LED chip automatic packaging structure

Abstract

The invention provides an LED chip automatic packaging structure, and belongs to the field of chip packaging, and the LED chip automatic packaging structure comprises a case which is internally provided with a dispensing cavity; a conveying plate is arranged at the bottom of the dispensing cavity through a conveying structure, a movable lifting structure is arranged at the top of the dispensing cavity, and a connecting frame is arranged on the movable lifting structure; the base plate dispensing assembly comprises a guide frame fixedly connected to the bottom of the connecting frame, rotating shafts are rotationally connected to the guide frame and are symmetrically distributed front and back, belt wheels are fixedly connected to the outer upper sides of the rotating shafts, and the same belt is arranged on the outer sides of the two belt wheels in a tensioning mode; and the outer lower sides of the two rotating shafts are fixedly connected with positioning plates. According to the invention, through the arrangement of the substrate dispensing assembly and the chip dispensing assembly, synchronous dispensing can be carried out on the substrate and the chip at the same time, the time occupied by the dispensing procedure in the automatic packaging process of the LED chip is shortened, the packaging speed is increased, and the packaging efficiency is improved.

Description

Technical Field

[0001] The invention relates to the technical field of chip packaging, in particular to an automatic packaging structure for LED chips. Background Art

[0002] LED chip is a solid-state semiconductor device, which is the core component of LED lamps. It mainly converts electrical energy into light energy. The heart of LED is a semiconductor wafer, one end of which is the negative pole, and the other end is connected to the positive pole of the power supply. The entire wafer is encapsulated by resin. The encapsulation process of LED chips mainly includes three methods: dispensing, potting and molding. Manual dispensing encapsulation requires a high level of operation, especially for white LEDs, which mainly depends on the control of the dispensing amount.

[0003] When packaging existing LED chips, thermal conductive glue and sealant need to be applied on the chip and substrate respectively. In order to ensure that the chip is tightly connected to the heat dissipation cover after glue application, ×-shaped glue is usually applied on the chip, and square glue is applied around the substrate. However, the glue application process of the existing glue application structure when packaging LED chips needs to be carried out step by step, that is, chip glue is applied first, and after glue application of multiple LED chips is completed, the next glue application machine is used for substrate glue application. This separation process will slow down the packaging speed of LED chips, reduce packaging efficiency, and affect the output per unit time.

[0004] Therefore, we propose an automatic packaging structure for LED chips to solve the above problems. Summary of the invention

[0005] In view of the shortcomings of the prior art, the present invention provides an automatic packaging structure for LED chips to solve the problems raised in the above background technology.

[0006] The object of the present invention can be achieved by the following technical solution: comprising a chassis, wherein a glue dispensing cavity is provided in the chassis;

[0007] The bottom of the dispensing cavity is provided with a conveying plate through a conveying structure, the top of the dispensing cavity is provided with a movable lifting structure, and a connecting frame is provided on the movable lifting structure;

[0008] The cam is provided with a plurality of pulleys, and the pulleys are provided with a plurality of pulleys, and the pulleys are provided with a plurality of pulleys.

[0009] As a preferred embodiment of the present invention, it also includes a chip dispensing component, the chip dispensing component includes an inverted T-plate fixedly connected to the middle of the bottom of the guide frame, one end of the rotating shaft is rotatably connected to the top of the inverted T-plate, a moving groove is provided on one side of the top of the inverted T-plate, a spur gear is fixedly connected to the outer lower side of the rotating shaft close to the moving groove, a connecting block is slidably connected in the moving groove, a rack is fixedly connected to the top of the connecting block, the rack is meshed with the spur gear, and an arc frame is fixedly connected to the bottom end of the connecting block, and the second rubber hose is fixedly connected to the front and rear sides of the bottom of the inverted T-plate respectively, a triangular block is fixedly connected to the side close to each other on the second rubber hose, a convex edge is fixedly connected to the top of the triangular block, a special-shaped groove is provided on the convex edge, a chip dispensing head is movably connected in the special-shaped groove, a second convex ring is fixedly connected to the top of the chip dispensing head, the second convex ring is movably connected to the inner side of the arc frame, a second pipe is connected to the chip dispensing head, and one end of the second pipe is connected to the adjacent second rubber hose.

[0010] As a preferred embodiment of the present invention, it also includes a driving component, which includes a bracket fixedly connected to the middle of the top of the guide frame, and a motor is fixedly connected to the bracket. The output end of the motor and the outer side of the top end of the adjacent rotating shaft are fixedly connected with a bevel gear, and the two bevel gears are meshed with each other.

