Electronic device

Abstract

The embodiment of the invention discloses an electronic device, which comprises a base cover, a cover body, a cover body and a cover body, and is characterized in that the base cover is provided with a groove; the cover plate covers the opening of the groove; the first bonding body is arranged between the cover plate and the base cover; and the base cover, the cover plate and the first bonding body are encircled to form a sealed first cavity. According to the embodiment of the invention, a dustproof and / or waterproof effect can be realized, parts in the cavity can be ensured not to be eroded by water and / or dust, and the protection effect of the terminal is improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of electronic devices, and in particular to an electronic device. Background Art

[0002] With the continuous development of terminals (e.g., mobile phones), users are paying more and more attention to the waterproof performance of terminals. Waterproof (e.g., IP68 compliant) has become one of the essential performances of high-end phones, and has also become a rigid requirement for mid- and low-end phones. In order to break the homogeneity of terminals and highlight the personality of users, terminals with different structures are emerging in an endless stream. After the terminal structure changes, how to seal the terminal structure to achieve waterproof and / or dustproof performance is a problem that needs to be considered. Summary of the invention

[0003] The present disclosure provides an electronic device.

[0004] According to a first aspect of the present disclosure, there is provided an electronic device, including:

[0005] A base cover, wherein a groove is provided on the base cover;

[0006] A cover plate, covering the notch of the groove;

[0007] A first adhesive body, disposed between the cover plate and the base cover;

[0008] The base cover, the cover plate and the first adhesive body are combined to form a sealed first cavity.

[0009] In one embodiment, the groove is provided with a first supporting surface and a first side wall which are adjacent to each other; the cover plate is provided on the first supporting surface, and the cover plate is spaced apart from the first supporting surface and the first side wall respectively, and the cover plate, the first supporting surface and the first side wall together enclose a first accommodating space for accommodating the first adhesive body.

[0010] In one embodiment, it also includes: a panel assembly arranged adjacent to the cover plate, the groove is provided with a second supporting surface and a second side wall arranged adjacent to each other, the panel assembly is spaced apart from the second supporting surface and the second side wall respectively, and the panel assembly, the second supporting surface and the second side wall together enclose a second accommodating space for accommodating a second adhesive body.

[0011] In one embodiment, the panel assembly and the second supporting surface are spaced apart, and a third accommodating space for accommodating a third adhesive is formed between the panel assembly and the second supporting surface.

[0012] In one embodiment, the base cover, the third adhesive body, the panel assembly and the cover plate are interference fit.

[0013] In one embodiment, a height of the second adhesive body is greater than a distance between the first supporting surface and the second supporting surface.

[0014] In one embodiment, it also includes: a panel assembly arranged adjacent to the cover plate and a circuit board bracket arranged adjacent to the panel assembly, the slot is provided with adjacently arranged second side walls, second supporting surfaces, third side walls and third supporting surfaces, the panel assembly is spaced apart from the second supporting surfaces and the second side walls respectively, the circuit board bracket is spaced apart from the third supporting surfaces and the third side walls respectively, and a fourth accommodating space for accommodating a fourth adhesive is formed between the panel assembly, the circuit board bracket, the third supporting surfaces, the third side walls, the second supporting surfaces and the second side walls.

[0015] In one embodiment, the fourth accommodating space includes: a first sub-accommodating space formed by the panel assembly, the second supporting surface and the second side wall, and a second sub-accommodating space formed by the circuit board bracket, the third supporting surface and the third side wall; the fourth adhesive body includes a first sub-adhesive body and a second sub-adhesive body; the first sub-space accommodates the first sub-adhesive body, and the second sub-space accommodates the second sub-adhesive body.

[0016] In one embodiment, the hardness of the first sub-adhesive body is less than the hardness of the second sub-adhesive body.

[0017] In one embodiment, the panel assembly and the circuit board bracket are spaced apart, and a fifth accommodating space for accommodating a fifth adhesive is formed between the panel assembly and the circuit board bracket; and / or, the circuit board bracket and the third supporting surface are spaced apart, and a sixth accommodating space for accommodating a sixth adhesive is formed between the circuit board bracket and the third supporting surface.

[0018] In one embodiment, the cover plate, the panel assembly, the fifth adhesive body, the sixth adhesive body and the base cover are interference fit.

[0019] In one embodiment, the height of the fourth adhesive body is greater than the distance between the first supporting surface and the third supporting surface.

[0020] In one embodiment, it further includes: a circuit board bracket arranged adjacent to the panel assembly, the circuit board bracket including a main bracket and an auxiliary bracket; a main circuit board is arranged on the main bracket, and an auxiliary circuit board is arranged on the auxiliary bracket.

[0021] In one embodiment, a camera assembly is disposed in the first cavity, a sound outlet channel is disposed on the base cover, a seventh adhesive body is disposed between the camera assembly and the sound inlet of the sound outlet channel, and the seventh adhesive body is disposed around the sound inlet. The technical solution provided by the embodiment of the present disclosure may include the following beneficial effects:

[0022] In the disclosed embodiment, the electronic device includes: a base cover, on which a groove is provided; a cover plate, covering the notch of the groove; a first adhesive body, provided between the cover plate and the base cover; wherein the base cover, the cover plate and the first adhesive body together form a sealed first cavity. Here, since the base cover is adopted, compared with the method of connecting the middle frame and the bottom cover, the sealing effect can be achieved without dispensing glue. And since the base cover, the cover plate and the first adhesive body together form a sealed first cavity, dustproof and / or waterproof effects can be achieved, and it can be ensured that the components in the cavity are not corroded by water and / or dust, thereby improving the protection effect of the terminal.

[0023] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0025] Figure 1 The diagram is a schematic diagram of an electronic device according to an exemplary embodiment.

