Bending form measurement method, device and system, storage medium and program product

Abstract

The invention discloses a bending shape measuring method and device, and one embodiment of the method comprises the steps: arranging a differential capacitance sensor array at a measured position on a measured object, and enabling the differential capacitance sensor array to comprise a plurality of differential capacitance sensors which are arranged in the extension direction of at least part of the measured position of the measured object; capacitance differential signals respectively output by the plurality of differential capacitance sensors are collected; based on the capacitance differential signals, the bending radius and the rotation angle of each differential capacitance sensor in the extension direction are obtained; and determining the bending form of at least part of the measured position based on the bending radius and the rotation angle of each differential capacitance sensor. The problems of low precision, poor stability, short service life, high cost and the like of the existing form measurement technology in the form measurement field are solved.

Description

Technical Field

[0001] The present disclosure relates to the field of measurement technology, and in particular to a bending morphology measurement method, device, system, storage medium and computer program product. Background Art

[0002] Morphological measurement technology accurately reflects the overall and local shape, position and posture of the measured object by analyzing the measurement signals collected by the sensor. At present, morphological measurement technology is widely used in the field of morphological sensing intelligent wearable devices to track the shape, position and posture of human bodies, robots and other intelligent equipment in real time. Common measurement methods include measurement methods based on resistance technology and measurement methods based on optical fiber technology. However, in application research such as local posture of the human body, the measurement method based on resistance technology performs poorly in terms of service life and stability; the measurement method based on optical fiber technology is expensive and the back-end optical path is complex.

[0003] Another measurement method based on inductive morphological sensing technology involves sewing inductive sensors directly onto wearable T-shirts. The sensor is made of thin copper wires and is sewn onto the fabric of the T-shirt in a serpentine pattern, covering the back and chest areas, to sense the extension and upright movement of the human torso in the sagittal plane. This sensor monitors the body's posture changes by sensing the body's deformation of the T-shirt. When the human body is moving, changes in the shape and posture of the body will cause changes in the shape and posture of the T-shirt, which will cause changes in the morphology of the sensor sewn on the T-shirt, which in turn affects the sensor's inductance value. This change in inductance value is detected and analyzed in real time by an electronic circuit board integrated on the T-shirt. However, this measurement method has a slow response speed, a large time delay, and can result in data reading errors if the sensor is not properly attached to the carrier such as clothing or shifts during activity.

[0004] The above information is presented only as background information to help understand the present disclosure. No confirmation or other related meaning is made as to whether any of the above can be used as prior art application with respect to the present disclosure. Summary of the invention

[0005] Embodiments of the present disclosure solve the problems in the aforementioned morphology measurement technology. A bending morphology measurement method with high response speed, high accuracy, reliability and durability is provided. A bending morphology measurement device is also provided to solve the problem of remote dynamic detection of the morphology of the measured object. A measurement system, a non-transitory storage medium and a computer program product are also provided to solve the problem of executing the bending morphology measurement method.

[0006] A first aspect of the present disclosure provides a bending morphology measurement method, comprising: arranging a differential capacitance sensor array at a measured position on a measured object, the differential capacitance sensor array comprising a plurality of differential capacitance sensors arranged along an extension direction of at least a portion of the measured position of the measured object; collecting capacitance differential signals output by each of the plurality of differential capacitance sensors; obtaining a bending radius and a rotation angle of each of the differential capacitance sensors in the extension direction based on each of the capacitance differential signals; and determining a bending morphology of at least a portion of the measured position based on the bending radius and the rotation angle of each of the differential capacitance sensors.

[0007] For example, in at least one embodiment, the differential capacitance sensor array includes a first flexible circuit layer and a second flexible circuit layer that are stacked, and each of the differential capacitance sensors includes an electrode pair arranged in the first flexible circuit layer and a reference electrode arranged in the second flexible circuit layer; the second flexible circuit layer is configured to move relative to the first flexible circuit layer according to the bending degree of at least part of the measured position, so that the reference electrode is displaced relative to the electrode pair; wherein, collecting the capacitance differential signals output by each of the plurality of differential capacitance sensors includes: collecting the capacitance differential signal value caused by the displacement between the reference electrode and the electrode pair of each differential capacitance sensor.

