Electronic device

Abstract

The invention relates to electronic equipment which comprises a shell, an electrical assembly and a sound sensor, the electrical assembly is arranged in the shell, a collection cavity is defined between the electrical assembly and the shell, the shell or the electrical assembly is provided with a sound guide channel, and the sound guide channel is communicated with the collection cavity; the sound sensor is arranged on the shell or the electrical assembly, and the sound sensor is communicated with the collection cavity through the sound guide channel. The abnormal sound parameter of the whole machine is acquired by configuring the acquisition cavity connected with the sound sensor in the electronic equipment, and the detection is convenient, rapid and accurate.

Description

Technical Field

[0001] The present disclosure relates to the technical field of electronic devices, and in particular to an electronic device. Background Art

[0002] Electronic devices such as mobile phones are usually equipped with vibrators, such as motors. When users use electronic devices, the motors will vibrate and transmit the vibrations to the electronic device's frame, touch screen and other vibrating bodies. If the motor body is defective or the structure of the electronic device is not compact, the motor vibration will cause obvious noise in the whole device, thus affecting the user experience.

[0003] Currently, electronic devices do not have an effective mechanism to detect abnormal noise from motor vibration in the entire device state. Summary of the invention

[0004] In order to overcome the problems existing in the related art, the present disclosure provides an electronic device.

[0005] According to a first aspect of an embodiment of the present disclosure, there is provided an electronic device, comprising: a shell; an electrical component disposed in the shell, a collection cavity being defined between the electrical component and the shell, the shell or the electrical component being provided with a sound guide channel, the sound guide channel being connected to the collection cavity; and a sound sensor disposed in the shell or the electrical component, the sound sensor being connected to the collection cavity via the sound guide channel.

[0006] In some possible implementations, the aperture of the sound guide channel is smaller than the equivalent aperture of the collection cavity.

[0007] In some possible implementations, the sound guide channel is connected to the collection cavity at a first end, and the first end is in a shape that gradually expands toward the collection cavity.

[0008] In some possible implementations, the collection cavity includes a first end and a second end, the first end of the collection cavity is connected to the sound guide channel, and the collection cavity is a shape that gradually decreases from the second end to the first end.

[0009] In some possible implementations, the electronic device includes a plurality of the collection chambers, wherein the chamber connected to the sound guide channel is a main collection chamber, and the other collection chambers are all connected to the main collection chamber.

[0010] In some possible embodiments, the sound guide channel includes: a first sound guide channel, a first end of which is connected to the collection chamber; and a second sound guide channel, a first end of which is connected to the second end of the first sound guide channel, and a second end of the second sound guide channel is connected to the outside of the shell and to the sound sensor.

[0011] In some possible implementations, a switch is provided on the sound guide channel, and the switch is used to open or close the connection between the collection cavity and the sound sensor.

[0012] In some possible embodiments, the electrical component includes a middle frame, a circuit board and a bracket, the middle frame has a first installation area, the circuit board is installed in the first installation area, and the bracket is located between the circuit board and the shell, wherein a first sub-cavity is defined between the circuit board and the bracket, and a second sub-cavity is defined between the shell and the bracket, and the second sub-cavity is connected to the first sub-cavity to form the collection cavity.

[0013] In some possible implementations, the electrical component includes a middle frame and a battery assembly, the middle frame has a second installation area, the battery assembly is installed in the second installation area, and the collection cavity is formed between the battery assembly and the shell.

[0014] In some possible implementations, the components surrounding the collection chamber are all rigid components.

[0015] In some possible implementations, the electrical component includes a middle frame, and the sound guide channel is formed on the middle frame.

[0016] In some possible implementations, the electronic device further includes: an audio data processing component disposed in the housing, and the audio data processing component is connected to the sound sensor.

[0017] The technical solution provided by the embodiments of the present disclosure may include the following beneficial effects: the present disclosure provides an electronic device, wherein a collection cavity is defined between the electrical component and the housing, the housing or the electrical component is provided with a sound guide channel, and the sound guide channel is connected to the collection cavity; the sound sensor is provided in the housing or the electrical component, and the sound sensor is connected to the collection cavity through the sound guide channel. The present disclosure utilizes a collection cavity connected to a sound sensor configured in the electronic device to obtain abnormal sound parameters of the entire device, and the detection is convenient, fast, and accurate.

[0018] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0020] Figure 1 The diagram is a schematic structural diagram of an electronic device according to an exemplary embodiment.

[0021] Figure 2 The figure is an equivalent principle diagram of abnormal noise detection of an electronic device according to an exemplary embodiment.

[0022] Figure 3 is a cross-sectional view showing the internal structure of an electronic device according to an exemplary embodiment.

[0023] Figure 4 is a cross-sectional view showing the internal structure of another electronic device according to an exemplary embodiment.

[0024] Figure 5 is a cross-sectional view showing an internal structure of yet another electronic device according to an exemplary embodiment.

[0025] Figure 6 The figure is a schematic diagram showing the internal structure of an electronic device according to an exemplary embodiment.

[0026] Figure 7 The figure is a signal waveform diagram of abnormal sound detection according to an exemplary embodiment.

