Server component, server and method for operating server component

Abstract

The invention relates to the field of servers, and provides a server assembly, a server and a method for operating the server assembly. The deformation part is used for generating a first state or a second state according to deformation; the resisting part is connected to the carrier and is used for resisting the deformation piece when the deformation piece is in the first state; and the inserting part is used for installing the server assembly.

Description

Technical Field

[0001] The present invention relates to the field of servers, and more particularly to a server component, a server, and a method for operating a server component. Background Art

[0002] The server room includes a server rack, which may include multiple layered racks on which servers (such as server chassis) may be placed. The server itself may be assembled from different server components. Since the space in the server rack layer is limited, the size of each server is also limited, which also limits the size of the server components.

[0003] The inventors have discovered that, in some cases, the size limitation of the server components causes inconvenience in the installation and removal of the server components. Summary of the invention

[0004] According to one aspect of the present invention, a server component is proposed, comprising: a carrier; a deformable member, the deformable member being used to generate a first state or a second state according to deformation; a resisting portion, connected to the carrier and used to resist the deformable member when the deformable member is in the first state; and a plug-in portion, used to install the server component.

[0005] In some embodiments, the server component includes a limiting member, and the limiting member is used to limit the position of the deformable member.

[0006] In some embodiments, the server assembly includes an optical module mounted to the carrier.

[0007] In some embodiments, the server assembly includes a circuit board, and the optical module is electrically connected to the circuit board.

[0008] In some embodiments, the limiting member includes an opening, and the deformable member passes through the opening.

[0009] In some embodiments, the deformable member is an elongated deformable member.

[0010] According to one aspect of the present invention, a server is provided, which includes the server component and a mounting base; wherein the plug-in portion of the server component is mounted to the mounting base.

[0011] In some embodiments, the server includes a plurality of computing chips.

[0012] In some embodiments, the computing chip includes a GPU.

[0013] According to one aspect of the present invention, a method for operating a server component is proposed, wherein the server component comprises: a carrier; a plug-in portion for installing the server component; a deformable member, wherein the deformable member is used to generate a first state or a second state according to deformation; a resisting portion connected to the carrier and used to resist the deformable member when the deformable member is in the first state; wherein the server component is installed to a mounting base of the server via the plug-in portion; the method comprises: changing the deformable member from the first state to the second state, and in the second state, applying a force to the deformable member so that the server component is separated from the mounting base.

[0014] Due to the existence of the deformable member, the deformable member is used to produce a first state or a second state according to deformation. In the second state, the deformable member can provide a larger operating space to provide a fulcrum for disassembling the server component; while in the first state, the deformable member can be accommodated in a smaller space range, which is conducive to adapting to the size specifications of the server component and the server.

[0015] Various aspects, features, advantages, etc. of the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. According to the following detailed description in conjunction with the accompanying drawings, the above aspects, features, advantages, etc. of the present invention will become more clear. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a top view of the server assembly 100 .

[0017] Figure 2 is another view of server component 100 .

[0018] Figure 3 It is some structural components of the server 1000.

[0019] Figure 4 This is a schematic diagram of an optical module. DETAILED DESCRIPTION

[0020] In order to facilitate understanding of various aspects, features and advantages of the technical solution of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings. It should be understood that the various embodiments described below are only for illustration and are not intended to limit the scope of protection of the present invention.

[0021] Embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although some embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure should not be interpreted as being limited to the embodiments described herein, but rather, these embodiments are provided to provide a more thorough and complete understanding of the present disclosure. It should be understood that the drawings and embodiments of the present disclosure are only for exemplary purposes and are not intended to limit the scope of protection of the present disclosure.

[0022] It should be noted that the various parts or components described in the various embodiments of the present disclosure are merely illustrative. In some cases, some of the parts or components may be omitted, or replaced with other parts or components having the same or similar functions, or additional parts or components may be added.

