Measuring device based on combined optical 2D and 3D image acquisition method

Abstract

The invention relates to a measuring device based on a combined optical 2D and 3D image capturing method. A measuring device (100, 101, 102) also suitable for use in a manufacturing or detection system, comprising a light source (500) for emitting an illumination light beam (520) and a reference light beam (510) and comprising an objective lens (800) for directing measurement light (530) and reference light (510) onto a 2D image sensor (200) and a 3D image sensor (300), where the measuring device (100) is configured such that, when operating in a 2D imaging mode, the measurement light (530) and the reference light (510) are transmitted to the 2D image sensor (200) and the 3D image sensor (300). The intensity of the reference light (510) incident on the 2D image sensor (200) is substantially reduced.

Description

Technical Field

[0001] The present disclosure relates to a measuring device based on a combined optical 2D and 3D image acquisition method. The present disclosure also relates to a manufacturing system and a testing system respectively having such a measuring device. Background Art

[0002] Due to its non-contact and non-destructive measurement characteristics, various optical technologies for 3D image capture are used in industry.

[0003] Among them, online measurement methods are the preferred detection technology because the percentage of objects to be tested is large and remedial measures can be taken quickly when the system finds defects, for example in the form of flaws or deviations from target variables. Such remedial measures are, for example, the control of set variables such as the pressure during the dispensing of (epoxy) adhesives.

[0004] Some manufacturing systems, such as semiconductor assembly systems, require machine vision processing to achieve high throughput while achieving high component placement accuracy.

[0005] These techniques include point / profile measurements such as laser line triangulation, confocal scanning and imaging methods such as light field cameras, fringe projection, structured light projection or focus variation, as well as time-of-flight (TOF) cameras, white light interferometry and parallel optical coherence tomography (pOCT).

[0006] Point / profile measurements typically use lateral scanning to produce a height map of the desired area, but this can be too slow for inline measurement and suffers from reduced accuracy due to issues such as shadowing behind edges. The desired area is typically the optical field of view of the imaging optics.

[0007] In this context and throughout the disclosure, “inline” means “in the manufacturing process” and / or “integrated in a manufacturing system”.

[0008] Imaging methods can be used to directly measure a single area or detect a measured variable within a field of view or multiple fields of view. Different axial and lateral (transverse) resolutions can be used - in particular, the axial resolution can affect the accuracy of the height measurement. Light field cameras and time-of-flight cameras typically only provide an axial resolution of about 0.1 mm. Due to the coupling between axial and vertical resolution, focus changes with higher axial resolution may require relatively small working distances (a few millimeters or less). The so-called fringe projection method also requires a relatively large build volume, as a projector is required together with two tilted cameras for projection.

[0009] Imaging white light interferometry is suitable for axial resolutions in the sub-micron range, and high-speed smart pixel sensors are commercially available that can be configured to provide a height map of a 3D point cloud in about 300ms. However, the possible pixel count of such image sensors is about 280x292 or about 512x560, which severely limits their lateral resolution.

[0010] Detailed examples of such devices are known from US 2011 / 0317169 A1 or JP 2016-102713 A, which describe devices for recording interference fringe-free images of a measurement object. In addition, US 2003 / 0 197 871 A1 or US 9 719777 B1 both disclose methods for creating images without interference fringes but also without affecting the reference beam path.

[0011] Technical tasks

[0012] The object of the present invention is to provide a measuring device for online measurement, which can achieve high image resolution and measurement accuracy while having a fast measuring speed to achieve high throughput, and can be manufactured compactly while meeting these high requirements, so it can also be manufactured at low cost. Summary of the invention

[0013] As a solution, a measuring device is provided, comprising a light source for emitting an illumination beam and a reference beam, and an objective lens for directing the measuring light and the reference light to at least one 2D image sensor and at least one 3D imaging sensor, wherein the measuring device is configured to substantially reduce the intensity of the reference light projected onto the 2D image sensor when operating in a 2D image capture mode.

[0014] By using an optical system in which at least the above-mentioned optical components are suitable for both 2D and 3D image capture, all embodiments of the measuring device can use a smaller build volume. This has the advantage that the optical system can be accommodated in only one housing despite having multiple light paths for 2D and 3D image capture. Furthermore, a measuring device with a smaller build volume enables a more compact design of the manufacturing system or the inspection system. This has the advantage that the travel distances of the active axes of the respective system itself can be shortened, which in turn increases the productivity.

[0015] Mechanical interference factors, such as tolerance-related deviations or component offsets, are also reduced in this way, while design-induced offsets are reduced, which enables the sensor to provide optimally coordinated measurement results.

[0016] In addition, using the same light source and essentially the same optical components can not only simplify assembly or reduce component and manufacturing costs, but also has the positive effect of further coordinating the measurement results with each other by using the same optical properties (such as illumination or light intensity), which will also make the measurement results more comparable and repeatable.

[0017] Furthermore, the use of the same light source and essentially the same optical components enables faster switching between 2D and 3D image acquisition within a predeterminable time compared to conventional systems, which is extremely beneficial for in-line measurements.

[0018] The advantage is that it provides data for creating high-resolution images for image processing performed by the machine, which, in addition to the measurement accuracy that can be obtained therefrom, also enables high lateral and axial measurement speeds and high throughput, thereby achieving highly accurate and fast component placement, in which the measurement errors related to the design of the measuring device itself are minimized.

[0019] Throughout the disclosure, “in-line” means “in the manufacturing process” and / or “integrated in a manufacturing system”.

[0020] According to one aspect, the object of the present invention is achieved by a measuring device, the measuring device comprising a first image sensor for 2D image capture and a second image sensor for 3D image capture, wherein the measuring device is configured and arranged to be focused on a common area of ​​the object, wherein the measuring device comprises a light source, the light source being configured and arranged to emit an illumination beam to the common area during operation, and the light source being further configured and arranged to emit a reference beam to the second image sensor. In addition, the measuring device comprises an objective lens, the objective lens comprising at least one optical element, the optical element being arranged so that: during use, light that can be reflected by the common area enters the objective lens as light to be measured in the form of a measuring beam together with a reference beam of the light source. To this end, the objective lens is designed and arranged to guide and focus at least a portion of the measuring beam onto the first image sensor and the second image sensor, and to guide and focus at least a portion of the reference beam onto the second image sensor. In addition, the measuring device is designed and arranged to reduce the intensity of the reference beam received at the first image sensor relative to the intensity of the measuring beam when the measuring device operates in a 2D imaging mode.

[0021] The measuring device combines 2D imaging and 3D imaging in one optical system, using the same illumination optics and the same imaging optics.