[0011] As a preferred embodiment of the present invention, a pump body is disposed in each of the first rubber hose and the second rubber hose, and the output ends of the pump bodies are respectively connected to the first pipeline and the second pipeline, and the first pipeline and the second pipeline are both flexible pipes.

[0012] As a preferred embodiment of the present invention, the conveying plate is provided with grooves at equal intervals from left to right, and a plurality of groups of positioning points are distributed at equal intervals on the conveying plate, and an LED chip body is placed in each group of positioning points.

[0013] As a preferred embodiment of the present invention, one end surface of the abutment block is matched with the outer contour of the adjacent fixing sleeve, and the abutment block abuts against the adjacent fixing sleeve.

[0014] As a preferred embodiment of the present invention, the connection block is in a Z-shape, a separation block is fixedly connected to the middle of the arc frame, and the bottom of the connection block is connected to the separation block.

[0015] As a preferred embodiment of the present invention, the top-view cross-section of the special-shaped groove is a half-X shape, and the diameter of the second convex ring is greater than the width of the special-shaped groove.

[0016] As a preferred embodiment of the present invention, the height of the second rubber hose is higher than the height of the triangular block, and one end of the second pipe is connected to an upper half of one side of an adjacent second rubber hose.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. By setting up the substrate dispensing component and chip dispensing component, the substrate and chip can be dispensed synchronously at the same time, which shortens the time occupied by the dispensing process in the automatic packaging of LED chips, improves the packaging speed and improves the packaging efficiency.

[0019] 2. By setting up the substrate dispensing component and chip dispensing component, the two dispensing heads can be controlled to perform independent dispensing during the dispensing process of the substrate and chip, and finally form the required colloid shape, which further speeds up the dispensing speed and saves the dispensing time, thereby greatly speeding up the packaging speed and increasing the packaging output per unit time. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to facilitate understanding by those skilled in the art, the present invention is further described below with reference to the accompanying drawings.

[0021] Figure 1 It is a schematic diagram of a partial three-dimensional structure of the present invention;

[0022] Figure 2 It is a schematic diagram of the overall three-dimensional structure of the present invention;

[0023] Figure 3 It is a schematic diagram of a partially cutaway enlarged structure of the present invention;

[0024] Figure 4 It is a partially enlarged structural schematic diagram of the present invention;

[0025] Figure 5 yes Figure 1 Enlarged structural diagram at A in the middle.

[0026] In the figure: 1, chassis; 2, dispensing chamber; 3, conveying plate; 4, connecting frame; 5, guide frame; 6, rotating shaft; 7, pulley; 8, belt; 9, positioning plate; 10, slide groove; 11, stop block; 12, spring; 13, fixing sleeve; 14, substrate dispensing head; 15, first convex ring; 16, guide groove; 17, first rubber hose; 18, first pipeline; 19, inverted T-plate; 20, moving groove; 21, spur gear; 22, connecting block; 23, rack; 24, arc frame; 25, second rubber hose; 26, triangular block; 27, convex edge; 28, special-shaped groove; 29, chip dispensing head; 30, second convex ring; 31, second pipeline; 32, bracket; 33, motor; 34, bevel gear; 35, cutting groove; 36, LED chip body. DETAILED DESCRIPTION

[0027] The technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] See also Figure 1-Figure 5 As shown, an automatic packaging structure for LED chips includes a chassis 1, in which a dispensing cavity 2 is arranged; a conveying plate 3 is arranged at the bottom of the dispensing cavity 2 through a conveying structure, a movable lifting structure is arranged at the top of the dispensing cavity 2, and a connecting frame 4 is arranged on the movable lifting structure. The movable lifting structure is an existing mature technology, and a plurality of electric cylinders or motors can be used to realize the cross-shaped movement of the connecting frame 4 on the horizontal plane and the lifting movement in the height direction, wherein the cross-shaped movement on the horizontal plane is to meet the dispensing operation of multiple LED chip bodies on the same conveying plate 3, and the lifting movement is to meet the separation of the dispensing head from the conveying plate 3 before and after the dispensing, and the conveying plate 3 is introduced into the chassis 1 through an external device for the dispensing process in the automatic packaging, wherein the conveying plate 3 can be driven by a common conveying structure such as a conveyor belt on both sides to move unidirectionally on the horizontal plane in the chassis 1, so as to facilitate the loading and unloading operation of the conveying plate 3, and in order to further improve the packaging efficiency, the substrate dispensing assembly and the chip dispensing assembly can also be provided with two to three groups, which can further speed up the dispensing operation and improve the packaging speed and packaging efficiency;

