Power module unit and power module having the same

Abstract

The present invention provides a power module unit and a power module having the same, wherein the power module unit comprises: a first conductive plate; a plurality of chips, the plurality of chips are arranged on the first conductive plate at intervals; a conductive equalizing member, the conductive equalizing member is arranged on a side of the plurality of chips away from the first conductive plate, the conductive equalizing member comprises an equalizing plate, the equalizing plate is provided with a plurality of conductive parts connected to the plurality of chips in a one-to-one correspondence; a crimping assembly, the crimping assembly is arranged on a side of the conductive equalizing member away from the plurality of chips; a second conductive plate, arranged on a side of the crimping assembly away from the conductive equalizing member. The technical solution of the present application effectively solves the problem in the related art that the chip is subjected to a large pressure and has a high probability of being damaged.

Description

Technical Field

[0001] The present invention relates to the technical field of power modules, and in particular to a power module unit and a power module having the same. Background Art

[0002] In a conventional press-fit power module, the press-fit structure is generally in direct contact with the chip, and current is conducted through the press-fit structure. That is, in a conventional press-fit power module, direct pressure contact is used on the chip to interconnect circuits.

[0003] In the prior art, multiple chips can be provided, and the crimping structure abuts against the multiple chips. The crimping structure may produce different pressures on each chip, which may cause some chips to be subjected to greater pressure and some chips to be subjected to lesser pressure. Due to the high brittleness of silicon carbide chips, the chips subjected to greater pressure may be damaged, affecting the use of the power module. Summary of the invention

[0004] The main purpose of the present invention is to provide a power module unit and a power module having the same, so as to solve the problem in the related art that the chip is subjected to a large pressure and is likely to be damaged.

[0005] In order to achieve the above-mentioned purpose, according to one aspect of the present invention, a power module unit is provided, including: a first conductive plate; a plurality of chips, which are arranged on the first conductive plate at intervals; a conductive equalizing member, which is arranged on a side of the plurality of chips away from the first conductive plate, and the conductive equalizing member includes an equalizing plate, on which a plurality of conductive parts connected one-to-one with the plurality of chips are arranged; a crimping assembly, which is arranged on a side of the conductive equalizing member away from the plurality of chips, and the crimping assembly includes a plurality of crimping members, and the plurality of crimping members are all in abutment with the equalizing plate; a second conductive plate, which is arranged on a side of the crimping assembly away from the conductive equalizing member.

[0006] Further, the load-balancing plate is electrically connected to the conductive part, each conductive part is a convex part, and each convex part is arranged on a side of the load-balancing plate facing the first conductive plate.

[0007] Furthermore, the load-balancing plate has at least one connecting recess, a connecting recess is arranged between any two adjacent protrusions, the surface of the connecting recess facing the first conductive plate is an arc surface, and the middle of the arc surface protrudes in a direction away from the first conductive plate.

[0008] Furthermore, the load-balancing plate, the plurality of conductive portions and the at least one connecting recess are an integrally formed structure.

[0009] Further, the plurality of convex portions include a first convex portion and a second convex portion, the plurality of connecting concave portions include a first concave portion, and the first concave portion is disposed between the first convex portion and the second convex portion.

[0010] Furthermore, the plurality of convex portions further include a third convex portion, the plurality of connecting concave portions further include a second concave portion, and the second concave portion is arranged between the second convex portion and the third convex portion, or the second concave portion is arranged between the first convex portion and the third convex portion.

[0011] Furthermore, the multiple protrusions also include a fourth protrusion, the first protrusion, the second protrusion and the third protrusion are arranged in sequence along the first direction, the fourth protrusion and the second protrusion are arranged along the second direction, and the multiple connecting recesses also include a third recess arranged between the second protrusion and the fourth protrusion, and the third recess is connected to the first recess and / or the second recess.

[0012] Furthermore, a size of the third concave portion in the first direction is greater than a size of the fourth convex portion in the first direction, and a portion of the third concave portion protruding from the fourth convex portion in the first direction is connected to the first concave portion and the second concave portion respectively.

[0013] Furthermore, there is a preset distance between the junction of the arc surface and the convex portion and the surface of the convex portion facing the first conductive plate.

[0014] Furthermore, the conductive equalizing load also includes a first notch portion arranged on the equalizing load plate, and the power module unit also includes a third conductive plate arranged on the first conductive plate, the third conductive plate is insulated from the first conductive plate, the third conductive plate is located in the first notch portion, and the gates of multiple chips arranged adjacent to the first notch portion are all conductively connected to the third conductive plate.

[0015] Furthermore, the conductive equalizing member also includes a second notch portion arranged on the equalizing plate, the second notch portion being spaced apart from the first notch portion, the power module unit also includes a fourth conductive plate arranged on the first conductive plate, the fourth conductive plate being insulated from the first conductive plate, the fourth conductive plate being located in the second notch portion, and the gates of multiple chips arranged adjacent to the second notch portion are all conductively connected to the fourth conductive plate.

[0016] Furthermore, the conductive load balancing member further includes a hollow portion arranged in the middle of the load balancing plate, and the first notch portion and the second notch portion are respectively arranged on two opposite ends of the load balancing plate.

[0017] Furthermore, the load-balancing plate includes a first plate segment, a second plate segment, a third plate segment and a fourth plate segment, the third plate segment and the fourth plate segment are spaced apart in the first direction, the first plate segment and the second plate segment are spaced apart in the second direction, the third plate segment is connected between the first plate segment and the second plate segment, the fourth plate segment is connected between the first plate segment and the second plate segment, and the first direction and the second direction are vertically arranged.

[0018] Further, the length of the first plate segment is greater than that of the third plate segment, the first notch portion is arranged between the first plate segment, the second plate segment and the third plate segment, the first notch portion is located on the side of the third plate segment away from the fourth plate segment, the second notch portion is arranged between the first plate segment, the second plate segment and the fourth plate segment, the second notch portion is located on the side of the fourth plate segment away from the first plate segment, and the hollow portion is arranged between the first plate segment, the second plate segment, the third plate segment and the fourth plate segment.

[0019] Furthermore, the conductive load-balancing element is connected to the multiple chips through a welding process or a sintering process.

[0020] According to another aspect of the present invention, a power module is provided, comprising a plurality of power module units arranged at intervals, wherein the power module units are the power module units described above.