[0027] Figure 8 is a signal waveform diagram of another abnormal sound detection according to an exemplary embodiment.

[0028] Reference numerals:

[0029] 10. Shell; 20. Electrical components; 21. Middle frame; 22. Circuit board; 23. Bracket; 24. First sub-cavity; 25. Second sub-cavity; 26. Battery assembly; 261. First battery unit; 262. Second battery unit; 27. Third sub-cavity; 28. Fourth sub-cavity; 30. Collection cavity; 301. First end; 302. Second end; 40. Sound guide channel; 41. Second sound guide channel; 50. Sound sensor; 60. Vibrator. DETAILED DESCRIPTION

[0030] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0031] Electronic devices such as mobile phones are usually equipped with vibrators, such as motors. When the motor is running, there are many kinds of abnormal sounds inside the electronic device. The abnormal sounds produced by the motor during operation that exceed the design requirements are often called abnormal sounds. Repeated abnormal sounds are often a manifestation of motor failure. After the electronic equipment is assembled, it is necessary to detect abnormal sounds during factory inspection and after-sales use.

[0032] In the related technology, abnormal noise detection is mainly carried out by manual experience detection. However, listening and judging by experience are often inaccurate and easily disturbed by environmental noise. It is time-consuming and laborious to rely on manual experience detection. Manual detection is slow. At the same time, due to the difference in manual detection proficiency and hearing fatigue, it is easy to make subjective judgments. It is difficult to unify the standards of each person, and the repeatability is poor, resulting in a high customer complaint rate and return rate of electronic equipment after leaving the factory.

[0033] In order to solve the above technical problems, the present disclosure provides an electronic device. Figure 1 The diagram is a schematic structural diagram of an electronic device according to an exemplary embodiment. Figure 2 The figure is an equivalent principle diagram of abnormal noise detection of an electronic device according to an exemplary embodiment. Figure 3 is a cross-sectional view showing the internal structure of an electronic device according to an exemplary embodiment. Figure 4 is a cross-sectional view showing the internal structure of another electronic device according to an exemplary embodiment. Figure 5 is a cross-sectional view showing an internal structure of yet another electronic device according to an exemplary embodiment.

[0034] like Figure 1-5 As shown, the electronic device mainly includes: a housing 10 , an electrical component 20 and a sound sensor 50 .

[0035] The electrical component 20 is arranged in the shell 10, and a collection chamber 30 is defined between the electrical component 20 and the shell 10. The shell 10 or the electrical component 20 is provided with a sound guide channel 40, and the sound guide channel 40 is connected to the collection chamber 30; the sound sensor 50 is arranged in the shell 10 or the electrical component 20, and the sound sensor 50 is connected to the collection chamber 30 through the sound guide channel 40.

[0036] It should be noted that the electronic device may be a smart phone, a laptop computer, an ultra-mobile personal computer (UMPC), a handheld computer, a netbook, a personal digital assistant (PDA), a tablet computer, a virtual reality device, a wearable device such as a smart watch, a smart bracelet, and the like.

[0037] The housing 10 may have an installation cavity, and the shape of the installation cavity may be a rectangular cavity, an ellipsoidal cavity, or an installation cavity of other structures, which is not specifically limited in the present disclosure.

[0038] The electrical component 20 is disposed in the installation cavity of the housing 10. The shape of the collection cavity 30 can be a rectangular cavity, an ellipsoidal cavity, or an installation cavity of other structures, which is not specifically limited in the present disclosure.

[0039] According to the structural design and stacking requirements inside the electronic device, one scenario is: the sound guide channel 40 is separately arranged on the housing 10, and the sound sensor 50 is connected to the collection chamber 30 through the sound guide channel 40. Another scenario is: the sound guide channel 40 is separately arranged on the electrical component 20, and the sound sensor 50 is connected to the collection chamber 30 through the sound guide channel 40. Another scenario is: a part of the sound guide channel 40 is arranged on the electrical component 20, and another part of the sound guide channel 40 is arranged on the housing 10, the sound guide channel 40 is arranged on the electrical component 20 and the housing 10, and the sound sensor 50 is connected to the collection chamber 30 through the sound guide channel 40.

[0040] According to the structural design and stacking requirements inside the electronic device, one scenario is that the sound sensor 50 is disposed in the housing 10 , and another scenario is that the sound sensor 50 is disposed in the electrical component 20 .

[0041] The sound sensor 50 may be a sound collecting component, such as a microphone, for collecting sound.

[0042] It can be understood that a collection chamber 30 is defined between the electrical component 20 and the housing 10, and the housing 10 or the electrical component 20 is provided with a sound guide channel 40, which is connected to the collection chamber 30; the sound sensor 50 is provided in the housing 10 or the electrical component 20, and the sound sensor 50 is connected to the collection chamber 30 through the sound guide channel 40. Figure 2 As shown, the collection chamber 30 can be equivalent to a spatial volume to form a Helmholtz resonance cavity. The spatial volume can be 5 cubic centimeters or other volumes, and the present disclosure does not make any specific limitations on this.