[0008] For example, in at least one embodiment, the differential capacitance sensor array includes n differential capacitance sensors, where n is a positive integer greater than or equal to 2; the first flexible circuit layer and the second flexible circuit layer are respectively divided into n+1 curve segments by the n differential capacitance sensors, wherein the first flexible circuit layer is divided into Lr[1] to Lr[n+1], and the second flexible circuit layer is divided into Ls[1] to Ls[n+1].

[0009] The bending radius corresponding to the nth differential capacitance sensor is calculated based on the following formula:

[0010]

[0011] The rotation angle corresponding to the nth differential capacitance sensor is calculated based on the following formula:

[0012]

[0013] Among them, r[n] is the bending radius, Δθ[n] is the rotation angle, t is the distance between the first flexible circuit layer and the second flexible circuit layer, ΔLr[n] is the preset capacitor spacing, and ΔLs[n] is the displacement of the second flexible circuit layer calculated based on the digital signal.

[0014] For example, in at least one embodiment, the displacement ΔLs[n] of the second flexible circuit layer is calculated based on the following formula:

[0015] ΔLs[n]=a[n]×(Cs[n+1]-Cs[n])

[0016] Wherein, a[n] is the coefficient of linear regression, Cs[n+1] is the capacitance differential signal value measured by the n+1th differential capacitance sensor, and Cs[n] is the capacitance differential signal value measured by the nth differential capacitance sensor.

[0017] For example, in at least one embodiment, the differential capacitance sensor array is in contact with the measured position, and the first flexible circuit layer and the second flexible circuit layer move synchronously with the movement of the measured position. Wherein, the acquisition of the capacitance differential signals output by each of the plurality of differential capacitance sensors includes: real-time acquisition of the capacitance differential signal value caused by the displacement between the reference electrode and the electrode pair of each differential capacitance sensor. Wherein, the determination of the bending shape of at least part of the measured position includes: determining the real-time dynamic bending shape of at least part of the measured position based on the capacitance differential signal value acquired in real time.

[0018] For example, in at least one embodiment, before collecting the capacitance differential signals outputted by each of the plurality of differential capacitance sensors, the bending morphology measurement method further includes: zeroing and calibrating the differential capacitance sensors. Wherein, after collecting the capacitance differential signals outputted by each of the plurality of differential capacitance sensors, the bending morphology measurement method further includes: performing analog-to-digital conversion and preprocessing on the capacitance differential signals of the differential capacitance sensors to obtain preprocessed signals; polling and calling the plurality of preprocessed signals, arranging the plurality of preprocessed signals into an array in the order of the differential capacitance sensors; and converting the array into a set of multi-bit vectors for storage.

[0019] For example, in at least one embodiment, the acquisition of the capacitance differential signal is controlled, wherein the determining of the bending shape of at least part of the measured position based on the bending radius and the rotation angle of each of the differential capacitance sensors comprises: drawing a bending curve of at least part of the measured position based on the bending radius and the rotation angle of each of the differential capacitance sensors.

[0020] A second aspect of the present disclosure provides a bending morphology measurement device, comprising: a differential capacitance sensor array, the differential capacitance sensor array comprising a plurality of differential capacitance sensors arranged along an extension direction of at least part of the measured position of the measured object; an acquisition module, the acquisition module being configured to acquire capacitance differential signals outputted by each of the plurality of differential capacitance sensors; an acquisition module, the acquisition module being configured to obtain a bending radius and a rotation angle of each of the differential capacitance sensors in the extension direction based on each of the capacitance differential signals; and a determination module, the determination module being configured to determine the bending morphology of at least part of the measured position based on the bending radius and the rotation angle of each of the differential capacitance sensors.

[0021] For example, in at least one embodiment, it also includes: a calibration module, configured to zero and calibrate the differential capacitance sensor before collecting the capacitance differential signal output by the differential capacitance sensor; a conversion module, configured to convert the capacitance differential signal into a digital signal; a preprocessing module, preprocessing the capacitance differential signals of the multiple differential capacitance sensors to obtain a preprocessed signal; an expansion module, configured to increase the number of devices connectable to the bus; and a calling module, configured to poll and call the multiple preprocessed signals, arrange the multiple preprocessed signals into an array in the order of the differential capacitance sensors, and convert the array into a set of multi-bit vectors.