[0021] Applying the technical solution of the present invention, a plurality of chips are arranged on the first conductive plate, and the plurality of chips are arranged at intervals. A conductive equalizing member is arranged on a side of the plurality of chips away from the first conductive plate, and the conductive equalizing member includes an equalizing plate, and a plurality of conductive parts are arranged on the equalizing plate, and the plurality of conductive parts are connected one-to-one with the plurality of chips. A crimping assembly is arranged on a side of the conductive equalizing member away from the plurality of chips, and the crimping assembly includes a plurality of crimping members, and the plurality of crimping members are all abutted and matched with the equalizing plate. The second conductive plate is arranged on a side of the crimping assembly away from the conductive equalizing member. Through the above arrangement, the first conductive plate can be conductive with the plurality of chips, the conductive part can be conductive with the plurality of chips, and the second conductive plate can also be conductive with the plurality of chips, so that current can flow between the first conductive plate, the plurality of chips, the conductive part and the second conductive plate. A conductive load-balancing member is arranged between multiple chips and the crimping assembly, and multiple conductive parts of the conductive load-balancing member are arranged one-to-one with multiple chips, and multiple conductive parts are arranged on the load-balancing board, and multiple crimping members are all in abutment with the load-balancing board, so that the pressure of multiple crimping members can be dispersed through the load-balancing board, and then transferred to multiple conductive parts, and then the pressure is transferred to the chip corresponding to the conductive part through each conductive part, that is, multiple chips and the conductive load-balancing member share the pressure of the crimping assembly together, avoiding direct contact between multiple crimping members and multiple chips, and reducing the probability that the chip may be damaged under the action of pressure. When there is a difference in the pressure of multiple crimping members, in the prior art, the chip that abuts against the crimping member with the greatest pressure is subjected to the greatest pressure and is easily damaged. In the present application, by setting the load-balancing board, and multiple crimping members abutting against the load-balancing board, the pressure of all crimping members will be dispersed through the load-balancing board, so that the pressure on each chip is more uniform, and then the maximum pressure on a single chip is much smaller than that in the prior art, thereby reducing the probability of damage to the chip subjected to the greatest pressure. Therefore, the technical solution of the present application effectively solves the problem in the related art that the chip is subjected to greater pressure and is more likely to be damaged. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The drawings constituting a part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0023] Figure 1 A schematic diagram of the three-dimensional structure of an embodiment of a power module unit according to the present invention is shown;

[0024] Figure 2 Shows Figure 1 A schematic diagram of a three-dimensional structure in which a first conductive plate, a plurality of chips and a conductive load-carrying member of a power module unit are connected;

[0025] Figure 3 Shows Figure 2 A schematic diagram of a three-dimensional structure from another perspective showing the connection of a first conductive plate, a plurality of chips and a conductive load-carrying member of a power module unit;

[0026] Figure 4 Shows Figure 1 A schematic diagram of a three-dimensional structure in which a first conductive plate of a power module unit is connected to a plurality of chips;

[0027] Figure 5 Shows Figure 1 A schematic diagram of the three-dimensional structure of a conductive load-bearing component of a power module unit;

[0028] Figure 6 Shows Figure 5 A schematic top view of a conductive load-bearing member;

[0029] Figure 7 Shows Figure 6 A cross-sectional view of the conductive load-bearing member at AA;

[0030] Figure 8 Shows Figure 6 A cross-sectional view of the conductive load-bearing member at BB;

[0031] Fig. 9 Shows Figure 7 A partial schematic diagram of a conductive load-bearing member at position C;

[0032] Fig.10 Shows Figure 7 A partial schematic diagram of a conductive uniform load member at position D;

[0033] Fig.11 Shows Figure 1 A schematic diagram of a three-dimensional structure of a power module unit from another perspective;

[0034] Fig.12 Shows Figure 1 A schematic diagram of the three-dimensional structure of a housing of a power module unit;

[0035] Fig.13 A schematic diagram of the three-dimensional structure of an embodiment of a power module according to the present invention is shown;

[0036] Fig.14 Shows Fig.13 Schematic diagram of the exploded structure of the power module.

[0037] The above drawings include the following reference numerals:

[0038] 10. first conductive plate; 20. chip; 30. conductive uniform carrier; 31. uniform carrier; 311. conductive part; 3111. convex part; 31111. first convex part; 31112. second convex part; 31113. third convex part; 31114. fourth convex part; 31115. fifth convex part; 31116. sixth convex part; 31117. seventh convex part; 31118. eighth convex part; 31119. ninth convex part; 311110. tenth convex part; 311111. eleventh convex part; 311112. twelfth convex part; 312. connecting concave part; 3121. arc surface; 3122. first concave part; 3123. second concave part; 3124. third concave part 3125, fourth recess; 3126, fifth recess; 3127, sixth recess; 3128, seventh recess; 3129, eighth recess; 31210, ninth recess; 31211, tenth recess; 31212, eleventh recess; 31213, twelfth recess; 313, first plate section; 314, second plate section; 315, third plate section; 316, fourth plate section; 32, first notch; 33, second notch; 34, hollow portion; 40, crimping assembly; 50, second conductive plate; 60, third conductive plate; 70, fourth conductive plate; 80, housing; 100, tube shell; 110, control board; 120, bottom plate; 130, buffer pad. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0041] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the present invention. Meanwhile, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, method and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, method and equipment should be considered as a part of the specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0042] Traditional press-fit power modules all use direct pressure contact on the chip to interconnect circuits. The hard contact between solids has a certain contact thermal resistance. At the same time, it is difficult to keep the junction temperature between chips consistent. At the same time, the thermal capacity of the upper pressure block of traditional press-fit is small, and the chip does not have a high surge resistance capability.

[0043] In the power module unit of this embodiment, both sides of the chip are interconnected by welding or sintering, and a copper bridge is used above the chip to sinter multiple chips 20 in parallel, and the copper bridge is a guide current carrier 30. The technical solution of this embodiment has the following advantages:

[0044] 1. Compared with direct pressure contact, the welding or sintering layer reduces the contact thermal resistance. At the same time, the copper bridge can play a role in heat distribution, enhancing the heat dissipation and surge resistance of the chip.

[0045] 2. Since silicon carbide chips are relatively brittle, resulting in poor pressure-bearing capacity, the technical solution of this embodiment is to set a conductive load-balancing component 30 under the crimping assembly 40. The conductive load-balancing component 30 is pressed on the top of the chip, and the pressure can be dispersed through the conductive load-balancing component 30, ensuring that the chip is subjected to less pressure.

[0046] like Figure 1As shown, the power module unit of this embodiment includes: a first conductive plate 10, a plurality of chips 20, a conductive equalizing member 30, a crimping assembly 40 and a second conductive plate 50. The plurality of chips 20 are arranged on the first conductive plate 10 at intervals. The conductive equalizing member 30 is arranged on a side of the plurality of chips 20 away from the first conductive plate 10, and the conductive equalizing member 30 includes a load balancing plate 31, and the load balancing plate 31 is provided with a plurality of conductive parts 311 connected to the plurality of chips 20 in a one-to-one correspondence. The crimping assembly 40 is arranged on a side of the conductive equalizing member 30 away from the plurality of chips 20, and the crimping assembly 40 includes a plurality of crimping members, and the plurality of crimping members are all in abutment with the load balancing plate 31. The second conductive plate 50 is arranged on a side of the crimping assembly 40 away from the conductive equalizing member 30.