[0043] The present disclosure provides an electronic device. When the abnormal sound detection mechanism of the electronic device is started, the collection chamber 30 is connected with the sound guide channel 40, and then the vibration airflow of the collection chamber 30 is transmitted to the sound sensor 50. The present disclosure uses the collection chamber 30 connected to the sound sensor 50 configured in the electronic device to obtain the abnormal sound parameters of the electronic device, thereby solving the problem that the electronic device has no abnormal sound detection mechanism. The detection is convenient, fast and accurate, and it avoids relying on manual experience for detection. The detection is convenient, fast and accurate, and at the same time, the detection standards are unified, thereby solving the problem of high customer complaint rate and return rate of electronic devices after leaving the factory.

[0044] In some possible implementations, such as Figure 1 , 2 and Figure 6 As shown, the aperture of the sound guide channel 40 is smaller than the equivalent aperture of the collection cavity 30 .

[0045] The aperture of the sound guide channel 40 may be 0.6 mm, 0.8 mm, etc., which is not specifically limited in the embodiment of the present disclosure. The aperture of the sound guide channel 40 is smaller than the equivalent aperture of the collection cavity 30, so that the collection cavity 30 and the sound guide channel 40 form a Helmholtz resonance cavity together, which significantly amplifies the tiny vibration, making it easier for the sound sensor 50 to collect the vibration signal.

[0046] The main vibration source in the electronic device is the vibrator 60, wherein the vibrator 60 can be a motor. A motor is a device that converts electrical energy into mechanical energy. A motor is also called an electric motor or an engine. The motor includes: a stator, a rotor, a base, a bearing and other components. During the operation of the motor, the stator, the rotor, the base, the bearing and the like can vibrate and produce sound. Due to the configuration gap in the stacking of the structural design inside the electronic device, the sound produced by the motor vibration will produce a relatively large sound inside the electronic device, i.e., abnormal sound or noise. By detecting whether an abnormal sound is generated, the quality of the motor can be determined, as well as the quality of the electronic device after the motor is assembled.

[0047] When an electronic device such as a mobile phone is in vibration mode, the vibrator vibrates to generate a vibration prompt when the mobile phone receives an incoming call or text message. In this way, the mobile phone reminds the user of the incoming call or text message by vibration instead of ringing the phone.

[0048] The mobile phone can also receive various notification messages, or reminders such as alarms, to-do items, countdowns, etc. in vibration mode.

[0049] In the embodiment of the present disclosure, the aperture of the sound guide channel 40 is smaller than the equivalent aperture of the collection chamber 30. When the abnormal sound detection mechanism of the electronic device is started, the collection chamber 30 is connected with the sound guide channel 40, and then the vibrating airflow of the collection chamber 30 is transmitted to the sound sensor 50. The collection chamber 30 connected to the sound sensor 50 is configured in the electronic device to obtain the abnormal sound parameters of the electronic device, thereby solving the problem that the electronic device has no abnormal sound detection mechanism. The detection is convenient, fast and accurate, and it avoids relying on manual experience for detection. The detection is convenient, fast and accurate, and at the same time, the detection standards are unified, which solves the problem of high customer complaint rate and return rate of electronic equipment after leaving the factory.

[0050] In some possible implementations, such as Figure 6 As shown, the sound guide channel 40 is connected to the collection cavity 30 at a first end, and the first end is in a shape that gradually expands in the direction of the collection cavity 30 .

[0051] It can be understood that the first end of the sound guiding channel 40 is a part of the sound guiding channel 40 . Specifically, the first end of the sound guiding channel 40 is a distance set along the length direction of the sound guiding channel 40 .

[0052] The sound guide channel 40 is shaped to gradually expand toward the collection cavity 30 with the first end facing the direction of the sound guide channel 40. Figure 6 As shown, the sound guide channel 40 is horn-shaped at the first end, so as to facilitate the vibrating airflow of the collection chamber 30 to enter the horn-shaped sound guide channel 40.

[0053] In the embodiment of the present disclosure, the sound guide channel 40 is connected to the collection chamber 30 at a first end, and the first end is in a shape that gradually expands in the direction of the collection chamber 30. When the abnormal sound detection mechanism of the electronic device is started, the collection chamber 30 is connected to the sound guide channel 40, so that the vibrating airflow of the collection chamber 30 enters the sound guide channel 40 through the first end of the sound guide channel 40, and then is transmitted to the sound sensor 50. By configuring the collection chamber 30 connected to the sound sensor 50 in the electronic device, the diaphragm of the sound sensor 50 collects signals and outputs them for processing to obtain the abnormal sound parameters of the electronic device, thereby solving the problem that the electronic device has no abnormal sound detection mechanism, and the detection is convenient, fast and accurate.

[0054] In some possible implementations, such as Figure 6 As shown, the collection cavity 30 includes a first end 301 and a second end 302 . The first end 301 of the collection cavity 30 is connected to the sound guide channel 40 . The collection cavity 30 is a shape that gradually decreases from the second end 302 to the first end 301 .

[0055] It can be understood that the first end 301 of the collecting chamber 30 is a part of the collecting chamber 30, and the second end 302 of the collecting chamber 30 is a part of the collecting chamber 30. Specifically, the first end 301 of the collecting chamber 30 is a section of the collecting chamber 30, the second end 302 of the collecting chamber 30 is a section of the collecting chamber 30, and the second end 302 of the collecting chamber 30 is spaced apart from the first end 301 of the collecting chamber 30.

