Substrate processing apparatus

Abstract

The purpose of the present invention is to provide a substrate processing apparatus capable of suitably transporting a substrate. A substrate processing apparatus (1) is provided with a storage rack mounting unit (3), a conveyance mechanism (4), and a control unit (9). The storage rack mounting part mounts the storage rack (C). The accommodating rack is provided with a plurality of shelves (22) arranged in the vertical direction (Z). Each shelf is provided with a substrate (W) in a horizontal posture. The conveying mechanism conveys the substrate to the accommodating rack (C) loaded on the accommodating rack loading part. The control unit (9) controls the conveyance mechanism (4). The conveyance mechanism (4) has a hand (33) and a hand drive unit (34). The hand supports the substrate. The hand drive unit (34) moves the hand (33). The control unit (9) changes the height position (HA) of the hand when the hand (33) is inserted between two shelves (22) adjacent to each other in the vertical direction (Z), in accordance with the shape of the substrate taken down from the shelf by the transport mechanism or the shape of the substrate placed on the shelf by the transport mechanism (4).

Description

[0001] This application is a divisional application of a patent application with application number CN 202010824054.5, application date August 17, 2020, and invention name “Substrate Processing Device”. Technical Field

[0002] The present invention relates to a substrate processing device for processing a substrate. The substrate is, for example, a semiconductor wafer, a substrate for a liquid crystal display, a substrate for an organic EL (Electroluminescence), a substrate for an FPD (Flat Panel Display), a substrate for an optical display, a substrate for a magnetic disk, a substrate for an optical disk, a substrate for an optical magneto-magnetic disk, a substrate for a photomask, or a substrate for a solar cell. Background Art

[0003] Japanese Patent Publication No. 2008-270626 discloses a substrate processing device. Below, the figure marks recorded in Japanese Patent Publication No. 2008-270626 are recorded in brackets. The substrate processing device (1) has a loading port (16) and an inspection device. The loading port (16) accommodates a box (C). The box (C) accommodates multiple wafers (W). The inspection device has a main chuck (13) and a probe pin card (14). The substrate (W) is placed on the main chuck (13). The probe pin card (14) is arranged above the main chuck (13).

[0004] The substrate processing device (1) has a substrate transport device (18). The substrate transport device (18) holds a substrate (W) based on the Bernoulli principle. The substrate transport device (18) transports the substrate (W) between a box (C) accommodated in a loading port (16) and a main chuck (13).

[0005] The substrate transport device (18) comprises a tweezer (17) and an adsorption mechanism (171). The adsorption mechanism (171) is arranged on the lower surface of the tweezer (17). The adsorption mechanism (171) is connected to a high-pressure air source. The high-pressure air source supplies high-pressure air to the adsorption mechanism (171). When the adsorption mechanism (171) is located above the substrate (W), the high-pressure air flows out from the adsorption mechanism (171) through the gap between the adsorption mechanism (171) and the upper surface of the substrate (W). Thus, the adsorption mechanism (171) holds the upper surface of the substrate (W).

[0006] In recent years, substrates have been thinned and enlarged in diameter. If the thickness of the substrate is reduced and the diameter of the substrate is increased, the deflection of the substrate is significantly increased. Therefore, in the conventional substrate conveying device (18), it is sometimes difficult to properly convey the substrate relative to the box. Summary of the invention

[0007] The present invention has been made in view of such circumstances, and an object of the present invention is to provide a substrate processing apparatus capable of appropriately conveying a substrate.

[0008] In order to achieve such an object, the present invention has the following structure. That is, the substrate processing device of the present invention,

[0009] have:

[0010] A receiving rack loading portion for loading the receiving rack;

[0011] a transport mechanism that transports the substrate to the storage rack placed on the storage rack placement portion; and

[0012] a control unit, controlling the transport mechanism,

[0013] The storage rack has a plurality of shelves arranged in a vertical direction.

[0014] Each of the shelves carries a substrate in a horizontal position.

[0015] The transport mechanism includes a hand for supporting the substrate and a hand driving unit for moving the hand.

[0016] The control unit changes the height position of the hand when inserting the hand between two adjacent shelves in the vertical direction according to at least any one of the shape of the substrate removed from the shelf by the conveying mechanism and the shape of the substrate placed on the shelf by the conveying mechanism.

[0017] The substrate processing device includes a rack loading portion, a conveying mechanism, and a control portion. The conveying mechanism conveys a substrate to a rack loaded on the rack loading portion. The rack includes a plurality of shelves arranged in the up-down direction. The control portion changes the height position of the hand when the hand is inserted between two shelves adjacent in the up-down direction, according to the shape of the substrate. In more detail, the control portion changes the height position of the hand when the hand is inserted between two shelves adjacent in the up-down direction, according to at least one of the shape of the substrate removed from the shelf by the conveying mechanism and the shape of the substrate placed on the shelf by the conveying mechanism. Thus, regardless of the shape of the substrate, the hand can properly enter between two shelves adjacent in the up-down direction. Therefore, the conveying mechanism can properly convey the substrate to the rack.

[0018] As described above, the substrate processing apparatus can appropriately transport the substrate.

[0019] The substrate processing device of the present invention,

[0020] have:

[0021] a loading portion;

[0022] a transport mechanism that transports the substrate to the mounting portion; and

[0023] a control unit, controlling the transport mechanism,

[0024] The loading portion includes a plurality of shelves arranged in a vertical direction.

[0025] Each of the shelves carries a substrate in a horizontal position.

[0026] The transport mechanism includes a hand for supporting the substrate and a hand driving unit for moving the hand.

[0027] The control unit changes the height position of the hand when inserting the hand between two adjacent shelves in the vertical direction according to at least any one of the shape of the substrate removed from the shelf by the conveying mechanism and the shape of the substrate placed on the shelf by the conveying mechanism.

[0028] The substrate processing device includes a loading portion, a conveying mechanism, and a control portion. The conveying mechanism conveys the substrate to the loading portion. The loading portion includes a plurality of shelves arranged in the up-down direction. The control portion changes the height position of the hand when the hand is inserted between two shelves adjacent to each other in the up-down direction, according to the shape of the substrate. In more detail, the control portion changes the height position of the hand when the hand is inserted between two shelves adjacent to each other in the up-down direction, according to at least any one of the shape of the substrate removed from the shelf by the conveying mechanism and the shape of the substrate placed on the shelf by the conveying mechanism. Thus, regardless of the shape of the substrate, the hand can properly enter between two shelves adjacent to each other in the up-down direction. Therefore, the conveying mechanism can properly convey the substrate W to the loading portion.

[0029] As described above, the substrate processing apparatus can appropriately transport the substrate.

[0030] In the above substrate processing device, preferably,

[0031] The control unit changes the height position of the hand when the hand is inserted between two of the shelf plates adjacent to each other in the vertical direction, according to the thickness of the main portion of the substrate located inside the peripheral portion of the substrate.

[0032] Regardless of the thickness of the main portion of the substrate, the hand can appropriately enter between two shelf plates adjacent to each other in the up-down direction Z. Therefore, the transport mechanism can appropriately transport the substrate.

[0033] In the above substrate processing device, preferably,

[0034] The substrate includes:

[0035] a first substrate having a recessed portion formed by making a main portion of the substrate located inside a peripheral portion of the substrate recessed relative to the peripheral portion of the substrate, and having no protective plate made of glass; and

[0036] The second substrate does not have the recessed portion.

[0037] When the substrate removed from the shelf by the transport mechanism or the substrate placed on the shelf by the transport mechanism is the first substrate, the hand enters between two adjacent shelves in the vertical direction at a first height position,

[0038] When the substrate removed from the shelf by the conveying mechanism or placed on the shelf by the conveying mechanism is the second substrate, the hand enters between two vertically adjacent shelves at a second height position higher than the first height position.

[0039] When the conveying mechanism removes the first substrate from the shelf, the hand enters between the two shelves adjacent in the vertical direction at the first height position. When the conveying mechanism places the first substrate on the shelf, the hand enters between the two shelves adjacent in the vertical direction at the first height position. When the conveying mechanism removes the second substrate from the shelf, the hand enters between the two shelves adjacent in the vertical direction at the second height position. When the conveying mechanism places the second substrate on the shelf, the hand enters between the two shelves adjacent in the vertical direction at the second height position. Here, the first height position is lower than the second height position. Thus, when the conveying mechanism removes the first substrate from the shelf, the hand can properly enter between the two shelves adjacent in the vertical direction. When the conveying mechanism places the first substrate on the shelf, the hand can properly enter between the two shelves adjacent in the vertical direction. The second height position is higher than the first height position. Thus, when the conveying mechanism removes the second substrate from the shelf, the hand can properly enter between the two shelves adjacent in the vertical direction. When the conveying mechanism places the second substrate on the shelf, the hand can properly enter between the two shelves adjacent in the vertical direction.

[0040] In the above substrate processing device, preferably,

[0041] The substrate includes:

[0042] a first substrate having a recessed portion formed by making a main portion of the substrate located inside a peripheral portion of the substrate recessed relative to the peripheral portion of the substrate, and having no protective plate made of glass; and

[0043] The third substrate has the concave portion and a protective plate made of glass,

[0044] When the substrate removed from the shelf by the transport mechanism or the substrate placed on the shelf by the transport mechanism is the first substrate, the hand enters between two adjacent shelves in the vertical direction at a first height position,

[0045] When the substrate removed from the shelf by the conveying mechanism or placed on the shelf by the conveying mechanism is the third substrate, the hand enters between two of the shelves adjacent to each other in the vertical direction at a third height position higher than the first height position.

[0046] When the transport mechanism removes the first substrate from the shelf or places the first substrate on the shelf, the hand enters between two shelves adjacent to each other in the vertical direction at the first height position. When the transport mechanism removes the third substrate from the shelf or places the third substrate on the shelf, the hand enters between two shelves adjacent to each other in the vertical direction at the third height position. Here, the first height position is lower than the third height position. Thus, when the transport mechanism removes the first substrate from the shelf or places the first substrate on the shelf, the hand can properly enter between two shelves adjacent to each other in the vertical direction. The third height position is higher than the first height position. Thus, when the transport mechanism removes the third substrate from the shelf or places the third substrate on the shelf, the hand can properly enter between two shelves adjacent to each other in the vertical direction.

[0047] In the above substrate processing device, preferably,

[0048] The control unit changes the insertion amount of the hand when inserting the hand between two of the shelves adjacent in the vertical direction according to at least any one of the shape of the substrate removed from the shelf by the conveying mechanism and the shape of the substrate placed on the shelf by the conveying mechanism.

[0049] The control unit changes the amount of the hand inserted into the space between two shelves adjacent to each other in the vertical direction according to the shape of the substrate. More specifically, the control unit changes the amount of the hand inserted into the space between two shelves adjacent to each other in the vertical direction according to at least one of the shape of the substrate removed from the shelf by the conveying mechanism and the shape of the substrate placed on the shelf by the conveying mechanism. Thus, the hand can remove the substrate from the shelf at an appropriate position regardless of the shape of the substrate. The hand can place the substrate at an appropriate position on the shelf regardless of the shape of the substrate.

[0050] In the above substrate processing device, preferably,

[0051] The substrate includes:

[0052] Usually a diameter substrate; and

[0053] The large diameter substrate has a larger diameter than the normal diameter substrate.

[0054] When the substrate removed from the shelf by the transport mechanism or the substrate placed on the shelf by the transport mechanism is the normal diameter substrate, the insertion amount of the hand inserted between two adjacent shelves in the vertical direction is the first insertion amount,

[0055] When the substrate removed from the shelf by the conveying mechanism or placed on the shelf by the conveying mechanism is the large-diameter substrate, the insertion amount of the hand inserted between two adjacent shelves in the vertical direction is a second insertion amount greater than the first insertion amount.

[0056] When the conveying mechanism removes a normal diameter substrate from the shelf, the hand inserts a first insertion amount between two shelves adjacent in the vertical direction. When the conveying mechanism places a normal diameter substrate on the shelf, the hand inserts a first insertion amount between two shelves adjacent in the vertical direction. When the conveying mechanism removes a large diameter substrate from the shelf, the hand inserts a second insertion amount between two shelves adjacent in the vertical direction. When the conveying mechanism places a large diameter substrate on the shelf, the hand inserts a second insertion amount between two shelves adjacent in the vertical direction. Here, the first insertion amount is smaller than the second insertion amount. On the contrary, the second insertion amount is larger than the first insertion amount. Thus, regardless of the diameter of the substrate, the hand can remove the substrate from the shelf at an appropriate position. Regardless of the diameter of the substrate, the hand can place the substrate at an appropriate position on the shelf.

[0057] In the above substrate processing device, preferably,

[0058] The hand supports the substrate by contacting at least one of the lower surface of the substrate and the edge of the substrate.

[0059] Even when the hand supports the substrate in this way, the hand can appropriately place the substrate on the shelf, and the hand can appropriately remove the substrate from the shelf.

[0060] In the above substrate processing device, preferably,

[0061] The hand has two rods extending in a first horizontal direction and supporting the substrate,

[0062] The rods each have a length that is the same as or greater than the diameter of the substrate,

[0063] The rods each have a constant cross-sectional shape along a first direction,

[0064] When the hand enters between two of the shelves adjacent to each other in the up-down direction, the moving direction of the hand is consistent with the first direction.

[0065] Even if the space between two shelves adjacent to each other in the vertical direction is narrow, the rod can fit between the two shelves adjacent to each other in the vertical direction.

[0066] In the above substrate processing device, preferably,

[0067] The hand has a suction part that causes a gas to flow along a first surface of a substrate to suction the substrate without contacting the substrate.

[0068] The hands are able to properly support the substrate.

[0069] In the above substrate processing device, preferably,

[0070] The shelves respectively include a first shelf for receiving a first side portion of the substrate and a second shelf for receiving a second side portion of the substrate.

[0071] Even when the shelf supports the substrate in this manner, the transport mechanism can appropriately transport the substrate to the shelf. BRIEF DESCRIPTION OF THE DRAWINGS

[0072] Although for the purpose of illustrating the present invention there has been shown what are presently considered to be preferred forms, it is to be understood that the invention is not limited to the arrangements and forms shown.

[0073] Figure 1 It is a top view of the substrate processing apparatus according to the embodiment.

[0074] Figure 2 It is a control block diagram of a substrate processing apparatus.

[0075] Figure 3 is a top view of the substrate.

[0076] Figure 4A is a cross-sectional view of the first substrate, Figure 4B is a cross-sectional view of the second substrate, Figure 4C is a cross-sectional view of the third substrate.

[0077] Figure 5A This is a top view of a normal diameter substrate. Figure 5B It is a top view of the large diameter substrate.

[0078] Figure 6 It is the front view of the storage rack.

[0079] Figure 7 is a top view of a shelf of a receiving rack.

[0080] Figure 8 This is a left side view showing the structure of the central portion of the substrate processing apparatus in the width direction.

[0081] Fig. 9 This is a top view of the hand.

[0082] Fig.10 It is a side view of the hand.

[0083] Fig.11 This is a left side view showing the structure of the left portion of the substrate processing apparatus.

[0084] Fig.12 It is a front view of the mounting part.

[0085] Fig.13 It is a top view of the shelf of the placement section.

[0086] Fig.14 It is a figure which shows the detailed structure of the shelf of the placement part.

[0087] Fig.15 This is a bottom view of the hand.

[0088] Fig.16A , 16B Side views of the hands.

[0089] Fig.17 It is a top view of the suction part, the substrate sucked by the suction part, and the receiving part.

[0090] Fig.18 It is a top view of the receiving part.

[0091] Fig.19 It is a diagram schematically showing the structure of the first processing unit.

[0092] Fig. 20 is a top view of the first plate.

[0093] Fig.21A , 21B They are top views of the detailed structures of the position adjustment pins.

[0094] Fig.22A , 22B They are side views of the position adjustment pin.

[0095] Fig.23A , 23B They are side views of the lifting pins.

[0096] Fig.24 It is a diagram schematically showing the structure of the second processing unit.

[0097] Fig.25 is a top view of the second plate.

[0098] Fig.26A , 26B It is a top view of the detailed structure of the edge contact pin.

[0099] Fig.27A , 27B is a side view of an edge contact pin.

[0100] Fig.28 This is a flowchart showing the steps of the operation of the control unit to obtain the shape of the substrate.

[0101] Fig.29 It is a flowchart showing the control procedure of the control unit and the operation of the conveying mechanism.

[0102] Figures 30A-30D This is a diagram schematically showing an operation example of the transport mechanism removing a substrate from a shelf of a storage rack.

[0103] Fig.31A , 31B It is a diagram showing the relationship between the substrate placed on the shelf and the insertion height of the hand.

[0104] Figures 32A-32D This is a diagram schematically showing an operation example of the transport mechanism removing a substrate from a shelf of a placement section.

[0105] Fig.33 It is a flowchart showing the control procedure of the control unit and the operation of the conveying mechanism.

[0106] Figures 34A-34D This is a diagram schematically showing an operation example of the transport mechanism removing a substrate from a shelf of a placement section.

[0107] Figures 35A-35D This is a diagram schematically showing an operation example of the transport mechanism removing a substrate from a shelf of a placement section.

[0108] Figures 36A-36F This is a diagram schematically showing an operation example of the transport mechanism transferring a substrate to a substrate holding portion of a processing unit.

[0109] Figures 37A-37F This is a diagram schematically showing an operation example of the transport mechanism removing a substrate from a substrate holding portion of a processing unit.

[0110] Figures 38A-38D This is a diagram schematically showing an operation example of the transport mechanism placing a substrate on a shelf of the placement section.

[0111] Figures 39A-39D This is a diagram schematically showing an operation example of the transport mechanism placing a substrate on a shelf of the placement section.

[0112] Fig.40 This is a flowchart showing the steps of an operation example of the first processing unit.

[0113] Fig.41 It is a timing chart showing an operation example of the first processing unit.

[0114] Fig.42 It is a diagram schematically showing the structure of the first processing unit in a modified embodiment.

[0115] Fig.43 It is a diagram schematically showing the structure of the first processing unit in a modified embodiment.

[0116] Description of reference numerals:

[0117] 1 Substrate processing device

[0118] 2 Indexer

[0119] 3 Storage rack mounting part

[0120] 4. Transport mechanism (second transport mechanism)

[0121] 5. Processing Area

[0122] 6 Loading section (first position, second position)

[0123] 7 Processing unit (first position, second position)

[0124] 7A First processing unit

[0125] 7B Second processing unit

[0126] 8. Transport mechanism (first transport mechanism)

[0127] 9 Control Unit

[0128] 11 substrate main body

[0129] 12 Peripheral part of substrate

[0130] 13 Main part of the base plate

[0131] 14 Recessed portion of base plate

[0132] 15 Protection board

[0133] 16 Lower surface of substrate

[0134] 17 Upper surface of substrate

[0135] 18 first side of the substrate

[0136] 19 Second side of the substrate

[0137] 20 Edge of substrate

[0138] 22 Shelves

[0139] 23 First Shelf

[0140] 24 Second Shelf

[0141] 31 Barcode reader

[0142] 33 Hands

[0143] 34 Hand drive unit

[0144] 35 Connection

[0145] 36 shots

[0146] 37 Contact Department

[0147] 38. Substrate inspection unit

[0148] 45 Shelves

[0149] 46 First Shelf

[0150] 47 Second Shelf

[0151] 51 First inclined surface

[0152] 51T Upper end of the first inclined surface

[0153] 51B Lower end of the first inclined surface

[0154] 51M Midpoint of the first inclined surface

[0155] 52 Upper inclined surface

[0156] 53 Lower inclined surface

[0157] 55 Second inclined surface

[0158] 56 Upper inclined surface

[0159] 57 Lower inclined surface

[0160] 61 Hands

[0161] 62 Hand drive unit

[0162] 64 Connection

[0163] 65 Base

[0164] 66 Branch

[0165] 68 Attraction

[0166] 69 Attraction pad

[0167] 71 Gas supply path

[0168] 72 Gas supply source

[0169] 73 Suction adjustment unit

[0170] 74 Contact Department

[0171] 75 First contact

[0172] 76 Second contact part

[0173] 77 Wall

[0174] 78 First wall

[0175] 79 Second wall

[0176] 80 Third wall

[0177] 81 Receiving Department

[0178] 82 First receiving part

[0179] 83 Second receiving part

[0180] 86 Receiving unit Driving unit

[0181] 87 Actuator

[0182] 88 Elastic member

[0183] 89 Substrate Inspection Unit

[0184] 91 substrate holding portion

[0185] 91A first substrate holding portion

[0186] 91B Second substrate holding portion

[0187] 92 Rotation drive unit

[0188] 92A first rotation drive unit

[0189] 92B Second rotation drive unit

[0190] 93 Baffle

[0191] 101 First Board

[0192] 102 upper surface

[0193] 103 fixing pin (support part)

[0194] 104 Gas blowout port

[0195] 105 First blowing outlet

[0196] 106 Second blowing outlet

[0197] 107 First gas supply path

[0198] 108 Second gas supply path

[0199] 109 Gas supply source

[0200] 111 First blow-out adjustment unit

[0201] 112 Second blow-out adjustment unit

[0202] 113 Position adjustment pin (position adjustment part)

[0203] 114 shaft

[0204] 116 lifting pin (lifting part)

[0205] 121 Processing liquid supply unit

[0206] 122 Nozzle

[0207] 123 Piping

[0208] 124 Treatment liquid supply source

[0209] 125 Flow regulating unit

[0210] 127 Substrate Inspection Unit

[0211] 131 Second Board

[0212] 132 upper surface

[0213] 133 edge contact pin (edge ​​contact portion)

[0214] 134 Small piece

[0215] 135 Lower surface contact pin

[0216] 136 Shaft

[0217] 141 First processing unit

[0218] 142 Pure water supply unit

[0219] 143 Piping

[0220] 144 Pure water supply source

[0221] 145 Flow regulation unit

[0222] 151 First processing unit

[0223] 153 Piping

[0224] 154 Treatment liquid supply source

[0225] 155 Flow regulation unit

[0226] A1, A2, A3, A4, A5, A6 rotation axis

[0227] C Container (first position, second position)

[0228] D Diameter of the base plate

[0229] D1 Normal diameter of the substrate

[0230] D2 large diameter substrate

[0231] E1 The interval between the first shelf 23 and the second shelf 24 arranged in the horizontal direction

[0232] E2 The interval between the first shelf 46 and the second shelf 47 arranged in the horizontal direction (the interval between the first inclined surface and the second inclined surface in the horizontal direction)

[0233] ET The distance between the upper end of the first inclined surface and the upper end of the second inclined surface in the horizontal direction

[0234] The distance between the lower end of the first inclined surface and the lower end of the second inclined surface in the horizontal direction of EB

[0235] The distance between the middle point of the first inclined surface and the middle point of the second inclined surface in the horizontal direction of EM

[0236] F1 First Direction

[0237] F2 Second direction

[0238] F3 Third direction

[0239] F4 Fourth direction

[0240] HA, HB, HC height position

[0241] HA1, HB1, HC1 first height position

[0242] HA2, HB2, HC2 second height position

[0243] HA3, HB3, HC3 third height position

[0244] J Center of the base plate

[0245] KA, KB insertion amount

[0246] KA1, KB1 first insertion amount

[0247] KA2, KB2 second insertion amount

[0248] L1 The total length of the two rods in the second direction

[0249] L2 The length of the rod in the first direction

[0250] L3 The length of a rod in the second direction

[0251] Thickness of the main part of T1, T2, T3 substrate

[0252] Thickness of the peripheral part of T4, T5, and T6 substrates

[0253] VA, VB moving speed

[0254] VA1, VB1 first moving speed

[0255] VA2, VB2 second moving speed

[0256] AA, AB acceleration

[0257] AA1, AB1 first acceleration

[0258] AA2, AB2 second acceleration

[0259] M Flow

[0260] M1 First Flow

[0261] M2 Second flow

[0262] M3 Third flow

[0263] W substrate

[0264] W1 First substrate

[0265] W2 Second substrate

[0266] W3 Third substrate

[0267] WN normal diameter base plate

[0268] WD large diameter substrate

[0269] X front and back direction

[0270] Y width direction

[0271] Z Up and Down Direction

[0272] θ1 Angle of the upper inclined surface

[0273] θ2 Angle of the lower inclined surface DETAILED DESCRIPTION

[0274] Hereinafter, a substrate processing apparatus according to the present invention will be described with reference to the accompanying drawings.

