Apparatus and method for preparing shoe soles using heating wires

Abstract

The application relates to the field of shoe production and processing, and provides a device and method for preparing a shoe sole by using heating wires, which comprises a rack, a mold main body arranged on the rack, a driving device for driving the mold main body to open and close the mold, the mold main body comprises a bottom mold and a top mold, an internal mold cavity is formed when the bottom mold and the top mold are closed, at least one wire groove is arranged on the bottom mold and the top mold respectively, heating wires are arranged in the wire grooves, the heating wires are arranged on the top, the side wall and the bottom of the mold main body, a sealing layer is arranged on the wire groove, the heating wires are sealed in the wire groove by the sealing layer, and a thermocouple is connected to each heating wire. The heating wires are arranged on the mold main body, the heating wires replace traditional heating pipes, electric energy is saved, temperature can be accurately controlled, the quality of the shoe sole is improved, and the technical problems of large heat loss and low heating efficiency during the production of the shoe sole are solved.

Description

Technical Field

[0001] This invention relates to the field of shoe manufacturing and processing, and in particular to an apparatus and method for preparing shoe soles by heating with a heating wire. Background Technology

[0002] Current shoe soles are manufactured using rubber vulcanizing machines. These machines provide pressure and heat to vulcanize the soles; the three key elements of vulcanization are temperature, time, and pressure. However, rubber vulcanizing machines have significant drawbacks in heating the shoe mold and sole. They use heating rods to transfer heat to a hot plate, which then conducts heat to the shoe mold, bringing it to the vulcanization temperature. The mold then heats the material inside its cavity. This method has the following shortcomings:

[0003] 1. The heat conduction process is too long. Heat needs to pass through the heating rod, hot plate, shoe mold, and sole in sequence, which increases the heat conduction time. Heat loss occurs at each stage of heat conduction, especially when heating the hot plate. The hot plate has a large area, and a lot of heat is dissipated into the air during heat conduction, resulting in huge heat loss. Therefore, the heating rod needs to be set at a high temperature to ensure the temperature of the sole, which not only increases production costs but also results in long heating times and low production efficiency.

[0004] 2. Heating rods are placed on the top and bottom surfaces of the shoe mold. Heat conduction is only carried out through the top and bottom surfaces of the shoe mold. There are no heating plates on the sides of the shoe mold. The temperature on the sides of the shoe mold is lower than that on the top and bottom surfaces. As a result, the side molding force of the shoe sole is poor. If the vulcanization time is too long, cracks, unevenness, and other problems may occur on the sole.

[0005] 3. Uneven heating of different parts of the sole. Even on a single side, the temperature is higher where the material is closer to the heating element. Different parts of the shoe mold have different temperatures, such as the inner part and the bottom surface of the sole. The different distances from the heating plate cause uneven heating and cooling, resulting in poor molding ability. This leads to the sole not meeting the requirements for softness and elasticity in certain areas, resulting in a high defect rate. Even soles from the same batch may have different performance due to the different heat conduction during each molding process.

[0006] 4. For some special high-end shoes, such as the heel, midfoot, and toe, different parts need to achieve different performance indicators such as softness and elasticity, which cannot be achieved by controlling the temperature.

[0007] 5. The hot plate on the rubber vulcanizing machine dissipates heat to the surroundings, making the temperature around the equipment high, which affects the working environment. Workers may be burned if they accidentally touch the hot plate, posing a safety hazard.

[0008] 6. Rubber vulcanizing machines typically have multiple mounting slots on the hot plate. The heating tubes are inserted into the mounting slots. The hot plate is thick, and the heating tubes need to be maintained and replaced regularly, which increases costs.

[0009] 7. The heating element may leak electricity, posing a safety hazard;

[0010] 8. After some shoe soles are formed, the mold and hot plate need to be sprayed with water to cool them down. The spraying area is large, which wastes water resources.

