Method for determining use condition of semiconductor photomask and electronic equipment

Abstract

The invention provides a semiconductor photomask use condition determination method, electronic equipment and a computer readable storage medium. The method comprises the following steps: displaying an identifier of a to-be-tested component in a to-be-tested chip in a first interface; receiving a first operation of a first control in the first interface; and in response to the first operation, determining a photomask use condition of the to-be-tested component by using the determination software module and the process design tool library, and displaying the photomask use condition of the to-be-tested component in the second interface. According to the method, the use condition of the photomask of the to-be-tested component in the to-be-tested chip is determined and calculated based on the method, the use condition of the photomask of the to-be-tested component in the to-be-tested chip can be efficiently and accurately calculated, and when calculation is carried out based on the method, the calculation time is short, so that the iteration efficiency of design is improved.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to a method for determining the usage of a semiconductor mask, an electronic device, and a computer-readable storage medium. Background Art

[0002] In the prior art, masks are widely used in the manufacturing process of electronic devices. However, when components, integrated circuits or chips are formed based on masks, it is necessary to calculate the usage of components and various masks. With the intensification of market competition, cost reduction and efficiency improvement have become the goals of many companies, which requires repeated modification of the device list used in the product, adjustment of the devices used in the product, and manual calculation of the required number of masks and mask types by comparing the device mask comparison table, in an attempt to reduce costs while improving product quality. However, when manually calculating the required number of masks and mask types, the calculation efficiency and accuracy are low, and after adjusting the devices used in the circuit, it is necessary to re-find the number of masks corresponding to the device and the number of masks corresponding to the process, and then recalculate. However, multiple recalculations are prone to increase the error rate, and the process is cumbersome, which makes the early chip design and cost evaluation time longer and the design iteration efficiency lower.

[0003] For example, before a chip is put into mass production, it needs to be tested through tape-out to test its function, performance, and yield. In order to save costs, design companies need to repeatedly evaluate and correct the process nodes and devices used in the product during the initial cost assessment and circuit structure design process. Since the mask plays an important role in the chip manufacturing process, and the mask cost accounts for a large proportion of the tape-out cost, during the chip design process, the design company also needs to calculate the final use of the mask in the product. Summary of the invention

[0004] The present application provides a method for determining the usage of semiconductor masks, an electronic device and a computer-readable storage medium to solve the problem of low calculation efficiency and accuracy when manually calculating the number of masks and mask types required, thereby freeing designers from the tedious and error-prone work of manually comparing and calculating the usage of masks for a large number of devices, greatly shortening the time for early chip tape-out cost evaluation and improving design iteration efficiency.

[0005] In a first aspect, the present application provides a method for determining the usage of a semiconductor mask, the method comprising:

[0006] Displaying identifications of components to be tested in the chip to be tested in the first interface;

[0007] Receiving a first operation of a first control in a first interface;

[0008] In response to the first operation, the mask usage of the component to be tested is determined by using the correspondence between the preset identifications of the plurality of components and the mask usage of the components, and the mask usage of the component to be tested is displayed in the second interface.

[0009] The first aspect of the present application provides a method for determining the usage of a semiconductor mask. When determining the usage of the mask of a chip to be tested based on this method, the identification of the components to be tested in the chip to be tested can be displayed in the first interface, and the first operation of the first control in the first interface can be received and responded to. After responding to the first operation, based on the correspondence between the identification of multiple preset components and the mask usage of the components, the mask usage of the components to be tested can be determined, and the mask usage of the components to be tested can be displayed in the second interface. Determining and calculating the mask usage of the components to be tested in the chip to be tested based on this method can efficiently and accurately calculate the mask usage of the components to be tested in the chip to be tested, and when calculating based on this method, the calculation time is short, thereby improving the iteration efficiency of the design.

[0010] In a possible design, the method of displaying the identification of the component to be tested in the chip to be tested in the first interface includes:

[0011] Receiving a second operation of a second control in a third interface;

[0012] In response to the second operation, displaying identifications of multiple components in a fourth interface;

[0013] Receiving a third operation in the fourth interface, where the third operation is used to select an identification of a component to be tested from a plurality of preset identifications of components;

[0014] In response to the third operation, the identification of the component to be tested is displayed in the first interface.