[0026] Figure 2 The diagram is a schematic diagram of an electronic device according to an exemplary embodiment.

[0027] Figure 3 The diagram is a schematic diagram of an electronic device according to an exemplary embodiment.

[0028] Figure 4 The diagram is a schematic diagram of an electronic device according to an exemplary embodiment.

[0029] Figure 5 The diagram is a schematic diagram of an electronic device according to an exemplary embodiment.

[0030] Figure 6 The diagram is a schematic diagram of an electronic device according to an exemplary embodiment.

[0031] Figure 7 The diagram is a schematic diagram of an electronic device according to an exemplary embodiment.

[0032] Figure 8 The diagram is a schematic diagram of an electronic device according to an exemplary embodiment.

[0033] Fig. 9 The diagram is a schematic diagram of an electronic device according to an exemplary embodiment.

[0034] Fig.10 The diagram is a schematic diagram of an electronic device according to an exemplary embodiment.

[0035] Fig.11 The diagram is a schematic diagram of an electronic device according to an exemplary embodiment.

[0036] Fig.12 The diagram is a schematic diagram of an electronic device according to an exemplary embodiment.

[0037] Fig.13 The diagram is a schematic diagram of an electronic device according to an exemplary embodiment.

[0038] Fig.14 The diagram is a schematic diagram of an electronic device according to an exemplary embodiment.

[0039] Fig.15 It is a block diagram of an electronic device according to an exemplary embodiment.

[0040] Description of reference numerals:

[0041] Sealing glue 21; earpiece hole 22; filling glue 23; screen adhesive 24; motherboard bracket 31; motherboard 32; panel assembly 33; glue 34; CG cover 35; middle frame 36; battery cover adhesive 37; battery cover 38; base cover 51; cover 52; first adhesive body 53; first cavity 54; second adhesive body 55; third adhesive body 56; fourth adhesive body 57; notch 5111; first support surface 5112; first side wall 5113; second support Support surface 5114; second side wall 5115; third side wall 5116; third support surface 5117; main PCB board 81; auxiliary PCB board 82; screen assembly 83; battery 84; mainboard bracket 85; small board bracket 86; first sub-adhesive body 91; second sub-adhesive body 92; front bracket adhesive 111; sealant 112; mainboard bracket adhesive 113; front camera bracket adhesive 121; mainboard bracket adhesive 122; camera 131; front camera bracket 132. DETAILED DESCRIPTION

[0042] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Instead, they are merely examples of devices and methods consistent with some aspects of the present invention as detailed in the appended claims.

[0043] In order to facilitate the understanding of any embodiment of the present disclosure, first, the relevant structure of the electronic device is described:

[0044] In one embodiment, mobile phones that comply with IP8, IP68, etc. (corresponding to a waterproof level) mostly adopt a stacked structure (or a sandwich structure).

[0045] In one embodiment, see Figure 1 , shows a waterproofing method for the screen side, that is, at least one glue injection hole is opened in the middle frame, a caulking glue 21 is applied around the middle frame and the screen is assembled on the middle frame, and a hole injection glue 23 is filled in the glue injection hole position, so that the hole injection glue 23 is connected with the screen back glue 24 and the caulking glue 21 on the front side, thereby ensuring the screen side is sealed and waterproof. A handset hole 22 may also be provided.

[0046] In one embodiment, see Figure 2 , the electronic device shown includes a caulking glue 21, an earpiece hole 22, a hole filling glue 23 and a screen adhesive 24, and shows a section A and a section B. The caulking glue 21, the hole filling glue 23 and the screen adhesive 24 can be seamlessly connected to form an integrated colloid, so that the integrated colloid can be enclosed with the cover plate, panel assembly, middle frame and battery cover of the electronic device to form a sealed cavity, so as to realize the waterproof and / or dustproof function of the electronic device.

[0047] In one embodiment, see Figure 3 , showing Figure 2 Section A shows the positional relationship between the mainboard bracket 31, the mainboard 32, the screen adhesive 24, the panel assembly 33, the colloid 34, the hole filling glue 23, the CG cover 35, the filler glue 21, the middle frame 36, the battery cover adhesive 37 and the battery cover 38.

[0048] In one embodiment, see Figure 4 , showing Figure 2 Section B shows the mainboard bracket 31, screen adhesive 24, panel assembly 33, CG cover 35, earpiece sound hole 41, middle frame 36, battery cover adhesive 37, buffer foam 43, front camera 42 and battery cover 38.

[0049] like Figure 5As shown, an embodiment of the present disclosure provides an electronic device, including:

[0050] A base cover 51, wherein a groove 511 is provided on the base cover 51;

[0051] A cover plate 52, covering the notch 5111 of the groove 511;

[0052] A first adhesive body 53, disposed between the cover plate 52 and the base cover 51;

[0053] The base cover 51 , the cover plate 52 and the first adhesive body 53 together form a sealed first cavity 54 .

[0054] In one embodiment, the electronic device includes: an integrally formed base cover 51, on which a groove 511 is provided; a cover plate 52, covering the notch 5111 of the groove 511; a first adhesive body 53, arranged between the cover plate 52 and the base cover 51; wherein the base cover 51, the cover plate 52 and the first adhesive body 53 together form a sealed first cavity 54.

[0055] In one embodiment, the first cavity 54 is used to set at least one of the following: a battery, a PCB board, a bracket and a panel assembly. It can be understood that the base cover 51 and the cover plate 52 together enclose the first cavity 54, and the first cavity 54 is used to accommodate parts such as batteries, PCB boards, brackets, etc.

[0056] In one embodiment, the electronic device may be various types of mobile devices or fixed devices, such as a mobile phone, a computer, a smart wearable terminal, a smart home terminal, an industrial sensor device, and / or a medical device.

