Fixing mechanism of three-layer PCB host and assembling method thereof

Abstract

The invention discloses a fixing mechanism of a three-layer PCB host and an assembling method thereof in the technical field of vehicle-mounted host assembling, and the fixing mechanism comprises a host lower cover, the host lower cover is provided with a bottom layer board assembling structure, a middle layer board assembling structure and an upper layer board assembling structure, and the bottom layer board assembling structure is assembled with a functional PCB. Assembling the middle-layer board assembling structure with the core PCB, and assembling the upper-layer board assembling structure with the main PCB; and the host lower cover is also matched with a host side plate and a host upper cover. According to the sequence from bottom to top, the functional PCB and the bottom-layer board assembly structure are assembled and fixed, the core PCB and the middle-layer board assembly structure are assembled and fixed, the main PCB and the upper-layer board assembly structure are assembled and fixed, the three layers of PCBs are fixed and assembled in a highly concentrated mode, and the signal transmission reliability between the PCBs is improved; meanwhile, the arrangement space of the external socket is increased by adding the side plates, and the module function is highly integrated.

Description

Technical Field

[0001] The invention relates to a fixing mechanism of a three-layer PCB board host and an assembling method thereof in the technical field of vehicle-mounted host assembly. Background Art

[0002] As end users now have higher and higher requirements for the intelligence of large central control screens in cars, the demand for highly functional car control systems is also becoming stronger and stronger. The traditional host structure has three layers of PCB boards assembled and fixed. During the design process, an additional middle cover or bracket structure needs to be designed to undertake the assembly of three PCB boards. The middle cover or bracket requires sheet metal parts to be designed through complex bending, avoidance and positioning to meet the high-precision assembly relationship between the three layers of PCB. If the quality and assembly of the middle cover or bracket are poor, the signal transmission between the PCB boards will be interrupted, causing the central control screen to display a flowery screen or a black screen. At the same time, considering the signal interference between external sockets, the host shell needs to bend a very wide shielding wall structure to isolate each external socket connected to the car body, resulting in a very limited number of external sockets arranged on the host. Therefore, the traditional design scheme can no longer meet the needs of highly concentrated functional modules of the currently rapidly developing car control system. Summary of the invention

[0003] The purpose of the present invention is to provide a fixing mechanism for a three-layer PCB host and an assembly method thereof, which has a simple and compact structure, a shell adopts an extended material bending design, and highly centralized fixed assembly of the three-layer PCB board, thereby improving the reliability of signal transmission between the PCB boards; at the same time, a side panel is added to increase the layout space of the external socket, and the module function is highly integrated.

[0004] To achieve the above-mentioned purpose, the present invention provides a fixing mechanism for a three-layer PCB host, including a host lower cover, on which a bottom board assembly structure, a middle board assembly structure and an upper board assembly structure are arranged, the bottom board assembly structure is assembled with a functional PCB board, the middle board assembly structure is assembled with a core PCB board, and the upper board assembly structure is assembled with a main PCB board; the host lower cover is also equipped with a host side panel and a host upper cover.

[0005] Compared with the prior art, the beneficial effect of the present invention lies in that, in order from bottom to top, the functional PCB board and the bottom board assembly structure are assembled and fixed, the core PCB board and the middle board assembly structure are assembled and fixed, and the main PCB board and the upper board assembly structure are assembled and fixed, respectively, so that the three-layer PCB boards are highly centralized and fixedly assembled, thereby improving the signal transmission reliability between the PCB boards; at the same time, by adding a side panel, the layout space of the external socket is increased, and the module function is highly integrated.

[0006] As a further improvement of the present invention, the bottom plate assembly structure includes two lower assembly plates and a lower convex bump, wherein one of the lower assembly plates is arranged on one end of a side edge of a lower cover of the main unit, and the other lower assembly plate is arranged on a side edge of a lower cover of the main unit close to one end of a shielding platform, screw holes are provided on the lower assembly plates and positioning columns matching the positioning holes of the functional PCB boards are provided, the lower convex bump is arranged on the upper surface of the bottom plate of the lower cover of the main unit, and screw holes are provided on the lower convex bump.