[0015] In one possible design, the method further includes:

[0016] Receiving a fourth operation of a third control in the second interface;

[0017] In response to the fourth operation, displaying a fourth interface;

[0018] Receiving a fifth operation in the fourth interface, the fifth operation is used to reselect an identification of the component to be tested from identifications of multiple components;

[0019] In response to the fifth operation, displaying the identification of the reselected component to be tested in the first interface;

[0020] Receiving a first operation of a first control in a first interface;

[0021] In response to the first operation, a fifth interface is displayed, wherein the fifth interface is used to notify that the component to be tested has been reselected;

[0022] Receiving the sixth operation in the fifth interface;

[0023] In response to the sixth operation, the mask usage of the reselected component to be tested is determined by using the correspondence between the identifiers of the multiple components and the mask usage of the components, and the mask usage of the reselected component to be tested is displayed in the second interface.

[0024] In a possible design, the method of displaying the identification of the component to be tested in the chip to be tested in the first interface includes:

[0025] Displaying the graphics of the components to be tested in the sixth interface;

[0026] Receiving a seventh operation of the fourth control in the sixth interface;

[0027] In response to the seventh operation, the identification of the component to be tested is displayed in the first interface.

[0028] In one possible design, the method further includes:

[0029] Receiving a fourth operation of a third control in the second interface;

[0030] In response to the fourth operation, displaying a sixth interface;

[0031] Receiving an eighth operation in the sixth interface, where the eighth operation is used to update the graphics of the component to be tested;

[0032] In response to the eighth operation, displaying the updated graphic of the component to be tested in the sixth interface;

[0033] Receiving the seventh operation in the sixth interface;

[0034] In response to the seventh operation in the sixth interface, displaying the updated identification of the component to be tested in the first interface;

[0035] Receiving a first operation of a first control in a first interface;

[0036] In response to the first operation, a fifth interface is displayed, where the fifth interface is used to notify that the component to be tested has been updated;

[0037] Receiving the sixth operation in the fifth interface;

[0038] In response to the sixth operation, the updated mask usage of the component to be tested is determined by using the correspondence between the identifiers of the multiple components and the mask usage of the components, and the updated mask usage of the component to be tested is displayed in the second interface.

[0039] In a possible design, at least some of the components to be tested require the use of a photomask.

[0040] In a possible design, the mask usage of the component to be tested includes: the number of masks and the type of masks.

[0041] In a second aspect, the present application provides an electronic device, comprising: at least one memory and at least one processor;

[0042] Memory is used to store computer executable programs or instructions;

[0043] The processor is used to call the computer executable program or instruction in the memory so that the electronic device executes any of the above methods.

[0044] In a third aspect, the present application provides a computer-readable storage medium, which stores a computer-executable program or instructions, and the computer-executable program or instructions are configured to execute any of the above methods.

[0045] The beneficial effects of the second aspect, the third aspect and the possible designs of the second aspect and the third aspect can be referred to the beneficial effects brought about by the first aspect and the possible implementation methods of the first aspect, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 A method flow chart of a method for determining the usage of a semiconductor mask provided in the present application;

[0047] Figure 2 A method flow chart of a method for displaying identifications of components to be tested in a chip to be tested in a first interface in the present application;

[0048] Figure 3 An interface display diagram of the first interface and / or the fourth interface in a possible design of the present application;

[0049] Figure 4 A method flow chart of another method for determining the usage of a semiconductor mask provided by the present application;

[0050] Figure 5 A method flow chart of another method for displaying identifications of components to be tested in a chip to be tested in a first interface in the present application;

[0051] Figure 6 A flow chart of another method for determining the usage of a semiconductor mask provided by the present application. DETAILED DESCRIPTION

[0052] In this application, "at least one" means one or more, and "plurality" means two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone, where A and B can be singular or plural. The character " / " generally indicates that the associated objects before and after are in an "or" relationship. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, at least one of a, b, or c alone can represent: a, b, c, a and b, a and c, or a, b, and c, where a, b, and c can be single or multiple. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0053] The directions or positional relationships indicated by terms such as "center", "longitudinal", "lateral", "up", "down", "left", "right", "front", and "back" are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present application and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present application.

