Thermal electromagnetic coupling model construction method, device and system and storage medium

Abstract

The invention provides a thermal electromagnetic coupling model construction method, device and system and a storage medium, and belongs to the technical field of radars, and the method comprises the steps: importing a radar performance parameter set and a radio frequency front-end parameter set, and constructing a training model through the radar performance parameter set; training the training model through the radio frequency front-end parameter set to obtain a to-be-evaluated model; and performing performance evaluation on the to-be-evaluated model to obtain the thermal electromagnetic coupling model. According to the method, the thermal electromagnetic coupling model can be rapidly constructed according to requirements, the method is suitable for mechanical-thermal-electromagnetic integrated coupling of a high-power and high-performance radar radio frequency front end structure, and the requirements of structural mechanical-thermal-electromagnetic coupling in existing engineering are met.

Description

Technical Field

[0001] The present invention mainly relates to the field of radar technology, and in particular to a method, device, system and storage medium for constructing a thermal electromagnetic coupling model. Background Art

[0002] With the increasing application of SIP packaging (system-level packaging) in the field of radar technology, traditional radar design has gradually developed towards high performance, miniaturization, lightweight, high integration, and high power. With the widespread application of SIP packaging in radar design, the high-performance, high-reliability, and high-integration radar design issues within limited space and power consumption have become more important. Among them, the demand for multifunctional and highly integrated structures has become increasingly strong, and multi-field coupling design issues such as thermoelectric, electromagnetic, structural force and thermal deformation have also become extremely prominent. At present, the single-coupling and double-coupling model construction methods of split design are still used for multifunctional structures, which makes it difficult to achieve a truly multifunctional integrated structural coupling design. The traditional integrated construction method is no longer suitable for the coupling construction of high-power, high-performance radar RF front-end structure force, thermal and electromagnetic integration.

[0003] The traditional structural force, thermal and electromagnetic coupling platform has corresponding modules in various commercial software, but has not formed a corresponding systematic coupling construction model for multifunctional and highly integrated structural force, thermal and electromagnetic, nor can it meet the structural force, thermal and electromagnetic coupling design needs in existing projects.

[0004] At present, the existing methods have clearly explained the electromechanical thermal coupling methods between the array surface and the transceiver component temperature, and the antenna cold plate, but they are difficult to apply to the multifunctional and highly integrated system based on the radar RF front end. The multidisciplinary modeling methods involved are also unable to solve the structural mechanical, thermal and electromagnetic integrated coupling design problems. There is a lack of a top-level, complete model construction method based on the radar RF front end from a design perspective, and there is no accurate multi-physical field coupling analysis, rapid evaluation and design for each part of the object. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a method, device, system and storage medium for constructing a thermal electromagnetic coupling model in view of the deficiencies in the prior art.

[0006] The technical solution of the present invention to solve the above technical problem is as follows: A method for constructing a thermal electromagnetic coupling model comprises the following steps:

[0007] S1: importing a radar performance parameter set and a radio frequency front-end parameter set, and building a training model through the radar performance parameter set;

[0008] S2: training the training model by using the RF front-end parameter set to obtain a model to be evaluated;

[0009] S3: Performing performance evaluation on the model to be evaluated to obtain a thermal electromagnetic coupling model.

[0010] Another technical solution of the present invention to solve the above technical problem is as follows: a thermal electromagnetic coupling model construction device, comprising:

[0011] Import module, used to import radar performance parameter set and RF front-end parameter set;

[0012] A construction module, used to construct a training model through the radar performance parameter set;

[0013] A training module, used to train the training model through the RF front-end parameter set to obtain a model to be evaluated;

[0014] The thermal electromagnetic coupling model acquisition module is used to perform performance evaluation on the model to be evaluated to obtain a thermal electromagnetic coupling model.

[0015] Based on the above-mentioned thermal electromagnetic coupling model construction method, the present invention also provides a thermal electromagnetic coupling model construction system.

[0016] Another technical solution of the present invention to solve the above technical problem is as follows: a thermal electromagnetic coupling model construction system, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the thermal electromagnetic coupling model construction method as described above is implemented.

[0017] Based on the above-mentioned method for constructing a thermal electromagnetic coupling model, the present invention also provides a computer-readable storage medium.