[0007] In this way, two lower assembly plates are formed by bending the inner wall of one side of the lower cover of the main unit and each has a positioning column. The lower convex bump is formed by stamping the convex bump of the shell. The Z-axis assembly surface of the functional PCB board is positioned and assembled with these three parts. The overall structure is simple and easy to assemble.

[0008] As a further improvement of the present invention, the middle layer board assembly structure includes six middle assembly boards, each of which is provided with screw holes, wherein the first middle assembly board is arranged on the side two of the lower cover of the main engine, the second and third middle assembly boards are arranged on the side three of the lower cover of the main engine, the second and third middle assembly boards are both provided with positioning columns matching the positioning holes on the core PCB board, the fourth middle assembly board is arranged on the side four of the lower cover of the main engine, the fifth middle assembly board is arranged at the other end of the side one of the lower cover of the main engine and is provided with positioning columns matching the positioning holes on the core PCB board, and the sixth middle assembly board is arranged on the inner side of the shielding platform, the side one is opposite to the side three, and the side two is opposite to the side four.

[0009] In this way, since the left and right sides of the lower cover of the main unit are appearance surfaces, that is, the fourth assembly plate and the first assembly plate are formed by secondary bending of the front and rear extended materials to form support assembly surfaces, the other four assembly plates can be directly formed by bending the front and rear surfaces, and the second, third and fifth middle assembly plates are all provided with positioning columns, thus forming 6 support assembly surfaces, thereby eliminating the need for redundant middle covers or bracket structures.

[0010] As a further improvement of the present invention, the upper board assembly structure includes four upper assembly plates, each of which is provided with screw holes, wherein the first assembly plate is arranged on side two, the second and third assembly plates are respectively arranged at both ends of side plate three and are provided with positioning columns, and the fourth assembly plate is arranged on side four and is provided with positioning columns matching the positioning holes on the main PCB board.

[0011] In this way, four upper assembly plates are formed by bending the inner wall of the lower cover of the main unit, and three of them are provided with positioning columns to form the positioning assembly surface of the main PCB board, eliminating the redundant bracket structure.

[0012] As a further improvement of the present invention, a plurality of jacks are provided on the side panel of the host, and the jacks match the external sockets on the functional PCB board, the core PCB board and the main PCB board. The minimum spacing between the jacks in the same row is 2 mm, and positioning holes matching the positioning columns provided on the side of the lower cover of the host are provided at both ends of the side panel.

[0013] In this way, the side panel is a single-sided stamping structure, and the signal interference shielding barrier before the external socket opening can be minimized to 2mm by stamping in one time. Therefore, more external socket holes can be arranged continuously, which can meet the needs of arranging multiple external sockets on the PCB board.

[0014] To achieve the above purpose, the present invention also provides a method for assembling a three-layer PCB host, comprising the following steps: step 1, assembling a functional PCB board; step 2, assembling a core PCB board; step 3, assembling a main PCB board; and step 4, packaging and assembling the host.

[0015] Compared with the prior art, the beneficial effect of the present invention is that, during the assembly process, the three PCB boards and all parts are assembled from top to bottom, and are all locked and connected with the lower cover of the main unit, which meets the requirements of automatic assembly design and the needs of automated production lines, and can effectively reduce assembly hours and speed up production rhythm.

[0016] As a further improvement of the present invention, the specific content of step 1 is as follows: The opening of the lower cover of the host is facing upwards, and the function PCB board is accurately positioned from top to bottom through its own positioning holes and the positioning columns on the lower assembly board, so that the function PCB board and the lower assembly board are fitted together, and finally screwed into the corresponding screw holes on the lower assembly board and the function PCB board to lock and fix the function PCB board and the lower assembly board.

[0017] In this way, assemble the functional PCB board and the lower cover of the host from top to bottom, and then use three screws to fix the two together. The operation is simple and convenient.

