Alti n coating, cutting tool and method of manufacture

Abstract

This application discloses an AlTiN coating, a cutting tool, and a preparation method. The cutting tool has an AlTiN coating deposited on its surface as described above. The AlTiN coating has the molecular formula Al m Ti 1‑m N n The ratio of m to n is 0.5 to 0.7, and the ratio of n to n is 0.8 to 1.1, representing the atomic ratio. The AlTiN coating is deposited using high-power pulsed sputtering technology, and the preparation method includes the following steps: The coating chamber is evacuated to 5*10⁻⁶. ‑3 The substrate is heated to 450-600℃; inert gas is introduced, and the pressure in the coating chamber is adjusted to 0.5-1 Pa. The ion source is turned on, and the bias voltage is adjusted to -400-800V and the frequency to 40-80kHz. The temperature of the coating chamber is reduced to 300-400℃, and plasma cleaning is performed on the substrate. The nitrogen flow valve is opened, and the flow rates of inert gas and nitrogen are adjusted respectively. The inert gas flow rate is 100-200 sccm, and the partial pressure of inert gas is 0.1-0.3 Pa. Nitrogen is introduced to adjust the pressure in the coating chamber to 0.6-1.0 Pa. The average power density of the AlTi alloy target is set to 15-20 W / cm². 2 The coating is deposited with a peak current of 400 to 800 A and a substrate bias of -40 to -100 V.

Description

Technical Field

[0001] This application relates to the field of coating preparation technology, and in particular to an AlTiN coating, a cutting tool, and a preparation method. Background Technology

[0002] In recent years, advanced manufacturing technologies (such as ultra-precision machining and high-speed machining) have developed rapidly, which has placed higher demands on modern cutting technology. Faster cutting speeds, feed rates, longer service life, and higher precision and stability are the development directions of modern cutting technology. However, when machining some difficult-to-machine materials (such as mold steel, titanium alloys, stainless steel, and high-temperature alloys), higher requirements are placed on the performance of tool coatings. For example, stainless steel has characteristics such as high high-temperature strength, severe plastic deformation during cutting, large cutting forces, severe chip-tool adhesion, high coefficient of linear expansion, and low thermal conductivity. During the cutting process, there are problems such as high temperature, rapid tool wear, and easy workpiece deformation. Therefore, the performance of the tool coating is crucial.

[0003] AlTiN coatings are widely used as tool coatings due to their excellent hardness and high-temperature stability. The Al element in the coating enables the formation of a dense alumina protective film at the high temperatures of high-speed cutting, effectively increasing the coating's oxidation resistance. The solid solution and amplitude modulation decomposition of Al in the AlTiN coating improves its hardness and high-temperature hardness, effectively enhancing its cutting wear resistance. AlTiN coatings with a face-centered cubic phase structure exhibit relatively high hardness, but the larger grain size affects the coating's toughness. AlTiN coatings with a face-centered cubic + hexagonal phase structure have fine nanocrystalline grains, but the coating hardness is significantly reduced. How to obtain a fine nanocrystalline structure while maintaining high coating hardness and improving coating toughness remains a challenge.

[0004] Furthermore, traditional arc deposition techniques result in large, rough particles on the surface, often with large grains, which affects the coating's toughness and surface smoothness, thus impacting high-speed cutting performance. Therefore, to adapt to the development of advanced cutting technologies and the requirements of machining difficult-to-machine materials, it is imperative to seek methods to reduce the grain size and surface roughness of AlTiN coatings while maintaining high hardness and improving their cutting performance. Summary of the Invention

[0005] To solve at least one of the above-mentioned technical problems, this application provides an AlTiN coating, a cutting tool, and a preparation method, and the technical solution adopted is as follows.