[0018] Another technical solution of the present invention to solve the above technical problem is as follows: a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the thermal electromagnetic coupling model construction method as described above is implemented.

[0019] The beneficial effects of the present invention are as follows: by importing a radar performance parameter set and a radio frequency front-end parameter set, a training model is constructed through the radar performance parameter set, the training model is trained through the radio frequency front-end parameter set to obtain a model to be evaluated, and a performance evaluation is performed on the model to be evaluated to obtain a thermal electromagnetic coupling model. A thermal electromagnetic coupling model can be quickly constructed according to demand, which is suitable for the structural force, thermal electromagnetic integrated coupling of a high-power, high-performance radar radio frequency front-end, and meets the needs of structural force, thermal electromagnetic coupling in existing engineering projects. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1One of the flow charts of a method for constructing a thermal electromagnetic coupling model provided by an embodiment of the present invention;

[0021] Figure 2 One of the schematic diagrams of a thermal electromagnetic coupling model of a method for constructing a thermal electromagnetic coupling model provided by an embodiment of the present invention;

[0022] Figure 3 A second schematic diagram of a thermal electromagnetic coupling model of a method for constructing a thermal electromagnetic coupling model provided by an embodiment of the present invention;

[0023] Figure 4 A second flow chart of a method for constructing a thermal-electromagnetic coupling model provided in an embodiment of the present invention;

[0024] Figure 5 A module block diagram of a thermal electromagnetic coupling model building device provided in an embodiment of the present invention.

[0025] In the accompanying drawings, the names of the components represented by the various marks are as follows:

[0026] 1. Antenna cover, 2. Frequency selection structure, 3. PCB board, 4. Array panel, 5. Heat dissipation channel, 6. Array SIP chip. DETAILED DESCRIPTION

[0027] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0028] Figure 1 A schematic flow chart of a method for constructing a thermal-electromagnetic coupling model provided in an embodiment of the present invention.

[0029] like Figure 1 As shown, a method for constructing a thermal electromagnetic coupling model includes the following steps:

[0030] S1: importing a radar performance parameter set and a radio frequency front-end parameter set, and building a training model through the radar performance parameter set;

[0031] S2: training the training model by using the RF front-end parameter set to obtain a model to be evaluated;

[0032] S3: Performing performance evaluation on the model to be evaluated to obtain a thermal electromagnetic coupling model.

[0033] In the above embodiment, by importing a radar performance parameter set and a RF front-end parameter set, a training model is constructed by the radar performance parameter set, the training model is trained by the RF front-end parameter set to obtain a model to be evaluated, and the performance of the model to be evaluated is evaluated to obtain a thermal electromagnetic coupling model. A thermal electromagnetic coupling model can be quickly constructed according to demand, which is suitable for the structural force, thermal electromagnetic integrated coupling of high-power, high-performance radar RF front-ends, and meets the needs of structural force, thermal electromagnetic coupling in existing engineering projects.

[0034] Optionally, as an embodiment of the present invention, the radar performance parameter set includes a plurality of radar electrical performance parameters and a plurality of radar structural performance parameters.

[0035] In S1, the process of constructing a training model using the radar performance parameter set includes:

[0036] Constructing an index parameter library through all the radar electrical performance parameters and all the radar structural performance parameters;

[0037] The indicator parameter library is modeled using the Creo three-dimensional modeling tool to obtain a training model.

[0038] It should be understood that the index parameter library can be modeled using three-dimensional modeling software (creo ug, etc.), a multi-field coupling simulation platform (ansys comsol), and electromagnetic simulation software HFSS.

[0039] It should be understood that the technical index parameters affecting the electrical performance (i.e., radar electrical performance parameters) and structural performance (i.e., radar structural performance parameters) are refined, and a design index parameter library is established, including electrical performance indicators such as transmission performance and electromagnetic performance (i.e., radar electrical performance parameters), chip temperature, structural force load, deformation and structural lightweighting (i.e., radar structural performance parameters), and functional indicators of the RF front-end structure are proposed.

[0040] Specifically, based on the basic information such as the mission, electrical performance (i.e., radar electrical performance parameters) and structural engineering function indicators (i.e., radar structural performance parameters), a top-level preliminary layout plan for core equipment is carried out, and a preliminary design model scheme (i.e., training model) is prepared based on the electrical performance, size, weight, and installation method of the core equipment to meet the design requirements of the radar RF front-end structure.