[0011] Chinese Patent Application No. 202220332819.8 discloses a shoe sole forming heating mechanism for use with a shoe sole forming mold. It includes an upper heating component located at the top of the shoe sole mold and a lower heating component located at the bottom of the mold. The upper heating component includes a first fixing plate, a lamp mounting plate and mounting bracket, a temperature sensor, and a lamp. The lamp mounting plate has a lamp mounting groove, and the lamp is mounted in the groove. The first temperature sensor is located at the top of the first fixing plate and extends through the top of the mounting bracket. The lower heating component includes a drive component fixing plate, a wrap-around cover, a cover base, an infrared lamp, and a first lifting drive component. The wrap-around cover is located at the top of the drive component fixing plate, the infrared lamp is located inside the wrap-around cover, and the first lifting drive component is located at the bottom of the drive component fixing plate and connected to the cover base. This heating mechanism uses lamp heating, which results in significant heat loss during heat conduction. The lamp needs to be set at a high temperature to maintain the temperature of the shoe sole, increasing production costs, and causing long heating times and low production efficiency. Summary of the Invention

[0012] Therefore, to address the aforementioned problems, this invention proposes an apparatus and method for manufacturing shoe soles using a heating wire. This solves the technical problems of high heat loss and low heating efficiency during shoe sole production.

[0013] To achieve the above objectives, the present invention adopts the following technical solution:

[0014] An apparatus for manufacturing shoe soles using heating wires includes a frame, a mold body mounted on the frame, and a drive device for opening and closing the mold body. The mold body includes a bottom mold and a top mold. When the bottom mold and the top mold are closed, a mold cavity is formed inside. The bottom mold and the top mold are each provided with at least one groove. Heating wires are arranged in the grooves. The heating wires are arranged on the top, side walls, and bottom of the mold body. A sealing layer is provided on the grooves to seal the heating wires into the grooves. The sealing layer is made of a thermally conductive material. Each heating wire is connected to a thermocouple, and all or part of the thermocouples are located in the grooves.

[0015] Further:

[0016] The shortest distance between each part of the heating wire and the mold cavity is no more than 10mm.

[0017] The frame is provided with two fixed seats, which are respectively connected to the bottom mold and the top mold. The fixed seats are provided with cooling channels, which are connected to a first cooling device. The frame is provided with a second cooling device.

[0018] The groove includes at least one first groove body disposed on the bottom mold and the top mold. The first groove body is arranged in a meandering manner along the width direction. The first groove body is arranged at the front end, middle and rear end. The first groove body includes multiple first meandering grooves arranged along the width direction. The distance between the heating wires in two adjacent first meandering grooves is 5mm to 20mm.

[0019] The groove includes at least two second grooves disposed on the side wall of the mold body. The second grooves are distributed along the position of the mold cavity at the front, middle and rear of the side wall of the mold body. The second grooves extend from the heel of the shoe along the direction of the toe and then meander back to the heel. At least one of the second grooves extends to the toe of the shoe. The length of the upper second groove extending towards the toe of the shoe is greater than the length of the lower second groove extending towards the toe of the shoe. The second groove includes at least two second meandering grooves. The distance between the heating wires in two adjacent second meandering grooves is 5mm to 20mm.

[0020] The present invention also provides a method for preparing shoe soles using a heating wire based on the above-described apparatus, comprising the following methods:

[0021] S1. Material feeding: Feeding the shoe sole raw material into the mold cavity of the mold body;

[0022] S2. Mold Closure: The drive device drives the bottom mold and top mold to close, so that the mold cavity forms a closed space;

[0023] S3. Heating stage: The heating wires are activated, and each heating wire quickly heats up to the set temperature. Thermocouples detect the temperature of the corresponding heating wire. The temperature of each heating wire can be set to be the same or different. The heat is transferred to the mold body through heat conduction, and the mold body quickly heats up to the set temperature. The mold body precisely heats the material in the mold cavity.