[0006] The AlTiN coating preparation method provided in this application uses high-power pulsed sputtering technology to deposit the AlTiN coating, and the AlTiN coating preparation method includes the following process steps:

[0007] The coating chamber was evacuated to And heat to 450 to 600°C;

[0008] Inert gas is introduced, and the gas pressure in the coating chamber is adjusted to 0.5 to 1 Pa. The ion source is turned on, and the bias voltage is adjusted to -400 to... At 800V and a frequency of 40 to 80kHz, the temperature of the coating chamber is reduced to 300 to 400℃ to perform plasma cleaning on the substrate.

[0009] Open the nitrogen flow valve and adjust the flow rates of inert gas and nitrogen respectively. The inert gas flow rate is 100 to 200 sccm and the partial pressure of inert gas is 0.1 to 0.3 Pa. Adjust the pressure of the coating chamber by introducing nitrogen to 0.6 to 1.0 Pa.

[0010] The average power density of the AlTi alloy target was set to 15 to 20 W / cm². 2 The coating is deposited with a peak current of 400 to 800 A and a substrate bias of -40 to -100 V.

[0011] In some embodiments of this application, the AlTi alloy target has the molecular formula Al x Ti 1-x x is 0.6 to 0.7, and the ratio is the atomic ratio.

[0012] In some embodiments of this application, the substrate is subjected to plasma cleaning for 20 to 30 minutes.

[0013] In some embodiments of this application, the substrate is made of high-speed steel, hard alloy, or ceramic.

[0014] In some embodiments of this application, the inert gas is argon.

[0015] The AlTiN coating provided in this application is obtained by deposition using the AlTiN coating preparation method described above. The AlTiN coating has the molecular formula Al m Ti 1-m N n m is 0.5 to 0.7, n is 0.8 to 1.1, and the ratio is the atomic ratio.

[0016] In some embodiments of this application, the thickness of the AlTiN coating is 1 to 5 μm.

[0017] In some embodiments of this application, the AlTiN coating exhibits a (200) preferred orientation.

[0018] In some embodiments of this application, the AlTiN coating is applied to the surface of metal cutting tools or forming molds for friction reduction and wear resistance protection.

[0019] The tool provided in this application has an AlTiN coating deposited on its surface as described above.

[0020] This application has at least the following beneficial effects:

[0021] This application utilizes high-power pulsed sputtering technology to deposit and prepare AlTiN coatings. By employing high N2 partial pressure and high power density deposition, a smooth coating surface with better surface roughness than AlTiN coatings prepared by arc ion plating technology is obtained. A dense structure superior to that of AlTiN coatings prepared by conventional high-power pulsed sputtering technology is also obtained, with non-columnar crystals and fine nanocrystals.

[0022] The AlTiN coating prepared in this application is superior to AlTiN coatings prepared by arc ion plating technology and columnar AlTiN coatings prepared by conventional high-power pulse sputtering technology in high-speed cutting.

[0023] The AlTiN coating prepared in this application has the advantages of flexible deposition method, high deposition rate and controllability, and strong operability. It can be applied to the surface protection of cutting tools such as lathe tools, milling cutters, and drill bits, and extend their service life.

[0024] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0025] The present application will be further illustrated below with reference to the accompanying drawings and embodiments. It should be noted that the embodiments illustrated in the following drawings are exemplary and are only used to explain the present application, and should not be construed as limiting the present application.

[0026] Figure 1 This is a schematic diagram of the coating structure design for this application.

[0027] Figure 2 Comparative images of the surface morphology, cross-sectional morphology, and cutting edge morphology of the coatings in Comparative Examples 1 and 2 and Examples 1 and 2 under a scanning electron microscope.

[0028] Figure 3 The images show a comparison of the XRD patterns of the coatings in Comparative Examples 1 and 2 and Examples 1 and 2.

[0029] Figure 4 For comparison of the Vickers indentation morphology of the coatings in Comparative Examples 1 and 2 and Examples 1 and 2. Detailed Implementation

[0030] The embodiments of this application are described in detail below with reference to the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0031] In the description of this application, it should be understood that the terms "center", "middle", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0032] In the description of this application, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0033] In the description of this application, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0034] In the description of this application, the use of terms such as "as one implementation," "an embodiment," "some examples," "some embodiments," "illustrative embodiment," "example," "specific example," "some examples," etc., indicates that the specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0035] This application relates to a cutting tool whose surface is coated with an AlTiN coating, resulting in a smooth cutting edge surface that meets the performance requirements for high-speed cutting of difficult-to-machine materials.

