Electronic device

Abstract

The invention discloses electronic equipment, and belongs to the technical field of communication. The electronic equipment comprises an equipment body, a first circuit board and an acoustic device, the first circuit board and the acoustic device are both arranged in the equipment body, the equipment body is provided with a sound guide channel, the first circuit board is provided with a first through hole in the thickness direction of the first circuit board, and at least part of the acoustic device extends into the first through hole. The acoustic device is communicated with the sound guide channel through the first through hole.

Description

Technical Field

[0001] The present application belongs to the field of communication technology, and specifically relates to an electronic device. Background Art

[0002] With the development of communication technology, the functions of electronic devices are becoming more and more powerful, and the number of functional components of electronic devices is increasing, which will undoubtedly increase the thickness of electronic devices. Therefore, achieving lightweight and thin electronic devices has become an urgent problem to be solved.

[0003] In the related art, many electronic devices are equipped with acoustic devices such as microphones and speakers. Specifically, the electronic device includes a device body, a circuit board and an acoustic device. The circuit board and the acoustic device are both arranged in the device body, and the device body is provided with a sound guide channel, and the circuit board is provided with a through hole connected to the sound guide channel. The acoustic device is mounted on the surface of the circuit board, and the acoustic device is opposite to the through hole. The acoustic device is connected to the sound guide channel through the through hole to achieve sound emission or sound reception.

[0004] Thus, the stacked structure of the acoustic device and the circuit board results in a relatively large thickness of the electronic device, which is not conducive to making the electronic device thinner and lighter. Summary of the invention

[0005] The purpose of the embodiments of the present application is to provide an electronic device that can solve the problem of large thickness of electronic devices in related technologies.

[0006] An embodiment of the present application provides an electronic device, including a device body, a first circuit board, and an acoustic device, wherein the first circuit board and the acoustic device are both arranged in the device body, and the device body is provided with a sound guide channel.

[0007] The first circuit board is provided with a first through hole in the thickness direction of the first circuit board, at least a portion of the acoustic device extends into the first through hole, and the acoustic device is connected to the sound guide channel through the first through hole.

[0008] In the embodiment of the present application, the first circuit board is provided with a first through hole, so that at least part of the acoustic device can extend into the first through hole. Then, in the thickness direction of the first circuit board, at least part of the acoustic device overlaps with the first circuit board, and the space occupied by the acoustic device coincides with the space occupied by the first circuit board, so that the total space occupied by the first circuit board and the acoustic device is reduced, which is beneficial to reducing the total thickness of the electronic device and is more conducive to making the electronic device lighter and thinner. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 is a partial cross-sectional view of an electronic device disclosed in an embodiment of the present application;

[0010] Figure 2is a partial cross-sectional view of an electronic device disclosed in another embodiment of the present application;

[0011] Figure 3 It is a partial cross-sectional view of the first circuit board disclosed in the embodiment of the present application.

[0012] Description of reference numerals:

[0013] 100-device body, 111-frame, 111a-sound guide channel, 112-cover,

[0014] 110-threaded fasteners,

[0015] 120-first circuit board, 121-first through hole, 1211-first step surface, 1212-second step surface, 1213-third step surface, 121a-first opening, 121b-second through hole, 122-electronic device,

[0016] 130 - second circuit board, 131 - second through hole,

[0017] 140-display screen, 150-sealing gasket,

[0018] 200-Acoustic devices,

[0019] 300-shielding member, 310-shielding body, 311-connecting part, 320-protecting part,

[0020] a-first gap, b-second gap, c-third gap. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0022] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0023] The electronic device provided in the embodiment of the present application is described in detail below through specific embodiments and application scenarios in conjunction with the accompanying drawings.

[0024] Please refer to Figure 1-Figure 3 The electronic device disclosed in the embodiment of the present application includes a device body 100, a first circuit board 120 and an acoustic device 200, wherein the device body 100 serves as the main component of the electronic device, the acoustic device 200 and the first circuit board 120 are both installed on the device body 100, and the first circuit board 120 is used to supply power to the electrical devices in the electronic device. Of course, the device body 100 can also be installed with other components of the electronic device such as a battery module, etc.; the acoustic device 200 can be a sound-emitting device such as a speaker, or a sound-receiving device such as a microphone.

