A dual-band processing head for micro-jet laser equipment and a focusing control method thereof

Abstract

The invention discloses a dual-band processing head of a micro-jet laser device and a focusing control method thereof, belonging to the field of micro-jet laser devices, comprising a first laser emitter, a second laser emitter, a main dichroic beam splitter, a dual-band reflector group, a nozzle and an imaging module; the first laser emitter is used to emit a first light beam, the second laser emitter is used to emit a second light beam, and the main dichroic beam splitter is used to reflect the first light beam and transmit the second light beam; the first light beam is reflected to the dual-band reflector group by the main dichroic beam splitter, and is reflected to the nozzle by the dual-band reflector group, the second light beam is transmitted to the dual-band reflector group by the main dichroic beam splitter, and is reflected to the nozzle by the dual-band reflector group; a nozzle hole is provided on the upper surface of the nozzle, the first light beam and the second light beam are reflected to the dual-band reflector group by the upper surface of the nozzle, and are transmitted to the imaging module by the dual-band reflector group, thereby improving the processing efficiency of the processing head.

Description

Technical Field

[0001] The invention belongs to the technical field of micro-jet laser equipment, and in particular relates to a dual-band processing head of a micro-jet laser equipment and a focusing control method thereof. Background Art

[0002] Microjet laser processing technology is a precision processing technology that uses a water jet to guide a laser beam to cut and drill a workpiece. Microjet laser equipment is a laser processing equipment based on microjet laser processing technology. Usually, a microjet laser equipment includes a mounting frame, a processing head, and a fixture. The processing head is mounted on the mounting frame for fixing. The fixture is used to clamp the workpiece. The processing head is used to perform microjet laser processing on the workpiece on the fixture.

[0003] The processing head of a traditional micro-jet laser device is composed of a laser emitter, a focusing mirror, and a coupling water chamber. The laser emitter is used to emit laser, the focusing mirror is used to converge the light beam, and the coupling water chamber is used to provide high-pressure water flow. With this structure, after the laser emitted by the laser emitter is irradiated onto the focusing mirror, it can be converged into the coupling water chamber through the focusing mirror, and then mixed with the high-pressure water flow in the coupling water chamber to form a water jet and impact the surface of the workpiece, so that the laser beam in the water jet can penetrate the workpiece for processing under the guidance of the high-pressure water beam. However, the power of the laser beam output by the processing head of the traditional micro-jet laser device is relatively low, resulting in low processing efficiency when the processing head of the micro-jet laser device processes the workpiece. Summary of the invention

[0004] In order to solve the above problems existing in the prior art, the present invention provides a dual-band processing head of a micro jet laser device and a focusing control method thereof. The technical problem to be solved by the present invention is achieved by the following technical solutions:

[0005] In a first aspect, the present invention provides a dual-band processing head of a micro-jet laser device, comprising a first laser emitter, a second laser emitter, a main dichroic beam splitter, a dual-band reflector group, a nozzle and an imaging module; the first laser emitter is used to emit a first light beam, the second laser emitter is used to emit a second light beam, the main dichroic beam splitter is used to reflect the first light beam and transmit the second light beam, the dual-band reflector group and the main dichroic beam splitter are arranged relative to each other, the nozzle and the first side of the dual-band reflector group are arranged relative to each other, and the imaging module and the second side of the dual-band reflector group are arranged relative to each other; the first light beam is reflected to the dual-band reflector group by the main dichroic beam splitter, and is reflected to the nozzle by the dual-band reflector group, the second light beam is transmitted to the dual-band reflector group by the main dichroic beam splitter, and is reflected to the nozzle by the dual-band reflector group; a nozzle is provided on the upper surface of the nozzle, the first light beam and the second light beam are reflected to the dual-band reflector group by the upper surface of the nozzle, and are transmitted to the imaging module by the dual-band reflector group.

[0006] In one embodiment of the present invention, the imaging module includes a sub-dichroic beam splitter, a first camera, a first imaging lens, a second camera and a second imaging lens. The sub-dichroic beam splitter is used to reflect the first light beam and transmit the second light beam; the first light beam is transmitted to the sub-dichroic beam splitter through a dual-band reflector group, and is reflected to the first imaging lens through the sub-dichroic beam splitter, and then enters the first camera through the first imaging lens; the second light beam is transmitted to the sub-dichroic beam splitter through the dual-band reflector group, and is transmitted to the second imaging lens through the sub-dichroic beam splitter, and then enters the second camera through the second imaging lens.

[0007] In one embodiment of the present invention, an aperture is provided between the dual-band reflector assembly and the secondary dichroic beam splitter.

[0008] In one embodiment of the present invention, it also includes a first reflector, a second reflector and a third reflector, the first reflector and the first laser emitter are arranged opposite to each other, and the third reflector and the main dichroic beam splitter are arranged opposite to each other; the first light beam is reflected by the first reflector to the second reflector, and is reflected by the second reflector to the third reflector, and is then reflected by the third reflector to the main dichroic beam splitter.

[0009] In one embodiment of the present invention, it also includes a first collimator and a second collimator. The first collimator is arranged between the first reflector and the first laser emitter, and the first collimator is used to collimate the light beam emitted by the first laser emitter to form a parallel light beam; the second collimator is arranged between the main dichroic beam splitter and the second laser emitter, and the second collimator is used to collimate the light beam emitted by the second laser emitter to form a parallel light beam.

[0010] In one embodiment of the present invention, the dual-band reflector group includes a first dual-band reflector and a second dual-band reflector, the first dual-band reflector has a first surface and a second surface; the main dichroic beam splitter and the second dual-band reflector are both facing the first surface of the first dual-band reflector, and the imaging module is facing the second surface of the first dual-band reflector.

[0011] In one embodiment of the present invention, a first film layer is provided on the upper surface of the primary dichroic beam splitter, and a second film layer is provided on the lower surface of the primary dichroic beam splitter, wherein the first film layer is used to increase the transmittance of the second light beam, and the second film layer is used to increase the reflectance of the first light beam and increase the transmittance of the second light beam;

[0012] The first light beam is reflected to the dual-band reflector group through the lower surface of the main dichroic beam splitter, and the second light beam enters the main dichroic beam splitter through the upper surface of the main dichroic beam splitter and is transmitted to the dual-band reflector group through the main dichroic beam splitter.

[0013] In one embodiment of the present invention, it also includes a dual-band focusing objective lens, a window sheet, and a water cavity which are arranged in sequence. There is a gap between the upper surface of the nozzle and the window sheet. The liquid in the water cavity flows through the gap to the nozzle hole of the nozzle. The dual-band focusing objective lens and the dual-band reflecting mirror group are arranged opposite to each other. The nozzle hole is a conical hole. The aperture of the conical hole on one side close to the window sheet is smaller than the aperture on the other side.

[0014] The first light beam and the second light beam are reflected to the dual-band focusing objective lens by the dual-band reflecting mirror group, converged to the window plate by the dual-band focusing objective lens, and then propagated to the nozzle hole of the nozzle through the window plate.

[0015] In a second aspect, the present invention provides a micro-jet laser device, including a dual-band processing head of the micro-jet laser device provided by the above scheme.