[0036] The other components and operation of the cutting tool are already described in the relevant technology for those skilled in the art, and will not be described in detail here. The following will introduce the structure of the AlTiN coating and the preparation method of the AlTiN coating.

[0037] This application relates to an AlTiN coating, which is obtained by high-power pulsed sputtering technology. The AlTiN coating has the molecular formula Al m Ti 1-m N n m is 0.5 to 0.7, n is 0.8 to 1.1, and the ratio is the atomic ratio.

[0038] The control of Al content in the coating is to obtain good mechanical properties and oxidation resistance, while the numerical range of n is set to control the metal and nitrogen vacancies in the coating. An optimal nitrogen content in the coating can achieve sufficient lattice distortion. If the value of n is too low or too high, it will lead to changes in the preferred orientation of the coating, thereby affecting its mechanical properties.

[0039] Within the preferred range of n values, the AlTiN coating exhibits a (200) preferred orientation, which is evident. The XRD diffraction peaks of the coating are significantly broadened, and a face-centered cubic Ti(Al)N phase nanocrystal structure is formed in the coating, with fine nanocrystals. The coating is dense and has a smooth surface.

[0040] The coating has a hardness greater than 29 GPa, and while maintaining high hardness, it also has good toughness and machinability.

[0041] The thickness of the AlTiN coating ranges from 1 to 5 μm.

[0042] AlTiN coatings are used for friction reduction and wear resistance protection on the surfaces of metal cutting tools or forming dies.

[0043] This application relates to a method for preparing an AlTiN coating. The method uses high-power pulsed sputtering technology to deposit the AlTiN coating. The high-power pulsed magnetron sputtering technology selects parameters with high ionization rate and high power density to prepare a smooth and dense coating.

[0044] The process flow for preparing AlTiN coatings includes the following steps.

[0045] S1, the coating chamber is evacuated to... And heat it to 450 to 600°C.

[0046] S2, introduce inert gas, adjust the gas pressure in the coating chamber to 0.5 to 1 Pa, turn on the ion source, and adjust the bias voltage to -400 to... At 800V and a frequency of 40 to 80kHz, the temperature of the coating chamber is reduced to 300 to 400℃ to perform plasma cleaning on the substrate.

[0047] S3, open the nitrogen flow valve and adjust the flow rates of inert gas and nitrogen respectively to control their partial pressures. Specifically, the inert gas flow rate is 100 to 200 sccm, the inert gas partial pressure is 0.1 to 0.3 Pa, and the nitrogen flow rate is adjusted to control the pressure in the coating chamber to be 0.6 to 1.0 Pa.

[0048] S4, setting the average power density of the AlTi alloy target to 15 to 20 W / cm² 2 The coating is deposited with a peak current of 400 to 800 A and a substrate bias of -40 to -100 V.

[0049] It should be noted that in step S1, the substrate is subjected to plasma cleaning for 20 to 30 minutes.

[0050] In step S2, argon is used as the inert gas.

[0051] In step S3, the partial pressure ratio of the inert gas and nitrogen ranges from 2 to 10.

[0052] In step S3, during the process of adjusting the gas pressure in the coating chamber to 0.6 to 1.0 Pa with nitrogen, if the gas pressure is lower than 0.6 Pa, it will be difficult to start the ignition due to the low gas pressure, and if the gas pressure is higher than 1.0 Pa, it will result in low deposition efficiency due to the high gas pressure.

[0053] In step S4, the average power density of the AlTi alloy target is 15 to 20 W / cm². 2 To ensure high deposition efficiency, the peak current should be between 400 and 800 A. If the peak current is below 400 A, a high ionization rate cannot be obtained, resulting in low coating density. If the peak current is above 800 A, arcing on the target surface is likely to occur.