[0041] In the above embodiment, an index parameter library is constructed by using all radar electrical performance parameters and all radar structural performance parameters, and a training model is obtained by using the Creo three-dimensional modeling tool to construct a model of the index parameter library, which meets the design requirements of the radar RF front-end structure and can quickly build a thermal electromagnetic coupling model according to the requirements. It is suitable for the integrated coupling of mechanical, thermal and electromagnetic of high-power, high-performance radar RF front-end structures.

[0042] Optionally, as an embodiment of the present invention, the RF front-end parameter set includes a frequency-selective antenna cover parameter group, an array SIP chip parameter group, and a liquid-cooled array panel parameter group.

[0043] The S2 process includes:

[0044] The training model is trained with the frequency selective radome by using the frequency selective radome parameter group to obtain a first trained model;

[0045] The first trained model is trained with the array SIP chip by using the array SIP chip parameter group to obtain a second trained model;

[0046] The second trained model is trained on the liquid cooling array panel using the liquid cooling array panel parameter group to obtain a model to be evaluated.

[0047] It should be understood that based on the preliminary model (i.e., the training model), an optimization model design based on multi-objective optimization is carried out, and according to the design requirements of the structural frequency-selective antenna cover (i.e., the frequency-selective antenna cover parameter group), the array SIP chip (i.e., the array SIP chip parameter group) and the liquid-cooled array panel (i.e., the liquid-cooled array panel parameter group) of the RF front-end, a structural-electromagnetic coupling design and analysis model based on the frequency-selective antenna (i.e., the first trained model) is constructed, a mechanical, thermal and electrical integration coupling design and analysis model based on the array SIP chip (i.e., the second trained model) and a structural mechanical, thermal and electrical integration coupling design and analysis model based on the liquid-cooled array panel (i.e., the model to be evaluated) are constructed.

[0048] In the above embodiment, the training model is trained through the RF front-end parameter set to obtain the model to be evaluated, which can quickly build a thermal electromagnetic coupling model according to the needs, and is suitable for the structural force, thermal electromagnetic integration coupling of high-power, high-performance radar RF front-end, meeting the needs of structural force, thermal electromagnetic coupling in existing engineering.

[0049] Optionally, as an embodiment of the present invention, the frequency-selective radome parameter group includes a plurality of antenna frequency band parameters and a plurality of antenna electrical performance parameters.

[0050] The process of training the training model for the frequency selective radome by using the frequency selective radome parameter group to obtain the first trained model includes:

[0051] The training model is trained for frequency-selective radome using all the antenna frequency band parameters and all the antenna electrical performance parameters to obtain a first trained model.

[0052] It should be understood that the structure of the antenna cover is optimized based on the structural frequency-selective antenna cover design of the RF front end to achieve the wave transmission and frequency selection functions of different bands. Through the antenna frequency band (i.e., antenna frequency band parameters) and electrical indicators (i.e., antenna electrical performance parameters), a structure-electromagnetic antenna cover structure coupling model (i.e., the first trained model) is constructed, and the antenna cover structure-electromagnetic coupling design analysis based on frequency selection or wave transmission is carried out, and the influence relationship between the antenna cover structure and frequency selection or wave transmission is obtained, and the antenna cover structure design parameters are determined.

[0053] In the above embodiment, the training model is trained on the frequency-selective antenna cover through all antenna frequency band parameters and all antenna electrical performance parameters to obtain the first trained model, which can quickly build a thermal electromagnetic coupling model according to needs, and is suitable for the structural force, thermal electromagnetic integrated coupling of high-power, high-performance radar RF front-end, meeting the needs of structural force, thermal electromagnetic coupling in existing engineering.

[0054] Optionally, as an embodiment of the present invention, the array SIP chip parameter group includes a plurality of chip electrical performance parameters and a plurality of chip temperature distributions.

[0055] The process of training the array SIP chip of the first trained model by using the array SIP chip parameter group to obtain the second trained model includes:

[0056] The first trained model is trained on an array SIP chip using all the chip electrical performance parameters and all the chip temperature distributions to obtain a second trained model.

