Module dismounting device

Abstract

The invention discloses a module dismounting device, and relates to the technical field of servers, the module dismounting device comprises a fixed clamping plate, a movable clamping plate and a holding and pressing handle, the fixed clamping plate is provided with a first clamping surface, the first clamping surface is used for abutting against one end of a to-be-dismounted module, the movable clamping plate is rotatably connected to the fixed clamping plate, the movable clamping plate is provided with a second clamping surface, and the second clamping surface is used for abutting against the other end of the to-be-dismounted module. The movable clamping plate is used for rotating relative to the fixed clamping plate so that the second clamping face can abut against the other end of the to-be-disassembled module. The holding and pressing handle is arranged on the inner side of the fixed clamping plate and connected with the movable clamping plate, and the holding and pressing handle is used for driving the movable clamping plate to rotate relative to the fixed clamping plate so that the first clamping face and the second clamping face can abut against the two ends of the to-be-disassembled module correspondingly. The module dismounting device solves the problem that the module in the case is inconvenient to dismount.

Description

Technical Field

[0001] The present application relates to the technical field of servers, and in particular to a module disassembly device. Background Art

[0002] At present, in order to adapt to the data center environment of large-scale computing and storage resources, such as cloud computing, big data analysis and virtualization applications, server chassis often need to meet high configuration and high density requirements, which will make the space available for modules in the architecture extremely narrow. Therefore, the design and maintenance requirements become more difficult and demanding.

[0003] In the related art, the modules in the chassis are usually disassembled manually or with the help of small mechanical components such as handles. When the operating space of the hands is limited and it is impossible to place components such as handles, the disassembly purpose can only be achieved through unconventional operations, such as reverse separation and pressing the module. Unconventional operations have requirements for the disassembly environment used by repair personnel and maintainers. The external force applied during pressing and disassembly must be appropriate to prevent the module from falling; when the peripheral parts of the module are special-shaped, additional support fixtures are required. This type of operation method is relatively cumbersome, and there is a risk of damage due to unstable maintenance. In addition, some PCB boards, external boards, etc. that use male and female connectors for signal interconnection have limited operating space for disassembly. When disassembling the board, some components that are difficult to observe visually may be touched, which also poses a risk of damage or contamination of the components.

[0004] Therefore, it is necessary for those skilled in the art to provide a device that can facilitate the disassembly of modules in a chassis in a timely manner. Summary of the invention

[0005] The purpose of the present application is to provide a module disassembly device to solve the problem of inconvenient module disassembly in a chassis.

[0006] To achieve the above objectives, the present application provides a module disassembly device, comprising:

[0007] A fixed clamping plate, wherein the fixed clamping plate is provided with a first clamping surface, and the first clamping surface is used to abut against one end of the mold assembly to be removed;

[0008] A movable clamping plate, the movable clamping plate is rotatably connected to the fixed clamping plate, the movable clamping plate is provided with a second clamping surface, and the movable clamping plate is used to rotate relative to the fixed clamping plate so that the second clamping surface abuts against the other end of the mold group to be removed;

[0009] The squeezing handle is arranged on the inner side of the fixed clamping plate and is connected to the movable clamping plate. The squeezing handle is used to drive the movable clamping plate to rotate relative to the fixed clamping plate so that the first clamping surface and the second clamping surface respectively abut against the two ends of the mold group to be removed.

[0010] In some embodiments, the movable clamp has a first position and a second position, and the movable clamp is configured so that the second clamping surface and the first clamping surface respectively abut against the two ends of the mold group to be removed when the movable clamp is rotated from the first position to the second position, and the second clamping surface is separated from the mold group to be removed when the movable clamp is rotated from the second position to the first position.

[0011] In some embodiments, the end of the fixed clamping plate away from the first clamping surface is provided with a first limiting surface and a second limiting surface, and the first limiting surface and the second limiting surface have a preset angle;

[0012] The movable splint is provided with a third limiting surface, and the third limiting surface is used to contact and fit with the first limiting surface or the second limiting surface. The third limiting surface is configured to make the movable splint be in the first position when it contacts and fits with the first limiting surface, and to make the movable splint be in the second position when it contacts and fits with the second limiting surface.

[0013] In some embodiments, the length of the first limiting surface is equal to the length of the second limiting surface, and the range of the preset angle is 145-180°.

[0014] In some embodiments, the module disassembly device also includes an elastic member, the two ends of which are respectively connected to the fixed clamp and the movable clamp, and the elastic member is used to provide elastic force to the movable clamp so that the movable clamp has a tendency to turn from the second position to the first position.

[0015] In some embodiments, the fixed clamp plate is further provided with a first hook, the movable clamp plate is provided with a second hook, and both ends of the elastic member are respectively connected to the first hook and the second hook.