[0024] S4. Temperature control stage: During the temperature control stage, the minimum temperature set by the system is T0, and the maximum temperature set by the system is T1. The thermocouple detects the temperature of the heating wire connected to it and feeds back the real-time temperature T of the corresponding heating wire to the system. When T≥T1, the corresponding heating wire is de-energized and stops heating. When T≤T0, the heating wire is activated and heats up.

[0025] S5. Mold Opening: The driving device drives the bottom mold and top mold to open, and the formed shoe sole is taken out.

[0026] Further:

[0027] The frame is equipped with two fixed seats, which are respectively connected to the bottom mold and the top mold. The fixed seats are equipped with cooling channels, which are connected to a first cooling device. The frame is equipped with a second cooling device. After step S4 is completed, there is a cooling stage. The first cooling device inputs water or gas into the cooling channels. The water and gas cool the top mold and the bottom mold. The second cooling device sprays water or gas onto the side wall of the mold body. The water or gas contacts the side wall of the mold body and cools the side wall of the mold body, reducing the temperature of the sole and making the sole harden and set.

[0028] T0 is between 183 and 193 degrees Celsius, and T1 is between 198 and 208 degrees Celsius.

[0029] By adopting the aforementioned technical solution, the beneficial effects of the present invention are:

[0030] The mounting base of this invention eliminates the need for multiple heating tubes, reducing the thickness of the base and lowering the overall height and weight of the equipment. By using heating wires instead of heating tubes, the heating wires offer advantages such as smaller size, lighter weight, and faster heating speed. A sealing layer encloses the heating wires, minimizing heat loss and improving heat conduction efficiency. Since heat does not need to be conducted through the mounting base, the heating temperature of the heating wires is lower than that of the heating tubes, resulting in less influence on the surrounding air temperature and less heat loss, thus saving energy. During the heating process, the heating wires can be precisely controlled to ensure heating accuracy and reduce product defect rates. For high-end shoe soles, the heating wires can heat different areas at different temperatures, achieving varying degrees of softness, elasticity, and other performance indicators, thus improving the quality of the sole. The heating wires are lightweight and not easily damaged. Furthermore, thermocouples can monitor the temperature of each heating wire in real time, and the control system can automatically adjust the temperature, allowing all or part of the thermocouples to be switched on. Located within the wire groove, temperature measurement is unaffected by external air, resulting in more accurate measurements. Furthermore, the first groove's circuitous arrangement reduces the number of heating wires, while ensuring even distribution of the heating wires on the bottom and top molds. The distance between the heating wires in the first circuitous groove is set within the range of 5mm to 20mm, enabling more precise temperature control and improving heating efficiency. Furthermore, the second groove, distributed along the mold cavity, reduces the length of the heating wires, lowering the manufacturing and heating costs of the mold body and improving heating and cooling efficiency. The second groove, located at the front, middle, and rear, allows for precise heating of the entire circumference of the sole. Furthermore, the invention enables automatic temperature control adjustment by setting a minimum temperature value T0 and a maximum temperature value T1. Furthermore, when some soles are removed from the mold, cooling and shaping are required. The top and bottom surfaces of the mold body are cooled by circulating water or gas, while the sidewalls of the mold body are cooled by spraying a small amount of water or gas. This not only allows for rapid cooling but also saves water resources by reducing the cooling area, thereby lowering cooling costs and improving cooling efficiency. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the shoe-making device of the present invention.

[0032] Figure 2 This is a partial structural schematic diagram of the present invention.

[0033] Figure 3 This is a structural schematic diagram of the main body of the mold.

[0034] Figure 4 This is a structural schematic diagram of the mold body from another angle.

[0035] Figure 5 This is the front view of the main body of the mold.

[0036] Figure 6 This is a partial cross-sectional view of the heating wire.

[0037] Figure 7 This is a partial cross-sectional view of a thermocouple.

