Display device

Abstract

A display device is disclosed. The display device may include a display panel including a display area and a non-display area; the sensing unit is arranged on the display area of the display panel, and the sensing unit comprises a first conducting layer, a first insulating layer arranged on the first conducting layer, a second conducting layer arranged on the first insulating layer and a second insulating layer arranged on the second conducting layer; the first part and the second conductive layer are arranged on the same layer, and the first part and the non-display area are overlapped; and a second portion disposed on the same layer as the first conductive layer and overlapping the non-display area, in which the second insulating layer includes an opening exposing at least a portion of the first portion, and in which the second portion does not overlap the opening.

Description

[0001] This application is a divisional application of application No. 201910850975.6, entitled “Display Device”, filed with the State Intellectual Property Office of China on September 10, 2019.

[0002] The technical field relates to display devices. Background Art

[0003] Generally, an organic light emitting display device may be applied to a smart phone, a tablet personal computer, an ultra-thin notebook computer, a digital camera, a camcorder, an ultra-thin TV, etc. The organic light emitting display device has various applications.

[0004] In an organic light emitting display device, at least two substrates should be sealed to protect an image display unit. A sealing portion is formed between the two substrates, and the two substrates are bonded to each other by applying energy to the sealing portion.

[0005] During the bonding process, the substrates should be properly aligned. Summary of the invention

[0006] Embodiments may relate to a display device including an alignment structure for facilitating alignment between substrates / modules of the display device. The alignment structure may include a transparent conductive member and an opening exposing the transparent conductive member.

[0007] According to an embodiment, a display device may include the following elements: a display panel; and an input sensing unit, which is arranged on the display panel, and an alignment structure for aligning the display panel is formed in the input sensing unit, wherein the input sensing unit includes: a first sensing electrode, including a first sensor part and a first connecting part connecting the first sensor part; and a second sensing electrode, including a second sensor part and a second connecting part connecting the second sensor part, wherein the alignment structure includes a first pattern part arranged in the same layer as the first sensor part and the second sensor part.

[0008] The first pattern portion is formed of the same material as the first sensor portion and the second sensor portion.

[0009] The alignment structure may be formed of a transparent conductive oxide including at least one of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and indium tin zinc oxide (ITZO).

[0010] The input sensing unit may include: a first conductive layer, in which any one of the first connecting part and the second connecting part is provided; a first insulating layer, covering the one of the first connecting part and the second connecting part; a second conductive layer, in which the first sensor part, the second sensor part, the other one of the first connecting part and the second connecting part, and an alignment structure are provided; and a second insulating layer, covering the first sensor part, the second sensor part, the other one of the first connecting part and the second connecting part, and the alignment structure.

[0011] The input sensing unit may further include an opening formed on the alignment structure to expose the alignment structure to the outside.

[0012] The first conductive layer may be disposed below the second conductive layer, and an opening may be formed in the second insulating layer.

[0013] The first conductive layer may be disposed over the second conductive layer, and an opening may be formed to penetrate the first insulating layer and the second insulating layer.

[0014] Either one of the first connection portion and the second connection portion may be provided in a layer different from those of the first sensor portion and the second sensor portion, and the other one of the first connection portion and the second connection portion may be provided in the same layer as those of the first sensor portion and the second sensor portion.

[0015] The alignment structure may further include a second pattern portion disposed in the same layer as the one of the first connection portion and the second connection portion.

[0016] The second pattern part may be formed of the same material as the one of the first connection part and the second connection part.

[0017] The second pattern part may be formed of a metal including at least one of molybdenum, silver, titanium, copper, aluminum, and any alloy thereof.

[0018] The input sensing unit may include: a first conductive layer, in which the other connection part of the first connection part and the second connection part is arranged; a first insulating layer, covering the other connection part of the first connection part and the second connection part; a second conductive layer, in which the first sensor part, the second sensor part, the one connection part of the first connection part and the second connection part, and an alignment structure are arranged; and a second insulating layer, covering the first sensor part, the second sensor part, the one connection part of the first connection part and the second connection part, and the alignment structure.

[0019] The input sensing unit may further include an opening formed on the alignment structure to expose the alignment structure to the outside.

[0020] The first conductive layer may be disposed below the second conductive layer, and an opening may be formed in the second insulating layer.

[0021] The first conductive layer may be disposed over the second conductive layer, and an opening may be formed to penetrate the first insulating layer and the second insulating layer.

[0022] The first pattern portion and the second pattern portion may be disposed adjacent to each other, and may not overlap each other.

[0023] The second pattern part may be formed at a position corresponding to the frame of the first pattern part.

[0024] The alignment structure may have a quadrilateral ring shape or a T shape.

[0025] The display panel may include: a base substrate on which a display unit is formed; an encapsulation substrate encapsulating the display unit; and a sealing member disposed between the base substrate and the encapsulation substrate. The alignment structure may be formed at a position corresponding to the sealing member.

[0026] Alignment structures may be provided to align the package substrate and the base substrate.

[0027] Embodiments may relate to a display device. The display device may include a display panel, an input sensing unit, and an alignment structure. The display panel may include a sealing member. The input sensing unit may be disposed on the display panel. The input sensing unit may include a first type sensor electrode directly contacting a surface of a first insulator of the display device, a first type connector electrically connecting the first type sensor electrode, a second type sensor electrode directly contacting a surface of the first insulator of the display device, and a second type connector electrically connecting the second type sensor electrode. The alignment structure may overlap with the sealing member and may include a transparent member directly contacting a surface of the first insulator of the display device.

