Power module and device

Abstract

The power module comprises a packaging body, a power chip, a control chip, a power pin and a control pin, wherein the power chip and the control chip are positioned in the packaging body; and the power pin and the control pin are respectively led out from a first side surface and a second side surface which are oppositely arranged of the packaging body. The power chip is electrically connected with the control chip, the power pin is electrically connected with the power chip, and the control pin is electrically connected with the control chip. The packaging body comprises a flow guide part located at at least one corner of the packaging body, and the flow guide part is configured to achieve a resin flow guide effect so as to prevent the packaging body from generating a gap at the corner.

Description

Power modules and devices

[0001] This application claims priority to Chinese patent application No. 202211458029.5 filed on November 17, 2022, Chinese patent application No. 202211442180.X filed on November 17, 2022, and Chinese patent application No. 202223090111.5 filed on November 17, 2022, all of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the technical field of electronic devices, and in particular to a power module and a device. Background Art

[0003] Power modules (PMs) feature high current density, low saturation voltage, low drive power, high switching frequency, high functional integration, ease of use, and excellent reliability. They are widely used in consumer electronics, home appliances, automobiles, rail transportation, industrial equipment, new energy, smart grids, and many other fields. Typically, power modules use resin to encapsulate the power chip and control chip to achieve high integration.

[0004] Summary of the Invention

[0005] In one aspect, a power module is provided. The power module includes a package, a power chip and a control chip disposed within the package, power pins extending from a first side surface of the package, and control pins extending from a second side surface of the package. The power chip is electrically connected to the control chip, the power pins are electrically connected to the power chip, and the control pins are electrically connected to the control chip. The first side surface and the second side surface are disposed opposite each other. The package includes a guide portion located at at least one corner thereof, configured to guide resin flow to prevent gaps in the package at the corner.

[0006] On the other hand, a device is provided, including a controller and the power module provided in the above embodiment, wherein the power module is connected to the controller. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] FIG1A is a schematic structural diagram of a transfer molding method used to encapsulate the main structure of a power module in the related art;

[0008] FIG1B is a perspective view of a power module of the related art;

[0009] FIG2 is a perspective view of a power module according to some embodiments;

[0010] FIG3 is a perspective view of a power module according to some embodiments;

[0011] FIG4 is a perspective view of a power module according to some embodiments;

[0012] FIG5 is a perspective view of a power module according to some embodiments;

[0013] FIG6 is a top view of a power module according to some embodiments;

[0014] FIG7 is a top view of a power module according to some embodiments;

[0015] FIG8 is a bottom view of a power module according to some embodiments;

[0016] FIG9 is a top view of a power module according to some embodiments;

[0017] FIG10 is a partial enlarged view of the power module shown in FIG9 ;

[0018] FIG11A is a schematic structural diagram of encapsulating the main structure of a power module by using a transfer molding method according to some embodiments;

[0019] FIG11B is a schematic cross-sectional view of a power module along a width direction according to some embodiments;

[0020] FIG11C is a schematic cross-sectional view of a power module along a width direction according to some embodiments;

[0021] FIG11D is a schematic cross-sectional view of a power module along a width direction according to some embodiments;

[0022] FIG11E is a schematic cross-sectional view of a power module along a width direction according to some embodiments;

[0023] FIG12 is a side view of a power module according to some embodiments;

[0024] FIG13 is a cross-sectional view of a power module according to some embodiments;

[0025] FIG14 is a partial enlarged view of D1 of the power module in FIG13 ;

[0026] FIG15 is a partial enlarged view of D2 of the power module in FIG13 ;

[0027] FIG16 is a partial enlarged view of a portion D3 of the power module in FIG13 ;

[0028] FIG17 is a top view of a power module according to some embodiments;

[0029] FIG18 is a partial enlarged view of position A1 of the power module in FIG17 ;

[0030] FIG19 is a cross-sectional view of a power module according to some embodiments;

[0031] FIG20 is a partial enlarged view of position B1 of the power module in FIG19 ;

[0032] FIG21 is a partial enlarged view of position B1 of the power module in FIG19 ;

[0033] FIG22 is a schematic diagram of the structure of a device according to some embodiments. DETAILED DESCRIPTION

[0034] The following will be combined with the accompanying drawings to clearly and completely describe some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0035] In the following, the terms "first," "second," etc. are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the quantity of the technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include one or more of the features.

[0036] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0037] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thicknesses of layers and regions are exaggerated for clarity. The exemplary embodiments disclosed herein should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0038] In the related art, transfer molding is usually used to encapsulate a power module (PM). As shown in FIG1A , the main structure of the power module, such as a power chip, a control chip, a heat dissipation substrate, and a pin frame (including a power pin 40 ' and a control pin 50 '), is placed in the cavity of a mold 101 '. Then, liquid encapsulation resin is injected into the cavity through a resin injection port A' on the mold. After the encapsulation resin is cured, the mold 101 ' is disassembled to obtain the power module 100 ' shown in FIG1B .

[0039] As shown in Figure 1A, the mold comprises an upper shell and a lower shell, which snap together to form an internal cavity. The power and control pins extend from the snap-fit ​​point between the upper and lower shells. A resin injection port A' is typically located on the side of the mold 101' where the power pins 40' extend, near the snap-fit ​​point between the upper and lower shells. Therefore, during resin injection, the liquid encapsulating resin flows from the resin injection port to the sides and forward, for example, from the side where the power pins 40' extend toward the opposite side where the control pins 50' extend, gradually filling the cavity.

[0040] However, at the corners of the mold cavity (corresponding to the corners of the resulting package 10', as indicated by the dotted circle in Figure 1B), the liquid encapsulating resin is blocked by the cavity sidewalls, hindering its continued flow and causing it to stagnate and accumulate. The liquid encapsulating resin is easily mixed with air at these stagnant and accumulated areas, resulting in resin voids. This results in voids in the resulting package 10'. For the resulting power module 100', the presence of voids reduces the insulation withstand voltage and insulation reliability, thereby reducing the electrical safety of the power module.

[0041] Based on this, embodiments of the present disclosure provide a power module. As shown in Figures 11B to 11E , the main structure of the power module 100 includes a power chip 20, a control chip 30, power pins 40 electrically connected to the power chip 20, and control pins 50 electrically connected to the control chip 30. The power pins 40 are used to connect the power chip 20 to external drive components, and the control pins 50 are used to connect the control chip 30 to an external controller. The power chip 20 is also electrically connected to the control chip 30, and the control chip 30 is used to drive the power chip 20.

[0042] As shown in Figures 2 to 9 and 11B to 11E , the power module 100 further includes a package body 10 for encapsulating the main structure. The package body 10 has a first side surface 10A and a second side surface 10B that are oppositely disposed and extend along the package body's length direction X. A portion of the power pin 40 (hereinafter referred to as the first portion) extends from the first side surface 10A of the package body 10, while another portion (hereinafter referred to as the second portion) is located within the package body 10 and electrically connected to the power chip 20. A portion of the control pin 50 (hereinafter referred to as the first portion) extends from the second side surface 10B of the package body 10, while another portion (hereinafter referred to as the second portion) is located within the package body 10 and electrically connected to the control chip 30.

[0043] As shown in FIG. 2 to FIG. 9 , there are multiple power pins 40 and multiple control pins 50 , and the length direction X of the package is the direction in which the multiple power pins 40 or the multiple control pins 50 are arranged.

[0044] In the disclosed embodiment, transfer molding is used to encapsulate the main structure of the power module 100 to form a package 10. Specifically, the main structure of the power module 100 is placed in a mold cavity. The mold is provided with a resin injection port (for example, the resin injection port is located on the side of the mold where the power pins 40 are led out). Liquid resin is injected into the mold cavity through the resin injection port and fills the space between the main structure of the power module located in the cavity and the cavity wall. After the resin solidifies, the package 10 shown in FIG2 is formed. The package 10 provides cover and protection for the power chip 20 and the control chip 30, thereby improving the structural reliability of the power module 100.

[0045] As shown in FIG. 2 to FIG. 9 , the package body 10 includes a guide portion 103 located at at least one corner thereof, which is configured to guide the resin to avoid a gap in the package body 10 at the corner.

[0046] Here, the corner refers to the position where two adjacent side surfaces of the package body 10 with an angle are connected, for example, the position where the first side surface 10A of the package body and a side surface adjacent to the first side surface 10A and having an angle (for example, the third side surface or the fourth side surface described below) are connected, or the position where the second side surface 10B of the package body and a side surface adjacent to the second side surface 10B and having an angle (for example, the third side surface or the fourth side surface described below) are connected.