[0016] In a third aspect, the present invention provides a focusing control method for a dual-band processing head of a microjet laser device, which is applied to a dual-band processing head of a microjet laser device as provided in the above scheme, wherein the dual-band processing head comprises a first laser emitter, a second laser emitter, a main dichroic beam splitter, a dual-band reflector group, a nozzle and an imaging module, wherein the first laser emitter is used to emit a first light beam, the second laser emitter is used to emit a second light beam, the main dichroic beam splitter is used to reflect the first light beam and transmit the second light beam, and the dual-band reflector group and the main dichroic beam splitter are mutually connected. The nozzle and the first side of the dual-band reflector group are arranged opposite to each other, the imaging module and the second side of the dual-band reflector group are arranged opposite to each other, the first light beam is reflected to the dual-band reflector group by the main dichroic beam splitter, and is reflected to the nozzle by the dual-band reflector group, the second light beam is transmitted to the dual-band reflector group by the main dichroic beam splitter, and is reflected to the nozzle by the dual-band reflector group, the upper surface of the nozzle is provided with a nozzle hole, the first light beam and the second light beam are reflected to the dual-band reflector group by the upper surface of the nozzle, and are transmitted to the imaging module by the dual-band reflector group, the method comprises:

[0017] Initialize the position of the dual-band processing head;

[0018] According to the image information in the imaging module, the size and position of the focused light spots of the first light beam and the second light beam at the nozzle are adjusted so that the focused light spots of the first light beam and the second light beam are both in a minimum state and overlap with each other;

[0019] According to the image information in the imaging module, the reflection angle of the dual-band reflector group is adjusted to make the focusing spot of the first light beam, the focusing spot of the second light beam and the nozzle hole of the nozzle coincide with each other.

[0020] In one embodiment of the present invention, the imaging module includes a secondary dichroic beam splitter, a first camera, a first imaging lens, a second camera and a second imaging lens. The secondary dichroic beam splitter is used to reflect the first light beam and transmit the second light beam. The first light beam is transmitted to the secondary dichroic beam splitter through a dual-band reflector group, and is reflected to the first imaging lens through the secondary dichroic beam splitter, and then enters the first camera through the first imaging lens. The second light beam is transmitted to the secondary dichroic beam splitter through the dual-band reflector group, and is transmitted to the second imaging lens through the secondary dichroic beam splitter, and then enters the second camera through the second imaging lens.

[0021] The dual-band processing head also includes a first reflector, a second reflector and a third reflector, the first reflector and the first laser emitter are arranged opposite to each other, the third reflector and the main dichroic beam splitter are arranged opposite to each other, the first light beam is reflected by the first reflector to the second reflector, and is reflected by the second reflector to the third reflector, and is then reflected by the third reflector to the main dichroic beam splitter;

[0022] The dual-band processing head also includes a first collimator and a second collimator. The first collimator is arranged between the first reflector and the first laser emitter, and is used to collimate the light beam emitted by the first laser emitter to form a parallel light beam. The second collimator is arranged between the main dichroic beam splitter and the second laser emitter, and is used to collimate the light beam emitted by the second laser emitter to form a parallel light beam.

[0023] The dual-band reflector group includes a first dual-band reflector and a second dual-band reflector, the first dual-band reflector has a first surface and a second surface, the main dichroic beam splitter and the second dual-band reflector are both facing the first surface of the first dual-band reflector, and the imaging module faces the second surface of the first dual-band reflector;

[0024] According to the image information in the imaging module, the focus spot size and position of the first light beam and the second light beam at the nozzle are adjusted, specifically including:

[0025] Step 1: adjusting the second imaging lens so that the image in the second camera reaches the required clarity;

[0026] Step 2: Observe the size of the focused spot of the second light beam in the image of the second camera, reduce the size of the focused spot of the second light beam in the image of the second camera by adjusting the distance between the second laser emitter and the second collimator, and use the center point of the focused spot of the second light beam as a marking point;

[0027] Step 3: Adjust the first imaging lens so that the image in the first camera reaches the required clarity;

[0028] Step 4: Observe the size of the focused spot of the first light beam in the image of the first camera, and reduce the size of the focused spot of the first light beam in the image of the first camera by adjusting the distance between the first laser emitter and the first collimator;

[0029] Step 5: Observe the position between the focus spot of the first light beam and the marking point in the image of the first camera, and adjust the inclination angle of at least one of the first reflector, the second reflector, and the third reflector so that the center of the focus spot of the first light beam coincides with the marking point;

[0030] Step 6: Repeat steps 1 to 5 until the focused spot of the first light beam and the focused spot of the second light beam are both in a minimum state and overlap;

[0031] According to the image information in the imaging module, the reflection angle of the dual-band reflector group is adjusted so that the focus spot of the first light beam, the focus spot of the second light beam and the nozzle hole of the nozzle coincide with each other, specifically including:

[0032] Observe the position between the nozzle and the marking point in the image of the first camera or the second camera, and adjust the tilt angle of the second dual-band reflector so that the center of the nozzle coincides with the marking point.

[0033] Compared with the prior art, the present invention has the following beneficial effects:

[0034] In the above scheme of the present application, the dual-band processing head of the micro-jet laser device includes a first laser emitter, a second laser emitter, a main dichroic beam splitter, a dual-band reflector group, a nozzle and an imaging module. The first laser emitter can emit a first light beam, the second laser emitter can emit a second light beam, the main dichroic beam splitter can reflect the first light beam and transmit the second light beam, the dual-band reflector group and the main dichroic beam splitter are arranged relative to each other, the nozzle and the first side of the dual-band reflector group are arranged relative to each other, and the imaging module and the second side of the dual-band reflector group are arranged relative to each other. In this way, the first light beam can be reflected to the dual-band reflector group by the main dichroic beam splitter, and reflected to the nozzle by the dual-band reflector group, so that the first light beam can be ejected from the nozzle to process the workpiece. The second light beam can be transmitted to the dual-band reflector group by the main dichroic beam splitter, and reflected to the nozzle by the dual-band reflector group, so that the second light beam can be ejected from the nozzle to process the workpiece. By adopting this structure, firstly, the first light beam and the second light beam can be converged and form a dual-band light beam after passing through the main dichroic beam splitter. The dual-band light beam can be reflected to the nozzle by the dual-band reflector group and then ejected from the nozzle to process the workpiece. Therefore, compared with the processing head of the traditional micro-jet laser equipment, when the above-mentioned dual-band processing head of the present application is adopted, the processing head can output a dual-band light beam composed of two laser light beams to perform laser processing on the workpiece, so that the power of the laser light beam output by the processing head can be increased while the single pulse energy and pulse width emitted by the laser emitter remain unchanged, thereby improving the processing efficiency when processing the workpiece.

[0035] Secondly, when the workpiece to be processed is a workpiece formed by stacking or compounding multiple materials, since different materials in the workpiece respond differently to the laser wavelength, when using the above-mentioned dual-band processing head of the present application, the wavelengths of the first light beam and the second light beam can be adjusted so that the first light beam and the second light beam can be respectively suitable for different materials in the workpiece, thereby improving the processing efficiency of the dual-band processing head when processing composite workpieces.