[0047] Applying the technical solution of this embodiment, a plurality of chips 20 are arranged on the first conductive plate 10, and the plurality of chips 20 are arranged at intervals. A conductive equalizing member 30 is arranged on a side of the plurality of chips 20 away from the first conductive plate 10, and the conductive equalizing member 30 includes an equalizing plate 31, and a plurality of conductive parts 311 are arranged on the equalizing plate 31, and the plurality of conductive parts 311 are connected one by one with the plurality of chips 20. A crimping assembly 40 is arranged on a side of the conductive equalizing member 30 away from the plurality of chips 20, and the crimping assembly includes a plurality of crimping members, and the plurality of crimping members are all in abutment with the equalizing plate. The second conductive plate 50 is arranged on a side of the crimping assembly 40 away from the conductive equalizing member 30. Through the above arrangement, the first conductive plate 10 can be conducted with the plurality of chips 20, and the second conductive plate 50 can also be conducted with the plurality of chips 20, so that current can flow between the first conductive plate 10, the plurality of chips 20 and the second conductive plate 50. A conductive load-balancing member 30 is arranged between the multiple chips 20 and the crimping assembly 40. The multiple conductive parts 311 of the conductive load-balancing member 30 are arranged one-to-one with the multiple chips 20, and the multiple conductive parts 311 are arranged on the load-balancing board 31. The multiple crimping members are all in contact with the load-balancing board 31, so that the pressure of the multiple crimping members can be dispersed through the load-balancing board 31, and then transferred to the multiple conductive parts 311, and then the pressure is transferred to the chip 20 corresponding to the conductive part 311 through each conductive part 311, that is, the multiple chips 20 and the conductive load-balancing member 30 share the pressure of the crimping assembly 40 together, avoiding the direct contact between the multiple crimping members and the multiple chips 20, and reducing the probability that the chip 20 may be damaged under the action of pressure. When there is a difference in the pressure of the multiple crimping members, in the prior art, the chip that is in contact with the crimping member with the greatest pressure is subjected to the greatest pressure and is easily damaged. In the present application, by providing an equalizing plate 31, and multiple crimping parts abutting against the equalizing plate 31, the pressure of all crimping parts is dispersed through the equalizing plate, so that the pressure on each chip 20 is more uniform, and the maximum pressure on a single chip 20 is much smaller than that in the prior art, thereby reducing the probability of damage to the chip 20 subjected to the maximum pressure. Therefore, the technical solution of this embodiment effectively solves the problem in the related art that the chip is subjected to a large pressure and has a high probability of being damaged.

[0048] The power module unit of this embodiment is applied to a silicon carbide power module unit.

[0049] It should be noted that the crimping part includes a disc spring and a conductor, the conductor includes a first conductive column and a second conductive column, the diameter of the first conductive column is greater than the diameter of the second conductive column, the second conductive column is inserted into the disc spring, the first end of the disc spring abuts against the side of the second conductive column facing the second conductive plate 50, the second end of the disc spring abuts against the side of the second conductive plate 50 facing the first conductive plate 10, the first end of the second conductive column is connected to one end of the first conductive column facing the second conductive plate 50, and the second end of the second conductive column is connected to the second conductive plate 50. The first conductive plate 10 is a collector conductive plate, and the material of the collector conductive plate is molybdenum. The second conductive plate 50 is an emitter conductive plate, and the material of the emitter conductive plate is copper.

[0050] like Figure 1 and Figure 2 As shown, in this embodiment, the load balancing board 31 is connected to the conductive part 311, each conductive part 311 is a convex part 3111, and each convex part 3111 is arranged on the side of the load balancing board 31 facing the first conductive plate 10. The multiple convex parts 3111 can connect the multiple chips 20 and the load balancing board 31, and the load balancing board 31 is connected to the multiple convex parts 3111, so that the current can flow between the load balancing board 31 and the multiple convex parts 3111, thereby allowing the conductive load balancing member 30 to pass a larger current.

[0051] It should be noted that the number of the protrusions 3111 is equal to the number of the crimping parts, and the plurality of crimping parts are arranged in a one-to-one correspondence with the plurality of chips 20 , and each crimping part is located directly above each chip 20 .

[0052] like Figures 5 to 7 As shown, in this embodiment, the load-balancing plate 31 has at least one connecting recess 312, and a connecting recess 312 is arranged between any two adjacent protrusions 3111. The surface of the connecting recess 312 facing the first conductive plate 10 is an arc surface 3121, and the middle part of the arc surface 3121 protrudes in a direction away from the first conductive plate 10. A plurality of connecting recesses 312 can be connected to a plurality of protrusions 3111, so that the structural strength of the load-balancing plate 31 is better. The middle part of the arc surface 3121 protrudes in a direction away from the first conductive plate 10, so that the distance between the arc surface 3121 and the first conductive plate 10 can be increased, so as to avoid the short distance between the arc surface 3121 and the first conductive plate 10, which leads to direct conduction between the load-balancing plate 31 and the first conductive plate 10, thereby causing damage to the power module.

[0053] like Figure 2 , Figure 5 as well as Figure 6 As shown, in this embodiment, the load balancing plate 31, the plurality of conductive parts 311 and the at least one connecting recess 312 are an integrally formed structure. The above arrangement facilitates the processing and manufacturing of the conductive load balancing member 30 and also improves the structural strength of the conductive load balancing member 30.

[0054] It should be noted that the plurality of protrusions 3111 and the plurality of connecting recesses 312 form an arch bridge structure, so that the conductive load-balancing member 30 can withstand greater pressure.

[0055] like Figures 5 to 7 As shown, in this embodiment, the plurality of convex portions 3111 include a first convex portion 31111 and a second convex portion 31112, and the plurality of connecting concave portions 312 include a first concave portion 3122, which is disposed between the first convex portion 31111 and the second convex portion 31112. The first concave portion 3122 can connect the first convex portion 31111 and the second convex portion 31112.

[0056] like Figures 5 to 7 As shown, in this embodiment, the plurality of convex portions 3111 further include a third convex portion 31113, and the plurality of connecting concave portions 312 further include a second concave portion 3123, which is disposed between the second convex portion 31112 and the third convex portion 31113. The second concave portion 3123 can connect the second convex portion 31112 and the third convex portion 31113.

[0057] Of course, in other embodiments, the second recess 3123 may also be disposed between the first protrusion 31111 and the third protrusion 31113 .