[0047] It is understood that the shape of the cavity wall of the mold should match the outer shape of the package 10 of the power module 100 of the embodiment of the present disclosure. In other words, the mold cavity should have a cavity wall structure corresponding to the outer shape of the package 10.

[0048] For example, a portion of the package 10 corresponding to the resin injection port of the mold is called a resin injection portion 11 of the package 10 (as shown in FIG. 2 ). The roughness of the resin injection portion 11 is greater than that of other portions of the package 10 .

[0049] As can be seen from the above, the mold cavity wall has a cavity wall guide structure at its corner, corresponding to the guide portion 103 included in the package 10. When the resin flows to this cavity wall guide structure, the cavity wall guide structure located at the cavity corner can generate a component of force to guide the resin to the opposite side, thereby improving the fluidity of the resin at this location and guiding the resin to continue flowing, thereby preventing the resin from stagnating and accumulating at the corner. This makes it less likely that the resin will be mixed with air at this location and produce resin void defects, thereby preventing the formation of voids at the corners of the formed package 10, and ensuring the insulation and electrical safety of the power module 100.

[0050] Furthermore, in the power module 100 provided in the embodiment of the present disclosure, the insulation and electrical safety of the power module 100 are ensured by providing the guide portion 103 at the corner of the package body 10 , without requiring additional manufacturing equipment, and thus at low cost.

[0051] In the embodiment of the present disclosure, there can be one or more guide portions 103. For example, the guide portion 103 can be provided at a corner on one side of the power lead pin 40 of the package body 10. In this way, when the resin is injected, the cavity wall guide structure corresponding to the corner in the cavity can exert a force on the resin toward the opposite side to make the resin flow toward the opposite side, thereby reducing the stagnation and accumulation of the resin at the corner. Similarly, the guide portion 103 can also be provided at a corner on one side of the control lead pin 50 of the package body 10. The resin flowing to the corner in the cavity can flow toward the middle of the side, thereby reducing the stagnation and accumulation of the resin at the corner.

[0052] It is understandable that corresponding cavity wall guide structures can also be set at other corners in the cavity that can affect the flow of resin, so that the package body 10 forms a corresponding guide part 103 to improve the fluidity of the resin here, avoid stagnation and accumulation of resin, reduce the defects of resin gaps, and ensure the electrical safety of the power module.

[0053] In some embodiments, the package body 10 includes a guide portion located at the corner of the end of the first side surface 10A of the package body 10 along the length direction X of the package body (hereinafter referred to as the first guide portion, in Figures 2 to 4 and Figures 6 to 9, the first guide portion is represented by 1031).

[0054] Here, the corner refers to a position where the first side surface 10A of the package 10 is connected to the adjacent side surface (the third side surface 10C or the fourth side surface 10D described below).

[0055] For example, there can be one first guide portion 1031. The first guide portion 1031 can be provided at a corner of one end of the first side surface 10A of the package body 10 along the longitudinal direction X of the package body, that is, at the corner where the first side surface 10A and the fourth side surface 10D are connected. Alternatively, the first guide portion 1031 can be provided at a corner of the other end of the first side surface 10A of the package body 10 along the longitudinal direction X of the package body, that is, at the corner where the first side surface 10A and the third side surface 10C (that is, the other side surface adjacent to the first side surface 10A except the fourth side surface 10D) are connected.

[0056] As another example, as shown in Figures 2 to 4 and Figures 6 to 9, there may be two first guide portions 1031, which are respectively arranged at the corners of the two ends of the first side surface 10A of the package body 10 along the length direction X of the package body, that is, respectively arranged at the corner where the first side surface 10A is connected to the fourth side surface 10D and the corner where the first side surface 10A is connected to the third side surface 10C.

[0057] In this way, when injecting resin, the cavity wall guide structure corresponding to the first guide part 1031 in the cavity can generate a component force to guide the resin to the opposite side, so as to improve the fluidity of the resin here and guide the resin to flow forward, thereby reducing the stagnation and accumulation of resin at the position corresponding to the corner in the cavity, and reducing the generation of resin gaps, thereby ensuring the electrical safety of the power module.

[0058] In some examples, as shown in Figures 2 to 4 and 6 to 9, the first guide portion 1031 may be chamfered. Here, the chamfer may be understood as a surface connecting the first side surface 10A and the third side surface 10C (or the fourth side surface 10D) by cutting off a sharp edge, and forming a surface at a certain angle to both the first side surface 10A and the third side surface 10C (or the fourth side surface 10D).

[0059] For example, the resin injection port is located on the side where the power pin of the mold is led out (i.e., the side corresponding to the first side 10A of the package body 10), and resin is injected into the cavity through the resin injection port. When the resin flows to the position corresponding to the first guide portion 1031 in the cavity, as shown in Figure 9, the cavity wall guide structure corresponding to the chamfer in the cavity will generate a component force Fy obliquely toward the opposite side (e.g., the second side 10B) for the resin at this location, thereby allowing the resin flowing to the corner in the cavity to flow forward, avoiding stagnation and accumulation at the corner, and reducing the generation of resin gaps.

[0060] As can be seen from the above, the chamfer angle can affect the diversion effect of the diversion portion. For example, as shown in Figure 10, the chamfer angle θ can meet 50°≤θ≤70°. This ensures a high diversion capacity of the chamfer while saving raw materials. For example, the chamfer angle θ can be 50°, 60°, or 70°, etc., and this is not limited in the embodiments of the present disclosure.

[0061] For example, as shown in FIG10 , the chamfered side length L can be greater than 1.2 mm to further improve the chamfered flow conductivity. For example, the chamfered side length L can be 1.2 mm, 1.4 mm, or 1.6 mm, etc., and the present disclosure does not impose any restrictions on this. As shown in FIG10 , the chamfered side length L can be 1.4 mm.

[0062] Since the first air guide 1031 is disposed at the corner between the first side surface 10A and the third side surface 10C (or the fourth side surface 10D), and is typically installed in the middle of the width of the power module when used in a power module, it is understood that the side length L of the chamfer will not exceed 0.5 times the dimension of the third side surface 10C (or the fourth side surface 10D) along the width direction Y of the package body 10.

[0063] It should be noted that, in the embodiment of the present disclosure, the direction from the first side surface 10A to the second side surface 10B of the package is referred to as the width direction Y of the package, and the width direction of the power module is consistent with the width direction Y of the package.

[0064] Similarly, in other examples, the first guide portion 1031 can also be a convex portion, for example, an arc surface protruding toward the outside of the package body 10, which can also achieve the effect of guiding the resin at the corner where the first guide portion 1031 of the package body 10 is located in the cavity forward, avoiding stagnation and accumulation of resin at the corner, reducing the generation of resin gaps, and improving the electrical safety of the power module.

[0065] Of course, the shape of the first air guide portion 1031 is not limited thereto, and the embodiment of the present disclosure does not impose any limitation thereto.

[0066] In some embodiments, as shown in FIG. 2 to FIG. 4 and FIG. 6 to FIG. 9 , the package body 10 further includes a guide portion (hereinafter referred to as a second guide portion 1032 ) at a corner of the end portion of the second side surface 10B along the length direction X of the package body.

[0067] Here, the corner refers to a position where the second side surface 10B of the package 10 is connected to an adjacent side surface (hereinafter referred to as a third side surface 10C or a fourth side surface 10D).

[0068] For example, there may be one or two second guide portions 1032. For example, the second guide portion 1032 may be disposed at a corner of at least one end of the second side surface 10B of the package body 10 along the length direction X of the package body. In other words, the second guide portion 1032 may be disposed at a corner where the second side surface 10B and the fourth side surface 10D meet, and / or at a corner where the second side surface 10B and the third side surface 10C meet.

[0069] In this way, when the injected resin flows to the corner in the cavity corresponding to the second guide portion 1032, the cavity wall guide structure corresponding to the second guide portion 1032 in the cavity can generate an oblique middle component force (the component force Fx as shown in Figure 9) for the resin flowing toward this location, so as to guide the resin flowing toward this position to flow toward the middle of the cavity, thereby reducing the stagnation and accumulation of resin at this corner, reducing the generation of resin gaps, and ensuring the electrical safety of the power module.

[0070] In some examples, the second air guide portion 1032 may be a chamfer, a convex portion, or a concave portion.

[0071] For example, as shown in Figures 2, 3, 6 and 9, the second guide portion 1032 is chamfered. The angle and side length of the chamfer can be referred to the above description of the first guide portion 1031, which will not be repeated here.