[0057] In one embodiment, the base cover 51 may be made of metal, and the base cover 51 may be formed by stamping a metal sheet or by machining using a computerized numerical control (CNC) method.

[0058] In one embodiment, the base cover 51 may be made of plastic, and the base cover 51 may be formed by compression molding or injection molding of the plastic.

[0059] In one embodiment, transverse and / or vertical reinforcing ribs are disposed in the groove 511 , so as to prevent the base cover 51 from being deformed.

[0060] In one embodiment, at least two reinforcing ribs are arranged in the groove 511, and the reinforcing ribs divide the groove 511 into three spaces, namely, a first space, a second space and a third space, wherein the second space is arranged between the first space and the third space. The first space is used to set a mainboard bracket (or a circuit board bracket), and a first PCB board is arranged on the mainboard bracket 31; the second space is used to set a battery; and the third space is used to set a small board bracket, and a second PCB board is arranged on the small board bracket. It should be noted that the mainboard bracket and the circuit board bracket in the present disclosure can be replaced with each other.

[0061] In one embodiment, the base cover 51 may be a unibody battery cover 38 .

[0062] In one embodiment, the cover plate 52 is a transparent cover plate.

[0063] In one embodiment, the cover plate 52 is a glass cover plate (CG, Cover Glass).

[0064] In one embodiment, the first adhesive body 53 may be an adhesive body formed by dispensing through a dispensing process.

[0065] In one embodiment, the electronic device includes: an integrally formed base cover 51, the base cover 51 is provided with a groove 511; a glass cover plate 52, covering the opening 5111 of the groove 511; a first adhesive body 53, provided between the glass cover plate 52 and the base cover 51; wherein the base cover 51, the cover plate 52 and the first adhesive body 53 together form a sealed first cavity 54; the first cavity 54 is used to set the following components: a battery, a PCB board, a bracket and a panel assembly 33. Here, the panel assembly 33 may include a screen assembly.

[0066] In one embodiment, see Figure 6 The base cover 51 includes a middle frame, and a first adhesive 53 (eg, sealant) may be disposed on the middle frame.

[0067] In one embodiment, see Figure 7 , which is a schematic diagram of the layout of an electronic device, including area A for setting a bracket and area B for setting a battery. Figure 8 , is an exploded view of the structure of an electronic device, the electronic device includes a screen assembly 83 (including the cover plate 52 in the present disclosure), a mainboard bracket 85, a small board bracket 86, a battery 84, a main PCB board 81, a sub-PCB board 82 and a battery cover 38 (corresponding to the base cover 51 in the present disclosure); the battery 84 is arranged between the mainboard bracket 85 and the small board bracket 86.

[0068] In the disclosed embodiment, since the base cover 51 is integrally formed, compared with the method of connecting the middle frame and the bottom cover to form the base cover 51, the sealing effect can be achieved without dispensing glue. And since the base cover 51, the cover plate 52 and the first adhesive body 53 are enclosed to form a sealed first cavity 54, dustproof and / or waterproof effects can be achieved, and the battery, the mainboard 32 and / or the panel assembly in the cavity can be ensured not to be corroded by water and / or dust, thereby improving the protection effect of the terminal.

[0069] In one embodiment, see again Figure 5 The electronic device includes: an integrally formed base cover 51, on which a groove 511 is provided; a cover plate 52, covering the notch 5111 of the groove 511; a first adhesive body 53, arranged between the cover plate 52 and the base cover 51; wherein the base cover 51, the cover plate 52 and the first adhesive body 53 together form a sealed first cavity 54; wherein the notch 5111 is provided with a first supporting surface 5112 and a first side wall 5113 adjacently arranged; the cover plate 52 is arranged on the first supporting surface 5112, and the cover plate 52 is spaced apart from the first supporting surface 5112 and the first side wall 5113 respectively, and the cover plate 52, the first supporting surface 5112 and the first side wall 5113 together enclose a first accommodating space for accommodating the first adhesive body 53.

[0070] In one embodiment, the electronic device includes: an integrally formed base cover 51, the base cover 51 is provided with a groove 511; a cover plate 52, covering the notch 5111 of the groove 511; a first adhesive body 53, arranged between the cover plate 52 and the base cover 51; wherein the base cover 51, the cover plate 52 and the first adhesive body 53 are surrounded to form a sealed first cavity 54; wherein the notch 5111 is provided with a first supporting surface 5112 and a first side wall 5113 arranged adjacently; the cover plate 52 is arranged on the first supporting surface 5112, and the cover plate 52 is respectively connected to the first supporting surface 5112 and the first side wall 5113. The first side wall 5113 is arranged at intervals, and the cover plate 52, the first supporting surface 5112 and the first side wall 5113 together enclose a first accommodating space 54 for accommodating the first adhesive body 53; it also includes: a panel assembly 33 arranged adjacent to the cover plate 52, and the groove 5111 is provided with an adjacent second supporting surface 5114 and a second side wall 5115, the panel assembly 33 is respectively arranged at intervals with the second supporting surface 5114 and the second side wall 5115, and the panel assembly 33, the second supporting surface 5114 and the second side wall 5115 together enclose a second accommodating space for accommodating the second adhesive body 55.

[0071] In one embodiment, the first adhesive 53 may be a caulking glue, and the second adhesive 55 may be a sealant. The sealing property of the sealant is better than that of the caulking glue.

[0072] In one embodiment, a height of the second adhesive body 55 is greater than a distance between the first supporting surface 5112 and the second supporting surface 5114 .