[0028] The transparent member may be formed of the same material as the first type sensor electrodes and the second type sensor electrodes.

[0029] The transparent member may be formed of a transparent conductive oxide including at least one of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and indium tin zinc oxide (ITZO).

[0030] The input sensing unit may include the following elements: a first insulating layer covering and directly contacting the second type connector; and a second insulating layer covering and directly contacting each of the first type sensor electrode, the second type sensor electrode, and the first type connector, and directly contacting the transparent member.

[0031] The input sensing unit may include an opening exposing the transparent member.

[0032] An opening may be formed in the second insulating layer.

[0033] The opening may be formed in both the first insulating layer and the second insulating layer.

[0034] The first type connector may directly contact a surface of the first insulator of the display device, may overlap with the second type connector, and may be electrically insulated from the second type connector.

[0035] The second type connector may directly contact the surface of the second insulator of the display device. The second insulator of the display device may overlap with the first insulator of the display device. The alignment structure may include a conductive member. The conductive member may directly contact the surface of the second insulator of the display device.

[0036] The conductive member may be formed of the same material as the second type connector.

[0037] The conductive member may be formed of a metal including at least one of molybdenum, silver, titanium, copper, and aluminum.

[0038] The input sensing unit may include the following elements: a first insulating layer covering and directly contacting each of the second type connector and the conductive member; and a second insulating layer covering and directly contacting each of the first type sensor electrode, the second type sensor electrode and the first type connector, and directly contacting the transparent member.

[0039] The input sensing unit may include an opening exposing the transparent member.

[0040] An opening may be formed in the second insulating layer.

[0041] The opening may be formed in both the first insulating layer and the second insulating layer.

[0042] A portion of the transparent member may not overlap the conductive member.

[0043] In a plan view of the display device, one of the conductive member and the transparent member may surround the other of the conductive member and the transparent member.

[0044] The transparent member may be conductive. The color of the transparent member may be different from the color of the conductive member.

[0045] The transparent member may have a quadrangular ring shape or a T shape in a plan view of the display device.

[0046] The display panel may include the following elements: a base substrate; a display unit disposed on the base substrate; and an encapsulation substrate encapsulating the display unit. A sealing member may be disposed between the base substrate and the encapsulation substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 is an exploded perspective view showing a display device according to an embodiment.

[0048] Figure 2 is a diagram showing a method according to an embodiment of the present invention. Figure 1 A cross-sectional view of a display device.

[0049] Figure 3 is a diagram showing a method according to an embodiment of the present invention. Figure 1 A perspective view of an input sensing unit of a display device.

[0050] Figure 4 is a diagram showing a method according to an embodiment of the present invention. Figure 1 A cross-sectional view of a portion of a display device.

[0051] Figure 5A is a diagram showing the Figure 4 A plan view of the sealing area of ​​the box is shown in FIG.

[0052] Figure 5B is a diagram showing the Figure 4 A plan view of the sealing area of ​​the box is shown in FIG.

[0053] Figure 6 is a plan view showing an alignment structure according to an embodiment.

[0054] Figure 7 The embodiment according to the present invention is shown Figure 6 A cross-sectional view taken along line II'.

[0055] Figure 8 The embodiment according to the present invention is shown Figure 6 A cross-sectional view taken along line II'.

[0056] Fig. 9 is a plan view showing an alignment structure according to an embodiment.

[0057] Fig.10 The embodiment according to the present invention is shown Fig. 9 A cross-sectional view taken along line II-II'.

[0058] Fig.11 The embodiment according to the present invention is shown Fig. 9 A cross-sectional view taken along line II-II'. DETAILED DESCRIPTION

[0059] Example embodiments are described with reference to the accompanying drawings. Practical embodiments are not limited to specific shapes but are adaptable to changes, equivalent materials, and substitutions. The drawings are illustrative.

[0060] The same reference numerals may represent the same elements. In the accompanying drawings, for clarity, the thickness of an element or feature may be exaggerated. Although the terms "first", "second", etc. may be used here to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Therefore, without departing from the teachings of one or more embodiments, the "first" element discussed below may also be referred to as the "second" element. Describing an element as a "first" element may not require or imply the presence of a second element or other elements. The terms "first", "second", etc. may also be used here to distinguish between different types of elements or different groups of elements. For simplicity, the terms "first", "second", etc. may respectively represent "first type (or first group)", "second type (or second group)", etc.

[0061] Unless the context clearly indicates otherwise, singular forms may also include plural forms.

[0062] The terms “includes,” “comprising,” and / or variations thereof may indicate the presence of stated features, integers, steps, operations, elements, and / or components, but may not exclude the presence and / or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0063] The expression that a first element is “on” a second element may not only indicate that the first element is “directly” located “on” the second element but also indicate that an intervening element may be interposed between the first element and the second element.

[0064] The term “connect” may mean “electrically connected”; the term “formed” may mean “provided”; the term “part” may mean “member” or “component”; the term “conductive” may mean “electrically conductive”.

[0065] Figure 1 is an exploded perspective view showing a display device 100 according to an embodiment. Figure 2 is a diagram showing a method according to an embodiment of the present invention. Figure 1 1 is a cross-sectional view of a display device 100 .