[0072] For another example, the second guide portion 1032 may also be a convex portion, such as an arc surface that bulges outward of the package body (not shown in the figure).

[0073] As another example, as shown in Figures 4, 7, and 8, the second guide portion 1032 is a recessed portion. Similarly, the cavity wall guide structure corresponding to the recessed portion can squeeze the resin flowing to the corner, causing the resin to flow toward the center of the cavity. This prevents resin stagnation and accumulation at the corner, thereby reducing the formation of resin voids and saving raw materials.

[0074] In some embodiments, when the second guide portion 1032 is a recess, the second guide portion 1032 can be a single recess, such as the second guide portion 1032 located at the corner of the second side surface 10B and the fourth side surface 10D in Figures 7 and 8; the second guide portion 1032 can also be two continuous recesses, for example, a first recess 10321 and a second recess 10322, such as the second guide portion 1032 located at the corner of the second side surface 10B and the third side surface 10C in Figures 7 and 8.

[0075] In some embodiments, as shown in Figures 3 to 7 and 11B to 11E , the package 10 further includes a recessed first step 12. As shown in Figures 11B to 11E , the first step 12 is located on a side of the first portion 401 of the power pin 40 extending outward from the package 10 that is close to the bottom surface 10E of the package.

[0076] Here, the recessed first step portion 12 means that the first step portion 12 is recessed toward the interior of the package body 10. That is, as shown in Figures 11B to 11E , the first step portion 12 has a step surface 12A and a side surface 12B. Along the width direction Y of the package body 10, the side surface 12B of the first step portion 12 is closer to the center of the package body 10 than the first side surface 10A of the package body 10; and along the thickness direction Z of the package body 10, the step surface 12A of the first step portion 12 is closer to the center of the package body 10 than the bottom surface 10E of the package body.

[0077] Here, the center of the package 10 may be understood as the physical center of gravity of the package.

[0078] In the power module 100 provided in some embodiments of the present disclosure, as shown in Figures 11B to 11D , the main structure of the power module 100 further includes a heat dissipation substrate 60. The power chip 20 is disposed on the heat dissipation substrate 60, which is used to dissipate heat from the power chip 20 to ensure normal operation of the power chip 20. The bottom surface of the heat dissipation substrate can be flush with the bottom surface 10E of the package body and exposed outside the package body 10 to improve the heat dissipation effect. In this case, the bottom surface 10E of the package body 10 serves as the heat dissipation surface of the power module 100.

[0079] It should be noted that, as shown in Figures 11B to 11D, a surface of the package 10 on which the heat dissipation substrate 60 is provided is called the bottom surface 10E of the package 10, a surface of the package 10 opposite to its bottom surface 10E is called the top surface 10F of the package, and the direction from the bottom surface 10E of the package to the top surface 10F is called the thickness direction Z of the package.

[0080] 11B , along the thickness direction Z of the package, a distance H1 from the step surface 12A of the first step portion 12 to the bottom surface 10E of the package is smaller than a distance H0 from the resin injection portion 11 to the bottom surface 10E of the package.

[0081] It can be understood that in some embodiments of the present disclosure, the package body includes a first step portion 12, as shown in Figure 11A, and the cavity 1011 of the mold 101 for forming the package body 10 shown in Figure 11B has a first cavity wall step 1012 corresponding to the first step portion 12, and the first cavity wall step 1012 is located on the side of the resin injection port A close to the bottom of the mold, that is, the distance H11 from the step surface of the first cavity wall step 1012 to the bottom surface of the cavity is less than the distance H01 from the resin injection port A to the bottom surface of the cavity.

[0082] In this way, when the resin is injected into the mold cavity through the resin injection port, the resin can first fall onto the first cavity wall step 1012. The first cavity wall step 1012 has a certain buffering effect on it, reducing the height of the resin rushing toward the heat dissipation substrate 60, and reducing the oblique downward impact force of the resin on the heat dissipation substrate 60, so that the resin can flow toward the heat dissipation substrate 60 as smoothly as possible, thereby alleviating the problem of displacement defects of the heat dissipation substrate 60 and improving the electrical safety and stability of the power module.

[0083] Furthermore, by providing the first cavity wall step 1012, the space between the heat dissipation substrate 60 and the side of the corresponding power pin 40 of the cavity (i.e., the space between the heat dissipation substrate 60 and the first cavity wall step 1012) is reduced, thereby reducing the amount of resin accumulation in the space when injecting resin, and also reducing the risk of resin overflowing from the bottom surface of the heat dissipation substrate 60 and generating burrs.

[0084] In some examples, as shown in FIG11B , a distance H1 from a stepped surface 12A of the first stepped portion 12 to the bottom surface 10E of the package body is less than a distance H2 from a top surface 20A of the power chip 20 (i.e., a surface away from the bottom surface 10E of the package body) to the bottom surface 10E of the package body 10. Correspondingly, as shown in FIG11A , a distance H11 from a stepped surface of a cavity wall step 1012 provided in the mold cavity to the bottom surface of the cavity is less than a distance from a top surface 20A of the power chip 20 to the bottom surface of the cavity.

[0085] In this way, when the resin is injected into the mold cavity through the resin injection port A, the resin flows to the heat dissipation substrate 60 and the power chip 20 through the cavity wall step 1012. At this time, the resin tends to flow gently toward the heat dissipation substrate 60 in the horizontal direction, greatly reducing the impact force of the resin on the heat dissipation substrate 60, thereby further reducing the displacement defects caused by the impact force of the resin on the heat dissipation substrate 60.

[0086] Moreover, when the distance H1 from the step surface 12A of the first step portion 12 to the bottom surface 10E of the package body 10 is smaller, the space between the heat dissipation substrate 60 and the side surface of the corresponding power pin of the cavity is also smaller, which can further reduce the amount of resin accumulated in the space, thereby further reducing the risk of resin overflowing from the bottom surface of the heat dissipation substrate 60 and generating burrs.

[0087] In some embodiments, as shown in Figures 3 to 7 , the first step portion 12 includes a main portion 121 extending along the length direction X of the package body 10 and at least one end portion 122 extending along the width direction Y of the package body 10. For example, there may be one end portion 122, located on one side of the main portion 121 along the length direction X of the package body 10. For another example, there may be two end portions 122, one located on each side of the main portion 121 along the length direction X of the package body 10.

[0088] In this case, the first step portion 12 further includes a third guide portion 1033 connecting the main portion 121 and the end portion 122 of the first step portion 12 .

[0089] It can be understood that the third guide portion 1033 is located at a corner of the first step portion 12 to prevent the resin from stagnation and accumulation when it flows to a position corresponding to the corner in the cavity.

[0090] For example, when the first step portion 12 includes only one end portion 122, the first step portion 12 includes only one third guide portion 1033. For another example, when the first step portion 12 includes two end portions 122, the first step portion 12 may include two third guide portions 1033, with one third guide portion 1033 connecting one end portion 122 and the main body 121.

[0091] It is understandable that when the first step portion 12 includes the third guide portion 1033 , the first cavity wall step corresponding to the first step portion in the mold cavity forming the package body 10 also has a cavity wall guide structure corresponding to the third guide portion 1033 .

[0092] In this way, when the resin is injected into the mold cavity, when the resin flows to the corner in the mold cavity corresponding to the third guide part 1033, the cavity wall guide structure in the mold cavity corresponding to the third guide part 1033 can generate a component force to guide the resin to the opposite side, so as to improve the fluidity of the resin here and guide the resin to flow forward, thereby avoiding stagnation of the resin here, thereby further reducing the generation of resin voids.

[0093] In some examples, as shown in Figures 3, 4, 6 and 7, the third guide portion 1033 can be a chamfer; in other examples, the third guide portion 1033 can be a convex portion; for example, as shown in Figure 5, the third guide portion 1033 is an arc surface protruding toward the outside of the package body 10.

[0094] Here, regarding the specific configuration of the third guide portion 1033 and the effects it can produce, please refer to the above description of the first guide portion 1031, which will not be repeated here.

[0095] In some embodiments, as shown in Figures 3 to 7 and 11B to 11E , the package body 10 further includes a recessed second step portion 13. As shown in Figures 11B to 11E , the second step portion 13 is located on a side of the first portion 501 of the control pin 50 extending outward from the package body 10 that is close to the bottom surface 10E of the package body.

[0096] Here, similar to the recessed first step portion 12, the recessed second step portion 13 means that the second step portion 13 is recessed toward the interior of the package body 10. That is, the second step portion 13 has a step surface 13A and a side surface 13B. Along the width direction Y of the package body 10, the side surface 13B of the second step portion 13 is closer to the center of the package body 10 than the second side surface 10B of the package body 10; and along the thickness direction Z of the package body 10, the step surface 13A of the second step portion 13 is closer to the center of the package body 10 than the bottom surface 10E of the package body.