[0073] In one embodiment, the electronic device includes: an integrally formed base cover 51, the base cover 51 is provided with a groove 511; a cover plate 52, covering the notch 5111 of the groove 511; a first adhesive body 53, arranged between the cover plate 52 and the base cover 51; wherein the base cover 51, the cover plate 52 and the first adhesive body 53 are surrounded to form a sealed first cavity 54; wherein the notch 5111 is provided with a first supporting surface 5112 and a first side wall 5113 arranged adjacent to each other; the cover plate 52 is arranged on the first supporting surface 5112, and the cover plate 52 is spaced apart from the first supporting surface 5112 and the first side wall 5113, and the cover plate 52 and the first supporting surface 5112 are spaced apart from each other. and the first side wall 5113 together enclose a first accommodation space 54 for accommodating the first adhesive body 53; further comprising: a panel assembly 33 adjacent to the cover plate 52, the notch 5111 being provided with a second supporting surface 5114 and a second side wall 5115 adjacently arranged, the panel assembly 33 being spaced apart from the second supporting surface 5114 and the second side wall 5115 respectively, the panel assembly 33, the second supporting surface 5114 and the second side wall 5115 together enclose a second accommodation space for accommodating the second adhesive body; the panel assembly 33 and the second supporting surface 5114 being spaced apart, a third accommodation space for accommodating the third adhesive body 56 is formed between the panel assembly 33 and the second supporting surface 5114. Here, the third adhesive body 56 may be a screen adhesive.

[0074] In one embodiment, the base cover 51, the third adhesive body 56, the panel assembly 33 and the cover plate 52 are interference-fitted with each other, so that the sealing performance of the first cavity 54 can be improved.

[0075] In one embodiment, see Fig. 9The electronic device comprises: an integrally formed base cover 51, on which a groove 511 is provided; a cover plate 52, covering the notch 5111 of the groove 511; a first adhesive body 53, arranged between the cover plate 52 and the base cover 51; wherein the base cover 51, the cover plate 52 and the first adhesive body 53 together form a sealed first cavity 54; wherein the notch 5111 is provided with a first supporting surface 5112 and a first side wall 5113 adjacently arranged; the cover plate 52 is arranged on the first supporting surface 5112, and the cover plate 52 is spaced apart from the first supporting surface 5112 and the first side wall 5113 respectively, and the cover plate 52, the first supporting surface 5112 and the first side wall 5113 together enclose a first cavity 54 for accommodating the first adhesive body 53. Accommodation space; the electronic device also includes: a panel assembly 33 arranged adjacent to the cover plate 52 and a circuit board bracket 31 arranged adjacent to the panel assembly 33, the notch 5111 is provided with a second side wall 5115, a second supporting surface 5114, a third side wall 5116 and a third supporting surface 5117 arranged adjacent to each other, the panel assembly 33 is spaced apart from the second supporting surface 5114 and the second side wall 5115 respectively, the circuit board bracket 31 is spaced apart from the third supporting surface 5117 and the third side wall 5116 respectively, and a fourth accommodation space for accommodating a fourth adhesive 57 is formed between the panel assembly 33, the circuit board bracket 31, the third supporting surface 5117, the third side wall 5116, the second supporting surface 5114 and the second side wall 5115.

[0076] In one embodiment, the second adhesive body 55 includes: a first part and a second part connected to the first part, wherein the first part is filled in the accommodation space enclosed by the side wall of the panel assembly 33 and the second side wall 5115; wherein the second part is filled in the accommodation space enclosed by the bottom wall of the panel assembly 33 and the second supporting surface 5114, or the third adhesive body 56 is filled in the accommodation space enclosed by the bottom wall of the panel assembly 33 and the second supporting surface 5114. The second adhesive body 55 and the third adhesive body 56 may use the same type of colloid or the second adhesive body 55 and the third adhesive body 56 may use different colloids.

[0077] In one embodiment, the third adhesive body 57 includes: a first part and a second part connected to the first part, the first part is filled in the accommodation space enclosed by the side wall of the panel assembly 33, the second side wall 5115 and the top wall of the circuit board bracket 31; the second part is filled in the accommodation space enclosed by the second support surface 5114, the side of the circuit board bracket 31, the third support surface 5117 and the third side wall 5116. The first part and the second part can use the same type of colloid or the first part and the second part can use different colloids.

[0078] In one embodiment, the third adhesive body 57 includes: a first part, a second part connected to the first part, a third part connected to the first part, and a fourth part connected to the second part; wherein the first part is filled in the accommodation space enclosed by the side wall of the panel assembly 33, the second side wall 5115 and the top wall of the circuit board bracket 31, and the top wall of the circuit board bracket 31 and the second supporting surface 5114 can be on the same plane; the second part is filled in the accommodation space enclosed by the second supporting surface 5114, the side of the circuit board bracket 31, the third supporting surface 5117 and the third side wall 5116; the third part is filled in the accommodation space enclosed by the bottom wall of the panel assembly 33 and the top wall of the circuit board bracket 31; and the fourth part is filled in the accommodation space enclosed by the bottom surface of the circuit board bracket 31 and the third supporting surface 5117. The first part, the second part, the third part and the fourth part can use the same colloid, or at least two of the first part, the second part, the third part and the fourth part use different colloids.

[0079] Here, the fourth adhesive body can be one-time glue dispensing based on the same glue using a glue dispensing process, or multiple glue dispensing using different glue types using a glue dispensing process. For example, adjacent areas of different structures or components are glued using glue types that are compatible with the corresponding structures or components, so that the corresponding structures or components can be ensured to be more stable and reliable.

[0080] In one embodiment, the height of the fourth adhesive body is greater than the distance between the first supporting surface 5112 and the third supporting surface 5117 .

[0081] In one embodiment, the fourth receiving space may contain the same adhesive or different adhesives.

[0082] In one embodiment, the fourth accommodating space includes: a first sub-accommodating space formed by the panel assembly 33, the second supporting surface 5114 and the second side wall 5115, and a second sub-accommodating space formed by the circuit board bracket 31, the third supporting surface 5117 and the third side wall 5116; the fourth adhesive includes a first sub-adhesive 91 and a second sub-adhesive 92; the first sub-space accommodates the first sub-adhesive, and the second sub-space accommodates the second sub-adhesive.