[0022] For example, in at least one embodiment, the method further includes: a display module configured to display the capacitance differential signal and the bending shape.

[0023] A third aspect of the present disclosure provides a bending morphology measurement system, comprising: a memory for non-temporarily storing computer executable instructions; and a processor for executing the computer executable instructions, wherein the computer executable instructions, when executed by the processor, execute any one of the bending morphology measurement methods described above.

[0024] A fourth aspect of the present disclosure provides a non-transitory storage medium that non-transitorily stores computer-executable instructions, wherein when the computer-executable instructions are executed by a computer, the bending morphology measurement method according to any one of the above items is executed.

[0025] A fifth aspect of the present disclosure provides a computer program product, including a computer program, characterized in that when the computer program is executed by a processor, the bending morphology measurement method according to any one of the above items is implemented. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present disclosure, but are not intended to limit the present disclosure.

[0027] Figure 1 The process of the bending shape measurement method according to the embodiment of the present disclosure is as follows Figure 2

[0028] Figure 2 is a schematic cross-sectional structure diagram of a differential capacitance sensor array according to an embodiment of the present disclosure;

[0029] Figure 3 is a schematic cross-sectional structure diagram of a differential capacitance sensor array in a bent state according to an embodiment of the present disclosure;

[0030] Figure 4 is a schematic structural diagram of a differential capacitance sensor array composed of n differential capacitance sensors according to an embodiment of the present disclosure;

[0031] Figure 5 is a schematic diagram of an arc of the nth segment of the curve according to an embodiment of the present disclosure;

[0032] Figure 6 is a flow chart of a second bending morphology measurement method according to an embodiment of the present disclosure;

[0033] Figure 7 is a flow chart of a third bending morphology measurement method according to an embodiment of the present disclosure;

[0034] Figure 8 is a structural schematic diagram of a bending form measurement device according to an embodiment of the present disclosure;

[0035] Fig. 9 is another structural schematic diagram of a bending form measurement device according to an embodiment of the present disclosure;

[0036] Fig.10 is a schematic diagram of a display module interface according to an embodiment of the present disclosure;

[0037] Fig.11 It is a schematic diagram of measuring the bending morphology of fingers according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0039] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. "First", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly. In the present disclosure, "multiple" refers to two or more.

[0040] According to the embodiment of the present disclosure, Figure 1 A method for measuring bending morphology is disclosed, comprising the following steps:

[0041] S101: Arrange a differential capacitance sensor array at a measured position on the measured object. The differential capacitance sensor array includes a plurality of differential capacitance sensors arranged along an extension direction of at least a portion of the measured position of the measured object. The differential capacitance sensor array composed of a plurality of differential capacitance sensors can achieve bending morphology measurement of a larger measurement area, and the position of the differential capacitance sensor can be flexibly set according to measurement needs. The distribution of the differential capacitance sensors can cover the entire measurement position or part of the measurement position; they can be evenly arranged at the measurement site or more densely arranged in areas of focus.

[0042] Preferably, the measured object can be the whole or part of a human body, a robot body, a mechanical arm, etc. The measured position can be a fixed functional area of ​​a human body or other bionic device, such as the spine, arm, neck, waist, leg, etc. of a human body.

[0043] S102: Collecting capacitance differential signals output by each of the plurality of differential capacitance sensors. The plurality of differential capacitance sensors output capacitance differential signals independently, which is conducive to eliminating the error accumulation between the plurality of differential capacitance sensors. At the same time, as long as enough extension channels are introduced, enough differential capacitance sensors can be arranged, which is conducive to improving the measurement accuracy and expanding the measurement range.

[0044] S103: Based on each capacitance differential signal, the bending radius and rotation angle of each differential capacitance sensor in the extension direction are obtained. The capacitance differential signal is affected by the bending degree of the differential capacitance sensor. Through the correspondence between the pre-calibrated capacitance differential signal and the bending radius and rotation angle of the differential capacitance sensor, and the measured capacitance differential signal, the bending radius and rotation angle of the differential capacitance sensor in the extension direction under a certain bending shape can be obtained.

