Silicon wafer cleaning device and cleaning method

Abstract

The invention relates to the technical field of silicon wafer production and processing, in particular to a silicon wafer cleaning device and method.The silicon wafer cleaning device comprises a cleaning box, a water storage box, an ultrafiltration assembly, a circulating pump, a conveying assembly, a support, a linear module, a driving assembly B and a driving assembly D. A rotary driving part and an ultrasonic oscillator are arranged below the liquid level of a cleaning agent in the cleaning box. The water storage tank communicates with the cleaning tank through a drainage pipe at the bottom of the cleaning tank. And the ultrafiltration assembly is communicated with the water storage tank. The circulating pump communicates with the water storage tank and the cleaning tank. The conveying assemblies are symmetrically arranged on the two sides of the cleaning box. The support is slidably connected with a sliding frame, a U-shaped frame is arranged below the sliding frame, and the U-shaped frame is rotatably connected with a wafer cleaning box. The linear module drives the sliding frame to slide. The driving assembly B drives the U-shaped frame to ascend and descend. The driving assembly D is connected with the U-shaped frame and drives the wafer cleaning box to turn over. Automatic feeding and discharging of the silicon wafers are achieved, the cleaning efficiency of the silicon wafers is improved, cleaning water is recycled, and water is saved.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon wafer production and processing, and in particular to a silicon wafer cleaning device and a cleaning method. Background Art

[0002] Silicon wafers come in different shapes, such as round, square and polygonal, with round silicon wafers being the most common. After initial processing, contaminants will adhere to their surface, including metals, silicon slag, dust, bacteria, microorganisms and organic silicone fibers, etc. If these impurities are not cleaned with standard cleaning water, they will cause various defects.

[0003] During the cleaning process, the round silicon wafer needs to be placed in the wafer slot of the wafer cleaning box, and then placed in water for cleaning by an ultrasonic cleaning machine. The loading and unloading of silicon wafers requires manual loading, which is time-consuming and labor-intensive, and easily damages the surface structure of the silicon wafer. At the same time, the existing wafer cleaning device consumes a large amount of clean water. Summary of the invention

[0004] The purpose of the present invention is to provide a silicon wafer cleaning device and a cleaning method in view of the problems existing in the background technology.

[0005] Technical solution of the present invention: On the one hand, the present invention proposes a silicon wafer cleaning device, including a cleaning box, in which a rotating drive component and an ultrasonic oscillator are arranged below the liquid level of the cleaning agent.

[0006] A water storage tank is communicated with the cleaning tank through a drain pipe at the bottom of the cleaning tank.

[0007] The ultrafiltration component is connected to the water storage tank to filter the water entering the water storage tank from the drainage pipe.

[0008] A circulation pump is connected to the water storage tank and the cleaning tank to return the filtered clean water into the cleaning tank.

[0009] The conveying components are symmetrically arranged on both sides of the cleaning box.

[0010] The bracket is slidably connected to the slide, a U-shaped frame is arranged below the slide, and the U-shaped frame is rotatably connected to the wafer cleaning box.

[0011] The linear module is connected to the bracket and drives the slide to slide.

[0012] Driving component B, driving component B is connected with the slide and drives the U-shaped frame to rise and fall.

[0013] And a driving component D, which is connected to the U-shaped frame and drives the wafer cleaning box to flip.

[0014] Preferably, the ultrafiltration assembly includes a mounting frame, a fine sand layer, a coarse filter, a fine filter and an ultrafiltration membrane. The mounting frame is inserted into the water tank and slides therewith, and the upper opening of the mounting frame is located below the nozzle of the drain pipe, and the lower opening of the mounting frame is located above the liquid level in the water tank. The fine sand layer, the coarse filter, the fine filter and the ultrafiltration membrane are all located in the mounting frame and connected to the inner wall thereof, and the fine sand layer, the coarse filter, the fine filter and the ultrafiltration membrane are distributed layer by layer along the upper opening of the mounting frame toward the lower opening.