[0054] The terms "connected" and "connected" should be understood in a broad sense. For example, the "connected" or "connected" of a circuit structure can refer to not only physical connection, but also electrical connection or signal connection. For example, it can be directly connected, that is, physically connected, or indirectly connected through at least one intermediate element, as long as the circuit is connected, or it can be the internal connection of two elements; signal connection can refer to signal connection through a circuit or through a media medium, such as radio waves. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0055] refer to Figure 1 , Figure 1 This is a method flow chart of a method for determining the usage of a semiconductor mask provided by the present application. The present application provides a method for determining the usage of a semiconductor mask, the method comprising:

[0056] Step S1: Displaying the identification of the components to be tested in the chip to be tested in the first interface;

[0057] Step S2: receiving a first operation of a first control in a first interface;

[0058] Step S3: in response to the first operation, the mask usage of the component to be tested is determined by using the correspondence between the preset identifications of the components and the mask usage of the components, and the mask usage of the component to be tested is displayed in the second interface.

[0059] The present application provides a method for determining the usage of a semiconductor mask. When determining the usage of a mask of a component to be tested in a chip to be tested based on the method, the identification of the component to be tested in the chip to be tested is displayed in a first interface, and a first operation of a first control of the first interface is received and responded to. After responding to the first operation, the usage of the mask of the component to be tested can be determined based on the correspondence between the identification of a plurality of preset components and the usage of the mask of the component, and the usage of the mask of the component to be tested is displayed in a second interface. Based on the method for determining and calculating the usage of the mask of the component to be tested in the chip to be tested, the usage of the mask of the component to be tested in the chip to be tested can be calculated efficiently and accurately, and when calculating based on the method, the calculation time is short and the accuracy is high, which can effectively improve the iteration efficiency when designing the chip. In addition, when there are many components used in the circuit, compared with the traditional method, the calculation speed of this method is faster and the calculation result is more accurate.

[0060] The present application provides a method for determining the use of a semiconductor mask, in which, before determining the use of the mask, it is necessary to pre-set the correspondence between the identification of multiple components and the use of the mask of the components. The multiple component identifications may include: a component identification library, and the mask use may include: a device mask correspondence table, wherein the identification of the component includes but is not limited to: the model of the component, the name of the component, the type of the component, and the layout file of the component.

[0061] When determining the semiconductor mask usage based on the semiconductor mask usage determination method provided in the present application, the correspondence between the identification of multiple components and the mask usage of the components can be set in the process design tool library. The correspondence between the identification of multiple components and the mask usage of the components can be indicated based on the determination software module. The process design tool library and the determination software module are set in an electronic device for determining the semiconductor mask usage. The addresses of the process design tool library and the determination software module can be set in the calculation determination program corresponding to the determination method.

[0062] The use of the semiconductor mask can be determined based on the EDA tool, and a calculation determination program for determining the use of the semiconductor mask is provided in the EDA tool, and the EDA tool includes: a determination software module and a process design tool library.

[0063] When determining the usage of semiconductor masks based on the EDA tool, the calculation determination program corresponding to the determination method is designed in the EDA tool. After opening the EDA tool, step S1, step S2 and step S3 are executed based on the EDA tool. Step S1: The EDA tool calls the component identification library in the process design tool library so that the identification of the components to be tested in the chip to be tested can be displayed on the first interface. After determining that the identification of the components to be tested is correct, the first operation of the first control is executed in the first interface. Step S2: The EDA tool receives the instruction of the first operation of the first control. Step S3: The EDA tool responds to the first operation, determines that the software module calls the device mask correspondence table in the process design tool library to obtain the mask usage of each component to be tested in the first interface, determines that the software module calculates the sum of the mask usage of all components to be tested in the first interface based on the obtained mask usage of each component to be tested in the first interface, and displays the sum of the mask usage of all components to be tested in the first interface in the second interface.

[0064] Among them, the identifications of the components to be tested displayed in the first interface are all identifications of the components in the graphics of the elements to be tested in the chip to be tested, that is, the identifications of the components to be tested are identifications of the components used in the circuit diagram of the chip to be tested.

[0065] The component identification library in the EDA tool may include: identifications of components to be tested in the chip to be tested, and the components in the device mask correspondence table include: components to be tested in the chip to be tested.

[0066] The electronic device that performs the steps of the semiconductor mask usage determination method includes but is not limited to: EDA tools. The specific electronic device can be determined based on specific needs, and the electronic device only needs to be able to set a corresponding calculation determination program. The above is only described in detail using the EDA tool as an example, and there is no specific requirement for the electronic device that performs the above steps.