[0275] <Overview of substrate processing apparatus>

[0276] Figure 1 1 is a plan view of a substrate processing apparatus according to an embodiment.

[0277] The substrate W is, for example, a semiconductor wafer, a substrate for a liquid crystal display, a substrate for an organic EL (Electroluminescence), a substrate for an FPD (Flat Panel Display), a substrate for an optical display, a substrate for a magnetic disk, a substrate for an optical disk, a substrate for a magneto-optical disk, a substrate for a photomask, or a substrate for a solar cell.

[0278] The substrate processing device 1 has an indexer part 2. The indexer part 2 has a plurality of (for example, four) rack loading parts 3. Each rack loading part 3 carries a rack C. The rack C accommodates a plurality of substrates W. The rack C is, for example, a FOUP (front opening unified pod). The indexer part 2 has a transport mechanism 4. The transport mechanism 4 can access the racks C placed in all the rack loading parts 3.

[0279] The substrate processing apparatus 1 includes a processing block 5 . The processing block 5 is connected to the indexer unit 2 .

[0280] The processing area 5 has a loading section 6. The loading section 6 loads a plurality of substrates W. The processing area 5 has a plurality of processing units 7. Each processing unit 7 processes one substrate W. The processing area 5 has a transport mechanism 8. The transport mechanism 8 can access the loading section 6 and all the processing units 7. The transport mechanism 8 transports W to the loading section 6 and the processing unit 7.

[0281] The placement unit 6 is disposed between the transport mechanism 4 and the transport mechanism 8. The transport mechanism 4 can also access the placement unit 6. The transport mechanism 4 transports the substrate W to the placement unit 6. The placement unit 6 places the substrate W transported between the transport mechanism 4 and the transport mechanism 8.

[0282] The substrate processing apparatus 1 includes a control unit 9 . The control unit 9 controls the transfer mechanisms 4 and 8 and the processing unit 7 .

[0283] Figure 2 2 is a control block diagram of the substrate processing apparatus 1. The control unit 9 is connected to the transport mechanisms 4 and 8 and the processing unit 7 so as to be communicable.

[0284] The control unit 9 is implemented by a central processing unit (CPU) that performs various processing, a RAM (Random-Access Memory) as a work area for processing, a fixed disk or other storage medium, etc. The storage medium stores various information in advance. The storage medium stores, for example, information related to the operating conditions of the transport mechanisms 4 and 8 and the processing unit 7. The information related to the operating conditions of the processing unit 7 is, for example, a processing procedure (processing program) for processing the substrate W. The storage medium stores, for example, information for identifying each substrate W.

[0285] An operation example of the substrate processing apparatus 1 is described. The transport mechanism 4 transports the substrate W from the storage rack C on the storage rack loading section 3 to the loading section 6. The transport mechanism 8 transports the substrate W from the loading section 6 to one of the processing units 7. The processing unit 7 processes the substrate W. The transport mechanism 8 transports the substrate W from the processing unit 7 to the loading section 6. The transport mechanism 4 transports the substrate W from the loading section 6 to the storage rack C on the storage rack loading section 3.

[0286] The conveying mechanism 4 is an example of the second conveying mechanism in the present invention. The conveying mechanism 8 is an example of the first conveying mechanism in the present invention. The loading section 6 is an example of one of the first position and the second position in the present invention. The processing unit 7 is an example of the other of the first position and the second position in the present invention.

[0287] Reference Figure 1 . In this specification, for the sake of convenience, the direction in which the divider portion 2 and the processing area 5 are arranged is referred to as the "front-to-back direction X". The front-to-back direction X is horizontal. The direction from the processing area 5 toward the divider portion 2 in the front-to-back direction X is referred to as the "front". The direction opposite to the front is referred to as the "rear". The horizontal direction orthogonal to the front-to-back direction X is referred to as the "width direction Y" or "side". One direction of the "width direction Y" is appropriately referred to as the "right". The direction opposite to the right is referred to as the "left". The vertical direction is referred to as the "up-down direction Z". The up-down direction Z is orthogonal to the front-to-back direction X and to the width direction Y. In each figure, the front, back, right, left, top and bottom are appropriately shown for reference.

[0288] <Shape of substrate W>

[0289] Figure 3 1 is a top view of the substrate W. The basic shape of the substrate W is described. The substrate W has a thin flat plate shape. The substrate W is roughly circular when viewed from above. The substrate W has a peripheral portion 12 and a main portion 13. The main portion 13 is a portion of the substrate W located inside the peripheral portion 12. The semiconductor device is formed in the main portion 13. For the sake of convenience, Figure 3 In FIG. 1 , a boundary between the peripheral portion 12 and the main portion 13 is indicated by a dotted line.

[0290] In this specification, the substrates W are classified into a plurality of types according to the shapes of the substrates W. First, according to the thickness of the main portion 13 of the substrate W, the substrates W are classified into a first substrate W1 , a second substrate W2 , and a third substrate W3 .

[0291] Figure 4A is a cross-sectional view of the first substrate W1. Figure 4B is a cross-sectional view of the second substrate W2. Figure 4CIt is a cross-sectional view of the third substrate W3. The first substrate W1 is a substrate W including a recessed portion 14 formed by recessing the main portion 13 relative to the peripheral portion 12 and not including a protective plate 15 made of glass. The recessed portion 14 is formed, for example, by a grinding process (polishing process). The second substrate W2 is a substrate W that does not include the recessed portion 14. The third substrate W3 is a substrate W including the recessed portion 14 and including a protective plate 15 made of glass. The first substrate W1 may also be composed of only the substrate body 11. Alternatively, the first substrate W1 may include at least any one of a resin coating, a resin tape, a resin sheet, and a resin film in addition to the substrate body 11. The second substrate W2 may also be composed of only the substrate body 11. Alternatively, the second substrate W2 may include at least any one of a resin coating, a resin tape, a resin sheet, a resin film, and a protective plate 15 in addition to the substrate body 11. The third substrate W3 includes a substrate body 11 and a protective plate 15. The protective plate 15 is, for example, attached to the substrate body 11. The third substrate W3 may further include at least any one of a resin coating, a resin tape, a resin sheet, and a resin film.

[0292] The main portion 13 of the first substrate W1 is thinner than the main portion 13 of the second substrate W2. The main portion 13 of the first substrate W1 is thinner than the main portion 13 of the third substrate W3. The rigidity of the first substrate W1 is lower than that of the second substrate W2 and the third substrate W3. The first substrate W1 is more easily bent than the second substrate W2 and the third substrate W3.

[0293] Specifically, the main portion 13 of the first substrate W1 has a thickness T1. The main portion 13 of the second substrate W2 has a thickness T2. The main portion 13 of the third substrate W3 has a thickness T3. The thickness T1 is smaller than the thickness T2. The thickness T1 is smaller than the thickness T3. The thickness T1 is, for example, greater than 10 [μm] and less than 200 [μm]. The thickness T2 is, for example, greater than 600 [μm] and less than 1000 [μm]. The thickness T3 is, for example, greater than 800 [μm] and less than 1200 [μm].

[0294] The peripheral portion 12 of the first substrate W1 has a thickness T4. The peripheral portion 12 of the second substrate W2 has a thickness T5. The peripheral portion 12 of the third substrate W3 has a thickness T6. The thickness T4 is, for example, the same as the thickness T5. The thickness T4 is smaller than the thickness T6. The thickness T4 is, for example, greater than 600 [μm] and less than 1000 [μm]. The thickness T5 is, for example, greater than 600 [μm] and less than 1000 [μm]. The thickness T6 is, for example, greater than 1400 [μm] and less than 2200 [μm].

[0295] Second, according to the diameter D of the substrate W, the substrate W is divided into a normal diameter substrate WN and a large diameter substrate WL.

[0296] Figure 5A It is a top view of a normal diameter substrate WN. Figure 5B: is a top view of the large diameter substrate WL. The normal diameter substrate WN has a diameter D1. The large diameter substrate WL has a diameter D2. The diameter D2 is larger than the diameter D1.

[0297] The diameter D1 is, for example, 300 [mm], and the diameter D2 is, for example, 301 [mm].

[0298] For example, the first substrate W1 and the second substrate W2 belong to the normal diameter substrate WN. For example, the third substrate W3 belongs to the large diameter substrate WL.

[0299] The substrate processing apparatus 1 processes the first substrate W1, the second substrate W2, and the third substrate W3. The substrate processing apparatus 1 processes the normal diameter substrate WN and the large diameter substrate WL.

[0300] <Storage rack C>

[0301] Figure 6 2 is a front view of a storage rack C. The storage rack C has a container 21 and a plurality of shelves 22. The shelves 22 are provided inside the container 21. The shelves 22 are arranged in an up-down direction Z. Two shelves 22 adjacent to each other in the up-down direction Z are close to each other. The interval between two shelves 22 adjacent to each other in the up-down direction Z is, for example, 10 [mm].

[0302] Each shelf 22 carries a substrate W in a horizontal position. The shelf 22 contacts the lower surface 16 of the substrate W. For example, the shelf 22 contacts the lower surface 16 of the peripheral portion 12 of the substrate W. The shelf 22 does not contact the upper surface 17 of the substrate W. Thus, the shelf 22 supports the substrate W. When the shelf 22 supports the substrate W, the shelf 22 allows the substrate W to move upward relative to the shelf 22.

[0303] Each shelf 22 includes a first shelf 23 and a second shelf 24. The first shelf 23 and the second shelf 24 are separated from each other. The first shelf 23 and the second shelf 24 are opposite to each other in the horizontal direction. The interval E1 between the first shelf 23 and the second shelf 24 arranged in the horizontal direction is smaller than the diameter D of the substrate W.

[0304] Figure 7 2 is a top view of a shelf 22 of a receiving rack C. A first shelf 23 supports a first side portion 18 of a substrate W. A second shelf 24 supports a second side portion 19 of the substrate W. The second side portion 19 is located on a side opposite to the first side portion 18 relative to a center J of the substrate W. The first side portion 18 and the second side portion 19 respectively include a portion of the peripheral portion 12 of the substrate W. The first side portion 18 and the second side portion 19 may also respectively include a portion of the main portion 13 of the substrate W.

[0305] The storage rack C has a barcode (not shown). The barcode is, for example, an identifier for identifying the storage rack C. The barcode is, for example, an identifier for identifying the substrate W in the storage rack C. The barcode is attached to the container 21, for example.

[0306] Hereinafter, the configuration of each section of the substrate processing apparatus 1 will be described.

[0307] <Indexer section 2>

[0308] Reference Figure 1 The rack placement sections 3 are arranged in a row in the width direction Y. The indexer section 2 includes a barcode reader 31. The barcode reader 31 reads a barcode attached to the rack C placed on the rack placement section 3. The barcode reader 31 is attached to the rack placement section 3, for example.

[0309] The indexer part 2 has a transport space 32 . The transport space 32 is arranged behind the storage rack mounting part 3 . The transport space 32 extends in the width direction Y. The transport mechanism 4 is provided in the transport space 32 . The transport mechanism 4 is arranged behind the storage rack mounting part 3 .

[0310] The transport mechanism 4 includes a hand 33 and a hand driving unit 34. The hand 33 supports one substrate W in a horizontal posture. The hand 33 supports the substrate W by contacting the lower surface 16 of the substrate W. The hand driving unit 34 is connected to the hand 33. The hand driving unit 34 moves the hand 33.

[0311] Reference Figure 1 , 8 . Figure 8 1 is a left view showing the structure of the central part of the substrate processing device 1 in the width direction Y. The hand driving part 34 has a rail 34a, a horizontal moving part 34b, a vertical moving part 34c, a rotating part 34d, and an advance and retreat moving part 34e. The rail 34a is fixedly provided. The rail 34a is arranged at the bottom of the transport space 32. The rail 34a extends along the width direction Y. The horizontal moving part 34b is supported by the rail 34a. The horizontal moving part 34b moves in the width direction Y relative to the rail 34a. The vertical moving part 34c is supported by the horizontal moving part 34b. The vertical moving part 34c moves in the up-down direction Z relative to the horizontal moving part 34b. The rotating part 34d is supported by the vertical moving part 34c. The rotating part 34d rotates relative to the vertical moving part 34c. The rotating part 34d rotates around the rotation axis A1. The rotation axis A1 is parallel to the up-down direction Z. The advance and retreat moving part 34e reciprocates in one horizontal direction determined by the direction of the rotating part 34d.

[0312] The hand 33 is fixed to the forward and backward moving part 34e. The hand 33 can move in parallel in the horizontal direction and the up-down direction Z. The hand 33 can rotate around the rotation axis A1.

[0313] Fig. 9 It is a top view of the hand 33. Fig.10 34e is a side view of the hand 33. The structure of the hand 33 will be described. The hand 33 has a connecting portion 35. The connecting portion 35 is connected to the forward and backward moving portion 34e.

[0314] The hand 33 has two rods 36. Each rod 36 is supported by the connecting portion 35. The two rods 36 are separated from each other. The two rods 36 extend linearly. The two rods 36 extend from the connecting portion 35 in the same direction. The two rods 36 are parallel to each other. The direction in which each rod 36 extends is called a first direction F1. The first direction F1 is horizontal. The first direction F1 is the same as the direction in which the forward and backward moving portion 34e reciprocates relative to the rotating portion 34d. The horizontal direction orthogonal to the first direction F1 is called a second direction F2. The two rods 36 are arranged in the second direction F2.

[0315] The total length L1 of the two rods 36 in the second direction F2 is smaller than the interval E1. Therefore, the two rods 36 can pass in the vertical direction Z between the first shelf plate 23 and the second shelf plate 24 that face each other in the horizontal direction.

[0316] Each rod 36 has a length substantially equal to the diameter D of the substrate W. That is, the length L2 of the rod 36 in the first direction F1 is substantially equal to the diameter of the substrate W.

[0317] Each rod 36 is thin. That is, the length L3 of one rod 36 in the second direction F2 is small. The length L3 is, for example, 10 [mm]. The length L3 is substantially constant in the first direction F1. That is, the length L3 is substantially constant from the base end of the rod 36 to the top end of the rod 36. Each rod 36 has a substantially constant cross-sectional shape in the first direction F1. That is, the cross-sectional shape of the rod 36 is substantially constant from the base end of the rod 36 to the top end of the rod 36.

[0318] The hand 33 has a plurality of (for example, four) contact portions 37. The contact portions 37 are mounted on the respective rods 36. The respective contact portions 37 protrude upward from the respective rods 36. The respective contact portions 37 are in contact with the lower surface 16 of the substrate W. More specifically, the respective contact portions 37 are in contact with the lower surface 16 of the peripheral portion 12 of the substrate W. Thus, the hand 33 supports one substrate W in a horizontal posture. The respective contact portions 37 do not contact with the upper surface 17 of the substrate W. The hand 33 allows the substrate W to move upward relative to the hand 33. When the hand 33 supports the substrate W, the contact portions 37 and the rods 36 overlap with the substrate W in a plan view.

[0319] The hand 33 includes a substrate detection unit 38 . The substrate detection unit 38 detects the substrate W supported by the hand 33 . The substrate detection unit 38 is attached to the rod 36 .

[0320] Reference Figure 2The barcode reader 31 is connected to the control unit 9 so as to be communicable. The hand driving unit 34 and the substrate detecting unit 38 of the conveying mechanism 4 are connected to the control unit 9 so as to be communicable. The control unit 9 receives the detection results of the barcode reader 31 and the substrate detecting unit 38. The control unit 9 controls the hand driving unit 34.

[0321] <Processing Area 5>

[0322] Reference Figure 1 The arrangement of the components of the processing area 5 will be described. The processing area 5 has a transport space 41. The transport space 41 is arranged at the center of the processing area 5 in the width direction Y. The transport space 41 extends in the front-rear direction X. The transport space 41 is connected to the transport space 32 of the indexer part 2.

[0323] The placing section 6 and the conveying mechanism 8 are provided in the conveying space 41. The placing section 6 is arranged in front of the conveying mechanism 8. The placing section 6 is arranged behind the conveying mechanism 4. The placing section 6 is arranged between the conveying mechanism 4 and the conveying mechanism 8.

[0324] The processing unit 7 is arranged on both sides of the conveying space 41. The processing unit 7 is arranged to surround the side of the conveying mechanism 8. Specifically, the processing area 5 has a first processing section 42 and a second processing section 43. The first processing section 42, the conveying space 41 and the second processing section 43 are arranged in sequence in the width direction Y. The first processing section 42 is arranged on the right side of the conveying space 41. The second processing section 43 is arranged on the left side of the conveying space 41.

[0325] Fig.11 1 is a left side view showing the structure of the left part of the substrate processing apparatus 1. In the second processing section 43, a plurality of processing units 7 are arranged in a matrix in the front-rear direction X and the up-down direction Z. For example, in the second processing section 43, six processing units 7 are arranged in two rows in the front-rear direction X and in three layers in the up-down direction Z.

[0326] Although not shown in the figure, in the first processing section 42 , the plurality of processing units 7 are arranged in a matrix in the front-rear direction X and the up-down direction Z. For example, in the first processing section 42 , six processing units 7 are arranged in two rows in the front-rear direction X and in three layers in the up-down direction Z.

[0327] Fig.12 4 is a front view of the mounting section 6. The structure of the mounting section 6 will be described. The mounting section 6 can mount a plurality of substrates W. The mounting section 6 includes a plurality of shelves 45 and a support wall 48. The support wall 48 supports each shelf 45. The shelves 45 are arranged in a row in the vertical direction Z. Two shelves 45 adjacent to each other in the vertical direction Z are close to each other.

[0328] Each shelf 45 carries a substrate W in a horizontal position. The shelf 45 contacts the lower surface 16 of the substrate W. For example, the shelf 45 contacts the lower surface 16 of the peripheral portion 12 of the substrate W. The shelf 45 does not contact the upper surface 17 of the substrate W. Thus, the shelf 45 supports the substrate W. When the shelf 45 supports the substrate W, the shelf 45 allows the substrate W to move upward relative to the shelf 45.

[0329] Each shelf 45 includes a first shelf 46 and a second shelf 47. The first shelf 46 and the second shelf 47 are separated from each other. The first shelf 46 and the second shelf 47 are opposite to each other in the horizontal direction (specifically, the width direction Y). The interval E2 between the first shelf 46 and the second shelf 47 arranged in the horizontal direction is smaller than the diameter D of the substrate W. The interval E2 is larger than the length L1.

[0330] Fig.13 FIG. 4 is a plan view of the shelf 45 of the mounting portion 6 . The first shelf 46 supports the first side portion 18 of the substrate W. The second shelf 47 supports the second side portion 19 of the substrate W.