[0029] As an implementation method in this embodiment, Figure 1-Figure 3 and Figure 5As shown, the substrate dispensing assembly includes a guide frame 5 fixedly connected to the bottom of the connecting frame 4, a rotating shaft 6 is rotatably connected to the guide frame 5, and is symmetrically distributed front and back, a pulley 7 is fixedly connected to the outer upper side of the rotating shaft 6, and the outer sides of the two pulleys 7 are tensioned with the same belt 8, and the outer lower sides of the two rotating shafts 6 are fixedly connected to positioning plates 9, a slide groove 10 is provided in the positioning plate 9, a stopper 11 is slidably connected in the slide groove 10, and a spring 12 is fixedly connected between the stopper 11 and the other side of the slide groove 10, a fixed sleeve 13 is also inserted in the slide groove 10, a substrate dispensing head 14 is fixedly connected in the fixed sleeve 13, and a first convex ring 15 is fixedly connected to the top of the fixed sleeve 13, a guide groove 16 is provided on the inner side of the guide frame 5, and the first convex ring 15 is movably connected to the inner side of the guide groove 16, and the guide frame 5 The front and rear sides of the top are respectively fixedly connected with a first hose 17, and a first pipe 18 is arranged on the first hose 17. The first pipe 18 is connected with the adjacent substrate dispensing head 14. The guide frame 5 guides the first convex ring 15 through the guide groove 16 provided thereon, and at the same time, the first convex ring 15 is auxiliary guided by the slide groove 10 on the positioning plate 9, and the elastic force generated by the spring 12 pushing the stop block 11 ensures that the fixing sleeve 13 and the substrate dispensing head 14 are always located in the guide groove 16, so that when the rotating shaft 6 drives the positioning plate 9 to rotate, the fixing sleeve 13 and the substrate dispensing head 14 will move along a square trajectory to meet the requirements of the dispensing shape of the chip substrate, and at the same time, by controlling the synchronous movement of the two groups of dispensing heads 14, the dispensing speed of the substrate is accelerated, thereby improving the packaging speed of the LED chip by this structure.

[0030] As an implementation method in this embodiment, Figure 1-Figure 5As shown, it also includes a chip dispensing component, which includes an inverted T-plate 19 fixedly connected to the middle of the bottom of the guide frame 5, one end of the rotating shaft 6 is rotatably connected to the top of the inverted T-plate 19, a moving groove 20 is opened on one side of the top of the inverted T-plate 19, a spur gear 21 is fixedly connected to the outer lower side of the rotating shaft 6 close to the moving groove 20, a connecting block 22 is slidably connected in the moving groove 20, a rack 23 is fixedly connected to the top of the connecting block 22, the width of the vertical portion on the connecting block 22 is adapted to the width of the moving groove 20 to meet its sliding in the moving groove 20, the rack 23 is meshed with the spur gear 21, and the bottom end of the connecting block 22 is fixedly connected to an arc The second rubber hose 25 is fixedly connected to the front and rear sides of the bottom of the inverted T-plate 19. The top view cross-section of the second rubber hose 24 is semicircular, and one side thereof is flat, which is convenient for connection and fixation with one side of the triangular block 26. The triangular block 26 is a cavity structure, and a notch is provided at the bottom thereof to reduce the amount of material used and reduce the manufacturing cost. The second rubber hose 25 is fixedly connected to the triangular block 26 on one side close to each other, and the top of the triangular block 26 is fixedly connected to a convex edge 27, and a special-shaped groove 28 is provided on the convex edge 27. A chip dispensing head 29 is movably connected in the special-shaped groove 28, and a second convex ring 30 is fixedly connected to the top of the chip dispensing head 29, and the second convex ring 30 is movable. The chip dispensing head 29 is connected to the inner side of the arc frame 24, and a second pipe 31 is connected to one end of the second pipe 31. The second pipe 31 is connected to the adjacent second rubber hose 25. The inverted T-plate 19 is fixed to the bottom of the guide frame 5, so that it can move with the guide frame 5 and the connecting frame 4. The movable groove 20 is used to guide the connecting block 22. When the rotating shaft 6 on this side rotates, the spur gear 21 will mesh with the rack 23 and then drive the arc frame 24 to move along the direction of the movable groove 20 through the connecting block 22. It should be noted that, during the actual dispensing of the substrate, each substrate dispensing head 14 only needs to go half the distance along the guide groove 16, so the actual single rotation of the rotating shaft 6 The moving angle should be less than 270 degrees. Therefore, the module and number of teeth of the rack 23 and the spur gear 21 should be designed to ensure that when the shaft 6 rotates at a fixed angle, the connecting block 22 should move with the rack 23 from one end of the moving groove 20 to the other end. During the movement, it drives the chip dispensing head 29 to move through the second convex ring 30, and the chip dispensing head 29 will move along a specific trajectory under the guidance of the special-shaped groove 28, so that the colloid on the left and right sides forms an "X" shape when viewed from above, ensuring the colloid diffusion effect when the chip is connected to the heat dissipation cover, improving the dispensing quality, and the two chip dispensing heads 29 work synchronously, which can effectively increase the dispensing speed, and improve the packaging speed and packaging efficiency.