[0018] As a further improvement of the present invention, the specific content of step 2 is as follows: The core PCB board is accurately positioned from top to bottom through its own positioning holes and the positioning columns on the middle assembly board, and the core PCB board is fitted with the board surfaces of the six middle assembly boards. At this time, the floating socket on the back of the core PCB board is fully engaged with the floating socket on the functional PCB board, and the external socket on the back of the core PCB board is in the shielding platform. Then, screws are screwed into the corresponding screw holes on the middle assembly board and the core PCB board to lock and fix the core PCB and the middle assembly board.

[0019] In this way, the core PCB board can be positioned and assembled from top to bottom with the six assembly surfaces (middle assembly board) of the host bottom cover, and then locked and fixed with six screws. The operation is simple and convenient.

[0020] As a further improvement of the present invention, the specific content of step 3 is as follows: Step 3.1, accurately position the main PCB from top to bottom through its own positioning holes and the positioning columns of the upper assembly board, so that the main PCB board and the upper assembly board are fitted together. At this time, the floating socket on the back of the main PCB board is fitted with the floating socket of the core PCB board; Step 3.2: Position the upper cover of the host accurately from top to bottom through its own positioning holes and the positioning columns of the upper assembly plate, so as to assemble it with the lower cover of the host. Screw the screws into the upper cover of the host, the main PCB board and the upper assembly plate from top to bottom in sequence, so that the main PCB board is clamped between the lower cover of the host and the upper cover of the host and locked and fixed.

[0021] In this way, the main PCB is positioned and assembled with the host lower cover and the main PCB board with the core PCB board from top to bottom, and finally packaged and fixed by the host upper cover, and the main PCB board is clamped between the host upper cover and the lower cover.

[0022] As a further improvement of the present invention, the specific content of step 4 is as follows: Step 4.2, rotate the host lower cover 90° so that the external sockets of the three PCB boards face upwards, and accurately position the side panel from top to bottom through its own positioning holes and the positioning columns corresponding to the host lower cover, so that the side panel and the host lower cover are assembled, and the jacks of the side panel pass through the corresponding external sockets. Finally, tighten the side panel and the host lower cover with screws.

[0023] In this way, the assembly method is still from top to bottom, and screws are used to lock and fix, ensuring the continuity of the whole machine assembly and speeding up the production rhythm. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the assembly structure of the bottom plate of the lower cover of the host in the present invention.

[0025] Figure 2 It is a schematic diagram of the assembly structure of the middle plate of the lower cover of the host in the present invention.

[0026] Figure 3 It is a schematic diagram of the assembly structure of the upper plate of the lower cover of the main engine in the present invention.

[0027] Figure 4 It is a structural schematic diagram of the side plate in the present invention.

[0028] Figure 5 It is a schematic diagram of the functional PCB board assembly in the present invention.

[0029] Figure 6 It is a schematic diagram of the core PCB board assembly in the present invention.

[0030] Figure 7 It is a schematic diagram of the main PCB assembly in the present invention.

[0031] Figure 8 It is a schematic diagram of assembling the upper cover of the host in the present invention.

[0032] Fig. 9 It is a schematic diagram of the assembly of the side panel in the present invention.

[0033] Fig.10 This is a structural assembly diagram of a three-layer PCB host in the present invention.

[0034] Among them, 1 positioning column, 2 side two, 3 lower convex bump, 4 bottom plate, 5 side three, 6 side four, 7 shielding platform, 8 lower assembly plate, 9 side one, 10 middle assembly plate, 11 upper assembly plate, 12 jack, 13 floating socket, 14 screw, 15 positioning hole, 16 functional PCB board, 17 screw hole, 18 core PCB board, 19 main PCB board, 20 host upper cover, 21 side panel, 22 host lower cover, 23 external socket. DETAILED DESCRIPTION

[0035] The present invention is further described below in conjunction with the accompanying drawings: like Figure 1-4 The fixing mechanism of a three-layer PCB host shown in the figure includes a host lower cover 22, on which a bottom board assembly structure, a middle board assembly structure and an upper board assembly structure are arranged, the bottom board assembly structure is assembled with a functional PCB board 16, the middle board assembly structure is assembled with a core PCB board 18, and the upper board assembly structure is assembled with a main PCB board 19; the host lower cover 22 is also equipped with a host side panel 21 and a host upper cover 20.