[0331] Fig.14 : This is a diagram of the detailed structure of the shelf 45 of the loading section 6. The first shelf 46 has a first inclined surface 51. The second shelf 47 has a second inclined surface 55. The first inclined surface 51 and the second inclined surface 55 are separated from each other. The second inclined surface 55 is opposite to the first inclined surface 51 in the horizontal direction (specifically, the width direction Y). When viewed from the front, the first inclined surface 51 and the second inclined surface 55 are symmetrical. When viewed from the front-to-back direction X, the first inclined surface 51 and the second inclined surface 55 are symmetrical. The first inclined surface 51 is in contact with the first side portion 18 of the substrate W. The second inclined surface 55 is in contact with the second side portion 19 of the substrate W.

[0332] The interval E2 corresponds to the interval between the first inclined surface 51 and the second inclined surface 55 in the horizontal direction. The interval E2 decreases as it goes downward.

[0333] The first inclined surface 51 has an upper end 51T. The second inclined surface 55 has an upper end 55T. The interval ET between the upper ends 51T and 55T in the horizontal direction is larger than the diameter D of the substrate W. For example, the interval ET is 306 [mm]. For example, the difference between the interval ET and the diameter D of the substrate W is 1 [%] or more of the diameter of the substrate W. For example, the difference between the interval ET and the diameter D of the substrate W is 2 [mm] or more.

[0334] The first inclined surface 51 has a lower end 51B. The second inclined surface 55 has a lower end 55B. The interval EB between the lower ends 51B and 55B in the horizontal direction is narrower than the interval ET. The interval EB is smaller than the diameter D of the substrate W.

[0335] The angle of the first inclined surface 51 is not constant over the entire first inclined surface 51. The first inclined surface 51 has an upper inclined surface 52 and a lower inclined surface 53. The lower inclined surface 53 is disposed below the upper inclined surface 52. The lower inclined surface 53 is connected to the lower end of the upper inclined surface 52. The upper inclined surface 52 is inclined at a first angle θ1 relative to the horizontal plane. The lower inclined surface 53 is inclined at a second angle θ2 relative to the horizontal plane. The second angle θ2 is smaller than the first angle θ1. The lower inclined surface 53 is closer to the horizontal than the upper inclined surface 52.

[0336] Similarly, the second inclined surface 55 has an upper inclined surface 56 and a lower inclined surface 57. The second inclined surface 55 has the same shape as the first inclined surface 51 except that it is bilaterally symmetrical with the first inclined surface 51. The upper inclined surface 56 and the lower inclined surface 57 have the same shapes as the upper inclined surface 52 and the lower inclined surface 53 except that they are bilaterally symmetrical with the upper inclined surface 52 and the lower inclined surface 53, respectively.

[0337] The first inclined surface 51 has a middle point 51M. The middle point 51M is the connection position of the upper inclined surface 52 and the lower inclined surface 53. The second inclined surface 55 has a middle point 55M. The middle point 55M is the connection position of the upper inclined surface 56 and the lower inclined surface 57. The interval EM between the middle points 51M and 55M in the horizontal direction is substantially equal to the diameter D of the substrate W.

[0338] Reference Figure 1 , 7 The structure of the conveying mechanism 8 will be described.

[0339] The transport mechanism 8 includes a hand 61 and a hand driving unit 62. The hand 61 supports one substrate W in a horizontal posture. The hand driving unit 62 is connected to the hand 61. The hand driving unit 62 moves the hand 61.

[0340] The hand driving unit 62 includes a support 62a, a vertical moving unit 62b, a rotating unit 62c, and an advance-retract movement unit 62d. The support 62a is fixedly provided. The support 62a extends in the up-down direction Z. The vertical moving unit 62b is supported by the support 62a. The vertical moving unit 62b moves in the up-down direction Z relative to the support 62a. The rotating unit 62c is supported by the vertical moving unit 62b. The rotating unit 62c rotates relative to the vertical moving unit 62b. The rotating unit 62c rotates around a rotation axis A2. The rotation axis A2 is parallel to the up-down direction Z. The advance-retract movement unit 62d reciprocates in a horizontal direction determined by the direction of the rotating unit 62c.

[0341] The hand 61 is fixed to the forward and backward moving part 62d. The hand 61 can move in parallel in the horizontal direction and the up-down direction Z. The hand 61 can rotate around the rotation axis A2.

[0342] Fig.15 It is a bottom view of the hand 61. Fig.16A , Fig. 16B 61. The structure of the hand 61 will be described. The hand 61 has a connecting portion 64. The connecting portion 64 is connected to the forward and backward moving portion 62d.

[0343] The hand portion 61 has a base portion 65. The base portion 65 is supported by the connection portion 64. The base portion 65 extends from the connection portion 64 in the horizontal direction.

[0344] The base portion 65 includes two branch portions 66. The branch portions 66 are separated from each other. The branch portions 66 extend in the same direction from the connecting portion 64. The direction in which the branch portions 66 extend is called the third direction F3. The third direction F3 is horizontal. The third direction F3 is the same as the direction in which the forward and backward moving portion 62d moves back and forth relative to the rotating portion 62c. The horizontal direction orthogonal to the third direction F3 is called the fourth direction F4. The two branch portions 66 are arranged in the fourth direction F4. The two branch portions 66 are line-symmetrical with respect to an imaginary line passing through the two branch portions 66 and parallel to the third direction F3 when viewed from above. The branch portions 66 are bent. Each branch portion 66 has a portion bent in a manner away from each other. In other words, each branch portion 66 has a portion bent in a manner bulging outwardly in the fourth direction F4.

[0345] The hand 61 has a suction unit 68. The suction unit 68 is mounted on the base unit 65. The suction unit 68 blows out gas. The suction unit 68 blows out gas downward. The suction unit 68 blows out gas toward the substrate W from a position above the substrate W. Here, "a position above the substrate W" refers to a position higher than the substrate W, that is, a position overlapping with the substrate W when viewed from above. Fig.15 The substrate W sucked by the suction part 68 is indicated by a dotted line. The suction part 68 blows gas toward the upper surface 17 of the substrate W. The suction part 68 causes the gas to flow along the upper surface 17 of the substrate W. Thus, the suction part 68 sucks the substrate W without contacting the substrate W. Specifically, a negative pressure is formed by the flow of gas along the upper surface 17 of the substrate W. That is, the gas pressure on the upper surface 17 of the substrate W is lower than the gas pressure on the lower surface 16 of the substrate W. Based on the Bernoulli principle, an upward force is applied to the substrate W. That is, the substrate W is sucked upward. The substrate W is sucked toward the suction part 68. However, the suction part 68 does not contact the substrate W sucked by the suction part 68. The base part 65 also does not contact the substrate W sucked by the suction part 68.

[0346] The suction portion 68 includes a plurality of (six) suction pads 69. Each suction pad 69 is provided on the lower surface of the base portion 65. The suction pad 69 is embedded in the base portion 65. The suction pads 69 are separated from each other. The suction pads 69 are arranged on a circumference centered on the center J of the substrate W sucked by the suction portion 68 in a plan view.

[0347] Each suction pad 69 is circular when viewed from above. Each suction pad 69 is cylindrical with a central axis parallel to the up-down direction Z. Each suction pad 69 has a lower portion open downward. The suction pad 69 blows out gas from the lower portion of the suction pad 69. The suction pad 69 can also form a rotating airflow. The rotating airflow is an airflow that rotates inside the suction pad 69 around the central axis of the suction pad 69. For example, the suction pad 69 can form a rotating airflow before the suction pad 69 blows out gas. For example, the suction pad 69 can form a rotating airflow, and then the suction pad 69 releases the rotating airflow to the outside of the suction pad 69.

[0348] The conveying mechanism 8 has a gas supply path 71. The gas supply path 71 supplies gas to the suction part 68. The gas supply path 71 has a first end and a second end. The first end of the gas supply path 71 is connected to a gas supply source 72. The second end of the gas supply path 71 is connected to the suction part 68. The second end of the gas supply path 71 is connected to each suction pad 69. The gas supplied to the suction part 68 is, for example, nitrogen gas or air. The gas supplied to the suction part 68 is, for example, high-pressure gas or compressed gas.

[0349] The transport mechanism 8 has a suction regulating part 73. The suction regulating part 73 is provided in the gas supply path 71. The suction regulating part 73 regulates the flow rate of the gas supplied to the suction part 68. That is, the suction regulating part 73 regulates the flow rate of the gas blown out of the suction part 68. The suction regulating part 73 may also regulate the flow rate of the gas supplied to the suction part 68 steplessly. The suction regulating part 73 may also regulate the flow rate of the gas supplied to the suction part 68 in steps. As the flow rate of the gas supplied to the suction part 68 increases, the suction force acting on the substrate W increases. The suction regulating part 73 includes, for example, a flow regulating valve. The suction regulating part 73 may also include an opening and closing valve.

[0350] The hand 61 has a contact portion 74. The contact portion 74 is mounted on the lower surface of the base portion 65. The contact portion 74 protrudes downward from the base portion 65. The contact portion 74 protrudes to a position lower than the suction portion 68. The contact portion 74 is arranged at a position overlapping with the substrate W sucked by the suction portion 68 when viewed from above. The contact portion 74 contacts the upper surface 17 of the substrate W sucked by the suction portion 68. More specifically, the contact portion 74 contacts the upper surface 17 in the peripheral portion 12 of the substrate W. The contact portion 74 does not contact the lower surface 16 of the substrate W sucked by the suction portion 68. The contact portion 74 itself allows the substrate W to move downward relative to the contact portion 74.

[0351] The suction unit 68 sucks the substrate W upward and the contact unit 74 contacts the upper surface 17 of the substrate W, so that the substrate W is supported and held at a predetermined position. That is, the suction unit 68 sucks the substrate W upward and the contact unit 74 contacts the upper surface 17 of the substrate W, so that the hand 61 holds the substrate W.

[0352] The contact portion 74 is disposed at a position farther from the center J of the substrate W sucked by the suction portion 68 than the suction portion 68. The contact portion 74 is disposed radially outward of the substrate W sucked by the suction portion 68 than the suction portion 68.

[0353] The contact portion 74 includes a plurality of (for example, two) first contact portions 75 and a plurality of (for example, two) second contact portions 76. The position of the first contact portion 75 is substantially the same as the position of the first receiving portion 82 described later when viewed from above. The first contact portion 75 and the second contact portion 76 are separated from each other. The first contact portion 75 is mounted on the top end portion of the base portion 65. The first contact portion 75 is arranged at a position farther from the connecting portion 64 than the attraction portion 68. The second contact portion 76 is mounted on the base end portion of the base portion 65. The second contact portion 76 is arranged at a position closer to the connecting portion 64 than the attraction portion 68.

[0354] The hand 61 has a wall portion 77. The wall portion 77 is mounted on the lower surface of the base portion 65. The wall portion 77 extends downward from the base portion 65. The wall portion 77 extends to a position lower than the contact portion 74. The wall portion 77 extends to a position lower than the substrate W sucked by the suction portion 68. The wall portion 77 is arranged at a position that does not overlap with the substrate W sucked by the suction portion 68 when viewed from above. The wall portion 77 is arranged on the side of the substrate W sucked by the suction portion 68. The wall portion 77 does not contact the substrate W sucked by the suction portion 68. However, when the substrate W deviates in the horizontal direction by more than a specified value, the wall portion 77 contacts the substrate W. Thus, the wall portion 77 limits the substrate W from deviating in the horizontal direction by more than a specified value. The specified value is, for example, 3 [mm].

[0355] The wall portion 77 is disposed at a position farther from the center J of the substrate W sucked by the suction portion 68 than the contact portion 74. The wall portion 77 is disposed radially outward of the substrate W sucked by the suction portion 68 than the contact portion 74.

[0356] The wall portion 77 includes a plurality of (for example, two) first wall portions 78 and a plurality of (for example, two) second wall portions 79. The first wall portion 78 and the second wall portion 79 are fixed to the base portion 65. The first wall portion 78 and the second wall portion 79 are separated from each other. The first wall portion 78 is mounted on the top end portion of the base portion 65. The first wall portion 78 is arranged at a position farther from the connecting portion 64 than the suction portion 68. The second wall portion 79 is mounted on the base end portion of the base portion 65. The second wall portion 79 is arranged at a position closer to the connecting portion 64 than the suction portion 68.

[0357] The first wall portion 78 is connected to the first contact portion 75. The first wall portion 78 extends downward from the first contact portion 75. The second wall portion 79 is connected to the second contact portion 76. The second wall portion 79 extends downward from the second contact portion 76.

[0358] The hand 61 has a receiving portion 81. The receiving portion 81 is supported by the base portion. The receiving portion 81 is arranged below the substrate W sucked by the suction portion 68. The receiving portion 81 does not contact the substrate W sucked by the suction portion 68. The receiving portion 81 can receive the lower surface 16 of the substrate W. That is, the receiving portion 81 can contact the lower surface 16 of the substrate W. The receiving portion 81 can support the substrate W. The receiving portion 81 does not contact the upper surface 17 of the substrate W. The receiving portion 81 allows the substrate W to move upward relative to the receiving portion 81.

[0359] The receiving portion 81 has a plurality of (for example, two) first receiving portions 82. The first receiving portion 82 is supported by the base portion 65. The first receiving portion 82 is fixed to the base portion 65. The first receiving portion 82 cannot move relative to the base portion 65. The first receiving portion 82 is arranged below the substrate W attracted by the attraction portion 68. The first receiving portion 82 can receive the lower surface 16 of the substrate W. That is, the first receiving portion 82 can contact the lower surface 16 of the substrate W.

[0360] The first receiving portion 82 is arranged at a position farther from the center J of the substrate W sucked by the sucking portion 68 than the sucking portion 68. The first receiving portion 82 is arranged at a radially outer side of the substrate W sucked by the sucking portion 68 than the sucking portion 68. The first receiving portion 82 is arranged at a top end portion of the base portion 65. The first receiving portion 82 is arranged at a position farther from the connecting portion 64 than the sucking portion 68.

[0361] The first receiving portion 82 is disposed below the first contact portion 75. The first receiving portion 82 overlaps with the first contact portion 75 in a plan view.

[0362] The first receiving portion 82 is connected to the first wall portion 78. The first receiving portion 82 extends in the horizontal direction from the first wall portion 78. The first receiving portion 82 extends from the first wall portion 78 toward the center J of the substrate W sucked by the suction portion 68 in a plan view.

[0363] The first contact portion 75, the first wall portion 78, and the first receiving portion 82 are integrally formed components. The first contact portion 75, the first wall portion 78, and the first receiving portion 82 cannot be separated from each other. The second contact portion 76 and the second wall portion 79 are integrally formed components. The second contact portion 76 and the second wall portion 79 cannot be separated from each other.

[0364] The receiving portion 81 has a plurality of (for example, two) second receiving portions 83. The second receiving portion 83 is supported by the base portion 65. The second receiving portion 83 is disposed below the substrate W sucked by the suction portion 68. The second receiving portion 83 can receive the lower surface 16 of the substrate W. That is, the second receiving portion 83 can contact the lower surface 16 of the substrate W.

[0365] The second receiving portion 83 is arranged at a position farther from the center J of the substrate W sucked by the sucking portion 68 than the sucking portion 68. The second receiving portion 83 is arranged at a radially outer side of the substrate W sucked by the sucking portion 68 than the sucking portion 68. The second receiving portion 83 is arranged at a base end portion of the base portion 65. The second receiving portion 83 is arranged at a position closer to the connecting portion 64 than the sucking portion 68. The second receiving portion 83 is arranged between the two branch portions 66. The second receiving portion 83 is arranged between the two second contact portions 76.

[0366] The second receiving portion 83 is movable relative to the base portion 65. The second receiving portion 83 is movable in the horizontal direction relative to the base portion 65. Specifically, the second receiving portion 83 is movable between the fall-off prevention position and the retreat position. Fig.15 The second receiving portion 83 in the fall-off prevention position is indicated by a dotted line. Fig.15 In the figure, the second receiving portion 83 in the retreat position is indicated by a solid line. When the second receiving portion 83 moves from the retreat position to the fall-off prevention position, the second receiving portion 83 approaches the first receiving portion 82. When the second receiving portion 83 moves from the fall-off prevention position to the retreat position, the second receiving portion 83 moves away from the first receiving portion 82. When the second receiving portion 83 is in the retreat position, the second receiving portion 83 does not overlap with the substrate W sucked by the suction portion 68 in a plan view.

[0367] Fig.17 FIG. 8 is a top view of the suction unit 68, the substrate W sucked by the suction unit 68, and the receiving unit 81. Fig.17 , the second receiving portion 83 is located at the fall-off prevention position. At least a portion of the first receiving portion 82 overlaps with the substrate W sucked by the suction portion 68 in a plan view. When the second receiving portion 83 is at the fall-off prevention position, at least a portion of the second receiving portion 83 overlaps with the substrate W sucked by the suction portion 68 in a plan view. The second receiving portion 83 is arranged on the side opposite to the first receiving portion 82 with respect to the center J of the substrate W sucked by the suction portion 68.

[0368] Fig.18 is a top view of the receiving portion 81. Fig.18 In the embodiment, the second receiving portion 83 is in the retracted position. When the second receiving portion 83 is in the retracted position, the space between the first receiving portion 82 and the second receiving portion 83 is larger than the substrate W. When the second receiving portion 83 is in the retracted position, the substrate W can pass between the first receiving portion 82 and the second receiving portion 83 in a horizontal position along the vertical direction Z. Fig.18 In the figure, for the convenience of explanation, the substrate W is shown. Fig.18 The position of the substrate W shown is different from the position of the substrate W sucked by the suction portion 68 .

[0369] Reference Fig.15 , Fig.16A , Fig. 16B The wall portion 77 further includes a third wall portion 80. The third wall portion 80 is connected to the second receiving portion 83. The third wall portion 80 extends upward from the second receiving portion 83. The second receiving portion 83 extends horizontally from the third wall portion 80. The second receiving portion 83 extends from the third wall portion 80 toward the center J of the substrate W sucked by the suction portion 68 in a plan view.

[0370] The second receiving portion 83 and the third wall portion 80 are integrally formed members. The second receiving portion 83 and the third wall portion 80 cannot be separated from each other. The second receiving portion 83 and the third wall portion 80 move integrally. The third wall portion 80 can also move relative to the base portion 65.

[0371] The hand 61 has a receiving portion driving portion 86. The receiving portion driving portion 86 is supported by, for example, the base portion 65. The receiving portion driving portion 86 is connected to the second receiving portion 83. For example, the receiving portion driving portion 86 is connected to the second receiving portion 83 via the third wall portion 80. The receiving portion driving portion 86 moves the second receiving portion 83 relative to the base portion 65. The receiving portion driving portion 86 moves the second receiving portion 83 in a horizontal direction. The receiving portion driving portion 86 reciprocates the second receiving portion 83 in a third direction F3. The receiving portion driving portion 86 brings the second receiving portion 83 close to the first receiving portion 82, and makes the second receiving portion 83 deviate from the first receiving portion 82. The receiving portion driving portion 86 moves the second receiving portion 83 between a fall-off prevention position and a retreat position.

[0372] The receiving portion driving portion 86 has an actuator 87. The actuator 87 moves the second receiving portion 83 by a power source that inputs power to the actuator 87. The actuator 87 moves the second receiving portion 83 from the retreat position to the fall-off prevention position, and moves the second receiving portion 83 from the fall-off prevention position to the retreat position. The actuator 87 is, for example, an air cylinder. The power source of the air cylinder is air pressure. The actuator 87 is, for example, an electric motor. The power source of the electric motor is electricity.

[0373] The receiving portion driving portion 86 further includes an elastic member 88. The elastic member 88 applies force to the second receiving portion 83 from the retreat position toward the fall-off prevention position. The elastic member 88 is, for example, a spring. The elastic member 88 may also be disposed outside the actuator 87. Alternatively, the elastic member 88 may also be disposed inside the actuator 87.

[0374] When the power source of the actuator 87 stops, the second receiving portion 83 is held in the retracted position by the elastic member 88 .

[0375] The hand 61 includes a substrate detection unit 89 . The substrate detection unit 89 detects the substrate W supported by the hand 61 . The substrate detection unit 89 is attached to the base unit 65 .

[0376] Reference Figure 2The control unit 9 is communicatively connected to the hand driving unit 62, the suction regulating unit 73, the receiving unit driving unit 86 (actuator 87), and the substrate detecting unit 89 of the conveying mechanism 8. The control unit 9 receives the detection result of the substrate detecting unit 89. The control unit 9 controls the hand driving unit 62, the suction regulating unit 73, and the receiving unit driving unit 86 (actuator 87).

[0377] Reference Figure 1 , 11 . The basic structure of the processing unit 7 is described. Each processing unit 7 has a substrate holding portion 91, a rotation driving portion 92, and a baffle 93. The substrate holding portion 91 holds a substrate W. The substrate holding portion 91 holds the substrate W in a horizontal posture. The rotation driving portion 92 is connected to the substrate holding portion 91. The rotation driving portion 92 rotates the substrate holding portion 91. The baffle 93 is configured to surround the side of the substrate holding portion 91. The baffle 93 receives the processing liquid.

[0378] The processing unit 7 is divided into a first processing unit 7A and a second processing unit 7B according to the structure of the substrate holding portion 91. The substrate holding portion 91 of the first processing unit 7A is called a Bernoulli chuck or a Bernoulli fixture. The Bernoulli chuck is suitable for holding a relatively thin substrate W. The substrate holding portion 91 of the second processing unit 7B is called a mechanical chuck or a mechanical fixture. The mechanical chuck is suitable for holding a relatively thick substrate W.