[0016] In some embodiments, the fixed clamping plate includes a handle portion and a first clamping portion, the handle portion is U-shaped, the first clamping portion is fixed to one end of the handle portion, and the movable clamping plate is rotatably connected to the other end of the handle portion;

[0017] The first clamping portion includes a connecting plate body and two spaced-apart clamping plate bodies, the connecting plate body extends along a first direction, the middle portion of the connecting plate body is connected to the handle portion, the two clamping plate bodies are respectively connected to two ends of the connecting plate body, the two clamping plate bodies both extend along a second direction perpendicular to the first direction, and the inner walls of the two clamping plate bodies jointly form the first clamping surface;

[0018] An end of the handle away from the first clamping portion is provided with a mounting groove and a pin, the axis of the pin is parallel to the connecting plate body, the pin passes through the mounting groove, and the movable clamp can rotate around the axis of the pin;

[0019] The movable clamping plate includes a rotating connecting part and a second clamping part, the rotating connecting part is installed in the installation groove, and the rotating connecting part is provided with a rotating connecting hole for the pin shaft to pass through, the second clamping part is fixed to the bottom of the rotating connecting part, the second clamping part is L-shaped, the second clamping surface is provided on the second clamping part, and the projection of the second clamping part on the first clamping part is located in the middle position of the two clamping plate bodies.

[0020] In some embodiments, the inner walls of the two clamping plate bodies and the inner wall of the second clamping portion are each provided with a pair of limiting protrusions, and a limiting groove is formed between any pair of the limiting protrusions, and the limiting groove is used for being embedded and matched with the module to be removed.

[0021] In some embodiments, the inner walls of the two clamping plate bodies and the inner wall of the second clamping portion are provided with anti-skid pads, and the anti-skid pads are used to increase the friction with the mold set to be removed and to prevent damage to the mold set to be removed.

[0022] In some embodiments, the fixing splint is an integral injection-molded structure, and the fixing splint further comprises reinforcing ribs, and the reinforcing ribs are used to connect the connecting plate body and the handle portion to strengthen the connection strength between the connecting plate body and the handle portion.

[0023] With respect to the above-mentioned background technology, the module disassembly device provided in the embodiment of the present application includes a fixed clamping plate, a movable clamping plate and a gripping handle, wherein the fixed clamping plate is provided with a first clamping surface, the first clamping surface is used to abut against one end of the module to be disassembled, the movable clamping plate is rotatably connected to the fixed clamping plate, the movable clamping plate is provided with a second clamping surface, the movable clamping plate is used to rotate relative to the fixed clamping plate so that the second clamping surface abuts against the other end of the module to be disassembled; the gripping handle is provided on the inner side of the fixed clamping plate, and the gripping handle is connected to the movable clamping plate, the gripping handle is used to drive the movable clamping plate to rotate relative to the fixed clamping plate so that the first clamping surface and the second clamping surface respectively abut against the two ends of the module to be disassembled.

[0024] During disassembly, according to the type of module to be disassembled, the module disassembly device is placed from the top or side of the module to be disassembled. For example, the module disassembly device is placed from the top of the module to be disassembled, so that the inner side of the fixed clamp is close to the module to be disassembled until the first clamping surface abuts against one end of the module to be disassembled, and then the clamping handle of the movable clamp is squeezed upward (or counterclockwise), and the movable clamp rotates inward and approaches the other end of the module to be disassembled until the second clamping surface abuts against the other end of the module to be disassembled. In this way, the fixed clamp and the movable clamp are respectively abutted against the two ends of the module to be disassembled, so that the module to be disassembled can be effectively grasped and prevented from loosening and sliding. When the two sides of the module disassembly device clamp the module to be disassembled, an external force is applied to the module to be disassembled to pull it upward, so as to realize the disassembly and separation of the module to be disassembled.

[0025] The module disassembly device thus provided has the following beneficial effects:

[0026] Firstly, the first clamping surface of the fixed clamping plate and the second clamping surface of the movable clamping plate are respectively abutted against the two ends of the module to be disassembled to achieve the clamping effect on the module to be disassembled, and the lever principle is used to generate pressure at the joint of the clamping plate and the module to be disassembled, so as to increase the contact area between the clamping plates on both sides and the module to be disassembled, increase the friction force, and realize the reliable and convenient disassembly of the module to be disassembled.

[0027] Secondly, during the disassembly operation, you only need to squeeze the gripping handle of the movable splint so that the movable splint rotates inward and grabs one side of the module to be disassembled, and the other side of the module to be disassembled cooperates with the clamping surface of the fixed splint. This makes it easy for the operator to apply force and control the lever, making it convenient for the operator to quickly grab and disassemble the module to be disassembled.