[0045] Preferably, the differential capacitance sensor is a flexible sensor, the bending shape of which changes with the bending shape of the measured position of the measured object.

[0046] S104: Determine the bending shape of at least part of the measured position based on the bending radius and rotation angle of each differential capacitance sensor. Each differential capacitance sensor is arranged in the extension direction of the measured position, and based on the bending radius and rotation angle of each differential capacitance sensor, a continuous bending shape of the measured area can be obtained by fitting or other methods.

[0047] Preferably, in at least one embodiment, Figure 2 As shown, the differential capacitance sensor array includes a first flexible circuit layer and a second flexible circuit layer stacked, and each differential capacitance sensor includes an electrode pair arranged in the first flexible circuit layer and a reference electrode R arranged in the second flexible circuit layer. The electrode pair arranged in the first flexible circuit layer and the reference electrode R arranged in the second flexible circuit layer are arranged relative to each other, have an overlapping area, and constitute two capacitors. The difference between the two capacitance signals is calculated to obtain a capacitance differential signal. It should be noted that the structure of the above differential capacitance sensor is not the only structural form of the differential capacitance sensor. All differential capacitance sensors that can output capacitance differential signals and whose output differential capacitance signals are related to their own bending degree can be used to implement the bending morphology measurement method disclosed in the present invention.

[0048] Preferably, a spacer layer is provided between the electrode pair and the reference electrode R. The spacer layer can be used to adjust the distance between the electrode pair and the reference electrode, which is beneficial to adjust the accuracy of the sensor and reduce the influence of the structural rigidity of the differential capacitance sensor itself on bending.

[0049] Preferably, in at least one embodiment, Figure 3As shown, the second flexible circuit layer is configured to move relative to the first flexible circuit layer according to the bending degree of at least a portion of the measured position, so that the reference electrode is displaced relative to the electrode pair. Figure 3 The electrode pair shown in the figure is affected by the bending of the sensor and moves to both sides relative to the reference electrode, and the movement direction is shown by the arrow direction. The capacitance differential signals output by each of the plurality of differential capacitance sensors are collected, including: collecting the capacitance differential signal value caused by the displacement between the reference electrode and the electrode pair of each differential capacitance sensor.

[0050] Preferably, in at least one embodiment, Figure 4 As shown, the differential capacitance sensor array includes n differential capacitance sensors, where n is a positive integer greater than or equal to 2. The first flexible circuit layer and the second flexible circuit layer are respectively divided into n+1 curve segments by the n differential capacitance sensors, where the first flexible circuit layer is divided into Lr[1] to Lr[n+1], and the second flexible circuit layer is divided into Ls[1] to Ls[n+1].

[0051] For the nth segment of the curve, its bending shape is as follows Figure 5 The arc shown in the figure can be uniquely obtained by calculating the bending radius r[n] and the rotation angle Δθ[n] of the arc. According to the arc formula:

[0052] ΔLr[n]=r[n]Δθ[n] (1)

[0053] ΔLs[n]=(r[n]-t)Δθ[n] (2)

[0054] Subtracting the left and right sides of the equal signs in equation (1) and equation (2) above, we can get:

[0055] ΔLr[n]-ΔLs[n]=r[n]Δθ[n]-(r[n]-t)Δθ[n] (3)

[0056] Simplifying, we get:

[0057] ΔLr[n]-ΔLs[n]=r[n]Δθ[n]-r[n]Δθ[n]+tΔθ[n] (4)

[0058] ΔLr[n]-ΔLs[n]=tΔθ[n] (5)

[0059] Dividing both sides of equation (5) by t, we can get

[0060]

[0061] Therefore, the rotation angle Δθ[n] corresponding to the nth differential capacitance sensor can be calculated based on equation (6). Substituting equation (6) into equation (1), the following can be obtained after simplification:

[0062] Therefore, the bending radius r[n] corresponding to the nth differential capacitance sensor can be calculated based on equation (7).