[0379] For example, the six processing units 7 arranged in the first processing section 42 are respectively the first processing units 7A. For example, the six processing units 7 arranged in the second processing section 43 are respectively the second processing units 7B.

[0380] Hereinafter, the substrate holding portion 91 of the first processing unit 7A is appropriately described as the “first substrate holding portion 91A”. The rotation drive portion 92 of the first processing unit 7A is appropriately described as the “first rotation drive portion 92A”. The substrate holding portion 91 of the second processing unit 7B is appropriately described as the “second substrate holding portion 91B”. The rotation drive portion 92 of the second processing unit 7B is appropriately described as the “second rotation drive portion 92B”.

[0381] Fig.19 It is a diagram schematically showing the structure of the first processing unit 7A. Fig.19 Illustration of the baffle plate 93 is omitted. The structure of the first processing unit 7A will be described.

[0382] The first substrate holding portion 91A has a first plate 101. The first plate 101 has a substantially disk shape. The first plate 101 has an upper surface 102. The upper surface 102 is substantially horizontal. The upper surface 102 is substantially flat.

[0383] The first rotation drive unit 92A is connected to the lower part of the first plate 101. The first rotation drive unit 92A rotates the first plate 101. The first plate 101 is rotated about the rotation axis A3 by the first rotation drive unit 92A. The rotation axis A3 is parallel to the up-down direction Z. The rotation axis A3 passes through the center of the first plate 101.

[0384] Fig. 20 1 is a plan view of the first plate 101. The upper surface 102 of the first plate 101 is circular in a plan view. The upper surface 102 of the first plate 101 is larger than the substrate W in a plan view.

[0385] The first substrate holding portion 91A includes a plurality of (for example, 30) fixing pins 103. The fixing pins 103 support the substrate W. Each fixing pin 103 is fixed to the first plate 101. Each fixing pin 103 cannot move relative to the first plate 101. Each fixing pin 103 cannot rotate relative to the first plate 101. Each fixing pin 103 does not have a movable portion that can move relative to the first plate 101.

[0386] The fixing pins 103 are arranged on the peripheral edge of the upper surface 102 of the first plate 101. The fixing pins 103 are arranged on a circumference centered on the rotation axis A3 in a plan view. The fixing pins 103 are separated from each other.

[0387] Reference Fig.19 , 20 The fixing pins 103 protrude upward from the upper surface 102 of the first plate 101. The fixing pins 103 contact the lower surface 16 of the substrate W. More specifically, the fixing pins 103 contact the lower surface 16 of the peripheral edge portion 12 of the substrate W. Thus, the fixing pins 103 support the substrate W at a position higher than the upper surface 102 of the first plate 101. Fig. 20 The substrate W supported by the fixing pins 103 is indicated by a dotted line.

[0388] The fixing pins 103 do not contact the upper surface 17 of the substrate W. The fixing pins 103 allow the substrate W to move upward relative to the fixing pins 103. The fixing pins 103 do not contact the edge 20 of the substrate W. The fixing pins 103 themselves allow the substrate W to slide relative to the fixing pins 103. Thus, the fixing pins 103 themselves do not hold the substrate W.

[0389] The first substrate holding portion 91A has a gas blowing outlet 104. The gas blowing outlet 104 is formed on the upper surface 102 of the first plate 101. The gas blowing outlet 104 is arranged at a position overlapping with the substrate W supported by the fixing pins 103 when viewed from above. The gas blowing outlet 104 blows gas upward. The gas blowing outlet 104 blows gas between the upper surface 102 of the first plate 101 and the lower surface 16 of the substrate W supported by the fixing pins 103. The gas blowing outlet 104 blows gas toward the substrate W from a position below the substrate W supported by the fixing pins 103. The gas is supplied between the upper surface 102 of the first plate 101 and the lower surface 16 of the substrate W supported by the fixing pins 103. The gas flows along the lower surface 16 of the substrate W supported by the fixing pins 103. Thus, the gas blowing outlet 104 attracts the substrate W. Specifically, negative pressure is formed by the flow of gas along the lower surface 16 of the substrate W. That is, the gas pressure on the lower surface 16 of the substrate W is smaller than the gas pressure on the upper surface 17 of the substrate W. Based on the Bernoulli principle, a downward force is applied to the substrate W. That is, the substrate W is attracted downward. The substrate W is attracted toward the gas outlet 104 and the first plate 101. However, the gas outlet 104 does not contact the substrate W. The first plate 101 does not contact the substrate W either.

[0390] The substrate W is sucked downward by the gas blowing outlet 104 and the fixing pins 103 are in contact with the lower surface 16 of the substrate W, so that the substrate W is supported and held at a predetermined position. The substrate W does not slide in the horizontal direction relative to the fixing pins 103 due to the suction force acting on the substrate W. That is, the substrate W is sucked downward by the gas blowing outlet 104 and the fixing pins 103 are in contact with the lower surface 16 of the substrate W, so that the first substrate holding portion 91A holds the substrate W.

[0391] The gas outlet 104 has a first outlet 105 and a plurality of second outlets 106. The first outlet 105 is arranged at the central portion of the upper surface 102 of the first plate 101. The first outlet 105 is arranged on the rotation axis A3. The second outlet 106 is arranged radially outward of the rotation axis A3 compared to the first outlet 105. The second outlet 106 is arranged radially inward of the rotation axis A3 compared to the fixing pin 103. The second outlets 106 are arranged on a circle centered on the rotation axis A3 when viewed from above.

[0392] The first processing unit 7A has a first gas supply path 107 and a second gas supply path 108. The first gas supply path 107 supplies gas to the first outlet 105. The second gas supply path 108 supplies gas to the second outlet 106. A portion of the first gas supply path 107 and a portion of the second gas supply path 108 are formed inside the first plate 101. The first gas supply path 107 has a first end and a second end. The first end of the first gas supply path 107 is connected to a gas supply source 109. The second end of the first gas supply path 107 is connected to the first outlet 105. The second gas supply path 108 has a first end and a second end. The first end of the second gas supply path 108 is connected to the gas supply source 109. The second end of the second gas supply path 108 is connected to the second outlet 106. The gas supplied to the first outlet 105 and the second outlet 106 is, for example, nitrogen gas or air. The gas supplied to the first outlet 105 and the second outlet 106 is, for example, high-pressure gas or compressed gas.

[0393] The first processing unit 7A has a first blow-out regulating section 111 and a second blow-out regulating section 112. The first blow-out regulating section 111 is provided in the first gas supply path 107. The second blow-out regulating section 112 is provided in the second gas supply path 108. The first blow-out regulating section 111 regulates the flow rate of the gas blown out of the first blow-out port 105. That is, the first blow-out regulating section 111 regulates the flow rate of the gas supplied to the first blow-out port 105. The second blow-out regulating section 112 regulates the flow rate of the gas blown out of the second blow-out port 106. That is, the second blow-out regulating section 112 regulates the flow rate of the gas supplied to the second blow-out port 106. As the flow rate of the gas blown out of the first blow-out port 105 increases, the suction force acting on the substrate W increases. As the flow rate of the gas blown out of the second blow-out port 106 increases, the suction force acting on the substrate W increases.

[0394] The first blow-out regulating section 111 cannot regulate the flow rate of the gas blown out of the second blow-out outlet 106. The second blow-out regulating section 112 cannot regulate the flow rate of the gas blown out of the first blow-out outlet 105. The first blow-out regulating section 111 and the second blow-out regulating section 112 can operate independently of each other. Thus, the flow rate of the gas blown out of the first blow-out outlet 105 and the flow rate of the gas blown out of the second blow-out outlet 106 can be regulated independently of each other. The first blow-out regulating section 111 and the second blow-out regulating section 112 include, for example, flow rate regulating valves, respectively. The first blow-out regulating section 111 and the second blow-out regulating section 112 may also further include an opening and closing valve.

[0395] Reference Fig. 20. The processing unit 7 has a plurality of (for example, six) position adjustment pins 113. The position adjustment pins 113 are supported by the first plate 101. The position adjustment pins 113 are movable in the horizontal direction relative to the first plate 101. By moving the position adjustment pins 113 relative to the first plate 101, the position adjustment pins 113 are able to contact the substrate W supported by the fixed pins 103, and are able to separate from the substrate W supported by the fixed pins 103. In more detail, the position adjustment pins 113 are able to contact the end edge 20 of the substrate W supported by the fixed pins 103. The position adjustment pins 113 adjust the position of the substrate W supported by the fixed pins 103. The position adjustment pins 113 adjust the position of the substrate W in the horizontal direction. The position adjustment pins 113 make the center J of the substrate W supported by the fixed pins 103 located on the rotation axis A3.

[0396] In this specification, the position of the position adjustment pin 113 in contact with the substrate W is referred to as an “adjustment position”. The position of the position adjustment pin 113 separated from the substrate W is referred to as a “retracted position”. The position adjustment pin 113 is movable between the adjustment position and the retracted position.

[0397] The position adjustment pins 113 are arranged on the periphery of the upper surface 102 of the first plate 101. The position adjustment pins 113 are arranged on a circle centered on the rotation axis A3 in a plan view. The position adjustment pins 113 are arranged at substantially the same height as the substrate W supported by the fixing pins 103.

[0398] Fig.21A , 21B It is a top view of the detailed structure of the position adjustment pin. Fig.22A , 22B is a side view of the position adjustment pin. Fig.21A , 22A The position adjustment pin 113 is shown in the retracted position. Fig. 21B , 22BIndicates the position adjustment pin 113 in the adjustment position. Each position adjustment pin 113 is fixed to the shaft 114. The shaft 114 extends downward from the position adjustment pin 113. The shaft 114 is supported by the first plate 101. The position adjustment pin 113 is supported by the first plate 101 via the shaft 114. The shaft 114 is rotatable relative to the first plate 101. The shaft 114 is rotatable around the rotation axis A4. The rotation axis A4 is parallel to the up-down direction Z. The rotation axis A4 passes through the center of the shaft 114. The position adjustment pin 113 is arranged at a position eccentric to the rotation axis A4. By rotating the shaft 114 relative to the first plate 101, the position adjustment pin 113 moves in the horizontal direction relative to the first plate 101. Specifically, the position adjustment pin 113 rotates and moves around the rotation axis A4. As a result, the position adjustment pin 113 can approach the rotation axis A3 and can move away from the rotation axis A3. As the position adjustment pin 113 approaches the rotation axis A3, the position adjustment pin 113 moves to the adjustment position. When the position adjustment pin 113 is in the adjustment position, the position adjustment pin 113 contacts the end edge 20 of the substrate W supported by the fixed pin 103. Moreover, the position adjustment pin 113 presses the end edge 20 of the substrate W in contact with the position adjustment pin 113 toward the rotation axis A3. By pressing the end edge 20 of the substrate W by a plurality of position adjustment pins 113 arranged at different positions, the substrate W is adjusted to a specified position. As the position adjustment pin 113 moves away from the rotation axis A3, the position adjustment pin 113 moves to the retreat position. When the position adjustment pin 113 is in the retreat position, the position adjustment pin 113 is separated from the end edge 20 of the substrate W supported by the fixed pin 103. When the position adjustment pin 113 is in the retreat position, the position adjustment pin 113 does not contact the substrate W supported by the fixed pin 103.

[0399] Reference Fig. 20 The processing unit 7 has a plurality of (for example, six) lift pins 116. The lift pins 116 are arranged on the peripheral edge of the upper surface 102 of the first plate 101. The lift pins 116 are arranged on a circle centered on the rotation axis A3 in a plan view.

[0400] Fig.23A , 23B 101 is a side view of the lift pins 116. The lift pins 116 are supported by the first plate 101. The lift pins 116 are supported to be movable in the vertical direction Z relative to the first plate 101. The lift pins 116 support the substrate W. The lift pins 116 move the substrate W supported by the lift pins 116 in the vertical direction Z.

[0401] Fig.23A The lifting pins 116 are shown in the upper position. The lifting pins 116 can move to the upper position. The upper position is higher than the fixing pins 103. The lifting pins 116 can support the substrate W in the upper position. When the lifting pins 116 support the substrate W in the upper position, the substrate W is at a position higher than the fixing pins 103.

[0402] Reference Fig. 23B . The lifting pins 116 can move downward from an upper position. The lifting pins 116 lower the substrate W. Specifically, the lifting pins 116 lower the substrate W from a position higher than the fixed pins 103. As a result, the lifting pins 116 transfer the substrate W to the fixed pins 103. In this way, in a state where the lifting pins 116 support the substrate W, the lifting pins 116 move downward from an upper position, thereby transferring the substrate W to the fixed pins 103. After the lifting pins 116 transfer the substrate W to the fixed pins 103, the lifting pins 116 move further downward relative to the first plate 101 and separate from the substrate W supported by the fixed pins 103.

[0403] In this specification, the position of the lift pins 116 that is not in contact with the substrate W supported by the fixing pins 103 is referred to as a lower position. Fig. 23B Indicates the lift pin 116 in the lower position. The lower position is lower than the upper position. The lift pin 116 can move to the lower position.

[0404] The substrate W is removed from the fixing pins 103 by the lift pins 116 moving upward from the lower position.

[0405] In this way, the lift pins 116 move between the upper position and the lower position, thereby transferring the substrate W to the fixing pins 103 and removing the substrate W from the fixing pins 103 .

[0406] Reference Fig.19 The first processing unit 7A includes a processing liquid supply unit 121. The processing liquid supply unit 121 supplies the processing liquid to the substrate W.

[0407] The processing liquid supply unit 121 includes a nozzle 122. The nozzle 122 sprays the processing liquid toward the substrate W. The nozzle 122 is provided so as to be movable between a processing position and a retreat position. Fig.19 The nozzle 122 in the processing position is indicated by a dotted line. Fig.19 The nozzle 122 in the retracted position is indicated by a solid line in FIG. The processing position is a position above the substrate W held by the first substrate holding portion 91A. When the nozzle 122 is in the processing position, the nozzle 122 overlaps with the substrate W held by the first substrate holding portion 91A in a plan view. When the nozzle 122 is in the retracted position, the nozzle 122 does not overlap with the substrate W held by the first substrate holding portion 91A in a plan view.

[0408] The processing liquid supply unit 121 includes a pipe 123. The pipe 123 supplies the processing liquid to the nozzle 122. The pipe 123 includes a first end and a second end. The first end of the pipe 123 is connected to the processing liquid supply source 124. The second end of the pipe 123 is connected to the nozzle 122.

[0409] The first processing unit 7A includes a flow rate regulator 125 . The flow rate regulator 125 is provided in the pipe 123 . The flow rate regulator 125 regulates the flow rate of the processing liquid supplied from the processing liquid supply unit 121 to the substrate W. That is, the flow rate regulator 125 regulates the flow rate of the processing liquid ejected from the nozzle 122 .

[0410] The first processing unit 7A includes a substrate detection unit 127. The substrate detection unit 127 detects the substrate W supported by the fixing pins 103. Furthermore, the substrate detection unit 127 detects the position of the substrate W supported by the fixing pins 103. The substrate detection unit 127, for example, captures an image of the edge 20 of the substrate W supported by the fixing pins 103. The substrate detection unit 127 is, for example, an image sensor. The substrate detection unit 127 is, for example, disposed above the first substrate holding unit 91A.

[0411] Reference Figure 2 The control unit 9 is communicatively connected to the first rotation drive unit 92A, the position adjustment pin 113, the lifting pin 116, the first blow-out adjustment unit 111, the second blow-out adjustment unit 112, the flow rate adjustment unit 125, and the substrate detection unit 127 of the first processing unit 7A. The control unit 9 receives the detection result of the substrate detection unit 127. The control unit 9 controls the first rotation drive unit 92A, the position adjustment pin 113, the lifting pin 116, the first blow-out adjustment unit 111, the second blow-out adjustment unit 112, and the flow rate adjustment unit 125.

[0412] The fixing pin 103 is an example of a supporting portion in the present invention. The position adjustment pin 113 is an example of a position adjustment portion in the present invention. The lifting pin 116 is an example of a lifting portion in the present invention.

[0413] Fig.24 It is a diagram schematically showing the structure of the second processing unit 7B. Fig.24 The shutter 93 is omitted from the illustration. The structure of the second processing unit 7B will be described in detail. The same reference numerals are given to the same structures as those of the first processing unit 7A, and detailed descriptions thereof will be omitted.

[0414] The second substrate holding portion 91B has a second plate 131. The second plate 131 has a substantially disk shape. The second plate 131 has an upper surface 132. The upper surface 132 is substantially horizontal. The upper surface 132 is substantially flat.

[0415] The second rotation drive unit 92B is connected to the lower part of the second plate 131. The second rotation drive unit 92B rotates the second plate 131. The second plate 131 is rotated about the rotation axis A5 by the second rotation drive unit 92B. The rotation axis A5 is parallel to the up-down direction Z. The rotation axis A5 passes through the center of the second plate 131.

[0416] Fig.251 is a plan view of the second plate 131. The upper surface 132 of the second plate 131 is circular in a plan view. The upper surface 132 of the second plate 131 is larger than the substrate W in a plan view.

[0417] The second substrate holding portion 91B has a plurality of (for example, six) edge contact pins 133. The edge contact pins 133 are mounted on the second plate 131. The edge contact pins 133 are supported by the second plate 131. The edge contact pins 133 are movable relative to the second plate 131. The edge contact pins 133 are capable of contacting the edge 20 of the substrate W. For example, when the second rotation drive portion 92B rotates the second substrate holding portion 91B, the edge contact pins 133 contact the edge 20 of the substrate W. When the second rotation drive portion 92B rotates the second substrate holding portion 91B, the edge contact pins 133 hold the edge 20 of the substrate W so that the substrate W does not slide relative to the edge contact pins 133. Fig.25 The substrate W held by the edge contact pins 133 is indicated by dotted lines.

[0418] The edge contact pins 133 are arranged on the peripheral edge portion of the second plate 131. The edge contact pins 133 are arranged on a circumference centered on the rotation axis A5 in a plan view.

[0419] Fig.26A , 26B It is a top view showing the detailed structure of the edge contact pin 133 . Fig.27A , 27B 1 is a side view of the edge contact pin 133. The edge contact pin 133 and the structure related to the edge contact pin 133 are illustrated.

[0420] Each of the end edge contact pins 133 is fixed to a small piece 134. The small piece 134 is sufficiently smaller than the second plate 131. The small piece 134 has a wedge shape in a plan view. The small piece 134 extends in the horizontal direction.

[0421] The small piece 134 also supports the lower surface contact pin 135. The lower surface contact pin 135 is also fixed to the small piece 134. The edge contact pin 133 and the lower surface contact pin 135 protrude upward from the small piece 134 respectively. The lower surface contact pin 135 contacts the lower surface 16 of the substrate W. In more detail, the lower surface contact pin 135 contacts the lower surface 16 in the peripheral portion 12 of the substrate W. Thus, the lower surface contact pin 135 supports the substrate W. The lower surface contact pin 135 does not contact the upper surface 17 of the substrate W. The lower surface contact pin 135 allows the substrate W to move upward relative to the lower surface contact pin 135.

[0422] The small piece 134 is fixed to the shaft 136. The shaft 136 extends downward from the small piece 134. The shaft 136 is supported by the second plate 131. The edge contact pin 133 and the lower surface contact pin 135 are supported by the second plate 131 via the shaft 136. The shaft 136 is rotatable relative to the second plate 131. The shaft 136 is rotatable around the rotation axis A6. The rotation axis A6 is parallel to the up-down direction Z. The rotation axis A6 passes through the center of the shaft 136.

[0423] The lower surface contact pin 135 is arranged on the rotation axis A6. The rotation axis A6 passes through the center of the lower surface contact pin 135. When the shaft portion 136 rotates relative to the second plate 131, the lower surface contact pin 135 also rotates relative to the second plate 131. However, the position of the lower surface contact pin 135 relative to the second plate 131 does not substantially change. The distance between the lower surface contact pin 135 and the rotation axis A5 does not change.

[0424] The edge contact pin 133 is arranged at a position eccentric to the rotation axis A6.

[0425] The end edge contact pin 133 moves in the horizontal direction relative to the second plate 131 by the shaft portion 136 rotating relative to the second plate 131. Specifically, the end edge contact pin 133 can approach the rotation axis A5, and can be away from the rotation axis A5.

[0426] Reference Fig.26A , Fig.27A As the edge contact pin 133 approaches the rotation axis A5, the edge contact pin 133 contacts the edge 20 of the substrate W supported by the lower surface contact pin 135. Furthermore, the edge contact pin 133 may also press the edge 20 of the substrate W in contact with the edge contact pin 133 toward the rotation axis A5.

[0427] Reference Fig.26B , Fig.27B As the edge contact pins 133 move away from the rotation axis A5 , the edge contact pins 133 are separated from the edge 20 of the substrate W supported by the lower surface contact pins 135 .

[0428] When the second rotation drive unit 92B rotates the second substrate holding unit 91B, the edge contact pin 133 does not separate from the substrate W. The second rotation drive unit 92B rotates the second substrate holding unit 91B in a state where the edge contact pin 133 is in contact with the edge 20 of the substrate W. Thus, when the second substrate holding unit 91B rotates, the substrate W does not slide relative to the edge contact pin 133. That is, the edge contact pin 133 holds the edge 20 of the substrate W.

[0429] In the second substrate holding portion 91B, the lift pins 116 can support the substrate W at a position higher than the lower surface contact pins 135 . The lift pins 116 can transfer the substrate W to the lower surface contact pins 135 , and can remove the substrate W from the lower surface contact pins 135 .