[0097] In some embodiments of the present disclosure, a second step 13 is provided on a side of the first portion 501 of the control pin 50 extending outward from the package body 10, close to the bottom surface 10E of the package body 10. Accordingly, as shown in FIG11A , the cavity 1011 of the mold 101 has a second cavity wall step 1013 corresponding to the second step 13 of the package body 10. Thus, the provision of the second cavity wall step 1013 can reduce the space between the heat dissipation substrate 60 and the side of the cavity corresponding to the control pin 50 (i.e., the space between the heat dissipation substrate 60 and the second cavity wall step 1013), thereby reducing the amount of resin accumulated in this space and further reducing the risk of resin overflowing from the bottom surface of the heat dissipation substrate 60 and generating burrs.

[0098] In some examples, along the thickness direction Z of the package body 10, a distance H13 from the step surface 13A of the second step portion 13 to the bottom surface 10E of the package body is approximately equal to a distance H1 from the step surface 12A of the first step portion 12 to the bottom surface 10E of the package body 10. Furthermore, as shown in FIG11C , along the width direction Y of the package body 10, a distance D2 from the side surface 13B of the second step portion 13 to the second side surface 10B of the package body 10 is also approximately equal to a distance D1 from the side surface 12B of the first step portion 12 to the first side surface 10A of the package body 10. In other words, the second step portion 13 and the first step portion 12 are approximately symmetrically arranged along the width direction Y of the package body 10.

[0099] Such an arrangement not only simplifies the manufacturing process, but also allows the resin to more easily fill the space between the heat dissipation substrate 60 and the side of the cavity corresponding to the control pin 50, thereby avoiding the defect of resin gaps in the space.

[0100] In some embodiments, as shown in Figures 8 and 11B to 11E, the package body 10 further includes a recessed third step portion 14. As shown in Figures 11B to 11E, the third step portion 14 is located on a side of the first portion 501 of the control pin 50 extending toward the outside of the package body 10 away from the bottom surface 10E of the package body.

[0101] Here, similar to the recessed first step portion 12, the recessed third step portion 14 means that the third step portion 14 is recessed toward the interior of the package body 10. That is, the third step portion 14 has a step surface 14A and a side surface 14B; along the width direction Y of the package body, the side surface 14B of the third step portion 14 is closer to the center of the package body 10 than the second side surface 10B of the package body; and along the thickness direction Z of the package body, the step surface 14A of the third step portion 14 is closer to the center of the package body 10 than the top surface 10F of the package body.

[0102] It should be noted that the surface of the package 10 that is perpendicular to the thickness direction Z and on which the heat dissipation substrate 60 is not provided is referred to as the top surface 10F of the package 10 .

[0103] Since the side of the cavity where the control pin 50 is provided is far away from the resin injection port, by respectively providing a second step portion 13 and a third step portion 14 on both sides of the first portion 501 of the package body 10 extending outward from the package body 10 and located at the control pin 50, the mold flow speed of the resin on the side of the cavity where the control pin 50 is provided can be adjusted when injecting the resin, so that the mold flow speed in the entire cavity is more balanced and the generation of gaps is avoided; and the resin injection time can also be accelerated.

[0104] In some examples, as shown in Figure 11B, the distance H14 from the step surface 14A of the third step portion 14 to the top surface 10F of the package body is smaller than the distance H13 from the step surface 13A of the second step portion 13 to the bottom surface 10E of the package body and / or the distance H1 from the step surface 12A of the first step portion 12 to the bottom surface 10E of the package body.

[0105] In this way, under the premise of ensuring that the resin can completely submerge the control chip 30, the mold flow speed of the resin on one side of the control pin in the cavity can be further adjusted to make the mold flow speed in the entire cavity more balanced and avoid the generation of gaps.

[0106] In some embodiments, as shown in Figures 3 to 8 , the package body 10 includes a second step 13 and / or a third step 14 with a guide portion at a corner. These guide portions are configured to guide the resin flow and prevent it from stagnating and accumulating at the corners within the mold cavity. For example, a fourth guide portion 1034 is provided at a corner of the second step 13. For another example, a fifth guide portion 1035 is provided at a corner of the third step 14.

[0107] For example, as shown in FIG. 6 , the second step portion 13 includes a main body 131 extending along the length direction X of the package body 10 and at least one end 132 extending along the width direction Y of the package body 10 , and the fourth guide portion 1034 is connected between the main body 131 and the end 132 .

[0108] For another example, as shown in FIG8 , the third step portion 14 includes a main body 141 extending along the length direction X of the package body 10 and at least one end 142 extending along the width direction Y of the package body 10 , and the fifth guide portion 1035 is connected between the main body 141 and the end 142 .

[0109] In some embodiments, the fourth guide portion 1034 and / or the fifth guide portion 1035 may be chamfered or convex. Regarding the specific shapes and effects of the fourth guide portion 1034 and the fifth guide portion 1035, reference may be made to the above description of the second guide portion 1032 and will not be repeated here.

[0110] In the power modules provided in some embodiments of the present disclosure, the main structure of the power module may adopt various structural layouts, which are not specifically limited here.

[0111] For example, the main structure of the power module 100 employs a layout employing a direct bond copper (DBC) ceramic substrate. As shown in FIG11B , the heat dissipation substrate 60 included in the main structure of the power module 100 is a double-sided copper-clad ceramic board (also referred to as a DBC ceramic board) in an integrated structure, comprising a ceramic board 61 and a copper layer 62 and another copper layer 63 located on either side. The power chip 20 can be disposed on the copper layer 62 of the double-sided copper-clad ceramic board; for example, the power pins 40 are directly soldered to the copper layer 62 of the double-sided copper-clad ceramic board, with the copper layer 62 serving as a power chip pad for supporting the power chip 20. The other copper layer 63 of the double-sided copper-clad ceramic board is flush with the bottom surface 10E of the package 10 and is exposed outside the package 10. In other words, the surface of the other copper layer 63 of the double-sided copper-clad ceramic board, away from the ceramic board 61, is flush with the bottom surface 10E of the package 10 and is exposed outside the package 10. In this embodiment, the DBC ceramic substrate can achieve both electrical connection and thermal conductivity for the power chip 20. A control chip pad is provided on the second portion 502 of the control pin 50 located within the package 10 (i.e., on the side away from the bottom surface 10E of the package), and the control chip is mounted on the control chip pad.

[0112] For another example, the main structure of the power module 100 adopts a layout that simultaneously provides a DBC structure and a printed circuit board (PCB). As shown in Figure 11C, the heat dissipation substrate 60 included in the main structure of the power module 100 is a DBC ceramic substrate. Its structure is the same as the DBC ceramic substrate shown in Figure 11B and will not be repeated here. In this case, the power module 100 also includes a PCB encapsulated within the package body 10, which can serve as a control chip pad for mounting the control chip 30. That is, the control chip 30 is mounted on the printed circuit board (PCB); the control pins 50 can be soldered to the printed circuit board PCB.

[0113] For another example, the main structure of the power module 100 adopts a layout with a heat sink. As shown in FIG11D , the heat sink substrate 60 included in the main structure of the power module 100 includes a heat sink copper sheet 64 and an insulating layer 65 located thereon. The second portion 42 of the power pin located in the package body can extend to the heat sink substrate 60. A power chip pad (not shown in the figure) is provided on the second portion 42 of the power pin located in the package body (i.e., the side away from the heat sink substrate 60), and the power chip 20 can be mounted on the power chip pad. A control chip pad is provided on the second portion 502 of the control pin 50 located in the package body 10 (i.e., the side away from the bottom surface 10E of the package body), and the control chip 30 is mounted on the control chip pad.

[0114] For another example, the main structure of the power module 100 adopts a full-frame layout. As shown in Figure 11E, the second portion 42 of the power pins within the package body can serve as a first copper frame, on which the power chip 20 can be mounted. That is, the second portion 42 of the power pins within the package body can serve as a power chip pad for mounting the power chip 20. The second portion 502 of the control pins 50 within the package body 10 can serve as a second copper frame, on which the control chip 30 can be mounted. That is, the second portion 502 of the control pins 50 within the package body 10 can serve as a control chip pad for mounting the control chip 30.

