A testing machine for solid state drives

Abstract

The application provides a testing machine for solid state disks, comprising: a cabinet, a mounting chamber and a testing chamber are arranged in the cabinet from bottom to top, a plurality of testing mainboards are fixedly arranged in the testing chamber, and the testing mainboards are used for plugging the solid state disks to be detected; a testing host is arranged in the mounting chamber and is electrically connected with the plurality of testing mainboards; and a display is arranged at the top of the cabinet and is electrically connected with the testing host, so as to display the detection results of the plurality of testing mainboards. The problem that the indication information of the indicator light of the hard disk detection machine in the prior art is limited and the prompt information is not comprehensive is solved.

Description

Technical Field

[0001] This application relates to the field of solid-state drive (SSD) production equipment technology, and more specifically, to a SSD testing machine. Background Technology

[0002] Solid State Drives (SSDs) are widely used in various fields due to their powerful random read and write capabilities. SSDs can be installed on a host computer as its storage medium. The host sends data to the SSD, which then writes that data for storage. The main circuit components of an SSD are the PCB and its outer casing. The PCB uses an integrated circuit board, and after its production, it needs to undergo timely functional testing to ensure it can perform normal data storage.

[0003] Existing testing tools typically use test circuit boards for functional testing. These boards are equipped with indicator lights, and usually, a single test circuit board has multiple testing positions, allowing multiple solid-state drives (SSDs) to be tested simultaneously. If a test fails, the indicator lights will indicate the failure. However, the information displayed by these indicator lights is limited and incomplete.

[0004] Therefore, existing technologies still need to be improved and developed. Summary of the Invention

[0005] The purpose of this application is to provide a solid-state drive (SSD) testing machine that solves the problem that existing hard drive testing machines have limited indicator information and incomplete display of prompts via indicator lights.

[0006] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0007] This application provides a solid-state drive (SSD) testing machine, including: a chassis, with an installation chamber and a testing chamber arranged from bottom to top inside the chassis, and multiple testing motherboards fixedly installed inside the testing chamber, the testing motherboards being used to connect and test the SSD;

[0008] The test host is located in the installation chamber and is electrically connected to multiple test motherboards.

[0009] The monitor, located on the top of the chassis and electrically connected to the test host, is used to display the results of tests conducted on multiple test motherboards.

[0010] Optionally, the test chamber has a window on one side, a partition is provided inside the test chamber, and multiple test motherboards are installed on the side of the partition away from the window;

[0011] The test motherboard has a vertical connector that runs through the partition and faces the window.

[0012] Optionally, a partition divides the test chamber into a pre-test chamber and a post-test chamber, with the post-test chamber having a larger space than the pre-test chamber;

[0013] The testing chamber is used to house the solid-state drive to be tested.

[0014] Optionally, the window is provided with double doors, and the double doors are provided with viewing windows.

[0015] Optionally, the monitor is provided with an angle adjustment structure, which is connected to the chassis and used to adjust the tilt angle.

[0016] Optionally, the test motherboard includes: a test circuit board, on which at least one horizontal connector is provided;

[0017] At least one auxiliary circuit board, which is provided with a gold finger mating part and is pluggably connected to a horizontal connector via the gold finger mating part;

[0018] The vertical connector is mounted on the surface of the auxiliary circuit board that faces away from the test circuit board;

[0019] The vertical connector is used for pluggable connection of a test solid-state drive (SSD) to allow the SSD to be tested to be placed vertically on the test circuit board.

[0020] Optionally, the vertical connector includes: a connector disposed on the surface of an auxiliary circuit board, and the connector having a mating opening on the side opposite to the auxiliary circuit board for inserting a solid-state drive for testing;

[0021] A guide shell is located on the outside of the insertion opening and is used to guide the solid-state drive under test to be inserted into the connector.

[0022] Optionally, the guide housing includes: a housing surrounding the outside of the insertion opening, the housing having a guide opening;

[0023] The elastic tabs on both sides are symmetrically arranged on the inner wall of the shell;

[0024] The elastic plates on both sides generate a spring force towards the connector by squeezing the solid-state drive under test. The spring force on both sides squeezes the solid-state drive under test towards the connector.

[0025] Optionally, an insulating heat-insulating sheet is provided between the test circuit board and the auxiliary circuit board.