[0022] Thus, the measuring device retains the advantages of optical measurement (e.g. non-contact and / or non-destructive measurement) and, in addition, in 2D image acquisition, image data with a relatively high lateral resolution (i.e. in the micrometer range and below) are acquired and provided, while in 3D image acquisition, image data with a relatively high axial resolution (i.e. in the micrometer range) are acquired and provided, preferably for creating a 3D height map.

[0023] By significantly suppressing the reference beam reaching the first image sensor during operation in the 2D image capture mode, the dynamic measurement range can be increased and the accuracy of the 2D image capture and the measurement results of the combined 2D and 3D image capture can be improved.

[0024] Furthermore, using the same optical system for 2D and 3D image acquisition allows for a smaller build volume, thus offering a wide range of integration possibilities in manufacturing systems. By reducing the number of required components, the average cost of such a measuring device can also be reduced.

[0025] Furthermore, the measuring device may be configured and arranged to quickly switch between the 2D image acquisition mode and the 3D image acquisition mode, which is extremely advantageous for online measurement due to time saving.

[0026] Embodiments of the measuring device include an image capture sensor designed specifically for 2D image capture or 3D image capture. Any suitable image sensor can be used for this purpose, as long as it can provide suitable data in 2D image capture mode or in 3D image capture mode. In some cases, it is possible to use an image sensor designed for 3D image capture in 2D image capture mode. It has proven to be particularly advantageous if the first image sensor is a 2D image sensor and the second image sensor is a 3D image sensor, or if the first image sensor is also a 3D image sensor but is designed and arranged to operate in 2D image capture mode.

[0027] An embodiment of the measuring device comprises a second imaging sensor adapted for imaging white light interferometry for creating a 3D height map with a relatively high axial resolution in 3D image acquisition.

[0028] An embodiment of the measuring device is further designed and arranged so that: when the measuring device is operated in a 3D image acquisition mode, a significant portion of the reference beam can be transmitted from the objective lens to the second imaging sensor, wherein the measuring device can further include a first light distributor, which is designed and arranged to receive the measuring beam from the objective lens.

[0029] Furthermore, such an embodiment of the measuring device can also be designed such that a first portion of the measuring beam can be directed onto the first image sensor and / or a second portion of the measuring beam can be directed onto the second image sensor.

[0030] It may be advantageous to provide a higher degree of shared optical elements for each optical path.

[0031] In particular, limited space may be provided for other actuators in the vicinity of the image sensors, so that it is possible to reduce the build volume of the measuring device when such sensors are not used.

[0032] Furthermore, by reducing the need for components that significantly change or severely interfere with the light path to the image sensor, measurement disturbances and / or settling times can be reduced, thereby enabling higher mode switching rates.

[0033] Furthermore, both the 3D image and the 2D image preferably record essentially the same common area, i.e., what is shown in the 3D image and the 2D image is a recording of the same optical field of view, with at most slight deviations of the field of view imaged on the image. This may be caused, for example, by a slight shift of the optical field of view during the recording process. This allows both a higher switching rate between the 2D image capture mode and the 3D image capture mode and an increase in the measurement accuracy, in particular for volume measurements, since no axial displacement, i.e. mechanical displacement along the system movement axis, occurs between the two image recordings.

[0034] Embodiments of the measuring device are further designed and arranged such that the intensity of the reference beam can be reduced along the optical path of the reference beam. The intensity reduction advantageously occurs between the objective and the light source, between the first or second light distributor and the imaging sensor, or the intensity reduction can be implemented in the light source.

[0035] By reducing the intensity near the reference beam source, a higher degree of shared optical elements can be provided for each optical path. In particular, the optical paths used for measurement in 2D image acquisition mode or in 3D image acquisition mode are substantially the same. This can further reduce measurement disturbances and / or settling times. As an additional or additional effect, this can provide a measurement device with a smaller construction volume.

[0036] This may be advantageous because the switching operation is simplified and the switching speed is increased, so that relatively fast measurements can be performed, for example, greater than or equal to 1 Hz, which is particularly advantageous for online measurements.

[0037] An embodiment of the measuring device includes a beam intensity reducer in the form of one or more of the following elements, namely one or more apertures, one or more shutters, one or more mechanical apertures, one or more mirrors, one or more dichroic mirrors, one or more dielectric mirrors, one or more prisms, one or more corner prisms, one or more beam splitters, one or more lens elements, one or more coatings, one or more optical filters, one or more compensation plates and / or any combination thereof, as one or more additional elements, which or the additional elements are designed and arranged to substantially reduce the intensity of the reference beam received by the first imaging sensor when operating in 2D image acquisition mode.

[0038] An embodiment of the measuring device comprises a first light distributor which is designed and arranged to receive the measuring beam from the objective and to direct a first part of the measuring beam onto the first image sensor and / or to direct a second part of the measuring beam onto the second image sensor.

[0039] In these embodiments of the measuring device, the first light distributor is preferably further designed and arranged such that: when operating in the 3D image capture mode, the reference beam can be received from the objective lens and at least a portion of the reference beam can be transmitted to the second image capture sensor.

[0040] In addition, in a preferred embodiment of the measuring device, the first light distributor may include one or more of the following elements: a mirror, a dichroic mirror, a dielectric mirror, a prism, a corner prism, a beam splitter, an optical element, a coating, an optical filter, a compensation plate and / or any combination thereof.

[0041] An embodiment of the measuring device further comprises an objective lens, which comprises one or more compound lenses, wherein the objective lens is preferably a telecentric objective lens with object-side, image-side or bilateral telecentricity.

[0042] Embodiments of the measurement device are preferably designed and arranged to provide one or more fields of view of a common area of ​​the object.

[0043] An embodiment of the measuring device further includes a second light distributor, which is designed and arranged so that: when operating in a 3D image capture mode, an incident light beam can be received from the light source, and at least a portion of the incident light beam can be directed onto the common area as an illumination beam, and at least a portion of the incident light can be directed onto the objective lens as a reference beam.

[0044] It may be advantageous to provide a higher degree of shared optical components for each optical path. This can reduce interference factors, especially during mode switching.

[0045] Embodiments of the measurement device are configured and arranged to operate in a 3D image acquisition mode, such as white light interferometry, optical coherence tomography (OCT), parallel optical coherence tomography (pOCT), or any combination thereof.

[0046] Due to the combination of optical 2D image capture and 3D image capture, all the above-mentioned embodiments and further possible embodiments of the measuring device make it possible to determine the volume of the surface distributed medium based on the measurement data obtained by lateral 2D image capture and by lateral and axial 3D image capture.

[0047] Due to the combination of optical 2D image capture and 3D image capture, all of the above-mentioned embodiments and further possible embodiments of the measuring device are capable of performing topological surface measurements and roughness measurements on larger or continuous surfaces based on the measurement data obtained by lateral 2D image capture and lateral and axial 3D image capture.

