Hole plugging resin for high-frequency circuit board, high-frequency circuit board and preparation method

Abstract

The embodiment of the invention relates to the technical field of epoxy resin and circuit board manufacturing, in particular to hole plugging resin for a high-frequency circuit board, the high-frequency circuit board and a preparation method, and the method comprises the following steps: S1, extracting components according to the components of the hole plugging resin for the high-frequency circuit board and corresponding proportions; s2, mixing the carbazole-9-yl benzothiadiazole and diethanol amine in a pneumatic transmission pipeline, so as to obtain a first mixture; s3, performing electrostatic charge removal treatment on the first mixture in the pneumatic transmission pipeline by adopting an ion fan to obtain the first mixture subjected to charge removal; s4, bisphenol a epoxy resin, a curing agent, an inorganic filler, an auxiliary agent and the first mixture obtained after charge removal are mixed, stirring and grinding are conducted for 3-5 hours, the hole plugging resin for the high-frequency circuit board is obtained, the provided hole plugging resin has better copper adhesiveness and higher glass transition temperature, and therefore the product performance is improved.

Description

Technical Field

[0001] The present application relates to the technical field of epoxy resin and circuit board manufacturing, and in particular to a plugging resin for a high-frequency circuit board, a high-frequency circuit board and a preparation method. Background Art

[0002] With the rapid development of electronic communication products, the amount of information transmitted by products is getting larger and larger, the transmission speed is getting faster and faster, and the signal transmission loss requirements are getting smaller and smaller, which puts higher requirements on high-frequency circuit boards (PCBs). Circuit boards are rapidly developing in the direction of being thin, small, and high-frequency. When resin plugging is currently performed on high-frequency circuit boards, plugging resin is usually used directly for processing. For example, high-frequency circuit boards are drilled-copper-thickened copper-plugging resin-copper-thickened copper.

[0003] Since conventional plugging resins usually carry more negative charges on their surfaces after plugging the holes, the subsequent copper deposition effect is poor. At the same time, since the plugging resins require a high glass transition temperature to have better product performance, the above problems faced by conventional plugging resins need to be solved urgently. Summary of the invention

[0004] The embodiments of the present application provide a plugging resin for a high-frequency circuit board, a high-frequency circuit board, and a preparation method. The plugging resin provided has better copper adhesion and a higher glass transition temperature, thereby improving product performance.

[0005] A first aspect of an embodiment of the present application provides a plugging resin for a high-frequency circuit board, comprising the following components in percentage by mass:

[0006] Bisphenol A epoxy resin 30-40%, polarity adjuster 1.01-1.2%, curing agent 1-5%, inorganic filler 40-60%, additive 0.1-3%;

[0007] The polarity adjuster is a mixture of carbazole-9-ylbenzothiadiazole and diethanolamine; the mass ratio of the carbazole-9-ylbenzothiadiazole to diethanolamine is 1:(20-25);

[0008] The inorganic filler is a mixture of micron-sized silicon dioxide, graphene and calcium carbonate powder.

[0009] In this example, the high-frequency circuit board plugging resin includes a polarity adjuster, carbazole-9-ylbenzothiadiazole. Carbazole-9-ylbenzothiadiazole itself has a large amount of positive charge before the reaction. Therefore, when mixed with bisphenol A epoxy resin, the overall negative charge of the obtained high-frequency circuit board plugging resin can be reduced, thereby improving the copper deposition effect during subsequent copper deposition. At the same time, after the carbazole-9-ylbenzothiadiazole and bisphenol A epoxy resin are mixed, the generated product has a very high glass transition temperature, which can further improve the overall performance of the high-frequency circuit board plugging resin.

[0010] In a possible implementation, the curing agent is at least one of an organic anhydride curing agent and an organic hydrazide curing agent.

[0011] In a possible implementation, the particle size of the micron-sized silicon dioxide is 21-30 μm.

[0012] In a possible implementation, the auxiliary agent is at least one of 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-undecylimidazole, and 2-heptadecylimidazole.