[0015] Preferably, the conveying assembly includes a stand, a roller, a conveyor belt and a driving assembly A, and the two sets of stands are respectively connected to the corresponding sides of the cleaning box. The roller is rotatably connected to the stand, and the two sets of rollers on the same stand are connected by conveyor belt transmission. The driving assembly A includes a motor A, which is connected to the stand and drives the rollers on the corresponding side stand to rotate, so as to drive the conveyor belt on the corresponding side to drive, and the conveyor belts on both sides rotate in the same direction, so as to form a feed conveyor belt and a discharge conveyor belt on both sides of the cleaning box.

[0016] Preferably, a plurality of wafer slots are provided on the wafer cleaning box, and a passage for the conveyor belt to pass through is provided at the bottom of the wafer cleaning box.

[0017] Preferably, the rotating driving member includes a PVA rubber roller and a motor B, the PVA rubber roller is rotatably connected to the inner wall of the cleaning box, and the motor B is connected to the cleaning box and drives the PVA rubber roller to rotate, so that when the travel channel is stuck on the PVA rubber roller and the silicon wafer falls on the PVA rubber roller, the silicon wafer in the wafer cleaning box is driven to rotate through the PVA rubber roller.

[0018] Preferably, a grating detection unit for detecting the position of the silicon wafer on the conveyor belt is provided on the platform.

[0019] Preferably, the driving assembly B includes a motor C, a gear, a rack and a movable frame. The movable frame is connected to the U-shaped frame, the rack is connected to the movable frame, the gear is rotatably connected to the slide, and the gear is meshed with the rack. The motor C is connected to the slide and drives the gear to rotate, so that the movable frame, the U-shaped frame and the wafer cleaning box are lifted and lowered through the cooperation of the gear and the rack.

[0020] Preferably, a drying component for drying the wafers cleaned in the wafer cleaning box is provided on the cleaning box, and a driving component C is provided on the movable frame. The driving component C includes a motor D. The motor D is connected to the movable frame and drives the U-shaped frame to rotate, thereby driving the silicon wafers to rotate and accelerating the drying of the silicon wafers.

[0021] Preferably, the driving assembly D comprises a motor E, a worm and a worm wheel. The worm is rotatably connected to the U-shaped frame, and the motor E drives the worm. The worm wheel is connected to the mounting shaft of the wafer cleaning box, and the worm wheel meshes with the worm.

[0022] On the other hand, the present invention also provides a cleaning method based on the above silicon wafer cleaning device, comprising the following steps:

[0023] S1. Start the circulation pump to circulate and filter the water in the cleaning box, start the linear module, drive component B and drive component D, and clamp the wafer cleaning box on the feed conveyor belt through the travel channel at the bottom, while making the wafer slot loading port face the silicon wafer.

[0024] S2. Start loading silicon wafers. The conveyor belt delivers the silicon wafers into the top wafer slot. Then, the wafer cleaning box remains vertical and rises one unit height to load the silicon wafers into the second wafer slot. After all wafer slots are loaded in sequence, the wafer cleaning box returns to the horizontal state and keeps the wafer slot opening upward. The linear module moves the wafer cleaning box horizontally and cooperates with the drive component B to deliver the wafer cleaning box and the silicon wafer into the cleaning box and place them below the liquid surface. At the same time, the bottom of the silicon wafer falls on the PVA rubber roller of the rotating drive component.

[0025] S3, start the ultrasonic oscillator, the oscillator acts on the cleaning agent and stimulates a large number of bubbles to clean the silicon wafer. At the same time, the motor A drives the PVA rubber roller to rotate, thereby driving the silicon wafer to rotate, so that the silicon wafer is cleaned without dead angles.

[0026] S4. After cleaning is completed, the wafer cleaning box first rises out of the water under the action of the linear module, drive component B and drive component D, and then flips over so that its wafer slot opening faces the discharge conveyor belt, and the wafer cleaning box is stuck on the discharge conveyor belt through the bottom travel channel, and the silicon wafers are guided out of the wafer cleaning box layer by layer through the discharge conveyor belt.