[0048] According to another aspect, a manufacturing system for sorting objects and / or for assembling objects on a substrate is provided, the manufacturing system comprising: an image capture system having one or more measuring devices; at least one assembly head each having at least one tool for releasably holding the object; a robot system for generating relative motion between the assembly head and the substrate; and an image capture system for capturing one or more common areas of the object to be captured.

[0049] According to another aspect, a detection system is provided, comprising an image capture system and a processor, wherein the image capture system has one or more measuring devices for capturing one or more fields of view of an object to be detected, and the processor is designed and arranged to derive one or more measurement values ​​of the object to be detected from the one or more fields of view. In addition, the processor can be used to determine whether there is a defect in the form of a flaw or deviation from a target variable in the object to be detected from the one or more measurement values.

[0050] These aspects are particularly designed to be an assembly system or inspection system including an implementation of the aforementioned measuring device, and their advantage lies in the use of a measuring device with a reduced construction volume and a higher switching speed, so that online measurement during the manufacturing process of components and / or assemblies can be used not only in the field of semiconductor devices, but also in the field of any type of components and / or assemblies.

[0051] For some situations where it is necessary to move an image acquisition system including one or more measuring devices, weight reduction due to a reduced number of components is also advantageous. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] Further advantages and features of the present invention can be derived from the following drawings and detailed description, namely:

[0053] Figure 1A is a schematic diagram of the structure of the measuring device in 2D image capture mode;

[0054] Figure 1B is a schematic diagram of the structure of the measuring device in 3D image capture mode;

[0055] Figure 2A A schematic diagram of a portion of the structure of the measuring device in a 2D image capture mode;

[0056] Figure 2B A schematic diagram of a portion of the structure of the measuring device in a 3D image capture mode;

[0057] Figure 3A A top view of the structure of the measuring device in a 2D image capture mode; and

[0058] Figure 3B A top view of the structure of the measuring device in 3D image capture mode. DETAILED DESCRIPTION

[0059] In the following detailed description, numerous non-limiting specific details are provided to facilitate understanding.

[0060] Figure 1A and Figure 1B The structure of one embodiment of a measuring device, which is here referred to as measuring device 100, is schematically shown in each case. Figure 1A Work in 2D image capture mode as shown, or Figure 1B The measuring device 100 is shown to be operating in a 3D image acquisition mode. The measuring device 100 is configured and arranged to focus on an object 900, for example an element, in order to generate a 2D image or a 3D image of a common area 950 of the object 900. The measuring device 100 comprises at least two light-sensitive elements, shown schematically, in the form of two image sensors 200, 300. The light-sensitive elements used as image sensors are preferably photodiode arrays or so-called "position sensitive devices", also known as PSD chips. It has also proven to be advantageous to use CCD photodetectors or CMOS photodetectors.

[0061] In an embodiment of the measuring device, the two image sensors are preferably of different designs, ie one imaging sensor is designed as a photodiode array or a so-called "position sensitive device" or PSD chip and the second image sensor is designed as a CCD photodetector or CMOS photodetector.

[0062] In embodiments of the measuring device, the two imaging sensors can also each be of the same type and each be designed as a photodiode array or a “position sensitive device” or PSD chip, or each be designed as a CCD photodetector or a CMOS photodetector.

[0063] Specifically, the measuring device 100 comprises a first image sensor 200 suitable for 2D image acquisition, for example a relatively high resolution black and white or color image sensor. Such an image sensor for 2D image acquisition is therefore also referred to as a 2D image sensor, allowing the measuring device to create an image based on data collected from a common area 950 of the object depth plane (Objekttiefenebene) that is in focus during measurement. Such an image sensor is also capable of lateral measurements, i.e. measurements across the field of view at an axial position along the axis of the illumination beam 520 or along the Z axis of a rectangular coordinate system, wherein the common area 950 is located in a plane defined by the X-axis and the Y-axis of the coordinate system. The field of view of the measuring device 100 is substantially perpendicular to the axis of the illumination beam 520, wherein test results have shown that small angular deviations of no more than 0.75° are permissible.

[0064] Furthermore, the measuring device 100 comprises a second image sensor 300 suitable for 3D image acquisition. Such an image sensor for 3D image acquisition, also referred to as a 3D image sensor, enables the measuring device to collect surface property data and to provide said data in the form of a 3D point cloud. For example, an image sensor comprising a plurality of pixels and capable of generating such a 3D point cloud with said pixels is suitable for this. The height information is generated, for example, from an image sequence based on white light interferometry, optical coherence tomography (OCT), parallel optical coherence tomography (pOCT) or any combination of the above techniques.

[0065] A suitable 3D image sensor preferably has a lateral resolution of at least 280x292 pixels, using a process detector with a clamped photodiode. The row and column spacing is preferably 40 micrometers (μm) or less, and the quantum efficiency η is ideally 20%-60% between 330nm and 400nm, preferably 60%-80% between 400nm and 720nm, and particularly preferably 60%-20% between 720nm and 900nm. Ideally, with a particularly suitable 3D image sensor 300, more than 1 million images per second can be captured and processed.

[0066] The measuring device 100 further comprises a light source 500, which is configured and arranged to emit an illumination beam 520 to the common area 950 during use. The illumination beam 520 is shown as a solid arrow. The light source 500 is preferably a low coherence light source 500, such as an LED. For example, an LED light source with a wavelength of 650nm and a bandwidth of + / -20nm. A low coherence light source refers to a light source whose spectral width (full width at half maximum (FWHM)) exceeds 1% of the average wavelength. The light source 500 is further configured and arranged to emit a reference beam 510 to the second image sensor 300. This is not shown in the figure. Figure 1A In the case where the measuring device 100 operates in the 2D image acquisition mode, the intensity of the reference beam 510 is greatly reduced. Figure 1B In FIG. 5 , the reference beam 510 is shown as a dashed arrow because the reference beam 510 is used when the measuring device 100 operates in the 3D image acquisition mode.

[0067] The measuring device 100 further comprises an objective lens 800, which comprises at least one optical element, preferably an imaging lens, which is arranged so that: during operation, the light reflected by the common area 950 as the measuring beam 530 and the reference beam 510 from the light source 500 enter the objective lens 800 together as the light 540. The objective lens 800 preferably comprises one or more compound lenses. In addition, the objective lens 800 can be a telecentric objective lens with object side, image side or bilateral telecentricity. Thereby, the change of magnification can be reduced with the change of the axial distance from the object in the vertical direction along the Z axis.

[0068] The lens 800 is configured and arranged to direct and focus at least a portion of the measuring beam 530 onto the first image sensor 200 and the second image sensor 300 ; and direct and focus at least a portion of the reference beam 510 onto the second image sensor 300 .