[0026] Optionally, multiple vertical connectors are provided, which are arranged side by side at intervals along the extension direction of the auxiliary circuit board, and all of the multiple vertical connectors are electrically connected to the test circuit board by mating with the gold fingers.

[0027] The beneficial effects of the solid-state drive (SSD) testing machine provided in this application are at least as follows: By setting up a chassis, the test host and test motherboards can be placed inside the chassis, and multiple test motherboards are fixedly installed within the test chamber, allowing multiple SSDs to be connected and tested simultaneously. A monitor is installed on the top of the chassis, enabling the display of the test results from multiple test motherboards. The monitor's location on the top of the chassis allows the user to look up and directly observe the testing progress. This makes it more convenient to use, and the monitor displays more information, providing more comprehensive monitoring of the test parameters for each SSD, thus achieving complete monitoring of SSD test parameters and making it more convenient for the user. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 A schematic diagram of the main components of a solid-state drive testing machine provided in an embodiment of this application;

[0030] Figure 2 A schematic diagram of another form of a solid-state drive testing machine provided in an embodiment of this application;

[0031] Figure 3 A cross-sectional view of a solid-state drive testing machine provided in an embodiment of this application;

[0032] Figure 4 A schematic diagram of the main components of a test motherboard for a solid-state drive tester provided in this application embodiment;

[0033] Figure 5 A schematic diagram of another structure of the test motherboard of a solid-state drive tester provided in this application embodiment during use;

[0034] Figure 6 An exploded view of another structure of the test motherboard of a solid-state drive tester provided in an embodiment of this application;

[0035] Figure 7 A cross-sectional view of the vertical connector of a solid-state drive testing machine provided in an embodiment of this application;

[0036] Figure 8 This is a cross-sectional view of the pressure support of a solid-state drive testing machine provided in an embodiment of this application.

[0037] The following are the labeling elements in the figure:

[0038] 10. Solid-state drive to be tested; 100. Chassis; 110. Mounting chamber; 120. Test chamber; 121. Window; 122. Partition; 123. Front test chamber; 124. Rear test chamber; 125. Double door; 126. Crossbeam frame; 130. Test host; 140. Monitor; 141. Angle adjustment structure; 20. Test motherboard; 200. Test circuit board; 210. Horizontal connector; 300. Auxiliary circuit board; 310. Gold finger mating part; 320. End fixing position; 400. Vertical Connector; 410, Connector; 411, Insertion opening; 420, Guide shell; 421, Housing; 422, Guide port; 423, Spring mounting slot; 424, Spring protrusion; 425, Spring guide surface; 430, Elastic sheet; 431, Folding elastic part; 432, Extension connection part; 433, Arc-shaped bending part; 434, Bending protrusion; 435, Elastic guide surface; 436, Edge trim; 500, Insulating and heat-insulating sheet; 600, Downward pressure support; 610, Elastic force application part; 620, Pressure block. Detailed Implementation

[0039] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0040] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it may be directly or indirectly located on that other component. When a component is referred to as "connected to" another component, it may be directly or indirectly connected to that other component. The terms "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate orientations or positions based on the accompanying drawings, and are for ease of description only, and should not be construed as limiting the technical solution. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. "A plurality" means two or more, unless otherwise explicitly defined.

[0041] like Figure 1 , Figure 2 As shown, this embodiment proposes a solid-state drive (SSD) testing machine for connecting to and testing the SSD 10 under test. In this solution, the SSD 10 under test refers to the hard drive PCB portion, excluding the hard drive casing. Once the hard drive PCB passes the test, the hard drive casing is then installed, thus forming a complete SSD. Figure 1 , Figure 3 As shown, the solid-state drive (SSD) testing machine in this embodiment mainly includes: a chassis 100, a testing host 130, and a monitor 140. For ease of structural description, the side facing the user is considered the front of the chassis 100. The chassis 100 has a certain height, typically 1.6-2 meters high, or higher. Inside the chassis 100, from bottom to top, are a mounting chamber 110 and a testing chamber 120. Multiple testing motherboards 20 are fixedly mounted inside the testing chamber. The testing motherboards 20 are used to connect to the SSD 10 under test; the testing motherboards 20 are electrically connected to the SSD 10 under test, providing power and data communication. The testing host 130 is located in the mounting chamber 110 and is electrically connected to the multiple testing motherboards 20. The monitor 140 is located on top of the chassis 100 and is electrically connected to the testing host 130 to display the results detected by the multiple testing motherboards 20. In this embodiment, the monitor 140 can be a 19-inch or larger LCD monitor 140, which has a large display area and can display a large amount of information at once. The display 140 can show information such as test progress, transmission speed, pass / fail status, reasonableness rate, and substrate parameters of the solid-state drive under test.