[0115] In some embodiments of the present disclosure, a mold for forming the package 10 using transfer molding may have multiple resin injection ports, which may be spaced apart on one side of the mold from which the multiple power pins 40 are led. For example, along the length of the mold (i.e., the length direction X of the package), each resin injection port may be located between two power pins 40. Accordingly, in some embodiments, the package 10 may have multiple resin injection portions 11, which may be spaced apart on the first side surface 10A of the package.

[0116] 12 , the package body 10 has two resin injection portions 11, such as a first resin injection portion 1021 and a second resin injection portion 1022. Along the length direction X of the package body 10, the first resin injection portion 1021 and the second resin injection portion 1022 are evenly located on the first side surface 10A of the package body 10. That is, along the length direction X of the package body 10, a distance H101 between the first resin injection portion 1021 and its closest corner, a distance H102 between the first resin injection portion 1021 and the second resin injection portion 1022, and a distance H103 between the second resin injection portion 1022 and its closest corner are approximately equal.

[0117] In this way, when injecting resin, the resin can flow more evenly to the left and right sides and the middle of the cavity, which is beneficial to the uniformity of resin filling in the cavity and can also achieve the effect of reducing resin voids.

[0118] In the power module 100 provided in the embodiment of the present disclosure, the control chip 30 is used to drive and control the power chip 20. It is generally used to receive control signals from the outside or instructions from a microprocessor and convert these instructions into signals suitable for driving the power chip.

[0119] In some embodiments, as shown in Figure 13, the main structure of the power module 100 also includes a control chip pad 300 for carrying the control chip 30. The control chip pad 300 can provide a stable and reliable installation position for the control chip 30, and can ensure that the control chip 30 works stably in the power module 100.

[0120] The main structure of the power module 100 also includes a bootstrap chip 90 and a bootstrap chip pad 900 for mounting the bootstrap chip 90. The bootstrap chip 90 is connected to an external power source and can be used, for example, to boost the power voltage provided by the external power source. For example, the bootstrap chip 90 is electrically connected to a pin (referred to as the third functional pin in the following embodiments to distinguish between different pins) 53 via a wire 391. This pin can function as a high-voltage pin.

[0121] The bootstrap chip pad 900 and the control chip pad 300 are spaced apart, that is, a gap is set between the bootstrap chip pad 900 and the control chip pad 300 so that there is no electrical connection between the two, thereby ensuring that the bootstrap chip 90 and the control chip 30 both have independent and reliable installation positions, thereby ensuring the normal operation of the power module 100.

[0122] For example, the bootstrap chip pad 900 and the control chip pad 300 may be spaced apart from each other along the width direction of the power module 100 .

[0123] It should be noted that the width direction of the power module 100 is consistent with the width direction Y of the package, and the length direction of the power module 100 is also consistent with the length direction X of the package.

[0124] The bootstrap chip pad 900 includes a separator 901 that separates the bootstrap chip pad 900 into two parts: a chip bonding portion 902 and a wire connection portion 903. The chip bonding portion 902 is used to mount the bootstrap chip 90, and the wire connection portion 903 is used to electrically connect the bootstrap chip pad 900 to the control chip 30 via a wire 39, thereby achieving circuit connectivity in the power module 100.

[0125] A separator 901 is provided on the bootstrap chip pad 900. On the premise of ensuring that the bootstrap chip pad 900 provides a stable and reliable installation position for the bootstrap chip 90 and provides a stable and reliable connection position for the wire 39, the chip welding portion 902 and the wire connection portion 903 on the bootstrap chip pad 900 can also be separated.

[0126] When soldering the bootstrap chip 90 to the chip bonding portion 902, the solder used for soldering may flow out of the chip bonding portion 902 and spread. In this case, the separator 31 can receive the flowing solder. This prevents the solder from flowing to the wire connecting portion 903 and contacting the wire 39, causing a wire short circuit. This improves the operating safety and stability of the power module 100 when soldering the bootstrap chip 90.

[0127] In some embodiments, as shown in FIG. 14 to FIG. 16 , the partition 901 is a strip-shaped groove.

[0128] The separator 901 primarily serves to separate the chip bonding portion 902 and the wire connection portion 903 on the bootstrap chip pad 900. By configuring the separator 901 as a strip-shaped groove, the length of the separator 901 on the bootstrap chip pad 900 can be extended. This not only ensures that the separator 901 completely separates the chip bonding portion 902 and the wire connection portion 903, effectively preventing solder from flowing toward the wire connection portion 903 during soldering of the bootstrap chip 90, but also increases the solder holding capacity of the separator 901, allowing the separator 901 to receive as much solder as possible. This effectively ensures that the wire 39 connecting the bootstrap chip pad 90 and the control chip 30 is properly connected at the wire connection portion 903 during soldering of the bootstrap chip 90, thereby improving the circuit stability of the power module 100.

[0129] In some embodiments, as shown in Figures 13 to 16, the control chip pad 300 and the bootstrap chip pad 900 are spaced apart along the width direction of the power module 100, and the separator 901 extends along the width direction of the power module 100 to separate the bootstrap chip pad 900 into a chip welding portion 902 and a wire connection portion 903 in the length direction of the power module 100.

[0130] In these embodiments, the control chip pad 300 and the bootstrap chip pad 900 are spaced apart along the width direction of the power module 100. This not only optimizes the structural arrangement of the control chip pad 300 and the bootstrap chip pad 900 in the power module 100, but also facilitates the routing and connection of the wire 39 for connecting the control chip pad 300 and the control chip 30 in the power module 100.

[0131] In addition, the partition 901 extends along the width direction of the power module 100, which can ensure that the partition 901 can effectively receive the overflow solder while shortening the processing length of the partition 901 on the bootstrap chip pad 900, thereby shortening the processing time of the partition 901 and effectively improving the production efficiency of the power module 100.

[0132] At the same time, the partition 901 extends in the width direction of the power module 100, and can separate the bootstrap chip pad 900 into a chip bonding portion 902 and a wire connection portion 903 in the length direction of the power module 100. This facilitates the positioning of the chip bonding portion 902 and the wire connection portion 903 on the bootstrap chip pad 900, so that the chip bonding portion 902 facilitates the bonding operation of the bootstrap chip 90, and the wire connection portion 903 facilitates the connection operation of the wire 39, thereby increasing the installation convenience of the power module 100.

[0133] In some embodiments, as shown in FIG13 , there are multiple bootstrap chip pads 900 , each of which is provided with a bootstrap chip 90. This not only allows the number of bootstrap chips 90 in the power module 100 to meet the operating requirements of the electronic device in which the power module 100 is used, but also ensures that each bootstrap chip 90 has a stable and independent installation space in the power module 100, thereby ensuring the installation convenience and operating reliability of the bootstrap chip 90 in the power module 100.

[0134] As shown in FIG13 , a plurality of bootstrap chip pads 900 are spaced apart along the length of the power module 100. Furthermore, along the length of the power module 100, a bootstrap chip pad 900 located at at least one end of the plurality of bootstrap chip pads 900 includes a wire connection portion 903 that is closer to the control chip 30 than a chip bonding portion 902 included therein.

[0135] In this way, it can be ensured that when multiple bootstrap chips 90 are installed on the power module 100 at the same time, the width of the bootstrap chip pad 900 (i.e., the size along the width direction of the power module 100) is prevented from increasing, thereby improving the structural compactness of the power module 100 and improving the space utilization of the power module 100.

[0136] Moreover, when the bootstrap chip pad 900 and the control chip pad 300 are spaced apart along the width direction of the power module 100, the wire 39 can be conveniently connected to the wire connection portion 903 of the control chip 30 and the bootstrap chip pad 900 to ensure the circuit connectivity of the power module 100 and enable the power module 100 to operate normally.

[0137] In some examples, as shown in FIG. 13 to FIG. 16 , the plurality of bootstrap chip pads 900 include a first bootstrap chip pad 9001 , a second bootstrap chip pad 9002 , and a third bootstrap chip pad 9003 spaced apart along the length direction of the power module 100 .

[0138] The second bootstrap chip pad 9002 is located between the first bootstrap chip pad 9001 and the third bootstrap chip pad 9003. The wire connection parts 903 of the first bootstrap chip pad 9001 and the third bootstrap chip pad 9003 are both set close to the second bootstrap chip pad 9002, and the wire connection part 903 of the second bootstrap chip pad 9002 is set close to the first bootstrap chip pad 9001 or the third bootstrap chip pad 9003.