[0036] Furthermore, when the above-mentioned dual-band processing head of the present application is used, the emission time of the first laser emitter and the second laser emitter can be adjusted so that the pulse time interval between the first light beam and the second light beam can be controlled, thereby changing the laser pulse energy and pulse width acting on the workpiece at different times, so that the dual-band processing head can be applied to more complex processing environments, thereby improving the application range and processing freedom of the dual-band processing head.

[0037] In addition, with the above structure, a nozzle hole is provided on the upper surface of the nozzle, and the first light beam and the second light beam can be reflected by the upper surface of the nozzle to the dual-band reflector group, and transmitted to the imaging module through the dual-band reflector group, so that the imaging module can image the upper surface of the nozzle to obtain image information of the upper surface of the nozzle, so that the focusing effect of the dual-band light beam at the nozzle can be adjusted according to the position of the nozzle hole in the image information and the size and position of the focusing spot of the laser beam, thereby further improving the power and processing efficiency of the laser beam output by the processing head.

[0038] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 is a schematic diagram of a dual-band processing head provided by an embodiment of the present invention;

[0040] Figure 2 Schematic diagram of a dual-band focusing objective lens, a window, a water cavity and a nozzle in an embodiment of the present invention.

[0041] Figure markings: 1-first laser emitter, 2-second laser emitter, 3-primary dichroic beam splitter, 4-first collimator, 5-second collimator, 6-first reflector, 7-second reflector, 8-third reflector, 9-first dual-band reflector, 10-second dual-band reflector, 11-secondary dichroic beam splitter, 12-fourth reflector, 13-first imaging lens, 14-first camera, 15-second imaging lens, 16-second camera, 17-aperture, 18-dual-band focusing objective, 19-window, 20-water chamber, 21-nozzle, 211-nozzle hole. DETAILED DESCRIPTION

[0042] The present invention is further described in detail below with reference to specific embodiments, but the embodiments of the present invention are not limited thereto.

[0043] Embodiment 1:

[0044] See also Figure 1 and Figure 2The embodiment of the present invention provides a dual-band processing head of a micro jet laser device, comprising a first laser emitter 1, a second laser emitter 2, a main dichroic beam splitter 3, a dual-band reflector group, a nozzle 21 and an imaging module; the first laser emitter 1 is used to emit a first light beam, the second laser emitter 2 is used to emit a second light beam, the main dichroic beam splitter 3 is used to reflect the first light beam and transmit the second light beam, the dual-band reflector group and the main dichroic beam splitter 3 are arranged opposite to each other, the nozzle 21 and the first side of the dual-band reflector group The imaging module and the second side of the dual-band reflector group are arranged relative to each other; the first light beam is reflected to the dual-band reflector group by the main dichroic beam splitter 3, and is reflected to the nozzle 21 by the dual-band reflector group, the second light beam is transmitted to the dual-band reflector group by the main dichroic beam splitter 3, and is reflected to the nozzle 21 by the dual-band reflector group; a nozzle hole 211 is provided on the upper surface of the nozzle 21, the first light beam and the second light beam are reflected to the dual-band reflector group by the upper surface of the nozzle 21, and are transmitted to the imaging module by the dual-band reflector group.

[0045] In some embodiments of the present application, the first laser emitter 1 is an emitter for emitting a laser beam, such as a solid laser or a fiber laser, etc. The pulse power and pulse width of the first light beam emitted by the first laser emitter 1 can be adjusted by adjusting the power supply current of the first laser emitter 1.

[0046] In some embodiments of the present application, the second laser emitter 2 is an emitter for emitting a laser beam, such as a solid laser or a fiber laser, etc. The pulse power and pulse width of the second beam emitted by the second laser emitter 2 can be adjusted by adjusting the power supply current of the second laser emitter 2.

[0047] In some embodiments of the present application, the first laser emitter 1 includes a first emitter and a first optical fiber, the first emitter and the first optical fiber are connected, and the first light beam emitted by the first emitter is propagated through the first optical fiber to the first collimator 4. The second laser emitter 2 includes a second emitter and a second optical fiber, the second emitter and the second optical fiber are connected, and the second light beam emitted by the second emitter is propagated through the second optical fiber to the second collimator 5.

[0048] In some embodiments of the present application, the wavelength of the first light beam is different from the wavelength of the second light beam.

[0049] In some embodiments of the present application, the primary dichroic beam splitter 3 is an optical element for separating, reflecting or transmitting light of different wavelengths. The imaging module includes a secondary dichroic beam splitter 11. Both the primary dichroic beam splitter 3 and the secondary dichroic beam splitter 11 are dichroic beam splitters. "Primary" and "secondary" are only used to distinguish the two dichroic beam splitters, and do not limit the size, position, installation order, etc. of the two dichroic beam splitters.

[0050] In some embodiments of the present application, the first light beam and the second light beam can converge to form a dual-band light beam with the same propagation direction after passing through the main dichroic beam splitter 3, and the dual-band reflector group is a reflector group that reflects the dual-band light beam to the nozzle 21. The dual-band reflector group can be a reflector lens, or can include multiple reflectors, and the multiple reflectors can reflect in sequence to reflect the dual-band light beam to the nozzle 21.

[0051] In some embodiments of the present application, the main dichroic beam splitter 3 includes an upper surface and a lower surface, the second light beam is irradiated on the upper surface of the main dichroic beam splitter 3 and passes through the main dichroic beam splitter 3 to achieve transmission, and the first light beam is irradiated on the lower surface of the main dichroic beam splitter 3 to achieve reflection.

[0052] In some embodiments of the present application, the nozzle 21 can be a cylindrical structure. When the focused spot of the first light beam is not aligned with the nozzle hole 211 on the upper surface of the nozzle 21, the first light beam will irradiate the upper surface of the nozzle 21 and reflect. The reflected first light beam can be transmitted to the imaging module through the dual-band reflector group, so that the imaging module can receive the reflected first light beam and perform imaging. Among them, although the dual-band reflector group can reflect the first light beam, its reflectivity is not 100%. Therefore, when the first light beam is irradiated on the dual-band reflector group, part of the first light beam will pass through the dual-band reflector group for transmission. When the focused spot of the second light beam is not aligned with the nozzle hole 211 on the upper surface of the nozzle 21, the second light beam will irradiate the upper surface of the nozzle 21 and reflect. The reflected second light beam can be transmitted to the imaging module through the dual-band reflector group, so that the imaging module can receive the reflected second light beam and perform imaging. Among them, although the dual-band reflector group can reflect the second light beam, its reflectivity is not 100%. Therefore, when the second light beam is irradiated onto the dual-band reflector group, part of the second light beam will pass through the dual-band reflector group and be transmitted.

[0053] In some embodiments of the present application, the imaging module is a device for receiving light and forming an image, such as a camera, a webcam, etc.