[0058] like Figures 5 to 7 As shown, in this embodiment, the plurality of convex portions 3111 further include a fourth convex portion 31114, the first convex portion 31111, the second convex portion 31112 and the third convex portion 31113 are arranged in sequence along the first direction, the fourth convex portion 31114 and the second convex portion 31112 are arranged along the second direction, the first direction and the second direction are perpendicular, and the plurality of connecting recesses 312 further include a third recess 3124 disposed between the second convex portion 31112 and the fourth convex portion 31114, the third recess 3124 is connected to both the first recess 3122 and the second recess 3123. The first recess 3122 can connect the first convex portion 31111 and the second convex portion 31112, the second recess 3123 can connect the second convex portion 31112 and the third convex portion 31113, and the third recess 3124 can connect the second convex portion 31112 and the fourth convex portion 31114. The third recess 3124 is connected to the first recess 3122 and the second recess 3123, so that the connection among the first protrusion 31111, the second protrusion 31112, the third protrusion 31113, the fourth protrusion 31114 and the equalizing plate 31 is more stable, thereby improving the structural strength of the conductive equalizing member 30.

[0059] The plurality of protrusions also include a fifth protrusion 31115, a sixth protrusion 31116 and a seventh protrusion 31117. The first protrusion 31111, the second protrusion 31112, the third protrusion 31113, the fifth protrusion 31115 and the sixth protrusion 31116 are arranged in sequence along the first direction. The fifth protrusion 31115 and the seventh protrusion 31117 are arranged along the second direction. The plurality of connecting recesses 312 include a fourth recess 3125 arranged between the third protrusion 31113 and the fifth protrusion 31115, a fifth recess 3126 arranged between the fifth protrusion 31115 and the sixth protrusion 31116, and a sixth recess 3127 arranged between the fifth protrusion 31115 and the seventh protrusion 31117. The sixth recess 3127 is connected to both the fourth recess 3125 and the fifth recess 3126. The fourth recess 3125 can connect the third protrusion 31113 and the fifth protrusion 31115, the fifth recess 3126 can connect the fifth protrusion 31115 and the sixth protrusion 31116, and the sixth recess 3127 can connect the fifth protrusion 31115 and the seventh protrusion 31117. The sixth recess 3127 is connected to the fifth recess 3126 and the fourth recess 3125, so that the connection between the third protrusion 31113, the fifth protrusion 31115, the sixth protrusion 31116, the seventh protrusion 31117 and the equalizing plate 31 is more stable, thereby making the structural strength of the conductive equalizing member 30 better.

[0060] The plurality of convex portions further include an eighth convex portion 31118, a ninth convex portion 31119, and a tenth convex portion 311110, which are arranged in sequence along the first direction, and the ninth convex portion 31119 and the fourth convex portion 31114 are arranged along the second direction. The plurality of connecting recesses 312 include a seventh recess 3128 disposed between the eighth convex portion 31118 and the ninth convex portion 31119, an eighth recess 3129 disposed between the ninth convex portion 31119 and the tenth convex portion 311110, and a ninth recess 31210 disposed between the ninth convex portion 31119 and the fourth convex portion 31114. The ninth recess 31210 is connected to both the seventh recess 3128 and the eighth recess 3129. The seventh recess 3128 can connect the eighth protrusion 31118 and the ninth protrusion 31119, the eighth recess 3129 can connect the ninth protrusion 31119 and the tenth protrusion 311110, and the ninth recess 31210 can connect the ninth protrusion 31119 and the fourth protrusion 31114. The ninth recess 31210 is connected to both the seventh recess 3128 and the eighth recess 3129, so that the connection between the fourth protrusion 31114, the eighth protrusion 31118, the ninth protrusion 31119, the tenth protrusion 311110 and the equalizing plate 31 is more stable, thereby making the structural strength of the conductive equalizing member 30 better.

[0061] The plurality of convex portions further include an eleventh convex portion 311111 and a twelfth convex portion 311112, the eighth convex portion 31118, the ninth convex portion 31119, the tenth convex portion 311110, the eleventh convex portion 311111 and the twelfth convex portion 311112 are arranged in sequence along the first direction, and the eleventh convex portion 311111 and the seventh convex portion 31117 are arranged along the second direction. The plurality of connecting recesses 312 include a tenth recess 31211 disposed between the tenth convex portion 311110 and the eleventh convex portion 311111, an eleventh recess 31212 disposed between the eleventh convex portion 311111 and the twelfth convex portion 311112, and a twelfth recess 31213 disposed between the eleventh convex portion 311111 and the seventh convex portion 31117. The twelfth recess 31213 is connected to both the tenth recess 31211 and the eleventh recess 31212. The tenth recess 31211 can connect the tenth convex portion 311110 and the eleventh convex portion 311111, the eleventh recess 31212 can connect the eleventh convex portion 311111 and the twelfth convex portion 311112, and the twelfth recess 31213 can connect the eleventh convex portion 311111 and the seventh convex portion 31117.

[0062] The second convex portion 31112, the fourth convex portion 31114 and the ninth convex portion 31119 are sequentially arranged along the second direction. The fifth convex portion 31115, the seventh convex portion 31117 and the eleventh convex portion 311111 are sequentially arranged along the second direction.

[0063] The diameter of the arc surface of the first concave portion 3122, the diameter of the arc surface of the fifth concave portion 3126, the diameter of the arc surface of the seventh concave portion 3128, and the diameter of the arc surface of the eleventh concave portion 31212 are all the first diameter. The diameter of the arc surface of the second concave portion 3123, the diameter of the arc surface of the fourth concave portion 3125, the diameter of the arc surface of the eighth concave portion 3129, and the diameter of the arc surface of the tenth concave portion 31211 are all the second diameter. The diameter of the arc surface of the third concave portion 3124, the diameter of the arc surface of the sixth concave portion 3127, the diameter of the arc surface of the ninth concave portion 31210, and the diameter of the arc surface of the twelfth concave portion 31213 are all the third diameter. The third diameter is greater than the first diameter, and the first diameter is greater than the second diameter.

[0064] Part of the multiple chips 20 of this embodiment are silicon carbide MOSFET chips, and the other part are silicon carbide SBDs, which refer to silicon carbide barrier Schottky diodes. The first conductive plate 10 is connected to the drain of the silicon carbide MOSFET chip. The second conductive plate 50 is connected to the source of the silicon carbide MOSFET chip. The silicon carbide SBD is anti-parallel to the silicon carbide MOSFET chip, and plays a role of reverse freewheeling in the shutdown phase of the silicon carbide MOSFET chip. In addition, the silicon carbide SBD diode has a smaller body diode voltage drop than the silicon carbide MOSFET, which also reduces the switching loss of the power module unit.