[0139] For example, the first bootstrap chip pad 9001 is located at one end of the plurality of bootstrap chip pads 900 along the length direction of the power module 100, and the wire connection portion 903 included therein is closer to the control chip 30 than the chip bonding portion 902 included therein. Similarly, the third bootstrap chip pad 9003 is located at the other end of the plurality of bootstrap chip pads 900 along the length direction of the power module 100, and the wire connection portion 903 included therein is also closer to the control chip 30 than the chip bonding portion 902 included therein.

[0140] Such a configuration can shorten the length of the wires 39 connecting each bootstrap chip pad 900 and the control chip 30 , reduce the material consumption of the wires 39 , and improve the efficiency of the wires 39 connecting the bootstrap chip pads 900 and the control chip 30 .

[0141] The power module 100 provided in some embodiments of the present disclosure includes multiple control pins 50, which can provide an interface for electrical connection between the power module 100 and external devices. The multiple control pins 50 are all electrically connected to the control chip 30, which can ensure the reliability of the electrical connection between the control chip 30 and the external device.

[0142] In some embodiments, a control pin 50 is provided between two adjacent bootstrap chip pads 900. This facilitates electrical connection between the bootstrap chip 90 on each bootstrap chip pad 900 and an external device, and also ensures the operating reliability of the control chip 30 and the bootstrap chip 90, thereby ensuring the operating reliability of the power module 100.

[0143] In some examples, as shown in FIG13 , the area occupied by the chip bonding portion 902 is larger than the area occupied by the wire connection portion 903. This allows the chip bonding portion 902 to occupy an area sufficient for soldering the bootstrap chip 90 on the bootstrap chip pad 900. Furthermore, while ensuring a stable connection between the wire 39 and the bootstrap chip pad 900, the contact area between the bootstrap chip 90 and the chip bonding portion 902 is increased, thereby improving the connection reliability of the bootstrap chip 90 on the bootstrap chip pad 900. This makes the structure of the bootstrap chip pad 900 more rational, facilitating the production and assembly of the power module 100.

[0144] In some embodiments, as shown in FIG. 13 to FIG. 16 , a through hole 16 is provided on the chip bonding portion 902 . The through hole 16 is located on a side of the bootstrap chip 90 mounted on the chip bonding portion 902 away from the control chip 30 .

[0145] When the main structure of the power module 100 is encapsulated by transfer molding, resin can be poured into the mold cavity through the through hole 16. In this way, after the resin is cured, the through hole 16 is filled with the encapsulation body 10, thereby improving the bonding between the main structure of the power module 100 and the encapsulation body 10.

[0146] In addition, since the through hole 16 is filled with the package body 10, the package body 10 can isolate external water or air, and the through hole 16 is arranged between the part of the chip welding part 902 connected to the outside world and the part carrying the bootstrap chip 90. Therefore, it can also prevent external water or air from entering the interior of the chip through the chip welding part 902 of the bootstrap chip pad 900, which can further improve the structural reliability of the power module 100.

[0147] In some embodiments, as shown in Figures 6 to 8 and 13, the package body 10 further includes an isolation portion 15. The isolation portion 15 is located on the second side surface 10B of the package body 10, i.e., on the side of the package body 10 from which the multiple control pins 50 are extended. The isolation portion 15 is used to increase the creepage distance between the control pins 50, thereby preventing creepage when the surface of the power module 100 comes into contact with an external electrical conductor, thereby ensuring the safety and stability of the power module 100 during operation.

[0148] For example, the isolation portion 15 may be a recessed portion. This can increase the creepage distance between the conductors while saving raw materials and improving the compactness of the power module.

[0149] For example, there may be a plurality of isolation portions 15 , and each isolation portion 15 may be located between two adjacent control pins 50 to increase a creepage distance between the control pins 50 .

[0150] In the power module 100 provided in some embodiments of the present disclosure, as shown in FIG13 , the power module 100 further includes a bootstrap chip 90 and a bootstrap chip pad 900. The bootstrap chip pad 900 is connected to an external device via a pin, and a control pin 50 is provided between two adjacent bootstrap chip pads. In this case, the isolation portion 15 can be located between the control pin 50 and the bootstrap chip pad 900. This can increase the creepage distance between the bootstrap chips 40 while ensuring the structural stability of the bootstrap chip pad 900 in the power module 100. This can prevent creepage from occurring when the surface of the power module 100 comes into contact with an external electrical conductor, thereby ensuring the safety and stability of the power module 100 during operation.

[0151] In the power module 100 provided by the embodiment of the present disclosure, there are multiple control pins 50 , which are led out from the second side surface 10B of the package body 10 extending along the length direction X thereof, that is, the multiple control pins 50 are arranged along the second side surface 10B.

[0152] In some embodiments, as shown in Figures 7, 8, 13, and 17 to 21, the power module 100 further includes a first support pin 70 extending from a third side surface 10C of the package body 10 and solely for supporting the power module 100. The third side surface 10C is adjacent to the second side surface 10B and extends along the width direction Y of the package body 10.

[0153] The multiple control pins 50 include a first function pin 51 and a second function pin 52; along the length direction X of the package body 10, the second function pin 52 is close to the middle of the second side surface 10B of the package body 10, and the first function pin 51 is located on the side of the second function pin 52 away from the first support pin 70.

[0154] That is to say, the first functional pin 51, the second functional pin 52 and the first support pin 70 are respectively arranged roughly evenly along the length direction X of the package body 10, and are led out from different sides of the package body 10, and are configured to support the power module 100 from different sides of the power module 100 to improve the stability of the power module 100.

[0155] In this way, the first functional pin 51 and the second functional pin 52 and the first supporting pin 70 can support the power module 100 as a whole from both sides of the power module 100, thereby avoiding the shaking problem caused by supporting the power module 100 from one side, improving the stability of the power module 100, and preventing the power module 100 from deformation.

[0156] In addition, the first supporting pin 70 is led out from the third side surface 10C of the package body 10, which can avoid increasing the space occupied by the power module 100 along the length direction X and wasting materials, and can make the arrangement of each pin used to support the power module 100 more reasonable and compact, thereby reducing the volume of the power module 100 and improving the miniaturization of the power module 100.

[0157] In addition, the first functional pin 51 and the second functional pin 52 are led out from the second side surface 10B of the package body 10, and the first support pin 70 is led out from the third side surface 10C of the package body 10, which can also increase the insulation distance between these pins, thereby further improving the safety performance of the power module 100.

[0158] In some embodiments, as shown in Figures 13 and 19, the power module 100 also includes a control chip pad 300, and the control chip 30 is arranged on the control chip pad 300. This can ensure the stability and reliability of the installation of the control chip 30 and improve the performance of the control chip 30.

[0159] The first function pin 51, the second function pin 52, and the first support pin 70 are connected to the control chip pad 300, for example, as an integral structure. Alternatively, in some embodiments, it can be understood that different portions of the control chip pad 300 respectively form pads for mounting the control chip 30, as well as the first function pin 51, the second function pin 52, and the first support pin 70.

[0160] The first function pin 51 and the second function pin 52 are led out from the second side surface 10B of the package body 10 and are both electrically connected to peripheral circuits. They not only ensure the normal operation of the power module 100, but also support the power module 100 and ensure the reliable installation of the power module 100. The first support pin 70 is led out from the third side surface 10C of the package body 10 to support the power module 100 from a side different from that from which the control pin 50 is led, thereby ensuring the reliable installation of the power module 100.

[0161] It can be seen from this that in the power module 100 provided in some embodiments of the present disclosure, the solder pads in the power module 100 for mounting the control chip 30 can be used to form pins for supporting the power module 100, without the need to add additional pins for supporting the power module, thereby reducing the space occupied by the pins supporting the power module and improving the miniaturization of the power module 100.

[0162] In some embodiments, as shown in FIG19 , a power module 100 includes multiple control chips 30, such as a first control chip 31 and a second control chip 32. Depending on the application of the power module 100, the first control chip 31 can be used as a low-voltage chip, and the second control chip can be used as a high-voltage chip, thereby improving the operating performance of the power module 100.

[0163] In this case, the control pads 300 include a first control chip pad 301 and a second control chip pad 302, which can be integrally formed. The first control chip pad 301 and the second control chip pad 302 are sequentially connected along the length direction X of the package body 10. The first control chip 301 is mounted on the first control chip pad 301, and the second control chip 32 is mounted on the second control chip pad 302. This improves the structural compactness of the power module 100.