[0067] refer to Figure 2 , Figure 2 The method flow chart of a method for displaying the identification of the components to be tested in the chip to be tested in the first interface in the present application. In a possible design of the present application, the method for displaying the identification of the components to be tested in the chip to be tested in the first interface includes:

[0068] Step S11: receiving a second operation of a second control in the third interface;

[0069] Step S12: In response to the second operation, displaying identifications of multiple components in the fourth interface;

[0070] Step S13: receiving a third operation in the fourth interface, where the third operation is used to select an identification of a component to be tested from a plurality of preset identifications of components;

[0071] Step S14: In response to the third operation, the identification of the component to be tested is displayed in the first interface.

[0072] In a possible design of the present application, a method for displaying the identification of components to be tested in a chip to be tested in a first interface includes: a first method for displaying the identification of components to be tested in a chip to be tested, wherein the first method for displaying the identification of components to be tested in a chip to be tested is a method for displaying the identification of components to be tested in a first interface based on the above-mentioned steps S11, S12, S13 and S14.

[0073] When executing step S11, step S12, step S13 and step 14, in the method of first displaying the identification of the components to be tested in the chip to be tested, the third interface includes: an interface obtained after opening the calculation determination program corresponding to the determination method; executing the second operation of the second control on the third interface includes: the user selects the second control on the third interface, and performs the second operation on the second control to open the component identification library, so that the third interface jumps to the fourth interface, wherein the fourth interface includes: an interface obtained after opening the component identification library.

[0074] At this time, the fourth interface displays the identification of multiple components for the user to select; in the fourth interface, the user performs the third operation, and the third operation is used to select the identification of the component to be tested in the fourth interface, and the third operation can select multiple component identifications at the same time for transmission. After executing the third operation, the identification of the component to be tested is displayed in the first interface for subsequent steps, thereby displaying the number of masks used for the component to be tested in the second interface.

[0075] In addition, the identifiers of the components to be tested displayed in the first interface can be combined into a component list, and the component list can be stored in a user-specified path. The subsequently formed component list can also be stored in the stored component list. When the mask usage of the same group of components needs to be calculated later, it can be directly imported without repeated manual selection, for easy viewing.

[0076] Among them, in the above steps, after the third operation is performed on the fourth interface, when the identification of the non-component to be tested is still displayed in the first interface, the identification of the non-component to be tested can be removed based on the seventh operation.

[0077] Figure 3 This is an interface display diagram of the first interface and / or the fourth interface in a possible design of this application. Figure 3In a possible design of the present application, the fourth interface and the first interface may be the same interface, that is, the interface displays the identification of multiple components while also displaying the identification of the component to be tested.

[0078] Figure 3 The interface shown is the interface that may appear when the first interface and the fourth interface are the same interface. In this interface, the identifiers in the cells are the identifiers of each component in the component identification library, and the identifiers in the device list are the identifiers of the components to be tested. In this interface, when a selection error occurs after executing the third operation, the identifiers of the components not to be tested can be removed based on the seventh operation, that is, after selecting the identifiers of the components not to be tested, the selected component identifiers can be deleted based on the delete key.

[0079] In a possible design of the present application, the identification of components that do not require a mask in the component identification library can also be displayed in the first interface, so as to facilitate selection when additional components need to be added later.

[0080] refer to Figure 4 , Figure 4 A method flow chart of another method for determining the usage of a semiconductor mask provided in the present application. In a possible design of the present application, the method further includes:

[0081] Step S15: receiving a fourth operation of the third control in the second interface;

[0082] Step S16: In response to the fourth operation, displaying a fourth interface;

[0083] Step S17: receiving a fifth operation in the fourth interface, where the fifth operation is used to reselect an identification of the component to be tested from identifications of a plurality of components;

[0084] Step S18: In response to the fifth operation, the identification of the reselected component to be tested is displayed in the first interface;

[0085] Step S19: receiving a first operation of a first control in the first interface;

[0086] Step S110: In response to the first operation, displaying a fifth interface, the fifth interface being used to notify that the component to be tested has been reselected;

[0087] Step S111: receiving a sixth operation in the fifth interface;

[0088] Step S112: in response to the sixth operation, the mask usage of the reselected component to be tested is determined by using the correspondence between the identifiers of the multiple components and the mask usage of the components, and the mask usage of the reselected component to be tested is displayed in the second interface.