[0042] The solid-state drive (SSD) testing machine of this embodiment allows the testing host 130 and testing motherboard 20 to be placed inside the chassis 100. Multiple testing motherboards 20 are fixedly installed within the testing chamber 120, enabling the connection of multiple SSDs 10 for simultaneous testing. A display 140 is installed on the top of the chassis 100, displaying the test results from the multiple testing motherboards 20. Located at the top of the chassis 100, the display 140 allows users to easily observe the testing process. This enhances usability, and the display 140 provides comprehensive monitoring of the testing parameters for each SSD 10, enabling complete parameter monitoring and improving user convenience.

[0043] like Figure 1 , Figure 3As shown, the test chamber 120 further includes a window 121 on its front side. A partition 122 is installed inside the test chamber 120, and multiple test motherboards 20 are mounted on the side of the partition 122 facing away from the window 121. Each test motherboard 20 has a vertical connector 400, which penetrates the partition 122 and faces the window 121. Specifically, only the vertical connector 400 is visible on the side facing the window 121, thus concealing the connecting wires and circuit board structure by the partition 122. This results in a more aesthetically pleasing product layout and a better user experience. Furthermore, the solid-state drive 10 to be tested can be directly inserted into each vertical connector 400 through the window 121, facilitating the user's connection process. It should also be noted that because the partition 122 is vertically positioned, the vertical connectors 400 are arranged vertically on the vertical partition 122. The solid-state drive 10 to be tested is inserted into the vertical connector 400 from front to back.

[0044] In addition to providing space for the vertical connecting seat 400, the partition 122 also includes indicator lights and control switches. This allows information to be directly displayed to the user through the vertical partition 122, making operation more convenient.

[0045] like Figure 1 , Figure 3 As shown, further, the partition 122 divides the test chamber 120 into a front test chamber 123 and a rear test chamber 124, with the rear test chamber 124 having a larger space than the front test chamber 123. The front test chamber 123 is used to accommodate the solid-state drive under test, while the rear test chamber 124 is used to accommodate multiple test motherboards 20. Specifically, a crossbeam frame 126 can be installed inside the rear test chamber 124, and the test motherboards 20 are fixed on the crossbeam frame 126, with the front vertical connector 400 extending forward through the partition 122. Since the test motherboards 20 have multiple electrical components that generate heat during operation, providing a larger space through the larger rear test chamber 124 helps with heat dissipation. Additionally, a heat dissipation fan is installed in the rear test chamber 124 to improve heat dissipation efficiency.

[0046] like Figure 1 , Figure 3 As shown, in this embodiment, the window 121 is further provided with double doors 125, and a viewing window is provided on the double doors 125. The double doors 125 are closed during the test and opened during the loading and unloading of the solid-state drive 10 to be tested, which is convenient for use.

[0047] like Figure 1 , Figure 3As shown, in this embodiment, the display 140 is further provided with an angle adjustment structure 141. The display 140 is connected to the chassis 100 through the angle adjustment structure 141 and is used to adjust the tilt angle. According to the user's usage habits or the user's height, the tilt angle of the display 140 can be adjusted to make it more convenient for the user to use.