[0069] The measuring device 100 is further configured and arranged such that: Figure 1A When the measuring device is operated in the 2D image capture mode, the intensity of the reference beam 510 received at the first imaging sensor 200 is substantially reduced.

[0070] In such Figure 1B During operation in the illustrated 3D imaging mode, an illumination beam 520 (shown as a solid arrow) generated by the light source 500 is emitted toward the object 900 and focused on a common area 950 (not shown in FIG. 1 ). At least a portion of the illumination beam 520 is reflected by the common area 950, which is reflective or optically transparent in the light emitted from the light source 500.

[0071] After the measuring beam 530 is reflected by the object 900 , the reflected measuring beam 530 shown as a solid arrow enters the objective lens 800 , which guides and focuses the measuring beam 530 onto the second image sensor 300 .

[0072] Reference beam 510 (shown as a dotted arrow) generated by light source 500 is emitted toward objective lens 800 , which guides and focuses reference beam 510 onto second image sensor 300 .

[0073] The second image sensor 300 is configured and arranged to receive the measuring beam 530 and the reference beam 510 from the objective lens 800 and combine the measuring beam 530 and the reference beam 510 on the second image sensor 300 .

[0074] Figure 1A The structure shown in FIG. 1 is operated in 2D image acquisition mode. Figure 1B The structure shown in the 3D image capture mode is the same except for the first image sensor 200. The first image sensor 200 is Figure 1A is configured and arranged to replace Figure 1B The measuring device 100 receives the measuring beam 530 and the reference beam 510 from the objective lens 800 by using the second image sensor 300 in the measuring device 100. As shown in the schematic diagram, the measuring device 100 is configured and arranged so that the first image sensor 200 and the outgoing beam of the objective lens 800 are arranged in a line. For example, the first image sensor 200 and the second image sensor 300 may be included in a suitably configured linear exchange head (Austauschkopf), a suitably configured rotating drum or the like. The measuring device 100 is further configured and arranged so that the intensity of the reference beam 510 received at the first image sensor 200 is substantially reduced.

[0075] For the purposes of this and all other embodiments, “substantially reduced” means that the intensity of reference beam 510 received at first image sensor 200 is reduced by at least 80%, or preferably by at least 90%, or even by 95%, and particularly preferably by at least 98% to 99%, compared to the reference beam 510 reaching second image sensor 300 in 3D image capture mode, or that reference beam 510 may be eliminated.

[0076] Such reduction is preferably achieved by one or more software controls that change one or more operating parameters of the light source 500 accordingly.

[0077] However, such reduction may also be preferably achieved by a beam intensity reducer 700 or a plurality of mechanical beam intensity reducing elements that block at least a portion of the reference beam 510 between the light source 500 and the first image sensor 200, such as a shutter and / or an aperture and / or a mechanical aperture and / or a mirror and / or a dichroic mirror and / or a dielectric mirror and / or a prism and / or a corner prism and / or a beam splitter and / or a lens element and / or a coating and / or an optical filter and / or a compensation plate. One skilled in the art may also consider using one or more optical elements that direct at least a portion of the reference beam 510 away from its optical path for 3D image capture between the light source 500 and the first image capture sensor 200, such as a mirror, a dichroic mirror, a dielectric mirror, a prism, a corner prism or a beam splitter. One skilled in the art may also consider using one or more optical elements, such as lens elements, coatings, optical filters or compensation plates, and / or any combination thereof, that change one or more optical properties of at least a portion of reference beam 510 between light source 500 and first image sensor 200. For example, beam intensity reducer 700 may be modified to be highly optically absorptive to light emitted from light source 500.

[0078] In this embodiment, the above-mentioned means for substantially reducing the intensity may be included in the first image sensor 200, may be arranged between the first image sensor 200 and the objective lens 800, may be included in the objective lens 800, may be arranged between the objective lens 800 and the light source 500, may be included in the light source 500, or any combination thereof.

[0079] Preferably, the above means are mainly arranged along the optical path between the objective lens 800 and the light source 500 and / or included in the light source 500, because this can increase the proportion of the common optical path used for both the 2D image acquisition mode and the 3D image acquisition mode. This can achieve a high degree of component integration, thereby reducing the construction volume of the measuring device 101. Finally, the manufacturing cost can be reduced due to the reduction in the number of components.

[0080] One of the discoveries upon which the present invention is based is that many conventional measurement devices for 2D image capture or 3D image capture are capable of directing a significant portion of a reference beam to or incident on a 2D image sensor. The inventors have recognized that in some configurations this can increase the overall intensity of light incident on the 2D image sensor, resulting in an offset in the measurement that effectively reduces the dynamic range when measuring in 2D image capture mode. In some configurations, as an additional or alternative effect, this interference from the reference beam can perturb the image and affect the measurement results, particularly the accuracy of the measurement. By significantly suppressing the reference beam 510 reaching the first image sensor 200 during 2D image capture, the dynamic range and accuracy of 2D image capture, as well as the dynamic range and accuracy of the results of combined 2D image capture and 3D image capture, can be improved.

[0081] Furthermore, the measuring device 100 may be configured and arranged to be able to quickly switch between the 2D image acquisition mode and the 3D image acquisition mode, which is extremely beneficial for online measurement.

[0082] The measuring device 100 is also configured and arranged to image multiple axial positions during 3D image acquisition (also called axial scanning or Z scanning). This can be achieved, for example, by axially moving the object 900 towards and / or away from the exit of the measuring device 100. This can also be achieved, for example, by moving one or more optical elements that intersect at least a portion of the reference beam 510, at least a portion of the illumination beam 520, at least a portion of the measurement beam 530, or any combination thereof. This can also be achieved, for example, by changing one or more optical properties of elements that intersect at least a portion of the reference beam 510, at least a portion of the illumination beam 520, at least a portion of the measurement beam 530, or any combination thereof. This can also be achieved, for example, by any combination of the following measures: axial movement and / or movement and / or change.

[0083] During the axial scan or Z scan, images are continuously captured by the 3D (second) image sensor 300 .

[0084] During 2D image acquisition, one or more images may be acquired at a fixed axial position using the 2D (first) image sensor 200. Thus, the acquired image of the common area 950 is determined by the nominal focused field of view and the adjacent axial positions that are also focused based on the depth of field (DOF) of the measurement device 100.

[0085] Preferably, the device is configured and arranged to perform 3D image acquisition by parallel optical coherence tomography (pOCT). pOCT is based on imaging white light interferometry and typically provides sub-micron axial resolution. As described below, the light beam emitted from the light source 500 is preferably divided into an illumination beam 520 and a reference beam 510. After the measurement beam 530 is reflected on the object 900, the reflected measurement beam 530 and the reference beam 510 are incident on the second image sensor 300 together. The surface topology causes the optical path of the common area 950 to have different lengths, and the flight time difference of each single light caused thereby is measured, which modulates the interference signal on the second image sensor 300 and is resolved laterally by the sensor pixels.

