Waveform backflow texturing die and die texturing method thereof

Abstract

The application discloses a waveform backflow line processing die and a die processing method thereof. The die comprises a lower die, a middle die and an upper die. The upper die, the lower die and the middle die form a molding cavity. The lower half of the outer side surface of the upper die has backflow lines. The upper die has a molding side surface. The molding side surface has backflow lines. The backflow lines are waveform backflow lines. The lower part of the molding side surface is a contact support surface. The contact support surface is above the lower end surface of the upper die. The lower die has a molding bottom surface. The molding bottom surface has a part in the molding cavity. The molding bottom surface has a part outside the molding cavity and in contact with the contact support. The lower die has a middle end surface. The middle end surface is inside the molding bottom surface. The height of the middle bottom surface is lower than the height of the molding bottom surface. A gap is formed between the molding bottom surface and the lower end surface of the upper die. The application facilitates the processing of the waveform backflow lines of the seal in the molding cavity, increases the processing yield and ensures the sealing effect of the seal.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of reflow texturing device of seal, in particular to a wave reflow texturing die and a die processing method thereof. BACKGROUND

[0002] The existing die with reflow texturing seal processing generally includes an upper die, a lower die and a middle die, and some have lower die inserts or upper dies, but the original die processing process is not convenient for processing the seal with wave reflow texturing due to the fluctuating air flow generated during the rubber flow process caused by the wave reflow texturing structure, which can easily cause defects in the reflow texturing of the seal or even waste. SUMMARY

[0003] To solve the technical problems in the background art, the present application provides a wave reflow texturing die and a die processing method thereof.

[0004] The present application provides a wave reflow texturing die and a die, which includes a lower die, a middle die and an upper die, the middle die is located between the upper die and the lower die, the lower die, the upper die and the middle die form a forming cavity, and a metal skeleton is placed in the forming cavity.

[0005] The upper die has a first horizontal stepped surface and a second horizontal stepped surface, the second horizontal stepped surface is located below the first horizontal stepped surface and forms the top surface of the forming cavity, the first horizontal stepped surface is in contact with the upper end surface of the middle die, and the first horizontal stepped surface and the second horizontal stepped surface are connected by a connecting surface, and the connecting surface is in contact with the middle die.

[0006] The upper die has a forming side surface, the forming side surface has a reflow texturing, the reflow texturing is a wave reflow texturing, the lower side of the forming side surface is a contact support surface, and the contact support surface is located above the lower end surface of the upper die.

[0007] The lower die has a forming bottom surface, the forming bottom surface has a part located in the forming cavity, the forming bottom surface has a part located outside the forming cavity and in contact with the contact support, the lower die has a middle end surface, the middle end surface is located on the inner side of the forming bottom surface and the height of the middle bottom surface is lower than the height of the forming bottom surface, and the forming bottom surface and the lower end surface of the upper die form a gap.

[0008] The first horizontal stepped surface, the second horizontal stepped surface, the gap, the forming bottom surface and the part of the forming bottom surface located outside the forming cavity and in contact with the contact support facilitate the processing of the wave reflow texturing, increase the processing yield and ensure the sealing effect of the seal.

[0009] Preferably, the reflow lines comprise wave crests and wave troughs alternately arranged, and the wave crests and the wave troughs are connected by smooth curves.

[0010] Preferably, the wave-shaped lines are located on the lip of the seal processed by the forming cavity.

[0011] Preferably, the height of the gap is greater than the width of the abutting support surface.

[0012] Preferably, the middle end surface and the forming bottom surface are connected by a second transition surface, the abutting support surface and the lower end surface of the upper die are connected by a first transition surface, and the first transition surface, the second transition surface and the middle end surface form an overflow groove.

[0013] Preferably, the gap is in communication with the overflow groove.

[0014] Preferably, the first transition surface is an inclined surface gradually inclined downward from the side close to the forming cavity to the side away from the forming cavity.

[0015] Preferably, the second transition surface is a vertical surface.

[0016] Preferably, the connecting surface comprises a first inclined surface and a second inclined surface connected, the first inclined surface is connected with the first horizontal stepped surface, the second horizontal stepped surface is connected with the second inclined surface, and the inclination angle of the first inclined surface relative to the horizontal direction is greater than the inclination angle of the second inclined surface relative to the horizontal direction.

[0017] A processing method of reflow lines on an upper die, the upper die is made of high-carbon high-chromium material, first, the blank of the upper die is semi-finished by a numerical control lathe to form a semi-finished part, leaving a 0.3mm margin on one side, then the semi-finished part is vacuum quenched to make the hardness reach HRC50-60 to form a quenched part, then the quenched part is finished by a numerical control lathe, and the radial and height dimensions are required to be within 0.01mm, finally, the size and shape of the reflow lines are processed by a high-precision five-axis engraving equipment according to the three-dimensional modeling of the wave and the wave trough.