[0430] Furthermore, the second substrate holding portion 91B does not suck the substrate W held by the edge contact pins 133. The second substrate holding portion 91B does not blow gas between the upper surface 132 of the second plate 131 and the lower surface 16 of the substrate W held by the edge contact pins 133. The second plate 131 does not have a gas blowing port.

[0431] Reference Figure 2 The control unit 9 is communicatively connected to the second rotation drive unit 92B, the lifting pins 116, the flow rate adjustment unit 125, and the edge contact pins 133 of the second processing unit 7B. The control unit 9 controls the second rotation drive unit 92B, the lifting pins 116, the flow rate adjustment unit 125, and the edge contact pins 133.

[0432] The edge contact pin 133 is an example of an edge contact portion in the present invention.

[0433] <Operation Example of Substrate Processing Apparatus 1>

[0434] The following operation examples are described in order.

[0435] a) Example of operation of the control unit 9 acquiring the shape of the substrate W

[0436] b) Operation example of the conveying mechanism 4

[0437] c) Operation example of the conveying mechanism 8

[0438] d) Operation Example of the First Processing Unit 7A

[0439] e) Operation example of the second processing unit 7B

[0440] <Operation Example of Control Unit 9 Acquiring Shape of Substrate W>

[0441] Fig.28 This is a step showing an example of the operation of the control unit 9 acquiring the shape of the substrate W.

[0442] Step S1

[0443] The barcode reader 31 reads the barcode attached to the storage rack C. The barcode reader 31 outputs the detection result of the barcode reader 31 to the control unit 9 .

[0444] Step S2

[0445] The control unit 9 determines the shape of the substrate W based on the detection result of the barcode reader 31. Specifically, the control unit 9 determines whether the substrate W in the storage rack C belongs to the first substrate W1, the second substrate W2, and the third substrate W3. The control unit 9 determines whether the substrate W in the storage rack C belongs to the normal diameter substrate WN or the large diameter substrate WL.

[0446] In addition, after the substrate W is unloaded from the storage rack C, the control unit 9 associates and manages the position of the substrate W and the shape of the substrate W. Specifically, the control unit 9 manages the shape of the substrate W transported by the transport mechanism 4, 8 at each time. The control unit 9 manages the shape of the substrate W placed on the placement unit 6 at each time. The control unit 9 manages the shape of the substrate W processed by the processing unit 7 at each time. In order to manage the position of the substrate W and the shape of the substrate W, the control unit 9 may also appropriately refer to the detection results of the substrate detection units 38, 89, and 127.

[0447] <Operation Example of the Conveying Mechanism 4>

[0448] Fig.29 It is a flowchart showing the control procedure of the control unit 9 and the operation of the conveying mechanism 4 .

[0449] Step S11

[0450] The control unit 9 determines the height position of the hand 33 of the transport mechanism 4 when inserting the hand 33 into the storage rack C. Specifically, the control unit 9 determines the height position of the hand 33 when inserting the hand 33 of the transport mechanism 4 between two adjacent shelves 22 along the up-down direction Z. Hereinafter, the height position of the hand 33 when inserting the hand 33 of the transport mechanism 4 between two adjacent shelves 22 along the up-down direction Z is abbreviated as "height position HA". The control unit 9 changes the height position HA according to the shape of the substrate W. The control unit 9 changes the height position HA according to at least any one of the shape of the substrate W removed from the shelf 22 by the transport mechanism 4 and the shape of the substrate W placed on the shelf 22 by the transport mechanism 4.

[0451] Specifically, when the substrate W removed from the shelf 22 by the conveying mechanism 4 or the substrate W placed on the shelf 22 by the conveying mechanism 4 is the first substrate W1, the control unit 9 determines the height position HA as the first height position HA1. When the substrate W removed from the shelf 22 by the conveying mechanism 4 or the substrate W placed on the shelf 22 by the conveying mechanism 4 is the second substrate W2, the control unit 9 determines the height position HA as the second height position HA2. When the substrate W removed from the shelf 22 by the conveying mechanism 4 or the substrate W placed on the shelf 22 by the conveying mechanism 4 is the third substrate W3, the control unit 9 determines the height position HA as the third height position HA3. The second height position HA2 is higher than the first height position HA1. The third height position HA3 is higher than the first height position HA1. The third height position HA3 is the same as the second height position HA2.

[0452] Similarly, the control unit 9 determines the height position of the hand 33 of the transport mechanism 4 when the hand 33 is inserted into the loading unit 6. Specifically, the control unit 9 determines the height position of the hand 33 when the hand 33 of the transport mechanism 4 is inserted between two shelves 45 adjacent in the up-down direction Z. Hereinafter, the height position of the hand 33 when the hand 33 of the transport mechanism 4 is inserted between two shelves 45 adjacent in the up-down direction Z is abbreviated as "height position HB". The control unit 9 changes the height position HB according to the shape of the substrate W. The control unit 9 changes the height position HB according to at least any one of the shape of the substrate W removed from the shelf 45 by the transport mechanism 4 and the shape of the substrate W placed on the shelf 45 by the transport mechanism 4.

[0453] Specifically, when the substrate W removed from the shelf 45 by the transport mechanism 4 or the substrate W placed on the shelf 45 by the transport mechanism 4 is the first substrate W1, the control unit 9 determines the height position HB to be the first height position HB1. When the substrate W removed from the shelf 45 by the transport mechanism 4 or the substrate W placed on the shelf 45 by the transport mechanism 4 is the second substrate W2, the control unit 9 determines the height position HB to be the second height position HB2. When the substrate W removed from the shelf 45 by the transport mechanism 4 or the substrate W placed on the shelf 45 by the transport mechanism 4 is the third substrate W3, the control unit 9 determines the height position HB to be the third height position HB3. The second height position HB2 is higher than the first height position HB1. The third height position HB3 is higher than the first height position HB1. The third height position HB3 is the same as the second height position HB2.

[0454] Step S12

[0455] The control unit 9 determines the insertion amount of the hand 33 when the hand 33 of the conveying mechanism 4 is inserted between two adjacent shelves 22 along the up-down direction Z. The insertion amount of the hand 33 inserted between two adjacent shelves 22 along the up-down direction Z is equivalent to the movement amount of the hand 33 in the front-to-back direction X when the hand 33 of the conveying mechanism 4 is inserted between two adjacent shelves 22 along the up-down direction Z. Hereinafter, the insertion amount of the hand 33 inserted between two adjacent shelves 22 along the up-down direction Z is abbreviated as "insertion amount KA". The control unit 9 changes the insertion amount KA according to the shape of the substrate W. The control unit 9 changes the insertion amount KA according to at least any one of the shape of the substrate W removed from the shelf 22 by the conveying mechanism 4 and the shape of the substrate W placed on the shelf 22 by the conveying mechanism 4.

[0456] When the substrate W removed from the shelf 22 by the transport mechanism 4 or the substrate W placed on the shelf 22 by the transport mechanism 4 is a normal diameter substrate WN, the control unit 9 determines the insertion amount KA to be the first insertion amount KA1. When the substrate W removed from the shelf 22 by the transport mechanism 4 or the substrate W placed on the shelf 22 by the transport mechanism 4 is a large diameter substrate WL, the control unit 9 determines the insertion amount KA to be the second insertion amount KA2. The second insertion amount KA2 is larger than the first insertion amount KA1.

[0457] Similarly, the control unit 9 determines the insertion amount of the hand 33 when inserting the hand 33 of the transport mechanism 4 between two shelves 45 adjacent in the vertical direction Z. Hereinafter, the insertion amount of the hand 33 inserted between two shelves 45 adjacent in the vertical direction Z is abbreviated as "insertion amount KB". The control unit 9 changes the insertion amount KB according to the shape of the substrate W. The control unit 9 changes the insertion amount KB according to at least any one of the shape of the substrate W removed from the shelf 45 by the transport mechanism 4 and the shape of the substrate W placed on the shelf 45 by the transport mechanism 4.

[0458] When the substrate W removed from the shelf 45 by the transport mechanism 4 or the substrate W placed on the shelf 45 by the transport mechanism 4 is a normal diameter substrate WN, the control unit 9 determines the insertion amount KB to be the first insertion amount KB1. When the substrate W removed from the shelf 45 by the transport mechanism 4 or the substrate W placed on the shelf 45 by the transport mechanism 4 is a large diameter substrate WL, the control unit 9 determines the insertion amount KB to be the second insertion amount KB2. The second insertion amount KB2 is larger than the first insertion amount KB1.

[0459] Step S13

[0460] The control unit 9 determines the moving speed and acceleration of the hand 33 of the transport mechanism 4. Hereinafter, the moving speed of the hand 33 of the transport mechanism 4 is abbreviated as "moving speed VA". Hereinafter, the acceleration of the hand 33 of the transport mechanism 4 is abbreviated as "acceleration AA". The control unit 9 changes the moving speed VA according to whether the transport mechanism 4 supports the substrate W. The control unit 9 changes the acceleration AA according to whether the transport mechanism 4 supports the substrate W.

[0461] When the control unit 9 determines the moving speed VA and the acceleration AA, the control unit 9 may appropriately refer to the detection result of the substrate detection unit 38 .

[0462] When the transport mechanism 4 supports the substrate W, the control unit 9 determines the moving speed VA to be the first speed VA1. When the transport mechanism 4 does not support the substrate W, the control unit 9 determines the moving speed VA to be the second speed VA2. The second speed VA2 is greater than the first speed VA1. For example, the first speed VA1 is less than 50% of the second speed VA2.

[0463] When the transport mechanism 4 supports the substrate W, the control unit 9 determines the acceleration AA to be the first acceleration AA1. When the transport mechanism 4 does not support the substrate W, the control unit 9 determines the acceleration AA to be the second acceleration AA2. The second acceleration AA2 is greater than the first acceleration AA1. For example, the first acceleration AA1 is less than 70% of the second acceleration AA2.

[0464] Step S14

[0465] The control unit 9 controls the transport mechanism 4 (specifically, the hand driving unit 34 ) based on the determined height positions HA and HB, insertion amounts KA and KB, movement speed VA, and acceleration AA.

[0466] Step S15

[0467] The hand driving unit 34 of the transport mechanism 4 moves the hand 33 under the control of the control unit 9. Thus, the transport mechanism 4 transports the substrate W.

[0468] The following operation example will be described in detail.

[0469] b1) Example of the operation of the transport mechanism 4 removing the substrate W from the shelf 22 of the storage rack C

[0470] b2) Example of the operation of the transport mechanism 4 transporting the substrate W from the storage rack C to the mounting portion 6

[0471] b3) Operation example of the transport mechanism 4 placing the substrate W on the shelf 45 of the placement unit 6

[0472] <<Operation example of the transport mechanism 4 removing the substrate W from the shelf 22 of the storage rack C>>

[0473] Figures 30A-30D FIG. 2 is a diagram schematically showing an operation example in which the transport mechanism 4 removes the substrate W from the shelf 22 of the storage rack C. FIG.

[0474] Reference Fig. 30A The hand 33 does not support the substrate W. The hand 33 moves to a position facing the storage rack C. The hand 33 is adjusted to a height position HA determined by the control unit 9 .

[0475] Reference Fig. 30B The hand 33 enters the interior of the storage rack C. The hand 33 enters between two adjacent shelf plates 22 in the vertical direction Z at a height position HA determined by the control unit 9 .

[0476] When the hand 33 enters the storage rack C, the hand 33 moves in the horizontal direction. Specifically, the hand 33 moves in the front-rear direction X. The hand 33 moves forward. The first direction F1 in which the rod 36 extends is consistent with the moving direction of the hand 33. In other words, the hand 33 enters between two adjacent shelves 22 in the up-down direction Z while the first direction F1 is maintained as the moving direction of the hand 33.

[0477] The hand 33 enters between two adjacent shelf plates 22 in the vertical direction Z by an insertion amount KA determined by the control unit 9 and then stops.

[0478] In the steps up to this point, the hand 33 moves at the second velocity VA2 and the second acceleration AA2.

[0479] Reference Fig. 30C The hand 33 moves upward. The hand 33 passes between the first shelf 23 and the second shelf 24 included in one shelf 22 . Thus, the hand 33 removes one substrate W from one shelf 22 .

[0480] Reference Fig.30D In a state where the hand 33 supports the substrate W, the hand 33 moves backward and moves out of the storage rack C. From this step onward, the hand 33 moves at the first speed VA1 and the first acceleration AA1.

[0481] In the above-mentioned operation example, when the substrate W placed on the shelf 22 is the first substrate W1, the hand 33 enters between two shelves 22 adjacent in the vertical direction Z at the first height position HA1. When the substrate W placed on the shelf 22 is the second substrate W2, the hand 33 enters between two shelves 22 adjacent in the vertical direction Z at the second height position HA2. When the substrate W placed on the shelf 22 is the third substrate W3, the hand 33 enters between two shelves 22 adjacent in the vertical direction Z at the third height position HA3. When the substrate W placed on the shelf 22 is a normal diameter substrate WN, the hand 33 enters between two shelves 22 adjacent in the vertical direction Z by the first insertion amount KA1, and then stops. When the substrate W placed on the shelf 22 is a large diameter substrate WL, the hand 33 enters between two shelves 22 adjacent in the vertical direction Z by the second insertion amount KA2, and then stops.

[0482] Fig.31A , 31B 2 is a diagram showing the relationship between the substrate W placed on the shelf 22 and the insertion height HA of the hand 33. Fig.31A In the embodiment, a first substrate W1 is placed on the shelf 22. Fig.31B In the embodiment, the second substrate W2 or the third substrate W3 is placed on the shelf 22 .

[0483] The first substrate W1 is bent compared to the second substrate W2 and the third substrate W3. Specifically, the first substrate W1 is bent convexly downward. As described above, the first height position HA1 is lower than the second height position HA2 and the third height position HA3. Therefore, the hand 33 does not interfere with the first substrate W1, and the hand 33 can enter between two adjacent shelves 22 along the vertical direction Z.

[0484] The bending amount of the second substrate W2 or the third substrate W3 is smaller than that of the first substrate W1. As described above, the second height position HA2 and the third height position HA3 are both higher than the first height position HA1. Therefore, the hand 33 does not interfere with the second substrate W2 or the third substrate W3, and the hand 33 can enter between two adjacent shelves 22 along the vertical direction Z.

[0485] <<Operation example of conveying the substrate W from the storage rack C to the mounting portion 6>>

[0486] The hand 33 moves from the storage rack C to the placement portion 6 while the hand 33 supports the substrate W. Thus, the transport mechanism 4 transports the substrate W from the storage rack C to the placement portion 6. When the transport mechanism 4 transports the substrate W from the storage rack C to the placement portion 6, the hand 33 moves at the first speed VA1 and the first acceleration AA1.

[0487] <<Operation example of the transport mechanism 4 placing the substrate W on the shelf 45 of the placement unit 6>>

[0488] Figures 32A-32D 1 is a diagram schematically showing an operation example of the transport mechanism 4 placing the substrate W on the shelf 45 of the placement unit 6 .

[0489] Reference Fig.32A The hand 33 supports the substrate W. The hand 33 moves to a position facing the mounting portion 6 . The hand 33 is adjusted to a height position HB determined by the control unit 9 .

[0490] Reference Fig.32B The hand 33 moves backward. The hand 33 enters the placement portion 6. The hand 33 enters between two adjacent shelves 45 along the vertical direction Z at a height position HB determined by the control unit 9. The hand 33 enters between two adjacent shelves 45 along the vertical direction Z by an insertion amount KB determined by the control unit 9, and then stops.

[0491] In the steps up to this point, the hand 33 moves at the first velocity VA1 and the first acceleration AA1.

[0492] Reference Fig.32C The hand 33 moves downward. The hand 33 passes between the first shelf 46 and the second shelf 47 included in one shelf 45. Thus, the hand 33 places one substrate W on the one shelf 45. The hand 33 separates from the substrate W on the shelf 45.

[0493] As described above, the interval ET between the shelves 45 is larger than the diameter D of the substrate W. Thus, even if the position of the substrate W transferred to the shelf 45 by the hand 33 is misaligned, the shelf 45 can receive the substrate W appropriately.

[0494] The substrate W is guided by the first inclined surface 51 and the second inclined surface 55 of the shelf 45. Thus, when the substrate W is placed on the shelf 45, the substrate W is positioned at a predetermined position. If the position of the substrate W placed on the shelf 45 by the hand 33 is deviated, the shelf 45 can adjust the position of the substrate W so that the deviation of the position of the substrate W is reduced.

[0495] Reference Fig.32D In a state where the hand 33 does not support the substrate W, the hand 33 moves forward and moves out of the mounting portion 6. From this step onward, the hand 33 moves at the second speed VA2 and the second acceleration AA2.

[0496] In the above-mentioned operation example, when the substrate W supported by the hand 33 is the first substrate W1, the hand 33 enters between two adjacent shelves 45 along the vertical direction Z at the first height position HB1. When the substrate W supported by the hand 33 is the second substrate W2, the hand 33 enters between two adjacent shelves 45 along the vertical direction Z at the second height position HA2. When the substrate W supported by the hand 33 is the third substrate W3, the hand 33 enters between two adjacent shelves 45 along the vertical direction Z at the third height position HA3. When the substrate W supported by the hand 33 is a normal diameter substrate WN, the hand 33 enters between two adjacent shelves 45 along the vertical direction Z by the first insertion amount KB1 and then stops. When the substrate W supported by the hand 33 is a large diameter substrate WL, the hand 33 enters between two adjacent shelves 45 along the vertical direction Z by the second insertion amount KB2 and then stops.

[0497] The action of the transport mechanism 4 removing the substrate W from the shelf 45 of the loading section 6 is substantially the same as the action of the transport mechanism 4 removing the substrate W from the shelf 22 of the storage rack C. The action of the transport mechanism 4 placing the substrate W on the shelf 22 of the storage rack C is substantially the same as the action of the transport mechanism 4 placing the substrate W on the shelf 45 of the loading section 6.

[0498] <Operation example of the conveying mechanism 8>

[0499] Fig.33 It is a flowchart showing the control procedure of the control unit 9 and the operation of the conveying mechanism 8 .

[0500] Step S21

[0501] The control unit 9 determines the height position of the hand 33 when the hand 61 of the transport mechanism 8 is inserted into the loading unit 6. Specifically, the control unit 9 determines the height position of the hand 61 when the hand 61 of the transport mechanism 8 is inserted between two adjacent shelves 45 along the up-down direction Z. Hereinafter, the height position of the hand 61 when the hand 61 of the transport mechanism 8 is inserted between two adjacent shelves 45 along the up-down direction Z is abbreviated as "height position HC". The control unit 9 changes the height position HC according to the shape of the substrate W. The control unit 9 changes the height position HC according to at least any one of the shape of the substrate W removed from the shelf 45 by the transport mechanism 8 and the shape of the substrate W placed on the shelf 45 by the transport mechanism 8.

[0502] Specifically, when the substrate W removed from the shelf 45 by the conveying mechanism 8 or the substrate W placed on the shelf 45 by the conveying mechanism 8 is the first substrate W1, the control unit 9 determines the height position HC to be the first height position HC1. When the substrate W removed from the shelf 45 by the conveying mechanism 8 or the substrate W placed on the shelf 45 by the conveying mechanism 8 is the second substrate W2, the control unit 9 determines the height position HC to be the second height position HC2. When the substrate W removed from the shelf 45 by the conveying mechanism 8 or the substrate W placed on the shelf 45 by the conveying mechanism 8 is the third substrate W3, the control unit 9 determines the height position HC to be the third height position HC3. The second height position HC2 is higher than the first height position HC1. The third height position HC3 is higher than the first height position HC1. The third height position HC3 is the same as the second height position HC2.

[0503] Step S22

[0504] The control unit 9 determines the insertion amount of the hand 61 when the hand 61 of the transport mechanism 8 is inserted between two shelves 45 adjacent in the up-down direction Z. The insertion amount of the hand 61 inserted between two shelves 45 adjacent in the up-down direction Z is equivalent to the movement amount of the hand 61 in the front-to-back direction X when the hand 61 of the transport mechanism 8 is inserted between two shelves 45 adjacent in the up-down direction Z. Hereinafter, the insertion amount of the hand 61 inserted between two shelves 45 adjacent in the up-down direction Z is abbreviated as "insertion amount KC". The control unit 9 changes the insertion amount KC according to the shape of the substrate W. The control unit 9 changes the insertion amount KC according to at least any one of the shape of the substrate W removed from the shelf 45 by the transport mechanism 8 and the shape of the substrate W placed on the shelf 45 by the transport mechanism 8.

[0505] When the substrate W removed from the shelf 45 by the transport mechanism 8 or the substrate W placed on the shelf 45 by the transport mechanism 8 is a normal diameter substrate WN, the control unit 9 determines the insertion amount KC to be the first insertion amount KC1. When the substrate W removed from the shelf 45 by the transport mechanism 8 or the substrate W placed on the shelf 45 by the transport mechanism 8 is a large diameter substrate WL, the control unit 9 determines the insertion amount KC to be the second insertion amount KC2. The second insertion amount KC2 is larger than the first insertion amount KC1.

[0506] Step S23

[0507] The control unit 9 determines the flow rate of the gas supplied to the suction unit 68 . Hereinafter, the flow rate of the gas supplied to the suction unit 68 is simply referred to as “flow rate M.” The control unit 9 changes the flow rate M according to the shape of the substrate W transported by the transport mechanism 8 .

