Antenna packaging structure and antenna multiplexing method

Abstract

An antenna packaging structure comprises a substrate or an intermediate layer, a functional chip and a radio frequency chip are connected to the substrate or the intermediate layer, and the functional chip is in electric signal connection with the radio frequency chip; the radio frequency chip is also in electric signal connection with a laminated antenna module, the laminated antenna module comprises antennae which are laminated up and down, and a metal shielding layer is also arranged between the adjacent antennae; each layer of antenna and each metal shielding layer are respectively printed on a flexible adhesive layer, and the antennas and the metal shielding layers are bonded through a plurality of flexible adhesive layers to form a laminated antenna module. According to the antenna module, the stacked antenna module formed by bonding multiple layers is adopted, the unneeded antenna layers can be removed to expose the needed antenna layers according to needs, or the needed antenna layers can be additionally bonded, so that the antennas can be flexibly selected and used, the packaging structure of the whole antenna module has uniformity, and the packaging efficiency is improved. And additional differential logic circuit design is not needed, so that the packaging efficiency is improved, and the time and the labor cost are saved.

Description

Technical Field

[0001] The present invention relates to the technical field of radio frequency antenna packaging, and in particular to an antenna packaging structure and an antenna multiplexing method. Background Art

[0002] The RF module integrates two or more discrete devices with functions such as RF switches, low-noise amplifiers, filters, duplexers, power amplifiers, etc. into one module to improve integration, performance and miniaturization. It realizes functions such as signal modulation and demodulation, amplification, transmission and reception. In the prior art, the packaging or connection of the RF module is to solder RF switches, low-noise amplifiers, filters, duplexers, power amplifiers and other devices on the PCB to realize circuit interconnection. The prior art can only realize the signal transmission of one RF chip on the PCB board. If a certain antenna module needs to be selected to transmit the signal to realize signal transmission, the antenna module needs to be replaced, or the corresponding logic circuit needs to be designed to enable the antenna module to be used. There is a problem that the circuit structure has individual differences due to the use of different antennas, which is not suitable for mass packaging production.

[0003] Through searching, it is found that there are technical documents related to multi-antenna circuit structures in the prior art. For example, the utility model authorization announcement document with the publication number "CN207852888U" and the name "Semiconductor packaging structure with antenna assembly". The disclosed semiconductor packaging structure of the antenna assembly includes: a substrate, having at least one penetrating laser via; a rewiring layer, located on a surface of the substrate; a metal bump, located on the side of the rewiring layer away from the substrate and electrically connected thereto; a semiconductor chip, located on the surface of the rewiring layer away from the substrate and electrically connected thereto; a conductive column, filled in the laser via; a plastic encapsulation material layer, surrounding the metal bump and the semiconductor chip; and an antenna assembly, electrically connected to the metal bump via the conductive column and the rewiring layer. This comparative document discloses a packaging structure for a multi-layer antenna, but it solves the problem of thermal effects during the packaging process and the problem of easy chip warping in subsequent processes, and does not propose a corresponding technical solution for how to achieve selective multiplexing of multiple antennas.

[0004] For example, the invention patent publication document with the publication number "CN109873247A" and the name "Antenna Device and Antenna Module". An antenna device and an antenna module are disclosed, the antenna device comprising: a first ground layer; a second ground layer, arranged on the surface of the first ground layer; an antenna pattern, spaced apart from the first ground layer and the second ground layer in the direction of the surface, and configured to send and / or receive radio frequency (RF) signals; and a feeder, electrically connected to the antenna pattern and extending from the antenna pattern in the direction of the surface toward the first ground layer, wherein the first ground layer comprises a first area recessed relative to the second ground layer in the direction of the surface. This comparative document solves the technical problems of insufficient antenna layout space, limited antenna shape freedom, increased interference between the antenna and the IC, and increased size and / or cost of the antenna module, but does not propose a corresponding technical solution for how to achieve multi-antenna selective multiplexing.