[0013] A second aspect of the embodiment of the present application provides a method for preparing the plugging resin for a high-frequency circuit board according to any one of the first aspects, the preparation method comprising:

[0014] S1. Extracting various components according to the composition and corresponding proportion of the plugging resin for high-frequency circuit boards;

[0015] S2, mixing carbazole-9-ylbenzothiadiazole and diethanolamine in a pneumatic transmission pipeline to obtain a first mixture;

[0016] S3, using an ion blower in the pneumatic transmission pipeline to perform electrostatic charge removal treatment on the first mixture to obtain a first mixture after charge removal;

[0017] S4, mixing bisphenol A epoxy resin, curing agent, inorganic filler, auxiliary agent and the first mixture after the charge is removed, and stirring and grinding for 3-5 hours to obtain the plugging resin for high-frequency circuit board.

[0018] In a possible implementation, an ion blower is used in the pneumatic transmission pipeline to remove electrostatic charge from the first mixture to obtain the first mixture after the charge is removed, including:

[0019] Obtaining diameter distribution information of the first mixture;

[0020] Determining k diameter distribution points of the first mixture according to the diameter distribution information;

[0021] Determining a first reference electrostatic charge amount generated by collision of the first mixture when the first mixture is mixed according to the k diameter distribution points and the corresponding number of mixture particles;

[0022] Acquiring air velocity and air flow information when the first mixture is pneumatically transported in the pneumatic transport channel;

[0023] determining a second reference electrostatic charge amount according to the air flow velocity and the air flow information;

[0024] The first reference electrostatic charge amount and the second reference electrostatic charge amount are fused to obtain a target electrostatic charge amount;

[0025] Determining the ion wind generation parameters of the ion blower according to the target electrostatic charge amount;

[0026] The ion wind generating parameter is used to control the ion blower to perform electrostatic charge removal processing on the first mixture to obtain the first mixture after the charge is removed.

[0027] A third aspect of an embodiment of the present application provides a high-frequency circuit board, in which the high-frequency circuit board plugging resin as described in any one of the first aspects is applied. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0029] Figure 1 A schematic flow chart of a method for preparing a plugging resin for a high-frequency circuit board is provided for an embodiment of the present application. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0031] The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices.

[0032] Reference to "embodiments" in this application means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in this application may be combined with other embodiments.

[0033] In order to more fully understand the technical content of the present invention, the technical solution of the present invention is further introduced and illustrated in conjunction with specific embodiments below.

[0034] In a specific implementation, Figure 1 As shown, Figure 1 A schematic flow chart of a method for preparing a plugging resin for a high-frequency circuit board is provided for an embodiment of the present application. The preparation method comprises:

[0035] S1. Extracting various components according to the composition and corresponding proportion of the plugging resin for high-frequency circuit boards;

[0036] S2, mixing carbazole-9-ylbenzothiadiazole and diethanolamine in a pneumatic transmission pipeline to obtain a first mixture;

[0037] S3, using an ion blower in the pneumatic transmission pipeline to perform electrostatic charge removal treatment on the first mixture to obtain a first mixture after charge removal;

[0038] S4, mixing the bisphenol A epoxy resin, curing agent, inorganic filler, auxiliary agent and the first mixture after the charge is removed, and stirring and grinding for 3-5 hours to obtain a plugging resin for a high-frequency circuit board.

[0039] Among them, when extracting each component according to the composition and corresponding proportion of the plugging resin for high-frequency circuit boards, the extracted components can be extracted according to the following mass percentages, specifically: 30-40% of bisphenol A epoxy resin, 1.01-1.2% of polarity adjuster, 1-5% of curing agent, 40-60% of inorganic filler, 0.1-3% of auxiliary agent, the polarity adjuster is a mixture of carbazole-9-ylbenzothiadiazole and diethanolamine; the mass ratio of carbazole-9-ylbenzothiadiazole to diethanolamine is 1:(20-25), and the inorganic filler is a mixture of micron-sized silicon dioxide, graphene and calcium carbonate powder.

[0040] The wall of the pneumatic transmission pipeline is provided with an air outlet of the ion fan. The air outlet 2 ( Figure 1 Only the air outlet 2 of the ion fan is shown) arranged on the inner wall of the charge removal pipe 1, and there is a certain angle between the air outlet 2 of the ion fan and the longitudinal axis of the charge removal pipe 1, which can be an angle between 50 degrees and 60 degrees.