[0057] Specifically, based on the mechanical, thermal and electrical integration coupling design analysis of the RF front-end SIP chip, the chip thermal and electrical coupling method is improved according to the chip power consumption and internal circuit layout. A bidirectional coupling design method for chip electrical performance (i.e. chip electrical performance parameters) and chip temperature distribution (i.e. chip temperature distribution) is established, and a chip thermal and electrical coupling model (i.e. the second trained model) is constructed. The influence of chip thermal deformation analysis on electrical performance is simultaneously carried out, and the influence of temperature and thermal deformation on the electrical performance of the SIP array chip is obtained, completing the mechanical, thermal and electrical integration coupling design analysis based on the SIP chip.

[0058] In the above embodiment, the first trained model is trained on the array SIP chip through all chip electrical performance parameters and all chip temperature distributions to obtain the second trained model, which is suitable for the structural force, thermal and electromagnetic integrated coupling of high-power, high-performance radar RF front-end, and meets the needs of structural force, thermal and electromagnetic coupling in existing engineering.

[0059] Optionally, as an embodiment of the present invention, the liquid cooling array panel parameter group includes a plurality of panel structural characteristic parameters and a plurality of panel temperature distributions.

[0060] The process of training the second trained model for the liquid cooling array panel by using the liquid cooling array panel parameter group to obtain the model to be evaluated includes:

[0061] The second trained model is trained on the liquid cooling array panel using all the panel structural characteristic parameters and all the panel temperature distributions to obtain a model to be evaluated.

[0062] It should be understood that based on the structural mechanical and thermal integration coupling design analysis of the liquid cooling array panel, the temperature distribution of the liquid cooling array panel (i.e., the panel temperature distribution) is optimized in combination with the chip distribution, and the liquid cooling array panel is optimized in combination with the structural characteristics (bearing, weight, installation, vibration, deformation control) (i.e., the panel structural characteristic parameters) to achieve heat dissipation, bearing and other functions. A structural-mechanical-thermal coupling model based on the heat dissipation bearing of the liquid cooling array panel (i.e., the model to be evaluated) is constructed, a structural-mechanical-thermal coupling design method based on the liquid cooling array panel is established, and the influence relationship between the liquid cooling array panel and temperature, bearing, and deformation is obtained, and the structural design parameters of the liquid cooling array panel are determined.

[0063] In the above embodiment, the second trained model is trained on the liquid-cooled array panel through all panel structural characteristic parameters and all panel temperature distributions to obtain the model to be evaluated, which is suitable for the structural force, thermal and electromagnetic integrated coupling of high-power, high-performance radar RF front-end, and meets the needs of structural force, thermal and electromagnetic coupling in existing engineering.

[0064] Optionally, as an embodiment of the present invention, the process of S3 includes:

[0065] Performing a system electrical performance test on the model to be evaluated according to a preset system electrical performance test rule to obtain a system electrical performance test value;

[0066] Performing a thermal performance test on the model to be evaluated according to a preset thermal performance test rule to obtain a thermal performance test value;

[0067] Performing a force performance test on the model to be evaluated according to a preset force performance test rule to obtain a force performance test value;

[0068] Performing an electromagnetic performance test on the model to be evaluated according to a preset electromagnetic performance test rule to obtain an electromagnetic performance test value;

[0069] Performing an environmental test on the model to be evaluated according to preset environmental test rules to obtain an environmental test value;

[0070] Performing a reliability test on the model to be evaluated according to a preset reliability test rule to obtain a reliability test value;

[0071] Determine whether the system electrical performance test value, the thermal performance test value, the force performance test value, the electromagnetic performance test value, the environmental test value and the reliability test value are all greater than or equal to the preset electrical indicators and the preset structural indicators; if not, return to S2; if so, use the model to be evaluated as a thermal-electromagnetic coupling model.

[0072] It should be understood that the design parameters of each structure of the RF front-end are determined, the model is reconstructed according to the optimization design results or topology optimization results, the basic model (i.e., the model to be evaluated) is obtained, and the detailed model design is carried out in combination with the design indicators. Simultaneously, the final model simulation and verification design is carried out to complete the reconstruction and design of the highly integrated functional structure.