[0086] The height map of the common area 950 can then be derived from this light flight time difference. Each pixel provides a modulated signal with a decaying envelope curve - the signal is maximum when the length of the optical path and the resulting flight time difference of the reference beam 510 and the sample beam (illumination beam 520 + measurement beam 530) are equal. The height of the relevant common area 950 can thus be determined.

[0087] For example, a camera device based on a smart pixel sensor can record a series of images at a frequency of kHz at multiple axial positions and process them with the aid of embedded electronics. A 3D height map is then available within approximately 300 ms. In contrast to conventional point / profile measurements, time-consuming lateral sweeps (so-called scanning) are not required. The lateral resolution of a smart pixel sensor is usually limited to around 280x292 pixels, which can be at least partially compensated by combined measurements with a high lateral resolution, for example by a 12 megapixel 2D image sensor with, for example, 3000x4000 pixels.

[0088] For more details on the pOCT-based measurement process, see “Parallele Optische (pOCT) for 3D-Inspektion in industry (Parallel optical coherence tomography (pOCT) for 3D industrial inspection)", Patrick Lambelet, "Optische Messsysteme for 3D industrial inspection VII (Optical measurement systems for industrial inspection VII)", Proc. of SPIEVol. 8082, 80820X (2011), doi: 10.1117 / 12.889390.

[0089] For an example of a measurement device configured and arranged for dynamic focus imaging by parallel optical coherence tomography, see US patent application US2008 / 0024767 A1. Specifically, Figures 3, 4 and 5 together with the corresponding parts of the specification describe examples of additional embodiments using pOCT.

[0090] Figure 2A and Figure 2B Schematically shows a part of another embodiment of a measuring device as a measuring device 101, which operates in a 2D image acquisition mode or a 3D image acquisition mode. The components of the measuring device 101 shown in these figures include a first image sensor 200, a second image sensor 300 and a proximal part of an objective lens 800. Figure 1A and Figure 1B The embodiment shown is the same except that the first image sensor 200 and the second image sensor 300 are arranged at substantially fixed positions relative to the outgoing light beam of the objective lens 800. In other words, when the measuring device 101 switches between the 2D image acquisition mode and the 3D image acquisition mode, the arrangement of the first image sensor 200 and the second image sensor 300 does not change significantly.

[0091] A first light distributor 600 is further provided in the measuring device 101 , which is configured and arranged to receive the measuring light beam 530 from the objective lens 800 , to direct a first portion 530 a of the measuring light beam 530 onto the first image sensor 200 , and to direct a second portion 530 b of the measuring light beam 530 onto the second image sensor 300 .

[0092] Furthermore, the first optical distributor 600 is configured and arranged to receive the reference beam 510 from the objective lens 800 and allow at least a noticeable portion 510 b of the reference beam 510 to be transmitted to the second image sensor 300 .

[0093] The first light distributor 600 may be composed of one or more of the following elements: a mirror, a dichroic mirror, a dielectric mirror, a prism, a corner prism, a beam splitter, an optical element, a coating, an optical filter, a compensation plate, and / or any combination thereof. The light beam is preferably divided into the first part 510a and the second part 510b or the first part 530a and the second part 530b with an intensity ratio close to 50:50 to optimize the measurement beam 530 reaching both the 2D image sensor and the 3D image sensor.

[0094] However, in some configurations, it may be advantageous if the light distributor used allows the intensity ratio of the first part 510a or 530a to the second part 510b or 530b to be 40 to 60, 30 to 70, 20 to 80 or 10 to 90. In this case, for standard applications, e.g. with oxide-coated and therefore barely reflective components as the measurement object, a significant portion of the second part 510b is to be understood as more than 50%, while in special system designs, e.g. with reflective components as the measurement object of the reference beam 510 striking the first light distributor 600, in particular in 3D image acquisition mode, a significant portion of the second part 510b is to be understood as approximately 10%.

[0095] If no additional illumination is used in addition to the low coherence light source 500, the first light distributor 600 preferably comprises a beam splitter. If an additional illumination source is used, such as a ring light source emitting light in a different spectral range than the low coherence light source 500, the first light distributor 600 preferably comprises a dichroic mirror.

[0096] In 3D image capture mode, refer to the above Figure 2B During operation in the manner described, an illumination beam is generated and as described above with reference to Figure 1B It is reflected in the described manner to the objective lens 800 . The returning measuring beam 530 (shown as a solid arrow) is focused on the first image sensor 200 and the second image sensor 300 .

[0097] In addition, a reference beam 510 is generated and referred to above. Figure 1B The reference beam is emitted toward objective lens 800 in the manner described. Emitted reference beam 510 (shown as a dashed arrow) is focused on first image sensor 200 and second image sensor 300. First light distributor 600 divides measurement beam 530 into first portion 530a and second portion 530b. First light distributor 600 also divides reference beam 510 into first portion 510a and second portion 510b. Second image sensor 300 is configured and arranged to receive second portion 530b of measurement beam 530 and second portion 510b of reference beam 510 from objective lens 800, and to receive the measurement beam 530 from first portion 530a and second portion 510b of reference beam 510 as described above. Figure 1B The described manner combines second portion 530b of measuring beam 530 and second portion 510b of reference beam 510 on second image sensor 300. First image sensor 200 is configured and arranged to receive first portion 530a of measuring beam 530. First light distributor 600 also allows first portion 510a of reference beam 510 to be transmitted from objective lens 800 to first image sensor 200. This is a result of using first light distributor 600, which divides the incident light into two portions.

[0098] like Figure 2AThe operation in the 2D image capture mode shown is similar to that in Figure 2B The operation in the 3D image capture mode shown is the same, except that the measuring device 101 is configured and arranged to reduce the intensity of the first portion 510a of the reference beam 510 received at the first image sensor 200, so that a substantial reduction of at least 80% can be achieved compared to the first portion 510a of the reference beam 510 reaching the first image sensor 200 in the 3D image capture mode. In particular, a reduction of at least 90%, more preferably a reduction of 95%. This can be seen from the above reference Figure 1A The described method is implemented.

[0099] In such an embodiment of the measuring device, the operating principle of substantially reducing the intensity of the reference beam 510 may be applied in the manner described above with reference to FIG. 1 . Figure 2A and Figure 2B The embodiments of the measuring device 101 respectively illustrated in the figures allow a beam intensity reducer or a plurality of beam intensity reducing elements to be arranged at one or more positions, for example, between the first image sensor 200 and the first optical distributor 600, in the first optical distributor 600, between the first optical distributor 600 and the objective lens 800, and between the objective lens 800 and the second optical distributor 650 (not shown), or at any position along the optical path of the reference beam 510 before the reference beam 510 enters the objective lens 800, wherein when a plurality of beam intensity reducing elements are present, such beam intensity reducing elements may be arranged at all of the above-mentioned positions or only at a portion of the above-mentioned positions.