[0031] By providing the above structure, it is possible to achieve synchronous dispensing of the substrate and the chip at the same time, shortening the time occupied by the dispensing process in the automatic packaging of the LED chip, improving the packaging speed and efficiency, and simultaneously controlling the two dispensing heads to perform independent dispensing during the dispensing of the substrate and the chip, and finally forming the required colloid shape, further accelerating the dispensing speed, saving dispensing time, and thus greatly accelerating the packaging speed and increasing the packaging output per unit time.

[0032] As an implementation method in this embodiment, Figure 3 As shown, it also includes a driving component, which includes a bracket 32 ​​fixedly connected to the middle of the top of the guide frame 5, and a motor 33 is fixedly connected to the bracket 32. The output end of the motor 33 and the outer side of the top end of the adjacent rotating shaft 6 are fixedly connected with a bevel gear 34, and the two bevel gears 34 are meshed with each other. The bracket 32 ​​is used to adjust the height of the output end of the motor 33. The meshing of the two bevel gears 34 can facilitate the change of the installation position of the motor 33, reduce the overall height of the structure, and facilitate the installation and driving operation.

[0033] In this embodiment, if Figure 3 and Figure 4 As shown, a pump body is provided in the first rubber hose 17 and the second rubber hose 25, and the output ends of the pump bodies are respectively connected with the first pipe 18 and the second pipe 31, and the first pipe 18 and the second pipe 31 are both flexible pipes. The first rubber hose 17 and the second rubber hose 25 are respectively filled with sealing adhesive and thermal conductive glue to meet the different dispensing requirements of the chip and the substrate. At the same time, they are connected with the external colloid delivery structure through the connecting pipe to ensure the supply of colloid. This part of the structure is not shown in the figure. The pump body is controlled by the controller to supply glue to the substrate dispensing head 14 and the chip dispensing head 29 respectively, so as to ensure that the colloid can be sprayed out when needed.

[0034] In this embodiment, if Figure 1 As shown, the conveying plate 3 is provided with grooves 35 at equal intervals from left to right, and a plurality of groups of positioning points are distributed at equal intervals on the conveying plate 3. An LED chip body 36 is placed in each group of positioning points. The grooves 35 are used to reduce the amount of materials used and reduce the manufacturing cost of the conveying plate 3. At the same time, a single group of positioning points can be pre-positioned. The positioning points are used to position and support the LED chip body, so as to facilitate the connection and separation of the LED chip body from the conveying plate 3.

[0035] In this embodiment, if Figure 3As shown, one end face of the stop block 11 is adapted to the outer contour of the adjacent fixed sleeve 13, and the stop block 11 is in contact with the adjacent fixed sleeve 13. The stop block 11 forms an extrusion force on one side of the fixed sleeve 13 under the elastic force of the spring 12, so that it is always guaranteed to be connected with the guide groove 16, and then the substrate dispensing head 14 can move in a square trajectory under the synchronous action of the guide groove 16 and the slide groove 10, which is convenient for controlling the dispensing trajectory.

[0036] In this embodiment, if Figure 3 and Figure 4 As shown, the connecting block 22 is in a Z-shape, a separation block is fixedly connected to the middle of the arc frame 24, and the bottom of the connecting block 22 is connected to the separation block. The Z-shaped structure allows one end of the connecting block 22 to be connected to the middle separation block of the arc frame 24 to avoid interfering with the lateral movement of the second convex ring 30 in the arc frame 24, thereby ensuring that the structure can operate smoothly.