[0063] In equations (6) and (7), t is the distance between the first flexible circuit layer and the second flexible circuit layer. ΔLr[n] is the preset capacitor spacing, and ΔLs[n] is the second capacitor calculated based on the digital signal.

[0064]

[0065] Displacement of the flex circuit layer.

[0066] Preferably, the differential capacitance sensor can be calibrated, and the corresponding relationship between the capacitance differential signal value and ΔLs[n] can be calculated through multiple calibrations. After the capacitance differential signal value is collected, the value of ΔLs[n] is obtained according to the corresponding relationship.

[0067] Preferably, in at least one embodiment, the displacement ΔLs[n] of the second flexible circuit layer can also be calculated based on the following equation:

[0068] ΔLs[n]=a[n]×(Cs[n+1]-Cs[n])(8)

[0069] In equation (8), a[n] is the coefficient of linear regression, which is obtained by performing regression analysis on the capacitance differential value measured by the nth differential capacitance sensor and the theoretical length value. Ideally, this value is a linear regression with the origin as the starting point, so the least square method can be used for regression analysis. The linear regression algorithm can also be corrected and optimized by methods such as artificial intelligence. Cs[n+1] is the capacitance differential signal value measured by the n+1th differential capacitance sensor, and Cs[n] is the capacitance differential signal value measured by the nth differential capacitance sensor. It can be understood that for the last differential capacitance sensor in the differential capacitance sensor array, because it is the last differential capacitance sensor, there is no capacitance differential signal value Cs[n+1], so equation (8) cannot be used directly to calculate ΔLs[n]. Other methods such as pre-calibration can be used to obtain the ΔLs[n] value corresponding to the last differential capacitance sensor. The arc shape corresponding to the differential capacitance sensor may also be ignored, and the bending shape of the entire differential capacitance sensor array may be fitted directly based on the bending radius r[n] and the rotation angle Δθ[n] of other differential capacitance sensors.

[0070] Preferably, in at least one embodiment, Figure 6The bending morphology measurement method shown comprises the following steps:

[0071] S201: Arrange a differential capacitance sensor array at a measured position on the measured object. The differential capacitance sensor array fits the measured position, and the first flexible circuit layer and the second flexible circuit layer move synchronously with the movement of the measured position. Because the differential capacitance sensor array always fits the measured position, when the shape and posture of the measured position change, the differential capacitance sensor array changes synchronously therewith.

[0072] S202: Collecting in real time the capacitance difference signal value caused by the displacement between the reference electrode and the electrode pair of each differential capacitance sensor.

[0073] S203: Based on the capacitance differential signal value collected in real time, obtain the real-time bending radius and rotation angle of each differential capacitance sensor in the extension direction.

[0074] S204: Determine a real-time dynamic bending shape of at least part of the measured position based on the real-time bending radius and rotation angle of each differential capacitance sensor.

[0075] Based on the real-time acquisition of the capacitance differential signal value, the real-time dynamic bending shape is obtained, which can realize the real-time measurement of the measured object. In the field of measuring specific objects such as the human body, real-time tracking of the shape and posture changes of the measured position is of great significance.

[0076] Preferably, in at least one embodiment, Figure 7 The bending morphology measurement method shown comprises the following steps:

[0077] S301: Arrange a differential capacitance sensor array at a measured position on the measured object. The differential capacitance sensor array may be arranged in any of the arrangements in the previous embodiments.

[0078] S302: Zeroing and calibrating the differential capacitance sensor. Zeroing and calibration can eliminate the error of the differential capacitance sensor and improve measurement accuracy.

[0079] Theoretically, the differential capacitance value of the differential capacitance sensor should be 0 when it is in a straight state. However, due to the absolute error of the manufacturing process, this value will produce a random offset. Therefore, we need to calibrate the initial value of the differential capacitance sensor in this state. When we think that the measured object is in a straight state, the actual sensor signal is not 0, which will directly lead to the measurement result not being the expected straight line. In an optional embodiment, the 8 channels are respectively subjected to 5 times of rapid acquisition and zeroing to effectively realize the initial value calibration.

[0080] S303: Collecting capacitance differential signals outputted by each of the plurality of differential capacitance sensors. In the step of collecting capacitance differential signals, the collection of capacitance differential signals may be controlled by a computer program interface or the like.