[0048] like Figure 1 , Figure 3 , Figure 4 As shown, the test motherboard 20 in this embodiment further includes: a test circuit board 200 and at least one auxiliary circuit board 300. To facilitate the structural description of the test motherboard 20, the structure is illustrated using the example of the solid-state drive 10 under test being inserted into the vertical connector 400 from front to back. The test circuit board 200 is provided with at least one horizontal connector 210, which can be a standard M.2 solid-state drive socket or other solid-state drive sockets. Figure 5 , Figure 6 As shown, at least one auxiliary circuit board 300 is provided with a mating gold finger portion 310, and is pluggably connected to the horizontal connector 210 through the mating gold finger portion 310. At least one auxiliary circuit board 300 mates with the horizontal connector 210 through the gold finger portion, thereby achieving electrical connection with the test circuit board 200. A vertical connector 400 is disposed on the surface of the auxiliary circuit board 300 facing away from the test circuit board 200, thus effectively transforming the horizontal connector 210 into a vertically pluggable connector 400 through the auxiliary circuit board 300. The vertical connector 400 is used for pluggable connection of the solid-state drive under test, so that the solid-state drive 10 under test is placed vertically on the test circuit board 200. The interface form of the vertical connector 400 can be the same as or different from the interface form of the horizontal connector 210. Under the same circumstances, no additional conversion of the communication protocol is required; however, under different circumstances, additional conversion is required to achieve the communication connection function.

[0049] like Figure 5 , Figure 6 As shown, in this embodiment, a test circuit board 200 can be equipped with multiple horizontal connectors 210, and multiple corresponding auxiliary circuit boards 300 can be provided, which can be plugged into the multiple horizontal connectors 210 one by one. In this way, multiple solid-state drives 10 to be tested can be tested simultaneously on a single test circuit board 200, which can improve the testing efficiency of solid-state drives.

[0050] like Figure 5 , Figure 6As shown, by setting an auxiliary circuit board 300 on the test circuit board 200, the auxiliary circuit board 300 is inserted into the original horizontal connector 210 on the test circuit board 200 through the mating gold finger part 310, thereby achieving electrical connection between the auxiliary circuit board 300 and the test circuit board 200. The function of the vertical connector 400 on the auxiliary circuit board 300 is the same as that of the original horizontal connector 210. The vertical connector 400 is used for pluggable connection of the solid-state drive to be tested, so that the solid-state drive 10 to be tested is placed vertically on the test circuit board 200. Taking the test circuit board 200 placed horizontally as an example, in the original testing process, the solid-state drive 10 to be tested needed to be inserted horizontally from one side into the horizontal connector 210. Since the horizontal connector 210 only fixes one end of the solid-state drive 10, leaving the other end suspended, to improve stability during testing, the other end of the solid-state drive 10 usually needs to be secured with screws to ensure a stable connection between the solid-state drive 10 and the test circuit board 200 in a horizontal position. After testing, removing the solid-state drive 10 required removing the rear screws and pulling it out of the horizontal connector 210 horizontally. However, with this solution, when testing the motherboard 20, the solid-state drive 10 only needs to be inserted from front to back into the vertical connector 400 to stably connect it to the test circuit board 200 for testing. This changes the original method of the solid-state drive 10 lying horizontally on the test circuit board 200 to a vertical insertion method. The vertically plugged-in solid-state drive 10 not only facilitates insertion and removal but also avoids suspending the elongated solid-state drive 10 horizontally, thus eliminating the need for fixation at the other end for stable mounting. This simplifies installation and removal for testers and improves testing efficiency.

[0051] like Figure 5 , Figure 6 , Figure 7As shown, the vertical connector 400 of this embodiment further includes a connector 410 and a guide shell 420. The connector 410 is disposed on the surface of the auxiliary circuit board 300, and the side of the connector 410 facing away from the auxiliary circuit board 300 has a insertion opening 411 for inserting the solid-state drive 10 to be tested. The guide shell 420 is disposed outside the insertion opening 411 and is used to guide the solid-state drive 10 to be tested into the connector 410. In a specific structure, the connector 410 can adopt a standard connector 410 structure, mainly used to mate with one end of the gold fingers on the solid-state drive 10 to achieve electrical connection, and the solid-state drive 10 to be tested can be connected to the testing system. The guide shell 420 is arranged on the outer side in a circle around the insertion opening 411. The guide shell 420 protrudes from the auxiliary circuit board 300 by a certain height, so that a larger portion of the solid-state drive 10 to be tested is inserted into the vertical connector 400. Thus, even if the solid-state drive 10 to be tested shakes, the outer side of the solid-state drive 10 to be tested can be limited by the higher outer wall of the guide shell 420, so as to ensure connection stability.