[0100] As described above with reference to FIG. 1 , the implementation means for substantial reduction is preferably mainly disposed between the objective lens 800 and the light source 500 and / or embedded in the light source 500. In particular, for the embodiment of FIG. 2 , when the measuring device 101 switches between the 2D image capture mode and the 3D image capture mode, the optical path from the common area 950 to the first image sensor 200 and the second image sensor 300 does not substantially change or is substantially disturbed. In this way, in the 2D image capture mode and the 3D imaging mode, substantially the same field of view is imaged, and switching between the two modes is allowed at a relatively high speed, for example, greater than or equal to 1 Hz, which is particularly advantageous for online measurement.

[0101] Figure 3A and Figure 3B A top view of an embodiment of a measuring device as a measuring device 102 is shown, which operates in a 2D image acquisition mode or a 3D image acquisition mode. This embodiment 102 is similar to Figure 2A and Figure 2BThe embodiment of the measuring device shown is different in that the light emitted from the light source 500 first passes through an optional collimator 850, which includes at least one optical element. The collimator 850 is configured and arranged to provide an approximately parallel beam 505 from the light source 500. In some configurations, if the light emitted from the light source 500 is sufficiently parallel, the collimator can be omitted. Then, the approximately parallel beam 505 passes through a focusing lens 860 including at least one optical element. The focusing lens 860 is configured and arranged to focus the approximately parallel beam 505 onto a common area 950 of the object 900. As shown in the figure, the optional first beam deflector 400 is used to direct the focused parallel beam 505 to the second light distributor 650. In general, one or more beam deflectors (e.g., one or more mirrors) can be used to provide a suitable optical path and / or a suitable component orientation. The second light distributor 650 is configured and arranged to receive the focused parallel beam 505 and split it into a reference beam 510 shown as a dashed arrow and an illumination beam 520 shown as a solid arrow. In other words, the second optical distributor 650 directs at least a portion of the incident light 505 to illuminate the common area 950 , and the second optical distributor 650 directs at least another portion of the incident light 505 into the optical path of the reference beam 510 , which will subsequently enter the objective lens 800 .

[0102] The second optical splitter 650 may include one or more of the following elements: a mirror, a dichroic mirror, a dielectric mirror, a prism, a corner prism, a beam splitter, an optical element, a coating, an optical filter, a compensation plate, and any combination thereof. The light beam 505 is preferably split into the reference beam 510 and the illumination beam 520 with an intensity ratio close to 50:50 to optimize the interferometric measurement beam reaching the 3D image sensor 300. However, in some configurations, it may be advantageous to use an optical splitter that provides an intensity ratio of 40:60, 30:70, 20:80, or 10:90.

[0103] The second light distributor 650 is further configured and arranged such that the illumination light beam 520 is directed through the opening into or onto the common area 950 of the object 900. Additionally or alternatively, the illumination light beam 520 may be directed using one or more beam deflectors.

[0104] The second optical distributor 650 is further configured and arranged to direct the reference beam 510 to a reference mirror 420 for the reference beam 510, which is disposed inside the device 102. Additionally or alternatively, the reference beam 510 may be directed using one or more beam deflectors.

[0105] As shown, an optional second beam deflector 410 is used to direct the reference beam 510 onto a reference mirror 420. In general, one or more beam deflectors (eg, one or more mirrors) may be used to provide a suitable optical path and / or suitable component orientation.

[0106] The reference mirror 420 is configured and arranged to reflect the reference beam 510 back to the second optical distributor 650. As a supplement, one or more beam deflectors may be used to deflect the reference beam 510. As shown, the optional second beam deflector 410 is also used to direct the reference beam 510 back to the second optical distributor 650.

[0107] The reference mirror 420 is further configured and arranged to be axially movable during 3D image capture so that the optical path length from the second light distributor to the focal plane of the common area 950 is substantially equal to the optical path length from the second light distributor 650 to the reference mirror 420 .

[0108] This embodiment of the measurement device 102 includes a beam intensity reducer 700, such as an aperture, a shutter, a mechanical aperture, a mirror, a dichroic mirror, a dielectric mirror, a prism, a corner prism, a beam splitter, a lens element, a coating, an optical filter, a compensation plate, and / or any combination thereof, which is configured and arranged to substantially reduce the intensity of the reference beam 510. Figure 3A As shown, during 2D measurement, the beam intensity reducer 700 can be placed in the optical path of the reference beam 510 and directly in front of the reference mirror 420 to reduce or prevent reflection from the reference mirror 420 back to the second light distributor 650. The beam intensity reducer 700 preferably has a high degree of optical absorption for the light emitted from the light source 500. Figure 3B As shown, during 3D image capture, the beam intensity reducer 700 may be placed outside the optical path of the reference beam 510 so as to achieve reflection from the reference mirror 420 back to the second light distributor 650 .

[0109] The beam intensity reducer 700 may be included in, for example, a linear actuator, a rotatable actuator (such as Figure 3A and Figure 3B ), a rotating drum or any combination thereof.

[0110] The second optical distributor 650 is further configured and arranged to guide the reference beam 510 reflected from the reference mirror 420 into the objective lens 800. The second optical distributor 650 is also configured and arranged to guide the measurement beam 530 reflected from the common area 950 into the objective lens 800. Optionally, the second optical distributor 650 may be further configured and arranged to combine the reference beam 510 reflected from the reference mirror 420 and the measurement beam 530 reflected from the common area 950.

[0111] In such Figure 3B During operation in the illustrated 3D image capture mode, light emitted from the light source 500 is collimated by an optional collimator 850, preferably in the form of a lens, to provide a substantially parallel light beam 505. A focusing lens 860 focuses the substantially parallel light beam 505 onto a common region 950. After passing through the focusing lens 860, the substantially parallel light beam 505 is directed by the first beam deflector 400 onto the second light distributor 650.

[0112] In this exemplary embodiment of the measuring device 102, the second light distributor 650 divides the approximately parallel light beam 505 into an illumination beam 520 and a reference beam 510, and directs the illumination beam to the common area 950 of the object, and directs the reference beam to the reference mirror 420 using the second beam deflector 410. The focused illumination beam 520 is reflected back to the second light distributor 650 by the common area 950 as the measuring beam 530. An additional illumination source 570, such as one or more ring lights, may be provided for the object. The reference beam 510 (shown as a dashed arrow) is directed by the second beam deflector 410 to the reference mirror 420, where it is reflected back to the second light distributor 650 by the second beam deflector 410. The beam intensity reducer 700 is shown in an on state so that the reference beam 510 does not substantially intersect the reference beam when it approaches the reference mirror 420 or is reflected to the second light distributor 650.