[0073] Specifically, a comprehensive performance evaluation and verification of mechanical, thermal and electromagnetic coupling of highly integrated structures is carried out, including system electrical performance tests, thermal performance tests, force and electromagnetic performance tests, and corresponding environmental tests and reliability tests. When the design indicators (i.e., the system electrical performance test values, the thermal performance test values, the force performance test values, the electromagnetic performance test values, the environmental test values ​​and the reliability test values) do not meet the requirements of electrical indicators (distance, accuracy, frequency selection) (i.e., the preset electrical indicators) and structural indicators (load-bearing, vibration) (i.e., the preset structural indicators), the design indicators in the design steps are optimized, and an iterative design based on a multi-objective optimization model is performed until the requirements of various indicators are met.

[0074] In the above embodiment, the performance of the model to be evaluated is evaluated to obtain a thermal electromagnetic coupling model, which can quickly construct a thermal electromagnetic coupling model according to the needs. It is suitable for the structural force, thermal electromagnetic integration coupling of high-power, high-performance radar RF front-end, and meets the needs of structural force, thermal electromagnetic coupling in existing engineering.

[0075] Optionally, as another embodiment of the present invention, the present invention aims at the high performance, high integration, and multifunctional design problem of the radar RF front end of SIP, and proposes a multifunctional high integration structural force, heat, and electromagnetic coupling design method based on the structural force, heat, and electromagnetic coupling design requirements. The present invention systematically and comprehensively proposes a high integration and multifunctional design method for the radar RF front end based on SIP from the perspective of meeting the design indicators. It includes the construction of a design indicator parameter library, top-level structural planning combined with functions, the design and construction of a high integration and multifunctional optimization model based on multiple objectives, and the comprehensive performance evaluation of force, heat, and electromagnetic coupling, etc., to achieve the high integration and multifunctional design and engineering stage verification of the radar RF front end based on SIP.

[0076] Optionally, as another embodiment of the present invention, Figure 2 and 3As shown, the model constructed by the present invention includes: a radome 1, a plurality of frequency selection structures 2, a PCB board 3, an array panel 4, a heat dissipation channel 5 and a plurality of array SIP chips 6.

[0077] The PCB board 3 is arranged perpendicular to the ground, the antenna cover 1 and the array panel 4 are arranged at both ends of the PCB board 3, the multiple frequency selection structures 2 are arranged on the antenna cover 1, the frequency selection structure 2 can also be a wave-transmitting structure, the multiple array S IP chips 6 are arranged on the PCB board 3, and the heat dissipation channel 5 is arranged on the array panel 4.

[0078] Optionally, as another embodiment of the present invention, Figure 4 As shown, the present invention comprises the following steps:

[0079] S1: Build a design index parameter library

[0080] Aiming at the demand for mechanical, thermal and electromagnetic integrated coupling design of radar RF front-end structure based on SIP, the technical index parameters that affect electrical performance and structural performance are refined, and a design index parameter library is established, which includes electrical performance indicators such as emission performance and electromagnetic performance, index parameters such as chip temperature, structural force load, deformation and structural lightweight, and proposes functional indicators of RF front-end structure.

[0081] S2: Top-level structural planning combined with functions

[0082] Based on the basic overview of the mission, electrical performance, and structural engineering function indicators, a top-level preliminary layout plan for core equipment is carried out. A preliminary design model scheme is designed based on the electrical performance, size, weight, and installation method of the core equipment to meet the design requirements of the radar RF front-end structure.

[0083] S3: Design and construction of a highly integrated and multifunctional optimization model based on multiple objectives

[0084] Based on the preliminary model of S2, an optimization model design based on multi-objective optimization is carried out. According to the design requirements of the structural frequency-selective antenna cover, array SIP chip, and liquid-cooled array panel of the RF front-end, a structural-electromagnetic coupling design and analysis model based on the frequency-selective antenna, a mechanical-thermal-electrical integration coupling design and analysis model based on the array SIP chip, and a structural mechanical-thermal integration coupling design and analysis model based on the liquid-cooled array panel are constructed.