[0027] Compared with the prior art, the present invention has the following beneficial technical effects:

[0028] By setting two groups of conveyor belts and setting a passage for the conveyor belts to pass through on the wafer cleaning box, it is convenient to clamp the wafer cleaning box on the conveyor belt to complete the action of loading or unloading silicon wafers to the wafer slot layer by layer, that is, automatic loading and unloading is realized without manual operation, saving time and labor; by setting a PVA rubber roller in the cleaning box, when the bottom of the silicon wafer falls on the PVA rubber roller, the PVA rubber roller is driven to rotate by the motor A to drive the silicon wafer to rotate, thereby preventing edge dead corners during the cleaning process of the silicon wafer, and the PVA rubber roller itself is soft and will not damage the surface of the silicon wafer; by setting an ultrafiltration component and a circulating pump, the water in the cleaning box is recycled, and the water discharged from the cleaning box is filtered layer by layer during the circulation process, so as to achieve the purpose of saving water. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a structural schematic diagram of the present invention;

[0030] Figure 2 Schematic diagram of the structure of the ultrafiltration component

[0031] Figure 3 It is a schematic diagram of the connection structure of various components on the slide;

[0032] Figure 4 It is a schematic diagram of the connection structure between the drive assembly and the wafer cleaning box.

[0033] Figure numerals: 1, cleaning box; 2, rotating drive member; 3, ultrasonic oscillator; 4, drain pipe; 5, water storage tank; 6, ultrafiltration component; 601, mounting frame; 602, fine sand layer; 603, coarse filter; 604, fine filter; 605, ultrafiltration membrane; 7, circulating pump; 8, stand; 9, roller; 10, conveyor belt; 11, drive component A; 12, grating detection unit; 13, bracket; 14, linear module; 15, slide; 16, movable frame; 17, drive component B; 18, U-shaped frame; 19, drive component C; 20, wafer cleaning box; 2001, wafer slot; 21, drive component D; 211, motor E; 212, worm; 213, worm gear; 22, drying component. DETAILED DESCRIPTION

[0034] Embodiment 1

[0035] like Figure 1-Figure 4As shown, a silicon wafer cleaning device proposed by the present invention includes a cleaning box 1, a water storage tank 5, an ultrafiltration component 6, a circulating pump 7, a conveying component, a bracket 13, a linear module 14, a drive component B17 and a drive component D21. A rotating drive member 2 and an ultrasonic oscillator 3 are arranged below the liquid level of the cleaning agent in the cleaning box 1. The rotating drive member 2 includes a PVA rubber roller and a motor B, the PVA rubber roller is rotatably connected to the inner wall of the cleaning box 1, and the motor B is connected to the cleaning box 1 and drives the PVA rubber roller to rotate. The water storage tank 5 is connected to the cleaning box 1 through a drain pipe 4 at the bottom of the cleaning box 1. The ultrafiltration component 6 is connected to the water storage tank 5 to filter the water entering the water storage tank 5 from the drain pipe 4. The ultrafiltration component 6 includes a mounting frame 601, a fine sand layer 602, a coarse filter 603, a fine filter 604 and an ultrafiltration membrane 605. The installation frame 601 is inserted into the water storage tank 5 and slides therewith, and the upper opening of the installation frame 601 is located below the pipe mouth of the drain pipe 4, and the lower opening of the installation frame 601 is located above the liquid level in the water storage tank 5. The fine sand layer 602, the coarse filter 603, the fine filter 604 and the ultrafiltration membrane 605 are all located in the installation frame 601 and connected to its inner wall, and the fine sand layer 602, the coarse filter 603, the fine filter 604 and the ultrafiltration membrane 605 are distributed layer by layer along the upper opening of the installation frame 601 toward the lower opening. The circulation pump 7 connects the water storage tank 5 and the cleaning tank 1 to reflux the filtered clean water into the cleaning tank 1. The conveying assembly is symmetrically arranged on both sides of the cleaning tank 1. The conveying assembly includes a stand 8, a roller 9, a conveyor belt 10 and a driving assembly A11, and two sets of stands 8 are respectively connected to the corresponding sides of the cleaning tank 1. The roller 9 is rotatably connected to the stand 8, and the two sets of rollers 9 on the same stand 8 are connected by transmission through the conveyor belt 10. The driving component A11 includes a motor A, which is connected to the stage 8 and drives the roller 9 on the corresponding side stage 8 to rotate, so as to drive the corresponding side conveyor belt 10 to drive, and the conveyor belts 10 on both sides rotate in the same direction, so as to form a feeding conveyor belt and a discharging conveyor belt on both sides of the cleaning box 1. The stage 8 is provided with a grating detection unit 12 for detecting the position of the silicon wafer on the conveyor belt 10. The bracket 13 is slidably connected to the slide 15, and a U-shaped frame 18 is arranged below the slide 15. The U-shaped frame 18 is rotatably connected to the wafer cleaning box 20. A plurality of wafer slots 2001 are arranged on the wafer cleaning box 20, and a passage for the conveyor belt 10 to pass is arranged at the bottom of the wafer cleaning box 20. The linear module 14 is connected to the bracket 13 and drives the slide 15 to slide. The driving component B includes a motor C, a gear, a rack and a movable frame 16. The movable frame 16 is connected to the U-shaped frame 18, the rack is connected to the movable frame 16, the gear is rotatably connected to the slide 15, and the gear is meshed with the rack. The motor C is connected to the slide 15 and drives the gear to rotate, so as to drive the movable frame 16, the U-shaped frame 18 and the wafer cleaning box 20 to rise and fall through the cooperation of the gear and the rack. The driving assembly D includes a motor E211, a worm 212 and a worm wheel 213. The worm 212 is rotatably connected to the U-shaped frame 18, and the motor E211 drives the worm 212.The worm gear 213 is connected to the mounting shaft of the wafer cleaning box 20 , the worm gear 213 is meshed with the worm 212 , and the driving component D21 drives the wafer cleaning box 20 to flip.