[0038] Figure 8 This is a top view of the top mold.

[0039] Figure 9 This is a bottom view of the bottom mold.

[0040] Figure 10 This is a schematic diagram of the bottom mold structure.

[0041] Figure 11 This is a side view of the bottom mold.

[0042] Figure 12 This is a schematic diagram of one embodiment of the second groove.

[0043] Figure 13 This is a schematic diagram of another embodiment of the second groove.

[0044] Figure 14 yes Figure 11 A structural diagram from another angle.

[0045] Figure 15 This is a schematic diagram of the structure where the two first grooves are connected.

[0046] Figure 16 This is a schematic diagram of the first groove being spiral-shaped.

[0047] Figure 17 This is a structural schematic diagram of another embodiment of the first groove.

[0048] Figure label:

[0049] 1. Mold body; 10. Mold cavity; 11. Bottom mold; 12. Top mold; 13. Wire groove; 131. First groove; 1310. First detour groove; 132. Second groove; 1320. Second detour groove; 14. Heating wire; 15. Sealing layer; 16. Thermocouple; 17. Top; 18. Side wall; 19. Bottom; 2. Frame; 21. Guide rod; 22. Lifting seat; 220. Sliding sleeve; 3. Drive device; 4. Fixed seat; 40. Cooling channel; 41. Positioning rod; 42. Positioning hole. Detailed Implementation

[0050] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments.

[0051] refer to Figures 1 to 17This embodiment provides an apparatus for preparing shoe soles by heating with heating wires, including a frame 2, a mold body 1 mounted on the frame 2, and a driving device 3 for opening and closing the mold body 1. The mold body 1 includes a bottom mold 11 and a top mold 12. When the bottom mold 11 and the top mold 12 are closed, a mold cavity 10 is formed inside. The bottom mold 11 and the top mold 12 are respectively provided with wire grooves 13. Heating wires 14 are arranged in the wire grooves 13. The heating wires 14 are arranged on the top 17, side walls 18 and bottom 19 of the mold body 1. A sealing layer 15 is provided on the wire grooves 13. The sealing layer 15 is a heat-conducting material. The sealing layer 15 seals the heating wires 14 into the wire grooves 13. A thermocouple 16 is connected to each heating wire 14.

[0052] refer to Figure 1 In one embodiment, the frame 2 is provided with a plurality of guide rods 21, and a lifting seat 22 is provided on the guide rods 21. The lifting seat 22 is provided with a sliding sleeve 220, which is sleeved on the guide rods 21. One of the fixed seats 4 is fixed on the lifting seat 22. The telescopic end of the driving device 3 is connected to the lifting seat 22. The driving device 3 drives the lifting seat 22 and the bottom mold 11 to rise and fall to realize mold opening and mold closing.

[0053] refer to Figure 2 In one embodiment, the frame 2 is provided with two fixed seats 4, which are respectively connected to the bottom mold 11 and the top mold 12. The fixed seats 4 are provided with cooling channels 40, which are connected to a first cooling device. The frame 2 is provided with a second cooling device.

[0054] refer to Figure 2 In one embodiment, one of the fixed seats 4 is provided with a plurality of positioning rods 41, and the other fixed seat 4 is provided with positioning holes 42 corresponding to the positioning rods 41, wherein the positioning rods 41 can be inserted into the positioning holes 42 for support and positioning.

[0055] refer to Figure 8 and Figure 9 In one embodiment, the wire groove 13 includes a first groove 131 disposed on the bottom mold 11 and the top mold 12. The bottom mold 11 and the top mold 12 are each provided with two first grooves 131, which are respectively disposed at the upper and lower parts. The first grooves 131 are arranged in a meandering manner along the width direction, with both ends of the first grooves 131 extending to the middle. The first grooves 131 are arranged at the front end, middle part and rear end. The first groove 131 includes a plurality of first meandering grooves 1310 arranged along the width direction. The distance between the heating wires 14 in two adjacent first meandering grooves 1310 is 5mm to 20mm.