[0018] In the present application, the proposed wave-shaped reflow line processing die and the die processing method thereof, through the first horizontal stepped surface, the second horizontal stepped surface, the gap, the forming bottom surface, the forming bottom surface having a part located outside the forming cavity and abutting against the abutting support, facilitate the processing of the wave-shaped reflow lines, increase the processing yield, and ensure the sealing effect of the seal.

[0019] Additional aspects and advantages of the present application will be made apparent from the following description. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 This is a schematic diagram of the structure of the present invention;

[0021] Figure 2 This is a partially enlarged view of the connection between the lower mold and the upper mold of the present invention;

[0022] Figure 3 This is a schematic diagram of the backflow ripple peak structure of the upper mold of the present invention;

[0023] Figure 4 This is a schematic diagram of the backflow ripple valley structure of the upper mold of the present invention;

[0024] Figure 5 This is a schematic diagram of the structure of the flow pattern after it has been unfolded according to the present invention;

[0025] In the diagram: 1. Lower mold; 10. Molding bottom surface; 11. Middle end face; 2. Middle mold; 3. Upper mold; 30. First horizontal step surface; 31. Second horizontal step surface; 32. Connecting surface; 320. First inclined surface; 321. Second inclined surface; 33. Molding side surface; 34. Abutting support surface; 4. Skeleton; 5. Gap; 6. Crest; 7. Trough; 8. Second transition surface; 9. First transition surface; 13. Overflow groove. Detailed Implementation

[0026] Embodiments of the present invention are described in detail below. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar symbols denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0027] like Figures 1-2 The diagram shows a wave-shaped backflow pattern processing mold, including a lower mold 1, a middle mold 2, and an upper mold 3. The middle mold 2 is located between the upper mold 3 and the lower mold 1. The lower mold 1, the upper mold 3, and the middle mold 2 form a cavity. A metal skeleton 4 is placed inside the cavity. The upper mold 3 has a first horizontal step surface 30 and a second horizontal step surface 31. The second horizontal step surface 31 is located below the first horizontal step surface 30 and forms the top surface of the cavity. The first horizontal step surface 30 abuts against the upper end surface of the middle mold 2. The first horizontal step surface 30 and the second horizontal step surface 31 are connected by a connecting surface 32, which abuts against the middle mold 2.

[0028] The upper mold 3 has a forming side surface 33, and the forming side surface 33 has a return flow pattern, which is a wave-shaped return flow pattern, such as... Figures 4-5As shown, the end of the backflow pattern on the lip of the seal processed by the mold comprises a plurality of peaks 6 and troughs 7, which are alternately distributed on the outer side of the upper mold 3 and connected by smooth curves. The peaks 6, troughs 7 and smooth curves form a wave-shaped backflow pattern as shown in Figures 3-5

[0029] The lower side of the forming side 33 is a contact support surface 34, which is located above the lower end surface of the upper mold 3.

[0030] The lower mold 1 has a forming bottom surface 10, which has a part located in the forming cavity and a part located outside the forming cavity and in contact with the contact support. The lower mold 1 has a middle end surface 11, which is located inside the forming bottom surface 10 and has a height lower than that of the forming bottom surface 10. The forming bottom surface 10 and the lower end surface of the upper mold 3 form a gap 5.

[0031] The first horizontal stepped surface, the second horizontal stepped surface, the gap 5, the forming bottom surface 10, the part of the forming bottom surface 10 located outside the forming cavity and in contact with the contact support facilitate the processing of the wave-shaped backflow pattern, increase the processing yield and ensure the sealing effect of the seal.

[0032] To further increase the yield of the wave-shaped backflow pattern, preferably, the height of the gap 5 is greater than the width of the contact support surface 34.

[0033] To further increase the yield of the wave-shaped backflow pattern, preferably, the middle end surface 11 and the forming bottom surface 10 have a second transition surface 8, the contact support surface 34 and the lower end surface of the upper mold 3 are connected by a first transition surface 9, the first transition surface 9, the second transition surface 8 and the middle end surface 11 form an overflow groove 13, and the gap 5 communicates with the overflow groove 13, facilitating the flow of gas during processing.

[0034] Preferably, the first transition surface 9 is a slope gradually inclined downward from the side close to the forming cavity to the side away from the forming cavity, the first transition surface 9 is a vertical surface, thereby forming an overflow groove 13 with a triangular cross section, and the lower side of the overflow groove 13 communicates with the gap 5, further facilitating the processing of the wave-shaped backflow pattern.

[0035] ​In order to further facilitate the processing of the reflow lines, the connecting surface 32 comprises a first inclined surface 320 and a second inclined surface 321 connected to each other, the first inclined surface 320 is connected to the first horizontal stepped surface 30, the second horizontal stepped surface 31 is connected to the second inclined surface 321, the inclination angle of the first inclined surface 320 relative to the horizontal direction is greater than the inclination angle of the second inclined surface 321 relative to the horizontal direction, that is, the upper die 3 and the middle die 2 far away from the outside of the cavity of the reflow line are in contact, and the middle die 2 and the lower die 1 are in contact, thereby ensuring the yield of the reflow line part and increasing the sealing performance of the molded part.