[0052] like Figure 6 , Figure 7 As shown, the guide shell 420 of this embodiment further includes: a shell 421 and elastic pieces 430 on both sides. The shell 421 is disposed around the outside of the insertion opening 411. The shell 421 has a guide opening 422. The inner walls of the left and right sides of the guide opening 422 are inclined, so that the guide opening 422 is larger on the outside and smaller on the inside. In this way, when the solid-state drive 10 to be tested is inserted into the vertical connector 400, the inclined inner walls on both sides of the guide opening 422 guide and center the solid-state drive 10 to be tested, making the insertion process of the solid-state drive 10 to be tested more convenient. The elastic pieces 430 are symmetrically disposed on the inner wall of the shell 421. The elastic pieces 430 on both sides generate elastic force towards the connector 410 when the solid-state drive 10 to be tested is squeezed. The elastic force on both sides squeezes the solid-state drive 10 to be tested towards the connector 410. When the solid-state drive 10 to be tested is inserted into the connector 410, the elastic sheet 430 abuts against and limits the left and right sides of the solid-state drive 10 to be tested, while also applying a certain backward squeezing force, so that the solid-state drive 10 to be tested can be subjected to stable squeezing during the testing process after connection, thus making the connection more stable.

[0053] In the specific structure, the inner cavity of the guide shell 420 is used to insert the solid-state drive 10 to be tested. Spring clip mounting slots 423 are formed in the inner walls on both the left and right sides of the inner cavity. A spring clip protrusion 424 facing the inner cavity is provided in front of the spring clip mounting slots 423. An elastic piece 430 is disposed within the spring clip mounting slots 423 and bends forward, protruding towards the spring clip protrusion 424. Therefore, a spring clip guide surface 425 is provided on the upper side of the spring clip protrusion 424, and the spring clip guide surface 425 is inclined. When the solid-state drive 10 to be tested is inserted from above and the elastic piece 430 is squeezed, the elastic piece 430 not only deforms to the left and right sides but also deforms backward. Since the guide surface 425 of the elastic piece is inclined, the elastic piece can be squeezed to the left and right sides by the solid-state drive 10 to make room and be received into the spring piece protrusion 424, so that the solid-state drive 10 to be tested can be smoothly inserted into the inner cavity of the guide shell 420 and connected to the connector 410. At this time, the elastic piece 430, which is deformed backward, no longer squeezed from the front to the back by the solid-state drive 10 to be tested, so it generates a forward recovery elastic force through the previous backward compression deformation. The forward recovery trend causes the elastic piece 430 to generate an inclined squeezing force along the spring piece guide surface 425. Since the elastic guide surface 435 is inclined, the direction of the squeezing force is towards the outside of the spring piece protrusion 424, thereby squeezing the solid-state drive 10 to be tested located in the inner cavity.

[0054] like Figure 6 , Figure 7 As shown, to achieve the above functions, the elastic sheet 430 in this embodiment specifically includes: a folding elastic portion 431, an extension connecting portion 432, an arc-shaped bending portion 433, and a bending protrusion 434. The folding elastic portion 431 has good elasticity, for example, it can be a multi-segment wavy folding elastic plate. The folding elastic portion 431 is disposed in the spring sheet mounting groove 423. The extension connecting portion 432 can be configured as a straight piece, which is connected to one end of the folding elastic portion 431 and extends a predetermined length away from the auxiliary circuit board 300. The arc-shaped bending portion 433 is connected to the end of the extension connecting portion 432 away from the folding elastic portion 431, and extends towards the spring sheet protrusion 424 after bending, with its arc-shaped surface abutting against the spring sheet guide surface 425. The bending protrusion 434 is connected to the end of the arc-shaped bending portion 433 away from the extension connecting portion 432 and extends a predetermined length towards the center of the inner cavity.