[0037] In this embodiment, if Figure 3 and Figure 4 As shown, the top-view cross-section of the special-shaped groove 28 is a semi-X shape, and the diameter of the second convex ring 30 is larger than the width of the special-shaped groove 28. The semi-X shape can be designed to facilitate the connection block 22 to move in the movable groove 20, thereby driving the second convex ring 30 and the chip dispensing head 29 thereon to move along a special trajectory along the special-shaped groove 28, so that the shape of the colloid after a single dispensing is completed forms an entire X shape, thereby ensuring the subsequent connection effect of the chip and the heat dissipation cover.

[0038] In this embodiment, if Figure 4 As shown, the height of the second hose 25 is higher than the height of the triangular block 26, and one end of the second pipe 31 is connected to the upper half of one side of the adjacent second hose 25 so that the overall height of the second hose 25 is higher than the height of the triangular block 26, which can facilitate its installation under the inverted T-plate 19 and leave a certain space on the top, which is convenient for the routing of the second pipe 31. At the same time, one end of the second pipe 31 is set on one side of the second hose 25, which can reduce the difference between the maximum length and the minimum length of the second pipe 31, and facilitate installation and use.

[0039] When the present invention is used in practice, the structure is first connected to an external power source, and the conveying plate 3 equipped with multiple LED chip bodies 26 is moved to a suitable position in the chassis 1 through the conveying structure. Then the controller controls the mobile lifting structure to work, and moves the connecting frame 4 to the top of an LED chip body 36, and descends to the lowest height, so that the glue outlet ends of the substrate glue dispensing head 14 and the chip glue dispensing head 29 are close to the chip. Then the controller controls the pump body to work, and the pump body supplies glue to the substrate glue dispensing head 14 and the chip glue dispensing head 29 from the first pipeline 18 and the second pipeline 31 respectively. Then the controller controls the motor 33 to work, and the output end of the motor 33 drives a bevel gear 34 rotates, and drives one of the rotating shafts 6 to rotate by meshing with another bevel gear 34. When the rotating shaft 6 rotates, it drives the pulley 7 on it to rotate, and cooperates with the belt 8 to drive the pulley 7 on the other side to rotate, thereby realizing the same direction rotation of the two rotating shafts 6. When the rotating shaft 6 rotates, it will drive its outer positioning plate 9 to rotate, and the first convex ring 15 is pushed to move by the contact between the positioning plate 9 and the first convex ring 15. At the same time, the elastic force of the spring 12 on the stop block 11 presses the first convex ring 15 to always move along the guide groove 16 on the guide frame 5. Under the joint guiding action of the slide groove 10 and the guide groove 16, the substrate dispensing head 14 moves along the square track, and the LED chip body 36 At the same time, one of the rotating shafts 6 will drive the outer spur gear 21 to rotate when rotating, and the spur gear 21 will mesh with the rack 23, and slide in the moving groove 20 through the connecting block 22, driving the connecting block 22 and the arc frame 24 to move along the length direction of the moving groove 20. When the arc frame 24 moves, the second convex ring 30 and the chip dispensing head 29 are pushed to move. Since the chip dispensing head 29 is also restricted by the special-shaped groove 28, during the movement, the chip dispensing head 29 will also move in the arc frame 24 along the length direction of the arc frame 24, and the movement trajectory of the dispensing end of the chip dispensing head 29 on the chip is consistent with the special-shaped groove 28. The moving trajectory is the same. When the two dispensing heads 29 synchronously complete the corresponding trajectory, the controller controls the motor 33 and the pump body to stop working, controls the mobile lifting structure to work, raises the connecting frame 4, and moves horizontally to just above the other LED chip body 36 that has not been dispensed with glue, and then drops to the lowest point. Then, the motor 33 and the pump body are controlled to work again, and the output end of the motor 33 is rotated in the opposite direction to the last rotation direction, and the dispensing operation is continued until all the LED chip bodies are dispensed. After that, the controller controls the mobile lifting structure to work, raises the connecting frame 4, and moves the conveying plate 3 that has been dispensed with glue through the horizontal conveying structure to enter the next step of packaging.