[0025] Specifically, the first circuit board 120 and the acoustic device 200 are both disposed in the device body 100, and a storage space is provided in the device body 100, and the first circuit board 120, the acoustic device 200 and other components of the electronic device are all disposed in the storage space. Optionally, the device body 100 includes a frame 111 and a cover 112, the frame 111 and the cover 112 together form a storage space, and the first circuit board 120 is opposite to the cover 112.

[0026] The device body 100 is provided with a sound guide channel 111a. Optionally, the frame 111 is provided with a sound guide channel 111a, and the sound guide channel 111a is located on the side of the first circuit board 120 facing away from the cover 112. In the thickness direction of the first circuit board 120, that is, in the thickness direction of the electronic device, the first circuit board 120 is provided with a first through hole 121, that is, the first through hole 121 passes through the first circuit board 120, and the first through hole 121 is opposite to the sound guide channel 111a. Optionally, the first through hole 121 can be a square hole, a circular hole or the like. The embodiment of the present application does not limit the shape of the first through hole 121. Moreover, at least part of the acoustic device 200 extends into the first through hole 121. Optionally, a part of the acoustic device 200 can extend into the first through hole 121, or the entire acoustic device 200 can extend into the first through hole 121. The acoustic device 200 is connected to the sound guide channel 111a through the first through hole 121.

[0027] Optionally, the acoustic device 200 can be a sound-emitting device, the sound guiding channel 111a is a sound output channel, and the sound-emitting device is connected to the sound output channel through the first through hole 121, thereby achieving sound emission; or, the acoustic device 200 can be a sound-receiving device, the sound guiding channel 111a is a sound input channel, and the sound-receiving device is connected to the sound input channel through the first through hole 121, thereby achieving sound reception.

[0028] In the embodiment of the present application, the first circuit board 120 is provided with a first through hole 121, which enables at least a portion of the acoustic device 200 to extend into the first through hole 121. Then, in the thickness direction of the first circuit board 120, at least a portion of the acoustic device 200 overlaps with the first circuit board 120, and the space occupied by the acoustic device 200 coincides with the space occupied by the first circuit board 120, so that the total space occupied by the first circuit board 120 and the acoustic device 200 is reduced, which is beneficial to reducing the total thickness of the electronic device and is more conducive to realizing the lightweight and thin electronic device.

[0029] In an optional embodiment, reference Figure 1 As shown, the sound guide channel 111a is located on the first side of the first circuit board 120, and the surface of the first circuit board 120 facing the first side is provided with an electronic device 122. Optionally, the first side is the side of the first circuit board 120 facing the sound guide channel 111a. The device body 100 also includes a second circuit board 130, the first circuit board 120 and the second circuit board 130 are stacked, and the second circuit board 130 is connected to the surface of the first circuit board 120 where the electronic device 122 is set, that is, the electronic device 122 and the second circuit board 130 are located on the same side of the first circuit board 120. Optionally, the first circuit board 120 and the second circuit board 130 can be connected by welding, bonding, etc.; the laying area of ​​the second circuit board 130 is smaller than the laying area of ​​the first circuit board 120, and the second circuit board 130 can avoid the electronic device 122; the second circuit board 130 is provided with a second through hole 131, and the second through hole 131 can be a square hole, a circular hole or the like. The embodiment of the present application does not limit the specific structure of the second through hole 131; in the thickness direction of the second circuit board 130, the second through hole 131 passes through the second circuit board 130, and the first through hole 121 is opposite to the second through hole 131, and the first through hole 121 is connected to the sound guide channel 111a through the second through hole 131. Optionally, when the acoustic device 200 is a sound-emitting device, the second through hole 131 is a sound amplification hole; when the acoustic device 200 is a sound receiving device, the second through hole 131 is a sound receiving hole.

