Display module and display device

Abstract

The embodiment of the invention provides a display module and a display device. The display module comprises a display panel and a back plate. The back plate is located on one side of the backlight face of the display panel. The display panel further comprises an electrostatic discharge assembly which is located on the side, away from the display panel, of the backboard. The electrostatic discharge assembly comprises a metal layer and a conductive adhesive, and the conductive adhesive is located between the back plate and the metal layer and bonds the back plate and the metal layer. According to the display module, the electrostatic discharge assembly is prepared on the side, away from the display panel, of the back plate in the display module, so that static electricity gathered in the display module can be released to the electrostatic discharge assembly in time, and it is avoided that normal work of the display module is affected by static electricity gathering in the display module; the risk of damage of static electricity to components in the display module is reduced, and the risks of static electricity breakdown, short circuit, signal transmission disorder and the like can be effectively reduced.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] In the field of display technology, electrostatic testing of display modules is an important test. However, after the electrostatic testing of the display module, static electricity may accumulate inside the display module and cannot be released well, which will affect the working performance of the display module. In addition, during the working process of the display module, some static electricity will be generated in the display module because the display module includes the transmission of electrical signals. When this part of static electricity accumulates in the display module and cannot be released in time, it may cause the device in the display module to be broken down by static electricity, signal disorder, etc. In particular, in flexible display modules, the backplane of some flexible display modules uses a polyimide material with a certain degree of flexibility, which can support and protect the display module, but static electricity is easy to accumulate in the backplane area and cannot be released in time, which increases the risk of reduced working performance of the display module. Summary of the invention

[0003] In view of this, the present application provides a display module and a display device to solve the above problems.

[0004] In a first aspect, the present application provides a display module, comprising:

[0005] Display panel;

[0006] A back plate, which is located on the backlight side of the display panel;

[0007] The electrostatic release component is located on the side of the back plate away from the display panel; the electrostatic release component includes a metal layer and a conductive adhesive, and the conductive adhesive is located between the back plate and the metal layer and bonds the back plate and the metal layer.

[0008] In a second aspect, the present application provides a display device, comprising the display module provided in the first aspect.

[0009] In an embodiment of the present application, an electrostatic release component is prepared on the side of the back plate in the display module away from the display panel, so that the static electricity accumulated in the display module can be released to the electrostatic release component in time, which is beneficial to avoid static electricity accumulation in the display module and affecting the normal operation of the display module; it is also beneficial to reduce the risk of static electricity damaging the components in the display module, and can effectively reduce the risks of electrostatic breakdown, short circuit, signal transmission disorder, etc. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0011] Figure 1 A cross-sectional schematic diagram of a display module provided in an embodiment of the present application;

[0012] Figure 2 A schematic plan view of a display module provided in an embodiment of the present application;

[0013] Figure 3 A schematic plan view of another display module provided in an embodiment of the present application;

[0014] Figure 4 A method provided in the embodiment of the present application Figure 3 Schematic diagram of the cross section along the P-P' direction;

[0015] Figure 5 Another embodiment provided in this application is Figure 3 Schematic diagram of the cross section along the P-P' direction;

[0016] Figure 6 Another embodiment provided in this application is Figure 3 Schematic diagram of the cross section along the P-P' direction;

[0017] Figure 7 Another embodiment provided in this application Figure 3 Schematic diagram of the cross section along the P-P' direction;

[0018] Figure 8 Another embodiment provided in this application is Figure 3 Schematic diagram of the cross section along the P-P' direction;

[0019] Fig. 9 Another embodiment provided in this application Figure 3 Schematic diagram of the cross section along the P-P' direction;

[0020] Fig.10 Another embodiment provided in this application is Figure 3 Schematic diagram of the cross section along the P-P' direction;

[0021] Fig.11 A partial plan view of a conductive adhesive provided in an embodiment of the present application;

[0022] Fig.12 A schematic diagram of a display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0023] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0024] It should be clear that the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0025] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms "a", "an", "the" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings.

[0026] It should be understood that the term "and / or" used in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0027] In the description of this specification, it is necessary to understand that the words such as "substantially", "approximately", "approximately", "about", "roughly", "substantially" and the like described in the claims and embodiments of the present application refer to what can be generally recognized within a reasonable process operation range or tolerance range, rather than an exact value.