[0041] Carbazole-9-ylbenzothiadiazole and diethanolamine are in powder form. Therefore, carbazole-9-ylbenzothiadiazole and diethanolamine can be introduced into the charge removal pipe 1 through the feed port of the charge removal pipe 1, and the electrostatic charge is removed by the ion wind generated by the ion blower, and then output from the discharge port of the charge removal pipe 1. At the same time, carbazole-9-ylbenzothiadiazole and diethanolamine are mixed in the charge removal pipe. By mixing in the pneumatic transmission pipe, carbazole-9-ylbenzothiadiazole and diethanolamine can be mixed more fully.

[0042] When 9-carbazole-1-ylbenzothiadiazole and diethanolamine are mixed, static electricity will be generated due to collisions between powder particles. This will cause adsorption and agglomeration caused by static electricity when they are subsequently mixed with other components, resulting in a longer mixing time. In extreme cases, uneven mixing may even occur, causing a sharp decline in the performance of the plugging resin for high-frequency circuit boards.

[0043] An electrostatic detection device is provided at the discharge port of the pneumatic transmission pipeline, and the electrostatic detection device can directly detect the charge of the first mixture output from the discharge port. If the detected charge is lower than the preset electrostatic charge, the first mixture is mixed with other subsequent components;

[0044] If it is higher than the preset electrostatic charge, the first mixture at the outlet of the charge removal pipeline 1 is input into the charge removal pipeline 1 again for charge removal, until the electrostatic charge of the first mixture at the outlet of the charge removal pipeline 1 is lower than the preset electrostatic charge, and then the first mixture is mixed with other subsequent components. The preset electrostatic charge is set by empirical value or historical data, which is the electrostatic charge that meets the use requirements. By performing a destaticizing treatment on the first mixture while mixing it in the pneumatic transmission pipeline, the electrostatic charge in the first mixture can be made lower than the preset electrostatic charge, thereby avoiding the adsorption and agglomeration caused by electrostatic charge when mixing with other components, thereby improving the efficiency and stability of subsequent mixing.

[0045] In a possible implementation, in order to improve the effect of destaticization and reduce the number of repeated destaticization due to incomplete destaticization, the diameter of the first mixture can be analyzed and processed to analyze the electrostatic charge generated by the collision, so as to accurately perform destaticization, improve the effect of destaticization, and reduce the number of times of destaticization. For example, a method of removing the electrostatic charge of the first mixture using an ion blower in a pneumatic transmission pipeline to obtain a first mixture after the charge is removed includes:

[0046] A1. Obtaining diameter distribution information of the first mixture;

[0047] A2. determining k diameter distribution points of the first mixture according to the diameter distribution information;

[0048] A3. determining a first reference electrostatic charge amount generated by the first mixture due to collision when the first mixture is mixed according to the k diameter distribution points and the corresponding number of mixture particles;

[0049] A4. Acquiring air velocity and air flow information when the first mixture is pneumatically transmitted in the pneumatic transmission channel;

[0050] A5. determining a second reference electrostatic charge according to the air velocity and air flow information;

[0051] A6, fusing the first reference electrostatic charge and the second reference electrostatic charge to obtain a target electrostatic charge;

[0052] A7. Determine the ion wind generation parameters of the ion blower according to the target electrostatic charge;

[0053] A8. Using ion wind generation parameters to control the ion blower to remove electrostatic charges from the first mixture to obtain a first mixture after the charges are removed.

[0054] Among them, the method for obtaining the diameter distribution information of the first mixture can be to estimate the diameter from the raw materials of carbazole-9-based benzothiadiazole and diethanolamine to obtain the estimated diameters of carbazole-9-based benzothiadiazole and diethanolamine. Specifically, during the production of carbazole-9-based benzothiadiazole and diethanolamine, the carbazole-9-based benzothiadiazole and diethanolamine produced have a certain diameter distribution, and the diameter distribution information of the first mixture can be obtained by fusion processing according to the diameter distribution. Specifically, the diameter distribution information of carbazole-9-based benzothiadiazole and the diameter distribution information of diethanolamine are fused to obtain the diameter distribution information of the first mixture. The diameter distribution information includes the diameter information and the corresponding number of particles of the mixture.