[0055] like Figure 6 , Figure 7As shown, when the solid-state drive 10 to be tested is inserted from above, it first presses the bent protrusion 434 located in the inner cavity. After being subjected to force, the bent protrusion 434 is pressed backward and deformed to the left and right sides. The backward pressure compresses the folded elastic part 431, so the entire elastic piece 430 is shortened in the front-back direction. Since the spring guide surface 425 is inclined, the curved bent part 433 makes room behind the spring guide surface 425 during the backward pressing process, so that the bent protrusion 434, which is pressed in the left and right direction, can be squeezed open to the left and right sides by the solid-state drive 10 to be tested. The bent protrusion 434 is squeezed and received into the spring protrusion 424, so that the solid-state drive 10 to be tested can be smoothly inserted into the inner cavity of the guide shell 420 and connected to the connector 410. At this time, the backward-deformed folding elastic portion 431, without the front-to-back pressure from the solid-state drive 10 under test, generates a forward-recovering elastic force. During the recovery process, the arc-shaped bending portion 433 generates an inclined compressive force along the spring guide surface 425. Due to the inclined setting of the elastic guide surface 435, the arc-shaped bending portion 433 tends to recover forward and generates compressive force towards the outside of the spring protrusion 424, thereby pressing the bent protrusion 434 against the solid-state drive 10 under test located in the inner cavity. The solid-state drive 10 under test is pressed tightly on both sides, and since the elastic guide surface 435 gradually tilts away from the center of the inner cavity from front to back, the elastic piece 430 also has a certain downward compressive force under the action of the inclined elastic guide surface 435, which is more conducive to the stable connection of the solid-state drive 10 under test to the connector 410.

[0056] like Figure 6 , Figure 7 As shown, further, the bent protrusion 434 in this embodiment can be a bent spring. To apply a greater elastic force backward to the solid-state drive 10 under test, the bent protrusion 434 can be tilted. In this structure, the bent protrusion 434 gradually approaches the center line of the inner cavity from front to back. The tilted bent protrusions 434 on the left and right sides form a funnel shape with a larger front end and a smaller rear end. This not only guides the solid-state drive 10 under test into the center line when the tilted bent protrusions 434 are squeezed during insertion, thus achieving more accurate insertion; but also, after the solid-state drive 10 under test is inserted, the bent protrusions 434 on the left and right sides press against the outer wall of the solid-state drive 10 under test, generating a larger backward force, thereby making the solid-state drive 10 under test more stably inserted into the connector 410, ensuring a more stable electrical connection between the solid-state drive 10 under test and the testing system during the testing process.

[0057] like Figure 6 , Figure 7As shown, in this embodiment, the front end of the bent protrusion 434 is provided with a tapered edge 436. The tapered edge 436 can increase the compression length with the outer wall of the solid-state drive 10 under test, thereby improving the force stability at the junction of the bent protrusion 434 and the outer wall of the solid-state drive 10 under test.

[0058] like Figure 6 , Figure 7 As shown, the front edge portion 436 can take various forms, such as an inwardly rolled edge, an inwardly bent edge, etc. In this embodiment, the edge portion 436 can be oriented towards the bent edge piece. The front end of the bent protrusion 434 is bent downward and then extends in a direction away from the center of the inner cavity, which can extend and connect to the arc-shaped bent portion 433. This not only realizes the edge-gathering function, but also forms a reinforcing support between the bent protrusion 434 and the arc-shaped bent portion 433, effectively improving the structural strength.

[0059] like Figure 6 , Figure 7 , Figure 8 As shown, in this embodiment, an insulating heat-insulating sheet 500 is further provided between the test circuit board 200 and the auxiliary circuit board 300. The insulating heat-insulating sheet 500 prevents the circuits or solder joints on the two circuit boards from coming into contact and causing a short circuit, thus making the detection circuit more stable during use.

[0060] Furthermore, in this embodiment, the insulating heat insulation sheet 500 adopts a rigid insulating partition 122. The rigid insulating partition 122 has a predetermined thickness and is fixed to the surface of the auxiliary circuit board 300 facing the test circuit board 200, with the rigid insulating partition 122 abutting against the test circuit board 200. The rigid insulating partition 122 is not easily deformed by pressure, thereby connecting the front and rear test circuit board 200 and the auxiliary circuit board 300 into a whole. The rigid insulating partition 122 can prevent the auxiliary circuit board 300 from being deformed by pressure during the insertion of the solid-state drive 10 to be tested.

[0061] like Figure 6 , Figure 8As shown, the test motherboard 20 structure in this embodiment further includes a fixedly disposed pressing support 600. The pressing support 600 is connected to the auxiliary circuit board 300 and is used to push the auxiliary circuit board 300 toward the test circuit board 200. Since the auxiliary circuit board 300 is also subjected to a forward force during the removal of the solid-state drive 10 under test, repeated insertion and removal can easily cause the mating gold finger portion 310 of the auxiliary circuit board 300 to loosen from the horizontal connector 210, especially when the vertical connector 400 is very close to the mating gold finger portion 310. Therefore, by applying a backward pressing force to the auxiliary circuit board 300 through the pressing support 600, the stability of the electrical connection between the auxiliary circuit board 300 and the test circuit board 200 can be ensured.