[0036] A processing method of the reflow line on the upper die 3: the upper die 3 is made of high-carbon high-chromium material, first, the blank of the upper die 3 is semi-finished by a numerical control lathe to form a semi-finished part, and a 0.3mm margin is left on one side, then the semi-finished part is vacuum quenched to make its hardness reach HRC50-60 to form a quenched part, then the quenched part is finished by a numerical control lathe, and the range of the radial and height dimensions is required to be within 0.01mm, so as to provide a good working surface for subsequent processing of the reflow line, so as to accurately process the reflow line. Finally, the size and shape are processed by high-precision five-axis engraving equipment according to the three-dimensional modeling of the wave peak 6 and the wave valley 7.

[0037] It should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0038] In addition, the terms "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first" and "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited.

[0039] In the present application, unless specifically defined otherwise, the terms "mounting", "connected", "connecting", "fixed", and "fixedly" should be construed as broadest possible terms, for example, can be fixed connection, can also be detachable connection, or integral; can be mechanical connection, can also be electrical connection or communication with each other; can be directly connected, can also be indirectly connected through an intermediate medium, can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0040] In the present application, unless specifically defined otherwise, the first feature is "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature "above", "over" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "under" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0041] The above is only the preferred specific embodiment of the present application, but the protection scope of the present application is not limited thereto, any skilled person in the art can make equivalent replacement or change according to the technical solution and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered within the protection scope of the present application.

Claims

1. A wave-shaped backflow texturing die, comprising a lower die (1), a middle die (2) and an upper die (3), the middle die (2) being located between the upper die (3) and the lower die (1), the lower die (1), the upper die (3) and the middle die (2) forming a forming cavity, and a metal skeleton (4) being placed in the forming cavity, characterized in that the upper die (3) has a first horizontal stepped surface (30) and a second horizontal stepped surface (31), the second horizontal stepped surface (31) being located below the first horizontal stepped surface (30) and forming a top surface of the forming cavity, the first horizontal stepped surface (30) being in contact with an upper end surface of the middle die (2), and the first horizontal stepped surface (30) and the second horizontal stepped surface (31) being connected by a connecting surface (32), the connecting surface (32) being in contact with the middle die (2); the upper die (3) has a forming side surface (33) with a backflow pattern, the backflow pattern being a wave-shaped backflow pattern, the wave-shaped backflow pattern comprising wave crests (6) and wave troughs (7) arranged alternately, the wave crests (6) and the wave troughs (7) being connected by smooth curves, and a contact support surface (34) being located below a lower end surface of the upper die (3); the lower die (1) has a forming bottom surface (10), the forming bottom surface (10) having a portion located in the forming cavity and a portion located outside the forming cavity and in contact with the contact support surface, and the lower die (1) has a middle end surface (11) located on a side of the forming bottom surface (10) away from the forming cavity, the height of the middle end surface (11) being lower than the height of the forming bottom surface (10), and a gap (5) being formed between the middle end surface (11) and the lower end surface of the upper die (3), the height of the gap (5) being greater than the width of the contact support surface (34); the wave-shaped backflow pattern is located on a lip of a seal processed in the forming cavity; a second transition surface (8) is formed between the middle end surface (11) and the forming bottom surface (10), and a first transition surface (9) is formed between the contact support surface (34) and the lower end surface of the upper die (3), the first transition surface (9), the second transition surface (8) and the middle end surface (11) forming an overflow groove, and the gap (5) is in communication with the overflow groove for the flow of air during processing; the first transition surface (9) is an inclined surface gradually inclined downward from a side close to the forming cavity to a side away from the forming cavity, and the second transition surface (8) is a vertical surface. ​ ​ ​ ​ ​ ​ The upper die (3) is made of high-carbon high-chromium material, a blank of the upper die (3) is first semi-finished by a numerical control lathe to form a semi-finished piece with a 0.3mm margin on one side, then the semi-finished piece is vacuum quenched to make the hardness reach HRC50-60 to form a quenched piece, then the quenched piece is finished by a numerical control lathe, the radial and height dimensions of the quenched piece need to be ensured to be within 0.01mm, and finally the size and shape of the backflow lines are processed by a high-precision five-axis engraving equipment according to the three-dimensional modeling of the wave crest (6) and the wave trough (7).

2. The wave flow texturing die according to claim 1, wherein The connecting surface (32) comprises a first connecting inclined surface (320) and a second connecting inclined surface (321), the first connecting inclined surface (320) is connected with the first horizontal stepped surface (30), the second horizontal stepped surface (31) is connected with the second connecting inclined surface (321), and the inclination angle of the first connecting inclined surface (320) relative to the horizontal direction is greater than the inclination angle of the second connecting inclined surface (321) relative to the horizontal direction.

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