[0005] In view of the technical problems existing in the above-mentioned prior art, the present invention aims to propose an improved antenna packaging structure, which can flexibly choose to use a specific exposed antenna to transmit and receive signals according to the required application scenario without changing the original circuit connection structure. The selection method includes removing unnecessary antenna layers and adding required antenna layers. Summary of the invention

[0006] In view of the shortcomings of the prior art, the present invention provides an antenna packaging structure, including a substrate or an intermediary layer, on which a functional chip and a radio frequency chip are connected, and the functional chip and the radio frequency chip are electrically connected; the radio frequency chip is also electrically connected to a stacked antenna module, and the stacked antenna module includes antennas stacked up and down, and also includes a metal shielding layer between adjacent antennas; each layer of the antenna and the metal shielding layer is respectively printed on a soft adhesive layer, and the antenna and the metal shielding layer are bonded together through multiple layers of soft adhesive layers to form a stacked antenna module.

[0007] Furthermore, the metal shielding layer includes a signal connection area and an isolation area, the signal connection area is exposed, the antenna signal pins above and below the metal shielding layer are interconnected through the signal connection area, and the isolation area separates the signal connection area into at least two parts that are not connected to each other.

[0008] Furthermore, the isolation area is an isolation path that runs through the surface of the metal shielding layer, and the signal connection area is two parts of the metal shielding layer separated by the isolation path.

[0009] Alternatively, the signal connection area is a metal pad distributed in the middle of the surface of the metal shielding layer, the isolation area is an isolation ring distributed around the metal pad, and the rest of the metal shielding layer is a metal layer.

[0010] Furthermore, the substrate or interposer, functional chip and RF chip are integrally encapsulated, the stacked antenna module is stacked and connected above the RF chip, and the signal pin of the bottom antenna S0 of the stacked antenna module is electrically connected to the RF chip.

[0011] Furthermore, the RF chip is flip-chip connected on the substrate or the interposer, the signal pin of the RF chip is led out to the upper surface of the plastic package and exposed, and the signal pin of the bottom layer antenna S0 is electrically connected to the lead-out signal pin of the RF chip.

[0012] Furthermore, the signal pin of the radio frequency chip is connected to the implant ball, and the top of the implant ball has an electrical connection end exposed on the surface of the plastic package body.

[0013] Furthermore, a metal shielding layer is provided between the bottom layer antenna S0 and the upper surface of the radio frequency chip, and the electrical connection end of the implant ball is connected to the signal connection area.

[0014] An antenna multiplexing method is also proposed, which adopts the above-mentioned antenna packaging structure and includes an antenna exposure step, specifically determining whether the antenna Sa to be used is in the stacked antenna module. If so, all the stacked antennas above the antenna Sa and the soft adhesive layer where the metal shielding layer is located are removed, thereby exposing the antenna Sa.

[0015] Furthermore, if the antenna Sa to be used is not in the stacked antenna module, the soft adhesive layer containing the antenna Sa will be bonded to the top layer of the stacked antenna module. If the top layer of the stacked antenna module is not a non-shielding layer, the soft adhesive layer containing the metal shielding layer will be bonded first, and then the soft adhesive layer containing the antenna Sa will be bonded.