[0056] The collecting chamber 30 is in a shape that gradually decreases from the second end 302 to the first end 301 , so as to facilitate the vibrating airflow in the collecting chamber 30 to be guided out and enter the sound guide channel 40 .

[0057] In the embodiment of the present disclosure, the first end 301 of the collection chamber 30 is connected to the sound guide channel 40, and the collection chamber 30 is a shape that gradually decreases from the second end 302 to the first end 301. When the abnormal sound detection mechanism of the electronic device is started, the vibrating airflow of the collection chamber 30 is conveniently discharged and enters the sound guide channel 40, and is transmitted to the sound sensor 50 through the sound guide channel 40. The collection chamber 30 connected to the sound sensor 50 is configured in the electronic device to obtain the abnormal sound parameters of the electronic device, thereby solving the problem that the electronic device has no abnormal sound detection mechanism, and the detection is convenient, fast and accurate.

[0058] In some possible implementations, the electronic device includes a plurality of collection chambers 30 , wherein the chamber connected to the sound guide channel 40 is a main collection chamber, and the other collection chambers 30 are all connected to the main collection chamber.

[0059] It should be noted that, since there are configuration gaps in the stacked structures inside the electronic device, the interconnected gaps inside the electronic device can be the collection chamber 30 .

[0060] Exemplarily, there may be two collection chambers 30, one of which is a main collection chamber, which is at least part of the configuration gap of the stacked internal structure of the electronic device, the main collection chamber is connected to the sound guide channel 40, and another collection chamber 30 is connected to the main collection chamber, which is also at least part of the configuration gap of the stacked internal structure of the electronic device. Multiple collection chambers 30 can be equivalent to a spatial volume to form a Helmholtz resonance cavity, and the spatial volume can be 5 cubic centimeters or other volumes. The embodiment of the present disclosure does not specifically limit this. When the abnormal sound detection mechanism of the electronic device is started, the collection chamber 30 is connected to the sound guide channel 40, and then the vibration airflow of the collection chamber 30 is transmitted to the sound sensor 50. The collection chamber 30 connected to the sound sensor 50 is configured in the electronic device to obtain the abnormal sound parameters of the electronic device, so as to solve the problem that the electronic device has no abnormal sound detection mechanism, avoid relying on manual experience detection, and the detection is convenient, fast and accurate. At the same time, the detection standards are unified, and the problem of high customer complaint rate and return rate of electronic devices after leaving the factory is solved.

[0061] Exemplarily, there may be three collection chambers 30, one of which is a main collection chamber, which is at least part of the configuration gap of the stacked internal structure of the electronic device, and the main collection chamber is connected to the sound guide channel 40, and the other two collection chambers 30 are connected to the main collection chamber, and the two collection chambers 30 are also at least part of the configuration gap of the stacked internal structure of the electronic device. Multiple collection chambers 30 can be equivalent to a spatial volume to form a Helmholtz resonance cavity, and the spatial volume can be 5 cubic centimeters, or it can be other volumes, and the embodiments of the present disclosure do not specifically limit this. When the abnormal sound detection mechanism of the electronic device is started, the collection chamber 30 is connected to the sound guide channel 40, and then the vibration airflow of the collection chamber 30 is transmitted to the sound sensor 50, and the abnormal sound parameters of the electronic device are obtained by using the collection chamber 30 connected to the sound sensor 50 configured in the electronic device, so as to solve the problem that the electronic device has no abnormal sound detection mechanism, avoid relying on manual experience detection, and the detection is convenient, fast and accurate. At the same time, the detection standards are unified, and the problem of high customer complaint rate and return rate of electronic devices after leaving the factory is solved.

[0062] Exemplarily, there may be four collection chambers 30, one of which is a main collection chamber, which is at least part of the configuration gap of the stacked internal structure of the electronic device, and the main collection chamber is connected to the sound guide channel 40, and the other three collection chambers 30 are connected to the main collection chamber, and the three collection chambers 30 are also at least part of the configuration gap of the stacked internal structure of the electronic device. Multiple collection chambers 30 can be equivalent to a spatial volume to form a Helmholtz resonance cavity, and the spatial volume can be 5 cubic centimeters, or it can be other volumes, and the embodiments of the present disclosure do not specifically limit this. When the abnormal sound detection mechanism of the electronic device is started, the collection chamber 30 is connected to the sound guide channel 40, and then the vibration airflow of the collection chamber 30 is transmitted to the sound sensor 50, and the abnormal sound parameters of the electronic device are obtained by using the collection chamber 30 connected to the sound sensor 50 configured in the electronic device, so as to solve the problem that the electronic device has no abnormal sound detection mechanism, avoid relying on manual experience detection, and the detection is convenient, fast and accurate. At the same time, the detection standards are unified, and the problem of high customer complaint rate and return rate of electronic devices after leaving the factory is solved.