[0036] The bottom plate assembly structure includes two lower assembly plates 8 and a lower convex bump 3, wherein one lower assembly plate 8 is arranged on one end of a side edge 9 of the host lower cover 22, and the other lower assembly plate 8 is arranged on a position of a side edge 9 of the host lower cover 22 close to one end of the shielding platform 7. The lower assembly plates 8 are provided with screw holes 17 and positioning columns 1 matching the positioning holes 15 of the functional PCB board 16. The lower convex bump 3 is arranged on the upper surface of the bottom plate 4 of the host lower cover 22, and the lower convex bump 3 is provided with screw holes 17.

[0037] The middle-layer board assembly structure includes six middle assembly boards 10, each of which is provided with a screw hole 17. The first middle assembly board 10 is arranged on the side 2 2 of the main unit lower cover 22, the second and third middle assembly boards 10 are arranged on the side 3 5 of the main unit lower cover 22, the second and third middle assembly boards 10 are both provided with a positioning column 1 that matches the positioning hole 15 on the core PCB board 18, the fourth middle assembly board 10 is arranged on the side 4 6 of the main unit lower cover 22, the fifth middle assembly board 10 is arranged at the other end of the side 1 9 of the main unit lower cover 22 and is provided with a positioning column 1 that matches the positioning hole 15 on the core PCB board 18, and the sixth middle assembly board 10 is arranged on the inner side of the shielding platform 7, the side 1 9 is opposite to the side 3 5, and the side 2 2 is opposite to the side 4 6.

[0038] The upper board assembly structure includes four upper assembly plates 11, each of which is provided with a screw hole 17, wherein the first assembly plate is arranged on the side 2 2, the second and third assembly plates are respectively arranged at the two ends of the side plate 21 3 and are provided with positioning columns 1, and the fourth assembly plate is arranged on the side 4 6 and is provided with a positioning column 1 matching the positioning hole 15 on the main PCB board 19.

[0039] A plurality of jacks 12 are provided on the host side panel 21, and the jacks 12 match the external sockets 23 on the functional PCB board 16, the core PCB board 18 and the main PCB board 19. The minimum spacing between the jacks 12 in the same row is 2 mm. Positioning holes 15 matching the positioning columns 1 set on the side of the host lower cover 22 are provided at both ends of the side panel 21.

[0040] like Figure 5-10 The assembly method of a three-layer PCB host shown in the figure comprises the following steps: Step 1, assembly of the functional PCB board 16.

[0041] The opening of the host lower cover 22 faces upward, and the function PCB board 16 is accurately positioned from top to bottom through its own positioning holes 15 and the positioning columns 1 on the lower assembly board 8, so that the function PCB board 16 and the board surface of the lower assembly board 8 are fitted together, and finally the screws 14 are screwed into the corresponding screw holes 17 on the lower assembly board 8 and the function PCB board 16, so that the function PCB board 16 and the lower assembly board 8 are locked and fixed.

[0042] Step 2, assembling the core PCB board 18.

[0043] The core PCB board 18 is accurately positioned from top to bottom through its own positioning holes 15 and the positioning columns 1 on the middle assembly board 10, and the core PCB board 18 is fitted with the board surfaces of the six middle assembly boards 10. At this time, the floating socket 13 on the back of the core PCB board 18 is fully engaged with the floating socket 13 of the functional PCB board 16, and the external socket 23 on the back of the core PCB board 18 is in the shielding platform 7. Then, the screws 14 are screwed into the corresponding screw holes 17 on the middle assembly board 10 and the core PCB board 18 to lock and fix the core PCB and the middle assembly board 10.

[0044] Step 3, assembly of the main PCB board 19.

[0045] Step 3.1, accurately position the main PCB board 19 from top to bottom through its own positioning hole 15 and the positioning column 1 of the upper assembly board 11, so that the main PCB board 19 and the board surface of the upper assembly board 11 are fitted together. At this time, the floating socket 13 on the back of the main PCB board 19 is fully engaged with the floating socket 13 of the core PCB board 18.