[0055] After obtaining the diameter distribution information, diameter clustering processing can be performed according to the diameter distribution information to obtain k diameter clustering points, which are determined as diameter distribution points. The clustering method here can adopt a general clustering method to cluster the diameter distribution information to obtain k diameter distribution points.

[0056] After obtaining the diameter distribution points and the number of mixture particles, the sphericity and roundness information of the mixture particles can be referred to to approximate the mixture particles with an ellipsoid-like sphere. Therefore, the surface area of ​​a single mixture particle can be solved based on the diameter distribution points and the ellipsoid-like sphere after approximation, and then multiplied by the number of corresponding mixtures to obtain the group surface area corresponding to each diameter distribution point, and finally the group surface area corresponding to each diameter distribution point is added to obtain the overall surface area of ​​the first mixture. Then, based on the mapping relationship between the overall surface area and the collision electrostatic charge, the first reference electrostatic charge is determined. Thus, the first reference electrostatic charge can be quickly obtained.

[0057] When the first mixture is pneumatically transferred and mixed, the greater the air load, the more the first mixture. At this time, the probability of the first mixture colliding with the inner wall of the charge removal pipe 1 will be reduced, thereby reducing the probability of the first mixture generating electrostatic charge due to the collision, and ultimately the electrostatic charge of the first mixture will be reduced. Therefore, the air load can be determined based on the mass of the first mixture input into the charge removal pipe 1 each time, and the second reference electrostatic charge can be determined in combination with the air flow rate and air flow information in the pneumatic transfer channel.

[0058] Specifically, the gas flow direction can be determined according to the air flow information, and then the collision information of the particles in the first mixture is determined by combining the gas flow direction, air flow rate and air load, and the second reference electrostatic charge is determined according to the collision information. The air flow information includes the gas flow direction.

[0059] As the first mixture is transmitted along the charge removal pipe 1 along the wind direction, the first mixture moves in the vertical direction due to the effect of gravity. At this time, due to the drag of the air and the influence of gravity, collisions will occur between the first mixtures, and between the first mixture and the inner wall of the charge removal pipe 1. Due to the occurrence of collisions, the electrons on the surface of the first mixture will increase or disappear, thereby generating electrostatic charges. Therefore, the trajectory information of the first mixture during mixed transmission in the charge removal pipe 1 can be simulated according to the combined gas flow direction, air flow rate and air load, and the collision information can be determined according to the trajectory information. The collision information includes the collision point and the collision force.

[0060] When a collision occurs, the magnitude of the collision force will affect the charge transfer capability. As the collision force increases, the charge transfer capability will increase. Therefore, the second reference electrostatic charge amount can be determined based on the collision point and collision force in the collision information.

[0061] The weights corresponding to the first reference electrostatic charge and the second reference electrostatic charge may be obtained respectively, and then the weights are used to perform weight calculation to obtain the target electrostatic charge.

[0062] The method for determining the ion wind generation parameters of the ion blower according to the target electrostatic charge amount may be: obtaining a correlation function between the ion wind generation parameters and the target electrostatic charge amount, and then minimizing the correlation function to obtain the ion wind generation parameters, wherein the ion wind generation parameters include the ion wind generation amount and the air flow rate of the ion wind. The correlation function may be set by empirical values ​​or historical data.

[0063] Therefore, by implementing the above scheme, the electrostatic charge generated by the collision can be analyzed, so as to accurately perform static electricity removal, improve the effect of static electricity removal, and reduce the number of static electricity removal times.

[0064] In a specific implementation, the present application provides a plugging resin for a high-frequency circuit board, including the following components in percentage by mass:

[0065] Bisphenol A epoxy resin 30-40%, polarity adjuster 1.01-1.2%, curing agent 1-5%, inorganic filler 40-60%, additive 0.1-3%;

[0066] The polarity adjuster is a mixture of carbazole-9-ylbenzothiadiazole and diethanolamine; the mass ratio of carbazole-9-ylbenzothiadiazole to diethanolamine is 1:(20-25);

[0067] The inorganic filler is a mixture of micron-sized silicon dioxide, graphene and calcium carbonate powder.