[0030] In this embodiment, a second circuit board 130 is added to set the second through hole 131, so as to prevent the second circuit board 130 from obstructing the acoustic device 200 from making sound or receiving sound, thereby ensuring the acoustic performance of the acoustic device 200. Moreover, since the electronic device 122 and the second circuit board 130 are located on the same side of the first circuit board 120, at least part of the space occupied by the second circuit board 130 in the thickness direction overlaps with the space occupied by the electronic device 122, thereby effectively preventing the second circuit board 130 from occupying an additional large space in the thickness direction.

[0031] In a further embodiment, reference Figure 1As shown, the thickness of the second circuit board 130 is smaller than the height of the electronic device 122 protruding from the surface of the first circuit board 120 , that is, the thickness of the second circuit board 130 is smaller than the height of the electronic device 122 .

[0032] With this embodiment, in the thickness direction, the space occupied by the second circuit board 130 completely overlaps with the space occupied by the electronic device 122, so the second circuit board 130 does not occupy additional space in the thickness direction, which is beneficial to further reduce the thickness of the electronic device and achieve lightweight and thin electronic equipment.

[0033] Of course, in other embodiments, the thickness of the second circuit board 130 may be greater than the height of the electronic device 122 protruding from the surface of the first circuit board 120. That is to say, the second circuit board 130 will additionally occupy a portion of space in the thickness direction, but the additional space is still smaller than the space occupied by the acoustic device 200 and the first circuit board 120 in the thickness direction. Overall, the thickness of the electronic device can still be reduced.

[0034] Optionally, the thickness of the second circuit board 130 may be smaller than the thickness of the first circuit board 120 , or the thickness of the second circuit board 130 may be greater than the thickness of the first circuit board 120 .

[0035] In a further embodiment, reference Figure 1 As shown, the flow area of ​​the first through hole 121 is greater than the flow area of ​​the second through hole 131. At this time, the second through hole 131 serves as a sound receiving hole, the acoustic device 200 passes through the first through hole 121, and the second circuit board 130 carries the acoustic device 200. Optionally, the acoustic device 200 is connected to the surface of the second circuit board 130 facing the first circuit board 120 by welding, bonding, etc., so that the second circuit board 130 carries the acoustic device 200.

[0036] In this embodiment, the acoustic device 200 passes through the first through hole 121, so the overlapping thickness of the acoustic device 200 and the first circuit board 120 in the thickness direction of the first circuit board 120 is the thickness of the first circuit board 120. The larger the overlapping thickness, the space occupied by the first circuit board 120 is saved in the thickness direction of the electronic device, which is conducive to further reducing the total occupied space of the first circuit board 120 and the acoustic device 200, further reducing the thickness of the electronic device, and realizing the thinness of the electronic device. In addition, the second circuit board 130 directly carries the acoustic device 200, which is conducive to the stable installation of the acoustic device 200 in the first through hole 121, avoiding complicated installation operations.

[0037] Of course, in other embodiments, the flow area of ​​the first through hole 121 may be smaller than the flow area of ​​the second through hole 131 . In this case, the second through hole 131 serves as a sound expansion hole, and the acoustic device 200 may be connected to the hole wall of the first through hole 121 .

[0038] In another embodiment, reference Figure 2 and Figure 3 As shown, the first through hole 121 is a step hole, and the step hole has a first step surface 1211, a second step surface 1212 and a third step surface 1213 connected in sequence, the first step surface 1211 and the third step surface 1213 are respectively parallel to the axis of the first through hole 121, and the second step surface 1212 intersects with the axis of the first through hole 121. Optionally, the first step surface 1211, the second step surface 1212 and the third step surface 1213 can all be annular surfaces, and the second step surface 1212 is perpendicular to the axis of the first through hole 121, or the second step surface 1212 intersects with the axis of the first through hole 121 but is not perpendicular.