[0054] In the above scheme of the present application, the dual-band processing head of the micro-jet laser device includes a first laser emitter 1, a second laser emitter 2, a main dichroic beam splitter 3, a dual-band reflector group, a nozzle 21 and an imaging module, the first laser emitter 1 can emit a first light beam, the second laser emitter 2 can emit a second light beam, the main dichroic beam splitter 3 can reflect the first light beam and transmit the second light beam, the dual-band reflector group and the main dichroic beam splitter 3 are arranged relative to each other, the nozzle 21 and the first side of the dual-band reflector group are arranged relative to each other, and the imaging module and the second side of the dual-band reflector group are arranged relative to each other. In this way, the first light beam can be reflected to the dual-band reflector group by the main dichroic beam splitter 3, and reflected to the nozzle 21 by the dual-band reflector group, so that the first light beam can be ejected from the nozzle 21 to process the workpiece. The second light beam can be transmitted to the dual-band reflector group through the main dichroic beam splitter 3, and reflected to the nozzle 21 through the dual-band reflector group, so that the second light beam can be ejected from the nozzle 21 to process the workpiece. With this structure, firstly, the first light beam and the second light beam can be converged and form a dual-band light beam after passing through the main dichroic beam splitter 3, and the dual-band light beam can be ejected from the nozzle 21 to process the workpiece after being reflected to the nozzle 21 through the dual-band reflector group. Therefore, compared with the processing head of the traditional micro-jet laser device, when the dual-band processing head of the present application is adopted, the processing head can output a dual-band light beam composed of two laser beams to perform laser processing on the workpiece, so that the power of the laser beam output by the processing head can be increased while the single pulse energy and pulse width emitted by the laser emitter remain unchanged, thereby improving the processing efficiency when processing the workpiece.

[0055] Secondly, when the workpiece to be processed is a workpiece formed by stacking or compounding multiple materials, since different materials in the workpiece respond differently to the laser wavelength, when using the above-mentioned dual-band processing head of the present application, the wavelengths of the first light beam and the second light beam can be adjusted so that the first light beam and the second light beam can be respectively suitable for different materials in the workpiece, thereby improving the processing efficiency of the dual-band processing head when processing composite workpieces.

[0056] Furthermore, when the above-mentioned dual-band processing head of the present application is used, the emission time of the first laser emitter 1 and the second laser emitter 2 can be adjusted so that the pulse time interval between the first light beam and the second light beam can be controlled, thereby changing the laser pulse energy and pulse width acting on the workpiece at different times, so that the dual-band processing head can be applied to more complex processing environments, thereby improving the application range and processing freedom of the dual-band processing head.

[0057] In addition, by adopting the above structure, a nozzle hole 211 is provided on the upper surface of the nozzle head 21, and the first light beam and the second light beam can be reflected to the dual-band reflector group through the upper surface of the nozzle head 21, and transmitted to the imaging module through the dual-band reflector group, so that the imaging module can image the upper surface of the nozzle head 21 to obtain image information of the upper surface of the nozzle head 21, so as to adjust the focusing effect of the dual-band light beam at the nozzle head 21 according to the position of the nozzle hole 211 in the image information and the size and position of the focusing spot of the laser light beam, thereby further improving the power and processing efficiency of the laser light beam output by the processing head.

[0058] In some embodiments of the present application, the imaging module includes a secondary dichroic beam splitter 11, a first camera 14, a first imaging lens 13, a second camera 16, and a second imaging lens 15. The secondary dichroic beam splitter 11 is used to reflect the first light beam and transmit the second light beam; the first light beam is transmitted to the secondary dichroic beam splitter 11 through the dual-band reflector group, and is reflected to the first imaging lens 13 through the secondary dichroic beam splitter 11, and then enters the first camera 14 through the first imaging lens 13; the second light beam is transmitted to the secondary dichroic beam splitter 11 through the dual-band reflector group, and is transmitted to the second imaging lens 15 through the secondary dichroic beam splitter 11, and then enters the second camera 16 through the second imaging lens 15. With this structure, the dual-band light beam can be separated into the first light beam and the second light beam through the secondary dichroic beam splitter 11, the first light beam enters the first camera 14 through the first imaging lens 13 for imaging, and the second light beam enters the second camera 16 through the second imaging lens 15 for imaging. In this way, the image of the first camera 14 can display the upper surface image of the nozzle 21 and the focused spot of the first light beam, and the image of the second camera 16 can display the upper surface image of the nozzle 21 and the focused spot of the second light beam. By separating the imaging of the first light beam and the imaging of the second light beam, it is convenient to accurately adjust the size and position of the focused spots of the first light beam and the second light beam, thereby improving the focusing effect of the dual-band light beam on the upper surface of the nozzle 21 and improving the power and processing efficiency of the laser beam output by the processing head.

[0059] In some embodiments of the present application, the secondary dichroic beam splitter 11 is an optical element for separating, reflecting or transmitting light of different wavelengths. Among them, an upper film layer is provided on the upper surface of the secondary dichroic beam splitter 11, and a lower film layer is provided on the lower surface of the secondary dichroic beam splitter 11, the upper film layer is used to improve the reflectivity of the first light beam and improve the transmittance of the second light beam, and the lower film layer is used to improve the transmittance of the second light beam. Specifically, the upper film layer can be a film layer structure formed by stacking or compounding a reflective film and an anti-reflective film, the reflective film is used to reflect a light beam with a wavelength equal to the wavelength of the first light beam, the anti-reflective film is used to increase the transmittance of a light beam with a wavelength equal to the wavelength of the second light beam, and the lower film layer is an anti-reflective film, and the anti-reflective film is used to increase the transmittance of a light beam with a wavelength equal to the wavelength of the second light beam. Thus, when the first light beam passes through the upper film layer of the secondary dichroic beam splitter 11, it will be reflected to enter the first imaging lens 13, and when the second light beam passes through the upper film layer of the secondary dichroic beam splitter 11, it will be transmitted and pass through the secondary dichroic beam splitter 11 and the lower film layer to enter the second imaging lens 15.

[0060] In some embodiments of the present application, the first imaging lens 13 may be a single convex lens or a lens assembly composed of multiple lenses. Thus, by adjusting the distance between the convex lens and the first camera 14, or adjusting the distance between two adjacent lenses, the focusing effect of the first light beam at the first camera 14 may be adjusted, thereby improving the imaging effect of the first camera 14.

[0061] In some embodiments of the present application, the second imaging lens 15 may be a single convex lens or a lens assembly composed of multiple lenses. Thus, by adjusting the distance between the convex lens and the second camera 16, or adjusting the distance between two adjacent lenses, the focusing effect of the second light beam at the second camera 16 may be adjusted, thereby improving the imaging effect of the second camera 16.

[0062] In some embodiments of the present application, the imaging module further includes a fourth reflector 12, which is disposed between the secondary dichroic beam splitter 11 and the second imaging lens 15. The second light beam is transmitted to the fourth reflector 12 through the secondary dichroic beam splitter 11, and is reflected to the second imaging lens 15 through the fourth reflector 12. In this way, the propagation direction of the second light beam can be changed by the fourth reflector 12, so that the adjustment of the installation positions of the second imaging lens 15 and the second camera 16 is more convenient.

[0063] In some embodiments of the present application, Figure 1As shown, an aperture 17 is provided between the dual-band reflector group and the secondary dichroic beam splitter 11. With this structure, the aperture 17 can limit the beam diameter of the dual-band light beam formed by the reflection on the upper surface of the nozzle 21 during the process of propagating from the dual-band reflector group to the secondary dichroic beam splitter 11, and limit other stray light from propagating to the secondary dichroic beam splitter 11, thereby improving the imaging quality of the first camera 14 and the second camera 16.