[0164] In some examples, the first function pin 51 is electrically connected to the first control chip 31 and can be used to provide a ground voltage to the first control chip 31. The first function pin 51 is arranged on one side of the first control chip pad 301 along the length direction of the power module, the first support pin 70 is arranged on the side of the second control chip pad 302 along the length direction of the power module away from the first control chip pad 301, and the second function pin 52 is arranged in the middle of the second control chip pad 302 close to the first control chip pad 301. In this way, the first function pin 51, the second function pin 52, and the first support pin 70 can be more evenly distributed within the package 10, thereby making the support force of the first function pin 51, the second function pin 52, and the first support pin 70 on the power module 100 more evenly distributed, thereby improving the reliability and stability of the power module 100.

[0165] In some embodiments, as shown in FIG. 19 , the plurality of control pins 50 further include a third function pin 53 , which is electrically connected to the second control chip 32 and can be used to provide, for example, a high voltage to the second control chip 32 .

[0166] In this case, as shown in Figures 7, 8, 13, and 17 to 21, the power module 100 further includes a second support pin 80 extending from the third side surface 10C of the package body 10, solely for supporting the power module 100. The third function pin 53 is integrally connected to the second support pin 80. Furthermore, along the length direction X of the package body, the third function pin 53 is located on a side of the second function pin 52 that is away from the first function pin 51, and is located near the middle of the second side surface 10B of the package body 10. That is, the third function pin 53 is positioned midway between the first control chip pad 301 and the second control chip pad 302.

[0167] In this way, the third functional pin 53 and the second support pin 80 can also support the power module 100 from two directions, thereby assisting the first functional pin 51, the second functional pin 52 and the first support pin 70 in supporting the power module 100, and further improving the stability of the power module 100.

[0168] Furthermore, the second support pin 80 is led out from the side surface of the power module extending along its width direction, which can avoid increasing the space occupied by the power module 100 along the length direction X, thereby reducing the volume of the power module 100 and further improving the miniaturization of the power module 100.

[0169] At the same time, in some examples, the third functional pin 53 can be connected to the second support pin 80 as an integral structure. This can be understood as follows: utilizing a pin that provides high voltage to the control chip 30, one end of the pin is led out from the second side surface 10A of the package body 10 to serve as a high-voltage pin (i.e., the third functional pin 53), while the other end extends along the length direction X of the power module 100 and leads out from the third side surface 10C of the package body 10 to serve as a non-functional pin (i.e., the second support pin 80), which together with the high-voltage pin supports the power module 100. This eliminates the need for additional pins to support the power module, thereby further improving the miniaturization of the power module 100 while ensuring the support stability of the power module.

[0170] In the power module 100 provided in some embodiments of the present disclosure, the power module 100 includes a second air guide 1032 located at a corner of the second side surface 10B of the package body 10 at an end portion along the length direction X of the package body 10, and the second air guide 1032 includes at least one recess. In this way, while ensuring that the package body 10 protects the main structure of the power module 100, not only can the volume of the package body 10 be reduced, the resin material required for the package can be saved, and the production cost of the power module 100 can be reduced, but the structure of the power module 100 can also be made more compact, the volume of the power module 100 can be reduced, and the miniaturization of the power module 100 can be improved.

[0171] In the case where the second guide portion 1032 includes a recess, the first support pin 70 and the second support pin 80 are led out from a side surface of the recess extending along the width direction Y of the package body 10 .

[0172] When the second guide portion 1032 includes two continuous recesses (i.e., the first recess 10321 and the second recess 10322), the first recess 10321 extends as a whole along the length direction X of the package body 10, and the second recess 10322 extends as a whole along the width direction Y of the package body 10. In this way, the production process of the package body 10 can be simplified and the production difficulty of the package body 10 can be reduced.

[0173] As can be seen, the second recess 10322 is further away from the control pin 50 than the first recess 10321. Therefore, leading the first support pin 70 and the second support pin 80 out from the side surface of the second recess 10322 extending along the width direction Y of the package body 10 can not only improve the miniaturization of the power module, but also extend the insulation length between these pins.

[0174] In addition, as shown in Figures 17 and 18 , the length of the first support pins 70 and the second support pins 80 extending out of the package body 10 does not exceed the depth of the second recess 10322. That is, along the length direction X of the package body 10, the ends of the first support pins 70 and the second support pins 80 extending out of the package body 10 do not exceed the third side surface 10C of the package body 10. This not only increases the creepage distance between the first support pins 70 and the second support pins 80 and their corresponding functional pins, but also prevents the exposed first support pins 70 and the second support pins 80 from contacting external devices located on the third side surface 10C of the package body 10, thereby causing electrical shock or damage.

[0175] In some examples, as shown in FIG20 , the first recess 10321 and the second recess 10322 are both in the shape of an elongated strip, and the length d1 of the first recess 10321 is greater than or equal to the length d2 of the second recess 10322. This simplifies the shape design of the first recess 10321 and the second recess 10322, facilitates the molding of the first recess 10321 and the second recess 10322, and further reduces the difficulty of producing the package 10.

[0176] Furthermore, the lengths of the first recess 10321 and the second recess 10322 can be matched with the lengths of the first side surface 10A and the third side surface 10C to which they are located, thereby further improving the structural reliability of the power module 100 while saving the resin material required for packaging and improving the compactness of the structure.

[0177] In the power module 100 provided in some embodiments of the present disclosure, as shown in Figures 18 and 21, the first recess 10321 includes a first sub-side surface 311 and a second sub-side surface 312. The first sub-side surface 311 extends along the width direction Y of the package body 10, and the second sub-side surface 312 extends along the length direction X of the package body 10. The first sub-side surface 311 is connected (e.g., can be perpendicularly connected) between the second sub-side surface 312 and the second side surface 10B of the package body. The length of the first sub-side surface 311 (i.e., the dimension along the width direction Y of the package body 10) is less than the length of the second sub-side surface 312 (i.e., the dimension along the length direction X of the package body 10).

[0178] The second recess 10322 may mainly include a third sub-side surface 321 and a fourth sub-side surface 322. The third sub-side surface 321 extends along the length direction X of the package body 10, and the fourth sub-side surface 322 extends along the width direction Y of the package body 10. The third sub-side surface 321 is connected (e.g., may be perpendicular to) the fourth sub-side surface 322 and the third side surface 10C of the package body.

[0179] In this way, the structures of the first recess 10321 and the second recess 10322 can be simplified to realize the long strip structure of the first recess 10321 and the second recess 10322 , and the difficulty of producing the second guide portion 1032 can be reduced.

[0180] For example, as shown in Figures 18 and 21, the first recess 10321 is further provided with a first transition arc surface 313 between the first sub-side surface 311 and the second sub-side surface 312. This makes the stress distribution at the connection between the first sub-side surface 311 and the second sub-side surface 312 of the first recess 10321 more uniform, preventing stress concentration at the connection between the first sub-side surface 311 and the second sub-side surface 312 from causing fracture, thereby improving the fatigue safety factor of the package 10 at the first recess 10321, and improving the structural reliability of the package 10 and even the power module 100.

[0181] For example, as shown in Figures 18 and 21, the second recess 10322 further includes a second transition arc surface 323 between the third sub-side surface 321 and the fourth sub-side surface 322. This allows for a more uniform stress distribution at the junction of the third sub-side surface 321 and the fourth sub-side surface 322 of the second recess 10322, thereby preventing stress concentration at the junction of the third sub-side surface 321 and the fourth sub-side surface 322 from causing fracture. This improves the fatigue safety factor of the package 10 at the second recess 10332, thereby enhancing the structural reliability of the package 10 and, therefore, the power module 100.

[0182] In some embodiments, the first support pin 70 and the second support pin 80 may each include a first pin segment, a second pin segment, and a third pin segment connected in sequence.

[0183] As shown in Figure 19, the first support pin 70 may include a first pin segment 71, a second pin segment 72 and a third pin segment 73 connected in sequence; the first pin segment 71 extends along the length direction X of the package body 10; the second pin segment 72 is connected to the end of the first pin segment 71 away from the second control chip 32, and extends along the width direction Y of the package body 10; the third pin segment 73 is connected to the end of the second pin segment 72 away from the first pin segment 71, and is bent and extended along the length direction X of the package body 10, and the end of the third pin segment 73 away from the second pin segment 72 is led outward from the third side surface 10C of the package body 10 (for example, the fourth sub-side surface 322 of the second recess 10322).

[0184] The second support pin 80 may include a first pin segment 81, a second pin segment 82, and a third pin segment 83 connected in sequence. The connection method of the first pin segment 81, the second pin segment 82, and the third pin segment 83 of the second support pin 80 is similar to the connection method of the first pin segment 71, the second pin segment 72, and the third pin segment 73 of the first support pin 70, and will not be repeated here.