[0036] In the present embodiment, the water in the cleaning box 1 is circulated and filtered by the circulation pump 7 and the ultrafiltration component 6, so that the water quality in the cleaning box 1 is kept in a good state, which ensures continuous flow operation and achieves the purpose of saving water. In the present embodiment, the wafer cleaning box 20 automatically loads and unloads silicon wafers without manual placement, which improves the cleaning efficiency and saves labor. In the process of cleaning the silicon wafer, the PVA rubber roller drives the silicon wafer to rotate, so that the blocked part of the edge of the silicon wafer is also fully cleaned to avoid impurities.

[0037] Embodiment 2

[0038] like Figure 1 As shown, a silicon wafer cleaning device proposed by the present invention, compared with the first embodiment, is provided on the cleaning box 1 with a drying component 22 for drying the cleaned wafers in the wafer cleaning box 20, and the drying component 22 includes a heating box and a fan, the input end of the fan is connected to the output end of the heating box, and the output end of the fan faces the wafer cleaning box 20. A driving component C19 is provided on the movable frame 16, and the driving component C19 includes a motor D, which is connected to the movable frame 16 and drives the U-shaped frame 18 to rotate, so as to drive the silicon wafer to rotate and accelerate the drying of the silicon wafer.

[0039] In this embodiment, the silicon wafer rotates along with the wafer cleaning box 20 so that the silicon wafer is fully in contact with the hot air, thereby improving the drying efficiency of the silicon wafer.

[0040] Embodiment 3

[0041] The present invention further proposes a cleaning method for the silicon wafer cleaning device according to the first and second embodiments, comprising the following steps:

[0042] S1. Start the circulation pump 7 to circulate and filter the water in the cleaning box 1, start the linear module 14, the drive component B17 and the drive component D21, and clamp the wafer cleaning box 20 on the feed conveyor belt 10 through the travel channel at the bottom thereof, while making the loading port of the wafer slot 2001 face the silicon wafer.

[0043] S2. Start loading silicon wafers. The conveyor belt 10 delivers the silicon wafers into the top wafer slot 2001. Then, the wafer cleaning box 20 remains in a vertical state and rises one unit height to load the silicon wafers into the second wafer slot 2001. After all wafer slots 2001 are loaded in sequence, the wafer cleaning box 20 returns to a horizontal state and keeps the wafer slots 2001 open upward. The linear module 14 moves the wafer cleaning box 20 horizontally and cooperates with the drive component B17 to deliver the wafer cleaning box 20 and the silicon wafer into the cleaning box 1 and place them below the liquid surface. At the same time, the bottom of the silicon wafer falls on the PVA rubber roller of the rotating drive component 2.