[0508] Specifically, when the transport mechanism 8 transports the first substrate W1, the control unit 9 adjusts the flow rate M to the first flow rate M1. When the transport mechanism 8 transports the second substrate W2, the control unit 9 adjusts the flow rate M to the second flow rate M2. When the transport mechanism 8 transports the third substrate W3, the control unit 9 adjusts the flow rate M to the third flow rate M3. The second flow rate M2 is greater than the first flow rate M1. The third flow rate M3 is greater than the first flow rate M1.

[0509] Step S24

[0510] The control unit 9 determines the processing unit 7 that processes the substrate W. More specifically, the control unit 9 determines the processing unit 7 that processes the substrate W to be one of the first processing unit 7A and the second processing unit 7B, based on the shape of the substrate W.

[0511] Specifically, when the substrate W is the first substrate W1, the control unit 9 determines to process the substrate W in the first processing unit 7A. When the substrate W is the second substrate W2, the control unit 9 determines to process the substrate W in the second processing unit 7B. When the substrate W is the third substrate W3, the control unit 9 determines to process the substrate W in the second processing unit 7B.

[0512] Step S25

[0513] The control unit 9 determines the moving speed and acceleration of the hand 61 of the transport mechanism 8. Hereinafter, the moving speed of the hand 61 of the transport mechanism 8 is abbreviated as "moving speed VB". Hereinafter, the acceleration of the hand 61 of the transport mechanism 8 is abbreviated as "acceleration AB". The control unit 9 changes the moving speed VB according to whether the transport mechanism 8 is supporting the substrate W. The control unit 9 changes the acceleration AB according to whether the transport mechanism 8 is supporting the substrate W.

[0514] When the control unit 9 determines the moving speed VB and the acceleration AB, the control unit 9 may appropriately refer to the detection result of the substrate detection unit 89 .

[0515] Specifically, when the transport mechanism 8 supports the substrate W, the control unit 9 determines the moving speed VB to be the first speed VB1. When the transport mechanism 8 does not support the substrate W, the control unit 9 determines the moving speed VB to be the second speed VB2. The second speed VB2 is greater than the first speed VB1. For example, the first speed VB1 is less than 50% of the second speed VB2.

[0516] When the transport mechanism 8 supports the substrate W, the control unit 9 determines the acceleration AB to be the first acceleration AB1. When the transport mechanism 8 does not support the substrate W, the control unit 9 determines the acceleration AB to be the second acceleration AB2. The second acceleration AB2 is greater than the first acceleration AB1. For example, the first acceleration AB1 is less than 70% of the second acceleration AB2.

[0517] Step S26

[0518] The control unit 9 controls the transport mechanism 8 (specifically, the hand drive unit 62) by using the determined height position HC, insertion amount KC, flow rate M, processing unit 7, moving speed VB, and acceleration AB. The determined processing unit 7 is one of the first processing unit 7A and the second processing unit 7B. Specifically, the determined processing unit 7 is one of the first processing unit 7A and the second processing unit 7B.

[0519] Step S27

[0520] The hand driving unit 62 of the transport mechanism 8 moves the hand 61 under the control of the control unit 9. Thus, the transport mechanism 8 transports the substrate W.

[0521] The following operation example will be described in detail.

[0522] c1) Example of the operation of the transport mechanism 8 removing the substrate W from the shelf 45 of the mounting portion 6

[0523] c2) Operation example of the transport mechanism 8 transporting the substrate W from the mounting portion 6 to the processing unit 7

[0524] c3) Example of the operation of the transport mechanism 8 transferring the substrate W to the substrate holding portion 91 of the processing unit

[0525] c4) Example of the operation of the transport mechanism 8 removing the substrate W from the substrate holding portion 91 of the processing unit 7

[0526] c5) Example of the operation of the transport mechanism 8 transferring the substrate W to the shelf 45 of the placement unit 6

[0527] <<Operation example of the transport mechanism 8 removing the substrate W from the shelf 45 of the mounting portion 6>>

[0528] Figures 34A-34D as well as Figures 35A-35D 1 is a diagram schematically showing an operation example in which the transport mechanism 8 removes the substrate W from the shelf 45 of the placement unit 6 .

[0529] Reference Fig.34A The hand 61 does not hold the substrate W. The suction adjustment unit 73 does not supply gas to the suction unit 68. The suction unit 68 does not blow gas. The suction unit 68 does not suck the substrate W. The second receiving unit 83 is located at the retracted position. The hand 61 moves to a position opposite to the mounting unit 6. The hand 61 is adjusted to the height position HC determined by the control unit 9.

[0530] Reference Fig.34BThe hand 61 moves forward. The hand 61 enters the loading section 6. The hand 61 enters between two adjacent shelves 45 along the vertical direction Z at a height position HC determined by the control section 9. The hand 61 enters between two adjacent shelves 45 along the vertical direction Z by an insertion amount KC determined by the control section 9, and then stops. When the hand 61 stops, the first receiving section 82 and the second receiving section 83 do not overlap with the substrate W placed on the shelf 45 when viewed from above.

[0531] Reference Fig.34C The hand 61 moves downward. The first receiving portion 82 and the second receiving portion 83 pass by the side of the substrate W placed on one shelf 45. The first receiving portion 82 and the second receiving portion 83 move to a position lower than the substrate W placed on the shelf 45. The suction portion 68 approaches the upper surface 17 of the substrate W.

[0532] Reference Fig.34D The hand 61 slightly moves in the horizontal direction. As a result, the first receiving portion 82 moves to a position where it overlaps with the substrate W placed on the shelf 45 in a plan view. The second receiving portion 83 is in a state where it does not overlap with the substrate W placed on the shelf 45 in a plan view.

[0533] In the steps up to this point, the hand 61 moves at the second velocity VB2 and the second acceleration AB2.

[0534] Reference Fig.35A . The suction adjustment unit 73 supplies gas to the suction unit 68 at a flow rate M determined by the control unit 9. The suction unit 68 causes the gas to flow along the upper surface 17 of the substrate W. As a result, the suction unit 68 sucks the substrate W upward. The substrate W floats upward. The substrate W is separated from the shelf 45. The upper surface 17 of the substrate W contacts the contact unit 74. In this way, the hand 61 removes a substrate W from the shelf 45. The hand 61 holds the substrate W.

[0535] Reference Fig.35B The hand 61 moves upward. From this step onward, the hand 61 moves at the first speed VB1 and the first acceleration AB1.

[0536] Reference Fig.35C The receiving portion driving portion 86 moves the second receiving portion 83 from the retreat position to the fall-off prevention position. As a result, both the first receiving portion 82 and the second receiving portion 83 overlap with the substrate W sucked by the suction portion 68 in a plan view.

[0537] Therefore, even if the substrate W separates from the contact portion 74 and falls downward, the receiving portion 81 can receive the substrate W. In other words, the hand 61 does not cause the substrate W to fall.

[0538] Reference Fig.35DIn a state where the hand 61 holds the substrate W, the hand 61 moves rearward and moves out of the mounting portion 6 .

[0539] In the above-mentioned operation example, when the substrate W placed on the shelf 45 is the first substrate W1, the hand 61 enters between two shelves 45 adjacent to each other in the vertical direction Z at the first height position HC1. Furthermore, the suction adjustment unit 73 supplies gas to the suction unit 68 at the first flow rate M1. When the substrate W placed on the shelf 45 is the second substrate W2, the hand 61 enters between two shelves 45 adjacent to each other in the vertical direction Z at the second height position HC2. Furthermore, the suction adjustment unit 73 supplies gas to the suction unit 68 at the second flow rate M2. When the substrate W placed on the shelf 45 is the third substrate W3, the hand 61 enters between two shelves 45 adjacent to each other in the vertical direction Z at the third height position HC3. Furthermore, the suction adjustment unit 73 supplies gas to the suction unit 68 at the third flow rate M3. When the substrate W placed on the shelf 45 is a normal diameter substrate WN, the hand 61 enters between two shelves 45 adjacent to each other in the vertical direction Z by the first insertion amount KC1 and then stops. When the substrate W placed on the shelf 45 is a large-diameter substrate WL, the hand 61 enters between two adjacent shelves 45 in the up-down direction Z by the second insertion amount KC2 and then stops.

[0540] <<Operation example of the transport mechanism 8 transporting the substrate W from the mounting portion 6 to the processing unit 7>>

[0541] The hand 61 holds the substrate W. Specifically, the suction adjustment unit 73 supplies gas to the suction unit 68 at a flow rate M determined by the control unit 9. When the substrate W held by the hand 61 is the first substrate W1, the suction adjustment unit 73 supplies gas to the suction unit 68 at a first flow rate M1. When the substrate W held by the hand 61 is the second substrate W2 or the third substrate W3, the suction adjustment unit 73 supplies gas to the suction unit 68 at a second flow rate M2. The suction unit 68 causes the gas to flow along the upper surface 17 of the substrate W. The suction unit 68 sucks the substrate W.

[0542] The second receiving portion 83 is located at the fall-off prevention position. The first receiving portion 82 and the second receiving portion 83 both overlap the substrate W sucked by the suction portion 68 in a plan view.

[0543] The hand 61 moves from the placement unit 6 to the processing unit 7 determined by the control unit 9. As a result, the transport mechanism 8 transports the substrate W to the processing unit 7 determined by the control unit 9. When the substrate W held by the hand 61 is the first substrate W1, the transport mechanism 8 transports the substrate W to the first processing unit 7A. When the substrate W held by the hand 61 is the second substrate W2 or the third substrate W3, the transport mechanism 8 transports the substrate W to the second processing unit 7B.

[0544] When the transport mechanism 8 transports the substrate W from the placement unit 6 to the processing unit 7 , the hand 61 moves at the first velocity VB1 and the first acceleration AA1 .

[0545] <<Operation example of transferring the substrate W to the substrate holding portion 91 of the processing unit 7 by the transport mechanism 8>>

[0546] Figures 36A-36F 1 is a diagram schematically showing an example of the operation of the transport mechanism 8 transferring the substrate W to the substrate holding portion 91 of the processing unit 7. In addition, the operation of the transport mechanism 8 transferring the substrate W to the substrate holding portion 91 is the same regardless of whether the substrate holding portion 91 is the first substrate holding portion 91A or the second substrate holding portion 91B.

[0547] Reference Fig.36A The hand 61 holds the substrate W. Specifically, the suction adjustment unit 73 supplies the gas to the suction unit 68 at a flow rate M determined by the control unit 9. The suction unit 68 flows the gas along the upper surface 17 of the substrate W. The suction unit 68 sucks the substrate W.

[0548] The second receiving portion 83 is located at the fall-off prevention position. The hand 61 enters the interior of the processing unit 7. The hand 61 is located above the substrate holding portion 91. The lift pins 116 are located at the upper position.

[0549] Reference Fig.36B The suction regulating part 73 stops supplying gas to the suction part 68. The suction part 68 stops suctioning the substrate W. The substrate W falls downward. The receiving part 81 receives the substrate W. More specifically, the first receiving part 82 and the second receiving part 83 receive the lower surface 16 of the substrate W. In this way, the suction part 68 stops suctioning the substrate W, so that the substrate W is placed on the first receiving part 82 and the second receiving part 83.

[0550] Reference Fig.36C The hand 61 moves slightly downward. As a result, the first receiving portion 82 and the second receiving portion 83 transfer the substrate W to the lifting pins 116. The lifting pins 116 receive the substrate W from the receiving portion 81. The lifting pins 116 receive the substrate W at the upper position. The lifting pins 116 support the substrate W at the upper position. The first receiving portion 82 and the second receiving portion 83 move to a position lower than the substrate W supported by the lifting pins 116. The first receiving portion 82 and the second receiving portion 83 are separated from the substrate W supported by the lifting pins 116.

[0551] In the steps up to this point, the hand 61 moves at the first velocity VB1 and the first acceleration AB1.

[0552] Reference Fig.36DThe receiving portion driving portion 86 moves the second receiving portion 83 from the fall-off prevention position to the retreat position. Thus, the second receiving portion 83 moves to a position where it does not overlap with the substrate W supported by the lift pins 116 when viewed from above. The first receiving portion 82 is in a state where it overlaps with the substrate W supported by the lift pins 116 when viewed from above.

[0553] Reference Fig.36E The hand 61 moves slightly in the horizontal direction. As a result, the first receiving portion 82 and the second receiving portion 83 move to positions where they do not overlap with the substrate W supported by the lift pins 116 when viewed from above. From this step, the hand 61 moves at the second speed VB2 and the second acceleration AB2.

[0554] Reference Fig.36F The hand 61 moves upward. The first receiving portion 82 and the second receiving portion 83 pass by the side of the substrate W supported by the lift pins 116 , and move to a position higher than the substrate W supported by the lift pins 116 .

[0555] Thereafter, although not shown in the figure, in a state where the hand 61 does not hold the substrate W, the hand 61 moves away from the position above the substrate holding portion 91 and moves to the outside of the processing unit 7 .

[0556] <<Operation example of the transport mechanism 8 removing the substrate W from the substrate holding portion 91 of the processing unit 7>>

[0557] Figures 37A-37F 1 is a diagram schematically showing an example of the operation of the transport mechanism 8 removing the substrate W from the substrate holding portion 91 of the processing unit 7. The operation of the transport mechanism 8 removing the substrate W from the substrate holding portion 91 is the same regardless of whether the substrate holding portion 91 is the first substrate holding portion 91A or the second substrate holding portion 91B.

[0558] Reference Fig.37A . The hand 61 does not hold the substrate W. The suction adjustment part 73 does not supply gas to the suction part 68. The suction part 68 does not flow the gas along the upper surface 17 of the substrate W. The suction part 68 does not suck the substrate W. The second receiving part 83 is located in the retracted position. The hand 61 enters the interior of the processing unit 7. The hand 61 is located above the substrate holding part 91. The lifting pins 116 support the substrate W in the upper position. The first receiving part 82 and the second receiving part 83 do not overlap with the substrate W supported by the lifting pins 116 when viewed from above.

[0559] Reference Fig.37B The hand 61 moves slightly downward. The first receiving portion 82 and the second receiving portion 83 pass by the side of the substrate W supported by the lift pins 116. The first receiving portion 82 and the second receiving portion 83 move to a position lower than the substrate W supported by the lift pins 116. The suction portion 68 approaches the upper surface 17 of the substrate W.

[0560] Reference Fig.37C The hand 61 slightly moves in the horizontal direction. As a result, the first receiving portion 82 moves to a position where it overlaps with the substrate W supported by the lift pins 116 in a plan view. The second receiving portion 83 is in a state where it does not overlap with the substrate W supported by the lift pins 116 in a plan view.

[0561] Reference Fig.37D The receiving portion driving portion 86 moves the second receiving portion 83 from the retreat position to the fall-off prevention position. As a result, the second receiving portion 83 and the first receiving portion 82 overlap the substrate W sucked by the suction portion 68 in a plan view.

[0562] In the steps up to this point, the hand 61 moves at the second velocity VB2 and the second acceleration AB2.

[0563] Reference Fig.37E . The suction adjustment unit 73 supplies gas to the suction unit 68 at a flow rate M determined by the control unit 9. The suction unit 68 causes the gas to flow along the upper surface 17 of the substrate W. As a result, the suction unit 68 sucks the substrate W upward. The substrate W floats upward. The substrate W is separated from the lifting pins 116. The upper surface 17 of the substrate W contacts the contact portion 74. In this way, the hand 61 removes a substrate W from the lifting pins 116. The hand 61 holds the substrate W.

[0564] Reference Fig.37F While the hand 61 holds the substrate W, the hand 61 moves upward.

[0565] From this step on, the hand 61 moves at the first velocity VB1 and the first acceleration AB1.

[0566] Then, although not shown in the figure, in a state where the hand 61 holds the substrate W, the hand 61 is moved away from the position above the substrate holding portion 91 and is removed to the outside of the processing unit 7 .

[0567] <<Operation example of transferring the substrate W to the shelf 45 of the placement unit 6 by the transport mechanism 8>>

[0568] Figures 38A-38D as well as Figures 39A-39D 1 is a diagram schematically showing an operation example of the transport mechanism 8 placing the substrate W on the shelf 45 of the placement unit 6 .

[0569] Reference Fig.38A The hand 61 holds the substrate W. The suction adjustment unit 73 supplies gas to the suction unit 68 at a flow rate M determined by the control unit 9. The suction unit 68 causes the gas to flow along the upper surface 17 of the substrate W. The suction unit 68 suctions the substrate W. The second receiving unit 83 is located at the fall-off prevention position. The hand 61 moves to a position opposite to the mounting unit 6. The hand 61 is adjusted to a height position HC determined by the control unit 9.

[0570] Reference Fig.38B The hand 61 moves forward. The hand 61 enters the placement portion 6. The hand 61 enters between two adjacent shelves 45 in the vertical direction Z at a height position HC determined by the control unit 9. The hand 61 enters between two adjacent shelves 45 in the vertical direction Z by an insertion amount KC determined by the control unit 9, and then stops.

[0571] Reference Fig.38C The suction regulating part 73 stops supplying gas to the suction part 68. The suction part 68 stops suctioning the substrate W. The substrate W falls downward. The receiving part 81 receives the substrate W. More specifically, the first receiving part 82 and the second receiving part 83 receive the lower surface 16 of the substrate W. In this way, the suction part 68 stops suctioning the substrate W, so that the substrate W is placed on the first receiving part 82 and the second receiving part 83.

[0572] Reference Fig.38D The hand 61 moves slightly downward. As a result, the first receiving portion 82 and the second receiving portion 83 transfer the substrate W to the shelf 45. The shelf 45 receives the substrate W from the receiving portion 81. The shelf 45 supports the substrate W. The first receiving portion 82 and the second receiving portion 83 move to a position lower than the substrate W supported by the shelf 45. The first receiving portion 82 and the second receiving portion 83 are separated from the substrate W supported by the shelf 45.

[0573] In the steps up to this point, the hand 61 moves at the first velocity VB1 and the first acceleration AB1.

[0574] Reference Fig.39A The receiving portion driving portion 86 moves the second receiving portion 83 from the fall-off prevention position to the retreat position. Thus, the second receiving portion 83 moves to a position where it does not overlap with the substrate W supported by the shelf 45 when viewed from above. The first receiving portion 82 is in a state where it overlaps with the substrate W supported by the shelf 45 when viewed from above.

[0575] Reference Fig.39B The hand 61 slightly moves in the horizontal direction. As a result, the first receiving portion 82 and the second receiving portion 83 do not overlap with the substrate W supported by the shelf 45 in a plan view. From this step onward, the hand 61 moves at the second speed VB2 and the second acceleration AB2.

[0576] Reference Fig.39C The hand 61 moves upward. The first receiving portion 82 and the second receiving portion 83 pass by the side of the substrate W supported by the shelf 45 , and move to a position higher than the substrate W supported by the shelf 45 .

[0577] Reference Fig.39D In a state where the hand 61 does not hold the substrate W, the hand 61 retreats and moves out of the mounting portion 6 .

[0578] <Operation Example of First Processing Unit 7A>

[0579] Fig.40 It is a flowchart showing the steps of an operation example of the first processing unit 7A. Fig.41 It is a timing chart showing an operation example of the first processing unit 7A. Fig.41 The t31 shown is equivalent to executing Fig.40 At the moment of step S31 shown. Fig.41 The t32-t35, t37-t39, and t41-t44 shown are equivalent to executing Fig.40 The timing of steps S32-S35, S37-S39, and S41-S44 shown in FIG. The operation of each member described below is controlled by the control unit 9. A part of the operation example described below overlaps with the description of the operation example of the conveying mechanism 8 described above.

[0580] Step S31 (time t31): the lift pins 116 rise.

[0581] The lift pin 116 moves to the upward position.

[0582] Step S32 (time t32 ): the lift pins 116 receive the substrate W from the transport mechanism 8 .

[0583] The transport mechanism 8 transfers the substrate W to the lift pins 116. More specifically, the transport mechanism 8 transfers a first substrate W1 to the lift pins 116. The lift pins 116 receive the substrate W from the transport mechanism 8. The lift pins 116 support the substrate W in an upper position. The substrate W is located above the fixing pins 103. The substrate W does not contact the fixing pins 103.

[0584] Step S33 (time t33): The first outlet 105 starts blowing out gas.

[0585] The first blowing adjustment unit 111 starts supplying gas to the first blowing outlet 105. The first blowing outlet 105 starts blowing gas. The first blowing outlet 105 blows gas upward. The second blowing adjustment unit 112 has not started supplying gas to the second blowing outlet 106. The second blowing outlet 106 does not blow gas.

[0586] Step S34 (time t34 ): the lift pins 116 transfer the substrate W to the fixing pins 103 .

[0587] The lifting pins 116 move from the upper position to the lower position. Thus, the lifting pins 116 lower the substrate W from a position higher than the fixing pins 103. The lifting pins 116 transfer the substrate W to the fixing pins 103. The fixing pins 103 receive the substrate W from the lifting pins 116. The fixing pins 103 support the substrate W. The lifting pins 116 are separated from the substrate W supported by the fixing pins 103.

[0588] Step S35 (time t35 ): The position of the substrate W is adjusted by the position adjustment pins 113 .

[0589] The position adjustment pins 113 move from the retreat position to the adjustment position, thereby causing the position adjustment pins 113 to contact the substrate W supported by the fixing pins 103. The position adjustment pins 113 adjust the position of the substrate W in the horizontal direction.

[0590] Step S36: Check the position of the substrate W.

[0591] Check whether the position of the substrate W is at the specified position. Specifically, the substrate detection unit 127 checks the substrate W. The substrate detection unit 127 outputs the detection result of the substrate detection unit 127 to the control unit 9. The control unit 9 determines whether the substrate W is at the specified position. In the case where the control unit 9 determines that the substrate W is at the specified position, the process proceeds to step S37. If the control unit 9 determines that the substrate W is not at the specified position, the process does not proceed to step S37, and an exception process is performed. The exception process, for example, includes returning to step S35. The exception process, for example, includes notifying the user that an exception has occurred.