[0081] S304: Perform analog-to-digital conversion and preprocessing on the capacitance differential signal of the differential capacitance sensor to obtain a preprocessed signal. The analog-to-digital conversion converts the analog signal collected by the differential capacitance sensor into a digital signal, and the preprocessing further processes the digital signal into digital signal data readable by the processor.

[0082] S305: polling and calling a plurality of pre-processed signals, arranging the plurality of pre-processed signals into an array according to the sequence of differential capacitance sensors, and converting the array into a set of multi-bit vectors for storage.

[0083] The differential capacitance sensor array includes multiple differential capacitance sensors. In some embodiments, there is only one expansion board address inside the processing module, so it is impossible to call the capacitance differential signal values ​​output by all differential capacitance sensors at the same time. It is necessary to poll and call the capacitance differential signal values ​​output by multiple differential capacitance sensors. Finally, the read multiple capacitance differential signal values ​​are arranged into an array, which is conducive to orderly processing of each sensor signal. The array is converted into a set of multi-digit vector storage, which can save data and call it according to the needs of the processor.

[0084] S306: Based on each capacitance differential signal, obtain the bending radius and rotation angle of each differential capacitance sensor in the extension direction.

[0085] S307: Determine the bending shape of at least part of the measured position based on the bending radius and rotation angle of each differential capacitance sensor. Optionally, the method includes drawing a bending curve of at least part of the measured position based on the bending radius and rotation angle of each differential capacitance sensor.

[0086] According to the embodiment of the present disclosure, Figure 8 As shown, a bending morphology measuring device is also provided, comprising: a differential capacitance sensor array, the differential capacitance sensor array comprising a plurality of differential capacitance sensors arranged along the extension direction of at least a portion of the measured position of the measured object. An acquisition module, the acquisition module is configured to acquire capacitance differential signals outputted by each of the plurality of differential capacitance sensors. An acquisition module, the acquisition module is configured to obtain the bending radius and rotation angle of each differential capacitance sensor in the extension direction based on each capacitance differential signal. A determination module, the determination module is configured to determine the bending morphology of at least a portion of the measured position based on the bending radius and rotation angle of each differential capacitance sensor.

[0087] Preferably, in at least one embodiment, Fig. 9As shown, it also includes one or more of the following modules: a calibration module, configured to zero and calibrate the differential capacitance sensor before collecting the capacitance differential signal output by the differential capacitance sensor. A conversion module, configured to convert the capacitance differential signal into a digital signal. A preprocessing module, preprocessing the capacitance differential signals of multiple differential capacitance sensors to obtain preprocessed signals. An expansion module, configured to increase the number of devices that can be connected to the bus. A calling module, configured to poll and call multiple preprocessed signals, arrange the multiple preprocessed signals into an array according to the order of the differential capacitance sensors, and convert the array into a set of multi-digit vectors. A display module, the display module is configured to display the capacitance differential signal and the bending shape.

[0088] Preferably, in at least one embodiment, Fig.10 As shown, the display module can be configured as a computer program interface. The computer program interface includes an interactive bar, through which the measurement can be controlled to realize the functions of starting, pausing, inputting parameters and data storage. The interactive bar can include buttons for starting and pausing data transmission, refresh rate settings, serial port settings, acquisition time settings, start and stop acquisition buttons, storage acquisition data settings, etc. The computer program interface also includes a curve real-time display area, which can display the bending shape of the measured object in real time; and a capacitance value real-time display area, which can display multiple capacitance differential signal values ​​output by the differential capacitance sensor array in real time, so as to monitor whether the curve simulation displayed in real time meets expectations.