[0066] For example, the display device 100 may be an organic light emitting display device (OLED), a liquid crystal display device (LCD), a field emission display device (FED), or an electronic paper display device (EPD).

[0067] The display device 100 may be a rigid display device or a flexible display device.

[0068] Reference Figure 1 and Figure 2, the display device 100 may include a display panel 160 , an input sensing unit 150 , an anti-reflection unit 170 , and a window unit 180 .

[0069] The display panel 160 may include a base substrate 110 , a display unit 120 disposed on the base substrate 110 , and an encapsulation substrate 140 for encapsulating the display unit 120 .

[0070] The base substrate 110 may be a glass substrate, a polymer substrate, a flexible film, a metal substrate, or a composite substrate.

[0071] The encapsulation substrate 140 may be a glass substrate, a polymer resin substrate, or a flexible film. The encapsulation substrate 140 may be an insulator.

[0072] The sealing member 200 is formed between the base substrate 110 and the encapsulation substrate 140 to encapsulate the display unit 120. The sealing member 200 may be formed along edges of surfaces of the base substrate 110 and the encapsulation substrate 140. The sealing member 200 may include a UV curable resin.

[0073] The display unit 120 may include a display element layer including at least one light emitting element for displaying an image and a circuit element layer for controlling the light emitting element.

[0074] The circuit element layer includes at least one insulating layer and a circuit element. The insulating layer includes at least one intermediate inorganic layer and at least one intermediate organic layer. The circuit element includes a signal line, a driving circuit of a pixel, etc. The circuit element layer can be formed by a process of forming an insulating layer, a semiconductor layer, and a conductive layer by coating, deposition, etc., and a process of patterning the insulating layer, the semiconductor layer, and the conductive layer by photolithography.

[0075] The display element layer includes a light emitting element. The display element layer may include an organic light emitting diode. The display element layer may also include an organic layer such as a pixel defining layer.

[0076] In an embodiment, the input sensing unit 150 may be formed on the package substrate 140. The input sensing unit 150 may obtain coordinate information of an external input (e.g., a touch event). The input sensing unit 150 may be a touch sensing panel for sensing a user's touch or a fingerprint sensing panel for sensing fingerprint information of a user's finger. The input sensing unit 150 may be a digitizer sensing panel for sensing a digitizer pen. The input sensing unit 150 may partially or completely overlap with a display area (where an image is displayed on the display unit 120) and / or a non-display area.

[0077] like Figure 1 and Figure 2As shown in , the input sensing unit 150 may be a layer. The layered input sensing unit 150 may be directly disposed on a substrate surface provided by the display panel 160. In an embodiment, the substrate surface may be an upper surface of the encapsulation substrate 140. In an embodiment, the input sensing unit 150 may be a panel. The panel may include a substrate layer provided with a substrate surface, such as a synthetic resin film, a composite material film, or a glass substrate.

[0078] The anti-reflection unit 170 may be formed on the input sensing unit 150. The anti-reflection unit 170 reduces reflection of external light incident from the upper side of the window unit 180. In an embodiment, the anti-reflection unit 170 may include a retarder and a polarizer. The retarder may be a film type or a liquid crystal coating type, and may be / include a λ3 / 4 retarder or a λ / 4 retarder. The polarizer may be a film or a liquid crystal coating. The film may be / include a stretched synthetic resin film, and the liquid crystal coating may include liquid crystals arranged in a predetermined arrangement. The anti-reflection unit 170 may also include a protective film. The retarder, the polarizer, and / or the protective film may form a base layer of the anti-reflection unit 170.

[0079] In an embodiment, the anti-reflection unit 170 may include a color filter. The color filter may have a predetermined arrangement. The arrangement of the color filter may be determined by considering the color of light emitted from the pixels included in the display panel 160. The anti-reflection unit 170 may further include a black matrix adjacent to the color filter.

[0080] In an embodiment, the anti-reflection unit 170 may include a destructive interference structure. For example, the destructive interference structure may include a first reflective layer and a second reflective layer stacked on each other. The first reflected light and the second reflected light reflected in the first reflective layer and the second reflective layer, respectively, may destructively interfere with each other, and thus, the reflection of external light may be reduced.

[0081] The window unit 180 is disposed on the top of the anti-reflection unit 170 to protect the display device 100. The window unit 180 may include (rigid) glass.

[0082] The alignment structure 260 is formed on the package substrate 140. When the base substrate 110 and the package substrate 140 are connected together, the alignment structure 260 may facilitate the base substrate 110 and the package substrate 140 to be coupled to each other at a predetermined position.

[0083] The base substrate 110 may include a region A located outside the edge of the package substrate 140. A plurality of conductive pads (or “pads”) 190 are arranged in the exposed region A of the base substrate 110 and are spaced apart from each other.

[0084] The terminal 250 of the circuit board 240 may be electrically connected to the conductive pad 190 to transfer a signal from an external device to the base substrate 110. The circuit board 240 may be a flexible printed circuit board (FPCB).

[0085] Figure 3 is a perspective view illustrating the input sensing unit 150 according to an embodiment.

[0086] For example, the input sensing unit 150 may be an electrostatic capacitance type input sensing unit, a resistance type input sensing unit, an electromagnetic type input sensing unit, a SAW (Surface Acoustic Wave) type input sensing unit, or an infrared type input sensing unit.

[0087] Reference Figure 3 , the input sensing unit 150 is formed on the package substrate 140. The input sensing unit 150 may be directly formed on the package substrate 140 or may be formed on a separately provided substrate.