[0063] Exemplarily, there may be five collection chambers 30, one of which is a main collection chamber, which is at least part of the configuration gap of the stacked internal structure of the electronic device, and the main collection chamber is connected to the sound guide channel 40, and the other four collection chambers 30 are connected to the main collection chamber, and the four collection chambers 30 are also at least part of the configuration gap of the stacked internal structure of the electronic device. Multiple collection chambers 30 can be equivalent to a spatial volume to form a Helmholtz resonance cavity, and the spatial volume can be 5 cubic centimeters, or it can be other volumes, and the embodiments of the present disclosure do not specifically limit this. When the abnormal sound detection mechanism of the electronic device is started, the collection chamber 30 is connected to the sound guide channel 40, and then the vibration airflow of the collection chamber 30 is transmitted to the sound sensor 50, and the abnormal sound parameters of the electronic device are obtained by using the collection chamber 30 connected to the sound sensor 50 configured in the electronic device, so as to solve the problem that the electronic device has no abnormal sound detection mechanism, avoid relying on manual experience detection, and the detection is convenient, fast and accurate. At the same time, the detection standards are unified, and the problem of high customer complaint rate and return rate of electronic devices after leaving the factory is solved.

[0064] Exemplarily, there may be six collection chambers 30, one of which is a main collection chamber, which is at least part of the configuration gap of the stacked internal structure of the electronic device, and the main collection chamber is connected to the sound guide channel 40, and the other five collection chambers 30 are connected to the main collection chamber, and the five collection chambers 30 are also at least part of the configuration gap of the stacked internal structure of the electronic device. Multiple collection chambers 30 can be equivalent to a spatial volume to form a Helmholtz resonance cavity, and the spatial volume can be 5 cubic centimeters, or it can be other volumes, and the embodiments of the present disclosure do not specifically limit this. When the abnormal sound detection mechanism of the electronic device is started, the collection chamber 30 is connected to the sound guide channel 40, and then the vibration airflow of the collection chamber 30 is transmitted to the sound sensor 50, and the abnormal sound parameters of the electronic device are obtained by using the collection chamber 30 connected to the sound sensor 50 configured in the electronic device, so as to solve the problem that the electronic device has no abnormal sound detection mechanism, avoid relying on manual experience detection, and the detection is convenient, fast and accurate. At the same time, the detection standards are unified, and the problem of high customer complaint rate and return rate of electronic devices after leaving the factory is solved.

[0065] In some possible implementations, such as Figure 5 As shown, the sound guiding channel 40 includes: a first sound guiding channel (not shown in the figure) and a second sound guiding channel 41.

[0066] The first end of the first sound guide channel is connected to the collection chamber 30 ; the first end of the second sound guide channel 41 is connected to the second end of the first sound guide channel, and the second end of the second sound guide channel 41 is connected to the outside of the shell 10 and to the sound sensor 50 .

[0067] According to the structural design and stacking requirements inside the electronic device, one scenario is: the sound guide channel 40 is separately provided on the housing 10, that is, the first sound guide channel and the second sound guide channel 41 are both provided on the housing 10, and the sound sensor 50 is connected to the collection chamber 30 through the first sound guide channel. Another scenario is: the sound guide channel 40 is separately provided on the electrical component 20, that is, the first sound guide channel and the second sound guide channel 41 are both provided on the electrical component 20, and the sound sensor 50 is connected to the collection chamber 30 through the first sound guide channel. Another situation is: a part of the sound guiding channel 40 is arranged on the electrical component 20, and the other part of the sound guiding channel 40 is arranged on the shell 10, that is, the first sound guiding channel is arranged on the electrical component 20, and the second sound guiding channel 41 is arranged on the shell 10, or, the first sound guiding channel is arranged on the shell 10, and the second sound guiding channel 41 is arranged on the shell 10 and the electrical component 20, or, a part of the first sound guiding channel is arranged on the shell 10, and the other part of the first sound guiding channel and the second sound guiding channel 41 are arranged on the electrical component 20; or, a part of the first sound guiding channel and the second sound guiding channel 41 are arranged on the shell 10, and the other part of the second sound guiding channel 41 is arranged on the electrical component 20, the sound guiding channel 40 is arranged on the electrical component 20 and the shell 10, and the sound sensor 50 is connected to the collection chamber 30 through the sound guiding channel 40.

[0068] Among them, the first sound guide channel and the second sound guide channel 41 can be set as an integrated structure, the first sound guide channel and the second sound guide channel 41 can also be independent of each other, and the second sound guide channel 41 can be understood as a sound pickup pipe, and the embodiments of the present disclosure do not make specific limitations on this.

[0069] In the disclosed embodiment, when the abnormal sound detection mechanism of the electronic device is started, the vibrating airflow of the collection chamber 30 is conveniently discharged into the first sound guide channel, and is transmitted to the sound sensor 50 through the first sound guide channel. The collection chamber 30 connected to the sound sensor 50 is configured in the electronic device, and the diaphragm of the sound sensor 50 collects signals and outputs them for processing to obtain the abnormal sound parameters of the electronic device, thereby solving the problem that the electronic device has no abnormal sound detection mechanism and avoiding reliance on manual experience for detection. The detection is convenient, fast and accurate, and at the same time the detection standards are unified, solving the problem of high customer complaints and return rates of electronic devices after leaving the factory.