[0085] S3-1: Structural-electromagnetic coupling design analysis model based on frequency-selective radome

[0086] Based on the structural frequency-selective radome design of the RF front end, the radome structure is optimized to achieve the wave transmission and frequency selection functions of different bands. Through the antenna frequency band and electrical indicators, a structural-electromagnetic radome structure coupling model is constructed, and the radome structure-electromagnetic coupling design analysis based on frequency selection or wave transmission is carried out, and the influence relationship between the radome structure and frequency selection or wave transmission is obtained, and the radome structure design parameters are determined.

[0087] S3-2: Analysis of the coupled design of mechanical, thermal and electrical integration based on array SIP chips

[0088] Based on the mechanical, thermal and electrical integration coupling design analysis of the RF front-end SIP chip, the chip thermal and electrical coupling method is improved according to the chip power consumption and internal circuit layout. A bidirectional coupling design method for chip electrical performance and chip temperature distribution is established, a chip thermal and electrical coupling model is constructed, and the influence of chip thermal deformation analysis on electrical performance is simultaneously carried out. The influence of temperature and thermal deformation on the electrical performance of the SIP array chip is obtained, and the mechanical, thermal and electrical integration coupling design analysis based on the SIP chip is completed.

[0089] S3-3: Structural mechanical and thermal integration design analysis based on liquid cooling array panel

[0090] Based on the structural mechanical and thermal integration coupling design analysis of the liquid cooling array panel, the temperature distribution of the liquid cooling array panel is optimized in combination with the chip distribution, and the liquid cooling array panel is optimized in combination with the structural characteristics (load bearing, weight, installation, vibration, deformation control) to achieve heat dissipation, load bearing and other functions. A structural-mechanical-thermal coupling model based on the heat dissipation load of the liquid cooling array panel is constructed, and a structural-mechanical-thermal coupling design method based on the liquid cooling array panel is established. The influence relationship between the liquid cooling array panel and temperature, load bearing, and deformation is obtained, and the structural design parameters of the liquid cooling array panel are determined.

[0091] S4: Model reconstruction and structural design

[0092] Based on the S3 process, the design parameters of each structure of the RF front end are determined, and the model is reconstructed according to the optimization design results or topology optimization results to obtain the basic model. The detailed model design is carried out in combination with the design indicators, and the final model simulation verification design is carried out simultaneously to complete the reconstruction and design of the highly integrated structure.

[0093] S5: Comprehensive performance evaluation of high-integration structural mechanical, thermal and electromagnetic coupling

[0094] Carry out comprehensive performance evaluation and verification of mechanical, thermal and electromagnetic coupling of highly integrated structures, including system electrical performance test, thermal performance test, force and electromagnetic performance test, and corresponding environmental test and reliability test. When the design indicators do not meet the requirements of electrical indicators (distance, accuracy, frequency selection) and structural indicators (load-bearing, vibration), optimize the design indicators in the design steps and perform iterative design based on multi-objective optimization models until the requirements of various indicators are met.

[0095] Figure 5 A module block diagram of a thermal electromagnetic coupling model building device provided in an embodiment of the present invention.

[0096] Optionally, as another embodiment of the present invention, Figure 5 As shown, a thermal electromagnetic coupling model building device includes:

[0097] Import module, used to import radar performance parameter set and RF front-end parameter set;

[0098] A construction module, used to construct a training model through the radar performance parameter set;

[0099] A training module, used to train the training model through the RF front-end parameter set to obtain a model to be evaluated;

[0100] The thermal electromagnetic coupling model acquisition module is used to perform performance evaluation on the model to be evaluated to obtain a thermal electromagnetic coupling model.

[0101] Optionally, another embodiment of the present invention provides a thermal electromagnetic coupling model construction system, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, the thermal electromagnetic coupling model construction method described above is implemented. The system may be a computer or other system.

[0102] Optionally, another embodiment of the present invention provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the thermal-electromagnetic coupling model construction method as described above is implemented.

[0103] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0104] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the above-described devices and units can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0105] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic, for example, the division of units is only a logical function division, and there may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed.

[0106] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the embodiments of the present invention.

[0107] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0108] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention is essentially or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods of each embodiment of the present invention. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk and other media that can store program codes.

[0109] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for constructing a thermal electromagnetic coupling model, characterized in that: The steps include: S1: importing a radar performance parameter set and a radio frequency front-end parameter set, and building a training model through the radar performance parameter set; S2: training the training model by using the RF front-end parameter set to obtain a model to be evaluated; S3: Performing performance evaluation on the model to be evaluated to obtain a thermal electromagnetic coupling model.