[0088] The first sensing electrodes 151 and the second sensing electrodes 152 may be alternately disposed on the package substrate 140 .

[0089] The longitudinal direction of each first sensing electrode 151 is a first direction (X direction), which may be parallel to the first edge of the package substrate 140. Corners / edges of adjacent first sensing electrodes 151 may face each other. The first sensing electrode 151 includes a plurality of first sensor portions 153 and a plurality of first connection portions 154 for electrically connecting the first sensor portions 153.

[0090] The first sensor portion 153 may have a quadrilateral shape, such as a rhombus / oblong shape or a square shape. A plurality of first sensor portions 153 may be formed in a row along the first direction (X direction). The first connecting portion 154 connects between two first sensor portions 153 that are directly adjacent to each other along the first direction (X direction).

[0091] The second sensing electrodes 152 are disposed between pairs of adjacent first sensing electrodes 151. The longitudinal direction of each second sensing electrode 152 is the second direction (Y direction), which may be parallel to the second edge of the package substrate 140. The corners / edges of adjacent second sensing electrodes 152 may face each other. The second sensing electrode 152 includes a plurality of second sensor portions 155 and a plurality of second connection portions 156 for electrically connecting the second sensor portions 155.

[0092] The second sensor portion 155 may have a quadrilateral shape, such as a rhombus / oblong shape or a square shape. A plurality of second sensor portions 155 may be formed in a row along the second direction (Y direction). The second connecting portion 156 connects two directly adjacent second sensor portions 155 to each other.

[0093] Two first sensor portions 153 disposed adjacent to each other (in the X direction) are connected to each other via first connection portions 154 disposed on the same plane. Two second sensor portions 155 disposed adjacent to each other (in the Y direction) are connected to each other via second connection portions 156 disposed on another plane to avoid interference with the first sensing electrodes 151.

[0094] In an embodiment, Figure 3 As shown in , the second connection portion 156 may be formed in the first conductive layer 161 located on the package substrate 140; the first sensor portion 153, the second sensor portion 155, and the first connection portion 154 may be disposed in the second conductive layer 162 located above the first conductive layer 161. In an embodiment, the first sensor portion 153, the second sensor portion 155, and the first connection portion 154 may be formed in the first conductive layer 161 located on the package substrate 140; the second connection portion 156 may be disposed in the second conductive layer 162 located above the first conductive layer 161.

[0095] The first insulating layer 157 is disposed on the package substrate 140. The first insulating layer 157 covers the second connection portion 156 formed in the first conductive layer 161. The second insulating layer 158 is disposed on the first insulating layer 157. The second insulating layer 158 covers the first sensor portion 153, the second sensor portion 155, and the first connection portion 154 formed in the second conductive layer 162. The first insulating layer 157 and the second insulating layer 158 may insulate the first sensing electrode 151 and the second sensing electrode 152 from each other.

[0096] In an embodiment, the first sensor portion 153, the second sensor portion 155 and the first connecting portion 154 are arranged in the first conductive layer 161; the second connecting portion 156 is arranged in the second conductive layer 162; the first insulating layer 157 can cover the first sensor portion 153, the second sensor portion 155 and the first connecting portion 154; the second insulating layer 158 can cover the second connecting portion 156.

[0097] A plurality of contact holes 159 are formed in the first insulating layer 157. The contact holes 159 are formed in regions corresponding to corners of the second sensor parts 155 disposed adjacent to and facing each other.

[0098] The second connection portion 156 may be disposed inside the first insulating layer 157. Ends of the second connection portions 156 may extend in a vertical direction (Z direction) in corresponding contact holes 159. Ends of the second connection portions 156 may directly contact the second sensor portions 155. The second connection portions 156 may electrically connect two adjacent second sensor portions 155 to each other.

[0099] The first sensor portion 153 and the second sensor portion 155 may include or be formed of a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO). In an embodiment, the first connection portion 154 and the second connection portion 156 may include or be formed of a metal such as molybdenum, silver, titanium, copper, aluminum, or an alloy thereof.

[0100] Each of the first insulating layer 157 and the second insulating layer 158 may include or may be formed of an inorganic material, an organic material, or a composite material.

[0101] At least one of the first insulating layer 157 and the second insulating layer 158 may include an inorganic layer. In an embodiment, the second insulating layer 158 in which the first sensor part 153 and the second sensor part 155 are disposed may be configured with an inorganic layer. The inorganic layer may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0102] At least one of the first insulating layer 157 and the second insulating layer 158 may include an organic layer. In an embodiment, the first insulating layer 157 may be constructed with an organic layer. The organic layer may include at least one of an acryl resin, a methacryl resin, polyisoprene, a vinyl resin, an epoxy resin, a urethane resin, a cellulose resin, a siloxane resin, a polyimide resin, a polyamide resin, and a perylene resin.

[0103] When an input means such as a finger approaches or contacts the package substrate 140 , the input sensing unit 150 may detect a touch position by measuring a capacitance varied between the first sensing electrode 151 and the second sensing electrode 152 .

[0104] Figure 4 is a diagram showing a method according to an embodiment of the present invention. Figure 1 1 is a cross-sectional view of a portion of a display device 100 .

[0105] Reference Figure 4 The display panel 160 includes an active area AA in which the display unit 120 is formed on the base substrate 110 , a circuit area CA located outside the active area AA, and a cell sealing area CSA located outside the circuit area CA.