[0040] The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to only specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. An automatic packaging structure for LED chips, characterized in that: include: A chassis (1), wherein a glue cavity (2) is provided in the chassis (1); The bottom of the glue dispensing chamber (2) is provided with a conveying plate (3) through a conveying structure, the top of the glue dispensing chamber (2) is provided with a movable lifting structure, and a connecting frame (4) is provided on the movable lifting structure; A substrate dispensing assembly, the substrate dispensing assembly comprising a guide frame (5) fixedly connected to the bottom of a connecting frame (4), a rotating shaft (6) rotatably connected to the guide frame (5) and symmetrically distributed frontward and rearward, a pulley (7) fixedly connected to the outer upper side of the rotating shaft (6), a belt (8) tensioned on the outer sides of the two pulleys (7), a positioning plate (9) fixedly connected to the outer lower side of the two rotating shafts (6), a slide groove (10) provided in the positioning plate (9), a stop block (11) slidably connected in the slide groove (10), a spring fixedly connected between the stop block (11) and the other side of the slide groove (10) A spring (12) is provided in the slide groove (10), a fixing sleeve (13) is inserted in the fixing sleeve (13), a substrate dispensing head (14) is fixedly connected in the fixing sleeve (13), a first convex ring (15) is fixedly connected to the top of the fixing sleeve (13), a guide groove (16) is provided around the inner side of the guide frame (5), the first convex ring (15) is movably connected to the inner side of the guide groove (16), a first rubber hose (17) is fixedly connected to the front and rear sides of the top of the guide frame (5), a first pipe (18) is arranged on the first rubber hose (17), and the first pipe (18) is connected to the adjacent substrate dispensing head (14).

2. The LED chip automatic packaging structure according to claim 1, characterized in that: The chip dispensing assembly also includes a chip dispensing assembly, which includes an inverted T-plate (19) fixedly connected to the middle of the bottom of the guide frame (5), one end of the rotating shaft (6) is rotatably connected to the top of the inverted T-plate (19), a moving groove (20) is provided on one side of the top of the inverted T-plate (19), a spur gear (21) is fixedly connected to the outer lower side of the rotating shaft (6) close to the moving groove (20), a connecting block (22) is slidably connected in the moving groove (20), a rack (23) is fixedly connected to the top of the connecting block (22), the rack (23) is meshed with the spur gear (21), the bottom end of the connecting block (22) is fixedly connected to an arc frame (24), and the inverted T-plate ( The front and rear sides of the bottom of the arc frame (24) are respectively fixedly connected with second rubber hoses (25); a triangular block (26) is fixedly connected to the side close to each other on the second rubber hose (25); a convex edge (27) is fixedly connected to the top of the triangular block (26); a special-shaped groove (28) is provided on the convex edge (27); a chip dispensing head (29) is movably connected in the special-shaped groove (28); a second convex ring (30) is fixedly connected to the top of the chip dispensing head (29); the second convex ring (30) is movably connected to the inner side of the arc frame (24); a second pipe (31) is connected to the chip dispensing head (29); one end of the second pipe (31) is connected to the adjacent second rubber hose (25).

3. The LED chip automatic packaging structure according to claim 1, characterized in that: The invention also comprises a driving assembly, wherein the driving assembly comprises a bracket (32) fixedly connected to the middle of the top of the guide frame (5), a motor (33) fixedly connected to the bracket (32), a bevel gear (34) fixedly connected to the output end of the motor (33) and the outer side of the top end of the adjacent rotating shaft (6), and the two bevel gears (34) are meshed with each other.

4. The LED chip automatic packaging structure according to claim 1, characterized in that: A pump body is disposed inside the first rubber hose (17) and the second rubber hose (25), and the output ends of the pump bodies are respectively connected to the first pipeline (18) and the second pipeline (31), and the first pipeline (18) and the second pipeline (31) are both flexible pipes.

5. The LED chip automatic packaging structure according to claim 1, characterized in that: The conveying plate (3) is provided with grooves (35) at equal intervals from left to right, and a plurality of groups of positioning points are distributed at equal intervals on the conveying plate (3), wherein an LED chip body (36) is placed in each group of positioning points.

6. The LED chip automatic packaging structure according to claim 1, characterized in that: One end surface of the abutment block (11) is adapted to the outer contour of the adjacent fixing sleeve (13), and the abutment block (11) abuts against the adjacent fixing sleeve (13).

7. The LED chip automatic packaging structure according to claim 2, characterized in that: The connection block (22) is in a Z-shape, a separation block is fixedly connected to the middle of the arc frame (24), and the bottom of the connection block (22) is connected to the separation block.

8. The LED chip automatic packaging structure according to claim 2, characterized in that: The cross-section of the special-shaped groove (28) in top view is half-X-shaped, and the diameter of the second convex ring (30) is greater than the width of the special-shaped groove (28).

9. The LED chip automatic packaging structure according to claim 8, characterized in that: The height of the second rubber hose (25) is higher than the height of the triangular block (26), and one end of the second pipe (31) is connected to the upper half of one side of the adjacent second rubber hose (25).

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