[0023] It should be understood that when an element or feature is referred to as being "on another element or layer," "connected to," or "coupled to" another element or layer, it can be directly on, connected to, or coupled to the other element or feature, or there can be one or more intervening elements or features. In addition, it should be understood that when an element or feature is referred to as being "between" two elements or features, it can be the only element or feature between the two elements or features, or there can also be one or more intervening elements or features. The terms "first," "second," and other such numerical terms referring to structures do not imply a sequence or order unless the context clearly indicates.

[0024] like Figure 1 , shows a top view of a server assembly 100, the server assembly 100 includes: a carrier 110; a deformable member 120, the deformable member 120 is used to generate a first state or a second state according to deformation; a resisting portion 130, connected to the carrier 110, and used to resist the deformable member 120 when the deformable member 120 is in the first state. The server assembly 100 may also include a plug-in portion 140, which is used to install the server assembly 100, for example, to install the server assembly 100 on other structures.

[0025] exist Figure 1 In the embodiment, the deformable member 120 is in the second state. At this time, a section 121 of the deformable member 120 (i.e., located at Figure 2 The portion in the dashed box) can be pressed to the stopper 130, so that the deformable member 120 is changed from the second state to the first state. In one example, the stopper 130 is protruded from the carrier 110 (see Figure 2 ), so that it can resist the deformable member 120. The deformable member 120 is elastic, and a section 121 of the deformable member 120 can be pressed to the side where the resisting portion is located inside the carrier 110, thereby, the deformable member 120 itself can be deformed and restricted inside the carrier 110.

[0026] Exemplarily, the material of the deformable member may include metal material, plastic material, etc. In some embodiments, the deformable member may include a steel wire rope, and the deformable member may further include a wrapping wrapping the steel wire rope, that is, the steel wire rope is used as the core layer of the deformable member.

[0027] In some embodiments, the server assembly includes an optical module mounted to the carrier.

[0028] In some embodiments, the server assembly includes a circuit board, and the optical module is electrically connected to the circuit board.

[0029] Exemplarily, the server assembly 100 includes stoppers 150A, 150B, 150C, and 150D. Figure 1 The limit members 150A and 150B are shown in FIG. Figure 2 The limiting members 150A, 150B, 150C, and 150D are more clearly marked in the figure, and the limiting members can be used to limit the position of the deformable member 120. In some cases, the deformable member 120 can be prevented from shaking or shifting its position unnecessarily, so as to prevent the blocking portion from completely blocking the deformable member 120. Exemplarily, the limiting members 150A, 150B, 150C, and 150D include openings, and the deformable member passes through the openings.

[0030] also, Figure 1 It is also shown that the carrier 110 has a fixing portion 160A and a fixing portion 160B, and the first portion and the second portion of the stopper 120 can be fixed to the fixing portion 160A and the fixing portion 160B respectively. In some other embodiments, the fixing portion can also be disposed in other structures of the server assembly 100 .

[0031] Figure 3 1 shows some structures of a server 1000, specifically showing a schematic diagram of the server component 100 being installed on a mounting base 200 of the server. Figure 3 In the figure, the deformable member is in the second state and is not restricted by the resisting portion. Thus, in the second state, the deformable member 120 can be used to lift the server assembly 100. The detailed functions and method steps will be further described.

[0032] The embodiment of the present invention also provides a method for operating a server component 100, the method comprising: changing the deformable member 120 from a first state to a second state, in the second state, applying a force to the deformable member so that the server component 100 is separated from the mounting base. Through the design of the deformable member 120, when the server component 100 is installed on the mounting base 200, the deformable member 120 can be in the first state, and the deformable member 120 can be restricted to the blocking portion, which is equivalent to the deformable member 120 being accommodated, so that the overall size of the server is appropriate. When the server component 100 needs to be disassembled or separated from the mounting base 200, the deformable member 120 is changed from the first state to the second state, in the second state, the deformable member 120 is not blocked by the blocking portion, and has more operable space, and the deformable member 120 can be used as a force point (force bearing part), and the deformable member 120 can be lifted manually or mechanically, so that the server component 100 can be easily lifted and the server 100 can be separated from the mounting base 200.

[0033] In this way, the server component itself and the additional space required by the server itself are saved, and it is avoided to design a complex structure as a lifting force point for disassembling (separating) the server component.