[0070] In some possible implementations, such as Figure 2-6 As shown, a switch element (not shown in the figure) is provided on the sound guide channel 40 , and the switch element is used to open or close the communication between the collection cavity 30 and the sound sensor 50 .

[0071] In the embodiment of the present disclosure, when it is not necessary to start the abnormal sound detection mechanism of the electronic device, the connection between the collection chamber 30 and the sound sensor 50 is turned off by closing the switch component to prevent the vibration airflow of the collection chamber 30 from reaching the sound sensor 50. When it is necessary to start the abnormal sound detection mechanism of the electronic device, the connection between the collection chamber 30 and the sound sensor 50 is turned on by opening the switch component to allow the vibration airflow of the collection chamber 30 to reach the sound sensor 50, and the diaphragm of the sound sensor 50 collects signals and outputs them to the audio data processing component. The audio data processing component processes the collected signals to obtain the abnormal sound parameters of the electronic device, solves the problem that the electronic device has no abnormal sound detection mechanism, avoids relying on manual experience detection, and is convenient, fast, and accurate. At the same time, the detection standards are unified, solving the problem of high customer complaint rate and return rate of electronic devices after leaving the factory.

[0072] Furthermore, the switch element may be an air pressure valve, which is used to open or close the connection between the collection chamber 30 and the sound sensor 50. When it is not necessary to start the abnormal sound detection mechanism of the electronic device, the connection between the collection chamber 30 and the sound sensor 50 is closed by closing the switch element to prevent the vibration airflow of the collection chamber 30 from reaching the sound sensor 50. When it is necessary to start the abnormal sound detection mechanism of the electronic device, the connection between the collection chamber 30 and the sound sensor 50 is opened by opening the switch element to allow the vibration airflow of the collection chamber 30 to reach the sound sensor 50, and the diaphragm of the sound sensor 50 collects signals and outputs them to the audio data processing element. The audio data processing element processes the collected signals to obtain the abnormal sound parameters of the electronic device, solves the problem that the electronic device has no abnormal sound detection mechanism, avoids relying on manual experience detection, and is convenient, fast, and accurate. At the same time, the detection standards are unified, solving the problem of high customer complaint rate and return rate of electronic devices after leaving the factory.

[0073] In some possible implementations, such as Figure 3 As shown, the electrical component 20 includes a middle frame 21, a circuit board 22 and a bracket 23, the middle frame 21 has a first installation area, the circuit board 22 is installed in the first installation area, the bracket 23 is located between the circuit board 22 and the shell 10, a first sub-cavity 24 is defined between the circuit board 22 and the bracket 23, a second sub-cavity 25 is defined between the shell 10 and the bracket 23, and the second sub-cavity 25 is connected to the first sub-cavity 24 to form a collection cavity 30.

[0074] There may be multiple first installation areas, and the multiple first installation areas are located on the same side of the middle frame 21. The circuit board 22 and the bracket 23 are installed in the thickness direction of the middle frame 21. Further, the housing 10 includes a battery back cover, and the bracket 23 is located between the circuit board 22 and the battery back cover.

[0075] The circuit board 22 is a printed circuit board assembly (PCBA), also known as a printed circuit board, which is an important electronic component, a support for electronic components, and a carrier for electrical interconnection of electronic components. The circuit board 22 can be a single-sided board, a double-sided board, or a multi-layer board, which is not specifically limited in the embodiments of the present disclosure.

[0076] The first sub-cavity 24 can be a rectangular cavity, an ellipsoidal cavity, or a cavity of other structures. The second sub-cavity 25 can be a rectangular cavity, an ellipsoidal cavity, or a cavity of other structures. The first sub-cavity 24 is connected to the second sub-cavity 25. The first sub-cavity 24 and the second sub-cavity 25 can be cavities of the same shape or cavities of different shapes. The present disclosure does not make any specific limitations on this.

[0077] In the embodiment of the present disclosure, the collection chamber 30 formed by the second sub-cavity 25 and the first sub-cavity 24 is connected to each other. When the abnormal sound detection mechanism of the electronic device is started, the collection chamber 30 is connected to the sound guide channel 40, and then the vibration airflow of the collection chamber 30 is transmitted to the sound sensor 50. The collection chamber 30 connected to the sound sensor 50 is configured in the electronic device, and the diaphragm of the sound sensor 50 collects signals and outputs them to the audio data processing unit. The audio data processing unit processes the collected signals to obtain the abnormal sound parameters of the electronic device, solves the problem that the electronic device has no abnormal sound detection mechanism, avoids relying on manual experience detection, and is convenient, fast, and accurate. At the same time, the detection standards are unified, and the problem of high customer complaint rate and return rate of electronic devices after leaving the factory is solved.

[0078] In some possible implementations, such as Figure 4 As shown, the electrical component 20 includes a middle frame 21 and a battery component 26 . The middle frame 21 has a second installation area. The battery component 26 is installed in the second installation area. A collection cavity 30 is formed between the battery component 26 and the housing 10 .