[0062] like Figure 6 , Figure 8 As shown, the downward support member 600 in this embodiment further includes an elastic force-applying member 610 and a pressure block 620. Typically, the test circuit board 200 is fixed to the crossbeam 126 on the rear side of the partition 122, and the auxiliary circuit board 300 is located in front of the test circuit board 200. The elastic force-applying member 610 can be directly fixed to the partition 122 and extend towards the test circuit board 200. The elastic force-applying member 610 can be a compression spring. The pressure block 620 is connected to the elastic force-applying member 610, and the pressure block 620 abuts against the surface of the auxiliary circuit board 300 by the elastic force of the elastic force-applying member 610.

[0063] like Figure 1 , Figure 5 As shown, in this embodiment, multiple vertical connectors 400 are arranged side-by-side at intervals along the extension direction of the auxiliary circuit board 300, and each of the multiple vertical connectors 400 is electrically connected to the test circuit board 200 through the mating gold finger portion 310. Multiple solid-state drives 10 to be tested can be simultaneously plugged into the multiple vertical connectors 400. During the testing process, a testing program can be set to sequentially test the multiple solid-state drives 10 on the multiple vertical connectors 400. This allows for testing of multiple solid-state drives with a single installation, improving testing efficiency.

[0064] Furthermore, the multiple vertical connectors 400 in this embodiment are of different models, and the different models of vertical connectors 400 are used to connect to solid-state drives 10 with different interfaces. Existing solid-state drive interfaces come in various forms, such as mSATA, NVMe, M.2, PIC-e, etc. This makes the auxiliary circuit board 300 a converter, enabling the testing of more types of solid-state drives.

[0065] like Figure 4 , Figure 6As shown, the vertical connector 400 of this embodiment is further provided with an end fixing position 320, which is fixed to the test circuit board 200. Typically, the auxiliary circuit board 300 is elongated, with the mating gold finger portion 310 located at one end and the end fixing position located at the other end. For example, it is connected to the testing machine by screws passing through the end fixing position 320.

[0066] In summary, the solid-state drive (SSD) testing machine provided in this application allows for the placement of a test host 130 and a test motherboard 20 within a chassis 100. Multiple test motherboards 20 are fixedly mounted within a test chamber 120, enabling the connection of multiple SSDs 10 for simultaneous testing. A monitor 140 is positioned on the top of the chassis 100, displaying the test results from the multiple test motherboards 20. Located at the top of the chassis 100, the monitor 140 allows users to easily observe the testing process. This enhances usability, and the monitor 140 displays a wider range of information, providing more comprehensive monitoring of the test parameters for each SSD 10, thus enabling complete parameter monitoring of SSD testing and improving user convenience.