[0034] In some embodiments, the server 1000 may include a computing chip (not shown), which may include but is not limited to a graphics processing unit (GPU), a neural network processor (NPU), a tensor processing unit (TPU), an intelligent processing unit (IPU), a deep learning processor (DPU), etc. The computing chip may be installed in an installation base in the server.

[0035] In some embodiments, the server component may include an optical module, and the optical module is pluggably mounted on the server component.

[0036] Figure 4 , a schematic diagram of an optical module 400 is shown in FIG. The optical module 400 may include an electrical input / output interface EI / O, an optical input / output interface OI / O, an optical transmitting unit 101, an optical receiving unit 102, and a control unit 103. The term "electrical input / output interface" includes at least one electrical input port and at least one electrical output port. The term "optical input / output interface" includes at least one optical input port and at least one optical output port. Exemplarily, the electrical input / output interface may include 4 electrical input ports and 4 electrical output ports, and the optical input / output interface may include 4 optical input ports and 4 optical output ports.

[0037] The optical transmitting unit 101 may also be referred to as a TX unit, and is used to convert an input electrical signal 410 received from an electrical input port (or from an electrical input / output interface EI / O) into an output optical signal 420, i.e., perform electrical-to-optical conversion (also referred to as EO conversion), and the optical signal may be output via an optical output port.

[0038] The optical receiving unit 102 may also be referred to as an RX unit, and is used to convert an input optical signal 430 received from an optical input port (or from an optical input / output interface OI / O) into an output electrical signal 440 , that is, to perform optical-to-electrical conversion (also referred to as OE conversion).

[0039] The control unit 103 may be any form of controller or microcontroller, and is used to control the light emitting unit 101 to perform electrical-optical conversion from the input electrical signal 410 to the output optical signal 420. Similarly, the control unit 103 may also control the light receiving unit 102 to perform photoelectric conversion from the input optical signal 430 to the output electrical signal 440.

[0040] Exemplarily, the method of electro-optical conversion may include modulating an initial optical signal using an electrical signal carrying information, thereby outputting an optical signal carrying information.

[0041] Exemplarily, the photoelectric conversion process may include using a photodetector to convert an optical signal into an electrical signal.

[0042] Those skilled in the art should understand that what is disclosed above is only an implementation mode of the present invention, and it certainly cannot be used to limit the scope of rights for patent protection requested by the present invention. Equivalent changes made according to the implementation mode of the present invention are still within the scope covered by the claims of the present invention.

Claims

1. A server component, comprising: Carrier; A deformation member, wherein the deformation member is used to generate a first state or a second state according to deformation; a resisting portion, connected to the carrier, and used to resist the deformable member when the deformable member is in the first state; as well as The plug-in portion is used for installing the server component. 2 . The server component according to claim 1 , comprising a limiting member, wherein the limiting member is used to limit the position of the deformable member. 3 . The server assembly of claim 1 , comprising an optical module mounted to the carrier. 4 . The server assembly of claim 3 , comprising a circuit board, the optical module being electrically connected to the circuit board.

5. The server component of claim 2, wherein: The limiting member comprises an opening, and the deformable member passes through the opening.

6. The server component of claim 2, wherein: The deformable member is a long deformable member.

7. A server, comprising the server component according to any one of claims 1 to 6; and Install the substrate; in, The plug-in portion of the server assembly is mounted to a mounting base.

8. The server of claim 7, comprising a plurality of computing chips.

9. The server of claim 8, wherein the computing chip comprises a GPU.

10. A method of operating a server component, wherein: The server component comprises: a carrier; A plug-in portion, used for installing the server component; a deformable member, the deformable member is used to generate a first state or a second state according to deformation; a resisting portion, connected to the carrier, used to resist the deformable member when the deformable member is in the first state; Wherein, the server component is mounted to the mounting base of the server via a plug-in portion; The method comprises: changing the deformable member from a first state to a second state, and in the second state, applying a force to the deformable member so that the server component is separated from the installation base.

Images