[0028] Thirdly, the module disassembly device of the present application occupies a small space and is easy to operate. It can adapt to modules to be disassembled of different shapes. For example, it can support the disassembly of modules to be disassembled and boards to be disassembled with relatively narrow disassembly operation space. When disassembling the module to be disassembled, the module disassembly device is placed from the top of the module to be disassembled. When disassembling the board to be disassembled, the module disassembly device is placed from the side of the board to be disassembled. This can protect the module to be disassembled and the board to be disassembled, reduce the risk of scratches and damage during disassembly, save maintenance costs, and improve maintenance efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the related technical descriptions are briefly introduced below. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0030] FIG1 is a schematic structural diagram of a first module disassembly device according to an embodiment of the present application;

[0031] FIG2 is a schematic diagram of a first state of the module disassembly device shown in FIG1 when in use;

[0032] FIG3 is a schematic diagram of a second state of the module disassembly device shown in FIG1 when in use;

[0033] FIG4 is a schematic diagram of the module disassembly device shown in FIG1 disassembling a module to be disassembled in a chassis;

[0034] FIG5 is a schematic structural diagram of a second module disassembly device in an embodiment of the present application;

[0035] FIG6 is a schematic diagram of a first state of the module disassembly device shown in FIG5 when in use;

[0036] FIG7 is a schematic diagram of a second state of the module disassembly device shown in FIG5 when in use;

[0037] FIG8 is a schematic diagram of the module disassembly device shown in FIG5 disassembling a board to be disassembled in a chassis.

[0038] in:

[0039] 10-fixed splint, 11-handle portion, 111-first limiting surface, 112-second limiting surface, 113-installation groove, 114-pin shaft, 12-first clamping portion, 121-connecting plate body, 122-splint body, 1221-limiting protrusion, 1222-limiting groove, 1223-anti-slip pad, 123-first clamping surface, 13-reinforcement rib;

[0040] 20-movable clamping plate, 21-rotational connection portion, 22-second clamping portion, 221-second clamping surface, 222-third limiting surface;

[0041] 30-grip and squeeze handle;

[0042] 40-elastic member, 41-first hook, 42-second hook;

[0043] 50-module to be removed;

[0044] 60-Board to be removed. DETAILED DESCRIPTION

[0045] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0046] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0047] Please refer to Figures 1 to 8, Figure 1 is a structural schematic diagram of the first module disassembly device in the embodiment of the present application; Figure 2 is a schematic diagram of the first state of the module disassembly device shown in Figure 1 when in use; Figure 3 is a schematic diagram of the second state of the module disassembly device shown in Figure 1 when in use; Figure 4 is a schematic diagram of the module disassembly device shown in Figure 1 disassembling a module to be disassembled in a chassis; Figure 5 is a structural schematic diagram of the second module disassembly device in the embodiment of the present application; Figure 6 is a schematic diagram of the first state of the module disassembly device shown in Figure 5 when in use; Figure 7 is a schematic diagram of the second state of the module disassembly device shown in Figure 5 when in use; Figure 8 is a schematic diagram of the module disassembly device shown in Figure 5 disassembling a board to be disassembled in a chassis.

[0048] Please refer to FIG. 1 , the module disassembly device provided in the embodiment of the present application includes a fixed clamping plate 10 , a movable clamping plate 20 and a gripping handle 30 .

[0049] The fixed clamping plate 10 is provided with a first clamping surface 123, which is used to abut against one end of the mold assembly to be removed. One side of the fixed clamping plate 10 can be connected to the movable clamping plate 20, and the other side is provided with at least two first clamping surfaces 123. The top of the fixed clamping plate 10 can be used as a handle for hand grasping.

[0050] The movable clamping plate 20 is rotatably connected to the fixed clamping plate 10 . The movable clamping plate 20 is provided with a second clamping surface 221 . The movable clamping plate 20 is used to rotate relative to the fixed clamping plate 10 so that the second clamping surface 221 abuts against the other end of the mold to be removed.

[0051] In this way, the first clamping surface 123 of the fixed clamping plate 10 and the second clamping surface 221 of the movable clamping plate 20 respectively abut against the two ends of the mold set to be removed, so as to achieve the clamping effect on the mold set to be removed.

[0052] The gripping handle 30 is arranged on the inner side of the fixed splint 10, and the gripping handle 30 is connected to the movable splint 20. The gripping handle 30 is located on one side of the movable splint 20. When disassembling, the gripping handle 30 is rotated counterclockwise. The gripping handle 30 is used to drive the movable splint 20 to rotate relative to the fixed splint 10, so that the first clamping surface 123 and the second clamping surface 221 respectively abut against the two ends of the module to be disassembled.

[0053] In this way, during the disassembly operation, one only needs to squeeze the gripping handle 30 of the movable clamp 20 so that the movable clamp 20 rotates inward and grasps one side of the module to be disassembled, and the other side of the module to be disassembled cooperates with the clamping surface of the fixed clamp 10. This makes it easy for the operator to apply force and facilitates the quick grasping and disassembly of the module 50 to be disassembled.

[0054] It should be noted that during disassembly, depending on the type of module to be disassembled, the module disassembly device can be placed from the top or side of the module to be disassembled. For example, the module disassembly device can be placed from the top of the module to be disassembled, so that the inner side of the fixed clamping plate 10 is close to the module to be disassembled until the first clamping surface 123 abuts against one end of the module to be disassembled, and then the clamping handle 30 of the movable clamping plate 20 is squeezed upward (or counterclockwise), and the movable clamping plate 20 rotates inward and approaches the other end of the module to be disassembled until the second clamping surface 221 abuts against the other end of the module to be disassembled.