[0046] Step 3.2, accurately position the host upper cover 20 from top to bottom through its own positioning holes 15 and the positioning columns 1 of the upper assembly plate 11, so as to assemble it with the host lower cover 22, and screw the screws 14 into the host upper cover 20, the main PCB board 19 and the upper assembly plate 11 from top to bottom in sequence, so that the main PCB board 19 is clamped between the host lower cover 22 and the host upper cover 20 and locked and fixed.

[0047] Step 4, assembling the side panel 21.

[0048] Rotate the host lower cover 22 90° so that the external sockets 23 of the three PCB boards face upwards, and accurately position the side panel 21 from top to bottom through its own positioning holes 15 and the positioning columns 1 corresponding to the host lower cover 22, so that the side panel 21 and the host lower cover 22 are assembled, and the jacks 12 of the side panel 21 pass through the corresponding external sockets 23, and finally tighten the side panel 21 and the host lower cover 22 with screws 14.

[0049] In the present invention, Figure 1 As shown, the functional PCB board 16Z-direction assembly surface cooperates with two lower assembly plates 8 and a lower convex bump 3 of the host lower cover 22, wherein the lower assembly plate 8 is formed by bending the inner wall of the shell of the host lower cover 22 and is respectively provided with a positioning column 1, and the lower convex bump 3 is formed by stamping the shell, and the whole structure is simple and easy to assemble.

[0050] like Figure 2As shown, the Z-direction assembly surface of the core PCB board 18 cooperates with the six middle assembly plates 10 of the main unit lower cover 22, and the middle assembly plate 10 on the side 2 2 and the middle assembly plate 10 on the side 3 5 of the main unit lower cover 22 are formed into supporting assembly surfaces by secondary bending of the front and back extended materials, and the other four middle assembly plates 10 can be directly formed by bending the front and back surfaces, among which the second and third middle assembly plates 10 on the side 3 5 and the fifth middle assembly plate 10 on the side 1 9 are respectively provided with positioning columns 1, thereby forming 6 supporting assembly surfaces, thereby eliminating the need for redundant middle covers or bracket structures.

[0051] like Figure 3 As shown, the Z-direction assembly surface of the main PCB board 19 cooperates with the four upper assembly plates 11 of the main unit lower cover 22. The four upper assembly plates 11 are all formed by bending the inner wall of the shell of the main unit lower cover 22. Among them, one upper assembly plate 11 on the side four 6 and two upper assembly plates 11 on the side three are both provided with positioning columns 1.

[0052] The fixing and positioning structures of the above three layers of PCB boards are all formed by a single host lower cover 22 through different bending processes, and all assembly positioning features are concentrated in one body. Therefore, the three layers of PCB boards can form an assembly relationship through the host lower cover 22, which greatly improves the assembly accuracy of the floating socket 13 used for signal transmission between PCB boards.

[0053] like Figure 4 As shown, the side panel 21 is a single-sided stamping structure, and the signal interference shielding barrier between the external sockets 23 can be minimized to 2mm by one stamping. Therefore, more sockets 12 matching the external sockets 23 can be arranged continuously, which can meet the needs of arranging more external sockets 23 on the PCB board.

[0054] The assembly process is as follows: like Figure 5 As shown, the functional PCB board 16 is positioned from top to bottom through its own positioning holes 15 and the positioning columns 1 on the two lower assembly plates 8 on the lower cover 22 of the host, and then assembled with the two lower assembly plates 8 and a lower convex bump 3, and finally locked and fixed with three screws 14.

[0055] like Figure 6 As shown, the core PCB board 18 is positioned from top to bottom through its own positioning holes 15 and the positioning columns 1 on the three middle assembly boards 10 on the lower cover 22 of the main unit, and then assembled with the surfaces of the six middle assembly boards 10. At this time, the floating socket 13 (drawn by the dotted line in the figure) on the back of the core PCB board 18 is fully engaged with the floating socket 13 of the functional PCB board 16, and then the 6 screws 14 are locked and fixed.