[0039] The first step surface 1211 forms a first opening 121a, and the acoustic device 200 extends into the first opening 121a, and the second step surface 1212 carries the acoustic device 200, and the third step surface 1213 forms a second through hole 121b, and the first opening 121a and the second through hole 121b are connected, and the two together form the first through hole 121. The acoustic device 200 is opposite to the second through hole 121b, and the second through hole 121b is connected to the sound guide channel 111a, that is, the acoustic device 200 is connected to the sound guide channel 111a through the second through hole 121b. In this way, the acoustic device 200 only extends into the first opening 121a, and the acoustic device 200 protrudes from the surface of the first circuit board 120.

[0040] Optionally, when the acoustic device 200 is a sound-emitting device, the second through hole 121b is a sound amplification hole, the sound guiding channel 111a is a sound output channel, and the sound-emitting device produces sound through the sound amplification hole and the sound output channel; when the acoustic device 200 is a sound receiving device, the second through hole 121b is a sound receiving hole, the sound guiding channel 111a is a sound input channel, and the sound receiving device produces sound through the sound amplification hole and the sound output channel.

[0041] With this embodiment, in the thickness direction of the first circuit board 120, part of the space occupied by the acoustic device 200 overlaps with part of the space occupied by the first circuit board 120, saving part of the space occupied by the acoustic device 200, which is beneficial to reducing the total space occupied by the first circuit board 120 and the acoustic device 200, and is beneficial to reducing the thickness of the electronic device, and realizing the thinness of the electronic device. Moreover, the first circuit board 120 is provided with the first opening 121a and the second through hole 121b at the same time, and there is no need to set up other components to open the second through hole 121b as a sound receiving hole or a sound amplification hole, which is beneficial to reducing the number of components and simplifying the structure of the electronic device.

[0042] In a further embodiment, the flow area of ​​the first opening 121a is greater than the flow area of ​​the second through hole 121b, that is, in a direction parallel to the plane where the first circuit board 120 is located, the cross-sectional area of ​​the first opening 121a is greater than the cross-sectional area of ​​the second through hole 121b. Optionally, the first opening 121a and the second through hole 121b can both be circular holes, and the aperture of the first opening 121a is greater than the aperture of the second through hole 121b. Of course, the first opening 121a and the second through hole 121b can also be square holes or holes of other shapes. Moreover, in the thickness direction of the first circuit board 120, the depth of the second through hole 121b is greater than the depth of the first opening 121a.

[0043] In this embodiment, the depth of the second through hole 121b is relatively large, ensuring a good sound reception or amplification effect; the depth of the first opening 121a is relatively small, which is beneficial to reducing the volume of the portion to be removed from the first circuit board 120 and improving the strength of the first circuit board 120.

[0044] Of course, in other embodiments, in the thickness direction of the first circuit board 120 , the depth of the second through hole 121 b may be smaller than the depth of the first opening 121 a .

[0045] In an optional embodiment, the hole side wall of the first through hole 121 has a first area, the acoustic device 200 is opposite to the first area, and the acoustic device 200 is in contact with the first area.

[0046] In another embodiment, a first gap a is provided between the acoustic device 200 and the first region. That is, the acoustic device 200 is not in direct contact with the side wall of the first through hole 121. Optionally, in an embodiment in which a second circuit board 130 is added to open a second through hole 131, the acoustic device 200 passes through the first through hole 121, and a first gap a is provided between the acoustic device 200 and the side wall of the first through hole 121; in an embodiment in which the first through hole 121 opened in the first circuit board 120 includes a first opening 121a and a second through hole 121b, the acoustic device 200 extends into the first opening 121a, and a first gap a is provided between the acoustic device 200 and the side wall of the first opening 121a.

[0047] In this embodiment, since there is a first gap a between the acoustic device 200 and the side wall of the first through hole 121, the opening space of the first through hole 121 is relatively large, which is conducive to setting the acoustic device 200 in the first through hole 121 through the first gap a, thereby improving the installation convenience of the acoustic device 200.