[0089] In a possible design of the present application, after the user obtains the mask usage of the components to be tested based on the above steps, the user determines whether the chip to be tested needs to add or delete components based on the mask usage of the components to be tested and product requirements evaluation.

[0090] When the user determines to add or delete components, the user performs a fourth operation on the third control in the second interface of the electronic device used to determine the use of semiconductor masks, and the electronic device receives and responds to the fourth operation. The fourth operation is a return operation, that is, jumping back from the second interface to the fourth interface. When in the fourth interface, the user performs a fifth operation to reselect the identification of the component to be tested in the component identification library in the fourth interface, or performs a seventh operation in the fourth interface to remove the component to be tested that needs to be deleted from the component list, so as to display the list of components to be tested obtained after the reselection in the first interface, and the component list obtained after the reselection includes: the identification of the reselected component to be tested. The first interface displays the identification of the component to be tested after the reselection. At this time, the electronic device receives and responds to the first operation of the first control in the first interface, and displays the fifth interface. The fifth interface can display the reselected components to be tested, and display the number of masks added or deleted after the reselection of the components to be tested, so as to facilitate real-time judgment whether to add or delete components. The electronic device receives and responds to the sixth operation of the fifth interface to display the use of the mask of the reselected component to be tested in the second interface.

[0091] The fifth operation may be the same as the third operation, and if the user is not satisfied with the sum of the number of masks of the components to be tested in the list of components to be tested obtained after reselection, the above steps may be repeated until the user meets the requirements.

[0092] refer to Figure 5 , Figure 5 This is a method flow chart of another method for displaying the identification of the components to be tested in the chip to be tested in the first interface in the present application. In a possible design of the present application, the identification of the components to be tested in the chip to be tested is displayed in the first interface, including:

[0093] Step S21: displaying the graphics of the components to be tested in the sixth interface;

[0094] Step S22: receiving a seventh operation of the fourth control in the sixth interface;

[0095] Step S23: In response to the seventh operation, the identification of the component to be tested is displayed in the first interface.

[0096] In a possible design of the present application, environmental variables of the chip to be tested may be pre-set in an electronic device for determining the use of a semiconductor mask. The environmental variables are the simulation environment when the chip to be tested is prepared, or the environmental variables when the chip to be tested is working.

[0097] In a possible design of the present application, a method for displaying the identification of components to be tested in a chip to be tested in a first interface includes: a second method for displaying the identification of components to be tested in a chip to be tested, wherein the second method for displaying the identification of components to be tested in a chip to be tested is a method for displaying the identification of components to be tested in a first interface based on the above-mentioned steps S21, S22 and 23.

[0098] In the second method for displaying the identification of components to be tested in the chip to be tested, the method for displaying the identification of components to be tested in the chip to be tested in the first interface also includes: after opening the electronic device used to determine the use of the semiconductor mask, obtaining the graphic of the components to be tested to display the graphic of the components to be tested in the sixth interface, after receiving the seventh operation of the fourth control in the sixth interface, the electronic device will automatically capture the components to be tested in the graphic of the components to be tested and the connection relationship of each component to be tested to generate a netlist file of the graphic of the components to be tested, and based on the netlist file, display the identification of the components to be tested in the first interface.

[0099] Among them, the netlist file includes: information of each component to be tested in the graphics of the components to be tested, the graphics of the components to be tested is a circuit diagram prepared based on each component to be tested, and the method of obtaining the graphics of the components to be tested includes but is not limited to: importing a pre-stored circuit diagram into an electronic device, or drawing a graphics of the components to be tested in the electronic device.

[0100] refer to Figure 6 , Figure 6 A method flow chart of another method for determining the usage of a semiconductor mask provided by the present application. In a possible design of the present application, the method further includes:

[0101] Step S24: receiving a fourth operation of the third control in the second interface;

[0102] Step S25: In response to the fourth operation, displaying a sixth interface;

[0103] Step S26: receiving an eighth operation in the sixth interface, where the eighth operation is used to update the graphics of the component to be tested;

[0104] Step S27: in response to the eighth operation, displaying the updated graphic of the component to be tested in the sixth interface;

[0105] Step S28: receiving the seventh operation in the sixth interface;

[0106] Step S29: In response to the seventh operation in the sixth interface, the updated identification of the component to be tested is displayed in the first interface;

[0107] Step S210: receiving a first operation of a first control in a first interface;

[0108] Step S211: In response to the first operation, displaying a fifth interface, the fifth interface being used to notify that the component to be tested has been updated;

[0109] Step S212: receiving the sixth operation in the fifth interface;

[0110] Step S213: in response to the sixth operation, the updated mask usage of the component to be tested is determined by using the correspondence between the identifiers of the multiple components and the mask usage of the components, and the updated mask usage of the component to be tested is displayed in the second interface.