[0065] A silicon carbide MOSFET chip is connected to each of the first protrusion 31111, the second protrusion 31112, the fourth protrusion 31114, the fifth protrusion 31115, the sixth protrusion 31116, the seventh protrusion 31117, the eighth protrusion 31118, the ninth protrusion 31119, the eleventh protrusion 311111 and the twelfth protrusion 311112, and a silicon carbide SBD is connected to each of the third protrusion 31113 and the tenth protrusion 311110.

[0066] like Figure 6 As shown, in this embodiment, the size of the third recess 3124 in the first direction is greater than the size of the fourth convex portion 31114 in the first direction, and the partial structure of the third recess 3124 protruding from the fourth convex portion 31114 in the first direction is respectively connected to the first recess 3122 and the second recess 3123. Through the above arrangement, the third recess 3124 can connect the second convex portion 31112 and the fourth convex portion 31114, and because the partial structure of the third recess 3124 protruding from the fourth convex portion 31114 in the first direction is respectively connected to the first recess 3122 and the second recess 3123, the connection between the fourth convex portion 31114 and the first convex portion 31111, the second convex portion 31112 and the third convex portion 31113 is more stable.

[0067] The size of the sixth recess 3127 in the first direction is greater than the size of the seventh protrusion 31117 in the first direction, and the partial structure of the sixth recess 3127 protruding from the seventh protrusion 31117 in the first direction is respectively connected to the fourth recess 3125 and the fifth recess 3126. Through the above arrangement, the sixth recess 3127 can connect the fifth protrusion 31115 and the seventh protrusion 31117, and because the partial structure of the sixth recess 3127 protruding from the seventh protrusion 31117 in the first direction is respectively connected to the fourth recess 3125 and the fifth recess 3126, the connection between the seventh protrusion 31117 and the third protrusion 31113, the fifth protrusion 31115 and the sixth protrusion 31116 is more stable.

[0068] The size of the ninth recess 31210 in the first direction is greater than the size of the fourth protrusion 31114 in the first direction, and the partial structure of the ninth recess 31210 protruding from the fourth protrusion 31114 in the first direction is respectively connected to the seventh recess 3128 and the eighth recess 3129. Through the above arrangement, the ninth recess 31210 can not only connect the ninth protrusion 31119 with the fourth protrusion 31114, but also because the partial structure of the ninth recess 31210 protruding from the fourth protrusion 31114 in the first direction is respectively connected to the seventh recess 3128 and the eighth recess 3129, the connection between the fourth protrusion 31114 and the eighth protrusion 31118, the ninth protrusion 31119 and the tenth protrusion 311110 is more stable.

[0069] The dimension of the twelfth recess 31213 in the first direction is greater than the dimension of the seventh protrusion 31117 in the first direction, and the partial structure of the twelfth recess 31213 protruding from the seventh protrusion 31117 in the first direction is respectively connected to the tenth recess 31211 and the eleventh recess 31212. Through the above arrangement, the twelfth recess 31213 can not only connect the eleventh protrusion 311111 and the seventh protrusion 31117, but also because the partial structure of the twelfth recess 31213 protruding from the seventh protrusion 31117 in the first direction is respectively connected to the tenth recess 31211 and the eleventh recess 31212, the connection between the seventh protrusion 31117 and the tenth protrusion 311110, the eleventh protrusion 311111 and the twelfth protrusion 311112 is more stable.

[0070] like Figure 6 As shown, in this embodiment, the size of the equalizing plate 31 in the first direction is greater than the size of the equalizing plate 31 in the second direction. This allows the equalizing plate 31 to be provided with more protrusions 3111 in the first direction, which is convenient for connecting with multiple chips 20 and arranging the crimping assembly 40.

[0071] like Figure 7 As shown, in this embodiment, there is a preset distance between the joint of the arc surface 3121 and the convex portion 3111 and the surface of the convex portion 3111 facing the first conductive plate 10. The above arrangement makes the distance between the arc surface 3121 and the first conductive plate 10 larger, avoiding direct conduction between the connecting concave portion 312 and the first conductive plate 10.

[0072] It should be noted that if Fig. 9 As shown, the value of the preset distance is a, and a is greater than the thickness of the chip 20. This arrangement increases the insulation distance between the junction of the arc surface 3121 and the convex portion 3111 and the chip 20, reduces the electric field strength between the arc surface 3121, the chip 20 and the first conductive plate 10, and avoids the occurrence of local discharge or even breakdown.

[0073] When current flows, it flows through the first conductive plate 10, multiple chips 20, the conductive equalizing component 30, the crimping assembly 40 and the second conductive plate 50 in sequence, that is, the conductive equalizing component 30 is the low-voltage side of the power module unit, and the first conductive plate 10 is the high-voltage side of the power module unit.

[0074] like Figure 3 , Figure 4 as well as Figure 6 As shown, in this embodiment, the conductive load-balancing member 30 further includes a first notch portion 32 disposed on the load-balancing plate 31, and the power module unit further includes a third conductive plate 60 disposed on the first conductive plate 10, the third conductive plate 60 is insulated from the first conductive plate 10, the third conductive plate 60 is located in the first notch portion 32, and the gates of the plurality of chips 20 disposed adjacent to the first notch portion 32 are all conductively connected to the third conductive plate 60. The first notch portion 32 can avoid the third conductive plate 60, so as to facilitate the connection between the third conductive plate 60 and the gates of the plurality of chips 20 disposed adjacent to the first notch portion 32.

[0075] It should be noted that the gate of each chip 20 disposed adjacent to the first notch 32 is connected to the third conductive plate 60 through a bonding wire. A first insulating plate is disposed between the third conductive plate 60 and the first conductive plate 10, and an elastic adjustment member is disposed on the third conductive plate 60. The elastic adjustment member has the same structure as the crimping member except for the second conductive column, and the arrangement is the same as the crimping member. A third conductive column is also disposed at the second end of the second conductive column of the elastic adjustment member.

[0076] like Figure 4 and Figure 6 As shown, in this embodiment, the conductive load-balancing member 30 further includes a second notch portion 33 disposed on the load-balancing plate 31, the second notch portion 33 is spaced apart from the first notch portion 32, the power module unit further includes a fourth conductive plate 70 disposed on the first conductive plate 10, the fourth conductive plate 70 is insulated from the first conductive plate 10, the fourth conductive plate 70 is located in the second notch portion 33, and the gates of the plurality of chips 20 disposed adjacent to the second notch portion 33 are all conductively connected to the fourth conductive plate 70. The second notch portion 33 can avoid the fourth conductive plate 70, so as to facilitate the connection between the fourth conductive plate 70 and the gates of the plurality of chips 20 disposed adjacent to the second notch portion 33.