[0185] Such a setting can make the first support pin 70 and the second support pin 80 match the structure of the package body 10, not only ensuring that the first support pin 70 and the second support pin 80 are led outward from the third side surface 10C of the package body 10 (for example, the fourth sub-side surface 322 of the second recess 10322) to ensure the supporting effect of the first support pin 70 and the second support pin 80 on the power module 100; but also making the first support pin 70 and the second support pin 80 away from the screw fixing slot on the power module 100 through their respective first pin segments and second pin segments, avoiding interference or being too close to the screws and resulting in the failure to ensure the electrical insulation requirements of the power module 100, thereby improving the reliability of the power module 100.

[0186] In some examples, the width of the second pin segment 82 of the second support pin 80 is greater than the width of the second pin segment 72 of the first support pin 70 (ie, the dimension along the length direction X of the package body 10 ).

[0187] In this way, the second pin segment 82 of the second support pin 80 and the second pin segment 72 of the first support pin 70 can make full use of the available space on the control chip pad 300, enhance the structural stability of the second support pin 80 and the first support pin 70, and thus improve the stability of the second support pin 80 and the first support pin 70 in supporting the power module 100.

[0188] Some embodiments of the present disclosure further provide a device, and the power module provided by the above embodiments is applied to the device.

[0189] As shown in FIG. 22 , the device 1000 includes a controller 200 and a power module 100 provided in any one of the above embodiments, and the power module 100 is connected to the controller 200 .

[0190] In some embodiments, there may be one or more power modules 100 , and the device 1000 may include but is not limited to an inverter device or a rectifier device, for example, a motor drive controller.

[0191] For example, the controller 200 can generate a control signal according to user instructions and send the control signal to the power module 100. The power module 100 generates a drive signal according to the control signal and outputs it to the corresponding drive component to achieve drive control or inversion or rectification conversion, etc.

[0192] By adopting the power module 100 of the above embodiment, the insulation withstand voltage and insulation reliability of the device 1000 provided by the embodiment of the present disclosure are improved, and the electrical safety of the device is improved.

[0193] Those skilled in the art will understand that the scope of the present invention is not limited to the above specific embodiments, and that certain elements of the embodiments may be modified and replaced without departing from the spirit of the present application. The scope of the present invention is limited by the appended claims.

Claims

1. A power module, comprising: Encapsulation; A power chip disposed in the package; A control chip disposed in the package and electrically connected to the power chip; A power pin extending from a first side surface of the package body, the power pin being electrically connected to the power chip; and A control pin is led out from the second side surface of the package body, the first side surface and the second side surface are arranged opposite to each other, and the control pin is electrically connected to the control chip; wherein, The package body includes a guide portion located at at least one corner thereof, and is configured to achieve a resin guide function to avoid a gap in the package body at the corner.

2. The power module according to claim 1, wherein: The guide portion includes a first guide portion located at a corner of an end portion of a first side surface of the package body along a length direction of the package body; and or The guide portion includes a second guide portion located at a corner of an end portion of the second side surface of the package body along a length direction of the package body.

3. The power module according to claim 2, wherein: In the case where the guide portion includes the first guide portion, the first guide portion includes a chamfer or a convex portion; and / or In a case where the air guide portion includes the second air guide portion, the second air guide portion includes a chamfer, a convex portion, or at least one concave portion.

4. The power module according to any one of claims 1 to 3, wherein: The package body further includes a first step portion located on a side of the portion of the power pin extending out of the package body close to the bottom surface of the package body; wherein, The first step portion has a step surface and a side surface; along the width direction of the package body, the side surface of the first step portion is closer to the center of the package body relative to the first side surface of the package body; and along the thickness direction of the package body, the step surface of the first step portion is closer to the center of the package body relative to the bottom surface of the package body.

5. The power module according to claim 4, wherein: The first step portion includes a main portion extending along the length direction of the package body and an end portion extending along the width direction of the package body; wherein, The first step portion further includes a third guide portion connecting the main body portion and the end portion of the first step portion. The power module according to claim 5 , wherein: The third air guide portion includes a chamfer or a convex portion.

7. The power module according to any one of claims 1 to 6, wherein: The package body further includes a second step portion located on a side of the portion of the control pin extending out of the package body close to the bottom surface of the package body; wherein, The second step portion has a step surface and a side surface; along the width direction of the package body, the side surface of the second step portion is closer to the center of the package body relative to the second side surface of the package body; and along the thickness direction of the package body, the step surface of the second step portion is closer to the center of the package body relative to the bottom surface of the package body.

8. The power module according to claim 7, wherein: The second step portion includes a main portion extending along the length direction of the package body and an end portion extending along the width direction of the package body; wherein, The second step portion further includes a fourth guide portion connecting the main body portion and the end portion of the second step portion.

9. The power module according to claim 8, wherein: The fourth guide portion includes a chamfer, a convex portion or a concave portion.

10. The power module according to any one of claims 1 to 9, wherein: The package body further includes a third step portion located on a side of the portion of the control pin extending out of the package body away from the bottom surface of the package body; wherein, The third step portion has a step surface and a side surface; along the width direction of the package body, the side surface of the third step portion is closer to the center of the package body relative to the second side surface of the package body; and along the thickness direction of the package body, the step surface of the third step portion is closer to the center of the package body relative to the top surface of the package body.

11. The power module according to claim 10, wherein: The third step portion includes a main portion extending along the length direction of the package body and an end portion extending along the width direction of the package body; wherein, The third step portion further includes a fifth guide portion connecting the main body portion and the end portion of the third step portion.

12. The power module according to claim 11, wherein: The fifth guide portion includes a chamfer, a convex portion or a concave portion.

13. The power module according to any one of claims 1 to 12, further comprising: A control chip pad for carrying the control chip; At least one bootstrap chip disposed in the package; At least one bootstrap chip pad for carrying the at least one bootstrap chip is spaced apart from the control chip pad; wherein the bootstrap chip pad includes a partition, and a chip bonding portion and a wire connection portion respectively located on both sides of the partition, and the bootstrap chip is disposed in the chip bonding area; and At least one wire is used to electrically connect the control chip and the wire connection portion of the bootstrap chip pad.

14. The power module according to claim 13, wherein: The partition is a strip-shaped groove.

15. The power module according to claim 13 or 14, wherein: The control chip pad and the bootstrap chip pad are spaced apart along a width direction of the power module, and the partition extends along the width direction of the power module.

16. The power module according to any one of claims 13 to 15, wherein: The power module includes a plurality of bootstrap chip pads, and the plurality of bootstrap chip pads are arranged at intervals along the length direction of the power module; wherein, Along the length direction of the power module, the wire connection portion of the bootstrap chip pad located at at least one end of the plurality of bootstrap chip pads is closer to the control chip than the chip bonding portion thereof.

17. The power module according to any one of claims 13 to 16, wherein: The chip welding portion is provided with a through hole, and the through hole is located on a side of the bootstrap chip mounted on the chip welding portion away from the control chip.

18. The power module according to any one of claims 1 to 17, further comprising: A first supporting pin extending from a third side surface of the package body adjacent to the second side surface; wherein, The control pin includes a first function pin and a second function pin; along the length direction of the package body, the second function pin is close to the middle of the second side surface, and the first function pin is located on a side of the second function pin away from the first support pin; The first function pin, the second function pin, and the first support pin are configured to support the power module from different sides of the power module.

19. The power module according to claim 18, further comprising: A control chip pad for mounting the control chip; wherein the first function pin, the second function pin, and the first support pin are connected to the control chip pad as an integrated structure; and A second supporting pin is led out from the third side surface; wherein, The control pin further includes a third function pin, and along the length direction of the package body, the third function pin is located on a side of the second function pin away from the first function pin and close to the middle of the second side surface; wherein, The second supporting pin and the third functional pin are connected into an integral structure.

20. The power module according to claim 19, further comprising a second air guide located at a corner of an end portion of the second side surface of the package body along the length direction of the package body. The second guide portion includes a recess, and the first support pin and the second support pin are led out from the recess; or The second guide portion includes two continuous first recesses and a second recess, the first recess extends along the length direction of the package body, and the second recess extends along the width direction of the package body; the first support pin and the second support pin are both led out from the second recess.

21. The power module according to claim 19 or 20, wherein: The first support pin and the second support pin each include a first pin segment, a second pin segment and a third pin segment connected in sequence; the first pin segment extends along the length direction of the package body, the second pin segment extends along the width direction of the package body, and the third pin segment extends along the length direction of the package body and extends out of the package body from the third side surface of the package body.

22. A device comprising a controller and the power module according to any one of claims 1 to 21, wherein the power module is connected to the controller.

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