[0113] The axial position of the reference mirror 420 is predetermined and / or controlled such that, during 3D image capture, the optical path length from the second light distributor to the focal plane of the common area 950 is substantially equal to the optical path length from the second light distributor 650 to the reference mirror 420. Furthermore, during axial or vertical scanning, additional axial movement of the reference mirror 420 may be required to keep the lengths of the optical paths substantially equal.

[0114] In this exemplary embodiment of the measuring device 102, the second light distributor 650 combines the reference beam 510 and the returned measuring beam 530 reflected by the reference mirror 420. The combined beam is directed to the objective lens 800. The combined returned measuring beam 530 (shown as a solid arrow) and the reference beam 510 (shown as a dotted arrow) are focused and directed by the objective lens 800 and the first light distributor 600 to the first imaging sensor 200 and the second imaging sensor 300, as described above with reference to FIG. Figure 2B described.

[0115] like Figure 3A The operation in the 2D image capture mode shown is similar to that in Figure 3BThe operation in the 3D image capture mode shown is the same, except that the beam intensity reducer 700 enters its off state, thereby significantly reducing the intensity of the first portion 510a of the reference beam 510 received at the first imaging sensor 200. In particular, the intensity of the reference beam 510 reaching the reference mirror 420 is significantly reduced, and thus the intensity of the reference beam 510 reflected back to the second light distributor 650 is also significantly reduced.

[0116] Therefore, the light incident on first image sensor 200 and second image sensor 300 includes measuring beam 530 substantially the same as in the 3D image capture mode and at least substantially reduced reference beam 510. The intensity of reference beam 510 is preferably reduced to a level that does not substantially affect 2D image capture at first image sensor 200, and is further preferably reduced to a level that the reference beam is substantially unrecognizable at first image sensor 200. The term "non-substantial" herein means that the intensity of reduced reference beam 510 is lower than an intensity value preset for the image sensor as required.

[0117] This specification should not be construed as prescribing a fixed order in which the method steps described therein may be performed. Rather, the method steps may be performed in any practicable order. Likewise, the foregoing examples are provided to explain the algorithms, and are not intended to illustrate the only implementation of such algorithms. A person of ordinary skill in the relevant art will be able to conceive of many different ways to implement the same operation provided by the foregoing embodiments.

[0118] As an alternative, Figure 2A and Figure 2B The first light distributor 600 of the illustrated measuring device 101 may include, for example, a movable and / or rotatable mirror. In this case, the measuring device 101 may be configured and arranged to use the first light distributor 600 in a first and second arrangement and / or rotation corresponding to the orientation of directing light to the first image sensor 200 and the second image sensor 300. For example, the first light distributor 600 may include a suitably configured linear actuator, a rotary actuator, or the like.

[0119] For example, Figure 3A and Figure 3B The first light distributor 600 of the illustrated measuring device 102 may also adopt the above solution, that is, as an alternative, it may include a movable and / or rotatable mirror. In this case, the measuring device 102 may be configured and arranged to use the first light distributor 600 in the first and second layouts and / or rotations, which correspond to the orientations for directing light to the first image sensor 200 and the second image sensor 300. For example, the first light distributor 600 may include a suitably configured linear actuator, a rotary actuator, or the like.

[0120] For example, the second image sensor 300 is Figure 3A and Figure 3B As an alternative, the first light distributor 600 may be designed and arranged such that: the second image sensor 300 is shown in the top view as being installed behind, above, or at a lateral arrangement position of the first light distributor 600 (for example, Figure 3A and Figure 3B In this case, it is the right side).

[0121] For example, to correct to some extent the low reflectivity of the common area 950, the intensity of the reference beam 510 may be reduced when operating in the 3D image capture mode by modifying one or more of the measures implemented to substantially reduce the intensity during the 2D image capture mode. For example, a neutral density filter may be provided at an appropriate location on the optical path of the reference beam 510.

[0122] The present implementation of the measuring device 100 , 101 , 102 according to the aforementioned embodiments enables a relatively high measurement throughput in a relatively small build volume.

[0123] Preferably, the present implementation of the measuring devices 100 , 101 , 102 according to the aforementioned embodiments may be a part of an image acquisition system used in online manufacturing.

[0124] Such an image capture system is typically used in a manufacturing system for mounting an object 900 in the form of a component onto a substrate. Such a manufacturing system comprises a mounting head having at least one tool (e.g., a nozzle) which can preferably be vacuumed to grasp and / or releasably hold the object 900.

[0125] The manufacturing system further includes a robot system for moving the assembly head relative to the pick-up position of the object 900 and the substrate so as to pick up the object at the pick-up position with a picker and place the object picked up by the picker on the substrate.

[0126] In such a manufacturing system, the image capture system is preferably arranged to capture at least one image of the assembly position of the object 900 on the substrate, or to capture an image of the surface of the object 900, or to capture an image of any other common area 950 within one or more fields of view, wherein the image capture system includes one or more measuring devices 100, 101, 102 according to the aforementioned embodiments.

[0127] Therefore, the current embodiment of the measuring devices 100, 101, 102 disclosed above can also preferably be a part of the image capture system used for online detection. Such an image capture system is generally used in a detection system to capture one or more fields of view of the object to be detected 900 or one or more fields of view of the substrate to be detected. In such a detection system, the image capture system generally includes one or more measuring devices 100, 101, 102 and a processor, which is designed and arranged to obtain and / or derive one or more measurement values ​​from one or more fields of view of the object to be detected 900 or the substrate to be detected from the collected data. The processor is further designed to determine whether the object to be detected 900 or the substrate to be detected has defects in the form of defects or deviations from the target value based on the one or more measurement values, so as to also perform surface analysis on the substrate or object. Such defects may be, for example, surface damage in the form of cracks, scratches or defects, as well as damaged or misplaced components.

[0128] The present invention has been described above in conjunction with certain exemplary embodiments, but it should be understood that various modifications, substitutions and changes that are obvious to those of ordinary skill in the relevant art may be made to the disclosed embodiments without departing from the spirit and scope of the present invention as defined in the appended patent claims.