[0056] like Figure 7As shown, the main PCB board 19 is positioned from top to bottom through its own positioning holes 15 and the positioning columns 1 on the three upper assembly boards 11 of the main unit lower cover 22, and then assembled with the surfaces of the four upper assembly boards 11. At this time, the floating socket 13 (drawn by the dotted line in the figure) on the back of the main PCB board 19 is fully engaged with the floating socket 13 of the core PCB board 18, thereby completing the precise positioning and assembly between the three-layer PCB boards.

[0057] like Figure 8 As shown, the host upper cover 20 is positioned from top to bottom through its own positioning holes 15 and the positioning columns 1 on the three upper assembly plates 11 of the host lower cover 22 (the three positioning columns 1 extend upward from the positioning holes 15 of the main PCB board 19), and then the main PCB board 19, the upper assembly plate 11 and the host upper cover 20 are locked with four screws 14, and the main PCB board 19 is clamped between the host upper cover 20 and the host lower cover 22.

[0058] like Fig. 9 As shown, the assembled host needs to be rotated 90°. After completion, the side panel 21 is positioned from top to bottom in the same direction through its own positioning hole 15 and the positioning column 1 set on the host lower cover 22. The socket 12 of the side panel 21 passes through each external socket 23 on the three PCB boards. The minimum width between the densely arranged sockets 12 is 2mm, which can separate each external socket 23. Multiple external sockets 23 can be arranged and the signal interference between sockets can be effectively shielded. Finally, four screws 14 are used to lock the side panel 21 and the host lower cover 22. The final shape is as follows Fig.10 shown.

[0059] In the above assembly process, the three PCB boards and all parts are assembled from top to bottom, and all are locked and connected with the lower cover 22 of the main unit, which meets the requirements of automatic assembly design and the production needs of the automated production line. At the same time, in each locking process, a maximum of 6 screws 14 are used, which can effectively reduce assembly hours and speed up production while ensuring the stability of the whole machine connection. In addition, in order to meet the production requirements of the automatic screw 14 locking of the line body, all screws 14 are avoided at 3mm around, without structural parts blocking, so as to facilitate the free extension and retraction of the adsorption sleeve of the screw 14. By using the automatic screw 14 locking machine, the screw 14 locking process can be monitored and managed, and the actual locking force and locking state generated when each screw 14 is locked can be measured to ensure the normal locking of the screw 14.

[0060] The present invention reduces the number of assembly parts between the three layers of PCBs, fully utilizes the structure of the host lower cover 22 itself to stamp and bend the assembly board, improves the defect of redundant assembly errors of redundant structural parts, improves the matching accuracy of the floating socket 13 of the PCB board, simplifies the production line assembly process and improves production efficiency. At the same time, the side panel 21 structure effectively reduces the layout distance between the external sockets 23, and can integrate a large number of external sockets 23, meeting the requirements of the vehicle control system with highly concentrated functional modules, and improving customer satisfaction and product quality.

[0061] The present invention is not limited to the above-mentioned embodiments. On the basis of the technical solution disclosed herein, technicians in this field can make some substitutions and deformations to some technical features therein according to the disclosed technical content without creative labor, and these substitutions and deformations are all within the protection scope of the present invention.

Claims

1. A fixing mechanism for a three-layer PCB host, comprising a host bottom cover, characterized in that: The host bottom cover is provided with a bottom board assembly structure, a middle board assembly structure and an upper board assembly structure. The bottom board assembly structure is assembled with the functional PCB board, the middle board assembly structure is assembled with the core PCB board, and the upper board assembly structure is assembled with the main PCB board. The host bottom cover is also equipped with a host side panel and a host top cover.

2. The fixing mechanism of a three-layer PCB host according to claim 1 is characterized in that: The bottom board assembly structure includes two lower assembly plates and a lower convex bump, wherein one of the lower assembly plates is arranged on one end of a side edge of a lower cover of the main unit, and the other lower assembly plate is arranged on a side edge of a lower cover of the main unit close to one end of a shielding platform. The lower assembly plates are provided with screw holes and positioning columns matching the positioning holes of the functional PCB boards. The lower convex bump is arranged on the upper surface of the bottom plate of the lower cover of the main unit, and the lower convex bump is provided with screw holes.