[0028] It should be understood that although the terms first, second, etc. may be used to describe parts, grooves, sub-parts, etc. in the embodiments of the present application, these should not be limited to these terms. These terms are only used to distinguish parts, grooves, sub-parts, etc. from each other. For example, without departing from the scope of the embodiments of the present application, the first part may also be referred to as the second part, and similarly, the second part may also be referred to as the first part. The applicant of this case has provided a solution to the problems existing in the prior art through careful and in-depth research.

[0029] Figure 1 A cross-sectional schematic diagram of a display module provided in an embodiment of the present application, Figure 2 A schematic plan view of a display module provided in an embodiment of the present application, Figure 3 A plan view of another display module provided in an embodiment of the present application.

[0030] The embodiment of the present application provides a display module 100, including a display panel 10, wherein the display panel 10 includes a plurality of light-emitting elements, a driving transistor and other components for light-emitting display. The display module 100 also includes a back plate 20, which is located on the backlight side of the display panel 10, and is used to support the display panel 10 and protect the display panel 10 from being corroded by water and oxygen, squeezed, etc.

[0031] The display panel 10 and the back panel 20 in the display module 100 are adjacent to each other. The display panel 10 will generate some static electricity when working. Since the electric potential at the back panel 20 is relatively low, more static electricity will gather toward the back panel 20. Therefore, in order to avoid static electricity accumulation in the display module 100, it is necessary to release the static electricity in time to prevent static electricity from affecting signal transmission such as circuit boards and wiring in the display module 100 after accumulation.

[0032] The technical solution of the present application proposes that the display module 100 includes an electrostatic discharge component 30, which is located on the side of the back plate 20 away from the display panel 10. The electrostatic discharge component 30 is used to release static electricity, and the electrostatic discharge component 30 is located on the side of the back plate 20, which can effectively avoid affecting the structural setting of the display panel 10. The electrostatic discharge component 30 can receive and release the static electricity accumulated on the back plate 20, thereby reducing the electrostatic pressure in the display module 100.

[0033] refer to Figure 1 As shown, the electrostatic discharge component 30 includes a metal layer 30A and a conductive adhesive 30B. The conductive adhesive 30B is located between the back plate 20 and the metal layer 30A and bonds the back plate 20 and the metal layer 30A. Both the metal layer 30A and the conductive adhesive 30B are conductive, and the conductive adhesive 30B can also fix the metal layer 30A and the back plate 20. One end of the metal layer 30A is grounded. During the electrostatic discharge process, the static electricity flowing toward the back plate 20 will be further released to the conductive adhesive 30B and then released to the metal layer 30A and flow to the ground. Optionally, the ground electrically connected to the metal layer 30A can be the shell of the device where the display module 100 is located.

[0034] In addition, optionally, the conductive adhesive 30B has a certain flexibility, and in this case the metal layer 30A can be thinner and also have a certain flexibility. This is conducive to making the electrostatic discharge component 30 suitable for the case where the display module 100 is a flexible display module. When the display module 100 is bent or folded, the electrostatic discharge component 30 can be bent or folded well.

[0035] Alternatively, if Figure 2 As shown, the electrostatic discharge component 30 can be prepared on the entire surface of the back plate 20 away from the display panel 10, so that more paths can be used for electrostatic discharge. Figure 3As shown, the electrostatic discharge component 30 can be prepared in different positions according to actual use needs. For example, it can be prepared in the area close to the frame of the display module 100, where the stress generated when the display module 100 is bent is small, and the electrostatic discharge component 30 is not easy to warp and fall off; it is also beneficial to reduce the preparation area of ​​the electrostatic discharge module 30, and reserve more preparation positions for other components.

[0036] In an embodiment of the present application, an electrostatic discharge component 30 is prepared on the side of the back plate 20 in the display module 100 away from the display panel 10, so that the static electricity accumulated in the display module 100 can be released to the electrostatic discharge component 30 in time, which is beneficial to avoid static electricity accumulation in the display module 100 and affect the normal operation of the display module 100; it is also beneficial to reduce the risk of static electricity damaging the components in the display module 100, and can effectively reduce the risks of electrostatic breakdown, short circuit, signal transmission disorder, etc.

[0037] Figure 4 A method provided in the embodiment of the present application Figure 3 Schematic diagram of the cross section along the P-P' direction.

[0038] In one embodiment of the present application, Figure 4 As shown, the electrostatic discharge component 30 also includes an adhesive 30C, and the adhesive 30C is located between the back plate 20 and the metal layer 30A. At this time, the adhesive 30C can also adhere and fix the metal layer 30A to the back plate 20. Optionally, the adhesive 30C is not conductive.