[0068] In this example, the high-frequency circuit board plugging resin includes a polarity adjuster, carbazole-9-ylbenzothiadiazole. Carbazole-9-ylbenzothiadiazole itself has a large amount of positive charge before the reaction. Therefore, when mixed with bisphenol A epoxy resin, the overall negative charge of the obtained high-frequency circuit board plugging resin can be reduced, thereby improving the copper deposition effect during subsequent copper deposition. At the same time, after the carbazole-9-ylbenzothiadiazole and bisphenol A epoxy resin are mixed, the generated product has a very high glass transition temperature, which can further improve the overall performance of the high-frequency circuit board plugging resin.

[0069] In a possible implementation, at least one of an organic anhydride curing agent and an organic hydrazide curing agent.

[0070] In a possible implementation, the particle size of the micron-sized silicon dioxide is 21-30 μm.

[0071] In a possible implementation, the auxiliary agent is at least one of 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-undecylimidazole, and 2-heptadecylimidazole.

[0072] A second aspect of the embodiment of the present application provides a method for preparing a plugging resin for a high-frequency circuit board according to any one of the first aspects, the preparation method comprising:

[0073] In a specific embodiment, the embodiment of the present application provides a high-frequency circuit board, in which the plugging resin for a high-frequency circuit board as described in any one of the first aspects is applied.

[0074] In a specific embodiment, the copper plating performance of the plugging resin for high-frequency circuit boards prepared according to the embodiment of the present application is analyzed. Specifically, the plugging resin for high-frequency circuit boards contains 35% bisphenol A epoxy resin, 1.2% polarity adjuster, 4% curing agent, 57.6% inorganic filler, and 2.2% auxiliary agent; the polarity adjuster is a mixture of carbazole-9-ylbenzothiadiazole and diethanolamine; the mass ratio of carbazole-9-ylbenzothiadiazole to diethanolamine is 1:24; the inorganic filler is a mixture of micron-sized silica, graphene, and calcium carbonate powder. After using the plugging resin for high-frequency circuit boards, when copper plating is performed, after the copper plating and subsequent treatment are completed, the sample is tested, and the testing method is as follows:

[0075] 1. Surface appearance inspection: Visually inspect the copper layer on the surface of the modified resin after chemical copper deposition and electroplating. The copper layer is qualified if it is complete, without faults and voids;

[0076] 2. Adhesion inspection: After chemical copper deposition, dry the test circuit board, stick it on the surface of chemical copper with strong transparent tape, grab both ends of the tape with both hands and pull it upwards. If there is no peeling of the copper deposition layer, it is qualified;

[0077] 3. Inspection of copper plating layer: Metallographic sectioning, cut samples from the position where there is plugging resin, make crystal glue in the metallographic sectioning mold, and then grind the metallographic section to the center of the longitudinal hole of the plugging resin hole. Use a metallographic microscope 200 times to observe the copper layer thickness on the surface of the plugging resin. The copper layer is intact and has uniform thickness, which is qualified.

[0078] The surface appearance, adhesion and copper plating layer of the copper deposit are qualified.

[0079] In another specific embodiment, as a comparative experimental example.

[0080] The copper plating performance of the plugging resin for high-frequency circuit boards prepared according to the embodiment of the present application is analyzed. Specifically, the plugging resin for high-frequency circuit boards contains 35% bisphenol A epoxy resin, 1.2% polarity adjuster, 4% curing agent, 57.6% inorganic filler, and 2.2% auxiliary agent; the polarity adjuster is a mixture of carbazole-9-ylbenzothiadiazole and diethanolamine; the mass ratio of carbazole-9-ylbenzothiadiazole to diethanolamine is 1:24; the inorganic filler is a mixture of micron-grade silica, graphene and calcium carbonate powder. During the preparation process, the first mixture is not subjected to antistatic treatment, but is directly mixed with other components to prepare the plugging resin for high-frequency circuit boards. After using the plugging resin for high-frequency circuit boards, when copper is deposited, the sample is tested after the copper deposition and subsequent treatment are completed. The detection method is:

[0081] 1. Surface appearance inspection: Visually inspect the copper layer on the surface of the modified resin after chemical copper deposition and electroplating. The copper layer is qualified if it is complete, without faults and voids;

[0082] 2. Adhesion inspection: After chemical copper deposition, dry the test circuit board, stick it on the surface of chemical copper with strong transparent tape, grab both ends of the tape with both hands and pull it upwards. If there is no peeling of the copper deposition layer, it is qualified;

[0083] 3. Inspection of copper plating layer: Metallographic sectioning, cut samples from the position where there is plugging resin, make crystal glue in the metallographic sectioning mold, and then grind the metallographic section to the center of the longitudinal hole of the plugging resin hole. Use a metallographic microscope 200 times to observe the copper layer thickness on the surface of the plugging resin. The copper layer is intact and has uniform thickness, which is qualified.

[0084] The surface appearance and adhesion of the copper deposit are qualified, but the copper plating layer is unqualified.

[0085] The embodiments of the present application are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. At the same time, for general technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A plugging resin for a high-frequency circuit board, characterized in that: Includes the following mass percentage components: Bisphenol A epoxy resin 30-40%, polarity adjuster 1.01-1.2%, curing agent 1-5%, inorganic filler 40-60%, additive 0.1-3%; The polarity adjuster is a mixture of carbazole-9-ylbenzothiadiazole and diethanolamine; the mass ratio of the carbazole-9-ylbenzothiadiazole to diethanolamine is 1:(20-25); The inorganic filler is a mixture of micron-sized silicon dioxide, graphene and calcium carbonate powder.

2. The method for preparing a plugging resin for a high-frequency circuit board according to claim 1, characterized in that: At least one of the organic anhydride curing agent and the organic hydrazide curing agent.

3. The method for preparing a plugging resin for a high-frequency circuit board according to claim 1 or 2, characterized in that: The particle size of the micron-sized silicon dioxide is 21-30 μm.

4. The method for preparing a plugging resin for a high-frequency circuit board according to claim 3, characterized in that: The auxiliary agent is at least one of 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-undecylimidazole and 2-heptadecylimidazole.

5. A method for preparing a plugging resin for a high-frequency circuit board according to any one of claims 1 to 4, characterized in that: The preparation method comprises: S1. Extracting various components according to the composition and corresponding proportion of the plugging resin for high-frequency circuit boards; S2, mixing carbazole-9-ylbenzothiadiazole and diethanolamine in a pneumatic transmission pipeline to obtain a first mixture; S3, using an ion blower in the pneumatic transmission pipeline to perform electrostatic charge removal treatment on the first mixture to obtain a first mixture after charge removal; S4, mixing bisphenol A epoxy resin, curing agent, inorganic filler, auxiliary agent and the first mixture after the charge is removed, and stirring and grinding for 3-5 hours to obtain the plugging resin for high-frequency circuit board.

6. The method for preparing a plugging resin for a high-frequency circuit board according to claim 5, characterized in that: The method comprises: removing the electrostatic charge of the first mixture by using an ion blower in the pneumatic transmission pipeline to obtain the first mixture after the charge is removed, comprising: Obtaining diameter distribution information of the first mixture; Determining k diameter distribution points of the first mixture according to the diameter distribution information; Determining a first reference electrostatic charge amount generated by collision of the first mixture when the first mixture is mixed according to the k diameter distribution points and the corresponding number of mixture particles; Acquiring air velocity and air flow information when the first mixture is pneumatically transported in the pneumatic transport channel; determining a second reference electrostatic charge amount according to the air flow velocity and the air flow information; The first reference electrostatic charge amount and the second reference electrostatic charge amount are fused to obtain a target electrostatic charge amount; Determining the ion wind generation parameters of the ion blower according to the target electrostatic charge amount; The ion wind generating parameter is used to control the ion blower to perform electrostatic charge removal processing on the first mixture to obtain the first mixture after the charge is removed.

7. A high frequency circuit board, characterized in that: The high-frequency circuit board is applied with the plugging resin for high-frequency circuit board as claimed in any one of claims 1 to 5.

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