[0054] In step S4, the AlTi alloy target has the molecular formula Al x Ti 1-x x is 0.6 to 0.7, and the ratio is the atomic ratio. The selection of the target material composition is to obtain an AlTiN coating with optimized chemical composition under preferred process parameters. High Al content helps to improve the oxidation resistance of the coating, but if the Al content is too high, it is easy to cause the precipitation of hexagonal AlN, thereby reducing the mechanical properties of the coating.

[0055] The substrate is made of high-speed steel, hard alloy, or ceramic.

[0056] The AlTiN coating preparation method disclosed in this application employs high nitrogen partial pressure and high power density deposition to obtain an AlTiN coating with a surface roughness superior to that prepared by arc ion plating, resulting in a smooth coating surface. This method is also superior to AlTiN coatings prepared by conventional high-power pulse sputtering techniques, exhibiting a dense coating structure with non-columnar crystals, presenting as fine nanocrystals.

[0057] The AlTiN coatings prepared in this application include AlTiN coatings prepared by arc ion plating technology during high-speed cutting and columnar AlTiN coatings prepared by conventional high-power pulse sputtering technology.

[0058] The AlTiN coating prepared in this application has the advantages of flexible deposition method, high deposition rate, controllability and strong operability. It can be applied to the surface protection of cutting tools such as turning tools, milling cutters, and drills, and extend the service life of the tools.

[0059] The contents of this application are described in detail below with reference to specific embodiments and comparative examples. It should be noted that the following description is merely illustrative and not a specific limitation of this application.

[0060] This application prepares different AlTiN tool coatings based on high power density high power pulsed magnetron sputtering (HiPIMS) deposition technology, and compares AlTiN tool coatings prepared by arc ion plating technology with AlTiN tool coatings prepared by conventional HIPIMS parameters.

[0061] Comparative Example 1

[0062] 1. The polished cemented carbide substrate (WC-Co alloy) was placed in acetone and ethanol solutions for ultrasonic cleaning for 15 min each. After cleaning, it was dried with nitrogen gas with a purity of ≥99.5%.

[0063] 2. Clamp the cleaned sample onto the workpiece rotating frame, adjust the rotation speed of the rotating frame to 3 rpm, turn on the mechanical pump and molecular pump to draw a vacuum, and turn on the heater and set the heating temperature to 500 ℃.

[0064] 3. Wait until the vacuum degree reaches 5.0×10 3 Pa, open the Ar gas flow valve, adjust the gas pressure to 0.8 Pa, turn on the ion source power supply, and adjust the bias voltage to Pa. The substrate material was plasma cleaned for 25 minutes at 600 V, 80 kHz, and the temperature was reduced to 350 °C.

[0065] 4. Close the Ar gas flow valve, open the N2 gas flow valve, and adjust the flow rate to maintain the gas pressure in the coating chamber at 3.0 Pa. Set the bias voltage on the substrate to [value missing]. 40V, set Ti 40 Al 60 The current density of the arc target is 0.6 A / cm². 2 Enable Ti 40 Al 60 An arc target was used to deposit an AlTiN coating for 60 minutes.

[0066] 5. After deposition, turn off the target power supply and bias power supply, turn off the N2 gas flow valve and heater, and wait for the chamber temperature to drop to room temperature before opening the furnace door to take out the sample to complete the coating.

[0067] Comparative Example 2

[0068] The difference from Comparative Example 1 lies in the substitution of steps 4 and 5.

[0069] Step 4: Adjust the argon flow rate to 130 sccm, open the nitrogen flow valve, and control the total pressure of argon and nitrogen to 0.5 Pa; set up high-power pulse sputtering technology to deposit Al. x Ti 1-x (x: 0.6 to 0.7, atomic ratio) The average power density of the alloy target is 10 W / cm³. 2 With a peak current of 400 A and a substrate bias voltage of -60 V, coating deposition was performed for 2 hours.