[0083] In one embodiment, the first sub-adhesive body 91 includes: a first part and a second part connected to the first part, the first part fills the accommodation space enclosed by the side wall of the panel assembly 33 and the second side wall 5115, and the second part fills the accommodation space enclosed by the bottom wall of the panel assembly 33 and the circuit board bracket 31.

[0084] In one embodiment, the second adhesive body 92 includes: a first part and a second part connected to the first part, and the first part fills the accommodating space enclosed by the second supporting surface 5114, the circuit board bracket 31, the third supporting surface 5117 and the third side wall 5116.

[0085] In one embodiment, the electronic device includes: an integrally formed base cover 51, on which a groove 511 is provided; a cover plate 52, covering the notch 5111 of the groove 511; a first adhesive body 53, arranged between the cover plate 52 and the base cover 51; wherein the base cover 51, the cover plate 52 and the first adhesive body 53 together form a sealed first cavity 54; a panel assembly 33, a circuit board bracket 31 and a main board 32 are arranged in the first cavity 54, and the panel assembly 33 is arranged below the cover plate 52; the circuit board bracket 31 is arranged below the panel assembly 33; the main board 32 is arranged on the circuit board bracket 31.

[0086] In one embodiment, the electronic device comprises: an integrally formed base cover 51, on which a groove 511 is provided; a cover plate 52, covering the notch 5111 of the groove 511; a first adhesive body 53, arranged between the cover plate 52 and the base cover 51; wherein the base cover 51, the cover plate 52 and the first adhesive body 53 together form a sealed first cavity 54; a panel assembly 33, a circuit board bracket 31 and a main board 32 are arranged in the first cavity 54, and the panel assembly 33 is arranged below the cover plate 52; the circuit board bracket 31 is arranged below the panel assembly 33 and on the third supporting surface 5117; the main board 32 is arranged on the circuit board bracket 31; a fifth adhesive body 94 can be arranged between the panel assembly 33 and the circuit board bracket 31; a sixth adhesive body 93 can be arranged between the circuit board bracket 31 and the third supporting surface 5117.

[0087] In one embodiment, the hardness of the first sub-adhesive 91 is less than the hardness of the second sub-adhesive 92. For example, the first sub-adhesive 91 may be a sealant; the second sub-adhesive 92 may be a UV glue. It should be noted that the UV glue has excellent fluidity, filling properties, and self-leveling ability, as well as a very small shrinkage rate. It should be noted that the sealant is required to have a certain viscosity and adhesion, and is required to be soft and low stress after curing. Here, the self-leveling ability can be reflected by the fluidity of the colloid. The stronger the fluidity of the colloid, the better the self-leveling ability. It should be noted that the self-leveling ability is the ability of the irregular colloid after dispensing to make the surface of the colloid smooth through its own fluidity.

[0088] In one embodiment, the electronic device includes: an integrally formed base cover 51, on which a groove 511 is provided; a cover plate 52, covering the notch 5111 of the groove 511; a first adhesive body 53, arranged between the cover plate 52 and the base cover 51; wherein the base cover 51, the cover plate 52 and the first adhesive body 53 together form a sealed first cavity 54; wherein the notch 5111 is provided with a first supporting surface 5112 and a first side wall 5113 adjacent to each other; the cover plate 52 is arranged on the first supporting surface 5112, and the cover plate 52 is spaced apart from the first supporting surface 5112 and the first side wall 5113 respectively, and the cover plate 52, the first supporting surface 5112 and the first side wall 5113 together enclose a first accommodating space for accommodating the first adhesive body 53; the electronic device also includes: a panel assembly 33 adjacent to the cover plate 52 and a circuit board bracket 31 adjacent to the panel assembly 33, the notch A second side wall 5115, a second supporting surface 5114, a third side wall 5116 and a third supporting surface 5117 are adjacently arranged on 5111, the panel assembly 33 is spaced apart from the second supporting surface 5114 and the second side wall 5115 respectively, the circuit board bracket 31 is spaced apart from the third supporting surface 5117 and the third side wall 5116 respectively, a fourth accommodating space for accommodating a fourth adhesive is formed between the panel assembly 33, the circuit board bracket 31, the third supporting surface 5117, the third side wall 5116, the second supporting surface 5114 and the second side wall 5115; the panel assembly 33 and the circuit board bracket 31 are spaced apart, a fifth accommodating space for accommodating a fifth adhesive 93 is formed between the panel assembly 33 and the circuit board bracket 31; and / or the circuit board bracket and the third supporting surface 5117 are spaced apart, a sixth accommodating space for accommodating a sixth adhesive 94 is formed between the circuit board bracket and the third supporting surface 5117.

[0089] Here, the sixth adhesive body 94 may be a mainboard adhesive formed by a dispensing process, and the fifth adhesive body 93 may be a screen adhesive formed by a dispensing process. Here, the sixth adhesive body 94 and the fifth adhesive body 93 may be formed by adhesives of different materials. For example, the fifth adhesive body 93 may be formed by adhesive having a hardness greater than a hardness threshold, so that the circuit board bracket 31 may be more stable; the sixth adhesive body 94 may be formed by adhesive having a hardness less than a hardness threshold, so that it may be ensured that no damage is caused to the panel assembly 33.

[0090] In one embodiment, the cover plate 52 , the panel assembly 33 , the fifth adhesive body 93 , the sixth adhesive body 94 and the base cover 51 are interference fit.