[0067] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A testing machine for solid-state drives, characterized in that, Includes: a chassis, wherein an installation chamber and a test chamber are arranged from bottom to top inside the chassis, and multiple test motherboards are fixedly installed in the test chamber, the test motherboards being used to connect and test solid-state drives; A test host is disposed in the mounting chamber and electrically connected to the plurality of test motherboards; A display, which is disposed on the top of the chassis and electrically connected to the test host, is used to display the results of the tests conducted on the multiple test motherboards; The test motherboard includes: a test circuit board, on which at least one horizontal connector is provided; At least one auxiliary circuit board, wherein at least one of the auxiliary circuit boards is provided with a mating gold finger portion, and is pluggably connected to the horizontal connector via the mating gold finger portion; The test motherboard has a vertical connector, which includes a connector and a guide shell. The connector has a plug-in opening on the side opposite to the auxiliary circuit board. The guide shell includes: a housing and elastic plates on both sides, the housing being arranged around the outside of the insertion opening, and the elastic plates being symmetrically arranged on the inner wall of the housing; The vertical connector is disposed on the surface of the auxiliary circuit board opposite to the test circuit board; The vertical connector is used for pluggable connection of the solid-state drive to be tested, so that the solid-state drive to be tested is placed vertically on the test circuit board. The connector is disposed on the surface of the auxiliary circuit board, and the connector has a plug-in opening on the side opposite to the auxiliary circuit board, the plug-in opening being used to plug in the solid-state drive to be tested; The guide shell is disposed on the outside of the insertion opening and is used to guide the solid-state drive to be tested to be inserted into the connector; The housing has a guide opening; The elastic sheets on both sides generate a spring force toward the connector by the squeezing of the solid-state drive under test, and the solid-state drive under test is squeezed toward the connector by the spring force on both sides; The inner walls on the left and right sides of the inner cavity of the guide shell are provided with spring plate mounting grooves. Above the spring plate mounting grooves, there is a spring plate protrusion opening facing the middle of the inner cavity. The elastic sheet is placed in the spring plate mounting groove and is bent upwards and protrudes towards the spring plate protrusion opening. The upper side of the spring plate protrusion opening is an inclined spring plate guide surface. The elastic sheet includes: a folding elastic portion, an extension connecting portion, an arc-shaped bending portion, and a bending protrusion. The folding elastic portion is disposed in the spring sheet mounting groove. The extension connecting portion is connected to one end of the folding elastic portion and extends a predetermined length in a direction away from the auxiliary circuit board. The arc-shaped bending portion is connected to one end of the extension connecting portion away from the folding elastic portion and extends towards the spring sheet protrusion after bending. The arc-shaped surface of the arc-shaped bending portion abuts against the spring sheet guide surface. The bending protrusion is connected to one end of the arc-shaped bending portion away from the extension connecting portion and extends a predetermined length towards the center of the inner cavity. When the solid-state drive (SSD) to be tested is inserted from above, it first presses against the bent protrusion located in the inner cavity. Under pressure, the bent protrusion is pressed backward and deformed to the left and right. The backward pressure compresses the folded elastic portion, thus shortening the entire elastic piece in the front-back direction. Due to the tilt of the spring guide surface, the curved bend is pushed back during the backward pressing process, causing the bent protrusion, which is being pressed in the left-right direction, to be pushed aside by the SSD to the left and right. The bent protrusion is then squeezed and received into the spring extension opening, allowing the SSD to be tested to be smoothly inserted backward into the inner cavity of the guide shell and connected to the connector. At this time, the backward-deformed folded elastic portion... Without the front-to-back pressure from the solid-state drive (SSD) being tested, a forward-recovering elastic force is generated. During the recovery process, the arc-shaped bend generates an inclined compressive force along the spring guide surface. Due to the inclined setting of the spring guide surface, the arc-shaped bend tends to recover forward and generates compressive force towards the outside of the spring protrusion, thereby pressing the bend protrusion against the SSD being tested located in the inner cavity, pressing the SSD being tested tightly on both sides. Moreover, since the spring guide surface gradually tilts away from the center of the inner cavity from front to back, the elastic sheet also has a certain downward compressive force under the action of the inclined spring guide surface, which is more conducive to stably connecting the SSD being tested to the connector.

2. The solid-state drive testing machine as described in claim 1, characterized in that, The test chamber has a window on one side, and a partition is installed inside the test chamber. Multiple test motherboards are installed on the side of the partition away from the window. The vertical connecting seat passes through the partition and is positioned towards the window.

3. The solid-state drive testing machine as described in claim 2, characterized in that, The partition divides the test chamber into a front test chamber and a rear test chamber, with the rear test chamber having a larger space than the front test chamber. The test chamber is used to house the solid-state drive to be tested.

4. The solid-state drive testing machine as described in claim 2, characterized in that, The window is equipped with double doors, and the double doors have viewing windows.

5. The solid-state drive testing machine as described in claim 1, characterized in that, The monitor is equipped with an angle adjustment structure, which is connected to the chassis and used to adjust the tilt angle.

6. The solid-state drive testing machine as described in claim 1, characterized in that, An insulating heat-insulating sheet is provided between the test circuit board and the auxiliary circuit board.

7. The solid-state drive testing machine as described in claim 1, characterized in that, Multiple vertical connectors are provided, and the multiple vertical connectors are arranged side by side at intervals along the extension direction of the auxiliary circuit board. The multiple vertical connectors are electrically connected to the test circuit board through the mating gold finger portion.

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