[0055] In this way, by the fixed clamp 10 and the movable clamp 20 respectively abutting against the two ends of the module to be disassembled, the module to be disassembled can be effectively grasped to prevent the module from loosening and sliding. When the two sides of the module disassembly device clamp the module to be disassembled, external force is applied to the module to be disassembled to pull it upward, thereby realizing the disassembly and separation of the module to be disassembled.

[0056] The module disassembly device thus provided has the following beneficial effects:

[0057] Firstly, the first clamping surface 123 of the fixed clamping plate 10 and the second clamping surface 221 of the movable clamping plate 20 are respectively abutted against the two ends of the module to be disassembled to achieve the clamping effect on the module to be disassembled, and the lever principle is used to generate pressure at the joint of the clamping plate and the module to be disassembled, which can increase the contact area between the clamping plates on both sides and the module to be disassembled, increase the friction force, and realize reliable and convenient disassembly of the module to be disassembled.

[0058] Secondly, during the disassembly operation, it is only necessary to squeeze the gripping handle 30 of the movable clamp 20 so that the movable clamp 20 rotates inward and grasps one side of the module to be disassembled, and the other side of the module to be disassembled cooperates with the clamping surface of the fixed clamp 10. This makes it convenient for the operator to easily apply force and control the lever, thereby facilitating the quick grabbing and disassembly of the module 50 to be disassembled.

[0059] Thirdly, the module disassembly device of the present application occupies a small space and is easy to operate. It can adapt to modules to be disassembled of different shapes. For example, it can support the disassembly of modules to be disassembled 50 and boards to be disassembled 60 with relatively narrow disassembly operation space. When disassembling the module to be disassembled 50, the module disassembly device is placed from the top of the module to be disassembled 50. When disassembling the board to be disassembled 60, the module disassembly device is placed from the side of the board to be disassembled 60. This can protect the module to be disassembled 50 and the board to be disassembled 60, reduce the risk of scratches and damage during disassembly, save maintenance costs, and improve maintenance efficiency.

[0060] Please refer to FIG. 2 , FIG. 3 and FIG. 4 . On the basis of the above, the design of the movable clamping plate 20 can realize the conversion between different positions by utilizing the lever principle, so as to clamp and release the module 50 to be disassembled.

[0061] In some embodiments, the movable clamp 20 has a first position and a second position. The movable clamp 20 is configured so that the second clamping surface 221 and the first clamping surface 123 respectively abut against the two ends of the mold group to be removed when it is rotated from the first position to the second position, and the second clamping surface 221 is separated from the mold group to be removed when it is rotated from the second position to the first position.

[0062] That is to say, when the movable clamp 20 is in the first position, the entire module disassembly device is in an open state. At this time, the module disassembly device can be placed from the top or side of the module to be disassembled to both sides of the module to be disassembled. When the movable clamp 20 is in the second position, the entire module disassembly device is in a relatively closed state, so that the first clamping surface 123 of the fixed clamp 10 and the second clamping surface 221 of the movable clamp 20 are respectively abutted and cooperated with the two ends of the module to be disassembled to achieve the clamping effect on the module to be disassembled.

[0063] In some embodiments, a first limiting surface 111 and a second limiting surface 112 are formed at one end of the fixing clamping plate 10 away from the first clamping surface 123 , and the first limiting surface 111 and the second limiting surface 112 have a preset angle.

[0064] Correspondingly, the movable splint 20 is provided with a third limiting surface 222, which is used to contact and fit with the first limiting surface 111 or the second limiting surface 112. The third limiting surface 222 is configured to make the movable splint 20 in the first position when it contacts and fits with the first limiting surface 111, and to make the movable splint 20 in the second position when it contacts and fits with the second limiting surface 112.

[0065] Specifically, both the first limiting surface 111 and the second limiting surface 112 can be set as planes. Taking Figure 2 or 3 as a reference, the second limiting surface 112 is a horizontal plane, and the first limiting surface 111 is an inclined plane. The inclined plane forms a preset angle with the horizontal plane. The length of the first limiting surface 111 is equal to the length of the second limiting surface 112, and the range of the preset angle is 145-180°.

[0066] The setting of the above-mentioned first limiting surface 111 can prevent the movable splint 20 from excessively rotating during the process of rotating from the second position to the first position, and the second limiting surface 112 can prevent the movable splint 20 from excessively rotating during the process of rotating from the first position to the second position, while ensuring the distance between the gripping handle 30 and the top of the fixed splint 10 to avoid squeezing the hand when force is applied.

[0067] Preferably, the angle between the first limiting surface 111 and the second limiting surface 112 can be 150°. In this way, during the disassembly operation, the holding handle 30 of the movable splint 20 is held to rotate the movable splint 20 inward 30°. In this way, the movable splint 20 can be turned from the first position to the second position. The movable splint 20 grasps one side of the module to be disassembled, and the other side of the module to be disassembled cooperates with the clamping surface of the fixed splint 10, which facilitates the rapid grasping and disassembly of the module 50 to be disassembled.