[0106] The active area AA includes an area where pixels are formed, an area where transistors are formed, and an area where capacitors are formed. The circuit area CA includes an area where a circuit pattern for transmitting an electrical signal to the active area AA is formed. The cell sealing area CSA includes an area where a sealing member 200 is formed.

[0107] The base substrate 110 may be a glass substrate, a polymer substrate, a flexible film, a metal substrate, or a composite substrate. The base substrate 110 may be transparent, opaque, or translucent.

[0108] The display unit 120 may be formed in the active area AA. A pixel circuit including at least one transistor, at least one capacitor, and a light emitting element may be provided in the display unit 120.

[0109] Circuit patterns may be provided in the circuit area CA. The circuit patterns may include, for example, power supply patterns, antistatic patterns, and other circuit patterns.

[0110] The sealing member 200 is formed in the cell sealing area CSA. The sealing member 200 is formed between the base substrate 110 and the encapsulation substrate 140. The sealing member 200 may be formed in the cell sealing area CSA along the edge of the display panel 160. The sealing member 200 may be formed as a continuous structure to protect the display unit 120. The sealing member 200 seals between the base substrate 110 and the encapsulation substrate 140.

[0111] In an embodiment, the sealing member 200 may include a UV curable resin.

[0112] The encapsulation substrate 140 is coupled to the base substrate 110. The encapsulation substrate 140 may protect the organic light emitting element, etc., from external moisture or oxygen.

[0113] The encapsulation substrate 140 may be a glass substrate, a polymer resin substrate, or a flexible film. The encapsulation substrate 140 may include organic layers and inorganic layers alternately stacked on the organic light emitting element.

[0114] A first conductive layer 161 (including a second connection portion 156 ), a first insulating layer 157 , a second conductive layer 162 (including a first sensor portion 153 , a first connection portion 154 , and a second sensor portion 155 ), and a second insulating layer 158 as components of the input sensing unit 150 may be disposed on the package substrate 140 .

[0115] The alignment structure 260 may overlap the cartridge sealing area CSA and may be located in the input sensing unit 150. The alignment structure 260 may overlap the sealing member 200.

[0116] In an embodiment, the alignment structure 260 is formed in the same conductive layer as the first sensor portion 153 and the second sensor portion 155. The alignment structure 260 may be formed in the second conductive layer 162. In an embodiment, the first sensor portion 153 and the second sensor portion 155 may be formed in the first conductive layer 161, and the alignment structure 260 may be formed in the first conductive layer 161.

[0117] The alignment structure 260 may be formed by the same process steps as the first sensor portion 153 and the second sensor portion 155, may include the same material as the first sensor portion 153 and the second sensor portion 155, and / or may have the same stack structure as the first sensor portion 153 and the second sensor portion 155. In an embodiment, the alignment structure 260 may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO).

[0118] In an embodiment, the alignment structure 260 may have a thickness equal to that of each of the first sensor portion 153 and the second sensor portion 155. In an embodiment, the thickness of the alignment structure 260 may be 1000Å or more. The thickness of the alignment structure 260 may be less than the thickness of the insulating layer (e.g., the second insulating layer 158) in which the alignment structure 260 is formed. The thickness of the insulating layer may be, for example, 3000Å. Because the thickness of the alignment structure 260 is formed thick enough, the alignment structure 260 may be sufficiently visible when the alignment structure 260 is used as an indicator to align the display panel 160 with other components.

[0119] In an embodiment, the alignment structure 260 may be exposed from the input sensing unit 150 through the opening OP formed in the first insulating layer 157 and / or the second insulating layer 158 on the alignment structure 260. Because the alignment structure 260 is exposed through the opening OP, the alignment structure 260 may be sufficiently visible when the display panel 160 is aligned with other components.

[0120] The opening OP may have a shape corresponding to, similar to, and / or the same as that of the alignment structure 260. The opening OP may have an area equal to that of the alignment structure 260. In an embodiment, the opening OP may have an area narrower than that of the alignment structure 260.

[0121] In an embodiment, the alignment structure 260 may be formed by the same process steps as the first sensor portion 153 and the second sensor portion 155 , the first insulating layer 157 and / or the second insulating layer 158 may be formed over the alignment structure 260 , and then the opening OP may be formed in the first insulating layer 157 and / or the second insulating layer 158 by an etching process.

[0122] In an embodiment, a first sensor portion 153 and a second sensor portion 155 may be formed, a first insulating layer 157 or a second insulating layer 158 may be formed over the first sensor portion 153 and the second sensor portion 155, an opening OP may be formed by an etching process, and then an alignment structure 260 may be formed by injecting a transparent conductive oxide into the opening OP.

[0123] In the process of manufacturing the display device 100, the base substrate 110 and the encapsulation substrate 140 are aligned at a predetermined position using the alignment structure 260 to indicate alignment. Figure 2 The laser irradiation device 290 shown in FIG. 1 may irradiate a laser beam onto the sealing member 200 located between the base substrate 110 and the encapsulation substrate 140 , and the sealing member 200 is melted so that the base substrate 110 and the encapsulation substrate 140 are firmly bonded to each other.

[0124] In the bonding process, the alignment structure 260 formed on the package substrate 140 is aligned with the corresponding alignment structure formed on the base substrate 110 , and the alignment may be verified using a vision device so that the base substrate 110 and the package substrate 140 may be accurately aligned at a predetermined position.