[0091] In one embodiment, the electronic device includes: an integrally formed base cover 51, on which a groove 511 is provided; a cover plate 52, covering the notch 5111 of the groove 511; a first adhesive body 53, arranged between the cover plate 52 and the base cover 51; wherein the base cover 51, the cover plate 52 and the first adhesive body 53 are enclosed to form a sealed first cavity 54; wherein the notch 5111 is provided with a first supporting surface 5112 and a first side wall 5113 adjacent to each other; the cover plate 52 is arranged on the first supporting surface 5112, and the cover plate 52 is spaced apart from the first supporting surface 5112 and the first side wall 5113 respectively, and the cover plate 52, the first supporting surface 5112 and the first side wall 5113 together enclose a first accommodating space 54 for accommodating the first adhesive body 53; the electronic device also includes: a panel assembly arranged adjacent to the cover plate 52 33 and a circuit board bracket 31 adjacent to the panel assembly 33, the notch 5111 is provided with a second side wall 5115, a second supporting surface 5114, a third side wall 5116 and a third supporting surface 5117 adjacent to each other, the panel assembly 33 is spaced apart from the second supporting surface 5114 and the second side wall 5115, the circuit board bracket 31 is spaced apart from the third supporting surface 5117 and the third side wall 5116, and a fourth accommodating space for accommodating a fourth adhesive is formed between the panel assembly 33, the circuit board bracket 31, the third supporting surface 5117, the third side wall 5116, the second supporting surface 5114 and the second side wall 5115; and further comprising: a circuit board bracket 31 adjacent to the panel assembly 33, the circuit board bracket 31 comprising a main bracket and an auxiliary bracket; the main bracket is provided with a main circuit board, and the auxiliary bracket is provided with an auxiliary circuit board. The main circuit board and the auxiliary circuit board may be PCB boards.

[0092] In one embodiment, the PCB board can be connected to the circuit board bracket 31 by fasteners such as screws.

[0093] In one embodiment, the PCB board may be embedded in or clamped on the circuit board bracket 31 .

[0094] In one embodiment, the battery may be disposed between the main support and the auxiliary support.

[0095] In one embodiment, the battery is fixed on the cover 51 .

[0096] In one embodiment, the electronic device includes: an integrally formed base cover 51, the base cover 51 is provided with a groove 511; a cover plate 52, covering the notch 5111 of the groove 511; a first adhesive body 53, arranged between the cover plate 52 and the base cover 51; wherein the base cover 51, the cover plate 52 and the first adhesive body 53 together form a sealed first cavity 54; wherein the notch 5111 is provided with a first supporting surface 5112 and a first side wall 5113 arranged adjacently; the cover plate 52 is arranged On the first supporting surface 5112, the cover plate 52 is spaced apart from the first supporting surface 5112 and the first side wall 5113 respectively, and the cover plate 52, the first supporting surface 5112 and the first side wall 5113 together enclose a first accommodating space 54 for accommodating the first adhesive body 53; a camera assembly is arranged in the first cavity 54, and a sound outlet channel is arranged on the base cover 51; a seventh adhesive body is arranged between the camera assembly and the sound inlet of the sound outlet channel; and the seventh adhesive body is arranged around the sound inlet.

[0097] In one embodiment, see Fig.10 A handset hole 21 is provided in the component, and the height of the caulking glue 21 around the handset hole 21 is higher than the depth of the glue dispensing groove, so that the airtightness around the handset hole 21 can be better ensured.

[0098] In one embodiment, see Fig.11 , the assembly includes a caulking glue 21, a screen adhesive 24, an earpiece hole 22, a front bracket adhesive 111, a sealant 112 and a motherboard bracket adhesive 113, and shows a C section and a D section. The front bracket adhesive 111 is arranged around the front camera bracket, and the front camera bracket is used to install the camera; the earpiece hole 22 and the camera are arranged adjacent to each other, and illustratively, the camera can be installed below the earpiece hole 22; a sealant 112 is arranged between the earpiece hole 22 and the motherboard bracket adhesive 113; the caulking glue 21, the screen adhesive 24, the front bracket adhesive 111, the sealant 112 and the motherboard bracket adhesive 113 can be connected to form a sealed first cavity.

[0099] See also Fig.12 , showing a schematic diagram of the relationship between the caulking glue 21, the sealant 112, the screen adhesive 24, the front camera bracket adhesive 121 and the motherboard bracket adhesive 122. The front camera bracket adhesive 121 is arranged on the front camera bracket, and the motherboard bracket adhesive 122 is arranged on the motherboard bracket; the caulking glue 21, the sealant 112, the screen adhesive 24, the front camera bracket adhesive 121 and the motherboard bracket adhesive 122 can be connected to form a sealed first cavity.

[0100] See also Fig.13 The cross-sectional view of section D shows the positional relationship between the mainboard 32, the mainboard bracket 31, the mainboard bracket adhesive 113, the front camera bracket 132, the front camera bracket adhesive 121, the panel assembly 33, the screen adhesive 24, the sealant 112, the CG cover 35, the earpiece sound outlet 41, the metal battery cover 38, the front camera 131 and the buffer foam 43. In one embodiment, the front camera 130 is arranged on the front camera bracket 132; a buffer foam 43 is arranged between the front camera 131 and the metal battery cover 38; other parts for supporting the camera 131 can also be arranged between the buffer foam 43 and the camera 131; a front camera bracket adhesive 121 can be arranged between the front camera bracket 132 and the panel assembly 33; an earpiece sound outlet hole 41 (i.e., a sound outlet channel) can be arranged on the metal battery cover 38, and a seventh adhesive body is arranged between the camera 131 and the sound inlet of the earpiece sound outlet hole 41; the seventh adhesive body can be arranged around the sound inlet of the earpiece sound outlet hole 41.