[0039] The metal layer 30A includes a first portion 30A1 and a second portion 30A2, wherein the second portion 30A2 is located outside the first portion 30A1. In a direction parallel to the plane where the display module 100 is located, the display module 100 includes an edge. In a direction parallel to the plane where the display module 100 is located, the second portion 30A2 of the metal layer 30A is closer to the edge of the display module 100 than the first portion 30A1. In a direction perpendicular to the plane where the display module 100 is located, the first portion 30A1 of the metal layer 30A overlaps with the adhesive 30C and the second portion 30A2 of the metal layer 30A does not overlap with the adhesive 30C. If the adhesive 30C is included between the first portion 30A1 of the metal layer 30A and the back plate 20, then in a direction perpendicular to the plane where the display module is located, the path between the adhesive 30C and the first portion 30A1 is a non-electrostatic discharge path. The second portion 30A2 of the metal layer 30A does not include adhesive 30C between the back plate 20, and the conditions for the electrostatic discharge path are met. Since the second portion 30A2 of the metal layer 30A is located outside the first portion 30A1, closer to the edge of the display module 100, and the grounding end of the metal layer 30A can be placed on the housing of the device where the display module 100 is located, and is also close to the edge of the display module 100, the electrostatic discharge at the second portion 30A2 of the metal layer 30A is conducive to making the static electricity approach the second portion 30A2 area, and then released from the second portion 30A2 area to the ground, shortening the path of the electrostatic discharge.

[0040] The back plate 20 includes a third portion 201 and a fourth portion 202. In a direction perpendicular to the plane where the display module 100 is located, the third portion 201 overlaps with the adhesive 30C and the fourth portion 202 does not overlap with the adhesive 30C. Then, in a direction perpendicular to the plane where the display module 100 is located, the third portion 201 of the back plate 20 overlaps with the first portion 30A1 of the metal layer 30A, and the fourth portion 202 of the back plate 20 overlaps with the second portion 30A1 of the metal layer 30A. The adhesive 30C bonds and fixes the first portion 30A1 of the metal layer 30A to the third portion 201 of the back plate 20. The surface of the fourth portion 202 of the back plate 20 facing the electrostatic discharge component 30 is not provided with the adhesive 30C, and the fourth portion 202 of the back plate 20 has the ability to discharge electrostatics.

[0041] The conductive adhesive 30B is disposed to bond the second portion 30A2 and the fourth portion 202 , so that the path between the fourth portion 202 of the back plate 20 and the second portion 30A2 of the metal layer 30A is used as an electrostatic discharge path.

[0042] In the embodiment of the present application, the first part 30A1 of the metal layer 30A is bonded and fixed to the third part 201 of the back plate 20 by using adhesive 30C, and the second part 30A2 of the metal layer 30A is bonded and fixed to the fourth part 202 of the back plate 20 by using conductive adhesive 30B, which is conducive to forming an electrostatic discharge area between the fourth part 202 of the back plate 20 and the second part 30A2 of the metal layer instead of on the plane where the entire back 20 is located, which is conducive to making the static electricity in the display module 100 gather in the fourth part 202 area of ​​the back plate 20, and avoid static electricity from gathering on the entire plane of the back plate 20 and then releasing, so that the path of static electricity discharge is longer and the efficiency is lower. When static electricity is gathered in the fourth part 202, the grounding end for releasing static electricity is also closer to the second part 30A2 on the outside of the metal layer 30A, and static electricity can be directly released from the fourth part 202 to the second part 30A2, further shortening the static electricity discharge path and improving the efficiency of static electricity discharge.

[0043] Figure 5 Another embodiment provided in this application Figure 3 Schematic diagram of the cross section along the P-P' direction.

[0044] In one embodiment of the present application, Figure 5 As shown, the surface of the second part 30A2 of the metal layer 30A facing the fourth part 202 of the back plate 20 includes at least one first groove C1. The first groove C1 is filled with conductive glue 30B. The surface of the second part 30A2 of the metal layer 30A facing the back plate 20 includes the first groove C1, and the surface of the second part 30A2 facing the back plate 20 is a non-flat surface such as a wave shape or a sawtooth shape. The conductive glue 30B is also filled in the first groove C1, so that the second part 30A2 and the fourth part 2020 are still well bonded and fixed.