3. The fixing mechanism of a three-layer PCB host according to claim 2 is characterized in that: The middle-layer board assembly structure includes six middle assembly boards, each of which is provided with screw holes, wherein the first middle assembly board is arranged on the side 2 of the lower cover of the mainframe, the second and third middle assembly boards are arranged on the side 3 of the lower cover of the mainframe, the second and third middle assembly boards are both provided with positioning columns matching the positioning holes on the core PCB board, the fourth middle assembly board is arranged on the side 4 of the lower cover of the mainframe, the fifth middle assembly board is arranged at the other end of the side 1 of the lower cover of the mainframe and is provided with positioning columns matching the positioning holes on the core PCB board, and the sixth middle assembly board is arranged on the inner side of the shielding platform, the side 1 is opposite to the side 3, and the side 2 is opposite to the side 4.

4. The fixing mechanism of a three-layer PCB host according to claim 3 is characterized in that: The upper board assembly structure includes four upper assembly boards, each of which is provided with screw holes. The first assembly board is arranged on side two, the second and third assembly boards are respectively arranged at both ends of side board three and are provided with positioning columns, and the fourth assembly board is arranged on side four and is provided with positioning columns matching the positioning holes on the main PCB board.

5. The fixing mechanism of a three-layer PCB host according to claim 4 is characterized in that: There are several jacks on the side panel of the host, which match the external sockets on the functional PCB board, core PCB board and main PCB board. The minimum spacing between the jacks in the same row is 2mm. Positioning holes matching the positioning columns set on the side of the lower cover of the host are provided at both ends of the side panel.

6. A method for assembling a three-layer PCB host, characterized in that: The following steps are included: Step 1, assembly of functional PCB board; Step 2, assembly of core PCB board; Step 3, assembly of main PCB board; Step 4, assembly of side panels.

7. The method for assembling a three-layer PCB host according to claim 6, characterized in that: The specific contents of step 1 are as follows: The opening of the lower cover of the host is facing upwards, and the function PCB board is accurately positioned from top to bottom through its own positioning holes and the positioning columns on the lower assembly board, so that the function PCB board and the lower assembly board are fitted together, and finally screwed into the corresponding screw holes on the lower assembly board and the function PCB board to lock and fix the function PCB board and the lower assembly board.

8. The method for assembling a three-layer PCB host according to claim 7, characterized in that: The specific contents of step 2 are as follows: The core PCB board is accurately positioned from top to bottom through its own positioning holes and the positioning columns on the middle assembly board, and the core PCB board is fitted with the board surfaces of the six middle assembly boards. At this time, the floating socket on the back of the core PCB board is fully engaged with the floating socket on the functional PCB board, and the external socket on the back of the core PCB board is in the shielding platform. Then, screws are screwed into the corresponding screw holes on the middle assembly board and the core PCB board to lock and fix the core PCB and the middle assembly board.

9. The method for assembling a three-layer PCB host according to claim 8, characterized in that: The specific contents of step 3 are as follows: Step 3.1, accurately position the main PCB from top to bottom through its own positioning holes and the positioning columns of the upper assembly board, so that the main PCB board and the upper assembly board are fitted together. At this time, the floating socket on the back of the main PCB board is fitted with the floating socket of the core PCB board; Step 3.2: Position the upper cover of the host accurately from top to bottom through its own positioning holes and the positioning columns of the upper assembly plate, so as to assemble it with the lower cover of the host. Screw the screws into the upper cover of the host, the main PCB board and the upper assembly plate from top to bottom in sequence, so that the main PCB board is clamped between the lower cover of the host and the upper cover of the host and locked and fixed.

10. The method for assembling a three-layer PCB host according to claim 9, characterized in that: The specific contents of step 4 are as follows: Rotate the host lower cover 90° so that the external sockets of the three PCB boards face upwards, and accurately position the side panel from top to bottom through its own positioning holes and the corresponding positioning columns of the host lower cover, so that the side panel and the host lower cover are assembled, and the jacks of the side panel pass through the corresponding external sockets. Finally, tighten the side panel and the host lower cover with screws.

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