[0089] The bending morphology measurement device can dynamically detect the shape and posture of the measured object. It can be applied to a certain part of the human body, or to measurement fields similar to human posture, such as digital humans and robotic arms. The differential capacitance sensor array can be deployed on the surface of human joints and curved objects for morphological perception. Depending on the difference between the measured object and the deployment location, the differential capacitance sensor can achieve more accurate measurement by changing the length, number of capacitors, capacitor size, and capacitor thickness. For example, in Fig.11 In the process, the differential capacitance sensor array is pasted on the human finger. Since the distance to be collected at the finger joint is short, the differential capacitance sensor array is first completely covered with a plastic film by means of a plastic sleeve and heat reinforcement. The thickness and left and right displacement of the differential capacitance sensor array are fixed so that it can be freely bent only in one dimension of the measurement direction. The differential capacitance sensor array is made to fit the human finger joint by means of tape or cloth sewing, with the freely movable section pointing between the fingers. Based on the capacitance differential signal output by the differential capacitance sensor array, it can be used, for example Fig.10 The computer program interface shown in the figure can display the bending shape of the finger in real time, and can also display the capacitance differential signal value output by the differential capacitance sensor array in real time.

[0090] According to an embodiment of the present disclosure, a bending morphology measurement system is also provided, including: a memory for non-temporarily storing computer executable instructions; and a processor for executing the computer executable instructions, wherein the computer executable instructions, when executed by the processor, execute the bending morphology measurement method described in any one of the above embodiments.

[0091] According to an embodiment of the present disclosure, a non-transitory storage medium is further provided, which non-transitorily stores computer executable instructions, wherein when the computer executable instructions are executed by a computer, the bending morphology measurement method described in any one of the above embodiments is executed.

[0092] According to an embodiment of the present disclosure, a computer program product is further provided, including a computer program, wherein when the computer program is executed by a processor, the bending morphology measurement method described in any one of the above embodiments is implemented.

[0093] There are a few points to note:

[0094] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure, and other structures may refer to the general design.

[0095] (2) For the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the thickness of devices, layers or regions is exaggerated or reduced, that is, these drawings are not drawn according to the actual scale. It is understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, the element may be "directly" "on" or "under" the other element or there may be intervening elements.

[0096] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.

[0097] The above are only specific implementations of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and the protection scope of the present disclosure shall be based on the protection scope of the claims.

Claims

1. A method for measuring bending morphology, comprising: Arranging a differential capacitance sensor array at a measured position on the measured object, wherein the differential capacitance sensor array includes a plurality of differential capacitance sensors arranged along an extension direction of at least a portion of the measured position of the measured object; Collecting capacitance differential signals output by each of the plurality of differential capacitance sensors; Based on each of the capacitance differential signals, obtaining a bending radius and a rotation angle of each of the differential capacitance sensors in the extending direction; as well as Based on the bending radius and the rotation angle of each of the differential capacitance sensors, a bending shape of at least a portion of the measured location is determined.

2. The method for measuring bending morphology according to claim 1, in, The differential capacitance sensor array includes a first flexible circuit layer and a second flexible circuit layer stacked in layers, and each of the differential capacitance sensors includes an electrode pair disposed in the first flexible circuit layer and a reference electrode disposed in the second flexible circuit layer; The second flexible circuit layer is configured to move relative to the first flexible circuit layer according to the bending degree of at least part of the measured position, so that the reference electrode is displaced relative to the electrode pair; Wherein, collecting the capacitance differential signals outputted by each of the plurality of differential capacitance sensors comprises: The capacitance differential signal value caused by the displacement between the reference electrode and the electrode pair of each of the differential capacitance sensors is collected.

3. The method for measuring bending shape according to claim 2, wherein: The differential capacitance sensor array includes n differential capacitance sensors, where n is a positive integer greater than or equal to 2; the first flexible circuit layer and the second flexible circuit layer are respectively divided into n+1 curve segments by the n differential capacitance sensors, wherein the first flexible circuit layer is divided into Lr[1] to Lr[n+1], and the second flexible circuit layer is divided into Ls[1] to Ls[n+1]; The bending radius corresponding to the nth differential capacitance sensor is calculated based on the following formula: The rotation angle corresponding to the nth differential capacitance sensor is calculated based on the following formula: Among them, r[n] is the bending radius, Δθ[n] is the rotation angle, t is the distance between the first flexible circuit layer and the second flexible circuit layer, ΔLr[n] is the preset capacitor spacing, and ΔLs[n] is the displacement of the second flexible circuit layer calculated based on the digital signal.