[0079] There may be multiple second installation areas, and the multiple second installation areas are located on the same side of the middle frame 21. The battery assembly 26 is installed in the thickness direction of the middle frame 21. Further, the housing 10 includes a battery back cover, and a collection cavity 30 is formed between the battery assembly 26 and the battery back cover.

[0080] Furthermore, the battery assembly 26 has a first battery part 261 and a second battery part 262 which are connected to each other, a third sub-cavity 27 is formed between the first battery part 261 and the battery back cover, a fourth sub-cavity 28 is formed between the second battery part 262 and the battery back cover, and the third sub-cavity 27 is connected to the fourth sub-cavity 28 to form a collection cavity 30.

[0081] The third sub-cavity 27 can be a rectangular cavity, an ellipsoidal cavity, or a cavity of other structures. The fourth sub-cavity 28 can be a rectangular cavity, an ellipsoidal cavity, or a cavity of other structures. The third sub-cavity 27 is connected to the fourth sub-cavity 28. The third sub-cavity 27 and the fourth sub-cavity 28 can be cavities of the same shape or cavities of different shapes. The present disclosure does not make any specific limitations on this.

[0082] The first battery portion 261 may be a battery body and the second battery portion 262 may be a battery edge seal. Alternatively, the first battery portion 261 may be a battery edge seal and the second battery portion 262 may be a battery body, and the battery body and the battery edge seal may have different thicknesses along the thickness direction of the middle frame.

[0083] In the embodiment of the present disclosure, the collection chamber 30 formed by the connection between the third sub-cavity 27 and the fourth sub-cavity 28, when the abnormal sound detection mechanism of the electronic device is started, is connected to the sound guide channel 40 through the collection chamber 30, and then the vibration airflow of the collection chamber 30 is transmitted to the sound sensor 50, and the collection chamber 30 connected to the sound sensor 50 is configured in the electronic device, and the diaphragm of the sound sensor 50 collects signals and outputs them to the audio data processing unit. The audio data processing unit processes the collected signals to obtain the abnormal sound parameters of the electronic device, solves the problem that the electronic device has no abnormal sound detection mechanism, avoids relying on manual experience detection, and is convenient, fast, and accurate. At the same time, the detection standards are unified, and the problem of high customer complaint rate and return rate of electronic devices after leaving the factory is solved.

[0084] In some possible implementations, such as Figure 3-4 As shown, the components surrounding the collection chamber 30 are all rigid components.

[0085] In the present embodiment, the rigid component can be made of metal, plastic, ceramic, glass and other structures, and has a high structural strength. On the one hand, the rigid component can be used to enclose the collection cavity 30 equivalent to a Helmholtz resonance cavity. When the abnormal sound detection mechanism of the electronic device is activated, the vibration of the airflow will excite the vibration of the collection cavity 30, and then the relatively small vibration will be amplified through the collection cavity 30. On the one hand, the rigid component is used to support and protect the electronic device.

[0086] In some possible implementations, the electrical component 20 includes a middle frame 21 , and the sound guide channel 40 is formed on the middle frame 21 .

[0087] In the present embodiment, the middle frame 21 can be made of metal, plastic, ceramic, glass and other structures, and has a high structural strength. The sound guide channel 40 is formed on the middle frame 21, and the sound guide channel 40 is connected with the collection cavity 30, so that the collection cavity 30 and the sound guide channel 40 form a Helmholtz resonance cavity together, which significantly amplifies the tiny vibration, so that the sound sensor 50 can collect the vibration signal.

[0088] In some possible implementations, such as Figure 3-5 As shown, the electronic device also includes: an audio data processing unit (not shown in the figure).

[0089] The audio data processing component is disposed in the housing 10 , and is connected to the sound sensor 50 .

[0090] Among them, the audio data processing component is Digital Signal Processing, DSP. After the vibration airflow of the collection cavity 30 reaches the sound sensor 50, the diaphragm of the sound sensor 50 collects the signal and outputs it to the audio data processing component. The audio data processing component processes the collected signal to obtain the abnormal sound parameters of the electronic device, for example, obtains the measured spectrum of the electronic device, and determines the measured characteristic parameters of the measured spectrum; according to the preset spectrum, determines the threshold range of the target characteristic parameters of the preset spectrum; when the measured characteristic parameters exceed the threshold range of the corresponding target characteristic parameters, it is determined that the electronic device produces an abnormal sound. For example, judge its amplitude and spectrum distribution. If it is abnormal, a warning is issued. If Figure 7 As shown, the solid line waveform represents the detection signal that meets the requirements. 0 The dot spectrum broadening is relatively narrow, that is, the Q factor describing the vibration quality of the electronic equipment is relatively large. The Q factor is the quality factor, also known as the quality factor, and the English name is Quality Factor, so it is also referred to as the Q factor or Q value; the dotted waveform represents an abnormal detection signal, at the resonant frequency F 0 The point spectrum is relatively wide, that is, the Q factor describing the vibration quality of electronic equipment is relatively small. At the same time, the characteristics of high-order harmonics will also show different characteristics: such as Figure 8 As shown, especially for the 5th harmonic, the dotted line indicates that when the vibration is abnormal, the amplitude of the high-order harmonic is larger, and the solid line indicates that when the vibration is normal, the amplitude of the high-order harmonic is relatively smaller. 0 The width of the spectrum and the difference in high-order harmonics can be used to determine whether the vibration of the electronic equipment is abnormal.