[0068] During the disassembly operation, rotating the movable splint 20 inwardly by 30° instead of a larger angle has the following advantages:

[0069] Precise control: A smaller rotation angle can provide more precise control to ensure that the movable clamping plate 20 accurately reaches the predetermined position, which is particularly important for operations on the module 50 to be removed that require precise alignment and clamping.

[0070] Reduced movement distance: A smaller angle reduces the distance that the movable splint 20 rotates, which helps to speed up the operation and reduce errors caused by long-distance movement.

[0071] Reduced force requirements: A smaller rotation angle means that the force applied to the gripping handle 30 can be relatively small, thereby reducing the force requirements of the operator and making the operation easier.

[0072] Improved response speed: A shorter rotation path can make the movable clamping plate 20 respond faster, which is very helpful for application scenarios that require rapid clamping and release of the module 50 to be removed.

[0073] Reducing mechanical wear: A smaller rotation angle can reduce the friction and wear between the movable clamping plate 20 and the fixed clamping plate 10, thereby extending the service life of the module disassembly device.

[0074] Space saving: A smaller rotation angle can make the overall design of the module disassembly device more compact, making it easier for the module disassembly device to perform the disassembly operation of the module to be disassembled in a limited space.

[0075] Safety: A smaller rotation angle can reduce unexpected situations caused by excessive rotation, such as collision or interference with other structural parts, thereby improving operational safety.

[0076] In some embodiments, the module disassembly device also includes an elastic member 40, the two ends of which are respectively connected to the fixed clamp 10 and the movable clamp 20, and the elastic member 40 is used to provide elastic force to the movable clamp 20 so that the movable clamp 20 has a tendency to turn from the second position to the first position.

[0077] In this embodiment, the elastic member 40 is specifically a tension spring member, one end of the tension spring member is fixed to the fixed splint 10, and the other end is fixed to the movable splint 20. When the movable splint 20 is in the first position, the tension spring member can be in the original length state. When the movable splint 20 is in the second position, the tension spring member is in a tensioned state. The tension spring member in the tensioned state can provide elastic force to the movable splint 20, so that the movable splint 20 has a reset tendency to return from the second position to the first position.

[0078] In this way, when disassembling, according to the type of the module to be disassembled, the module disassembly device is placed from the top or side of the module to be disassembled, for example, the module disassembly device is placed from the top of the module to be disassembled, so that the inner side of the fixed clamping plate 10 is close to the module to be disassembled until the first clamping surface 123 abuts against one end of the module to be disassembled, and then the clamping handle 30 of the movable clamping plate 20 is squeezed upward (or counterclockwise), and the movable clamping plate 20 rotates inward and approaches the other end of the module to be disassembled until the second clamping surface 221 abuts against the other end of the module to be disassembled. When the two sides of the module disassembly device clamp the module to be disassembled, an external force is applied to the module to be disassembled, and it is pulled upward to achieve disassembly and separation.

[0079] After the disassembly is completed, the gripping handle 30 is released, and the tension spring member on the side gradually moves the movable clamping plate 20 to a released state, so that the user can safely use the module disassembly device next time.

[0080] It is understandable that the setting of the above-mentioned first limiting surface 111 can also prevent the tension spring member in a free state from loosening, thereby preventing the movable clamp 20 from excessively returning under the elastic force of the tension spring member, causing the tension spring member to loosen.

[0081] To facilitate installation of the elastic member 40 , the fixed clamp plate 10 is further provided with a first hook 41 , and the movable clamp plate 20 is provided with a second hook 42 . Both ends of the elastic member 40 are respectively connected to the first hook 41 and the second hook 42 .

[0082] In this way, the two ends of the elastic member 40 are respectively connected to the side edges of the movable splint 20 and the fixed splint 10, so that a restoring elastic force is generated on the movable splint 20 during the squeezing of the squeezing handle 30, so that after the squeezing handle 30 is released, the elastic member 40 on the side gradually moves the movable splint 20 to a released state, making it convenient for the user to safely use the module disassembly device next time.

[0083] In some embodiments, the fixed splint 10 includes a handle portion 11 and a first clamping portion 12 , the handle portion 11 is U-shaped, the first clamping portion 12 is fixed to one end of the handle portion 11 , and the movable splint 20 is rotatably connected to the other end of the handle portion 11 .

[0084] In this embodiment, the first clamping portion 12 includes a connecting plate body 121 and two spaced-apart splint bodies 122, the connecting plate body 121 extends along a first direction, the middle portion of the connecting plate body 121 is connected to the handle portion 11, the two splint bodies 122 are respectively connected to the two ends of the connecting plate body 121, the two splint bodies 122 both extend along a second direction perpendicular to the first direction, and the inner walls of the two splint bodies 122 jointly form a first clamping surface 123.

[0085] It should be noted that the first direction may be the X-axis direction as shown in FIG. 1 , and the second direction may be the Z-axis direction as shown in FIG. 1 .