[0056] refer to Figure 10 and Figure 11In one embodiment, the groove 13 includes multiple second grooves 132 disposed on the side wall 18 of the shoe mold body. The second grooves 132 are distributed along the position of the mold cavity 10 at the front, middle and rear of the side wall 18 of the shoe mold body. The second grooves 132 extend from the heel along the direction of the toe and then meander back to the heel. At least one second groove 132 extends to the toe. The length of the upper second groove 132 extending towards the toe is greater than the length of the lower second groove 132 extending towards the toe. The second groove 132 includes at least two second meandering grooves 1320. The distance between the heating wires 14 in two adjacent second meandering grooves 1320 is 5 mm to 20 mm.

[0057] The number of the above-mentioned wire troughs 13 can also be one, that is, all wire troughs 13 are connected; the number of the above-mentioned wire troughs 13 can also be two, three or even more, depending on the specific situation.

[0058] The thermocouple 16 described above can be replaced by a thermistor or other temperature detection device, which are well-known devices and will not be described in detail here. The thermocouple 16 is usually installed on the end of the wire groove 13, which facilitates wiring; in one embodiment, the thermocouple 16 may not be installed in the wire groove 13, but in this structure, the accuracy of temperature detection is relatively low; in another embodiment, the thermocouple 16 may not be installed at all.

[0059] In one embodiment, the heating wire 14 is disposed on the top 17 and bottom 19 of the mold body 1, but not on the side wall 18 of the mold body 1; in another embodiment, the heating wire 14 is disposed on the top 17 and side wall 18 of the mold body 1, but not on the bottom 19 of the mold body 1; in yet another embodiment, the heating wire 14 is disposed on the bottom 19 and side wall 18 of the mold body 1, but not on the top 17 of the mold body 1.

[0060] The aforementioned sealing layer 15 is made of aluminum, iron, thermally conductive plastic, or other thermally conductive materials, and can be sealed to the groove 13 by high-temperature melting. In another embodiment, the sealing layer 15 can also be made of wood or other non-thermally conductive materials. This type of sealing layer 15 is non-thermally conductive and is typically used for shoe soles that do not require water cooling, such as soles made of RB material. In another embodiment, the sealing layer 15 can also be made of one, two, or more materials, with some parts of the sealing layer 15 being thermally conductive and others not. In yet another embodiment, the sealing layer 15 may not be provided.

[0061] The aforementioned groove 13 can also be set on the inner wall of the mold body 1. This structure requires higher sealing of the heating wire 14, and the sealing layer 15 may need to be made into a pattern corresponding to the shoe sole pattern. The production cost of the mold body 1 is high. At the same time, for some shoe soles that need cooling, such as EVA shoe soles, it is not conducive to water cooling, and it is also more inconvenient to replace and maintain the groove 13. In another embodiment, some grooves 13 are set on the inner wall of the mold body 1, and some grooves 13 are set on the outer wall of the mold body 1.

[0062] The shortest distance between each part of the heating wire 14 and the mold cavity 10 is usually set to no more than 5m, such as 4mm, 3mm, etc. This structure has a better heating effect; other values ​​can also be used, such as 5mm, 6mm, 8mm, 10mm, etc., or it can be set to more than 10mm, such as 11mm, 12mm, etc. The farther the distance, the worse the heating effect.

[0063] The side wall 18 of the mold body 1 is usually only provided on the bottom mold 11. In one embodiment, the side wall 18 of the mold body 1 can also be provided on the bottom mold 11 and the top mold 12, that is, part of the second groove 132 is provided on the bottom mold 11 and also on the top mold 12. In another embodiment, the side wall 18 of the mold body 1 can also be only provided on the top mold 12.