[0044] S3, start the ultrasonic oscillator, the oscillator acts on the cleaning agent and stimulates a large number of bubbles to clean the silicon wafer. At the same time, the motor A drives the PVA rubber roller to rotate, thereby driving the silicon wafer to rotate, so that the silicon wafer is cleaned without dead angles.

[0045] S4. After cleaning is completed, the wafer cleaning box 20 first rises out of the water under the action of the linear module 14, the drive component B17 and the drive component D21, and then flips over so that its wafer slot 2001 opens toward the discharge conveyor belt, and the wafer cleaning box 20 is stuck on the discharge conveyor belt 10 through the bottom travel channel, and the silicon wafers are led out from the wafer cleaning box 20 layer by layer through the discharge conveyor belt.

[0046] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited thereto, and various changes can be made within the knowledge scope of technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A silicon wafer cleaning device, characterized in that: include A cleaning box (1), wherein a rotating driving member (2) and an ultrasonic oscillator (3) are arranged below the liquid level of the cleaning agent in the cleaning box (1); A water storage tank (5), the water storage tank (5) is connected to the cleaning tank (1) through a drainage pipe (4) at the bottom of the cleaning tank (1); An ultrafiltration component (6), the ultrafiltration component (6) is connected to the water storage tank (5) to filter the water entering the water storage tank (5) from the drainage pipe (4); A circulation pump (7), the circulation pump (7) is connected to the water storage tank (5) and the cleaning tank (1) so as to return the filtered clean water into the cleaning tank (1); A conveying assembly, the conveying assembly being symmetrically arranged on both sides of the cleaning box (1); A bracket (13), the bracket (13) is slidably connected to a slide (15), a U-shaped bracket (18) is arranged below the slide (15), and the U-shaped bracket (18) is rotatably connected to a wafer cleaning box (20); A linear module (14), the linear module (14) is connected to the bracket (13) and drives the slide (15) to slide; A driving assembly B (17), the driving assembly B (17) is connected to the slide (15) and drives the U-shaped frame (18) to rise and fall; And a driving component D (21), the driving component D (21) is connected to the U-shaped frame (18) and drives the wafer cleaning box (20) to flip.

2. A silicon wafer cleaning device according to claim 1, characterized in that: The ultrafiltration component (6) comprises an installation frame (601), a fine sand layer (602), a coarse filter (603), a fine filter (604) and an ultrafiltration membrane (605); the installation frame (601) is inserted into a water storage tank (5) and slides therewith, and the upper end opening of the installation frame (601) is located below the pipe mouth of the drainage pipe (4), and the lower end opening of the installation frame (601) is located above the liquid level in the water storage tank (5); the fine sand layer (602), the coarse filter (603), the fine filter (604) and the ultrafiltration membrane (605) are all located in the installation frame (601) and connected to the inner wall thereof, and the fine sand layer (602), the coarse filter (603), the fine filter (604) and the ultrafiltration membrane (605) are distributed layer by layer along the upper end opening of the installation frame (601) toward the lower end opening.

3. A silicon wafer cleaning device according to claim 1, characterized in that: The conveying assembly comprises a stand (8), a roller (9), a conveyor belt (10) and a driving assembly A (11), wherein two sets of stands (8) are respectively connected to corresponding sides of a cleaning box (1); the roller (9) is rotationally connected to the stand (8), and the two sets of rollers (9) on the same stand (8) are transmission-connected via the conveyor belt (10); the driving assembly A (11) comprises a motor A, which is connected to the stand (8) and drives the rollers (9) on the stand (8) on the corresponding side to rotate, thereby driving the conveyor belt (10) on the corresponding side to drive, and the conveyor belts (10) on the two sides rotate in the same direction, thereby forming a feeding conveyor belt and a discharging conveyor belt on the two sides of the cleaning box (1) respectively.