[0064] In some embodiments of the present application, the aperture 17 is a component that limits the light beam in the optical system. Specifically, the aperture 17 in the embodiment of the present application is an annular component, the circular hole in the middle of the annular component is used to pass the light beam, and the annular surface of the annular component can limit the diameter of the light beam and limit other stray light from propagating to the secondary dichroic beam splitter 11.

[0065] In some embodiments of the present application, the dual-band processing head further includes a first reflector 6, a second reflector 7 and a third reflector 8, the first reflector 6 and the first laser emitter 1 are arranged oppositely, and the third reflector 8 and the main dichroic beam splitter 3 are arranged oppositely; the first light beam is reflected to the second reflector 7 by the first reflector 6, and is reflected to the third reflector 8 by the second reflector 7, and is then reflected to the main dichroic beam splitter 3 by the third reflector 8. With this structure, the propagation direction of the first light beam can be changed by the first reflector 6, the second reflector 7 and the third reflector 8, so that the adjustment of the installation position of the first laser emitter 1 is more convenient. In addition, by adjusting the inclination angle of at least one of the first reflector 6, the second reflector 7 and the third reflector 8, the propagation direction of the first light beam can be adjusted, and then the position of the focusing spot of the first light beam on the upper surface of the nozzle 21 can be adjusted, so that the focusing spot of the first light beam can be aligned with the nozzle 211, thereby improving the focusing effect of the first light beam, and then improving the power and processing efficiency of the laser beam output by the processing head.

[0066] In some embodiments of the present application, in an initial state, the first reflector 6 , the second reflector 7 , and the third reflector 8 are all inclined at an angle of 45°, and the first reflector 6 , the second reflector 7 , and the third reflector 8 are parallel to each other.

[0067] In some embodiments of the present application, the dual-band processing head further includes a first collimator 4 and a second collimator 5. The first collimator 4 is disposed between the first reflector 6 and the first laser emitter 1, and is used to collimate the light beam emitted by the first laser emitter 1 to form a parallel light beam; the second collimator 5 is disposed between the main dichroic beam splitter 3 and the second laser emitter 2, and is used to collimate the light beam emitted by the second laser emitter 2 to form a parallel light beam. With this structure, the first light beam is collimated by the first collimator 4, which can reduce the divergence loss of the first light beam and improve the intensity of the first light beam. Moreover, by collimating the first light beam into a parallel light beam, the propagation direction of the light beam can be optimized, further reducing the divergence loss of the light beam when passing through the subsequent lens, and further improving the intensity of the first light beam, thereby further improving the power and processing efficiency of the laser beam output by the processing head. By collimating the second light beam through the second collimator 5, the divergence loss of the second light beam can be reduced, the intensity of the second light beam can be improved, and by collimating the second light beam into a parallel light beam, the propagation direction of the light beam can be optimized, the divergence loss of the light beam when passing through the subsequent lens can be further reduced, and the intensity of the second light beam can be further improved, thereby further improving the power and processing efficiency of the laser light beam output by the processing head. In addition, the size of the focus spot of the first light beam can be adjusted by adjusting the distance between the first laser emitter 1 and the first collimator 4, and the size of the focus spot of the second light beam can be adjusted by adjusting the distance between the second laser emitter 2 and the second collimator 5, thereby improving the focusing effect of the dual-band light beam on the upper surface of the nozzle 21, thereby improving the power and processing efficiency of the laser light beam output by the processing head.

[0068] In some embodiments of the present application, the first laser emitter 1 includes a first emitter and a first optical fiber, the first emitter and the first optical fiber are connected, and the first light beam emitted by the first emitter is transmitted to the first collimator 4 through the first optical fiber. At this time, the end face of the first optical fiber corresponds to the first collimator 4, and the size of the focus spot of the first light beam can be adjusted by adjusting the distance between the end face of the first optical fiber and the first collimator 4. Alternatively, the first laser emitter 1 is not provided with the first optical fiber, the emission end of the first laser emitter 1 corresponds to the first collimator 4, and the size of the focus spot of the first light beam can be adjusted by adjusting the distance between the emission end of the first laser emitter 1 and the first collimator 4.

[0069] In some embodiments of the present application, the second laser emitter 2 includes a second emitter and a second optical fiber, the second emitter and the second optical fiber are connected, and the second light beam emitted by the second emitter is transmitted to the second collimator 5 through the second optical fiber. At this time, the end face of the second optical fiber corresponds to the second collimator 5, and the size of the focus spot of the second light beam can be adjusted by adjusting the distance between the end face of the second optical fiber and the second collimator 5. Alternatively, the second laser emitter 2 is not provided with a second optical fiber, and the emission end of the second laser emitter 2 corresponds to the second collimator 5, and the size of the focus spot of the second light beam can be adjusted by adjusting the distance between the emission end of the second laser emitter 2 and the second collimator 5.

[0070] In some embodiments of the present application, the dual-band reflector group includes a first dual-band reflector 9 and a second dual-band reflector 10, the first dual-band reflector 9 has a first surface and a second surface; the main dichroic beam splitter 3 and the second dual-band reflector 10 are both facing the first surface of the first dual-band reflector 9, and the imaging module is facing the second surface of the first dual-band reflector 9. With this structure, the propagation direction of the dual-band light beam can be changed by the first dual-band reflector 9 and the second dual-band reflector 10, so that the adjustment of the installation position of the nozzle 21 and the imaging module is more convenient. In addition, by adjusting the inclination angle of the first dual-band reflector 9 or the second dual-band reflector 10, the position of the focusing spot of the first light beam and the second light beam can be adjusted as a whole, that is, the position of the focus of the dual-band light beam is adjusted, so that the focus of the dual-band light beam can be aligned with the nozzle 211, thereby improving the focusing effect of the dual-band light beam on the upper surface of the nozzle 21, thereby improving the power and processing efficiency of the laser beam output by the processing head.

[0071] In some embodiments of the present application, in the initial state, the inclination angle of the first dual-band reflector 9 and the second dual-band reflector 10 is 45°, and the inclination direction of the first dual-band reflector 9 and the second dual-band reflector 10 is opposite to the inclination direction of the first reflector 6.

[0072] In some embodiments of the present application, a first film layer is provided on the upper surface of the main dichroic beam splitter 3, and a second film layer is provided on the lower surface of the main dichroic beam splitter 3, wherein the first film layer is used to improve the transmittance of the second light beam, and the second film layer is used to improve the reflectivity of the first light beam and improve the transmittance of the second light beam; the first light beam is reflected to the dual-band reflector group through the lower surface of the main dichroic beam splitter 3, and the second light beam enters the main dichroic beam splitter 3 through the upper surface of the main dichroic beam splitter 3, and is transmitted to the dual-band reflector group through the main dichroic beam splitter 3. With this structure, the transmittance of the second light beam can be improved by the first film layer on the upper surface of the main dichroic beam splitter 3, thereby improving the intensity of the second light beam entering the main dichroic beam splitter 3 from the upper surface of the main dichroic beam splitter 3, and the transmittance of the second light beam can be improved by the second film layer on the lower surface of the main dichroic beam splitter 3, thereby improving the intensity of the second light beam emitted from the inside of the main dichroic beam splitter 3, thereby further improving the power of the laser beam output by the processing head and the processing efficiency. The second film layer on the lower surface of the main dichroic beam splitter 3 can reflect the first light beam and increase the reflectivity of the first light beam, thereby increasing the intensity of the first light beam reflected by the lower surface of the main dichroic beam splitter 3, thereby further improving the power of the laser beam output by the processing head and the processing efficiency.