[0086] It is understandable that two clamping plate bodies 122 are provided on one side of the fixed clamping plate 10. The two clamping plate bodies 122 can increase the contact area between one side of the fixed clamping plate 10 and the module to be removed, thereby increasing the friction force and ensuring a stable and reliable connection between the module removal device and the module to be removed during the removal process. The other side of the fixed clamping plate 10 is rotatably connected to the movable clamping plate 20, and the top of the fixed clamping plate 10 can be used as a handle for hand grasping.

[0087] In order to facilitate the movable splint 20 to be rotatably connected to the other end of the handle portion 11, an installation groove 113 and a pin shaft 114 are provided at the end of the handle portion 11 away from the first clamping portion 12. The axis of the pin shaft 114 is parallel to the connecting plate body 121, that is, the axis of the pin shaft 114 is arranged along the first direction. The pin shaft 114 passes through the installation groove 113 and connects the movable splint 20 and the fixed splint 10. At the same time, the movable splint 20 can be rotatably arranged in the installation groove 113 around the axis of the pin shaft 114.

[0088] More specifically, the movable splint 20 includes a rotating connection portion 21 and a second clamping portion 22. The rotating connection portion 21 is installed in the installation groove 113. The rotating connection portion 21 can be a T-shaped structure, and the rotating connection portion 21 is provided with a rotating connection hole for the pin shaft 114 to pass through. The pin shaft 114 passes through the through hole on the fixed splint 10 and the rotating connection hole of the rotating connection portion 21 to connect the movable splint 20 and the fixed splint 10, and at the same time make the movable splint 20 rotate around the axis of the pin shaft 114; the second clamping portion 22 is fixed to the bottom of the rotating connection portion 21, the second clamping portion 22 is L-shaped, and the second clamping surface 221 is provided on the second clamping portion 22. The projection of the second clamping portion 22 on the first clamping portion 12 is located in the middle position of the two splint bodies 122.

[0089] It can be seen that the L-shaped design of the second clamping portion 22 can provide better stability. The second clamping portion 22 occupies a clear position in space, which helps to maintain the stability of the structure when clamping the module to be removed. At the same time, the L-shaped second clamping portion 22 can be close to the bottom of the rotating connection portion 21, which can make more effective use of space, thereby reducing the occupation of surrounding space. In addition, the L-shaped structure usually has a higher structural strength and can provide good bending and torsion resistance, which is an important feature for clamping heavy objects or working under stress conditions. The projection of the second clamping portion 22 on the first clamping portion 12 is located in the middle of the two clamping plate bodies 122, which can more accurately position the module to be removed and ensure that the module to be removed will not be offset during the clamping process.

[0090] For different types of modules to be disassembled, the fixed clamping plate 10 and the movable clamping plate 20 of the module disassembly device may be arranged in different ways to ensure the clamping stability of the corresponding modules to be disassembled.

[0091] In some embodiments, please refer to Figures 5 to 8 together. When it is necessary to remove the board 60 to be removed in the chassis (the board 60 to be removed is used to place multiple devices, and the space available for disassembly operations is limited, only the edges can be used, and the bottom of the board 60 to be removed is connected to the mainboard through a connector), considering the shape of the board 60 to be removed and the thickness of the board body, the inner walls of the two clamping plate bodies 122 and the inner walls of the second clamping portion 22 are provided with a pair of limiting protrusions 1221, and a limiting groove 1222 is formed between any pair of limiting protrusions 1221, and the limiting groove 1222 is used to be embedded and matched with the edge of the board 60 to be removed.

[0092] Specifically, taking the two limiting protrusions 1221 on the inner wall of the clamp body 122 as an example, the size of the two limiting protrusions 1221 along the second direction (or vertical direction) gradually decreases in the direction away from the clamp body 122, so that the size of the limiting groove 1222 formed between the two limiting protrusions 1221 along the second direction (or vertical direction) gradually decreases in the direction close to the clamp body 122. In this way, a flared limiting groove 1222 can be formed so that the edge of the board 60 to be removed can be fitted in the limiting groove 1222.

[0093] During disassembly, choose to place the module disassembly device from the side of the board 60 to be disassembled, so that the limit groove 1222 on the fixed clamp 10 is embedded in the side edge of the board 60 to be disassembled, and then, squeeze the clamping handle 30 of the movable clamp 20 upward (or counterclockwise), and the movable clamp 20 rotates inward and approaches the other end of the board 60 to be disassembled until the limit groove 1222 on the movable clamp 20 is embedded in the other side edge of the board 60 to be disassembled, so that the purpose of clamping the board 60 to be disassembled can be achieved.

[0094] In some embodiments, when it is necessary to remove the module 50 to be removed in the chassis (the module 50 to be removed is located in a narrow area in the chassis, surrounded by other non-removable parts, and the bottom of the module 50 to be removed is connected to the chassis through a connector or other means), the inner walls of the two clamping bodies 122 and the inner walls of the second clamping portion 22 are provided with anti-slip pads 1223, and the anti-slip pads 1223 are nested in the corresponding clamping surfaces. The anti-slip pads 1223 are used to increase the friction with the module 50 to be removed and to prevent damage to the module 50 to be removed.