4. The method for measuring bending morphology according to claim 3, wherein: The displacement ΔLs[n] of the second flexible circuit layer is calculated based on the following formula: ΔLs[n]=a[n]×(Cs[n+1]-Cs[n]) Wherein, a[n] is the coefficient of linear regression, Cs[n+1] is the capacitance differential signal value measured by the n+1th differential capacitance sensor, and Cs[n] is the capacitance differential signal value measured by the nth differential capacitance sensor.

5. The method for measuring bending morphology according to claim 2, in, The differential capacitance sensor array is in contact with the measured position, and the first flexible circuit layer and the second flexible circuit layer move synchronously with the movement of the measured position; Wherein, collecting the capacitance differential signals outputted by each of the plurality of differential capacitance sensors comprises: collecting in real time the capacitance differential signal value caused by the displacement between the reference electrode and the electrode pair of each of the differential capacitance sensors; Wherein, determining the bending shape of at least part of the measured position includes: Based on the capacitance differential signal value collected in real time, the real-time dynamic bending shape of at least part of the measured position is determined.

6. The method for measuring bending morphology according to claim 1, in, Before collecting the capacitance differential signals outputted by each of the plurality of differential capacitance sensors, the bending morphology measurement method further comprises: zeroing and calibrating the differential capacitance sensors; Wherein, after collecting the capacitance differential signals outputted by each of the plurality of differential capacitance sensors, the bending morphology measurement method further comprises: performing analog-to-digital conversion and preprocessing on the capacitance differential signals of the differential capacitance sensors to obtain preprocessed signals; polling and calling a plurality of the pre-processed signals, and arranging the plurality of the pre-processed signals into an array in the order of the differential capacitance sensors; and Convert the array into a vector of multi-bit numbers for storage.

7. The method for measuring bending morphology according to any one of claims 1 to 6, further comprising: Controlling the collection of the capacitance differential signal; Wherein, determining the bending shape of at least part of the measured position based on the bending radius and the rotation angle of each of the differential capacitance sensors includes: A bending curve of at least part of the measured position is drawn based on the bending radius and the rotation angle of each of the differential capacitance sensors.

8. A bending shape measuring device, comprising: A differential capacitance sensor array, the differential capacitance sensor array comprising a plurality of differential capacitance sensors arranged along an extension direction of at least a portion of the measured position of the measured object; An acquisition module, wherein the acquisition module is configured to acquire capacitance differential signals outputted by each of the plurality of differential capacitance sensors; An acquisition module, wherein the acquisition module is configured to obtain a bending radius and a rotation angle of each of the differential capacitance sensors in the extension direction based on each of the capacitance differential signals; A determination module is configured to determine a bending shape of at least part of the measured position based on the bending radius and the rotation angle of each of the differential capacitance sensors.

9. The bending form measurement device according to claim 8, further comprising: A calibration module, configured to zero and calibrate the differential capacitance sensor before collecting the capacitance differential signal output by the differential capacitance sensor; A conversion module, configured to convert the capacitance differential signal into a digital signal; A preprocessing module, preprocessing the capacitance differential signals of the plurality of differential capacitance sensors to obtain a preprocessed signal; expansion modules configured to increase the number of devices connectable to the bus; The calling module is configured to poll and call the multiple pre-processed signals, arrange the multiple pre-processed signals into an array according to the sequence of the differential capacitance sensors, and convert the array into a set of multi-bit vectors.

10. The bending form measurement device according to claim 8 or 9, further comprising: A display module is configured to display the capacitance differential signal and the bending shape.

11. A bending morphology measurement system, comprising: a memory for non-transitory storage of computer executable instructions; and a processor, configured to execute the computer executable instructions, wherein the computer executable instructions, when executed by the processor, execute the bending morphology measurement method according to any one of claims 1 to 7.

12. A non-transitory storage medium that non-transitorily stores computer-executable instructions, wherein: When the computer executable instructions are executed by a computer, the bending morphology measurement method according to any one of claims 1 to 7 is performed.

13. A computer program product, comprising a computer program, characterized in that When the computer program is executed by a processor, the bending morphology measurement method according to any one of claims 1 to 7 is implemented.

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