[0070] Step 5: After deposition is complete, turn off the target power supply and bias power supply, turn off the Ar gas and N2 gas flow valves and heaters, and wait for the chamber temperature to drop to room temperature before opening the furnace door to remove the sample and completing the coating.

[0071] Example 1

[0072] The difference from Comparative Example 2 lies in the substitution in step 4.

[0073] In step 4, the Ar gas flow rate remains constant, and the total pressure of the deposition gases (argon and nitrogen) is 0.85 Pa; high-power pulsed sputtering technology is used to deposit Al. x Ti 1-x (x: 0.6 to 0.7, atomic ratio) The average power density of the alloy target is 15 W / cm³. 2 Peak current 400 A.

[0074] Example 2

[0075] The difference from Example 1 lies in the substitution of step 4.

[0076] In step 4, Al is deposited using high-power pulsed sputtering technology. x Ti 1-x (x: 0.6 to 0.7) The average power density of the alloy target is 15 W / cm³. 2 Peak current 600 A.

[0077] In this application, a scanning electron microscope (FEI Nova NanoSEM 430) was used to observe and analyze the coating surface, cross-section, and cutting edge surface. An energy-dispersive X-ray spectroscopy (Oxford Instruments X-Max) instrument was employed. N The chemical composition of the coating was analyzed. Nanoindentation (Anton Parr TTX-NHT) was used. 2 The coating hardness was tested and analyzed. The fracture toughness of the coating was measured using Vickers indentation with a 1 kg load applied for 10 s. The cutting experiment was conducted by turning, using a CNMG120408 type WC-6wt.%Co carbide insert, with 316L stainless steel as the workpiece. The cutting speed was 200 m / min, feed rate was 0.2 mm / rev, and depth of cut was 1.0 mm. The coating life was terminated when the tool wear reached 0.2 mm.

[0078] Table 1. Chemical composition (EDX results), coating hardness (nanoindentation results), and cutting life of coated tools for AlTiN coatings.

[0079]

[0080] Table 1 summarizes the structure, chemical composition, and hardness of the AlTiN coatings deposited using different AlTiN coating preparation methods in Comparative Examples 1 and 2 and Examples 1 and 2. It can be seen that the coating compositions are not significantly different. The coating in Comparative Example 1 has higher hardness, while the coating in Comparative Example 2 has lower hardness. Examples 1 and 2 increased the power density of HIPIMS, resulting in hardness close to that of Comparative Example 1. Compared to Comparative Examples 1 and 2, Examples 1 and 2 exhibit longer cutting lives. For the coating in Example 1, despite slightly lower hardness, it still maintains excellent cutting life. The increased hardness of the coating in Example 2 leads to even better cutting life for the tool.

[0081] Figure 1 The secondary electron SEM images show the surface, cross-section, and cutting edge surface of different AlTiN coatings in Comparative Examples 1 and 2 and Examples 1 and 2. It can be seen that the arc-ion-plated AlTiN coating in Comparative Example 1 has a dense columnar crystalline structure. In Comparative Example 2, it has a glassy phase structure with very small, nearly amorphous grains, which explains the low coating hardness. In Examples 1 and 2, the grain size is smaller than in Comparative Example 1, but better crystallized than in Comparative Example 2, achieving the grain conditions for high hardness. The coating surface and cutting edge surface in Comparative Example 1 have particulate defects. The coating surface and cutting edge surface in Comparative Example 2 deposited using conventional HIPIMS technology have a loose structure. The high-power-density, high-power-pulse-sputtered AlTiN coatings in Examples 1 and 2 have a fine nanocrystalline structure, and the surface and cutting edge surface are smooth and dense.