[0073] In some embodiments of the present application, the first film layer may be an anti-reflection film, which is used to increase the transmittance of a light beam having a wavelength equal to that of the second light beam. The second film layer may be a film layer structure formed by stacking or compounding a reflective film and an anti-reflection film, wherein the reflective film is used to reflect a light beam having a wavelength equal to that of the first light beam, and the anti-reflection film is used to increase the transmittance of a light beam having a wavelength equal to that of the second light beam. In this way, when the first light beam passes through the lower surface of the main dichroic beam splitter 3, it will be reflected to propagate to the dual-band reflector group, and when the second light beam passes through the upper surface of the main dichroic beam splitter 3, it will be transmitted and pass through the main dichroic beam splitter 3 and its lower surface to propagate to the dual-band reflector group.

[0074] In some embodiments of the present application, Figure 2As shown, the dual-band processing head also includes a dual-band focusing objective lens 18, a window 19 and a water chamber 20 which are arranged in sequence. There is a gap between the upper surface of the nozzle 21 and the window 19. The liquid in the water chamber 20 flows through the gap to the nozzle hole 211 of the nozzle 21. The dual-band focusing objective lens 18 and the dual-band reflector group are arranged oppositely. The nozzle hole 211 is a conical hole. The aperture of the conical hole close to the window 19 is smaller than the aperture of the other side. The first light beam and the second light beam are reflected to the dual-band focusing objective lens 18 through the dual-band reflector group, and converged to the window 19 through the dual-band focusing objective lens 18, and then propagated through the window 19 to the nozzle hole 211 of the nozzle 21. With this structure, the dual-band focusing objective lens 18 can focus the dual-band light beam reflected by the dual-band reflector group, and the dual-band focusing objective lens 18 can be processed by achromatic aberration to improve the focusing effect. The window 19 can isolate the dual-band focusing lens 18 and the water cavity 20. The water cavity 20 is filled with high-pressure water. When the dual-band light beam passes through the water cavity 20 and the nozzle 211, it can be a laser water jet, which is convenient for processing workpieces using laser water jets. When the nozzle 211 is a conical hole, the small hole on the upper side can be used to increase the pressure of the water when it is ejected and the accuracy of the laser focus, thereby improving the processing efficiency and the quality of the finished product. The conical space can also be used to gradually release the pressure of the water and expand the exit angle of the water, thereby further improving the processing efficiency and the quality of the finished product.

[0075] In some embodiments of the present application, the dual-band focusing objective lens 18 may be a convex lens, the convex surface of the convex lens faces the window 19, the window 19 may be a flat glass, and the nozzle hole 211 may be a conical hole.

[0076] Embodiment 2:

[0077] The present invention provides a micro-jet laser device, comprising a dual-band processing head of the micro-jet laser device provided in the first embodiment.

[0078] The beneficial effects of the second embodiment of the present invention and its various implementations can be analyzed by referring to the beneficial effects of the first embodiment and its various implementations, which will not be described in detail here.

[0079] Embodiment three:

[0080] The present invention provides a focusing control method for a dual-band processing head of a micro-jet laser device, comprising a dual-band processing head of a micro-jet laser device as provided in the first embodiment, wherein the dual-band processing head comprises a first laser emitter, a second laser emitter, a main dichroic beam splitter, a dual-band reflector group, a nozzle and an imaging module, wherein the first laser emitter is used to emit a first light beam, the second laser emitter is used to emit a second light beam, the main dichroic beam splitter is used to reflect the first light beam and transmit the second light beam, and the dual-band reflector group and the main dichroic beam splitter are arranged relative to each other. The nozzle and the first side of the dual-band reflector group are arranged opposite to each other, the imaging module and the second side of the dual-band reflector group are arranged opposite to each other, the first light beam is reflected to the dual-band reflector group by the main dichroic beam splitter, and is reflected to the nozzle by the dual-band reflector group, the second light beam is transmitted to the dual-band reflector group by the main dichroic beam splitter, and is reflected to the nozzle by the dual-band reflector group, the upper surface of the nozzle is provided with a nozzle hole, the first light beam and the second light beam are reflected to the dual-band reflector group by the upper surface of the nozzle, and are transmitted to the imaging module by the dual-band reflector group, the method comprises:

[0081] Initialize the position of the dual-band processing head;

[0082] According to the image information in the imaging module, the size and position of the focused light spots of the first light beam and the second light beam at the nozzle are adjusted so that the focused light spots of the first light beam and the second light beam are both in a minimum state and overlap with each other;

[0083] According to the image information in the imaging module, the reflection angle of the dual-band reflector group is adjusted to make the focusing spot of the first light beam, the focusing spot of the second light beam and the nozzle hole of the nozzle coincide with each other.

[0084] The beneficial effects of the third embodiment of the present invention and its various implementations can refer to the beneficial effects analysis in the first embodiment and its various implementations. In addition, the focus of the dual-band light beam can be accurately adjusted by using the above-mentioned focusing control method, thereby improving the focusing effect of the dual-band light beam on the upper surface of the nozzle, thereby improving the power and processing efficiency of the laser beam output by the processing head.

[0085] In some embodiments of the present application, the dual-band processing head is initialized, including:

[0086] Adjusting the distance between the second laser emitter and the second collimator lens so that the output light beam of the second collimator lens is substantially a parallel light beam;

[0087] Adjusting the distance between the first laser emitter and the first collimator so that the output light beam of the first collimator is substantially a parallel light beam;

[0088] Keep the mirror angles of the primary dichroic beam splitter, the first dual-band mirror and the second dual-band mirror at the initial 45°.

[0089] In some embodiments of the present application, the imaging module includes a secondary dichroic beam splitter, a first camera, a first imaging lens, a second camera and a second imaging lens. The secondary dichroic beam splitter is used to reflect the first light beam and transmit the second light beam. The first light beam is transmitted to the secondary dichroic beam splitter through a dual-band reflector group, and is reflected to the first imaging lens through the secondary dichroic beam splitter, and then enters the first camera through the first imaging lens. The second light beam is transmitted to the secondary dichroic beam splitter through the dual-band reflector group, and is transmitted to the second imaging lens through the secondary dichroic beam splitter, and then enters the second camera through the second imaging lens.

[0090] The dual-band processing head also includes a first reflector, a second reflector and a third reflector, the first reflector and the first laser emitter are arranged opposite to each other, the third reflector and the main dichroic beam splitter are arranged opposite to each other, the first light beam is reflected by the first reflector to the second reflector, and is reflected by the second reflector to the third reflector, and is then reflected by the third reflector to the main dichroic beam splitter;

[0091] The dual-band processing head also includes a first collimator and a second collimator. The first collimator is arranged between the first reflector and the first laser emitter, and is used to collimate the light beam emitted by the first laser emitter to form a parallel light beam. The second collimator is arranged between the main dichroic beam splitter and the second laser emitter, and is used to collimate the light beam emitted by the second laser emitter to form a parallel light beam.