[0045] Optionally, the surface of the second portion 30A2 facing the back plate 20 may be cut by laser cutting to form the first groove C1.

[0046] In the embodiment of the present application, the surface of the second portion 30A2 of the metal layer 30A facing the fourth portion 202 of the back plate 20 includes at least one first groove C1, which is beneficial for making the surface of the second portion 30A2 of the metal layer 30A facing the back plate 20 a non-flat surface, thereby increasing the surface area of ​​the second portion 30A2 facing the back plate 20, thereby increasing the electrostatic release area of ​​the metal layer 30A, thereby increasing the bonding performance between the second portion 30A2 of the metal layer 30A and the fourth portion 202 of the back plate 20, reducing the risks of warping, falling off, etc. during the bending process of the display module 100, and improving the working stability of the electrostatic release component 30.

[0047] Figure 6 Another embodiment provided in this application Figure 3Schematic diagram of the cross section along the P-P' direction.

[0048] In one embodiment of the present application, Figure 6 As shown, the electrostatic discharge component 30 further includes an insulating layer 30D, and the insulating layer 30D is located between the adhesive 30B and the metal layer 30A. The insulating layer 30D is not conductive, and the insulating layer 30D is located in the electrostatic discharge component 30 and can be used to enhance the structural stability of the electrostatic discharge component 30. By appropriately increasing the thickness of the electrostatic discharge component 30 through the insulating layer 30D, it is beneficial to improve the structural strength of the electrostatic discharge component 30 and prevent it from being stretched and broken when the display module 100 is bent.

[0049] The first part 30A1 of the metal layer 30A includes a first sub-part 30A11 and a second sub-part 30A12, and the second sub-part 30A12 is adjacently connected to the second part 30A2. In a direction perpendicular to the plane where the display module 100 is located, the first sub-part 30A11 overlaps with the insulating layer 30D, and the second sub-part 30A12 does not overlap with the insulating layer 30D. The adhesive 30C includes a fifth part 30C1 and a sixth part 30C2, and in a direction perpendicular to the plane where the display module 100 is located, the fifth part 30C1 overlaps with the insulating layer 30D, and the sixth part 30C2 does not overlap with the insulating layer 30D. In summary, in a direction perpendicular to the plane where the display module 100 is located, the fifth part 30C1 of the adhesive 30C overlaps with the insulating layer 30D and the first sub-part 30A11, and this path does not have the ability to transmit static electricity. The sixth portion 30C2 of the adhesive 30C does not overlap with the insulating layer 30D, and the second sub-portion 30A12 does not overlap with the insulating layer 30D, but the sixth portion 30C2 of the adhesive 30C overlaps with the second sub-portion 30A12. Therefore, there is a space between the sixth portion 30C2 and the second sub-portion 30A12 where the insulating layer 30D material is not set, which is beneficial to alleviate the structural compactness of the electrostatic release module 30, so that there is space for releasing stress when the display module 100 is bent.

[0050] Furthermore, a conductive adhesive 30B is provided to bond the second sub-section 30A12 and the sixth section 30C2. A conductive adhesive 30B is prepared between the sixth section 30C2 and the second sub-section 30A12 to bond the second sub-section 30A12 and the sixth section 30C2, which is beneficial to fix the structure of the electrostatic release component 30 and increases the release space for the static electricity of the second section 30A2 close to the metal layer 30A.

[0051] In the embodiment of the present application, an insulating layer 30D is provided between the adhesive 30C and the metal layer 30A, and the insulating layer 30D and the adhesive 30C do not overlap, which means that some space is left outside the electrostatic release module 30 and no film layer is prepared, but the conductive adhesive 30B is used for bonding, which is conducive to relieving the structural compactness of the electrostatic release module 30, so that there is space for stress release when the display module 100 is bent. In addition, the preparation of the insulating layer 30D is also conducive to appropriately increasing the structural thickness of the electrostatic release module 30, which is conducive to improving the structural stability of the electrostatic release module 30, and reducing the risk of edge warping and component disconnection of the electrostatic release module 30 when the display module 100 is bent.

[0052] Figure 7 Another embodiment provided in this application Figure 3 Schematic diagram of the cross section along the P-P' direction.