[0064] The number of the aforementioned first groove 131 and corresponding heating wire 14 can be one, two, three, or even more. In one embodiment, such as... Figure 15 The first groove 131 of the bottom mold 11 or the top mold 12 and the heating wire 14 may each have only one, Figure 9 In one embodiment, the two first grooves 131 are connected, with only one first groove 131 meandering along the width direction on the entire bottom mold 11 or top mold 12; in another embodiment, the number of the first grooves 131 is three, with the three first grooves 131 meandering around the front, middle, and top 17 respectively; in yet another embodiment, the first groove 131 can also be connected to the second groove 132, with a heating wire 14 extending from the first groove 131 to the second groove 132. In yet another embodiment, such as... Figure 16 The first groove 131 can also be configured as a single, spirally arranged along its length. However, in this configuration, wiring the beginning and end of the first groove 131 is somewhat inconvenient. In another embodiment, such as... Figure 17 The first groove 131 can also be configured as multiple grooves, with multiple first grooves 131 arranged in a spiral structure on the mold body 1; the first groove 131 can also be a line segment, arc, spiral or other structure.

[0065] The first groove 131 can also be connected to the second groove 132, and a heating wire 14 extends from the first groove 131 to the second groove 132.

[0066] The distance between two adjacent first detour grooves 1310 is usually set to 5mm to 10mm, such as 6mm, 8mm, etc.; it can also be greater than 5mm or less than 10mm, such as 3mm, 12mm, 15mm, 18mm, etc., depending on the specific situation.

[0067] The distance between two adjacent second detour grooves 1320 is usually set to 5mm to 10mm, such as 6mm, 8mm, etc.; it can also be greater than 5mm or less than 10mm, such as 3mm, 12mm, 15mm, 18mm, etc., depending on the specific situation.

[0068] The number of the aforementioned second groove 132 can also be one, that is, the aforementioned multiple second grooves 132 are connected end to end.

[0069] The second groove 132 is usually set according to the position of the mold cavity 10, which can minimize the length of the heating wire 14 and the second groove 132; in one embodiment, the second groove 132 may not be distributed along the position of the mold cavity 10, that is, the second groove 132 may be set on the side wall 18 without the mold cavity 10, or the second groove 132 may not be set on the side wall 18 with the mold cavity 10.

[0070] The second groove 132 described above can also be configured as a line segment, an arc, a multiple-detour configuration, or other structures. In one embodiment, such as... Figure 12 The aforementioned second groove 132 can also be two, with the two second grooves 132 respectively disposed on both sides of the mold body 1, and the second grooves 132 arranged in a circuitous manner on the side wall 18 of the mold body 1; in another embodiment, it can also be... Figure 12 The two second grooves 132 are connected, and only one heating wire 14 is used; in another embodiment, such as Figure 13 and Figure 14 The two second grooves 132 at the top 17 extend from the heel to the toe and then from the other side to the heel. The other two second grooves 132 are arranged in a meandering manner at the two side walls 18. The second grooves 132 can also be made of line segments, arcs or other structures.

[0071] The aforementioned drive device 3 can be a cylinder, hydraulic cylinder, or other linear motion device, which are well-known devices and will not be described in detail here.

[0072] The first cooling device and the second cooling device mentioned above can be a water tank and a water pump; the first cooling device and the second cooling device mentioned above can also be a fan or other cooling device, which are known devices and are not shown in the figure, so they will not be described in detail here.

[0073] The present invention also provides a method for preparing shoe soles using a heating wire based on the above-described apparatus, comprising the following methods:

[0074] S1. Material feeding: Feed the shoe sole material into the mold cavity 10 of the mold body 1.

[0075] S2. Mold closing: The driving device 3 drives the bottom mold 11 and the top mold 12 to close, so that the mold cavity 10 forms a closed space.