[0092] The dual-band reflector group includes a first dual-band reflector and a second dual-band reflector, the first dual-band reflector has a first surface and a second surface, the main dichroic beam splitter and the second dual-band reflector are both facing the first surface of the first dual-band reflector, and the imaging module faces the second surface of the first dual-band reflector;

[0093] According to the image information in the imaging module, the focus spot size and position of the first light beam and the second light beam at the nozzle are adjusted, specifically including:

[0094] Step 1: adjusting the second imaging lens so that the image in the second camera reaches the required clarity;

[0095] Step 2: Observe the size of the focused spot of the second light beam in the image of the second camera, reduce the size of the focused spot of the second light beam in the image of the second camera by adjusting the distance between the second laser emitter and the second collimator, and use the center point of the focused spot of the second light beam as the marking point. Specifically, use the coordinates of the center point of the focused spot of the second light beam as the coordinates of the marking point.

[0096] Step 3: Adjust the first imaging lens so that the image in the first camera reaches the required clarity;

[0097] Step 4: Observe the size of the focused spot of the first light beam in the image of the first camera, and reduce the size of the focused spot of the first light beam in the image of the first camera by adjusting the distance between the first laser emitter and the first collimator;

[0098] Step 5: Observe the position between the focus spot of the first light beam and the mark point in the image of the first camera, and adjust the inclination angle of at least one of the first reflector, the second reflector, and the third reflector so that the center of the focus spot of the first light beam coincides with the mark point. Specifically, adjust the inclination angle of at least one of the first reflector, the second reflector, and the third reflector so that the center coordinates of the focus spot of the first light beam coincide with the coordinates of the mark point.

[0099] Step 6: Repeat steps 1 to 5 until the focused spot of the first light beam and the focused spot of the second light beam are at a minimum state and the two overlap;

[0100] According to the image information in the imaging module, the reflection angle of the dual-band reflector group is adjusted so that the focus spot of the first light beam, the focus spot of the second light beam and the nozzle hole of the nozzle coincide with each other, specifically including:

[0101] Observe the position between the nozzle and the mark point in the image of the first camera or the second camera, and adjust the inclination angle of the second dual-band reflector so that the center of the nozzle and the mark point coincide with each other. Specifically, adjust the inclination angle of the second dual-band reflector so that the center coordinates of the nozzle and the coordinates of the mark point coincide with each other.

[0102] It can be understood that, by adopting this method, the size of the focusing spot of the second light beam is first adjusted, and then the size of the focusing spot of the first light beam is adjusted, and then the center of the focusing spot of the second light beam is used as a reference to adjust the positions of the focusing spot of the first light beam and the focusing spot of the second light beam so that the two overlap, and then the focusing spot of the first light beam and the focusing spot of the second light beam are repeated for many times to ensure that the focusing spot of the first light beam and the focusing spot of the second light beam are in the minimum state and the two overlap to improve the focusing effect, and finally the reflection angle of the dual-band reflector group is adjusted to make the focusing spot of the first light beam, the focusing spot of the second light beam and the nozzle of the nozzle overlap, so that the dual-band light beam can be accurately emitted from the nozzle, thereby improving the power and processing efficiency of the laser beam output by the processing head.

[0103] In some embodiments of the present application, the second laser emitter includes a second emitter and a second optical fiber, the second emitter and the second optical fiber are connected, and the second light beam emitted by the second emitter is transmitted to the second collimator through the second optical fiber. At this time, the end face of the second optical fiber corresponds to the second collimator, and adjusting the distance between the second laser emitter and the second collimator is specifically adjusting the distance between the end face of the second optical fiber and the second collimator. Alternatively, the second laser emitter is not provided with a second optical fiber, and the emission end of the second laser emitter corresponds to the second collimator. At this time, adjusting the distance between the second laser emitter and the second collimator is specifically adjusting the distance between the emission end of the second laser emitter and the second collimator.

[0104] In some embodiments of the present application, the first laser emitter includes a first emitter and a first optical fiber, the first emitter is connected to the first optical fiber, and the first light beam emitted by the first emitter is transmitted to the first collimator through the first optical fiber. At this time, the end face of the first optical fiber corresponds to the first collimator, and the distance between the first laser emitter and the first collimator is adjusted, specifically, the distance between the end face of the first optical fiber and the first collimator is adjusted. Alternatively, the first laser emitter is not provided with the first optical fiber, the emission end of the first laser emitter corresponds to the first collimator, and the distance between the first laser emitter and the first collimator is adjusted, specifically, the distance between the emission end of the first laser emitter and the first collimator is adjusted.

[0105] In some embodiments of the present application, the second imaging lens may be a single convex lens, and the second imaging lens is adjusted so that the image in the second camera reaches the desired clarity, specifically by adjusting the distance between the second imaging lens and the second camera so that the image in the second camera reaches the desired clarity. Alternatively, the second imaging lens may be a lens assembly composed of multiple lenses, and the second imaging lens is adjusted so that the image in the second camera reaches the desired clarity, specifically by adjusting the distance between two adjacent lenses so that the image in the second camera reaches the desired clarity.

[0106] In some embodiments of the present application, the first imaging lens may be a single convex lens, and the first imaging lens is adjusted so that the image in the first camera reaches the desired clarity, specifically by adjusting the distance between the first imaging lens and the first camera so that the image in the first camera reaches the desired clarity. Alternatively, the first imaging lens may be a lens assembly composed of multiple lenses, and the first imaging lens is adjusted so that the image in the first camera reaches the desired clarity, specifically by adjusting the distance between two adjacent lenses so that the image in the first camera reaches the desired clarity.

[0107] A specific example of the focusing control method of the dual-band processing head of the micro jet laser device in the embodiment of the present application is as follows:

[0108] (1) Adjust the distance between the end face of the second optical fiber and the second collimator so that the output light beam of the second collimator is basically a parallel light beam.

[0109] (2) Adjust the distance between the end face of the first optical fiber and the first collimator so that the output light beam of the first collimator is basically a parallel light beam.

[0110] (3) Keep the mirror angles of the main dichroic beam splitter, the first dual-band reflector, and the second dual-band reflector at the initial 45°.

[0111] (4) Turn on the second camera and adjust the second imaging lens so that the image in the second camera reaches the required clarity.

[0112] (5) Observe the size of the focused spot of the second light beam in the image of the second camera, and reduce the size of the focused spot of the second light beam in the image of the second camera by adjusting the distance between the end face of the second optical fiber and the second collimator. Use the center point of the focused spot of the second light beam as the marking point.

[0113] (6) Turn on the first camera and adjust the first imaging lens so that the image in the first camera reaches the required clarity.

[0114] (7) Observe the size of the focused spot of the first light beam in the image of the first camera, and reduce the size of the focused spot of the first light beam in the image of the first camera by adjusting the distance between the end face of the first optical fiber and the first collimator.

[0115] (8) Observe the position between the focus spot of the first light beam and the mark point in the image of the first camera, and adjust the inclination angle of at least one of the first reflector, the second reflector, and the third reflector so that the center of the focus spot of the first light beam coincides with the mark point.