[0053] In one embodiment of the present application, Figure 7 As shown, the surface of the second sub-portion 30A12 of the first portion 30A1 in the metal layer 30A facing the sixth portion 30C2 of the adhesive 30C includes at least one first groove C1. Optionally, the first groove C1 prepared on the surface of the second sub-portion 30A12 facing the back plate 20 is similar in shape to the first groove C1 prepared on the surface of the second portion 30A2 facing the back plate 20. The first groove C1 is filled with conductive glue 30B.

[0054] In the embodiment of the present application, a first groove C1 is prepared on the surface of the second sub-section 30A12 facing the back plate 20, which is conducive to increasing the surface area of ​​the second sub-section 30A1 facing the back plate 20, and the conductive glue 30B is also filled in the first groove C1 on the second sub-section 30A12, which is conducive to increasing the bonding force between the second sub-section 30A12 and the sixth section 30C2, and increasing the bonding stability between the metal layer 30A and the adhesive glue 30C, thereby improving the structural stability of the electrostatic discharge component 30. In addition, the second section 30A2 is adjacent to and connected to the second sub-section 30A12. Optionally, the conductive glue 30B located between the second section 30A2 and the fourth section 202 and the conductive glue 30B located between the second sub-section 30A12 and the sixth section 30C2 are adhered, so that the portion of the conductive glue 30B that is released from the fourth section 202 of the back plate 20 to the metal layer 30A on the electrostatic discharge component 30 is enlarged, thereby increasing the cross-sectional area of ​​the electrostatic discharge path, which is conducive to further improving the efficiency of electrostatic discharge.

[0055] Figure 8 Another embodiment provided in this application Figure 3 Schematic diagram of the cross section along the P-P' direction, Fig. 9 Another embodiment provided in this application Figure 3Schematic diagram of the cross section along the P-P' direction.

[0056] In one embodiment of the present application, Figure 8 As shown, the surface of the sixth portion 30C2 of the adhesive 30C facing the second sub-portion 30A12 includes at least one second groove C2. Optionally, the surface of the sixth portion 30C2 facing the second sub-portion 30A12 is engraved with the second groove C2 by laser cutting. The second groove C2 is filled with conductive glue 30B. Optionally, the second groove C2 has the same shape as the first groove C1.

[0057] In the embodiment of the present application, the surface of the sixth part 30C2 of the adhesive 30C facing the second sub-part 30A12 includes a second groove C2, which is beneficial to increase the surface area of ​​the adhesive 30C, thereby increasing the bonding force between the sixth part 30C2 and the second sub-part 30A12, preventing the second sub-part 30A12 from falling off, thereby increasing the structural stability of the electrostatic release component 30.

[0058] In some technical solutions, reference Figure 7-Figure 9 As shown, the second groove C2 may be prepared on the surface of the sixth portion 30C2 facing the second sub-portion 30A12, and / or the first groove C1 may be prepared on the surface of the second sub-portion 30A12 facing the sixth portion 30C2.

[0059] In one embodiment of the present application, continue to refer to Figure 6 As shown, the width of the adjacently connected second portion 30A2 and the second sub-portion 30A12 in the first direction X1 is L1. The first direction X1 is the direction in which the second portion 30A2 and the second sub-portion 30A12 are adjacently arranged. Among them, 100 μm≤L1≤200 μm.

[0060] The first direction X1 is parallel to the plane where the electrostatic discharge component 30 is located. The width of the second part 30A2 and the second sub-part 30A12 in the first direction X1 is set to L1 within a preset range, which is conducive to unifying the structural standard of the electrostatic discharge component 30 and improving its usability. In addition, setting 100μm≤L1≤200μm means limiting the size of the copper leakage area of ​​the metal layer 30A facing the surface of the back plate 20. The second part 30A2 and the second sub-part 30A12 are both copper leakage areas on the surface of the metal layer 30A. There are also spaces between some metal layers 30A and the back plate 20 in this area where other film layers are not provided with film materials. When these spaces are large, they are easy to cause the collapse of the electrostatic discharge component 30. Therefore, setting 100μm≤L1≤200μm is conducive to reducing the risk of collapse of the electrostatic discharge component 30, improving its structural stability, and thus improving the working stability of the electrostatic discharge component 30.

[0061] In one embodiment of the present application, reference Figure 5As shown, the depth of the first groove C1 in the direction perpendicular to the plane where the display module 100 is located is H1, 20μm≤H1≤40μm. The depth H1 of the first groove C1 is related to the thickness of the metal layer 30A in the direction perpendicular to the plane where the display module 100 is located. When the depth H1 of the first groove C1 is set larger, it means that the thickness of the metal layer 30A is also larger. The thickness of the metal layer 30A also needs to be set within a preset range to avoid the metal layer 30A being too thin and easy to break, and to avoid the metal layer 30A being too thick and resulting in poor flexibility.