[0076] S3. Heating stage: The heating wire 14 is activated, and each heating wire 14 quickly heats up to the set temperature. The thermocouple 16 detects the temperature of the corresponding heating wire 14. The temperature of each heating wire 14 can be set to be the same or different, which heats the mold body 1. The heat is conducted to the mold body 1, and the mold body 1 quickly heats up to the set temperature. The mold body 1 accurately heats the material in the mold cavity 10.

[0077] S4. Temperature control stage: During the temperature control stage, the minimum temperature set by the system is T0, and the maximum temperature set by the system is T1. Thermocouple 16 detects the temperature of the heating wire connected to it and feeds back the real-time temperature T of the corresponding heating wire 14 to the system. When T≥T1, the corresponding heating wire 14 is de-energized and stops heating. When T≤T0, the heating wire 14 is activated and heats up.

[0078] S5. Mold opening: The driving device 3 drives the bottom mold 11 and the top mold 12 to open the mold and remove the formed shoe sole.

[0079] The above method is used for shoe soles that do not require cooling and shaping, such as soles made of RB material. Some shoe soles require cooling and shaping; otherwise, the shoes will deform when removed at high temperatures. Therefore, this method is used when producing shoe soles that require water cooling and shaping, such as EVA soles. After step S4 is completed, there is a cooling stage. The first cooling device inputs water or gas into the cooling channel 40. The water and gas cool the top mold 12 and the bottom mold 11. The second cooling device sprays water or gas onto the side wall 18 of the mold body 1. The water or gas contacts the side wall 18 of the mold body 1, cooling the side wall 18 and lowering the temperature of the shoe sole to below 40 degrees Celsius. This hardens and shapes the shoe sole, preventing deformation when it is removed.

[0080] When the sole does not require cooling, the total time for the heating and temperature control stages is usually set to about 240 seconds. Therefore, one process in sole production takes about 4 minutes. In traditional sole production, the heating tube needs to reach a temperature of about 250 degrees Celsius, which requires heat conduction to the heating plate. The heating plate has a large area, resulting in significant heat loss and a slower heating time. One process in traditional sole production takes about 8 minutes.

[0081] When the sole needs to be cooled, the total time for the heating and temperature control stages is usually set to about 240 seconds, with the heating stage lasting about 90 seconds, the temperature control stage about 150 seconds, and the cooling stage about 300 seconds. Therefore, the sole forming time is about 4 minutes, the cooling time is about 5 minutes, and the sole production process takes about 10 minutes. In contrast, the cooling time for traditional soles is about 8 minutes, and the production process takes more than 18 minutes.

[0082] The diameter of the heating wire 14 is typically 2mm to 6mm, and the depth of the groove 13 is typically 6mm to 10mm. The depth of the groove 13 is 3mm to 5mm larger than the diameter of the heating wire 14, and the depth of the groove 13 is typically 4mm larger than the diameter of the heating wire 14.

[0083] Actual verification shows that when a pair of 220g shoe soles are made using a traditional rubber vulcanizing machine, if the main body of the shoe mold is a steel mold, vulcanization requires 2.35 kWh of electricity; if the main body of the shoe mold is an aluminum mold, vulcanization requires 1.54 kWh of electricity, and the vulcanization time is about 7 to 8 minutes. After using the direct heating method of the heating wire 14 of this invention, vulcanization only requires 0.44 kWh of electricity, and the vulcanization time is about 4 minutes.

[0084] Each shoe sole consumes 30% of the electricity of a traditional aluminum mold and 20% of the electricity of a traditional steel mold; it can save 70%-80% of electricity, shorten vulcanization time by half, and reduce the defect rate by 30%.

[0085] Although the invention has been specifically shown and described in conjunction with preferred embodiments, those skilled in the art should understand that various changes in form and detail may be made to the invention without departing from the spirit and scope of the invention as defined in the appended claims, all of which shall be within the scope of protection of the invention.