[0116] (9) Repeat steps (4) to (8) multiple times until the focused spot of the first light beam and the focused spot of the second light beam are at a minimum state and overlap.

[0117] (10) Observe the position between the nozzle and the marking point in the image of the first camera or the second camera, and adjust the tilt angle of the second dual-band reflector so that the center of the nozzle coincides with the marking point.

[0118] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by the terms "upper", "lower", "front", "back", "left", "right", "inside", "outside", etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0119] In addition, the terms "first", "second", "third", and "fourth" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second", "third", and "fourth" may explicitly or implicitly include one or more of the feature. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0120] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0121] The above contents are further detailed descriptions of the present invention in combination with specific preferred embodiments, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims

1. A focusing control method for a dual-band processing head of a micro jet laser device, characterized in that: A dual-band processing head comprising a micro-jet laser device, wherein the dual-band processing head comprises a first laser emitter, a second laser emitter, a main dichroic beam splitter, a dual-band reflector group, a nozzle and an imaging module, wherein the first laser emitter is used to emit a first light beam, the second laser emitter is used to emit a second light beam, the main dichroic beam splitter is used to reflect the first light beam and transmit the second light beam, the dual-band reflector group and the main dichroic beam splitter are arranged opposite to each other, the nozzle and a first side of the dual-band reflector group are arranged opposite to each other, the imaging module and the dual-band reflector group are arranged opposite to each other, and the imaging module and the dual-band reflector group are arranged opposite to each other. The second side of the band reflector group is arranged relatively, the first light beam is reflected to the dual-band reflector group by the main dichroic beam splitter, and is reflected to the nozzle by the dual-band reflector group, the second light beam is transmitted to the dual-band reflector group by the main dichroic beam splitter, and is reflected to the nozzle by the dual-band reflector group, the upper surface of the nozzle is provided with a nozzle hole, the first light beam and the second light beam are reflected to the dual-band reflector group by the upper surface of the nozzle, and are transmitted to the imaging module by the dual-band reflector group, the method comprises: According to the image information in the imaging module, the size and position of the focused light spot of the first light beam and the second light beam at the nozzle are adjusted so that the focused light spot of the first light beam and the focused light spot of the second light beam are both in a minimum state and overlap with each other; According to the image information in the imaging module, adjusting the reflection angle of the dual-band reflector group so that the focus spot of the first light beam, the focus spot of the second light beam and the nozzle hole of the nozzle overlap; The imaging module includes a secondary dichroic beam splitter, a first camera, a first imaging lens, a second camera and a second imaging lens. The secondary dichroic beam splitter is used to reflect the first light beam and transmit the second light beam. The first light beam is transmitted to the secondary dichroic beam splitter through the dual-band reflector group, and is reflected to the first imaging lens through the secondary dichroic beam splitter, and then enters the first camera through the first imaging lens. The second light beam is transmitted to the secondary dichroic beam splitter through the dual-band reflector group, and is transmitted to the second imaging lens through the secondary dichroic beam splitter, and then enters the second camera through the second imaging lens. The dual-band processing head further includes a first reflector, a second reflector and a third reflector, wherein the first reflector is arranged opposite to the first laser emitter, the third reflector is arranged opposite to the main dichroic beam splitter, the first light beam is reflected by the first reflector to the second reflector, and then reflected by the second reflector to the third reflector, and then reflected by the third reflector to the main dichroic beam splitter; The dual-band processing head further includes a first collimator and a second collimator, wherein the first collimator is disposed between the first reflector and the first laser emitter, and is used to collimate the light beam emitted by the first laser emitter to form a parallel light beam, and the second collimator is disposed between the main dichroic beam splitter and the second laser emitter, and is used to collimate the light beam emitted by the second laser emitter to form a parallel light beam; The dual-band reflector group comprises a first dual-band reflector and a second dual-band reflector, the first dual-band reflector has a first surface and a second surface, the primary dichroic beam splitter and the second dual-band reflector are both oriented toward the first surface of the first dual-band reflector, and the imaging module is oriented toward the second surface of the first dual-band reflector; The adjusting the focus spot size and position of the first light beam and the second light beam at the nozzle according to the image information in the imaging module specifically includes: Step 1: Adjust the second imaging lens so that the image in the second camera reaches a desired clarity; Step 2: Observe the size of the focused spot of the second light beam in the image of the second camera, reduce the size of the focused spot of the second light beam in the image of the second camera by adjusting the distance between the second laser emitter and the second collimator, and use the center point of the focused spot of the second light beam as a marking point; Step 3: Adjust the first imaging lens so that the image in the first camera reaches a desired clarity; Step 4: observing the size of the focused spot of the first light beam in the image of the first camera, and reducing the size of the focused spot of the first light beam in the image of the first camera by adjusting the distance between the first laser emitter and the first collimator; Step 5: observing the position between the focus spot of the first light beam and the marking point in the image of the first camera, and adjusting the inclination angle of at least one of the first reflector, the second reflector and the third reflector so that the center of the focus spot of the first light beam coincides with the marking point; Step 6: Repeat steps 1 to 5 until the focused spot of the first light beam and the focused spot of the second light beam are both in a minimum state and overlap; The step of adjusting the reflection angle of the dual-band reflector group according to the image information in the imaging module so that the focus spot of the first light beam, the focus spot of the second light beam and the nozzle hole of the nozzle overlap specifically includes: Observe the position between the nozzle and the marking point in the image of the first camera or the second camera, and adjust the tilt angle of the second dual-band reflector so that the center of the nozzle coincides with the marking point.

2. The focusing control method of the dual-band processing head of the micro jet laser device according to claim 1 is characterized in that: An aperture is arranged between the dual-band reflector group and the secondary dichroic beam splitter.

3. The focusing control method of the dual-band processing head of the micro jet laser device according to claim 1, characterized in that: The upper surface of the main dichroic beam splitter is provided with a first film layer, and the lower surface of the main dichroic beam splitter is provided with a second film layer, the first film layer is used to improve the transmittance of the second light beam, and the second film layer is used to improve the reflectivity of the first light beam and improve the transmittance of the second light beam; The first light beam is reflected from the lower surface of the main dichroic beam splitter to the dual-band reflector group, and the second light beam enters the main dichroic beam splitter through the upper surface of the main dichroic beam splitter and is transmitted from the main dichroic beam splitter to the dual-band reflector group.

4. The focusing control method of the dual-band processing head of the micro jet laser device according to claim 1, characterized in that: It also includes a dual-band focusing objective lens, a window sheet, and a water cavity which are sequentially arranged. There is a gap between the upper surface of the nozzle and the window sheet. The liquid in the water cavity flows through the gap to the nozzle hole of the nozzle. The dual-band focusing objective lens and the dual-band reflecting mirror group are arranged opposite to each other. The nozzle hole is a conical hole. The aperture of the conical hole on one side close to the window sheet is smaller than the aperture on the other side. The first light beam and the second light beam are reflected by the dual-band reflector group to the dual-band focusing objective lens, converged to the window plate by the dual-band focusing objective lens, and then propagated through the window plate to the nozzle hole of the nozzle.

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