[0062] In the embodiment of the present application, the depth H1 of the first groove C1 of the second portion 30A2 and the second sub-portion 30A12 of the metal layer 30A facing the surface of the back plate 20 is both within the range of [20μm, 40μm], which is beneficial for ensuring that the thickness of the prepared metal layer 30A is also within the preset range, so that the metal layer 30A can be used to prepare the first groove C1 and has a certain flexibility, and can better cope with the bending of the display module 100.

[0063] In one embodiment of the present application, continue to refer to Figure 8 As shown, the depth of the second groove C2 in the direction perpendicular to the plane of the display module 100 is H2, 20μm≤H2≤40μm. The depth H2 of the second groove C2 is related to the thickness of the adhesive 30C in the direction perpendicular to the plane of the display module 100. The greater the depth H2 of the second groove C2, the greater the thickness of the adhesive 30C required to be prepared. The thickness of the adhesive 30C also needs to be set within a preset range to avoid the adhesive 30C being too thin and having poor bonding ability, and to avoid the adhesive 30C being too thick and affecting the thinness of the electrostatic discharge component 30.

[0064] In the embodiment of the present application, the depth H2 of the second groove C2 arranged on the surface of the second sub-portion 30A12 of the sixth portion 30C2 of the adhesive 30C facing the metal layer 30A is within the range of [20μm, 40μm], which is conducive to ensuring that the thickness of the prepared adhesive 30C is also within the preset range, so that the adhesive 30C can not only well bond the electrostatic discharge component 30 to the back panel 20, but also reduce the influence of the excessive thickness of the electrostatic discharge component 30 in the direction perpendicular to the plane where the display module 100 is located on the thinness of the electrostatic discharge component 30, which is conducive to reducing the influence of the electrostatic discharge component 30 on the thinness of the display module 100 and improving the availability of the electrostatic discharge component 30.

[0065] In one embodiment of the present application, Fig. 9As shown, along the direction perpendicular to the plane where the display module 100 is located, the first grooves C1 located in the second sub-portion 30A12 overlap with the second grooves C2 located in the sixth portion 30C2, which is beneficial for symmetrical cutting when preparing the first grooves C1 located in the second sub-portion 30A12 and the second grooves C2 located in the sixth portion 30C2, and is beneficial for reducing the difficulty of preparing the first grooves C1 and the second grooves C2, thereby improving the preparation efficiency when preparing the electrostatic release component 30.

[0066] Fig.10 Another embodiment provided in this application Figure 3 Schematic diagram of the cross section along the P-P' direction.

[0067] like Fig.10 As shown, the second part 30A2 and the second sub-part 30A12 of the metal layer 30A may be provided with a first groove C1 on the side facing the back plate 20, which is beneficial to further increase the surface area of ​​the metal layer 30A on the side facing the back plate 20, thereby improving the combined force between the electrostatic release module 30 and the back plate 20, and also beneficial to improve the efficiency of electrostatic release. In addition, the sixth part 30C2 of the adhesive 30C is also provided with a second groove C1 on the side facing the metal layer 30, which is beneficial to increase the surface area of ​​the adhesive 30C on the side facing the metal layer 30, thereby further improving the combined force between the electrostatic release module 30 and the back plate 20, and improving the efficiency of electrostatic release.

[0068] Fig.11 A partial plan view of a conductive adhesive provided in an embodiment of the present application.

[0069] In one embodiment of the present application, Fig.11 As shown, the conductive adhesive 30B includes a curable adhesive material 30B1 and nano-conductive filaments 30B2. The size of the nano-conductive filaments 30B2 is usually at the nanometer level. A certain amount of the nano-conductive filaments 30B2 can be stirred and mixed with the curable adhesive material 30B1 so that the nano-conductive filaments 30B2 are evenly distributed in the curable adhesive material 30B1. The curable adhesive material 30B1 is made conductive after being doped with the nano-conductive filaments 30B2. The curable adhesive material 30B1 can be filled into the space between the electrostatic discharge component 30 and the back plate 20 that needs to be bonded, and then cured to complete the bonding and electrical connection functions of the conductive adhesive 30B.