[0125] Figure 5A is a diagram showing the Figure 4 A plan view of the sealing area of ​​the box is shown in FIG. Figure 5B is a diagram showing the Figure 4 A plan view of the sealing area of ​​the box is shown in FIG.

[0126] Reference Figure 5A and Figure 5B , the sealing member 200 may overlap the alignment structure 260 in a vertical direction (Z direction) perpendicular to the image display surface of the display panel 160. The sealing member 200 may include a continuous member provided along the edge of the display panel 160 in the cell sealing area CSA. The alignment structure 260 may be formed at the corner of the display panel 160. In an embodiment, the display panel 160 has a quadrilateral shape, and one alignment structure 260 may be formed at each corner. The arrangement of the sealing member 200 and the alignment structure 260 may be configured according to the shape and size of the display panel 160.

[0127] In an embodiment, the alignment structure 260 may have a quadrilateral shape, such as Figure 5A In an embodiment, the alignment structure 260 may have a T-shape, such as Figure 5BAs shown in . The alignment structure 260 may have one or more of various shapes, such as one or more of a quadrilateral shape, a rectangular shape, and an elliptical shape. The alignment structure 260 may be constructed with one segment. The alignment structure 260 may include multiple segments forming a specific pattern.

[0128] Figure 6 is a plan view showing an alignment structure according to an embodiment. Figure 7 According to the embodiment Figure 6 A cross-sectional view taken along line II'. Figure 8 is a diagram showing the Figure 6 A view of a cross section taken along line II'.

[0129] Reference Figures 6 to 8 , the alignment structure 260 is formed in the same conductive layer as the first sensor portion 153 and the second sensor portion 155. When the first sensor portion 153 and the second sensor portion 155 are formed in the second conductive layer 162, the alignment structure 260 is formed in the second conductive layer 162, such as Figure 7 When the first sensor portion 153 and the second sensor portion 155 are formed in the first conductive layer 161, the alignment structure 260 is formed in the first conductive layer 161, as shown in FIG. Figure 8 as shown in .

[0130] The alignment structure 260 may be formed by the same process steps as the first sensor portion 153 and the second sensor portion 155 to include the same material and have the same stack structure as the first sensor portion 153 and the second sensor portion 155. In an embodiment, the alignment structure 260 may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO).

[0131] An opening OP having a shape corresponding to the alignment structure 260 may be formed on the alignment structure 260. Figure 7 As shown in , when the alignment structure 260 is formed in the second conductive layer 162, the opening OP may be formed in the second insulating layer 158. Figure 8 As shown in , when the alignment structure 260 is formed in the first conductive layer 161 , the opening OP may be formed in both the first insulating layer 157 and the second insulating layer 158 .

[0132] The alignment structure 260 is exposed from the input sensing unit 150 through the opening OP, so that the alignment structure 260 may be effectively visible.

[0133] like Figure 6As shown in , the alignment structure 260 may have a quadrilateral shape. The alignment structure 260 may have one or more of various shapes, such as one or more of a quadrilateral shape, a rectangular shape, a circular shape, an elliptical shape, and a T shape.

[0134] Fig. 9 is a plan view showing an alignment structure according to an embodiment. Fig.10 According to the embodiment Fig. 9 A cross-sectional view taken along line II-II'. Fig.11 According to the embodiment Fig. 9 A cross-sectional view taken along line II-II'.

[0135] Reference Figures 9 to 11 The alignment structure 260 may include a first pattern portion 261 formed in the same conductive layer as the first sensor portion 153 and the second sensor portion 155 , and may include a second pattern portion 262 formed in a conductive layer different from those of the first sensor portion 153 and the second sensor portion 155 .

[0136] In an embodiment, the first pattern portion 261 may be formed by the same process steps as the first and second sensor portions 153 and 155 to include the same material and have the same stack structure as the first and second sensor portions 153 and 155. In an embodiment, the first pattern portion 261 may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO).

[0137] The second pattern part 262 may be formed by the same process steps as the second connection part 156 formed in the same layer to include the same material and have the same stacking structure as the second connection part 156. In an embodiment, the second pattern part 262 may include a metal such as molybdenum, silver, titanium, copper, aluminum, or an alloy thereof.

[0138] The first pattern portion 261 and the second pattern portion 262 are in contact with each other or at least adjacent to each other, but may not substantially overlap each other in the vertical direction (Z direction) perpendicular to the image display surface of the display panel 160. In an embodiment, the first pattern portion 261 may have one or more shapes in a plan view of the display device 100, such as one or more of a quadrilateral shape, a rectangular shape, a circular shape, an elliptical shape, and a T shape, and the second pattern portion 262 may correspond to and / or overlap the border / edge of the first pattern portion 261 in a plan view of the display device 100, but not overlap the inner portion of the first pattern portion 261. In a plan view of the display device 100, the outer second pattern portion 262 may surround the first pattern portion 261. In a plan view of the display device 100, the inner second pattern portion 262 may be surrounded by the first pattern portion 261.

[0139] In an embodiment, the first pattern portion 261 and the second pattern portion 262 are formed of different materials to have different colors. The first pattern portion 261 and the second pattern portion 262 having different colors contact each other or at least are adjacent to each other, so that effective visibility and recognition of the alignment structure 260 can be obtained.