[0077] It should be noted that the gate of each chip 20 disposed adjacent to the second notch 33 is connected to the fourth conductive plate 70 via a bonding wire. A second insulating plate is disposed between the fourth conductive plate 70 and the first conductive plate 10, and an elastic adjusting member is also disposed on the fourth conductive plate 70.

[0078] like Figure 6As shown, in this embodiment, the conductive load-balancing member 30 further includes a hollow portion 34 disposed in the middle of the load-balancing plate 31, and the first notch portion 32 and the second notch portion 33 are respectively disposed at two opposite ends of the load-balancing plate 31. By providing the hollow portion 34, the distance between the protrusions 3111 disposed adjacent to the hollow portion 34 is increased, so that the multiple protrusions 3111 are prevented from being directly connected when in use, and the distance between the load-balancing plate 31 and the first conductive plate 10 is prevented from being directly connected to each other due to a small distance between the load-balancing plate 31 and the first conductive plate 10. The first notch portion 32 and the second notch portion 33 are respectively disposed at two opposite ends of the load-balancing plate 31, and the hollow portion 34 is disposed in the middle of the load-balancing plate 31, so that the positions of the first notch portion 32, the hollow portion 34 and the second notch portion 33 are more reasonable, so that some of the multiple chips 20 are connected to the third conductive plate 60 and some of the multiple chips 20 are connected to the fourth conductive plate 70.

[0079] The convex portions 3111 disposed adjacent to the hollow portion 34 , in which the distance between the convex portions 3111 disposed adjacent to the hollow portion 34 is greater, refer to the third convex portion 31113 , the fourth convex portion 31114 , the seventh convex portion 31117 and the tenth convex portion 311110 .

[0080] In other embodiments, the convex portion 3111 also includes a thirteenth convex portion, a fourteenth convex portion, a fifteenth convex portion, and a sixteenth convex portion. The thirteenth convex portion is arranged between the second convex portion 31112 and the third convex portion 31113, the fourteenth convex portion is arranged between the third convex portion 31113 and the fifth convex portion 31115, the fifteenth convex portion is arranged between the ninth convex portion 31119 and the tenth convex portion 311110, and the sixteenth convex portion is arranged between the tenth convex portion 311110 and the eleventh convex portion 311111. A silicon carbide MOSFET chip is connected to each of the thirteenth convex portion, the fourteenth convex portion, the fifteenth convex portion, and the sixteenth convex portion. The power module unit also includes a fifth conductive plate arranged on the first conductive plate 10, the fifth conductive plate is insulated from the first conductive plate 10, and is located in the hollow portion 34. The gates of the silicon carbide MOSFET chips connected to the thirteenth convex portion, the fourteenth convex portion, the fifteenth convex portion, and the sixteenth convex portion are all connected to the fifth conductive plate.

[0081] like Figure 3As shown, in this embodiment, the load-balancing plate 31 includes a first plate segment 313, a second plate segment 314, a third plate segment 315 and a fourth plate segment 316. The third plate segment 315 and the fourth plate segment 316 are arranged at intervals in the first direction, the first plate segment 313 and the second plate segment 314 are arranged at intervals in the second direction, the third plate segment 315 is connected between the first plate segment 313 and the second plate segment 314, and the fourth plate segment 316 is connected between the first plate segment 313 and the second plate segment 314. The first direction and the second direction are arranged vertically. Through the above arrangement, the third plate segment 315 can connect the first plate segment 313 and the second plate segment 314, and the fourth plate segment 316 can connect the first plate segment 313 and the second plate segment 314, so that the connection between the first plate segment 313 and the second plate segment 314 is more stable, and the structural strength of the load-balancing plate 31 is better, so that when the load-balancing plate 31 abuts against the crimping assembly 40, the load-balancing plate 31 can have a stronger load-bearing capacity.

[0082] In other embodiments, a plurality of third protrusions 31113 may be provided, and a silicon carbide SBD is connected to each third protrusion 31113. The plurality of third protrusions 31113 are arranged on the first plate segment 313 at intervals along the first direction. Among the plurality of third protrusions 31113, two third protrusions 31113 farthest from the middle of the load-balancing plate 31 are connected to the second protrusion 31112, and the other is connected to the fifth protrusion 31115.

[0083] There can be multiple tenth protrusions 311110, and the multiple tenth protrusions 311110 are arranged at intervals along the first direction on the second plate segment 314. Among the multiple tenth protrusions 311110 arranged on the second plate segment 314, two tenth protrusions 311110 farthest from the middle of the load-balancing plate 31 are connected to the ninth protrusion 31119, and the other is connected to the eleventh protrusion 311111.

[0084] like Figure 6 As shown, in this embodiment, the length of the first plate segment 313 is greater than the length of the third plate segment 315, the first notch portion 32 is arranged between the first plate segment 313, the second plate segment 314 and the third plate segment 315, the first notch portion 32 is located on the side of the third plate segment 315 away from the fourth plate segment 316, the second notch portion 33 is arranged between the first plate segment 313, the second plate segment 314 and the fourth plate segment 316, the second notch portion 33 is located on the side of the fourth plate segment 316 away from the first plate segment 313, and the hollow portion 34 is arranged between the first plate segment 313, the second plate segment 314, the third plate segment 315 and the fourth plate segment 316. Through the above arrangement, the position arrangement of the first notch portion 32, the hollow portion 34 and the second notch portion 33 is more reasonable. The length of the first plate segment 313 is greater than the length of the third plate segment 315, and more convex portions 3111 can be arranged on the first plate segment 313, which is convenient for connecting with multiple chips 20.

[0085] It should be noted that the length of the first plate segment 313 is equal to the length of the second plate segment 314. The length of the fourth plate segment 316 is equal to the length of the third plate segment 315. The length of the first plate segment 313 refers to the distance between the two side walls of the first plate segment 313 in the first direction, the length of the second plate segment 314 refers to the distance between the two side walls of the second plate segment 314 in the second direction, the length of the third plate segment 315 refers to the distance between the two side walls of the third plate segment 315 in the second direction, and the length of the fourth plate segment 316 refers to the distance between the two side walls of the fourth plate segment 316 in the first direction.

[0086] The first convex portion 31111, the second convex portion 31112, the third convex portion 31113, the fifth convex portion 31115 and the sixth convex portion 31116 are sequentially arranged on the first plate section 313 along the first direction. The eighth convex portion 31118, the ninth convex portion 31119, the tenth convex portion 311110, the eleventh convex portion 311111 and the twelfth convex portion 311112 are sequentially arranged on the second plate section 314 along the first direction. The first convex portion 31111, the first notch portion 32 and the eighth convex portion 31118 are sequentially arranged along the second direction. The sixth convex portion 31116, the second notch portion 33 and the twelfth convex portion 311112 are sequentially arranged along the second direction. The fourth convex portion 31114, the hollow portion and the seventh convex portion 31117 are sequentially arranged along the first direction.