[0095] It can be seen that the method of adding the anti-slip mat 1223 can bring the following benefits:

[0096] Increase friction: The anti-skid pad 1223 increases the roughness of the contact surface, thereby increasing the friction between the clamping plate and the module 50 to be removed, thereby preventing the module from sliding or falling off during the clamping process.

[0097] Protecting the module: The soft or elastic anti-skid pad 1223 can protect the surface of the module to avoid scratches, indentations or other damages caused by hard contact during the clamping process.

[0098] Reduce vibration: During dynamic operation, the anti-skid pad 1223 can absorb and reduce vibration, thereby reducing potential damage to the module and improving the stability of operation.

[0099] Adapt to different surfaces: The anti-slip pad 1223 can be designed into modules that adapt to different materials and surface characteristics, thereby providing consistent clamping performance.

[0100] When designing the anti-skid pad 1223, factors to be considered include material selection, surface treatment, durability, and cleaning and maintenance. Among them, material selection: select a suitable anti-skid pad 1223 material according to the material and surface characteristics of the module 50 to be removed, such as rubber, silicone, foam or other synthetic materials; surface treatment: the surface treatment of the anti-skid pad 1223 needs to be able to provide sufficient friction without causing damage to the module surface; durability: the anti-skid pad 1223 needs to be durable enough to withstand repeated clamping and disassembly operations; cleaning and maintenance: the anti-skid pad 1223 should be easy to clean and maintain to maintain its performance and hygiene.

[0101] During disassembly, the module disassembly device is placed from the top of the module 50 to be disassembled, so that the first limiting surface 111 on the fixed clamp 10 is in contact with one end of the module 50 to be disassembled, and then the clamping handle 30 of the movable clamp 20 is squeezed upward (or counterclockwise), and the movable clamp 20 rotates inward and approaches the other end of the module 50 to be disassembled, until the second limiting surface 112 on the movable clamp 20 is in contact with the other end of the module 50 to be disassembled, thereby achieving the purpose of clamping the module 50 to be disassembled.

[0102] In some embodiments, both the first clamping surface 123 of the fixed clamping plate 10 and the second clamping surface 221 of the movable clamping plate 20 are provided with a pressure sensor or a clamping force detection sheet for detecting the magnitude of the clamping force.

[0103] Furthermore, a controller and a display may be provided, wherein the controller is communicatively connected with the pressure sensor or the clamping force detection piece and the display, and is used to display the clamping force value detected by the pressure sensor or the clamping force detection piece in real time, so that the operator can adjust the gripping force in time.

[0104] In this way, by real-time monitoring of the clamping force of the clamps on both sides, it can be ensured that the module 50 to be removed is clamped safely and stably, avoiding damage to the module or accidental falling off due to excessive or insufficient clamping force. This precise control is particularly important for the disassembly of precision components and sensitive components in the chassis.

[0105] It should be emphasized that since different modules in the chassis require different clamping forces, through sensor feedback, operators can adjust the clamping force according to the characteristics of different modules to improve the adaptability and flexibility of the device. When the clamping force exceeds the preset safety threshold, a corresponding warning component can be set, which can issue an alarm to avoid the risk of damage to the module.

[0106] The safety thresholds of the above-mentioned different modules can be determined by testing the clamping force or grasping force of the corresponding modules, analyzing the effects of using different pressure sensors and changing test parameters on the test results, and thereby testing the appropriate clamping force corresponding to different modules to be disassembled, thereby ensuring that the module 50 to be disassembled is clamped safely and stably, and avoiding module damage or accidental falling off due to excessive or insufficient clamping force.

[0107] In some embodiments, the fixing splint 10 is an integral injection-molded structure, and the fixing splint 10 further includes a reinforcing rib 13, which is used to connect the handle portion 11 and the connecting plate body 121 to strengthen the connection strength between the connecting plate body 121 and the handle portion 11. In this way, the handle portion 11 and the connecting plate body 121 of the fixing splint 10 are connected by the reinforcing rib 13, which can improve the overall structural strength of the fixing splint 10.

[0108] When using the module disassembly device, during the disassembly operation, the movable clamping plate 20 is rotated inward by squeezing the gripping handle 30 of the movable clamping plate 20, and one end of the module to be disassembled is grasped, while the other end cooperates with the fixed clamping plate 10, which can increase the contact area between the clamping plate and the module to be disassembled, increase the friction, and facilitate the disassembly of the module without loosening and slipping, thereby achieving convenient disassembly. After the disassembly is completed, the side elastic member 40 moves the movable clamping plate 20 to the released state. The module disassembly device can adapt to different shapes, and through effective clamping and force application, the module or board can be quickly disassembled, saving maintenance time and cost and improving maintenance efficiency.

[0109] The module disassembly device of the present application occupies a small space and is easy to operate. It can adapt to modules to be disassembled of different shapes. For example, it can support the disassembly of modules 50 to be disassembled and boards 60 to be disassembled whose disassembly operation space is relatively narrow. When disassembling the module 50 to be disassembled, the module disassembly device is placed from the top of the module 50 to be disassembled. When disassembling the board 60 to be disassembled, the module disassembly device is placed from the side of the board 60 to be disassembled. This can protect the module 50 to be disassembled and the board 60 to be disassembled, reduce the risk of scratches and damage during disassembly, save maintenance costs, and improve maintenance efficiency.