[0111] In a possible design of the present application, after obtaining the identification of the component to be tested based on the second method of displaying the identification of the component to be tested in the chip to be tested, and obtaining the mask usage of the component to be tested based on the above steps 2 and 3, if the user needs to update the graphics of the component to be tested, the updated mask usage of the component to be tested graphics can be obtained through steps S24, step S25, step S26, step S27, step S28, step S29, step S210 and step S211.

[0112] When the user needs to update the graphics of the components to be tested, the electronic device receives and responds to the fourth operation of the second interface, thereby displaying the sixth interface. In the sixth interface, the electronic device receives and responds to the eighth operation to change the graphics with guessed components corresponding to the previous second interface to obtain the updated graphics of the components to be tested. Based on the updated graphics of the components to be tested, the electronic device captures and identifies the netlist file corresponding to the updated graphics of the components to be tested. Based on the netlist file, the electronic device displays the identification of the updated components to be tested in the first interface. The electronic device receives and responds to the first operation in the first interface. At this time, the fifth interface is displayed. The fifth interface shows that the components to be tested have been updated, and the changes in the use of the mask after the components to be tested are displayed. When the user confirms the update, the electronic device receives and responds to the sixth operation of the fifth interface, thereby displaying the updated mask use of the components to be tested in the second interface.

[0113] In a possible design of the present application, when gradually designing and generating the chip to be tested, the first method of displaying the identification of the components to be tested in the chip to be tested and the second method of displaying the identification of the components to be tested in the chip to be tested can be mixed and used in stages.

[0114] That is, when the number of components used in the circuit diagram of the chip to be tested is small, the user can directly identify the identification of each component to be tested in the circuit diagram based on the first method of displaying the identification of the components to be tested in the chip to be tested, and select the identified identification of each component to be tested in the electronic device to obtain the mask usage of the components to be tested based on subsequent steps.

[0115] When there are a large number of components used in the circuit diagram of the chip to be tested, based on the second method of displaying the identification of the components to be tested in the chip to be tested, the user can import the circuit diagram into an electronic device or the user draws the circuit diagram based on the electronic device, and then identify the identification of each component to be tested in the circuit diagram based on the electronic device to generate a netlist file, and obtain the identification of the components to be tested, so as to obtain the mask usage of the components to be tested based on subsequent steps.

[0116] In a possible design of the present application, at least some of the components to be tested require the use of a photomask.

[0117] When determining the mask usage of the components to be tested based on the mask usage determination method in the present application, the components in the components to be tested include but are not limited to components that require the use of masks, that is, the components to be tested may also not require the use of masks.

[0118] In a possible design of the present application, the mask usage of the component to be tested includes: the number of masks and the type of masks.

[0119] In the present application, the mask usage of the components to be tested may include: the type of mask and the number of masks, wherein the type of mask includes but is not limited to: the mask name, the mask identification and the mask model; the number of masks refers to the total number of masks in the circuit diagram composed of the components to be tested, that is, the number of masks may include: the number of masks in a single component, and the number of masks used when multiple components to be tested form a circuit diagram.

[0120] The mask usage of the components to be tested includes but is not limited to the number and type of masks.

[0121] In addition, in possible designs of the present application, multiple interfaces may be the same interface.

[0122] In addition, if the use of semiconductor masks is determined based on electronic devices, the electronic device executing the above method needs to be embedded with a calculation and determination program corresponding to the use of masks in components, and when determining the use of masks in components based on the program, the use of masks in the graphics can be obtained by importing the drawn graphics, or the program can be started after drawing in the electronic device to obtain the use of masks in the graphics, or the use of masks in the graphics can be obtained by manually selecting in the selection interface. This makes it more convenient and simple to calculate the use of masks based on the above method, and the calculation accuracy is high and the calculation efficiency is more efficient.