[0016] Compared with the prior art, the technical solution of this application has the following beneficial effects: The multi-antenna packaging reuse method and packaging structure proposed in the present invention adopts a multi-layered adhesive stacked antenna module, which stacks the antennas that may be used and connects them with electrical signals. The stacked antenna module reuses the same functional chips and radio frequency chips. As needed, the unnecessary antenna layer can be removed to expose the required antenna layer, or the required antenna layer can be added and bonded, so as to flexibly realize the selection and use of the antenna, so that the packaging structure of the entire antenna module is unified, and no additional differentiated logic circuit design is required, thereby improving packaging efficiency and saving time and labor costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 : A schematic diagram of a packaging structure provided in an embodiment of the present invention; Figure 2 :Schematic diagram of stacked antenna module structure Figure 1 ; Figure 3 :Schematic diagram of stacked antenna module structure Figure 2 ; Figure 4 :Schematic diagram of stacked antenna module structure Figure 3 ; Figure 5 :Schematic diagram of the electrical connection between the RF chip and the stacked antenna module Figure 1 ; Figure 6 :Schematic diagram of the electrical connection between the RF chip and the stacked antenna module Figure 2 ; Figure 7 :Instructions for selecting the appropriate antenna layer using a stacked antenna module Figure 1 ; Figure 8 :Instructions for selecting the appropriate antenna layer using a stacked antenna module Figure 2 . DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] An antenna packaging structure includes a substrate or an intermediate layer 1, on which a functional chip 2 and a radio frequency chip 3 are connected, and the functional chip 2 and the radio frequency chip 3 are electrically connected; the radio frequency chip 3 is also electrically connected to a stacked antenna module 4, and the stacked antenna module 4 includes antennas S stacked up and down, and also includes a metal shielding layer K between adjacent antennas S; each layer of antenna S and metal shielding layer K is respectively printed on a soft adhesive layer F, and the antenna S and the metal shielding layer K are bonded together through multiple layers of soft adhesive layers F to form a stacked antenna module 4.

[0020] Specific examples include Figure 1 As described above, the stacked antenna module 4 is formed by stacking and bonding multiple layers of soft adhesive layers F, and a metal shielding layer K is spaced between two layers of antenna S. Each layer of antenna S and metal shielding layer K can be flexibly bonded and superimposed or removed with the soft adhesive layer F, thereby providing a flexible multiplexing structure for exposing the required antenna layer. The soft adhesive layer F and the metal shielding layer K or the antenna S can be manufactured using the AIP process, so that the metal shielding layer K or the antenna S becomes a layer of soft layers that can be bonded to each other.

[0021] Generally, the signal pins of the antennas S of each layer need to be interconnected, that is, after the signal pins of the antennas S of each layer are interconnected, the pins of the antenna S0 of the last layer are electrically connected to the RF chip 3. Due to the existence of the metal shielding layer K between the layers, only the exposed antenna S on the top layer will send and receive signals to the outside. When the upper layer of one of the antennas S is completely removed, due to the interconnection between the antennas S of each layer, the exposed antenna S after being removed can still achieve signal interaction with the RF chip 3 normally. In order to achieve this signal pin interconnection, the accuracy may not be guaranteed by simply relying on bonding. In order to solve this problem, the following method is adopted: Figure 2 The embodiment shown.

[0022] The metal shielding layer K includes a signal connection area K1 and an isolation area K2. The signal connection area K1 is exposed. The signal pins of the antenna S above and below the metal shielding layer K are interconnected through the signal connection area K1. The isolation area K2 separates the signal connection area K1 into at least two parts that are not connected to each other. In this embodiment, the metal shielding layer K is composed of a large-area metal thin layer, and the isolation area K2 can separate the metal shielding layer K into at least two electrically isolated parts. These mutually electrically isolated signal connection areas K1 can be used to electrically switch the antennas S of the upper and lower layers. That is, under this structure, the metal shielding layer K not only realizes the signal shielding of the antenna S, but also realizes the signal interconnection of the antenna S between the two layers. Since the isolation area K2 is only for preventing the short circuit between the signal pins of the antenna S, it occupies less area and will not affect the shielding effect too much. Since the signal connection area K1 has a large area, when the signal pin of the antenna S is bonded and connected to it, the precision requirement is very low, which can ensure that the electrical connection after bonding is reliable and stable.

[0023] like Figure 3 As shown, the isolation area K2 is an isolation path K21 that runs through the surface of the metal shielding layer K, and the signal connection area K1 is two parts of the metal shielding layer K separated by the isolation path K21. In this embodiment, the isolation path K21 is an isolation channel that runs through the metal shielding layer K horizontally or vertically, dividing the isolation area K2 into two, and the two signal connection areas K1 can be connected to the upper and lower antenna S signal pins respectively. Since the signal connection area K1 has a large area, when the positions of the antenna S signal pins of the upper and lower layers are offset or the positions are different due to different models and types, as long as they can be connected to the signal connection area K1 after bonding, the stability of the electrical connection between the antenna S signal pins of the upper and lower layers will not be affected.