[0592] Step S37 (time t37): The second blowing outlet 106 starts blowing out gas.

[0593] The second blowout adjustment unit 112 starts supplying gas to the second blowout port 106. The second blowout port 106 starts blowing gas. The second blowout port 106 blows gas upward. The flow rate of the gas blown out of the second blowout port 106 is greater than the flow rate of the gas blown out of the first blowout port 105.

[0594] Step S38 (time t38 ): the position adjustment pins 113 are separated from the substrate W.

[0595] The position adjustment pins 113 move from the adjustment position to the retreat position, whereby the position adjustment pins 113 and the substrate W are separated.

[0596] Step S39 (time t39): the substrate W is processed (processing liquid is supplied to the substrate W).

[0597] The first rotation drive unit 92A rotates the first substrate holding unit 91A and the substrate W. The processing liquid supply unit 121 supplies the processing liquid to the substrate W supported by the fixing pins 103. When the processing liquid supply unit 121 supplies the processing liquid to the substrate W, the first blowing port 105 blows out the gas, and the second blowing port 106 blows out the gas at a larger flow rate than the first blowing port 105.

[0598] When the predetermined time has passed, the processing of the substrate is terminated and the process proceeds to step S40.

[0599] Step S40: Check the position of the substrate W.

[0600] It is checked again whether the position of the substrate W is at the predetermined position. This step S40 is substantially the same as step S36.

[0601] Step S41 (time t41): The second blowing outlet 106 stops blowing gas.

[0602] The second blowing adjustment unit 112 stops supplying gas to the second blowing outlet 106. The second blowing outlet 106 stops blowing gas.

[0603] Step S42 (time t42 ): the lift pins 116 remove the substrate W from the fixing pins 103 .

[0604] The lifting pins 116 move from the lower position to the upper position. As a result, the lifting pins 116 remove the substrate W from the fixing pins 103. The lifting pins 116 support the substrate W. The lifting pins 116 raise the substrate W. Specifically, the lifting pins 116 raise the substrate W to a position higher than the fixing pins 103. The substrate W is separated from the fixing pins 103. The lifting pins 116 support the substrate W at the upper position. The substrate W is supported at a position higher than the fixing pins 103.

[0605] Step S43 (time t43): The first blowing outlet 105 stops blowing gas.

[0606] The first blowing adjustment unit stops supplying gas to the first blowing outlet 105. The first blowing outlet 105 stops blowing gas.

[0607] Step S44 (time t44 ): the lift pins 116 transfer the substrate W to the transport mechanism 8 .

[0608] The transport mechanism 8 removes the substrate W from the lift pins 116. Then, the transport mechanism 8 transports the substrate W to the outside of the first processing unit 7A.

[0609] <Operation Example of Second Processing Unit 7B>

[0610] The operation example of the second processing unit 7B is similar to the operation example of the first processing unit 7A except that steps S33, S35-S38, and S40-S41 are omitted. The operation example of the second processing unit 7B is briefly described.

[0611] The lifting pins 116 move upward. The lifting pins 116 receive a substrate W (specifically, the second substrate W2 or the third substrate W3) from the transport mechanism 8. The lifting pins 116 transfer the substrate W to the lower surface contact pins 135. The lower surface contact pins 135 support the substrate W. The edge contact pins 133 contact the edge 20 of the substrate W supported by the lower surface contact pins 135. Thus, the edge contact pins 133 hold the substrate W.

[0612] The substrate W is processed while the substrate W is held by the edge contact pins 133. Specifically, the second rotation drive unit 92B rotates the second substrate holding unit 91B and the substrate W. When the second rotation drive unit 92B rotates the second substrate holding unit 91B, the edge contact pins 133 hold the edge 20 of the substrate W so that the substrate W does not slide relative to the edge contact pins 133. The processing liquid supply unit 121 supplies the processing liquid to the substrate W held by the edge contact pins 133.

[0613] When the processing of the substrate W is completed, the edge contact pins 133 are separated from the substrate W. The lift pins 116 remove the substrate W from the lower surface contact pins 135 . The transport mechanism 8 removes the substrate W from the lift pins 116 .

[0614] <Effects of implementation>

[0615] The substrate processing apparatus 1 includes a rack loading section 3 for loading a rack C. The rack C includes a plurality of shelves 22 arranged in the vertical direction Z. Each shelf 22 carries a substrate W in a horizontal position. The substrate processing apparatus 1 further includes a conveying mechanism 4 and a control section 9. The conveying mechanism 4 conveys a substrate W to the rack C loaded on the rack loading section 3. The conveying mechanism 4 includes a hand 33 for supporting the substrate W and a hand driving section 34 for moving the hand 33. The control section 9 controls the conveying mechanism 4. The control section 9 changes the height position HA of the hand 33 when inserting the hand 33 between two shelves 22 adjacent to each other in the vertical direction Z, according to the shape of the substrate W. Specifically, the control section 9 changes the height position HA of the hand 33 when inserting the hand 33 between two shelves 22 adjacent to each other in the vertical direction Z, according to at least any one of the shape of the substrate W removed from the shelf 22 by the conveying mechanism 4 and the shape of the substrate W placed on the shelf 22 by the conveying mechanism 4. Thus, regardless of the shape of the substrate W, the hand 33 can properly enter between two shelves 22 adjacent to each other in the vertical direction Z. For example, the hand 33 can enter between two shelves 22 adjacent to each other in the vertical direction Z, and the hand 33 does not interfere with the substrate W placed on the shelves 22. For example, the hand 33 can enter between two shelves 22 adjacent to each other in the vertical direction Z, and the substrate W supported by the hand 33 does not interfere with the shelves 22 or the substrate W placed on the shelves 22. Therefore, the transport mechanism 4 can properly transport the substrate W to the storage rack C placed on the storage rack placement unit 3.

[0616] As described above, according to the substrate processing apparatus 1, the substrate W can be appropriately conveyed.

[0617] The substrate processing apparatus 1 has a loading section 6. The loading section 6 has a plurality of shelves 45 arranged in the vertical direction Z. Each shelf 45 carries a substrate in a horizontal position. The conveying mechanism 4 conveys a substrate W to the loading section 6. The control section 9 changes the height position HB of the hand 33 when the hand 33 is inserted between two adjacent shelves 45 in the vertical direction Z, according to the shape of the substrate W removed from the shelf 45 by the conveying mechanism 4 or the substrate W placed on the shelf 45 by the conveying mechanism 4. Thus, the hand 33 can enter between two adjacent shelves 45 in the vertical direction Z regardless of the shape of the substrate W. Therefore, the conveying mechanism 4 can properly convey the substrate W to the loading section 6.

[0618] The substrate processing apparatus 1 includes a conveying mechanism 8. The conveying mechanism 8 conveys a substrate W to a loading section. The conveying mechanism 8 includes a hand 61 that supports the substrate W and a hand driving section 62 that moves the hand 61. The control section 9 controls the conveying mechanism 8. The control section 9 changes the height position HC of the hand 61 when inserting the hand 61 between two adjacent shelves 45 along the vertical direction Z, according to the shape of the substrate W. Specifically, the control section 9 changes the height position HC of the hand 61 when inserting the hand 61 between two adjacent shelves 45 along the vertical direction Z, according to at least one of the shape of the substrate W removed from the shelf 45 by the conveying mechanism 8 and the shape of the substrate W placed on the shelf 45 by the conveying mechanism 8. Thus, regardless of the shape of the substrate W, the hand 61 can enter between two adjacent shelves 45 along the vertical direction Z. Therefore, the conveying mechanism 8 can properly convey the substrate W to the loading section 6.

[0619] The control unit 9 changes the height position HA according to the thickness of the main portion 13 of the substrate W. Thus, the hand 33 can properly enter between two adjacent shelves 22 in the vertical direction Z regardless of the thickness of the main portion 13 of the substrate W. Therefore, the transport mechanism 4 can properly transport the substrate W to the storage rack C.

[0620] The control unit 9 changes the height position HB according to the thickness of the main portion 13 of the substrate W. Thus, regardless of the thickness of the main portion 13 of the substrate W, the hand 33 can properly enter between two adjacent shelves 45 in the vertical direction Z. Therefore, the transport mechanism 4 can properly transport the substrate W to the placement unit 6.

[0621] The control unit 9 changes the height position HC according to the thickness of the main portion 13 of the substrate W. Thus, the hand 61 can properly enter between two adjacent shelves 45 in the vertical direction Z regardless of the thickness of the main portion 13 of the substrate W. Therefore, the transport mechanism 8 can properly transport the substrate W to the placement unit 6.

[0622] The substrate W includes a first substrate W1 and a second substrate W2. When the substrate W removed from the shelf 22 by the conveying mechanism 4 or the substrate placed on the shelf 22 by the conveying mechanism 4 is the first substrate W1, the hand 33 enters between two adjacent shelves 22 along the vertical direction Z at the first height position HA1. When the substrate W removed from the shelf 22 by the conveying mechanism 4 or the substrate W placed on the shelf 22 by the conveying mechanism 4 is the second substrate W2, the hand 33 enters between two adjacent shelves 22 along the vertical direction Z at the second height position HA2 higher than the first height position HA1. The first height position HA1 is lower than the second height position HA2. Thus, when the substrate W removed from the shelf 22 by the conveying mechanism 4 or the substrate placed on the shelf 22 by the conveying mechanism 4 is the first substrate W1, the hand 33 can appropriately enter between two adjacent shelves 22 along the vertical direction Z. The second height position HA2 is higher than the first height position HA1. Thus, when the substrate W removed from the shelf 22 by the transport mechanism 4 or the substrate W placed on the shelf 22 by the transport mechanism 4 is the second substrate W2 , the hand 33 can appropriately enter between two shelves 22 adjacent to each other in the vertical direction Z.

[0623] When the substrate W removed from the shelf 45 by the conveying mechanism 4 or the substrate placed on the shelf 22 by the conveying mechanism 4 is the first substrate W1, the hand 33 enters between two adjacent shelves 45 along the vertical direction Z at the first height position HB1. When the substrate W removed from the shelf 45 by the conveying mechanism 4 or the substrate W placed on the shelf 45 by the conveying mechanism 4 is the second substrate W2, the hand 33 enters between two adjacent shelves 45 along the vertical direction Z at the second height position HB2 higher than the first height position HB1. The first height position HB1 is lower than the second height position HB2. Thus, when the substrate W removed from the shelf 45 by the conveying mechanism 4 or the substrate placed on the shelf 22 by the conveying mechanism 4 is the first substrate W1, the hand 33 can appropriately enter between two adjacent shelves 45 along the vertical direction Z. The second height position HB2 is higher than the first height position HB1. Thus, when the substrate W removed from the shelf 45 by the transport mechanism 4 or the substrate W placed on the shelf 45 by the transport mechanism 4 is the second substrate W2 , the hand 33 can appropriately enter between two shelves 45 adjacent to each other in the vertical direction Z.

[0624] When the substrate W removed from the shelf 45 by the conveying mechanism 8 or the substrate placed on the shelf 45 by the conveying mechanism 8 is the first substrate W1, the hand 61 enters between two adjacent shelves 45 along the vertical direction Z at the first height position HC1. When the substrate W removed from the shelf 45 by the conveying mechanism 8 or the substrate W placed on the shelf 45 by the conveying mechanism 8 is the second substrate W2, the hand 61 enters between two adjacent shelves 45 along the vertical direction Z at the second height position HC2 higher than the first height position HC1. The first height position HC1 is lower than the second height position HC2. Thus, when the substrate W removed from the shelf 45 by the conveying mechanism 8 or the substrate placed on the shelf 45 by the conveying mechanism 8 is the first substrate W1, the hand 61 can appropriately enter between two adjacent shelves 45 along the vertical direction Z. The second height position HC2 is higher than the first height position HC1. Thus, when the substrate W removed from the shelf 45 by the transport mechanism 8 or the substrate W placed on the shelf 45 by the transport mechanism 8 is the second substrate W2 , the hand 61 can appropriately enter between two shelves 45 adjacent to each other in the vertical direction Z.

[0625] The substrate W includes a first substrate W1 and a third substrate W3. When the substrate W removed from the shelf 22 by the conveying mechanism 4 or the substrate W placed on the shelf 22 by the conveying mechanism 4 is the third substrate W3, the hand 33 enters between two adjacent shelves 22 along the vertical direction Z at the third height position HA3 higher than the first height position HA1. The first height position HA1 is lower than the third height position HA3. Thus, when the substrate W removed from the shelf 22 by the conveying mechanism 4 or the substrate W placed on the shelf 22 by the conveying mechanism 4 is the first substrate W1, the hand 33 can properly enter between two adjacent shelves 22 along the vertical direction Z. The third height position HA3 is higher than the first height position HA1. Thus, when the substrate W removed from the shelf 22 by the conveying mechanism 4 or the substrate W placed on the shelf 22 by the conveying mechanism 4 is the third substrate W3, the hand 33 can properly enter between two adjacent shelves 22 along the vertical direction Z.

[0626] When the substrate W removed from the shelf 45 by the conveying mechanism 4 or the substrate W placed on the shelf 45 by the conveying mechanism 4 is the third substrate W3, the hand 33 enters between two adjacent shelves 45 along the vertical direction Z at the third height position HB3 which is higher than the first height position HB1. The first height position HB1 is lower than the third height position HB3. Thus, when the substrate W removed from the shelf 45 by the conveying mechanism 4 or the substrate W placed on the shelf 45 by the conveying mechanism 4 is the first substrate W1, the hand 33 can properly enter between two adjacent shelves 45 along the vertical direction Z. The third height position HB3 is higher than the first height position HB1. Thus, when the substrate W removed from the shelf 45 by the conveying mechanism 4 or the substrate W placed on the shelf 45 by the conveying mechanism 4 is the third substrate W3, the hand 33 can properly enter between two adjacent shelves 45 along the vertical direction Z.

[0627] When the substrate W removed from the shelf 45 by the conveying mechanism 8 or the substrate W placed on the shelf 45 by the conveying mechanism 8 is the third substrate W3, the hand 61 enters between two adjacent shelves 45 along the vertical direction Z at the third height position HC3 which is higher than the first height position HC1. The first height position HC1 is lower than the third height position HC3. Thus, when the substrate W removed from the shelf 45 by the conveying mechanism 8 or the substrate W placed on the shelf 45 by the conveying mechanism 8 is the first substrate W1, the hand 61 can properly enter between two adjacent shelves 45 along the vertical direction Z. The third height position HC3 is higher than the first height position HC1. Thus, when the substrate W removed from the shelf 45 by the conveying mechanism 8 or the substrate W placed on the shelf 45 by the conveying mechanism 8 is the third substrate W3, the hand 61 can properly enter between two adjacent shelves 45 along the vertical direction Z.

[0628] The control unit 9 changes the insertion amount KA of the hand 33 when inserting the hand 33 between two shelves 22 adjacent to each other in the vertical direction Z, according to the shape of the substrate W removed from the shelf 22 by the transport mechanism 4 or placed on the shelf 22 by the transport mechanism 4. Thus, regardless of the shape of the substrate W, the hand 33 can remove the substrate W from the shelf 22 at an appropriate position, and the hand 33 can place the substrate W at an appropriate position on the shelf 22.

[0629] The control unit 9 changes the insertion amount KB of the hand 33 when inserting the hand 33 between two shelves 45 adjacent to each other in the vertical direction Z, according to the shape of the substrate W taken off from the shelf 45 by the transport mechanism 4 or the substrate W placed on the shelf 45 by the transport mechanism 4. Thus, regardless of the shape of the substrate W, the hand 33 can take the substrate W off the shelf 45 at an appropriate position, and the hand 33 can place the substrate W at an appropriate position on the shelf 45.

[0630] The control unit 9 changes the insertion amount KC of the hand 61 when inserting the hand 61 between two shelves 45 adjacent to each other in the vertical direction Z, according to the shape of the substrate W taken off from the shelf 45 by the transport mechanism 8 or the substrate W placed on the shelf 45 by the transport mechanism 8. Thus, regardless of the shape of the substrate W, the hand 61 can take the substrate W off the shelf 45 at an appropriate position, and the hand 61 can place the substrate W at an appropriate position on the shelf 45.

[0631] The substrate W includes a normal diameter substrate WN and a large diameter substrate WL. When the substrate W removed from the shelf 22 by the conveying mechanism 4 or the substrate W placed on the shelf 22 by the conveying mechanism 4 is a normal diameter substrate WN, the insertion amount KA is a first insertion amount KA1. When the substrate W removed from the shelf 22 by the conveying mechanism 4 or the substrate W placed on the shelf 22 by the conveying mechanism 4 is a large diameter substrate WL, the insertion amount KA is a second insertion amount KA2 that is larger than the first insertion amount KA1. Thus, regardless of the diameter D of the substrate W, the hand 33 can remove the substrate W from the shelf 22 at a suitable position, and the hand 33 can place the substrate W at a suitable position on the shelf 22.

[0632] When the substrate W removed from the shelf 45 by the transport mechanism 4 or the substrate W placed on the shelf 45 by the transport mechanism 4 is a normal diameter substrate WN, the insertion amount KB is the first insertion amount KB1. When the substrate W removed from the shelf 45 by the transport mechanism 4 or the substrate W placed on the shelf 45 by the transport mechanism 4 is a large diameter substrate WL, the insertion amount KB is the second insertion amount KB2 which is larger than the first insertion amount KB1. Thus, regardless of the diameter D of the substrate W, the hand 33 can remove the substrate W from the shelf 45 at an appropriate position, and the hand 33 can place the substrate W at an appropriate position on the shelf 45.

[0633] When the substrate W removed from the shelf 45 by the transport mechanism 8 or the substrate W placed on the shelf 45 by the transport mechanism 8 is a normal diameter substrate WN, the insertion amount KC is the first insertion amount KC1. When the substrate W removed from the shelf 45 by the transport mechanism 8 or the substrate W placed on the shelf 45 by the transport mechanism 8 is a large diameter substrate WL, the insertion amount KC is the second insertion amount KC2 which is larger than the first insertion amount KC1. Thus, regardless of the diameter D of the substrate W, the hand 61 can remove the substrate W from the shelf 45 at an appropriate position, and the hand 61 can place the substrate W at an appropriate position on the shelf 45.

[0634] The hand 33 supports the substrate W by contacting the lower surface 16 of the substrate W. When the hand 33 supports the substrate W in this way, the hand 33 can appropriately place the substrate W on the shelf 22 , 45 , and can appropriately remove the substrate W from the shelf 22 , 45 .

[0635] The hand 33 has two rods 36 for supporting the substrate W. The two rods 36 are arranged in the second direction F2. Each rod 36 has a length equal to or greater than the diameter D of the substrate W. Each rod 36 has a substantially constant cross-sectional shape in the first direction F1. When the hand 33 enters between two adjacent shelves 22 and 45 along the up-down direction Z, the moving direction of the hand 33 is consistent with the first direction F1. Therefore, even if the space between the two adjacent shelves 22 and 45 along the up-down direction Z is narrow, the rod 36 can properly enter between the two adjacent shelves 22 and 45 along the up-down direction Z.

[0636] The hand 61 includes a suction portion 68. The suction portion 68 causes a gas to flow along the upper surface 17 of the substrate W. The suction portion 68 suctions the substrate W without contacting the substrate W. Thus, the hand 61 can support the substrate W appropriately.

[0637] Each shelf 22 includes a first shelf 23 for receiving the first side portion 18 of the substrate W and a second shelf 24 for receiving the second side portion 19 of the substrate W. Even when the shelf 22 supports the substrate W in this manner, the transport mechanism 4 can transport the substrate W to the storage rack C appropriately.

[0638] Each shelf 45 includes a first shelf 46 for receiving the first side portion 18 of the substrate W and a second shelf 47 for receiving the second side portion 19 of the substrate W. Even when the shelf 45 supports the substrate W in this way, the transport mechanism 4 can properly transport the substrate W to the placement portion 6. Even when the shelf 45 supports the substrate W in this way, the transport mechanism 8 can properly transport the substrate W to the placement portion 6.

[0639] The present invention is not limited to the embodiments, and can be implemented in the following modified forms.

[0640] In the above-mentioned embodiment, the shelf 22 is in contact with the lower surface 16 of the substrate W. However, the present invention is not limited thereto. For example, the shelf 22 may be in contact with at least one of the lower surface 16 of the substrate W and the edge 20 of the substrate W. For example, the shelf 22 may be in contact with the edge 20 of the substrate W from obliquely below.

[0641] In the above-mentioned embodiment, the hand 33 contacts the lower surface 16 of the substrate W. However, the present invention is not limited thereto. For example, the hand 33 may contact at least one of the lower surface 16 of the substrate W and the edge 20 of the substrate W. For example, the hand 33 may contact the edge 20 of the substrate W from obliquely below.

[0642] In the above-mentioned embodiment, the shelf 45 is in contact with the lower surface 16 of the substrate W. However, the present invention is not limited thereto. For example, the shelf 45 may be in contact with at least one of the lower surface 16 of the substrate W and the edge 20 of the substrate W. For example, the shelf 45 may be in contact with the edge 20 of the substrate W from obliquely below.

[0643] In the above-mentioned embodiment, the contact portion 74 contacts the upper surface 17 of the substrate W. However, the present invention is not limited thereto. For example, the contact portion 74 may contact at least one of the upper surface 17 of the substrate W and the edge 20 of the substrate W. For example, the contact portion 74 may contact the edge 20 of the substrate W from obliquely above.

