting traces passing through the first insulating layer.

17. The display module according to any one of claims 1 to 16, wherein: The flexible circuit board further includes an auxiliary portion, the auxiliary portion is connected to the first connecting portion; the auxiliary portion includes a bending portion and a main portion, the bending portion is located on a side of the first connecting portion close to the display area, and the main portion is bent toward a direction close to the first connecting portion through the bending portion; and The main body portion and the first connecting portion are connected via a first adhesive layer.

18. The display module according to claim 17, wherein: The first connecting line is located in the main body; and / or the bending portion has a first bending radius, the first adhesive layer has a first thickness in a third direction, the first bending radius is greater than the first thickness, and the third direction is parallel to the light emitting direction of the display panel.

19. The display module according to claim 1, wherein: The second spacing distance is approximately equal to 0.

20. A display device comprising the display module according to any one of claims 1 to 19.

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