[0129]

Explanation of symbols

[0130] 100: Implementation of the measuring device

[0131] 101: Implementation of the measuring device

[0132] 102: Implementation of the measuring device

[0133] 200: First imaging sensor for 2D measurement

[0134] 300: Second imaging sensor for 3D measurement

[0135] 400: first beam deflector

[0136] 410: Second beam deflector

[0137] 420: Reference mirror

[0138] 500: Light source

[0139] 505: Approximately parallel beams emitted from a light source

[0140] 510: Reference beam

[0141] 510a: first part of the beam

[0142] 510b: The second part of the beam

[0143] 520: Illumination beam

[0144] 530: Measurement beam

[0145] 530a: The first part of the beam

[0146] 530b: Second part of the beam

[0147] 570: Lighting source

[0148] 600: first optical distributor

[0149] 650: Second optical distributor

[0150] 700: Beam Intensity Reducer

[0151] 800:Objective lens

[0152] 850: Collimator

[0153] 860: Focusing lens

[0154] 900: Objects in component form

[0155] 950: Common area of ​​object

Claims

1. A measuring device (100, 101, 102), comprising a first imaging sensor (200) for 2D imaging and a second imaging sensor (300) for 3D imaging, wherein the measuring device (100, 101, 102) is configured and arranged to be focusable on a common area (950) of an object (900), wherein the measuring device (100, 101, 102) further include: a light source (500) configured and arranged to emit an illumination beam (520) toward the common area (950) during operation, and the light source (500) is further configured and arranged to emit a reference beam (510) toward the second imaging sensor (300); An objective lens (800) comprising at least one optical element, the optical element being arranged such that: during use, light reflected by the common area (950) as a measuring beam (530) enters the objective lens (800) together with a reference beam (510) of the light source (500), wherein the objective lens (800) is further designed and arranged to: directing and focusing at least a first portion (530a) of the measuring beam (530) onto the first imaging sensor (200); and / or directing and focusing at least a second portion (530b) of the measuring beam (530) and a second portion (510b) of the reference beam (510) onto the second imaging sensor (300); Furthermore, the measuring device (100, 101, 102) is designed and arranged to reduce or eliminate the intensity of the first part (510a) of the reference beam (510) that can be received at the first imaging sensor (200) relative to the intensity of the measuring beam (530) when the measuring device (100, 101, 102) operates in a 2D imaging mode.

2. The measuring device (100, 101, 102) of claim 1, wherein the first imaging sensor (200) is a 2D imaging sensor and the second imaging sensor (300) is a 3D imaging sensor.

3. The measuring device (100, 101, 102) of claim 1, wherein the first imaging sensor (200) is a 3D imaging sensor and the second imaging sensor (300) is a 3D imaging sensor, wherein the imaging sensor (200) is designed and arranged so that the imaging sensor (200) can operate in a 2D imaging mode.

4. A measuring device (100, 101, 102) as described in any of the preceding claims, further designed and arranged to allow at least a second portion (510b) of the reference beam (510) to be transmitted from the objective lens (800) to the second imaging sensor (300) when the measuring device (100, 101, 102) operates in a 3D imaging mode.

5. A measuring device (100, 101, 102) as claimed in any of the preceding claims, wherein the measuring device (100, 101, 102) is designed and arranged so that the intensity of the reference beam (510) can be reduced along the optical path of the reference beam (510), preferably between the objective lens (800) and the light source (500).

6. A measuring device (100, 101, 102) as described in any of the preceding claims 1 to 4, wherein the measuring device (100, 101, 102) is designed and arranged so that the intensity of the reference beam (510) can be reduced in the light source (500).

7. A measuring device (100, 101, 102) as claimed in any of the preceding claims, wherein the measuring device (100, 101, 102) comprises a beam intensity reducer (700) in the form of one or more of the following elements, namely an aperture, a shutter, a mechanical aperture, a mirror, a dichroic mirror, a dielectric mirror, a prism, a corner prism, a beam splitter, a lens element, a coating, an optical filter, a compensation plate or any combination thereof, the beam intensity reducer being designed and arranged to reduce the intensity of the first part (510a) of the reference beam (510) received by the first imaging sensor (200) when operating in the 2D imaging mode.

8. A measuring device (100, 101, 102) as claimed in any one of the preceding claims, wherein the measuring device (100, 101, 102) further comprises a first light distributor (600), which is designed and arranged to receive the measuring light beam (530) from the objective lens (800) and to guide a first part (530a) of the measuring light beam (530) to the first imaging sensor (200) and / or to guide a second part (530b) of the measuring light beam (530) to the second imaging sensor (300).

9. The measuring device (100, 101, 102) of claim 7, wherein the first light distributor (600) is further designed and arranged so that: when operating in a 3D imaging mode, the reference beam (510) can be received from the objective lens (800), and at least a second portion (510b) of the reference beam (510) can be transmitted to the second imaging sensor (300).

10. The measuring device (100, 101, 102) of claim 7 or claim 8, wherein the first light distributor (600) comprises one or more of the following elements: a mirror, a dichroic mirror, a dielectric mirror, a prism, a corner prism, a beam splitter, an optical element, a coating, an optical filter, a compensation plate and / or any combination thereof.

11. The measuring device (100, 101, 102) according to any of the preceding claims, wherein the objective (800) comprises one or more compound lenses.

12. The measuring device (100, 101, 102) according to any one of the preceding claims, wherein the objective (800) is a telecentric objective.

13. The measuring device (100, 101, 102) as claimed in any one of the preceding claims, wherein the measuring device (100, 101, 102) is designed and arranged to provide one or more fields of view of a common area (950) of the object (900).

14. A measuring device (100, 101, 102) as claimed in any one of the preceding claims, wherein the measuring device (100, 101, 102) further comprises a second light distributor (650), which is designed and arranged so that: when operating in a 3D imaging mode, an incident light beam (505) can be received from the light source (500), and at least a portion of the incident light beam (505) can be directed to the common area (950) as an illumination light beam (520), and at least a portion of the incident light (505) can be directed to the objective lens (800) as a reference light beam (510).

15. A measuring device (100, 101, 102) as described in any of the preceding claims, wherein the measuring device (100, 101, 102) is configured and arranged to be operable in a 3D imaging mode, such as white light interferometry, optical coherence tomography (OCT), parallel optical coherence tomography (pOCT) or any combination thereof.

16. A manufacturing system for sorting objects (900) and / or for assembling objects (900) on a substrate, wherein the manufacturing system include: at least one assembly head each having at least one tool for releasably holding the object (900); A robot system for causing the assembly head to perform relative movement between a pickup position of the object (900) and the substrate; and An image capture system is provided for capturing one or more common areas (950) of the object to be captured (900), wherein the image capture system comprises one or more measuring devices (100, 101, 102) as claimed in any one of claims 1 to 13.

17. A detection system, include: An image capture system for capturing one or more fields of view of an object to be detected (900); as well as a processor, designed and arranged to derive one or more measurements of the object to be inspected (900) from the one or more fields of view, wherein the processor is operable to determine from the one or more measurements whether the object to be inspected (900) has a defect in the form of a flaw or deviation from a target variable, The image acquisition system comprises one or more measuring devices (100, 101, 102) as claimed in any one of claims 1 to 14.

Images