[0140] In an embodiment, an opening OP may be formed on the first pattern portion 261 to expose the first pattern portion 261 to the outside from the input sensing unit 150. Fig.10 As shown in FIG. 1 , the first pattern portion 261 may be disposed in a layer above the second pattern portion 262 so that the opening OP is effectively formed only on the first pattern portion 261 . The first pattern portion 261 may be formed in the second conductive layer 162 , and the second pattern portion 262 may be formed in the first conductive layer 161 .

[0141] In an embodiment, Fig.11 As shown in FIG. 1 , the first pattern portion 261 may be formed in the first conductive layer 161, and the second pattern portion 262 may be formed in the second conductive layer 162. In an embodiment, an opening OP may be formed on the first pattern portion 261. The opening OP may have a width narrower than that of the first pattern portion 261, so that the second pattern portion 262 may be prevented from being exposed to the outside.

[0142] In the display device according to the embodiment, the visibility of the alignment structure formed on the display panel is effective. Therefore, sufficient alignment accuracy between the display panel and the window panel can be obtained, and process failure can be reduced or prevented.

[0143] In the display device according to the embodiment, the alignment structure includes a transparent conductive member. Therefore, external energy can reach the sealing member formed under the alignment structure. Therefore, adhesion between the display panel and the window panel can be effectively performed.

[0144] Example embodiments have been disclosed. Although specific terms are employed, they are to be interpreted in a general and descriptive sense and not for purposes of limitation. In some cases, unless expressly noted otherwise, it will be apparent to one of ordinary skill in the art as of the time of filing this application that features, characteristics, and / or elements described in conjunction with a particular embodiment may be used alone or in combination with features, characteristics, and / or elements described in conjunction with other embodiments. Various changes in form and detail may be made without departing from the scope set forth in the claims.

Claims

1. A display device, the display device include: A display panel including a display area and a non-display area; A sensing unit, disposed on the display area of ​​the display panel, wherein the sensing unit includes a first conductive layer, a first insulating layer disposed on the first conductive layer, a second conductive layer disposed on the first insulating layer, and a second insulating layer disposed on the second conductive layer; A first portion, disposed on the same layer as the second conductive layer and overlapping the non-display area; and The second part is arranged on the same layer as the first conductive layer and overlaps the non-display area. wherein the second insulating layer includes an opening exposing at least a portion of the first portion, and Wherein, the second portion does not overlap with the opening.

2. The display device according to claim 1, in, A boundary of the first portion overlaps at least a portion of the second portion in a thickness direction.

3. The display device according to claim 1, in, The second portion includes an outer second portion and an inner second portion.

4. The display device according to claim 3, in, The outer second portion surrounds the first portion, and the inner second portion is surrounded by the first portion.

5. The display device according to claim 1, in, The display panel includes a light emitting layer and an encapsulation layer disposed on the light emitting layer.

6. The display device according to claim 5, in, The sensing unit is directly disposed on the encapsulation layer.

7. The display device according to claim 1, in, The first portion includes a transparent conductive layer.

8. The display device according to claim 7, in, The transparent conductive layer includes at least one of indium tin oxide, indium zinc oxide, zinc oxide and indium tin zinc oxide.

9. The display device according to claim 1, in, The second portion includes at least one of molybdenum, silver, titanium, copper, and aluminum.

10. A display device, the display device include: A display panel including a sealing component; A sensing unit, disposed on the display area of ​​the display panel, wherein the sensing unit includes a first conductive layer, a first insulating layer disposed on the first conductive layer, a second conductive layer disposed on the first insulating layer, and a second insulating layer disposed on the second conductive layer; a first portion disposed on the same layer as the second conductive layer and overlapping the sealing member; and a second part, which is arranged on the same layer as the first conductive layer and overlaps the sealing component; wherein the second insulating layer includes an opening exposing at least a portion of the first portion, and Wherein, the second portion does not overlap with the opening.

11. The display device according to claim 10, in, The display panel comprises: base substrate; A light-emitting layer is disposed on the base substrate; and an encapsulation layer disposed on the light-emitting layer, and Wherein, the sealing component is arranged between the base substrate and the packaging layer.

12. The display device according to claim 11, in, The sensing unit is directly disposed on the encapsulation layer.

13. The display device according to claim 10, in, A boundary of the first portion overlaps at least a portion of the second portion in a thickness direction.

14. The display device according to claim 10, in, The second portion includes an outer second portion and an inner second portion.

15. The display device according to claim 14, in, A boundary of the outer second portion overlaps at least a portion of the sealing member in a thickness direction.

16. The display device according to claim 10, in, A center of the first portion overlaps a center of the sealing member.

17. A display device, the display device include: A display panel including a display area and a non-display area; A sensing unit is disposed on the display area of ​​the display panel, wherein the sensing unit includes a first conductive layer, a second conductive layer disposed on a layer different from the first conductive layer, a first insulating layer disposed between the first conductive layer and the second conductive layer, and a second insulating layer disposed on the first insulating layer; A first portion, disposed on the same layer as the first conductive layer and overlapping the non-display area; and A second portion is disposed on the same layer as the second conductive layer and overlaps the non-display area. wherein at least one of the first insulating layer and the second insulating layer includes an opening exposing at least a portion of the first portion, and The second portion overlaps the second insulating layer in a thickness direction.

18. The display device according to claim 17, in, A boundary of the first portion overlaps at least a portion of the second portion in the thickness direction.

19. The display device according to claim 17, in, The second portion includes an outer second portion and an inner second portion.