2. The method for constructing a thermal-electromagnetic coupling model according to claim 1, characterized in that: The radar performance parameter set includes a plurality of radar electrical performance parameters and a plurality of radar structural performance parameters, In S1, the process of constructing a training model using the radar performance parameter set includes: Constructing an index parameter library through all the radar electrical performance parameters and all the radar structural performance parameters; The indicator parameter library is modeled using the Creo three-dimensional modeling tool to obtain a training model.

3. The method for constructing a thermal-electromagnetic coupling model according to claim 1, characterized in that: The RF front-end parameter set includes a frequency-selective radome parameter group, an array SIP chip parameter group, and a liquid-cooled array panel parameter group. The S2 process includes: The training model is trained with the frequency selective radome by using the frequency selective radome parameter group to obtain a first trained model; The first trained model is used to train the array SIP chip by using the array SIP chip parameter group to obtain a second trained model; The second trained model is trained on the liquid cooling array panel using the liquid cooling array panel parameter group to obtain a model to be evaluated.

4. The method for constructing a thermal-electromagnetic coupling model according to claim 3, characterized in that: The frequency-selective radome parameter group includes a plurality of antenna frequency band parameters and a plurality of antenna electrical performance parameters, The process of training the training model for the frequency selective radome by using the frequency selective radome parameter group to obtain the first trained model includes: The training model is trained for frequency-selective radome using all the antenna frequency band parameters and all the antenna electrical performance parameters to obtain a first trained model.

5. The method for constructing a thermal-electromagnetic coupling model according to claim 3, characterized in that: The array SIP chip parameter group includes multiple chip electrical performance parameters and multiple chip temperature distributions. The process of training the array SIP chip by the array SIP chip parameter group to the first trained model to obtain the second trained model includes: The first trained model is trained on the array SIP chip using all the chip electrical performance parameters and all the chip temperature distributions to obtain a second trained model.

6. The method for constructing a thermal-electromagnetic coupling model according to claim 3, characterized in that: The liquid cooling array panel parameter group includes a plurality of panel structural characteristic parameters and a plurality of panel temperature distributions. The process of training the second trained model for the liquid cooling array panel by using the liquid cooling array panel parameter group to obtain the model to be evaluated includes: The second trained model is trained on the liquid cooling array panel using all the panel structural characteristic parameters and all the panel temperature distributions to obtain a model to be evaluated.

7. The method for constructing a thermal-electromagnetic coupling model according to claim 1, characterized in that: The S3 process includes: Performing a system electrical performance test on the model to be evaluated according to a preset system electrical performance test rule to obtain a system electrical performance test value; Performing a thermal performance test on the model to be evaluated according to a preset thermal performance test rule to obtain a thermal performance test value; Performing a force performance test on the model to be evaluated according to a preset force performance test rule to obtain a force performance test value; Performing an electromagnetic performance test on the model to be evaluated according to a preset electromagnetic performance test rule to obtain an electromagnetic performance test value; Performing an environmental test on the model to be evaluated according to preset environmental test rules to obtain an environmental test value; Performing a reliability test on the model to be evaluated according to a preset reliability test rule to obtain a reliability test value; Determine whether the system electrical performance test value, the thermal performance test value, the force performance test value, the electromagnetic performance test value, the environmental test value and the reliability test value are all greater than or equal to the preset electrical indicators and the preset structural indicators; if not, return to S2; if so, use the model to be evaluated as a thermal-electromagnetic coupling model.

8. A thermal electromagnetic coupling model construction device, characterized in that: include: Import module, used to import radar performance parameter set and RF front-end parameter set; A construction module, used to construct a training model through the radar performance parameter set; A training module, used to train the training model through the RF front-end parameter set to obtain a model to be evaluated; The thermal electromagnetic coupling model acquisition module is used to perform performance evaluation on the model to be evaluated to obtain a thermal electromagnetic coupling model.

9. A thermal electromagnetic coupling model construction system, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the thermal-electromagnetic coupling model construction method according to any one of claims 1 to 7 is implemented.

10. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the method for constructing a thermal electromagnetic coupling model according to any one of claims 1 to 7 is implemented.

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