4. A silicon wafer cleaning device according to claim 3, characterized in that: A plurality of wafer slots (2001) are arranged on the wafer cleaning box (20), and a passage for the conveyor belt (10) to pass through is arranged at the bottom of the wafer cleaning box (20).

5. A silicon wafer cleaning device according to claim 4, characterized in that: The rotary drive member (2) comprises a PVA rubber roller and a motor B, wherein the PVA rubber roller is rotatably connected to the inner wall of the cleaning box (1), and the motor B is connected to the cleaning box (1) and drives the PVA rubber roller to rotate, so that when the travel channel is stuck on the PVA rubber roller and the silicon wafer falls on the PVA rubber roller, the silicon wafer in the wafer cleaning box (20) is driven to rotate through the PVA rubber roller.

6. A silicon wafer cleaning device according to claim 3, characterized in that: A grating detection unit (12) for detecting the position of the silicon wafer on the conveyor belt (10) is arranged on the stand (8).

7. A silicon wafer cleaning device according to claim 1, characterized in that: The driving assembly B comprises a motor C, a gear, a rack and a movable frame (16); the movable frame (16) is connected to the U-shaped frame (18), the rack is connected to the movable frame (16), the gear is rotatably connected to the slide (15), and the gear is meshed with the rack. The motor C is connected to the slide (15) and drives the gear to rotate, so as to drive the movable frame (16), the U-shaped frame (18) and the wafer cleaning box (20) to rise and fall through the cooperation of the gear and the rack.

8. A silicon wafer cleaning device according to claim 7, characterized in that: A drying assembly (22) for drying wafers that have been cleaned in a wafer cleaning box (20) is arranged on the cleaning box (1), and a driving assembly C (19) is arranged on the movable frame (16). The driving assembly C (19) includes a motor D. The motor D is connected to the movable frame (16) and drives the U-shaped frame (18) to rotate, thereby driving the silicon wafers to rotate and accelerating the drying of the silicon wafers.

9. The silicon wafer cleaning device according to claim 1, characterized in that: The driving assembly D comprises a motor E (211), a worm (212) and a worm wheel (213); the worm (212) is rotatably connected to the U-shaped frame (18), and the motor E (211) drives the worm (212); the worm wheel (213) is connected to the mounting shaft of the wafer cleaning box (20), and the worm wheel (213) is meshed with the worm (212).

10. A silicon wafer cleaning method, using the silicon wafer cleaning device according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1, start the circulation pump (7) to circulate and filter the water in the cleaning box (1), start the linear module (14), the drive component B (17) and the drive component D (21), and clamp the wafer cleaning box (20) on the feed conveyor belt (10) through the travel channel at the bottom thereof, and at the same time make the loading port of the wafer slot (2001) face the silicon wafer; S2, start loading silicon wafers, the conveyor belt (10) delivers the silicon wafers into the topmost wafer slot (2001), then the wafer cleaning box (20) remains in a vertical state and rises one unit height to load the silicon wafers into the second wafer slot (2001), after all the wafer slots (2001) are loaded in sequence, the wafer cleaning box (20) returns to a horizontal position and keeps the wafer slots (2001) open upward, the linear module (14) moves the wafer cleaning box (20) horizontally and cooperates with the drive assembly B (17) to deliver the wafer cleaning box (20) and the silicon wafers into the cleaning box (1) and place them below the liquid surface, and at the same time, the bottom of the silicon wafer falls on the PVA rubber roller of the rotating drive member (2); S3, start the ultrasonic oscillator, the oscillator acts on the cleaning agent and stimulates a large number of bubbles to clean the silicon wafer, and at the same time, the motor A drives the PVA rubber roller to rotate, thereby driving the silicon wafer to rotate, so that the silicon wafer is cleaned without dead angles; S4. After cleaning is completed, the wafer cleaning box (20) first rises out of the water surface under the action of the linear module (14), the drive assembly B (17) and the drive assembly D (21), and then turns over so that the opening of its wafer slot (2001) faces the discharge conveyor belt, and the wafer cleaning box (20) is stuck on the discharge conveyor belt (10) through the bottom passage, and the silicon wafers are discharged from the wafer cleaning box (20) layer by layer through the discharge conveyor belt.

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