[0024] like Figure 4 As shown, another implementation is proposed. The signal connection area K1 is a metal pad K11 distributed in the middle of the surface of the metal shielding layer K, the isolation area K2 is an isolation ring K22 distributed around the metal pad K11, and the rest of the metal shielding layer K is a metal layer.

[0025] In a more preferred embodiment, the substrate or intermediate layer 1, functional chip 2 and RF chip 3 are integrally plastic-encapsulated, the stacked antenna module 4 is stacked and connected above the RF chip 3, and the signal pin of the bottom antenna S0 of the stacked antenna module 4 is electrically connected to the RF chip 3.

[0026] like Figure 5 As shown, the RF chip 3 is flip-chip connected on the substrate or the intermediate layer 1, the signal pin of the RF chip 3 is led out to the upper surface of the plastic package and exposed, and the signal pin of the bottom antenna S0 is electrically connected to the lead-out signal pin of the RF chip 3. In order to optimize the signal connection structure between the RF chip 3 and the stacked antenna module 4. When connecting the RF chip 3 to the substrate or the intermediate layer 1, the RF chip 3 is flipped so that its signal pin faces upward, and the signal pin of the RF chip 3 is led out to the upper surface of the plastic package. When the stacked antenna module 4 is stacked and connected above the RF chip 3, the signal pin of the bottom antenna S0 is electrically connected to the lead-out signal pin of the RF chip 3. Under this embodiment, the signal connection between the RF chip 3 and the stacked antenna module 4 can be fully realized by utilizing the existing packaging circuit etching process accuracy.

[0027] Based on the above-mentioned embodiment, a method of electrically connecting the signal pin of the bottom layer antenna S0 and the signal pin of the RF chip 3 is as follows: Figure 6 As shown. The signal pin of the RF chip 3 is led out to the upper surface of the plastic package body by planting a ball 31 on the signal pin of the RF chip 3, and after the substrate or intermediary layer 1, the functional chip 2, and the RF chip 3 are plastic-sealed as a whole, the upper surface of the plastic package body is ground so that the signal pin planting ball 31 is exposed. The upper surface of the signal pin planting ball 31 after grinding will be a plane, and the signal pin of the bottom antenna S0 can be attached to the area of ​​the signal pin planting ball 31 to realize the electrical connection between the signal pin of the bottom antenna S0 and the signal pin led out of the RF chip 3.

[0028] In order to reduce the precision requirement of the electrical connection between the RF chip 3 and the bottom antenna S0, there is also a metal shielding layer K between the bottom antenna S0 and the upper surface of the RF chip 3, and the electrical connection end of the implant ball 31 is connected to the signal connection area K1. In this way, the interconnection between the antennas S of each layer of the entire stacked antenna module 4 and the metal shielding layer K can be completely interconnected by low-precision bonding, and the same is true for the interconnection between the stacked antenna module 4 as a whole and the RF chip 3.

[0029] This embodiment also provides an antenna multiplexing method, including an antenna exposure step, specifically as follows: Figure 7 and Figure 8In the stacked antenna module 4, it is determined whether the antenna Sa to be used is in the stacked antenna module 4. If so, all stacked antennas S on the antenna Sa and the soft adhesive layer F where the metal shielding layer K is located are removed, so as to expose the antenna Sa.

[0030] Furthermore, if the antenna Sa to be used is not in the stacked antenna module 4, the soft adhesive layer F containing the antenna Sa is bonded to the top layer of the stacked antenna module 4. If the top layer of the stacked antenna module 4 is not a non-shielding layer, the soft adhesive layer F containing the metal shielding layer K is first bonded, and then the soft adhesive layer F containing the antenna Sa is bonded.