[0101] In order to better understand the embodiments of the present disclosure, the assembly process of the components is described below through two exemplary embodiments:

[0102] Example 1: See Fig.14 ,

[0103] Step a1, complete the assembly of the semi-finished components, that is, the main board, small board, battery, etc. are assembled, and the main board bracket and small board bracket are installed and the screw locking operation is completed;

[0104] Step a2, perform the first dispensing, that is, use a piezoelectric valve to dispense UV glue at the dispensing slot (UV glue has good fluidity, filling and self-leveling ability, and very small shrinkage). To ensure that the UV glue fills the dispensing slot well, after completing the UV dispensing, place it horizontally for 5 minutes, and then use a UV lamp to cure it for 10 seconds to ensure that the UV glue has a certain strength and adhesion;

[0105] Step a3, then do the second glue dispensing, that is, use the spiral valve to fill the sealant on the surface of the UV glue at the glue dispensing groove position (the sealant is required to have a certain viscosity and adhesion, and is required to be soft and low stress after curing). The glue dispensing height is required to be higher than the glue dispensing surface of the CG and the battery cover after the screen is assembled (as shown below Figure 6 ) as indicated by the dotted line in ;

[0106] Step a4: Then apply circumferential sealant, wherein the sealant needs to exceed the sealant dispensing groove on the earpiece side;

[0107] Step a5. Finally, assemble the screen and use the extrusion between the screen and the sealant to achieve the connection between the sealant and the screen adhesive, and between the sealant and the caulking adhesive to achieve a waterproof seal.

[0108] Example 2:

[0109] Step b1, the whole machine is separated from the bracket in the main board area and the small board area, wherein the bracket backing glue is set on the main board bracket, and the backing glue is set on both sides of the battery cover and battery compartment to ensure the bonding strength of the screen;

[0110] Step b2, reserve a certain amount of space for adhesive and sealant on the earpiece side of the battery cover, where the adhesive is used to form a dam to prevent the sealant from overflowing to the front camera or the inside of the screen after being dispensed, and the adhesive also serves as a Z-axis limiter;

[0111] Step b3, the front camera bracket is set on the screen by adhesive bonding, and is integrated with the screen material, and the front camera is assembled to the screen through CCD. During the screen assembly process, the front camera bracket is assembled together and the front camera is positioned to ensure that the front camera is concentric;

[0112] Step b4: After the semi-finished product assembly of the whole machine is completed (the main board, small board, battery, main board bracket, small board bracket, etc. are completed), a certain width of sealant is applied between the top screen adhesive and the battery cover. This is the front glue application.

[0113] Step b5, the waterproof sealing width of the top of the screen is: screen adhesive width + sealant width. The general limit design can be selected as: screen adhesive 24 width 0.6mm (mainly considering the die-cutting of adhesive) + front sealant width 1.0mm (the sealant is too small and the dispensing height is insufficient, which affects the front waterproof yield);

[0114] Step b6, the waterproof paths involved are all between the metal battery cover and the screen (such as the circumferential caulking glue + the earpiece side sealant are all glued on the metal battery cover, and then glued and sealed with the screen), so less waterproof materials are involved, less size chain, so the waterproof reliability is higher;

[0115] Step b7. Considering that the adhesive on the motherboard bracket only serves to bond the screen, that is, the adhesive on the motherboard bracket has no waterproof requirements, to ensure the bonding of the screen, you can consider whether to glue the ends of the motherboard bracket according to the actual situation to avoid the problem of insufficient adhesive activation caused by tolerance between the adhesive on the bracket and the adhesive on both ends of the battery cover and battery compartment.

[0116] The present disclosure provides a terminal, comprising any component described in the present disclosure.

[0117] Fig.15 is a block diagram of an electronic device 600 according to an exemplary embodiment. For example, the electronic device 600 may be a mobile phone, a computer, a digital broadcast electronic device, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, etc.

[0118] Reference Fig.15 , the electronic device 600 may include one or more of the following components: a processing component 602 , a memory 604 , a power component 606 , a multimedia component 608 , an audio component 610 , an input / output (I / O) interface 612 , a sensor component 614 , and a communication component 616 .

[0119] The processing component 602 generally controls the overall operation of the electronic device 600, such as operations associated with display, phone calls, data communications, camera operations, and recording operations. The processing component 602 may include one or more processors 820 to execute instructions to complete all or part of the steps of the above-mentioned method. In addition, the processing component 602 may include one or more modules to facilitate the interaction between the processing component 602 and other components. For example, the processing component 602 may include a multimedia module to facilitate the interaction between the multimedia component 608 and the processing component 602.

[0120] The memory 604 is configured to store various types of data to support operations on the device 600. Examples of such data include instructions for any application or method operating on the electronic device 600, contact data, phone book data, messages, pictures, videos, etc. The memory 604 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk or optical disk.

[0121] The power supply component 606 provides power to the various components of the electronic device 600. The power supply component 606 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to the electronic device 600.

[0122] The multimedia component 608 includes a screen that provides an output interface between the electronic device 600 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touch, slide, and gestures on the touch panel. The touch sensor may not only sense the boundaries of the touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 608 includes a front camera and / or a rear camera. When the device 600 is in an operating mode, such as a shooting mode or a video mode, the front camera and / or the rear camera may receive external multimedia data. Each front camera and the rear camera may be a fixed optical lens system or have a focal length and optical zoom capability.

[0123] The audio component 610 is configured to output and / or input audio signals. For example, the audio component 610 includes a microphone (MIC), and when the electronic device 600 is in an operating mode, such as a call mode, a recording mode, and a voice recognition mode, the microphone is configured to receive an external audio signal. The received audio signal can be further stored in the memory 604 or sent via the communication component 616. In some embodiments, the audio component 610 also includes a speaker for outputting audio signals.

[0124] I / O interface 612 provides an interface between processing component 602 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include but are not limited to: a home button, a volume button, a start button, and a lock button.