[0048] In the scheme of this application, reference is made to Figure 1 and Figure 2As shown, the device body 100 includes a connected frame body 111 and a cover body 112, and the frame body 111 and the cover body 112 can be connected by welding, bonding, clamping, etc. The first circuit board 120 and the acoustic device 200 are both arranged in the frame body 111, the sound guide channel 111a is opened in the frame body 111, the first circuit board 120 is opposite to the cover body 112, the acoustic device 200 protrudes from the surface of the first circuit board 120 facing the cover body 112, and the cover body 112 is located on the side of the first circuit board 120 facing away from the sound guide channel 111a, that is, the acoustic device 200 protrudes from the surface of the first circuit board 120 facing away from the sound guide channel 111a, and a second gap b is provided between the surface of the acoustic device 200 facing the cover body 112 and the cover body 112, that is, there is no direct contact between the acoustic device 200 and the cover body 112.

[0049] By adopting this embodiment, the second gap b is reserved to prevent the cover body 112 from hitting the acoustic device 200 when the cover body 112 is deformed by force, thereby avoiding affecting the sound cavity of the acoustic device 200 and thus affecting the acoustic effect, thereby ensuring the sound performance of the acoustic device 200.

[0050] Of course, in other embodiments, the acoustic device 200 protrudes from the surface of the first circuit board 120 facing the cover 112 , and the surface of the acoustic device 200 facing the cover 112 is in contact with the cover 112 .

[0051] In an optional embodiment, if Figure 2 As shown, the electronic device further includes a shielding member 300, which may be a shielding cover, a shielding cover, or other components capable of achieving electromagnetic shielding effect; the shielding member 300 is connected to the first circuit board 120, specifically, the shielding member 300 is connected to the surface of the first circuit board 120 facing the cover body 112, and optionally, the shielding member 300 may be connected to the surface of the first circuit board 120 by welding, bonding, etc. Moreover, the shielding member 300 is located at the side of the acoustic device 200, and in the thickness direction of the first circuit board 120, the shielding member 300 protrudes from the surface of the acoustic device 200 facing the cover body 112. Optionally, the height of the shielding member 300 protruding relative to the surface of the acoustic device 200 facing the cover body 112 is 0.05mm-0.1mm.

[0052] By adopting this embodiment, the shielding member 300 can protect the acoustic device 200 and avoid signal interference; moreover, the shielding member 300 protrudes from the surface of the acoustic device 200 facing the cover body 112. Then, in the thickness direction of the first circuit board 120, when the cover body 112 is deformed by force, the cover body 112 first contacts the shielding member 300. The shielding member 300 can prevent the cover body 112 from acting on the acoustic device 200, which is beneficial to further ensure the safety performance and sound performance of the acoustic device 200.

[0053] Of course, in other embodiments, the electronic device may not be provided with the shielding member 300 , that is, only the second gap b is reserved between the surface of the acoustic device 200 facing the cover body 112 and the cover body 112 .

[0054] In an optional embodiment, the shielding member 300 includes a shielding body 310 and a protection part 320 connected in sequence, the shielding body 310 is connected to the first circuit board 120, the protection part 320 is bent relative to the shielding body 310 toward the acoustic device 200, and in the thickness direction of the first circuit board 120, the protection part 320 protrudes from the surface of the acoustic device 200 facing the cover 112, so that when the cover 112 is deformed by force, the cover 112 first contacts the protection part 320, and the cover 112 is prevented from hitting the acoustic device 200 by the protection part 320. Optionally, the plane where the protection part 320 is located is parallel to the surface of the acoustic device 200 facing the cover 112, that is, the plane where the protection part 320 is located is parallel to the plane where the cover 112 is located.

[0055] refer to Figure 2 As shown, a protective portion 320 is provided at one end of the shielding body 310, and a connecting portion 311 is provided at the other end of the shielding body 310. The connecting portion 311 is also bent relative to the shielding body 310. The shielding body 310 is connected to the first circuit board 120 through the connecting portion 311. Optionally, the connecting portion 311, the shielding body 310 and the protective portion 320 can be an integrated structure, and the connecting portion 311 and the first circuit board 120 can be connected by welding, bonding, etc.