[0091] In the embodiment of the present disclosure, when the abnormal sound detection mechanism of the electronic device is started, the collection chamber 30 is connected to the sound guide channel 40, and then the vibration airflow of the collection chamber 30 is transmitted to the sound sensor 50. The collection chamber 30 connected to the sound sensor 50 is configured in the electronic device, and the diaphragm of the sound sensor 50 collects signals and outputs them to the audio data processing unit. The audio data processing unit processes the collected signals to obtain the abnormal sound parameters of the electronic device, solves the problem that the electronic device has no abnormal sound detection mechanism, avoids relying on manual experience detection, and is convenient, fast, and accurate. At the same time, the detection standards are unified, and the problem of high customer complaint rate and return rate of electronic devices after leaving the factory is solved.

[0092] It is to be understood that in the present disclosure, "plurality" refers to two or more than two, and other quantifiers are similar thereto. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the associated objects before and after are in an "or" relationship. The singular forms "a", "" and "the" are also intended to include plural forms, unless the context clearly indicates other meanings.

[0093] It is further understood that the terms "first", "second", etc. are used to describe various information, but such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other, and do not indicate a specific order or degree of importance. In fact, the expressions "first", "second", etc. can be used interchangeably. For example, without departing from the scope of the present disclosure, the first information can also be referred to as the second information, and similarly, the second information can also be referred to as the first information.

[0094] It will be further understood that the terms “center”, “longitudinal”, “lateral”, “front”, “back”, “up”, “down”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present embodiment and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation.

[0095] It can be further understood that, unless otherwise specified, “connection” includes a direct connection without other components between the two, and also includes an indirect connection with other components between the two.

[0096] It is further understood that, although the operations are described in a specific order in the drawings in the embodiments of the present disclosure, it should not be understood as requiring the operations to be performed in the specific order shown or in a serial order, or requiring the execution of all the operations shown to obtain the desired results. In certain environments, multitasking and parallel processing may be advantageous.

[0097] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. The present disclosure is intended to cover any variations, uses or adaptations of the present disclosure, which follow the general principles of the present disclosure and include common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present disclosure are indicated by the following scope of rights.

[0098] It should be understood that the present disclosure is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the scope of the appended claims.

Claims

1. An electronic device, characterized in that: include: case; An electrical component is disposed in the housing, a collection cavity is defined between the electrical component and the housing, and the housing or the electrical component is provided with a sound guide channel, the sound guide channel is connected to the collection cavity; A sound sensor is arranged in the shell or the electrical component, and the sound sensor is connected to the collection cavity through the sound guide channel.

2. The electronic device according to claim 1, characterized in that: The aperture of the sound guide channel is smaller than the equivalent aperture of the collection cavity.

3. The electronic device according to claim 1, characterized in that: The sound guide channel is connected to the collection cavity at a first end, and the first end is in a shape that gradually expands toward the collection cavity.

4. The electronic device according to claim 1, characterized in that: The collecting cavity includes a first end and a second end. The first end of the collecting cavity is connected to the sound guide channel. The collecting cavity is a shape that gradually decreases from the second end to the first end.

5. The electronic device according to claim 1, characterized in that: The electronic device comprises a plurality of the collection cavities, wherein the one connected to the sound guide channel is a main collection cavity, and the other collection cavities are all connected to the main collection cavity.

6. The electronic device according to claim 1, characterized in that: The sound guide channel comprises: a first sound guide channel, a first end of which is connected to the collection cavity; and A second sound guiding channel, wherein a first end of the second sound guiding channel is connected to a second end of the first sound guiding channel, and a second end of the second sound guiding channel is connected to the outside of the shell and to the sound sensor.

7. The electronic device according to claim 1, characterized in that: A switch is provided on the sound guide channel, and the switch is used to open or close the connection between the collection cavity and the sound sensor.

8. The electronic device according to any one of claims 1 to 7, characterized in that: The electrical component comprises a middle frame, a circuit board and a bracket, the middle frame has a first mounting area, the circuit board is mounted in the first mounting area, and the bracket is located between the circuit board and the housing. A first sub-cavity is defined between the circuit board and the bracket, a second sub-cavity is defined between the shell and the bracket, and the second sub-cavity is connected to the first sub-cavity to form the collection cavity.

9. The electronic device according to any one of claims 1 to 7, characterized in that: The electrical component includes a middle frame and a battery component. The middle frame has a second installation area. The battery component is installed in the second installation area. The collection cavity is formed between the battery component and the shell.

10. The electronic device according to any one of claims 1 to 7, characterized in that: The components surrounding the collection chamber are all rigid components.

11. The electronic device according to any one of claims 1 to 7, characterized in that: The electrical component includes a middle frame, and the sound guide channel is formed on the middle frame.

12. The electronic device according to any one of claims 1 to 7, characterized in that: Also includes: The audio data processing component is arranged in the housing and is connected to the sound sensor.

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