[0110] It should be noted that, in this specification, relational terms such as first and second are merely used to distinguish one entity from other entities, but do not necessarily require or imply any actual relationship or order between these entities.

[0111] The module disassembly device provided by the present application is introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the scheme and core ideas of the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the present application.

Claims

1. A module disassembly device, characterized in that: include: A fixed clamping plate, wherein the fixed clamping plate is provided with a first clamping surface, and the first clamping surface is used to abut against one end of the mold assembly to be removed; A movable clamping plate, the movable clamping plate is rotatably connected to the fixed clamping plate, the movable clamping plate is provided with a second clamping surface, and the movable clamping plate is used to rotate relative to the fixed clamping plate so that the second clamping surface abuts against the other end of the mold group to be removed; The squeezing handle is arranged on the inner side of the fixed clamping plate and is connected to the movable clamping plate. The squeezing handle is used to drive the movable clamping plate to rotate relative to the fixed clamping plate so that the first clamping surface and the second clamping surface respectively abut against the two ends of the mold group to be removed.

2. The module disassembly device according to claim 1, characterized in that: The movable clamp has a first position and a second position. The movable clamp is configured so that the second clamping surface and the first clamping surface respectively abut against the two ends of the mold group to be removed when the movable clamp is rotated from the first position to the second position, and the second clamping surface is separated from the mold group to be removed when the movable clamp is rotated from the second position to the first position.

3. The module disassembly device according to claim 2, characterized in that: The fixed clamping plate is provided with a first limiting surface and a second limiting surface at one end away from the first clamping surface, and the first limiting surface and the second limiting surface have a preset angle; The movable splint is provided with a third limiting surface, and the third limiting surface is used to contact and fit with the first limiting surface or the second limiting surface. The third limiting surface is configured to make the movable splint be in the first position when it contacts and fits with the first limiting surface, and to make the movable splint be in the second position when it contacts and fits with the second limiting surface.

4. The module disassembly device according to claim 3, characterized in that: The length of the first limiting surface is equal to the length of the second limiting surface, and the range of the preset angle is 145-180°.

5. The module disassembly device according to claim 4, characterized in that: The module disassembly device also includes an elastic member, both ends of which are respectively connected to the fixed clamping plate and the movable clamping plate, and the elastic member is used to provide elastic force to the movable clamping plate so that the movable clamping plate has a tendency to turn from the second position to the first position.

6. The module disassembly device according to claim 5, characterized in that: The fixed clamping plate is further provided with a first hook, the movable clamping plate is provided with a second hook, and the two ends of the elastic member are respectively clamped to the first hook and the second hook.

7. The module disassembly device according to any one of claims 1 to 6, characterized in that: The fixed clamping plate comprises a handle portion and a first clamping portion, the handle portion is U-shaped, the first clamping portion is fixed to one end of the handle portion, and the movable clamping plate is rotatably connected to the other end of the handle portion; The first clamping portion includes a connecting plate body and two spaced-apart clamping plate bodies, the connecting plate body extends along a first direction, the middle portion of the connecting plate body is connected to the handle portion, the two clamping plate bodies are respectively connected to two ends of the connecting plate body, the two clamping plate bodies both extend along a second direction perpendicular to the first direction, and the inner walls of the two clamping plate bodies jointly form the first clamping surface; An end of the handle away from the first clamping portion is provided with a mounting groove and a pin, the axis of the pin is parallel to the connecting plate body, the pin passes through the mounting groove, and the movable clamp can rotate around the axis of the pin; The movable clamping plate includes a rotating connecting part and a second clamping part, the rotating connecting part is installed in the installation groove, and the rotating connecting part is provided with a rotating connecting hole for the pin shaft to pass through, the second clamping part is fixed to the bottom of the rotating connecting part, the second clamping part is L-shaped, the second clamping surface is provided on the second clamping part, and the projection of the second clamping part on the first clamping part is located in the middle position of the two clamping plate bodies.

8. The module disassembly device according to claim 7, characterized in that: The inner walls of the two clamping plate bodies and the inner wall of the second clamping portion are each provided with a pair of limiting protrusions, and a limiting groove is formed between any pair of the limiting protrusions, and the limiting groove is used for being embedded and matched with the module to be removed.

9. The module disassembly device according to claim 7, characterized in that: The inner walls of the two clamping plate bodies and the inner wall of the second clamping portion are both provided with anti-skid pads, and the anti-skid pads are used to increase the friction with the mold set to be removed and to prevent the mold set to be removed from being damaged.

10. The module disassembly device according to claim 7, characterized in that: The fixing clamp is an integral injection-molded structure and further comprises a reinforcing rib, wherein the reinforcing rib is used to connect the connecting plate body and the handle portion to strengthen the connection strength between the connecting plate body and the handle portion.

Images