[0644] In the above-mentioned embodiment, the first receiving portion 82 can receive the lower surface 16 of the substrate W. However, the present invention is not limited thereto. For example, the first receiving portion 82 can also receive at least one of the lower surface 16 of the substrate W and the edge 20 of the substrate W. For example, the first receiving portion 82 can also receive the edge 20 of the substrate W from obliquely below.

[0645] In the above-mentioned embodiment, the second receiving portion 83 can receive the lower surface 16 of the substrate W. However, the present invention is not limited thereto. For example, the second receiving portion 83 can also receive at least one of the lower surface 16 of the substrate W and the edge 20 of the substrate W. For example, the second receiving portion 83 can also receive the edge 20 of the substrate W from obliquely below.

[0646] In the above-mentioned embodiment, the fixing pins 103 are in contact with the lower surface 16 of the substrate W. However, the present invention is not limited thereto. For example, the fixing pins 103 may be in contact with at least one of the lower surface 16 of the substrate W and the edge 20 of the substrate W. For example, the fixing pins 103 may be in contact with the edge 20 of the substrate W from obliquely below.

[0647] In the above-mentioned embodiment, the first receiving portion 82 is fixed to the base portion 65. However, this is not limited thereto. That is, the first receiving portion 82 may also be movable relative to the base portion 65. In this modified embodiment, the hand 61 may further include a driving portion (a second receiving portion driving portion) that moves the first receiving portion 82 relative to the base portion 65.

[0648] In the above-described embodiment, the suction unit 68 flows the gas along the upper surface 17 of the substrate W. The suction unit 68 sucks the substrate W upward. However, the present invention is not limited thereto. The suction unit 68 may flow the gas along the lower surface 16 of the substrate W. The suction unit 68 may also suck the substrate W downward.

[0649] In the above-mentioned embodiment, the hand 33 of the transport mechanism 4 does not have a suction unit. However, this is not limited to this. The hand 33 of the transport mechanism 4 may also have a suction unit that causes gas to flow along the first surface of the substrate W. Here, the first surface is any one of the upper surface and the lower surface of the substrate W. The hand 33 of the transport mechanism 4 may also have a suction unit that attracts the substrate W. Moreover, the transport mechanism 4 may also have a receiving unit for preventing the substrate W from falling off the hand 33.

[0650] When the hand 33 of the conveying mechanism 4 has a suction unit, the conveying mechanism 4 is an example of the first conveying mechanism in the present invention. The storage rack C is an example of one of the first position and the second position in the present invention. The placing portion 6 is an example of the other of the first position and the second position in the present invention.

[0651] In the above-mentioned embodiment, the control unit 9 changes the height positions HA, HB, and HC according to whether the substrate W is the first substrate W1, the second substrate W2, or the third substrate W3. However, this is not limited to this. For example, the control unit 9 may also change the height positions HA, HB, and HC according to the thickness of the main portion 13 of the substrate W. For example, the control unit 9 may also make the height positions HA, HB, and HC higher as the thickness of the main portion 13 of the substrate W increases.

[0652] In the above-mentioned embodiment, the control unit 9 determines the processing unit 7 for processing the substrate W as one of the first processing unit and the second processing unit, depending on whether the substrate W is the first substrate W1, the second substrate W2, or the third substrate W3. However, it is not limited to this. For example, the control unit 9 may also determine the processing unit 7 for processing the substrate W as one of the first processing unit and the second processing unit, depending on the thickness of the main portion 13 of the substrate W. For example, the control unit 9 may also transport the substrate W whose main portion 13 of the substrate W has a first thickness to the first processing unit 7A. For example, the control unit 9 may also transport the substrate W whose main portion 13 of the substrate W has a second thickness greater than the first thickness to the second processing unit 7B. For example, the control unit 9 may also process the substrate W whose main portion 13 of the substrate W has a first thickness in the first processing unit 7A. The control unit 9 may also process the substrate W whose main portion 13 of the substrate W has a second thickness greater than the first thickness in the second processing unit 7B.

[0653] In the above-mentioned embodiment, the control unit 9 changes the flow rate M according to whether the substrate W is the first substrate W1, the second substrate W2, or the third substrate W3. However, this is not limited to this. For example, the control unit 9 may also change the flow rate M according to the thickness of the main portion 13 of the substrate W. For example, the control unit 9 may also increase the flow rate M as the thickness of the main portion 13 of the substrate W increases.

[0654] In the above-mentioned embodiment, the moving speed VA may be further subdivided. For example, the moving speed VA may be divided into a horizontal moving speed VAH, a vertical moving speed VAZ, and a rotation speed VAR. Here, the horizontal moving speed VAH is the moving speed of the hand 33 in the horizontal direction. The vertical moving speed VAZ is the moving speed of the hand 33 in the up-down direction Z. The rotation speed VAR is the moving speed of the hand 33 rotating around the rotation axis A1. The control unit 9 may also determine the horizontal moving speed VAH, the vertical moving speed VAZ, and the rotation speed VAR separately in step S13.

[0655] In the above-mentioned embodiment, the acceleration AA may be further subdivided. For example, the acceleration AA may be divided into the horizontal acceleration AAH, the vertical acceleration AAZ, and the rotational acceleration AAR. Here, the horizontal acceleration AAH is the acceleration of the hand 33 in the horizontal direction. The vertical acceleration AAZ is the acceleration of the hand 33 in the up-down direction Z. The rotational acceleration AAR is the acceleration of the hand 33 rotating around the rotation axis A1. The control unit 9 may also determine the horizontal acceleration AAH, the vertical acceleration AAZ, and the rotational acceleration AAR separately in step S13.

[0656] In the above-mentioned embodiment, the moving speed VB may be further subdivided. For example, the moving speed VB may be divided into a horizontal moving speed VBH, a vertical moving speed VBZ, and a rotation speed VBR. Here, the horizontal moving speed VBH is the moving speed of the hand 61 in the horizontal direction. The vertical moving speed VBZ is the moving speed of the hand 61 in the up-down direction Z. The rotation speed VBR is the moving speed of the hand 61 rotating around the rotation axis A2. The control unit 9 may also determine the horizontal moving speed VBH, the vertical moving speed VBZ, and the rotation speed VBR separately in step S25.

[0657] In the above-mentioned embodiment, the acceleration AB may be further subdivided. For example, the acceleration AB may be divided into the horizontal acceleration ABH, the vertical acceleration ABZ, and the rotational acceleration ABR. Here, the horizontal acceleration ABH is the acceleration of the hand 61 in the horizontal direction. The vertical acceleration ABZ is the acceleration of the hand 61 in the up-down direction Z. The rotational acceleration ABR is the acceleration of the hand 61 rotating around the rotation axis A2. The control unit 9 may also determine the horizontal acceleration ABH, the vertical acceleration ABZ, and the rotational acceleration ABR separately in step S25.

[0658] In the above-mentioned embodiment, the number of the first outlet 105 formed in the first plate 101 is one, but the present invention is not limited thereto and the number of the first outlet 105 formed in the first plate 101 may be plural.

[0659] In the above-mentioned embodiment, the lifting pins 116 receive the substrate W from the transport mechanism 8 (step S32), and then the first blow outlet 105 starts blowing out the gas (step S33). However, this is not limited to this. For example, the first blow outlet 105 may start blowing out the gas before the lifting pins 116 receive the substrate W from the transport mechanism 8. According to this modified embodiment, the lifting pins 116 can receive the substrate W from the transport mechanism 8 while the first blow outlet 105 is blowing out the gas.

[0660] In the above-mentioned embodiment, the blowing of gas is stopped at the first blowing outlet 105 (step S43), and then the lifting pins 116 transfer the substrate W to the transport mechanism 8 (step S44). However, this is not limited to this. For example, the blowing of gas may be stopped at the first blowing outlet 105 after the lifting pins 116 transfer the substrate W to the transport mechanism 8. According to this modified embodiment, the lifting pins 116 can transfer the substrate W to the transport mechanism 8 while the first blowing outlet 105 is blowing gas.

[0661] In this modified embodiment, preferably, the flow rate of the gas blown out of the first blowing port 105 is smaller than the flow rate of the gas supplied to the suction unit 68 of the transport mechanism 8. Based on this, when the transport mechanism 8 removes the substrate W from the lifting pins 116, the suction unit 68 can easily suck the substrate W. In other words, when the transport mechanism 8 removes the substrate W from the lifting pins 116, the hand 61 can easily hold the substrate W.

[0662] In the above-mentioned embodiment, the lift pins 116 receive the substrate W from the transport mechanism 8 . However, the present invention is not limited thereto. The fixed pins 103 may receive the substrate W from the transport mechanism 8 . In other words, the transport mechanism 8 may directly transfer the substrate W to the fixed pins 103 without passing through the lift pins 116 .

[0663] In the above-mentioned embodiment, the lifting pins 116 transfer the substrate W to the transport mechanism 8 . However, the present invention is not limited thereto. The fixing pins 103 may transfer the substrate W to the transport mechanism 8 . In other words, the transport mechanism 8 may directly remove the substrate W from the fixing pins 103 without passing through the lifting pins 116 .

[0664] In the above-described embodiment, the first outlet 105 of the first processing unit 7A can eject pure water in addition to the gas.

[0665] Fig.42 1 is a diagram schematically showing the configuration of the first processing unit 141 in the modified embodiment. Note that the same reference numerals are given to the same configurations as those of the first processing unit 7A in the embodiment, and detailed descriptions thereof are omitted.

[0666] The first processing unit 141 in the modified embodiment includes a pure water supply unit 142. The pure water supply unit 142 sprays pure water toward the substrate W through the first blower port 105.

[0667] The pure water supply unit 142 includes a pipe 143. The pipe 143 supplies pure water to the first outlet 105. The pipe 143 includes a first end and a second end. The first end of the pipe 143 is connected to the pure water supply source 144. The second end of the pipe 143 is connected to the first outlet 105.

[0668] The first processing unit 141 includes a flow rate regulator 145. The flow rate regulator 145 is provided in the pipe 143. The flow rate regulator 145 regulates the flow rate of pure water supplied from the pure water supply unit 142 to the substrate W. That is, the flow rate regulator 145 regulates the flow rate of pure water sprayed from the first blowing port 105. The flow rate regulator 145 is controlled by the control unit 9.

[0669] The first blowing outlet 105 may also eject gas and pure water at the same time. Alternatively, the first blowing outlet 105 may eject pure water instead of gas. Based on this, the pure water ejected from the first blowing outlet 105 touches the lower surface 16 in the central part of the substrate W, which can further appropriately prevent the lower surface 16 in the central part of the substrate W from bending downward. Thus, the substrate W can be further appropriately prevented from contacting the upper surface 102 of the first plate 101.

[0670] When supplying the processing liquid to the substrate W (step S39), the first blowing outlet 105 may also simultaneously blow out gas and pure water. Alternatively, when supplying the processing liquid to the substrate W (step S39), the first blowing outlet 105 may not blow out gas but blow out pure water. Based on this, when the processing liquid supply unit 121 supplies the processing liquid to the substrate W, the substrate W can be further appropriately prevented from contacting the upper surface 102 of the first plate 101.

[0671] In this modified embodiment, preferably, the space between the upper surface 102 of the first plate 101 and the lower surface 16 of the substrate W supported by the fixing pins 103 is not filled with pure water (not formed liquid-tight). This is to allow gas to flow in the space between the upper surface 102 of the first plate 101 and the lower surface 16 of the substrate W supported by the fixing pins 103, so that a suitable attraction acts on the substrate W supported by the fixing pins 103.

[0672] In the above-mentioned embodiment, the first outlet 105 may not only discharge gas but also discharge processing liquid. The processing liquid supply unit 121 may also discharge processing liquid toward the substrate W through the first outlet 105 .

[0673] Fig.43 1 is a diagram schematically showing the configuration of the first processing unit 151 in the modified embodiment. Note that the same components as those of the first processing unit 7A in the embodiment are denoted by the same reference numerals, and detailed descriptions thereof are omitted.

[0674] The treatment liquid supply unit 121 includes a pipe 153. The pipe 153 supplies the treatment liquid to the first outlet 105. The pipe 153 includes a first end and a second end. The first end of the pipe 153 is connected to the treatment liquid supply source 154. The second end of the pipe 153 is connected to the first outlet 105.

[0675] The first processing unit 141 includes a flow rate adjustment unit 155. The flow rate adjustment unit 155 is provided in the pipe 153. The flow rate adjustment unit 155 adjusts the flow rate of the processing liquid supplied from the processing liquid supply unit 121 to the substrate W. More specifically, the flow rate adjustment unit 155 adjusts the flow rate of the processing liquid sprayed from the first blowing port 105. The flow rate adjustment unit 155 is controlled by the control unit 9.

[0676] When supplying the processing liquid to the substrate W (step S39), the first outlet 105 may simultaneously eject the gas and the processing liquid. This allows the processing liquid to be supplied to the lower surface 16 of the substrate W. Thus, the lower surface 16 of the substrate W can be appropriately processed.

[0677] In this modified embodiment, preferably, the space between the upper surface 102 of the first plate 101 and the lower surface 16 of the substrate W supported by the fixing pins 103 is not filled with the treated water (not formed to be liquid-tight). This is to allow a suitable suction force to act on the substrate W supported by the fixing pins 103 .

[0678] In the above-described embodiment, the control unit 9 acquires the shape of the substrate W based on the detection result of the barcode reader 31. However, the present invention is not limited to this. As modified embodiments in which the control unit 9 acquires the shape of the substrate W, four examples are described below.

[0679] first case

[0680] The substrate processing apparatus 1 may also include a substrate information detection unit for reading substrate information attached to the substrate W. The control unit 9 may also determine the shape of the substrate W based on the detection result of the substrate information detection unit. Here, the substrate information attached to the substrate W is, for example, an identification code printed on the substrate W. The substrate information detection unit is, for example, a reader.

[0681] Second example

[0682] The substrate processing apparatus 1 may include an imaging unit that images the substrate W. The control unit 9 may determine the shape of the substrate W based on the detection result of the imaging unit. The imaging unit is, for example, a one-dimensional image sensor or a two-dimensional image sensor.

[0683] The third example

[0684] The control unit 9 may also obtain information related to the shape of the substrate W from an external device of the substrate processing apparatus 1. The external device of the substrate processing apparatus 1 is, for example, a host computer. Before the control unit 9 obtains the information related to the shape of the substrate W from the external device, the control unit 9 may, for example, send the detection result of the barcode reader 31 to the external device. Before the control unit 9 obtains the information related to the shape of the substrate W from the external device, the control unit 9 may, for example, send the detection result of the substrate detection unit 38, 89, 127 to the external device.

[0685] Example 4

[0686] The substrate processing apparatus 1 may include an input unit capable of inputting information on the shape of the substrate. The control unit 9 may acquire the information on the shape of the substrate W input into the input unit.

[0687] In the third example or the fourth example, the information related to the shape of the substrate W may be information directly indicating the shape of the substrate W. The information directly indicating the shape of the substrate W is, for example, information directly indicating whether the substrate W belongs to the first substrate W1, the second substrate W2, or the third substrate W3. When the control unit 9 acquires the information directly indicating the shape of the substrate W, the control unit 9 does not perform step S2 of determining the shape of the substrate W.

[0688] In the third or fourth example, the information related to the shape of the substrate W may be information indirectly indicating the shape of the substrate W. When the control unit 9 acquires the information indirectly indicating the shape of the substrate W, the control unit 9 performs step S2 of determining the shape of the substrate W based on the information indirectly indicating the shape of the substrate W.

[0689] In the above-mentioned embodiment, the control unit 9 executes step S11 of determining the height positions HA and HB, step S12 of determining the insertion amounts KA and KB, and step S13 of determining the moving speed VA and the acceleration AA. However, the present invention is not limited thereto. For example, at least one of steps S11, S12, and S13 may be omitted. For example, the control unit 9 may not execute at least one of steps S11, S12, and S13.

[0690] In the above-mentioned embodiment, the control unit 9 executes step S21 of determining the height position HC, step S22 of determining the insertion amount KC, step S23 of determining the flow rate M, step S24 of determining the processing unit 7, and step S25 of determining the moving speed VB and the acceleration AB. However, this is not limited to this. For example, at least any one of steps S21, S22, S23, S24, and S25 may be omitted. For example, the control unit 9 may not execute at least any one of steps S21, S22, S23, S24, and S25.

[0691] In the above-mentioned embodiment, the structure of the conveying mechanism 4 and 8 is illustrated. However, it is not limited to this. For example, the conveying mechanism 4 may also have a multi-joint arm to replace the rotating part 34d and the forward and backward moving part 34e. The multi-joint arm is supported by the vertical moving part 34c and supports the hand 33. For example, the conveying mechanism 4 may also omit the track 34a and the horizontal moving part 34b and have a table or a pillar. The table or the pillar is fixedly arranged to support the vertical moving part 34c. For example, the conveying mechanism 8 may also have a multi-joint arm to replace the rotating part 62c and the forward and backward moving part 62d. The multi-joint arm is supported by the vertical moving part 62b and supports the hand 61.

[0692] In the above-mentioned embodiment, the number of the transport mechanisms provided in the processing area 5 is one. However, this is not limited thereto. The number of the transport mechanisms provided in the processing area 5 may also be two. That is, the processing area 5 may also have more than two transport mechanisms. For example, a plurality of transport mechanisms may also be provided in the transport space 41 based on the processing area 5. For example, a plurality of transport mechanisms may also be configured to be arranged in the front-to-back direction X. The number of the processing units 7 may also be increased according to the number of transport mechanisms in the processing area 5. The number of the processing units 7 arranged in the front-to-back direction X may also be appropriately changed.

[0693] The above-described embodiment and each modified embodiment may be appropriately modified by replacing or combining each structure with the structure of another modified embodiment.

[0694] The present invention may be embodied in other specific forms without departing from the spirit or essence thereof and, accordingly, reference should be made to the appended claims rather than to the foregoing description as indicating the scope of the invention.

Claims

1. A substrate processing device, wherein: have: a loading portion; a transport mechanism that transports the substrate to the mounting portion; and a control unit, controlling the transport mechanism, The loading portion includes a plurality of shelves arranged in a vertical direction. Each of the shelves carries a substrate in a horizontal position. The transport mechanism comprises: a hand supporting the substrate, the hand having a suction portion, the suction portion causing the gas to flow along the first surface of the substrate to suction the substrate in a non-contact manner; A hand driving unit for moving the hand; as well as A suction regulating unit is configured to regulate the flow rate of the gas supplied to the suction unit. The control unit changes the flow rate of the gas supplied to the suction unit according to at least one of the shape of the substrate removed from the shelf by the transport mechanism and the shape of the substrate placed on the shelf by the transport mechanism.

2. The substrate processing apparatus according to claim 1, wherein: The control unit changes the flow rate of the gas supplied to the suction unit according to at least one of the thickness of the main portion of the substrate removed from the shelf by the conveying mechanism and the thickness of the main portion of the substrate placed on the shelf by the conveying mechanism, The main portion is located inside the peripheral portion of the substrate.

3. The substrate processing apparatus according to claim 2, wherein: The control unit increases the flow rate of the gas supplied to the suction unit as the thickness of the main portion of the substrate removed from the shelf by the transport mechanism and the substrate placed on the shelf by the transport mechanism increases.

4. The substrate processing apparatus according to any one of claims 1 to 3, wherein: The substrate includes: a first substrate having a recessed portion formed by making a main portion of the substrate located inside a peripheral portion of the substrate recessed relative to the peripheral portion of the substrate, and having no protective plate made of glass; and The second substrate does not have the recessed portion. When the substrate removed from the shelf by the transport mechanism or the substrate placed on the shelf by the transport mechanism is the first substrate, the control unit adjusts the flow rate of the gas supplied to the suction unit to a first flow rate, When the substrate removed from the shelf by the transport mechanism or the substrate placed on the shelf by the transport mechanism is a second substrate, the control unit adjusts the flow rate of the gas supplied to the suction unit to a second flow rate greater than the first flow rate.

5. The substrate processing apparatus according to any one of claims 1 to 3, wherein: The substrate includes: a first substrate having a recessed portion formed by making a main portion of the substrate located inside a peripheral portion of the substrate recessed relative to the peripheral portion of the substrate, and having no protective plate made of glass; and The third substrate has the concave portion and a protective plate made of glass, When the substrate removed from the shelf by the transport mechanism or the substrate placed on the shelf by the transport mechanism is the first substrate, the control unit adjusts the flow rate of the gas supplied to the suction unit to a first flow rate, When the substrate removed from the shelf by the transport mechanism or placed on the shelf by the transport mechanism is the third substrate, the control unit adjusts the flow rate of the gas supplied to the suction unit to a third flow rate greater than the first flow rate.

6. The substrate processing apparatus according to any one of claims 1 to 3, wherein: The suction unit causes gas to flow along the upper surface of the substrate to suck the substrate upward, so that the hand holds the substrate.

7. The substrate processing apparatus according to claim 6, wherein: The hand has: Base part; A first receiving portion, supported by the base portion, disposed below the substrate sucked by the suction portion, and capable of receiving at least one of a lower surface of the substrate and an edge of the substrate; A second receiving portion, supported by the base portion, disposed below the substrate sucked by the suction portion, and capable of receiving at least one of the lower surface of the substrate and the end edge of the substrate; as well as The receiving portion driving portion moves the second receiving portion relative to the base portion so that the second receiving portion approaches the first receiving portion and moves the second receiving portion away from the first receiving portion.

Images