Claims

1. An apparatus for preparing shoe soles by heating with a heating wire, characterized in that: The device includes a frame, a mold body mounted on the frame, and a drive device for opening and closing the mold body. The mold body includes a bottom mold and a top mold. When the bottom mold and the top mold are closed, a mold cavity is formed inside. The bottom mold and the top mold are each provided with at least one groove. Heating wires are arranged in the grooves. The heating wires are arranged on the top, side walls, and bottom of the mold body. A sealing layer is provided on the grooves. The sealing layer is made of thermally conductive material. A thermocouple is connected to each heating wire. All or part of the thermocouples are arranged in the grooves.

2. The apparatus for preparing shoe soles using a heating wire according to claim 1, characterized in that: The shortest distance between each part of the heating wire and the mold cavity is no more than 10mm.

3. The apparatus for preparing shoe soles by heating with a heating wire according to claim 1, characterized in that: The frame is provided with two fixed seats, which are respectively connected to the bottom mold and the top mold. The fixed seats are provided with cooling channels, which are connected to a first cooling device. The frame is provided with a second cooling device.

4. The apparatus for preparing shoe soles by heating with a heating wire according to claim 1, characterized in that: The groove includes at least one first groove body disposed on the bottom mold and the top mold. The first groove body is arranged in a meandering manner along the width direction. The first groove body is arranged at the front end, middle and rear end. The first groove body includes multiple first meandering grooves arranged along the width direction. The distance between the heating wires in two adjacent first meandering grooves is 5mm to 20mm.

5. The apparatus for preparing shoe soles by heating with a heating wire according to claim 1 or 4, characterized in that: The groove includes at least two second grooves disposed on the side wall of the mold body. The second grooves are distributed along the position of the mold cavity at the front, middle and rear of the side wall of the mold body. The second grooves extend from the heel of the shoe along the direction of the toe and then meander back to the heel. At least one of the second grooves extends to the toe of the shoe. The length of the upper second groove extending towards the toe of the shoe is greater than the length of the lower second groove extending towards the toe of the shoe. The second groove includes at least two second meandering grooves. The distance between the heating wires in two adjacent second meandering grooves is 5mm to 20mm.

6. A method for preparing shoe soles using a heating wire as described in claim 1, characterized in that: Including the following methods: S1. Material feeding: Feeding the shoe sole raw material into the mold cavity of the mold body; S2. Mold Closure: The drive device drives the bottom mold and top mold to close, so that the mold cavity forms a closed space; S3. Heating stage: The heating wires are activated, and each heating wire quickly heats up to the set temperature. Thermocouples detect the temperature of the corresponding heating wire. The temperature of each heating wire can be set to be the same or different. The heat is transferred to the mold body through heat conduction, and the mold body quickly heats up to the set temperature. The mold body precisely heats the material in the mold cavity. S4. Temperature control stage: During the temperature control stage, the minimum temperature set by the system is T0, and the maximum temperature set by the system is T1. The thermocouple detects the temperature of the heating wire connected to it and feeds back the real-time temperature T of the corresponding heating wire to the system. When T≥T1, the corresponding heating wire is de-energized and stops heating. When T≤T0, the heating wire is activated and heats up. S5. Mold Opening: The driving device drives the bottom mold and top mold to open, and the formed shoe sole is taken out.

7. The method according to claim 6, characterized in that: The frame is equipped with two fixed seats, which are respectively connected to the bottom mold and the top mold. The fixed seats are equipped with cooling channels, which are connected to a first cooling device. The frame is equipped with a second cooling device. After step S4 is completed, there is a cooling stage. The first cooling device inputs water or gas into the cooling channels. The water and gas cool the top mold and the bottom mold. The second cooling device sprays water or gas onto the side wall of the mold body. The water or gas contacts the side wall of the mold body and cools the side wall of the mold body, reducing the temperature of the sole and making the sole harden and set.

8. The method according to claim 6, characterized in that: T0 is between 183 and 193 degrees Celsius, and T1 is between 198 and 208 degrees Celsius.

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