[0056] Optionally, the shielding member 300 is an annular structure, the shielding body 310 and the protection part 320 are both annular structures, and the shielding member 300 is arranged around the acoustic device 200; of course, the shielding member 300 can also adopt other structures besides the annular structure, and the embodiment of the present application does not limit the specific structure of the shielding member 300.

[0057] In this embodiment, the protection portion 320 of the shielding member 300 is bent relative to the shielding body 310. Then, the protection area of ​​the acoustic device 200 provided by the shielding member 300 through the protection portion 320 is increased. At the same time, the area relative to the protection portion 320 and the cover body 112 is larger. When the cover body 112 is deformed by force, the contact area with the shielding member 300 is increased, which is beneficial to reducing the force pressure of the shielding member 300, thereby avoiding deformation of the shielding member 300 by force.

[0058] Of course, in other embodiments, the shielding member 300 may only include the shielding body 310 , and the surface of the shielding body 310 facing the cover 112 protrudes beyond the surface of the acoustic device 200 facing the cover 112 .

[0059] In an optional embodiment, the surface of the shielding member 300 facing the cover body 112 is in contact with the cover body 112. Optionally, the protection portion 320 may be in direct contact with the cover body 112.

[0060] In another embodiment, a third gap c is provided between the surface of the shielding member 300 facing the cover body 112 and the cover body 112, that is, the surface of the shielding member 300 facing the cover body 112 is not in direct contact with the cover body 112. Optionally, a third gap c is provided between the protection portion 320 of the shielding member 300 and the cover body 112. Further optionally, the thickness of the cover body 112 may be 0.2 mm-0.4 mm, and the third gap c may be 0.1 mm-0.2 mm.

[0061] By adopting this embodiment, a third gap c is reserved between the shielding member 300 and the cover body 112, so as to further increase the gap between the cover body 112 and the acoustic device 200, thereby further preventing the cover body 112 from hitting the acoustic device 200 when the cover body 112 is deformed by force; moreover, it can also prevent the cover body 112 from hitting the shielding member 300 when the cover body 112 is deformed by force to a certain extent, thereby preventing the shielding member 300 from deformation, thereby ensuring the shielding performance of the shielding member 300.

[0062] Optionally, the electronic device also includes a display screen 140, which is arranged in the frame 111. The display screen 140 is located on the side of the first circuit board 120 that is away from the cover body 112, the display screen 140 is opposite to the first circuit board 120, and the acoustic device 200 protrudes from the surface of the first circuit board 120 that is away from the display screen 140; the electronic device also includes a sealing gasket 150 and a threaded fastener 110, the sealing gasket 150 is arranged between the frame 111 and the component where the second through hole is set to seal the second through hole and the sound guide channel 111a to avoid sound leakage; the threaded fastener 110 is used to install the first circuit board 120, the threaded fastener 110 can be a fastener such as a screw or a bolt, the threaded fastener 110 passes through the first circuit board 120 and extends into the frame 111 to install the first circuit board 120 on the device body 100.

[0063] Since the surface of the first circuit board 120 is usually provided with an electronic device 122, and the electronic device 122 faces the side where the display screen 140 is located, a certain gap needs to be reserved between the electronic device 122 and the frame 111 to avoid contact between the electronic device 122 and the frame 111. At the same time, in order to improve the installation strength of the first circuit board 120 and ensure the reliability of the first circuit board 120, the depth of the threaded fastener 110 extending into the frame 111 cannot be too small. In this way, the distance between the first circuit board 120 and the display screen 140 cannot be shortened. Therefore, in the embodiment of the present application, at least a portion of the acoustic device 200 overlaps with the first circuit board 120 to reduce the distance between the first circuit board 120 and the cover 112, thereby reducing the thickness of the electronic device and achieving a lightweight electronic device.