[0123] Among them, the electronic device that executes the steps of the above-mentioned semiconductor mask usage determination method can be determined based on specific needs. It is only necessary that the electronic device be provided with a calculation determination program corresponding to the mask usage determination method and the correspondence between the identifications of the required multiple components and the mask usage of the components.

[0124] In a third aspect, the present application provides an electronic device, comprising: at least one memory and at least one processor;

[0125] Memory is used to store computer executable programs or instructions;

[0126] The processor is used to call the computer executable program or instruction in the memory so that the electronic device executes any of the above methods.

[0127] In a fourth aspect, the present application provides a computer-readable storage medium, which stores a computer-executable program or instructions, and the computer-executable program or instructions are configured to execute any of the above methods.

Claims

1. A method for determining the usage of a semiconductor mask, characterized in that: The method comprises: Displaying identifications of components to be tested in the chip to be tested in the first interface; Receiving a first operation of a first control in the first interface; In response to the first operation, the mask usage of the component to be tested is determined by using the correspondence between the preset identifications of multiple components and the mask usage of the components, and the mask usage of the component to be tested is displayed in the second interface.

2. The method according to claim 1, characterized in that The method of displaying the identification of the components to be tested in the chip to be tested in the first interface includes: Receiving a second operation of a second control in a third interface; In response to the second operation, displaying the identifiers of the plurality of components in a fourth interface; Receiving a third operation in the fourth interface, wherein the third operation is used to select an identification of a component to be tested from a plurality of preset identifications of components; In response to the third operation, the identification of the component to be tested is displayed in the first interface.

3. The method according to claim 2, characterized in that The method further comprises: receiving a fourth operation of a third control in the second interface; In response to the fourth operation, displaying the fourth interface; Receiving a fifth operation in the fourth interface, wherein the fifth operation is used to reselect an identification of the component to be tested from the identifications of the plurality of components; In response to the fifth operation, displaying the identification of the reselected component to be tested in the first interface; Receiving a first operation of a first control in the first interface; In response to the first operation, displaying a fifth interface, wherein the fifth interface is used to notify that the component to be tested has been reselected; Receiving a sixth operation in the fifth interface; In response to the sixth operation, the mask usage of the reselected component to be tested is determined by using the correspondence between the identifiers of the multiple components and the mask usage of the components, and the mask usage of the reselected component to be tested is displayed in the second interface.

4. The method according to claim 1, characterized in that: The method of displaying the identification of the components to be tested in the chip to be tested in the first interface includes: Displaying the graphics of the component to be tested in the sixth interface; Receiving a seventh operation of a fourth control in the sixth interface; In response to the seventh operation, the identification of the component to be tested is displayed in the first interface.

5. The method according to claim 4, characterized in that The method further comprises: receiving a fourth operation of a third control in the second interface; In response to the fourth operation, displaying the sixth interface; Receiving an eighth operation in the sixth interface, wherein the eighth operation is used to update a graphic of the component to be tested; In response to the eighth operation, displaying an updated graphic of the component to be tested in the sixth interface; Receiving the seventh operation in the sixth interface; In response to the seventh operation in the sixth interface, displaying the updated identification of the component to be tested in the first interface; receiving the first operation of the first control in the first interface; In response to the first operation, displaying a fifth interface, wherein the fifth interface is used to notify that the component to be tested has been updated; Receiving a sixth operation in the fifth interface; In response to the sixth operation, the updated mask usage of the component to be tested is determined by using the correspondence between the identifiers of the multiple components and the mask usage of the components, and the updated mask usage of the component to be tested is displayed in the second interface.

6. The method according to any one of claims 1 to 5, characterized in that: At least some of the components to be tested require the use of a photomask.

7. The method according to any one of claims 1 to 5, characterized in that: The mask usage of the component to be tested includes: the number of masks and the type of masks.

8. An electronic device, characterized in that: include: at least one memory and at least one processor, a display; The memory is used to store computer executable programs or instructions; The processor is used to call the computer executable program or instruction in the memory so that the electronic device executes the method according to any one of claims 1 to 7; The display is used to display the interface described in any one of claims 1 to 7, and the interface includes: a first interface, a second interface, a third interface, a fourth interface and a fifth interface.

9. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer-executable program or instructions, and the computer-executable program or instructions are configured to execute the method according to any one of claims 1 to 7.

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