[0082] Figure 1These are schematic diagrams of the microstructures of several AlTiN coatings in this application. Arc-AlTiN is the AlTiN coating prepared by arc ion plating in Comparative Example 1, exhibiting a micron-sized columnar grain structure. HIPIMS-AlTiN is the AlTiN coating prepared by conventional high-power pulsed magnetron sputtering in Comparative Example 2; due to the mixed structure of face-centered cubic and hexagonal phases in the coating, it exhibits a near-amorphous structure. HP-HIPIMS-AlTiN is the AlTiN coating prepared by high-power-density HIPIMS technology in Examples 1 and 2; the coating generates fine nanocrystalline structures under high ion density, resulting in improved toughness and mechanical properties.

[0083] Figure 2 The XRD patterns of the coatings in Examples 1 and 2 show that the coatings in Examples 1 and 2 exhibit a clear (200) preferred orientation and a significant broadening of the XRD diffraction peaks. The (200) preferred orientation and the broadening of the diffraction peaks qualitatively reflect that the enhanced ion bombardment during coating deposition leads to restricted grain growth, increased micro-defects, and grain refinement in the (111) close-packed plane of the coating.

[0084] Figure 3 The images show the fracture toughness indentation patterns of several AlTiN coatings. The coating obtained in Comparative Example 1 exhibits numerous annular cracks in its Vickers indentation, with these cracks being both prominent and deep. The coating in Comparative Example 2 shows long diagonal cracks, indicating poor fracture toughness. The coatings in Examples 1 and 2 show very few annular cracks in their Vickers indentations, and the diagonal cracks are very short, qualitatively reflecting the improved fracture toughness of the coatings in Examples 1 and 2 of this invention.

[0085] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application. Furthermore, unless otherwise specified, the embodiments and features described in the embodiments of this application can be combined with each other.

Claims

1. A method for preparing an AlTiN coating, characterized in that: The preparation method employs high-power pulsed sputtering technology to deposit an AlTiN coating. The preparation method includes... The coating chamber was evacuated to And heat to 450 to 600°C; Inert gas is introduced, and the gas pressure in the coating chamber is adjusted to 0.5 to 1 Pa. The ion source is turned on, and the bias voltage is adjusted to -400 to... At 800V and a frequency of 40 to 80kHz, the temperature of the coating chamber is reduced to 300 to 400℃ to perform plasma cleaning on the substrate. Open the nitrogen flow valve and adjust the flow rates of inert gas and nitrogen respectively. The inert gas flow rate is 100 to 200 sccm and the partial pressure of inert gas is 0.1 to 0.3 Pa. Adjust the pressure of the coating chamber by introducing nitrogen to 0.6 to 1.0 Pa. The average power density of the AlTi alloy target was set to 15 to 20 W / cm². 2 The coating is deposited with a peak current of 400 to 800 A and a substrate bias of -40 to -100 V. The AlTi alloy target has the molecular formula Al x Ti 1-x x is 0.6 to 0.7, and the ratio is the atomic ratio; The AlTiN coating obtained by the preparation method exhibits a (200) preferred orientation, and the grains of the coating are fine nanocrystals and non-columnar crystals.

2. The method for preparing AlTiN coating according to claim 1, characterized in that: The substrate is subjected to plasma cleaning for 20 to 30 minutes.

3. The method for preparing AlTiN coating according to claim 1, characterized in that: The substrate is made of high-speed steel, hard alloy, or ceramic.

4. The method for preparing AlTiN coating according to claim 1, characterized in that: Argon is used as the inert gas.

5. An AlTiN coating, characterized in that: The AlTiN coating is obtained by deposition using the preparation method described in any one of claims 1 to 4, and the AlTiN coating has the molecular formula Al m Ti 1-m N n m is 0.5 to 0.7, n is 0.8 to 1.1, and the ratio is the atomic ratio.

6. The AlTiN coating according to claim 5, characterized in that: The thickness of the AlTiN coating is 1 to 5 μm.

7. The AlTiN coating according to claim 6, characterized in that: The AlTiN coating is applied to the surface of metal cutting tools or forming molds for friction reduction and wear resistance protection.

8. A cutting tool, characterized in that: The surface of the cutting tool is deposited with an AlTiN coating as described in any one of claims 5 to 7.

Images