[0031] Through the above method, the stacked antenna module 4 can be added or removed according to the required scenario, and the required antenna layer can be flexibly selected to be at the top layer and exposed to receive and transmit signals. Multiple antennas can be reused without making differentiated improvements to other circuit structures.

[0032] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0033] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An antenna packaging structure, characterized in that: The invention comprises a substrate or an intermediate layer (1), on which a functional chip (2) and a radio frequency chip (3) are connected, wherein the functional chip (2) and the radio frequency chip (3) are electrically connected; the radio frequency chip (3) is also electrically connected to a stacked antenna module (4), wherein the stacked antenna module (4) comprises antennas (S) stacked up and down, and a metal shielding layer (K) is provided between adjacent antennas (S); each layer of the antenna (S) and the metal shielding layer (K) is respectively printed on a soft adhesive layer (F), and the antenna (S) and the metal shielding layer (K) are bonded to each other through multiple layers of soft adhesive layers (F) to form the stacked antenna module (4).

2. The antenna packaging structure according to claim 1, characterized in that: The metal shielding layer (K) comprises a signal connection area (K1) and an isolation area (K2); the signal connection area (K1) is exposed, the signal pins of the antenna (S) above and below the metal shielding layer (K) are interconnected through the signal connection area (K1), and the isolation area (K2) separates the signal connection area (K1) into at least two parts that are not connected to each other.

3. The antenna packaging structure according to claim 2, characterized in that: The isolation area (K2) is an isolation path (K21) that penetrates the surface of the metal shielding layer (K), and the signal connection area (K1) is two parts of the metal shielding layer (K) separated by the isolation path (K21).

4. The antenna packaging structure according to claim 2, characterized in that: The signal connection area (K1) is a metal pad (K11) distributed in the middle of the surface of the metal shielding layer (K), the isolation area (K2) is an isolation ring (K22) distributed around the metal pad (K11), and the rest of the metal shielding layer (K) is a metal layer.

5. The antenna packaging structure according to claim 3 or 4, characterized in that: The substrate or intermediate layer (1), the functional chip (2) and the radio frequency chip (3) are integrally plastic-encapsulated; the stacked antenna module (4) is stacked and connected above the radio frequency chip (3); and the signal pin of the antenna S0 at the bottom layer of the stacked antenna module (4) is electrically signal-connected to the radio frequency chip (3).

6. The antenna packaging structure according to claim 5, characterized in that: The radio frequency chip (3) is flip-chip connected to the substrate or the intermediate layer (1), the signal pin of the radio frequency chip (3) is led out to the upper surface of the plastic package to be exposed, and the signal pin of the bottom layer antenna S0 is electrically connected to the lead-out signal pin of the radio frequency chip (3).

7. The antenna packaging structure according to claim 6, characterized in that: The signal pin of the radio frequency chip (3) is connected to the implant ball (31), and the top of the implant ball (31) has an electrical connection end exposed on the surface of the plastic package body.

8. The antenna packaging structure according to claim 7, characterized in that: A metal shielding layer (K) is also provided between the bottom layer antenna S0 and the upper surface of the radio frequency chip (3), and the electrical connection end of the implant ball (31) is connected to the signal connection area (K1).

9. An antenna multiplexing method, characterized in that: The antenna packaging structure as claimed in claim 5 is adopted, and includes an antenna exposure step, specifically determining whether the antenna Sa to be used is in the stacked antenna module (4), and if so, removing all the stacked antennas (S) above the antenna Sa and the soft adhesive layer (F) where the metal shielding layer (K) is located, thereby exposing the antenna Sa.

10. The antenna multiplexing method according to claim 1, characterized in that: If the antenna Sa to be used is not in the stacked antenna module (4), the soft adhesive layer (F) containing the antenna Sa is bonded to the top layer of the stacked antenna module (4); if the top layer of the stacked antenna module (4) is not a non-shielding layer, the soft adhesive layer (F) containing the metal shielding layer (K) is first bonded, and then the soft adhesive layer (F) containing the antenna Sa is bonded.

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