20. The display device according to claim 19, in, The outer second portion surrounds the first portion, and the inner second portion is surrounded by the first portion.

21. The display device according to claim 17, in, The display panel includes a light emitting layer and an encapsulation layer disposed on the light emitting layer.

22. The display device according to claim 21, in, The sensing unit is directly disposed on the encapsulation layer.

23. The display device according to claim 17, in, The opening penetrates the second insulating layer.

24. The display device according to claim 23, in, The opening also penetrates the first insulating layer.

25. The display device according to claim 17, in, The first portion includes a transparent conductive layer.

26. The display device according to claim 25, in, The transparent conductive layer includes at least one of indium tin oxide, indium zinc oxide, zinc oxide and indium tin zinc oxide.

27. The display device according to claim 17, in, The second portion includes at least one of molybdenum, silver, titanium, copper, and aluminum.

28. A display device, the display device include: A display panel including a sealing component; A sensing unit is arranged on the display area of ​​the display panel, wherein the sensing unit includes a first conductive layer, a second conductive layer arranged on a layer different from the first conductive layer, a first insulating layer arranged between the first conductive layer and the second conductive layer, and a second insulating layer arranged on the first insulating layer; A first portion is disposed on the same layer as the first conductive layer; and The second part is provided on the same layer as the second conductive layer, wherein at least one of the first insulating layer and the second insulating layer includes an opening exposing at least a portion of the first portion, and Wherein, the sealing component overlaps with the opening in the thickness direction.

29. The display device according to claim 28, in, The sealing member overlaps at least a portion of the first portion.

30. The display device according to claim 28, in, The sealing member overlaps at least a portion of the second portion.

31. The display device according to claim 28, in, The display panel comprises: base substrate; A light-emitting layer is disposed on the base substrate; and an encapsulation layer disposed on the light-emitting layer, and Wherein, the sealing component is arranged between the base substrate and the packaging layer.

32. The display device according to claim 31, in, The sensing unit is directly disposed on the encapsulation layer.

33. The display device according to claim 28, in, A boundary of the first portion overlaps at least a portion of the second portion in the thickness direction.

34. The display device according to claim 28, in, The second portion includes an outer second portion and an inner second portion.

35. The display device according to claim 34, in, A boundary of the outer second portion overlaps at least a portion of the sealing member in the thickness direction.

36. The display device according to claim 28, in, A center of the first portion overlaps a center of the sealing member.

37. A display device, the display device include: A display panel including a display area and a non-display area; A sensing unit is arranged on the display area of ​​the display panel, wherein the sensing unit comprises a first conductive layer and a second conductive layer, and the first conductive layer and the second conductive layer are arranged in different layers; A first portion, disposed on the same layer as the first conductive layer and overlapping the non-display area; and A second portion is disposed on the same layer as the second conductive layer and overlaps the non-display area. Wherein, a boundary of the first portion overlaps with at least a portion of the second portion in a thickness direction.

38. The display device according to claim 37, in, The second portion includes an outer second portion and an inner second portion.

39. The display device according to claim 38, in, The outer second portion surrounds the first portion, and the inner second portion is surrounded by the first portion.

40. The display device according to claim 37, in, The display panel includes a light emitting layer and an encapsulation layer disposed on the light emitting layer.

41. The display device according to claim 40, in, The sensing unit is directly disposed on the encapsulation layer.

42. The display device according to claim 37, in, The first portion includes a transparent conductive layer.

43. The display device according to claim 42, in, The transparent conductive layer includes at least one of indium tin oxide, indium zinc oxide, zinc oxide and indium tin zinc oxide.

44. The display device according to claim 37, in, The second portion includes at least one of molybdenum, silver, titanium, copper, and aluminum.

45. The display device according to claim 37, in, The display panel includes a sealing member.

46. ​​The display device according to claim 45, in, The sealing member overlaps at least a portion of the first portion.

47. The display device according to claim 45, in, The sealing member overlaps at least a portion of the second portion.

48. The display device according to claim 45, in, A center of the first portion overlaps a center of the sealing member.

49. A display device, the display device include: A display panel including a display area and a non-display area; A sensing unit is arranged on the display area of ​​the display panel, wherein the sensing unit comprises a first conductive layer and a second conductive layer, and the first conductive layer and the second conductive layer are arranged in different layers; A first portion, disposed on the same layer as the first conductive layer and overlapping the non-display area; and A second portion is disposed on the same layer as the second conductive layer and overlaps the non-display area. The second part surrounds the first part.

50. The display device according to claim 49, in, The display panel includes a sealing member.

51. The display device according to claim 50, in, The second portion overlaps a boundary of the sealing member.

52. The display device according to claim 49, wherein the display device further comprises: include: The third part is arranged on the same layer as the second conductive layer and overlaps the non-display area.

53. The display device according to claim 52, in, The third portion is surrounded by the second portion.

54. The display device according to claim 53, in, The third portion is surrounded by the first portion.

55. A display device, the display device include: A display panel including a display area and a non-display area; A sensing unit is arranged on the display area of ​​the display panel, wherein the sensing unit comprises a first conductive layer and a second conductive layer, and the first conductive layer and the second conductive layer are arranged in different layers; A first portion, disposed on the same layer as the first conductive layer and overlapping the non-display area; and A second portion is disposed on the same layer as the second conductive layer and overlaps the non-display area. Wherein, the second part is surrounded by the first part.

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