[0064] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. An electronic device, It is characterized in that The device comprises a device body (100), a first circuit board (120) and an acoustic device (200), wherein the first circuit board (120) and the acoustic device (200) are both arranged in the device body (100), and the device body (100) is provided with a sound guide channel (111a). The first circuit board (120) is provided with a first through hole (121) in the thickness direction of the first circuit board (120), at least a portion of the acoustic device (200) extends into the first through hole (121), and the acoustic device (200) is connected to the sound guide channel (111a) via the first through hole (121).

2. The electronic device according to claim 1, It is characterized in that The sound guide channel (111a) is located on a first side of the first circuit board (120); an electronic device (122) is provided on a surface of the first circuit board (120) facing the first side. The electronic device further comprises a second circuit board (130), the first circuit board (120) and the second circuit board (130) are stacked, and the second circuit board (130) is connected to a surface of the first circuit board (120) on which the electronic device (122) is arranged, the second circuit board (130) is provided with a second through hole (131), the first through hole (121) and the second through hole (131) are opposite, and the first through hole (121) is connected to the sound guide channel (111a) through the second through hole (131).

3. The electronic device according to claim 2, It is characterized in that The thickness of the second circuit board (130) is smaller than the height of the electronic device (122) protruding from the surface of the first circuit board (120).

4. The electronic device according to claim 2, It is characterized in that The flow area of ​​the first through hole (121) is greater than the flow area of ​​the second through hole (131), the acoustic device (200) passes through the first through hole (121), and the second circuit board (130) carries the acoustic device (200).

5. The electronic device according to claim 1, It is characterized in that The first through hole (121) is a stepped hole, and the stepped hole has a first stepped surface (1211), a second stepped surface (1212) and a third stepped surface (1213) connected in sequence, the first stepped surface (1211) and the third stepped surface (1213) are respectively parallel to the axis of the first through hole (121), and the second stepped surface (1212) intersects with the axis of the first through hole (121). The first step surface (1211) forms a first opening (121a), the acoustic device (200) extends into the first opening (121a), and the second step surface (1212) supports the acoustic device (200); the third step surface (1213) forms a second through hole (121b), the acoustic device (200) is opposite to the second through hole (121b), and the second through hole (121b) is connected to the sound guide channel (111a).

6. The electronic device according to claim 5, It is characterized in that The flow area of ​​the first opening (121a) is greater than the flow area of ​​the second through hole (121b), and in the thickness direction of the first circuit board (120), the depth of the second through hole (121b) is greater than the depth of the first opening (121a).

7. The electronic device according to claim 1, It is characterized in that The hole side wall of the first through hole (121) has a first area, the acoustic device (200) is opposite to the first area, and a first gap (a) is provided between the acoustic device (200) and the first area.

8. The electronic device according to claim 1, It is characterized in that The device body (100) comprises a connected frame (111) and a cover (112); the first circuit board (120) and the acoustic device (200) are both arranged in the frame (111); the sound guide channel (111a) is opened in the frame (111); The first circuit board (120) is opposite to the cover body (112), the acoustic device (200) protrudes from the surface of the first circuit board (120) facing the cover body (112), and a second gap (b) is provided between the acoustic device (200) and the cover body (112).

9. The electronic device according to claim 8, It is characterized in that The electronic device further comprises a shielding member (300), wherein the shielding member (300) is connected to the surface of the first circuit board (120) facing the cover body (112), and the shielding member (300) is located on the side of the acoustic device (200), and in the thickness direction of the first circuit board (120), the shielding member (300) protrudes from the surface of the acoustic device (200) facing the cover body (112).

10. The electronic device according to claim 9, It is characterized in that The shielding member (300) comprises a shielding body (310) and a protection portion (320) which are connected in sequence, wherein the shielding body (310) is connected to the first circuit board (120), and the protection portion (320) is bent relative to the shielding body (310) toward the acoustic device (200), and in the thickness direction of the first circuit board (120), the protection portion (320) protrudes from the surface of the acoustic device (200) facing the cover body (112).

11. The electronic device according to claim 9, It is characterized in that A third gap (c) is provided between the surface of the shielding member (300) facing the cover body (112) and the cover body (112).

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