[0070] In the process of bonding using the conductive adhesive 30B, it is optional to prepare the film layers in the electrostatic discharge component 30 first, use the adhesive 30C to bond and fix the electrostatic discharge component 30 to the back plate 20, and then cut the positions where the grooves need to be prepared on the surfaces of the metal layer 30A and the adhesive 30C to form the first groove C1 and the second groove C2. The conductive adhesive 30B is filled in the space between the back plate 20 and the metal layer 30A and between the adhesive 30C and the metal layer 30A, and then cured in the filled space to complete the bonding and electrical connection functions.

[0071] Fig.12 A schematic diagram of a display device provided in an embodiment of the present application.

[0072] The present application embodiment provides a display device 200, such as Fig.12 As shown, the display device 200 includes the display module 100 provided in the above embodiment. The display device 200 can be a device including a display function, such as a computer, a television, a mobile phone, etc.

[0073] In the display device 200, an electrostatic discharge component 30 is prepared on the side of the back plate 20 in the display module 100 away from the display panel 10, so that the static electricity accumulated in the display module 100 can be released to the electrostatic discharge component 30 in time, which is beneficial to avoid static electricity accumulation in the display module 100 and affect the normal operation of the display module 100; it is also beneficial to reduce the risk of static electricity damaging the components in the display module 100, and can effectively reduce the risks of electrostatic breakdown, short circuit, signal transmission disorder, etc.

[0074] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A display module, characterized in that: include: Display panel; A back plate, the back plate being located on a backlight side of the display panel; An electrostatic release component is located on a side of the back plate away from the display panel; the electrostatic release component includes a metal layer and a conductive adhesive, the conductive adhesive is located between the back plate and the metal layer and bonds the back plate and the metal layer.

2. The display module according to claim 1, characterized in that: The electrostatic release assembly further includes an adhesive, and the adhesive is located between the back plate and the metal layer; The metal layer includes a first portion and a second portion, the second portion is located outside the first portion; along a direction perpendicular to the plane where the display module is located, the first portion overlaps with the adhesive and the second portion does not overlap with the adhesive; the back plate includes a third portion and a fourth portion, along a direction perpendicular to the plane where the display module is located, the third portion overlaps with the adhesive and the fourth portion does not overlap with the adhesive; The conductive adhesive bonds the second portion and the fourth portion.

3. The display module according to claim 2, characterized in that: The surface of the second portion facing the fourth portion includes at least one first groove; Wherein, the first groove is filled with conductive glue.

4. The display module according to claim 2, characterized in that: The electrostatic discharge component further includes an insulating layer, and the insulating layer is located between the adhesive and the metal layer; the first part includes a first sub-part and a second sub-part, and the second sub-part is adjacently connected to the second part; along a direction perpendicular to the plane where the display module is located, the first sub-part overlaps with the insulating layer and the second sub-part does not overlap with the insulating layer; the adhesive includes a fifth part and a sixth part, and along a direction perpendicular to the plane where the display module is located, the fifth part overlaps with the insulating layer and the sixth part does not overlap with the insulating layer; Wherein, the conductive adhesive bonds the second sub-section and the sixth section.

5. The display module according to claim 4, characterized in that: The surface of the second sub-portion facing the sixth portion includes at least one first groove; Wherein, the first groove is filled with conductive glue.

6. The display module according to claim 4 or 5, characterized in that: The surface of the sixth portion facing the second sub-portion includes at least one second groove; Wherein, the second groove is filled with conductive glue.

7. The display module according to claim 4, characterized in that: The width of the second portion and the second sub-portion connected adjacently in the first direction is L1; the first direction is the direction in which the second portion and the second sub-portion are adjacently arranged; Among them, 100μm≤L1≤200μm.

8. The display module according to claim 3 or 5, characterized in that: The depth of the first groove in a direction perpendicular to the plane where the display module is located is H1; 20 μm≤H1≤40 μm.

9. The display module according to claim 6, characterized in that: The depth of the second groove in a direction perpendicular to the plane where the display module is located is H2; 20 μm≤H2≤40 μm.

10. The display module according to claim 6, characterized in that: Along a direction perpendicular to the plane where the display module is located, the first groove located in the second sub-portion overlaps with the second groove located in the sixth portion.

11. The display module according to claim 1, characterized in that: The conductive adhesive comprises a curable adhesive material and nano conductive wires.

12. A display device, characterized in that: Comprising a display module as described in any one of claims 1-11.

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