[0125] The sensor assembly 614 includes one or more sensors for providing various aspects of status assessment for the electronic device 600. For example, the sensor assembly 614 can detect the open / closed state of the device 600, the relative positioning of components, such as the display and keypad of the electronic device 600, and the sensor assembly 614 can also detect the position change of the electronic device 600 or a component of the electronic device 600, the presence or absence of contact between the user and the electronic device 600, the orientation or acceleration / deceleration of the electronic device 600, and the temperature change of the electronic device 600. The sensor assembly 614 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. The sensor assembly 614 may also include an optical sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 614 may also include an acceleration sensor, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.

[0126] The communication component 616 is configured to facilitate wired or wireless communication between the electronic device 600 and other devices. The electronic device 600 can access a wireless network based on a communication standard, such as WiFi, 2G or 3G, or a combination thereof. In an exemplary embodiment, the communication component 616 receives a broadcast signal or broadcast-related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 616 also includes a near field communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on radio frequency identification (RFID) technology, infrared data association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology and other technologies.

[0127] In an exemplary embodiment, the electronic device 600 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components to perform the above methods.

[0128] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 604 including instructions, and the instructions can be executed by the processor 820 of the electronic device 600 to perform the above method. For example, the non-transitory computer-readable storage medium can be a ROM, a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, etc.

[0129] Those skilled in the art will readily appreciate other embodiments of the present invention after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses or adaptations of the present invention that follow the general principles of the present invention and include common knowledge or customary techniques in the art that are not disclosed in this disclosure. The specification and examples are to be considered exemplary only, and the true scope and spirit of the present invention are indicated by the following claims.

[0130] It should be understood that the present invention is not limited to the exact construction that has been described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

Claims

1. An electronic device, characterized in that: include: A base cover, wherein a groove is provided on the base cover; A cover plate, covering the notch of the groove; A first adhesive body, disposed between the cover plate and the base cover; The base cover, the cover plate and the first adhesive body are combined to form a sealed first cavity.

2. The electronic device according to claim 1, characterized in that: The notch is provided with a first supporting surface and a first side wall which are adjacent to each other; the cover plate is provided on the first supporting surface, and the cover plate is spaced apart from the first supporting surface and the first side wall respectively; the cover plate, the first supporting surface and the first side wall together enclose a first accommodating space for accommodating the first adhesive body.

3. The electronic device according to claim 2, characterized in that: Also includes: A panel assembly is arranged adjacent to the cover plate, and a second supporting surface and a second side wall are arranged adjacent to each other on the groove. The panel assembly is spaced apart from the second supporting surface and the second side wall respectively, and the panel assembly, the second supporting surface and the second side wall together enclose a second accommodating space for accommodating a second adhesive body.

4. The electronic device according to claim 3, characterized in that: The panel assembly and the second supporting surface are spaced apart, and a third accommodating space for accommodating a third adhesive is formed between the panel assembly and the second supporting surface.

5. The electronic device according to claim 4, characterized in that: The base cover, the third adhesive body, the panel assembly and the cover plate are interference-fitted with each other.

6. The electronic device according to claim 3, characterized in that: The height of the second adhesive body is greater than the distance between the first supporting surface and the second supporting surface.

7. The electronic device according to claim 2, characterized in that: Also includes: A panel assembly is arranged adjacent to the cover plate, and a circuit board bracket is arranged adjacent to the panel assembly, the groove is provided with a second side wall, a second supporting surface, a third side wall and a third supporting surface which are arranged adjacent to each other, the panel assembly is spaced apart from the second supporting surface and the second side wall respectively, the circuit board bracket is spaced apart from the third supporting surface and the third side wall respectively, and a fourth accommodating space for accommodating a fourth adhesive is formed between the panel assembly, the circuit board bracket, the third supporting surface, the third side wall, the second supporting surface and the second side wall.

8. The electronic device according to claim 7, characterized in that: The fourth accommodating space includes: a first sub-accommodating space formed by the panel assembly, the second supporting surface and the second side wall, and a second sub-accommodating space formed by the circuit board bracket, the third supporting surface and the third side wall; the fourth adhesive body includes a first sub-adhesive body and a second sub-adhesive body; the first sub-space accommodates the first sub-adhesive body, and the second sub-space accommodates the second sub-adhesive body.

9. The electronic device according to claim 8, characterized in that: The hardness of the first sub-adhesive body is smaller than the hardness of the second sub-adhesive body.

10. The electronic device according to claim 7, characterized in that: The panel assembly and the circuit board bracket are spaced apart, and a fifth accommodating space for accommodating a fifth adhesive is formed between the panel assembly and the circuit board bracket; and / or the circuit board bracket and the third supporting surface are spaced apart, and a sixth accommodating space for accommodating a sixth adhesive is formed between the circuit board bracket and the third supporting surface.

11. The electronic device according to claim 10, characterized in that: The cover plate, the panel assembly, the fifth adhesive body, the sixth adhesive body and the base cover are interference-fitted with each other.

12. The electronic device according to claim 7, characterized in that: The height of the fourth adhesive body is greater than the distance between the first supporting surface and the third supporting surface.

13. The electronic device according to claim 2, characterized in that: Also includes: A circuit board bracket is arranged adjacent to the panel assembly, and the circuit board bracket includes a main bracket and an auxiliary bracket; a main circuit board is arranged on the main bracket, and an auxiliary circuit board is arranged on the auxiliary bracket.

14. The electronic device according to any one of claims 1 to 13, characterized in that: A camera assembly is disposed in the first cavity, and a sound outlet channel is disposed on the base cover; a seventh adhesive body is disposed between the camera assembly and the sound inlet of the sound outlet channel; and the seventh adhesive body is disposed around the sound inlet.

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