[0087] like Figure 8 As shown, in the direction from the first conductive plate 10 to the second conductive plate 50, the distance between the two side surfaces of the conductive equalizing member 30 in the second direction gradually increases, so that the side of the conductive equalizing member 30 away from the first conductive plate 10 has a larger area, which is convenient for abutting with the crimping assembly 40 and also makes the structural strength of the conductive equalizing member 30 better.

[0088] One of the two side surfaces of the conductive load-balancing component 30 in the second direction is composed of a side of the first plate segment 313 away from the second plate segment 314, a side of the first protrusion 31111 away from the second plate segment 314, a side of the second protrusion 31112 away from the second plate segment 314, a side of the third protrusion 31113 away from the second plate segment 314, a side of the fifth protrusion 31115 away from the second plate segment 314, a side of the sixth protrusion 31116 away from the second plate segment 314, a side of the first recess 3122 away from the second plate segment 314, a side of the second recess 3123 away from the second plate segment 314, a side of the fourth recess 3125 away from the second plate segment 314, and a side of the fifth recess 3126 away from the second plate segment 314. One side is composed of, and the other side is composed of a side of the second plate segment 314 away from the first plate segment 313, a side of the eighth protrusion 31118 away from the first plate segment 313, a side of the ninth protrusion 31119 away from the first plate segment 313, a side of the tenth protrusion 311110 away from the first plate segment 313, a side of the eleventh protrusion 311111 away from the first plate segment 313, a side of the twelfth protrusion 311112 away from the first plate segment 313, a side of the seventh recess 3128 away from the first plate segment 313, a side of the eighth recess 3129 away from the first plate segment 313, a side of the tenth recess 31211 away from the first plate segment 313 and a side of the eleventh recess 31212 away from the first plate segment 313.

[0089] like Figure 3 , Figure 5 as well as Figure 6 As shown, in this embodiment, the cross section of the first notch portion 32 is rectangular, the cross section of the second notch portion 33 is rectangular, and the cross section of the hollow portion 34 is circular. The cross section of the first notch portion 32 is rectangular, so that the distance between the end adjacent to the first plate segment 313 and the first notch portion 32 and the end adjacent to the second plate segment 314 and the second notch portion 33 is large, avoiding direct conduction between the end adjacent to the first plate segment 313 and the first notch portion 32 and the end adjacent to the second plate segment 314 and the second notch portion 33, which affects the use of the power module unit.

[0090] like Figures 1 to 3 As shown, in this embodiment, the conductive load balancing member 30 is connected to the plurality of chips 20 by a welding process or a sintering process. The conductive load balancing member 30 can be connected to the plurality of chips 20 by a welding process or a sintering process.

[0091] It should be noted that since the side of the equalizing plate 31 away from the chip 20 is a plane, and the surface where the protrusion 3111 contacts the chip 20 is a plane, it is possible to use a sintering process to connect the chip 20 to the first conductive plate 10, and to use a sintering process to connect the conductive equalizing member 30 to the side of multiple chips 20 away from the first conductive plate 10.

[0092] When the chip 20 is connected to the first conductive plate 10 through a welding process, the power module unit further includes a plurality of welding pieces, and the plurality of welding pieces are arranged in one-to-one correspondence with the plurality of chips 20 , and each welding piece is arranged between the chip 20 and the first conductive plate 10 .

[0093] The distance between the two side walls of the third protrusion 31113 in the first direction is greater than the distance between the two side walls of the first protrusion 31111 in the first direction, and is also greater than the distance between the two side walls of the second protrusion 31112 in the first direction. Such a setting can make the third protrusion 31113 have a stronger bearing capacity and a larger abutment area with the chip 20.

[0094] like Fig. 9 As shown, the minimum distance between the arc surface of the first recess 3122 and the side of the load-balancing plate 31 away from the first conductive plate 10 is c.

[0095] like Fig.10 As shown, the thickness of the conductive carrier is e.

[0096] like Fig.10 As shown, the minimum distance between the arc surface of the second recess 3123 and the side of the load-balancing plate 31 away from the first conductive plate 10 is b.

[0097] like Figure 8 As shown, the minimum distance between the arc surface of the third recess 3124 and the side of the load balancing plate 31 away from the first conductive plate 10 is d.

[0098] The value of c is between 1.5 and 1.8 mm. Such a setting can ensure that the first recess 3122 has a better bearing capacity.

[0099] The value of e is between 4 and 4.3 mm. Such a setting can ensure that the conductive load-bearing component 30 has a better load-bearing capacity.

[0100] The ratio of the value of c to the value of e is between 0.3 and 0.5. Such a setting can ensure that the conductive equalizing load-bearing component 30 has a better load-bearing capacity, and can also ensure the spacing between the top of the arc surface and the first conductive plate 10, so as to achieve insulation between the conductive equalizing load-bearing component 30 and the first conductive plate 10, and avoid direct conduction between the conductive equalizing load-bearing component 30 and the first conductive plate 10, that is, avoid current flowing directly between the conductive equalizing load-bearing component 30 and the first conductive plate 10 without passing through the chip 20.

[0101] The values ​​of c, b and d are equal. Such a setting can facilitate the processing and manufacturing of the conductive load-balancing component and also enable the pressure of the crimping assembly 40 to be better dispersed to the conductive load-balancing component 30, ensuring that the chip is subjected to uniform force.

[0102] like Fig.11 and Fig.12As shown, the power module unit further includes a housing 80 , and the crimping assembly 40 is disposed in the housing 80 .

[0103] like Fig.13 and Fig.14 As shown, the power module of this embodiment includes a plurality of power module units arranged at intervals, and the power module unit is the above-mentioned power module unit. The above-mentioned power module unit is provided with a conductive load-balancing member 30, which can disperse the pressure of the crimping assembly 40 to a plurality of chips 20, and the conductive load-balancing member 30 can share the pressure of the crimping assembly 40 with the plurality of chips 20, thereby reducing the probability of damage to the chip 20 during use. The silicon carbide probability module having the above-mentioned power module unit also has the above-mentioned advantages.

[0104] The power module of this embodiment is applied to a silicon carbide power module.

[0105] It should be noted that the power module further includes a tube shell 100 , and a plurality of power module units are arranged in the shell. The power module further includes a control board 110 , and the control board is connected to the gates of the plurality of chips 20 .

[0106] The control board 110 is a PCB board. A plurality of connection convex plates are arranged on the PCB board. The end of the elastic adjustment member away from the first conductive plate 10 is lower than the side of the second conductive plate 50 away from the first conductive plate, that is, the end of the third conductive column away from the first conductive plate 10 is lower than the side of the second conductive plate 50 away from the first conductive plate. The plurality of connection convex plates are connected to the end of the elastic adjustment member away from the first conductive plate 10.

[0107] The power module further includes a base plate 120 , and a plurality of second conductive plates 50 are disposed on the base plate 120 at intervals.

[0108] like Fig.14 As shown, the power module further includes a plurality of buffer pads 130 , and the plurality of buffer pads 130 are disposed between the plurality of housings 80 and the plurality of tube cases 100 .

[0109] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the devices or elements referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention. The directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0110] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" may include both "above" and "below". The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used herein are interpreted accordingly.

[0111] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the present invention.

[0112] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A power module unit, characterized in that: include: A first conductive plate (10); a plurality of chips (20), wherein the plurality of chips (20) are arranged at intervals on the first conductive plate (10); A conductive equalizing member (30), the conductive equalizing member (30) being arranged on a side of the plurality of chips (20) away from the first conductive plate (10), the conductive equalizing member (30) comprising an equalizing plate (31), the equalizing plate (31) being provided with a plurality of conductive parts (311) connected to the plurality of chips (20) in a one-to-one correspondence; A crimping assembly (40), the crimping assembly (40) being arranged on a side of the conductive load-balancing member (30) away from the plurality of chips (20), the crimping assembly (40) comprising a plurality of crimping members, the plurality of crimping members all being in abutment with the load-balancing plate (31); A second conductive plate (50) is arranged on a side of the crimping assembly (40) away from the conductive load-balancing member (30); The equalizing plate (31) is arranged to be in conduction with the conductive part (311), each of the conductive parts (311) is a convex part (3111), and each of the convex parts (3111) is arranged on a side of the equalizing plate (31) facing the first conductive plate (10); The load-balancing plate (31) has at least one connecting recess (312), one connecting recess (312) being provided between any two adjacent protrusions (3111), the surface of the connecting recess (312) facing the first conductive plate (10) being an arc surface (3121), the middle portion of the arc surface (3121) protruding in a direction away from the first conductive plate (10).

2. The power module unit according to claim 1, characterized in that: The equalizing plate (31), the plurality of conductive parts (311) and at least one connecting recess (312) are an integrally formed structure.

3. The power module unit according to claim 1, characterized in that: The plurality of protrusions (3111) include a first protrusion (31111) and a second protrusion (31112), and the plurality of connecting recesses (312) include a first recess (3122), wherein the first recess (3122) is arranged between the first protrusion (31111) and the second protrusion (31112).

4. The power module unit according to claim 3, characterized in that: The plurality of protrusions (3111) further include a third protrusion (31113), and the plurality of connecting recesses (312) further include a second recess (3123), wherein the second recess (3123) is arranged between the second protrusion (31112) and the third protrusion (31113), or the second recess (3123) is arranged between the first protrusion (31111) and the third protrusion (31113).

5. The power module unit according to claim 4, characterized in that: The plurality of protrusions (3111) further include a fourth protrusion (31114), the first protrusion (31111), the second protrusion (31112) and the third protrusion (31113) are arranged in sequence along a first direction, the fourth protrusion (31114) and the second protrusion (31112) are arranged along a second direction, and the plurality of connecting recesses (312) further include a third recess (3124) arranged between the second protrusion (31112) and the fourth protrusion (31114), and the third recess (3124) is connected to the first recess (3122) and / or the second recess (3123).

6. The power module unit according to claim 5, characterized in that: The size of the third recess (3124) in the first direction is greater than the size of the fourth protrusion (31114) in the first direction, and the partial structure of the third recess (3124) protruding from the fourth protrusion (31114) in the first direction is respectively connected to the first recess (3122) and the second recess (3123).

7. The power module unit according to claim 1, characterized in that: There is a preset distance between the junction of the arc surface (3121) and the convex portion (3111) and the surface of the convex portion (3111) facing the first conductive plate (10).

8. The power module unit according to claim 1, characterized in that: The conductive equalizing member (30) further comprises a first notch portion (32) arranged on the equalizing plate (31); the power module unit further comprises a third conductive plate (60) arranged on the first conductive plate (10); the third conductive plate (60) is insulated from the first conductive plate (10); the third conductive plate (60) is located in the first notch portion (32); and the gates of a plurality of chips (20) arranged adjacent to the first notch portion (32) are all conductively connected to the third conductive plate (60).

9. The power module unit according to claim 8, characterized in that: The conductive equalizing member (30) further comprises a second notch portion (33) arranged on the equalizing plate (31), the second notch portion (33) being spaced apart from the first notch portion (32); the power module unit further comprises a fourth conductive plate (70) arranged on the first conductive plate (10), the fourth conductive plate (70) being insulated from the first conductive plate (10), the fourth conductive plate (70) being located in the second notch portion (33), and the gates of the plurality of chips (20) arranged adjacent to the second notch portion (33) are all conductively connected to the fourth conductive plate (70).

10. The power module unit according to claim 9, characterized in that: The conductive load-balancing member (30) further comprises a hollow portion (34) arranged in the middle of the load-balancing plate (31), and the first notch portion (32) and the second notch portion (33) are respectively arranged on two opposite ends of the load-balancing plate (31).

11. The power module unit according to claim 10, characterized in that: The load-balancing plate (31) comprises a first plate segment (313), a second plate segment (314), a third plate segment (315) and a fourth plate segment (316); the third plate segment (315) and the fourth plate segment (316) are arranged at intervals in a first direction; the first plate segment (313) and the second plate segment (314) are arranged at intervals in a second direction; the third plate segment (315) is connected between the first plate segment (313) and the second plate segment (314); the fourth plate segment (316) is connected between the first plate segment (313) and the second plate segment (314); and the first direction and the second direction are arranged perpendicularly.

12. The power module unit according to claim 11, characterized in that: The length of the first plate segment (313) is greater than the length of the third plate segment (315); the first notch portion (32) is arranged between the first plate segment (313), the second plate segment (314) and the third plate segment (315); the first notch portion (32) is located on a side of the third plate segment (315) away from the fourth plate segment (316); the second notch portion (33) is arranged between the first plate segment (313), the second plate segment (314) and the fourth plate segment (316); the second notch portion (33) is located on a side of the fourth plate segment (316) away from the first plate segment (313); and the hollow portion (34) is arranged between the first plate segment (313), the second plate segment (314), the third plate segment (315) and the fourth plate segment (316).

13. The power module unit according to any one of claims 1 to 12, characterized in that: The conductive load-balancing component (30) is connected to the plurality of chips (20) through a welding process or a sintering process.

14. A power module, comprising a plurality of power module units arranged at intervals, characterized in that: The power module unit is the power module unit according to any one of claims 1 to 13.

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